TW201418507A - Deposition apparatus and method for manufacturing organic light emitting diode display using the same - Google Patents

Abstract

A deposition apparatus includes a deposition source that receives a deposition material, in which the deposition source is divided into a center area and outer areas at opposite ends of the center area, respectively, along a first direction, a plurality of spray nozzles that are arranged in the first direction at one side of the deposition source and that spray the deposition material to a substrate, and a nozzle tip detachably attached to one of the plurality of spray nozzles arranged in one of the outer areas. The nozzle tip has an end cross-section that sprays the deposition material toward an outer direction of the deposition source and has an inclination angle with a surface of the substrate.

Description

Deposition apparatus and method of manufacturing an organic light emitting diode display therewith 【0001】

Among the display devices, the organic light-emitting display has a wide viewing angle, excellent contrast, and high reaction speed, and thus has attracted attention as a next-generation display device.

【0002】

The present invention relates to a deposition apparatus and a method of manufacturing an organic light emitting diode display using the same.

[0003]

Embodiments may be implemented by providing a deposition apparatus including a deposition source for receiving a deposition material; a plurality of ejection nozzles arranged along a first direction on one side of the deposition source and ejecting the deposition material onto the substrate, the deposition source An outer region that is respectively divided into a central region and opposite sides of the central region along the first direction; and a nozzle tip that is formed to be attached or detached to the ejection nozzles arranged in an outer region, and when the nozzle thereof When the tip end section forms an oblique angle with respect to the surface of the substrate, it ejects the deposition material toward the outer side of the deposition source.

[0004]

The midpoint of the substrate in the first direction may be aligned to a midpoint of the deposition source in the first direction, and the central region of the deposition source may have a length along the first direction that satisfies the following conditions:

[0005]

Here, L ₁ is the length of the central region in the first direction, L ₂ is the length of the deposition region of the substrate in the first direction, T is the distance from the substrate to the end of the ejection nozzle, and θ is the inclination angle.

[0006]

The first angle of inclination may be formed to be included in a range from about 43 degrees to about 53 degrees. The first angle of inclination may be formed to be included in a range from about 25 degrees to about 35 degrees with respect to the predetermined angle. The nozzle tip mounted to the spray nozzle can be mounted symmetrically about the midpoint of the deposition source along the first direction.

【0007】

Embodiments can be achieved by providing a method of fabricating an organic light emitting diode (OLED) display, comprising providing a deposition apparatus including a deposition source for receiving a deposition material, and a plurality of spray nozzles arranged in a first direction And spraying the deposition material onto the substrate; placing the substrate to face the ejection nozzle; and facing the substrate through the ejection nozzle when the deposition source moves in a second direction intersecting the first direction The deposited material is ejected. The deposition source is separately divided into a central region and an outer region on opposite sides of the central region in a first direction, and the nozzle tips are formed to be mounted or detached to the ejection nozzles arranged in an outer region, and When the surface of the substrate forms an oblique angle, it has an end section which ejects the deposition material toward the outer side of the deposition source.

[0008]

A point in the substrate along the first direction may be accurately aligned with a midpoint of the deposition source along the first direction, and the central region of the deposition source has a length along the first direction, satisfying the following conditions:

【0009】

Here, L ₁ is the length of the central region along the first direction, L ₂ is the length of the deposition region of the substrate along the first direction, T is the distance from the substrate to the end of the ejection nozzle, and θ is Tilt angle.

[0010]

The angle of inclination of the end section can be formed to encompass a range of from about 43 degrees to about 53 degrees. The angle of inclination of the end section can be formed to be included in the range of from about 25 degrees to about 35 degrees. The nozzle tip mounted to the spray nozzle can be mounted symmetrically about the midpoint of the deposition source along the first direction.

100. . . Sedimentary source

102. . . Central region

104a. . . Outer area

104b. . . Outer area

112. . . Spray nozzle

114a. . . Spray nozzle

114b. . . Spray nozzle

124a. . . Nozzle tip

124b. . . Nozzle tip

130a. . . Nozzle tip

130b. . . Nozzle tip

130c. . . Nozzle tip

130d. . . Nozzle tip

200. . . Substrate fixing unit

210. . . Substrate

220. . . Deposition mask

DM. . . Deposition material

A. . . Spout area

B. . . Spout area

L ₁ . . . Center area length

L ₂ . . . Deposition area length

T. . . distance

M. . . Intersection

N1. . . The outermost position of the deposition area

N2. . . The outermost position of the deposition area

P1. . . The outermost position of the center area

P2. . . The outermost position of the center area

t ₁ . . . distance

t ₂ . . . distance

θ. . . Incident angle

θ'. . . Incident angle

θ"...inclination angle

Φ. . . Tilt angle

λ. . . angle

[0011]

The features of the present invention will become apparent to those of ordinary skill in the art in the <RTIgt;

[0012]

Figure 1 is a perspective view of a deposition apparatus in accordance with an exemplary embodiment.

[0013]

2 and 3 are schematic views showing the distribution of deposition materials ejected by the ejection nozzles of the deposition apparatus according to the exemplary embodiment.

[0014]

4 is a schematic diagram of the correlation between the incident angle of the deposition material incident on the substrate and the position between the ejection nozzles of the deposition apparatus according to an exemplary embodiment.

[0015]

Figure 5 is a schematic illustration of a method of determining a central region and an outer region of a deposition apparatus in accordance with an exemplary embodiment.

[0016]

6A through 6D are exemplary variations of the nozzle tip of the deposition apparatus in accordance with an exemplary embodiment.

[0017]

Hereinafter, a deposition apparatus of an organic light emitting diode (OLED) display and a method of fabricating the same will be described in accordance with an exemplary embodiment and with reference to the accompanying drawings. As will be appreciated by those skilled in the art, the described embodiments may be modified in various different ways without departing from the spirit and scope of the embodiments. Rather, the exemplary embodiments cited herein are provided to provide a thorough and complete disclosure of the invention. Throughout the text, like reference characters indicate similar elements.

[0018]

In addition, the word "comprise" and variations thereof, such as "comprises" or "comprising", are to be understood to include the elements, but do not exclude any other elements. In addition, throughout the specification, the word "on" will be understood to mean above or below the target position, and need not be understood to be above the direction of the gravity position.

[0019]

Figure 1 is a perspective view of a deposition apparatus in accordance with an exemplary embodiment.

[0020]

For convenience of description, although the chambers are not shown in the drawings, all of the constituent elements in Fig. 1 are disposed in the vacuum chamber and appropriately maintain the degree of vacuum in the chamber. The vacuum chamber can have various shapes depending on the shape of the substrate to be processed. For example, where the treated substrate has a circular shape, the integral vacuum chamber may be cylindrical. Where the treated substrate has a rectangular shape, the overall vacuum chamber can be a cube. In addition, a vacuum pump (not shown in the drawing) that can extract the gas inside the vacuum chamber to reduce the pressure inside the vacuum chamber, and inject the gas into the vacuum chamber to increase the pressure inside the vacuum chamber may be further included in the vacuum chamber. Aeration device (not shown in the drawings), and similar devices.

[0021]

The deposition source 100 is for ejecting a deposition material to be deposited on the substrate 210, and includes a storage space (not shown) for storing a deposition material therein, such as an organic material. The storage space of the deposited material may be made of a ceramic material having good heat radiation properties, such as aluminum oxide (Al ₂ O ₃ ) and aluminum nitride, but is not limited thereto, and may have good heat radiation and heat. The impedance is made of various materials. A heater (not shown) configured to contact and surround the outer surface may be provided on the outer surface of the storage space of the deposition material and used to heat and evaporate the deposited deposition material.

[0022]

The deposition source 100 extends in the first direction with a length in the first direction (y-axis direction) of the substrate 210. The deposition source 100 is divided into a central region 102 and outer side regions 104a and 104b on both sides of the central region 102 along the first direction. For example, the outer region 104a, the central region 102, and the outer region 104b may be sequentially arranged along the first direction. The ejection angles of the ejection nozzles 112 of the central region 102 and the ejection nozzles 114a and 114b of the outer regions 104a and 104b may be individually determined to be different from each other, and will be described later.

[0023]

The ejection nozzles 112, 114a, and 114b that eject the deposition material are formed on one side of the deposition source 100 facing the substrate 210. The injection nozzles 112, 114a, and 114b are formed in a circular tubular shape and connected to the internal space of the deposition source 100. Therefore, the deposition material evaporated or sublimated in the internal space of the deposition source 100 is ejected onto the substrate 210 by the ejection nozzles 112, 114a, and 114b.

[0024]

A plurality of spray nozzles 112, 114a, and 114b may be provided and arranged in a line along the deposition source 100 extending along the first direction. The substrate 210 for depositing a material may be formed in a rectangular flat plate shape, and in this case, the plurality of ejection nozzles 112, 114a, and 114b are linearly arranged along the first direction to be parallel to one edge of the substrate 210. As shown in Fig. 1, the ejection nozzles 112, 114a, and 114b may be arranged on a straight line, but are not limited thereto. The spray nozzles 112, 114a, and 114b may be arranged on two or more straight lines.

[0025]

The substrate 210 is fixed by the substrate fixing unit 200 and faces the deposition source 100. Since the substrate fixing unit 200 stably fixes the substrate 210, when the thin layer is formed on the substrate 210 and the substrate 210 is transferred after the process is completed, the substrate fixing unit 200 has a structure that can be easily attached or detached from the substrate 210. The substrate 210 may be fixed to the substrate fixing unit 200 along the deposition mask 220. The deposition mask 220 may be used to form a pattern of the organic layer on the substrate 210 and to form an opening between the shielding portions of the organic material such that the organic material may be deposited on the substrate 210 via the opening. Since the configuration of the substrate fixing unit 200 can be substantially the same as that for the general deposition apparatus, a detailed description thereof will be omitted herein. The center of the substrate 210 along the first direction may be arranged and arranged to correspond to the center of the deposition source 100 along the first direction.

[0026]

When both the deposition source 100 and the substrate 200 are moved relative to each other, deposition can be performed. In the case where the substrate 210 is fixed, the deposition source 100 may move in a second direction (x-axis direction) intersecting the first direction to move the deposition source 100 from the substrate 210 by a predetermined distance. When the deposition source 100 is configured to eject the deposition material in the vertical direction, the substrate 210 may be configured to be parallel to the deposition source 100, and when the deposition source 100 is configured to eject the deposition material in the horizontal direction, the substrate 210 may be configured To be perpendicular to the deposition source 100. In an exemplary embodiment, when the substrate 210 is horizontally disposed in the vacuum chamber, the deposition source 100 is disposed on the bottom surface of the vacuum chamber, however the embodiment is not limited thereto.

[0027]

Spray nozzles 114a and 114b are disposed in each of the outer regions 104a and 104b and include nozzle tips 124a and 124b to individually control the discharge direction of the deposited material. Nozzle tips 124a and 124b are formed to be individually mounted or detached to the spray nozzles 114a and 114b, for example, the nozzle tips 124a and 124b are detachably individually attached to the spray nozzles 114a and 114b. When the nozzle tips 124a and 124b are disposed to form an oblique angle with the surface of the substrate 210 in the first direction, the end section thereof extends toward the outer side of the deposition source 100 to eject the deposition material. For example, the tilt angle may be formed in a plane relative to the surface of the parallel substrate 210.

[0028]

Before explaining the ejection direction of the ejection nozzle, the distribution of the deposition material ejected from the ejection nozzle will be explained.

[0029]

2 and 3 are schematic views showing the distribution of the deposition material of the ejection nozzle of the deposition apparatus according to the exemplary embodiment. The deposition mask 220 in the vicinity of the substrate 210 will be omitted for convenience and clarity of explanation.

[0030]

The deposition material DM is ejected from the ejection nozzles 112, 114a, and 114b into the vacuum, and therefore, as shown in Fig. 2, the deposition material DM is about 0 to 90 degrees with respect to the end sections of the ejection nozzles 112, 114a, and 114b. The angles are distributed in a non-specific direction, that is, all directions of the front side. For example, as shown in FIG. 2, the deposition material DM may be ejected from the ejection nozzle having the end shape of the end section at an angle of about 0 to 90 degrees, without division. For example, the end section can be substantially parallel to the substrate 210 without having an angle of inclination relative to the substrate 210.

[0031]

Therefore, in the formation of the injection nozzles 112, 114a, and 114b, the angles of the end sections of the injection nozzles 112, 114a, and 114b can be considered. If the discharge area ejected by the deposition material DM is divided into the ejection area A and the ejection area B in accordance with the ejection angle and distribution ratio of the deposition material DM, Table 1 is provided as follows.

[0032]

Table 1

[0033]

When the ejection angle increases from 0 degrees, the deposition amount of the deposition material also increases, and when the ejection angle is 90 degrees, the deposition amount is the maximum value. The deposition material is rapidly increased at a discharge angle of about 18 degrees, for example, the amount of deposition material toward the substrate 210 is greater than the ejection angle of less than 18 degrees at an ejection angle of about 18 degrees. The discharge area A has a discharge angle of 0 to 18 degrees with respect to the end cross section of the injection nozzles 112, 114a, and 114b, and the discharge area B has a discharge angle of 18 to 90 degrees.

[0034]

The ratio of the deposition material DM distributed in the ejection area A to the deposition material DM ejected from the ejection nozzles 112, 114a, 114b is 0.054%. In this case, the influence of the deposition material DM having a discharge angle corresponding to the discharge area A is relatively small for the substrate 210.

[0035]

On the other hand, the deposition material DM having the discharge angle corresponding to the discharge area B is mainly deposited on the substrate 210 such that the discharge area B corresponding to the discharge angle of 18 to 90 degrees is defined as the effective discharge area. The effective ejection area is not limited thereto and may vary depending on the kind of the deposition material. The angle of the end cross section of the injection nozzles 112, 114a, and 114b for the substrate 210 is determined by considering the angle λ corresponding to the discharge area A, which will be described later.

[0036]

4 is a schematic diagram illustrating the correlation between the incident angle of the deposition material incident on the substrate and the position of the ejection nozzle in the deposition apparatus according to an exemplary embodiment.

[0037]

When the deposition material is deposited on the substrate 210, the deposition material is incident to form a predetermined angle (θ) (eg, a predetermined minimum angle) to the substrate 210, for example, with reference to the first direction. In this case, the minimum incident angle of the deposited material is determined, for example, the distance between the substrate 210 and the deposition source 100, the size of the substrate 210, and the amount of deposition. For example, the angle of the minimum angle of incidence can be determined to be in the range of about 43 degrees to 53 degrees.

[0038]

When the minimum incident angle of the deposited material is greater than or equal to about 43 degrees, the phenomenon of shadowing of the deposited material between the deposition mask 220 and the substrate 210 can be avoided. When the minimum angle is less than or equal to about 53 degrees, it has a sufficient amount of deposited material to increase and/or maintain deposition efficiency. Unless otherwise stated, the angle of incidence and the angle associated therewith are determined with reference to the first direction.

[0039]

When a region having a deposition material deposited on the substrate 210 with a predetermined thickness is referred to as a deposition region, the deposition region has outermost positions N1 and N2 in the first direction (y-axis direction) as shown in FIG. If the minimum incident angle of the deposited material is referred to as θ, when any line having an inclination angle θ with respect to the minimum incident angle extends at the position N1, any line intersects the deposition source 100 at the position P2. And, similarly to the position N2, when any line having the inclination angle θ extends, the arbitrary line intersects the deposition source 100 at the position P1. The area between the positions P1 and P2 is referred to as the center area 102, and the area determined outside the position P1 and the area determined outside the position P2 are referred to as the outer areas 104a and 104b.

[0040]

The injection nozzle 112 formed in the central region 102 can eject a minimum angle of incidence θ of the deposition material at an incident angle that is greater than or equal to any position of the deposition region between the positions N1 and N2. In other words, the ejection nozzles 114a and 114b formed in the outer regions 104a and 104b are determined to have the incident angles θ' and θ" outside the positions P1 and P2, which are smaller than the preset minimum incident angle θ, as shown in FIG. Shown in .

[0041]

Therefore, the incident angle of the deposition material ejected from the ejection nozzles 114a and 114b disposed in the outer regions 104a and 104b can be controlled. As described above, since the deposition material is ejected in all directions on the side before the end section, as shown in Fig. 3, the inclination angle (Φ) between the end section of the ejection nozzle and the substrate 210 becomes incident on the substrate 210 on the deposition material. Incidence angle (θ). Therefore, the ejection nozzles 114a and 114b provided to the outer regions 104a and 104b are disposed to have an end section toward the outer side of the deposition source 100.

[0042]

For example, when the determined incident angle (θ) is included in the range of about 43 degrees to about 53 degrees, the end section of the ejection nozzle may form an oblique angle (Φ) with the surface of the substrate 210 (eg, parallel to the substrate 210). The plane of the surface is included in the range of about 43 degrees to about 53 degrees. Meanwhile, if an angle (λ) corresponding to 18 degrees of the ejection area A is considered, the inclination angle at which the end section of the ejection nozzle and the surface of the substrate 210 can be formed is included in the range of about 25 to 35 degrees.

[0043]

A method of determining the size of the deposition source 100 of the central region 102 and the outer regions 104a and 104b will now be described. Fig. 5 is a schematic view showing a method of determining a central region and an outer region in a deposition apparatus according to an exemplary embodiment.

[0044]

The substrate 210 and the deposition source 100 are positioned such that a point in the substrate 210 in the first direction and a point in the deposition source 100 in the first direction are aligned. Further, when the length of the central region 102 in the first direction is referred to as L ₁ , the length of the predetermined deposition region of the substrate 210 in the first direction is referred to as L ₂ , the substrate 210, and the end of the ejection nozzle The distance called T, the preset incident angle is called θ, the intersection of the line segment N2P1 and the line segment N1P2 is called M (or may correspond to a line segment extending from the end section of the injection nozzle having the inclination angle (Φ) The distance between the intersection point, the intersection M, and the end of the ejection nozzle is referred to as t ₁ , and the distance between the intersection M and the substrate 210 is referred to as t ₂ , and the relationship therein can be expressed as follows.

[0045]

(Equation 1)

[0046]

Since t ₁ + t ₂ = T, if t ₁ = T - t ₂ and substituted into Equation 1, Equation 2 can be expressed as follows.

[0047]

(Equation 2)

[0048]

Referring to Figure 5, t ₂ can be represented by Equation 13.

[0049]

(Equation 3)

[0050]

If Equation 3 is substituted into Equation 2, Equation 4 can be expressed as follows.

[0051]

(Equation 4)

[0052]

The length L ₁ of the central region 102 in the first direction may be related to a predetermined tilt angle (θ), a distance (T) between the substrate 210 and the ejection nozzles 112, 114a, and 114b, and the substrate 210 The relationship between the deposition zone length L 2 and the equation is expressed.

[0053]

L ₁ corresponding to the remaining portion of the length of the portion, on opposite sides of the central region 102, the deposition source 100 in a first direction into an outer region 104a and individual 104b.

[0054]

6A through 6D are views of nozzle tips of an exemplary variation of a deposition apparatus in accordance with an exemplary embodiment. For example, the nozzle tips in FIGS. 6A to 6D are detachably attached to one of the spray nozzles 114a and 114b. The nozzle tip in Figures 6A-6D can be excluded from the spray nozzle 112, for example, it can comprise an end section that is substantially parallel to the first direction.

[0055]

As shown in FIG. 6A, for the nozzle tip 130a, the end section of the discharge deposition material may have an inclination angle (θ) (relative to the first direction) from the surface of the substrate 210. As shown in FIG. 6B, the nozzle tip 130b can asymmetrically block a portion of the spray nozzle and can have a surface to form a cross section perpendicular to the end. As shown in Fig. 6C, the nozzle tip 130c may surround a portion of the injection hole such that the shape of the end thereof may be asymmetrically formed. For the nozzle tips 130b and 130c shown in FIGS. 6B and 6C, the imaginary line extending in the first direction is in contact with the end point, and the imaginary line may have an oblique angle with the surface of the substrate 210 (θ ). Further, as shown in FIG. 6D, the nozzle tip 130d may have an inclination angle (θ) with the surface of the substrate 210 while reducing the end section in the ejection direction. The nozzle tip is not limited to these embodiments, and even if the shape of the nozzle tip is different, if the angle of the end section of the nozzle tip is inclined in the first direction, the nozzle tip can be changed and realized in various ways.

[0056]

Next, an operation of a deposition apparatus and a method of manufacturing an organic light emitting diode (OLED) display according to an exemplary embodiment will be made with reference to the accompanying drawings.

[0057]

First, the substrate 210 is inserted into a vacuum chamber (not shown), and the substrate 210 is configured to be opposite to the deposition source 100 that ejects the deposition material. At this time, the distance between the deposition source 100 and the substrate 210 controls the preset incident angle (θ) of the deposition material. The substrate 210 can be configured to satisfy Equation 4.

[0058]

The deposition material is ejected by the ejection nozzles 112, 114a, and 114b while the deposition source 100 moves in the second direction (x-axis direction) intersecting the first direction. The ejection nozzles 114a and 114b are arranged in the outer region and eject the deposition material along the first direction at the inclination angle θ as shown in FIG. 5, and the deposition material may be attached to the substrate 210 at an incident angle θ greater than or equal to the inclination angle. .

[0059]

Such a deposition material may be an organic emission layer in an organic light emitting diode (OLED) display, for example, an organic material forming sub-pixel exhibiting R (red), G (green), and B (blue).

[0060]

By summarizing and reviewing, an organic light emitting display can have a structure in which an emissive layer is inserted between an anode and a cathode and recombined with electrons and holes emitted from an anode and a cathode in the light emitting layer to produce a theory of luminescence to achieve color. However, this structure cannot obtain high-efficiency luminescence, and thus an intermediate layer such as an electron injection layer (EIL), an electron transport layer (ETL), a hole transport layer (HTL), and/or a hole injection layer (HIL) can be selectively selected. It is additionally inserted between each electrode and the emission layer.

[0061]

In flat panel displays, such as organic light emitting diode (OLED) displays, vacuum deposition is used to deposit various layers. Therefore, a film is formed on the flat plate by using a material used as an organic material or an electrode by depositing a corresponding material in a vacuum environment. According to the vacuum deposition method, a substrate having a machine film formed thereon is disposed in a vacuum chamber, and a precision metal mask (FMM) having the same pattern as that of the formed film is attached thereto, and is deposited by a deposition source unit The organic material is evaporated or sublimed to be deposited on the substrate.

[0062]

However, when the deposited material is ejected and contacts the substrate, a shadow phenomenon may occur due to the penetration of the organic material between the deposition mask and the substrate.

[0063]

Rather, embodiments are related to a deposition apparatus, and a method of using the same to fabricate an organic light emitting diode display, wherein the angle at which the deposited material is ejected is controlled to reduce the incidence of shadowing and/or to avoid it. Embodiments are related to a deposition apparatus that increases the angle of incidence of a deposited material onto a substrate. Further, the embodiments relate to a method of fabricating an organic light emitting diode (OLED) display, which increases deposition uniformity and deposition efficiency.

[0064]

According to an exemplary embodiment, by increasing an incident angle of the deposition material incident on the substrate, a shadow phenomenon generated by the deposition material interposing between the deposition mask and the substrate can be suppressed, the deposition margin can be reduced, and deposition can be increased. Uniformity and deposition efficiency. Therefore, a high-resolution organic light-emitting diode (OLED) display can be easily realized.

[0065]

Although the present disclosure has been described as illustrative embodiments that are currently considered to be practicable, it is understood that the embodiments are not limited to the illustrative embodiments of the present disclosure, but are instead intended to cover Various modifications and equivalent settings of the spirit and scope of the scope.

100. . . Sedimentary source

102. . . Central region

104a. . . Outer area

104b. . . Outer area

112. . . Spray nozzle

114a. . . Spray nozzle

114b. . . Spray nozzle

124a. . . Nozzle tip

124b. . . Nozzle tip

200. . . Substrate fixing unit

210. . . Substrate

220. . . Deposition mask

Claims (10)

[Item 1] A deposition apparatus comprising:
a deposition source for receiving a deposition material, the deposition source being separately divided into a central region along a first direction and two outer regions on opposite sides of the central region;
a plurality of spray nozzles arranged on one side of the deposition source along the first direction and ejecting the deposition material onto a substrate; and a nozzle tip detachably mounted to the outer region In one of the plurality of spray nozzles, the tip end of the nozzle tip is oriented toward the outside of the deposition source and ejects the deposition material and has an oblique angle with respect to the surface of the substrate. [Item 2] The deposition apparatus of claim 1, wherein:
A point in the substrate in the first direction is aligned with a midpoint of the deposition source in the first direction, and the central region of the deposition source has a length along the first direction that satisfies the following conditions:

Wherein L ₁ is the length of the central region along the first direction, L ₂ is the length of the deposition region of the substrate along the first direction, and T is the end of the substrate to the plurality of ejection nozzles. The distance and the θ system are the inclination angles. [Item 3] The deposition apparatus of claim 1, wherein the tilt angle is formed to be included in a range from about 43 degrees to about 53 degrees. [Item 4] The deposition apparatus of claim 1, wherein the tilt angle is formed to be included in a range of about 25 degrees to about 35 degrees with respect to a predetermined angle. [Item 5] The deposition apparatus of claim 1, wherein the nozzle tip is mounted on one of the plurality of injection nozzles to be symmetric with respect to a midpoint of the deposition source along the first direction. [Item 6] A method of fabricating an organic light emitting diode (OLED) display, the method comprising:
Providing a deposition apparatus including a deposition source for receiving a deposition material, and a plurality of ejection nozzles arranged on a side of the deposition source along a first direction and ejecting the deposition material to On a substrate;
Positioning the substrate to face the plurality of ejection nozzles; and ejecting the deposition material through the plurality of ejection nozzles when moving the deposition source along a second direction intersecting the first direction, wherein:
The deposition source is individually divided into a central region and two outer regions on opposite sides of the central region, and a nozzle tip is detachably mounted to the plurality of jets arranged in one of the outer regions On one of the nozzles, the tip end of the nozzle tip is oriented toward the outside of the deposition source and ejects the deposition material, and it has an inclination angle with respect to one of the surfaces of the substrate. [Item 7] The method of claim 6, wherein:
A point in the substrate in the first direction is aligned with a midpoint of the deposition source in the first direction, and the central region of the deposition source has a length in the first direction that satisfies the following conditions:


Wherein L ₁ is the length of the central region along the first direction, L ₂ is the length of the deposition region of the substrate along the first direction, and T is the end of the substrate to the plurality of ejection nozzles. The distance and the θ system are the inclination angles. [Item 8] The method of claim 6, wherein the tilt angle is formed to be included in a range from about 43 degrees to about 53 degrees. [Item 9] The method of claim 6, wherein the tilt angle is formed to be included in a range from about 25 degrees to about 35 degrees with respect to a predetermined angle. [Item 10] The method of claim 6, wherein the nozzle tip is mounted to one of the plurality of spray nozzles to be symmetric with respect to a midpoint of the deposition source along the first direction.