TW201432332A - 光纖連接器組裝裝置 - Google Patents

光纖連接器組裝裝置 Download PDF

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TW201432332A
TW201432332A TW102104294A TW102104294A TW201432332A TW 201432332 A TW201432332 A TW 201432332A TW 102104294 A TW102104294 A TW 102104294A TW 102104294 A TW102104294 A TW 102104294A TW 201432332 A TW201432332 A TW 201432332A
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bonding surface
image
conductive adhesive
connector assembly
assembly device
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TW102104294A
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Chih-Chen Lai
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Hon Hai Prec Ind Co Ltd
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Priority to TW102104294A priority Critical patent/TW201432332A/zh
Priority to US13/931,766 priority patent/US20140216338A1/en
Publication of TW201432332A publication Critical patent/TW201432332A/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/27—Manufacturing methods
    • H01L2224/274—Manufacturing methods by blanket deposition of the material of the layer connector
    • H01L2224/2741—Manufacturing methods by blanket deposition of the material of the layer connector in liquid form
    • H01L2224/27422—Manufacturing methods by blanket deposition of the material of the layer connector in liquid form by dipping, e.g. in a solder bath
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75743—Suction holding means
    • H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/759—Means for monitoring the connection process
    • H01L2224/75901—Means for monitoring the connection process using a computer, e.g. fully- or semi-automatic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/83908—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector involving monitoring, e.g. feedback loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Mechanical Coupling Of Light Guides (AREA)

Abstract

本發明提供一種光纖連接器組裝裝置，其包括一基座、一吸嘴、一驅動裝置、一影像感測器及一影像處理器。該基座開設有一收容槽，用於收容導電膠。該吸嘴用於吸取一光電元件，該光電元件包括一黏結面。該驅動裝置用於驅動該吸嘴移動該光電元件以使該黏結面蘸取該導電膠。該影像感測器用於拍攝該黏結面的一第一圖像。該影像處理器用於處理該第一圖像以獲取該黏結面的灰階值並根據該灰階值判斷該黏結面蘸取的導電膠是否適量。如此，可在該光電元件的黏結過程中識別該黏結面蘸取的導電膠是否適量，以允許在必要時調整該黏結面的導電膠用量，確保良率。

Description

光纖連接器組裝裝置
本發明涉及光纖連接器，特別涉及一種光纖連接器組裝裝置。
光纖連接器包括基板、設置於基板上的光電元件及外殼，外殼形成有透鏡，光電元件通過透鏡收發光線，也就是說光電元件需與透鏡對齊。目前，光電元件主要通過導電膠黏結並電性連接基板。然而，黏結過程中導電膠是否適量並無法知曉而常常導致產品不良，導致良率低下。
有鑑於此，有必要提供一種可提高良率的光纖連接器組裝裝置。
一種光纖連接器組裝裝置，其包括一基座、一吸嘴、一驅動裝置、一影像感測器及一影像處理器。該基座開設有一收容槽，用於收容導電膠。該吸嘴用於吸取一光電元件，該光電元件包括一黏結面。該驅動裝置用於驅動該吸嘴移動該光電元件以使該黏結面蘸取該導電膠。該影像感測器用於拍攝該黏結面的一第一圖像。該影像處理器用於處理該第一圖像以獲取該黏結面的灰階值並根據該灰階值判斷該黏結面蘸取的導電膠是否適量。
如此，可在該光電元件的黏結過程中識別該黏結面蘸取的導電膠是否適量，以允許在必要時調整該黏結面的導電膠用量，確保良率。
10．．．光纖連接器組裝裝置
100．．．基座
110．．．收容槽
120．．．頂面
200．．．吸嘴
210．．．吸取面
300．．．驅動裝置
400．．．影像感測器
500．．．影像處理器
600．．．第一料盤
700．．．第二影像感測器
800．．．第二料盤
900．．．第三影像感測器
20．．．導電膠
30．．．光電元件
31．．．黏結面
40．．．基板
圖1為本發明較佳實施方式的光纖連接器的立體示意圖。
請參閱圖1，本發明較佳實施方式的光纖連接器組裝裝置10包括一基座100、一吸嘴200、一驅動裝置300、一影像感測器400及一影像處理器500。該基座100開設有一收容槽110，用於收容導電膠20。該吸嘴200用於吸取一光電元件30，該光電元件30包括一黏結面31。該驅動裝置300用於驅動該吸嘴200移動該光電元件30以使該黏結面31蘸取該導電膠20。該影像感測器400用於拍攝該黏結面31的一第一圖像。該影像處理器500用於處理該第一圖像以獲取該黏結面31的灰階值並根據該灰階值判斷該黏結面31蘸取的導電膠是否適量。
如此，可在該光電元件30的黏結過程中識別該黏結面31蘸取的導電膠是否適量，以允許在必要時調整該黏結面31的導電膠用量，確保良率。
具體的，該基座100包括一頂面120，該收容槽110開設於該頂面120上。
該驅動裝置300為機械手臂，可以鄰近該基座100設置，也可以直接設置在該基座100上。
該吸嘴200與該驅動裝置300連接，並包括一吸取面210，該吸取面210開設有與真空源(如真空泵)連通的開口(圖未示)。該吸嘴200一般採用不銹鋼製成，該吸取面210為亮白金屬色，並與該基座100正對。
該影像感測器400可採用電荷耦合裝置(charge-coupled device)或互補性金屬氧化物半導體(complementary metal-oxide semiconductor)。該影像感測器400可鄰近該收容槽110設置於該頂面120上，並朝向該吸取面210。
該導電膠20一般採用銀膠或者其他偏黑色的導電材料製成，呈黏稠流體狀。
該光電元件30可以是鐳射二極體(laser diode)或者光電二極體(photo diode)。該光電元件30包括一陽極及設置於該陽極上的半導體本體。該黏結面31即為該陽極與該本體相背的表面。由於該陽極一般採用金屬製成，因此通常具有亮白金屬色。
因此，該影像處理器500可以將該吸取面210及該黏結面31的亮白金屬色(兩者可能相同或存在差異)作為參考色，通過識別蘸取該導電膠20後的該黏結面31的顏色後與參考色對比判斷該黏結面31蘸取的導電膠20是否適量。例如蘸取該導電膠20後的該黏結面31的顏色與該黏結面31原始的亮白金屬色存在差異，則判斷該黏結面31已蘸取到該導電膠20，蘸取該導電膠20後的該黏結面31的顏色與參考色的差異越大(即蘸取該導電膠20後的該黏結面31的顏色越深)則該黏結面31蘸取的導電膠20的越多。因此，蘸取該導電膠20後的該黏結面31的顏色過淺或過深都不適合。
該影像處理器500還可以識別蘸取該導電膠20後的該黏結面31的輪廓，與蘸取前的該黏結面31的原始輪廓相比，若發生變化，則判斷蘸取的導電膠20過量溢出該黏結面31的原始輪廓。
該光纖連接器組裝裝置10還包括一第一料盤600、一第二影像感測器700、一第二料盤800及一第三影像感測器900。
該第一料盤600用於承載多個該光電元件30。該第二影像感測器700用於拍攝該第一料盤600的一第二圖像。該影像處理器500還用於處理該第二圖像以識別該多個光電元件30的位置及輪廓，以輔助該吸嘴200準確吸取每個光電元件30。
該第二料盤800用於承載多個基板40。該第三影像感測器900用於拍攝該第二料盤800的一第三圖像。該影像處理器500還用於處理該第三圖像以識別該多個基板40的位置及輪廓，以輔助該吸嘴200準確將每個光電元件30貼附到對應的基板上。
10．．．光纖連接器組裝裝置
100．．．基座
110．．．收容槽
120．．．頂面
200．．．吸嘴
210．．．吸取面
300．．．驅動裝置
400．．．影像感測器
500．．．影像處理器
600．．．第一料盤
700．．．第二影像感測器
800．．．第二料盤
900．．．第三影像感測器
20．．．導電膠
30．．．光電元件
31．．．黏結面
40．．．基板

Claims (9)

  1. 一種光纖連接器組裝裝置，其包括一基座、一吸嘴、一驅動裝置、一影像感測器及一影像處理器；該基座開設有一收容槽，用於收容導電膠；該吸嘴用於吸取一光電元件，該光電元件包括一黏結面；該驅動裝置用於驅動該吸嘴移動該光電元件以使該黏結面蘸取該導電膠；該影像感測器用於拍攝該黏結面的一第一圖像；該影像處理器用於處理該第一圖像以獲取該黏結面的灰階值並根據該灰階值判斷該黏結面蘸取的導電膠是否適量。
  2. 如請求項1所述的光纖連接器組裝裝置，其中，該基座包括一頂面，該收容槽開設於該頂面上，該吸嘴包括一與該頂面相對的吸取面，該影像感測器鄰近該收容槽設置於該頂面上，並朝向該吸取面。
  3. 如請求項2所述的光纖連接器組裝裝置，其中，該吸取面為亮白金屬色，該黏結面也呈亮白金屬色，該導電膠為黑色黏稠流體狀。
  4. 如請求項3所述的光纖連接器組裝裝置，其中，該影像處理器將該吸取面及該黏結面的亮白金屬色作為參考色，通過識別蘸取該導電膠後的該黏結面的顏色後與參考色對比判斷該黏結面蘸取的導電膠是否適量。
  5. 如請求項4所述的光纖連接器組裝裝置，其中，若蘸取該導電膠後的該黏結面的顏色與該黏結面原始的亮白金屬色存在差異，則該影像處理器判斷該黏結面已蘸取到該導電膠。
  6. 如請求項4所述的光纖連接器組裝裝置，其中，蘸取該導電膠後的該黏結面的顏色與參考色的差異越大，則該影像處理器判斷該黏結面蘸取的導電膠的越多。
  7. 如請求項1所述的光纖連接器組裝裝置，其中，該影像處理器還用於識別蘸取該導電膠後的該黏結面的輪廓，並與蘸取前的該黏結面的原始輪廓相比，若發生變化，則該影像處理器判斷蘸取的導電膠過量。
  8. 如請求項1所述的光纖連接器組裝裝置，其中，該光纖連接器組裝裝置還包括一第一料盤及一第二影像感測器；該第一料盤用於承載多個該光電元件；該第二影像感測器用於拍攝該第一料盤的一第二圖像；該影像處理器還用於處理該第二圖像以識別該多個光電元件的位置及輪廓，以輔助該吸嘴準確吸取每個光電元件。
  9. 如請求項1所述的光纖連接器組裝裝置，其中，該光纖連接器組裝裝置還包括一第二料盤及一第三影像感測器；該第二料盤0用於承載多個基板；該第三影像感測器用於拍攝該第二料盤的一第三圖像；該影像處理器還用於處理該第三圖像以識別該多個基板的位置及輪廓，以輔助該吸嘴準確將每個光電元件貼附到對應的基板上。
TW102104294A 2013-02-05 2013-02-05 光纖連接器組裝裝置 TW201432332A (zh)

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JPH08162797A (ja) * 1994-12-08 1996-06-21 Matsushita Electric Ind Co Ltd 電子部品実装装置
JP2002204096A (ja) * 2000-12-28 2002-07-19 Fuji Mach Mfg Co Ltd 電気部品装着システムおよび電気部品装着方法

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