TW201428892A - Detection method and system for wafer cleavage position - Google Patents
Detection method and system for wafer cleavage position Download PDFInfo
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Description
本發明有關於晶圓劈裂，尤其是有關於取得晶圓劈裂位置的方法及系統。
The present invention relates to wafer splitting, and more particularly to methods and systems for obtaining wafer splitting locations.
請參閱「圖1」與「圖2」所示，晶圓劈裂機用於將晶圓1劈裂為一粒粒的晶粒，以進行後續的封裝作業，晶圓1在進行劈裂之前，會先用雷射切割出橫向與縱向的雷射切割線2，晶圓1上的雷射切割線2並未斷裂，其約略保留三分之二的厚度相連，接著將晶圓1貼附一藍片3(或白膜)，再於晶圓1上方覆蓋一保護膜(圖未示)加以保護後，藉一固定夾具4送入一晶圓劈裂機進行劈裂作業。
晶圓劈裂機包含一工作台5、一劈刀6、二劈裂台7與一影像擷取系統8，該工作台5夾置該固定夾具4，並可作平面方向的移動與轉動，該劈刀6與該二劈裂台7係分設於該晶圓1的上下兩側，以讓該晶圓1抵壓該二劈裂台7，並藉擊錘(圖未示)敲擊該劈刀6所產生的衝擊力進行劈裂作業，該影像擷取系統8則用於截取該晶圓1的影像。
據而該晶圓1可藉該劈刀6的衝擊力與該工作台5的定量位移，對多個雷射切割線2連續進行劈裂，而該影像擷取系統8則在連續劈裂過程中監控該晶圓1的定位是否偏移，以視偏移的程度重新進行定位，而當橫向與縱向的雷射切割線2皆被劈裂之後即完成劈裂作業。
請再參閱「圖3」所示，晶圓9在製造的過程中，有可能因為外力的撞擊、製程的不良而造成晶圓9局部破裂，因此對於有損壞的晶圓9，在進行劈裂作業之前，必須先確定晶圓9的破裂邊緣10，以於劈裂時知道第一刀的下刀位置。
習知晶圓9的破裂邊緣10的測定方法，主要是利用全景影像擷取元件來擷取影像，並利用影像處理方法針對明暗對比度來判斷晶圓9的破裂邊緣10的大概位置，接著再利用劈裂機的影像擷取系統，分別朝上下左右單方向位移，以搜尋取得破裂邊緣10的劈裂邊緣座標。此種方法至少需要重覆搜尋4次，以確定上下左右破裂邊緣10的劈裂邊緣座標，其相當的費時，造成劈裂的效率低落。
Referring to Figure 1 and Figure 2, the wafer splitting machine is used to split the wafer 1 into a grain of grain for subsequent packaging operations. Before the wafer 1 is cracked. The horizontal and vertical laser cutting lines 2 are first cut by laser, the laser cutting line 2 on the wafer 1 is not broken, and approximately two-thirds of the thickness is connected, and then the wafer 1 is attached. A blue sheet 3 (or white film) is then covered with a protective film (not shown) over the wafer 1 and then protected by a fixing fixture 4 into a wafer splitting machine for splitting.
The wafer splitting machine comprises a working table 5, a trowel 6, a splitting table 7 and an image capturing system 8 which sandwiches the fixing fixture 4 and can move and rotate in a plane direction. The boring tool 6 and the two cleavage table 7 are respectively disposed on the upper and lower sides of the wafer 1 so that the wafer 1 presses against the two cleavage table 7 and is struck by a hammer (not shown). The impact force generated by the file 6 is split, and the image capturing system 8 is used to intercept the image of the wafer 1.
According to the wafer 1 , the plurality of laser cutting lines 2 can be chopped continuously by the impact force of the boring tool 6 and the quantitative displacement of the table 5, and the image capturing system 8 is in the continuous cleaving process. The position of the wafer 1 is monitored to be offset, and the positioning is re-positioned to the extent of the offset, and the splitting operation is completed when both the horizontal and vertical laser cutting lines 2 are cleaved.
Please refer to FIG. 3 again. During the manufacturing process of the wafer 9, the wafer 9 may be partially broken due to the impact of external force and poor process, so that the damaged wafer 9 is cleaved. Prior to the job, the fracture edge 10 of the wafer 9 must be determined to know the lower knife position of the first knife during splitting.
The method for measuring the rupture edge 10 of the conventional wafer 9 mainly uses a panoramic image capturing component to capture an image, and uses an image processing method to determine the approximate position of the rupture edge 10 of the wafer 9 for the light and dark contrast, and then utilizes the splitting. The image capture system of the machine is respectively displaced in one direction up, down, left, and right to search for the split edge coordinates of the fracture edge 10. This method requires at least four searches to determine the split edge coordinates of the upper and lower left and right rupture edges 10, which is quite time consuming and results in a low efficiency of splitting.
爰此，本發明之主要目的在於提供一種晶圓劈裂位置測定方法，以快速取得晶圓的劈裂邊緣座標，以增加晶圓劈裂的效率，提升產量，滿足使用上的需求。
本發明之次要目的在於提供一種執行晶圓劈裂位置測定方法的系統，以供進行晶圓劈裂作業。
本發明的系統包含一全景取像裝置、一劈裂裝置、一標準片與一控制元件，而其方法包含步驟A~E，其中步驟A：建立取像座標體系，為讓一全景取像裝置建立一取像座標體系，該全景取像裝置供擷取一物件的一外觀輪廓，並取得該外觀輪廓的一取像座標；步驟B：建立劈裂座標體系，為讓一劈裂裝置建立一劈裂座標體系，該劈裂裝置具有一影像擷取元件，該影像擷取元件供擷取該物件的一細部影像，並取得該細部影像的一劈裂座標；步驟C：建立轉換函數，為讓一標準片輪流置於該全景取像裝置處與該劈裂裝置處，該標準片具有一已知尺寸的外觀輪廓與二已知位置座標的參考點，其透過該全景取像裝置擷取該標準片的外觀輪廓，並取得該標準片的一參考取像座標；又透過該影像擷取元件擷取該標準片的二參考點，並分別取得該二參考點的一參考劈裂座標；最後藉由一控制元件，依據該標準片的該外觀輪廓尺寸與該二參考點位置座標、該參考取像座標與該參考劈裂座標，建立該取像座標體系與該劈裂座標體系的一轉換函數；步驟D：輪廓取像，為於該全景取像裝置處取得一待劈裂晶圓的一輪廓取像座標；步驟E：轉換座標，為藉由該控制元件依據該轉換函數，將該輪廓取像座標轉換為一劈裂邊緣座標。
據此，本發明透過全景取像裝置取得該輪廓取像座標，再依據該轉換函數的轉換，即可快速取得該劈裂邊緣座標，亦即，本發明不需找尋該待劈裂晶圓的劈裂邊緣座標，而可節省該待劈裂晶圓的邊緣搜尋時間，以增加晶圓劈裂的效率，滿足使用上的需求。
Accordingly, the main object of the present invention is to provide a method for measuring the position of a wafer to quickly obtain the split edge coordinates of the wafer, thereby increasing the efficiency of wafer splitting, increasing the yield, and meeting the demand for use.
A secondary object of the present invention is to provide a system for performing a wafer splitting position measurement method for performing wafer splitting operations.
The system of the present invention comprises a panoramic image capturing device, a splitting device, a standard piece and a control element, and the method comprises steps A~E, wherein step A: establishing an image capturing coordinate system for allowing a panoramic image capturing device Establishing an image capturing coordinate system, the panoramic image capturing device is configured to capture an outline of an object, and obtain an image capturing coordinate of the outer contour; step B: establishing a splitting coordinate system to establish a splitting device a splitting coordinate system, the splitting device having an image capturing component for capturing a detailed image of the object and obtaining a split coordinate of the detailed image; Step C: establishing a transfer function, Placing a standard sheet at the panoramic image capturing device and the splitting device, the standard sheet having a known size outline and a reference point of two known position coordinates, which are captured by the panoramic image capturing device Obtaining the outline of the standard piece and obtaining a reference image taking coordinate of the standard piece; and acquiring the two reference points of the standard piece through the image capturing component, and respectively obtaining a reference splitting block of the two reference points Finally, the image capturing coordinate system and the splitting coordinate system are established by a control component according to the appearance contour size of the standard sheet and the two reference point position coordinates, the reference image capturing coordinate and the reference splitting coordinate a conversion function; step D: contour acquisition, to obtain a contour image acquisition coordinate of the wafer to be split at the panoramic image capturing device; step E: converting the coordinates, according to the conversion function, according to the conversion function, Convert the contour image coordinates to a split edge coordinate.
According to the present invention, the contour image capturing coordinate is obtained by the panoramic image capturing device, and the splitting edge coordinate can be quickly obtained according to the conversion function of the conversion function, that is, the present invention does not need to find the wafer to be split. The edge of the edge is split, which saves the edge search time of the wafer to be split, so as to increase the efficiency of wafer splitting and meet the needs of use.
1、9．．．晶圓1, 9. . . Wafer
2．．．雷射切割線2. . . Laser cutting line
3．．．藍片3. . . Blue film
4．．．固定夾具4. . . Fixing fixture
5．．．工作台5. . . Workbench
6．．．劈刀6. . . chopper
7．．．劈裂台7. . . Splitting table
8．．．影像擷取系統8. . . Image capture system
10．．．破裂邊緣10. . . Cracked edge
A．．．建立取像座標體系A. . . Establish image acquisition coordinate system
B．．．建立劈裂座標體系B. . . Establishing a split coordinate system
C．．．建立轉換函數C. . . Establish a conversion function
C1．．．找出旋轉中心C1. . . Find the center of rotation
D．．．輪廓取像D. . . Contour image
D1．．．偵測輪廓D1. . . Detecting contours
E．．．轉換座標E. . . Conversion coordinates
20．．．全景取像裝置20. . . Panoramic image capturing device
21．．．打光裝置twenty one. . . Lighting device
30．．．劈裂裝置30. . . Splitting device
31．．．影像擷取元件31. . . Image capture component
40．．．標準片40. . . Standard film
41．．．外觀輪廓41. . . Outline
42．．．參考點42. . . Reference point
50．．．控制元件50. . . control element
60．．．待劈裂晶圓60. . . Cracked wafer
70．．．旋轉平台70. . . Rotating platform
圖1，為習知晶圓劈裂裝置之局部結構示意圖。
圖2，為習知待劈裂晶圓之結構示意圖。
圖3，為習知晶圓破片之結構示意圖。
圖4，為本發明流程步驟示意圖。
圖5，為本發明結構示意圖。
圖6，為本發明標準片之結構圖。
FIG. 1 is a partial structural schematic view of a conventional wafer splitting device.
FIG. 2 is a schematic structural view of a conventional wafer to be split.
FIG. 3 is a schematic structural view of a conventional wafer fragment.
4 is a schematic diagram showing the steps of the process of the present invention.
Fig. 5 is a schematic structural view of the present invention.
Figure 6 is a structural view of a standard sheet of the present invention.
為俾使貴委員對本發明之特徵、目的及功效，有著更加深入之瞭解與認同，茲列舉較佳實施例並配合圖式說明如后：
請參閱「圖4」、「圖5」與「圖6」所示，本發明為一種晶圓劈裂位置測定方法及系統，其系統包含一全景取像裝置20、一劈裂裝置30、一標準片40與一控制元件50，而其步驟包含：步驟A：建立取像座標體系、步驟B：建立劈裂座標體系、步驟C：建立轉換函數、步驟D：輪廓取像與步驟E：轉換座標。
其中，步驟A：建立取像座標體系，為讓該全景取像裝置20建立一取像座標體系，該全景取像裝置20供擷取一物件(圖未示)的一外觀輪廓41，並取得該外觀輪廓41的一取像座標，此處所指建立座標體系，為指固定全景取像裝置20的取像光學條件，而僅替換被取像的物件。
步驟B：建立劈裂座標體系，為讓該劈裂裝置30建立一劈裂座標體系，該劈裂裝置30具有一影像擷取元件31，該影像擷取元件31供擷取該物件的一細部影像，並取得該細部影像的一劈裂座標，同樣的，此處所指建立座標體系，為指固定劈裂裝置30的各部件的相對位置。
步驟C：建立轉換函數，為讓該標準片40輪流置於該全景取像裝置20處與該劈裂裝置30處，該標準片40具有一已知尺寸的外觀輪廓41與二已知位置座標的參考點42，亦即該標準片40的規格為已知，而可作為量測基礎，因此可以透過該全景取像裝置20擷取該標準片40的外觀輪廓41，並取得該標準片40的一參考取像座標；又透過該影像擷取元件31擷取該標準片40的二參考點42，並分別取得該二參考點42的一參考劈裂座標；由於該標準片40可以作為量測基礎，其外觀輪廓41尺寸與二參考點42位置座標皆為已知，故可以藉由該控制元件50，依據該標準片40的該外觀輪廓41尺寸與該二參考點42位置座標、該參考取像座標與該參考劈裂座標，建立該取像座標體系與該劈裂座標體系的一轉換函數，換句話說，透過該轉換函數可以快速將該取像座標體系轉換為該劈裂座標體系。
步驟D：輪廓取像，於該全景取像裝置20處取得一待劈裂晶圓60的一輪廓取像座標，而在實際操作於步驟D之後，更可以更包含一步驟D1：偵測輪廓，為判斷是否完成輪廓取像，若是則續行下一步驟，若否則發出警報。且為了增加取像成功率，該全景取像裝置20處更可以裝設有一打光裝置21，並在該全景取像裝置20取像時發光，且該打光裝置21可以為一背光板，以提供均勻的光源。
步驟E：轉換座標，為藉由該控制元件50依據該轉換函數，將該輪廓取像座標轉換為一劈裂邊緣座標，而在步驟E之前，可以將該待劈裂晶圓60移載至該劈裂裝置30處，並在該輪廓取像座標轉換為該劈裂邊緣座標之後，即可進行劈裂作業。
此外，本發明於步驟C之後，更可包含一步驟C1：找出旋轉中心，為讓該標準片40於該劈裂裝置30處承載於一旋轉平台70上旋轉90度，並再一次取得該二參考點42的一旋轉參考劈裂座標，以找出該旋轉平台70的旋轉中心座標，而在找出旋轉中心座標之後，即可換算得知該待劈裂晶圓60旋轉90度之後的座標位置，因而可以直接進行另一方向的劈裂作業。
又該全景取像裝置20可以為透過該標準片40的該外觀輪廓41尺寸而換算取得該全景取像裝置20的解析度，並由該全景取像裝置20的解析度而可換算，該待劈裂晶圓60的邊緣與該全景取像裝置20的中心點的距離，而得知該待劈裂晶圓60的尺寸。
如上所述，本發明透過全景取像裝置取得該輪廓取像座標，再依據該轉換函數的轉換，即可取得該劈裂邊緣座標，其優點至少如下所述：
1.不需要檢測晶圓是否破片，本發明直接取得該待劈裂晶圓的邊緣座標值，而可直接安排劈裂的下刀位置，其一體適用完整晶圓與破片晶圓。
2.透過先找到晶圓邊緣輪廓，即可快速運算而得知劈裂邊緣座標，可增加進行劈裂作業的效率。
3.不需搜尋待劈裂晶圓的上下邊緣，可節省搜尋時間。
4.可推算得知晶圓中心，即使晶圓位置偏移(與藍片貼歪)，亦可進行劈裂作業。
因此，本發明確實可以增加晶圓劈裂的效率，滿足使用上的需求。
綜上所述僅為本發明的較佳實施例而已，並非用來限定本發明之實施範圍，即凡依本發明申請專利範圍之內容所為的等效變化與修飾，皆應為本發明之技術範疇。
In order to give your members a deeper understanding and recognition of the features, purposes and effects of the present invention, the preferred embodiments are illustrated with the following description:
Please refer to FIG. 4 , FIG. 5 and FIG. 6 . The present invention provides a wafer splitting position measuring method and system, the system comprising a panoramic image capturing device 20 , a splitting device 30 , and a The standard sheet 40 and a control element 50, and the steps thereof include: step A: establishing an image acquisition coordinate system, step B: establishing a split coordinate system, step C: establishing a transfer function, step D: contour image capturing, and step E: converting coordinate.
Step A: establishing an image capturing coordinate system, in order to allow the panoramic image capturing device 20 to establish an image capturing coordinate system, the panoramic image capturing device 20 is configured to capture an outline 41 of an object (not shown) and obtain An image taking coordinate of the outer contour 41, which is referred to herein as a coordinate system, refers to the image taking optical condition of the fixed panoramic image capturing device 20, and only replaces the imaged object.
Step B: Establishing a splitting coordinate system, in order to establish a splitting coordinate system for the splitting device 30, the splitting device 30 has an image capturing element 31 for extracting a detail of the object The image is taken and a split coordinate of the detailed image is obtained. Similarly, the coordinate system is referred to herein to refer to the relative position of the components of the fixed splitting device 30.
Step C: establishing a transfer function for placing the standard sheet 40 in turn at the panoramic image capturing device 20 and the splitting device 30, the standard sheet 40 having a known size of the outline 41 and two known position coordinates The reference point 42, that is, the specification of the standard sheet 40 is known, and can be used as a basis for measurement, so that the outline 41 of the standard sheet 40 can be captured by the panoramic image capturing device 20, and the standard sheet 40 can be obtained. And a reference point 42 of the standard piece 40 is obtained by the image capturing component 31, and a reference splitting coordinate of the two reference points 42 is respectively obtained; since the standard piece 40 can be used as a quantity The basis of the measurement, the size of the outer contour 41 and the position coordinates of the two reference points 42 are known, so that the control element 50 can be used according to the size of the outer contour 41 of the standard sheet 40 and the position coordinates of the two reference points 42 . Referring to the image taking coordinate and the reference split coordinate, establishing a conversion function of the image coordinate system and the split coordinate system, in other words, the image coordinate system can be quickly converted into the split coordinate by the transfer function system.
Step D: contour image capturing, a contour image capturing coordinate of the wafer to be split 60 is obtained at the panoramic image capturing device 20, and after actually operating in step D, a step D1 may be further included: detecting the contour To determine whether the contour is completed, if yes, continue to the next step, otherwise issue an alarm. In addition, in order to increase the imaging success rate, the panoramic image capturing device 20 may further be provided with a light-emitting device 21, and emit light when the panoramic image capturing device 20 takes an image, and the light-emitting device 21 may be a backlight. To provide a uniform light source.
Step E: Converting the coordinates, by the control element 50, converting the contour image coordinates to a split edge coordinate according to the transfer function, and before step E, the wafer to be split 60 can be transferred to The splitting device 30 is located, and after the contour image taking coordinate is converted into the split edge coordinate, the splitting operation can be performed.
In addition, the present invention may further comprise a step C1 after the step C: finding the center of rotation, for the standard piece 40 to be rotated 90 degrees on the rotating platform 70 at the splitting device 30, and obtaining the rotation again A rotation of the reference point 42 is referenced to the splitting coordinate to find the center of rotation of the rotating platform 70, and after the center of rotation is found, the rotation of the wafer 60 to be split can be converted to 90 degrees. The coordinate position allows the splitting operation to be performed directly in the other direction.
Further, the panoramic image capturing device 20 can convert and obtain the resolution of the panoramic image capturing device 20 by the size of the external contour 41 of the standard sheet 40, and can be converted by the resolution of the panoramic image capturing device 20. The distance between the edge of the split wafer 60 and the center point of the panoramic image capturing device 20 is known to the size of the wafer 60 to be split.
As described above, the present invention obtains the contour image capturing coordinates through the panoramic image capturing device, and according to the conversion of the conversion function, the split edge coordinates can be obtained, and the advantages are at least as follows:
1. It is not necessary to detect whether the wafer is fragmented. The invention directly obtains the edge coordinate value of the wafer to be split, and can directly arrange the splitting of the lower knife position, and the whole is suitable for the complete wafer and the fragment wafer.
2. By first finding the edge profile of the wafer, you can quickly calculate the split edge coordinates to increase the efficiency of the splitting operation.
3. No need to search the upper and lower edges of the wafer to be split, saving search time.
4. It can be estimated that the center of the wafer can be split even if the wafer is offset (with the blue piece).
Therefore, the present invention can indeed increase the efficiency of wafer splitting and meet the needs of use.
The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, that is, the equivalent changes and modifications of the content of the patent application of the present invention should be the technology of the present invention. category.
A．．．建立取像座標體系A. . . Establish image acquisition coordinate system
B．．．建立劈裂座標體系B. . . Establishing a split coordinate system
C．．．建立轉換函數C. . . Establish a conversion function
C1．．．找出旋轉中心C1. . . Find the center of rotation
D．．．輪廓取像D. . . Contour image
D1．．．偵測輪廓D1. . . Detecting contours
E．．．轉換座標E. . . Conversion coordinates
Claims (10)
步驟A：建立取像座標體系，為讓一全景取像裝置建立一取像座標體系，該全景取像裝置供擷取一物件的一外觀輪廓，並取得該外觀輪廓的一取像座標；
步驟B：建立劈裂座標體系，為讓一劈裂裝置建立一劈裂座標體系，該劈裂裝置具有一影像擷取元件，該影像擷取元件供擷取該物件的一細部影像，並取得該細部影像的一劈裂座標；
步驟C：建立轉換函數，為讓一標準片輪流置於該全景取像裝置處與該劈裂裝置處，該標準片具有一已知尺寸的外觀輪廓與二已知位置座標的參考點，其透過該全景取像裝置擷取該標準片的外觀輪廓，並取得該標準片的一參考取像座標；又透過該影像擷取元件擷取該標準片的二參考點，並分別取得該二參考點的一參考劈裂座標；最後藉由一控制元件，依據該標準片的該外觀輪廓尺寸與該二參考點位置座標、該參考取像座標與該參考劈裂座標，建立該取像座標體系與該劈裂座標體系的一轉換函數；
步驟D：輪廓取像，為於該全景取像裝置處取得一待劈裂晶圓的一輪廓取像座標；
步驟E：轉換座標，為藉由該控制元件依據該轉換函數，將該輪廓取像座標轉換為一劈裂邊緣座標。A method for determining a fracture position of a wafer, comprising:
Step A: establishing an image capturing coordinate system, in order to allow a panoramic image capturing device to establish an image capturing coordinate system, the panoramic image capturing device is configured to capture an outline of an object, and obtain an image capturing coordinate of the outer contour;
Step B: Establishing a splitting coordinate system for establishing a splitting coordinate system for a splitting device, the splitting device having an image capturing component for capturing a detailed image of the object and obtaining a split coordinate of the detailed image;
Step C: establishing a transfer function for placing a standard sheet at the panoramic image capturing device and the splitting device, the standard sheet having a reference contour of a known size and a reference point of two known position coordinates, Obtaining an outline of the standard piece by the panoramic image capturing device, and obtaining a reference image capturing coordinate of the standard piece; and acquiring the two reference points of the standard piece through the image capturing component, and respectively obtaining the two reference points a reference splitting coordinate of the point; finally, the image capturing coordinate system is established by a control component according to the appearance contour size of the standard sheet and the two reference point position coordinates, the reference image capturing coordinate and the reference splitting coordinate a transfer function with the cleaved coordinate system;
Step D: contour image acquisition, in order to obtain a contour image capturing coordinate of the wafer to be split at the panoramic image capturing device;
Step E: Converting coordinates, wherein the contour image coordinates are converted into a split edge coordinate by the control element according to the conversion function.
一全景取像裝置，該全景取像裝置建立一取像座標體系，且該全景取像裝置供擷取一物件的一外觀輪廓，並取得該外觀輪廓的一取像座標；
一劈裂裝置，該劈裂裝置建立一劈裂座標體系，該劈裂裝置具有一影像擷取元件，該影像擷取元件供擷取該物件的一細部影像，並取得該細部影像的一劈裂座標；
一標準片，該標準片輪流置於該全景取像裝置處與該劈裂裝置處，該標準片具有一已知尺寸的外觀輪廓與二已知位置座標的參考點，且該全景取像裝置擷取該標準片的外觀輪廓，並取得該標準片的一參考取像座標；又該影像擷取元件擷取該標準片的二參考點，並分別取得該二參考點的一參考劈裂座標；
一控制元件，該控制元件依據該標準片的該外觀輪廓尺寸與該二參考點位置座標、該參考取像座標與該參考劈裂座標，建立該取像座標體系與該劈裂座標體系的一轉換函數，以讓該控制元件依據該轉換函數，將一待劈裂晶圓的一輪廓取像座標轉換為一劈裂邊緣座標。A wafer splitting position measuring system comprising:
a panoramic image capturing device, the panoramic image capturing device establishes an image capturing coordinate system, and the panoramic image capturing device is configured to capture an outline of an object and obtain an image capturing coordinate of the appearance contour;
a splitting device, the splitting device establishing a splitting coordinate system, the splitting device having an image capturing component for capturing a detailed image of the object and obtaining a detail of the detailed image Split coordinates
a standard sheet, which is placed in turn at the panoramic image capturing device and the splitting device, the standard sheet having a known size and a reference point of two known position coordinates, and the panoramic image capturing device Extracting the outline of the standard piece and obtaining a reference image taking coordinate of the standard piece; and the image capturing component capturing the two reference points of the standard piece, and respectively obtaining a reference splitting coordinate of the two reference points ;
a control component, the control component establishes the image capturing coordinate system and the splitting coordinate system according to the appearance contour size of the standard sheet and the two reference point position coordinates, the reference image capturing coordinate and the reference splitting coordinate And a conversion function for causing the control component to convert a contour image coordinate of a wafer to be split into a split edge coordinate according to the conversion function.
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| TW102101440A TW201428892A (en) | 2013-01-15 | 2013-01-15 | Detection method and system for wafer cleavage position |
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| TW102101440A TW201428892A (en) | 2013-01-15 | 2013-01-15 | Detection method and system for wafer cleavage position |
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| US8577119B2 (en) * | 2006-02-24 | 2013-11-05 | Hitachi High-Technologies Corporation | Wafer surface observing method and apparatus |
| JP5040643B2 (en) * | 2007-12-28 | 2012-10-03 | 日本電産リード株式会社 | Alignment method |
| TWM377691U (en) * | 2009-10-09 | 2010-04-01 | Horng Terng Automation Co Ltd | Wafer cleavage detection device |
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