TW201416664A - Detecting system for electronic components on circuit board and method thereof - Google Patents

Detecting system for electronic components on circuit board and method thereof Download PDF

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TW201416664A
TW201416664A TW101138405A TW101138405A TW201416664A TW 201416664 A TW201416664 A TW 201416664A TW 101138405 A TW101138405 A TW 101138405A TW 101138405 A TW101138405 A TW 101138405A TW 201416664 A TW201416664 A TW 201416664A
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image
circuit board
standard
area
comparison
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TW101138405A
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Shu-Qing Chen
Yu-Qiang Han
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Inventec Corp
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Abstract

A detecting system for electronic components on circuit board and a method thereof are provided. A standard image with correction points and standard areas is generated. A circuit board image which is being detected is captured. The circuit board image is corrected by the correction points. Match areas of the circuit board image which are being corrected are found by the standard areas of the standard image. The standard areas and the match areas are processed and matched by electronic component types. The processed match area which is not matched with the standard area is then processed to generate a prompt message including standard area and manufacture number of the circuit board. Therefore, the efficiency of improving detection efficiency of electronic component on circuit board may be achieved.

Description

電路板上電子元件的檢測系統及其方法 Detection system and method for electronic components on circuit board

一種檢測系統及其方法,尤其是指一種用於生產線上對電路板上電子元件的檢測系統及其方法。 A detection system and method thereof, and more particularly to a detection system and method for electronic components on a circuit board on a production line.

傳統電路板的檢測方法多採用人力目測方式,其係需要被檢測的電路板經由人力對電路板上的電子元件採用逐一的檢測,亦即當需要被檢測的電路板送進檢測系統中,並藉由檢測系統中的攝像功能擷取電路板上的對位靶標,進而將所取得的對位靶標的影像列印出來或顯示在顯示器上,最後再利用量測工具,以人力方式對所列印出來或顯示出來的靶標影像進行檢測,並根據檢測結果來判斷此待測電路板為良板或瑕疵板。 The detection method of the traditional circuit board mostly adopts the manual visual inspection method, which is to use the detected circuit board to manually detect the electronic components on the circuit board one by one, that is, when the circuit board to be detected is sent into the detection system, and By capturing the alignment target on the circuit board by the camera function in the detection system, the image of the acquired alignment target is printed or displayed on the display, and finally the measurement tool is manually used to manually list the target. The target image printed or displayed is detected, and the circuit board to be tested is judged to be a good board or a seesaw according to the detection result.

使用前述電路板的檢測方式,其不僅作業效率差,同時也難確保檢測的精確度,因此,於檢測電路板程序中,往往因為瑕疵版沒有檢測出來,而造成瑕疵板在後續應用上引發極大的損失。 The detection method of the foregoing circuit board not only has poor working efficiency, but also makes it difficult to ensure the accuracy of detection. Therefore, in the detection circuit board program, the stencil is often not caused by the stencil, and the slab is greatly induced in subsequent applications. Loss.

隨著科技的進步,電路板的檢測系統可以利用馬達的帶動將待測的電路板送入系統中,以及透過彩色顯示器顯示對位靶標的影像,以提供人力的節省。 With the advancement of technology, the detection system of the circuit board can use the motor to drive the circuit board to be tested into the system, and display the image of the alignment target through the color display to provide manpower savings.

然而,前述的檢測方式雖然有改善了傳統人力上面的消耗,但是仍需要藉由人力方式對靶標影像進行檢測,以根據檢測結果判斷此待測電路板為良板或瑕疵板。因此,現今仍無一套對檢測人員而言,有高精度、高速度及自動化、人性化、易操作等兼備功能的電路板檢測方法。 However, although the foregoing detection method improves the consumption of the conventional manpower, it is still necessary to manually detect the target image to determine whether the circuit board to be tested is a good board or a seesaw according to the detection result. Therefore, there is still no set of circuit board detection methods for the inspectors that have high precision, high speed, and automation, humanization, and easy operation.

綜上所述,可知先前技術中長期以來一直存在現有電路板上 電子元件的檢測方式效率低落的問題,因此有必要提出改進的技術手段,來解決此一問題。 In summary, it can be seen that the prior art has existed on existing circuit boards for a long time. The detection method of electronic components is inefficient, so it is necessary to propose improved technical means to solve this problem.

有鑒於先前技術存在現有電路板上電子元件的檢測方式效率低落的問題,本發明遂揭露一種電路板上電子元件的檢測系統及其方法,其中:本發明所揭露的電路板上電子元件的檢測系統,檢測系統是用於生產線中的檢測,其包含:標準圖像模組、影像擷取模組、影像校正模組、影像處理模組、影像比對模組、記錄模組以及提示模組。 In view of the prior art, there is a problem that the detection method of the electronic components on the existing circuit board is inefficient, and the present invention discloses a detection system for an electronic component on a circuit board and a method thereof, wherein: the detection of the electronic components on the circuit board disclosed in the present invention The system is used for detection in a production line, and includes: a standard image module, an image capture module, an image correction module, an image processing module, an image comparison module, a recording module, and a prompt module. .

標準圖像模組是用以預先擷取標準電路板的標準影像,並於標準影像中建立二校正點、建立至少一標準區域以及與標準區域對應的電子元件類型;影像擷取模組是當具有生產序號的電路板藉由生產線進入檢測系統並定位時,影像擷取模組用以擷取電路板影像;影像校正模組是用以於電路板影像找出與標準影像中的校正點對應的特徵點,並依據校正點與特徵點以計算出平移矩陣與旋轉矩陣,以對電路板影像進行校正;影像處理模組是依據標準區域於校正後的電路板影像中找出對應的比對區域,並依據電子元件類型進行標準區域與比對區域指定的影像處理;影像比對模組是將標準區域與比對區域進行指定的影像處理結果,依據電子元件類型選取比對條件對影像處理結果進行比對;記錄模組是當標準區域與比對區域的影像處理結果比對不符時,用以對應記錄標準區域與電路板的生產序號;及提示模組是當記錄模組對應記錄標準區域與電路板的生產序號,提示模組用以生成提示訊息。 The standard image module is used to pre-capture standard images of a standard circuit board, and establish two calibration points in the standard image, establish at least one standard area, and an electronic component type corresponding to the standard area; the image capturing module is The image capture module is used to capture the image of the circuit board when the production line enters the detection system and is positioned by the production line. The image correction module is used to find the correction of the calibration image in the standard image. The feature points are based on the correction points and the feature points to calculate the translation matrix and the rotation matrix to correct the circuit board image; the image processing module finds the corresponding alignment in the corrected circuit board image according to the standard area. The area and the image processing specified by the standard area and the comparison area according to the type of the electronic component; the image comparison module is an image processing result that specifies the standard area and the comparison area, and selects the matching condition according to the type of the electronic component to process the image. The result is compared; the recording module is used when the standard area and the comparison area image processing result are inconsistent Standard production number recording region of the circuit board; and a prompt module when the module corresponding to the recording region of the recording standard production number of the circuit board, suggesting prompt message generating module is used.

本發明所揭露的電路板上電子元件的檢測方法,檢測方法是用於生產線中的檢測,其包含下列步驟:首先,預先擷取標準電路板的標準影像,並於標準影像中建立二校正點、建立至少一標準區域以及與標準區域對應的電子元件類型;接著,當具有生產序號的電路板藉由生產線定位以進行檢測時,擷取電路板影像;接著,於電路板影像找出與標準影像中的校正點對應的特徵點,並依據校正點與特徵點以計算出平移矩陣與旋轉矩陣,以對電路板影像進行校正;接著,依據標準區域於校正後的電路板影像中找出對應的比對區域,並依據電子元件類型進行標準區域與比對區域指定的影像處理;接著,將標準區域與比對區域進行指定的影像處理結果,依據電子元件類型選取比對條件對影像處理結果進行比對;接著,當標準區域與比對區域的影像處理結果比對不符時,用以對應記錄標準區域與電路板的生產序號;最後,當對應記錄標準區域與電路板的生產序號,生成提示訊息。 The method for detecting electronic components on a circuit board disclosed in the present invention is a detection method used in a production line, which comprises the following steps: first, pre-capture standard images of a standard circuit board, and establish two calibration points in the standard image. Establishing at least one standard area and an electronic component type corresponding to the standard area; then, when the circuit board having the production serial number is positioned by the production line for detection, the board image is captured; and then, the board image is found and standard The feature points corresponding to the correction points in the image, and calculating the translation matrix and the rotation matrix according to the correction points and the feature points to correct the circuit board image; and then finding corresponding correspondences in the corrected circuit board image according to the standard area The comparison area, and the image processing specified by the standard area and the comparison area according to the type of the electronic component; then, the image processing result of the standard area and the comparison area is specified, and the comparison condition is selected according to the type of the electronic component. Performing an alignment; then, comparing the image processing results of the standard area and the comparison area When the character, corresponding to the production number for the standard recording area of the circuit board; Finally, when the standard recording area corresponding to the production number of the circuit board, generating a prompt message.

本發明所揭露的系統與方法如上,與先前技術之間的差異在於本發明預先建立具有校正點與標準區域的標準影像,接著,擷取需要被檢測的電路板影像,並依據校正點進行電路板影像的影像校正,即可依據標準區域於校正後的電路板影像中找出對應的比對區域,並依據電子元件類型進行標準區域與比對區域指定的影像處理,將標準區域與比對區域進行指定的影像處理結果,依據電子元件類型選取比對條件對影像處理結果進行比對,當標準區域與比對區域的影像處理結果比對不符時,用以對應記錄標準區域與電路板的生產序號,並當對應記錄標準區域與電路板的生 產序號,生成提示訊息。 The system and method disclosed by the present invention are as above, and the difference from the prior art is that the present invention pre-establishes a standard image having a calibration point and a standard area, and then extracts a board image to be detected, and performs a circuit according to the correction point. The image correction of the board image can find the corresponding comparison area in the corrected circuit board image according to the standard area, and perform image processing specified by the standard area and the comparison area according to the type of the electronic component, and compare the standard area and the comparison area. The area performs the specified image processing result, and compares the image processing results according to the electronic component type selection comparison condition. When the standard area and the comparison area image processing result are inconsistent, the corresponding standard area and the circuit board are correspondingly recorded. Production serial number, and when corresponding to the standard area and board Production serial number, generate a prompt message.

透過上述的技術手段,本發明可以達成電路板上電子元件檢測效率提升的技術功效。 Through the above technical means, the present invention can achieve the technical effect of improving the detection efficiency of electronic components on the circuit board.

以下將配合圖式及實施例來詳細說明本發明的實施方式,藉此對本發明如何應用技術手段來解決技術問題並達成技術功效的實現過程能充分理解並據以實施。 The embodiments of the present invention will be described in detail below with reference to the drawings and embodiments, so that the application of the technical means to solve the technical problems and achieve the technical effects can be fully understood and implemented.

以下首先要說明本發明電路板上電子元件的檢測系統,並請參考「第1圖」所示,「第1圖」繪示為本發明電路板上電子元件的檢測系統方塊圖。 First, the detection system of the electronic component on the circuit board of the present invention will be described first. Please refer to FIG. 1 and FIG. 1 is a block diagram showing the detection system of the electronic component on the circuit board of the present invention.

本發明所揭露的電路板上電子元件的檢測系統,檢測系統是用於生產線中的檢測,其包含:標準圖像模組11、影像擷取模組12、影像校正模組13、影像處理模組14、影像比對模組15、記錄模組16以及提示模組17。 The detection system of the electronic component on the circuit board disclosed in the invention is used for detecting in the production line, and comprises: a standard image module 11, an image capturing module 12, an image correcting module 13, and an image processing module. The group 14, the image matching module 15, the recording module 16, and the prompting module 17.

首先,檢測人員可以先利用檢測系統的標準圖像模組11透過檢測系統的影像擷取裝置擷取標準電路板的標準影像(標準影像是以像素作為計算單位),標準電路板即是經過檢測後所確定標準電路板上的電子元件並無任何的問題,而標準電路板如是主機板、顯示卡、音效卡、擴充卡…等,在此僅為舉例說明之,並不以此侷限本發明的應用範疇。 First, the tester can first use the standard image module 11 of the detection system to capture the standard image of the standard circuit board through the image capture device of the detection system (the standard image is measured in pixels), and the standard circuit board is tested. The electronic components on the standard circuit board are determined to have no problem, and the standard circuit boards, such as the motherboard, the display card, the sound card, the expansion card, etc., are merely illustrative here, and the invention is not limited thereto. The scope of application.

在標準圖像模組11擷取到標準電路板的標準影像之後,即可於標準影像中建立二校正點(即是建立校正點的像素座標),校正點例如是螺絲孔、標準電路板的頂點…等,在此僅為舉例說明之,並不以此侷限本發明的應用範疇,而校正點是用以提供後續檢測 時,將被擷取的電路板影像進行校正之用。 After the standard image module 11 captures the standard image of the standard circuit board, two calibration points (ie, pixel coordinates for establishing the calibration point) can be established in the standard image, and the calibration points are, for example, screw holes and standard circuit boards. The vertices, etc., are merely illustrative here, and are not intended to limit the scope of application of the present invention, and the correction points are used to provide subsequent detection. When the board image captured is used for correction.

在標準圖像模組11擷取到標準電路板的標準影像之後,亦可於標準影像中建立至少一標準區域(即是建立標準區域的像素座標)以及與標準區域對應的電子元件類型,標準區域亦即包含有需要檢測電子元件的區域,而電子元件類型例如是電容、插槽、散熱元件、晶片、處理器…等,在此僅為舉例說明之,並不以此侷限本發明的應用範疇。 After the standard image module 11 captures the standard image of the standard circuit board, at least one standard area (ie, the pixel coordinates of the standard area) and the electronic component type corresponding to the standard area may be established in the standard image. The area also contains the area where the electronic component needs to be detected, and the electronic component type is, for example, a capacitor, a socket, a heat dissipating component, a chip, a processor, etc., which are merely exemplified herein, and are not intended to limit the application of the present invention. category.

接著,需要被檢測具有生產序號的電路板是被放置於生產線上,生產線即類似輸送裝置一般,會帶動放置於生產線上的電路板而移動,並當電路板由生產線的帶動進入到檢測系統並定位(藉以避免影像擷取模組12在擷取電路板影像時擷取到不完整電路板)時,檢測系統的影像擷取模組12即可透過檢測系統的影像擷取裝置擷取電路板影像(電路板影像亦是以像素作為計算單位),而上述的電路板例如是主機板、顯示卡、音效卡、擴充卡…等,在此僅為舉例說明之,並不以此侷限本發明的應用範疇。 Then, the circuit board that needs to be detected with the production serial number is placed on the production line, and the production line is similar to the conveying device, which will drive the circuit board placed on the production line to move, and when the circuit board is driven by the production line, the detection system is The image capturing module 12 of the detecting system can capture the circuit board through the image capturing device of the detecting system when the image capturing module 12 captures the incomplete circuit board when capturing the image of the circuit board. The image (the board image is also in units of pixels), and the above-mentioned circuit board is, for example, a motherboard, a display card, a sound card, an expansion card, etc., which are merely illustrative, and are not intended to limit the present invention. The scope of application.

接著,雖然說電路板會在生產線上進行定位,但電路板仍然可能會產生小幅度的偏移或是旋轉,而影像擷取模組12所擷取到的電路板影像將會與標準影像產生誤差,而電路板影像將會與標準影像所產生誤差即可能會造成檢測上的錯誤,故需要再由影像校正模組13進行電路板影像的校正。 Then, although the board will be positioned on the production line, the board may still be slightly offset or rotated, and the board image captured by the image capturing module 12 will be generated with the standard image. The error, and the error caused by the board image and the standard image may cause a detection error, so the image correction module 13 needs to perform the correction of the board image.

影像校正模組13即可於電路板影像找出與標準影像中的校正點對應的特徵點(亦即螺絲孔、電路板的頂點…等,在此僅為舉例說明之,並不以此侷限本發明的應用範疇),特徵點是依據校正點的像素座標於電路板影像中該像素座標的一定範圍內進行搜 尋,以找出與校正點特徵相似的特徵點,而找出的特徵點即可找出在電路板影像的像素座標,並依據校正點與特徵點以計算出平移矩陣與旋轉矩陣,請參考現有的影像校正技術,而透過二校正點進行影像校正的技術應包含於本發明的內容,本發明在此不再進行贅述,而當影像校正模組13計算出平移矩陣與旋轉矩陣之後,即可將電路板影像校正還原與標準影像近似,以減少電路板影像將會與標準影像所產生的誤差。 The image correcting module 13 can find the feature points corresponding to the correction points in the standard image on the board image (that is, the screw holes, the vertices of the circuit board, etc., which are merely exemplified herein, and are not limited thereto. The application scope of the present invention is characterized in that the pixel coordinates of the calibration point are searched within a certain range of the pixel coordinates in the image of the circuit board. Find to find the feature points similar to the correction point feature, and find the feature points to find the pixel coordinates of the board image, and calculate the translation matrix and rotation matrix according to the correction points and feature points, please refer to The existing image correction technology, and the technique of performing image correction through the two correction points should be included in the content of the present invention. The present invention will not be described herein again, and after the image correction module 13 calculates the translation matrix and the rotation matrix, The board image correction can be approximated to the standard image to reduce the error that the board image will produce with the standard image.

接著,影像處理模組14是依據標準區域於校正後的電路板影像中找出對應的比對區域,並依據電子元件類型進行標準區域與比對區域指定的影像處理,上述的影像處理可包含灰階處理、空間濾波、頻率濾波、圖像復原、圖像色彩分析、小波處理、形態處理、圖像分割以及圖像定量分析。 Then, the image processing module 14 finds a corresponding comparison area in the corrected circuit board image according to the standard area, and performs image processing specified by the standard area and the comparison area according to the electronic component type, and the image processing may include Grayscale processing, spatial filtering, frequency filtering, image restoration, image color analysis, wavelet processing, morphological processing, image segmentation, and image quantitative analysis.

具體而言,假設標準區域與比對區域所被指定的電子元件類型為“電容”,則影像處理模組14即可選擇灰階處理以及圖像色彩分析,藉以於標準區域與比對區域中找出電子元件的外型輪廓以及在電子元件的外型輪廓內的圖像色彩分佈,在此僅為舉例說明之,並不以此侷限本發明的應用範疇。 Specifically, if the electronic component type specified by the standard area and the comparison area is “capacitance”, the image processing module 14 can select gray scale processing and image color analysis, thereby being used in the standard area and the comparison area. Finding the outline of the electronic component and the color distribution of the image within the outline of the electronic component are merely illustrative and are not intended to limit the scope of application of the present invention.

而在影像處理模組14分別於標準區域與比對區域中依據電子元件類型進行指定的影像處理之後,影像比對模組15即可再依據電子元件類型選取比對條件,以對標準區域與比對區域進行指定的影像處理結果比對,而上述的比對條件可包含電子元件的輪廓、電子元件的幾何條件(例如是半徑、長度…等)以及電子元件的顏色配置,在此僅為舉例說明之,並不以此侷限本發明的應用範疇。 After the image processing module 14 performs image processing according to the type of the electronic component in the standard area and the comparison area, the image comparison module 15 can select the comparison condition according to the type of the electronic component to match the standard area. The alignment area is compared with the specified image processing result, and the above alignment conditions may include the outline of the electronic component, the geometric condition of the electronic component (for example, radius, length, etc.) and the color configuration of the electronic component, only By way of example, it is not intended to limit the scope of application of the invention.

影像比對模組15中會預先設定誤差值(是由系統預先設定之),當對標準區域與比對區域進行指定的影像處理結果比對結果未超出誤差值時,則標準區域與比對區域進行指定的影像處理結果比對結果即是相符,當對標準區域與比對區域進行指定的影像處理結果比對結果超出誤差值時,則標準區域與比對區域進行指定的影像處理結果比對結果即是不相符。 The image comparison module 15 presets an error value (pre-set by the system). When the comparison result of the image processing result specified by the standard area and the comparison area does not exceed the error value, the standard area and the comparison are performed. The comparison result of the specified image processing result in the area is consistent. When the comparison result of the image processing result specified by the standard area and the comparison area exceeds the error value, the standard area and the comparison area perform the specified image processing result. The result is not consistent.

接著,記錄模組16即可在影像比對模組15對標準區域與比對區域的影像處理結果比對不符時,用以對應記錄標準區域與電路板的生產序號,藉此可以知道特定電路板(透過生產序號)的特定電子元件(透過比對區域)出現錯誤,電子元件所出現的錯誤例如是沒有電子元件、使用錯誤的電子元件、電子元件裝設方向錯誤…等,在此僅為舉例說明之,並不以此侷限本發明的應用範疇。 Then, the recording module 16 can be used to record the standard area and the production serial number of the circuit board when the image comparison module 15 does not match the image processing result of the standard area and the comparison area, thereby knowing the specific circuit. The specific electronic component of the board (through the serial number of the production) has an error. The errors that occur in the electronic component are, for example, no electronic components, incorrect electronic components, incorrect orientation of the electronic components, etc. By way of example, it is not intended to limit the scope of application of the invention.

而在記錄模組16對應記錄標準區域與電路板的生產序號時,提示模組17即可同時生成提示訊息,其中提示訊息包含比對區域與電路板的生產序號,檢測人員即可透過數據中心即時的數據監控狀態以及收到檢測系統所生成的提示訊息,藉此可快速的得知電路板上電子元件發生錯誤情況,即可快速的對電路板上的電子元件進行檢測的效果。 When the recording module 16 records the standard area and the production serial number of the circuit board, the prompting module 17 can simultaneously generate a prompt message, wherein the prompt message includes the comparison area and the production serial number of the circuit board, and the detecting personnel can pass through the data center. The instant data monitoring status and the prompt message generated by the detection system can quickly detect the error of the electronic components on the circuit board, and can quickly detect the electronic components on the circuit board.

接著,以下將以一個實施例來解說本發明的運作方式及流程,以下的實施例說明將同步配合「第1圖」以及「第2圖」所示進行說明,「第2圖」繪示為本發明電路板上電子元件的檢測方法流程圖。 Next, the operation mode and flow of the present invention will be described below by way of an embodiment. The following embodiments will be described with reference to "first figure" and "second figure", and "second figure" is shown as A flow chart of a method for detecting electronic components on a circuit board of the present invention.

請同時參考「第3圖」以及「第4圖」所示,「第3圖」繪示 為本發明電路板上電子元件的檢測系統架構示意圖;「第4圖」繪示為本發明電路板上電子元件檢測的標準影像示意圖。 Please also refer to "Figure 3" and "Figure 4", "Figure 3" The schematic diagram of the architecture of the detection system of the electronic components on the circuit board of the present invention; FIG. 4 is a schematic diagram showing the standard image of the electronic component detection on the circuit board of the present invention.

檢測人員可以先利用檢測系統的標準圖像模組11透過檢測系統的影像擷取裝置18擷取標準電路板的標準影像21(標準影像21是以像素作為計算單位),標準電路板即是經過檢測後所確定標準電路板上的電子元件並無任何的問題。 The tester can first use the standard image module 11 of the detection system to capture the standard image 21 of the standard circuit board through the image capturing device 18 of the detection system (the standard image 21 is a pixel as a calculation unit), and the standard circuit board passes through There are no problems with the electronic components on the standard board determined after the test.

在標準圖像模組11擷取到標準電路板的標準影像21之後,即可於標準影像21中建立第一校正點22以及第二校正點23(即是建立第一校正點22以及第二校正點23的像素座標),而校正點是用以提供後續檢測時,將被擷取的電路板影像21進行校正之用(步驟110)。 After the standard image module 11 captures the standard image 21 of the standard circuit board, the first correction point 22 and the second correction point 23 can be established in the standard image 21 (ie, the first correction point 22 and the second are established). The pixel coordinates of the correction point 23 are used, and the correction point is used to correct the captured circuit board image 21 for subsequent detection (step 110).

在標準圖像模組11擷取到標準電路板的標準影像21之後,亦可於標準影像21中建立標準區域24(即是建立標準區域24的像素座標),而與標準區域24對應的電子元件類型,以實施例來說此處的電子元件類型為“電容”(步驟110),電子元件類型為“電容”在此僅為舉例說明之,並不以此侷限本發明的應用範疇,電子元件類型亦可為“電阻”、“開關”…等。 After the standard image module 11 captures the standard image 21 of the standard circuit board, the standard area 24 can be established in the standard image 21 (that is, the pixel coordinates of the standard area 24 are established), and the electronic corresponding to the standard area 24 The component type, in the embodiment, the electronic component type here is “capacitance” (step 110), and the electronic component type “capacitance” is merely exemplified herein, and is not limited to the application scope of the invention. The component type can also be "resistance", "switch", etc.

接著,請同時參考「第3圖」至「第5A圖」所示,「第5A圖」繪示為本發明電路板上電子元件檢測的電路板影像示意圖。 Next, please refer to "Figure 3" to "5A", and "5A" is a schematic diagram of the circuit board image of the electronic component detection on the circuit board of the present invention.

需要被檢測具有生產序號為“AB00543”的電路板31是被放置於生產線41上,而生產線41即類似輸送裝置一般,會帶動放置於生產線41上的電路板31而向左移動,並當電路板31由生產線41的帶動進入到檢測系統並定位(藉以避免影像擷取模組12在擷取電路板影像32時擷取到不完整電路板31)時,檢測系統的 影像擷取模組12即可透過檢測系統的影像擷取裝置18擷取電路板影像32(電路板影像32亦是以像素作為計算單位)(步驟120)。 The circuit board 31 to be detected having the production serial number "AB00543" is placed on the production line 41, and the production line 41, which is similar to the conveying device, drives the circuit board 31 placed on the production line 41 to move to the left, and when the circuit The board 31 is driven by the production line 41 into the detection system and positioned (to avoid the image capture module 12 capturing the incomplete circuit board 31 when capturing the board image 32), the detection system The image capture module 12 can capture the circuit board image 32 through the image capture device 18 of the detection system (the circuit board image 32 is also in pixels) (step 120).

接著,雖然說電路板31會在生產線41上進行定位,但電路板31仍然可能會產生小幅度的偏移或是旋轉,而影像擷取模組12所擷取到的電路板影像32將會與標準影像21產生誤差,而電路板影像32將會與標準影像21所產生誤差即可能會造成檢測上的錯誤,故需要再由影像校正模組13進行電路板影像32的校正。 Then, although the circuit board 31 is positioned on the production line 41, the circuit board 31 may still be slightly offset or rotated, and the circuit board image 32 captured by the image capturing module 12 will An error occurs with the standard image 21, and the error caused by the board image 32 and the standard image 21 may cause a detection error, so the image correction module 13 needs to perform the correction of the board image 32.

影像校正模組13即可於電路板影像32找出與標準影像21中的第一校正點22以及第二校正點23對應的第一特徵點33以及第一特徵點34,第一特徵點33以及第一特徵點34是分別依據第一校正點22以及第二校正點23的像素座標於電路板影像32中該像素座標的一定範圍內進行搜尋,以找出與第一校正點22以及第二校正點23特徵相似的第一特徵點33以及第一特徵點34,而找出的第一特徵點33以及第一特徵點34即可找出在電路板影像32的像素座標。 The image correcting module 13 can find the first feature point 33 corresponding to the first correction point 22 and the second correction point 23 in the standard image 21 and the first feature point 34 on the board image 32, and the first feature point 33 And the first feature point 34 searches for a certain range of the pixel coordinates in the circuit board image 32 according to the pixel coordinates of the first correction point 22 and the second correction point 23, respectively, to find the first correction point 22 and the first The first feature point 33 and the first feature point 34 having similar features are corrected by the second correction point 23, and the first feature point 33 and the first feature point 34 are found to find the pixel coordinates of the board image 32.

接著,即可依據第一校正點22以及第二校正點23與第一特徵點33以及第一特徵點34以計算出平移矩陣與旋轉矩陣,請參考現有的影像校正技術,而透過二校正點進行影像校正的技術應包含於本發明的內容,本發明在此不再進行贅述,而當影像校正模組13計算出平移矩陣與旋轉矩陣之後,即可將電路板影像32校正還原與標準影像21近似,以減少電路板影像32將會與標準影像21所產生的誤差(步驟130),在「第5A圖」中是以較為誇張的方式繪示出電路板影像32與標準影像21的誤差,事實上電路板影像32與標準影像21的誤差並不會像「第5A圖」中的差距, 在此僅為示意說明,並不以此侷限本發明的應用範疇。 Then, the translation matrix and the rotation matrix can be calculated according to the first calibration point 22 and the second calibration point 23, and the first feature point 33 and the first feature point 34. Please refer to the existing image correction technology and pass the second correction point. The technique for performing image correction should be included in the content of the present invention, and the present invention will not be described again herein. After the image correcting module 13 calculates the translation matrix and the rotation matrix, the circuit board image 32 can be corrected and restored to the standard image. 21 approximation to reduce the error that the board image 32 will produce with the standard image 21 (step 130). In "5A", the error of the board image 32 and the standard image 21 is shown in a more exaggerated manner. In fact, the error between the board image 32 and the standard image 21 is not like the gap in "5A". This is for illustrative purposes only and is not intended to limit the scope of application of the invention.

接著,請同時參考「第3圖」、「第4圖」以及「第5B圖」所示,「第5B圖」繪示為本發明電路板上電子元件檢測的電路板影像校正結果示意圖。 Next, please refer to "3", "4th" and "5B", and "5B" is a schematic diagram of the circuit board image correction result of the electronic component detection on the circuit board of the present invention.

假設依據平移矩陣與旋轉矩陣所校正還原的電路板影像32結果如「第5B圖」所示,先計算出第一校正點22至第二校正點23的距離A,再計算出第一特徵點33至第一特徵點34的距離B。 It is assumed that the result of the board image 32 corrected by the translation matrix and the rotation matrix is as shown in "5B", and the distance A of the first correction point 22 to the second correction point 23 is first calculated, and then the first feature point is calculated. 33 to the distance B of the first feature point 34.

當距離A與距離B之間的誤差未超過預設值時,則認定電路板31及/或影像擷取裝置18之間並無發生相對位移的情況,即可進行後續的檢測。 When the error between the distance A and the distance B does not exceed the preset value, it is determined that there is no relative displacement between the circuit board 31 and/or the image capturing device 18, and subsequent detection can be performed.

而當距離A與距離B之問的誤差超過預設值時,則認定電路板31及/或影像擷取裝置18之間並發生相對位移的情況,則需要提出錯誤警告,而當提出錯誤警告時,即會停止後續檢測,以避免後續對電路板31檢測全部出現錯誤的情況。 When the error between the distance A and the distance B exceeds a preset value, it is determined that a relative displacement occurs between the circuit board 31 and/or the image capturing device 18, and an error warning is required, and an error warning is issued. At the same time, subsequent detection is stopped to avoid subsequent detection of all occurrences of errors on the board 31.

而在「第5B圖」圖式中即為距離A與距離B之間的誤差超過預設值,即會發出錯誤警告並停止後續檢測。 In the "Fig. 5B" diagram, the error between the distance A and the distance B exceeds the preset value, and an error warning is issued and the subsequent detection is stopped.

接著,請同時參考「第6A圖」以及「第6B圖」所示,「第6A圖」繪示為本發明電路板上電子元件檢測的標準區域影像處理結果示意圖;「第6B圖」繪示為本發明電路板上電子元件檢測的比對區域影像處理結果示意圖。 Next, please refer to "6A" and "6B", and "6A" is a schematic diagram of the standard area image processing result of electronic component detection on the circuit board of the present invention; "Fig. 6B" The schematic diagram of the image processing result of the comparison area of the electronic component detection on the circuit board of the present invention.

影像處理模組14是依據標準區域24於校正後的電路板影像32中找出對應的比對區域35。 The image processing module 14 finds the corresponding alignment area 35 in the corrected circuit board image 32 according to the standard area 24.

接著,由於標準區域24對應的電子元件類型為“電容”,影像處理模組14即可選擇灰階處理以及圖像色彩分析對標準區域 24與比對區域35進行影像處理(步驟140),標準區域24與比對區域35影像處理結果請參考「第6A圖」以及「第6B圖」所示,即可分別於標準區域24與比對區域35找出電子元件的外型輪廓以及在電子元件的外型輪廓內的圖像色彩分佈。 Then, since the electronic component type corresponding to the standard area 24 is “capacitance”, the image processing module 14 can select gray scale processing and image color analysis on the standard area. 24 and the comparison area 35 for image processing (step 140), the standard area 24 and the comparison area 35 image processing results, please refer to "6A map" and "6B map", respectively, can be in the standard area 24 and the ratio The contour of the electronic component and the color distribution of the image within the contour of the electronic component are found for region 35.

接著,影像比對模組15即可再依據電子元件類型為“電容”選取比對條件為“電子元件的幾何條件”以及“電子元件的顏色配置”,以標準區域24與比對區域35進行指定的影像處理結果比對(步驟150),以實施例來說標準區域24與比對區域35的比對結果是相符合的。 Then, the image matching module 15 can select the matching condition according to the electronic component type as “capacitance” as “the geometric condition of the electronic component” and “the color configuration of the electronic component”, and perform the standard region 24 and the comparison region 35. The specified image processing result alignment (step 150), in the embodiment, the alignment of the standard area 24 with the comparison area 35 is consistent.

接著,記錄模組16即可在影像比對模組15對標準區域24與比對區域35的影像處理結果比對不符時,用以對應記錄標準區域24與電路板的生產序號為“AB00543”(步驟160),藉此可以知道特定電路板(透過生產序號為“AB00543”)的特定電子元件(透過標準區域24或是比對區域35)出現錯誤。 Then, the recording module 16 can be used to correspond to the recording standard area 24 and the production serial number of the circuit board as "AB00543" when the image matching module 15 does not match the image processing result of the standard area 24 and the comparison area 35. (Step 160), whereby an error occurs in a particular electronic component (through the standard area 24 or the alignment area 35) of a particular circuit board (through the production number "AB00543").

而在記錄模組16對應記錄標準區域24與電路板的生產序號為“AB00543”時,提示模組17即可同時生成提示訊息(步驟170),其中提示訊息包含標準區域24與電路板31的生產序號為“AB00543”,檢測人員即可透過數據中心即時的數據監控狀態以及收到檢測系統所生成的提示訊息,藉此可快速的得知電路板31上電子元件發生錯誤情況,即可快速的對電路板31上的電子元件進行檢測的效果。 When the recording module 16 corresponds to the recording standard area 24 and the production serial number of the circuit board is "AB00543", the prompting module 17 can simultaneously generate a prompt message (step 170), wherein the prompt message includes the standard area 24 and the circuit board 31. The production serial number is “AB00543”, and the tester can quickly monitor the electronic components on the circuit board 31 by using the data center to monitor the status and receive the prompt information generated by the detection system. The effect of detecting electronic components on the circuit board 31.

綜上所述,可知本發明與先前技術之間的差異在於本發明預先建立具有校正點與標準區域的標準影像,接著,擷取需要被檢測的電路板影像,並依據校正點進行電路板影像的影像校正,即 可依據標準區域於校正後的電路板影像中找出對應的比對區域,並依據電子元件類型進行標準區域與比對區域指定的影像處理,將標準區域與比對區域進行指定的影像處理結果,依據電子元件類型選取比對條件對影像處理結果進行比對,當標準區域與比對區域的影像處理結果比對不符時,用以對應記錄標準區域與電路板的生產序號,並當對應記錄標準區域與電路板的生產序號,生成提示訊息。 In summary, it can be seen that the difference between the present invention and the prior art is that the present invention pre-establishes a standard image having a calibration point and a standard area, and then extracts a board image to be detected, and performs a board image according to the correction point. Image correction, ie According to the standard area, the corresponding comparison area is found in the corrected circuit board image, and the image processing specified by the standard area and the comparison area is performed according to the type of the electronic component, and the image processing result of the standard area and the comparison area is specified. According to the electronic component type, the comparison condition is used to compare the image processing results. When the standard area and the comparison area image processing result are inconsistent, the corresponding serial number of the standard area and the circuit board is recorded, and the corresponding record is recorded. The standard area and the production serial number of the board generate a prompt message.

藉由此一技術手段可以來解決先前技術所存在現有電路板上電子元件的檢測方式效率低落的問題,進而達成電路板上電子元件檢測效率提升的技術功效。 The technical method can solve the problem that the detection method of the electronic components on the existing circuit board in the prior art has low efficiency, thereby achieving the technical effect of improving the detection efficiency of the electronic components on the circuit board.

雖然本發明所揭露的實施方式如上,惟所述的內容並非用以直接限定本發明的專利保護範圍。任何本發明所屬技術領域中具有通常知識者,在不脫離本發明所揭露的精神和範圍的前提下,可以在實施的形式上及細節上作些許的更動。本發明的專利保護範圍,仍須以所附的申請專利範圍所界定者為準。 While the embodiments of the present invention have been described above, the above description is not intended to limit the scope of the invention. Any changes in the form and details of the embodiments may be made without departing from the spirit and scope of the invention. The scope of the invention is to be determined by the scope of the appended claims.

11‧‧‧標準圖像模組 11‧‧‧Standard Image Module

12‧‧‧影像擷取模組 12‧‧‧Image capture module

13‧‧‧影像校正模組 13‧‧‧Image Correction Module

14‧‧‧影像處理模組 14‧‧‧Image Processing Module

15‧‧‧影像比對模組 15‧‧‧Image comparison module

16‧‧‧記錄模組 16‧‧‧recording module

17‧‧‧提示模組 17‧‧‧Tips module

18‧‧‧影像擷取裝置 18‧‧‧Image capture device

21‧‧‧標準影像 21‧‧‧Standard imagery

22‧‧‧第一校正點 22‧‧‧First calibration point

23‧‧‧第二校正點 23‧‧‧Second correction point

24‧‧‧標準區域 24‧‧‧Standard area

31‧‧‧電路板 31‧‧‧ boards

32‧‧‧電路板影像 32‧‧‧Board image

33‧‧‧第一特徵點 33‧‧‧ first feature point

34‧‧‧第二特徵點 34‧‧‧Second feature points

35‧‧‧比對區域 35‧‧‧ comparison area

41‧‧‧生產線 41‧‧‧Production line

步驟110‧‧‧預先擷取標準電路板的標準影像,並於標準影像中 建立二校正點、建立至少一標準區域以及與標準區域對應的電子元件類型 Step 110‧‧‧ Pre-capture standard images of standard boards and in standard images Establishing two calibration points, establishing at least one standard area, and electronic component types corresponding to the standard area

步驟120‧‧‧當具有生產序號的電路板藉由生產線定位以進行檢測時,擷取電路板影像 Step 120‧‧‧ Capture the board image when the board with the production serial number is positioned by the production line for inspection

步驟130‧‧‧於電路板影像找出與標準影像中的校正點對應的特徵點,並依據校正點與特徵點以計算出平移矩陣與旋轉矩陣,以對電路板影像進行校正 Step 130‧‧‧ Find the feature points corresponding to the correction points in the standard image on the board image, and calculate the translation matrix and the rotation matrix according to the correction points and the feature points to correct the board image

步驟140‧‧‧依據標準區域於校正後的電路板影像中找出對應的比對區域,並依據電子元件類型進行標準區域與比對區域指定的影像處理 Step 140‧‧‧ Find the corresponding comparison area in the corrected circuit board image according to the standard area, and perform image processing specified by the standard area and the comparison area according to the type of the electronic component

步驟150‧‧‧將標準區域與比對區域進行指定的影像處理結果,依據電子元件類型選取比對條件對影像處理結果進行比對 Step 150‧‧‧Specify the image processing results of the standard area and the comparison area, and compare the image processing results according to the electronic component type

步驟160‧‧‧當標準區域與比對區域的影像處理結果比對不符時,用以對應記錄標準區域與電路板的生產序號 Step 160‧‧‧ When the comparison between the standard area and the comparison area image processing result is used, the production serial number corresponding to the recording standard area and the circuit board is used.

步驟170‧‧‧當對應記錄標準區域與電路板的生產序號,生成提示訊息 Step 170‧‧‧ Generate a reminder message when recording the serial number of the standard area and the board

第1圖繪示為本發明電路板上電子元件的檢測系統方塊圖。 1 is a block diagram of a detection system for electronic components on a circuit board of the present invention.

第2圖繪示為本發明電路板上電子元件的檢測方法流程圖。 FIG. 2 is a flow chart showing a method for detecting electronic components on a circuit board of the present invention.

第3圖繪示為本發明電路板上電子元件的檢測系統架構示意。 FIG. 3 is a schematic diagram showing the architecture of the detection system of the electronic component on the circuit board of the present invention.

第4圖繪示為本發明電路板上電子元件檢測的標準影像示意圖。 FIG. 4 is a schematic view showing a standard image of electronic component detection on the circuit board of the present invention.

第5A圖繪示為本發明電路板上電子元件檢測的電路板影像示意圖。 FIG. 5A is a schematic diagram of a circuit board image of the electronic component detection on the circuit board of the present invention.

第5B圖繪示為本發明電路板上電子元件檢測的電路板影像 校正結果示意圖 FIG. 5B is a circuit board image of the electronic component detection on the circuit board of the present invention Schematic diagram of calibration results

第6A圖繪示為本發明電路板上電子元件檢測的標準區域影像處理結果示意圖。 FIG. 6A is a schematic diagram showing the result of standard area image processing of electronic component detection on the circuit board of the present invention.

第6B圖繪示為本發明電路板上電子元件檢測的比對區域影像處理結果示意圖。 FIG. 6B is a schematic diagram showing the result of the comparison of the image processing of the electronic component on the circuit board of the present invention.

11‧‧‧標準圖像模組 11‧‧‧Standard Image Module

12‧‧‧影像擷取模組 12‧‧‧Image capture module

13‧‧‧影像校正模組 13‧‧‧Image Correction Module

14‧‧‧影像處理模組 14‧‧‧Image Processing Module

15‧‧‧影像比對模組 15‧‧‧Image comparison module

16‧‧‧記錄模組 16‧‧‧recording module

17‧‧‧提示模組 17‧‧‧Tips module

Claims (10)

一種電路板上電子元件的檢測系統,所述檢測系統是用於生產線中的檢測,其包含:一標準圖像模組,用以預先擷取標準電路板的一標準影像,並於所述標準影像中建立二校正點、建立至少一標準區域以及與所述標準區域對應的電子元件類型;一影像擷取模組,當具有一生產序號的一電路板藉由生產線進入所述檢測系統並定位時,所述影像擷取模組用以擷取一電路板影像;一影像校正模組,用以於所述電路板影像找出與所述標準影像中的所述校正點對應的特徵點,並依據所述校正點與所述特徵點以計算出平移矩陣與旋轉矩陣,以對所述電路板影像進行校正;一影像處理模組,依據所述標準區域於校正後的所述電路板影像中找出對應的比對區域,並依據所述電子元件類型進行所述標準區域與所述比對區域指定的影像處理;一影像比對模組,將所述標準區域與所述比對區域進行指定的影像處理結果,依據所述電子元件類型選取比對條件對影像處理結果進行比對;一記錄模組,當所述標準區域與所述比對區域的影像處理結果比對不符時,用以對應記錄所述標準區域與所述電路板的所述生產序號;及一提示模組,當記錄模組對應記錄所述標準區域與所述電路板的所述生產序號,所述提示模組用以生成一提示訊息。 A detection system for electronic components on a circuit board, the detection system being used for detection in a production line, comprising: a standard image module for pre-capturing a standard image of a standard circuit board, and Establishing two calibration points in the image, establishing at least one standard area, and an electronic component type corresponding to the standard area; an image capturing module, when a circuit board having a production serial number enters the detection system and is positioned by the production line The image capture module is configured to capture a circuit board image; and an image correction module is configured to find feature points corresponding to the correction points in the standard image on the circuit board image. And calculating, according to the correction point and the feature point, a translation matrix and a rotation matrix to correct the image of the circuit board; and an image processing module, according to the standard area, the corrected image of the circuit board Finding a corresponding alignment area, and performing image processing specified by the standard area and the comparison area according to the electronic component type; an image comparison module, the label Performing the specified image processing result on the area and the comparison area, selecting the comparison condition to compare the image processing result according to the electronic component type; and a recording module, when the standard area and the comparison area image When the processing result is inconsistent, the production serial number corresponding to the standard area and the circuit board is correspondingly recorded; and a prompting module, when the recording module corresponds to recording the standard area and the circuit board The production serial number is used to generate a prompt message. 如申請專利範圍第1項所述的電路板上電子元件的檢測系統,其中所述影像處理包含灰階處理、空間濾波、頻率濾波、圖像復原、圖像色彩分析、小波處理、形態處理、圖像分割以及圖像定量分析。 The detection system for an electronic component on a circuit board according to the first aspect of the invention, wherein the image processing comprises grayscale processing, spatial filtering, frequency filtering, image restoration, image color analysis, wavelet processing, morphology processing, Image segmentation and image quantitative analysis. 如申請專利範圍第1項所述的電路板上電子元件的檢測系統,其中所述影像比對模組依據所述電子元件類型選取比對條件對影像處理結果進行比對中比對條件包含輪廓、幾何條件以及顏色配置。 The detection system for an electronic component on a circuit board according to the first aspect of the invention, wherein the image comparison module selects a comparison condition according to the electronic component type, and compares the image processing result with a comparison condition including a contour. , geometry and color configuration. 如申請專利範圍第1項所述的電路板上電子元件的檢測系統,其中所述標準區域與所述比對區域的影像處理結果比對不符是當所述標準區域與所述比對區域的影像處理結果超出誤差值則比對不符。 The detection system for electronic components on a circuit board according to claim 1, wherein the standard area and the image processing result of the comparison area are inconsistent when the standard area and the comparison area are If the image processing result exceeds the error value, the comparison does not match. 如申請專利範圍第1項所述的電路板上電子元件的檢測系統,其中該提示模組所生成的所述提示訊息是包含所述標準區域與所述電路板的所述生產序號。 The detection system of the electronic component on the circuit board according to the first aspect of the invention, wherein the prompt message generated by the prompting module is the production serial number including the standard area and the circuit board. 一種電路板上電子元件的檢測方法,所述檢測方法是用於生產線中的檢測,其包含下列步驟:預先擷取標準電路板的一標準影像,並於所述標準影像中建立二校正點、建立至少一標準區域以及與所述標準區域對應的電子元件類型;當具有一生產序號的一電路板藉由生產線定位以進行檢測時,擷取一電路板影像;於所述電路板影像找出與所述標準影像中的所述校正點對應的特徵點,並依據所述校正點與所述特徵點以計算出平移 矩陣與旋轉矩陣,以對所述電路板影像進行校正;依據所述標準區域於校正後的所述電路板影像中找出對應的比對區域,並依據所述電子元件類型進行所述標準區域與所述比對區域指定的影像處理;將所述標準區域與所述比對區域進行指定的影像處理結果,依據所述電子元件類型選取比對條件對影像處理結果進行比對;當所述標準區域與所述比對區域的影像處理結果比對不符時,用以對應記錄所述標準區域與所述電路板的所述生產序號;及當對應記錄所述標準區域與所述電路板的所述生產序號,生成一提示訊息。 A method for detecting electronic components on a circuit board, the detection method being used for detection in a production line, comprising the steps of: pre-capturing a standard image of a standard circuit board, and establishing two calibration points in the standard image, Establishing at least one standard area and an electronic component type corresponding to the standard area; when a circuit board having a production serial number is positioned by the production line for detection, capturing a circuit board image; finding the image of the circuit board a feature point corresponding to the correction point in the standard image, and calculating a translation according to the correction point and the feature point a matrix and a rotation matrix for correcting the image of the circuit board; finding a corresponding alignment area in the corrected image of the circuit board according to the standard area, and performing the standard area according to the type of the electronic component And the image processing result specified by the comparison area; the image processing result specified by the standard area and the comparison area is selected according to the electronic component type, and the comparison condition is used to compare the image processing result; When the standard area is inconsistent with the image processing result of the comparison area, the production serial number corresponding to the standard area and the circuit board is correspondingly recorded; and when the standard area and the circuit board are correspondingly recorded The production serial number generates a prompt message. 如申請專利範圍第6項所述的電路板上電子元件的檢測方法,其中依據所述標準區域於校正後的所述電路板影像中找出對應的比對區域,並依據所述電子元件類型進行所述標準區域與所述比對區域指定的影像處理的步驟中所述影像處理包含灰階處理、空間濾波、頻率濾波、圖像復原、圖像色彩分析、小波處理、形態處理、圖像分割以及圖像定量分析。 The method for detecting an electronic component on a circuit board according to claim 6, wherein the corresponding alignment area is found in the corrected image of the circuit board according to the standard area, and according to the type of the electronic component. The image processing in the step of performing image processing specified by the standard area and the comparison area includes grayscale processing, spatial filtering, frequency filtering, image restoration, image color analysis, wavelet processing, morphological processing, and image processing. Segmentation and quantitative analysis of images. 如申請專利範圍第6項所述的電路板上電子元件的檢測方法,其中將所述標準區域與所述比對區域進行指定的影像處理結果,依據所述電子元件類型選取比對條件對影像處理結果進行比對的步驟中比對條件包含輪廓、幾何條件以及顏色配置。 The method for detecting electronic components on a circuit board according to claim 6, wherein the standard area and the comparison area are subjected to image processing results, and the comparison condition is selected according to the type of the electronic component. The alignment conditions in the step of processing the results of the alignment include contours, geometric conditions, and color configurations. 如申請專利範圍第6項所述的電路板上電子元件的檢測方 法,其中當所述標準區域與所述比對區域的影像處理結果比對不符時,用以對應記錄所述標準區域與所述電路板的所述生產序號的步驟是當所述標準區域與所述比對區域的影像處理結果超出誤差值則比對不符。 The detection side of the electronic component on the circuit board as described in claim 6 of the patent application scope a method, wherein when the standard area is inconsistent with the image processing result of the comparison area, the step of correspondingly recording the production serial number of the standard area and the circuit board is when the standard area is If the image processing result of the comparison area exceeds the error value, the comparison does not match. 如申請專利範圍第6項所述的電路板上電子元件的檢測方法,其中當對應記錄所述標準區域與所述電路板的所述生產序號,生成所述提示訊息的步驟中所述提示訊息包含所述標準區域與所述電路板的所述生產序號。 The method for detecting an electronic component on a circuit board according to claim 6, wherein the prompt message in the step of generating the prompt message is corresponding to the recording of the standard area and the production serial number of the circuit board. The production serial number of the standard area and the circuit board is included.
TW101138405A 2012-10-18 2012-10-18 Detecting system for electronic components on circuit board and method thereof TW201416664A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI582721B (en) * 2016-11-03 2017-05-11 英業達股份有限公司 Workpiece conductive feature inspecting method and workpiece conductive feature inspecting system
CN112801987A (en) * 2021-02-01 2021-05-14 上海悦易网络信息技术有限公司 Mobile phone part abnormity detection method and equipment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI582721B (en) * 2016-11-03 2017-05-11 英業達股份有限公司 Workpiece conductive feature inspecting method and workpiece conductive feature inspecting system
CN112801987A (en) * 2021-02-01 2021-05-14 上海悦易网络信息技术有限公司 Mobile phone part abnormity detection method and equipment

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