TW201435912A - Thermal monitor for an extreme ultraviolet light source - Google Patents

Thermal monitor for an extreme ultraviolet light source Download PDF

Info

Publication number
TW201435912A
TW201435912A TW103100977A TW103100977A TW201435912A TW 201435912 A TW201435912 A TW 201435912A TW 103100977 A TW103100977 A TW 103100977A TW 103100977 A TW103100977 A TW 103100977A TW 201435912 A TW201435912 A TW 201435912A
Authority
TW
Taiwan
Prior art keywords
temperature
component
optical
lens
amplified
Prior art date
Application number
TW103100977A
Other languages
Chinese (zh)
Other versions
TWI611427B (en
Inventor
Vladimir Fleurov
Igor Fomenkov
Shailendra Srivastava
Original Assignee
Cymer LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cymer LLC filed Critical Cymer LLC
Publication of TW201435912A publication Critical patent/TW201435912A/en
Application granted granted Critical
Publication of TWI611427B publication Critical patent/TWI611427B/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05GX-RAY TECHNIQUE
    • H05G2/00Apparatus or processes specially adapted for producing X-rays, not involving X-ray tubes, e.g. involving generation of a plasma
    • H05G2/001X-ray radiation generated from plasma
    • H05G2/008X-ray radiation generated from plasma involving a beam of energy, e.g. laser or electron beam in the process of exciting the plasma
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05GX-RAY TECHNIQUE
    • H05G2/00Apparatus or processes specially adapted for producing X-rays, not involving X-ray tubes, e.g. involving generation of a plasma
    • H05G2/001X-ray radiation generated from plasma
    • H05G2/003X-ray radiation generated from plasma being produced from a liquid or gas
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05GX-RAY TECHNIQUE
    • H05G2/00Apparatus or processes specially adapted for producing X-rays, not involving X-ray tubes, e.g. involving generation of a plasma
    • H05G2/001X-ray radiation generated from plasma
    • H05G2/003X-ray radiation generated from plasma being produced from a liquid or gas
    • H05G2/005X-ray radiation generated from plasma being produced from a liquid or gas containing a metal as principal radiation generating component

Abstract

A first temperature distribution that represents a temperature of an element adjacent to and distinct from a first optical element that is positioned to receive an amplified light beam is accessed. The accessed first temperature distribution is analyzed to determine a temperature metric associated with the element, the determined temperature metric is compared to a baseline temperature metric, and an adjustment to position of the amplified light beam relative to the first optical element is determined based on the comparison.

Description

用於極紫外線光源的熱監測器 Thermal monitor for extreme ultraviolet light sources

此揭露內容係有關用於一極紫外線(EUV)光源之一熱監測器。 This disclosure relates to a thermal monitor for one of the extreme ultraviolet (EUV) light sources.

極紫外線(EUV)光,例如具有約為50nm或更小之波長(有時亦稱為軟X射線(soft x-rays)),且包括約為13.5nm之光波長的電磁輻射,可用於光微影程序以在例如矽晶圓之基體中生成極小的形貌體。 Extreme ultraviolet (EUV) light, for example, having a wavelength of about 50 nm or less (sometimes referred to as soft x-rays), and including electromagnetic radiation having a wavelength of about 13.5 nm, can be used for light. The lithography process produces very small topography in a matrix such as a germanium wafer.

產生EUV光之方法包括,但不必然限於,將具有例如氙、鋰或錫有在EUV範圍內之放射線的元素之材料轉換成電漿態。在一通常稱為雷射生成電漿(LPP)之此種方法中,所需電漿可藉由以可稱為一驅動雷射的一放大光束照射靶材來生成,該靶材例如係成材料細滴、串流、或群集形式。就此種程序而言,電漿典型地在例如一真空腔室的一封閉容器中生成,且使用多種類型之度量設備來監測。 Methods of producing EUV light include, but are not necessarily limited to, converting materials having elements such as germanium, lithium or tin having radiation in the EUV range to a plasma state. In such a method, commonly referred to as laser-generated plasma (LPP), the desired plasma can be generated by illuminating the target with an amplified beam of light that can be referred to as a driven laser, such as a target. Material droplets, streams, or clusters. For such procedures, the plasma is typically generated in a closed container, such as a vacuum chamber, and monitored using a variety of types of metrology equipment.

在一廣義態樣中,用以相對於極紫外線(EUV)光源中之第一光學元件調整放大光束之位置的方法包括取用表示鄰近該第一光學元件且與其分別之元件的溫度之一第 一溫度分佈。此第一光學元件係設置來接收放大光束。此方法亦包括分析所取用的第一溫度分佈來決定與該元件相關聯之溫度度量,將決定的溫度度量與一基準線溫度度量比較,以及根據此比較之結果決定放大光束之位置相對於第一光學元件的調整。 In a generalized aspect, a method for adjusting a position of an amplified beam relative to a first optical element in an extreme ultraviolet (EUV) source includes taking a temperature indicative of a temperature adjacent to the first optical element and a component thereof A temperature distribution. This first optical element is arranged to receive an amplified beam. The method also includes analyzing the first temperature profile taken to determine a temperature metric associated with the component, comparing the determined temperature metric to a baseline temperature metric, and determining the position of the amplified beam relative to the result of the comparison Adjustment of the first optical component.

具現例可包括一或多個以下特徵。可產生表示對 放大光束之位置的所決定調整之指標。此指標可包括供機械耦合至第二光學元件的一致動器用之輸入,此第二光學元件可包括設置來接收放大光束的一作用區域,且供至致動器的輸入可足夠使致動器於至少一方向移動此作用區域。此等輸入可提供給致動器。提供此等輸入給致動器後,與第一光學元件鄰近之該元件的第二溫度分佈可被取用,此第二溫度分佈可被分析以決定溫度度量,且此溫度度量可與第一溫度分佈或基準線溫度度量中的一或多者相比較。 A present case may include one or more of the following features. Can produce a representation pair An indicator of the determined adjustment of the position of the amplified beam. The indicator can include an input for an actuator for mechanical coupling to the second optical element, the second optical element can include an active region configured to receive the amplified beam, and the input to the actuator can be sufficient to cause the actuator The active area is moved in at least one direction. These inputs can be provided to the actuator. After providing such input to the actuator, a second temperature profile of the component adjacent the first optical component can be taken, the second temperature profile can be analyzed to determine a temperature metric, and the temperature metric can be compared to the first One or more of the temperature distribution or baseline temperature metrics are compared.

此指標亦可包括供耦合至EUV光源中之第三光 學元件的一第二致動器用的輸入,供至該第二致動器的此等輸入係足夠使第二致動器於至少一方向移動該第三光學元件。第二光學元件的作用區域可包括具有接收放大光束之反射部分的一鏡體,且在移動時,此反射部分相對於第一光學元件改變放大光束的位置。 This indicator may also include a third light for coupling into the EUV source The input to a second actuator of the component is such that the input to the second actuator is sufficient for the second actuator to move the third optical component in at least one direction. The active area of the second optical element can include a mirror having a reflective portion that receives the amplified beam, and when moved, the reflective portion changes the position of the magnified beam relative to the first optical element.

第一溫度分佈可包括與第一光學元件鄰近之元 件的一部分之溫度,此部分之溫度至少在兩個不同時間量測。第一溫度分佈可包括與第一光學元件鄰近之元件的多 個部分之溫度。多個部分中之每一部分的溫度可至少在兩個不同時間量測。第一溫度分佈可包括表示由熱感測器接收之溫度量測的資料,此等熱感測器機械耦合至與第一光學元件鄰近之元件。第一溫度分佈可包括元件於不同時間量測的多個溫度,且溫度度量可包括該等多個溫度的方差、該等多個溫度的平均、或該等多個溫度中至少二者間的變化率當中的一或多者。 The first temperature distribution can include a element adjacent to the first optical element The temperature of a portion of the part, the temperature of which is measured at least two different times. The first temperature distribution can include a plurality of components adjacent to the first optical component The temperature of the part. The temperature of each of the plurality of sections can be measured at least two different times. The first temperature profile can include data indicative of temperature measurements received by the thermal sensor, the thermal sensors being mechanically coupled to components adjacent to the first optical component. The first temperature profile can include a plurality of temperatures measured by the component at different times, and the temperature metric can include a variance of the plurality of temperatures, an average of the plurality of temperatures, or at least between the plurality of temperatures One or more of the rate of change.

第一光學元件可為放大光束所通過的斂聚透 鏡,且鄰近該斂聚透鏡之該元件可為一鏡罩。 The first optical element can be used to amplify the beam The mirror, and the element adjacent to the converging lens, can be a mirror cover.

第一溫度分佈可包括在一特定時間於該元件上 的不同位置處量測的多個溫度,且溫度度量可包括該等多個溫度的空間方差(spatial variance)。此第一溫度分佈亦可包括在與第一光學元件鄰近之該元件上的不同位置所量測的該元件之多個溫度。此溫度度量亦可包括在與第一光學元件鄰近之該元件上的不同位置量測的該等多個溫度之一空間方差。此溫度度量可包括表示與第一光學元件鄰近之該元件的量測溫度之一隨時間變化的數值,且將溫度度量與基準線溫度度量比較可包括將該數值與一臨界值比較。 The first temperature distribution can include the component at a particular time A plurality of temperatures are measured at different locations, and the temperature metric can include a spatial variance of the plurality of temperatures. The first temperature profile can also include a plurality of temperatures of the component measured at different locations on the component adjacent the first optical component. The temperature metric can also include a spatial variance of the plurality of temperatures measured at different locations on the component adjacent the first optical component. The temperature metric can include a value indicative of one of the measured temperatures of the element adjacent the first optical element as a function of time, and comparing the temperature metric to the baseline temperature metric can include comparing the value to a threshold.

在另一廣義態樣中,一系統包括一熱感測器,此 熱感測器組配來機械耦合至與接收極紫外線(EUV)光源的放大光束之一第一光學元件鄰近之元件,量測該元件之溫度,且產生所量測溫度的一指標。此系統亦包括一控制器,其包括耦合至一非暫時性電腦可讀媒體的一或多個電子處理器,此電腦可讀媒體儲存包括可由此一或多個電子處理 器執行的指令之軟體,指令被執行時會使該一或多個電子處理器接收所產生之量測溫度的指標,且依據所產生之此量測溫度的指標而生成一輸出信號,此輸出信號足以使一致動器移動接收該放大光束的一第二光學元件、且相對於該第一光學元件調整該放大光束的一位置。 In another generalized aspect, a system includes a thermal sensor, The thermal sensor assembly is configured to mechanically couple to an element adjacent to the first optical element of the amplified beam of the extreme ultraviolet (EUV) source, measure the temperature of the element, and produce an index of the measured temperature. The system also includes a controller including one or more electronic processors coupled to a non-transitory computer readable medium, the computer readable medium storage including one or more electronic processes The software executed by the device, when executed, causes the one or more electronic processors to receive an index of the generated measured temperature, and generate an output signal according to the generated index of the measured temperature, the output The signal is sufficient to cause the actuator to move a second optical component that receives the amplified beam and adjust a position of the amplified beam relative to the first optical component.

具現例可包括一或多個以下特徵。第一光學元件 可為放大光束所通過的一透鏡,鄰近該透鏡的該元件可為鄰近該透鏡的一鏡罩,且熱感測器可組配來安裝至該鏡罩。熱感測器可包括一熱電偶、一熱阻器、或一基於纖維的熱感測器中之一或多個。此第一光學元件可為功率放大器輸出窗、最終焦點旋轉鏡、或空間濾器孔徑之一者。熱感測器可包括多個熱感測器,此第一光學元件可包括在聚焦該放大光束的透鏡下游之一或多個光學元件,且各該一或多個光學元件可耦合至一熱感測器。此一或多個光學元件可為鏡體。 A present case may include one or more of the following features. First optical component It may be a lens through which the light beam is amplified, the element adjacent to the lens may be a mirror cover adjacent to the lens, and the thermal sensor may be assembled to be mounted to the lens cover. The thermal sensor can include one or more of a thermocouple, a thermal resistor, or a fiber-based thermal sensor. This first optical element can be one of a power amplifier output window, a final focus rotating mirror, or a spatial filter aperture. The thermal sensor can include a plurality of thermal sensors, the first optical component can include one or more optical components downstream of the lens that focuses the amplified beam, and each of the one or more optical components can be coupled to a thermal Sensor. The one or more optical elements can be a mirror body.

指令亦可包括提供輸出信號給致動器的指令,且 此致動器可組配來耦合至第二光學元件。指令亦可包括執行時會讓控制器進行下列動作的指令:取用一第一溫度分佈,此第一溫度分佈係根據來自熱感測器的元件之量測溫度的指標;分析所取用的溫度分佈以決定與該元件相關聯的溫度度量;將決定的溫度度量與一基準線溫度分佈比較;以及根據比較之結果決定放大光束之一參數的調整。 The instructions may also include instructions to provide an output signal to the actuator, and This actuator can be assembled to couple to the second optical element. The instructions may also include instructions that, when executed, cause the controller to: take a first temperature profile that is based on an index of the measured temperature of the component from the thermal sensor; The temperature profile determines a temperature metric associated with the component; the determined temperature metric is compared to a baseline temperature profile; and the adjustment of one of the parameters of the amplified beam is determined based on the result of the comparison.

在另一廣義態樣中,一系統包括接收極紫外光線(EUV)光源之放大光束的一第一光學元件,及鄰近且分別於 該第一光學元件的一元件。此系統亦包括耦合至鄰近該第一光學元件之該元件的一熱系統,且此熱系統包括一或多個溫度感測器,其各與該元件之不同部分相關聯,此一或多個溫度感測器係組配來產生該元件之相關聯部分的量測溫度之指標;及耦合至一第二光學元件的一致動系統,當此第二光學元件移動時,會造成放大光束的一對應移動。 此系統亦包括一控制系統,其連接至該熱系統之輸出及該致動系統之一或多個輸入,且係組配來根據所產生之量測溫度的指標而生成供致動系統輸入用的輸出信號,此輸出信號足夠使一致動器移動第二光學元件,且相對於第一光學元件調整該放大光束的一位置。 In another generalized aspect, a system includes a first optical component that receives an amplified beam of an extreme ultraviolet (EUV) source, and is adjacent and respectively An element of the first optical component. The system also includes a thermal system coupled to the component adjacent the first optical component, and the thermal system includes one or more temperature sensors each associated with a different portion of the component, the one or more The temperature sensor is configured to generate an index of the measured temperature of the associated portion of the component; and an actuating system coupled to a second optical component that, when moved, causes an amplification of the beam Corresponding to move. The system also includes a control system coupled to the output of the thermal system and one or more inputs of the actuation system, and configured to generate an input for actuation of the system based on the generated index of measured temperature An output signal sufficient to cause the actuator to move the second optical element and to adjust a position of the amplified beam relative to the first optical element.

上述任何一種技術之具現例可包括一種方法、一 種程序、一種裝置、用以改裝一現有EUV光源之一套件、或一種設備。一或多個具現例之細節會在後附圖式及以下敘述中說明。其他特徵將可從該等敘述及圖式且從申請專利範圍明顯看出。 A current example of any of the above techniques may include a method, a A program, a device, a kit for retrofitting an existing EUV source, or a device. One or more of the details of the present invention will be described in the following figures and the following description. Other features will be apparent from the description and drawings and from the scope of the claims.

100‧‧‧光源 100‧‧‧Light source

105、610‧‧‧標靶位置 105, 610‧‧‧ Target location

107‧‧‧內部 107‧‧‧Internal

110‧‧‧放大光束 110‧‧‧Amplified beam

114‧‧‧標靶混合物 114‧‧‧Target mixture

115‧‧‧雷射系統 115‧‧‧Laser system

120、240、615‧‧‧光束傳輸系統 120, 240, 615‧ ‧ beam transmission system

122、620‧‧‧焦點總成 122, 620‧ ‧ focus assembly

124‧‧‧度量系統 124‧‧‧Metric system

125‧‧‧靶材傳遞系統 125‧‧‧Target delivery system

127‧‧‧靶材供應裝置 127‧‧‧ target supply device

130‧‧‧腔室/真空容器 130‧‧‧Case/vacuum container

135‧‧‧集光鏡 135‧‧‧ concentrator

140、197‧‧‧孔徑 140, 197‧‧‧ aperture

145‧‧‧中間位置 145‧‧‧ intermediate position

150‧‧‧遮罩 150‧‧‧ mask

155‧‧‧主控制器 155‧‧‧Master controller

156‧‧‧細滴位置偵測回授系統 156‧‧‧Droplet position detection feedback system

157‧‧‧雷射控制系統 157‧‧‧Laser Control System

158‧‧‧光束控制系統 158‧‧‧ Beam Control System

160‧‧‧成像器 160‧‧‧ Imager

165‧‧‧光源偵測器 165‧‧‧Light source detector

175‧‧‧導引雷射 175‧‧‧Guided laser

180、605‧‧‧驅動雷射系統 180, 605‧‧‧ drive laser system

181、182、183‧‧‧放大器 181, 182, 183‧ ‧ amplifiers

184、191、665‧‧‧光線 184, 191, 665 ‧ ‧ rays

185、190、194‧‧‧輸出窗 185, 190, 194‧‧‧ output windows

186、188‧‧‧彎曲鏡 186, 188‧‧‧ bending mirror

187‧‧‧空間濾器 187‧‧‧ Space filter

189、193‧‧‧輸入窗 189, 193‧‧‧ input window

192‧‧‧摺疊鏡 192‧‧‧Folding mirror

195‧‧‧輸出光束 195‧‧‧Output beam

210‧‧‧最終焦點總成/最終焦點透鏡總成 210‧‧‧Final Focus Assembly / Final Focus Lens Assembly

212‧‧‧透鏡固持器 212‧‧‧Lens Holder

214‧‧‧導向鏡 214‧‧‧Guide mirror

215‧‧‧反射部分 215‧‧‧reflection

216、221‧‧‧致動器 216, 221‧‧ ‧ actuator

217‧‧‧固持器 217‧‧‧Retainer

218‧‧‧最終焦點透鏡 218‧‧‧ final focus lens

220‧‧‧支撐架 220‧‧‧Support frame

228A~228D‧‧‧溫度感測器 228A~228D‧‧‧Temperature Sensor

234‧‧‧周邊 Around 234‧‧

235、236‧‧‧部分 235, 236‧‧‧

237‧‧‧內表面 237‧‧‧ inner surface

238‧‧‧外表面 238‧‧‧ outer surface

241‧‧‧EUV監測模組 241‧‧‧EUV monitoring module

242‧‧‧導向模組 242‧‧‧guide module

243‧‧‧位置 243‧‧‧ position

244‧‧‧中心 244‧‧‧ Center

302~308‧‧‧時間序列 302~308‧‧‧ Time Series

600‧‧‧光束傳遞系統 600‧‧‧beam delivery system

625‧‧‧放大光束 625‧‧‧Amplified beam

630、632、638‧‧‧鏡體/光學組件 630, 632, 638‧‧ ‧ Mirror / optical components

634‧‧‧導引光學元件/光學組件 634‧‧‧Guiding optics/optical components

640‧‧‧光束擴展系統 640‧‧‧beam extension system

650‧‧‧鏡體 650‧‧ ‧ Mirror body

655‧‧‧斂聚透鏡 655‧‧‧ Converging lens

660‧‧‧度量系統 660‧‧‧Metric system

670‧‧‧對準雷射 670‧‧‧Aligning the laser

675‧‧‧檢測裝置 675‧‧‧Detection device

680‧‧‧診斷光束 680‧‧‧Diagnostic beam

700‧‧‧系統 700‧‧‧ system

710‧‧‧熱感測器 710‧‧‧ Thermal Sensor

712‧‧‧感測機構 712‧‧‧Sensor

714、744‧‧‧耦合件 714, 744‧‧‧ coupling parts

716、736、746‧‧‧輸入/輸出介面/I/O介面 716, 736, 746‧‧‧Input/Output Interface/I/O Interface

718‧‧‧電源模組 718‧‧‧Power Module

720‧‧‧受監測元件 720‧‧‧Monitored components

722‧‧‧高功率光學組件 722‧‧‧High power optical components

730‧‧‧控制器 730‧‧‧ Controller

732‧‧‧處理器 732‧‧‧ processor

734‧‧‧電子儲存器 734‧‧‧Electronic storage

740‧‧‧致動系統 740‧‧‧ actuation system

742‧‧‧致動機構 742‧‧‧Activity agency

750‧‧‧導向元件 750‧‧‧guide elements

752‧‧‧作用區域 752‧‧‧Action area

800‧‧‧程序 800‧‧‧ procedures

810~840‧‧‧步驟 810~840‧‧‧Steps

圖1A係為一雷射生成電漿極紫外光線光源的一方塊圖。 Figure 1A is a block diagram of a laser generated plasma extreme ultraviolet light source.

圖1B係為可使用在圖1A之光源中的一範例驅動雷射系統之一方塊圖。 Figure 1B is a block diagram of an exemplary driven laser system that can be used in the light source of Figure 1A.

圖2A係為圖1A之光源的範例具現例之一側視圖。 Fig. 2A is a side elevational view showing an example of the light source of Fig. 1A.

圖2B係為沿線2B-2B取得之圖2A的鏡罩之一前 視圖。 Figure 2B is a front view of one of the mirror covers of Figure 2A taken along line 2B-2B view.

圖3A及3B係為作為時間的函數之量測溫度的範例。 Figures 3A and 3B are examples of measured temperatures as a function of time.

圖4A係為有一未對準放大光束之圖2A的光源之範例具現例的一側視圖。 4A is a side elevational view of an exemplary embodiment of the light source of FIG. 2A having a misaligned magnified beam.

圖4B係為圖4A之最終焦點透鏡的一前視圖。 Figure 4B is a front elevational view of the final focus lens of Figure 4A.

圖5A係為有一對準放大光束之圖2A的光源之範例具現例的一側視圖。 Figure 5A is a side elevational view of an exemplary embodiment of the light source of Figure 2A having an aligned magnified beam.

圖5B係為圖5A之最終焦點透鏡的一前視圖。 Figure 5B is a front elevational view of the final focus lens of Figure 5A.

圖6係為一範例光束傳遞系統之一例示。 Figure 6 is an illustration of an example beam delivery system.

圖7係為對準一放大光束的一範例系統之一方塊圖。 Figure 7 is a block diagram of an exemplary system for aligning an amplified beam.

圖8係為用以對準一放大光束的一範例程序。 Figure 8 is an exemplary procedure for aligning an amplified beam.

用於一極紫外線(EUV)光源之一熱監測器被揭露。此熱監測器決定鄰近且分別於接收放大光束之一光學元件的元件之溫度。此放大光束係被導引朝向靶材細滴之串流,且在放大光束與一靶材細滴交互作用時,此靶材細滴轉換成一電漿態並放射EUV光。 A thermal monitor for one of the extreme ultraviolet (EUV) sources is disclosed. The thermal monitor determines the temperature of the components adjacent to and respectively receiving the optical elements of one of the amplified beams. The magnified beam is directed toward the stream of target droplets, and when the magnified beam interacts with a target droplet, the target droplet is converted to a plasma state and emits EUV light.

此熱監測器可藉由提供放大光束相對於反射或折射此光束之光學元件更準確的定位,來增進EUV光源之性能。由於此EUV光係由以放大光束照射一靶材細滴而生成,對準放大光束使此光束聚焦於靶材細滴所通過之標靶位置,可對細滴提供集中能量,促使細滴更有可能轉換成 電漿,因此能增加產生的EUV光之數量及提升EUV光源之整體性能。再者,維持放大光束的對準度及品質可增進光源產生的EUV功率之穩定性。另外,監測空間溫度分佈及接收該放大光束之元件上的強度對稱性,亦允許補償熱漂移引起的誤差。 The thermal monitor can enhance the performance of the EUV source by providing a more accurate positioning of the magnifying beam relative to the optical element that reflects or refracts the beam. Since the EUV light system is generated by irradiating a target droplet with an enlarged beam, aligning the amplified beam to focus the beam on the target position through which the target droplet passes, can provide concentrated energy to the fine droplet, and promote the fine droplet It is possible to convert into Plasma, thus increasing the amount of EUV light produced and improving the overall performance of the EUV source. Furthermore, maintaining the alignment and quality of the amplified beam enhances the stability of the EUV power generated by the source. In addition, monitoring the spatial temperature distribution and the intensity symmetry on the components receiving the amplified beam also allows for compensation for errors caused by thermal drift.

如同下文所述,監測鄰近於接收該放大光束之一 光學元件(諸如透鏡或鏡體)的一元件(諸如一鏡罩)之溫度可改善該放大光束的對準度。對一元件的直接及間接輻射可加熱該元件,而在該元件之溫度上產生一可量測變化。 來自該元件吸收或所暴露的放大光束之輻射數量依光束對準之品質而定。例如,若該放大光束相對於一透鏡妥適準直及對準,透鏡上之光束的強度分佈即會實質上在空間及/或時間上均勻。當放大光束適當瞄準時,此強度分佈呈對稱形狀且位於透鏡及鄰近該透鏡之元件中央。由於在透鏡上的強度分佈均勻,在該透鏡與鄰近於該透鏡的元件上之加熱作用亦為均勻;此外,自材料細滴反射的光束之強度分佈會準直且均勻。 As described below, monitoring is adjacent to receiving one of the amplified beams The temperature of an element of an optical component, such as a lens or mirror, such as a mirror cover, can improve the alignment of the magnified beam. Direct and indirect radiation to an element heats the element and produces a measurable change in the temperature of the element. The amount of radiation from the amplified beam that is absorbed or exposed by the component depends on the quality of the beam alignment. For example, if the magnified beam is properly collimated and aligned with respect to a lens, the intensity distribution of the beam on the lens will be substantially spatially and/or temporally uniform. When the magnified beam is properly aimed, the intensity distribution is symmetric and lies in the center of the lens and the element adjacent the lens. Since the intensity distribution on the lens is uniform, the heating effect on the lens and the element adjacent to the lens is also uniform; in addition, the intensity distribution of the beam reflected from the material droplets is collimated and uniform.

相反地,若放大光束未對準,透鏡上的放大光束 之強度分佈及反射光束之強度分佈即不均勻。例如,在未對準時,放大光束可能會偏心(偏離中心)地穿過透鏡,且可能有不對稱的強度分佈,而可能造成透鏡及/或鄰近元件之某些部分加熱得較其他部分多。此不均勻加熱可能導致會對透鏡及/或鄰近元件造成熱損害之局部化熱點。此外,此等熱點可能在透鏡中造成諸如熱透鏡的光學效應,其可能 因折射率的變化而改變透鏡的焦距及使光源的性能降低。 光學效應指的是在透鏡上改變透鏡之光學特性的那些效應。再者,當非對準時,放大光束可能偏心地照在鏡體上,且射中非反射元件或射中鄰近於一孔徑或透鏡的非透射元件。在此二範例中,放大光束可能變成不對稱且使鄰近元件具有一不均勻的強度分佈。 Conversely, if the amplified beam is misaligned, the amplified beam on the lens The intensity distribution and the intensity distribution of the reflected beam are not uniform. For example, in the event of misalignment, the magnified beam may eccentrically (off-center) through the lens and may have an asymmetrical intensity distribution, which may cause some portions of the lens and/or adjacent elements to heat more than others. This uneven heating can result in localized hot spots that can cause thermal damage to the lens and/or adjacent components. In addition, such hot spots may cause optical effects such as thermal lenses in the lens, which may The focal length of the lens is changed due to the change in the refractive index and the performance of the light source is lowered. Optical effects refer to those effects that alter the optical properties of the lens on the lens. Furthermore, when misaligned, the magnified beam may eccentrically illuminate the scope and strike a non-reflective element or strike a non-transmissive element adjacent to an aperture or lens. In this two example, the amplified beam may become asymmetrical and cause adjacent elements to have an uneven intensity distribution.

換言之,放大光束的非準確對準可能造成透鏡上 的溫度分佈於時間及/或空間上呈不均勻。因此,鄰近透鏡的一熱傳導元件或組件之多個部分的溫度亦可為不均勻。 所以,在鄰近組件上的不均勻溫度分佈之量測可為放大光束未對準的指標。再者,將鄰近組件上的溫度分佈特徵化(亦即予以呈現出來),未對準的數量可被決定,且用來藉由調整導引放大光束朝向靶材細滴之光學元件的位置,以調整或校正放大光束的對準度。 In other words, inaccurate alignment of the amplified beam may result in the lens The temperature distribution is not uniform in time and/or space. Thus, the temperature of portions of a thermally conductive element or component adjacent the lens may also be non-uniform. Therefore, the measurement of the uneven temperature distribution on adjacent components can be an indicator of the misalignment of the amplified beam. Furthermore, by characterizing (ie, presenting) the temperature distribution on adjacent components, the amount of misalignment can be determined and used to adjust the position of the optical element that directs the amplified beam toward the target droplet. To adjust or correct the alignment of the amplified beam.

此外,鄰近組件上的溫度分佈之特徵化允許由熱 漂移造成之性能改變的補償。EUV光源中的光學組件在暴露於熱時尺寸可能膨脹。例如,一鏡體或固持該鏡體的座體可能因被快速加熱及/或加熱一段時間而膨脹。此種額外加熱作用在放大光束的工作週期(duty cycle)增加時可能會產生。熱膨脹可能導致鏡體位置的微小變化,造成指向漂移(pointing drift),其係為從鏡體反射之光線行進方向的一改變。指向漂移可能造成放大光束未位在該鏡體下游的光學元件中央。指向漂移亦可能導致下游光學元件上的不對稱強度分佈。 In addition, the characterization of the temperature distribution on adjacent components allows for heat Compensation for performance changes caused by drift. The optical components in an EUV source may expand in size when exposed to heat. For example, a mirror body or a body that holds the mirror body may expand due to rapid heating and/or heating for a period of time. This additional heating may occur as the duty cycle of the amplified beam increases. Thermal expansion may result in small changes in the position of the mirror body, causing a pointing drift, which is a change in the direction of travel of the light reflected from the mirror body. Pointing drift may cause the amplified beam to be not centered in the optical element downstream of the mirror. Pointing drift can also result in an asymmetric intensity distribution on the downstream optical components.

以下所討論之熱監測器亦可用來藉由判定放大 光束是否非對稱地位在光學元件上,且若光束係為非對稱定位,則會重新定位該放大光束,使得該光束以一對稱強度分佈位在光學元件中央,來補償指向漂移。 The thermal monitors discussed below can also be used to zoom in by decision Whether the beam is asymmetrically placed on the optical element, and if the beam is asymmetrically positioned, the amplified beam is repositioned such that the beam is centered at the center of the optical element with a symmetric intensity distribution to compensate for the pointing drift.

據此,以下所述之熱監測技術可藉由改善放大光 束的對準及補償熱漂移來改善EUV光源之性能。以下,在更詳細探討熱監測器前,先論述EUV光源。 Accordingly, the thermal monitoring technique described below can be improved by amplifying light. Beam alignment and compensation for thermal drift to improve the performance of the EUV source. Below, the EUV source will be discussed before discussing the thermal monitor in more detail.

參照圖1A,一LPP EUV光源100係藉由在一標靶 位置105以沿朝向一標靶混合物114之光束路徑行進的一放大光束110照射該標靶混合物114。亦稱照射位置之標靶位置105係位在一真空腔室130之內部107中。當放大光束110照射標靶混合物114時,標靶混合物114內的一靶材轉換成具有在EUV範圍中的放射線之元素的一電漿態。所產生的電漿具有依標靶混合物114內之靶材成分而定的某些特性。這些特性可包括由電漿產生的EUV光之波長及從電漿釋出的殘片類型與數量。 Referring to FIG. 1A, an LPP EUV light source 100 is used in a target Position 105 illuminates the target mixture 114 with an amplified beam 110 traveling along a beam path toward a target mixture 114. The target position 105, also referred to as the illumination position, is positioned in the interior 107 of the vacuum chamber 130. When the amplified beam 110 illuminates the target mixture 114, a target within the target mixture 114 is converted to a plasma state having elements of radiation in the EUV range. The resulting plasma has certain characteristics depending on the target composition within the target mixture 114. These characteristics may include the wavelength of the EUV light produced by the plasma and the type and amount of debris released from the plasma.

光源100亦包括一靶材傳遞系統125,其傳遞、控 制並導引呈液體細滴、液體串流、固體粒子或群集、包含在液體細滴內之固體粒子、或包含在液體串流內的固體粒子形式之標靶混合物114。此標靶混合物114包括諸如例如水、錫、鋰、氙或在轉換成電漿態時具有在EUV範圍中的放射線的任何材料之靶材。例如,元素錫可使用純錫(Sn);例如SnBr4、SnBr2、SnH4的錫化合物;例如錫鎵合金、錫銦合金、錫銦鎵合金的錫合金、或這些合金的組合。標靶 混合物114亦可包括諸如非標靶粒子之雜質。因此,在無雜質的情況下,標靶混合物114僅由靶材製成。標靶混合物114由靶材傳遞系統125傳遞進入腔室130之內部107並至標靶位置105。 Light source 100 also includes a target delivery system 125 that transmits, controls, and directs liquid droplets, liquid streams, solid particles or clusters, solid particles contained within liquid droplets, or contained within a liquid stream. Target mixture 114 in the form of solid particles. This target mixture 114 includes targets such as, for example, water, tin, lithium, cesium or any material that has radiation in the EUV range when converted to a plasma state. For example, using pure elemental tin, tin (of Sn); e.g. SnBr 4, SnBr 2, SnH 4, a tin compound; e.g. tin-gallium alloys, indium-tin alloy, tin alloy, tin-indium-gallium alloys, or combinations of these alloys. Target mixture 114 may also include impurities such as non-target particles. Therefore, in the absence of impurities, the target mixture 114 is made only of the target. The target mixture 114 is delivered by the target delivery system 125 into the interior 107 of the chamber 130 and to the target location 105.

光源100包括一驅動雷射系統115,其因雷射系統 115之一或多種增益媒體內的群集反轉(population inversion)而產生放大光束110。此光源100包括雷射系統115與標靶位置105間的一光束傳遞系統,此光束傳遞系統包括一光束傳輸系統120及一焦點總成122。此光束傳輸系統120接收來自雷射系統115的放大光束110,並在需要時引導及修正放大光束110,且將放大光束110輸出至焦點總成122。此焦點總成122接收放大光束110且將光束110聚焦在標靶位置105。 Light source 100 includes a drive laser system 115 due to a laser system Amplifying inversion of one or more of the gain media produces an amplified beam 110. The light source 100 includes a beam delivery system between the laser system 115 and the target location 105. The beam delivery system includes a beam delivery system 120 and a focus assembly 122. This beam delivery system 120 receives the amplified beam 110 from the laser system 115 and directs and modifies the amplified beam 110 as needed, and outputs the amplified beam 110 to the focus assembly 122. This focus assembly 122 receives the amplified beam 110 and focuses the beam 110 at the target position 105.

在一些具現例中,雷射系統115可包括用以提供 一或多個主要脈衝及在一些情況下提供一或多個預脈衝的一或多個光學放大器、雷射、及/或燈具。各光學放大器包括能使想要的波長在一高增益下光學放大之一增益媒體、一激發源、及內部光學機構。此光學放大器可以或可不具有形成一雷射腔的雷射鏡或其他回授裝置。因此,雷射系統115由於雷射放大器之增益媒體中的群集轉換而產生一放大光束110,即使無雷射腔亦然。此外,若有雷射腔提供雷射系統115足夠的回授,雷射系統115可產生同調雷射的一放大光束110。「放大光束」一詞包含下列光線中之一或多者:來自雷射系統115之僅放大而未必為一同調雷射振盪的光、及放大且亦為同調雷射振盪的光。 In some embodiments, the laser system 115 can include One or more primary amplifiers and, in some cases, one or more optical amplifiers, lasers, and/or luminaires that provide one or more pre-pulses. Each optical amplifier includes a gain medium, an excitation source, and an internal optical mechanism that optically amplifies a desired wavelength at a high gain. This optical amplifier may or may not have a laser or other feedback device that forms a laser cavity. Thus, the laser system 115 produces an amplified beam 110 due to cluster switching in the gain medium of the laser amplifier, even without a laser cavity. In addition, if a laser cavity provides sufficient feedback to the laser system 115, the laser system 115 can produce an amplified beam 110 of the coherent laser. The term "magnifying beam" encompasses one or more of the following rays: light from the laser system 115 that is only amplified but not necessarily a coherent laser oscillation, and light that is amplified and also is a coherent laser oscillation.

雷射系統115中之光學放大器可包括作為一增益 媒體的一填充氣體,其含括CO2,並可把在約9100及約11000nm間之波長的光、且特別是在約10600nm的光以大於或等於1000之增益予以放大。供使用在雷射系統115中之合適的放大器及雷射可包括一脈衝雷射裝置,例如一脈衝氣體放電CO2雷射裝置,其例如以DC或RF激發產生在約9300nm或約10600nm的輻射,在例如10kW或更高之相當高功率、及例如50kHz或更高之高脈衝重覆率下運作。雷射系統115中之光學放大器亦可包括一冷卻系統,諸如雷射系統115在較高功率下運作時所使用的水。 The optical amplifier in laser system 115 can include a fill gas as a gain medium that includes CO 2 and can illuminate light having a wavelength between about 9100 and about 11000 nm, and particularly at about 10600 nm. Or a gain equal to 1000 to amplify. Suitable amplifiers and lasers for use in the laser system 115 can include a pulsed laser device, such as a pulsed gas discharge CO 2 laser device that produces radiation at about 9300 nm or about 10600 nm, for example, by DC or RF excitation. It operates at a relatively high power of, for example, 10 kW or higher, and a high pulse repetition rate of, for example, 50 kHz or higher. The optical amplifier in the laser system 115 can also include a cooling system, such as water used by the laser system 115 to operate at higher power.

圖1B顯示一範例驅動雷射系統180之方塊圖。此 驅動雷射系統180可用作在光源100中的驅動雷射系統115。此驅動雷射系統180包括三個功率放大器181、182及183。功率放大器181、182及183之任一者或全部可包括內部光學元件(圖中未示出)。 FIG. 1B shows a block diagram of an example driven laser system 180. this The drive laser system 180 can be used as a drive laser system 115 in the light source 100. This drive laser system 180 includes three power amplifiers 181, 182, and 183. Either or all of power amplifiers 181, 182, and 183 may include internal optical components (not shown).

光線184自功率放大器181透過一輸出窗185射出 且從一彎曲鏡186反射。反射之後,穿過一空間濾器187的光線184受一彎曲鏡188反射,且透過一輸入窗189進入功率放大器182。光線184在功率放大器182中被放大,且透過一輸出窗190重新導出功率放大器182作為光線191。光線191以摺疊鏡192導引朝向放大器183,且透過一輸入窗193進入放大器183。放大器183放大光線191且透過一輸出窗194將光線191導出放大器193作為一輸出光束195。一摺疊鏡196導引該輸出光束195朝上(從頁面出來)且朝向光束傳輸系統 120。 Light 184 is emitted from power amplifier 181 through an output window 185 And reflected from a curved mirror 186. After reflection, light 184 passing through a spatial filter 187 is reflected by a curved mirror 188 and passed through an input window 189 into power amplifier 182. Light ray 184 is amplified in power amplifier 182 and re-exported power amplifier 182 as light 191 through an output window 190. Light ray 191 is directed toward amplifier 183 by folding mirror 192 and into amplifier 183 through an input window 193. Amplifier 183 amplifies light 191 and directs light 191 through an output window 194 to amplifier 193 as an output beam 195. A folding mirror 196 directs the output beam 195 upward (from the page) and toward the beam delivery system 120.

空間濾器187界定一孔徑197,其可為例如具有約 2.2mm與3mm間之直徑的圓圈。彎曲鏡186及188可例如為分別具有焦距1.7m及2.3m的離軸拋物面鏡。此空間濾器187可被置設成使得孔徑197與驅動雷射系統180之一焦點重合。 The space filter 187 defines an aperture 197, which may for example have A circle of diameter between 2.2 mm and 3 mm. The curved mirrors 186 and 188 can be, for example, off-axis parabolic mirrors having focal lengths of 1.7 m and 2.3 m, respectively. This spatial filter 187 can be positioned such that the aperture 197 coincides with the focus of one of the drive laser systems 180.

再次參照圖1A,光源100包括具有一孔徑140允 許放大光束110通過並到達標靶位置105的一集光鏡135。此集光鏡135可例如為具有在標靶位置105之主焦點及在中間位置145之副焦點(亦稱為中間焦點)的橢圓鏡,其中EUV光可從光源100輸出及可輸入例如積體電路微影工具(圖中未示出)。光源100亦可包括一末端敞開中空圓錐遮罩150(例如一氣錐),其自集光鏡135朝向標靶位置105漸細,以在允許放大光束110到達標靶位置105的同時,減少電漿產生的殘片進入焦點總成122及/或光束傳輸系統120之數量。針對此目的,可在遮罩中提供導引朝向標靶位置105之氣流。 Referring again to FIG. 1A, the light source 100 includes an aperture 140. The amplified beam 110 passes through and reaches a concentrating mirror 135 at the target location 105. The concentrating mirror 135 can be, for example, an elliptical mirror having a primary focus at the target position 105 and a secondary focus (also referred to as an intermediate focus) at the intermediate position 145, wherein the EUV light can be output from the light source 100 and can be input, for example, an integrated body. Circuit lithography tool (not shown). The light source 100 can also include an open ended hollow conical mask 150 (eg, a gas cone) that tapers from the concentrating mirror 135 toward the target location 105 to reduce plasma while allowing the amplified beam 110 to reach the target location 105. The resulting debris enters the number of focus assemblies 122 and/or beam delivery systems 120. For this purpose, the airflow directed towards the target location 105 can be provided in the mask.

光源100亦可包括一主控制器155,其連接至細滴 位置偵測回授系統156、雷射控制系統157、及光束控制系統158。此光源100亦可包括一或多個標靶或細滴成像器160,其提供指出例如相對於標靶位置105的細滴位置之輸出,且提供此輸出給細滴位置偵測回授系統156,其可例如計算出細滴位置及軌道,而從此等細滴位置及軌道即可一個細滴一個細滴地或平均地計算出細滴位置誤差。此細滴位置偵測回授系統156因此提供細滴位置誤差作為主控制 器155的輸入。此主控制器155可因此提供一雷射位置、方向、及時序校正信號,例如給可被用來譬如控制雷射時序電路的雷射控制系統157及/或給光束控制系統158,以控制光束傳輸系統120之放大光束位置及成形,以改變腔室130內的光束焦點之位置及/或焦點功率。 The light source 100 can also include a main controller 155 connected to the fine droplets Position detection feedback system 156, laser control system 157, and beam control system 158. The light source 100 can also include one or more target or fine droplet imagers 160 that provide an output indicative of, for example, a droplet position relative to the target location 105, and provide this output to the droplet position detection feedback system 156. For example, the position and orbit of the fine droplets can be calculated, and from the fine droplet positions and the tracks, the fine droplet position error can be calculated by one fine drop or one fine drop or evenly. This fine drop position detection feedback system 156 thus provides fine drop position error as the primary control The input of the device 155. The main controller 155 can thus provide a laser position, direction, and timing correction signal, such as a laser control system 157 and/or a beam control system 158 that can be used, for example, to control a laser timing circuit to control the beam. The amplified beam position and shaping of transmission system 120 changes the position of the beam focus and/or focus power within chamber 130.

靶材傳遞系統125包括靶材傳遞控制系統126,其 可響應於來自主控制器155之信號而運作,例如修正細滴在由靶材供應裝置127釋放時之釋放點,以校正到達所欲標靶位置105之細滴中的誤差。 Target delivery system 125 includes a target delivery control system 126 that The operation may be responsive to signals from the main controller 155, such as correcting the release point of the droplets as they are released by the target supply 127 to correct for errors in the fine droplets reaching the desired target position 105.

此外,光源100可包括量測一或多個EUV光參數 的一光源偵測器165,此等參數包括但不限於脈衝能量、與波長有函數關係的能量分佈、在特定波長帶內的能量、在特定波長帶外的能量、及EUV強度及/或平均功率的角度分佈。光源偵測器165產生供主控制器155使用的一回授信號。此回授信號可例如指出諸如雷射脈衝的時序及焦點之參數中的誤差,以適切地在正確位置點及時間攔截液滴供有效且有效率EUV光產出。 Additionally, light source 100 can include measuring one or more EUV light parameters a light source detector 165, such as but not limited to pulse energy, energy distribution as a function of wavelength, energy in a particular wavelength band, energy outside a particular wavelength band, and EUV intensity and/or average The angular distribution of power. Light source detector 165 generates a feedback signal for use by main controller 155. This feedback signal may, for example, indicate errors in the timing of the laser pulse and the parameters of the focus to properly intercept the droplets at the correct point and time for efficient and efficient EUV light production.

光源100亦可包括一導引雷射175,其用來對準光 源100的多個部段或輔助引導放大光束110至標靶位置105。關於導引雷射175,光源100包括一度量系統124,其置設於焦點總成122內以對來自導引雷射175及放大光束110的光之一部分取樣。在其他具現例中,度量系統124置設於光束傳輸系統120內。此度量系統124可包括取樣或重新導引光之一子集的一光學元件,此光學元件由可承受導 引雷射光束及放大光束110之功率的任何材料所製成。由於主控制器155分析來自導引雷射175的取樣光且使用此資訊透過光束控制系統158調整焦點總成122內的組件,度量系統124及主控制器155便形成了一光束分析系統。 The light source 100 can also include a guiding laser 175 for aligning light The plurality of sections of source 100 or auxiliary guides the amplified beam 110 to the target location 105. With respect to guiding the laser 175, the light source 100 includes a metrology system 124 disposed within the focus assembly 122 to partially sample one of the light from the pilot laser 175 and the amplified beam 110. In other embodiments, the metrology system 124 is disposed within the beam delivery system 120. The metrology system 124 can include an optical component that samples or redirects a subset of the light that is tolerated Made of any material that directs the laser beam and amplifies the power of the beam 110. Since the main controller 155 analyzes the sampled light from the pilot laser 175 and uses this information to adjust the components within the focus assembly 122 through the beam control system 158, the metrology system 124 and the main controller 155 form a beam analysis system.

因此,總結來說,光源100產生一放大光束110, 其沿光束路徑被導引以在標靶位置105照射標靶混合物114,來將混合物114內的靶材轉換成放射在EUV範圍之光的電漿。此放大光束110在基於雷射系統115之設計與特性所決定的一特定波長(其亦稱為源波長)下運作。此外,在靶材提供足夠的回授給雷射系統115以產生同調雷射光、或若驅動雷射系統115包括合適光學回授以形成一雷射腔時,放大光束110可為一雷射光束。 Therefore, in summary, the light source 100 produces an amplified beam 110, It is directed along the beam path to illuminate the target mixture 114 at the target location 105 to convert the target within the mixture 114 into a plasma that emits light in the EUV range. This amplified beam 110 operates at a particular wavelength (also referred to as the source wavelength) that is determined based on the design and characteristics of the laser system 115. In addition, the amplified beam 110 can be a laser beam if the target provides sufficient feedback to the laser system 115 to produce coherent laser light, or if the driving laser system 115 includes suitable optical feedback to form a laser cavity. .

參照圖2A,光源100在一範例具現例中包括置設 在驅動雷射系統115與標靶位置105間的一最終焦點總成210及一光束傳輸系統240。此最終焦點總成210將放大光束110聚焦在真空容器130中的標靶位置105處。驅動雷射系統115產生由光束傳輸系統240接收的放大光束110。放大光束110通過光束傳輸系統240後,到達最終焦點總成210。此最終焦點總成210將放大光束110聚焦且導引光束110至真空容器130。 Referring to FIG. 2A, the light source 100 includes a set in an example. A final focus assembly 210 and a beam delivery system 240 between the laser system 115 and the target position 105 are driven. This final focus assembly 210 focuses the amplified beam 110 at the target location 105 in the vacuum vessel 130. The drive laser system 115 produces an amplified beam 110 that is received by the beam delivery system 240. After the amplified beam 110 passes through the beam delivery system 240, it reaches the final focus assembly 210. This final focus assembly 210 focuses the amplified beam 110 and directs the beam 110 to the vacuum vessel 130.

如同下文所述,在光源100運作的同時,放大光 束110的對準可主動受調整。特別是,為判定一不均勻的溫度分佈存在於一透鏡固持器212上,主控制器155藉由移動及/或重新定位導向元件來控制在最終焦點總成210及/或光 束傳輸系統240中的導向元件。移動及/或重新定位導向元件可調整放大光束110的位置,使得放大光束110為對準以使EUV光生成作用最大化。此導向元件可為光源100中能影響放大光束110之位置及/或方向的任何元件。 As described below, while the light source 100 is operating, the light is amplified The alignment of the beam 110 can be actively adjusted. In particular, to determine that an uneven temperature distribution exists on a lens holder 212, the main controller 155 controls the final focus assembly 210 and/or light by moving and/or repositioning the guiding elements. A guiding element in the beam transport system 240. Moving and/or repositioning the guiding elements adjusts the position of the magnified beam 110 such that the magnifying beam 110 is aligned to maximize EUV light generation. This guiding element can be any element in the light source 100 that can affect the position and/or orientation of the amplified beam 110.

光束傳輸系統240包括一導向模組242。此導向模 組242包括一或多個光學組件(諸如鏡體),其在定置或移動時,會造成在放大光束110之位置上的一對應變化。主控制器155藉由例如提供信號給光學組件以使組件移動或改變位置來控制導向模組242的光學組件。導向模組242中的光學組件之範例會在下文就圖6論述。主控制器155與導向模組242之光學元件間的交互作用係就圖7及8在以下論述。 Beam delivery system 240 includes a guide module 242. This guiding mode Group 242 includes one or more optical components (such as a mirror body) that, when positioned or moved, cause a corresponding change in the position of the magnified beam 110. The main controller 155 controls the optical components of the guide module 242 by, for example, providing a signal to the optical assembly to move or change the position of the assembly. An example of an optical component in the guide module 242 will be discussed below with respect to FIG. The interaction between the main controller 155 and the optical components of the guide module 242 is discussed below with respect to Figures 7 and 8.

最終焦點總成210包括導向鏡214、透鏡固持器 212、最終焦點透鏡218、支撐架220、及定位致動器221。 導向鏡214接收來自光束傳輸系統240的光束110,且將此光束110反射朝向最終焦點透鏡218,透鏡218將光束110聚焦在標靶位置105上。由於聚焦的光束110及細滴間的交互作用造成EUV光的產生,且維持光束110的適當對準能協助保持焦點位在標靶位置105上,故監測光束110的位置及品質並響應監測而重新定位光束110可改善光源100的性能。 The final focus assembly 210 includes a mirror 214, a lens holder 212, final focus lens 218, support frame 220, and positioning actuator 221. The steering mirror 214 receives the beam 110 from the beam delivery system 240 and reflects this beam 110 toward the final focus lens 218, which focuses the beam 110 at the target location 105. Since the interaction between the focused beam 110 and the droplets causes EUV light to be generated, and maintaining proper alignment of the beam 110 can help maintain the focus position at the target position 105, monitoring the position and quality of the beam 110 and responding to the monitoring Repositioning the beam 110 can improve the performance of the light source 100.

透鏡固持器212圍繞透鏡218,且透鏡固持器212 的溫度與透鏡218之表面上的溫度成比例。圖2B顯示沿圖2A中線2B-2B取得之透鏡固持器212的範例具現例之一前視圖。在圖2A及2B所示範例中,透鏡固持器212係為由透鏡218向外延伸的一熱遮罩。透鏡固持器212之不同部分的 溫度由溫度感測器228A、228B、228C、及228D量測。溫度感測器228A、228B、228C、及228D沿透鏡固持器212之周邊234互相大略等距隔開。溫度感測器228A~228D可置放在透鏡固持器212之內表面237及/或外表面238。雖然感測器228A~228D顯示為沿透鏡固持器212之外周邊置放,但不必然如此。感測器228A~228D可置放在透鏡固持器212之內表面237及/或外表面238的任何處。 Lens holder 212 surrounds lens 218 and lens holder 212 The temperature is proportional to the temperature on the surface of the lens 218. 2B shows a front view of an exemplary embodiment of the lens holder 212 taken along line 2B-2B of FIG. 2A. In the example shown in FIGS. 2A and 2B, lens holder 212 is a thermal shield that extends outwardly from lens 218. Different parts of the lens holder 212 The temperature is measured by temperature sensors 228A, 228B, 228C, and 228D. Temperature sensors 228A, 228B, 228C, and 228D are spaced substantially equidistant from one another along perimeter 234 of lens holder 212. Temperature sensors 228A-228D can be placed on inner surface 237 and/or outer surface 238 of lens holder 212. While the sensors 228A-228D are shown as being placed along the periphery of the lens holder 212, this is not necessarily the case. Sensors 228A-228D can be placed anywhere on inner surface 237 and/or outer surface 238 of lens holder 212.

由任一感測器228A~228D量測的溫度與最接近 特定溫度感測器之透鏡218的一部分之溫度成比例。例如,由溫度感測器228A量測之溫度表示在透鏡218之部分235上的溫度。同樣地,由溫度感測器228B量測之溫度表示在透鏡218之部分236上的溫度。 The temperature measured by any of the sensors 228A~228D is closest to The temperature of a portion of the lens 218 of a particular temperature sensor is proportional. For example, the temperature measured by temperature sensor 228A represents the temperature on portion 235 of lens 218. Likewise, the temperature measured by temperature sensor 228B represents the temperature on portion 236 of lens 218.

如同光束傳輸系統240,最終焦點總成210包括引 導光束110且可被調整以校正未對準的光學元件。例如,最終焦點總成210包括導向鏡214。此導向鏡214包括具有反射放大光束110之反射部分215的一固持器217,及響應於接收來自主控制器155的命令信號而在「X」及「Y」方向之一者或二者中移動固持器217及/或反射部分215的一致動器216。因此,導向鏡214可導引放大光束110至最終焦點透鏡218的一特定部分。此可協助確保光束110係聚焦在標靶位置105。此最終焦點總成210亦可包括定位沿「X」方向移動透鏡218以進一步調整光束110之焦點位置的致動器。 Like the beam delivery system 240, the final focus assembly 210 includes an introduction The beam 110 can be adjusted to correct for misaligned optical components. For example, the final focus assembly 210 includes a steering mirror 214. The steering mirror 214 includes a holder 217 having a reflective portion 215 that reflects the amplified beam 110, and moves in one or both of the "X" and "Y" directions in response to receiving a command signal from the main controller 155. The holder 217 and/or the actuator 216 of the reflective portion 215. Thus, the mirror 214 can direct the amplified beam 110 to a particular portion of the final focus lens 218. This can assist in ensuring that the beam 110 is focused at the target location 105. The final focus assembly 210 can also include an actuator that positions the lens 218 in the "X" direction to further adjust the focus position of the beam 110.

放大光束110從最終焦點總成210通過進入真空容器130。放大光束110通過在集光鏡135中的孔徑140且朝 標靶位置105行進。放大光束110與標靶混合物114中的細滴交互作用以產生EUV光。真空容器130可由一EUV監測模組241來監測。此EUV監測模組241可包括就圖1A所論述的光源偵測器165。提供EUV監測模組241的輸出給主控制器155且此輸出可用來監測EUV光生成量。例如,EUV監測模組241的輸出可被用來調整在導向模組242及/或導向鏡214中的組件以使在標靶位置105產生的EUV光數量最大化。 The amplified beam 110 passes from the final focus assembly 210 into the vacuum vessel 130. The amplified beam 110 passes through the aperture 140 in the concentrating mirror 135 and The target position 105 travels. The amplified beam 110 interacts with the droplets in the target mixture 114 to produce EUV light. The vacuum vessel 130 can be monitored by an EUV monitoring module 241. The EUV monitoring module 241 can include a light source detector 165 as discussed with respect to FIG. 1A. The output of the EUV monitoring module 241 is provided to the main controller 155 and this output can be used to monitor the amount of EUV light generated. For example, the output of the EUV monitoring module 241 can be used to adjust components in the steering module 242 and/or the steering mirror 214 to maximize the amount of EUV light generated at the target location 105.

圖3A及3B顯示作為時間之一函數而如同由耦合 至一最終焦點鏡罩之表面的四個熱電偶所量測的溫度。此最終焦點鏡罩可類似於上述之透鏡固持器212。熱電偶可用與感測器228A~228D(圖2A及2D)類似的方式置設在鏡罩上。在圖3A及3B中,時間序列302、304、306及308各代表由一特定熱電偶在一段時間內量測的溫度。 Figures 3A and 3B show as a function of time as if by coupling The temperature measured by the four thermocouples on the surface of the final focus mirror. This final focus mirror can be similar to lens holder 212 described above. Thermocouples can be placed on the mirror cover in a manner similar to sensors 228A-228D (Figs. 2A and 2D). In Figures 3A and 3B, time series 302, 304, 306, and 308 each represent a temperature measured by a particular thermocouple over a period of time.

圖3A顯示根據在光源100產生相對不穩定數量 的EUV功率時所收集的資料之一範例,圖3B顯示根據在光源100產生相對穩定(固定)數量的EUV功率時所收集的資料之一範例。最終焦點鏡罩可類似於圖2B中所示之透鏡固持器212。 FIG. 3A shows that a relatively unstable amount is generated according to the light source 100. An example of one of the data collected for EUV power, FIG. 3B shows an example of data collected based on the relatively stable (fixed) amount of EUV power generated by source 100. The final focus mirror can be similar to the lens holder 212 shown in Figure 2B.

如同範例所示,光源100係在叢發率900Hz的小 叢發模式下運作。比較圖3A及3B,最終焦點鏡罩之溫度於一段時間內在光源100產生穩定的EUV功率時(圖3B)較光源100產生相對不穩定的EUV功率時相對較為恆定。例如,圖3B顯示在一段時間內會有約攝氏1~2度的溫度偏差,且四個熱電偶之間在一特定時間會發生約攝氏2~4度的溫度偏 差;即使在光源100產生相對穩定的EUV功率時亦然。相反地,圖3A顯示由一特定熱電偶在一段時間內所量測的溫度及由全部熱電偶在一特定時間所量測的溫度之較大變化。 因此,藉由在鏡罩上的多個位置於一段時間內所量測的溫度且調整光束,直到在熱遮罩上量測的溫度分佈在時間及/或空間變得相對恆定為止,由光源100產生的EUV功率之穩定性及數量可被改善。 As shown in the example, the light source 100 is small at a burst rate of 900 Hz. Operating in burst mode. Comparing Figures 3A and 3B, the temperature of the final focus mirror is relatively constant over a period of time when the source 100 produces a stable EUV power (Fig. 3B) when the source 100 produces a relatively unstable EUV power. For example, Figure 3B shows that there will be a temperature deviation of about 1 to 2 degrees Celsius over a period of time, and a temperature deviation of about 2 to 4 degrees Celsius will occur between four thermocouples at a specific time. Poor; even when the light source 100 produces relatively stable EUV power. Conversely, Figure 3A shows the temperature measured by a particular thermocouple over a period of time and the large change in temperature measured by all thermocouples at a particular time. Thus, by adjusting the temperature over a period of time at a plurality of locations on the mirror cover and adjusting the beam until the temperature profile measured on the thermal mask becomes relatively constant in time and/or space, the source The stability and quantity of EUV power generated by 100 can be improved.

參照圖4A~5B,圖4A係為有光束110未對準之最 終焦點透鏡總成210的一側視圖,而圖4B顯示最終焦點透鏡218之一前視圖,且光束110係沿圖4A中之線4B-4B所取得。圖5A係為有光束110正常對準之最終焦點透鏡總成210的一側視圖。圖5B顯示從圖5A中的線5B-5B取得之最終焦點透鏡218之一前視圖。 4A to 5B, FIG. 4A is the most misaligned beam 110 A side view of the final focus lens assembly 210, while FIG. 4B shows a front view of one of the final focus lenses 218, and the beam 110 is taken along line 4B-4B in FIG. 4A. FIG. 5A is a side view of the final focus lens assembly 210 with the beam 110 aligned normally. Figure 5B shows a front view of one of the final focus lenses 218 taken from line 5B-5B in Figure 5A.

在圖4A及4B所示之範例中,光束110係為未對準 並通過最終焦點透鏡218在遠離透鏡218之中心244的一位置243處。因此,透鏡靠近溫度感測器228A的一部分較透鏡218的其他部分溫暖,且感測器228A產生較感測器228B、228C及228D更高的溫度讀值。再者,由於光束110並未通過透鏡218之中心244,光束110不會聚焦在標靶位置105上。因此,標靶混合物114中的細滴可能不會輕易轉換成電漿,而造成僅產生一些或沒有EUV光。 In the example shown in Figures 4A and 4B, the beam 110 is misaligned. And passing through the final focus lens 218 at a location 243 remote from the center 244 of the lens 218. Thus, a portion of the lens near temperature sensor 228A is warmer than other portions of lens 218, and sensor 228A produces a higher temperature reading than sensors 228B, 228C, and 228D. Moreover, since the beam 110 does not pass through the center 244 of the lens 218, the beam 110 will not focus on the target location 105. Therefore, the fine droplets in the target mixture 114 may not be easily converted into plasma, resulting in only some or no EUV light.

來自感測器228A~228D的溫度讀值提供給主控 制器155。主控制器155比較溫度讀值且決定光束110之位置,例如相對於中心244或在空間座標中。主控制器155提 供足以使反射部分215改變位置以將光束110移入透鏡218之中心244的一信號給導向鏡214。 Temperature readings from sensors 228A~228D are provided to the master Controller 155. The main controller 155 compares the temperature readings and determines the position of the beam 110, such as relative to the center 244 or in space coordinates. Main controller 155 A signal is provided to the mirror 214 for a signal sufficient to cause the reflective portion 215 to change position to move the beam 110 into the center 244 of the lens 218.

如圖5A及5B所示,導向鏡214在「A」及「B」 方向移動以將光束110移動至透鏡218的中心244。致動器221亦在「Z」方向移動透鏡218以聚焦光束110。由於此等調整,光束110在透鏡218上呈對稱且各溫度感測器228A~228D量測出大略相同溫度。光束110聚焦在標靶位置105,且照射標靶混合物114中的細滴。此細滴轉換成電漿並放出EUV光。 As shown in Figures 5A and 5B, the mirror 214 is at "A" and "B" The direction moves to move the beam 110 to the center 244 of the lens 218. Actuator 221 also moves lens 218 in the "Z" direction to focus beam 110. Due to these adjustments, beam 110 is symmetric on lens 218 and each temperature sensor 228A-228D measures approximately the same temperature. The beam 110 is focused at the target location 105 and illuminates the droplets in the target mixture 114. This fine droplet is converted into a plasma and emits EUV light.

因此,與圖4A及4B之範例比較,藉由以導向鏡 214定位光束110使光束110通過透鏡218之中心244,EUV光產生的數量增加。再者,EUV光之數量的穩定性亦可改善,因為藉由監測光束110相對於透鏡218之對準,光束110可更一致聚焦在標靶位置105,故而產生相對固定數量的EUV光。 Therefore, compared with the examples of FIGS. 4A and 4B, by using a mirror The 214 positioning beam 110 causes the beam 110 to pass through the center 244 of the lens 218, and the amount of EUV light generated increases. Moreover, the stability of the amount of EUV light can also be improved because by monitoring the alignment of beam 110 with respect to lens 218, beam 110 can be more uniformly focused at target location 105, thereby producing a relatively fixed amount of EUV light.

參照圖6,一範例光束傳遞系統600置設於驅動雷 射系統605及標靶位置610間。此光束傳遞系統600包括一光束傳輸系統615及一焦點總成620。此光束傳輸系統615可用作為光束傳輸系統240,而焦點總成620可用作為最終焦點總成210。 Referring to Figure 6, an exemplary beam delivery system 600 is placed in a drive mine The injection system 605 and the target position 610. The beam delivery system 600 includes a beam delivery system 615 and a focus assembly 620. This beam delivery system 615 can be used as the beam delivery system 240, and the focus assembly 620 can be used as the final focus assembly 210.

光束傳輸系統615接收由驅動雷射系統605產生的一放大光束625,重新導引且擴展此放大光束625,並接著將已擴展已重新導引的放大光束514導向焦點總成620。此焦點總成620將放大光束625聚焦在標靶位置610上。 Beam delivery system 615 receives an amplified beam 625 generated by drive laser system 605, redirects and expands the amplified beam 625, and then directs the expanded redirected amplified beam 514 to focus assembly 620. This focus assembly 620 focuses the amplified beam 625 on the target location 610.

光束傳輸系統615包括光學組件,諸如改變放大 光束625之方向的鏡體630、632及其他光束導引光學元件634。光學組件630、632、634及638可包括在光束傳輸系統240之導向模組242中(圖2A)。 Beam delivery system 615 includes optical components, such as changing magnification The mirror bodies 630, 632 and other beam guiding optical elements 634 in the direction of the beam 625. Optical components 630, 632, 634, and 638 can be included in guide module 242 of beam delivery system 240 (Fig. 2A).

光束傳輸系統615亦包括一光束擴展系統640,其 擴展放大光束625,使得光束擴展系統640送出之放大光束625的橫向尺寸大於進入光束擴展系統640之放大光束625的橫向尺寸。此光束擴展系統640可包括一彎曲鏡,其具有橢圓拋物面之離軸片段的一反射面(此鏡亦可稱為一離軸拋物面鏡)。此光束擴展系統640可包括被選定以重新導引且擴展或準直放大光束625的其他光學組件。用於光束擴展系統640的多種設計於名為「用於極紫外光源之光束傳輸系統」的美國專利申請案第12/638,092號中論述,該案整個藉參考方式併入本文。 Beam delivery system 615 also includes a beam expansion system 640 that The amplified beam 625 is expanded such that the lateral extent of the amplified beam 625 sent by the beam expanding system 640 is greater than the lateral dimension of the amplified beam 625 entering the beam expanding system 640. The beam expanding system 640 can include a curved mirror having a reflective surface of the off-axis segment of the elliptical paraboloid (this mirror can also be referred to as an off-axis parabolic mirror). This beam expanding system 640 can include other optical components that are selected to redirect and expand or collimate the amplified beam 625. A variety of designs for the beam expansion system 640 are discussed in U.S. Patent Application Serial No. 12/638,092, the entire disclosure of which is incorporated herein by reference.

如圖6所示,焦點總成620包括一鏡體650及包括 一聚焦元件,其包括一斂聚透鏡655組配且配置成將從鏡體650反射的放大光束625聚焦至標靶位置610。此斂聚透鏡655可為斂聚透鏡218,而鏡體650可為就圖2A論述之範例中的導向鏡214。 As shown in FIG. 6, the focus assembly 620 includes a mirror body 650 and includes A focusing element includes a converging lens 655 that is assembled and configured to focus the magnified beam 625 reflected from the mirror body 650 to the target position 610. The converging lens 655 can be a converging lens 218, and the mirror body 650 can be a guiding mirror 214 in the example discussed with respect to FIG. 2A.

因此,在光束傳輸系統615中的鏡體630、632、 638及光束導引光學元件634之至少一者與焦點總成620中的鏡體650可藉使用由一致動系統致動的可移動座體而為可移動式,該致動系統包括可由主控制器155控制以針對標靶位置610提供放大光束625之主動指向控制之一馬達。可 移動鏡體及光束導引光學元件可被調整以維持放大光束625在透鏡655上的位置及放大光束625在靶材的焦點。 Therefore, the mirror bodies 630, 632 in the beam delivery system 615, At least one of 638 and beam directing optical element 634 and mirror body 650 in focus assembly 620 can be movable by using a movable base that is actuated by an actuating system that includes control by the master The 155 controls a motor that provides active pointing control of the amplified beam 625 for the target position 610. can The moving mirror body and beam steering optics can be adjusted to maintain the position of the amplified beam 625 on the lens 655 and to magnify the focus of the beam 625 at the target.

歛聚透鏡655可為球透鏡,以減少球像差及球透鏡可產生的其他光學像差。此斂聚透鏡655可安裝在腔室壁上作為一窗、可安裝在腔室內部、或可安裝在腔室外部。透鏡655可為可移動且因此其可安裝至一或多個致動器上,以在系統運作期間提供用於主動焦點控制的機構。依此,透鏡655可移動以更有效率收集放大光束625且將此光束625導引至標靶位置以增加EUV產出數量或使其最大化。透鏡655位移量及方向係依據由上述溫度感測器228A~228D或以下將論述之熱感測器710提供的回授來判定。 Converging lens 655 can be a ball lens to reduce spherical aberration and other optical aberrations that can be produced by the ball lens. The converging lens 655 can be mounted on the chamber wall as a window, can be mounted inside the chamber, or can be mounted outside the chamber. Lens 655 can be movable and thus can be mounted to one or more actuators to provide a mechanism for active focus control during system operation. Accordingly, lens 655 can be moved to collect amplified beam 625 more efficiently and direct this beam 625 to the target position to increase or maximize the amount of EUV produced. The amount and direction of displacement of the lens 655 is determined in accordance with the feedback provided by the temperature sensors 228A-228D described above or the thermal sensor 710 discussed below.

斂聚透鏡655具有大到足夠捕捉大部分的放大光束625且還提供足夠曲度以將放大光束625聚焦至標靶位置的一直徑。一些具現例中,斂聚透鏡655可有至少0.25的數值孔徑。一些具現例中,斂聚透鏡655由ZnSe製成,其為可用在紅外線應用的材料。ZnSe有一涵蓋0.6至20μm的透射範圍且可用於從高功率放大器產生的高功率光束。ZnSe在電磁頻譜之紅端(特別是紅外線端)中具有一低熱吸收。其他可用於斂聚透鏡的材料包括但不限於砷化鎵(GaAs)及鑽石。此外,斂聚透鏡655可包括一抗反射塗層,且可透射在放大光束625之波長的至少95%的放大光束625。 Converging lens 655 has a diameter that is large enough to capture a majority of the amplified beam 625 and also provides sufficient curvature to focus the amplified beam 625 to the target location. In some embodiments, the condensing lens 655 can have a numerical aperture of at least 0.25. In some cases, the condensing lens 655 is made of ZnSe, which is a material that can be used in infrared applications. ZnSe has a transmission range covering 0.6 to 20 μm and can be used for high power beams generated from high power amplifiers. ZnSe has a low heat absorption in the red end (especially the infrared end) of the electromagnetic spectrum. Other materials that can be used to collect lenses include, but are not limited to, gallium arsenide (GaAs) and diamonds. Additionally, the converging lens 655 can include an anti-reflective coating and can transmit an amplified beam 625 of at least 95% of the wavelength of the amplified beam 625.

焦點總成620一可包括捕捉從透鏡655反射之光線665的一度量系統660。捕捉的光線可用來分析放大光束 625及來自導引雷射175之光線的特性,例如,用以判定放大光束625的位置及監測放大光束625之焦距的變化。 Focus assembly 620 may include a metrology system 660 that captures light 665 reflected from lens 655. The captured light can be used to analyze the amplified beam 625 and characteristics of the light from the guided laser 175, for example, to determine the position of the amplified beam 625 and to monitor the change in the focal length of the amplified beam 625.

光束傳遞系統600亦可包括一對準雷射670,其在 建置時用來對準光束傳遞系統600之組件(諸如鏡體630、632、光束導引光學元件634、光束擴展系統640內的組件、及透鏡前鏡體650)的一或多者之定位及角度或位置。此對準雷射670可為在可見光譜中運作以協助組件之視覺對準的一二極體雷射。 Beam delivery system 600 can also include an alignment laser 670, which is Positioning of one or more of the components used to align with the beam delivery system 600 (such as the mirror bodies 630, 632, the beam guiding optical element 634, the components within the beam expanding system 640, and the lens front mirror body 650) when deployed And angle or position. This alignment laser 670 can be a diode laser that operates in the visible spectrum to assist in visual alignment of the components.

光束傳遞系統600亦可包括諸如相機的一檢測裝 置675,其監測在標靶位置610從標靶混合物114中之細滴反射的光束,此光束從驅動雷射系統605之前表面反射以形成可在檢測裝置675處被檢測到的一診斷光束680。檢測裝置675可連接至主控制器155。 The beam delivery system 600 can also include a test cartridge such as a camera At 675, it monitors the beam reflected from the droplets in the target mixture 114 at the target location 610 that is reflected from the surface prior to driving the laser system 605 to form a diagnostic beam 680 that can be detected at the detection device 675. . Detection device 675 can be coupled to main controller 155.

參照圖7,顯示在EUV光源中對準放大光束(或驅 動雷射)的範例系統700之一方塊圖。此系統700包括與一受監測元件720及一控制器730連通的一熱感測器710。此控制器730亦與一致動系統740連通。此致動系統740耦合至一導向元件750且與其連通。 Referring to Figure 7, it is shown that the magnifying beam is aligned in the EUV source (or A block diagram of a sample system 700 of a moving laser. The system 700 includes a thermal sensor 710 in communication with a monitored component 720 and a controller 730. This controller 730 is also in communication with the actuation system 740. This actuation system 740 is coupled to and in communication with a guiding element 750.

藉由監測受監測元件720之溫度,在系統700使用 時,系統700可使驅動雷射(圖中未示出)對準。溫度被提供給控制器730,且控制器730提供足以使導向元件750重新定位驅動雷射光束的一信號731給致動系統740,直到受監測元件720之溫度大略均勻為止。在受監測元件720之溫度於時間及/或空間上大略固定時,此驅動雷射光束可被對準。 因此,系統700可視為提供了驅動雷射光束的主動對準。 By monitoring the temperature of the monitored component 720, it is used in system 700. System 700 can cause a drive laser (not shown) to be aligned. Temperature is provided to controller 730, and controller 730 provides a signal 731 sufficient for reorienting guide beam 750 to drive the laser beam to actuation system 740 until the temperature of monitored element 720 is substantially uniform. The driven laser beam can be aligned when the temperature of the monitored component 720 is substantially fixed in time and/or space. Thus, system 700 can be viewed as providing active alignment that drives a laser beam.

熱感測器710可為任何類型的感測器,其在該感 測器置放於、接觸於、或靠近於受監測元件720時,會產生受監測元件720之溫度指標。例如,此熱感測器710可為熱電偶、基於纖維的熱感測器、或熱阻器中之一或多者。此熱感測器710可包括一個以上熱感測器,且此等多個熱感測器皆可為相同類型,或它們可以為多種不同類型之熱感測器的集合。 The thermal sensor 710 can be any type of sensor that feels When the detector is placed in, in contact with, or in proximity to the monitored component 720, a temperature index of the monitored component 720 is generated. For example, the thermal sensor 710 can be one or more of a thermocouple, a fiber based thermal sensor, or a thermal resistor. The thermal sensor 710 can include more than one thermal sensor, and the plurality of thermal sensors can all be of the same type, or they can be a collection of a plurality of different types of thermal sensors.

熱感測器710包括一感測機構712、一輸入/輸出 (I/O)介面716、及一電源模組718。感測機構712係為能夠感測熱能且產生表示感測到的熱能數量之一信號或其他指標的一主動或被動元件。I/O介面716允許感測到的熱能之信號或其他指標從熱感測器710取用及/或移除。此I/O介面716亦允許系統700的使用者透過例如遠端電腦與熱感測器710通訊,以取用由感測機構712產生之信號。此熱感測器710亦可包括將熱感測器710連接至受監測元件720之一表面或其他部分的一耦合件714。耦合件714可為將熱感測器710實體連接至受監測元件720的一機械耦合件。此耦合件714可為保持熱感測器710靠近受監測元件720但未將熱感測器710實體連接至受監測元件720的一元件。 The thermal sensor 710 includes a sensing mechanism 712, an input/output (I/O) interface 716, and a power module 718. Sensing mechanism 712 is an active or passive component capable of sensing thermal energy and generating a signal or other indicator indicative of the amount of thermal energy sensed. The I/O interface 716 allows signals or other indicators of the sensed thermal energy to be taken and/or removed from the thermal sensor 710. The I/O interface 716 also allows a user of the system 700 to communicate with the thermal sensor 710 via, for example, a remote computer to access signals generated by the sensing mechanism 712. The thermal sensor 710 can also include a coupling 714 that connects the thermal sensor 710 to one of the surfaces or other portions of the monitored component 720. Coupling 714 can be a mechanical coupling that physically couples thermal sensor 710 to monitored component 720. This coupling 714 can be an element that holds the thermal sensor 710 close to the monitored component 720 but does not physically connect the thermal sensor 710 to the monitored component 720.

熱感測器710量測受監測元件720之一部分的溫 度。受監測元件720可為任何在高功率光學組件722之附近的熱傳導元件。例如,受監測元件720係為在高功率光學組件722附近的實體組件,其透過反射或折射與驅動雷射光束 交互作用。此高功率光學組件722可為透過反射或折射與驅動雷射光束交互作用的任何組件。例如,高功率光學組件722可為暴露於大數量雷射功率的一光學元件,諸如一最終焦點透鏡(諸如透鏡218)、功率放大器上的一窗(諸如輸入窗189及193及/或輸出窗185、190、及194)、最終焦點透鏡總成中的一導向鏡(諸如導向鏡214)、最終焦點透鏡之下游的一鏡體、及/或一空間濾器孔徑(諸如孔徑197)。一個以上高功率光學組件722可同時被監測。 The thermal sensor 710 measures the temperature of a portion of the monitored component 720 degree. The monitored component 720 can be any thermal conduction component in the vicinity of the high power optical component 722. For example, the monitored component 720 is a physical component in the vicinity of the high power optical component 722 that transmits or reflects the laser beam through reflection or refraction. Interaction. This high power optical component 722 can be any component that interacts with the driven laser beam through reflection or refraction. For example, high power optical component 722 can be an optical component that is exposed to a large amount of laser power, such as a final focus lens (such as lens 218), a window on the power amplifier (such as input windows 189 and 193 and/or an output window). 185, 190, and 194), a steering mirror (such as guide mirror 214) in the final focus lens assembly, a mirror body downstream of the final focus lens, and/or a spatial filter aperture (such as aperture 197). More than one high power optical component 722 can be monitored simultaneously.

若受監測元件720之溫度與組件722之溫度成比 例或受其影響,則受監測元件720可視為在組件722之附近。例如,受監測元件720可為固持、支撐、或保護此等組件722的一元件。例如,受監測元件720可為圍繞最終焦點透鏡的一熱遮罩、將在一鏡體的一或多側上固持該鏡體的一鏡體座體、或固持一空間濾器的一固持器。此受監測元件720可與組件722實體接觸,但並非必然如此,因為受監測元件720與組件722可在實體上彼此分開。 If the temperature of the monitored component 720 is proportional to the temperature of the component 722 The monitored component 720 can be considered to be in the vicinity of the component 722, or affected by it. For example, the monitored component 720 can be an element that holds, supports, or protects such components 722. For example, the monitored component 720 can be a thermal mask surrounding the final focus lens, a mirror body that holds the lens body on one or more sides of the lens body, or a holder that holds a space filter. This monitored component 720 can be in physical contact with the component 722, but this need not be the case, as the monitored component 720 and component 722 can be physically separated from one another.

熱感測器710量測受監測元件720在受監測元件 上之一或多個位置上的溫度。此熱感測器710提供表示在一或多個位置處之溫度的信號給控制器730。在一些具現例中,此熱感測器710量測受監測元件720之溫度一段時間,且提供溫度量測的時間序列給控制器730。此控制器730分析溫度量測結果以判定驅動雷射光束是否適當對準。依據此分析結果,控制器730可提供致動系統740足以校正驅動雷射光束的一信號731。 Thermal sensor 710 measures the monitored component 720 at the monitored component Temperature on one or more locations. This thermal sensor 710 provides a signal to the controller 730 indicating the temperature at one or more locations. In some embodiments, the thermal sensor 710 measures the temperature of the monitored component 720 for a period of time and provides a time series of temperature measurements to the controller 730. This controller 730 analyzes the temperature measurement results to determine if the drive laser beam is properly aligned. Based on the results of this analysis, controller 730 can provide a signal 731 that is sufficient to correct actuation of the laser beam by actuation system 740.

控制器730包括一電子處理器732、一電子儲存器 734、及一I/O介面736。電子儲存器734儲存指令及/或一電腦程式,其在執行時會使電子處理器732實行一些動作。例如,處理器732可接收來自熱感測器710的信號,且分析此等信號以判定在受監測元件720上的溫度分佈於空間及/或時間為不均勻,而因此驅動雷射光束為未對準。輸入/輸出(I/O)介面736可以在顯示器上可見或可聽地呈現處理器732分析過的資料。此I/O介面736可接受來自一輸入裝置(例如由系統700的一操作員或一自動程序致動的一輸入裝置)的命令,以組配熱感測器710、致動系統740、或更新儲存於電子儲存器734中的資料或電腦程式指令。 The controller 730 includes an electronic processor 732 and an electronic storage device. 734, and an I/O interface 736. The electronic storage 734 stores instructions and/or a computer program that, when executed, causes the electronic processor 732 to perform some actions. For example, the processor 732 can receive signals from the thermal sensor 710 and analyze the signals to determine that the temperature distribution on the monitored component 720 is spatially and/or temporally non-uniform, and thus the laser beam is driven alignment. An input/output (I/O) interface 736 can be visible or audibly present on the display to the data analyzed by the processor 732. The I/O interface 736 can accept commands from an input device (eg, an operator actuated by an operator of the system 700 or an automated program) to assemble the thermal sensor 710, the actuation system 740, or The data or computer program instructions stored in the electronic storage 734 are updated.

控制器730提供足以使致動系統740調整導向元 件750之位置的一信號731給致動系統740。此信號可包括例如針對導向元件750之新位置的座標或於一或多個方向移動導向元件750之實體距離。此信號係成能夠由致動系統740接受及處理的形式,且該信號可透過一有線或無線連接傳送到致動系統740。 Controller 730 provides sufficient steering system 740 to adjust the guide element A signal 731 at the location of the member 750 is applied to the actuation system 740. This signal may include, for example, a coordinate for a new position of the guiding element 750 or a physical distance to move the guiding element 750 in one or more directions. This signal is in a form that can be accepted and processed by the actuation system 740, and the signal can be transmitted to the actuation system 740 over a wired or wireless connection.

致動系統740包括一致動機構742、一耦合件 744、及一I/O介面746。此致動機構742可為例如一馬達、一壓電元件、一驅動槓桿、或任何造成在另一物件中之移動的其他元件。此致動系統亦包括一耦合件,其允許致動機構742附接至一外部元件,使得該外部元件可由致動機構742移動。此耦合件744可為與該外部元件作實體接觸的一機械耦合件,或該耦合件744可為非接觸式(諸如一磁性耦 合件)。此I/O介面746允許系統700之一操作者或一自動程序與致動系統740互動。此I/O介面746可例如從該操作者而非從該控制器730,接受足以使致動機構742移動導向元件750之一信號。 The actuation system 740 includes an actuator 742, a coupling member 744, and an I/O interface 746. The actuation mechanism 742 can be, for example, a motor, a piezoelectric element, a drive lever, or any other element that causes movement in another item. The actuation system also includes a coupling that allows the actuation mechanism 742 to be attached to an external component such that the external component can be moved by the actuation mechanism 742. The coupling member 744 can be a mechanical coupling member in physical contact with the external component, or the coupling member 744 can be non-contact (such as a magnetic coupling) Combined). This I/O interface 746 allows an operator of the system 700 or an automated program to interact with the actuation system 740. This I/O interface 746 can receive a signal from the operator, rather than from the controller 730, sufficient to cause the actuation mechanism 742 to move one of the guiding elements 750.

導向元件750與致動機構742接觸,且該導向元件 750響應於來自致動機構742之動作而移動。例如,導向元件750可為一平台,該平台之一部分會在與該平台接觸之致動機構742中的一壓電元件擴展時移動。此導向元件750包括與驅動雷射光束交互作用的一作用區域752。導向元件750之移動造成作用區域752的對應移動,且作用區域的位置變化重新定位光束。例如,作用區域752可為反射該光束的一鏡體,且定位該鏡體即可改變光束反射的方向。 The guiding member 750 is in contact with the actuating mechanism 742, and the guiding member 750 moves in response to action from actuation mechanism 742. For example, the guide member 750 can be a platform that moves a portion of the platform when a piezoelectric element in the actuation mechanism 742 that is in contact with the platform expands. This guiding element 750 includes an active area 752 that interacts with the driving laser beam. Movement of the guide member 750 causes a corresponding movement of the active region 752, and the change in position of the active region repositions the beam. For example, the active area 752 can be a mirror that reflects the beam, and positioning the mirror can change the direction of beam reflection.

參照圖8,用於相對於一光學元件調整放大光束 之位置的一範例程序800被顯示出來。此程序800可實行於EUV光源中的放大光束,諸如圖1A所示之光源100的放大光束110。此程序800可由包括在控制導向該放大光束之元件的定位之一電子組件內的一或多個電子處理器來執行,該電子處理器諸如為包括在就圖7所述之控制器730內的電子處理器732。 Referring to Figure 8, for adjusting an amplified beam relative to an optical component An example program 800 of the location is displayed. This process 800 can be performed on an amplified beam of light in an EUV source, such as the amplified beam 110 of the source 100 shown in FIG. 1A. The program 800 can be performed by one or more electronic processors included in one of the electronic components that control the positioning of the elements that direct the amplified beam, such as included in the controller 730 described with respect to FIG. Electronic processor 732.

一第一溫度分佈被取用(步驟810)。該第一溫度 分佈表示鄰近一第一光學元件之組件的溫度。此第一光學元件係置設來接收放大光束110。在該組件上的溫度與該第一光學元件之溫度成正比或受其影響時,此組件鄰近於該第一光學元件或在其附近。因此,量測組件溫度提供光學 元件之溫度的指標,藉此允許光學元件的溫度可間接地量測。此組件與光學元件可互相實體接觸,或該組件與該光學元件可彼此足夠靠近而使得該光學元件的加熱作用亦會加熱該組件。 A first temperature profile is taken (step 810). The first temperature The distribution represents the temperature of the component adjacent to a first optical component. This first optical element is arranged to receive the amplified beam 110. The component is adjacent to or adjacent to the first optical component when the temperature on the component is proportional to or affected by the temperature of the first optical component. Therefore, measuring component temperature provides optics An indicator of the temperature of the component, thereby allowing the temperature of the optical component to be measured indirectly. The component and the optical element may be in physical contact with one another, or the component and the optical element may be sufficiently close to each other such that heating of the optical element also heats the component.

光學元件藉由反射光束110、吸收光束110、及/ 或傳送光束110來接收放大光束110。此光學元件可為在EUV光源中的任何光學組件。此光學元件可為例如一高功率光學元件,諸如最終焦點透鏡、一功率放大器上的輸出窗、最終焦點旋轉鏡、或一空間濾器孔徑。在光學元件附近的此組件可例如固持或支撐該光學元件。 The optical element is by reflecting the beam 110, absorbing the beam 110, and/or Or the beam 110 is transmitted to receive the amplified beam 110. This optical element can be any optical component in an EUV light source. The optical element can be, for example, a high power optical element such as a final focus lens, an output window on a power amplifier, a final focus rotating mirror, or a spatial filter aperture. This component in the vicinity of the optical element can, for example, hold or support the optical component.

第一溫度分佈可為代表由在組件上或靠近組件 的一或多個溫度感測器取得之溫度量測的一組數值。由於該組件之溫度與光學元件之溫度相關,第一溫度分佈就提供了光學元件之溫度的近似值。此第一溫度分佈可為代表組件之一特定部分在一段時間內的溫度之一組數值。在一些具現例中,此第一溫度分佈可為代表組件之多個不同部分在一段時間或在一特定情況之溫度的一組數值。 The first temperature distribution can be representative of the component on or near the component A set of values measured by one or more temperature sensors. Since the temperature of the component is related to the temperature of the optical component, the first temperature profile provides an approximation of the temperature of the optical component. This first temperature profile can be a set of values representing the temperature of a particular portion of the component over a period of time. In some embodiments, the first temperature profile can be a set of values representing a plurality of different portions of the component over a period of time or at a particular temperature.

所取用的第一溫度分佈被分析以決定一溫度度 量(步驟820)。溫度度量可為與一基準線值比較之數值式質量指標(figure of merit)。溫度度量可為與該光學元件上或鄰近該光學元件之一組件上的溫度分佈細節相關之任何合適的數學表現型態。例如,且如同以下將進一步論述地,溫度度量可為溫度分佈之空間對稱性的量度值,諸如於鄰近光學元件上的不同位置處所量測之溫度的一標準差或方 差。此溫度度量可為一數值,諸如溫度改變的變化量或變化率,其係從代表一或多個感測器228A~228D於一段時間內之溫度的一組數值來決定。 The first temperature distribution taken is analyzed to determine a temperature Amount (step 820). The temperature metric can be a numerical figure of merit compared to a baseline value. The temperature metric can be any suitable mathematical expression associated with temperature distribution details on or adjacent to one of the components of the optical component. For example, and as will be discussed further below, the temperature metric can be a measure of the spatial symmetry of the temperature distribution, such as a standard deviation or square of the temperature measured at different locations on adjacent optical elements. difference. This temperature metric can be a value, such as a change or rate of change in temperature change, determined from a set of values representing the temperature of one or more of the sensors 228A-228D over a period of time.

如上所述,光學元件上的溫度變化量可指出放大 光束110為未對準或其具有差劣品質。因此,分析第一溫度分佈以判定溫度是否相對一致,可提供光束對準及光束品質的指標。例如,該第一溫度分佈可由決定空間對稱性之程度來分析。空間對稱性的程度可藉由例如取用沿透鏡固持器212(圖2A)之一表面大略均勻隔開的四個溫度感測器228A~228D(圖2A)所取得之溫度量測結果來計算。在一特定時間,來自溫度感測器228A~228D的量測結果各提供最終焦點透鏡218之對應部分的溫度指標。若放大光束110如圖4B所示偏心地通過透鏡218,則來自溫度感測器228A及228C的溫度讀值之數值大於來自溫度感測器228B及228D的溫度讀值之數值。感測器228A~228D在一特定時間的溫度讀值之間的差異可指出光束110不是位在透鏡218中央。 As mentioned above, the amount of temperature change on the optical element can be indicated by amplification Beam 110 is misaligned or has poor quality. Therefore, analyzing the first temperature profile to determine if the temperatures are relatively consistent provides an indication of beam alignment and beam quality. For example, the first temperature distribution can be analyzed by determining the degree of spatial symmetry. The degree of spatial symmetry can be calculated, for example, by taking temperature measurements taken from four temperature sensors 228A-228D (Fig. 2A) that are substantially evenly spaced along one surface of lens holder 212 (Fig. 2A). . At a particular time, the measurements from temperature sensors 228A-228D each provide a temperature index for a corresponding portion of final focus lens 218. If the amplified beam 110 is eccentrically passed through the lens 218 as shown in FIG. 4B, the values of the temperature readings from the temperature sensors 228A and 228C are greater than the values from the temperature readings of the temperature sensors 228B and 228D. The difference between the temperature readings of the sensors 228A-228D at a particular time may indicate that the beam 110 is not at the center of the lens 218.

以上所述之範例有關於光束110並非位在透鏡 218中央的情況。另一範例中,若光束110有不均勻的強度分佈,則感測器228A~228D各量測出且生成一不同溫度,而最高的溫度來自最靠近光束110具有最高強度的部分之感測器。因此,藉由比較來自各該感測器228A~228D之溫度數值,光束110可被監測以判定是否在強度中有一空間不均勻性。若來自感測器228A~228D的溫度數值不同,接著光束110則可被決定具有一空間不均勻性。強度分佈之形狀 (作為空間位置之函數的強度之數量)可藉由把感測器228A~228D所提供的溫度數值排序來取得近似值。強度之不均勻性的嚴重度可藉計算感測器228A~228D所量測之溫度的方差或標準差來判定。 The above example relates to the fact that the beam 110 is not in the lens. 218 central situation. In another example, if the beam 110 has an uneven intensity distribution, the sensors 228A-228D are each measured and generate a different temperature, and the highest temperature is from the sensor closest to the beam 110 having the highest intensity. . Thus, by comparing the temperature values from each of the sensors 228A-228D, the beam 110 can be monitored to determine if there is a spatial non-uniformity in the intensity. If the temperature values from sensors 228A-228D are different, then beam 110 can be determined to have a spatial non-uniformity. Shape of intensity distribution (The amount of intensity as a function of spatial position) can be approximated by ordering the temperature values provided by sensors 228A-228D. The severity of the intensity non-uniformity can be determined by calculating the variance or standard deviation of the temperature measured by the sensors 228A-228D.

另一範例中,第一溫度分佈可為代表一或多個感 測器228A~228D在一段時間內的溫度之一組數值。此範例中,該第一溫度分佈可藉計算由感測器228A~228D之任一者所量測之溫度數值的一時間序列之方差或標準差來作分析。在最佳或可接受之運作條件下,放大光束110在標靶位置105對準以聚焦,且該光束110不改變相對於與該光束110交互作用之一光學元件的位置。若光束110在一段時間內改變相對於該光學元件的位置,或若光束110之光束輪廓隨時間變化,則該光學元件上的強度分佈亦會改變。故此,在光束110呈未對準時,由該等感測器228A~228D之各者所量測的溫度亦改變。分析該第一溫度分佈以決定分佈的方差及/或時間之函數的溫度之變化率,可提供光束110之位置或輪廓是否改變之指標。 In another example, the first temperature distribution can represent one or more senses A set of values for the temperature of the detectors 228A-228D over a period of time. In this example, the first temperature profile can be analyzed by calculating a variance or standard deviation of a time series of temperature values measured by any of the sensors 228A-228D. Under optimal or acceptable operating conditions, the amplified beam 110 is aligned at the target location 105 for focusing, and the beam 110 does not change position relative to one of the optical elements that interact with the beam 110. If the beam 110 changes position relative to the optical element over a period of time, or if the beam profile of the beam 110 changes over time, the intensity distribution across the optical element will also change. Thus, when the beam 110 is misaligned, the temperature measured by each of the sensors 228A-228D also changes. Analyzing the rate of change of the first temperature profile to determine the variance and/or time of the distribution provides an indication of whether the position or profile of the beam 110 has changed.

將步驟820中所決定的溫度度量與一基準線溫度度量作比較(步驟830)。此基準線溫度度量可為在光源以一可接受或最佳的方式下操作時所決定的一度量之一數值。所決定之溫度度量可藉由例如從該基準線溫度度量減去經決定的溫度度量,來與該基準線溫度度量比較以決定兩者間之差值。此差值可與一臨界值比較,以判定放大光束110是否未對準或將在另一種狀況下從一調整中獲益。例如, 由一特定溫度感測器所量測之大於攝氏2度的溫度變化,可指出該放大光束110已呈未對準。 The temperature metric determined in step 820 is compared to a baseline temperature metric (step 830). This baseline temperature metric can be one of a metric determined when the light source is operated in an acceptable or optimal manner. The determined temperature metric can be compared to the baseline temperature metric by, for example, subtracting the determined temperature metric from the baseline temperature metric to determine the difference between the two. This difference can be compared to a threshold to determine if the amplified beam 110 is misaligned or will benefit from an adjustment in another condition. E.g, A temperature change greater than 2 degrees Celsius measured by a particular temperature sensor indicates that the amplified beam 110 is misaligned.

放大光束110係基於比較之結果來調整(步驟840)。例如,若由感測器228A所量測之溫度在一段時間內升高4℃,而由感測器228C所量測之溫度在相同的一段時間內降低4℃,則光束110即被判定已移至該透鏡218較靠近感測器228A的一部分。於「X」方向移動反射部分215以於一對應方向朝向感測器228C移動該光束110的一調整便被決定。此調整可為由主控制器155生成的一信號。此信號可包括指定要由致動器216引生的移動量之資訊。在致動器216接收且處理此信號時,致動器216會使該反射部分215移動,使得光束110在透鏡218上移至較低處。 The amplified beam 110 is adjusted based on the result of the comparison (step 840). For example, if the temperature measured by sensor 228A increases by 4 ° C for a period of time and the temperature measured by sensor 228 C decreases by 4 ° C for the same period of time, then beam 110 is determined to have been determined Move to the lens 218 closer to a portion of the sensor 228A. An adjustment to move the reflective portion 215 in the "X" direction to move the beam 110 toward the sensor 228C in a corresponding direction is determined. This adjustment can be a signal generated by the main controller 155. This signal may include information specifying the amount of movement to be induced by the actuator 216. When the actuator 216 receives and processes this signal, the actuator 216 moves the reflective portion 215 such that the beam 110 moves to a lower position on the lens 218.

尚有其他具現例落在後附申請專利範圍之範疇中。 There are other examples that fall within the scope of the attached patent application.

100‧‧‧光源 100‧‧‧Light source

105‧‧‧標靶位置 105‧‧‧ Target location

110‧‧‧放大光束 110‧‧‧Amplified beam

114‧‧‧標靶混合物 114‧‧‧Target mixture

115‧‧‧雷射系統 115‧‧‧Laser system

127‧‧‧靶材供應裝置 127‧‧‧ target supply device

130‧‧‧腔室/真空容器 130‧‧‧Case/vacuum container

135‧‧‧集光鏡 135‧‧‧ concentrator

140‧‧‧孔徑 140‧‧‧ aperture

155‧‧‧主控制器 155‧‧‧Master controller

210‧‧‧最終焦點總成/最終焦點透鏡總成 210‧‧‧Final Focus Assembly / Final Focus Lens Assembly

212‧‧‧透鏡固持器 212‧‧‧Lens Holder

214‧‧‧導向鏡 214‧‧‧Guide mirror

215‧‧‧反射部分 215‧‧‧reflection

216、221‧‧‧致動器 216, 221‧‧ ‧ actuator

217‧‧‧固持器 217‧‧‧Retainer

218‧‧‧最終焦點透鏡 218‧‧‧ final focus lens

220‧‧‧支撐架 220‧‧‧Support frame

228A、228D‧‧‧溫度感測器 228A, 228D‧‧‧ Temperature Sensor

240‧‧‧光線傳輸系統 240‧‧‧Light transmission system

241‧‧‧EUV監測模組 241‧‧‧EUV monitoring module

242‧‧‧導向模組 242‧‧‧guide module

Claims (25)

一種相對於極紫外線(EUV)光源中第一光學元件調整放大光束之位置的方法,該方法包含:取用表示鄰近於該第一光學元件且與其分別的一元件之一溫度的一第一溫度分佈,該第一光學元件置設來接收該放大光束;分析所取用的該第一溫度分佈以決定與該元件相關聯的一溫度度量;將決定的該溫度度量與一基準線溫度度量比較;及依據比較結果決定該放大光束之位置相對於該第一光學元件所需之一調整。 A method of adjusting a position of an amplified beam relative to a first optical element in an extreme ultraviolet (EUV) light source, the method comprising: taking a first temperature indicative of a temperature adjacent to the first optical element and a component thereof Distributing, the first optical component is configured to receive the amplified beam; analyzing the first temperature profile taken to determine a temperature metric associated with the component; comparing the determined temperature metric to a baseline temperature metric And determining, according to the comparison result, the position of the amplified beam relative to one of the first optical elements required to be adjusted. 如請求項1之方法,其更包含產生表示對於該放大光束之該位置所決定之調整的一指標。 The method of claim 1, further comprising generating an indicator indicative of an adjustment determined for the location of the amplified beam. 如請求項2之方法,其中:該指標包含供機械耦合至一第二光學元件之一致動器用的輸入;該第二光學元件包含置設來接收該放大光束的一作用區域;及供至該致動器的該等輸入足以使該致動器於至少一方向移動該作用區域。 The method of claim 2, wherein: the indicator includes an input for an actuator coupled to a second optical component; the second optical component includes an active region disposed to receive the amplified beam; and The inputs of the actuator are sufficient to cause the actuator to move the active area in at least one direction. 如請求項3之方法,其更包含提供該等輸入給該致動器。 The method of claim 3, further comprising providing the input to the actuator. 如請求項4之方法,其更包含:提供該等輸入給該致動器後,取用鄰近該第一光學 元件之該元件的一第二溫度分佈;分析該第二溫度分佈以決定該溫度度量;及將該溫度度量與該第一溫度分佈或該基準線溫度度量中之一或多者比較。 The method of claim 4, further comprising: after providing the input to the actuator, accessing the first optical a second temperature distribution of the component of the component; analyzing the second temperature profile to determine the temperature metric; and comparing the temperature metric to one or more of the first temperature profile or the baseline temperature metric. 如請求項3之方法,其中該第二光學元件之該作用區域包含具有接收該放大光束之一反射部分的一鏡體,且該反射部分在移動時,相對於該第一光學元件改變該放大光束之該位置。 The method of claim 3, wherein the active area of the second optical element comprises a mirror body having a reflective portion that receives the amplified light beam, and the reflective portion changes the magnification relative to the first optical element while moving The position of the beam. 如請求項3之方法,其中該指標更包含供耦合至在該EUV光源中的一第三光學元件之一第二致動器用的輸入,供至該第二致動器的該等輸入足以使該第二致動器於至少一方向移動該第三光學元件。 The method of claim 3, wherein the indicator further comprises an input for coupling to a second actuator of a third optical component in the EUV source, the inputs to the second actuator being sufficient for The second actuator moves the third optical element in at least one direction. 如請求項1之方法,其中該第一溫度分佈包含鄰近該第一光學元件的該元件之一部分的一溫度,該部分之該溫度至少在兩個不同時間量測。 The method of claim 1, wherein the first temperature profile comprises a temperature adjacent a portion of the component of the first optical component, the temperature of the portion being measured at least two different times. 如請求項1之方法,其中該第一溫度分佈包含鄰近該第一光學元件的該元件之多個部分的一溫度。 The method of claim 1, wherein the first temperature profile comprises a temperature of a plurality of portions of the component adjacent the first optical component. 如請求項9之方法,其中該等多個部分中每一部分之該溫度至少在兩個不同時間量測。 The method of claim 9, wherein the temperature of each of the plurality of portions is measured at least two different times. 如請求項10之方法,其中該第一溫度分佈包含表示從熱感測器接收的溫度量測的資料,該等熱感測器機械耦合至鄰近該第一光學元件的該元件。 The method of claim 10, wherein the first temperature profile comprises data indicative of temperature measurements received from a thermal sensor, the thermal sensors being mechanically coupled to the component adjacent the first optical component. 如請求項1之方法,其中該第一光學元件包含該放大光束穿過的一歛聚透鏡,且鄰近該歛聚透鏡的該元件包含 一鏡罩。 The method of claim 1, wherein the first optical component comprises a converging lens through which the magnifying beam passes, and the component adjacent to the converging lens comprises A mirror cover. 如請求項1之方法,其中該第一溫度分佈包含該元件於多個時間量測的多個溫度,且溫度度量包含該等多個溫度之一方差、該等多個溫度之一平均、或該等溫度中至少二者間的一變化率中之一或多者。 The method of claim 1, wherein the first temperature profile comprises a plurality of temperatures measured by the component at a plurality of times, and the temperature metric comprises one of the plurality of temperatures, an average of the plurality of temperatures, or One or more of a rate of change between at least two of the temperatures. 如請求項1之方法,其中該第一溫度分佈包含在該元件上之不同位置處於一特定時間所量測的多個溫度,且該溫度度量包含該等多個溫度的一空間方差。 The method of claim 1, wherein the first temperature profile comprises a plurality of temperatures measured at different locations on the component at a particular time, and the temperature metric comprises a spatial variance of the plurality of temperatures. 如請求項13之方法,其中該第一溫度分佈更包含在鄰近該第一光學元件之該元件上的不同位置處所量測的多個溫度。 The method of claim 13, wherein the first temperature profile further comprises a plurality of temperatures measured at different locations on the component adjacent the first optical component. 如請求項15之方法,其中該溫度度量更包含在鄰近該第一光學元件之該元件上的不同位置處所量測的該等多個溫度之一空間方差。 The method of claim 15, wherein the temperature metric further comprises a spatial variance of the plurality of temperatures measured at different locations on the component adjacent the first optical component. 如請求項1之方法,其中該溫度度量包含表示鄰近該第一光學元件之該元件的量測溫度上之一時間變化的一數值,且將該溫度度量與一基準線溫度度量比較包含將該數值與一臨界值比較。 The method of claim 1, wherein the temperature metric comprises a value indicative of a temporal change in a measured temperature of the component adjacent the first optical component, and comparing the temperature metric to a baseline temperature metric comprises including The value is compared to a threshold. 一種系統,其包含:一熱感測器,組配來:機械耦合至與接收一極紫外線(EUV)光源之一放大光束的一第一光學元件鄰近之一元件;量測該元件之一溫度;及產生所量測溫度的一指標;及 一控制器,包含耦合至一非暫時性電腦可讀媒體的一或多個電子處理器,該電腦可讀媒體儲存包含可由該一或多個電子處理器執行之指令的軟體,該等指令在被執行時,會使該一或多個電子處理器進行下列動作:接收該量測溫度之所產生的指標;及依據該量測溫度之所產生的該指標產生一輸出信號,該輸出信號足以使一致動器移動接收該放大光束之一第二光學元件,且相對於該第一光學元件調整該放大光束之一位置。 A system comprising: a thermal sensor configured to: mechanically couple to a component adjacent a first optical component that receives an amplified beam of one of an extreme ultraviolet (EUV) light source; measure a temperature of the component And an indicator that produces the measured temperature; and A controller comprising one or more electronic processors coupled to a non-transitory computer readable medium, the computer readable medium storing software comprising instructions executable by the one or more electronic processors, the instructions being When executed, the one or more electronic processors perform the following actions: receiving an index generated by the measured temperature; and generating an output signal according to the measured value of the measured temperature, the output signal is sufficient The actuator is moved to receive a second optical element of the amplified beam and a position of the amplified beam is adjusted relative to the first optical element. 如請求項18之系統,其中該等指令更包含提供該輸出信號給該致動器的指令,且其中該致動器係組配來耦合至該第二光學元件。 The system of claim 18, wherein the instructions further comprise instructions to provide the output signal to the actuator, and wherein the actuator is coupled to the second optical component. 如請求項18之系統,其中:該第一光學元件係為該放大光束穿過之一透鏡;鄰近該透鏡之該元件係為鄰近該透鏡之一鏡罩;及該等熱感測器係組配來安裝至該鏡罩。 The system of claim 18, wherein: the first optical component is such that the amplified beam passes through a lens; the component adjacent to the lens is a mirror cover adjacent to the lens; and the thermal sensor sets It is fitted to the mirror cover. 如請求項18之系統,其中該等熱感測器包含熱電偶、一熱阻器、或一基於纖維的熱感測器中之一或多個。 The system of claim 18, wherein the thermal sensors comprise one or more of a thermocouple, a thermal resistor, or a fiber-based thermal sensor. 如請求項18之系統,其中該等指令更包含在被執行時會使該控制器進行下列動作之指令:取用一第一溫度分佈,該第一溫度分佈係依據來自該熱感測器之該元件的該量測溫度之指標;分析所取用的溫度分佈以決定與該元件相關聯的一溫度度量; 將決定的該溫度度量與一基準線溫度分佈比較;及依據比較結果決定該放大光束之一參數所需的一調整。 The system of claim 18, wherein the instructions further comprise instructions that, when executed, cause the controller to: take a first temperature profile based on the thermal sensor from the thermal sensor An index of the measured temperature of the component; analyzing the temperature profile taken to determine a temperature metric associated with the component; The determined temperature metric is compared to a baseline temperature profile; and an adjustment required to determine one of the parameters of the amplified beam is determined based on the comparison. 如請求項18之系統,其中該第一光學元件包含一功率放大器輸出窗、一最終焦點旋轉鏡、或一空間濾器孔徑中之一或多者。 The system of claim 18, wherein the first optical component comprises one or more of a power amplifier output window, a final focus rotating mirror, or a spatial filter aperture. 如請求項18之系統,其中該熱感測器包含多個熱感測器,該第一光學元件包含在聚焦該放大光束之一透鏡下游的一或多個光學元件,且各該一或多個光學元件耦合至一熱感測器。 The system of claim 18, wherein the thermal sensor comprises a plurality of thermal sensors, the first optical component comprising one or more optical components downstream of a lens that focuses one of the amplified beams, and each of the one or more The optical elements are coupled to a thermal sensor. 一種系統,其包含:接收一極紫外線(EUV)光源之一放大光束的一第一光學元件;與該第一光學元件鄰近且與其分別的一元件;耦合至與該第一光學元件鄰近之該元件的一熱系統,該熱系統包含:一或多個溫度感測器,其各與該元件之一不同部分相關聯,該一或多個溫度感測器係組配來產生該元件之一相關聯部分的一量測溫度之一指標;耦合至一第二光學元件的一致動系統,在該第二光學元件移動時,會造成該放大光束的一對應移動;及一控制系統,其連接至該熱系統之一輸出及該致動系統之一或多個輸入,且組配來依據該量測溫 度之所產生的該指標生成供該致動系統輸入用的一輸出信號,該輸出信號足以使一致動器移動該第二光學元件且相對於該第一光學元件調整該放大光束之一位置。 A system comprising: a first optical component that receives an amplified beam of one of an extreme ultraviolet (EUV) light source; an element adjacent to and separate from the first optical component; coupled to the first optical component A thermal system of components, the thermal system comprising: one or more temperature sensors each associated with a different portion of the component, the one or more temperature sensors being configured to produce one of the components An index of a measured temperature of the associated portion; an actuating system coupled to a second optical element that causes a corresponding movement of the amplified beam when the second optical element moves; and a control system that is coupled One of the output of the thermal system and one or more inputs of the actuation system, and is configured to measure temperature according to the quantity The indicator produced by the degree produces an output signal for input to the actuation system that is sufficient for the actuator to move the second optical element and adjust one of the positions of the amplified beam relative to the first optical element.
TW103100977A 2013-01-22 2014-01-10 Method and system for adjusting a position of an amplified light beam TWI611427B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/747,263 US9148941B2 (en) 2013-01-22 2013-01-22 Thermal monitor for an extreme ultraviolet light source
US13/747,263 2013-01-22

Publications (2)

Publication Number Publication Date
TW201435912A true TW201435912A (en) 2014-09-16
TWI611427B TWI611427B (en) 2018-01-11

Family

ID=51207012

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103100977A TWI611427B (en) 2013-01-22 2014-01-10 Method and system for adjusting a position of an amplified light beam

Country Status (5)

Country Link
US (1) US9148941B2 (en)
JP (1) JP6250067B2 (en)
KR (2) KR102100789B1 (en)
TW (1) TWI611427B (en)
WO (1) WO2014116371A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI767991B (en) * 2017-02-13 2022-06-21 美商應用材料股份有限公司 A charge control apparatus for controlling charge on a substrate in a vacuum chamber, a charged particle beam device and a method of controlling charge on a substrate

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3142823B1 (en) * 2014-05-13 2020-07-29 Trumpf Laser- und Systemtechnik GmbH Device for monitoring the orientation of a laser beam and euv radiation-generating device comprising same
US9927292B2 (en) 2015-04-23 2018-03-27 Asml Netherlands B.V. Beam position sensor
US10128017B1 (en) * 2017-05-12 2018-11-13 Asml Netherlands B.V. Apparatus for and method of controlling debris in an EUV light source
US10824083B2 (en) 2017-09-28 2020-11-03 Taiwan Semiconductor Manufacturing Co., Ltd. Light source, EUV lithography system, and method for generating EUV radiation
CN111742454A (en) * 2018-02-20 2020-10-02 Asml荷兰有限公司 Sensor system
WO2019186754A1 (en) 2018-03-28 2019-10-03 ギガフォトン株式会社 Extreme ultraviolet light generation system and method for manufacturing electronic device
US20200057376A1 (en) * 2018-08-14 2020-02-20 Taiwan Semiconductor Manufacturing Co., Ltd. Lithography system and lithography method
NL2024323A (en) 2018-12-18 2020-07-07 Asml Netherlands Bv Sacrifical device for protecting an optical element in a path of a high-power laser beam

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61123492A (en) * 1984-11-19 1986-06-11 Toshiba Corp Laser working device
US4749122A (en) * 1986-05-19 1988-06-07 The Foxboro Company Combustion control system
JPS6348509A (en) * 1986-08-18 1988-03-01 Komatsu Ltd Laser scanner device
DE19622671A1 (en) * 1995-06-30 1997-01-02 Basf Magnetics Gmbh Temperature indicator for refrigerated products
US6559424B2 (en) * 2001-01-02 2003-05-06 Mattson Technology, Inc. Windows used in thermal processing chambers
JPWO2002067390A1 (en) * 2001-02-22 2004-06-24 三菱電機株式会社 Laser device
US7598509B2 (en) * 2004-11-01 2009-10-06 Cymer, Inc. Laser produced plasma EUV light source
US7554662B1 (en) * 2002-06-24 2009-06-30 J.A. Woollam Co., Inc. Spatial filter means comprising an aperture with a non-unity aspect ratio in a system for investigating samples with electromagnetic radiation
US6825681B2 (en) * 2002-07-19 2004-11-30 Delta Design, Inc. Thermal control of a DUT using a thermal control substrate
US6992306B2 (en) * 2003-04-15 2006-01-31 Canon Kabushiki Kaisha Temperature adjustment apparatus, exposure apparatus having the same, and device fabricating method
US7164144B2 (en) * 2004-03-10 2007-01-16 Cymer Inc. EUV light source
DE102004038310A1 (en) * 2004-08-05 2006-02-23 Kuka Schweissanlagen Gmbh Laser device and operating method
US7891075B2 (en) * 2005-01-19 2011-02-22 Gm Global Technology Operations, Inc. Reconfigurable fixture device and method for controlling
JP4710406B2 (en) * 2005-04-28 2011-06-29 ウシオ電機株式会社 Extreme ultraviolet light exposure device and extreme ultraviolet light source device
US7333904B2 (en) * 2005-08-26 2008-02-19 Delphi Technologies, Inc. Method of determining FET junction temperature
US8290753B2 (en) * 2006-01-24 2012-10-16 Vextec Corporation Materials-based failure analysis in design of electronic devices, and prediction of operating life
US8766212B2 (en) * 2006-07-19 2014-07-01 Asml Netherlands B.V. Correction of spatial instability of an EUV source by laser beam steering
JP5076087B2 (en) * 2006-10-19 2012-11-21 ギガフォトン株式会社 Extreme ultraviolet light source device and nozzle protection device
KR100841478B1 (en) * 2007-08-28 2008-06-25 주식회사 브이엠티 Liquid target producing device being able to use multiple capillary tube and x-ray and euv light source device with the same
US8115900B2 (en) * 2007-09-17 2012-02-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2009046955A2 (en) * 2007-10-09 2009-04-16 Carl Zeiss Smt Ag Device for controlling temperature of an optical element
JP2009099390A (en) * 2007-10-17 2009-05-07 Tokyo Institute Of Technology Extreme ultraviolet light source device and extreme ultraviolet light generating method
US20090275815A1 (en) * 2008-03-21 2009-11-05 Nova Biomedical Corporation Temperature-compensated in-vivo sensor
JP5833806B2 (en) * 2008-09-19 2015-12-16 ギガフォトン株式会社 Extreme ultraviolet light source device, laser light source device for extreme ultraviolet light source device, and adjustment method of laser light source for extreme ultraviolet light source device
US7641349B1 (en) * 2008-09-22 2010-01-05 Cymer, Inc. Systems and methods for collector mirror temperature control using direct contact heat transfer
JP5587578B2 (en) * 2008-09-26 2014-09-10 ギガフォトン株式会社 Extreme ultraviolet light source device and pulse laser device
JP5314433B2 (en) 2009-01-06 2013-10-16 ギガフォトン株式会社 Extreme ultraviolet light source device
JP5312959B2 (en) 2009-01-09 2013-10-09 ギガフォトン株式会社 Extreme ultraviolet light source device
JP5559562B2 (en) * 2009-02-12 2014-07-23 ギガフォトン株式会社 Extreme ultraviolet light source device
US8306774B2 (en) * 2009-11-02 2012-11-06 Quinn David E Thermometer for determining the temperature of an animal's ear drum and method of using same
US8373758B2 (en) * 2009-11-11 2013-02-12 International Business Machines Corporation Techniques for analyzing performance of solar panels and solar cells using infrared diagnostics
US8000212B2 (en) * 2009-12-15 2011-08-16 Cymer, Inc. Metrology for extreme ultraviolet light source
US8173985B2 (en) 2009-12-15 2012-05-08 Cymer, Inc. Beam transport system for extreme ultraviolet light source
JP5705592B2 (en) * 2010-03-18 2015-04-22 ギガフォトン株式会社 Extreme ultraviolet light generator
JP5726546B2 (en) * 2010-03-29 2015-06-03 ギガフォトン株式会社 Chamber equipment
US8686381B2 (en) * 2010-06-28 2014-04-01 Media Lario S.R.L. Source-collector module with GIC mirror and tin vapor LPP target system
JP2012129345A (en) * 2010-12-15 2012-07-05 Renesas Electronics Corp Method of manufacturing semiconductor device, exposure method and exposure device
US20120210999A1 (en) * 2011-02-21 2012-08-23 Straeter James E Solar heating system for a hot water heater
US8993976B2 (en) * 2011-08-19 2015-03-31 Asml Netherlands B.V. Energy sensors for light beam alignment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI767991B (en) * 2017-02-13 2022-06-21 美商應用材料股份有限公司 A charge control apparatus for controlling charge on a substrate in a vacuum chamber, a charged particle beam device and a method of controlling charge on a substrate

Also Published As

Publication number Publication date
JP6250067B2 (en) 2017-12-20
KR20150108820A (en) 2015-09-30
TWI611427B (en) 2018-01-11
US9148941B2 (en) 2015-09-29
KR102062296B1 (en) 2020-01-03
US20140203195A1 (en) 2014-07-24
KR102100789B1 (en) 2020-04-16
WO2014116371A1 (en) 2014-07-31
JP2016509343A (en) 2016-03-24
KR20200003271A (en) 2020-01-08

Similar Documents

Publication Publication Date Title
TWI611427B (en) Method and system for adjusting a position of an amplified light beam
US8324600B2 (en) Apparatus and method for measuring and controlling target trajectory in chamber apparatus
US9167679B2 (en) Beam position control for an extreme ultraviolet light source
US9363878B2 (en) Device for controlling laser beam and apparatus for generating extreme ultraviolet light utilizing wavefront adjusters
JP4642618B2 (en) Extreme ultraviolet light source device
JP2008119716A (en) Laser beam machining apparatus, and focus maintaining method therein
TWI821839B (en) Method of measuring a moving property of a target and optical apparatus
TWI575329B (en) Alignment system and extreme ultraviolet light generation system
JP2012523694A (en) System, method and apparatus for aligning and synchronizing target materials for optimal extreme ultraviolet output
US20140314121A1 (en) Optical non-destructive inspection apparatus and optical non-destructive inspection method
CN110431391B (en) Measurement system for extreme ultraviolet light source
US20150264792A1 (en) Laser beam controlling device and extreme ultraviolet light generating apparatus
US10213869B2 (en) Laser machining apparatus with adaptive mirror
TWI612851B (en) System for an extreme ultraviolet light source, method of aligning an irradiating amplified light beam generated from an extreme ultraviolet light system relative to a target material, and extreme ultraviolet light system
US20160091798A1 (en) Optical assembly
KR20190047044A (en) A technique for determining the movement property of a target in an ultraviolet light source
CN104807547A (en) Laser cladding molten pool temperature detecting device, processing system adopting same and control method of system
US11920977B2 (en) Metrology system and method for measuring an excitation laser beam in an EUV plasma source
US20140321497A1 (en) Optical non-destructive inspection apparatus and optical non-destructive inspection method
Grantham et al. Optical design and initial results from NIST's AMMT/TEMPS facility
JP2010101808A (en) Method and device for measuring radius of curvature
JP2006045598A (en) Device for improving residual stress in installed pipe
JP6894485B2 (en) Soldering equipment and its system controller