TW201415313A - Touch panel and manufacturing method - Google Patents

Abstract

The present invention discloses a touch panel comprising: a first transparent flexible substrate, a touch sensing structure which be settled on first transparent flexible substrate and includes a plurality of transparent sensing series and a first peripheral circuit. A patterned light-shielding layer deposed on touch sensing structure. The patterned light-shielding layer is disposed on the first peripheral circuits, and the plastic substrate is integrally formed on the top surface of the patterned light-shielding layer.

Description

Touch device and method of manufacturing same

The invention provides a touch device and provides a touch device with good mass production yield and rapid mass production, and a manufacturing method thereof.

In today's market for consumer electronics products, portable electronic products such as personal digital assistants (PDAs), mobile phones, notebooks, and tablet PCs have been widely used. A touch panel is used as an interface tool for data communication. In addition, since the design of electronic products is currently in the direction of light, thin, short and small, there is not enough space on the product to accommodate traditional input devices such as keyboards and mice, especially in the demand for tablet PCs that are designed with humanity in mind. Next, touch panels have become one of the key components. In addition to the multi-level menu design requirements, the touch panel can also have the functions of keyboard, mouse and other humanized operation modes.

At present, the outermost layer of the touch panel structure and the environment is usually a reinforced glass substrate, and then the adhesive contact control layer is used. For example, indium tin oxide (ITO) is used as the conductive material, and the touch panel is partially integrated and then displayed. The panels are combined to form a complete touch display device. As described above, the past between the tempered glass substrate and the touch sensing layer is bonded by optical glue. In addition, in the periphery of the tempered glass substrate, a black screen of the image layer is often printed by the ink screen to shield the wiring. However, the tempered glass substrate is printed one by one in screen printing, and its mass production efficiency is poor.

It is an object of the present invention to provide a touch device that is excellent in mass production yield and that can be mass-produced quickly and a method of manufacturing the same.

To achieve the above objective, the touch device of the present invention comprises: a first flexible transparent substrate, the touch sensing structure is located on the first flexible transparent substrate, and has a plurality of sensing upper series and a plurality of upper periphery line. The patterned light shielding layer is located on the touch sensing structure, and the patterned light shielding layer is relatively located on the plurality of upper peripheral lines. And a plastic substrate integrally formed on the patterned light shielding layer.

The touch sensing structure further includes a plurality of sensing series and a plurality of sensing series, and the plurality of sensing series and the plurality of sensing series are interlaced.

To achieve the above objective, the touch sensing structure of the present invention further includes a plurality of sensing series and a plurality of upper peripheral lines, a plurality of sensing series and a plurality of lower peripheral lines, a plurality of sensing series and upper peripheral lines. The first flexible transparent substrate is disposed on the first flexible transparent substrate, the second flexible transparent substrate is adhered to the first flexible transparent substrate, and the second flexible transparent substrate is adhered to the first flexible transparent substrate. Under the material, the plurality of sensing series and the plurality of sensing series are interlaced, and the plurality of peripheral lines are relatively located at the patterned light shielding layer.

In order to achieve the above objective, the touch sensing structure of the present invention further includes a plurality of sensing series and a plurality of upper peripheral lines, a plurality of sensing series and a plurality of lower peripheral lines, a plurality of sensing series and a plurality of upper peripheral lines. The circuit is located on the first flexible transparent substrate, and the plurality of sensing series and the plurality of lower peripheral lines are located under the first flexible transparent substrate, and the plurality of sensing series and the plurality of sensing strings are respectively The columns are interlaced and the plurality of peripheral lines are located opposite the patterned mask.

To achieve the above object, the touch device of the present invention further includes an easy-to-attach layer between the patterned light-shielding layer and the plastic substrate.

In order to achieve the above object, the surface of the flexible transparent substrate of the touch device of the present invention further includes a scratch-resistant layer, which can block the infiltration of moisture.

To achieve the above objective, the touch device of the present invention further includes a dielectric layer on top of the touch sensing structure.

To achieve the above object, a method of manufacturing a touch device of the present invention includes: providing a release layer to form a first flexible transparent substrate on an upper surface of the release layer. The touch sensing structure is formed on the first flexible transparent substrate, and the touch sensing structure has a plurality of sensing series and a plurality of upper peripheral lines. A patterned light shielding layer is formed on the touch sensing structure, and the patterned light shielding layer is relatively located on the upper peripheral line. The hot-pressed flexible circuit board is on the upper peripheral line, and the integrally formed plastic substrate is on the upper surface of the patterned light-shielding layer and is separated from the release layer.

In order to achieve the above objective, the forming the touch sensing structure further includes: forming a plurality of sensing series and a plurality of upper peripheral lines on the first flexible transparent substrate to form a plurality of sensing series and plural The lower peripheral line is on the second flexible transparent substrate. And pasting the second flexible transparent substrate under the first flexible transparent substrate, so that the plurality of sensing series and the plurality of sensing series are interlaced, and the plurality of peripheral lines are relatively located in the patterned shading At the floor.

In order to achieve the above object, the manufacturing method of the touch device of the present invention further comprises forming an easy-adhesion layer on the patterned light-shielding layer.

In order to achieve the above object, the surface of the first flexible transparent substrate of the manufacturing method of the touch device of the present invention further comprises forming a scratch-resistant layer to prevent moisture from penetrating.

To achieve the above, the method for manufacturing the touch device of the present invention further includes the dielectric layer being disposed on the touch sensing structure and used to planarize the surface of the touch sensing structure.

FIG. 1 is a schematic diagram of a touch device according to a first embodiment of the present invention. The touch device 1 of the present invention comprises: a first flexible transparent substrate 100, a touch sensing structure 120, a patterned light shielding layer 130 and a plastic substrate 140. The first flexible transparent substrate 100 has a corresponding upper surface 11 and a lower surface 12, wherein the material of the first flexible transparent substrate 100 can be, for example, PET, TAC, glass, PMMA, ARTON, which can further enhance the whole The clarity of the LCD panel. The touch sensing structure 120 is located on the upper surface 11 of the first flexible transparent substrate 100, and has a plurality of sensing series 121 and a plurality of upper peripheral lines 122 connected to each other. The touch sensing structure 120 can be a capacitive touch sensing structure or a resistive touch sensing structure. The patterned light-shielding layer 130 is located on the touch-sensing structure 120, and the patterned light-shielding layer 130 is relatively located on the plurality of upper peripheral lines 122, and the plurality of upper peripheral lines 122 can be shielded. Then, the plastic substrate 140 is integrally formed on the patterned light shielding layer 130 as a protective layer or as a use surface. Since the plastic substrate 140 has plasticity, various shapes and outer frames can be formed through integral molding, so that the appearance can be A variety of designs can improve the design limitations of traditional full-planar glass processing. The adhesive layer 130 and the plastic substrate 140 can be bonded to each other by the easy adhesion layer 150. The easy adhesion layer 150 can improve the adhesion between the plastic substrate 140 and the touch sensing structure 120.

2A to 2f are diagrams showing a method of manufacturing a touch device according to a first embodiment of the present invention, comprising: providing a release layer 260 for use in release. A first flexible transparent substrate 200 is formed on the upper surface of the release layer 260. Forming the touch sensing structure 220 on the first flexible transparent substrate 200, sequentially forming a transparent conductive layer 26 and a metal layer 27 on the surface of the first flexible transparent substrate 200, wherein The manner in which the transparent conductive layer 26 and the metal layer 27 are formed may be, for example, a roll-to-roll physical vapor deposition (PVD), a roll-to-roll chemical vapor deposition (CVD), a roll-to-roll plating, a roll-to-roll coating process, or the like. The transparent conductive layer 26 can be, for example, a metal oxide, a nano silver wire or a nano conductive metal. The metal oxide can be, for example, indium tin oxide (ITO), indium zinc oxide (IZO), oxidation. Cadmium tin oxide (CTO), aluminum zinc oxide (AZO), indium tin zinc oxide (ITZO), zinc oxide, cadmium oxide, cerium oxide (hafnium oxide, HfO), indium gallium zinc oxide (InGaZnO), indium gallium zinc magnesium oxide (InGaZnMgO), indium gallium magnesium oxide (InGaMgO) or indium oxide Indium gallium aluminum oxide (InGaAlO), etc.). The metal layer 27 may be, for example, at least one layer of a conductive metal or a plurality of layers of a conductive metal. The material may be a conductive metal or a conductive alloy such as a copper alloy, an aluminum alloy, gold, silver, aluminum, copper or molybdenum. The structure of the multi-layer conductive metal layer may be, for example, a stacked structure of a molybdenum layer/aluminum layer/molybdenum layer, or may be a conductive metal or a conductive alloy selected from the group consisting of copper alloy, aluminum alloy, gold, silver, aluminum, copper, molybdenum, and the like. A multi-layer conductive metal layer structure stacked with a plurality of materials. Patterning is then applied, wherein the patterning process can be, for example, a yellow process or a laser etch process to form a plurality of interconnected sense sense strings 221 and a plurality of upper peripheral lines 222. In addition, the method of forming the plurality of upper peripheral lines 222 can also be directly formed on the periphery by a printing or ink jet method and electrically connected to the plurality of sensing series 221, wherein the material of the plurality of upper peripheral lines 222 can be, for example, silver paste. Or conductive paste such as copper paste. The plurality of sensing series 221 may include, for example, a plurality of first direction series (not shown) And a plurality of second direction series (not shown) are mutually staggered and electrically insulated from each other. For example, a single-sided bridging wire (SITO), a jumper wire, an insulating element, or a conductive bridge may be used in the prior art. ...etc. Among them, the patterning process can be a roll-to-roll yellow process, a roll-to-roll laser etch process or a roll-to-roll printing technique. Then, the patterned light-shielding layer 230 is formed on the touch-sensing structure 220, and the patterned light-shielding layer 230 is relatively located on the upper peripheral line 222, and the patterned light-shielding layer 230 can be a design pattern printed by at least one layer of ink. It can be formed by printing, and different patterns can be designed according to the needs to increase the beauty and uniqueness of the product. In addition, the method for forming the patterned light-shielding layer 230 may be, for example, a Lithography process, and after the photoresist is applied, the mask may be sequentially used to perform exposure, development, and the like. To complete the fabrication of the patterned light shielding layer 230. Then, a circuit end point (gold finger) and a flexible circuit board (FPC) (not shown) of the plurality of upper peripheral lines 222 are electrically connected in a hot-press (HOT BAR) manner. Next, as shown in FIGS. 2e to 2f, the integrally molded plastic substrate 240 is patterned on the upper surface of the light shielding layer 230, and the molded plastic substrate 240 can be ejected onto the patterned light shielding layer by the mold 270. The release layer 260 is released from the shape to form a touch device. Of course, there are different ways of forming according to the needs. For example: precision injection molding, micro injection Molding (micro-flow injection molding, microstructure injection molding), fine-tuning injection compression molding, micro-injection molding, precision lamination resin molding, precision deposition ( Deposition) Resin molding...etc. The material for injecting the molded plastic may be, for example, a general-purpose resin such as a polystyrene resin, a polyolefin resin, a polyacrylonitrile-butadiene-styrene resin, an acrylonitrile-styrene resin, or an acrylonitrile resin. Also, polydiphenyl ether oxide can also be used. Polystyrene resin, polycarbonate resin, polyoxymethylene resin, polypropylene Resin, polycarbonate modified polydiphenyl ether resin, polybutylene terephthalate resin, ultra high molecular weight polystyrene resin, general engineering resin or polycarbonate resin, polydiphenyl ether sulfide resin, poly 2 A super engineering resin such as a phenyl ether oxide resin, a polyacrylate resin, a polyether quinone resin, a polyimide resin, a liquid crystal polyester resin, or a polypropyl heat resistant resin.

As shown in FIGS. 3a to 3b, the surface of the first flexible transparent substrate 300 further includes a scratch-resistant layer 390 for blocking moisture infiltration and improving the service life of the product. In addition, the dielectric layer 380 is formed on the touch sensing structure 320. The dielectric layer 380 is used to planarize the bonding surface between the touch sensing structure 320 and the plastic substrate 340, so that the gap can be smoothed and the plastic substrate can be reduced. The 340 produces the fine bubbles generated during the integral molding, which improves the quality and yield of the overall product.

FIG. 4 is a schematic view showing a touch device according to a second embodiment of the present invention. The touch device 1 of the present invention comprises: a first flexible transparent substrate 400, a second flexible transparent substrate 410, a touch sensing structure 420, a patterned light shielding layer 430, and a plastic substrate 440. The materials of the first flexible transparent substrate 400 and the second flexible transparent substrate 410 may be, for example, PET, TAC, glass, PMMA, or ARTON. The touch sensing structure 420 can include a plurality of sensing series 421 and a plurality of upper peripheral lines 422, a plurality of sensing series 423 and a plurality of lower peripheral lines 424. The plurality of sensing series 421 and the plurality of upper peripheral lines 422 are disposed on the upper surface of the first flexible transparent substrate 400, and the plurality of sensing series 421 and the plurality of upper peripheral lines 422 are connected to each other. The plurality of sensing series 423 and the plurality of lower peripheral lines 424 are disposed on the upper surface of the second flexible transparent substrate 410, and the plurality of sensing series 423 and the plurality of lower peripheral lines 424 are connected to each other. The second flexible transparent substrate 410 is adhered to the first flexible transparent substrate 400 Below, wherein the plurality of sensing series 421 and the plurality of sensing series 423 are interlaced. The patterned light-shielding layer 430 is located on the touch-sensing structure 420, and the patterned light-shielding layer 430 is located at a plurality of upper peripheral lines 422 and a plurality of lower peripheral lines 424, and the plurality of upper peripheral lines 422 and the plurality of lower peripheral lines 424 Shaded. The plastic substrate 440 is integrally formed on the patterned light shielding layer 430.

FIG. 5 is a diagram showing a method of manufacturing a touch device according to a second embodiment of the present invention. The flow of the steps is the same as that of the embodiment described above, except that the manufacturing method of the touch sensing structure is different. When the touch sensing structure is fabricated, first, a transparent conductive layer and a metal layer are sequentially formed on the surface of the first flexible transparent substrate 500 (refer to FIGS. 2a to 2d). Further, patterning is performed to form a plurality of sensing series 521 and a plurality of upper peripheral lines 522 which are connected to each other. In addition, the method of forming the plurality of upper peripheral lines 522 can also be directly formed on the periphery by a printing or ink jet method and electrically connected to the plurality of upper sensing series 521. The material of the plurality of upper peripheral lines 522 may be, for example, a conductive paste such as silver paste or copper paste. Then, a second flexible transparent substrate 510 is further provided, and the transparent conductive layer and the metal layer can be sequentially formed on the second flexible transparent substrate 510 (refer to FIGS. 2a to 2d), and then applied The patterning process forms a plurality of sensing series 523 interconnected and a plurality of lower peripheral lines 524 on the upper surface of the second flexible transparent substrate 510. In addition, the method of forming the plurality of lower peripheral lines 524 can also be directly formed on the periphery by a printing or ink jet method and electrically connected to the plurality of sensing series 523. The material of the plurality of lower peripheral lines 524 can be, for example, silver paste. Or conductive paste such as copper paste. The patterning process can be a roll-to-roll yellow process, a roll-to-roll laser etch process or a roll-to-roll printing process. The plurality of sensing series 521 and the plurality of sensing series 523 are interlaced and electrically edge. The first flexible transparent substrate 500 and the second flexible transparent substrate 510 are bonded by the easy-adhesion layer 550 in a roll-to-roll bonding manner. The easy-adhesion layer 550 further has an opening for electrically connecting the upper gold finger and the lower gold finger to the flexible circuit board (FPC). The material of the easy-adhesion layer 550 can be, for example, a combination of optical glue, water glue or other composite materials.

FIG. 6 is a schematic view showing a touch device according to a third embodiment of the present invention. The touch device 1 of the present invention also includes a first flexible transparent substrate 600, a touch sensing structure 620, a patterned light shielding layer 630, and a plastic substrate 640. The material of the first flexible transparent substrate 600 can be, for example, PET, TAC, glass, PMMA, ARTON. The touch sensing structure 20 is located on the first flexible transparent substrate 600. The touch sensing structure 620 includes a plurality of sensing series 621 and an upper peripheral line 622, a plurality of sensing series 623, and a plurality of lower peripheral lines 624. . The plurality of sensing series 621 and the plurality of upper peripheral lines 622 are located on the upper surface of the first flexible transparent substrate 600, and the plurality of sensing series 623 and the plurality of lower peripheral lines 624 are located at the first flexible transparent base. The lower surface of the material 600, the plurality of sensing series 621 and the plurality of sensing series 623 are interlaced and electrically insulated, and the plurality of upper peripheral lines 622 are relatively located at the patterned light shielding layer 630, and the shielding effect can also be achieved. . In the manufacturing method disclosed in the third embodiment of the present invention, the touch device and the plastic substrate are integrally formed to be mass-produced and effectively improve the production efficiency. In addition, by the disclosure of the present invention, the touch can be reduced. The cost of the device and the purpose of achieving thinning are in line with the trend of development.

Although the present invention has been disclosed above by way of example, it is not intended to limit the invention. Any person skilled in the art can make some changes and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention is subject to the application. The scope defined by the patent scope shall prevail.

1‧‧‧ touch device

100,200,300,400,500,600‧‧‧first flexible transparent substrate

410,510‧‧‧Second flexible transparent substrate

11‧‧‧ upper surface

12‧‧‧ Lower surface

120,220,320,420,520,620‧‧‧ touch sensing structure

121,221,321,421,521,621‧‧‧multiple sense series

423,523,623‧‧‧Multiple sense series

122,222,322,422,522,622‧‧‧multiple peripheral lines

424,524,624‧‧‧Multiple peripheral lines

26‧‧‧Transparent conductive layer

27‧‧‧metal layer

130,230,330,430,530,630‧‧‧ patterned blackout layer

140,240,340,440,640‧‧‧ plastic substrates

150, 250, 350, 450, 550, 650 ‧ ‧ easy layer

260,560‧‧‧ release layer

270‧‧‧Mold

380‧‧‧ dielectric layer

390‧‧‧Scratch resistant layer

FIG. 1 is a schematic structural view of a first embodiment of a touch device according to the present invention.

2a to 2f are schematic views showing the method of the first embodiment of the touch device of the present invention.

3a to 3b are schematic views showing the structure of the first embodiment of the touch device of the present invention.

FIG. 4 is a schematic structural view of a second embodiment of the touch device of the present invention.

FIG. 5 is a schematic view showing the method of the second embodiment of the touch device of the present invention.

FIG. 6 is a schematic structural view of a third embodiment of the touch device of the present invention.

1‧‧‧ touch device

100‧‧‧First flexible transparent substrate

11‧‧‧ upper surface

12‧‧‧ Lower surface

120‧‧‧Touch sensing structure

121‧‧‧Multiple sensing series

122‧‧‧Multiple peripheral lines

130‧‧‧ patterned shade layer

140‧‧‧Plastic substrate

150‧‧‧Easy layer

Claims (12)

A touch device includes: a first flexible transparent substrate; a touch sensing structure on the first flexible transparent substrate, having a plurality of sensing series and a plurality of peripheral lines; a patterning The light shielding layer is disposed on the touch sensing structure, and the patterned light shielding layer is located opposite to the plurality of peripheral lines; and a plastic substrate is integrally formed on the patterned light shielding layer. The touch sensing device of the first aspect of the invention, wherein the touch sensing structures further comprise a plurality of sensing series and a plurality of sensing series, the upper sensing series and the lower The sensing series are interlaced. The touch device of claim 1, wherein the touch sensing structure further comprises a plurality of sensing series and a plurality of upper peripheral lines, a plurality of sensing series and a plurality of lower peripheral lines, and the upper sensing The measurement series and the upper peripheral circuit are located on the first flexible transparent substrate, and the lower sensing series and the lower peripheral circuit are located on a second flexible transparent substrate, and the second flexible transparent substrate The substrate is adhered to the first flexible transparent substrate, the upper sensing series and the lower sensing series are interlaced, and the upper peripheral lines are opposite to the patterned light shielding layer. The touch device of claim 1, wherein the touch sensing structure further comprises a plurality of sensing series and a plurality of upper peripheral lines, a plurality of sensing series and a plurality of lower peripheral lines, and the upper sensing The measurement series and the upper peripheral circuit are located on the first flexible transparent substrate, and the lower sensing series and the lower peripheral circuits are located under the first flexible transparent substrate, The upper sensing series and the lower sensing series are interlaced, and the upper peripheral lines are phased The pair is located at the patterned shading layer. The touch device of any one of claims 1 to 4, further comprising an easy-to-back layer between the patterned light-shielding layer and the plastic substrate. The touch device of any one of claims 1 to 4, wherein the first flexible transparent substrate surface further comprises a scratch resistant layer. The touch device of any one of the preceding claims, further comprising a dielectric layer on the touch sensing structure. A method for manufacturing a touch device includes: providing a release layer; forming a first flexible transparent substrate on the upper surface of the release layer; and forming a touch sensing structure on the first flexible transparent substrate The touch sensing structure has a plurality of sensing series and a plurality of upper peripheral lines; forming a patterned light shielding layer on the touch sensing structure, and the patterned light shielding layer is relatively located on the upper peripheral line And integrally molding a plastic substrate on the upper surface of the patterned light shielding layer and being separated from the release layer. The method of manufacturing the touch device of claim 8, wherein the forming the touch sensing structure further comprises: forming a plurality of upper sensing series and a plurality of upper peripheral lines on the first flexible transparent base Forming a plurality of sensing series and a plurality of lower peripheral lines on the second flexible transparent substrate; and adhering the second flexible transparent substrate to the first flexible transparent substrate , the upper sensing series and the lower sensing series are interlaced, and the The upper peripheral line is located below the patterned shading layer. The method of manufacturing a touch device according to claim 8 or claim 9, further comprising forming an easy-to-back layer on the patterned light-shielding layer. The method of manufacturing the touch device of claim 8, wherein the first flexible transparent substrate surface further comprises a scratch-resistant layer for preventing moisture from penetrating. The method of manufacturing the touch device of claim 8 or claim 9, further comprising a dielectric layer formed on the touch sensing structure, wherein the dielectric layer is used to planarize the touch Measure the surface of the structure.