TW201414691A - Manufacturing method of sealing structure body and member for liquid crystal display panel - Google Patents

Manufacturing method of sealing structure body and member for liquid crystal display panel Download PDF

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TW201414691A
TW201414691A TW102136607A TW102136607A TW201414691A TW 201414691 A TW201414691 A TW 201414691A TW 102136607 A TW102136607 A TW 102136607A TW 102136607 A TW102136607 A TW 102136607A TW 201414691 A TW201414691 A TW 201414691A
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glass substrate
sealing
support structure
peeling
liquid crystal
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TW102136607A
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Chinese (zh)
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TWI616412B (en
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Daisuke Uchida
Yasunori Ito
Kei Takiuchi
Yutaka Otsubo
Hirotoshi Terui
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Asahi Glass Co Ltd
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    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1339Gaskets; Spacers; Sealing of cells
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/20Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/202LCD, i.e. liquid crystal displays
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Liquid Crystal (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Glass Compositions (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention relates to a sealing structure body, which is used in manufacturing a member for a liquid crystal display panel and comprises: a first laminate body which contains a first glass substrate with its board thickness below 0.3 mm and a first support structure body detachably adhered to the above-mentioned first glass substrate; a second laminate body which contains a second glass substrate with its board thickness below 0.3 mm and a second support structure body detachably adhered to the above-mentioned second glass substrate; a sealing part, which is disposed by way of forming a formation area by surrounding the liquid crystal display panel in between the above-mentioned first and second laminate bodies; and an adhesion part which adheres the above-mentioned first and second laminate bodies by the way of arbitrary constitution; and the above-mentioned first and second glass substrates face oppositely to each other and satisfy the following correlations (1) and (2): {(X1×Y1)+(Z1×W1)}/(A1×B1)>1… correlation (1); {(X2×Y2)+(Z2×W2)}/(A2×B2)>1… correlation (2); in the correlation (1), X1 represents the peeling strength (N/mm) in between the above-mentioned sealing part and the first glass substrate, Y1 represents the total contact area (mm<2>) in between the above-mentioned sealing part and the first glass substrate, Z1 represents the peeling strength (N/mm) in between the above-mentioned adhesion part and the first glass substrate, W1 represents the total contact area (mm<2>) in between the above-mentioned adhesion part and the first glass substrate, A1 represents the peeling strength (N/mm) in between the above-mentioned first glass substrate and the first support structure body, and B1 represents the total contact area (mm<2>) in between the above-mentioned first glass substrate and the first support structure body; in the correlation (2), X2 represents the peeling strength (N/mm) in between the above-mentioned sealing part and the second glass substrate, Y2 represents the total contact area (mm<2>) in between the above-mentioned sealing part and the second glass substrate, Z2 represents the peeling strength (N/mm) in between the above-mentioned adhesion part and the second glass substrate, W2 represents the total contact area (mm<2>) in between the above-mentioned adhesion part and the second glass substrate, A2 represents the peeling strength (N/mm) in between the above-mentioned second glass substrate and the second support structure body, and B2 represents the total contact area (mm<2>) in between the above-mentioned second glass substrate and the second support structure body; moreover, in the absence of the above-mentioned adhesion part, (Z1xW1)=0 and (Z2xW2)=0.

Description

密封構造體及液晶顯示面板用構件之製造方法 Sealing structure and method for manufacturing member for liquid crystal display panel

本發明係關於一種密封構造體,尤其係關於一種製造液晶顯示面板用構件時所使用之密封構造體。又,本發明亦係關於一種使用該密封構造體之液晶顯示面板用構件之製造方法。 The present invention relates to a sealing structure, and more particularly to a sealing structure used in the manufacture of a member for a liquid crystal display panel. Moreover, the present invention also relates to a method of manufacturing a member for a liquid crystal display panel using the sealing structure.

近年來,液晶顯示面板等電子機器之薄型化、輕量化得到發展,而不斷推進該等電子機器中所使用之玻璃基板之薄板化。然而,玻璃基板之薄板化會導致玻璃基板之強度降低,從而玻璃基板在電子機器之製造步驟中之操作性降低。 In recent years, thinner and lighter electronic devices such as liquid crystal display panels have been developed, and the thinning of glass substrates used in these electronic devices has been continuously promoted. However, the thinning of the glass substrate causes the strength of the glass substrate to be lowered, so that the operability of the glass substrate in the manufacturing steps of the electronic device is lowered.

因此,先前採用如下方法:於使用厚於最終板厚之玻璃基板形成各種元件等後,藉由化學蝕刻處理使玻璃基板薄板化。然而,根據此種方法,於例如將玻璃基板之厚度自0.7 mm薄板化成0.2 mm或0.1 mm之情形時,必須利用蝕刻液去除原玻璃基板之材料之大半,就生產性或原材料之使用效率之觀點而言未必較佳。 Therefore, a method has been previously employed in which a glass substrate is thinned by a chemical etching treatment after forming various elements and the like using a glass substrate thicker than the final thickness. However, according to such a method, for example, when the thickness of the glass substrate is reduced from 0.7 mm to 0.2 mm or 0.1 mm, it is necessary to remove most of the material of the original glass substrate by using an etching solution, in terms of productivity or use efficiency of raw materials. This is not necessarily preferable.

又,於利用化學蝕刻使玻璃基板薄板化時,於在玻璃基板之表面存在微細劃痕之情形時,存在如下情況:因蝕刻處理導致形成以劃痕為起點之微細之凹陷(腐蝕坑),從而成為光學缺陷。 In the case where the glass substrate is thinned by chemical etching, when there is a fine scratch on the surface of the glass substrate, there is a case where a fine pit (corrosion pit) starting from a scratch is formed by the etching process. Thereby becoming an optical defect.

為了應對上述課題,提出有如下方法:最初起便使用具有最終板厚之較薄之玻璃基板,於亦被稱為加強板之支撐構造體上積層玻璃基板而製成積層體,並以該積層體之狀態於玻璃基板形成各種元件等後,自玻璃基板剝離支撐構造體(例如,參照專利文獻1)。支撐構造 體包含支撐板、及固定於該支撐板上之黏著劑層,藉由黏著劑層將玻璃基板可剝離地密接。最終,自玻璃基板剝離支撐構造體,於該被剝離之支撐構造體上積層新的玻璃基板而再利用。 In order to cope with the above problems, there has been proposed a method in which a thin glass substrate having a final thickness is used, and a glass substrate is laminated on a support structure also called a reinforcing plate to form a laminate, and the laminate is formed. After forming various elements and the like on the glass substrate, the support structure is peeled off from the glass substrate (see, for example, Patent Document 1). Support structure The body comprises a support plate and an adhesive layer fixed on the support plate, and the glass substrate is detachably adhered by the adhesive layer. Finally, the support structure is peeled off from the glass substrate, and a new glass substrate is laminated on the peeled support structure and reused.

[先前技術文獻] [Previous Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]日本專利特開平8-86993號公報 [Patent Document 1] Japanese Patent Laid-Open No. Hei 8-86993

使用上述積層體之液晶顯示面板用構件之製造係例如以如下方式進行。首先,準備1對積層體,視需要於各自之玻璃基板之成為液晶顯示面板之1個或2個以上之形成區域形成薄膜電晶體(TFT)或彩色濾光片(CF)等。又,於一玻璃基板上,以包圍成為液晶顯示面板之各個形成區域之方式塗佈密封材料。繼而,介隔密封材料積層1對積層體,並使密封材料硬化而形成密封部,從而獲得密封構造體。其後,自密封構造體之各個玻璃基板剝離支撐構造體,而製造具有1個或2個以上之成為液晶顯示面板之區域之液晶顯示面板用構件。 The manufacturing of the member for liquid crystal display panels using the above laminated body is performed, for example, as follows. First, a pair of laminated bodies are prepared, and a thin film transistor (TFT), a color filter (CF), or the like is formed as needed in one or two or more formation regions of the liquid crystal display panel of each of the glass substrates. Further, a sealing material is applied to a glass substrate so as to surround each of the formation regions of the liquid crystal display panel. Then, the sealing material is deposited by laminating the sealing material laminate 1 and the sealing material is cured to form a sealing portion. Then, the support structure is peeled off from each of the glass substrates of the self-sealing structure, and a member for liquid crystal display panels having one or two or more regions serving as liquid crystal display panels is produced.

然而,於上述方法之情形時,於自密封構造體剝離支撐構造體時,有時未必會於液晶顯示面板用構件與支撐構造體之間剝離,而於液晶顯示面板用構件之內部、具體而言為玻璃基板與密封部之間剝離,又,有時會於玻璃基板產生破裂等損傷。若於液晶顯示面板用構件產生密封部之剝離或玻璃基板之損傷,則無法將該液晶顯示面板用構件用於液晶顯示面板之製造中。 However, in the case of the above-described method, when the support structure is peeled off from the self-sealing structure, the liquid crystal display panel member and the support structure are not necessarily peeled off, and the inside of the liquid crystal display panel member is specifically In other words, the glass substrate and the sealing portion are peeled off, and damage such as cracking may occur in the glass substrate. When the sealing member is peeled off or the glass substrate is damaged by the member for a liquid crystal display panel, the member for liquid crystal display panels cannot be used for manufacture of a liquid crystal display panel.

本發明係為了解決上述課題而完成者,其目的在於提供一種可抑制支撐構造體之剝離時之密封部之剝離或玻璃基板之損傷,為了製造液晶顯示面板用構件而使用之密封構造體。 In order to solve the problem, the present invention has been made to provide a sealing structure for use in manufacturing a member for a liquid crystal display panel, which is capable of suppressing peeling of a sealing portion or damage of a glass substrate when the support structure is peeled off.

本發明者對先前技術之問題進行研究後,發現可藉由以下之構成解決上述課題,從而完成了本發明。 The present inventors have studied the problems of the prior art and found that the above problems can be solved by the following constitution, and the present invention has been completed.

即,為了達成上述目的,本發明之第1態樣係一種密封構造體,其係用於製造液晶顯示面板用構件者,且包含:第1積層體,其具有板厚為0.3 mm以下之第1玻璃基板及與第1玻璃基板可剝離地貼合之第1支撐構造體;第2積層體,其具有板厚為0.3 mm以下之第2玻璃基板及與第2玻璃基板可剝離地貼合之第2支撐構造體;密封部,其於第1積層體及第2積層體之間以包圍成為液晶顯示面板之形成區域之方式設置;及接著部,其以任意構成之形式接著第1積層體及第2積層體;且第1玻璃基板及第2玻璃基板對向,且滿足以下之關係式(1)及式(2)。 In other words, in order to achieve the above object, a first aspect of the present invention is a sealing structure for manufacturing a member for a liquid crystal display panel, comprising: a first layered body having a thickness of 0.3 mm or less a glass substrate and a first support structure that is detachably bonded to the first glass substrate, and a second laminate having a second glass substrate having a thickness of 0.3 mm or less and being detachably attached to the second glass substrate a second supporting structure; the sealing portion is provided between the first laminated body and the second laminated body so as to surround the formation region of the liquid crystal display panel; and the connecting portion is followed by the first laminated layer in an arbitrary configuration And the second layered body; and the first glass substrate and the second glass substrate are opposed to each other, and satisfy the following relational expressions (1) and (2).

式(1){(X1×Y1)+(Z1×W1)}/(A1×B1)>1 Formula (1) {(X1 × Y1) + (Z1 × W1)} / (A1 × B1) > 1

式(2){(X2×Y2)+(Z2×W2)}/(A2×B2)>1 Equation (2) {(X2 × Y2) + (Z2 × W2)} / (A2 × B2) > 1

(式(1)中,X1表示密封部與第1玻璃基板之間之剝離強度(N/mm),Y1表示密封部與第1玻璃基板之總接觸面積(mm2),Z1表示接著部與第1玻璃基板之間之剝離強度(N/mm),W1表示接著部與第1玻璃基板之總接觸面積(mm2),A1表示第1玻璃基板與第1支撐構造體之間之剝離強度(N/mm),B1表示第1玻璃基板與第1支撐構造體之總接觸面積(mm2),式(2)中,X2表示密封部與第2玻璃基板之間之剝離強度(N/mm),Y2表示密封部與第2玻璃基板之總接觸面積(mm2),Z2表示接著部與第2玻璃基板之間之剝離強度(N/mm),W2表示接著部與第2玻璃基板之總接觸面積(mm2),A2表示第2玻璃基板與第2支撐構造體之間之剝離強度(N/mm),B2表示第2玻璃基板與第2支撐構造體之總接觸面積(mm2);再者,於不存在接著部之情形時,設為(Z1×W1)=0及(Z2×W2)=0) (In the formula (1), X1 represents the peeling strength (N/mm) between the sealing portion and the first glass substrate, Y1 represents the total contact area (mm 2 ) between the sealing portion and the first glass substrate, and Z1 represents the bonding portion and Peel strength (N/mm) between the first glass substrates, W1 indicates the total contact area (mm 2 ) between the second portion and the first glass substrate, and A1 indicates the peel strength between the first glass substrate and the first support structure. (N/mm), B1 represents the total contact area (mm 2 ) between the first glass substrate and the first support structure, and in the formula (2), X2 represents the peel strength between the seal portion and the second glass substrate (N/). Mm), Y2 represents the total contact area (mm 2 ) between the sealing portion and the second glass substrate, Z2 represents the peel strength (N/mm) between the bonding portion and the second glass substrate, and W2 represents the bonding portion and the second glass substrate. The total contact area (mm 2 ), A2 indicates the peel strength (N/mm) between the second glass substrate and the second support structure, and B2 indicates the total contact area between the second glass substrate and the second support structure (mm). 2 ); Furthermore, in the case where there is no follower, it is set to (Z1 × W1) = 0 and (Z2 × W2) = 0)

於第1態樣中,較佳為包含複數個密封部。 In the first aspect, it is preferable to include a plurality of sealing portions.

於第1態樣中,較佳為包含接著部,且接著部係沿著密封部呈直線狀設置。 In the first aspect, it is preferable to include a follower portion, and the subsequent portion is linearly disposed along the sealing portion.

於第1態樣中,較佳為包含接著部,且接著部係以包圍複數個密封部之整體之方式設置。 In the first aspect, it is preferable to include a follower portion, and the subsequent portion is provided to surround the entirety of the plurality of seal portions.

於第1態樣中,較佳為包含接著部,且接著部係以包圍複數個密封部之各者之方式設置。 In the first aspect, it is preferable to include a follower portion, and the subsequent portion is provided to surround each of the plurality of seal portions.

於第1態樣中,較佳為第1玻璃基板及第2玻璃基板具有縱730 mm×橫920 mm以上之大小。 In the first aspect, it is preferable that the first glass substrate and the second glass substrate have a size of 730 mm in length × 920 mm in width.

於第1態樣中,較佳為第1玻璃基板及/或第2玻璃基板由無鹼玻璃構成。 In the first aspect, preferably, the first glass substrate and/or the second glass substrate are made of alkali-free glass.

於第1態樣中,較佳為玻璃板由以氧化物基準之質量百分率表示含有下述成分之無鹼玻璃構成。 In the first aspect, it is preferred that the glass plate is composed of an alkali-free glass containing the following components in terms of mass percentage based on oxide.

SiO2:50~66% SiO 2 : 50~66%

Al2O3:10.5~24% Al 2 O 3 : 10.5~24%

B2O3:0~12% B 2 O 3 : 0~12%

MgO:0~8% MgO: 0~8%

CaO:0~14.5% CaO: 0~14.5%

SrO:0~24% SrO: 0~24%

BaO:0~13.5% BaO: 0~13.5%

MgO+CaO+SrO+BaO:9~29.5% MgO+CaO+SrO+BaO: 9~29.5%

ZnO:0~5% ZnO: 0~5%

於第1態樣中,玻璃板較佳為由以氧化物基準之質量百分率表示含有下述成分之無鹼玻璃構成。 In the first aspect, the glass plate is preferably composed of an alkali-free glass containing the following components in terms of a mass percentage based on an oxide.

SiO2:58~66% SiO 2 : 58~66%

Al2O3:15~22% Al 2 O 3 : 15~22%

B2O3:5~12% B 2 O 3 : 5~12%

MgO:0~8% MgO: 0~8%

CaO:0~9% CaO: 0~9%

SrO:3~12.5% SrO: 3~12.5%

BaO:0~2% BaO: 0~2%

MgO+CaO+SrO+BaO:9~18% MgO+CaO+SrO+BaO: 9~18%

ZnO:0~2% ZnO: 0~2%

本發明之第2態樣係一種液晶顯示面板用構件之製造方法,其包括自第1態樣剝離第1支撐構造體及第2支撐構造體之剝離步驟。 According to a second aspect of the invention, there is provided a method for producing a member for a liquid crystal display panel, comprising the step of peeling off the first support structure and the second support structure from the first aspect.

於第2態樣中,在剝離步驟中,第1支撐構造體及第2支撐構造體自密封構造體之剝離較佳為自密封構造體之一端部緩慢地進行。 In the second aspect, in the peeling step, the peeling of the first support structure and the second support structure from the sealing structure is preferably performed slowly at one end portion of the self-sealing structure.

根據本發明,可提供一種能夠抑制支撐構造體之剝離時之密封部之剝離或玻璃基板之損傷、為了製造液晶顯示面板用構件而使用之密封構造體。 According to the present invention, it is possible to provide a sealing structure for use in manufacturing a member for a liquid crystal display panel, which is capable of suppressing peeling of a sealing portion or damage of a glass substrate when the support structure is peeled off.

10、200、300、400‧‧‧密封構造體 10, 200, 300, 400‧‧‧ Sealed structures

11‧‧‧第1積層體 11‧‧‧1st layered body

12‧‧‧第2積層體 12‧‧‧2nd layered body

13‧‧‧密封部 13‧‧‧ Sealing Department

14‧‧‧接著部 14‧‧‧Continue

20‧‧‧液晶顯示面板用構件 20‧‧‧Components for LCD panels

111‧‧‧第1玻璃基板 111‧‧‧1st glass substrate

112‧‧‧第1支撐構造體 112‧‧‧1st support structure

113‧‧‧第1支撐板 113‧‧‧1st support plate

114‧‧‧第1黏著層 114‧‧‧1st adhesive layer

121‧‧‧第2玻璃基板 121‧‧‧2nd glass substrate

122‧‧‧第2支撐構造體 122‧‧‧2nd support structure

123‧‧‧第2支撐板 123‧‧‧2nd support plate

124‧‧‧第2黏著層 124‧‧‧2nd adhesive layer

L‧‧‧剝離邊界線 L‧‧‧ peeling boundary line

圖1係表示本發明之密封構造體之第1實施形態之俯視圖。 Fig. 1 is a plan view showing a first embodiment of the sealing structure of the present invention.

圖2係圖1所示之密封構造體之A-A線剖面圖。 Fig. 2 is a cross-sectional view taken along line A-A of the sealing structure shown in Fig. 1.

圖3係說明自圖1所示之密封構造體剝離第1支撐構造體之剝離方法之說明圖。 Fig. 3 is an explanatory view for explaining a peeling method of peeling off the first support structure from the seal structure shown in Fig. 1;

圖4係表示本發明之密封構造體之第2實施形態之俯視圖。 Fig. 4 is a plan view showing a second embodiment of the sealing structure of the present invention.

圖5係圖4所示之密封構造體之A-A線剖面圖。 Fig. 5 is a cross-sectional view taken along line A-A of the sealing structure shown in Fig. 4;

圖6係說明自圖4所示之密封構造體剝離第1支撐構造體之剝離方法之說明圖。 Fig. 6 is an explanatory view for explaining a peeling method of peeling off the first support structure from the seal structure shown in Fig. 4;

圖7係表示密封構造體之變化例之俯視圖。 Fig. 7 is a plan view showing a modification of the sealing structure.

圖8係表示密封構造體之另一變化例之俯視圖。 Fig. 8 is a plan view showing another modification of the sealing structure.

以下,對本發明之實施形態進行說明。 Hereinafter, embodiments of the present invention will be described.

再者,列舉滿足下述式(1)及式(2)之關係之方面作為本發明之特徵點。關於式(1)及式(2)之詳細情況將於下文敍述。 In addition, aspects which satisfy the relationship of the following formula (1) and formula (2) are listed as the characteristic points of this invention. Details of the formulas (1) and (2) will be described below.

<第1實施形態> <First embodiment>

以下,參照圖式對密封構造體之第1實施形態進行具體說明。 Hereinafter, the first embodiment of the sealing structure will be specifically described with reference to the drawings.

圖1、2係表示密封構造體之第1實施形態之一例之俯視圖及A-A線剖面圖。 Figs. 1 and 2 are a plan view and a cross-sectional view taken along line A-A showing an example of the first embodiment of the sealing structure.

密封構造體10係用於製造液晶顯示面板用構件20者,且如圖2所示,於一部分具有成為液晶顯示面板用構件20之部分。密封構造體10包含第1積層體11、第2積層體12及密封部13。再者,密封構造體10不含接著部。 The sealing structure 10 is used for manufacturing the liquid crystal display panel member 20, and as shown in FIG. 2, has a portion which is a member for the liquid crystal display panel 20. The sealed structure 10 includes the first layered body 11 , the second layered body 12 , and the sealing portion 13 . Furthermore, the sealing structure 10 does not include a follower.

第1積層體11與第2積層體12係設置間隔而對向配置。密封部13係於第1積層體11與第2積層體12之間,以例如包圍成為液晶顯示面板之形成區域之方式設置成例如複數個框狀。於圖1所示之密封構造體10中,對應於6個形成區域而設置有6個框狀之密封部13。 The first layered body 11 and the second layered body 12 are arranged to face each other with a space therebetween. The sealing portion 13 is provided between the first layered body 11 and the second layered body 12, and is provided, for example, in a plurality of frame shapes so as to surround the formation region of the liquid crystal display panel. In the seal structure 10 shown in Fig. 1, six frame-shaped seal portions 13 are provided corresponding to the six formation regions.

第1積層體11包含第1玻璃基板111、及可剝離地貼合於該第1玻璃基板111之第1支撐構造體112。第1支撐構造體112進而包含第1支撐板113、及設置於該第1支撐板113之一主面之第1黏著層114。第1支撐構造體112係藉由第1黏著層114而可剝離地貼合於第1玻璃基板111。 The first layered body 11 includes a first glass substrate 111 and a first support structure 112 that is detachably bonded to the first glass substrate 111. The first support structure 112 further includes a first support plate 113 and a first adhesive layer 114 provided on one main surface of the first support plate 113. The first support structure 112 is detachably bonded to the first glass substrate 111 by the first adhesive layer 114 .

第2積層體12包含第2玻璃基板121、及可剝離地貼合於該第2玻璃基板121之第2支撐構造體122。第2支撐構造體122進而包含第2支撐板123、及設置於該第2支撐板123之一主面之第2黏著層124。第2支撐構造體122係藉由第2黏著層124而可剝離地貼合於第2玻璃基板121。 The second laminated body 12 includes a second glass substrate 121 and a second support structure 122 that is detachably bonded to the second glass substrate 121 . The second support structure 122 further includes a second support plate 123 and a second adhesive layer 124 provided on one main surface of the second support plate 123. The second support structure 122 is detachably bonded to the second glass substrate 121 by the second adhesive layer 124 .

再者,密封構造體10中之除第1支撐構造體112及第2支撐構造體122以外之部分、即第1玻璃基板111、第2玻璃基板121、及配置於該 等之間之密封部13成為液晶顯示面板用構件20。 In addition, the first glass substrate 111, the second glass substrate 121, and the portions other than the first support structure 112 and the second support structure 122 in the sealing structure 10 are disposed on the first glass substrate 111 and the second glass substrate 121. The sealing portion 13 between the two serves as the member 20 for the liquid crystal display panel.

第1積層體11與第2積層體12係以第1玻璃基板111與第2玻璃基板121對向之方式配置。於第1玻璃基板111、第2玻璃基板121之表面中之成為液晶顯示面板之形成區域,雖未圖示,但根據液晶顯示方式並視需要形成有絕緣膜、透明電極膜、薄膜電晶體(TFT)或薄膜二極體(TFD)等開關元件、彩色濾光片(CF)等。 The first layered body 11 and the second layered body 12 are disposed such that the first glass substrate 111 and the second glass substrate 121 face each other. The formation region of the liquid crystal display panel among the surfaces of the first glass substrate 111 and the second glass substrate 121 is not shown, but an insulating film, a transparent electrode film, and a thin film transistor are formed as needed according to the liquid crystal display method. Switching elements such as TFT) or thin film diode (TFD), color filter (CF), and the like.

密封部13係於第1積層體11與第2積層體12之間,以包圍成為液晶顯示面板之形成區域之方式設置成框狀,並且接著第1積層體11與第2積層體12。密封部13係根據形成區域之個數而形成,如圖示般於形成區域為複數個之情形時,形成有複數個,於形成區域僅為1個之情形時,僅形成1個。 The sealing portion 13 is provided between the first layered body 11 and the second layered body 12, and is formed in a frame shape so as to surround the formation region of the liquid crystal display panel, and then the first layered body 11 and the second layered body 12. The sealing portion 13 is formed according to the number of formation regions. When a plurality of formation regions are formed as shown in the figure, a plurality of the formation regions are formed, and when the formation region is only one, only one is formed.

於密封部13之內部既可填充液晶,亦可不填充。於藉由液晶滴加貼合方式進行製造之情形時,於密封構造體10中之密封部13之內部填充有液晶,且為了保持內部之液晶,各個密封部13之形狀係設為不具有開口部之連續之框狀。另一方面,於藉由液晶注入方式進行製造之情形時,通常於密封構造體10中之密封部13之內部未填充液晶,各個密封部13之形狀係設為具有開口部之框狀,該開口部成為用以於後續步驟中向內部注入液晶之注入口。 The inside of the sealing portion 13 may or may not be filled with liquid crystal. In the case of manufacturing by the liquid crystal dropping and bonding method, the inside of the sealing portion 13 in the sealing structure 10 is filled with liquid crystal, and the shape of each sealing portion 13 is set to have no opening in order to hold the liquid crystal inside. The continuous frame of the department. On the other hand, in the case of manufacturing by the liquid crystal injection method, the inside of the sealing portion 13 in the sealing structure 10 is usually not filled with liquid crystal, and the shape of each sealing portion 13 is a frame shape having an opening. The opening portion serves as an injection port for injecting liquid crystal into the inside in a subsequent step.

密封構造體10滿足以下之式(1-1)及(2-1)。再者,由於密封構造體10中無接著部,故而上述式(1)中之(Z1×W1)及(Z2×W2)分別相當於0。 The sealing structure 10 satisfies the following formulas (1-1) and (2-1). Further, since there is no follower in the sealed structure 10, (Z1 × W1) and (Z2 × W2) in the above formula (1) correspond to 0, respectively.

式(1-1) (X1×Y1)/(A1×B1)>1 Formula (1-1) (X1×Y1)/(A1×B1)>1

式(2-1) (X2×Y2)/(A2×B2)>1 Formula (2-1) (X2×Y2)/(A2×B2)>1

式(1-1)中,X1表示密封部13與第1玻璃基板111之間之剝離強度(N/mm)。剝離強度之測定方法並無特別限制,可使用SAICAS等公知之測定裝置進行測定。作為X1,只要滿足上述關係則其值並無特別 限制,但就可進一步抑制支撐構造體之剝離時之密封部之剝離或玻璃基板之損傷的方面而言,較佳為0.10 N/mm以上,更佳為0.15 N/mm以上。上限並無特別限制。 In the formula (1-1), X1 represents the peel strength (N/mm) between the sealing portion 13 and the first glass substrate 111. The method for measuring the peel strength is not particularly limited, and measurement can be carried out using a known measuring device such as SAICAS. As X1, as long as the above relationship is satisfied, its value is not special. However, it is preferably 0.10 N/mm or more, and more preferably 0.15 N/mm or more, from the viewpoint of further suppressing peeling of the sealing portion or damage of the glass substrate at the time of peeling of the support structure. The upper limit is not particularly limited.

Y1表示密封部13與第1玻璃基板111之總接觸面積(mm2)。於圖1及2所示之密封部13之情形時,意指6個框狀之密封部13與第1玻璃基板11接觸之面積之總和。換言之,相當於圖1中之密封部13所占之總面積。 Y1 represents the total contact area (mm 2 ) between the sealing portion 13 and the first glass substrate 111. In the case of the sealing portion 13 shown in Figs. 1 and 2, it means the sum of the areas where the six frame-shaped sealing portions 13 are in contact with the first glass substrate 11. In other words, it corresponds to the total area occupied by the sealing portion 13 in Fig. 1.

A1表示第1玻璃基板111與第1支撐構造體112之間之剝離強度(N/mm)。如上所述,第1玻璃基板111與第1支撐構造體112係可剝離地貼合。作為A1,只要滿足上述關係則其值並無特別限制,但就可進一步抑制支撐構造體之剝離時之密封部之剝離或玻璃基板之損傷的方面而言,較佳為0.015 N/mm以下,更佳為0.010 N/mm以下。上限並無特別限制,但就可進一步抑制第1玻璃基板111之位置偏移之方面而言,較佳為0.001 N/mm以上。 A1 represents the peel strength (N/mm) between the first glass substrate 111 and the first support structure 112. As described above, the first glass substrate 111 and the first support structure 112 are detachably bonded to each other. The value of A1 is not particularly limited as long as the above-mentioned relationship is satisfied. However, it is preferable to further suppress the peeling of the sealing portion or the damage of the glass substrate when the support structure is peeled off, and it is preferably 0.015 N/mm or less. More preferably, it is 0.010 N/mm or less. The upper limit is not particularly limited, but it is preferably 0.001 N/mm or more in terms of further suppressing the positional shift of the first glass substrate 111.

B1表示第1玻璃基板111與第1支撐構造體112之總接觸面積(mm2)。於圖1及2之情形時,第1玻璃基板111與第1支撐構造體112係遍及整個面地接觸,兩者之總接觸面積相當於第1玻璃基板111(或第1支撐構造體112)之面積。 B1 represents the total contact area (mm 2 ) between the first glass substrate 111 and the first support structure 112. In the case of FIGS. 1 and 2, the first glass substrate 111 and the first support structure 112 are in contact with each other over the entire surface, and the total contact area of the first glass substrate 111 corresponds to the first glass substrate 111 (or the first support structure 112). The area.

藉由使密封構造體10滿足式(1-1)之關係,可於自密封構造體10剝離第1支撐構造體112時,抑制密封部13之剝離或第1玻璃基板111之損傷。 When the sealing structure 10 satisfies the relationship of the formula (1-1), when the first supporting structure 112 is peeled off from the self-sealing structure 10, peeling of the sealing portion 13 or damage of the first glass substrate 111 can be suppressed.

若僅控制密封部13與第1玻璃基板111之間之剝離強度、與第1玻璃基板111與第1支撐構造體112之間之剝離強度的差,則於剝離第1支撐構造體112時,無法充分地抑制密封部13之剝離或第1玻璃基板111之損傷。推測其原因在於:剝離第1支撐構造體112時之應力不僅波及至局部之部分,而且波及至整個面。因此,本發明者等人想到密封部 13與第1玻璃基板111之總接觸面積、及第1玻璃基板111與第1支撐構造體112之總接觸面積會對表現所期望之效果發揮重要作用,從而發現必須滿足式(1-1)之關係。亦即,於式(1-1)中,將密封部13與第1玻璃基板111之間之剝離強度X1乘以接觸面積Y1所得之值與第1玻璃基板111與第1支撐構造體112之間之剝離強度A1乘以接觸面積B1所得之值進行比較,若該值超過特定值,則意為可抑制密封部之剝離或玻璃基板之損傷。再者,剝離強度乘以總接觸面積所得之值意為接著之兩者之間之剝離能之總和。 When only the peeling strength between the sealing portion 13 and the first glass substrate 111 and the difference in peel strength between the first glass substrate 111 and the first supporting structure 112 are controlled, when the first supporting structure 112 is peeled off, The peeling of the sealing portion 13 or the damage of the first glass substrate 111 cannot be sufficiently suppressed. It is presumed that the reason is that the stress when the first support structure 112 is peeled off is not only spread to a part but also to the entire surface. Therefore, the inventors of the present invention have thought of the sealing portion. The total contact area with the first glass substrate 111 and the total contact area between the first glass substrate 111 and the first support structure 112 play an important role in expressing the desired effect, and it is found that the formula (1-1) must be satisfied. Relationship. In the formula (1-1), the peeling strength X1 between the sealing portion 13 and the first glass substrate 111 is multiplied by the contact area Y1, and the first glass substrate 111 and the first support structure 112 are The peeling strength A1 is multiplied by the value obtained by the contact area B1, and if the value exceeds a specific value, it means that the peeling of the sealing portion or the damage of the glass substrate can be suppressed. Further, the value obtained by multiplying the peel strength by the total contact area means the sum of the peeling energies between the two.

再者,於式(1-1)中,雖然(X1×Y1)/(A1×B1)超過1,但就可進一步抑制密封部之剝離或玻璃基板之損傷之方面而言,較佳為1.10以上,更佳為1.40以上。再者,上限並無特別限制,但10以下之情形較多。 Further, in the formula (1-1), (X1 × Y1) / (A1 × B1) exceeds 1, but it is possible to further suppress the peeling of the sealing portion or the damage of the glass substrate, preferably 1.10. More preferably, it is 1.40 or more. Furthermore, the upper limit is not particularly limited, but there are many cases of 10 or less.

又,藉由使密封構造體10滿足式(2-1)之關係,可於自密封構造體10剝離第2支撐構造體122時,抑制密封部13之剝離或第2玻璃基板121之損傷。 In addition, when the sealing structure 10 satisfies the relationship of the formula (2-1), when the second supporting structure 122 is peeled off from the self-sealing structure 10, the peeling of the sealing portion 13 or the damage of the second glass substrate 121 can be suppressed.

式(2-1)中,X2表示密封部13與第2玻璃基板121之間之剝離強度(N/mm)。剝離強度之測定方法並無特別限制,可使用SAICAS等公知之測定裝置進行測定。X2之較佳態樣與上述X1之較佳態樣相同。 In the formula (2-1), X2 represents the peel strength (N/mm) between the sealing portion 13 and the second glass substrate 121. The method for measuring the peel strength is not particularly limited, and measurement can be carried out using a known measuring device such as SAICAS. The preferred aspect of X2 is the same as the preferred aspect of X1 above.

Y2表示密封部13與第2玻璃基板121之總接觸面積(mm2)。於圖1及2所示之密封部13之情形時,意指6個框狀之密封部13與第2玻璃基板121接觸之面積之總和。 Y2 represents the total contact area (mm 2 ) between the sealing portion 13 and the second glass substrate 121. In the case of the sealing portion 13 shown in Figs. 1 and 2, it means the sum of the areas where the six frame-shaped sealing portions 13 are in contact with the second glass substrate 121.

A2表示第2玻璃基板121與第2支撐構造體122之間之剝離強度(N/mm)。如上所述,第2玻璃基板121與第2支撐構造體122係可剝離地貼合。A2之較佳態樣與上述A1之較佳態樣相同。 A2 represents the peel strength (N/mm) between the second glass substrate 121 and the second support structure 122. As described above, the second glass substrate 121 and the second support structure 122 are detachably bonded to each other. The preferred aspect of A2 is the same as the preferred aspect of A1 above.

B2表示第2玻璃基板121與第2支撐構造體122之總接觸面積(mm2)。於圖1及2之情形時,第2玻璃基板121與第2支撐構造體122係 遍及整個面地接觸,兩者之總接觸面積相當於第1玻璃基板111(或第1支撐構造體112)之面積。 B2 represents the total contact area (mm 2 ) between the second glass substrate 121 and the second support structure 122. In the case of FIGS. 1 and 2, the second glass substrate 121 and the second support structure 122 are in contact with each other over the entire surface, and the total contact area of the two is equivalent to the first glass substrate 111 (or the first support structure 112). The area.

進而,於式(2-1)中,雖然(X2×Y2)/(A2×B2)超過1,但就可進一步抑制密封部之剝離或玻璃基板之損傷之方面而言,較佳為1.10以上,更佳為1.40以上。再者,上限並無特別限制,但10以下之情形較多。 Further, in the formula (2-1), (X2 × Y2) / (A2 × B2) is more than 1, but it is preferable to further suppress the peeling of the sealing portion or the damage of the glass substrate, and it is preferably 1.10 or more. More preferably, it is 1.40 or more. Furthermore, the upper limit is not particularly limited, but there are many cases of 10 or less.

又,於密封構造體10中,就可進一步抑制密封部之剝離或玻璃基板之損傷之方面而言,X1/A1或X2/A2較佳為5~100,更佳為10~100。 Further, in the sealing structure 10, X1/A1 or X2/A2 is preferably 5 to 100, and more preferably 10 to 100, in terms of further suppressing peeling of the sealing portion or damage of the glass substrate.

進而,於密封構造體10中,就可進一步抑制密封部之剝離或玻璃基板之損傷之方面而言,Y1/B1或Y2/B2較佳為5~100,更佳為10~100。 Further, in the sealing structure 10, Y1/B1 or Y2/B2 is preferably 5 to 100, and more preferably 10 to 100, in terms of further suppressing peeling of the sealing portion or damage of the glass substrate.

作為第1玻璃基板111、第2玻璃基板121,分別使用板厚為0.3 mm以下之玻璃板。藉由將板厚設為0.3 mm以下,可有效地使液晶顯示面板輕量化。第1玻璃基板111、第2玻璃基板121之大小並無特別限制,例如,較佳為縱100 mm以上×橫100 mm以上,更佳為縱500 mm以上×橫500 mm以上。尤佳為縱730 mm以上×橫920 mm以上之大小。藉由設為此種大小,可有效率地製造複數個液晶顯示面板。作為此種第1玻璃基板111、第2玻璃基板121,使用液晶顯示面板之製造所使用之公知之玻璃板。 As the first glass substrate 111 and the second glass substrate 121, a glass plate having a thickness of 0.3 mm or less is used. By setting the thickness to 0.3 mm or less, the liquid crystal display panel can be effectively made lighter. The size of the first glass substrate 111 and the second glass substrate 121 is not particularly limited. For example, it is preferably 100 mm or more in length × 100 mm or more in width, more preferably 500 mm in length or more than 500 mm in width. It is especially suitable for the length of 730 mm or more × 920 mm or more. By setting it to such a size, a plurality of liquid crystal display panels can be efficiently manufactured. As such a first glass substrate 111 and a second glass substrate 121, a known glass plate used for the production of a liquid crystal display panel is used.

玻璃板係將玻璃原料熔融,並將熔融玻璃成形為板狀而獲得。作為此種成形方法,可為一般方法,例如使用浮式法、熔融法、流孔下引法、富可法、魯伯法等。尤其是板厚較薄之玻璃板係藉由如下方法(再曳引法)較佳地成形而獲得:將暫時成形為板狀之玻璃加熱至可成形溫度,並利用延伸等方法拉伸而使其變薄。 The glass plate is obtained by melting a glass raw material and forming the molten glass into a plate shape. As such a molding method, a general method such as a floating method, a melting method, a flow down method, a rich method, a Luber method, or the like can be used. In particular, a glass plate having a thin plate thickness is preferably formed by a method in which a glass temporarily formed into a plate shape is heated to a moldable temperature and stretched by stretching or the like. It is thinner.

玻璃板之種類可不必受到限定,較佳為無鹼硼矽酸玻璃、硼矽 酸玻璃、鹼石灰玻璃、高矽玻璃、其他以氧化矽作為主要成分之氧化物系玻璃。作為氧化物系玻璃,較佳為藉由氧化物換算而得之氧化矽之含量為40~90質量%之玻璃。 The type of the glass plate may not be limited, and is preferably an alkali-free borosilicate glass or boron bismuth. Acid glass, soda lime glass, sorghum glass, and other oxide-based glass containing cerium oxide as a main component. The oxide-based glass is preferably a glass having a content of cerium oxide of 40 to 90% by mass in terms of oxide.

鹼金屬成分之溶出容易對液晶造成影響,故而尤佳為實質上不含鹼金屬成分之玻璃(無鹼玻璃)。作為無鹼玻璃,可列舉以氧化物基準之質量百分率表示,含有SiO2:50~66%、Al2O3:10.5~24%、B2O3:0~12%、MgO:0~8%、CaO:0~14.5%、SrO:0~24%、BaO:0~13.5%、MgO+CaO+SrO+BaO:9~29.5%、ZnO:0~5%者。 Since the elution of the alkali metal component is likely to affect the liquid crystal, it is particularly preferable to use a glass (alkali-free glass) which does not substantially contain an alkali metal component. The alkali-free glass is represented by mass percentage based on oxide, and contains SiO 2 : 50 to 66%, Al 2 O 3 : 10.5 to 24%, B 2 O 3 : 0 to 12%, and MgO: 0 to 8 %, CaO: 0 to 14.5%, SrO: 0 to 24%, BaO: 0 to 13.5%, MgO + CaO + SrO + BaO: 9 to 29.5%, and ZnO: 0 to 5%.

關於SiO2,若其含量未達50%,則應變點不會充分提高,並且化學耐久性變差,熱膨脹係數增大。若超過66%,則熔解性降低,失透溫度上升。較佳為58~66莫耳%。 Regarding SiO 2 , if the content is less than 50%, the strain point is not sufficiently increased, and the chemical durability is deteriorated, and the coefficient of thermal expansion is increased. When it exceeds 66%, the meltability is lowered and the devitrification temperature is increased. It is preferably 58 to 66 mol%.

Al2O3抑制玻璃之分相性,降低熱膨脹係數,且提高應變點。若其含量未達10.5%,則不會表現出該效果,若超過24%,則玻璃之熔解性變差。較佳為15~22%。 Al 2 O 3 suppresses the phase separation of the glass, lowers the coefficient of thermal expansion, and increases the strain point. If the content is less than 10.5%, the effect is not exhibited, and if it exceeds 24%, the meltability of the glass is deteriorated. It is preferably 15 to 22%.

B2O3並非必需成分,但可提高對半導體形成時所使用之各種化學品等之化學耐久性,並且可不使高溫下之黏性提高而達成熱膨脹係數與密度之降低。若其含量超過12%,則耐酸性變差,並且應變點變低。較佳為5~12%。 B 2 O 3 is not an essential component, but can improve the chemical durability of various chemicals used in the formation of a semiconductor, and can achieve a decrease in thermal expansion coefficient and density without increasing the viscosity at a high temperature. If the content exceeds 12%, the acid resistance is deteriorated and the strain point becomes low. It is preferably 5 to 12%.

MgO於鹼土類金屬氧化物中降低熱膨脹係數,且應變點不會降低,故而雖並非必需成分但亦可含有。若其含量超過8%,則對半導體形成時所使用之各種化學品等之化學耐久性降低,又,易於產生玻璃之分相。 MgO reduces the coefficient of thermal expansion in the alkaline earth metal oxide, and the strain point does not decrease, so it may not be an essential component but may be contained. When the content exceeds 8%, the chemical durability of various chemicals used in the formation of a semiconductor is lowered, and the phase separation of the glass is apt to occur.

CaO並非必需成分,但藉由含有CaO可提高玻璃之熔解性。另一方面,若超過14.5%,則熱膨脹係數變大,失透溫度亦上升。較佳為0~9%。 CaO is not an essential component, but the solubility of glass can be improved by containing CaO. On the other hand, when it exceeds 14.5%, the thermal expansion coefficient will become large, and the devitrification temperature will also rise. It is preferably 0 to 9%.

SrO並非必需成分,但由於其抑制玻璃之分相,且提高對半導體形成時所使用之各種化學品等之化學耐久性,故而為有用之成分。若其含量超過24%,則膨脹係數增大。較佳為3~12.5%。 SrO is not an essential component, but is a useful component because it suppresses the phase separation of the glass and improves the chemical durability of various chemicals used in the formation of a semiconductor. If the content exceeds 24%, the expansion coefficient increases. It is preferably 3 to 12.5%.

BaO並非必需成分,但就密度較小且減小熱膨脹係數之觀點而言為有用之成分。其含量為0~13.5%,較佳為0~2%。 BaO is not an essential component, but is a useful component from the viewpoint of a small density and a small coefficient of thermal expansion. The content is 0 to 13.5%, preferably 0 to 2%.

若MgO+CaO+SrO+BaO未達9%,則難以熔解,若超過29.5%,則密度變大。MgO+CaO+SrO+BaO較佳為9~18%。 If MgO+CaO+SrO+BaO is less than 9%, it is difficult to melt, and if it exceeds 29.5%, the density becomes large. MgO+CaO+SrO+BaO is preferably from 9 to 18%.

ZnO並非必需成分,但為了改善玻璃之熔解性、澄清性、成形性,可添加ZnO。其含量為0~5%,較佳為0~2%。 ZnO is not an essential component, but ZnO may be added in order to improve the meltability, clarity, and formability of the glass. The content is 0 to 5%, preferably 0 to 2%.

無鹼玻璃中,除上述成分以外,為了改善玻璃之熔解性、澄清性、成形性,亦可添加總量為5%以下之SO3、F、Cl。 In the alkali-free glass, in addition to the above components, SO 3 , F, and Cl may be added in a total amount of 5% or less in order to improve the meltability, clarity, and moldability of the glass.

作為無鹼玻璃,較佳為可列舉以氧化物基準之質量百分率表示含有SiO2:58~66%、Al2O3:15~22%、B2O3:5~12%、MgO:0~8%、CaO:0~9%、SrO:3~12.5%、BaO:0~2%、MgO+CaO+SrO+BaO:9~18%、ZnO:0~2%者。 The alkali-free glass preferably contains SiO 2 : 58 to 66%, Al 2 O 3 : 15 to 22%, B 2 O 3 : 5 to 12%, and MgO: 0 by mass percentage based on oxide. ~8%, CaO: 0~9%, SrO: 3~12.5%, BaO: 0~2%, MgO+CaO+SrO+BaO: 9~18%, ZnO: 0~2%.

無鹼玻璃之應變點較佳為640℃以上,更佳為650℃以上。熱膨脹係數較佳為未達40×10-7/℃,更佳為30×10-7/℃以上且未達40×10-7/℃。密度較佳為未達2.60 g/cc,更佳為未達2.55 g/cc,進而較佳為未達2.50 g/cc。 The strain point of the alkali-free glass is preferably 640 ° C or higher, more preferably 650 ° C or higher. The coefficient of thermal expansion is preferably less than 40 × 10 -7 / ° C, more preferably 30 × 10 -7 / ° C or more and less than 40 × 10 -7 / ° C. The density is preferably less than 2.60 g/cc, more preferably less than 2.55 g/cc, and even more preferably less than 2.50 g/cc.

作為第1支撐板113、第2支撐板123,只要能有效地支撐第1玻璃基板111、第2玻璃基板121則無特別限定,作為較佳者可列舉玻璃板、金屬板、樹脂板。第1玻璃基板111與第1支撐板113之線膨脹係數之差較佳為150×10-7/℃以下,更佳為100×10-7/℃以下,進而較佳為50×10-7/℃以下。同樣地,第2玻璃基板121與第2支撐板123之線膨脹係數之差較佳為150×10-7/℃以下,更佳為100×10-7/℃以下,進而較佳為50×10-7/℃以下。 The first support plate 113 and the second support plate 123 are not particularly limited as long as they can effectively support the first glass substrate 111 and the second glass substrate 121. Preferred examples thereof include a glass plate, a metal plate, and a resin plate. The difference in linear expansion coefficient between the first glass substrate 111 and the first support plate 113 is preferably 150 × 10 -7 / ° C or less, more preferably 100 × 10 -7 / ° C or less, and further preferably 50 × 10 -7 / °C below. Similarly, the difference in linear expansion coefficient between the second glass substrate 121 and the second support plate 123 is preferably 150 × 10 -7 / ° C or less, more preferably 100 × 10 -7 / ° C or less, and further preferably 50 × 10 -7 / °C or less.

作為玻璃板,使用與第1玻璃基板111或第2玻璃基板121所使用者相同之種類,較佳為無鹼硼矽酸玻璃、硼矽酸玻璃、鹼石灰玻璃、高矽玻璃、其他以氧化矽作為主要成分之氧化物系玻璃。作為金屬板,可例示不鏽鋼、銅等。 As the glass plate, the same type as the user of the first glass substrate 111 or the second glass substrate 121 is used, and preferably an alkali-free borosilicate glass, a borosilicate glass, a soda lime glass, a sorghum glass, or the like is oxidized. Oxide-based glass as a main component. As the metal plate, stainless steel, copper, or the like can be exemplified.

作為樹脂板,可例示:聚對苯二甲酸乙二酯樹脂、聚碳酸酯樹脂、聚醯亞胺樹脂、氟樹脂、聚醯胺樹脂、聚芳醯胺樹脂、聚醚碸樹脂、聚醚酮樹脂、聚醚醚酮樹脂、聚萘二甲酸乙二酯樹脂、聚丙烯酸樹脂、各種液晶聚合物樹脂、聚矽氧樹脂等。 As the resin sheet, polyethylene terephthalate resin, polycarbonate resin, polyimine resin, fluororesin, polyamide resin, polyarylamine resin, polyether oxime resin, polyether ketone can be exemplified Resin, polyetheretherketone resin, polyethylene naphthalate resin, polyacrylic resin, various liquid crystal polymer resins, polyoxyxylene resins, and the like.

第1支撐板113、第2支撐板123之板厚並無特別限定,就有效地支撐第1玻璃基板111、第2玻璃基板121之觀點而言,分別較佳為0.1~1.1 mm之板厚。第1支撐板113、第2支撐板123之板厚尤佳為可應用於現行之液晶顯示面板之生產線之板厚。例如,現行之液晶顯示面板之生產線所使用之玻璃基板之板厚處於0.5~1.2 mm之範圍內,尤其以0.7 mm居多。因此,較佳為考慮第1玻璃基板111或第2玻璃基板121之板厚為0.3 mm以下,同時決定第1支撐板113或第2支撐板123之板厚,以使例如第1積層體11或第2積層體12之板厚成為0.7 mm。 The thickness of the first support plate 113 and the second support plate 123 is not particularly limited, and is preferably 0.1 to 1.1 mm in terms of effectively supporting the first glass substrate 111 and the second glass substrate 121. . The thickness of the first support plate 113 and the second support plate 123 is particularly preferably a plate thickness which can be applied to a production line of a conventional liquid crystal display panel. For example, the thickness of the glass substrate used in the production line of the current liquid crystal display panel is in the range of 0.5 to 1.2 mm, especially 0.7 mm. Therefore, it is preferable to consider the thickness of the first support plate 113 or the second support plate 123 in consideration of the thickness of the first glass substrate 111 or the second glass substrate 121 of 0.3 mm or less, for example, to make the first laminated body 11 Or the thickness of the second layered body 12 is 0.7 mm.

第1黏著層114能夠供第1玻璃基板111可剝離地貼合,只要為第1玻璃基板111與第1黏著層114之剝離強度較第1支撐板113與第1黏著層114之剝離強度低者則無特別限制。第1黏著層114主要係為了抑制第1玻璃基板111之位置偏移而使用。 The first adhesive layer 114 can be bonded to the first glass substrate 111 in a peelable manner, and the peel strength between the first glass substrate 111 and the first adhesive layer 114 is lower than that of the first support plate 113 and the first adhesive layer 114. There are no special restrictions. The first adhesive layer 114 is mainly used to suppress the positional shift of the first glass substrate 111.

再者,關於第2黏著層124亦基本上相同,故而僅對第1黏著層114進行說明。 Further, since the second adhesive layer 124 is also substantially the same, only the first adhesive layer 114 will be described.

於自密封構造體10剝離第1支撐構造體112之情形時,必須於第1玻璃基板111與第1黏著層114之間剝離,而於第1支撐板113與第1黏著層114之間不會剝離。因此,第1黏著層114較佳為不易與第1支撐板113剝離,而容易與第1玻璃基板111剝離。 When the first support structure 112 is peeled off from the self-sealing structure 10, it is necessary to peel between the first glass substrate 111 and the first adhesive layer 114, and between the first support plate 113 and the first adhesive layer 114. Will be stripped. Therefore, it is preferable that the first adhesive layer 114 is not easily peeled off from the first support plate 113 and is easily peeled off from the first glass substrate 111.

作為使第1玻璃基板111與第1黏著層114之剝離強度低於第1支撐板113與第1黏著層114之剝離強度之方法,例如,可列舉如下方法:使用硬化性聚矽氧樹脂組合物作為構成第1黏著層114者,於第1支撐板113上塗佈硬化性聚矽氧樹脂組合物,並使其硬化而形成第1黏著層114後,於第1黏著層114上貼合第1玻璃基板111。 The method of making the peeling strength of the first glass substrate 111 and the first adhesive layer 114 lower than the peeling strength of the first support plate 113 and the first adhesive layer 114 is, for example, a method in which a curable polyoxymethylene resin combination is used. As the first adhesive layer 114, the curable polyoxynoxy resin composition is applied onto the first support plate 113 and cured to form the first adhesive layer 114, and then bonded to the first adhesive layer 114. The first glass substrate 111.

又,於即便使硬化性聚矽氧樹脂組合物與第1玻璃基板111及第1支撐板113之兩者接觸並使其硬化,與第1支撐板113之剝離強度亦高於與第1玻璃基板111之剝離強度之情形時,亦可使硬化性聚矽氧樹脂組合物與第1玻璃基板111及第1支撐板113之兩者接觸並使其硬化。作為此種方法,例如,可列舉對第1支撐板113之表面進行為了提高結合力而提高矽烷醇基之濃度之表面處理的方法。 In addition, even if the curable polyoxynoxy resin composition is brought into contact with both the first glass substrate 111 and the first support plate 113 and cured, the peeling strength with the first support plate 113 is higher than that of the first glass. In the case of the peeling strength of the substrate 111, the curable polyoxyxene resin composition may be brought into contact with both the first glass substrate 111 and the first support plate 113 to be cured. As such a method, for example, a method of subjecting the surface of the first support plate 113 to surface treatment for increasing the binding strength to increase the concentration of the stanol group can be mentioned.

作為硬化性聚矽氧樹脂組合物,較佳為含有例如線性有機烯基聚矽氧烷、線性有機氫聚矽氧烷、及觸媒等添加劑,且藉由加熱而硬化之加成反應型硬化性聚矽氧樹脂組合物。加成反應型硬化性聚矽氧樹脂組合物與其他硬化性聚矽氧樹脂組合物相比,硬化反應容易進行,硬化收縮亦較低,硬化物之剝離較容易。作為加成反應型硬化性聚矽氧樹脂組合物之形態,可列舉溶劑型、乳液型、無溶劑型等,可為任一形態。作為加成反應型硬化性聚矽氧樹脂組合物,較佳為例如國際公開第2011/024775號所揭示者。 The curable polyoxyxene resin composition preferably contains an additive such as a linear organic alkenyl polysiloxane, a linear organic hydrogen polyoxyalkylene, and a catalyst, and is hardened by heating to form an addition reaction type hardening. Polyoxygenated resin composition. The addition reaction type curable polyanthracene resin composition is easier to carry out the curing reaction than the other curable polyoxynoxy resin composition, and the curing shrinkage is also low, and the peeling of the cured product is easy. The form of the addition reaction type curable polyanthracene resin composition may, for example, be a solvent type, an emulsion type or a solventless type, and may be in any form. The addition reaction type curable polyoxyxene resin composition is preferably disclosed, for example, in International Publication No. 2011/024775.

再者,於第1實施形態中使用了第1黏著層114及第2黏著層124,但於第1玻璃基板111與第1支撐板113之間、及第2玻璃基板121與第2支撐板123之間能以所需之關係可剝離地積層之情形時,亦可不使用第1黏著層114及第2黏著層124。 Further, in the first embodiment, the first adhesive layer 114 and the second adhesive layer 124 are used, but between the first glass substrate 111 and the first support plate 113, and the second glass substrate 121 and the second support plate. When the 123 layers can be peelably laminated in a desired relationship, the first adhesive layer 114 and the second adhesive layer 124 may not be used.

密封部13只要可接著第1玻璃基板111與第2玻璃基板121則無特別限制,可使用此種液晶顯示面板用構件之製造中通常所使用之公知之使環氧系樹脂等密封材料硬化而成者。 The sealing portion 13 is not particularly limited as long as the first glass substrate 111 and the second glass substrate 121 can be used, and a sealing material such as an epoxy resin can be cured by using a member generally used for the production of the member for a liquid crystal display panel. Adult.

密封部13之寬度較佳為0.08 mm以上。藉由將寬度設為0.08 mm以上,可藉由密封部13有效地接著第1玻璃基板111與第2玻璃基板121,且可有效地抑制密封部13之剝離以及第1玻璃基板111及第2玻璃基板121之破損。寬度更佳為0.1 mm以上,進而較佳為0.5 mm以上。寬度通常只要為0.1 mm左右即可充分地接著第1玻璃基板111與第2玻璃基板121,但就生產性等觀點而言,較佳為5 mm以下,更佳為3 mm以下。 The width of the sealing portion 13 is preferably 0.08 mm or more. By setting the width to 0.08 mm or more, the first glass substrate 111 and the second glass substrate 121 can be effectively adhered to by the sealing portion 13, and the peeling of the sealing portion 13 and the first glass substrate 111 and the second can be effectively suppressed. The glass substrate 121 is damaged. The width is more preferably 0.1 mm or more, and further preferably 0.5 mm or more. The width of the first glass substrate 111 and the second glass substrate 121 can be sufficiently increased as long as the width is about 0.1 mm. However, from the viewpoint of productivity and the like, it is preferably 5 mm or less, and more preferably 3 mm or less.

又,於設置密封部13之情形時,較佳為將位於最外周部之密封部13之與積層體端邊相隔之距離設置於10 mm之範圍內。藉由縮短與積層體端邊相隔之距離,可有效地抑制密封部13之剝離以及第1玻璃基板111及第2玻璃基板121之破損。位於最外周部之密封部13之與積層體端邊相隔之距離更佳為5 mm之範圍內,進而較佳為3 mm之範圍內。 Further, in the case where the sealing portion 13 is provided, it is preferable that the distance between the sealing portion 13 located at the outermost peripheral portion and the edge of the laminated body is set within a range of 10 mm. By shortening the distance from the edge of the laminate, the peeling of the sealing portion 13 and the breakage of the first glass substrate 111 and the second glass substrate 121 can be effectively suppressed. The distance between the sealing portion 13 located at the outermost periphery and the end of the laminated body is preferably in the range of 5 mm, and more preferably in the range of 3 mm.

(密封構造體之製造方法) (Manufacturing method of sealing structure)

密封構造體10之製造方法並無特別限制,可利用公知之方法進行製造。例如,於製造第1積層體11及第2積層體12後,以包圍第1積層體11中之第1玻璃基板111或第2積層體12中之第2玻璃基板121之形成區域之方式塗佈成為密封部13之密封材料。其後,於採用液晶滴加貼合方式之情形時,對形成區域滴加液晶後,介隔密封材料及液晶積層第1積層體11與第2積層體12。又,於採用液晶注入方式之情形時,介隔密封材料積層第1積層體11與第2積層體12。 The method for producing the sealed structure 10 is not particularly limited, and it can be produced by a known method. For example, after the first layered body 11 and the second layered body 12 are produced, the first glass substrate 111 of the first layered body 11 or the second glass substrate 121 of the second layered body 12 is coated. The cloth becomes a sealing material for the sealing portion 13. Thereafter, when a liquid crystal dropping and bonding method is employed, liquid crystal is dropped on the formation region, and the first laminate 11 and the second laminate 12 are laminated with a sealing material and a liquid crystal. Moreover, in the case of using the liquid crystal injection method, the first layered body 11 and the second layered body 12 are laminated via a sealing material.

再者,密封材料之塗佈方法並無特別限制,既可使用分注器或噴墨裝置進行描繪,亦可藉由網版印刷進行印刷。再者,作為密封材料,並不限於環氧系樹脂,亦可為例如紫外線硬化型環氧改性丙烯酸系樹脂等。 Further, the coating method of the sealing material is not particularly limited, and it may be drawn using a dispenser or an inkjet device, or may be printed by screen printing. In addition, the sealing material is not limited to an epoxy resin, and may be, for example, an ultraviolet curable epoxy-modified acrylic resin.

於第1積層體11與第2積層體12之積層後,進行密封材料之硬化。 密封材料之硬化可根據密封材料之硬化方式而採用最佳之硬化方法,例如,於使用環氧系樹脂等作為密封材料之情形時藉由加熱進行硬化,於使用紫外線硬化型環氧改性丙烯酸系樹脂等作為密封材料之情形時藉由照射紫外線進行硬化。 After the first layered body 11 and the second layered body 12 are laminated, the sealing material is cured. The hardening of the sealing material may be performed by an optimum hardening method depending on the hardening method of the sealing material, for example, curing by heating in the case of using an epoxy resin or the like as a sealing material, and using ultraviolet curing epoxy-modified acrylic acid. When a resin or the like is used as the sealing material, it is cured by irradiation with ultraviolet rays.

再者,第1積層體11係藉由例如將第1玻璃基板111可剝離地貼合於第1支撐構造體112而製造。第1支撐構造體112係例如對第1支撐板113塗佈成為第1黏著層114之硬化性聚矽氧樹脂組合物,並使該硬化性聚矽氧樹脂組合物硬化而製造。第1積層體11係例如將第1玻璃基板111貼合於以此方式製造而成之第1支撐構造體112之第1黏著層114而製造。作為貼合方法,例如,可列舉使用加壓室之非接觸式壓接方法、使用輥或壓機之接觸式壓接方法。關於第2積層體12,亦能以基本上相同之方式製造。 In addition, the first layered body 11 is produced by, for example, attaching the first glass substrate 111 to the first support structure 112 in a peelable manner. The first support structure 112 is produced by, for example, applying a curable polyoxynoxy resin composition as the first adhesive layer 114 to the first support plate 113 and curing the curable polyoxynoxy resin composition. The first layered body 11 is produced by, for example, bonding the first glass substrate 111 to the first adhesive layer 114 of the first support structure 112 manufactured in this manner. Examples of the bonding method include a non-contact pressure bonding method using a pressurizing chamber, and a contact pressure bonding method using a roll or a press. The second laminated body 12 can also be manufactured in substantially the same manner.

於第1積層體11中之第1玻璃基板111及第2積層體12中之第2玻璃基板121各自之形成區域,根據液晶顯示方式,且視需要形成絕緣膜、透明電極膜、薄膜電晶體(TFT)或薄膜二極體(TFD)等開關元件、彩色濾光片(CF)等(圖案化步驟)。又,以可排列液晶分子之方式印刷聚醯亞胺膜等配向膜,並形成用以配向之溝槽(摩擦步驟)。 In each of the first glass substrate 111 of the first layered product 11 and the second glass substrate 121 of the second layered body 12, an insulating film, a transparent electrode film, and a thin film transistor are formed as needed according to a liquid crystal display method. A switching element such as (TFT) or a thin film diode (TFD), a color filter (CF), or the like (patterning step). Further, an alignment film such as a polyimide film is printed so that liquid crystal molecules can be aligned, and a groove for alignment is formed (friction step).

(液晶顯示面板用構件) (Member for liquid crystal display panel)

自密封構造體10剝離第1支撐構造體112及第2支撐構造體122而製造液晶顯示面板用構件20。 The first support structure 112 and the second support structure 122 are peeled off from the self-sealing structure 10 to manufacture the liquid crystal display panel member 20.

第1支撐構造體112自密封構造體10之剝離可藉由如下方法等進行:例如,於液晶顯示面板用構件20及第1支撐構造體112之一端部、尤其是角部之界面插入銳利之刃具狀者,賦予剝離之契機後,對該插入部分吹送水與壓縮空氣之混合流體。剝離較佳為例如圖3所示般自液晶顯示面板用構件20與第1支撐構造體112之一端部、尤其是角部朝向對向之角部緩慢地進行。 The peeling of the first support structure 112 from the sealing structure 10 can be performed by, for example, inserting a sharp portion at the end of one of the liquid crystal display panel member 20 and the first support structure 112, particularly the corner portion. In the blade shape, after the separator is given, a mixed fluid of water and compressed air is blown to the insertion portion. It is preferable that the peeling is performed from the end portion of the liquid crystal display panel member 20 and the first support structure 112, in particular, the corner portion toward the opposite corner portion, as shown in FIG.

較佳為,以利用複數個真空吸附墊真空吸附密封構造體10之兩面,於該狀態下向液晶顯示面板用構件20與第1支撐構造體112之一端部、尤其是角部之界面插入銳利之刃具狀者,自該插入部分緩慢地剝離第1支撐構造體112之方式,以提昇吸附有第1支撐構造體112之真空吸附墊之方式使其移動而進行。 Preferably, both sides of the sealing structure 10 are vacuum-adsorbed by a plurality of vacuum suction pads, and in this state, the interface between the liquid crystal display panel member 20 and one end portion of the first support structure 112, particularly the corner portion, is sharply inserted. In the blade shape, the first support structure 112 is gradually peeled off from the insertion portion, and the vacuum adsorption pad to which the first support structure 112 is adsorbed is lifted and moved.

關於第2支撐構造體122自密封構造體10(液晶顯示面板用構件20)之剝離,亦可以基本上相同之方式進行。 The peeling of the second support structure 122 from the self-sealing structure 10 (the member for liquid crystal display panel 20) can also be performed in substantially the same manner.

於採用液晶滴加貼合方式之情形時,在所製造之液晶顯示面板用構件20各自之成為液晶顯示面板之密封部13填充有液晶。因此,於例如形成有複數個密封部13之情形時,可藉由切分成各個密封部13而製造液晶顯示面板。 In the case where the liquid crystal dropping and bonding method is employed, the liquid crystal display panel sealing portion 13 of each of the manufactured liquid crystal display panel members 20 is filled with liquid crystal. Therefore, for example, in the case where a plurality of sealing portions 13 are formed, the liquid crystal display panel can be manufactured by being divided into the respective sealing portions 13.

又,於液晶注入方式之情形時,通常於所製造之液晶顯示面板用構件20各自之成為液晶顯示面板之密封部13未填充液晶。因此,對密封部13注入液晶而製成液晶顯示面板。具體而言,例如,以液晶顯示面板用構件20之狀態注入液晶,其後,切分成各個密封部13而製成液晶顯示面板。又,例如,亦可於將液晶顯示面板用構件20切分成各個密封部13後,對各個密封部13注入液晶而製成液晶顯示面板,或亦可於將液晶顯示面板用構件20切分成包含若干個密封部13之特定大小後,對各個密封部13注入液晶,進而切分成各個密封部13而製成液晶顯示面板。 Further, in the case of the liquid crystal injection method, the sealing portion 13 which is a liquid crystal display panel of each of the liquid crystal display panel members 20 to be manufactured is not filled with liquid crystal. Therefore, liquid crystal is injected into the sealing portion 13 to form a liquid crystal display panel. Specifically, for example, liquid crystal is injected in the state of the liquid crystal display panel member 20, and thereafter, it is cut into individual sealing portions 13 to form a liquid crystal display panel. Further, for example, after the liquid crystal display panel member 20 is divided into the respective sealing portions 13, the liquid crystal display panel may be formed by injecting liquid crystal into each of the sealing portions 13, or the liquid crystal display panel member 20 may be divided into After a certain size of the plurality of sealing portions 13, a liquid crystal is injected into each of the sealing portions 13, and further divided into individual sealing portions 13 to form a liquid crystal display panel.

以此方式製造之液晶顯示面板可用作各種電子機器之顯示部。作為電子機器,例如,可列舉:可攜式電話、筆記型電腦等個人電腦、PDA(Personal Digital Assistants,個人數位助理)等可攜式資訊機器、工作站、數位靜態相機、數位視訊攝影機、車輛用監視器、液晶電視、汽車導航裝置、電子記事本、計算器、POS(point-of-sale,銷售點)終端機等。 A liquid crystal display panel manufactured in this manner can be used as a display portion of various electronic machines. Examples of the electronic device include a portable computer such as a portable telephone or a notebook computer, a portable information device such as a PDA (Personal Digital Assistants), a workstation, a digital still camera, a digital video camera, and a vehicle. Monitors, LCD TVs, car navigation devices, electronic notebooks, calculators, POS (point-of-sale) terminals, etc.

再者,液晶顯示面板可製成透過型、反射型、或半透過型、及單色或彩色之各種液晶顯示面板。又,可製成被動矩陣型、主動矩陣型之各種液晶顯示面板。 Furthermore, the liquid crystal display panel can be made into a liquid crystal display panel of a transmissive type, a reflective type, or a semi-transmissive type, and a single color or a color. Further, various liquid crystal display panels of a passive matrix type and an active matrix type can be manufactured.

<第2實施形態> <Second embodiment>

以下,參照圖式對密封構造體之第2實施形態進行具體說明。 Hereinafter, the second embodiment of the sealing structure will be specifically described with reference to the drawings.

圖4、5係表示密封構造體之第2實施形態之一例之俯視圖及A-A線剖面圖。 4 and 5 are a plan view and a cross-sectional view taken along line A-A showing an example of the second embodiment of the seal structure.

密封構造體200係用於製造液晶顯示面板用構件20者,如圖4及5所示般於一部分具有成為液晶顯示面板用構件20之部分。密封構造體200包含第1積層體11、第2積層體12、密封部13及接著部14。 The sealing structure 200 is used to manufacture the liquid crystal display panel member 20, and has a portion which becomes the liquid crystal display panel member 20 in a part as shown in FIGS. 4 and 5 . The sealing structure 200 includes a first layered body 11 , a second layered body 12 , a sealing portion 13 , and a rear portion 14 .

若為密封構造體200之形態,則可進一步抑制自密封構造體剝離1對支撐構造體時之成為液晶顯示面板用構件之部分之損傷。 In the form of the sealing structure 200, it is possible to further suppress damage to the portion of the liquid crystal display panel member when the pair of support structures are peeled off from the self-sealing structure.

具體而言,於自密封構造體之各個玻璃基板剝離支撐構造體時,於密封部附近不同於該密封部而設置有接著部,藉此可減少局部地施加至密封部之應力,從而可抑制密封部之剝離、即玻璃基板與密封部之剝離。又,藉由在密封部附近不同於該密封部地設置接著部,亦可減少局部地施加至玻璃基板之應力,從而亦可抑制玻璃基板之破損。 Specifically, when the support structure is peeled off from each of the glass substrates of the self-sealing structure, a contact portion is provided in the vicinity of the seal portion different from the seal portion, whereby the stress locally applied to the seal portion can be reduced, thereby suppressing Peeling of the sealing portion, that is, peeling of the glass substrate and the sealing portion. Moreover, by providing the adhesion portion different from the sealing portion in the vicinity of the sealing portion, the stress locally applied to the glass substrate can be reduced, and the damage of the glass substrate can be suppressed.

圖4及5所示之密封構造體200除具備接著部14之方面以外,具有與圖1所示之密封構造體10相同之構成,故而對相同之構成要素標註相同之參照符號而省略其說明,主要對接著部14進行說明。 The sealing structure 200 shown in FIGS. 4 and 5 has the same configuration as that of the sealing structure 10 shown in FIG. 1 except for the connection portion 14. Therefore, the same components are denoted by the same reference numerals, and the description thereof is omitted. The main portion 14 will be mainly described.

接著部14係設為如下形狀及配置:於密封部13之外側接著第1積層體11與第2積層體12,於自密封構造體10剝離第1支撐構造體112或第2支撐構造體122時,可抑制成為液晶顯示面板用構件20之部分之損傷、具體而言為密封部13之剝離以及第1玻璃基板111及第2玻璃基板121之損傷。即,只要為可抑制剝離時之成為液晶顯示面板用構件20 之部分之損傷者,則接著部14之形狀或配置等並無特別限制。 The rear portion 14 is formed into a shape and arrangement in which the first laminated body 11 and the second laminated body 12 are attached to the outer side of the sealing portion 13 , and the first supporting structure 112 or the second supporting structure 122 is peeled off from the self-sealing structure 10 . In this case, damage to the portion of the liquid crystal display panel member 20, specifically, peeling of the sealing portion 13 and damage of the first glass substrate 111 and the second glass substrate 121 can be suppressed. In other words, the liquid crystal display panel member 20 is provided as long as it can suppress peeling. The shape, arrangement, and the like of the subsequent portion 14 are not particularly limited.

接著部14只要能接著第1玻璃基板111與第2玻璃基板121則無特別限制,使環氧系樹脂等接著材料硬化而形成。 The following portion 14 is not particularly limited as long as it can follow the first glass substrate 111 and the second glass substrate 121, and is formed by curing an adhesive material such as an epoxy resin.

接著部14係例如圖4所示般沿著密封部13呈直線狀設置。例如,於密封構造體200為長方形狀之情形時,於密封構造體200之長邊與鄰接於該長邊之密封部13之間以沿密封構造體200之長邊方向延伸之方式設置,並且於密封構造體200之短邊方向上之密封部13彼此之間以沿密封構造體200之長邊方向延伸之方式設置。 The rear portion 14 is linearly disposed along the sealing portion 13 as shown in FIG. 4, for example. For example, when the sealing structure 200 has a rectangular shape, it is disposed between the long side of the sealing structure 200 and the sealing portion 13 adjacent to the long side so as to extend in the longitudinal direction of the sealing structure 200, and The seal portions 13 in the short-side direction of the seal structure 200 are disposed to extend in the longitudinal direction of the seal structure 200.

於設置直線狀之接著部14之情形時,較佳為於密封構造體200之長邊方向上,於與設置有密封部13之區域相同之區域以相同之長度進行設置,或者設置於較其長之區域。具體而言,如圖4所示,於在密封構造體200之長邊方向上設置有3個密封部13之情形時,較佳為於與設置有該等3個密封部13之區域相同之區域以相同之長度、或較其長地進行設置。藉由設置成此種區域及長度,例如,如圖6所示般自1個角部剝離第2支撐構造體122時,剝離邊界線L位於密封部13上,同時亦位於接著部14上,可抑制僅對密封部13之一部分局部地施加應力,從而可抑制密封部13之剝離以及第1玻璃基板111及第2玻璃基板121之破損。 In the case where the linear connecting portion 14 is provided, it is preferably provided in the same length as the region in which the sealing portion 13 is provided in the longitudinal direction of the sealing structure 200, or is provided in the same length. Long area. Specifically, as shown in FIG. 4, when three sealing portions 13 are provided in the longitudinal direction of the sealing structure 200, it is preferably the same as the region in which the three sealing portions 13 are provided. The area is set with the same length or longer. By providing such a region and length, for example, when the second support structure 122 is peeled off from one corner as shown in FIG. 6, the peeling boundary line L is located on the sealing portion 13, and is also located on the rear portion 14. It is possible to suppress the partial stress applied to only one portion of the sealing portion 13, and it is possible to suppress the peeling of the sealing portion 13 and the damage of the first glass substrate 111 and the second glass substrate 121.

又,於設置密封部13或接著部14之情形時,較佳為將位於最外周部之密封部13或接著部14之任一者與積層體端邊相隔之距離設置於10 mm之範圍內。藉由縮短與積層體端邊相隔之距離,可有效地抑制密封部13之剝離以及第1玻璃基板111及第2玻璃基板121之破損。位於最外周部之密封部13或接著部14與積層體端邊相隔之距離更佳為5 mm之範圍內,進而較佳為3 mm之範圍內。 Further, in the case where the sealing portion 13 or the rear portion 14 is provided, it is preferable to set the distance between the sealing portion 13 or the rear portion 14 located at the outermost peripheral portion to the end edge of the laminated body within a range of 10 mm. . By shortening the distance from the edge of the laminate, the peeling of the sealing portion 13 and the breakage of the first glass substrate 111 and the second glass substrate 121 can be effectively suppressed. The sealing portion 13 or the adjoining portion 14 located at the outermost peripheral portion is preferably spaced apart from the end of the laminated body by a distance of 5 mm, and more preferably in the range of 3 mm.

又,於設置直線狀之接著部14之情形時,設置於密封構造體200之長邊與鄰接於該長邊之密封部13之間之接著部14較佳為與密封部13 相隔之距離係設置於10 mm之範圍內。藉由縮短密封部13至接著部14之距離,可有效地抑制密封部13之剝離以及第1玻璃基板111及第2玻璃基板121之破損。與密封部13相隔之距離更佳為5 mm之範圍內,進而較佳為3 mm之範圍內。再者,與密封部13相隔之距離並不需要固定,亦可於直線狀之接著部14之長度方向上不同,但較佳為整體上成為上述範圍內。又,密封部13至接著部14之距離越近越好,接著部14亦可設置成與密封部13接觸。此處,密封部13至接著部14之距離係設為密封部13之側面部與接著部14之側面部之間之距離。 Further, when the linear connecting portion 14 is provided, the connecting portion 14 provided between the long side of the sealing structure 200 and the sealing portion 13 adjacent to the long side is preferably the sealing portion 13 The distance between them is set within 10 mm. By shortening the distance between the sealing portion 13 and the adhesion portion 14, the peeling of the sealing portion 13 and the damage of the first glass substrate 111 and the second glass substrate 121 can be effectively suppressed. The distance from the sealing portion 13 is preferably in the range of 5 mm, and more preferably in the range of 3 mm. Further, the distance from the sealing portion 13 does not need to be fixed, and may be different in the longitudinal direction of the linear connecting portion 14, but preferably it is within the above range as a whole. Further, the closer the distance between the sealing portion 13 and the rear portion 14 is, the better the contact portion 14 may be provided in contact with the sealing portion 13. Here, the distance from the seal portion 13 to the rear portion 14 is a distance between the side surface portion of the seal portion 13 and the side surface portion of the joint portion 14.

於設置直線狀之接著部14之情形時,較佳為至少設置於密封構造體200之長邊與鄰接於該長邊之密封部13之間,但較佳為亦設置於密封構造體200之短邊方向上之密封部13彼此之間。再者,於在密封構造體200之短邊方向上設置有3個以上之密封部13之情形時,較佳為設置於所有密封部13彼此之間。關於設置於密封構造體200之短邊方向上之密封部13彼此之間之接著部14,就使對位於接著部14之兩側之密封部13之應力均等之觀點而言,較佳為設置於密封部13彼此之中央部分。 In the case where the linear connecting portion 14 is provided, it is preferably provided at least between the long side of the sealing structure 200 and the sealing portion 13 adjacent to the long side, but it is preferably provided also in the sealing structure 200. The sealing portions 13 in the short side direction are located between each other. Further, in the case where three or more sealing portions 13 are provided in the short-side direction of the sealing structure 200, it is preferably provided between all the sealing portions 13. The connection portion 14 provided between the sealing portions 13 provided in the short-side direction of the sealing structure 200 is preferably provided so as to equalize the stress on the sealing portions 13 located on both sides of the sealing portion 14. In the central portion of the sealing portion 13 from each other.

直線狀之接著部14之寬度較佳為0.08 mm以上。藉由將寬度設為0.08 mm以上,可藉由接著部14有效地接著第1玻璃基板111與第2玻璃基板121,且可有效地抑制密封部之剝離以及玻璃基板之破損。寬度更佳為0.1 mm以上,進而較佳為0.5 mm以上。寬度通常只要為0.1 mm左右即可充分地接著第1玻璃基板111與第2玻璃基板121,就生產性等觀點而言,較佳為5 mm以下,更佳為3 mm以下。 The width of the linear end portion 14 is preferably 0.08 mm or more. By setting the width to 0.08 mm or more, the first glass substrate 111 and the second glass substrate 121 can be efficiently adhered by the bonding portion 14, and peeling of the sealing portion and breakage of the glass substrate can be effectively suppressed. The width is more preferably 0.1 mm or more, and further preferably 0.5 mm or more. The width of the first glass substrate 111 and the second glass substrate 121 can be sufficiently increased as long as the width is about 0.1 mm. From the viewpoint of productivity and the like, it is preferably 5 mm or less, more preferably 3 mm or less.

密封構造體200滿足以下之式(1)及(2)。 The sealing structure 200 satisfies the following formulas (1) and (2).

式(1) {(X1×Y1)+(Z1×W1)}/(A1×B1)>1 Equation (1) {(X1×Y1)+(Z1×W1)}/(A1×B1)>1

式(2) {(X2×Y2)+(Z2×W2)}/(A2×B2)>1 Equation (2) {(X2×Y2)+(Z2×W2)}/(A2×B2)>1

式(1)中,X1、Y1、A1及B1之定義如上所述。 In the formula (1), X1, Y1, A1 and B1 are as defined above.

式(1)中,Z1表示接著部14與第1玻璃基板111之間之剝離強度(N/mm)。剝離強度之測定方法並無特別限制,可使用SAICAS等公知之測定裝置進行測定。作為Z1,只要滿足上述關係則其值並無特別限制,就可進一步抑制支撐構造體之剝離時之密封部之剝離或玻璃基板之損傷之方面而言,較佳為0.10 N/mm以上,更佳為0.15 N/mm以上。上限並無特別限制。 In the formula (1), Z1 represents the peel strength (N/mm) between the adhesion portion 14 and the first glass substrate 111. The method for measuring the peel strength is not particularly limited, and measurement can be carried out using a known measuring device such as SAICAS. Z1 is not particularly limited as long as the above-mentioned relationship is satisfied, and it is preferable to further suppress the peeling of the sealing portion or the damage of the glass substrate at the time of peeling of the support structure, and it is preferably 0.10 N/mm or more. Good is 0.15 N/mm or more. The upper limit is not particularly limited.

W1表示接著部14與第1玻璃基板111之總接觸面積(mm2)。於圖4及5所示之接著部14之情形時,意指3個直線狀之接著部14與第1玻璃基板11接觸之面積之總和。換言之,相當於圖4中之接著部14所占之總面積。 W1 represents the total contact area (mm 2 ) between the adhesion portion 14 and the first glass substrate 111. In the case of the contact portion 14 shown in FIGS. 4 and 5, it means the sum of the areas where the three linear end portions 14 are in contact with the first glass substrate 11. In other words, it corresponds to the total area occupied by the lands 14 in FIG.

藉由使密封構造體200滿足式(1)之關係,可於自密封構造體200剝離第1支撐構造體112時,抑制密封部13之剝離或第1玻璃基板111之損傷。 When the sealing structure 200 satisfies the relationship of the formula (1), when the first supporting structure 112 is peeled off from the self-sealing structure 200, peeling of the sealing portion 13 or damage of the first glass substrate 111 can be suppressed.

若僅控制密封部13與第1玻璃基板111之間之剝離強度、接著部14與第1玻璃基板111之間之剝離強度、及第1玻璃基板111與第1支撐構造體112之間之剝離強度的差,則於剝離第1支撐構造體112時,無法充分地抑制密封部13之剝離或第1玻璃基板111之損傷。推測其原因在於:剝離第1支撐構造體112時之應力不僅波及至局部的部分,而且波及至整個面。本發明者等人想到密封部13與第1玻璃基板111之總接觸面積、接著部14與第1玻璃基板121之總接觸面積、及第1玻璃基板111與第1支撐構造體112之總接觸面積會對表現所期望之效果發揮重要作用,從而發現滿足式(1)之關係較為重要。亦即,於式(1)中,將密封部13與第1玻璃基板111之間之剝離強度X1乘以接觸面積Y1所得之值及接著部14與第1玻璃基板121之間之剝離強度Z1乘以接觸面積W1所得之值的總和與第1玻璃基板111與第1支撐構造體112之間之剝離強度A1乘以接觸面積B1所得之值進行比較,若其值超過特定值,則意為 可抑制密封部之剝離或玻璃基板之損傷。 Only the peeling strength between the sealing portion 13 and the first glass substrate 111, the peeling strength between the bonding portion 14 and the first glass substrate 111, and the peeling between the first glass substrate 111 and the first supporting structure 112 are controlled. When the first support structure 112 is peeled off, the peeling of the sealing portion 13 or the damage of the first glass substrate 111 cannot be sufficiently suppressed. It is presumed that the reason is that the stress when the first support structure 112 is peeled off affects not only the local portion but also the entire surface. The inventors of the present invention thought of the total contact area of the sealing portion 13 and the first glass substrate 111, the total contact area between the bonding portion 14 and the first glass substrate 121, and the total contact between the first glass substrate 111 and the first supporting structure 112. The area plays an important role in the performance desired, and it is found that it is important to satisfy the relationship of formula (1). That is, in the formula (1), the peeling strength X1 between the sealing portion 13 and the first glass substrate 111 is multiplied by the contact area Y1, and the peeling strength Z1 between the bonding portion 14 and the first glass substrate 121 is obtained. The sum of the values obtained by multiplying the contact area W1 is compared with the value obtained by multiplying the peeling strength A1 between the first glass substrate 111 and the first support structure 112 by the contact area B1, and if the value exceeds a specific value, it means It is possible to suppress peeling of the sealing portion or damage of the glass substrate.

再者,於式(1)中,雖然{(X1×Y1)+(Z1×W1)}/(A1×B1)超過1,但就可進一步抑制密封部之剝離或玻璃基板之損傷之方面而言,較佳為1.1以上,更佳為1.4以上。再者,上限並無特別限制,但10以下之情形較多。 Further, in the formula (1), although {(X1 × Y1) + (Z1 × W1)} / (A1 × B1) exceeds 1, the peeling of the sealing portion or the damage of the glass substrate can be further suppressed. In other words, it is preferably 1.1 or more, and more preferably 1.4 or more. Furthermore, the upper limit is not particularly limited, but there are many cases of 10 or less.

又,藉由使密封構造體200滿足式(2)之關係,可於自密封構造體200剝離第2支撐構造體122時,抑制密封部13之剝離或第2玻璃基板121之損傷。 In addition, when the sealing structure 200 satisfies the relationship of the formula (2), when the second supporting structure 122 is peeled off from the self-sealing structure 200, the peeling of the sealing portion 13 or the damage of the second glass substrate 121 can be suppressed.

式(2)中,X2、Y2、A2及B2之定義如上所述。 In the formula (2), X2, Y2, A2 and B2 are as defined above.

式(2)中,Z2表示接著部14與第2玻璃基板121之間之剝離強度(N/mm)。剝離強度之測定方法並無特別限制,可使用SAICAS等公知之測定裝置進行測定。Z2之較佳態樣與Z1之較佳態樣同義。 In the formula (2), Z2 represents the peel strength (N/mm) between the adhesion portion 14 and the second glass substrate 121. The method for measuring the peel strength is not particularly limited, and measurement can be carried out using a known measuring device such as SAICAS. The preferred aspect of Z2 is synonymous with the preferred aspect of Z1.

W2表示接著部14與第1玻璃基板121之總接觸面積(mm2)。於圖4及5所示之接著部14之情形時,意指3個直線狀之接著部14與第2玻璃基板121接觸之面積之總和。 W2 represents the total contact area (mm 2 ) between the adhesion portion 14 and the first glass substrate 121. In the case of the contact portion 14 shown in FIGS. 4 and 5, it means the sum of the areas where the three linear end portions 14 are in contact with the second glass substrate 121.

進而,於式(2)中,雖然{(X2×Y2)+(Z2×W2)}/(A2×B2)超過1,但就可進一步抑制密封部之剝離或玻璃基板之損傷之方面而言,較佳為1.1以上,更佳為1.4以上。再者,上限並無特別限制,但10以下之情形較多。 Further, in the formula (2), although {(X2 × Y2) + (Z2 × W2)} / (A2 × B2) exceeds 1, the aspect of peeling of the sealing portion or damage of the glass substrate can be further suppressed. Preferably, it is 1.1 or more, More preferably, it is 1.4 or more. Furthermore, the upper limit is not particularly limited, but there are many cases of 10 or less.

又,於密封構造體200中,就可進一步抑制密封部之剝離或玻璃基板之損傷之方面而言,X1/A1或X2/A2較佳為5~100,更佳為10~100。 Further, in the sealing structure 200, X1/A1 or X2/A2 is preferably 5 to 100, and more preferably 10 to 100, in terms of further suppressing peeling of the sealing portion or damage of the glass substrate.

又,於密封構造體200中,就可進一步抑制密封部之剝離或玻璃基板之損傷之方面而言,Z1/A1或Z2/A2較佳為5~100,更佳為10~100。 Further, in the sealing structure 200, Z1/A1 or Z2/A2 is preferably 5 to 100, and more preferably 10 to 100, in terms of further suppressing peeling of the sealing portion or damage of the glass substrate.

又,於密封構造體200中,就可進一步抑制密封部之剝離或玻璃 基板之損傷之方面而言,Y1/B1或Y2/B2較佳為5~100,更佳為10~100。 Further, in the sealing structure 200, peeling of the sealing portion or glass can be further suppressed. In terms of damage of the substrate, Y1/B1 or Y2/B2 is preferably 5 to 100, more preferably 10 to 100.

進而,於密封構造體200中,就可進一步抑制密封部之剝離或玻璃基板之損傷之方面而言,W1/B1或W2/B2較佳為5~100,更佳為10~100。 Further, in the sealing structure 200, in terms of further preventing the peeling of the sealing portion or the damage of the glass substrate, W1/B1 or W2/B2 is preferably 5 to 100, more preferably 10 to 100.

(密封構造體之製造方法) (Manufacturing method of sealing structure)

密封構造體200之製造方法並無特別限制,可利用公知之方法進行製造。例如,於製造第1積層體11及第2積層體12後,以包圍第1積層體11中之第1玻璃基板111或第2積層體12中之第2玻璃基板121之形成區域之方式塗佈成為密封部13之密封材料,並且將成為接著部14之接著材料塗佈成其外側之特定形狀。其後,於採用液晶滴加貼合方式之情形時,於在形成區域滴加液晶後,介隔密封材料、及液晶而積層第1積層體11與第2積層體12。又,於採用液晶注入方式之情形時,介隔密封材料及接著材料積層第1積層體11與第2積層體12。 The method for producing the sealed structure 200 is not particularly limited, and it can be produced by a known method. For example, after the first layered body 11 and the second layered body 12 are produced, the first glass substrate 111 of the first layered body 11 or the second glass substrate 121 of the second layered body 12 is coated. The cloth serves as a sealing material for the sealing portion 13, and is formed into a specific shape in which the adhesive material of the bonding portion 14 is applied to the outside thereof. Then, in the case where the liquid crystal dropping and bonding method is employed, after the liquid crystal is dropped in the formation region, the first laminate 11 and the second laminate 12 are laminated via the sealing material and the liquid crystal. Moreover, in the case of using the liquid crystal injection method, the first layered body 11 and the second layered body 12 are laminated with a sealing material and a bonding material.

再者,密封材料及接著材料之塗佈方法並無特別限制,既可使用分注器或噴墨裝置進行描繪,亦可藉由網版印刷進行印刷。再者,作為密封材料及接著材料,並不限於環氧系樹脂,亦可為例如紫外線硬化型環氧改性丙烯酸系樹脂等。 Further, the method of applying the sealing material and the bonding material is not particularly limited, and it may be drawn using a dispenser or an inkjet device, or may be printed by screen printing. In addition, the sealing material and the bonding material are not limited to the epoxy resin, and may be, for example, an ultraviolet curing epoxy-modified acrylic resin.

密封部13及接著部14既可以相同之材料形成,亦可以不同之材料形成。 The sealing portion 13 and the sealing portion 14 may be formed of the same material or may be formed of different materials.

於第1積層體11及第2積層體12之積層後進行密封材料及接著材料之硬化。密封材料及接著材料之硬化可根據密封材料及接著材料之硬化方式而採用最佳之硬化方法,例如,於使用環氧系樹脂等作為密封材料及接著材料之情形時藉由加熱進行硬化,於使用紫外線硬化型環氧改性丙烯酸系樹脂等作為密封材料及接著材料之情形時藉由照射紫外線進行硬化。於密封材料與接著材料中硬化方式不同之情形時,亦 可分為2次以上之步驟進行硬化。 After the first laminate 11 and the second laminate 12 are laminated, the sealing material and the subsequent material are cured. The hardening of the sealing material and the bonding material can be carried out according to the curing method of the sealing material and the bonding material, for example, by using an epoxy resin or the like as a sealing material and a bonding material, and hardening by heating. When an ultraviolet curable epoxy-modified acrylic resin or the like is used as a sealing material and a bonding material, it is cured by irradiation with ultraviolet rays. When the sealing material is different from the hardening method in the subsequent material, It can be divided into two or more steps for hardening.

接著部14之形成較佳為與密封部13之形成同時進行。具體而言,較佳為與成為密封部13之密封材料之塗佈同時地進行成為接著部14之接著材料之塗佈,介隔密封材料及接著材料之塗佈物積層第1積層體11與第2積層體12,並進行加熱等使兩者硬化。尤佳為將用於形成密封部13之密封材料、與用於形成接著部14之接著材料設為包含相同材料者,並使用同一裝置以同一步驟進行密封材料及接著材料之塗佈。藉由利用此種方法,可有效率地形成接著部14。 The formation of the succeeding portion 14 is preferably performed simultaneously with the formation of the sealing portion 13. Specifically, it is preferable to apply the bonding material to be the bonding portion 14 simultaneously with the application of the sealing material to be the sealing portion 13, and to laminate the first laminated body 11 with the coating material interposing the sealing material and the bonding material. The second layered body 12 is cured by heating or the like. It is particularly preferable that the sealing material for forming the sealing portion 13 and the bonding material for forming the bonding portion 14 be made of the same material, and the sealing material and the subsequent material may be applied in the same step using the same apparatus. By using such a method, the adhesion portion 14 can be formed efficiently.

再者,密封材料與接著材料可不必將兩者塗佈於第1積層體11中之第1玻璃基板111或第2積層體12中之第2玻璃基板121之一者而形成,亦可相互獨立地塗佈而形成。例如,亦可於第1積層體11中之第1玻璃基板111塗佈密封材料,於第2積層體12中之第2玻璃基板121塗佈接著材料,亦可設為相反之狀態。 Further, the sealing material and the bonding material may be formed by applying one of the first glass substrate 111 of the first laminated body 11 or the second glass substrate 121 of the second laminated body 12 to each other, or may be mutually It is formed by coating independently. For example, a sealing material may be applied to the first glass substrate 111 of the first layered body 11, and the second glass substrate 121 of the second layered body 12 may be coated with a bonding material, or may be in an opposite state.

自密封構造體200剝離第1支撐構造體112及第2支撐構造體122而製造液晶顯示面板用構件20。剝離之方法可以與第1實施形態相同之程序進行。 The first support structure 112 and the second support structure 122 are peeled off from the self-sealing structure 200 to manufacture the liquid crystal display panel member 20. The method of peeling can be carried out in the same manner as in the first embodiment.

更具體而言,例如,如圖6所示般自一端側剝離第1支撐構造體112。具體而言,自密封構造體200之1個角部朝向對向之角部之方向緩慢地進行剝離。此時,藉由在密封部13之附近設置接著部14,已剝離之部分與即將被剝離之部分之邊界線且易於施加應力之剝離邊界線L位於密封部13上,同時亦位於附近之接著部14上。藉此,可抑制應力僅局部地施加至密封部13之一部分,從而可抑制密封部13之剝離,具體而言,可抑制第1玻璃基板111與密封部13之剝離、第2玻璃基板121與密封部13之剝離。同樣地,亦可抑制應力局部地施加至第1玻璃基板111及第2玻璃基板121,從而亦可抑制第1玻璃基板111及第2玻璃基板121之破損。再者,對於剝離第2支撐構造體122之情形,亦可基 本上以相同之方式進行,又,可獲得相同之效果。 More specifically, for example, as shown in FIG. 6 , the first support structure 112 is peeled off from one end side. Specifically, one corner portion of the self-sealing structure 200 is gradually peeled off in the direction of the opposite corner portion. At this time, by providing the adhesion portion 14 in the vicinity of the sealing portion 13, the peeling boundary line L which is easy to apply stress on the boundary line between the peeled portion and the portion to be peeled off is located on the sealing portion 13, and is also located nearby. On the 14th. Thereby, it is possible to suppress the stress from being locally applied to only one portion of the sealing portion 13, and it is possible to suppress the peeling of the sealing portion 13, and specifically, the peeling of the first glass substrate 111 from the sealing portion 13 and the second glass substrate 121 can be suppressed. Peeling of the sealing portion 13. Similarly, the stress can be locally applied to the first glass substrate 111 and the second glass substrate 121, and the first glass substrate 111 and the second glass substrate 121 can be prevented from being damaged. Furthermore, in the case of peeling off the second support structure 122, it is also possible to base This is done in the same way, and the same effect can be obtained.

再者,通常,接著部14係設為不需要之部分,自密封部13切除並丟棄。 Further, in general, the end portion 14 is an unnecessary portion, and is cut off from the sealing portion 13 and discarded.

圖7係表示密封構造體10之變化例之俯視圖,尤其係表示接著部14之變化例之俯視圖。 FIG. 7 is a plan view showing a modification of the sealing structure 10, and in particular, a plan view showing a modification of the sealing portion 14.

關於該密封構造體300,接著部14以外之構成、即第1積層體11、第2積層體12、及密封部13之構成與圖4、5所示之密封構造體200相同。關於該密封構造體300,不同之處在於:接著部14係以包圍複數個密封部13之整體之方式沿著第1積層體11及第2積層體12之周緣部進行設置。 In the seal structure 300, the configuration of the first laminate body 11, the second laminate body 12, and the seal portion 13 other than the joint portion 14 is the same as that of the seal structure body 200 shown in Figs. The sealing structure 300 is different in that the rear portion 14 is provided along the peripheral edge portions of the first layered body 11 and the second layered body 12 so as to surround the entirety of the plurality of sealing portions 13 .

藉由以包圍複數個密封部13之整體之方式設置框狀之接著部14,如圖6所示之剝離邊界線L亦會位於密封部13上之同時亦位於接著部14上,可抑制應力僅局部地施加至密封部13之一部分,從而可抑制密封部13之剝離,具體而言,可抑制第1玻璃基板111與密封部13之剝離、第2玻璃基板121與密封部13之剝離。同樣地,亦可抑制應力局部地施加至第1玻璃基板111及第2玻璃基板121,從而亦可抑制第1玻璃基板111及第2玻璃基板121之破損。 By providing the frame-shaped connecting portion 14 so as to surround the entirety of the plurality of sealing portions 13, the peeling boundary line L as shown in FIG. 6 is also located on the sealing portion 13 and also on the connecting portion 14, thereby suppressing stress. Only partial application to the sealing portion 13 can suppress peeling of the sealing portion 13 . Specifically, peeling of the first glass substrate 111 from the sealing portion 13 and peeling of the second glass substrate 121 from the sealing portion 13 can be suppressed. Similarly, the stress can be locally applied to the first glass substrate 111 and the second glass substrate 121, and the first glass substrate 111 and the second glass substrate 121 can be prevented from being damaged.

於設置框狀之接著部14之情形時,設置於密封構造體10之長邊與鄰接於該長邊之密封部13之間之接著部14較佳為與密封部13相隔之距離係設置於10 mm之範圍內。藉由縮短密封部13至接著部14之距離,可有效地抑制密封部13之剝離以及第1玻璃基板111及第2玻璃基板121之破損。與密封部13相隔之距離更佳為5 mm之範圍內,進而較佳為3 mm之範圍內。再者,與密封部13相隔之距離未必需要固定,亦可於接著部14之長度方向上不同,但較佳為整體上成為上述範圍內。 In the case where the frame-shaped connecting portion 14 is provided, the connecting portion 14 provided between the long side of the sealing structure 10 and the sealing portion 13 adjacent to the long side is preferably spaced apart from the sealing portion 13 by Within 10 mm. By shortening the distance between the sealing portion 13 and the adhesion portion 14, the peeling of the sealing portion 13 and the damage of the first glass substrate 111 and the second glass substrate 121 can be effectively suppressed. The distance from the sealing portion 13 is preferably in the range of 5 mm, and more preferably in the range of 3 mm. Further, the distance from the sealing portion 13 does not necessarily need to be fixed, and may be different in the longitudinal direction of the connecting portion 14, but preferably it is within the above range as a whole.

又,於設置框狀之接著部14之情形時,較佳為將位於最外周部 之接著部14與積層體端邊相隔之距離設置於10 mm之範圍內。藉由縮短與積層體端邊相隔之距離,可有效地抑制密封部13之剝離以及第1玻璃基板111及第2玻璃基板121之破損。框狀之接著部14與積層體端邊相隔之距離更佳為5 mm之範圍內,進而較佳為3 mm之範圍內。 Moreover, in the case where the frame-shaped rear portion 14 is provided, it is preferably located at the outermost periphery. The distance between the rear portion 14 and the end of the laminate is set to be within 10 mm. By shortening the distance from the edge of the laminate, the peeling of the sealing portion 13 and the breakage of the first glass substrate 111 and the second glass substrate 121 can be effectively suppressed. The frame-like rear portion 14 is spaced apart from the end of the laminate body by a distance of preferably 5 mm, and more preferably in the range of 3 mm.

又,設置於密封構造體10之短邊與鄰接於該短邊之密封部13之間之接著部14較佳為與密封部13相隔之距離係設置於10 mm之範圍內。藉由縮短密封部13至接著部14之距離,可有效地抑制密封部13之剝離以及第1玻璃基板111及第2玻璃基板121之破損。與密封部13相隔之距離更佳為5 mm之範圍內,進而較佳為3 mm之範圍內。再者,與密封部13相隔之距離未必需要固定,亦可於接著部14之長度方向上不同,但較佳為整體上成為上述範圍內。 Moreover, it is preferable that the contact portion 14 provided between the short side of the sealing structure 10 and the sealing portion 13 adjacent to the short side is disposed within a range of 10 mm from the sealing portion 13. By shortening the distance between the sealing portion 13 and the adhesion portion 14, the peeling of the sealing portion 13 and the damage of the first glass substrate 111 and the second glass substrate 121 can be effectively suppressed. The distance from the sealing portion 13 is preferably in the range of 5 mm, and more preferably in the range of 3 mm. Further, the distance from the sealing portion 13 does not necessarily need to be fixed, and may be different in the longitudinal direction of the connecting portion 14, but preferably it is within the above range as a whole.

框狀之接著部14之寬度較佳為0.08 mm以上。藉由將寬度設為0.08 mm以上,可藉由接著部14有效地接著第1玻璃基板111與第2玻璃基板121,且可有效地抑制密封部13之剝離以及第1玻璃基板111及第2玻璃基板121之破損。寬度更佳為0.1 mm以上,進而較佳為0.5 mm以上。寬度通常只要為0.1 mm左右即可充分地接著第1玻璃基板111與第2玻璃基板121,就生產性等觀點而言,較佳為5 mm以下,更佳為3 mm以下。 The width of the frame-like joint portion 14 is preferably 0.08 mm or more. By setting the width to 0.08 mm or more, the first glass substrate 111 and the second glass substrate 121 can be efficiently adhered by the bonding portion 14, and the peeling of the sealing portion 13 and the first glass substrate 111 and the second can be effectively suppressed. The glass substrate 121 is damaged. The width is more preferably 0.1 mm or more, and further preferably 0.5 mm or more. The width of the first glass substrate 111 and the second glass substrate 121 can be sufficiently increased as long as the width is about 0.1 mm. From the viewpoint of productivity and the like, it is preferably 5 mm or less, more preferably 3 mm or less.

圖8係表示密封構造體10之另一變化例之俯視圖,尤其係表示接著部14之變化例之俯視圖。 FIG. 8 is a plan view showing another modification of the sealing structure 10, and particularly shows a plan view showing a modification of the attachment portion 14.

關於該密封構造體400,接著部14以外之構成、即第1積層體11、第2積層體12、及密封部13之構成亦與圖4、5所示之密封構造體100相同。關於該密封構造體400,不同之處在於接著部14係以包圍複數個密封部13之各者之方式設置。 In the seal structure 400, the configuration of the first laminate body 11, the second laminate body 12, and the seal portion 13 other than the joint portion 14 is also the same as that of the seal structure 100 shown in Figs. The seal structure 400 is different in that the joint portion 14 is provided to surround each of the plurality of seal portions 13.

藉由以包圍複數個密封部13之各者之方式設置框狀之接著部14,如圖3所示之剝離邊界線L亦會位於密封部13上之同時亦位於接著 部14上,可抑制應力僅局部地施加至密封部13之一部分,從而可抑制密封部13之剝離,具體而言,可抑制第1玻璃基板111與密封部13之剝離、第2玻璃基板121與密封部13之剝離。同樣地,亦可抑制應力局部地施加至第1玻璃基板111及第2玻璃基板121,從而亦可抑制第1玻璃基板111及第2玻璃基板121之破損。尤其,藉由以包圍複數個密封部13之各者之方式設置框狀之接著部14,與設置其他形狀之接著部14之情形相比,可有效地抑制密封部13之剝離以及第1玻璃基板111及第2玻璃基板121之破損。 By providing the frame-shaped connecting portion 14 so as to surround each of the plurality of sealing portions 13, the peeling boundary line L as shown in FIG. 3 is also located on the sealing portion 13 while being located next to In the portion 14 , the stress can be suppressed from being partially applied to only one portion of the sealing portion 13 , and the peeling of the sealing portion 13 can be suppressed. Specifically, the peeling of the first glass substrate 111 and the sealing portion 13 and the second glass substrate 121 can be suppressed. Peeling from the sealing portion 13. Similarly, the stress can be locally applied to the first glass substrate 111 and the second glass substrate 121, and the first glass substrate 111 and the second glass substrate 121 can be prevented from being damaged. In particular, by providing the frame-shaped connecting portion 14 so as to surround each of the plurality of sealing portions 13, the peeling of the sealing portion 13 and the first glass can be effectively suppressed as compared with the case where the other shape of the connecting portion 14 is provided. The substrate 111 and the second glass substrate 121 are damaged.

於設置如上所述之框狀之接著部14之情形時,接著部14較佳為與密封部13相隔之距離係設置於10 mm之範圍內。藉由縮短密封部13至接著部14之距離,可有效地抑制密封部13之剝離以及第1玻璃基板111及第2玻璃基板121之破損。與密封部13相隔之距離更佳為5 mm之範圍內,進而較佳為3 mm之範圍內。再者,與密封部13相隔之距離未必需要固定,亦可於接著部14之長度方向(周向)上不同,但較佳為整體上成為上述範圍內。 In the case where the frame-shaped joint portion 14 as described above is provided, the distance between the rear portion 14 and the sealing portion 13 is preferably set within a range of 10 mm. By shortening the distance between the sealing portion 13 and the adhesion portion 14, the peeling of the sealing portion 13 and the damage of the first glass substrate 111 and the second glass substrate 121 can be effectively suppressed. The distance from the sealing portion 13 is preferably in the range of 5 mm, and more preferably in the range of 3 mm. Further, the distance from the sealing portion 13 does not necessarily need to be fixed, and may be different in the longitudinal direction (circumferential direction) of the connecting portion 14, but preferably it is within the above range as a whole.

又,於設置如上所述之框狀之接著部14之情形時,較佳為將位於最外周部之接著部14與積層體端邊相隔之距離設置於10 mm之範圍內。藉由縮短與積層體端邊相隔之距離,可有效地抑制密封部13之剝離以及第1玻璃基板111及第2玻璃基板121之破損。如上所述之框狀之接著部14與積層體端邊相隔之距離更佳為5 mm之範圍內,進而較佳為3 mm之範圍內。 Further, in the case where the frame-shaped connecting portion 14 is provided as described above, it is preferable that the distance between the end portion 14 located at the outermost peripheral portion and the edge of the laminated body is set within a range of 10 mm. By shortening the distance from the edge of the laminate, the peeling of the sealing portion 13 and the breakage of the first glass substrate 111 and the second glass substrate 121 can be effectively suppressed. The frame-like connecting portion 14 as described above is preferably spaced apart from the end of the laminated body by a distance of 5 mm, and more preferably in the range of 3 mm.

框狀之接著部14之寬度較佳為0.08 mm以上。藉由將寬度設為0.08 mm以上,可藉由接著部14有效地接著第1玻璃基板111與第2玻璃基板121,且可有效地抑制密封部13之剝離以及第1玻璃基板111及第2玻璃基板121之破損。寬度更佳為0.1 mm以上,進而較佳為0.5 mm以上。寬度通常只要為0.1 mm左右即可充分地接著第1玻璃基板111與第 2玻璃基板121,就生產性等觀點而言,較佳為5 mm以下,更佳為3 mm以下。 The width of the frame-like joint portion 14 is preferably 0.08 mm or more. By setting the width to 0.08 mm or more, the first glass substrate 111 and the second glass substrate 121 can be efficiently adhered by the bonding portion 14, and the peeling of the sealing portion 13 and the first glass substrate 111 and the second can be effectively suppressed. The glass substrate 121 is damaged. The width is more preferably 0.1 mm or more, and further preferably 0.5 mm or more. The width is usually about 0.1 mm, and the first glass substrate 111 and the first 2 The glass substrate 121 is preferably 5 mm or less, and more preferably 3 mm or less from the viewpoint of productivity.

以上,對接著部14之代表性形狀等進行了說明,但接著部14之形狀等只要為可於自密封構造體10剝離第1支撐構造體112及第2支撐構造體122時抑制成為液晶顯示面板用構件20之部分之損傷、具體而言為密封部13之剝離以及第1玻璃基板111及第2玻璃基板121之損傷的形狀及配置等,則無特別限制。 In the above, the representative shape and the like of the adhesive portion 14 have been described. However, the shape of the adhesive portion 14 or the like is suppressed to be liquid crystal display when the first support structure 112 and the second support structure 122 are peeled off from the self-sealing structure 10 . The damage of the portion of the panel member 20, specifically, the peeling of the sealing portion 13 and the shape and arrangement of the damage of the first glass substrate 111 and the second glass substrate 121 are not particularly limited.

例如,接著部14並不限定於如圖7所示之包圍複數個密封部13之整體者、或如圖8所示之包圍各個密封部13者,亦可為僅包圍複數個密封部13中之鄰接之一部分密封部13者,或亦可為設置於複數個密封部13彼此之間之格子狀,並且可視需要且根據密封部13之個數或配置組合如上所述之各形狀。又,直線狀或框狀之接著部14未必需要由連續之線狀部分構成,亦可由虛線狀等不連續之線狀部分構成。 For example, the splicing portion 14 is not limited to the one that surrounds the plurality of sealing portions 13 as shown in FIG. 7 or the respective sealing portions 13 as shown in FIG. 8, and may only enclose the plurality of sealing portions 13 One of the adjacent partial sealing portions 13 may be arranged in a lattice shape between the plurality of sealing portions 13, and the respective shapes as described above may be combined according to the number or arrangement of the sealing portions 13 as needed. Further, the linear or frame-shaped connecting portion 14 does not necessarily need to be composed of a continuous linear portion, and may be formed of a discontinuous linear portion such as a broken line.

以上,對實施形態之液晶顯示面板用構件之製造方法進行了說明,但可在不違反本發明之主旨之限度內,且視需要適當變更其構成。例如,作為密封構造體,並不限定於具有如圖所示之個數之密封部者,亦可為進而具有多個密封部者。根據具有多個密封部者,可更有效率地製造液晶顯示面板。又,於設置複數個密封部之情形時,關於各個密封部之大小或配置等亦不限定於如圖所示之大小或配置等,可適當變更。進而,接著部可對應於此種密封部之大小或配置等而適當變更大小或配置等。 In the above, the method of manufacturing the member for a liquid crystal display panel of the embodiment has been described. However, the configuration may be appropriately changed as needed within the limits of the gist of the invention. For example, the sealing structure is not limited to the number of sealing portions as shown in the drawings, and may have a plurality of sealing portions. According to the one having a plurality of sealing portions, the liquid crystal display panel can be manufactured more efficiently. Moreover, when a plurality of sealing portions are provided, the size, arrangement, and the like of the respective sealing portions are not limited to those shown in the drawings, and may be appropriately changed. Further, the rear portion can be appropriately changed in size, arrangement, and the like in accordance with the size, arrangement, and the like of the sealing portion.

[實施例] [Examples]

以下,藉由實施例等對本發明進行具體說明,但本發明並不限定於該等之例。 Hereinafter, the present invention will be specifically described by way of examples, but the invention is not limited to the examples.

於以下之實施例及比較例中,作為玻璃基板,使用由無鹼硼矽酸玻璃構成之玻璃板(縱170 mm、橫125 mm、板厚0.3 mm、線膨脹係 數38×10-7/℃,旭硝子公司製造之商品名「AN100」)。又,作為支撐板,使用同樣由無鹼硼矽酸玻璃構成之玻璃板(縱170 mm、橫125 mm、板厚0.4 mm、線膨脹係數38×10-7/℃,旭硝子公司製造之商品名「AN100」)。 In the following examples and comparative examples, a glass plate composed of alkali-free borosilicate glass (length 170 mm, width 125 mm, thickness 0.3 mm, linear expansion coefficient 38×10 -7 /° C) was used as the glass substrate. The brand name "AN100" manufactured by Asahi Glass Co., Ltd.). Further, as the support plate, a glass plate (length 170 mm, width 125 mm, plate thickness 0.4 mm, linear expansion coefficient 38×10 -7 /°C), which is also made of alkali-free borosilicate glass, is used as a product name manufactured by Asahi Glass Co., Ltd. "AN100").

<實施例1> <Example 1>

對支撐板之一主面進行純水清洗,其後進行UV(ultraviolet,紫外線)清洗而使其淨化。 One of the main faces of the support plate is cleaned with pure water, and then subjected to UV (ultraviolet) cleaning to purify it.

其次,將作為成分(A)之直鏈狀乙烯基甲基聚矽氧烷(「VDT-127」,25℃下之黏度700-800 cP(厘泊):Azmax製造,有機聚矽氧烷1 mol中之乙烯基之mol%:0.325)、與作為成分(B)之直鏈狀甲基氫聚矽氧烷(「HMS-301」,25℃下之黏度25-35 cP(厘泊):Azmax製造,1分子內之鍵結於矽原子之氫原子數:8個)以所有乙烯基與所有鍵結於矽原子之氫原子之莫耳比(氫原子/乙烯基)成為0.9之方式混合,且相對於該矽氧烷混合物100重量份,混合作為成分(C)之以下述式(1)表示之具有乙炔系不飽和基之矽化合物1質量份。 Next, as a component (A), a linear vinyl methyl polyoxyalkylene ("VDT-127", viscosity at 25 ° C, 700-800 cP (centipoise): Azmax, organic polyoxyl 1 The mol% of the vinyl group in the mol: 0.325), and the linear methyl hydrogen polyoxyalkylene as the component (B) ("HMS-301", the viscosity at 25 ° C 25-35 cP (centipoise): Made by Azmax, the number of hydrogen atoms bonded to the deuterium atom in one molecule: 8) is mixed in such a manner that the molar ratio (hydrogen atom/vinyl group) of all the vinyl groups to all the hydrogen atoms bonded to the deuterium atom becomes 0.9. In addition, 1 part by mass of the oxime compound having an acetylene-based unsaturated group represented by the following formula (1) as the component (C) is mixed with 100 parts by weight of the oxirane mixture.

HC≡C-C(CH3)2-O-Si(CH3)3 式(1) HC≡CC(CH 3 ) 2 -O-Si(CH 3 ) 3 (1)

繼而,相對於成分(A)、成分(B)及成分(C)之合計量,以按鉑換算鉑金屬濃度成為100 ppm之方式添加鉑系觸媒(Shin-Etsu Silicone股份有限公司製造,CAT-PL-56)而獲得有機聚矽氧烷組合物之混合液。 Then, a platinum-based catalyst (manufactured by Shin-Etsu Silicone Co., Ltd., CAT) is added to the total amount of the component (A), the component (B), and the component (C) in a platinum-converted platinum metal concentration of 100 ppm. -PL-56) A mixture of organopolyoxane compositions was obtained.

藉由模具塗佈機將所獲得之混合液塗佈於之前經淨化之支撐板之第1主面上(速度5 mm/s、GAP(間隙)150 μm、塗佈壓95 kPa)。其後,將塗佈於支撐板上之混合物(樹脂層形成用組合物層)於室溫下靜置10分鐘後,於大氣中以180℃使其加熱硬化60分鐘,從而於支撐板之整個面上形成厚度15 μm之硬化聚矽氧樹脂層而獲得支撐構造體A(第1支撐構造體)。 The obtained mixed liquid was applied onto the first main surface of the previously purified support plate by a die coater (speed 5 mm/s, GAP (gap) 150 μm, coating pressure 95 kPa). Thereafter, the mixture (resin layer for forming a resin layer) applied on the support plate was allowed to stand at room temperature for 10 minutes, and then heat-hardened at 180 ° C for 60 minutes in the air to serve the entire support plate. A hardened polyoxymethylene resin layer having a thickness of 15 μm was formed on the surface to obtain a support structure A (first support structure).

其次,對玻璃基板之一主面進行純水清洗,其後進行UV清洗而 使其淨化。 Next, pure water cleaning is performed on one main surface of the glass substrate, followed by UV cleaning. Make it clean.

其後,使支撐構造體A與玻璃基板位置對準後,使用真空加壓裝置,於室溫下使玻璃基板之第1主面與支撐構造體A之硬化聚矽氧樹脂層之剝離性表面密接而獲得積層體A(第1積層體)。 Thereafter, after the support structure A and the glass substrate are aligned, the peeling surface of the first main surface of the glass substrate and the cured polyoxyl resin layer of the support structure A is applied at room temperature using a vacuum pressurizing device. The laminate A (first laminate) is obtained by close contact.

其次,藉由與上述程序相同之程序,獲得另一個積層體B(第2積層體)。 Next, another laminate B (second laminate) is obtained by the same procedure as the above procedure.

繼而,於積層體A之玻璃基板A之主面側,藉由分注法將密封用樹脂液以成為與圖4所示之密封部13相同形狀之方式描繪成框狀。 Then, the sealing resin liquid is drawn into a frame shape by the dispensing method so as to have the same shape as the sealing portion 13 shown in FIG. 4 on the main surface side of the glass substrate A of the laminated body A.

進而,於積層體A之玻璃基板A之主面側,藉由分注法將接著用樹脂液以成為與圖4所示之接著部14相同形狀之方式描繪成直線狀。其後,以積層體A之玻璃基板A與積層體B之玻璃基板B對向之方式,使積層體A與積層體B貼合,並使其等熱硬化而獲得密封構造體1。 Further, on the main surface side of the glass substrate A of the laminated body A, the resin liquid to be subsequently used is drawn in a straight line shape in the same shape as the bonding portion 14 shown in FIG. 4 by a dispensing method. Then, the laminated body A and the laminated body B are bonded together so that the glass substrate A of the laminated body A faces the glass substrate B of the laminated body B, and the sealing structure 1 is obtained by heat-hardening.

再者,密封部之寬度及接著部之寬度分別為0.08 mm及0.08 mm。 Further, the width of the sealing portion and the width of the succeeding portion were 0.08 mm and 0.08 mm, respectively.

密封構造體1中,藉由SAICAS(DAIPLA WINTES公司製造)對密封部與一玻璃基板A之間之剝離強度進行測定,結果為0.11 N/mm。又,密封部與一玻璃A之總接觸面積為960 mm2In the sealing structure 1, the peeling strength between the sealing portion and a glass substrate A was measured by SAICAS (manufactured by DAIPLA WINTES Co., Ltd.), and it was 0.11 N/mm. Further, the total contact area of the sealing portion with a glass A was 960 mm 2 .

密封構造體1中,藉由SAICAS(DAIPLA WINTES公司製造)對接著部與一玻璃基板A之間之剝離強度進行測定,結果為0.11 N/mm。又,接著部與一玻璃基板A之總接觸面積為408 mm2In the sealing structure 1, the peeling strength between the adhesive portion and a glass substrate A was measured by SAICAS (manufactured by DAIPLA WINTES Co., Ltd.), and it was 0.11 N/mm. Further, the total contact area of the succeeding portion with a glass substrate A was 408 mm 2 .

密封構造體1中,藉由SAICAS(DAIPLA WINTES公司製造)對一玻璃基板A與支撐構造體A之間之剝離強度進行測定,結果為0.007 N/mm。又,一玻璃基板A與支撐構造體A之總接觸面積為21250 mm2In the seal structure 1, the peel strength between a glass substrate A and the support structure A was measured by SAICAS (manufactured by DAIPLA WINTES Co., Ltd.), and it was 0.007 N/mm. Further, the total contact area of a glass substrate A and the support structure A was 21,250 mm 2 .

再者,密封構造體1中,密封部與一玻璃基板B之間之剝離強度及總接觸面積、接著部與一玻璃基板B之間之剝離強度及總接觸面 積、以及一玻璃基板B與支撐構造體B之間之剝離強度及總接觸面積之數值分別與密封部與一玻璃基板A之間之剝離強度及總接觸面積、接著部與一玻璃基板A之間之剝離強度及總接觸面積、以及一玻璃基板A與支撐構造體A之間之剝離強度及總接觸面積之數值相同。 Further, in the sealing structure 1, the peel strength and the total contact area between the sealing portion and a glass substrate B, the peel strength between the bonding portion and a glass substrate B, and the total contact surface The peeling strength and the total contact area between the glass substrate B and the support structure B and the peel strength and total contact area between the sealing portion and a glass substrate A, and the adhesion between the bonding portion and a glass substrate A, respectively. The peel strength and the total contact area between the glass substrate A and the support structure A are the same as the peel strength and the total contact area.

根據上述數值,{(X1×Y1)+(Z1×W1)}/(A1×B1)及{(X2×Y2)+(Z2×W2)}/(A2×B2)之值為1.01。 From the above numerical values, the values of {(X1 × Y1) + (Z1 × W1)} / (A1 × B1) and {(X2 × Y2) + (Z2 × W2)} / (A2 × B2) are 1.01.

使所獲得之密封構造體1之積層體B側真空吸附於壓盤後,於密封構造體1之角隅部之玻璃基板A與硬化聚矽氧樹脂層之界面插入厚度0.1 mm之不鏽鋼製刃具,將支撐構造體A自密封構造體1分離。 After the laminated body B side of the obtained sealed structure 1 was vacuum-adsorbed to the platen, a stainless steel blade having a thickness of 0.1 mm was inserted into the interface between the glass substrate A and the cured polyoxynated resin layer at the corner portion of the sealing structure 1. The support structure A is separated from the self-sealing structure 1.

其後,進而按照相同之程序,自將支撐構造體A分離後之密封構造體分離支撐構造體B,從而獲得液晶顯示面板用構件。 Then, the support structure B is separated from the seal structure separated by the support structure A in accordance with the same procedure, thereby obtaining a member for a liquid crystal display panel.

於分離支撐構造體A及支撐構造體B時,雖在密封部與玻璃基板A或玻璃基板B之間觀察到輕微之剝離,但在實用上不存在問題,未產生玻璃基板A及玻璃基板B之破壞。 When the support structure A and the support structure B were separated, slight peeling was observed between the sealing portion and the glass substrate A or the glass substrate B, but there was no problem in practical use, and the glass substrate A and the glass substrate B were not produced. The destruction.

<實施例2> <Example 2>

以使密封部與一玻璃基板A(及另一玻璃基板B)之總接觸面積成為1200 mm2之方式,將密封部之寬度變更為0.1 mm,除此以外,按照與實施例1相同之程序製造液晶顯示面板用構件。 The same procedure as in the first embodiment was carried out except that the total contact area of the sealing portion and the glass substrate A (and the other glass substrate B) was 1200 mm 2 and the width of the sealing portion was changed to 0.1 mm. A member for a liquid crystal display panel is manufactured.

於實施例2中,{(X1×Y1)+(Z1×W1)}/(A1×B1)及{(X2×Y2)+(Z2×W2)}/(A2×B2)之值為1.19。 In the second embodiment, the value of {(X1 × Y1) + (Z1 × W1)} / (A1 × B1) and {(X2 × Y2) + (Z2 × W2)} / (A2 × B2) is 1.19.

再者,於分離支撐構造體A及支撐構造體B時,雖在密封部與玻璃基板A或B之間觀察到輕微之剝離,但在實用上不存在問題,未產生玻璃基板A及B之破壞。 Further, when the support structure A and the support structure B were separated, although slight peeling was observed between the sealing portion and the glass substrate A or B, there was no problem in practical use, and the glass substrates A and B were not produced. damage.

<實施例3> <Example 3>

以使接著部與一玻璃基板A(及另一玻璃基板B)之總接觸面積成為510 mm2之方式,將接著部之寬度變更為0.1 mm,除此以外,按照 與實施例1相同之程序製造液晶顯示面板用構件。 The same procedure as in the first embodiment was carried out except that the width of the adhesive portion was changed to 0.1 mm so that the total contact area between the adhesive portion and the glass substrate A (and the other glass substrate B) was 510 mm 2 . A member for a liquid crystal display panel is manufactured.

於實施例3中,{(X1×Y1)+(Z1×W1)}/(A1×B1)及{(X2×Y2)+(Z2×W2)}/(A2×B2)之值為1.09。 In the third embodiment, the value of {(X1 × Y1) + (Z1 × W1)} / (A1 × B1) and {(X2 × Y2) + (Z2 × W2)} / (A2 × B2) is 1.09.

再者,於分離支撐構造體A及支撐構造體B時,雖在密封部與玻璃基板A或B之間觀察到輕微之剝離,但在實用上不存在問題,未產生玻璃基板A及B之破壞。 Further, when the support structure A and the support structure B were separated, although slight peeling was observed between the sealing portion and the glass substrate A or B, there was no problem in practical use, and the glass substrates A and B were not produced. damage.

<實施例4> <Example 4>

以使密封部與一玻璃基板A(及另一玻璃基板B)之總接觸面積成為6000 mm2之方式,將密封部之寬度變更為0.5 mm,以使接著部與一玻璃基板A(及另一玻璃基板B)之總接觸面積成為2550 mm2之方式,將接著部之寬度變更為0.5 mm,除此以外,按照與實施例1相同之程序製造液晶顯示面板用構件。 The width of the sealing portion is changed to 0.5 mm so that the total contact area of the sealing portion with a glass substrate A (and the other glass substrate B) is 6000 mm 2 so that the bonding portion and a glass substrate A (and A member for a liquid crystal display panel was produced in the same manner as in Example 1 except that the total contact area of the glass substrate B) was 2550 mm 2 and the width of the adhesive portion was changed to 0.5 mm.

於實施例4中,{(X1×Y1)+(Z1×W1)}/(A1×B1)及{(X2×Y2)+(Z2×W2)}/(A2×B2)之值為6.32。 In the fourth embodiment, the value of {(X1 × Y1) + (Z1 × W1)} / (A1 × B1) and {(X2 × Y2) + (Z2 × W2)} / (A2 × B2) is 6.32.

再者,於分離支撐構造體A及支撐構造體B時,未產生密封部與玻璃基板A或B之剝離、或玻璃基板A及B之破壞。 Further, when the support structure A and the support structure B were separated, peeling of the sealing portion from the glass substrate A or B or destruction of the glass substrates A and B did not occur.

<實施例5> <Example 5>

變更密封用樹脂液之種類,將密封部與一玻璃基板A(及另一玻璃基板B)之間之剝離強度變更為0.17 N/mm,除此以外,按照與實施例1相同之程序製造液晶顯示面板用構件。 The liquid crystal was produced in the same manner as in Example 1 except that the type of the resin liquid for sealing was changed, and the peeling strength between the sealing portion and the glass substrate A (and the other glass substrate B) was changed to 0.17 N/mm. Display panel components.

於實施例5中,{(X1×Y1)+(Z1×W1)}/(A1×B1)及{(X2×Y2)+(Z2×W2)}/(A2×B2)之值為1.40。 In the fifth embodiment, the value of {(X1 × Y1) + (Z1 × W1)} / (A1 × B1) and {(X2 × Y2) + (Z2 × W2)} / (A2 × B2) is 1.40.

再者,於分離支撐構造體A及支撐構造體B時,未產生密封部與玻璃基板A或B之剝離、或玻璃基板A及B之破壞。 Further, when the support structure A and the support structure B were separated, peeling of the sealing portion from the glass substrate A or B or destruction of the glass substrates A and B did not occur.

<實施例6> <Example 6>

變更接著用樹脂液之種類,將接著部與一玻璃基板A(及另一玻 璃基板B)之間之剝離強度變更為0.17 N/mm,除此以外,按照與實施例1相同之程序製造液晶顯示面板用構件。 The change is followed by the type of resin liquid, and the bonding portion is combined with a glass substrate A (and another glass) A member for a liquid crystal display panel was produced in the same manner as in Example 1 except that the peeling strength between the glass substrates B) was changed to 0.17 N/mm.

於實施例6中,{(X1×Y1)+(Z1×W1)}/(A1×B1)及{(X2×Y2)+(Z2×W2)}/(A2×B2)之值為1.18。 In the sixth embodiment, the value of {(X1 × Y1) + (Z1 × W1)} / (A1 × B1) and {(X2 × Y2) + (Z2 × W2)} / (A2 × B2) is 1.18.

再者,於分離支撐構造體A及支撐構造體B時,雖在密封部與玻璃基板A或B之間觀察到輕微之剝離,但在實用上不存在問題,未產生玻璃基板A及B之破壞。 Further, when the support structure A and the support structure B were separated, although slight peeling was observed between the sealing portion and the glass substrate A or B, there was no problem in practical use, and the glass substrates A and B were not produced. damage.

<比較例1> <Comparative Example 1>

以使密封部與一玻璃基板A(及另一玻璃基板B)之總接觸面積成為600 mm2之方式,將密封部之寬度變更為0.05 mm,除此以外,按照與實施例1相同之程序製造液晶顯示面板用構件。 The same procedure as in the first embodiment was carried out except that the width of the sealing portion was changed to 0.05 mm so that the total contact area of the sealing portion with a glass substrate A (and the other glass substrate B) was 600 mm 2 . A member for a liquid crystal display panel is manufactured.

於比較例1中,{(X1×Y1)+(Z1×W1)}/(A1×B1)及{(X2×Y2)+(Z2×W2)}/(A2×B2)之值為0.75。 In Comparative Example 1, the value of {(X1 × Y1) + (Z1 × W1)} / (A1 × B1) and {(X2 × Y2) + (Z2 × W2)} / (A2 × B2) was 0.75.

再者,於分離支撐構造體A及支撐構造體B時,產生有密封部與玻璃基板A或B之剝離、或者玻璃基板A或B之破壞。 Further, when the support structure A and the support structure B are separated, peeling of the sealing portion from the glass substrate A or B or destruction of the glass substrate A or B occurs.

<比較例2> <Comparative Example 2>

以使接著部與一玻璃基板A(及另一玻璃基板B)之總接觸面積成為255 mm2之方式,將接著部之寬度變更為0.05 mm,除此以外,按照與實施例1相同之程序製造液晶顯示面板用構件。 The same procedure as in the first embodiment was carried out except that the width of the adhesive portion was changed to 0.05 mm so that the total contact area between the adhesive portion and the glass substrate A (and the other glass substrate B) was 255 mm 2 . A member for a liquid crystal display panel is manufactured.

於比較例2中,{(X1×Y1)+(Z1×W1)}/(A1×B1)及{(X2×Y2)+(Z2×W2)}/(A2×B2)之值為0.90。 In Comparative Example 2, the value of {(X1 × Y1) + (Z1 × W1)} / (A1 × B1) and {(X2 × Y2) + (Z2 × W2)} / (A2 × B2) was 0.90.

再者,於分離支撐構造體A及支撐構造體B時,產生有密封部與玻璃基板A或B之剝離、或者玻璃基板A或B之破壞。 Further, when the support structure A and the support structure B are separated, peeling of the sealing portion from the glass substrate A or B or destruction of the glass substrate A or B occurs.

<比較例3> <Comparative Example 3>

變更密封用樹脂液之種類,將密封部與一玻璃基板A(及另一玻璃基板B)之間之剝離強度變更為0.08 N/mm,除此以外,按照與實施 例1相同之程序製造液晶顯示面板用構件。 The type of the resin liquid for sealing was changed, and the peeling strength between the sealing portion and one glass substrate A (and the other glass substrate B) was changed to 0.08 N/mm, and the same was carried out. The member for the liquid crystal display panel was manufactured in the same procedure as in Example 1.

於比較例3中,{(X1×Y1)+(Z1×W1)}/(A1×B1)及{(X2×Y2)+(Z2×W2)}/(A2×B2)之值為0.82。 In Comparative Example 3, the value of {(X1 × Y1) + (Z1 × W1)} / (A1 × B1) and {(X2 × Y2) + (Z2 × W2)} / (A2 × B2) was 0.82.

再者,於分離支撐構造體A及支撐構造體B時,產生有密封部與玻璃基板A或B之剝離、或者玻璃基板A或B之破壞。 Further, when the support structure A and the support structure B are separated, peeling of the sealing portion from the glass substrate A or B or destruction of the glass substrate A or B occurs.

<比較例4> <Comparative Example 4>

變更接著用樹脂液之種類,將接著部與一玻璃基板A(及另一玻璃基板B)之間之剝離強度變更為0.08 N/mm,除此以外,按照與實施例1相同之程序製造液晶顯示面板用構件。 In the same manner as in Example 1, except that the peeling strength between the adhesive portion and the glass substrate A (and the other glass substrate B) was changed to 0.08 N/mm by the type of the resin liquid, the liquid crystal was produced in the same manner as in Example 1. Display panel components.

於比較例4中,{(X1×Y1)+(Z1×W1)}/(A1×B1)及{(X2×Y2)+(Z2×W2)}/(A2×B2)之值為0.93。 In Comparative Example 4, the value of {(X1 × Y1) + (Z1 × W1)} / (A1 × B1) and {(X2 × Y2) + (Z2 × W2)} / (A2 × B2) was 0.93.

再者,於分離支撐構造體A及支撐構造體B時,產生有密封部與玻璃基板A或B之剝離、或者玻璃基板A或B之破壞。 Further, when the support structure A and the support structure B are separated, peeling of the sealing portion from the glass substrate A or B or destruction of the glass substrate A or B occurs.

將上述實施例及比較例之結果匯總示於表1。 The results of the above examples and comparative examples are summarized in Table 1.

表1中,「剝離強度X」一欄表示密封部與玻璃基板A(或玻璃基板B)之間之剝離強度(N/mm),「總接觸面積Y」一欄表示密封部與玻璃基板A(或玻璃基板B)之總接觸面積(mm2),「剝離強度Z」一欄表示接著部與玻璃基板A(或玻璃基板B)之間之剝離強度(N/mm),「總接觸面積W」一欄表示密封部與玻璃基板A(或玻璃基板B)之總接觸面積(mm2),「剝離強度A」一欄表示玻璃基板A(或玻璃基板B)與支撐構造體A(或支撐構造體B)之間之剝離強度(N/mm),「總接觸面積B」一欄表示玻璃基板A(或玻璃基板B)與支撐構造體A(或支撐構造體B)之總接觸面積(mm2),「式(1)」一欄表示「(X1×Y1)+(Z1×W1)}/(A1×B1)」之結果,「式(2)」一欄表示「(X2×Y2)+(Z2×W2)}/(A2×B2)」之結果。 In Table 1, the column of "peel strength X" indicates the peel strength (N/mm) between the sealing portion and the glass substrate A (or the glass substrate B), and the column "total contact area Y" indicates the sealing portion and the glass substrate A. (or glass substrate B) total contact area (mm 2 ), and the "peel strength Z" column indicates the peel strength (N/mm) between the rear portion and the glass substrate A (or the glass substrate B), "total contact area The column "W" indicates the total contact area (mm 2 ) between the sealing portion and the glass substrate A (or the glass substrate B), and the column of "peel strength A" indicates the glass substrate A (or the glass substrate B) and the support structure A (or The peel strength (N/mm) between the support structures B), and the column of "total contact area B" indicates the total contact area of the glass substrate A (or the glass substrate B) and the support structure A (or the support structure B). (mm 2 ), the column of "Formula (1)" indicates the result of "(X1 × Y1) + (Z1 × W1)} / (A1 × B1)", and the column of "Formula (2)" indicates "(X2 ×) Y2)+(Z2×W2)}/(A2×B2)".

又,表1中之剝離結果係按照以下基準而得者。於實用上,必須為「○」、「◎」。 Moreover, the peeling result in Table 1 was obtained based on the following criteria. Practically, it must be "○" or "◎".

「◎」:未產生密封部與玻璃基板A或B之剝離、或者玻璃基板A或B之破壞 "◎": no peeling of the sealing portion from the glass substrate A or B, or destruction of the glass substrate A or B

「○」:在密封部與玻璃基板A或B之間觀察到輕微之剝離,但於實用上不存在問題 "○": slight peeling was observed between the sealing portion and the glass substrate A or B, but there was no problem in practical use.

「×」產生有密封部與玻璃基板A或B之剝離、或者玻璃基板A或B之破壞。 "X" causes peeling of the sealing portion with the glass substrate A or B or destruction of the glass substrate A or B.

由上述表1可確認,於滿足式(1)及式(2)之關係之密封構造體中,密封部與玻璃基板之間之剝離、或玻璃基板之破損得到抑制。尤其,經確認若式(1)及式(2)之值為1.40以上,則剝離進一步受到抑制。 In the sealing structure which satisfies the relationship of the formula (1) and the formula (2), it is confirmed that the peeling between the sealing portion and the glass substrate or the breakage of the glass substrate is suppressed. In particular, it has been confirmed that when the values of the formulae (1) and (2) are 1.40 or more, the peeling is further suppressed.

另一方面,於不滿足式(1)或式(2)之關係之比較例1~4中,產生有密封部與玻璃基板之間之剝離、或玻璃基板之破損。 On the other hand, in Comparative Examples 1 to 4 which did not satisfy the relationship of the formula (1) or the formula (2), peeling between the sealing portion and the glass substrate or breakage of the glass substrate occurred.

以上,對本發明之一實施形態進行了說明,但本發明並不限制於上述實施形態。可於不脫離本發明之範圍之前提下,對上述實施形態施加各種變形及置換。 Although an embodiment of the present invention has been described above, the present invention is not limited to the above embodiment. Various modifications and substitutions can be made to the above embodiments without departing from the scope of the invention.

本申請案係基於2012年10月9日提出申請之日本專利申請案2012-224448,其內容係以參照之形式併入本文中。 The present application is based on Japanese Patent Application No. 2012-224448, filed on Jan.

10‧‧‧密封構造體 10‧‧‧ Sealing structure

11‧‧‧第1積層體 11‧‧‧1st layered body

13‧‧‧密封部 13‧‧‧ Sealing Department

Claims (11)

一種密封構造體,其係用於製造液晶顯示面板用構件者,且包含:第1積層體,其具有板厚為0.3 mm以下之第1玻璃基板及與上述第1玻璃基板可剝離地貼合之第1支撐構造體;第2積層體,其具有板厚為0.3 mm以下之第2玻璃基板及與上述第2玻璃基板可剝離地貼合之第2支撐構造體;密封部,其於上述第1積層體及上述第2積層體之間以包圍成為液晶顯示面板之形成區域之方式設置;及接著部,其以任意構成之形式接著上述第1積層體及上述第2積層體;且上述第1玻璃基板及上述第2玻璃基板對向,且滿足以下之關係式(1)及式(2):式(1) {(X1×Y1)+(Z1×W1)}/(A1×B1)>1 式(2) {(X2×Y2)+(Z2×W2)}/(A2×B2)>1(式(1)中,X1表示上述密封部與上述第1玻璃基板之間之剝離強度(N/mm),Y1表示上述密封部與上述第1玻璃基板之總接觸面積(mm2),Z1表示上述接著部與上述第1玻璃基板之間之剝離強度(N/mm),W1表示上述接著部與上述第1玻璃基板之總接觸面積(mm2),A1表示上述第1玻璃基板與上述第1支撐構造體之間之剝離強度(N/mm),B1表示上述第1玻璃基板與上述第1支撐構造體之總接觸面積(mm2);式(2)中,X2表示上述密封部與上述第2玻璃基板之間之剝離強度(N/mm),Y2表示上述密封部與上述第2玻璃基板之總接觸面積(mm2),Z2表示上述接著部與上述第2玻璃基板之間之剝離強度 (N/mm),W2表示上述接著部與上述第2玻璃基板之總接觸面積(mm2),A2表示上述第2玻璃基板與上述第2支撐構造體之間之剝離強度(N/mm),B2表示上述第2玻璃基板與上述第2支撐構造體之總接觸面積(mm2);再者,於不存在上述接著部之情形時,設為(Z1×W1)=0及(Z2×W2)=0)。 A sealing structure for manufacturing a member for a liquid crystal display panel, comprising: a first laminate having a first glass substrate having a thickness of 0.3 mm or less and being detachably attached to the first glass substrate a first support structure; the second laminate having a second glass substrate having a thickness of 0.3 mm or less and a second support structure detachably bonded to the second glass substrate; and a sealing portion The first layered body and the second layered body are provided so as to surround the formation region of the liquid crystal display panel; and the second portion is connected to the first layered body and the second layered body in an arbitrary configuration; The first glass substrate and the second glass substrate face each other and satisfy the following relational expressions (1) and (2): Formula (1) {(X1 × Y1) + (Z1 × W1)} / (A1 × B1 >1 (2) {(X2 × Y2) + (Z2 × W2)} / (A2 × B2) > 1 (In the formula (1), X1 represents peeling between the sealing portion and the first glass substrate Strength (N/mm), Y1 represents the total contact area (mm 2 ) between the sealing portion and the first glass substrate, and Z1 represents the peel strength (N/mm) between the bonding portion and the first glass substrate. W1 represents the total contact area (mm 2 ) between the above-mentioned bonding portion and the first glass substrate, and A1 represents the peeling strength (N/mm) between the first glass substrate and the first supporting structure, and B1 represents the above-mentioned 1) a total contact area (mm 2 ) between the glass substrate and the first support structure; and in the formula (2), X2 represents a peel strength (N/mm) between the seal portion and the second glass substrate, and Y2 represents the above. a total contact area (mm 2 ) between the sealing portion and the second glass substrate, Z2 represents a peeling strength (N/mm) between the bonding portion and the second glass substrate, and W2 represents the bonding portion and the second glass substrate The total contact area (mm 2 ), A2 indicates the peel strength (N/mm) between the second glass substrate and the second support structure, and B2 indicates the total of the second glass substrate and the second support structure. The contact area (mm 2 ); further, in the case where the above-mentioned succeeding portion is not present, it is assumed that (Z1 × W1) = 0 and (Z2 × W2) = 0). 如請求項1之密封構造體,其包含複數個上述密封部。 A sealing structure according to claim 1, which comprises a plurality of said sealing portions. 如請求項2之密封構造體,其包含上述接著部,且上述接著部係沿著上述密封部呈直線狀設置。 The sealing structure according to claim 2, comprising the above-mentioned splicing portion, wherein the splicing portion is linearly arranged along the sealing portion. 如請求項2之密封構造體,其包含上述接著部,且上述接著部係以包圍上述複數個密封部之整體之方式設置。 A sealing structure according to claim 2, comprising the above-mentioned splicing portion, wherein the splicing portion is provided to surround the entirety of the plurality of sealing portions. 如請求項2之密封構造體,其包含上述接著部,且上述接著部係以包圍上述複數個密封部之各者之方式設置。 The sealing structure according to claim 2, comprising the above-mentioned splicing portion, wherein the splicing portion is provided to surround each of the plurality of sealing portions. 如請求項1至5中任一項之密封構造體,其中上述第1玻璃基板及上述第2玻璃基板具有縱730 mm×橫920 mm以上之大小。 The sealing structure according to any one of claims 1 to 5, wherein the first glass substrate and the second glass substrate have a size of 730 mm in length × 920 mm in width. 如請求項1至6中任一項之密封構造體,其中上述第1玻璃基板及/或上述第2玻璃基板由無鹼玻璃構成。 The sealing structure according to any one of claims 1 to 6, wherein the first glass substrate and/or the second glass substrate are made of alkali-free glass. 如請求項7之密封構造體,其中上述玻璃板由以氧化物基準之質量百分率表示含有下述成分之無鹼玻璃構成:SiO2:50~66% Al2O3:10.5~24% B2O3:0~12% MgO:0~8% CaO:0~14.5% SrO:0~24% BaO:0~13.5% MgO+CaO+SrO+BaO:9~29.5% ZnO:0~5%。 The sealing structure according to claim 7, wherein the glass plate is composed of an alkali-free glass containing a composition based on an oxide percentage: SiO 2 : 50 to 66% Al 2 O 3 : 10.5 to 24% B 2 O 3 : 0~12% MgO: 0~8% CaO: 0~14.5% SrO: 0~24% BaO: 0~13.5% MgO+CaO+SrO+BaO: 9~29.5% ZnO: 0~5%. 如請求項7之密封構造體,其中上述玻璃板由以氧化物基準之質量百分率表示含有下述成分之無鹼玻璃構成:SiO2:58~66% Al2O3:15~22% B2O3:5~12% MgO:0~8% CaO:0~9% SrO:3~12.5% BaO:0~2% MgO+CaO+SrO+BaO:9~18% ZnO:0~2%。 The sealing structure according to claim 7, wherein the glass plate is composed of an alkali-free glass containing a composition based on an oxide-based mass percentage: SiO 2 : 58 to 66% Al 2 O 3 : 15 to 22% B 2 O 3 : 5~12% MgO: 0~8% CaO: 0~9% SrO: 3~12.5% BaO: 0~2% MgO+CaO+SrO+BaO: 9~18% ZnO: 0~2%. 一種液晶顯示面板用構件之製造方法,其包括剝離步驟,該剝離步驟係自如請求項1至9中任一項之密封構造體剝離上述第1支撐構造體及上述第2支撐構造體。 A method for producing a member for a liquid crystal display panel, comprising a peeling step of peeling off the first support structure and the second support structure from the seal structure according to any one of claims 1 to 9. 如請求項10之液晶顯示面板用構件之製造方法,其中於上述剝離步驟中,上述第1支撐構造體及上述第2支撐構造體自上述密封構造體之剝離係自上述密封構造體之一端部緩慢地進行。 The method for producing a member for a liquid crystal display panel according to claim 10, wherein in the peeling step, the peeling of the first support structure and the second support structure from the seal structure is from one end of the seal structure Go slowly.
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