TW201426859A - High aspect ratio micro-structure etching method using changeable power generator - Google Patents

Abstract

The present invention discloses a high aspect ratio micro-structure etching method using changeable power generator. The high aspect ratio micro-structure etching method comprises the following steps: inputting a low-power low-frequency signal to stimulate plasma for performing a high aspect ratio micro-structure etching on the hard mask layer and amorphous carbon layer or organic mask layer of a wafer; changing the low power low-frequency signal input to a high power low-frequency signal input; using the high power low-frequency signal to stimulate plasma for performing a high aspect ratio micro-structure etching on the silica layer of the wafer. The present invention can be changed to high frequency power input or low frequency power output based on the requirement in order to avoid issues such as differences or repetitions from using high-frequency power generator to output low-frequency power. The present invention realizes a precise adjustment of power output for enhancing the yield rate and reducing the manufacturing cost.

Description

High aspect ratio microstructure etching method using switchable power generator

The present invention relates to a reactive ion etching process for a semiconductor fabrication process, and more particularly to a high aspect ratio microstructure etching method using a switchable power generator.

High aspect ratio (HAR) structures are very common in semiconductor fabrication, particularly in electrode reactions. A structure having an aspect ratio greater than 10:1 is often used with a critical dimension (CD) similar to less than 50 nanometers (nm). The reduction in feature size (CD) poses great difficulties for lithography.

As shown in FIG. 1, when a high aspect ratio (HAR) structure etching process is performed, the structure of the semiconductor device includes a photoresist layer and a bottom anti-reflective layer 1' (photoresist layer and Arc layer) disposed on the top layer. a hard mask layer under the adhesive layer and the bottom anti-reflective layer 1', and an amorphous carbon layer or organic mask layer 3' under the hard mask 2' (Carbon layer or organic mask layer) ), and the SiO2 layer located on the bottom layer.

In order to consider the precision of photolithography, the photoresist layer 1' is usually thinly set, but this causes the photoresist layer 1' to be insufficient for protection in a deep silicon oxide etch process. effect. Therefore, a hard mask layer 2' and an organic mask layer 3' are deposited under the photoresist layer 1' as a mask which actually acts in the germanium oxide etching process. Typically, the hard mask layer 2' employs a bottom anti-reflective layer (Barc layer) / dielectric anti-reflective layer (Darc layer), while the organic mask layer 3' employs a C-rich layer. The thickness of the amorphous carbon layer usually exceeds 150 nm, which helps to improve the above. The etched sidewall morphology of the deep oxidized etch.

Since the top mask layer is thin, etching is usually performed with low power, and etching is performed with a high frequency signal power of less than 1500 W and a low frequency signal power of less than 500 W. The cerium oxide layer has a deep etching depth and a hard material, and is usually etched with high power, and is etched with a high frequency signal power of 1000-3000 W and a low frequency signal power of 2500-6000 W. In most Reactive Ion Etching (RIE) systems, high frequency power output and low frequency power output are required. High-frequency signal power, also known as source power, is utilized for molecular dissociation, and the output frequency of high-frequency signal power ranges from 30 megahertz to 120 megahertz. Low-frequency signal power, also known as bias power, is used to control ion bombardment and contributes to anisotropic etching. The output frequency of low-frequency signal power ranges from 0.2 MHz to 15 MHz. High aspect ratio structure etching processes generally have higher requirements for low frequency signal power output. The very low power bias power (power below 200W) is suitable for the hard mask and amorphous carbon layer perforation etching steps. In hard mask and amorphous carbon layer perforation etching, if a higher power bias power is used, the problem of etched surface damage or CD shift may occur. High bias power (sometimes greater than 5000W) is suitable for deep ruthenium etch processes because ion bombardment is very helpful in high aspect ratio HAR contact etching. Therefore, a low-power signal generator with a large rated power, such as a low-frequency signal generator with a rated output of 5000 W or 7000 W, is often mounted on an etching reaction chamber for etching a high aspect ratio structure.

If the low-frequency signal generator with large rated output power is used alone, although the power output range of the generator covers low power output and high power output, when the low-frequency signal generator with large rated output power outputs low power, the generator It is often impossible to precisely control the tiny power output, which affects the etching effect and equipment stability. A low-frequency power generator with a rated output power greater than 5000 W is often used in the prior art, but when the low-frequency power generator outputs a low-power low-frequency signal of about 200 W, a problem of large error and poor repeatability occurs.

For example, when a 7000W low frequency power generator outputs 200W of power, a positive or negative 35W tolerance may be generated. If the 7000W low frequency power generator is used in the hard mask etch step, a 35W deviation may result in feature size shifts and process instability. The above factors lead to higher instability in the formation of existing high aspect ratio structure etching processes. At the same time, it provides higher requirements for equipment manufacturers to provide more accurate power output, which increases the difficulty of the process.

The invention provides a high aspect ratio microstructure etching method using a switchable power generator, which facilitates precise control of high frequency power and low frequency power output during high aspect ratio microstructure etching process to improve stability of etching process. .

To achieve the above object, the present invention provides a high aspect ratio microstructure etching method using a switchable power generator. The plasma etching chamber to which the microstructure etching method is applied includes a chamber in which a chamber is distributed. a plasma; an upper electrode disposed at a top of the chamber; a lower electrode disposed at a bottom of the chamber; an etched wafer placed on the lower electrode; a high frequency signal source that outputs a high frequency signal to the lower electrode a high-power low-frequency signal source and a low-power low-frequency signal source, the high-power low-frequency signal source and the low-power low-frequency signal source switchably output a high-power low-frequency signal or a low-power low-frequency signal to a lower electrode; the wafer includes lithography a glue layer, a hard mask layer disposed under the photoresist layer, an amorphous carbon layer or an organic mask layer disposed under the hard mask layer, and a dioxide disposed under the amorphous carbon layer or the organic mask layer The ruthenium layer is characterized in that the above-mentioned microstructure etch method comprises the following steps; Step 1. Input low-power low-frequency signal to excite plasma, on-wafer hard mask layer, and amorphous carbon layer or organic mask layer High aspect ratio microstructure Eclipse; step 1.1, low-power low-frequency signal source outputs low-power low-frequency signal to the lower electrode to excite the plasma; step 1.2, high-aspect ratio microstructure etching of the hard mask layer of the wafer; step 1.3, not for the wafer The shaped carbon layer or the organic mask layer is subjected to high aspect ratio microstructure etching; in step 2, the low power low frequency signal input is switched to the high power low frequency signal input; step 3, the high power low frequency signal is excited to the plasma, and the wafer is The yttrium oxide layer is subjected to high aspect ratio microstructure etching.

In the above step 1, the power output of the low power low frequency signal is less than 1000 watts.

In the above step 1, when the hard mask layer, and the amorphous carbon layer or the organic mask layer are etched, the etching gas is CF ₄ , CHF ₃ , CH ₂ F ₂ , O ₂ , N ₂ gas.

The pressure of the etching gas in the above step 1 is 30 to 100 mT.

In the above step 3, the power output of the high power low frequency signal is greater than 3000 watts.

In the above step 3, when the ceria layer is etched, the etching gas is CF ₄ , C ₄ F ₈ , F ₄ F ₆ , CH ₂ F ₂ , Ar, O ₂ gas.

The pressure of the etching gas in the above step 3 is 10 to 50 mT.

After the above step 3, the following steps are further included: performing subsequent processing on the wafer, and turning off the high-power low-frequency signal source after completing the subsequent processing.

In the above wafer, a bottom anti-reflection layer or a dielectric anti-reflection layer may also be disposed at the photoresist layer.

The present invention utilizes a high aspect ratio microstructure etch method of a switchable power generator compared to prior art high aspect ratio microstructure etch techniques, which has the advantage that the present invention employs switchable high frequency power output and low frequency power output. In need High-frequency power is used to etch the wafer with high-frequency power output. When low-frequency power is required, the low-frequency power output is used to etch the wafer, which avoids the error caused by the high-level power generator output low-frequency power output. The problem of poor repeatability; achieving precise adjustment of power output, improving product qualification rate and reducing cost.

1‧‧‧ chamber

2‧‧‧Upper electrode

3‧‧‧ lower electrode

4‧‧‧ Wafer

41‧‧‧Photoresist layer

42‧‧‧hard mask layer

43‧‧‧Indeterminate carbon or organic mask

44‧‧‧ cerium oxide layer

5‧‧‧ Plasma

6‧‧‧Low-rated low-frequency signal generator

7‧‧‧High-rated low-frequency signal generator

8‧‧‧Switching device

1'‧‧‧Photoresist layer and bottom anti-reflective layer

2'‧‧‧ Hard mask layer

3'‧‧‧Indeterminate carbon or organic mask

4'‧‧‧2 bismuth oxide layer

1 is a schematic view showing the structure of a wafer when a high aspect ratio microstructure etching process is prepared in the prior art; and FIG. 2 is a plasma etching method applicable to a high aspect ratio microstructure etching method using a switchable power generator. FIG. 3 is a schematic diagram of a method for a high aspect ratio microstructure etching method using a switchable power generator according to the present invention; FIG. 4 is a high aspect ratio of the present invention using a switchable power generator. Schematic diagram of the wafer structure during the mask etching process in the process of the microstructure etching method; FIG. 5 is a process of performing the cerium oxide etching process in the process of the high aspect ratio microstructure etching method using the switchable power generator Schematic diagram of the wafer structure.

Specific embodiments of the present invention are further described below in conjunction with the accompanying drawings.

The invention discloses a high aspect ratio microstructure etching method using a switchable power generator, and is suitable for a high aspect ratio microstructure etching process with a diameter of 28 nm or 40 nm and a depth of 300 nm to 1000 nm.

As shown in FIG. 2, the present invention utilizes a plasma etching chamber to which a high aspect ratio microstructure etching method of a switchable power generator is applied, which can perform reactive ion etching ( RIE) for performing high aspect ratio microstructure etching on wafer 4, the etching chamber includes: chamber 1, upper electrode 2, lower electrode 3, low rated power low frequency signal generator 6, high rated A low frequency signal generator 7 for power, a high frequency signal generator (not shown) and a switching device 8.

The chamber 1 contains an outer wall of the reaction chamber to form a closed reaction chamber.

The plasma 5 is sealed and distributed in the chamber 1 as an etching gas for the wafer 4.

The upper electrode 2 is disposed at the top inside the chamber 1, and the upper electrode 2 is grounded.

The lower electrode 3 is disposed at the bottom of the chamber 1, and the lower electrode 3 is connected to the power input. The wafer 4 to be etched can be fixed above the lower electrode 3 through an electrostatic chuck (not shown), and the lower electrode 3 passes the power. The wafer 4 is etched by inputting the excitation plasma 5.

The high frequency signal generator is connected to the lower electrode 3 for outputting a high frequency power signal to the chamber 1 to excite and detach the plasma 5 in the chamber 1. The output power of the high-frequency signal generator is usually 1000W-5000W.

The low rated power low frequency signal generator 6 can output a low frequency power signal having a power of less than 1000 watts, preferably 200 watts. The low-rated low-frequency signal generator 6 is for outputting a low-power low-frequency signal to the lower electrode 3. When the low-rated low-frequency signal generator 6 is connected to the lower electrode 3, the plasma etching chamber uses low power. The low frequency signal controls the plasma 5 to bombard and etch the wafer 4.

The high-rated low-frequency signal generator 7 can output a high-frequency power signal of more than 3000 watts, preferably 5,000 watts or 7,000 watts. The high-rated low-frequency signal generator 7 is for outputting a high-power low-frequency signal to the lower electrode 3. When the high-rated low-frequency signal generator 7 is connected to the lower electrode 3, the plasma etching chamber uses high power. The low frequency signal controls the plasma 5 to bombard and etch the wafer 4.

One end of the switching device 8 is electrically connected to the lower electrode 3, and the other end is switched and connected with a low-frequency signal generator 6 of low power rating and a low-frequency signal generator 7 of high power rating for controlling the power signal input to the lower electrode 3 at low power. Switch between low frequency signals and high power low frequency signals. The switching device 8 can be externally connected The control module receives the switching control command, or directly adopts manual control, and switches between the low-rated power low-frequency signal generator 6 and the high-rated low-frequency signal generator 7, so that the lower electrode 3 is at a low frequency with low rated power. The signal generator 6 is switched or switched between a connection with a high-rated low-frequency signal generator 7. When the lower electrode 3 is connected to the low-rated power low-frequency signal generator 6 through the switching device 8, the lower electrode 3 receives the low-power low-frequency signal output by the low-rated low-frequency signal generator 6, and is excited by the low-power low-frequency signal. The plasma 5 etches the wafer 4. When the lower electrode 3 is connected to the high-rated low-frequency signal generator 7 through the switching device 8, the lower electrode 3 receives the high-power low-frequency signal output from the high-rated low-frequency signal generator 7, and uses the high-power low-frequency signal to excite the plasma. Body 5 etches wafer 4.

The invention also discloses a second embodiment of a plasma etching chamber suitable for a high aspect ratio microstructure etching method using a switchable power generator, the etching system comprising: a chamber, an upper electrode, a lower electrode, A high frequency power generator and a low frequency power generator that can switch output power.

The chamber contains an outer wall of the reaction chamber to form a closed reaction chamber.

The plasma seal is distributed in the chamber as an etching gas for the wafer.

The upper electrode is disposed at the top of the chamber, and the upper electrode is grounded.

The lower electrode is disposed at the bottom of the chamber, and the lower electrode is connected to the power input. The wafer to be etched can be fixed on the lower electrode through the electrostatic chuck, and the lower electrode etches the wafer by the power input excitation plasma.

A high frequency signal generator is coupled to the lower electrode for outputting a high frequency power signal to the chamber for excitation and molecular dissociation of the plasma within the chamber. The output power of the high-frequency signal generator is usually 1000W-5000W.

The output end of the low-frequency power generator capable of switching the output power is connected to the lower electrode circuit for outputting the high-power low-frequency signal to the lower electrode switchably Or low power low frequency signals. The power generator can switchably output low frequency power with a power of less than 1000 watts or low frequency power with a power greater than 3000 watts. Preferably, the low power low frequency signal output can be 200 watts. Preferably, the high power low frequency signal output can be 5000 watts or 7000 watts.

The power generator capable of switching output power can receive a switching control command through an external control module, or directly adopt manual control to switch between a low-power low-frequency signal output and a high-power low-frequency signal output, thereby realizing a switchable downward electrode Input low power low frequency signals or high power low frequency signals. The power generator performs specific requirements of a high aspect ratio microstructure etching process according to a plasma etching chamber, and switches output low-power low-frequency signal output or high-power low-frequency signal output, and low-power low-frequency signal or high-power low-frequency from the lower electrode. The signal excites the plasma to etch the wafer.

As shown in FIG. 3, the present invention discloses a high aspect ratio microstructure etching method using a switchable power generator, which is applicable to the first and second embodiments of the plasma etching (RIE) chamber. Any of them.

The high aspect ratio microstructure etching method includes the steps of placing the wafer 4 at the lower electrode 3 in the chamber 1 and fixing the wafer 4 through an electrostatic chuck before etching.

The high frequency signal generator outputs high frequency power to the lower electrode 3, and the plasma 5 molecules in the excitation chamber 1 are dissociated. The output power of the high-frequency signal generator is not limited, and it is usually 1000W-5000W.

Step 1. As shown in FIG. 4, the hard mask layer 42 on the wafer 4, and the amorphous carbon layer or the organic mask layer 43 are etched using a low power low frequency signal.

The top layer of the wafer 4 is provided with a photoresist layer 41. The photoresist layer 41 may further be provided with a bottom anti-reflection layer (Bare layer) or a dielectric anti-reflection layer (Darc layer), which is generated under the photoresist layer 41. There is a hard mask layer 42, an amorphous carbon layer or an organic mask layer 43 is formed under the hard mask layer 42, and the ceria layer 44 is formed under the amorphous carbon layer or the organic mask layer 43. Low-power low-frequency signal etching in step 1 In the process step of the wafer mask layer, a high aspect ratio (HAR) microstructure is performed on the hard mask layer 42, the amorphous carbon layer or the organic mask layer 43 according to the rules of the photoresist layer 41 setting. eclipse. When the hard mask layer 42, the amorphous carbon layer or the organic mask layer 43 is etched, the plasma 5 may be a reaction gas such as CF4, CHF3, CH2F2, O2, N2 or the like at a pressure of 30-100 mT.

Step 1.1: A low-rated power low-frequency signal generator is activated to output a low-power low-frequency signal to the lower electrode 3, and the excitation plasma 5 bombards the wafer 4. The low-power signal generator with low power rating has an output power of less than 1000 watts, and the power of the low-power low-frequency signal output is preferably less than 500 watts, and the low-power low-frequency signal output is preferably 200 watts.

Step 1.2: The plasma etching chamber performs high aspect ratio microstructure etching on the hard mask layer 42 of the wafer 4.

Step 1.3: The plasma etching chamber performs high aspect ratio microstructure etching on the amorphous carbon layer or the organic mask layer 43 of the wafer 4.

Step 2, low-frequency power output switching, low-rated power low-frequency signal generator 6 is turned off, high-rated low-frequency signal generator 7 is turned on, so that low-frequency input connected to lower electrode 3 is switched from low-rated power generator to high-rated power generator .

Among them, the output power of the high-rated low-frequency signal generator 7 is 2500-7000 watts, and the power of the output high-power low-frequency signal can preferably be more than 3000 watts, and more preferably 5000 watts or 7000 watts.

Step 3, as shown in FIG. 5, the low-frequency signal of high power rating is output to the lower electrode 3, the plasma 5 is excited to bombard the wafer 4, and the ceria layer 44 of the wafer 4 is subjected to the rules set by the photoresist layer 41. High aspect ratio (HAR) microstructure etch. When the ruthenium dioxide layer 44 is continuously etched, the plasma 5 can be reacted at a pressure of, for example, 10-50 mT, CF ₄ , C ₄ F ₈ , F ₄ F ₆ , CH ₂ F ₂ , Ar, O _{2 ,} etc. gas.

Step 4, completing the high aspect ratio micro-junction of the above steps 1 to 3 After the etching, the wafer is subjected to subsequent processing.

Step 5: After completing the subsequent process, the low-frequency signal generator and the high-frequency signal generator of high rated power are turned off, and the high-frequency signal and the high-power low-frequency signal output are stopped.

Step 6. At the end of the process, the electrostatic chuck releases the wafer 4, and the wafer 4 exits the plasma etching chamber.

Although the present invention has been described in detail by the preferred embodiments thereof, it should be understood that the foregoing description should not be construed as limiting. Various modifications and alterations of the present invention will be apparent to those skilled in the art. Therefore, the scope of the invention should be defined by the appended claims.

1‧‧‧ chamber

2‧‧‧Upper electrode

3‧‧‧ lower electrode

Claims (10)

A high aspect ratio microstructure etching method using a switchable power generator, the plasma etching chamber to which the microstructure etching method is applied includes: a chamber (1) having a distribution in the chamber (1) a plasma (5); an upper electrode (2) disposed at a top portion of the chamber (1); a lower electrode (3) disposed at a bottom portion of the chamber (1); An etched wafer (4) is placed on the lower electrode (3); a high frequency signal source that outputs a high frequency signal to the lower electrode (3); a high power low frequency signal source and a low power low frequency signal source, The high-power low-frequency signal source and the low-power low-frequency signal source switchably output a high-power low-frequency signal or a low-power low-frequency signal to the lower electrode (3); the wafer (4) includes a photoresist layer a hard mask layer disposed under the photoresist layer, an amorphous carbon layer or an organic mask layer disposed under the hard mask layer, and disposed on the amorphous carbon layer or organic mask a ruthenium dioxide layer under the film layer; wherein the microstructure etch method comprises the following steps: Step 1. Input a low-power low-frequency signal to excite the plasma Body (5), performing high aspect ratio microstructure etching on the hard mask layer on the wafer (4), and the amorphous carbon layer or the organic mask layer; and step 2, switching low power low frequency signals into input For high-power low-frequency signal input; step 3, the high-power low-frequency signal excites the plasma (5), and the high-aspect ratio microstructure etching of the ceria layer of the wafer (4). The high aspect ratio microstructure etching method using the switchable power generator according to claim 1, wherein the step 1 comprises the following steps: Step 1.1: The low power low frequency signal source outputs a low power low frequency signal to the lower electrode (3) Exciting the plasma (5); step 1.2, performing high aspect ratio microstructure etching on the hard mask layer of the wafer (4); step 1.3, the amorphous carbon layer on the wafer (4) or The organic mask layer is subjected to high aspect ratio microstructure etching. A high aspect ratio microstructure etching method using a switchable power generator as claimed in claim 1 or 2, wherein in step 1, the power output of the low power low frequency signal is less than 1000 watts. A high aspect ratio microstructure etching method using a switchable power generator according to claim 1 or 2, wherein in step 1, the hard mask layer, and the amorphous carbon layer or the organic mask layer are subjected to When etching, the etching gas is CF ₄ , CHF ₃ , CH ₂ F ₂ , O ₂ , N ₂ gas. A high aspect ratio microstructure etching method using a switchable power generator according to claim 4, wherein the pressure of the etching gas in the step 1 is 30 to 100 mT. A high aspect ratio microstructure etching method using a switchable power generator as claimed in claim 1, wherein in step 3, the power output of the high power low frequency signal is greater than 3000 watts. The high aspect ratio microstructure etching method using the switchable power generator according to claim 1, wherein in the step 3, when the germanium dioxide layer is etched, the etching gas is CF ₄ , C ₄ F ₈ , F ₄ F ₆ , CH ₂ F ₂ , Ar, O ₂ gas. A high aspect ratio microstructure etching method using a switchable power generator according to claim 7, wherein the pressure of the etching gas in the step 3 is 10 to 50 mT. The high aspect ratio microstructure etching method using the switchable power generator according to claim 1, wherein the step 3 further comprises the following steps: performing subsequent processing on the wafer (4), and closing after completing the subsequent processing. High power low frequency signal source. The high aspect ratio microstructure etching method using the switchable power generator according to claim 1, wherein in the wafer (4), the photoresist layer may further be provided with a bottom anti-reflection layer or a dielectric anti-reflection layer. Reflective layer.