TW201422124A - Server - Google Patents

Abstract

A server includes a chassis, a first tray, and two motherboard modules. The chassis includes a receiving space, a first opening and a second opening which is relative to the first opening. The first tray which locates in the second opening, disposes in the receiving space and carries a power supply module and a plurality of fan modules. The power supply module locates on the middle of the first tray and the fan modules locate on two sides of the power supply module. The power supply module and the fan modules are adapted to insert in the chassis or draw out from the chassis with the first tray from the second opening. The two motherboard modules which dispose side by side in the receiving space, locate in the first opening. Each motherboard module electrically connects to the power supply module and corresponds to the fan module. The gap between the two motherboard modules corresponds to the power supply module.

Description

server

The present invention relates to an electronic device, and more particularly to a server.

The server is the core computer that serves each computer in the network system. It can provide the functions of the disk and printing services required by the network users, and also allows each client to share resources in the network environment with each other. The basic structure of the server is roughly the same as that of a general personal computer. It consists of a central processing unit (CPU), a memory, and an input/output (I/O) device, and is connected by a bus. It is connected internally, connected to the central processing unit and memory through the north bridge chip, and connected to the input/output device through the south bridge chip. The server has undergone three evolutions in terms of chassis architecture: from early tower chassis to rack servers that emphasize centralized performance to high-density computing.

Taking the rack server as an example, the rack server is a server designed to have a uniform appearance and is used in conjunction with the cabinet. It can be said that the rack type is an optimized structure of the tower server, and its design purpose is mainly to minimize the occupation of the server space. Many professional network devices are rack-mounted, mostly flat, just like drawers. Such as switches, routers, hardware firewalls. The rack server has a width of 19 inches and a height in U (1U = 1.75 inches = 44.45 mm). There are usually 1U, 2U, 3U, 4U, 5U, 7U standard servers.

The dimensions of the cabinet are also based on common industry standards, usually from 22U to 42U Not waiting. The height of the U in the cabinet has a detachable sliding trailer. Users can flexibly adjust the height according to the elevation of their own servers to store network devices such as servers, hubs, and disk array cabinets. After the server is placed, all its I/O lines are taken out from the rear of the cabinet (all interfaces of the rack server are also at the rear), and are uniformly placed in the trunking of the cabinet, generally labeled with labels for easy management.

In the computer server, since the height of a host has been standardized to a height of 1U, how to configure the various electronic components in the limited space of a host to achieve the highest performance speed of the computer server. It is a big challenge in the design of computer servers. In addition, the higher the performance of the computer server also means the more efficient cooling requirements, so how to make the most effective space configuration and meet the heat dissipation requirements of various electronic components in a limited space is worthy of discussion in the design of computer servers. problem.

The invention provides a server with good computing performance and heat dissipation efficiency.

The invention provides a server comprising a chassis, a first carrier disk and two motherboard modules. The chassis has a receiving space, a first opening and a second opening relative to the first opening. The first carrier tray is disposed in the receiving space and located at the second opening, and carries the power supply module and the plurality of fan modules. The power supply module is located at an intermediate position of the carrier disk, and the fan module is located at two sides of the power supply module. The power supply module and the fan module are adapted to follow the first carrier disk and insert the chassis from the second opening or withdraw from the chassis. . Two motherboard modules are arranged side by side in the space and located first In the opening, each motherboard module is electrically connected to the power supply module and corresponds to the fan module, and the gap between the two motherboard modules corresponds to the power supply module.

In an embodiment of the invention, the power supply module has a power backplane and a plurality of power supplies, and the motherboard module is electrically connected to the power supply via the power backplane.

In an embodiment of the present invention, each of the foregoing motherboard modules is disposed on a second carrier, and is adapted to be inserted into or withdrawn from the chassis from the first opening.

In an embodiment of the present invention, the front ends of the respective motherboard modules are respectively provided with a plurality of input and output interfaces, and the input and output interfaces are exposed to the first openings.

In an embodiment of the invention, the server further includes a first electronic component stacked and/or laid flat on the front end of each of the motherboard modules.

In an embodiment of the invention, the aforementioned first electronic component comprises a hard disk and/or an expansion card.

In an embodiment of the invention, the server further includes a flow guiding blocking structure disposed in the gap between the two motherboard modules.

In an embodiment of the invention, the fan modules are arranged in a straight line.

In an embodiment of the invention, each of the aforementioned motherboard modules corresponds to a respective fan module.

In an embodiment of the invention, each of the motherboard modules and the corresponding fan modules form another storage space for accommodating a plurality of second electronic components.

Based on the above, the server of the present invention has two motherboard modules, and thereby improves the computing efficiency of the server. In addition, the server includes a plurality of fan modules, and the fan modules correspond to the respective motherboard modules, so that a good heat dissipation effect can be achieved, and the server of the present invention can have both high computational efficiency and high heat dissipation efficiency.

The above described features and advantages of the present invention will be more apparent from the following description.

1 is a perspective view of a server in accordance with an embodiment of the present invention. Referring to FIG. 1, the server 100 includes a chassis 110, a first carrier 120, and two motherboard modules 150a and 150b. The chassis 110 has a receiving space S1, a first opening 110a and a second opening 110b opposite to the first opening 110a. The first carrier 120 is disposed in the receiving space S1 and located at the second opening 110b. The first carrier 120 carries a power supply module 130 and a plurality of fan modules 140a and 140b. The power supply module 130 is located at an intermediate position of the first carrier 120, and the fan modules 140a and 140b are located at the power supply module 130. The position on both sides.

Since the power supply module 130 and the fan modules 140a, 140b are placed on the first carrier 120, the first carrier 120 is adapted to be inserted into or withdrawn from the chassis 110 from the second opening 110b. The two motherboard modules 150a and 150b are disposed side by side in the receiving space S1 and located at the first opening 110a. Each of the motherboard modules 150a, 150b is electrically connected to the power supply module 130 and corresponding to the fan modules 140a, 140b, and two The gap G between the motherboard modules 150a, 150b corresponds to the power supply module 130.

In this embodiment, the server 100 includes two motherboard modules 150a and 150b. Therefore, the server 100 of the embodiment can utilize two hosts as compared with the design of a single motherboard module in the prior art. The board modules 150a and 150b are designed to improve the computing performance of the server 100.

In the above, the server 100 of the embodiment includes two motherboard modules 150a and 150b and a plurality of fan modules 140a and 140b. The fan module 140a corresponds to the motherboard module 150a and the fan module 140b corresponds to the motherboard module 150b. Such a one-to-one configuration can improve the heat dissipation efficiency of the server 100. In addition, in this embodiment, each of the fan modules 140a and 140b has three fans 141, but the present invention does not limit the number of fans 141 in the fan modules 140a and 140b, as long as each of the motherboard modules 150a and 150b has The corresponding fan module can be used. That is to say, the designer can adjust the number of the fans 141 according to the actual application, so that the heat dissipation effect of the server 100 is better.

Referring to FIG. 1, the motherboard modules 150a and 150b are respectively disposed on the second carrier 160a, 160b, and are adapted to be inserted into or withdrawn from the chassis 110 from the first opening 110a following the second carrier 160a, 160b. That is, in the architecture of the server 100 of the embodiment, the first carrier 120 carries the power supply module 130 and the fan modules 140a, 140b, and the second carrier 160a carries the motherboard module 150a, and The other second carrier 160b carries the motherboard module 150b. The first carrier 120 can be inserted into or withdrawn from the chassis 110 by the second opening 110b, and the second bearing The carriers 160a, 160b can be inserted into or withdrawn from the chassis 110 by the first opening 110a. In addition, the front ends of the motherboard modules 150a and 150b are respectively provided with a plurality of input and output interfaces 152, and the input and output interfaces 152 are exposed to the first opening 110a for convenient operation by a user.

2 is a perspective view of one of the motherboard modules of FIG. 1. As shown in FIG. 2, one of the motherboard modules 150a of the server 100 is carried by a second carrier 160a. The motherboard module 150b is carried by the second carrier 160b, which is the same as that illustrated in FIG.

In the above, each of the motherboard modules 150a and 150b has a motherboard 151. In addition, each of the motherboard modules 150a and 150b may further include a first electronic component 170 stacked and/or tiled at the front end of the motherboard modules 120a and 120b. The first electronic component 170 can be a hard disk, such as a 2.5-inch solid state drive (SSD) of a small form factor (SFF), or an expansion card, such as a short profile (low profile). , LP) display card. The server 100 can achieve the improved computing performance by using the different first electronic components 170, or increase the data storage capacity of the servo device 100. During operation of the server 100, the motherboard modules 150a and 150b having a plurality of first electronic components 170 will be the portion of the entire server 100 that produces the most thermal energy. However, in this embodiment, each of the motherboard modules 150a and 150b corresponds to the respective fan modules 140a and 140b, so that the heat generated by the motherboard modules 150a and 150b when the server 100 is operated will be It will dissipate under the operation of the corresponding fan modules 140a, 140b, so that the heat dissipation efficiency of the overall server 100 is better.

3 is a top view of the server of FIG. 1, please refer to FIG. In detail, the power supply module 130 of the server 100 has a power backplane 131 and a power supply 132. In the present embodiment, the power supply module 130 has a power supply 132 as an example, but the present invention does not limit the number of power supplies 132. The motherboard modules 150a and 150b are electrically connected to the power supply 132 via the power backplane 131, and the power supply of the motherboard modules 150a and 150b is provided via the power supply 132.

In addition, in the embodiment, the server 100 further includes a flow guiding blocking structure 180 disposed in the gap G between the main board modules 150a and 150b. The airflow blocking structure 180 can separate the wind blown by the fan 141 in the fan module 140a and the wind blown by the fan 141 of the fan module 140b, so that the wind blown by the fan 141 of the fan module 140a is only blown toward The main board module 150a causes the wind blown by the fan 141 of the fan module 140b to blow only to the main board module 150b. As a result, the fan 141 has a similar one-to-one effect with the motherboard modules 150a and 150b, and thereby enables the server 100 to achieve better heat dissipation efficiency.

In this embodiment, the fan modules 140a and 140b are laid on one side of the first carrier 120 in a straight line, and are aligned with each other, so that the fan modules 140a and 140b can achieve the most internal saving of the server 100 in specifications and arrangement. The configuration of the space.

In addition, referring to FIG. 3, in the embodiment, the fan module 140a and the motherboard module 150a form a receiving space S2, and the fan module 140b and the motherboard module 150b also form a space. Space S2. In order to make the space utilization efficiency inside the server 100 better, this The space S2 can selectively place other suitable second electronic components 190, such as the aforementioned small-size solid state hard disk, etc., to increase the performance of the server 100. Of course, the present invention should not limit the kind of the second electronic component 190. The designer can select a suitable second electronic component 190 to be placed in the receiving spaces S2 according to the design requirements of the server 100.

In summary, the server of the present invention improves the computing efficiency of the server by designing two motherboard modules, and each motherboard module has its corresponding fan module. This design allows the server to combine high computational efficiency with high heat dissipation efficiency. In addition, the server may further include a flow guiding blocking structure to separate the wind blown by the fans in the respective fan modules, so that the wind blown by each fan only faces the corresponding motherboard module, and the design makes the servo The heat dissipation efficiency of the device is improved.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

100‧‧‧Server

110‧‧‧Chassis

110a‧‧‧first opening

110b‧‧‧second opening

120‧‧‧First carrier

130‧‧‧Power supply module

131‧‧‧Power backplane

132‧‧‧Power supply

140a, 140b‧‧‧Fan modules

141‧‧‧Fan

150a, 150b‧‧‧ motherboard module

151‧‧‧ motherboard

152‧‧‧Input and output interface

160a, 160b‧‧‧second carrier

170‧‧‧First electronic components

180‧‧‧drain blocking structure

190‧‧‧Second electronic components

S1, S2‧‧‧ accommodation space

G‧‧‧ gap

1 is a perspective view of a server in accordance with an embodiment of the present invention.

2 is a perspective view of one of the motherboard modules of FIG. 1.

Figure 3 is a top plan view of the server of Figure 1.

100‧‧‧Server

110‧‧‧Chassis

110a‧‧‧first opening

110b‧‧‧second opening

120‧‧‧First carrier

130‧‧‧Power supply module

140a, 140b‧‧‧Fan modules

141‧‧‧Fan

150a, 150b‧‧‧ motherboard module

152‧‧‧Input and output interface

160a, 160b‧‧‧second carrier

S1‧‧‧Containing space

G‧‧‧ gap

Claims (10)

A server includes: a chassis having a receiving space, a first opening and a second opening relative to the first opening; a first carrier disk disposed in the receiving space and located in the second The power supply module and the plurality of fan modules are disposed on the first carrier, wherein the power supply module is located at an intermediate position of the first carrier, and the fan modules are located in the power supply module. The power supply module and the fan modules are adapted to be inserted into or withdrawn from the chassis from the second opening; and two motherboard modules are disposed side by side. The main board module is electrically connected to the power supply module and corresponds to the fan module, and the gap between the two main board modules corresponds to the power supply mode. group. The server of claim 1, wherein the power supply module has a power backplane and a plurality of power supplies, and the motherboard modules are electrically connected to the power supply via the power backplane Device. The server of claim 1, wherein each of the motherboard modules is respectively disposed on a second carrier, and is adapted to follow the second carrier from the first opening or into the chassis. The chassis is pulled out. The server of claim 3, wherein the front end of each of the motherboard modules is respectively provided with a plurality of input and output interfaces, and the input and output interfaces are exposed to the first opening. For example, the server described in claim 4 of the patent scope includes cascading And/or laying the first electronic component placed at the front end of each of the motherboard modules. The server of claim 5, wherein the first electronic component comprises a hard disk and/or an expansion card. The server of claim 1, further comprising a flow guiding blocking structure disposed in the gap between the two motherboard modules. The server of claim 1, wherein the fan modules are arranged in a straight line. The server of claim 1, wherein each of the motherboard modules corresponds to the respective fan module. The server of claim 9, wherein each of the motherboard modules and the corresponding fan module form another space for accommodating a plurality of second electronic components.