TW201418127A - Apparatus for transfering substrate - Google Patents
Apparatus for transfering substrate Download PDFInfo
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- TW201418127A TW201418127A TW102135100A TW102135100A TW201418127A TW 201418127 A TW201418127 A TW 201418127A TW 102135100 A TW102135100 A TW 102135100A TW 102135100 A TW102135100 A TW 102135100A TW 201418127 A TW201418127 A TW 201418127A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
- H05K13/021—Loading or unloading of containers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G54/00—Non-mechanical conveyors not otherwise provided for
- B65G54/02—Non-mechanical conveyors not otherwise provided for electrostatic, electric, or magnetic
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16H—GEARING
- F16H49/00—Other gearings
- F16H49/005—Magnetic gearings with physical contact between gears
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
本發明係關於用於移送基材的設備。 The present invention relates to an apparatus for transferring a substrate.
像半導體晶片、印刷電路板及半導體模組之組件對於最終產品賦有重要的功能,組件的可靠性是非常重要的,也因此該等組件在裝運之前須受到嚴格的品質檢測。 Components such as semiconductor wafers, printed circuit boards, and semiconductor modules have important functions for the final product. The reliability of the components is very important, and therefore these components are subject to strict quality inspection before shipment.
同時,不僅半導體晶片及半導體模組,而印刷電路板也越來越多以高密度和在較小的厚度裡卻有更多數量的嵌入式晶片來製造。利用AFVI(自動最終目測)裝備來做高密度半導體晶片、半導體模組及印刷電路板表面的損壞、汙染、凹陷及汙點的外觀審查及偵測。 At the same time, not only semiconductor wafers and semiconductor modules, but also printed circuit boards are increasingly manufactured with a higher density and a smaller number of embedded wafers in a smaller thickness. Use AFVI (Automatic Final Visual Inspection) equipment to visually inspect and detect damage, contamination, dents, and stains on high-density semiconductor wafers, semiconductor modules, and printed circuit board surfaces.
當印刷電路板用AFVI裝備檢測時,使用多種移送設備移送印刷電路板。在該等多種移送設備的一些實例中,以真空墊直接吸附及移送印刷電路板,或以軌道移送印刷電路板。 When the printed circuit board is inspected with AFVI equipment, the printed circuit board is transferred using a variety of transfer equipment. In some examples of such various transfer devices, the printed circuit board is directly adsorbed and transferred by a vacuum pad, or the printed circuit board is transferred in a track.
然而,就使用真空墊做為移送設備而言,如果真空墊被有機物質汙染,則印刷電路板可能也被汙染,並且如果真空墊的吸力電源出了問題,則印刷電路板可能會掉落,而 造成不能修補的產品損壞。 However, in the case of using a vacuum pad as a transfer device, if the vacuum pad is contaminated with organic substances, the printed circuit board may also be contaminated, and if the suction power of the vacuum pad is problematic, the printed circuit board may fall. and Damage to the product that cannot be repaired.
此外,就使用軌道作為移送設備而言,如果印刷電路板沒有被排出,則必須以手動排出該印刷電路板或再做一次,如此有可能會造成印刷電路板表面上的刮痕。 Further, in the case of using the track as the transfer device, if the printed circuit board is not discharged, it is necessary to manually discharge the printed circuit board or do it again, which may cause scratches on the surface of the printed circuit board.
本發明之相關技術在韓國專利公開號10-2008-0113711(用於移送基材之單元及晶粒接著設備之單元;已在2008年12月31日公開)。 The related art of the present invention is disclosed in Korean Patent Publication No. 10-2008-0113711 (unit for transferring a substrate and a die attaching device; disclosed on December 31, 2008).
本發明提供用於移送基材的設備,該設備可最小化印刷電路板的汙染或損壞。 The present invention provides an apparatus for transferring a substrate that minimizes contamination or damage to the printed circuit board.
本發明一方面提供用於移送基材的設備包含:基座;第一移送磁鐵,該第一移送磁鐵安裝於基座上;工作台,該工作台在其頂面接收基材,該基材經配置從基座向上分離,並安裝在基座附近而可前後或上下移動;及第二移送磁鐵,該第二移送磁鐵相對應於第一移送磁鐵之位置安裝於工作台上,並被配置為與第一移送磁鐵相互作用,產生磁力以移動該工作台。 An aspect of the present invention provides an apparatus for transferring a substrate, comprising: a base; a first transfer magnet, the first transfer magnet being mounted on the base; and a work table receiving the substrate on a top surface thereof, the substrate It is configured to be separated upward from the base and installed near the base to move back and forth or up and down; and a second transfer magnet, the second transfer magnet is mounted on the table corresponding to the position of the first transfer magnet, and is configured In order to interact with the first transfer magnet, a magnetic force is generated to move the table.
用於移送基台的設備也可包含位置對準單元,該位置對準單元被配置為調整工作台上之基材之位置,以對準在工作台之頂面接收之基材至參照位置。 The apparatus for transferring the base station can also include a position aligning unit configured to adjust the position of the substrate on the work table to align the substrate received at the top surface of the table to the reference position.
位置對準單元也可包含:調整裝置,該調整裝置可活動地安裝在工作台上,並被配置為提供位置調整之外力給基材;及驅動器,該驅動器被配置為提供移動調整裝置之驅 動力。 The position aligning unit may also include: an adjustment device movably mounted on the table and configured to provide a position adjustment external force to the substrate; and a driver configured to provide a movement adjustment device power.
驅動器可包含一對對準磁鐵,該對對準磁鐵分別安裝於調整裝置及工作台上,並藉由其相互作用產生磁力。 The driver may include a pair of alignment magnets that are respectively mounted on the adjustment device and the table and that generate magnetic forces by their interaction.
該對對準磁鐵至少有一個為電磁鐵。 At least one of the pair of alignment magnets is an electromagnet.
調整裝置可包含:橫向調整裝置,該橫向調整裝置被配置為調整該基材之橫向位置;及縱向調整裝置,該縱向調整裝置被配置為調整該基材之縱向位置。 The adjustment device can include: a lateral adjustment device configured to adjust a lateral position of the substrate; and a longitudinal adjustment device configured to adjust a longitudinal position of the substrate.
用於移送基材的設備也可包含參照架,該參照架安裝在工作台之頂面上,並被配置為提供參照位置,讓基材藉由位置對準單元定位。 The apparatus for transferring the substrate may also include a reference frame mounted on the top surface of the table and configured to provide a reference position for positioning the substrate by the position alignment unit.
參照架可包含:橫向參照架,該橫向參照架被配置為提供基材在橫向上之參照位置;及縱向參照架,該縱向參照架被配置為提供基材在縱向上之參照位置。 The reference frame can include: a lateral reference frame configured to provide a reference position of the substrate in a lateral direction; and a longitudinal reference frame configured to provide a reference position of the substrate in the longitudinal direction.
用於移送基材的設備也可包含吸引裝置,該吸引裝置被配置為提供對吸力空間之吸力。工作台可具有構成在其頂面之複數個吸力孔,以藉由吸力支撐基材,以及工作台可具有在其內部構成之吸力空間,該吸力空間連接於複數個吸力孔。 The apparatus for transferring the substrate may also include a suction device configured to provide suction to the suction space. The table may have a plurality of suction holes formed on a top surface thereof to support the substrate by suction, and the table may have a suction space formed therein, the suction space being connected to the plurality of suction holes.
可提供複數個第二移送磁鐵,且複數個第二移送磁鐵可沿著該工作台底部面之任一側邊界而佈置於一列。可提供複數個第一移送磁鐵,且複數個第一移送磁鐵可佈置於複數個第二移送磁鐵的對側。 A plurality of second transfer magnets may be provided, and the plurality of second transfer magnets may be arranged in a row along either side boundary of the bottom surface of the table. A plurality of first transfer magnets may be provided, and a plurality of first transfer magnets may be disposed on opposite sides of the plurality of second transfer magnets.
第一移送磁鐵及第二移送磁鐵至少有一個為電磁鐵。 At least one of the first transfer magnet and the second transfer magnet is an electromagnet.
10‧‧‧基材 10‧‧‧Substrate
100‧‧‧設備 100‧‧‧ Equipment
110‧‧‧基座 110‧‧‧Base
120‧‧‧第一移送磁鐵 120‧‧‧First transfer magnet
130‧‧‧工作台 130‧‧‧Workbench
132‧‧‧吸力孔 132‧‧‧ suction hole
134‧‧‧吸力空間 134‧‧‧ suction space
140‧‧‧第二移送磁鐵 140‧‧‧Second transfer magnet
150‧‧‧位置對準單元 150‧‧‧ Position Alignment Unit
151‧‧‧調整裝置 151‧‧‧Adjustment device
152‧‧‧橫向調整裝置 152‧‧‧Horizontal adjustment device
153‧‧‧縱向調整裝置 153‧‧‧Longitudinal adjustment device
154‧‧‧驅動器 154‧‧‧ drive
155‧‧‧對準磁鐵 155‧‧‧Aligning magnets
160‧‧‧參照架 160‧‧‧ reference frame
162‧‧‧橫向參照架 162‧‧‧Horizontal reference frame
164‧‧‧縱向參照架 164‧‧‧Vertical reference frame
170‧‧‧吸引裝置 170‧‧‧Attraction device
第1圖係根據本發明的實施例中之用於移送基材的設備。 Figure 1 is an apparatus for transferring a substrate in accordance with an embodiment of the present invention.
第2圖係根據本發明的實施例中之用於移送基材的設備之上視圖。 Figure 2 is a top plan view of an apparatus for transferring a substrate in accordance with an embodiment of the present invention.
第3圖係根據本發明的實施例中之用於移送基材的設備之工作台底面的底視圖。 Figure 3 is a bottom plan view of the underside of the table of the apparatus for transferring substrates in accordance with an embodiment of the present invention.
在下文中,根據本發明的實施例,用於移送基材的設備將參照隨附圖式做詳細描述。在參照隨附圖式來描述本發明時,任何相同或相應的元件將指派到相同的參照標號,且將不會被重複描述。 Hereinafter, an apparatus for transferring a substrate will be described in detail with reference to the accompanying drawings in accordance with an embodiment of the present invention. In the description of the present invention, the same or corresponding elements will be assigned to the same reference numerals, and will not be repeatedly described.
第1圖顯示根據本發明的實施例中之用於移送基材的設備100,及第2圖係根據本發明的實施例中之用於移送基材的設備100之上視圖。此外第3圖係根據本發明的實施例中之用於移送基材的設備100之工作台130底面的底視圖。 1 shows an apparatus 100 for transferring a substrate according to an embodiment of the present invention, and FIG. 2 is a top view of an apparatus 100 for transferring a substrate according to an embodiment of the present invention. Further, Fig. 3 is a bottom view of the bottom surface of the table 130 of the apparatus 100 for transferring a substrate in accordance with an embodiment of the present invention.
如第1圖至第3圖圖示,根據本實施例中之用於移送基材的設備100是可被安裝於例如AFVI(自動最終目測)裝備中,該AFVI裝備需要移送印刷電路板,且包含基座110、第一移送磁鐵120、工作台130、第二移送磁鐵140、位置對準單元150、調整裝置151、驅動器154、參照架160及吸引裝置170。 As illustrated in FIGS. 1 to 3, the apparatus 100 for transferring a substrate according to the present embodiment can be installed in, for example, an AFVI (Automatic Final Visual Inspection) apparatus that needs to transfer a printed circuit board, and The susceptor 110, the first transfer magnet 120, the table 130, the second transfer magnet 140, the alignment unit 150, the adjustment device 151, the driver 154, the reference frame 160, and the suction device 170 are included.
根據本實施例,當基材10被接收到工作台130上時,藉由使用磁力來移送工作台130,而基材10可穩定地移送及可防止任何基材10可能的污染或損壞。 According to the present embodiment, when the substrate 10 is received on the table 130, the table 130 is transferred by using a magnetic force, and the substrate 10 can be stably transferred and any possible contamination or damage of the substrate 10 can be prevented.
在下文中,根據本實施例,用於移送基材之設備100之元件將會參照第1圖至第3圖而做詳細描述。 Hereinafter, according to the present embodiment, elements of the apparatus 100 for transferring a substrate will be described in detail with reference to FIGS. 1 to 3.
基座110係為對應用於移送基材之設備100的緊固單元之元件,如第1圖圖示,該基座110可具有安裝在其上表面之第一移送磁鐵120。 The susceptor 110 is an element corresponding to a fastening unit of the apparatus 100 for transferring a substrate, and as shown in Fig. 1, the susceptor 110 may have a first transfer magnet 120 mounted on an upper surface thereof.
工作台130係為對應用於移送基座之設備100的移動單元之元件,如第1圖圖示,該工作台130經配置從基座110向上分離,並可安裝在基座110附近而可前後或上下移動。 The table 130 is an element corresponding to the mobile unit of the device 100 for transferring the pedestal. As shown in FIG. 1 , the table 130 is configured to be separated upward from the susceptor 110 and can be installed near the susceptor 110. Move back and forth or up and down.
即使沒有圖示,用於移送基座之設備100可具有移動工作台130之引導。舉例來說,用於移送基座之設備100可內建水平引導來引導前後方向的移動,以及垂直引導來引導上下方向的移動。 The device 100 for transferring the pedestal can have guidance of the mobile workbench 130 even if not shown. For example, the apparatus 100 for transferring a pedestal may have built-in horizontal guidance to guide movement in the front-rear direction, and vertical guidance to guide movement in the up-and-down direction.
如第2圖圖示,工作台130在其頂面接收基材10。如第1圖及第2圖圖示,複數個吸力孔132可相對於基材10被接收的位置在一區域中形成,以及連接於複數個吸力孔132的吸力空間134可在工作台130內部形成。 As illustrated in Figure 2, the table 130 receives the substrate 10 on its top surface. As shown in FIGS. 1 and 2, a plurality of suction holes 132 may be formed in a region with respect to a position at which the substrate 10 is received, and a suction space 134 connected to the plurality of suction holes 132 may be inside the table 130. form.
吸力空間134連接於吸引裝置170(像是真空泵),吸入空氣以提供負壓,經由吸力空間134及吸力孔132來提供吸力至基材10。 The suction space 134 is connected to the suction device 170 (such as a vacuum pump), sucks air to provide a negative pressure, and provides suction to the substrate 10 via the suction space 134 and the suction hole 132.
因此,藉由在工作台130裡形成吸力孔132及吸力空間134以及安裝吸引裝置170連結於其上,在工作台130 上接收的基材10可藉由吸引裝置170的吸力穩定地被支撐在工作台130上。 Therefore, the suction hole 132 and the suction space 134 are formed in the table 130 and the mounting suction device 170 is coupled thereto, at the table 130. The substrate 10 received thereon can be stably supported on the table 130 by the suction force of the suction device 170.
如第1圖圖示,第二移送磁鐵140根據第一移送磁鐵120的位置而安裝在工作台130上,以藉由與第一移送磁鐵120互動而產生之磁力(例如引力與斥力)來移動工作台130。 As shown in FIG. 1, the second transfer magnet 140 is mounted on the table 130 according to the position of the first transfer magnet 120 to move by a magnetic force (for example, gravity and repulsive force) generated by interaction with the first transfer magnet 120. Workbench 130.
亦即,第二移送磁鐵140係為與第一移送磁鐵120互動之元件,而與第一移送磁鐵120一起做為用於移送基材之設備100的驅動單元,該第二移送磁鐵140可類似根據弗萊明左手定則來驅動電動馬達的原理,而使工作台130在基座110上做前後方向的移動。 That is, the second transfer magnet 140 is an element that interacts with the first transfer magnet 120, and together with the first transfer magnet 120 serves as a drive unit for the apparatus 100 for transferring the substrate, and the second transfer magnet 140 can be similar. The principle of the electric motor is driven according to Fleming's left-hand rule, and the table 130 is moved in the front-rear direction on the base 110.
電磁鐵的磁特性可根據電流方向和大小而有所改變,在這種情況下,該電磁鐵可用於第一移送磁鐵120。換句話說,第一移送磁鐵120的電磁可根據電流方向的變化而具有極性的變換,或根據電流大小的變化而改變磁場的大小。 The magnetic characteristics of the electromagnet may vary depending on the direction and magnitude of the current, in which case the electromagnet may be used for the first transfer magnet 120. In other words, the electromagnetic force of the first transfer magnet 120 may have a change in polarity depending on a change in the direction of the current, or a change in the magnitude of the magnetic field depending on a change in the magnitude of the current.
如此,由於藉著使用電磁鐵為第一移送磁鐵120,該第一移送磁鐵120的極性方向可被反覆地改變,引力和斥力被反覆地施加到第二移送磁鐵140,該第二移送磁鐵140與第一移送磁鐵120相互作用,由於第一移送磁鐵120的極性改變,也因此具有第二移送磁鐵140安裝於其上的工作台130可以在基座110上做前後方向的移動。 Thus, since the polarity of the first transfer magnet 120 can be reversely changed by using the electromagnet as the first transfer magnet 120, the attractive force and the repulsive force are repeatedly applied to the second transfer magnet 140, and the second transfer magnet 140 In interaction with the first transfer magnet 120, since the polarity of the first transfer magnet 120 is changed, the table 130 having the second transfer magnet 140 mounted thereon can be moved in the front-rear direction on the susceptor 110.
此外,當第一移送磁鐵120與第二移送磁鐵140的極性彼此匹配時,可藉由調整施加於第一移送磁鐵120電流的大小來調整第一移送磁鐵的強度,並可變換藉由第一移送 磁鐵120與第二移送磁鐵140相互作用所產生的磁力大小。結果,具有第二移送磁鐵140安裝於其上的工作台130可以在基座110上做前後方向的移動。 In addition, when the polarities of the first transfer magnet 120 and the second transfer magnet 140 match each other, the intensity of the first transfer magnet can be adjusted by adjusting the magnitude of the current applied to the first transfer magnet 120, and can be converted by the first Transfer The magnitude of the magnetic force generated by the interaction of the magnet 120 and the second transfer magnet 140. As a result, the table 130 having the second transfer magnet 140 mounted thereon can be moved in the front-rear direction on the susceptor 110.
永久磁鐵可被使用於第二移送磁鐵140,並應理解電磁鐵也可用於第二移送磁鐵140。 A permanent magnet can be used for the second transfer magnet 140, and it should be understood that the electromagnet can also be used for the second transfer magnet 140.
如第1圖及第3圖圖示,第一移送磁鐵120及第二移送磁鐵140可分別提供為複數個,且該複數個第二移送磁鐵140可沿著該工作台130底部面之任一側邊界而佈置於一列。此外,第一移送磁鐵120可安裝在基座110之頂面及第二移送磁鐵140的對側。 As shown in FIGS. 1 and 3, the first transfer magnet 120 and the second transfer magnet 140 may be provided in plurality, and the plurality of second transfer magnets 140 may be along any of the bottom faces of the table 130. The side boundaries are arranged in a row. Further, the first transfer magnet 120 may be mounted on the top surface of the susceptor 110 and the opposite side of the second transfer magnet 140.
如第2圖圖示,位置對準單元150可調整基材10在工作台130上的位置,以對準在頂面上接收之基材10至參照位置。 As illustrated in FIG. 2, the alignment unit 150 can adjust the position of the substrate 10 on the table 130 to align the substrate 10 received on the top surface to the reference position.
藉由安裝位置對準單元150於工作台130上,當使用外部裝備開始在工作台130接收基材10時,定位基材10不需要過於精確,再者,基材10在工作台130上對準能夠比藉由外部裝備定位更精確。位置對準單元150可由調整裝置151及驅動器154構成。 By mounting the position aligning unit 150 on the table 130, when the substrate 10 is received at the table 130 using external equipment, the positioning of the substrate 10 need not be too precise. Further, the substrate 10 is on the table 130. It is more accurate than positioning by external equipment. The alignment unit 150 can be composed of an adjustment device 151 and a driver 154.
如第2圖圖示,調整裝置151可活動地安裝在工作台130上以施加外力至基材10以調整位置。亦即,調整裝置151可線性活動地安裝在工作台130之頂面,並可將基材10在調整裝置151的移動方向上重新定位。 As illustrated in Fig. 2, the adjustment device 151 is movably mounted on the table 130 to apply an external force to the substrate 10 to adjust the position. That is, the adjusting device 151 is linearly movably mounted on the top surface of the table 130, and the substrate 10 can be repositioned in the moving direction of the adjusting device 151.
驅動器154可提供驅動力給調整裝置151以做調整裝置151的移動。舉例而言,如第2圖圖示,驅動器154可 由一對對準磁鐵155所構成,該對對準磁鐵155可分別安裝在調整裝置151及工作桌130上,並藉由其相互作用產生一個磁力(引力和斥力)。 The driver 154 can provide a driving force to the adjusting device 151 to perform the movement of the adjusting device 151. For example, as illustrated in FIG. 2, the driver 154 can It is composed of a pair of alignment magnets 155 which are respectively mounted on the adjustment device 151 and the work table 130, and which generate a magnetic force (gravitational force and repulsive force) by their interaction.
在這個情況下,一對對準磁鐵155中至少有一個可為電磁鐵,並如上所述,對準磁鐵155的極性方向或大小可藉由調整提供給對準磁鐵155的電流而變換。因此,調整裝置151可移動工作台130及調整基材10的位置。 In this case, at least one of the pair of alignment magnets 155 may be an electromagnet, and as described above, the polarity direction or magnitude of the alignment magnet 155 may be changed by adjusting the current supplied to the alignment magnet 155. Therefore, the adjusting device 151 can move the table 130 and adjust the position of the substrate 10.
調整裝置151可由橫向調整裝置152及縱向調整裝置153所構成。亦即,如第2圖圖示,橫向調整裝置152可藉由橫向施加外力來使基材10橫向移動,而縱向調整裝置153可藉由縱向施加外力來使基材10縱向移動。 The adjustment device 151 can be constituted by a lateral adjustment device 152 and a longitudinal adjustment device 153. That is, as illustrated in Fig. 2, the lateral adjustment means 152 can laterally move the substrate 10 by applying an external force laterally, and the longitudinal adjustment means 153 can longitudinally move the substrate 10 by applying an external force in the longitudinal direction.
儘管有三個縱向調整裝置153安裝在本實施例中,但是橫向調整裝置152及縱向調整裝置153安裝的數量並不限制本實施例。 Although three longitudinal adjustment devices 153 are installed in the present embodiment, the number of lateral adjustment devices 152 and longitudinal adjustment devices 153 are not limited to the present embodiment.
如第1圖及第2圖圖示,參照架160可安裝在工作台130之頂面,並提供藉由位置對準單元150為基材10定位的參照位置。因此,藉由使用參照架160而預先確定工作台130上之基材10的對準位置,則位置對準單元150不需要為了調整基材10至精確位置而過於精密地控制,而因此基材10可更簡單及更有效率地在正確的位置上接收。 As shown in FIGS. 1 and 2, the reference frame 160 can be mounted on the top surface of the table 130 and provides a reference position for positioning the substrate 10 by the alignment unit 150. Therefore, by predetermining the alignment position of the substrate 10 on the table 130 by using the reference frame 160, the alignment unit 150 does not need to be too precisely controlled in order to adjust the substrate 10 to the precise position, and thus the substrate 10 can be received in the right place more easily and efficiently.
參照架160可由橫向參照架162及縱向參照架164構成,該橫向參照架162提供基材10在橫向上之參照位置,該縱向參照架164提供基材10在縱向上之參照位置。 The reference frame 160 may be comprised of a lateral reference frame 162 and a longitudinal reference frame 164 that provides a reference position of the substrate 10 in the lateral direction, the longitudinal reference frame 164 providing a reference position of the substrate 10 in the longitudinal direction.
藉著使用橫向調整裝置152來橫向移動基材10(朝 第2圖的左方),橫向參照架162作為橫向制動裝置,以避免基材10離開參照點以及更朝橫向移動(即移動到左方)。此外,藉著使用縱向調整裝置153來縱向移動基材10(朝第2圖的下方),縱向參照架164作為縱向制動裝置,以避免基材10離開參照點以及更朝縱向移動(即移動到下方)。 Moving the substrate 10 laterally by using the lateral adjustment device 152 The left side of the second figure), the lateral reference frame 162 acts as a lateral braking device to prevent the substrate 10 from moving away from the reference point and more laterally (i.e., moving to the left). In addition, by using the longitudinal adjustment device 153 to longitudinally move the substrate 10 (toward the lower portion of FIG. 2), the longitudinal reference frame 164 acts as a longitudinal braking device to prevent the substrate 10 from moving away from the reference point and more longitudinally (ie, moving to Below).
儘管已描述本發明的一些實施例,但本領域具有通常知識者應理解本發明可為非常大量的變更及修改,不脫離本發明的技術概念和本發明的範圍都應定義於下列附加之申請專利範圍。 While a few embodiments of the invention have been described, it will be understood by those of ordinary skill in the art that the invention Patent scope.
除了上述之實施例之外,許多其他的實施例也應理解被包含於本發明之申請專利範圍中。 In addition to the above-described embodiments, many other embodiments are also understood to be included in the scope of the present invention.
100‧‧‧設備 100‧‧‧ Equipment
110‧‧‧基座 110‧‧‧Base
120‧‧‧第一移送磁鐵 120‧‧‧First transfer magnet
130‧‧‧工作台 130‧‧‧Workbench
132‧‧‧吸力孔 132‧‧‧ suction hole
134‧‧‧吸力空間 134‧‧‧ suction space
140‧‧‧第二移送磁鐵 140‧‧‧Second transfer magnet
160‧‧‧參照架 160‧‧‧ reference frame
162‧‧‧橫向參照架 162‧‧‧Horizontal reference frame
164‧‧‧縱向參照架 164‧‧‧Vertical reference frame
170‧‧‧吸引裝置 170‧‧‧Attraction device
Claims (11)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020120129518A KR20140065526A (en) | 2012-11-15 | 2012-11-15 | Apparatus for transfering a substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
TW201418127A true TW201418127A (en) | 2014-05-16 |
Family
ID=50892332
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW102135100A TW201418127A (en) | 2012-11-15 | 2013-09-27 | Apparatus for transfering substrate |
Country Status (2)
Country | Link |
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KR (1) | KR20140065526A (en) |
TW (1) | TW201418127A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114684619A (en) * | 2022-04-11 | 2022-07-01 | 江苏贺鸿电子有限公司 | Material moving mechanism for circuit board detection |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR102415588B1 (en) * | 2021-02-25 | 2022-06-30 | 아주대학교산학협력단 | Apparatus for align the plate and system for leveling the plate including the same |
-
2012
- 2012-11-15 KR KR1020120129518A patent/KR20140065526A/en not_active Application Discontinuation
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2013
- 2013-09-27 TW TW102135100A patent/TW201418127A/en unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114684619A (en) * | 2022-04-11 | 2022-07-01 | 江苏贺鸿电子有限公司 | Material moving mechanism for circuit board detection |
CN114684619B (en) * | 2022-04-11 | 2023-09-22 | 江苏贺鸿电子有限公司 | Material moving mechanism for circuit board detection |
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KR20140065526A (en) | 2014-05-30 |
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