TW201424906A - Apparatus and method for laser processing - Google Patents
Apparatus and method for laser processing Download PDFInfo
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- TW201424906A TW201424906A TW101151210A TW101151210A TW201424906A TW 201424906 A TW201424906 A TW 201424906A TW 101151210 A TW101151210 A TW 101151210A TW 101151210 A TW101151210 A TW 101151210A TW 201424906 A TW201424906 A TW 201424906A
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本提案係關於一種雷射加工裝置及其方法,特別是利用雷射光束移除玻璃板端面上的缺陷之雷射加工裝置及其方法。 This proposal relates to a laser processing apparatus and method therefor, and more particularly to a laser processing apparatus and method for removing defects on the end faces of glass sheets using laser beams.
由於玻璃板具有硬且脆的物理特性,使得玻璃板經過輪刀或雷射切割、裂片(breaking)之加工後,在玻璃板的斷面(以下稱為端面)會有加工玻璃板過程所產生的微裂紋(micro-crack),這些微裂紋會降低玻璃板的強度,進而造成玻璃板易產生脆裂的現象。 Due to the hard and brittle physical properties of the glass sheet, after the glass sheet is processed by a wheel cutter or a laser cutting or a breaking, the section of the glass sheet (hereinafter referred to as the end surface) may be produced by processing the glass sheet. Micro-crack, these micro-cracks will reduce the strength of the glass plate, which will cause the glass plate to be brittle.
為了移除於玻璃板之端面上的微裂紋以提升玻璃板的強度,有提出利用機械磨邊(grinding)的方式修整玻璃板的端面,以使玻璃板的端面為光滑面。但由於利用機械磨邊修整玻璃板存在有因處理速度太慢(速度約為10~80 mm/s)使得處理時間太長與端面仍有微裂紋的問題,而且當玻璃板的厚度太薄時(即厚度≦0.1mm),機械磨邊容易造成破片。 In order to remove the microcracks on the end faces of the glass sheets to increase the strength of the glass sheets, it is proposed to trim the end faces of the glass sheets by mechanical grinding so that the end faces of the glass sheets are smooth. However, since the glass plate is trimmed by mechanical edging, there is a problem that the processing speed is too slow (the speed is about 10 to 80 mm/s), the processing time is too long, and the end face still has microcracks, and when the thickness of the glass plate is too thin, (ie thickness ≦ 0.1mm), mechanical edging is easy to cause fragmentation.
本提案在於提供一種雷射加工裝置及其方法,藉以解決先前技術因利用機械磨邊修整玻璃板存在有處理速度太慢、端面仍有微裂紋以及當玻璃板的厚度太薄時(即厚度≦0.1mm),機械磨邊容易造成破片的問題。 The present invention is to provide a laser processing apparatus and a method thereof, which solve the prior art that the processing speed is too slow due to the use of mechanical edging to trim the glass sheet, the end surface still has micro cracks, and when the thickness of the glass sheet is too thin (ie, thickness ≦ 0.1mm), mechanical edging is easy to cause fragmentation problems.
本提案所揭露之雷射加工裝置的一實施例,用以修整一玻璃板的一端面,雷射加工裝置包含一雷射輸出模組、一雷射控制模 組與一移動控制模組。移動控制模組用以承載玻璃板並以一第一速度旋轉玻璃板。雷射輸出模組用以輸出一雷射光束至端面,以劈裂出一玻璃削屑層,其中雷射光束對應端面具有一照射直徑,照射直徑大於或等於端面的一寬度。雷射控制模組用以調整雷射光束的一能量密度,能量密度相應於第一速度。 An embodiment of the laser processing apparatus disclosed in the present proposal is for trimming an end surface of a glass plate, the laser processing device comprising a laser output module and a laser control module Group with a mobile control module. The mobile control module is configured to carry the glass plate and rotate the glass plate at a first speed. The laser output module is configured to output a laser beam to the end surface to split a glass shaving layer, wherein the laser beam has an illumination diameter corresponding to the end surface, and the illumination diameter is greater than or equal to a width of the end surface. The laser control module is used to adjust an energy density of the laser beam, and the energy density corresponds to the first speed.
本提案所揭露之雷射加工裝置的另一實施例,用以修整一玻璃板的一端面,雷射加工裝置包含一雷射輸出模組、一雷射控制模組與一承載模組。承載模組用以承載並固定玻璃板。雷射輸出模組用以輸出一雷射光束,雷射光束以一第二速度環繞照射端面,以劈裂出一玻璃削屑層,其中雷射光束於該端面上具有一照射直徑,照射直徑大於或等於端面的一寬度。雷射控制模組用以調整雷射光束的一能量密度,能量密度相應於第二速度。 Another embodiment of the laser processing apparatus disclosed in the present proposal is for trimming an end surface of a glass plate. The laser processing apparatus comprises a laser output module, a laser control module and a carrier module. The carrying module is used to carry and fix the glass plate. The laser output module is configured to output a laser beam, and the laser beam surrounds the illumination end surface at a second speed to split a glass shaving layer, wherein the laser beam has an illumination diameter on the end surface, and the illumination diameter Greater than or equal to a width of the end face. The laser control module is configured to adjust an energy density of the laser beam, and the energy density corresponds to the second speed.
本提案所揭露之雷射加工方法的一實施例,其步驟包含以一第一速度旋轉一玻璃板,其中玻璃板包含一端面。根據第一速度調整一雷射光束的一能量密度。以雷射光束照射端面,以劈裂出一玻璃削屑層,其中雷射光束於端面上具有一照射直徑,照射直徑大於或等於端面的一寬度。 An embodiment of the laser processing method disclosed in the present proposal includes the steps of rotating a glass sheet at a first speed, wherein the glass sheet includes an end surface. An energy density of a laser beam is adjusted according to the first speed. The end face is irradiated with a laser beam to split a glass shaving layer, wherein the laser beam has an illumination diameter on the end surface, and the illumination diameter is greater than or equal to a width of the end surface.
本提案所揭露之雷射加工方法的另一實施例,其步驟包含使一雷射控制模組以一第二速度環繞一玻璃板的一端面。根據第二速度調整一雷射光束的一能量密度。以雷射光束環繞照射端面,劈裂出一玻璃削屑層,其中雷射光束於端面上具有一照射直徑,照射直徑大於或等於端面的一寬度。 Another embodiment of the laser processing method disclosed in the present proposal includes the steps of causing a laser control module to surround an end surface of a glass sheet at a second speed. An energy density of a laser beam is adjusted according to the second speed. The laser beam surrounds the illumination end surface, and a glass shaving layer is cracked. The laser beam has an illumination diameter on the end surface, and the illumination diameter is greater than or equal to a width of the end surface.
根據上述本提案所揭露之雷射加工裝置及其方法的實施例, 係利用雷射光束移除玻璃板端面上的缺陷。可藉由雷射光束的配置位置不動但旋轉玻璃板,或玻璃板不動雷射光束沿玻璃板端面環繞的方式,藉以解決先前技術因利用機械磨邊修整玻璃板存在有處理速度太慢、端面仍有微裂紋以及當玻璃板的厚度太薄時(即厚度≦0.1mm),機械磨邊容易造成破片的問題。可藉由雷射光束的能量密度相應於第一速度或第二速度的方式,使得雷射光束照射於端面的能量趨近相同。 According to the embodiment of the laser processing apparatus and method thereof disclosed in the above proposal, The laser beam is used to remove defects on the end faces of the glass sheets. The surface of the laser beam can be moved by rotating the glass plate, or the glass plate is not moved around the end surface of the glass plate, so as to solve the prior art, the processing speed is too slow due to the mechanical edging of the glass plate. There are still microcracks and when the thickness of the glass plate is too thin (i.e., thickness ≦ 0.1 mm), mechanical edging is liable to cause a problem of fragmentation. The energy of the laser beam irradiated to the end face can be made nearly the same by the energy density of the laser beam corresponding to the first speed or the second speed.
有關本提案的特徵、實作與功效,茲配合圖式作最佳實施例詳細說明如下。 The features, implementation and efficacy of this proposal are described in detail below with reference to the preferred embodiment of the drawings.
請參照「第1圖」與「第2A圖」,係分為根據本提案之一實施例的雷射加工裝置與圓形玻璃板的配置位置示意圖與根據「第1圖」之雷射光束照射於玻璃板的第一實施例立體示意圖。雷射加工裝置100所處的空間具有一第一方向x、一第二方向y與一第三方向z,第一方向x、第二方向y與第三方向z相互垂直。玻璃板50包含一端面52以及彼此相對的一第一表面54與一第二表面56,端面52連接第一表面54與第二表面56,端面52具有一寬度t1,寬度t1可介於十微米(micrometer,um)至五十毫米(millimeter,mm)之間。在本實施例中,玻璃板50可為圓形板,第一表面54與第二表面56皆可為圓形表面,端面52可為環繞玻璃板50的環形側表面,寬度t1為玻璃板50的厚度。 Please refer to FIG. 1 and FIG. 2A for a schematic arrangement of a laser processing apparatus and a circular glass plate according to an embodiment of the present invention and a laser beam irradiation according to FIG. A perspective view of a first embodiment of a glass sheet. The space in which the laser processing apparatus 100 is located has a first direction x, a second direction y, and a third direction z, and the first direction x, the second direction y, and the third direction z are perpendicular to each other. The glass plate 50 includes an end surface 52 and a first surface 54 and a second surface 56 opposite to each other. The end surface 52 connects the first surface 54 and the second surface 56. The end surface 52 has a width t 1 and the width t 1 may be between Between ten micrometers (um) and fifty millimeters (millimeter, mm). In this embodiment, the glass plate 50 may be a circular plate, and both the first surface 54 and the second surface 56 may be circular surfaces, the end surface 52 may be an annular side surface surrounding the glass plate 50, and the width t 1 is a glass plate. 50 thickness.
在本實施例中,雷射加工裝置100係用以修整玻璃板50的端面52。雷射加工裝置100包含:一雷射輸出模組200、一雷射控 制模組300與一移動控制模組400。雷射輸出模組200用以輸出一雷射光束60,其中雷射光束60的波長可介於十奈米(nanometer,nm)至十二微米之間。雷射控制模組300接收雷射光束60並調整雷射光束60的能量密度後使雷射光束60照射於端面52,其中雷射光束60的能量密度可介於每一平方公分一焦耳至五百焦耳之間,且雷射光束60於端面52上具有一照射直徑D1,照射直徑D1大於或等於寬度t1。移動控制模組400用.以承載並以第一速度旋轉玻璃板50,使雷射光束60環繞照射端面52。其中,移動控制模組400耦接雷射控制模組300,使得雷射光束60的能量密度相應於第一速度。 In the present embodiment, the laser processing apparatus 100 is used to trim the end face 52 of the glass sheet 50. The laser processing apparatus 100 includes a laser output module 200, a laser control module 300, and a motion control module 400. The laser output module 200 is configured to output a laser beam 60, wherein the wavelength of the laser beam 60 can be between ten nanometers (nm) and twelve micrometers. The laser control module 300 receives the laser beam 60 and adjusts the energy density of the laser beam 60 to illuminate the laser beam 60 to the end face 52. The energy density of the laser beam 60 can be between one joule and five centimeters per square centimeter. Between the hundred joules, and the laser beam 60 has an illumination diameter D 1 on the end face 52, the illumination diameter D 1 being greater than or equal to the width t 1 . The motion control module 400 is used to carry and rotate the glass plate 50 at a first speed such that the laser beam 60 surrounds the illumination end face 52. The mobile control module 400 is coupled to the laser control module 300 such that the energy density of the laser beam 60 corresponds to the first speed.
在玻璃板50的端面52上,因於雷射光束60的照射區域與未照射區域之間存在有溫度梯度,當溫度梯度產生的張應力大於玻璃材料的抗張強度時,使得端面52因劈裂而產生一玻璃削屑層70,進而使端面52為光滑表面,以移除端面52的缺陷。其中,玻璃削屑層70的厚度G可介於一微米至一毫米之間。 On the end face 52 of the glass plate 50, due to the temperature gradient between the irradiated area and the unirradiated area of the laser beam 60, when the tensile stress generated by the temperature gradient is greater than the tensile strength of the glass material, the end face 52 is caused by 劈The crack produces a layer of glass shavings 70 which in turn causes the end surface 52 to be a smooth surface to remove defects in the end surface 52. Wherein, the thickness G of the glass shaving layer 70 may be between one micrometer and one millimeter.
在本實施例中,照射直徑D1等於寬度t1,移動控制模組400係以P方向(即逆時鐘方向)旋轉玻璃板50,但本實施例並非用以限定本提案。舉例而言,照射直徑D1可大於寬度t1,移動控制模組400可以順時鐘方向旋轉玻璃板50,可根據實際需求進行調整。此外,雷射控制模組300另可包含一光路引導單元302,以引導雷射光束60照射於端面52。其中,光路引導單元302可更包含掃描裝置。移動控制模組400更可包含一中心固定單元40,中心固定單元40可將玻璃板50的中心點固定於移動控制模組400上, 使得移動控制模組400可以趨近等速的方式旋轉玻璃板50。 In the present embodiment, the irradiation diameter D 1 is equal to the width t 1 , and the movement control module 400 rotates the glass sheet 50 in the P direction (ie, the counterclockwise direction), but this embodiment is not intended to limit the proposal. For example, the illumination diameter D 1 can be greater than the width t 1 , and the movement control module 400 can rotate the glass plate 50 clockwise, which can be adjusted according to actual needs. In addition, the laser control module 300 may further include an optical path guiding unit 302 to guide the laser beam 60 to the end surface 52. The optical path guiding unit 302 may further include a scanning device. The mobile control module 400 further includes a central fixing unit 40. The central fixing unit 40 can fix the center point of the glass plate 50 to the mobile control module 400, so that the mobile control module 400 can rotate the glass in a manner similar to the constant speed. Board 50.
請參照「第2B圖」與「第2C圖」,係分為根據「第1圖」之雷射光束照射於玻璃板的第二實施例與第三實施例立體示意圖。雷射加工的裝置100另可包含一送風噴嘴88,送風噴嘴88輸出冷卻氣體89至玻璃板50或被雷射光束60照射後端面52,以提高雷射光束60的照射區域與未照射區域之間的溫度梯度。 Please refer to "2B" and "2C", which are schematic perspective views of a second embodiment and a third embodiment in which a laser beam according to "Fig. 1" is irradiated onto a glass sheet. The laser processing apparatus 100 may further include a blowing nozzle 88 that outputs the cooling gas 89 to the glass sheet 50 or the end surface 52 that is illuminated by the laser beam 60 to increase the illuminated area and the unirradiated area of the laser beam 60. Temperature gradient between.
請參照「第1圖」、「第2A圖」與「第3A圖」,「第3A圖」係為根據本提案之雷射加工方法的第一實施例步驟流程圖。雷射加工的方法包含: Please refer to "FIG. 1", "2A" and "3A", and "3A" is a flow chart of the first embodiment of the laser processing method according to the present proposal. Laser processing methods include:
步驟S500:以第一速度旋轉玻璃板,其中玻璃板包含端面。 Step S500: rotating the glass plate at a first speed, wherein the glass plate includes an end surface.
步驟S502:根據第一速度調整雷射光束的能量密度。 Step S502: Adjust the energy density of the laser beam according to the first speed.
步驟S504:以雷射光束照射端面,劈裂出玻璃削屑層,其中雷射光束於端面上具有照射直徑,照射直徑大於或等於端面的寬度。 Step S504: irradiating the end surface with the laser beam to split the glass shaving layer, wherein the laser beam has an irradiation diameter on the end surface, and the irradiation diameter is greater than or equal to the width of the end surface.
在步驟S500中,移動控制模組400承載玻璃板50並以第一速度旋轉玻璃板50,其中第一速度的變化率小於或等於百分之二十(即移動控制模組400以趨近等速的方式旋轉玻璃板50)。接著在步驟S502中,由於移動控制模組400耦接雷射控制模組300,使得雷射光束60的能量密度相應於第一速度(即雷射光束60的能量密度變化率小於或等於百分之二十),以令執行步驟S504時雷射光束60照射於端面52的能量趨近相同。需注意的是,雷射光束60於端面52上的照射直徑D1大於或等於端面52的寬度t1。 In step S500, the mobile control module 400 carries the glass plate 50 and rotates the glass plate 50 at a first speed, wherein the rate of change of the first speed is less than or equal to 20% (ie, the mobile control module 400 approaches, etc. Rotate the glass plate 50) in a quick manner. Next, in step S502, since the motion control module 400 is coupled to the laser control module 300, the energy density of the laser beam 60 corresponds to the first speed (ie, the energy density change rate of the laser beam 60 is less than or equal to the percentage). Twenty)) so that the energy of the laser beam 60 irradiated to the end face 52 when the step S504 is performed approaches the same. It should be noted that the illumination diameter D 1 of the laser beam 60 on the end face 52 is greater than or equal to the width t 1 of the end face 52.
此外,步驟S500可包含移動控制模組以一時間間隔控制玻璃 板連續旋轉。在本實施例中,移動控制模組400承載玻璃板50並可於一預設的時間間隔內以第一速度連續旋轉玻璃板50直到玻璃板50的端面52全部劈裂出玻璃削屑層70,但本實施例並非用以限定本提案。 In addition, step S500 can include the mobile control module controlling the glass at a time interval The plate rotates continuously. In the present embodiment, the mobile control module 400 carries the glass plate 50 and continuously rotates the glass plate 50 at a first speed for a predetermined time interval until the end faces 52 of the glass plate 50 are all cracked out of the glass shaving layer 70. However, this embodiment is not intended to limit the proposal.
舉例而言,步驟S500可包含移動控制模組以一時間間隔控制玻璃板多段旋轉。在本舉例中,玻璃板50可為方形玻璃板,端面52可為環繞玻璃板50的四個側表面。移動控制模組400可移動方形玻璃板50線性位移,令環繞玻璃板50的部分端面52被雷射光束60劈裂出玻璃削屑層70。接著,移動控制模組400可移動玻璃板50復歸位移,再控制玻璃板50旋轉至少一角度。接下來,移動控制模組400可重複上述步驟,令玻璃板50的端面52全部劈裂出玻璃削屑層70。 For example, step S500 can include the mobile control module controlling the multi-segment rotation of the glass sheet at a time interval. In the present example, the glass sheet 50 may be a square glass sheet, and the end surface 52 may be four side surfaces surrounding the glass sheet 50. The motion control module 400 can move the square glass plate 50 linearly displaced such that a portion of the end face 52 surrounding the glass plate 50 is split by the laser beam 60 out of the glass chip layer 70. Then, the mobile control module 400 can move the glass plate 50 back to the displacement, and then control the glass plate 50 to rotate at least one angle. Next, the movement control module 400 can repeat the above steps to cause the end faces 52 of the glass sheets 50 to be completely split out of the glass shaving layer 70.
更詳細地說,由於玻璃板50可為方形玻璃板,因此移動控制模組400可移動玻璃板50線性位移,令環繞玻璃板50的部分端面52(即環繞玻璃板50的四個側表面之一)被雷射光束60劈裂出玻璃削屑層70,接著將玻璃板50復歸位移,並控制玻璃板50旋轉九十度,重複上述步驟直到環繞玻璃50的整個端面52(即環繞玻璃板50的四個側表面)劈裂出玻璃削屑層70。此外,在本舉例中(即玻璃板50可為方形玻璃板,端面52可為環繞玻璃板50的四個側表面),移動控制模組400以一時間間隔控制玻璃板50多段旋轉的步驟更包含:形成至少一導角於玻璃板50的至少一端角,導角的曲率半徑介於0.1毫米至20毫米之間。也就是說,玻璃板50於修整端面52(即環繞玻璃板50的四個側表面)的缺陷後於至少一 端角形成曲率半徑介於0.1毫米至20毫米之間的導角。 In more detail, since the glass plate 50 can be a square glass plate, the movement control module 400 can move the glass plate 50 linearly displaced so as to surround the partial end faces 52 of the glass plate 50 (ie, the four side surfaces surrounding the glass plate 50). a) being deflected by the laser beam 60 out of the glass shaving layer 70, then repositioning the glass sheet 50, and controlling the glass sheet 50 to rotate by ninety degrees, repeating the above steps until the entire end surface 52 of the surrounding glass 50 (ie, surrounding the glass sheet) The four side surfaces of 50) rupture the glass shaving layer 70. In addition, in the present example (ie, the glass plate 50 may be a square glass plate, and the end surface 52 may be four side surfaces surrounding the glass plate 50), the movement control module 400 controls the plurality of rotations of the glass plate 50 at a time interval. The method comprises: forming at least one lead angle at at least one end angle of the glass plate 50, and the radius of curvature of the lead angle is between 0.1 mm and 20 mm. That is, the glass plate 50 is at least one after trimming the end faces 52 (ie, surrounding the four side surfaces of the glass plate 50) The corners form a guide angle having a radius of curvature of between 0.1 mm and 20 mm.
請參照「第2B圖」與「第3B圖」,「第3B圖」係為根據本提案之雷射加工方法的第二實施例步驟流程圖。在本實施例中,雷射加工的方法除了包含上述步驟S500、步驟S502與步驟S504之外,另包含: Please refer to "2B" and "3B", and "3B" is a flow chart of the second embodiment of the laser processing method according to the present proposal. In this embodiment, the laser processing method includes: in addition to the above steps S500, S502, and S504, the method further includes:
步驟S390:預刻一刻痕於端面,以作為劈裂玻璃板端面的起點。 Step S390: pre-engraving a mark on the end face to serve as a starting point of the end face of the split glass plate.
步驟S506:施予冷卻氣體於玻璃板。 Step S506: The cooling gas is applied to the glass plate.
其中,步驟S390執行於步驟S500之前,刻痕51可利用機械式刀具或雷射光束而刻成。步驟S506可於執行步驟S504時同步實施,以提高雷射光束60的照射區域與未照射區域之間的溫度梯度,進而提升劈裂速度,但本實施例並非用以限定本提案。舉例而言,步驟S506亦可於執行步驟S504之前、執行步驟S502之前、執行步驟S502的同時、執行步驟S500之前或執行步驟S500的同時實施。 Wherein, before step S390 is performed in step S500, the score 51 can be engraved by using a mechanical cutter or a laser beam. Step S506 can be implemented synchronously when performing step S504 to increase the temperature gradient between the illuminated area and the unirradiated area of the laser beam 60, thereby increasing the splitting speed, but this embodiment is not intended to limit the proposal. For example, step S506 may also be performed before step S504, before step S502, step S502, before step S500, or at step S500.
請參照「第2C圖」與「第3C圖」,「第3C圖」係為根據本提案之雷射加工方法的第三實施例步驟流程圖。在本實施例中,雷射加工的方法除了包含上述步驟S390、步驟S500、步驟S502與步驟S504之外,另包含: Please refer to "2C" and "3C", and "3C" is a flow chart of the third embodiment of the laser processing method according to the present proposal. In this embodiment, the laser processing method includes: in addition to the above steps S390, S500, S502, and S504, the method further includes:
步驟S508:施予冷卻氣體於被雷射光束照射後的端面。 Step S508: applying a cooling gas to the end surface after being irradiated by the laser beam.
其中,步驟S508可於執行步驟S504之後實施,以提高雷射光束60的照射區域與未照射區域之間的溫度梯度,進而提升劈裂速度。 The step S508 can be performed after the step S504 is performed to increase the temperature gradient between the illuminated area and the unirradiated area of the laser beam 60, thereby increasing the splitting speed.
在上述實施例中,由於雷射控制模組300與圓形玻璃板(即玻璃板50)的端面52之間於第三方向z上的距離為定值,使得雷射光束60照射於端面52的能量不受上述於第三方向z上距離的影響,所以能夠在不停止雷射輸出模組200輸出雷射光束60的情況下,直接完成玻璃板50的端面52的劈裂,但是當玻璃板90為非圓形玻璃板時(即雷射控制模組300與玻璃板90的端面92之間於第三方向上的距離為不定值時,如「第4A圖」與「第4B圖」所示),雷射控制模組300與玻璃板90的端面92之間於第三方向z上的距離不為定值,使得雷射光束60照射於端面92的能量會受上述於第三方向z上距離的影響。因此,以下實施例中,雷射控制模組300更包含一變焦單元304,藉以改變雷射光束60的焦距,雷射光束60照射於端面92的能量不受雷射控制模組300與端面92之間於第三方向z上的距離的影響,詳細描述請參照以下實施例說明。 In the above embodiment, since the distance between the laser control module 300 and the end surface 52 of the circular glass plate (ie, the glass plate 50) in the third direction z is constant, the laser beam 60 is irradiated to the end face 52. The energy is not affected by the above-described distance in the third direction z, so that the splitting of the end face 52 of the glass plate 50 can be directly performed without stopping the output of the laser beam 60 by the laser output module 200, but when the glass is When the plate 90 is a non-circular glass plate (that is, when the distance between the laser control module 300 and the end surface 92 of the glass plate 90 in the third direction is not constant, such as "4A" and "4B" The distance between the laser control module 300 and the end surface 92 of the glass plate 90 in the third direction z is not constant, so that the energy of the laser beam 60 irradiated to the end surface 92 is affected by the third direction. The effect of the distance on z. Therefore, in the following embodiments, the laser control module 300 further includes a zoom unit 304 to change the focal length of the laser beam 60. The energy of the laser beam 60 irradiated to the end surface 92 is not affected by the laser control module 300 and the end surface 92. For the influence of the distance between the third direction z, please refer to the following description for a detailed description.
請參照「第4A圖」、「第4B圖」與「第5A圖」,係分為根據本提案之另一實施例的雷射加工裝置與旋轉於第一位置的方形玻璃板的示意圖、根據「第4A圖」之雷射加工裝置與旋轉於第二位置的方形玻璃板的示意圖以及根據「第4A圖」之雷射光束照射於玻璃板的第一實施例立體示意圖。雷射加工裝置100所處的空間具有一第一方向x、一第二方向y與一第三方向z,第一方向x、第二方向y與第三方向z相互垂直。玻璃板90包含一端面92以及彼此相對的一第一表面94與一第二表面96,端面92連接第一表面94與第二表面96,端面92具有一寬度t2,寬度t2可介於 十微米(micrometer,um)至五十毫米(millimeter,mm)之間。在本實施例中,玻璃板90可為方形玻璃板,第一表面94與第二表面96皆可為方形表面,但不以此為限(例如:具有倒圓角或倒斜角之玻璃板或具有弧形或不規則任意曲線所組合之玻璃板),端面92可為環繞玻璃板90的四個側表面,寬度t2為玻璃板90的厚度。 Please refer to "4A", "4B" and "5A", which are schematic diagrams of a laser processing apparatus according to another embodiment of the present proposal and a square glass plate rotated in a first position, according to A schematic view of a laser processing apparatus of "Ath 4A" and a square glass plate rotated at a second position, and a first embodiment of a laser beam irradiated to a glass plate according to "Ath 4A". The space in which the laser processing apparatus 100 is located has a first direction x, a second direction y, and a third direction z, and the first direction x, the second direction y, and the third direction z are perpendicular to each other. The glass plate 90 includes an end surface 92 and a first surface 94 and a second surface 96 opposite to each other. The end surface 92 connects the first surface 94 and the second surface 96. The end surface 92 has a width t 2 , and the width t 2 may be between Between ten micrometers (um) and fifty millimeters (millimeter, mm). In this embodiment, the glass plate 90 can be a square glass plate, and the first surface 94 and the second surface 96 can both be square surfaces, but not limited thereto (for example, a glass plate having round or chamfered angles) Or a glass plate having a combination of curved or irregular arbitrary curves, the end faces 92 may be four side surfaces surrounding the glass plate 90, and the width t 2 is the thickness of the glass plate 90.
在本實施例中,雷射加工裝置100係用以修整玻璃板90的端面92。雷射加工裝置100包含:一雷射輸出模組200、一雷射控制模組300與一移動控制模組400。雷射輸出模組200用以輸出一雷射光束60,其中雷射光束60的波長可介於十奈米(nanometer,nm)至十二微米之間。雷射控制模組300接收雷射光束60並調整雷射光束60的能量密度後使雷射光束60照射於端面92,其中雷射光束60的能量密度可介於每一平方公分一焦耳至五百焦耳之間,且雷射光束60於端面92上具有一照射直徑D2,照射直徑D2大於或等於寬度t2。移動控制模組400用以承載並以第一速度旋轉玻璃板90,使雷射光束60環繞照射端面92。其中,移動控制模組400耦接雷射控制模組300,使得雷射光束60的能量密度相應於第一速度。 In the present embodiment, the laser processing apparatus 100 is used to trim the end face 92 of the glass sheet 90. The laser processing apparatus 100 includes a laser output module 200, a laser control module 300, and a motion control module 400. The laser output module 200 is configured to output a laser beam 60, wherein the wavelength of the laser beam 60 can be between ten nanometers (nm) and twelve micrometers. The laser control module 300 receives the laser beam 60 and adjusts the energy density of the laser beam 60 to illuminate the laser beam 60 to the end face 92. The energy density of the laser beam 60 can be between one joule and five centimeters per square centimeter. Between the hundred joules, and the laser beam 60 has an illumination diameter D 2 on the end face 92, the illumination diameter D 2 being greater than or equal to the width t 2 . The motion control module 400 is configured to carry and rotate the glass plate 90 at a first speed such that the laser beam 60 surrounds the illumination end face 92. The mobile control module 400 is coupled to the laser control module 300 such that the energy density of the laser beam 60 corresponds to the first speed.
在玻璃板90的端面92上,因於雷射光束60的照射區域與未照射區域之間存在有溫度梯度,使得端面92因劈裂而產生一玻璃削屑層72,進而使端面92為光滑表面,以移除端面92的缺陷。其中,玻璃削屑層72的厚度H可介於一微米至一毫米之間。 On the end face 92 of the glass plate 90, due to the temperature gradient between the irradiated area and the unirradiated area of the laser beam 60, the end face 92 generates a glass shaving layer 72 due to the splitting, thereby making the end face 92 smooth. Surface to remove defects of end face 92. The thickness H of the glass shaving layer 72 may be between one micrometer and one millimeter.
在本實施例中,照射直徑D2等於寬度t2,移動控制模組400 係以Q方向(即逆時鐘方向)旋轉玻璃板90,但本實施例並非用以限定本提案。舉例而言,照射直徑D2可大於寬度t2,移動控制模組400可以順時鐘方向旋轉玻璃板90,可根據實際需求進行調整。此外,雷射控制模組300另可包含一光路引導單元302與一變焦單元304,光路引導單元302用以引導雷射光束60照射於端面92,變焦單元304用以調整雷射光束60的焦距。其中,光路引導單元302可更包含掃描裝置。移動控制模組400更可包含一中心固定單元40,中心固定單元40可將玻璃板90的中心點固定於移動控制模組400上,使得移動控制模組400可以趨近等速的方式旋轉玻璃板90。 In the present embodiment, the irradiation diameter D 2 is equal to the width t 2 , and the movement control module 400 rotates the glass sheet 90 in the Q direction (ie, the counterclockwise direction), but this embodiment is not intended to limit the present proposal. For example, the illumination diameter D 2 can be greater than the width t 2 , and the movement control module 400 can rotate the glass plate 90 clockwise, which can be adjusted according to actual needs. In addition, the laser control module 300 can further include an optical path guiding unit 302 for guiding the laser beam 60 to illuminate the end surface 92, and a zooming unit 304 for adjusting the focal length of the laser beam 60. . The optical path guiding unit 302 may further include a scanning device. The mobile control module 400 further includes a central fixing unit 40. The central fixing unit 40 can fix the center point of the glass plate 90 to the mobile control module 400, so that the mobile control module 400 can rotate the glass in a manner similar to the constant speed. Board 90.
請參照「第5B圖」與「第5C圖」,係分為根據「第4A圖」之雷射光束照射於玻璃板的第二實施例與第三實施例立體示意圖。雷射加工的裝置100另可包含一送風噴嘴88,送風噴嘴88輸出冷卻氣體89至玻璃板90或被雷射光束90照射後端面92,以提高雷射光束60的照射區域與未照射區域之間的溫度梯度。 Please refer to "Fig. 5B" and "5C" for the second embodiment and the third embodiment of the laser beam irradiated to the glass plate according to "Fig. 4A". The laser processing apparatus 100 may further include a blowing nozzle 88 that outputs the cooling gas 89 to the glass sheet 90 or the rear end surface 92 illuminated by the laser beam 90 to increase the irradiation area and the unirradiated area of the laser beam 60. Temperature gradient between.
請參照「第4A圖」、「第4B圖」、「第5A圖」與「第6A圖」,「第6A圖」係為根據本提案之雷射加工方法的第四實施例步驟流程圖。雷射加工的方法包含: Please refer to "4A", "4B", "5A" and "6A", and "6A" is a flow chart of the fourth embodiment of the laser processing method according to the present proposal. Laser processing methods include:
步驟S600:以第一速度旋轉玻璃板,其中玻璃板包含端面。 Step S600: rotating the glass plate at a first speed, wherein the glass plate includes an end surface.
步驟S602:根據第一速度調整雷射光束的能量密度。 Step S602: Adjust the energy density of the laser beam according to the first speed.
步驟S603:根據光路引導單元與端面的距離調整雷射光束的焦距。 Step S603: Adjust the focal length of the laser beam according to the distance between the optical path guiding unit and the end surface.
步驟S604:以雷射光束照射端面,以劈裂出玻璃削屑層,其 中雷射光束於端面上具有照射直徑,照射直徑大於或等於端面的寬度。 Step S604: irradiating the end surface with the laser beam to crack the glass shaving layer, The medium laser beam has an illumination diameter on the end surface, and the illumination diameter is greater than or equal to the width of the end surface.
在步驟S600中,移動控制模組400承載玻璃板90並以第一速度旋轉玻璃板90,其中第一速度的變化率小於或等於百分之二十(即移動控制模組400以趨近等速的方式旋轉玻璃板90)。接著在步驟S602中,由於移動控制模組400耦接雷射控制模組300,使得雷射光束60的能量密度相應於第一速度(即雷射光束60的能量密度變化率小於或等於百分之二十)。需注意的是,由於雷射控制模組300與玻璃板90的端面92之間的距離為不定值(例如玻璃板90於第一位置F1時,雷射控制模組300與玻璃板90的端面92之間的距離為S1;玻璃板90於第二位置F2時,雷射控制模組300與玻璃板90的端面92之間的距離為S2,其中S1>S2),使得雷射光束60照射於端面92的能量會不同。因此,為了雷射光束60照射於端面92的能量能趨近相同,雷射控制模組300根據光路引導單元302與端面92的距離調整變焦單元304,以改變雷射光束60的焦距(即步驟S603)。接著執行步驟604,使得端面92因劈裂而產生一玻璃削屑層72,進而使端面92為光滑表面,以移除端面92的缺陷。 In step S600, the mobile control module 400 carries the glass plate 90 and rotates the glass plate 90 at a first speed, wherein the rate of change of the first speed is less than or equal to 20% (ie, the mobile control module 400 approaches, etc. Rotate the glass plate 90) in a quick manner. Next, in step S602, since the motion control module 400 is coupled to the laser control module 300, the energy density of the laser beam 60 corresponds to the first speed (ie, the energy density change rate of the laser beam 60 is less than or equal to the percentage). Twenty). It is noted that, since the distance between the laser 92 and the control module 300 of end surface glass plate 90 an undefined value (e.g. the first glass plate 90 at 1 position F, the laser control module 300 with the glass plate 90 The distance between the end faces 92 is S 1 ; when the glass plate 90 is at the second position F 2 , the distance between the laser control module 300 and the end face 92 of the glass plate 90 is S 2 , where S 1 >S 2 ) The energy that causes the laser beam 60 to illuminate the end face 92 will be different. Therefore, in order for the energy of the laser beam 60 to be irradiated to the end surface 92 to be nearly the same, the laser control module 300 adjusts the zoom unit 304 according to the distance between the light path guiding unit 302 and the end surface 92 to change the focal length of the laser beam 60 (ie, the steps) S603). Next, step 604 is performed such that the end face 92 produces a glass shaving layer 72 due to the splitting, thereby making the end face 92 a smooth surface to remove the defects of the end face 92.
請參照「第5B圖」與「第6B圖」,「第6B圖」係為根據本提案之雷射加工方法的第五實施例步驟流程圖。在本實施例中,雷射加工的方法除了包含上述步驟S600、步驟S602、步驟S603與步驟S604之外,另包含: Please refer to "5B" and "6B", and "6B" is a flow chart of the fifth embodiment of the laser processing method according to the present proposal. In this embodiment, the laser processing method includes: in addition to the foregoing steps S600, S602, S603, and S604, the method further includes:
步驟S380:預刻一刻痕於端面,作為劈裂玻璃板端面的起點。 Step S380: pre-engraving a mark on the end surface as a starting point of the end face of the split glass plate.
步驟S606:施予冷卻氣體於玻璃板。 Step S606: applying a cooling gas to the glass plate.
其中,步驟S380執行於步驟S600之前,刻痕91可利用機械式刀具或雷射光束而刻成。步驟606可於執行步驟S604時同步實施,以提高雷射光束60的照射區域與未照射區域之間的溫度梯度,進而提升劈裂速度,但本實施例並非用以限定本提案。舉例而言,步驟S606亦可於執行步驟S604之前、執行步驟S602之前、執行步驟S602的同時、執行步驟S600之前或執行步驟S600的同時實施。 Wherein, before step S380 is performed before step S600, the score 91 can be engraved by using a mechanical cutter or a laser beam. Step 606 can be implemented synchronously when performing step S604 to increase the temperature gradient between the illuminated area and the unirradiated area of the laser beam 60, thereby increasing the splitting speed, but this embodiment is not intended to limit the proposal. For example, step S606 may also be performed before step S604, before step S602, step S602, before step S600, or at step S600.
請參照「第5C圖」與「第6C圖」,「第6C圖」係為根據本提案之雷射加工方法的第六實施例步驟流程圖。在本實施例中,雷射加工的方法除了包含上述步驟S380、步驟S600、步驟S602、步驟S603與步驟S604之外,另包含: Please refer to "5C" and "6C", and "6C" is a flow chart of the sixth embodiment of the laser processing method according to the present proposal. In this embodiment, the laser processing method includes: in addition to the foregoing steps S380, S600, S602, S603, and S604, the method further includes:
步驟S608:施予冷卻氣體於被雷射光束照射後的端面。 Step S608: applying a cooling gas to the end surface after being irradiated by the laser beam.
其中,步驟S608可於執行步驟S604之後實施,以提高雷射光束60的照射區域與未照射區域之間的溫度梯度,進而提升劈裂速度。 The step S608 can be performed after the step S604 is performed to increase the temperature gradient between the illuminated area and the unirradiated area of the laser beam 60, thereby increasing the splitting speed.
此外,上述實施例中,移動控制模組400可耦接雷射輸出模組200。當移動控制模組400輸出啟動訊號至雷射輸出模組200時,雷射輸出模組200輸出雷射光束60。當移動控制模組400輸出停止訊號至雷射輸出模組200時,雷射輸出模組200停止輸出雷射光束60。 In addition, in the above embodiment, the mobile control module 400 can be coupled to the laser output module 200. When the motion control module 400 outputs the activation signal to the laser output module 200, the laser output module 200 outputs the laser beam 60. When the motion control module 400 outputs a stop signal to the laser output module 200, the laser output module 200 stops outputting the laser beam 60.
在上述實施例中,藉由雷射光束60的配置位置不動(即雷射控制模組300位置固定)但旋轉玻璃板50的方式,使得在不停止 雷射輸出模組200輸出雷射光束60的情況下,直接完成端面52的劈裂,但上述實施例並非用限定本提案。舉例而言,亦可藉由玻璃板50固定不動而雷射光束60環繞照射玻璃板50的端面52(即雷射控制模組300環繞玻璃板50的端面52)之方式,使得在不停止雷射輸出模組200輸出雷射光束60的情況下,直接完成端面52的劈裂,詳細描述請參照以下實施例說明。 In the above embodiment, the position of the laser beam 60 is fixed (ie, the position of the laser control module 300 is fixed), but the glass plate 50 is rotated, so that the position is not stopped. In the case where the laser output module 200 outputs the laser beam 60, the splitting of the end face 52 is directly performed, but the above embodiment is not intended to limit the proposal. For example, the laser beam 50 can be fixed by the glass plate 50 and the laser beam 60 surrounds the end surface 52 of the illumination glass plate 50 (ie, the laser control module 300 surrounds the end surface 52 of the glass plate 50), so that the lightning is not stopped. When the output module 200 outputs the laser beam 60, the splitting of the end surface 52 is directly performed. For details, please refer to the following description.
請參照「第7A圖」、「第7B圖」與「第8A圖」,係分為根據本提案之又一實施例的雷射加工裝置與旋轉於第一位置的方形玻璃板的示意圖、根據「第7A圖」之雷射加工裝置與旋轉於第二位置的方形玻璃板的示意圖與根據「第7A圖」之雷射光束照射於玻璃板的第一實施例立體示意圖。雷射加工裝置700所處的空間具有一第一方向x、一第二方向y與一第三方向z,第一方向x、第二方向y與第三方向z相互垂直。在本實施例中,玻璃板50可為圓形板,端面52可為環繞玻璃板50的環形側表面,寬度t1為玻璃板50的厚度。 Please refer to "7A", "7B" and "8A", which are schematic diagrams of a laser processing apparatus according to still another embodiment of the present proposal and a square glass plate rotated in a first position, according to A schematic view of a laser processing apparatus of "Fig. 7A" and a schematic view of a square glass plate rotated at a second position and a laser beam irradiated to a glass plate according to "Fig. 7A". The space in which the laser processing apparatus 700 is located has a first direction x, a second direction y and a third direction z, and the first direction x, the second direction y and the third direction z are perpendicular to each other. In the present embodiment, the glass sheet 50 may be a circular plate, the end surface 52 may be an annular side surface surrounding the glass sheet 50, and the width t 1 is the thickness of the glass sheet 50.
在本實施例中,雷射加工裝置700係用以修整玻璃板50的端面52。雷射加工裝置700包含:一雷射輸出模組200、一雷射控制模組300與一承載模組450。承載模組450用以承載並固定玻璃板50。雷射輸出模組200用以輸出一雷射光束60,其中雷射光束60的波長可介於十奈米(nanometer,nm)至十二微米之間。雷射控制模組300接收雷射光束60並調整雷射光束60的能量密度後使雷射光束60以第二速度環繞照射端面52,其中雷射光束60的能量密度可介於每一平方公分一焦耳至五百焦耳之間,雷射光束60 於端面52上具有一照射直徑D1,照射直徑D1大於或等於寬度t1,且雷射光束60的能量密度相應於第二速度。 In the present embodiment, the laser processing apparatus 700 is used to trim the end face 52 of the glass sheet 50. The laser processing apparatus 700 includes a laser output module 200, a laser control module 300, and a carrier module 450. The carrying module 450 is used to carry and fix the glass plate 50. The laser output module 200 is configured to output a laser beam 60, wherein the wavelength of the laser beam 60 can be between ten nanometers (nm) and twelve micrometers. The laser control module 300 receives the laser beam 60 and adjusts the energy density of the laser beam 60 to cause the laser beam 60 to surround the illumination end face 52 at a second speed, wherein the energy density of the laser beam 60 can be between each square centimeter. Between one joule and five hundred joules, the laser beam 60 has an illumination diameter D 1 on the end face 52, the illumination diameter D 1 is greater than or equal to the width t 1 , and the energy density of the laser beam 60 corresponds to the second velocity.
在玻璃板50的端面52上,因於雷射光束60的照射區域與未照射區域之間存在有溫度梯度,當溫度梯度產生的張應力大於玻璃材料的抗張強度時,使得端面52因劈裂而產生一玻璃削屑層70,進而使端面52為光滑表面,以移除端面52的缺陷。其中,玻璃削屑層70的厚度K可介於一微米至一毫米之間。 On the end face 52 of the glass plate 50, due to the temperature gradient between the irradiated area and the unirradiated area of the laser beam 60, when the tensile stress generated by the temperature gradient is greater than the tensile strength of the glass material, the end face 52 is caused by 劈The crack produces a layer of glass shavings 70 which in turn causes the end surface 52 to be a smooth surface to remove defects in the end surface 52. Wherein, the thickness K of the glass shaving layer 70 may be between one micrometer and one millimeter.
在本實施例中,照射直徑D1等於寬度t1,雷射控制模組300沿R方向(逆時鐘方向)以第二速度環繞端面52,進而使雷射光束60環繞照射端面52,但本實施例並非用以限定本提案。舉例而言,照射直徑D1可大於寬度t1,雷射控制模組300沿順時鐘方向以第二速度相對端面52旋轉,可根據實際需求進行調整。此外,雷射控制模組300另可包含一光路引導單元302,以引導雷射光束60照射於端面52。其中,光路引導單元302可更包含掃描裝置。承載模組450更可包含一中心固定單元43,中心固定單元43可將玻璃板50的中心點固定於承載模組450上。 In this embodiment, the illumination diameter D 1 is equal to the width t 1 , and the laser control module 300 surrounds the end surface 52 at a second speed in the R direction (counterclockwise direction), thereby causing the laser beam 60 to surround the illumination end surface 52, but The examples are not intended to limit the proposal. For example, the illumination diameter D 1 can be greater than the width t 1 , and the laser control module 300 rotates relative to the end surface 52 at a second speed in the clockwise direction, which can be adjusted according to actual needs. In addition, the laser control module 300 may further include an optical path guiding unit 302 to guide the laser beam 60 to the end surface 52. The optical path guiding unit 302 may further include a scanning device. The carrying module 450 further includes a central fixing unit 43 that can fix the center point of the glass plate 50 to the carrying module 450.
請參照「第8B圖」與「第8C圖」,係分為根據「第7A圖」之雷射光束照射於玻璃板的第二實施例與第三實施例立體示意圖。雷射加工的裝置700另可包含一送風噴嘴88,送風噴嘴88輸出冷卻氣體89至玻璃板50或被雷射光束60照射後端面52,以提高雷射光束60的照射區域與未照射區域之間的溫度梯度。 Please refer to "8B" and "8C", which are schematic perspective views of a second embodiment and a third embodiment in which a laser beam according to "FIG. 7A" is irradiated onto a glass sheet. The laser processing apparatus 700 may further include a blowing nozzle 88 that outputs the cooling gas 89 to the glass sheet 50 or the end surface 52 that is illuminated by the laser beam 60 to increase the illuminated area and the unirradiated area of the laser beam 60. Temperature gradient between.
請參照「第7A圖」、「第7B圖」與「第9A圖」,「第9A圖」係為根據本提案之雷射加工方法的第七實施例步驟流程圖。 雷射加工的方法包含: Please refer to "7A", "7B" and "9A", and "9A" is a flow chart of the seventh embodiment of the laser processing method according to the present proposal. Laser processing methods include:
步驟S800:使雷射控制模組以第二速度環繞玻璃板的端面。 Step S800: The laser control module is caused to surround the end surface of the glass plate at the second speed.
步驟S802:根據第二速度調整雷射光束的能量密度。 Step S802: Adjust the energy density of the laser beam according to the second speed.
步驟S804:以雷射光束環繞照射端面,劈裂出玻璃削屑層,其中雷射光束於端面上具有照射直徑,照射直徑大於或等於端面的寬度。 Step S804: Surrounding the illumination end surface with the laser beam, the glass shaving layer is split, wherein the laser beam has an illumination diameter on the end surface, and the illumination diameter is greater than or equal to the width of the end surface.
在步驟S800中,雷射控制模組300沿逆時鐘方向以第二速度環繞端面52,其中第二速度的變化率小於或等於百分之二十(即雷射控制模組300以趨近等速的方式環繞玻璃板50)。接著在步驟S802中,雷射控制模組300可依據第二速度調整雷射光束60的能量密度(即雷射光束60的能量密度變化率小於或等於百分之二十),以令執行步驟S804時雷射光束60環繞照射於端面52的能量趨近相同。需注意的是,雷射光束60於端面52上的照射直徑D1大於或等於端面52的寬度t1。 In step S800, the laser control module 300 surrounds the end surface 52 at a second speed in the counterclockwise direction, wherein the rate of change of the second speed is less than or equal to twenty percent (ie, the laser control module 300 approaches, etc. The speed way surrounds the glass plate 50). Next, in step S802, the laser control module 300 can adjust the energy density of the laser beam 60 according to the second speed (ie, the energy density change rate of the laser beam 60 is less than or equal to 20%), so as to perform the steps. At S804, the energy of the laser beam 60 that illuminates the end face 52 approaches the same. It should be noted that the illumination diameter D 1 of the laser beam 60 on the end face 52 is greater than or equal to the width t 1 of the end face 52.
請參照「第8B圖」與「第9B圖」,「第9B圖」係為根據本提案之雷射加工方法的第八實施例步驟流程圖。在本實施例中,雷射加工的方法除了包含上述步驟S800、步驟S802與步驟S804之外,另包含: Please refer to "8B" and "9B", and "9B" is a flow chart of the eighth embodiment of the laser processing method according to the present proposal. In this embodiment, the laser processing method includes: in addition to the above steps S800, S802 and S804, the method further comprises:
步驟S410:預刻一刻痕於端面,以作為劈裂玻璃板端面的起點。 Step S410: pre-engraving a mark on the end face to serve as a starting point of the end face of the split glass plate.
步驟S806:施予冷卻氣體於玻璃板。 Step S806: The cooling gas is applied to the glass plate.
其中,步驟S410執行於步驟S800之前,刻痕51可利用機械式刀具或雷射光束而刻成。步驟S806可於執行步驟S804時同步 實施,以提高雷射光束60的照射區域與未照射區域之間的溫度梯度,進而提升劈裂速度,但本實施例並非用以限定本提案。舉例而言,步驟S806亦可於執行步驟S804之前、執行步驟S802之前、執行步驟S802的同時、執行步驟S800之前或執行步驟S800的同時實施。 Wherein, step S410 is performed before step S800, and the score 51 can be engraved by using a mechanical cutter or a laser beam. Step S806 can be synchronized when performing step S804. It is implemented to increase the temperature gradient between the irradiated area and the unirradiated area of the laser beam 60, thereby increasing the splitting speed, but this embodiment is not intended to limit the proposal. For example, step S806 may also be performed before step S804, before step S802, step S802, before step S800, or step S800.
請參照「第8C圖」與「第9C圖」,「第9C圖」係為根據本提案之雷射加工方法的第九實施例步驟流程圖。在本實施例中,雷射加工的方法除了包含上述步驟S410、步驟S800、步驟S802與步驟S804之外,另包含: Please refer to "8C" and "9C", and "9C" is a flow chart of the ninth embodiment of the laser processing method according to the present proposal. In this embodiment, the laser processing method includes: in addition to the foregoing steps S410, S800, S802, and S804, the method further includes:
步驟S808:施予冷卻氣體於被雷射光束照射後的端面。 Step S808: applying a cooling gas to the end surface after being irradiated by the laser beam.
其中,步驟S808可於執行步驟S804之後實施,以提高雷射光束60的照射區域與未照射區域之間的溫度梯度,進而提升劈裂速度。 The step S808 can be performed after the step S804 is performed to increase the temperature gradient between the illuminated area and the unirradiated area of the laser beam 60, thereby increasing the splitting speed.
請參照「第10A圖」、「第10B圖」與「第11A圖」,係分為根據本提案之更一實施例的雷射加工裝置與旋轉於第一位置的方形玻璃板的示意圖、根據「第10A圖」之雷射加工裝置與旋轉於第二位置的方形玻璃板的示意圖以及根據「第10A圖」之雷射光束照射於玻璃板的第一實施例立體示意圖。雷射加工裝置700所處的空間具有一第一方向x、一第二方向y與一第三方向z,第一方向x、第二方向y與第三方向z相互垂直。在本實施例中,玻璃板90可為方形玻璃板,但不以此為限(例如:具有倒圓角或倒斜角之玻璃板或具有弧形或不規則任意曲線所組合之玻璃板),端面92可為環繞玻璃板90的四個側表面,寬度t2為玻璃 板90的厚度。 Please refer to "10A", "10B" and "11A", which are schematic diagrams of a laser processing apparatus according to a further embodiment of the present invention and a square glass plate rotated in a first position, according to A schematic view of a laser processing apparatus of "10A" and a square glass plate rotated at a second position, and a perspective view of a first embodiment of a laser beam irradiated to the glass plate according to "Fig. 10A". The space in which the laser processing apparatus 700 is located has a first direction x, a second direction y and a third direction z, and the first direction x, the second direction y and the third direction z are perpendicular to each other. In this embodiment, the glass plate 90 may be a square glass plate, but not limited thereto (for example, a glass plate having round or chamfered angle or a glass plate having a combination of curved or irregular arbitrary curves) The end face 92 may be four side surfaces surrounding the glass sheet 90, and the width t 2 is the thickness of the glass sheet 90.
在本實施例中,雷射加工裝置700係用以修整玻璃板90的端面92。雷射加工裝置700包含:一雷射輸出模組200、一雷射控制模組300與一承載模組450。承載模組450用以承載並固定玻璃板90。雷射輸出模組200用以輸出一雷射光束60,其中雷射光束60的波長可介於十奈米(nanometer,nm)至十二微米之間。雷射控制模組300接收雷射光束60並調整雷射光束60的能量密度後使雷射光束60以第二速度環繞照射端面92,其中雷射光束60的能量密度可介於每一平方公分一焦耳至五百焦耳之間,且雷射光束60於端面92上具有一照射直徑D2,照射直徑D2大於或等於寬度t2,雷射光束60的能量密度相應於第二速度。 In the present embodiment, the laser processing apparatus 700 is used to trim the end face 92 of the glass sheet 90. The laser processing apparatus 700 includes a laser output module 200, a laser control module 300, and a carrier module 450. The carrying module 450 is used to carry and fix the glass plate 90. The laser output module 200 is configured to output a laser beam 60, wherein the wavelength of the laser beam 60 can be between ten nanometers (nm) and twelve micrometers. The laser control module 300 receives the laser beam 60 and adjusts the energy density of the laser beam 60 to cause the laser beam 60 to surround the illumination end face 92 at a second speed. The energy density of the laser beam 60 can be between each square centimeter. Between one joule and five hundred joules, and the laser beam 60 has an illumination diameter D 2 on the end face 92, the illumination diameter D 2 is greater than or equal to the width t 2 , and the energy density of the laser beam 60 corresponds to the second velocity.
在玻璃板90的端面92上,因於雷射光束60的照射區域與未照射區域之間存在有溫度梯度,使得端面92因劈裂而產生一玻璃削屑層72,進而使端面92為光滑表面,以移除端面92的缺陷。其中,玻璃削屑層72的厚度J可介於一微米至一毫米之間。 On the end face 92 of the glass plate 90, due to the temperature gradient between the irradiated area and the unirradiated area of the laser beam 60, the end face 92 generates a glass shaving layer 72 due to the splitting, thereby making the end face 92 smooth. Surface to remove defects of end face 92. The thickness J of the glass shaving layer 72 may be between one micrometer and one millimeter.
在本實施例中,照射直徑D2等於寬度t2,雷射控制模組300沿W方向(逆時鐘方向)以第二速度環繞端面92,但本實施例並非用以限定本提案。舉例而言,照射直徑D2可大於寬度t2,雷射控制模組300沿順時鐘方向以第二速度環繞端面92,可根據實際需求進行調整。此外,雷射控制模組300另可包含一光路引導單元302與一變焦單元304,光路引導單元302用以引導雷射光束60照射於端面92,變焦單元304用以調整雷射光束60的焦距。其中,光路引導單元302可更包含掃描裝置。承載模組450更可 包含一中心固定單元43,中心固定單元43可將玻璃板50的中心點固定於承載模組450上。 In the present embodiment, the illumination diameter D 2 is equal to the width t 2 , and the laser control module 300 surrounds the end surface 92 at the second speed in the W direction (counterclockwise direction), but this embodiment is not intended to limit the present proposal. For example, the illumination diameter D 2 may be greater than the width t 2 , and the laser control module 300 surrounds the end surface 92 at a second speed in a clockwise direction, which may be adjusted according to actual needs. In addition, the laser control module 300 can further include an optical path guiding unit 302 for guiding the laser beam 60 to illuminate the end surface 92, and a zooming unit 304 for adjusting the focal length of the laser beam 60. . The optical path guiding unit 302 may further include a scanning device. The carrying module 450 further includes a central fixing unit 43 that can fix the center point of the glass plate 50 to the carrying module 450.
請參照「第11B圖」與「第11C圖」,係分為根據「第10A圖」之雷射光束照射於玻璃板的第二實施例與第三實施例立體示意圖。雷射加工的裝置700另可包含一送風噴嘴88,送風噴嘴88輸出冷卻氣體89至玻璃板90或被雷射光束60照射後端面92,以提高雷射光束60的照射區域與未照射區域之間的溫度梯度。 Please refer to "11B" and "11C" for the second embodiment and the third embodiment of the laser beam irradiated to the glass plate according to "Fig. 10A". The laser processing apparatus 700 may further include a blowing nozzle 88 that outputs the cooling gas 89 to the glass sheet 90 or the rear end surface 92 irradiated by the laser beam 60 to increase the illuminated area and the unirradiated area of the laser beam 60. Temperature gradient between.
請參照「第10A圖」、「第10B圖」、「第11A圖」與「第12A圖」,「第12A圖」係為根據本提案之雷射加工方法的第十實施例步驟流程圖。雷射加工的方法包含: Please refer to "10A", "10B", "11A" and "12A", and "12A" is a flow chart of the tenth embodiment of the laser processing method according to the present proposal. Laser processing methods include:
步驟S900:使雷射控制模組以第二速度環繞玻璃板的端面。 Step S900: The laser control module is caused to surround the end surface of the glass plate at the second speed.
步驟S902:根據第二速度調整雷射光束的能量密度。 Step S902: Adjust the energy density of the laser beam according to the second speed.
步驟S903:根據光路引導單元與端面的距離調整雷射光束的焦距。 Step S903: Adjust the focal length of the laser beam according to the distance between the optical path guiding unit and the end surface.
步驟S904:以雷射光束環繞照射端面,劈裂出玻璃削屑層,其中雷射光束於端面上具有照射直徑,照射直徑大於或等於端面的寬度。 Step S904: Surrounding the illumination end surface with the laser beam, the glass shaving layer is split, wherein the laser beam has an illumination diameter on the end surface, and the illumination diameter is greater than or equal to the width of the end surface.
在步驟S900中,雷射控制模組300沿逆時鐘方向以第二速度環繞端面92,其中第二速度的變化率小於或等於百分之二十(即雷射控制模組300以趨近等速的方式環繞玻璃板90)。接著在步驟S902中,雷射控制模組300可依據第二速度調整雷射光束60的能量密度(即雷射光束60的能量密度變化率小於或等於百分之二十)。需注意的是,由於雷射控制模組300與玻璃板90的端面 92之間的距離為不定值(例如玻璃板90於第一位置I1時,雷射控制模組300與玻璃板90的端面92之間的距離為N1;玻璃板90於第二位置I2時,雷射控制模組300與玻璃板90的端面92之間的距離為N2,其中N1>N2),使得雷射光束60照射於端面92的能量會不同。因此,為了使雷射光束60環繞照射於端面92的能量能趨近相同,雷射控制模組300根據光路引導單元302與端面92的距離調整變焦單元304,以改變雷射光束60的焦距(即步驟S903)。接著執行步驟904,使得端面92因劈裂而產生一玻璃削屑層72,進而使端面92為光滑表面,以移除端面92的缺陷。 In step S900, the laser control module 300 surrounds the end surface 92 at a second speed in the counterclockwise direction, wherein the rate of change of the second speed is less than or equal to twenty percent (ie, the laser control module 300 approaches, etc. The speed way surrounds the glass plate 90). Next, in step S902, the laser control module 300 can adjust the energy density of the laser beam 60 according to the second speed (ie, the energy density change rate of the laser beam 60 is less than or equal to twenty percent). It is noted that, since the distance between the end faces 300 and laser control module 92 of the glass plate 90 an undefined value (e.g., a glass plate 90 in a first position I 1, the laser control module 300 with the glass plate 90 The distance between the end faces 92 is N 1 ; when the glass plate 90 is at the second position I 2 , the distance between the laser control module 300 and the end face 92 of the glass plate 90 is N 2 , where N 1 >N 2 ) The energy that causes the laser beam 60 to illuminate the end face 92 will be different. Therefore, in order to make the energy of the laser beam 60 circumscribing the end face 92 nearly the same, the laser control module 300 adjusts the zoom unit 304 according to the distance between the optical path guiding unit 302 and the end surface 92 to change the focal length of the laser beam 60 ( That is, step S903). Next, step 904 is performed such that the end face 92 produces a glass shaving layer 72 due to the splitting, thereby making the end face 92 a smooth surface to remove the defects of the end face 92.
請參照「第11B圖」與「第12B圖」,「第12B圖」係為根據本提案之雷射加工方法的第十一實施例步驟流程圖。在本實施例中,雷射加工的方法除了包含上述步驟S900、步驟S902、步驟S903與步驟S904之外,另包含: Please refer to "11B" and "12B", and "12B" is a flow chart of the eleventh embodiment of the laser processing method according to the present proposal. In this embodiment, the laser processing method includes: in addition to the above steps S900, S902, S903, and S904, the method further includes:
步驟S420:預刻一刻痕於端面,作為劈裂玻璃板端面的起點。 Step S420: pre-engraving a mark on the end surface as a starting point of the end face of the split glass plate.
步驟S906:施予冷卻氣體於玻璃板。 Step S906: The cooling gas is applied to the glass plate.
其中,步驟S420執行於步驟S900之前,刻痕91可利用機械式刀具或雷射光束而刻成。步驟906可於執行步驟S904時同步實施,以提高雷射光束60的照射區域與未照射區域之間的溫度梯度,進而提升劈裂速度,但本實施例並非用以限定本提案。舉例而言,步驟S906亦可於執行步驟S904之前、執行步驟S902之前、執行步驟S902的同時、執行步驟S900之前或執行步驟S900的同時實施。 Wherein, before step S420 is performed in step S900, the score 91 can be engraved by using a mechanical cutter or a laser beam. Step 906 can be implemented synchronously when performing step S904 to increase the temperature gradient between the illuminated area and the unirradiated area of the laser beam 60, thereby increasing the splitting speed, but this embodiment is not intended to limit the proposal. For example, step S906 may also be performed before step S904 is performed, before step S902 is performed, step S902 is performed, before step S900 is performed, or step S900 is performed.
請參照「第11C圖」與「第12C圖」,「第12C圖」係為根 據本提案之雷射加工方法的第十二實施例步驟流程圖。在本實施例中,雷射加工的方法除了包含上述步驟S420、步驟S900、步驟S902、步驟S903與步驟S904之外,另包含: Please refer to "11C" and "12C". "12C" is the root. A flow chart of the steps of the twelfth embodiment of the laser processing method according to the present proposal. In this embodiment, the laser processing method includes: in addition to the above steps S420, S900, S902, S903, and S904, the method further includes:
步驟S908:施予冷卻氣體於被雷射光束照射後的端面。 Step S908: applying a cooling gas to the end surface after being irradiated by the laser beam.
其中,步驟S908可於執行步驟S904之後實施,以提高雷射光束60的照射區域與未照射區域之間的溫度梯度,進而提升劈裂速度。 The step S908 can be implemented after the step S904 is performed to increase the temperature gradient between the illuminated area and the unirradiated area of the laser beam 60, thereby increasing the splitting speed.
上述實施例中,雷射控制模組300可耦接雷射輸出模組200。當雷射控制模組300輸出啟動訊號至雷射輸出模組200時,雷射輸出模組200輸出雷射光束60。當雷射控制模組300輸出停止訊號至雷射輸出模組200時,雷射輸出模組200停止輸出雷射光束60。此外,上述實施例中(如「第7B圖」與「第11B圖」所示),雷射輸出模組200可隨著雷射控制模組300的配置位置的變動而變動,但上述實施例並非用以限定本提案。 In the above embodiment, the laser control module 300 can be coupled to the laser output module 200. When the laser control module 300 outputs the start signal to the laser output module 200, the laser output module 200 outputs the laser beam 60. When the laser control module 300 outputs a stop signal to the laser output module 200, the laser output module 200 stops outputting the laser beam 60. In addition, in the above embodiment (as shown in FIG. 7B and FIG. 11B), the laser output module 200 may fluctuate with the change of the arrangement position of the laser control module 300, but the above embodiment It is not intended to limit this proposal.
根據上述本提案所揭露之雷射加工裝置及其方法,係利用雷射光束移除玻璃板端面上的缺陷。可藉由雷射光束的配置位置不動但旋轉玻璃板,或玻璃板不動雷射光束環繞照射玻璃板端面的方式,藉以解決先前技術因利用機械磨邊修整玻璃板存在有處理速度太慢、端面仍有微裂紋以及當玻璃板的厚度太薄時(即厚度≦0.1mm),機械磨邊容易造成破片的問題。可藉由雷射光束的能量密度相應於第一速度或第二速度的方式,使得雷射光束照射於端面的能量趨近相同。可藉由變焦單元的設置,調整雷射光束的焦距以使得雷射光束照射於端面的能量不受雷射控制模組與玻璃 板的端面之間距離的影響。此外,可藉由中心固定單元的設置,將玻璃板的中心點固定於移動控制模組上,使得移動控制模組可以趨近等速的方式旋轉玻璃板。再者,可藉由送風噴嘴的設置,以提高雷射光束的照射區域與未照射區域之間的溫度梯度,進而提升修整玻璃板端面的速度。 According to the laser processing apparatus and method disclosed in the above proposal, the laser beam is used to remove defects on the end faces of the glass sheets. The surface of the laser beam can be rotated by the position of the laser beam, or the glass plate can be moved around the end surface of the glass plate to solve the problem. The prior art has a slow processing speed due to the use of mechanical edging to trim the glass plate. There are still microcracks and when the thickness of the glass plate is too thin (i.e., thickness ≦ 0.1 mm), mechanical edging is liable to cause a problem of fragmentation. The energy of the laser beam irradiated to the end face can be made nearly the same by the energy density of the laser beam corresponding to the first speed or the second speed. The focal length of the laser beam can be adjusted by the setting of the zoom unit so that the energy of the laser beam irradiated to the end face is not affected by the laser control module and the glass. The effect of the distance between the end faces of the plates. In addition, the center point of the glass plate can be fixed to the movement control module by the setting of the central fixing unit, so that the movement control module can rotate the glass plate in a manner similar to the constant speed. Furthermore, the temperature gradient between the irradiated area of the laser beam and the unirradiated area can be increased by the arrangement of the air blowing nozzle, thereby increasing the speed of the end surface of the trimmed glass sheet.
雖然本提案以前述之較佳實施例揭露如上,然其並非用以限定本提案,任何熟習相像技藝者,在不脫離本提案之精神和範圍內,當可作些許之更動與潤飾,因此本提案之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。 While the present invention has been disclosed in the foregoing preferred embodiments, it is not intended to limit the present invention. Any skilled person skilled in the art can make some changes and refinements without departing from the spirit and scope of the present proposal. The scope of patent protection of the proposal shall be subject to the definition of the scope of the patent application attached to this specification.
40、43‧‧‧中心固定單元 40, 43‧‧‧ center fixed unit
50、90‧‧‧玻璃板 50, 90‧‧‧ glass plates
51、91‧‧‧刻痕 51, 91‧‧‧ nicks
52、92‧‧‧端面 52, 92‧‧‧ end face
54、94‧‧‧第一表面 54, 94‧‧‧ first surface
56、96‧‧‧第二表面 56, 96‧‧‧ second surface
60‧‧‧雷射光束 60‧‧‧Laser beam
70、72‧‧‧玻璃削屑層 70, 72‧‧‧ glass shaving layer
88‧‧‧送風噴嘴 88‧‧‧Air supply nozzle
89‧‧‧冷卻氣體 89‧‧‧Cooling gas
100、700‧‧‧雷射加工裝置 100, 700‧‧ ‧ laser processing equipment
200‧‧‧雷射輸出模組 200‧‧‧Laser output module
300‧‧‧雷射控制模組 300‧‧‧Laser Control Module
302‧‧‧光路引導單元 302‧‧‧Light path guiding unit
304‧‧‧變焦單元 304‧‧‧Zoom unit
400‧‧‧移動控制模組 400‧‧‧Mobile Control Module
450‧‧‧承載模組 450‧‧‧ Carrying Module
D1、D2‧‧‧照射直徑 D 1 , D 2 ‧‧‧irradiation diameter
t1、t2‧‧‧寬度 t 1 , t 2 ‧‧‧width
G、H、K、J‧‧‧厚度 G, H, K, J‧‧ thickness
F1、I1‧‧‧第一位置 F 1 , I 1 ‧‧‧ first position
F2、I2‧‧‧第二位置 F 2 , I 2 ‧‧‧ second position
S1、S2‧‧‧距離 S 1 , S 2 ‧‧‧ distance
N1、N2‧‧‧距離 N 1 , N 2 ‧‧‧ distance
x‧‧‧第一方向 x‧‧‧First direction
y‧‧‧第二方向 Y‧‧‧second direction
z‧‧‧第三方向 z‧‧‧The third direction
第1圖係為根據本提案之一實施例的雷射加工裝置與圓形玻璃板的配置位置示意圖。 Fig. 1 is a schematic view showing the arrangement position of a laser processing apparatus and a circular glass plate according to an embodiment of the present proposal.
第2A圖係為根據第1圖之雷射光束照射於玻璃板的第一實施例立體示意圖。 Fig. 2A is a perspective view showing a first embodiment in which a laser beam according to Fig. 1 is irradiated onto a glass plate.
第2B圖係為根據第1圖之雷射光束照射於玻璃板的第二實施例立體示意圖。 Fig. 2B is a perspective view showing a second embodiment of the laser beam irradiated to the glass plate according to Fig. 1.
第2C圖係為根據第1圖之雷射光束照射於玻璃板的第三實施例立體示意圖。 Fig. 2C is a perspective view showing a third embodiment in which the laser beam according to Fig. 1 is irradiated onto the glass plate.
第3A圖係為根據本提案之雷射加工方法的第一實施例步驟流程圖。 Figure 3A is a flow chart of the first embodiment of the laser processing method according to the present proposal.
第3B圖係為根據本提案之雷射加工方法的第二實施例步驟流程圖。 Figure 3B is a flow chart of the second embodiment of the laser processing method according to the present proposal.
第3C圖係為根據本提案之雷射加工方法的第三實施例步驟 流程圖。 Figure 3C is a third embodiment step of the laser processing method according to the present proposal flow chart.
第4A圖係為根據本提案之另一實施例的雷射加工裝置與旋轉於第一位置的方形玻璃板的示意圖。 Figure 4A is a schematic illustration of a laser processing apparatus and a square glass plate rotated in a first position in accordance with another embodiment of the present proposal.
第4B圖係為根據第4A圖之雷射加工裝置與旋轉於第二位置的方形玻璃板的示意圖。 Figure 4B is a schematic illustration of a laser processing apparatus according to Figure 4A and a square glass plate rotated in a second position.
第5A圖係為根據第4A圖之雷射光束照射於玻璃板的第一實施例立體示意圖。 Fig. 5A is a perspective view showing a first embodiment in which a laser beam according to Fig. 4A is irradiated onto a glass plate.
第5B圖係為根據第4A圖之雷射光束照射於玻璃板的第二實施例立體示意圖。 Fig. 5B is a perspective view showing a second embodiment of the laser beam irradiated to the glass plate according to Fig. 4A.
第5C圖係為根據第4A圖之雷射光束照射於玻璃板的第三實施例立體示意圖。 Fig. 5C is a perspective view showing a third embodiment in which a laser beam according to Fig. 4A is irradiated onto a glass plate.
第6A圖係為根據本提案之雷射加工方法的第四實施例步驟流程圖。 Figure 6A is a flow chart showing the steps of a fourth embodiment of the laser processing method according to the present proposal.
第6B圖係為根據本提案之雷射加工方法的第五實施例步驟流程圖。 Figure 6B is a flow chart showing the steps of the fifth embodiment of the laser processing method according to the present proposal.
第6C圖係為根據本提案之雷射加工方法的第六實施例步驟流程圖。 Figure 6C is a flow chart showing the steps of the sixth embodiment of the laser processing method according to the present proposal.
第7A圖係為根據本提案之又一實施例的雷射加工裝置與旋轉於第一位置的方形玻璃板的示意圖。 Figure 7A is a schematic illustration of a laser processing apparatus and a square glass plate rotated in a first position in accordance with yet another embodiment of the present proposal.
第7B圖係為根據第7A圖之雷射加工裝置與旋轉於第二位置的方形玻璃板的示意圖。 Fig. 7B is a schematic view of the laser processing apparatus according to Fig. 7A and a square glass plate rotated in the second position.
第8A圖係為根據第7A圖之雷射光束照射於玻璃板的第一實施例立體示意圖。 Fig. 8A is a perspective view showing a first embodiment in which a laser beam according to Fig. 7A is irradiated onto a glass plate.
第8B圖係為根據第7A圖之雷射光束照射於玻璃板的第二實施例立體示意圖。 Fig. 8B is a perspective view showing a second embodiment of the laser beam irradiated to the glass plate according to Fig. 7A.
第8C圖係為根據第7A圖之雷射光束照射於玻璃板的第三實施例立體示意圖。 Fig. 8C is a perspective view showing a third embodiment in which a laser beam according to Fig. 7A is irradiated onto a glass plate.
第9A圖係為根據本提案之雷射加工方法的第七實施例步驟流程圖。 Figure 9A is a flow chart showing the steps of the seventh embodiment of the laser processing method according to the present proposal.
第9B圖係為根據本提案之雷射加工方法的第八實施例步驟流程圖。 Figure 9B is a flow chart showing the steps of the eighth embodiment of the laser processing method according to the present proposal.
第9C圖係為根據本提案之雷射加工方法的第九實施例步驟流程圖。 Figure 9C is a flow chart showing the steps of the ninth embodiment of the laser processing method according to the present proposal.
第10A圖係為根據本提案之更一實施例的雷射加工裝置與旋轉於第一位置的方形玻璃板的示意圖。 Figure 10A is a schematic illustration of a laser processing apparatus and a square glass plate rotated in a first position in accordance with a further embodiment of the present proposal.
第10B圖係微根據第10A圖之雷射加工裝置與旋轉於第二位置的方形玻璃板的示意圖。 Figure 10B is a schematic illustration of a laser processing apparatus according to Figure 10A and a square glass plate rotated in a second position.
第11A圖係為根據第10A圖之雷射光束照射於玻璃板的第一實施例立體示意圖。 Fig. 11A is a perspective view showing a first embodiment in which a laser beam according to Fig. 10A is irradiated onto a glass plate.
第11B圖係為根據第10A圖之雷射光束照射於玻璃板的第二實施例立體示意圖。 Fig. 11B is a perspective view showing a second embodiment in which a laser beam according to Fig. 10A is irradiated onto a glass plate.
第11C圖係為根據第10A圖之雷射光束照射於玻璃板的第三實施例立體示意圖。 Fig. 11C is a perspective view showing a third embodiment in which a laser beam according to Fig. 10A is irradiated onto a glass plate.
第12A圖係為根據本提案之雷射加工方法的第十實施例步驟流程圖。 Figure 12A is a flow chart showing the steps of a tenth embodiment of the laser processing method according to the present proposal.
第12B圖係為根據本提案之雷射加工方法的第十一實施例步 驟流程圖。 Figure 12B is an eleventh embodiment of the laser processing method according to the present proposal Flow chart.
第12C圖係為根據本提案之雷射加工方法的第十二實施例步驟流程圖。 Figure 12C is a flow chart showing the steps of the twelfth embodiment of the laser processing method according to the present proposal.
40‧‧‧中心固定單元 40‧‧‧Center fixed unit
50‧‧‧玻璃板 50‧‧‧ glass plate
52‧‧‧端面 52‧‧‧ end face
60‧‧‧雷射光束 60‧‧‧Laser beam
100‧‧‧雷射加工裝置 100‧‧‧ Laser processing equipment
200‧‧‧雷射輸出模組 200‧‧‧Laser output module
300‧‧‧雷射控制模組 300‧‧‧Laser Control Module
302‧‧‧光路引導單元 302‧‧‧Light path guiding unit
400‧‧‧移動控制模組 400‧‧‧Mobile Control Module
x‧‧‧第一方向 x‧‧‧First direction
y‧‧‧第二方向 Y‧‧‧second direction
z‧‧‧第三方向 z‧‧‧The third direction
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