TW201425913A - Section division determination method for wafer non-breakage detection - Google Patents
Section division determination method for wafer non-breakage detection Download PDFInfo
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Abstract
Description
本發明係有關於劈裂晶圓的方法,尤其是有關於檢測晶圓劈裂後是否斷開的方法。
The present invention relates to a method of splitting a wafer, and more particularly to a method of detecting whether a wafer is broken after splitting.
請參閱「圖1」與「圖2」所示,晶圓劈裂機1用於將晶圓2劈裂為一粒粒的晶粒,以進行後續的封裝作業,晶圓2在進行劈裂之前,會先用雷射切割出橫向與縱向的預切線3,接著將晶圓2貼附一藍膜4加以固定後,藉一固定夾具5送入一晶圓劈裂機1進行劈裂作業。
晶圓劈裂機1包含一晶圓固定座6、一懸臂桿7、一劈刀8、一影像擷取元件9、一壓制元件10與一照明光源11,該晶圓固定座6夾置該固定夾具5,並可作平面方向的移動與轉動,該劈刀8固定於該懸臂桿7上且設於該晶圓2的上方,以進行劈裂作業,且在進行劈裂作業時,為利用該壓制元件10抵壓該晶圓2,以避免晶圓2翹曲,而該照明光源11則可一體連接設置於該壓制元件10上,其用於產生成像光源(圖未示)照射該晶圓2,以穿透晶圓2,而該影像擷取元件9則設於該晶圓2的下方,為用於擷取該晶圓2的影像,以得知該晶圓2的位置。
據而該晶圓2可藉該晶圓固定座6的位移與該影像擷取元件9對該晶圓2的取像而進行定位,而在定位完成之後,即可藉該劈刀8的上下位移與該晶圓固定座6的定量位移,對多個預切線3連續進行劈裂,而該影像擷取元件9則在連續劈裂過程中,持續監控該預切線3的定位是否偏移,以視偏移的程度補償定位,而當橫向與縱向的預切線3皆被劈裂之後即完成劈裂作業。
又當製程偏差,導致晶圓2有未斷現象時,習知需要重新對位尋找未斷的位置加以重劈,其不但費時且對位不準時容易造成晶圓的崩壞,造成良率的下降。因此,目前作法為在劈裂後即檢知晶圓2是否斷開,若未斷開則加深刀位,直接重劈直至晶圓2斷開為止。
而檢知晶圓2於劈裂之後是否斷開,習知已有透過光學檢測的方式進行判斷,一般來說晶圓2在被劈斷後,透光度會增加,如請參閱「圖3」與「圖4」所示,其為晶圓2劈裂前後的局部光學取像圖,可以清楚發現劈斷後的晶圓2,其亮度顯然增加,因此可以習知可以比對晶圓2劈裂前後的光學影像,來判斷晶圓是否斷開。
然而,對於習知該影像擷取元件9所擷取的影像來說,晶圓2是否斷開對於影像的改變有可能差異不大,其會導致難以判斷晶圓2是否斷開,因而會需要做更精細的影像解析處理而造成判斷緩慢,不符合即時判斷的需求,甚至相當容易造成誤判的情形。
Referring to FIG. 1 and FIG. 2, the wafer splitting machine 1 is used to split the wafer 2 into a grain of grains for subsequent packaging operations, and the wafer 2 is undergoing splitting. Previously, the transverse and longitudinal pre-cut lines 3 are first cut by laser, and then the wafer 2 is attached with a blue film 4 and fixed, and then sent to a wafer splitting machine 1 by a fixing jig 5 for cleaving operation. .
The wafer splitting machine 1 comprises a wafer holder 6, a cantilever rod 7, a file 8, an image capturing member 9, a pressing member 10 and an illumination source 11, the wafer holder 6 sandwiching the wafer holder 6 Fixing the clamp 5 and moving and rotating in a plane direction, the boring tool 8 is fixed on the cantilever rod 7 and disposed above the wafer 2 for performing a splitting operation, and when performing a splitting operation, The pressing member 10 is pressed against the wafer 2 to prevent the wafer 2 from being warped, and the illumination source 11 is integrally connected to the pressing member 10 for generating an imaging light source (not shown) to illuminate the wafer 2 The wafer 2 is penetrated by the wafer 2, and the image capturing element 9 is disposed under the wafer 2, and is used for capturing the image of the wafer 2 to know the position of the wafer 2.
Therefore, the wafer 2 can be positioned by the displacement of the wafer holder 6 and the image capturing component 9 to take image of the wafer 2, and after the positioning is completed, the upper and lower sides of the file 8 can be borrowed. The displacement and the quantitative displacement of the wafer holder 6 continuously chop the plurality of pre-cut lines 3, and the image capturing element 9 continuously monitors whether the positioning of the pre-cut line 3 is offset during the continuous cleaving process. The positioning is compensated by the degree of visual offset, and the splitting operation is completed when both the lateral and longitudinal pre-cut lines 3 are cleaved.
When the process deviation causes the wafer 2 to be unbroken, it is customary to re-align the position to find the unbroken position, which is not only time-consuming but also causes the wafer to collapse if the alignment is not accurate, resulting in a yield. decline. Therefore, the current practice is to detect whether the wafer 2 is broken after the splitting, and if it is not disconnected, the tool position is deepened and the wafer is directly re-cut until the wafer 2 is disconnected.
It is known that the wafer 2 is broken after the splitting. It has been known by means of optical detection. Generally, the transmittance of the wafer 2 is increased after being cut off, as shown in Fig. 3 and As shown in Fig. 4, it is a partial optical image before and after the cleaving of the wafer 2. It can be clearly found that the wafer 2 after the chopping is obviously increased in brightness, so that it can be known that the wafer 2 can be compared before and after the cleaving. Optical image to determine if the wafer is broken.
However, for the image captured by the image capturing component 9, whether the wafer 2 is disconnected may have little difference to the image change, which may make it difficult to determine whether the wafer 2 is broken or not, and thus may need Doing more detailed image analysis processing results in slow judgment, does not meet the needs of instant judgment, and is even more likely to cause misjudgment.
爰此,本發明之主要目的在於提供一種晶圓未斷偵測分區判斷方法,以加快判斷速度與準確度。
本發明為一種晶圓未斷偵測的分區判斷方法,用於判斷一晶圓進行劈裂後,該晶圓是否斷開,其透過一影像擷取器於該晶圓劈裂前後各擷取一劈裂前晶圓影像與一劈裂後晶圓影像,並透過一影像處理單元比對該劈裂前晶圓影像與該劈裂後晶圓影像的差異,以產生一光學判定結果而得知該晶圓是否斷開,該分區判斷方法包含:
步驟S1:取得劈裂前晶圓影像,為透過該影像擷取器擷取該劈裂前晶圓影像。
步驟S2:建立複數判斷區塊,為透過該影像處理單元於該影像擷取器的擷取區域內,讓使用者依據該晶圓的特性,建立兩個以上的判斷區塊,並分別作為該影像處理單元產生該光學判定結果的比對區域,亦即該影像處理單元為依據所建立的該些判斷區塊,一一去比對影像產生該些判斷區塊的光學判定結果。
步驟S3:決定判斷方式,為讓該影像處理單元依據該晶圓的特性與該些判斷區塊的數量選擇一判定條件,該判定條件為當該些判斷區塊的光學判定結果為斷開的數量,超過一指定值時,判定該晶圓斷開,反之判定該晶圓未斷開,且該指定值為不大於該些判斷區塊數量的正整數。
步驟S4:劈裂,為對該晶圓進行劈裂動作,其為透過習用的劈裂機進行劈裂晶圓。
步驟S5:取得劈裂後晶圓影像,為透過該影像擷取器擷取該劈裂後晶圓影像。
步驟S6:判斷晶圓是否斷開,為讓該影像處理單元依據該劈裂前晶圓影像與該劈裂後晶圓影像產生該些判斷區塊的光學判定結果,並依據該判定條件與該些判斷區塊的光學判定結果,判定該晶圓是否斷開。
據此,本發明透過分區判斷的方式,縮小判斷面積,故可以減少光學影像辨析上困難度,而達到加快光學判定結果的產生速度,且本發明可因應晶圓的特性,選擇判斷區塊的位置與數量,其可增加劈裂前後,判斷區塊的光學影像差異性,而使判斷更為準確,並更可依據晶圓特性,改變判定條件,以由複數判斷區塊的光學判定結果,綜合判斷晶圓是否斷開,進一步增加判斷的準確度,因而可以避免晶圓檢查時發現未斷而需要重新對位重劈的困擾。
Accordingly, the main object of the present invention is to provide a method for judging the uninterrupted detection of wafers to speed up the judgment and accuracy.
The invention is a method for judging the uninterrupted detection of a wafer, and is used for judging whether a wafer is broken after a wafer is cleaved, and is captured by an image picker before and after the wafer is split. a pre-split wafer image and a split wafer image, and an image processing unit compares the difference between the pre-crack wafer image and the cleaved wafer image to generate an optical determination result Knowing whether the wafer is disconnected, the partition determination method includes:
Step S1: Obtaining a pre-cleavage wafer image, and capturing the pre-crack wafer image through the image extractor.
Step S2: establishing a plurality of determination blocks, wherein the user is configured to create more than two determination blocks according to the characteristics of the wafer, and respectively, as the image processing unit, in the capture area of the image capture unit The image processing unit generates a comparison region of the optical determination result, that is, the image processing unit generates an optical determination result of the determination blocks according to the determined determination blocks.
Step S3: determining a determination mode, wherein the image processing unit selects a determination condition according to the characteristics of the wafer and the number of the determination blocks, and the determination condition is that when the optical determination result of the determination blocks is disconnected When the quantity exceeds a specified value, it is determined that the wafer is disconnected, and otherwise the wafer is not disconnected, and the specified value is not more than a positive integer of the number of the determined blocks.
Step S4: Splitting, in order to perform a splitting operation on the wafer, which is to split the wafer by a conventional splitting machine.
Step S5: obtaining the image of the wafer after the splitting, and capturing the image of the split wafer through the image picker.
Step S6: determining whether the wafer is disconnected, in order for the image processing unit to generate optical determination results of the determination blocks according to the pre-crack wafer image and the cleaved wafer image, and according to the determination condition and the These determine the optical determination result of the block and determine whether the wafer is disconnected.
Accordingly, the present invention narrows the judgment area by means of the partition determination, so that the difficulty in discriminating the optical image can be reduced, and the speed of the optical determination result can be accelerated, and the present invention can select the judgment block according to the characteristics of the wafer. Position and quantity, which can increase the optical image difference before and after the splitting, and make the judgment more accurate, and can change the judgment condition according to the wafer characteristics, so as to judge the optical judgment result of the block by the plural number. Comprehensively judge whether the wafer is disconnected, and further increase the accuracy of the judgment, thereby avoiding the trouble that the wafer inspection is found to be unbroken and needs to be realigned.
為俾使貴委員對本發明之特徵、目的及功效,有著更加深入之瞭解與認同,茲列舉較佳實施例並配合圖式說明如后:
請參閱「圖5」、「圖6」與「圖7」所示,本發明為一種晶圓未斷偵測的分區判斷方法,用於判斷一晶圓進行劈裂後,該晶圓是否斷開,其透過一影像擷取器於該晶圓劈裂前後各擷取一劈裂前晶圓影像與一劈裂後晶圓影像,並透過一影像處理單元比對該劈裂前晶圓影像與該劈裂後晶圓影像的差異,以產生一光學判定結果而得知該晶圓是否斷開,該分區判斷方法包含:
步驟S1:取得劈裂前晶圓影像,為透過該影像擷取器擷取該劈裂前晶圓影像。
步驟S2:建立複數判斷區塊,為透過該影像處理單元於該影像擷取器的擷取區域10內,讓使用者依據該晶圓的特性,建立兩個以上的判斷區塊20,此處圖為繪製兩個為例說明(如圖6),或者亦可增加判斷區塊20的數量為3個(如圖7),並分別作為該影像處理單元產生該光學判定結果的比對區域,亦即該影像處理單元為依據所建立的該些判斷區塊20,一一去比對影像產生該些判斷區塊20的光學判定結果。且該判斷區塊20的面積大小與位置為使用者圈選而決定,其主要是依據晶圓的特性與過往的經驗來決定,亦可依據現場即時測試的結果加以決定。又該些判斷區塊20的位置較佳的方式為均勻分佈。
步驟S3:決定判斷方式,為讓該影像處理單元依據該晶圓的特性與該些判斷區塊20的數量選擇一判定條件,該判定條件為當該些判斷區塊20的光學判定結果為斷開的數量,超過一指定值時,判定該晶圓斷開,反之判定該晶圓未斷開,且該指定值為不大於該些判斷區塊20數量的正整數。請參閱「圖8」所示,如該些判斷區塊20為兩個,該指定值為1,則該些判斷區塊20只要有任一個斷開,即可判斷開(如圖8所示),若皆為未斷開,才判定為斷開。此處值得一提的是,該指定值的選擇為依據過往經驗與現場操作的回饋而加以決定的,對於易發生未斷開的晶圓,則可以採取嚴格標準,讓該指定值選擇較大數值,反之,則可以選擇較小數值。
步驟S4:劈裂,為對該晶圓進行劈裂動作,其為透過習用的劈裂機進行劈裂晶圓。
步驟S5:取得劈裂後晶圓影像,為透過該影像擷取器擷取該劈裂後晶圓影像。
步驟S6:判斷晶圓是否斷開,為讓該影像處理單元依據該劈裂前晶圓影像與該劈裂後晶圓影像產生該些判斷區塊20的光學判定結果,並依據該判定條件與該些判斷區塊20的光學判定結果,判定該晶圓是否斷開。且為了增加處理速度,本發明可以當該影像處理單元逐一產生該些判斷區塊20的光學判定結果,累積到達該判定條件而判定該晶圓斷開時,即不再產生剩餘該些判斷區塊20的光學判定結果。據此減少所需的光學辨識時間,以加快判定速度。
而依據步驟S6的判斷結果,可再進行步驟S7:加深刀位,或是步驟S8:完成劈裂流程。其中步驟S7:加深刀位,為當判定該晶圓未斷開時,加深劈裂動作的刀位深度,並回到步驟S4,其透過加深劈裂動作的刀位深度(即增加劈裂的深度)的方式,而使晶圓確實斷開。而步驟S8:完成劈裂流程,為當判定該晶圓斷開時,則該晶圓位移至下一刀位置,以進行下一刀的劈裂,以完成劈裂流程。
如上所述,本發明主要是透過分區判斷的方式,縮小判斷面積,故可以減少光學影像辨析上困難度,而達到加快光學判定結果的產生速度,且本發明可因應晶圓的特性、過往經驗與現場實際的試驗結果,選擇判斷區塊的位置與數量,其可增加劈裂前後,判斷區塊的光學影像差異性,而使判斷更為準確,並更可依據晶圓特性,改變判定條件,以由複數判斷區塊的光學判定結果,綜合判斷晶圓是否斷開,進一步增加判斷的準確度與速度,因而可以避免晶圓檢查時發現未斷而需要重新對位重劈的困擾。
綜上所述僅為本發明的較佳實施例而已,並非用來限定本發明之實施範圍,即凡依本發明申請專利範圍之內容所為的等效變化與修飾,皆應為本發明之技術範疇。
In order to give your members a deeper understanding and recognition of the features, purposes and effects of the present invention, the preferred embodiments are illustrated with the following description:
Referring to FIG. 5, FIG. 6 and FIG. 7 , the present invention is a method for judging the uninterrupted detection of a wafer, and determining whether the wafer is broken after a wafer is cleaved. Opening, the image capture device obtains a pre-cracked wafer image and a cleaved wafer image before and after the wafer splitting, and compares the pre-crack wafer image through an image processing unit And the difference between the cleaved wafer image and the optical determination result to know whether the wafer is disconnected, and the partition determining method includes:
Step S1: Obtaining a pre-cleavage wafer image, and capturing the pre-crack wafer image through the image extractor.
Step S2: Establishing a plurality of determination blocks, wherein the image processing unit is used in the capture area 10 of the image capture device to allow the user to create more than two determination blocks 20 according to the characteristics of the wafer. The figure shows two diagrams as an example (as shown in FIG. 6), or may increase the number of judgment blocks 20 to three (as shown in FIG. 7), and respectively serve as a comparison area for generating the optical determination result by the image processing unit. That is, the image processing unit generates the optical determination results of the determination blocks 20 according to the determined determination blocks 20 and the comparison images. Moreover, the size and position of the determining block 20 are determined by the user's circle selection, which is mainly determined according to the characteristics of the wafer and past experience, and may also be determined according to the results of on-site testing. Further, the manner in which the positions of the blocks 20 are judged is preferably uniform.
Step S3: determining the determination mode, in order for the image processing unit to select a determination condition according to the characteristics of the wafer and the number of the determination blocks 20, the determination condition is that when the optical determination result of the determination blocks 20 is broken When the number of openings exceeds a specified value, it is determined that the wafer is disconnected, and otherwise the wafer is not disconnected, and the specified value is not more than a positive integer of the number of the determination blocks 20. Please refer to FIG. 8 . If the determination block 20 is two, and the designated value is 1, the determination block 20 can be judged to be open as long as any one of them is disconnected (as shown in FIG. 8 ). ), if all are not disconnected, it is judged to be disconnected. It is worth mentioning here that the selection of the specified value is determined based on past experience and feedback from the field operation. For wafers that are prone to unbroken, strict standards can be adopted to make the specified value larger. Value, otherwise, you can choose a smaller value.
Step S4: Splitting, in order to perform a splitting operation on the wafer, which is to split the wafer by a conventional splitting machine.
Step S5: obtaining the image of the wafer after the splitting, and capturing the image of the split wafer through the image picker.
Step S6: determining whether the wafer is disconnected, in order for the image processing unit to generate optical determination results of the determination blocks 20 according to the pre-crack wafer image and the cleaved wafer image, and according to the determination condition and The optical determination result of the determination block 20 determines whether the wafer is disconnected. In order to increase the processing speed, the image processing unit may generate the optical determination results of the determination blocks 20 one by one, and when the determination reaches the determination condition to determine that the wafer is disconnected, the remaining determination regions are no longer generated. The optical determination result of block 20. Accordingly, the required optical recognition time is reduced to speed up the determination.
According to the determination result of step S6, step S7 may be further performed: deepening the location, or step S8: completing the splitting process. Step S7: deepening the tool position, when it is determined that the wafer is not broken, deepening the tool depth of the cleaving action, and returning to step S4, the depth of the tool bit deepening the cleaving action (ie, increasing the splitting position) The depth) way the wafer is actually disconnected. Step S8: The cleaving process is completed. When it is determined that the wafer is disconnected, the wafer is displaced to the next knife position to perform the splitting of the next knife to complete the cleaving process.
As described above, the present invention mainly reduces the judgment area by means of the partition judgment, so that the difficulty in discriminating the optical image can be reduced, and the speed of the optical judgment result can be accelerated, and the present invention can respond to the characteristics and past experience of the wafer. And the actual test results on the site, choose to determine the location and quantity of the block, which can increase the optical image difference before and after the splitting, and make the judgment more accurate, and can change the judgment condition according to the wafer characteristics. By judging the optical determination result of the block by the plural number, it is comprehensively judged whether the wafer is disconnected, and the accuracy and speed of the judgment are further increased, thereby avoiding the trouble that the wafer inspection is unbroken and needs to be realigned.
The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, that is, the equivalent changes and modifications of the content of the patent application of the present invention should be the technology of the present invention. category.
1...晶圓劈裂機1. . . Wafer splitting machine
2...晶圓2. . . Wafer
3...預切線3. . . Pre-cut line
4...藍膜4. . . Blue film
5...固定夾具5. . . Fixing fixture
6...晶圓固定座6. . . Wafer mount
7...懸臂桿7. . . Cantilever rod
8...劈刀8. . . chopper
9...影像擷取元件9. . . Image capture component
10...壓制元件10. . . Pressing element
11...照明光源11. . . Illumination source
S1...取得劈裂前晶圓影像S1. . . Obtaining a pre-crack wafer image
S2...建立複數判斷區塊S2. . . Establish a complex judgment block
S3...決定判斷方式S3. . . Decide how to judge
S4...劈裂S4. . . Splitting
S5...取得劈裂後晶圓影像S5. . . Obtaining a wafer image after splitting
S6...判斷晶圓是否斷開S6. . . Determine if the wafer is disconnected
S7...加深刀位S7. . . Deepen the knife position
S8...完成劈裂流程S8. . . Complete the splitting process
10...擷取區域10. . . Capture area
20...判斷區塊20. . . Judging block
圖1,係習知晶圓之結構圖。
圖2,係習知晶圓劈裂機結構圖。
圖3,係習知晶圓未斷開影像圖。
圖4,係習知晶圓斷開影像圖。
圖5,係本發明判斷方法步驟圖。
圖6,係本發明判斷區塊選取示意圖一。
圖7,係本發明判斷區塊選取示意圖二。
圖8,係本發明判斷結果列表圖。
Figure 1 is a structural diagram of a conventional wafer.
Figure 2 is a structural diagram of a conventional wafer splitting machine.
Figure 3 is a conventional image of a wafer that has not been disconnected.
Figure 4 is a conventional wafer disconnect image.
Figure 5 is a diagram showing the steps of the judgment method of the present invention.
FIG. 6 is a schematic diagram 1 of the determination block of the present invention.
FIG. 7 is a schematic diagram 2 of selecting a judgment block of the present invention.
Figure 8 is a diagram showing a list of judgment results of the present invention.
S1...取得劈裂前晶圓影像S1. . . Obtaining a pre-crack wafer image
S2...建立複數判斷區塊S2. . . Establish a complex judgment block
S3...決定判斷方式S3. . . Decide how to judge
S4...劈裂S4. . . Splitting
S5...取得劈裂後晶圓影像S5. . . Obtaining a wafer image after splitting
S6...判斷晶圓是否斷開S6. . . Determine if the wafer is disconnected
S7...加深刀位S7. . . Deepen the knife position
S8...完成劈裂流程S8. . . Complete the splitting process
Claims (6)
步驟S1:取得劈裂前晶圓影像,為透過該影像擷取器擷取該劈裂前晶圓影像;
步驟S2:建立複數判斷區塊,為透過該影像處理單元於該影像擷取器的擷取區域內,讓使用者依據該晶圓的特性,建立兩個以上的判斷區塊,並分別作為該影像處理單元產生該光學判定結果的比對區域;
步驟S3:決定判斷方式,為讓該影像處理單元依據該晶圓的特性與該些判斷區塊的數量選擇一判定條件,該判定條件為當該些判斷區塊的光學判定結果為斷開的數量,超過一指定值時,判定該晶圓斷開,反之判定該晶圓未斷開,且該指定值為不大於該些判斷區塊數量的正整數;
步驟S4:劈裂,為對該晶圓進行劈裂動作;
步驟S5:取得劈裂後晶圓影像,為透過該影像擷取器擷取該劈裂後晶圓影像;
步驟S6:判斷晶圓是否斷開,為讓該影像處理單元依據該劈裂前晶圓影像與該劈裂後晶圓影像產生該些判斷區塊的光學判定結果,並依據該判定條件與該些判斷區塊的光學判定結果,判定該晶圓是否斷開。A wafer undetected partition judging method for judging whether a wafer is broken after a wafer is cleaved, and an image picker is used to obtain a split before and after the wafer is split. Wafer image and a split wafer image, and an image processing unit compares the difference between the pre-crack wafer image and the split wafer image to generate an optical determination result Whether to disconnect, the partition judgment method includes:
Step S1: obtaining a pre-crack wafer image, and capturing the pre-crack wafer image through the image extractor;
Step S2: establishing a plurality of determination blocks, wherein the user is configured to create more than two determination blocks according to the characteristics of the wafer, and respectively, as the image processing unit, in the capture area of the image capture unit The image processing unit generates a comparison area of the optical determination result;
Step S3: determining a determination mode, wherein the image processing unit selects a determination condition according to the characteristics of the wafer and the number of the determination blocks, and the determination condition is that when the optical determination result of the determination blocks is disconnected When the quantity exceeds a specified value, it is determined that the wafer is disconnected, and otherwise the wafer is not disconnected, and the specified value is not more than a positive integer of the number of the determined blocks;
Step S4: splitting, performing a splitting action on the wafer;
Step S5: obtaining a cleaved wafer image, and capturing the cleaved wafer image through the image extractor;
Step S6: determining whether the wafer is disconnected, in order for the image processing unit to generate optical determination results of the determination blocks according to the pre-crack wafer image and the cleaved wafer image, and according to the determination condition and the These determine the optical determination result of the block and determine whether the wafer is disconnected.
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