TW201419180A - Solder paste management system and solder paste management method - Google Patents

Abstract

A solder paste management system and solder paste management method are provided, which solder paste annealing system includes a solder paste annealing box and a server. The solder paste annealing box can be used to put the solder paste inside, so that the solder paste can be provided to production line users after the temperature of the solder paste reverts back to the room temperature. The solder paste annealing box also can used to verify the identification of the production line users and collect the solder paste use data to the server. The server can aim at the data received from the solder paste annealing box to carry on statistical analysis and provides the result to remote management users. The server can also provide a management interface to the remote management users, so that the remote management users can link to the box and set the rights of the users through the server and the use of the solder paste is improved effectively.

Description

Solder paste management system and solder paste management method

The invention relates to a solder paste reheating device, and in particular to a solder paste management system and a solder paste management method with remote management function.

Surface mount technology (SMT) is the most commonly used process technology in the current electronic packaging industry. The solder paste used in the process needs to be refrigerated during storage. It needs to be warmed up before use. Generally, the storage temperature of solder paste is about 5 degrees Celsius. It must be taken out of the refrigerator before use, and then returned to room temperature for 3-4 hours at room temperature to allow the solder paste to return to normal temperature before use. Before use, it is necessary to stir the solder paste by using a solder paste mixer to mix the tin powder and the flux evenly before it can be used in the production line.

If the temperature is not completed, the solder paste is opened and the moisture is easily introduced into the solder paste. When the furnace is overheated, tin explosion is likely to occur and tin beads are generated, which affects the process quality. Therefore, the control of solder paste rewarming affects the quality of SMT process is a very important part.

In addition, since solder paste is quite expensive, the use of solder paste is very important for line cost control. The current solder paste reheating device does not provide an effective and convenient function for the administrator to conveniently manage the use of solder paste.

The prior art (Taiwan Patent Application No. 93103441) proposes a solder paste control system and method that only focuses on analysis and statistics of information such as temperature recovery time and stirring time, and the monitoring data may need to be input by the user, and does not mention how to Hardware integration to achieve automated functions is quite inconvenient to use. In addition, the prior art can not monitor the user of the solder paste of the production line, and it is impossible to conduct a cost-effective analysis on the relationship between the utilization rate of the solder paste and the performance of the production line, thereby providing useful instant information for the manager.

In addition, the above-mentioned pre-existing case also does not disclose the actual flow control mechanism of the solder paste. It has been disclosed that the online monitoring sub-module is used to determine the online use. The online use dialog box also needs to enter the usage line and the recipient's employee number. Since anyone can go online, there is still a risk of fraudulent or misleading.

The above predecessor does not disclose the recovery mechanism for the unused solder paste. Although the previous case discloses the use of the return/change sub-module to determine whether the solder paste has been returned or changed, it still needs to be artificially used in the limit time ( For example: 48 hours) choose to return or change the line, no doubt increasing the chance of scrapping the solder paste.

The invention provides a solder paste management system and a solder paste management method, which has the functions of solder paste temperature storage and control production line solder paste, and can perform remote data statistical analysis, so that the manager can conveniently control the production line solder paste. Use to reduce the waste of solder paste. The above management method can estimate the utilization rate of solder paste according to the production capacity and the amount of solder paste on the production line, and it is estimated that there is a problem that the solder paste is improperly used, abnormal quality or waste.

Embodiments of the present invention provide a solder paste management system including at least one solder paste return tank and a server. The solder paste returning box has a plurality of temperature returning areas for placing a solder paste for performing a warming process, and a freezing storage area for refrigerating the solder paste, and the solder paste is returned to the temperature. The box further comprises: a control unit; a time setting module for setting the temperature return time of the return temperature zones, and timing to determine whether the solder paste placed in the temperature return zones completes the warming process; a sensing module coupled to the control unit for sensing an identification card to determine a user's data; a retrieval module disposed on the solder paste returning box, according to the user's authority And the timing result of the time setting module determines whether to release the solder paste in the return temperature zones for the user to access; a returning module is disposed in the solder paste returning temperature box The solder paste returning tank returns the unused solder paste to the frozen storage area via the returning module when the solder paste for placing the returning temperature zones is not used for a predetermined period of time; and The data transmission module is coupled to the control unit for transmitting the amount of the solder paste in the return temperature zone and the data of the user who takes the solder paste.

The server is connected to the solder paste returning box via a network to receive the data transmitted by the data transmission module to obtain a solder paste usage information of the solder paste returning temperature box. The server further provides a manager interface, so that a remote manager can obtain the solder paste usage information corresponding to the solder paste return box via the manager interface.

In the embodiment of the present invention, the solder paste returning box further has a display module for displaying the temperature information of the solder paste in the return temperature zones.

In the embodiment of the invention, the solder paste returning box further has a temperature control module for controlling the temperatures of the return temperature zones.

In the embodiment of the present invention, the solder paste returning box further has a temperature sensing module for sensing the temperature of the temperature returning zone and the temperature of the solder paste placed in the solder paste returning oven.

In the embodiment of the present invention, the solder paste returning box further has a heating module for adjusting the temperature of the return temperature zones, so that the temperature of the temperature returning zones is maintained in a specific range, and the specific range is Celsius. 20 to 25 degrees.

In the embodiment of the present invention, the solder paste returning box further includes a data storage unit for storing a user lookup table having a plurality of user data and corresponding solder paste accessing rights. The access module determines the user's authority based on the user lookup table to determine whether to release the solder paste in the warming zone for the user to access.

In an embodiment of the invention, the server can remotely control the solder paste return tank to adjust the content of the user lookup table.

In the embodiment of the present invention, the server further provides a production line receiving interface. For receiving a production line data from a production line, the production line data includes a production line data, a printed circuit board output and a number of solder joints, and the server calculates a predetermined amount of solder paste according to the production line data. And comparing the estimated amount of the solder paste with the solder paste usage information to calculate a solder paste utilization rate, the server sends a warning message when the solder paste utilization rate is lower than a preset value.

From another point of view, the embodiment of the present invention further provides a solder paste management method, comprising the steps of: providing a solder paste returning box to place a solder paste, the solder paste returning box comprising a plurality of temperature-recovering zones and a a refrigerating storage area for placing a solder paste for performing a warming process for refrigerating the solder paste; setting a temperature recovery time of the regenerative temperature zones, and timing to determine the placement Whether the solder paste in the rewarming zone completes the warming process; providing a sensing module for identifying the card to determine a user's data; determining whether to release according to the user's authority and timing result The solder paste in the rewarming zone is used by the user; when the solder paste of the rewarming zone is placed for more than a predetermined period of time, the solder paste returning tank is passed through the returning module Unused solder paste is returned to the frozen storage area; according to the state of use of the solder paste in the solder paste return tank, a solder paste usage information is provided to a server; and a manager interface is provided via the server A remote manager can obtain corresponding correspondence via the manager interface Paste back paste incubator of the use of information.

In the embodiment of the present invention, the solder paste management method further includes the following steps: providing, by the server, a production line data receiving interface for receiving a production line data from a production line, where the production line data includes a printed circuit The board output and the number of solder joints, the server calculates the estimated amount of solder paste according to the production line data; compares the estimated amount of the solder paste with the solder paste usage information to calculate a solder paste utilization rate; and when the solder paste is utilized When the rate is lower than a preset value, the server sends a warning message.

The invention further provides a solder paste management system, comprising: a plurality of solder paste return tanks and a server, wherein each of the solder paste return tanks comprises: a plurality of temperature recovery zones; The unit is configured to switch the temperature recovery box to a rewarming mode and a refrigerating storage mode; a time setting module is configured to set a regenerative time of the regenerative zones, and perform timing to determine placement Whether the solder paste in the rewarming zone is warmed up; a sensing module coupled to the control unit for sensing an identification card to determine a user's data; and an access module disposed at the On the solder paste returning box, according to the user's authority and the timing result of the time setting module, it is determined whether to release the solder paste in the return temperature zone for the user to access; a returning module, setting On the solder paste returning box, when the solder paste for placing the returning temperature zones is not more than a predetermined time, the control unit sets the solder paste returning oven to the warming mode, and when the returning temperature zones are placed When the solder paste is not used for a predetermined period of time, the solder paste return tank is switched to the freeze storage mode; and a data transmission module is coupled to the control unit for transmitting the return temperature zones The amount of solder paste and the user's information on the solder paste.

The server is connected to the solder paste returning tank via a network for receiving data transmitted by each solder paste returning oven to monitor a solder paste usage state corresponding to each solder paste returning warmer; the server Providing a manager interface, such that the remote manager can obtain the solder paste usage information corresponding to each of the solder paste return boxes via the administrator interface; wherein the solder paste return box further includes a data storage unit For storing a user lookup table, the user lookup table has a plurality of user data and corresponding solder paste access rights, and the access module determines the user's authority according to the user lookup table to determine Whether to release the solder paste in the return temperature zone for the user to access.

In an embodiment of the invention, the server further provides a production line receiving interface for receiving a production line data from the production line, the production line data including a printed circuit board output and a number of solder joints, the servo According to the production line data, the estimated amount of solder paste is used, and the estimated amount of the solder paste and the solder paste usage information are compared to calculate the utilization rate of the solder paste. When the solder paste utilization rate is lower than a preset value, The servo The server sends a warning message.

In summary, the solder paste management system of the present invention can monitor the rewarming time of individual solder pastes and related personnel and other related materials, and transmit relevant solder paste usage information to the remote end via the network, thereby achieving remote control. The effect of solder paste use, and effectively reduce the problem of solder paste waste.

The above described features and advantages of the present invention will be more apparent from the following description.

In the following, the invention will be described in detail by the embodiments of the invention, and the same reference numerals are used in the drawings.

[First Embodiment]

Please refer to FIG. 1. FIG. 1 is a schematic diagram of a solder paste management system according to a first embodiment of the present invention. The solder paste management system 100 includes a plurality of solder paste return tanks 110 and a server 120. The server 120 can be connected to the plurality of solder paste return tanks 110 via the network to obtain the solder paste usage information of the solder paste return tank 110. The remote user 130 can be connected to the server 120 via a computer to obtain solder paste usage information, thereby regulating the use of statistical data related to the solder paste by the solder paste.

The server 120 is, for example, a computer or a data control center, and can be used to process related data and perform data processing. This embodiment does not limit the type of the server 120. The server 120 can provide a user interface for the administrator to use to read the relevant solder paste usage information for solder paste management. The solder paste usage information is, for example, information on the amount of the user, the time taken, the amount of solder paste used in the production line, the stock of the solder paste, the temperature of the solder paste, and the like, and the embodiment is not limited. The server 120 can provide a manager interface, so that the remote manager can obtain the corresponding tin through the administrator interface. The paste is used to return the solder paste usage information of the thermostat 110. In this way, the efficacy of remote solder paste management and statistical analysis is achieved.

The solder paste management system 100 of the present invention can solve the problem that the solder paste of the production line is not easy to be wasted and regulated, and provides a technical solution for the integrity, so that the manager can control the state of the solder paste used in the whole factory. In addition, the present invention can provide statistical analysis data for the use of solder paste to the administrator for reference, as a basis for cost control, quality improvement and workflow improvement.

2 and FIG. 3, FIG. 2 is a schematic diagram of the function of the solder paste returning warmer according to the first embodiment of the present invention, and FIG. 3 is a schematic view of the solder paste returning warmer according to the first embodiment of the present invention. The solder paste reheating box 110 includes a control unit 201, a data transmission module 202, a data storage module 203, a display module 210, a time setting die resistor 220, a sensing module 230, an access module 240, and a stripping module. 250, temperature control module 260, temperature sensing module 270, heating module 280 and warning module 290. The above modules can be selectively installed according to the use requirements, and the embodiment is not limited.

Referring to FIG. 3 at the same time, the storage of the solder paste return tank 110 is divided into a normal temperature zone 310 and a frozen storage zone 320. The medium temperature zone 310 is divided into a plurality of temperature recovery zones 311, 312, 313, and 314, which can be stored at different times. Into the solder paste 301. The user can set a corresponding warm-up time for different temperature-recovery areas 311, 312, 313, and 314 to facilitate control of the temperature return state of the solder paste 301. When the solder paste 301 placed back to the temperature zones 311, 312, 313, 314 is not used for a predetermined time, the solder paste return tank 110 can return the unused solder paste 301 to the frozen via the return module 250. Storage area 320.

The control unit 201 is coupled to the modules 202-290 for controlling the state of use of the solder paste return tank 110, and determining whether to allow the user to access the solder paste 301 according to the user's authority and the solder paste return time. Control unit 201 is used as control and The data processing center can be used to control the operation of each module. The control unit 201 is, for example, a microcontroller or an embedded controller, and the embodiment is not limited.

It is worth noting that the solder paste returning tank 110 can further have a rewarming mode and a freezing storage mode. In the rewarming mode, the plurality of rewarming zones 311 to 314 of the solder paste reheating tank 110 are at a normal temperature state; In the frozen storage mode, the solder paste return tank 110 can lower the temperature of the temperature return zones 311 to 314 to refrigerate the solder paste 301. The control unit 201 can control the mode switching of the solder paste return tank 110. When the solder paste 301 placed in the temperature return regions 311 to 314 does not exceed a predetermined time, the control unit 201 sets the solder paste returning temperature tank to the warming mode; when the solder paste 301 to 314 is placed back to the temperature region 311~314 When the preset time is not used, the solder paste return tank 110 is switched to the freeze storage mode to refrigerate the solder paste 301. The above preset time may be required, for example, 24 hours or 48 hours, and the embodiment is not limited.

It can be seen from the above that when the solder paste return tank 110 has a switchable temperature return mode and a frozen storage mode, the solder paste return tank 110 only needs to have the temperature return zones 311 to 314 to achieve the effects of temperature recovery and refrigeration. In other words, in another embodiment of the present invention, the solder paste return tank 110 may not have the frozen storage area 320, and the effect of tempering and refrigerating the solder paste 301 may be achieved. The refrigerating apparatus of the general refrigerator can be disposed in the solder paste reheating box 110 to achieve the effect of refrigerating. This embodiment does not limit the implementation of the refrigerating apparatus in the solder paste reheating box 110.

The data transmission module 202 is coupled to the control unit 201, and can transmit data to and from the server 120 via a wired or wireless network, for example, transmitting solder paste usage information (the amount of solder paste, the user's data of the solder paste, etc.) to The server 120 receives the control signal from the server 120. The data storage unit 203 is coupled to the control unit 201 and can be used to store the information on the use of the solder paste and the related information of the user. The form of the data is, for example, a lookup table, which may include information such as the name of the user, the information of the production line, the authority, and the like. The embodiment does not limit the funds stored in the data storage unit 203. Material form and content. For example, the user lookup table has multiple user data and corresponding solder paste access rights, and the access module 240 can determine the user's authority according to the user lookup table to determine whether to release the temperature return zone 311~314. The solder paste 301 is available for the user to access.

The display module 210 is, for example, a liquid crystal panel for displaying solder paste usage information and related setting information. The time setting module 220 is disposed on the solder paste returning tank 110 for setting the temperature return time of the temperature returning areas 311 to 314, and timing is performed to determine whether the solder paste placed in the temperature returning areas 311 to 314 is warmed up. carry out. The sensing module 230 is coupled to the control unit 201 for sensing the identification card to determine the user's data. The access module 240 is placed on the solder paste returning box 110, and the timing of the module 220 can be determined according to the user's authority and time to determine whether to release the solder paste in the returning temperature zones 311 to 314 for the user to access. . The access module 240 can include a plurality of partitions 241, 242 for selectively releasing solder paste to the user. The access module 240 can be implemented by using different structures, and the embodiment is not limited to FIG. 3. After the description of the above embodiments, those skilled in the art should be able to infer other embodiments, and no further details are provided herein.

The stripping module 250 is disposed in the solder paste return tank 110 for transferring the solder paste 301 to the frozen storage area 320. When the solder paste placed in the temperature zone 311~314 is not used for a predetermined period of time, the solder paste reheating box 110 can return the unused solder paste to the freezing storage area 320 via the stripping module 250. The frozen storage area 320 can provide a frozen low temperature to hold unused solder paste. The preset time may be determined according to design requirements, for example, 24 hours or 48 hours, but the embodiment is not limited. It should be noted that the above-mentioned stripping module 250 and the freezing storage area 320 can be selectively disposed in the solder paste reheating box 110 according to design requirements, that is, in another embodiment of the invention, the solder paste is warmed up. The tank 110 may not have the return module 250 and the freezing storage area 320.

The temperature control module 260 is coupled to the control unit 201 and can be used to control the temperatures of the temperature return zones 311 314 314 and the freezing storage zone 320 . The temperature sensing module 270 is coupled to the control unit 201 and can be used to sense the temperature of the temperature return regions 311 to 314 and the temperature of the solder paste placed in the solder paste return tank 110. The temperature sensing module 270 can be composed of a plurality of temperature sensors 271, 272, 273, 274, but the embodiment is not limited.

The heating module 280 is disposed in the solder paste returning tank 110, and can be used to adjust the temperature of the temperature returning regions 311 to 314 to maintain the temperature of the temperature returning regions 311 to 314 in a specific range, for example, 20 to 25 degrees Celsius, but This embodiment is not limited. The heating module 280 is, for example, an infrared heater or a heating device such as various types of electric heating tubes. This embodiment does not limit the type of the heating module 280. The heating module 280 can be controlled by the control unit 201 and adjust the temperature according to the control signal of the temperature control module 260.

In the normal state, as long as the ambient temperature meets the demand, the heating module 280 does not need to be activated to adjust the temperature of the return temperature zones 311 to 314. Therefore, in another embodiment of the present invention, the solder paste return tank 110 may not have the heating module 280, and the solder paste is warmed at a normal temperature.

The warning module 290 is coupled to the control unit 201 and can send a warning message when an abnormal condition occurs, for example, when the solder paste is placed in the temperature recovery area 310 for more than a preset time (for example, 48 hours), or When an unauthorized user takes solder paste. The warning message is, for example, a sound, an image, or the like, and the embodiment is not limited.

When the personnel on the production line need to use the solder paste, the sensing module 230 on the solder paste return tank 110 can be used to sense the user's identity, and then the access module 240 will release the temperature according to the user's permission state. The finished solder paste is given to the user to control the use of the solder paste. The server 120 is connected to the solder paste returning box 110 via the network, and can receive the data transmitted by the data transmission module 202 to obtain the solder paste returning temperature box. 110 solder paste usage information, then statistical analysis and control. The remote administrator can know the usage of the solder paste through the user interface provided by the server 120 to achieve the management effect. In addition, the solder paste management system 100 of the present invention can provide remote customers with instant queries to understand the use of solder paste on the production line, and allows remote clients to immediately respond to relevant information to the manager, thereby improving customer satisfaction. degree. In other words, the server 120 of the present invention can be used as a communication pipeline between the production line, the manager and the customer, so that the manager can conveniently manage the use of the solder paste to reduce the cost and improve the efficiency of the production line.

The server 120 further provides a production line receiving interface for receiving a production line data from the production line, and the production line data includes factory data, production line personnel, production line data, printed circuit board output, solder paste dosage and welding. The number of points, etc. The server 120 calculates the estimated amount of the solder paste according to the production line data, and compares the estimated amount of the solder paste with the solder paste usage information to calculate the utilization rate of the solder paste. When the solder paste utilization rate is lower than a preset value, the server 120 may issue a warning message to alert the manager. The above-mentioned warning message can be presented by means of a voice, an image, a text message, an email or a message, and the embodiment of the present invention is not limited. The above-mentioned solder paste utilization rate can reflect the use of the solder paste on the production line, such as the occurrence probability of the solder balls, the poor quality of the solder paste, and whether or not the solder paste is wasted.

It should be noted that the server 120 can be connected to the solder paste return tank 110 through a computer or a programmable logic controller (PLC). This embodiment does not limit the server 120 and the solder paste return tank 110. The intermediary device can be used as long as it can achieve the function of data transmission. After the description of the above embodiments, those skilled in the art should be able to infer other embodiments, and no further details are provided herein.

The server 120 can be integrated with the enterprise data management system or the production management system, and the related information can be uploaded to the enterprise system, so that the enterprise manager can Instantly obtain usage information of the production line solder paste, and set and change the authority of the user. Thereby, the solder paste management system of the invention can effectively improve the convenience of the enterprise in managing the use of the solder paste and reduce the waste of the solder paste.

[Second embodiment]

Please refer to FIG. 4. FIG. 4 is a flow chart of a solder paste management method according to a second embodiment of the present invention. Through the above embodiment of the solder paste management system 100, the present invention can further provide a solder paste management method, which comprises the following steps: providing a solder paste returning box to place the solder paste, and the solder paste returning temperature box includes a plurality of temperature recovery And a refrigerating storage area for placing a solder paste for performing a warming process, wherein the refrigerating storage area is used for refrigerating the solder paste (step S410); and setting the rewarming time of the regenerative temperature zones, And performing timing to determine whether the solder paste placed in the rewarming zones completes the rewarming process (step S420); providing a sensing module for identifying the card to determine a user's data (step S430) According to the user's authority and timing result, it is determined whether to release the solder paste in the regenerative zone for the user to take (step S440); when placing the reheating zone of the solder paste exceeds a pre- When the time is not used, the solder paste returning box returns the unused solder paste to the frozen storage area via the returning module (step S450); according to the state of use of the solder paste in the solder paste returning box, Providing a solder paste usage information to a server (step S460); providing via the server a manager interface, such that the remote manager can obtain the solder paste usage information corresponding to the solder paste return box via the administrator interface (step S470); providing a production line data receiving interface via the server To receive a production line from the production line, which includes printed circuit board production and solder joints The quantity, the server calculates an estimated amount of solder paste according to the line data (step S480); compares the estimated amount of the solder paste with the solder paste usage information to calculate a solder paste utilization rate (step S490); When the solder paste utilization rate is lower than a predetermined value, the server issues a warning message (step S495).

For details of the implementation of the solder paste management method of the present embodiment, reference may be made to the implementation of the solder paste management system 100 of the first embodiment. After the description of the above embodiments, those skilled in the art should be able to infer the implementation thereof. I will not repeat them here.

In addition, it is to be noted that the coupling relationship between the above elements includes a direct or indirect electrical connection as long as the desired electrical signal transfer function can be achieved, and the invention is not limited. The technical means in the above embodiments may be combined or used alone, and the components may be added, removed, adjusted or replaced according to their functions and design requirements, and the invention is not limited. After the description of the above embodiments, those skilled in the art should be able to deduce the embodiments thereof, and no further details are provided herein.

In summary, the solder paste management system of the present invention can provide solder paste temperature management and usage management, and can provide data analysis and statistics to remote managers, thereby effectively improving the management convenience of solder paste and reducing tin. The cost of using the paste.

Although the embodiments of the present invention have been disclosed as above, the present invention is not limited to the above-described embodiments, and those skilled in the art can make some modifications without departing from the scope of the present invention. The scope of protection of the present invention is therefore defined by the scope of the appended claims.

100‧‧‧ solder paste management system

110‧‧‧ solder paste return box

120‧‧‧Server

130‧‧‧Remote users

201‧‧‧Control unit

202‧‧‧Data Transmission Module

203‧‧‧Data storage module

210‧‧‧ display module

220‧‧‧ time setting mode resistance

230‧‧‧Sense Module

240‧‧‧Access module

241, 242‧‧ ‧ partition

250‧‧‧Return module

260‧‧‧temperature control module

270‧‧‧Temperature Sensing Module

271, 272, 273, 274‧‧ ‧ temperature sensor

280‧‧‧heating module

290‧‧‧ Warning Module

301‧‧‧ solder paste

310‧‧‧Normal temperature zone

311, 312, 313, 314‧‧ ‧ return zone

320‧‧‧Frozen storage area

S410~S495‧‧‧ Flowchart steps

1 is a schematic view of a solder paste management system in accordance with a first embodiment of the present invention.

2 is a schematic view showing the function of a solder paste returning warmer according to a first embodiment of the present invention.

3 is a schematic view of a solder paste reheating box in accordance with a first embodiment of the present invention.

4 is a flow chart of a solder paste management method in accordance with a second embodiment of the present invention.

100‧‧‧ solder paste management system

110‧‧‧ solder paste return box

120‧‧‧Server

130‧‧‧Remote users

Claims (16)

A solder paste management system includes: a solder paste returning thermostat having a plurality of temperature recovery zones and a freezing storage zone for placing solder paste for performing a warming process, the refrigeration storage zone The refrigerating solder paste comprises: a control unit; a time setting module configured to set a temperature recovery time of the regenerative zones, and timing is performed to determine placement in the regenerative zones Whether the solder paste completes the warming process; a sensing module coupled to the control unit for sensing an identification card to determine a user's data; and an access module disposed on the solder paste On the temperature box, according to the user's authority and the timing result of the time setting module, determining whether to release the solder paste in the return temperature zones for the user to access; a returning module is disposed on the tin In the paste returning thermostat, when the solder paste for placing the returning temperature zones is not used for a predetermined period of time, the solder paste returning tank returns the unused solder paste to the frozen storage via the returning module. And a data transmission module coupled to the control unit for transmitting the regenerative zones a quantity of solder paste and information of the user who takes the solder paste; and a server connected to the solder paste return tank via a network for receiving the data transmitted by the data transfer module to obtain the solder paste back A solder paste usage information of the thermostat; wherein the server provides a manager interface, so that a remote manager can obtain the solder paste usage information corresponding to the solder paste return tank via the administrator interface. The solder paste management system according to claim 1, wherein the The solder paste returning box further has a display module for displaying the temperature information of the solder paste in the return temperature zones. The solder paste management system of claim 1, wherein the solder paste return tank further has a temperature control module for controlling the temperature of the temperature return zones. The solder paste management system of claim 1, wherein the solder paste return tank further has a temperature sensing module for sensing the temperature of the return temperature zones and placing the solder paste back. The temperature of the solder paste in the incubator. The solder paste management system of claim 1, wherein the solder paste return tank further has a heating module for adjusting the temperature of the return temperature zones, so that the temperature of the return temperature zones is maintained at In a specific range. The solder paste management system of claim 5, wherein the specific range is 20 to 25 degrees Celsius. The solder paste management system of claim 1, wherein the solder paste reheating box further comprises a data storage unit for storing a user lookup table having a plurality of user data and Corresponding solder paste access authority, the access module determines the user's authority according to the user lookup table to determine whether to release the solder paste in the return temperature zone for the user to access. The solder paste management system of claim 7, wherein the server can remotely control the solder paste return tank to adjust the content of the user lookup table. The solder paste management system of claim 1, wherein the solder paste returning box further comprises a warning module, and when the solder paste for placing the returning temperature zones is not used for the preset time, the The alert module sends a warning message. The solder paste management system of claim 7, wherein the server further provides a production line receiving interface for receiving a product from the production line. Line data, the line data includes a production line data, a printed circuit board output and a number of solder joints, the server calculates a solder paste estimated amount according to the line data, and compares the estimated amount of the solder paste with the The solder paste uses information to calculate a solder paste utilization rate. When the solder paste utilization rate is lower than a preset value, the server sends a warning message. A solder paste management system includes: a plurality of solder paste returning boxes, each of the solder paste returning boxes having a plurality of temperature returning zones and a freezing storage zone, each of the solder paste returning thermostats comprising: a control unit; The setting module is configured to set the temperature recovery time of the temperature return zones, and perform timing to determine whether the solder paste placed in the temperature recovery zones is warmed up; a sensing module coupled to the control The unit is configured to sense an identification card to determine a user's data; a retrieval module is disposed on the solder paste returning box, and is determined according to the user's authority and the timing result of the time setting module. Whether to release the solder paste in the return temperature zone for the user to use; a returning module is disposed on the solder paste returning box, when the solder paste of the returning temperature zone is placed over a preset When the time is not in use, the solder paste return tank returns the unused solder paste to the frozen storage area via the return module; and a data transmission module is coupled to the control unit for transmitting the The amount of solder paste in the temperature return zone and the user's data of the solder paste; and a server These data network is connected to the tank to warm paste, the paste for receiving each transmitted back to the incubator to a monitor corresponding to each of the solder paste used state back to the incubator; The server provides a manager interface, so that a remote administrator can obtain the solder paste usage information corresponding to each of the solder paste return boxes via the administrator interface. The solder paste management system of claim 11, wherein the server further provides a production line receiving interface for receiving a production line data from the production line, wherein the production line includes printed circuit board output and The number of solder joints, the server calculates the estimated amount of solder paste according to the production line data, and compares the estimated amount of the solder paste with the solder paste usage information to calculate a solder paste utilization rate, when the solder paste utilization rate is lower than The server issues a warning message when a preset value is reached. A solder paste management method includes: providing a solder paste returning box for placing solder paste, the solder paste returning box comprising a plurality of temperature returning areas and a freezing storage area, wherein the temperature returning areas are used for placing solder paste To perform a temperature returning process, the frozen storage area is used for refrigerating the solder paste; setting the temperature recovery time of the return temperature zones, and timing to determine whether the solder paste placed in the temperature recovery zones completes the temperature recovery a method for providing a sensing module for identifying a card to determine a user's data; and determining whether to release the solder paste in the warming zone for the user according to the user's authority and timing result When the solder paste for placing the return temperature zones is not used for a predetermined period of time, the solder paste returning tank returns the unused solder paste to the frozen storage area via the returning module; The solder paste in the solder paste returning box provides a solder paste usage information to a server; and provides a manager interface via the server, so that a remote manager can obtain the corresponding interface through the manager interface The solder paste is used to return the solder paste. For example, the solder paste management method described in claim 13 of the patent application scope is further included. Included: providing a production line receiving interface through the server for receiving a production line data from the production line, the production line data includes printed circuit board output and the number of solder joints, and the server is counted according to the production line data. Estimated dosage of a solder paste; compare the estimated amount of the solder paste with the solder paste usage information to calculate a solder paste utilization rate; and when the solder paste utilization rate is lower than a preset value, the server issues a warning message . A solder paste management system comprises: a plurality of solder paste returning boxes, each of the solder paste returning boxes has a plurality of temperature returning zones, each of the solder paste returning thermostats comprising: a control unit, wherein the regenerative thermostat Switched to a rewarming mode and a frozen storage mode; a time setting module for setting the regenerative time of the regenerative zones, and timing to determine whether the solder paste placed in the rewarming zones is The temperature sensing is completed; a sensing module is coupled to the control unit for sensing an identification card to determine a user's data; and an access module is disposed on the solder paste returning box, according to the The user's authority and the timing result of the time setting module determine whether to release the solder paste in the return temperature zone for the user to access; a returning module is disposed on the solder paste returning box, When the solder paste for placing the return temperature zones is not more than a predetermined time, the control unit sets the solder paste returning thermostat to the rewarming mode, and when the solder pastes for placing the regenerative temperature zones exceeds the preset When the time is not used, the solder paste returning box is switched to the frozen storage mode; and a data transmission module Coupled to the control unit, for transmitting the number of the plurality of solder warmed zone data with the user access to the solder paste; and a server connected to the solder paste return tanks via the network for receiving data transmitted by each of the solder paste return tanks to monitor a solder paste usage state corresponding to each of the solder paste return tanks; The server provides a management interface, so that a remote administrator can obtain the solder paste usage information corresponding to each solder paste return box through the administrator interface; wherein the solder paste return box further includes a data a storage unit for storing a user lookup table having a plurality of user profiles and corresponding solder paste access rights, the access module determining the user rights according to the user lookup table To determine whether to release the solder paste in the rewar zone for the user to access. The solder paste management system of claim 15, wherein the server further provides a production line receiving interface for receiving a production line data from the production line, wherein the production line includes printed circuit board output. And the number of solder joints, the server calculates the estimated amount of solder paste according to the production line data, and compares the estimated amount of the solder paste with the solder paste usage information to calculate a solder paste utilization rate, when the solder paste utilization rate is low The server issues a warning message when a preset value is reached.