TW201428399A - Package structure and display module - Google Patents

Abstract

A package structure configured to be connected to a display panel is provided. The package structure includes a flexible substrate, a circuit layer, a chip and a protective layer. The circuit layer is disposed on the flexible substrate and has a bonding region and a circuit region electrically connected with the bonding region, wherein the circuit layer is electrically connected to a pad region on a circuit disposing surface of the display panel through the bonding region. The chip is disposed on the flexible substrate and electrically connected to the circuit region. The protective layer covers the circuit region and exposes the bonding region, wherein an end of the protective layer which is adjacent to the bonding region is located between the circuit disposing surface and the circuit region. A display module including a display panel and a package structure is also provided.

Description

Package structure and display module

The invention relates to a package structure and a display module.

In recent years, in order to meet the trend of high-density packaging of electronic components, Tape Tape Carrier (TCP) technology has become one of the main trends of chip packaging technology by replacing the traditional wire bonding technology. Among them, the chip on film (COF) packaging technology is generally applied to various layers, such as an electrical connection between a liquid crystal panel and a driver IC. Taking a bonding process of a liquid crystal display panel and a driving chip as an example, a wafer is formed on a flexible substrate such as a tape or a film by a COF packaging technology to form a package structure, and then the liquid crystal display is connected via the package structure. Panel and board.

Since the encapsulated package structure by the COF package technology has the characteristics of small size, light weight, and flexible substrate, the package structure can be easily bent after being bonded to the liquid crystal display panel. The back surface of the liquid crystal display panel further enables the thickness of the liquid crystal module (LCM) to be further thinned. However, when the package structure is bent to the back surface of the liquid crystal display panel, the line on the flexible substrate for connecting the liquid crystal display panel and the circuit board may be broken due to bending, thereby affecting the driving function of the wafer.

The present invention provides a package structure having better strength.

The invention provides a display module with better reliability and durability.

One embodiment of the present invention provides a package structure suitable for connection to a display panel. The package structure includes a flexible substrate, a wiring layer, a wafer, and a protective layer. The circuit layer is disposed on the flexible substrate and has a bonding region and a wiring region electrically connected to the bonding region, wherein the circuit layer is electrically connected to a pad region on a line configuration surface of the display panel via the bonding region. The wafer is disposed on the flexible substrate and electrically connected to the wiring region. The protective layer covers the wiring region and exposes the bonding region, wherein one end of the protective layer adjacent to the bonding region is located between the wiring arrangement surface and the wiring region.

An embodiment of the present invention provides a display module including a display panel and a package structure. The display panel has a line configuration surface and a pad area on the line arrangement surface. The package structure includes a flexible substrate, a first circuit layer, a wafer, and a first protective layer. The first circuit layer is disposed on the flexible substrate and has a bonding region and a first wiring region electrically connected to the bonding region, wherein the first circuit layer is electrically connected to the pad region of the display panel via the bonding region. The wafer is disposed on the flexible substrate and electrically connected to the first line region. The first protective layer covers the first wiring region and exposes the bonding region, wherein one end of the first protective layer adjacent to the bonding region is located between the wiring arrangement surface and the first wiring region.

In an embodiment of the invention, the first circuit layer is located between the first protective layer and the flexible substrate.

In an embodiment of the invention, the first circuit layer includes multiple pieces wire. The wire extends from the first line region to the land. Each wire has a line segment, a joint segment and a connecting segment connecting the wire segment and the joint segment. The line segment is located in the first line area. The joint segment is located in the joint zone. The connecting section is located in a portion of the first line area adjacent to the land. The line width of the line segment is greater than the line width of the joint portion, and the line width of one end of the connecting portion near the line segment is greater than the line width of the end portion of the connecting portion near the joint portion.

In an embodiment of the invention, the end of the first protective layer adjacent to the land is located between the line arrangement surface and the connecting section.

In an embodiment of the invention, the first protective layer is a solder resist layer.

In an embodiment of the invention, the display module further includes a conductive connection unit electrically connected to the land of the first circuit layer and the pad region of the display panel.

In an embodiment of the invention, the conductive connecting unit is an anisotropic conductive paste.

In an embodiment of the invention, the display module further includes a circuit board, wherein the first circuit layer is electrically connected to the circuit board and the display panel.

In an embodiment of the invention, the display panel comprises a substrate and a second circuit layer. The substrate has a line configuration surface. The second circuit layer is disposed on the line arrangement surface and has a second line area and a pad area electrically connected to the second line area.

In an embodiment of the invention, the display module further includes a second protective layer covering the second line region and exposing the pad region.

In an embodiment of the invention, the display panel is a liquid crystal display A display panel or an organic light emitting diode display panel.

Based on the above, the package structure and the display module of the embodiment of the present invention dispose the first circuit layer on the flexible substrate, and cover the first circuit region of the first circuit layer to expose the first circuit. a junction region of the layer, and one end of the first protection layer adjacent to the junction region is between the line arrangement surface of the display panel and the first line region. Therefore, when the package structure is connected to the display panel and the display module is formed by bending, the package structure prevents the first circuit layer from being damaged by the first protection layer being located between the line arrangement surface and the first line region, thereby enabling the first circuit layer to be damaged. The wafer connected to the first line area can maintain normal operation. Accordingly, the package structure of the present invention has better strength, and the display module of the present invention has better reliability and durability.

The above described features and advantages of the present invention will be more apparent from the following description.

1 is a schematic diagram of a display module in accordance with an embodiment of the present invention. 2 is a partially enlarged schematic view of the display module of FIG. 1. Referring to FIG. 1 and FIG. 2 , in the embodiment, the display module 50 includes a display panel 52 , a circuit board 54 , and a package structure 100 . The package structure 100 electrically connects the circuit board 54 and the display panel 52. The display panel 52 is, for example, a liquid crystal display panel or an organic light emitting diode display panel, and the present invention does not limit the type of the display panel 52. In addition, in order to make the drawings clearer, FIG. 1 and FIG. 2 only show the components required for the embodiment, and the display module 50 may actually include other unillustrated members such as a frame. The invention is not limited thereto.

In the present embodiment, the display panel 52 has a line arrangement surface S1 and a pad area 52a on the line arrangement surface S1. The package structure 100 includes a flexible substrate 110, a first wiring layer 120, a wafer 130, and a first protective layer 140. The first circuit layer 120 is disposed on the flexible substrate 110 and has a bonding region 122 and a first wiring region 124 electrically connected to the bonding region 122. The package structure 100 is electrically connected to the circuit board 54 and the display panel 52 by the first circuit layer 120. The first circuit layer 120 is electrically connected to the pad region 52a of the display panel 52 via the bonding region 122, and the first circuit layer 120 is Electrically connected to circuit board 54 via first line region 124. In addition, the first protective layer 140 covers the first line region 124 and exposes the land 122 to prevent damage to the first line region 124 that is not connected to the pad region 52a. One end of the first protective layer 140 near the land 122 is located between the line arrangement surface S1 and the first line area 124 such that the first line layer 120 is located between the first protection layer 140 and the flexible substrate 110.

On the other hand, the wafer 130 is disposed on the flexible substrate 110 and electrically connected to the first line region 124. The wafer 130 and the first circuit layer 120 can be disposed on the same surface of the flexible substrate 110 to electrically connect the wafer 130 to the first wiring region 124 or to the opposite sides of the flexible substrate 110 to pass the wafer 130 through the flexible substrate 110. The hole (not shown) is electrically connected to the first line region 124, and an opening (not shown) is disposed on the flexible substrate 110, and the wafer 130 is disposed therein to electrically connect the first line region 124. The invention is not limited. The arrangement of the wafer 130. Therefore, the package structure 100 is electrically connected to the circuit board 54 and the display panel 52 through the first circuit layer 120 to electrically connect the wafer 130 of the first circuit layer 120 through the circuit board 54. The display panel 52 is controlled.

In the present embodiment, the display panel 52 includes a substrate 52b and a second wiring layer 52c. The substrate 52b is, for example, a glass substrate, but the present invention does not limit the type of the substrate 52b. The material of the second circuit layer 52c is Indium Tin Oxide (ITO), but the invention is not limited thereto. The substrate 52b has a line arrangement surface S1. The second circuit layer 52c is disposed on the line arrangement surface S1 and has a second line area 52d and a pad area 52a electrically connected to the second line area 52d. Therefore, the bonding region 122 of the first circuit layer 120 of the package structure 100 is electrically connected to the pad region 52a, so that the package structure 100 is electrically connected to the display panel 52 through the second line region 52d of the electrical connection pad region 52a. The member is, for example, an electrode layer or a liquid crystal layer (not shown).

On the other hand, in the embodiment, the display module 50 further includes a conductive connection unit 56 electrically connected to the land area 122 of the first circuit layer 120 and the pad area 52a of the display panel 52. The conductive connecting unit 56 is an anisotropic conductive film (ACF), but the invention is not limited thereto. In addition, the display module 50 further includes a second protective layer 58 covering the second line region 52d and exposing the pad region 52a to prevent the second line region 52d not connected to the package structure 100 from being damaged.

In this embodiment, the conductive connection unit 56 is disposed on the pad region 52a of the display panel 52 such that the bonding region 122 of the first circuit layer 120 of the package structure 100 is electrically connected to the display panel 52 through the conductive connection unit 56. Pad area 52a. In addition, since one end of the first protective layer 140 adjacent to the land portion 122 of the present embodiment is located between the line arrangement surface S1 and the first line region 124, a portion of the line arrangement surface S1 contacts the first protection layer. The end of 140 is adjacent to one end of the land 122, thereby reducing the area of the land area 52a on the line arrangement surface S1. Therefore, the display module 50 can reduce the amount of the conductive connection unit 56, thereby reducing the cost of the display module 50.

In the present embodiment, the package structure 100 is, for example, a chip on film (COF) package structure, wherein the material of the flexible substrate 110 is, for example, polyimide (PI), and the wafer 130 is, for example, an integrated circuit ( The integrated circuit (IC) wafer, and the first protective layer 140 is a solder mask, but the invention is not limited thereto. After the package structure 100 is electrically connected to the display panel 52 and the circuit board 54, the package structure 100 can be bent to the back surface of the display panel 52 to thin the display module 50, as shown in FIG. At this time, the package structure 100 prevents the first circuit layer 120 from being damaged by the first protection layer 140 between the line arrangement surface S1 and the first line region 124, so that the wafer 130 connected to the first line region 124 can be maintained normally. Operation. Accordingly, the package structure 100 has better strength, and the display module 50 has better reliability and durability.

3 is a partially enlarged schematic view of the package structure of FIG. 2. Please refer to FIG. 1 to FIG. 3 . Specifically, in the embodiment, the first circuit layer 120 includes a plurality of wires 126 . The material of the wire 126 is, for example, copper (Cu), but the invention is not limited thereto. Wire 126 extends from first line region 124 to land 122, wherein each wire 126 has a wire segment 126a, a joint segment 126b, and a connecting segment 126c that connects wire segment 126a to joint segment 126b. The line segment 126a is located in the first line region 124, the junction segment 126b is located in the land region 122, and the connection segment 126c is located in the portion of the first line region 124 adjacent the land region 122. Therefore, the first protective layer 140 covers the first line region 124. The line segment 126a is connected to the segment 126c and exposes the joint segment 126b at the land 122. Therefore, when the package structure 100 is electrically connected to the display panel 52, each of the wires 126 is electrically connected to the pad region 52a via the bonding portion 126b, and one end of the first protection layer 140 adjacent to the bonding region 122 is located at the line arrangement surface S1 and the connection segment. Between 126c.

On the other hand, in the present embodiment, the line width of the line segment 126a is greater than the line width of the joint portion 126b, and the line width of the end of the connecting portion 126c adjacent to the line segment 126a is greater than the end of the connecting portion 126c adjacent to the joint portion 126b. Line width. In other words, the junction segment 126b of the wire 126 is thinner than the wire segment 126a to increase the distance of each wire 126 on the land 122 to prevent the wire 126 from collecting conductive particles on the conductive connection unit 56 to create a bridging effect. Causes a short circuit. Therefore, the connecting portion 126c can be regarded as a transitional region connecting the line segment 126a and the joint portion 126b having different line widths to exhibit a bottle neck shape.

When the package structure 100 is bent to the back surface of the display panel 52, the wires 126 of the first circuit layer 120 are bent to generate stress, and the stress is easily concentrated in the region where the line width of the wire 126 changes, that is, the connection. Segment 126c. At this time, since one end of the first protective layer 140 near the land 122 is located between the line arrangement surface S1 and the connection portion 126c, the first line layer 120 is located on the line by the end of the first protection layer 140 near the junction area 122. Between the surface S1 and the connecting portion 126c, the wire 126 can be prevented from being broken due to bending, so that the wafer 130 connecting the line segments 126a can maintain normal operation. Accordingly, the package structure 100 has better strength, and the display module 50 has better reliability and durability.

In summary, the package structure and the display module of the present invention dispose the first circuit layer on the flexible substrate, and cover the first circuit layer of the first circuit layer to expose the first circuit layer. The junction area, and one end of the first protection layer adjacent to the junction area is located between the line arrangement surface of the display panel and the first line area. Therefore, when the package structure is connected to the display panel and the display module is formed by bending, the package structure prevents the first circuit layer from being damaged by the first protection layer being located between the line arrangement surface and the first line region, thereby enabling the first circuit layer to be damaged. The wafer connected to the first line area can maintain normal operation. Accordingly, the package structure of the present invention has better strength, and the display module of the present invention has better reliability and durability.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

50‧‧‧ display module

52‧‧‧ display panel

52a‧‧‧Pushing area

52b‧‧‧Substrate

52c‧‧‧second circuit layer

52d‧‧‧Second line area

54‧‧‧Circuit board

56‧‧‧Electrically connected unit

58‧‧‧Second protective layer

100‧‧‧Package structure

110‧‧‧Soft substrate

120‧‧‧First line layer

122‧‧‧ junction area

124‧‧‧First line area

126‧‧‧ wire

126a‧‧‧ line segment

126b‧‧‧joining section

126c‧‧‧Connection section

130‧‧‧ wafer

140‧‧‧First protective layer

S1‧‧‧ line configuration surface

1 is a schematic diagram of a display module in accordance with an embodiment of the present invention.

2 is a partially enlarged schematic view of the display module of FIG. 1.

3 is a partially enlarged schematic view of the package structure of FIG. 2.

50‧‧‧ display module

52‧‧‧ display panel

52a‧‧‧Pushing area

52b‧‧‧Substrate

52c‧‧‧second circuit layer

52d‧‧‧Second line area

54‧‧‧Circuit board

56‧‧‧Electrically connected unit

58‧‧‧Second protective layer

100‧‧‧Package structure

110‧‧‧Soft substrate

120‧‧‧First line layer

122‧‧‧ junction area

124‧‧‧First line area

130‧‧‧ wafer

140‧‧‧First protective layer

S1‧‧‧ line configuration surface

Claims (16)

a package structure, which is adapted to be connected to a display panel, the package structure includes: a flexible substrate; a circuit layer disposed on the flexible substrate, and having a bonding region and a circuit region electrically connected to the bonding region, The circuit layer is electrically connected to a pad region on a line arrangement surface of the display panel via the bonding region; a chip disposed on the flexible substrate and electrically connected to the line region; and a protective layer Covering the line area and exposing the joint area, wherein an end of the protective layer adjacent to the joint area is between the line arrangement surface and the line area. The package structure of claim 1, wherein the circuit layer is located between the protective layer and the flexible substrate. The package structure of claim 1, wherein the circuit layer comprises a plurality of wires extending from the line region to the junction region, each wire having a line segment, a junction segment and a connection a connecting section of the line segment and the joint section, the line section is located in the line zone, the joint section is located in the joint zone, the connection section is located at a portion of the line zone close to the joint zone, and the line segment has a large line width The line width of the joint segment, and the line width of the connecting section near the end of the line segment is greater than the line width of the connecting section adjacent to the end of the joint section. Such as the package structure described in claim 3, wherein the protection The end of the sheath adjacent the land is located between the line configuration surface and the connecting section. The package structure of claim 1, wherein the protective layer is a solder resist layer. A display module includes: a display panel having a line arrangement surface and a pad area on the line arrangement surface; and a package structure comprising: a flexible substrate; a first circuit layer disposed on the soft On the substrate, and having a bonding region and a first wiring region electrically connected to the bonding region, wherein the first circuit layer is electrically connected to the pad region of the display panel via the bonding region; On the flexible substrate, and electrically connected to the first line region; and a first protective layer covering the first line region and exposing the joint region, wherein the first protective layer is adjacent to the joint region One end is located between the line configuration surface and the first line area. The display module of claim 6, wherein the first circuit layer is located between the first protective layer and the flexible substrate. The display module of claim 6, wherein the first circuit layer comprises a plurality of wires extending from the first line region to the junction region, each wire having a line segment and a joint a segment and a connecting segment connecting the line segment and the joint segment, the line segment is located at the first line In the road zone, the joint section is located in the joint zone, the joint section is located at a portion of the first line zone adjacent to the joint zone, the line width of the line segment is greater than the line width of the joint section, and the connection section is close The line width of one end of the line segment is greater than the line width of the end of the connecting segment adjacent to the joint segment. The display module of claim 8, wherein the end of the first protective layer adjacent to the joint region is located between the line arrangement surface and the connecting portion. The display module of claim 6, wherein the first protective layer is a solder resist layer. The display module of claim 6, further comprising a conductive connecting unit electrically connecting the land of the first circuit layer and the pad region of the display panel. The display module of claim 11, wherein the conductive connecting unit is an anisotropic conductive adhesive. The display module of claim 6, further comprising a circuit board, wherein the first circuit layer is electrically connected to the circuit board and the display panel. The display module of claim 6, wherein the display panel comprises: a substrate having the line arrangement surface; and a second circuit layer disposed on the line arrangement surface and having a second line a region and the pad region electrically connected to the second line region. The display module of claim 14, further comprising a second protective layer covering the second line region and exposing the pad region. The display module of claim 6, wherein the display panel is a liquid crystal display panel or an organic light emitting diode display panel.