TWI616412B - Method for manufacturing seal structure and member for liquid crystal display panel - Google Patents

Method for manufacturing seal structure and member for liquid crystal display panel Download PDF

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TWI616412B
TWI616412B TW102136607A TW102136607A TWI616412B TW I616412 B TWI616412 B TW I616412B TW 102136607 A TW102136607 A TW 102136607A TW 102136607 A TW102136607 A TW 102136607A TW I616412 B TWI616412 B TW I616412B
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glass substrate
sealing
support structure
sealing portion
liquid crystal
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TW102136607A
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Chinese (zh)
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TW201414691A (en
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Daisuke Uchida
Yasunori Ito
Kei Takiuchi
Yutaka Otsubo
Hirotoshi Terui
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Asahi Glass Co Ltd
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    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1339Gaskets; Spacers; Sealing of cells
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/20Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/202LCD, i.e. liquid crystal displays
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Liquid Crystal (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Glass Compositions (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Joining Of Glass To Other Materials (AREA)

Abstract

本發明係關於一種密封構造體,其係用於製造液晶顯示面板用構件者,且包含:第1積層體,其具有板厚為0.3 mm以下之第1玻璃基板及與上述第1玻璃基板可剝離地貼合之第1支撐構造體;第2積層體,其具有板厚為0.3 mm以下之第2玻璃基板及與上述第2玻璃基板可剝離地貼合之第2支撐構造體;密封部,其於上述第1積層體及上述第2積層體之間以包圍成為液晶顯示面板之形成區域之方式設置;及接著部,其以任意構成之形式接著上述第1積層體及上述第2積層體;且上述第1玻璃基板及上述第2玻璃基板對向,且滿足以下之關係式(1)及式(2):式(1) {(X1×Y1)+(Z1×W1)}/(A1×B1)>1、式(2) {(X2×Y2)+(Z2×W2)}/(A2×B2)>1,(式(1)中,X1表示上述密封部與上述第1玻璃基板之間之剝離強度(N/mm),Y1表示上述密封部與上述第1玻璃基板之總接觸面積(mm2),Z1表示上述接著部與上述第1玻璃基板之間之剝離強度(N/mm),W1表示上述接著部與上述第1玻璃基板之總接觸面積(mm2),A1表示上述第1玻璃基板與上述第1支撐構造體之間之剝離強度(N/mm),B1表示上述第1玻璃基板與上述第1支撐構造體之總接觸面積(mm2), 式(2)中,X2表示上述密封部與上述第2玻璃基板之間之剝離強度(N/mm),Y2表示上述密封部與上述第2玻璃基板之總接觸面積(mm2),Z2表示上述接著部與上述第2玻璃基板之間之剝離強度(N/mm),W2表示上述接著部與上述第2玻璃基板之總接觸面積(mm2),A2表示上述第2玻璃基板與上述第2支撐構造體之間之剝離強度(N/mm),B2表示上述第2玻璃基板與上述第2支撐構造體之總接觸面積(mm2);再者,於不存在上述接著部之情形時,設為(Z1×W1)=0及(Z2×W2)=0)。 The present invention relates to a sealing structure, which is used for manufacturing a member for a liquid crystal display panel, and includes a first laminated body having a first glass substrate having a thickness of 0.3 mm or less, and the first glass substrate A first support structure to be peeledly attached; a second laminated body having a second glass substrate having a thickness of 0.3 mm or less and a second support structure to be peelably attached to the second glass substrate; a sealing portion And is provided between the first laminated body and the second laminated body so as to surround the formation area of the liquid crystal display panel; and an adhering section, which is in the form of an arbitrary structure, and is connected to the first laminated body and the second laminated body The first glass substrate and the second glass substrate are opposite to each other and satisfy the following relational expressions (1) and (2): Equation (1) {(X1 × Y1) + (Z1 × W1)} / (A1 × B1)> 1, formula (2) {(X2 × Y2) + (Z2 × W2)} / (A2 × B2)> 1, (in formula (1), X1 represents the sealing portion and the first the peel strength between the glass substrate (N / mm), Y1 represents the sealing portion and the total contact area (mm 2) of the first glass substrate 1, Z1 indicates the first portion and then the above-described glass substrate 1 The peel strength (N / mm), W1 indicating that the next portion of the total contact area (mm 2) of the first glass substrate 1, A1 represents the peel strength between the first glass substrate 1 and the first support structure (N / mm), B1 represents the total contact area (mm 2 ) between the first glass substrate and the first support structure, and in formula (2), X2 represents the peel strength between the sealing portion and the second glass substrate ( N / mm), Y2 represents the total contact area (mm 2 ) between the sealing portion and the second glass substrate, Z2 represents the peel strength (N / mm) between the bonding portion and the second glass substrate, and W2 represents the above The total contact area (mm 2 ) between the bonding portion and the second glass substrate, A2 represents the peel strength (N / mm) between the second glass substrate and the second support structure, and B2 represents the second glass substrate and the second glass substrate. the total contact area of the second support structure (mm 2); when Furthermore, in the case of the above section is not present then, set (Z1 × W1) = 0 and (Z2 × W2) = 0) .

Description

密封構造體及液晶顯示面板用構件之製造方法 Method for manufacturing seal structure and member for liquid crystal display panel

本發明係關於一種密封構造體,尤其係關於一種製造液晶顯示面板用構件時所使用之密封構造體。又,本發明亦係關於一種使用該密封構造體之液晶顯示面板用構件之製造方法。 The present invention relates to a sealing structure, and more particularly, to a sealing structure used in manufacturing a member for a liquid crystal display panel. The present invention also relates to a method for manufacturing a member for a liquid crystal display panel using the sealed structure.

近年來,液晶顯示面板等電子機器之薄型化、輕量化得到發展,而不斷推進該等電子機器中所使用之玻璃基板之薄板化。然而,玻璃基板之薄板化會導致玻璃基板之強度降低,從而玻璃基板在電子機器之製造步驟中之操作性降低。 In recent years, thinner and lighter electronic devices such as liquid crystal display panels have been developed, and thinner glass substrates used in these electronic devices have been continuously promoted. However, the thinning of the glass substrate causes a reduction in the strength of the glass substrate, which reduces the operability of the glass substrate in the manufacturing steps of the electronic device.

因此,先前採用如下方法:於使用厚於最終板厚之玻璃基板形成各種元件等後,藉由化學蝕刻處理使玻璃基板薄板化。然而,根據此種方法,於例如將玻璃基板之厚度自0.7 mm薄板化成0.2 mm或0.1 mm之情形時,必須利用蝕刻液去除原玻璃基板之材料之大半,就生產性或原材料之使用效率之觀點而言未必較佳。 Therefore, previously, the following method was adopted: After forming various elements and the like using a glass substrate thicker than the final plate thickness, the glass substrate is thinned by a chemical etching process. However, according to this method, when, for example, the thickness of a glass substrate is changed from a 0.7 mm thin plate to 0.2 mm or 0.1 mm, it is necessary to remove most of the material of the original glass substrate with an etching solution, in terms of productivity or the use of raw materials. Not necessarily better from a point of view.

又,於利用化學蝕刻使玻璃基板薄板化時,於在玻璃基板之表面存在微細劃痕之情形時,存在如下情況:因蝕刻處理導致形成以劃痕為起點之微細之凹陷(腐蝕坑),從而成為光學缺陷。 In addition, when the glass substrate is thinned by chemical etching, when there are fine scratches on the surface of the glass substrate, there are cases where fine depressions (corrosion pits) starting from the scratches are formed by the etching process, It becomes an optical defect.

為了應對上述課題,提出有如下方法:最初起便使用具有最終板厚之較薄之玻璃基板,於亦被稱為加強板之支撐構造體上積層玻璃基板而製成積層體,並以該積層體之狀態於玻璃基板形成各種元件等後,自玻璃基板剝離支撐構造體(例如,參照專利文獻1)。支撐構造 體包含支撐板、及固定於該支撐板上之黏著劑層,藉由黏著劑層將玻璃基板可剝離地密接。最終,自玻璃基板剝離支撐構造體,於該被剝離之支撐構造體上積層新的玻璃基板而再利用。 In order to cope with the above-mentioned problems, a method has been proposed in which a thin glass substrate having a final plate thickness is used from the beginning, and a glass substrate is laminated on a supporting structure also called a reinforcing plate to form a laminated body, and the laminated layer After forming various elements and the like on the glass substrate, the support structure is peeled from the glass substrate (for example, refer to Patent Document 1). Support structure The body includes a support plate and an adhesive layer fixed on the support plate, and the glass substrate is peelably adhered by the adhesive layer. Finally, the support structure is peeled from the glass substrate, and a new glass substrate is laminated on the peeled support structure and reused.

[先前技術文獻] [Prior technical literature] [專利文獻] [Patent Literature]

[專利文獻1]日本專利特開平8-86993號公報 [Patent Document 1] Japanese Patent Laid-Open No. 8-86993

使用上述積層體之液晶顯示面板用構件之製造係例如以如下方式進行。首先,準備1對積層體,視需要於各自之玻璃基板之成為液晶顯示面板之1個或2個以上之形成區域形成薄膜電晶體(TFT)或彩色濾光片(CF)等。又,於一玻璃基板上,以包圍成為液晶顯示面板之各個形成區域之方式塗佈密封材料。繼而,介隔密封材料積層1對積層體,並使密封材料硬化而形成密封部,從而獲得密封構造體。其後,自密封構造體之各個玻璃基板剝離支撐構造體,而製造具有1個或2個以上之成為液晶顯示面板之區域之液晶顯示面板用構件。 The manufacturing method of the member for liquid crystal display panels using the said laminated body is performed as follows, for example. First, prepare a pair of laminated bodies, and if necessary, form a thin film transistor (TFT) or a color filter (CF) in one or two or more formation areas of the respective glass substrates to become a liquid crystal display panel. Further, a sealing material is applied on a glass substrate so as to surround each formation region that becomes a liquid crystal display panel. Then, the sealing material is laminated 1 to the laminated body, and the sealing material is hardened to form a sealing portion, thereby obtaining a sealed structure. Thereafter, the support structure is peeled from each of the glass substrates of the sealing structure, and a member for a liquid crystal display panel having one or two or more regions that become a liquid crystal display panel is manufactured.

然而,於上述方法之情形時,於自密封構造體剝離支撐構造體時,有時未必會於液晶顯示面板用構件與支撐構造體之間剝離,而於液晶顯示面板用構件之內部、具體而言為玻璃基板與密封部之間剝離,又,有時會於玻璃基板產生破裂等損傷。若於液晶顯示面板用構件產生密封部之剝離或玻璃基板之損傷,則無法將該液晶顯示面板用構件用於液晶顯示面板之製造中。 However, in the case of the above method, when the support structure is peeled from the self-sealing structure, it may not necessarily be peeled off between the member for the liquid crystal display panel and the support structure, but inside the member for the LCD panel, specifically In other words, the glass substrate is peeled from the sealing portion, and damage to the glass substrate may occur such as cracking. If peeling of a sealing portion or damage to a glass substrate occurs in a member for a liquid crystal display panel, the member for a liquid crystal display panel cannot be used in the manufacture of a liquid crystal display panel.

本發明係為了解決上述課題而完成者,其目的在於提供一種可抑制支撐構造體之剝離時之密封部之剝離或玻璃基板之損傷,為了製造液晶顯示面板用構件而使用之密封構造體。 The present invention has been made in order to solve the above-mentioned problems, and an object thereof is to provide a sealing structure used to manufacture a member for a liquid crystal display panel, which can suppress peeling of a sealing portion or damage to a glass substrate when peeling a support structure.

本發明者對先前技術之問題進行研究後,發現可藉由以下之構成解決上述課題,從而完成了本發明。 The present inventors have studied the problems of the prior art and found that the above-mentioned problems can be solved by the following configuration, thereby completing the present invention.

即,為了達成上述目的,本發明之第1態樣係一種密封構造體,其係用於製造液晶顯示面板用構件者,且包含:第1積層體,其具有板厚為0.3 mm以下之第1玻璃基板及與第1玻璃基板可剝離地貼合之第1支撐構造體;第2積層體,其具有板厚為0.3 mm以下之第2玻璃基板及與第2玻璃基板可剝離地貼合之第2支撐構造體;密封部,其於第1積層體及第2積層體之間以包圍成為液晶顯示面板之形成區域之方式設置;及接著部,其以任意構成之形式接著第1積層體及第2積層體;且第1玻璃基板及第2玻璃基板對向,且滿足以下之關係式(1)及式(2)。 That is, in order to achieve the above object, a first aspect of the present invention is a sealing structure, which is used for manufacturing a member for a liquid crystal display panel, and includes a first laminated body having a thickness of 0.3 mm or less. 1 glass substrate and first support structure releasably bonded to the first glass substrate; second laminated body having a second glass substrate having a thickness of 0.3 mm or less and releasably bonded to the second glass substrate A second supporting structure; a sealing portion provided between the first laminated body and the second laminated body so as to surround the formation area of the liquid crystal display panel; and a bonding portion following the first laminated layer in an arbitrary configuration. And the second laminated body; and the first glass substrate and the second glass substrate face each other, and satisfy the following relational expressions (1) and (2).

式(1){(X1×Y1)+(Z1×W1)}/(A1×B1)>1 Formula (1) {(X1 × Y1) + (Z1 × W1)} / (A1 × B1)> 1

式(2){(X2×Y2)+(Z2×W2)}/(A2×B2)>1 Formula (2) {(X2 × Y2) + (Z2 × W2)} / (A2 × B2)> 1

(式(1)中,X1表示密封部與第1玻璃基板之間之剝離強度(N/mm),Y1表示密封部與第1玻璃基板之總接觸面積(mm2),Z1表示接著部與第1玻璃基板之間之剝離強度(N/mm),W1表示接著部與第1玻璃基板之總接觸面積(mm2),A1表示第1玻璃基板與第1支撐構造體之間之剝離強度(N/mm),B1表示第1玻璃基板與第1支撐構造體之總接觸面積(mm2),式(2)中,X2表示密封部與第2玻璃基板之間之剝離強度(N/mm),Y2表示密封部與第2玻璃基板之總接觸面積(mm2),Z2表示接著部與第2玻璃基板之間之剝離強度(N/mm),W2表示接著部與第2玻璃基板之總接觸面積(mm2),A2表示第2玻璃基板與第2支撐構造體之間之剝離強度(N/mm),B2表示第2玻璃基板與第2支撐構造體之總接觸面積(mm2);再者,於不存在接著部之情形時,設為(Z1×W1)=0及(Z2×W2)=0) (In formula (1), X1 represents the peel strength (N / mm) between the sealing portion and the first glass substrate, Y1 represents the total contact area (mm 2 ) between the sealing portion and the first glass substrate, and Z1 represents the bonding portion and Peel strength (N / mm) between the first glass substrate, W1 represents the total contact area (mm 2 ) between the bonding portion and the first glass substrate, and A1 represents the peel strength between the first glass substrate and the first support structure. (N / mm), B1 represents the total contact area (mm 2 ) between the first glass substrate and the first support structure, and in formula (2), X2 represents the peel strength between the sealing portion and the second glass substrate (N / mm), Y2 indicates the total contact area (mm 2 ) between the sealing portion and the second glass substrate, Z2 indicates the peel strength (N / mm) between the bonding portion and the second glass substrate, and W2 indicates the bonding portion and the second glass substrate. The total contact area (mm 2 ), A2 represents the peel strength (N / mm) between the second glass substrate and the second support structure, and B2 represents the total contact area (mm) of the second glass substrate and the second support structure 2 ); Furthermore, when there is no bonding part, set (Z1 × W1) = 0 and (Z2 × W2) = 0)

於第1態樣中,較佳為包含複數個密封部。 In the first aspect, it is preferable to include a plurality of sealing portions.

於第1態樣中,較佳為包含接著部,且接著部係沿著密封部呈直線狀設置。 In the first aspect, it is preferable to include a bonding portion, and the bonding portion is provided linearly along the sealing portion.

於第1態樣中,較佳為包含接著部,且接著部係以包圍複數個密封部之整體之方式設置。 In the first aspect, it is preferable that the bonding portion is included, and the bonding portion is provided so as to surround the entirety of the plurality of sealing portions.

於第1態樣中,較佳為包含接著部,且接著部係以包圍複數個密封部之各者之方式設置。 In the first aspect, it is preferable to include a bonding portion, and the bonding portion is provided so as to surround each of the plurality of sealing portions.

於第1態樣中,較佳為第1玻璃基板及第2玻璃基板具有縱730 mm×橫920 mm以上之大小。 In the first aspect, the first glass substrate and the second glass substrate preferably have a size of 730 mm in length × 920 mm in width.

於第1態樣中,較佳為第1玻璃基板及/或第2玻璃基板由無鹼玻璃構成。 In the first aspect, it is preferable that the first glass substrate and / or the second glass substrate be made of alkali-free glass.

於第1態樣中,較佳為玻璃板由以氧化物基準之質量百分率表示含有下述成分之無鹼玻璃構成。 In the first aspect, the glass plate is preferably composed of an alkali-free glass containing the following components in terms of mass percentage based on an oxide.

SiO2:50~66% SiO 2 : 50 ~ 66%

Al2O3:10.5~24% Al 2 O 3 : 10.5 ~ 24%

B2O3:0~12% B 2 O 3 : 0 ~ 12%

MgO:0~8% MgO: 0 ~ 8%

CaO:0~14.5% CaO: 0 ~ 14.5%

SrO:0~24% SrO: 0 ~ 24%

BaO:0~13.5% BaO: 0 ~ 13.5%

MgO+CaO+SrO+BaO:9~29.5% MgO + CaO + SrO + BaO: 9 ~ 29.5%

ZnO:0~5% ZnO: 0 ~ 5%

於第1態樣中,玻璃板較佳為由以氧化物基準之質量百分率表示含有下述成分之無鹼玻璃構成。 In the first aspect, the glass plate is preferably composed of an alkali-free glass containing the following components in terms of mass percentage based on an oxide.

SiO2:58~66% SiO 2 : 58 ~ 66%

Al2O3:15~22% Al 2 O 3 : 15 ~ 22%

B2O3:5~12% B 2 O 3 : 5 ~ 12%

MgO:0~8% MgO: 0 ~ 8%

CaO:0~9% CaO: 0 ~ 9%

SrO:3~12.5% SrO: 3 ~ 12.5%

BaO:0~2% BaO: 0 ~ 2%

MgO+CaO+SrO+BaO:9~18% MgO + CaO + SrO + BaO: 9 ~ 18%

ZnO:0~2% ZnO: 0 ~ 2%

本發明之第2態樣係一種液晶顯示面板用構件之製造方法,其包括自第1態樣剝離第1支撐構造體及第2支撐構造體之剝離步驟。 A second aspect of the present invention is a method for manufacturing a member for a liquid crystal display panel, which includes a step of peeling off the first support structure and the second support structure from the first aspect.

於第2態樣中,在剝離步驟中,第1支撐構造體及第2支撐構造體自密封構造體之剝離較佳為自密封構造體之一端部緩慢地進行。 In the second aspect, in the peeling step, the peeling of the first support structure and the second support structure from the self-sealing structure is preferably performed slowly at one end of the self-sealing structure.

根據本發明,可提供一種能夠抑制支撐構造體之剝離時之密封部之剝離或玻璃基板之損傷、為了製造液晶顯示面板用構件而使用之密封構造體。 According to the present invention, it is possible to provide a sealing structure that can suppress peeling of a sealing portion or damage to a glass substrate during peeling of a support structure and is used for manufacturing a member for a liquid crystal display panel.

10、200、300、400‧‧‧密封構造體 10, 200, 300, 400‧‧‧ sealed structures

11‧‧‧第1積層體 11‧‧‧The first laminated body

12‧‧‧第2積層體 12‧‧‧Second layered body

13‧‧‧密封部 13‧‧‧Sealing Department

14‧‧‧接著部 14‧‧‧ Follow-up

20‧‧‧液晶顯示面板用構件 20‧‧‧Members for liquid crystal display panels

111‧‧‧第1玻璃基板 111‧‧‧1st glass substrate

112‧‧‧第1支撐構造體 112‧‧‧The first supporting structure

113‧‧‧第1支撐板 113‧‧‧The first support plate

114‧‧‧第1黏著層 114‧‧‧The first adhesive layer

121‧‧‧第2玻璃基板 121‧‧‧ 2nd glass substrate

122‧‧‧第2支撐構造體 122‧‧‧ 2nd supporting structure

123‧‧‧第2支撐板 123‧‧‧Second support plate

124‧‧‧第2黏著層 124‧‧‧Second adhesive layer

L‧‧‧剝離邊界線 L‧‧‧ strip boundary

圖1係表示本發明之密封構造體之第1實施形態之俯視圖。 Fig. 1 is a plan view showing a first embodiment of a sealing structure according to the present invention.

圖2係圖1所示之密封構造體之A-A線剖面圖。 Fig. 2 is a sectional view taken along the line A-A of the sealing structure shown in Fig. 1.

圖3係說明自圖1所示之密封構造體剝離第1支撐構造體之剝離方法之說明圖。 FIG. 3 is an explanatory diagram illustrating a peeling method of peeling a first support structure from the sealing structure shown in FIG. 1.

圖4係表示本發明之密封構造體之第2實施形態之俯視圖。 Fig. 4 is a plan view showing a second embodiment of the sealing structure according to the present invention.

圖5係圖4所示之密封構造體之A-A線剖面圖。 Fig. 5 is a sectional view taken along the line A-A of the sealing structure shown in Fig. 4.

圖6係說明自圖4所示之密封構造體剝離第1支撐構造體之剝離方法之說明圖。 FIG. 6 is an explanatory diagram illustrating a peeling method of peeling a first support structure from the sealing structure shown in FIG. 4.

圖7係表示密封構造體之變化例之俯視圖。 FIG. 7 is a plan view showing a modified example of the sealing structure.

圖8係表示密封構造體之另一變化例之俯視圖。 FIG. 8 is a plan view showing another modified example of the sealing structure.

以下,對本發明之實施形態進行說明。 Hereinafter, embodiments of the present invention will be described.

再者,列舉滿足下述式(1)及式(2)之關係之方面作為本發明之特徵點。關於式(1)及式(2)之詳細情況將於下文敍述。 In addition, aspects satisfying the relationship of the following formulae (1) and (2) are cited as characteristic points of the present invention. The details of the formulas (1) and (2) will be described later.

<第1實施形態> <First Embodiment>

以下,參照圖式對密封構造體之第1實施形態進行具體說明。 Hereinafter, a first embodiment of the seal structure will be specifically described with reference to the drawings.

圖1、2係表示密封構造體之第1實施形態之一例之俯視圖及A-A線剖面圖。 1 and 2 are a plan view and an A-A cross-sectional view showing an example of the first embodiment of the sealed structure.

密封構造體10係用於製造液晶顯示面板用構件20者,且如圖2所示,於一部分具有成為液晶顯示面板用構件20之部分。密封構造體10包含第1積層體11、第2積層體12及密封部13。再者,密封構造體10不含接著部。 The sealing structure 10 is used for manufacturing the member 20 for a liquid crystal display panel, and as shown in FIG. 2, it has a part which becomes the member 20 for a liquid crystal display panel. The sealing structure 10 includes a first laminated body 11, a second laminated body 12, and a sealing portion 13. The sealing structure 10 does not include a bonding portion.

第1積層體11與第2積層體12係設置間隔而對向配置。密封部13係於第1積層體11與第2積層體12之間,以例如包圍成為液晶顯示面板之形成區域之方式設置成例如複數個框狀。於圖1所示之密封構造體10中,對應於6個形成區域而設置有6個框狀之密封部13。 The first laminated body 11 and the second laminated body 12 are arranged facing each other with a gap therebetween. The sealing portion 13 is provided between the first laminated body 11 and the second laminated body 12 and is provided in, for example, a plurality of frames so as to surround, for example, a formation area of a liquid crystal display panel. In the sealing structure 10 shown in FIG. 1, six frame-shaped sealing portions 13 are provided corresponding to the six formation regions.

第1積層體11包含第1玻璃基板111、及可剝離地貼合於該第1玻璃基板111之第1支撐構造體112。第1支撐構造體112進而包含第1支撐板113、及設置於該第1支撐板113之一主面之第1黏著層114。第1支撐構造體112係藉由第1黏著層114而可剝離地貼合於第1玻璃基板111。 The first laminated body 11 includes a first glass substrate 111 and a first support structure 112 that is releasably attached to the first glass substrate 111. The first support structure 112 further includes a first support plate 113 and a first adhesive layer 114 provided on a main surface of the first support plate 113. The first support structure 112 is releasably bonded to the first glass substrate 111 via the first adhesive layer 114.

第2積層體12包含第2玻璃基板121、及可剝離地貼合於該第2玻璃基板121之第2支撐構造體122。第2支撐構造體122進而包含第2支撐板123、及設置於該第2支撐板123之一主面之第2黏著層124。第2支撐構造體122係藉由第2黏著層124而可剝離地貼合於第2玻璃基板121。 The second laminated body 12 includes a second glass substrate 121 and a second support structure 122 that is releasably attached to the second glass substrate 121. The second support structure 122 further includes a second support plate 123 and a second adhesive layer 124 provided on one main surface of the second support plate 123. The second support structure 122 is releasably bonded to the second glass substrate 121 via the second adhesive layer 124.

再者,密封構造體10中之除第1支撐構造體112及第2支撐構造體122以外之部分、即第1玻璃基板111、第2玻璃基板121、及配置於該 等之間之密封部13成為液晶顯示面板用構件20。 In addition, the portions of the seal structure 10 other than the first support structure 112 and the second support structure 122, that is, the first glass substrate 111, the second glass substrate 121, and the glass structure are disposed thereon. The sealing portion 13 between the two parts becomes a member 20 for a liquid crystal display panel.

第1積層體11與第2積層體12係以第1玻璃基板111與第2玻璃基板121對向之方式配置。於第1玻璃基板111、第2玻璃基板121之表面中之成為液晶顯示面板之形成區域,雖未圖示,但根據液晶顯示方式並視需要形成有絕緣膜、透明電極膜、薄膜電晶體(TFT)或薄膜二極體(TFD)等開關元件、彩色濾光片(CF)等。 The first laminated body 11 and the second laminated body 12 are arranged so that the first glass substrate 111 and the second glass substrate 121 face each other. An area for forming a liquid crystal display panel on the surfaces of the first glass substrate 111 and the second glass substrate 121 is not shown, but an insulating film, a transparent electrode film, and a thin-film transistor are formed according to the liquid crystal display method and as needed. TFT), thin-film diode (TFD), and other switching elements, color filters (CF), and so on.

密封部13係於第1積層體11與第2積層體12之間,以包圍成為液晶顯示面板之形成區域之方式設置成框狀,並且接著第1積層體11與第2積層體12。密封部13係根據形成區域之個數而形成,如圖示般於形成區域為複數個之情形時,形成有複數個,於形成區域僅為1個之情形時,僅形成1個。 The sealing portion 13 is provided between the first multilayer body 11 and the second multilayer body 12, and is arranged in a frame shape so as to surround the formation area of the liquid crystal display panel, and then the first multilayer body 11 and the second multilayer body 12. The seal portion 13 is formed according to the number of formation regions. As shown in the figure, when there are a plurality of formation regions, a plurality of seal portions are formed. When the formation region is only one, only one is formed.

於密封部13之內部既可填充液晶,亦可不填充。於藉由液晶滴加貼合方式進行製造之情形時,於密封構造體10中之密封部13之內部填充有液晶,且為了保持內部之液晶,各個密封部13之形狀係設為不具有開口部之連續之框狀。另一方面,於藉由液晶注入方式進行製造之情形時,通常於密封構造體10中之密封部13之內部未填充液晶,各個密封部13之形狀係設為具有開口部之框狀,該開口部成為用以於後續步驟中向內部注入液晶之注入口。 The sealing portion 13 may be filled with liquid crystal or not. In the case of manufacturing by the liquid crystal dropping and bonding method, the inside of the sealing portion 13 in the sealing structure 10 is filled with liquid crystal, and in order to maintain the internal liquid crystal, the shape of each sealing portion 13 is set to have no opening. The continuous frame of the department. On the other hand, in the case of manufacturing by a liquid crystal injection method, the liquid crystal is generally not filled in the sealing portion 13 in the sealing structure 10, and the shape of each sealing portion 13 is a frame shape having an opening portion. The opening portion becomes an injection port for injecting liquid crystal into the interior in a subsequent step.

密封構造體10滿足以下之式(1-1)及(2-1)。再者,由於密封構造體10中無接著部,故而上述式(1)中之(Z1×W1)及(Z2×W2)分別相當於0。 The sealing structure 10 satisfies the following formulae (1-1) and (2-1). In addition, since there is no adhesion part in the sealing structure 10, (Z1 × W1) and (Z2 × W2) in the above formula (1) each correspond to 0.

式(1-1) (X1×Y1)/(A1×B1)>1 Formula (1-1) (X1 × Y1) / (A1 × B1)> 1

式(2-1) (X2×Y2)/(A2×B2)>1 Formula (2-1) (X2 × Y2) / (A2 × B2)> 1

式(1-1)中,X1表示密封部13與第1玻璃基板111之間之剝離強度(N/mm)。剝離強度之測定方法並無特別限制,可使用SAICAS等公知之測定裝置進行測定。作為X1,只要滿足上述關係則其值並無特別 限制,但就可進一步抑制支撐構造體之剝離時之密封部之剝離或玻璃基板之損傷的方面而言,較佳為0.10 N/mm以上,更佳為0.15 N/mm以上。上限並無特別限制。 In the formula (1-1), X1 represents the peel strength (N / mm) between the sealing portion 13 and the first glass substrate 111. The method for measuring the peel strength is not particularly limited, and it can be measured using a known measuring device such as SAICAS. As X1, as long as the above relationship is satisfied, its value is not special It is limited, but from the viewpoint of further suppressing the peeling of the sealing portion or the damage of the glass substrate during the peeling of the support structure, it is preferably 0.10 N / mm or more, and more preferably 0.15 N / mm or more. The upper limit is not particularly limited.

Y1表示密封部13與第1玻璃基板111之總接觸面積(mm2)。於圖1及2所示之密封部13之情形時,意指6個框狀之密封部13與第1玻璃基板11接觸之面積之總和。換言之,相當於圖1中之密封部13所占之總面積。 Y1 represents the total contact area 111 of the substrate glass 13 and the first sealing portion (mm 2). In the case of the sealing portion 13 shown in FIGS. 1 and 2, it means the sum of the areas where the six frame-shaped sealing portions 13 contact the first glass substrate 11. In other words, it corresponds to the total area occupied by the sealing portion 13 in FIG. 1.

A1表示第1玻璃基板111與第1支撐構造體112之間之剝離強度(N/mm)。如上所述,第1玻璃基板111與第1支撐構造體112係可剝離地貼合。作為A1,只要滿足上述關係則其值並無特別限制,但就可進一步抑制支撐構造體之剝離時之密封部之剝離或玻璃基板之損傷的方面而言,較佳為0.015 N/mm以下,更佳為0.010 N/mm以下。上限並無特別限制,但就可進一步抑制第1玻璃基板111之位置偏移之方面而言,較佳為0.001 N/mm以上。 A1 represents the peel strength (N / mm) between the first glass substrate 111 and the first support structure 112. As described above, the first glass substrate 111 and the first support structure 112 are releasably attached. As A1, the value is not particularly limited as long as the above relationship is satisfied, but it is preferably 0.015 N / mm or less in terms of further suppressing the peeling of the sealing portion or the damage of the glass substrate at the time of peeling of the support structure, It is more preferably 0.010 N / mm or less. The upper limit is not particularly limited, but it is preferably 0.001 N / mm or more from the viewpoint that the positional deviation of the first glass substrate 111 can be further suppressed.

B1表示第1玻璃基板111與第1支撐構造體112之總接觸面積(mm2)。於圖1及2之情形時,第1玻璃基板111與第1支撐構造體112係遍及整個面地接觸,兩者之總接觸面積相當於第1玻璃基板111(或第1支撐構造體112)之面積。 B1 represents the total contact area (mm 2 ) between the first glass substrate 111 and the first support structure 112. In the case of FIGS. 1 and 2, the first glass substrate 111 and the first support structure 112 are in contact over the entire surface, and the total contact area of the two is equivalent to the first glass substrate 111 (or the first support structure 112). Of the area.

藉由使密封構造體10滿足式(1-1)之關係,可於自密封構造體10剝離第1支撐構造體112時,抑制密封部13之剝離或第1玻璃基板111之損傷。 When the sealing structure 10 satisfies the relationship of formula (1-1), when the first support structure 112 is peeled from the sealing structure 10, peeling of the sealing portion 13 or damage to the first glass substrate 111 can be suppressed.

若僅控制密封部13與第1玻璃基板111之間之剝離強度、與第1玻璃基板111與第1支撐構造體112之間之剝離強度的差,則於剝離第1支撐構造體112時,無法充分地抑制密封部13之剝離或第1玻璃基板111之損傷。推測其原因在於:剝離第1支撐構造體112時之應力不僅波及至局部之部分,而且波及至整個面。因此,本發明者等人想到密封部 13與第1玻璃基板111之總接觸面積、及第1玻璃基板111與第1支撐構造體112之總接觸面積會對表現所期望之效果發揮重要作用,從而發現必須滿足式(1-1)之關係。亦即,於式(1-1)中,將密封部13與第1玻璃基板111之間之剝離強度X1乘以接觸面積Y1所得之值與第1玻璃基板111與第1支撐構造體112之間之剝離強度A1乘以接觸面積B1所得之值進行比較,若該值超過特定值,則意為可抑制密封部之剝離或玻璃基板之損傷。再者,剝離強度乘以總接觸面積所得之值意為接著之兩者之間之剝離能之總和。 If only the difference between the peel strength between the sealing portion 13 and the first glass substrate 111 and the peel strength between the first glass substrate 111 and the first support structure 112 is controlled, when the first support structure 112 is peeled, Peeling of the sealing portion 13 or damage to the first glass substrate 111 cannot be sufficiently suppressed. The reason for this is presumably that the stress when the first support structure 112 was peeled off not only spread to a local part, but also spread to the entire surface. Therefore, the inventors thought of the sealing portion The total contact area between 13 and the first glass substrate 111 and the total contact area between the first glass substrate 111 and the first support structure 112 will play an important role in expressing the desired effect, and it was found that it must satisfy the formula (1-1) Relationship. That is, in the formula (1-1), the value obtained by multiplying the peeling strength X1 between the sealing portion 13 and the first glass substrate 111 by the contact area Y1 and the value between the first glass substrate 111 and the first support structure 112 The value obtained by multiplying the peeling strength A1 by the contact area B1 is compared. If the value exceeds a specific value, it means that peeling of the sealing portion or damage to the glass substrate can be suppressed. In addition, the value obtained by multiplying the peeling strength by the total contact area means the sum of the peeling energy between the following two.

再者,於式(1-1)中,雖然(X1×Y1)/(A1×B1)超過1,但就可進一步抑制密封部之剝離或玻璃基板之損傷之方面而言,較佳為1.10以上,更佳為1.40以上。再者,上限並無特別限制,但10以下之情形較多。 Furthermore, in the formula (1-1), although (X1 × Y1) / (A1 × B1) exceeds 1, from the viewpoint of further suppressing the peeling of the sealing portion or the damage of the glass substrate, it is preferably 1.10. The above is more preferably 1.40 or more. The upper limit is not particularly limited, but there are many cases where the upper limit is 10 or less.

又,藉由使密封構造體10滿足式(2-1)之關係,可於自密封構造體10剝離第2支撐構造體122時,抑制密封部13之剝離或第2玻璃基板121之損傷。 In addition, by satisfying the relationship of the formula (2-1) with the seal structure 10, when the second support structure 122 is peeled from the seal structure 10, peeling of the seal portion 13 or damage to the second glass substrate 121 can be suppressed.

式(2-1)中,X2表示密封部13與第2玻璃基板121之間之剝離強度(N/mm)。剝離強度之測定方法並無特別限制,可使用SAICAS等公知之測定裝置進行測定。X2之較佳態樣與上述X1之較佳態樣相同。 In the formula (2-1), X2 represents a peel strength (N / mm) between the sealing portion 13 and the second glass substrate 121. The method for measuring the peel strength is not particularly limited, and it can be measured using a known measuring device such as SAICAS. The preferred aspect of X2 is the same as the aforementioned preferred aspect of X1.

Y2表示密封部13與第2玻璃基板121之總接觸面積(mm2)。於圖1及2所示之密封部13之情形時,意指6個框狀之密封部13與第2玻璃基板121接觸之面積之總和。 Y2 represents the total contact area (mm 2 ) of the sealing portion 13 and the second glass substrate 121. In the case of the sealing portion 13 shown in FIGS. 1 and 2, it means the sum of the areas where the six frame-shaped sealing portions 13 are in contact with the second glass substrate 121.

A2表示第2玻璃基板121與第2支撐構造體122之間之剝離強度(N/mm)。如上所述,第2玻璃基板121與第2支撐構造體122係可剝離地貼合。A2之較佳態樣與上述A1之較佳態樣相同。 A2 indicates the peel strength (N / mm) between the second glass substrate 121 and the second support structure 122. As described above, the second glass substrate 121 and the second support structure 122 are releasably attached. The preferred aspect of A2 is the same as the aforementioned preferred aspect of A1.

B2表示第2玻璃基板121與第2支撐構造體122之總接觸面積(mm2)。於圖1及2之情形時,第2玻璃基板121與第2支撐構造體122係 遍及整個面地接觸,兩者之總接觸面積相當於第1玻璃基板111(或第1支撐構造體112)之面積。 B2 indicates the total contact area (mm 2 ) between the second glass substrate 121 and the second support structure 122. In the cases of FIGS. 1 and 2, the second glass substrate 121 and the second support structure 122 are in contact over the entire surface, and the total contact area of the two is equivalent to the first glass substrate 111 (or the first support structure 112). Of the area.

進而,於式(2-1)中,雖然(X2×Y2)/(A2×B2)超過1,但就可進一步抑制密封部之剝離或玻璃基板之損傷之方面而言,較佳為1.10以上,更佳為1.40以上。再者,上限並無特別限制,但10以下之情形較多。 Furthermore, in the formula (2-1), although (X2 × Y2) / (A2 × B2) exceeds 1, in terms of further suppressing the peeling of the sealing portion or damage to the glass substrate, it is preferably 1.10 or more , More preferably 1.40 or more. The upper limit is not particularly limited, but there are many cases where the upper limit is 10 or less.

又,於密封構造體10中,就可進一步抑制密封部之剝離或玻璃基板之損傷之方面而言,X1/A1或X2/A2較佳為5~100,更佳為10~100。 Moreover, in the sealing structure 10, X1 / A1 or X2 / A2 is preferably 5 to 100, and more preferably 10 to 100 in terms of further suppressing peeling of the sealing portion or damage to the glass substrate.

進而,於密封構造體10中,就可進一步抑制密封部之剝離或玻璃基板之損傷之方面而言,Y1/B1或Y2/B2較佳為5~100,更佳為10~100。 Furthermore, in the sealing structure 10, from the viewpoint of further suppressing the peeling of the sealing portion or the damage to the glass substrate, Y1 / B1 or Y2 / B2 is preferably 5 to 100, and more preferably 10 to 100.

作為第1玻璃基板111、第2玻璃基板121,分別使用板厚為0.3 mm以下之玻璃板。藉由將板厚設為0.3 mm以下,可有效地使液晶顯示面板輕量化。第1玻璃基板111、第2玻璃基板121之大小並無特別限制,例如,較佳為縱100 mm以上×橫100 mm以上,更佳為縱500 mm以上×橫500 mm以上。尤佳為縱730 mm以上×橫920 mm以上之大小。藉由設為此種大小,可有效率地製造複數個液晶顯示面板。作為此種第1玻璃基板111、第2玻璃基板121,使用液晶顯示面板之製造所使用之公知之玻璃板。 As the first glass substrate 111 and the second glass substrate 121, glass plates each having a thickness of 0.3 mm or less were used. By setting the plate thickness to 0.3 mm or less, the weight of the liquid crystal display panel can be effectively reduced. The size of the first glass substrate 111 and the second glass substrate 121 is not particularly limited. For example, it is preferably 100 mm or more × 100 mm or more, and more preferably 500 mm or more × 500 mm or more. Particularly preferred is a size of 730 mm or more x 920 mm or more. With such a size, a plurality of liquid crystal display panels can be efficiently manufactured. As such a 1st glass substrate 111 and a 2nd glass substrate 121, the well-known glass plate used for manufacture of a liquid crystal display panel is used.

玻璃板係將玻璃原料熔融,並將熔融玻璃成形為板狀而獲得。作為此種成形方法,可為一般方法,例如使用浮式法、熔融法、流孔下引法、富可法、魯伯法等。尤其是板厚較薄之玻璃板係藉由如下方法(再曳引法)較佳地成形而獲得:將暫時成形為板狀之玻璃加熱至可成形溫度,並利用延伸等方法拉伸而使其變薄。 The glass plate is obtained by melting a glass raw material and molding the molten glass into a plate shape. As such a molding method, a general method can be used, and for example, a float method, a melting method, a downhole method, a Fock method, a Ruber method, or the like can be used. In particular, a glass plate having a thinner plate thickness is obtained by better forming by a method (retraction method): heating the glass temporarily formed into a plate shape to a formable temperature, and stretching it by a method such as stretching It becomes thin.

玻璃板之種類可不必受到限定,較佳為無鹼硼矽酸玻璃、硼矽 酸玻璃、鹼石灰玻璃、高矽玻璃、其他以氧化矽作為主要成分之氧化物系玻璃。作為氧化物系玻璃,較佳為藉由氧化物換算而得之氧化矽之含量為40~90質量%之玻璃。 The type of glass plate need not be limited, and alkali-free borosilicate glass and borosilicate are preferred Acid glass, soda-lime glass, high-silica glass, and other oxide-based glass containing silicon oxide as the main component. The oxide-based glass is preferably a glass having a silicon oxide content of 40 to 90% by mass, which is obtained by conversion of an oxide.

鹼金屬成分之溶出容易對液晶造成影響,故而尤佳為實質上不含鹼金屬成分之玻璃(無鹼玻璃)。作為無鹼玻璃,可列舉以氧化物基準之質量百分率表示,含有SiO2:50~66%、Al2O3:10.5~24%、B2O3:0~12%、MgO:0~8%、CaO:0~14.5%、SrO:0~24%、BaO:0~13.5%、MgO+CaO+SrO+BaO:9~29.5%、ZnO:0~5%者。 The dissolution of an alkali metal component easily affects the liquid crystal, and therefore, glass (alkaline-free glass) that does not substantially contain an alkali metal component is particularly preferred. Examples of the alkali-free glass include an oxide-based mass percentage, containing SiO 2 : 50 to 66%, Al 2 O 3 : 10.5 to 24%, B 2 O 3 : 0 to 12%, and MgO: 0 to 8 %, CaO: 0 ~ 14.5%, SrO: 0 ~ 24%, BaO: 0 ~ 13.5%, MgO + CaO + SrO + BaO: 9 ~ 29.5%, ZnO: 0 ~ 5%.

關於SiO2,若其含量未達50%,則應變點不會充分提高,並且化學耐久性變差,熱膨脹係數增大。若超過66%,則熔解性降低,失透溫度上升。較佳為58~66莫耳%。 Regarding SiO 2 , if the content is less than 50%, the strain point will not be sufficiently increased, the chemical durability will be deteriorated, and the thermal expansion coefficient will be increased. If it exceeds 66%, the meltability will decrease and the devitrification temperature will increase. It is preferably 58 to 66 mol%.

Al2O3抑制玻璃之分相性,降低熱膨脹係數,且提高應變點。若其含量未達10.5%,則不會表現出該效果,若超過24%,則玻璃之熔解性變差。較佳為15~22%。 Al 2 O 3 suppresses the phase separation of glass, reduces the coefficient of thermal expansion, and increases the strain point. If the content is less than 10.5%, the effect will not be exhibited, and if it exceeds 24%, the melting property of the glass will be deteriorated. It is preferably 15 to 22%.

B2O3並非必需成分,但可提高對半導體形成時所使用之各種化學品等之化學耐久性,並且可不使高溫下之黏性提高而達成熱膨脹係數與密度之降低。若其含量超過12%,則耐酸性變差,並且應變點變低。較佳為5~12%。 B 2 O 3 is not an essential component, but it can improve chemical durability to various chemicals and the like used in the formation of semiconductors, and can reduce the coefficient of thermal expansion and density without increasing the viscosity at high temperatures. When the content exceeds 12%, the acid resistance is deteriorated, and the strain point is lowered. It is preferably 5 to 12%.

MgO於鹼土類金屬氧化物中降低熱膨脹係數,且應變點不會降低,故而雖並非必需成分但亦可含有。若其含量超過8%,則對半導體形成時所使用之各種化學品等之化學耐久性降低,又,易於產生玻璃之分相。 MgO reduces the coefficient of thermal expansion in the alkaline earth metal oxide and does not reduce the strain point. Therefore, MgO may be contained although it is not an essential component. If the content exceeds 8%, the chemical durability of various chemicals and the like used in the formation of semiconductors is reduced, and the glass is likely to undergo phase separation.

CaO並非必需成分,但藉由含有CaO可提高玻璃之熔解性。另一方面,若超過14.5%,則熱膨脹係數變大,失透溫度亦上升。較佳為0~9%。 CaO is not an essential component, but by including CaO, the melting property of glass can be improved. On the other hand, if it exceeds 14.5%, the thermal expansion coefficient increases and the devitrification temperature also increases. It is preferably 0 to 9%.

SrO並非必需成分,但由於其抑制玻璃之分相,且提高對半導體形成時所使用之各種化學品等之化學耐久性,故而為有用之成分。若其含量超過24%,則膨脹係數增大。較佳為3~12.5%。 SrO is not an essential component, but it is a useful component because it suppresses the phase separation of glass and improves the chemical durability against various chemicals and the like used in the formation of semiconductors. If its content exceeds 24%, the expansion coefficient increases. It is preferably 3 to 12.5%.

BaO並非必需成分,但就密度較小且減小熱膨脹係數之觀點而言為有用之成分。其含量為0~13.5%,較佳為0~2%。 BaO is not an essential component, but it is a useful component from the viewpoint of a small density and a reduced thermal expansion coefficient. Its content is 0 to 13.5%, preferably 0 to 2%.

若MgO+CaO+SrO+BaO未達9%,則難以熔解,若超過29.5%,則密度變大。MgO+CaO+SrO+BaO較佳為9~18%。 If MgO + CaO + SrO + BaO is less than 9%, it will be difficult to melt, and if it exceeds 29.5%, the density will increase. MgO + CaO + SrO + BaO is preferably 9 to 18%.

ZnO並非必需成分,但為了改善玻璃之熔解性、澄清性、成形性,可添加ZnO。其含量為0~5%,較佳為0~2%。 ZnO is not an essential component, but ZnO may be added in order to improve the melting, clarity, and formability of glass. Its content is 0 to 5%, preferably 0 to 2%.

無鹼玻璃中,除上述成分以外,為了改善玻璃之熔解性、澄清性、成形性,亦可添加總量為5%以下之SO3、F、Cl。 In addition to the above components, in the alkali-free glass, SO 3 , F, and Cl may be added in a total amount of 5% or less in order to improve the melting, clarification, and formability of the glass.

作為無鹼玻璃,較佳為可列舉以氧化物基準之質量百分率表示含有SiO2:58~66%、Al2O3:15~22%、B2O3:5~12%、MgO:0~8%、CaO:0~9%、SrO:3~12.5%、BaO:0~2%、MgO+CaO+SrO+BaO:9~18%、ZnO:0~2%者。 Examples of the alkali-free glass include containing SiO 2 : 58 to 66%, Al 2 O 3 : 15 to 22%, B 2 O 3 : 5 to 12%, and MgO: 0 in terms of mass percentage based on oxides. ~ 8%, CaO: 0 ~ 9%, SrO: 3 ~ 12.5%, BaO: 0 ~ 2%, MgO + CaO + SrO + BaO: 9 ~ 18%, ZnO: 0 ~ 2%.

無鹼玻璃之應變點較佳為640℃以上,更佳為650℃以上。熱膨脹係數較佳為未達40×10-7/℃,更佳為30×10-7/℃以上且未達40×10-7/℃。密度較佳為未達2.60 g/cc,更佳為未達2.55 g/cc,進而較佳為未達2.50 g/cc。 The strain point of the alkali-free glass is preferably 640 ° C or higher, and more preferably 650 ° C or higher. The thermal expansion coefficient is preferably less than 40 × 10 -7 / ° C, more preferably 30 × 10 -7 / ° C or more and less than 40 × 10 -7 / ° C. The density is preferably less than 2.60 g / cc, more preferably less than 2.55 g / cc, and even more preferably less than 2.50 g / cc.

作為第1支撐板113、第2支撐板123,只要能有效地支撐第1玻璃基板111、第2玻璃基板121則無特別限定,作為較佳者可列舉玻璃板、金屬板、樹脂板。第1玻璃基板111與第1支撐板113之線膨脹係數之差較佳為150×10-7/℃以下,更佳為100×10-7/℃以下,進而較佳為50×10-7/℃以下。同樣地,第2玻璃基板121與第2支撐板123之線膨脹係數之差較佳為150×10-7/℃以下,更佳為100×10-7/℃以下,進而較佳為50×10-7/℃以下。 The first support plate 113 and the second support plate 123 are not particularly limited as long as they can effectively support the first glass substrate 111 and the second glass substrate 121, and glass plates, metal plates, and resin plates are preferably used. The difference in linear expansion coefficient between the first glass substrate 111 and the first support plate 113 is preferably 150 × 10 -7 / ° C or lower, more preferably 100 × 10 -7 / ° C or lower, and further preferably 50 × 10 -7 / ° C or less. Similarly, the difference between the linear expansion coefficients of the second glass substrate 121 and the second support plate 123 is preferably 150 × 10 -7 / ° C or lower, more preferably 100 × 10 -7 / ° C or lower, and further preferably 50 × 10 -7 / ℃ or less.

作為玻璃板,使用與第1玻璃基板111或第2玻璃基板121所使用者相同之種類,較佳為無鹼硼矽酸玻璃、硼矽酸玻璃、鹼石灰玻璃、高矽玻璃、其他以氧化矽作為主要成分之氧化物系玻璃。作為金屬板,可例示不鏽鋼、銅等。 As the glass plate, the same type as the user of the first glass substrate 111 or the second glass substrate 121 is used, preferably alkali-free borosilicate glass, borosilicate glass, soda-lime glass, high-silica glass, or others An oxide-based glass whose main ingredient is silicon. Examples of the metal plate include stainless steel and copper.

作為樹脂板,可例示:聚對苯二甲酸乙二酯樹脂、聚碳酸酯樹脂、聚醯亞胺樹脂、氟樹脂、聚醯胺樹脂、聚芳醯胺樹脂、聚醚碸樹脂、聚醚酮樹脂、聚醚醚酮樹脂、聚萘二甲酸乙二酯樹脂、聚丙烯酸樹脂、各種液晶聚合物樹脂、聚矽氧樹脂等。 Examples of the resin plate include polyethylene terephthalate resin, polycarbonate resin, polyimide resin, fluororesin, polyimide resin, polyaramide resin, polyether resin, and polyetherketone. Resins, polyetheretherketone resins, polyethylene naphthalate resins, polyacrylic resins, various liquid crystal polymer resins, polysiloxane resins, and the like.

第1支撐板113、第2支撐板123之板厚並無特別限定,就有效地支撐第1玻璃基板111、第2玻璃基板121之觀點而言,分別較佳為0.1~1.1 mm之板厚。第1支撐板113、第2支撐板123之板厚尤佳為可應用於現行之液晶顯示面板之生產線之板厚。例如,現行之液晶顯示面板之生產線所使用之玻璃基板之板厚處於0.5~1.2 mm之範圍內,尤其以0.7 mm居多。因此,較佳為考慮第1玻璃基板111或第2玻璃基板121之板厚為0.3 mm以下,同時決定第1支撐板113或第2支撐板123之板厚,以使例如第1積層體11或第2積層體12之板厚成為0.7 mm。 The thicknesses of the first support plate 113 and the second support plate 123 are not particularly limited. From the viewpoint of effectively supporting the first glass substrate 111 and the second glass substrate 121, plate thicknesses of 0.1 to 1.1 mm are preferred, respectively. . The thickness of the first support plate 113 and the second support plate 123 is particularly preferably a thickness that can be applied to a production line of an existing liquid crystal display panel. For example, the thickness of the glass substrate used in the current production line of liquid crystal display panels is in the range of 0.5 to 1.2 mm, especially 0.7 mm. Therefore, the thickness of the first glass substrate 111 or the second glass substrate 121 is preferably 0.3 mm or less, and the thickness of the first support plate 113 or the second support plate 123 is preferably determined so that, for example, the first laminated body 11 Or, the plate thickness of the second laminated body 12 is 0.7 mm.

第1黏著層114能夠供第1玻璃基板111可剝離地貼合,只要為第1玻璃基板111與第1黏著層114之剝離強度較第1支撐板113與第1黏著層114之剝離強度低者則無特別限制。第1黏著層114主要係為了抑制第1玻璃基板111之位置偏移而使用。 The first adhesive layer 114 can be used for releasable bonding of the first glass substrate 111, as long as the peel strength of the first glass substrate 111 and the first adhesive layer 114 is lower than that of the first support plate 113 and the first adhesive layer 114. There are no special restrictions. The first adhesive layer 114 is mainly used to suppress the positional deviation of the first glass substrate 111.

再者,關於第2黏著層124亦基本上相同,故而僅對第1黏著層114進行說明。 Since the second adhesive layer 124 is also basically the same, only the first adhesive layer 114 will be described.

於自密封構造體10剝離第1支撐構造體112之情形時,必須於第1玻璃基板111與第1黏著層114之間剝離,而於第1支撐板113與第1黏著層114之間不會剝離。因此,第1黏著層114較佳為不易與第1支撐板113剝離,而容易與第1玻璃基板111剝離。 When the first support structure 112 is peeled from the self-sealing structure 10, it must be peeled between the first glass substrate 111 and the first adhesive layer 114, but not between the first support plate 113 and the first adhesive layer 114. Will peel off. Therefore, it is preferable that the first adhesive layer 114 is not easily separated from the first support plate 113 and is easily separated from the first glass substrate 111.

作為使第1玻璃基板111與第1黏著層114之剝離強度低於第1支撐板113與第1黏著層114之剝離強度之方法,例如,可列舉如下方法:使用硬化性聚矽氧樹脂組合物作為構成第1黏著層114者,於第1支撐板113上塗佈硬化性聚矽氧樹脂組合物,並使其硬化而形成第1黏著層114後,於第1黏著層114上貼合第1玻璃基板111。 As a method of making the peeling strength of the first glass substrate 111 and the first adhesive layer 114 lower than the peeling strength of the first support plate 113 and the first adhesive layer 114, for example, the following method may be used: a combination of a hardening silicone resin As a constituent of the first adhesive layer 114, a curable polysiloxane resin composition is coated on the first support plate 113 and cured to form the first adhesive layer 114, and then bonded to the first adhesive layer 114. First glass substrate 111.

又,於即便使硬化性聚矽氧樹脂組合物與第1玻璃基板111及第1支撐板113之兩者接觸並使其硬化,與第1支撐板113之剝離強度亦高於與第1玻璃基板111之剝離強度之情形時,亦可使硬化性聚矽氧樹脂組合物與第1玻璃基板111及第1支撐板113之兩者接觸並使其硬化。作為此種方法,例如,可列舉對第1支撐板113之表面進行為了提高結合力而提高矽烷醇基之濃度之表面處理的方法。 In addition, even if the curable polysiloxane resin composition is brought into contact with both the first glass substrate 111 and the first support plate 113 and cured, the peeling strength with the first support plate 113 is higher than that with the first glass. In the case of the peeling strength of the substrate 111, the curable polysiloxane resin composition may be brought into contact with both the first glass substrate 111 and the first support plate 113 and cured. Examples of such a method include a method of performing a surface treatment on the surface of the first support plate 113 to increase the concentration of a silanol group in order to increase the bonding force.

作為硬化性聚矽氧樹脂組合物,較佳為含有例如線性有機烯基聚矽氧烷、線性有機氫聚矽氧烷、及觸媒等添加劑,且藉由加熱而硬化之加成反應型硬化性聚矽氧樹脂組合物。加成反應型硬化性聚矽氧樹脂組合物與其他硬化性聚矽氧樹脂組合物相比,硬化反應容易進行,硬化收縮亦較低,硬化物之剝離較容易。作為加成反應型硬化性聚矽氧樹脂組合物之形態,可列舉溶劑型、乳液型、無溶劑型等,可為任一形態。作為加成反應型硬化性聚矽氧樹脂組合物,較佳為例如國際公開第2011/024775號所揭示者。 The curable polysiloxane resin composition is preferably an addition reaction type hardening containing additives such as a linear organic alkenyl polysiloxane, a linear organic hydrogen polysiloxane, and a catalyst, and hardened by heating. Sexual silicone resin composition. Compared with other curable polysiloxane resin compositions, the addition reaction type curable polysiloxane resin composition has a harder curing reaction, lower curing shrinkage, and easier peeling of the cured product. Examples of the form of the addition-reaction-type curable polysiloxane resin composition include a solvent type, an emulsion type, and a solventless type, and may be in any form. As the addition reaction type curable silicone resin composition, for example, those disclosed in International Publication No. 2011/024775 are preferred.

再者,於第1實施形態中使用了第1黏著層114及第2黏著層124,但於第1玻璃基板111與第1支撐板113之間、及第2玻璃基板121與第2支撐板123之間能以所需之關係可剝離地積層之情形時,亦可不使用第1黏著層114及第2黏著層124。 In the first embodiment, the first adhesive layer 114 and the second adhesive layer 124 are used, but between the first glass substrate 111 and the first support plate 113 and between the second glass substrate 121 and the second support plate. When the layers 123 can be peeled and laminated in a desired relationship, the first adhesive layer 114 and the second adhesive layer 124 may not be used.

密封部13只要可接著第1玻璃基板111與第2玻璃基板121則無特別限制,可使用此種液晶顯示面板用構件之製造中通常所使用之公知之使環氧系樹脂等密封材料硬化而成者。 The sealing portion 13 is not particularly limited as long as it can be connected to the first glass substrate 111 and the second glass substrate 121. A known sealing material such as an epoxy resin, which is generally used in the manufacture of such a member for a liquid crystal display panel, can be used to harden Success.

密封部13之寬度較佳為0.08 mm以上。藉由將寬度設為0.08 mm以上,可藉由密封部13有效地接著第1玻璃基板111與第2玻璃基板121,且可有效地抑制密封部13之剝離以及第1玻璃基板111及第2玻璃基板121之破損。寬度更佳為0.1 mm以上,進而較佳為0.5 mm以上。寬度通常只要為0.1 mm左右即可充分地接著第1玻璃基板111與第2玻璃基板121,但就生產性等觀點而言,較佳為5 mm以下,更佳為3 mm以下。 The width of the sealing portion 13 is preferably 0.08 mm or more. By setting the width to be 0.08 mm or more, the first glass substrate 111 and the second glass substrate 121 can be effectively joined by the sealing portion 13, and the peeling of the sealing portion 13 and the first glass substrate 111 and the second can be effectively suppressed. The glass substrate 121 is damaged. The width is more preferably 0.1 mm or more, and still more preferably 0.5 mm or more. Generally, the width can be approximately 0.1 mm to sufficiently adhere the first glass substrate 111 and the second glass substrate 121, but from the viewpoint of productivity and the like, it is preferably 5 mm or less, and more preferably 3 mm or less.

又,於設置密封部13之情形時,較佳為將位於最外周部之密封部13之與積層體端邊相隔之距離設置於10 mm之範圍內。藉由縮短與積層體端邊相隔之距離,可有效地抑制密封部13之剝離以及第1玻璃基板111及第2玻璃基板121之破損。位於最外周部之密封部13之與積層體端邊相隔之距離更佳為5 mm之範圍內,進而較佳為3 mm之範圍內。 When the sealing portion 13 is provided, it is preferable to set the distance between the sealing portion 13 located at the outermost peripheral portion and the end of the laminated body within a range of 10 mm. By shortening the distance from the edge of the laminated body, peeling of the sealing portion 13 and damage of the first glass substrate 111 and the second glass substrate 121 can be effectively suppressed. The distance between the sealing portion 13 located at the outermost peripheral portion and the end of the laminated body is preferably within a range of 5 mm, and further preferably within a range of 3 mm.

(密封構造體之製造方法) (Manufacturing method of sealed structure)

密封構造體10之製造方法並無特別限制,可利用公知之方法進行製造。例如,於製造第1積層體11及第2積層體12後,以包圍第1積層體11中之第1玻璃基板111或第2積層體12中之第2玻璃基板121之形成區域之方式塗佈成為密封部13之密封材料。其後,於採用液晶滴加貼合方式之情形時,對形成區域滴加液晶後,介隔密封材料及液晶積層第1積層體11與第2積層體12。又,於採用液晶注入方式之情形時,介隔密封材料積層第1積層體11與第2積層體12。 The manufacturing method of the sealing structure 10 is not specifically limited, It can manufacture by a well-known method. For example, after the first laminated body 11 and the second laminated body 12 are manufactured, they are applied so as to surround the formation area of the first glass substrate 111 in the first laminated body 11 or the second glass substrate 121 in the second laminated body 12. The cloth becomes a sealing material of the sealing portion 13. Then, when a liquid crystal dropping and bonding method is adopted, after the liquid crystal is dropped to the formation region, the sealing material and the liquid crystal laminated first laminated body 11 and the second laminated body 12 are interposed. When a liquid crystal injection method is used, the first laminated body 11 and the second laminated body 12 are laminated with a sealing material interposed therebetween.

再者,密封材料之塗佈方法並無特別限制,既可使用分注器或噴墨裝置進行描繪,亦可藉由網版印刷進行印刷。再者,作為密封材料,並不限於環氧系樹脂,亦可為例如紫外線硬化型環氧改性丙烯酸系樹脂等。 In addition, the coating method of the sealing material is not particularly limited, and it can be drawn using a dispenser or an inkjet device, or printed by screen printing. The sealing material is not limited to an epoxy resin, and may be, for example, a UV-curable epoxy-modified acrylic resin.

於第1積層體11與第2積層體12之積層後,進行密封材料之硬化。 密封材料之硬化可根據密封材料之硬化方式而採用最佳之硬化方法,例如,於使用環氧系樹脂等作為密封材料之情形時藉由加熱進行硬化,於使用紫外線硬化型環氧改性丙烯酸系樹脂等作為密封材料之情形時藉由照射紫外線進行硬化。 After the first laminated body 11 and the second laminated body 12 are laminated, the sealing material is hardened. The hardening method of the sealing material can be optimized according to the hardening method of the sealing material. For example, when an epoxy resin is used as the sealing material, the hardening is performed by heating, and the ultraviolet curing epoxy-modified acrylic is used. In the case where a resin or the like is used as a sealing material, it is cured by irradiating ultraviolet rays.

再者,第1積層體11係藉由例如將第1玻璃基板111可剝離地貼合於第1支撐構造體112而製造。第1支撐構造體112係例如對第1支撐板113塗佈成為第1黏著層114之硬化性聚矽氧樹脂組合物,並使該硬化性聚矽氧樹脂組合物硬化而製造。第1積層體11係例如將第1玻璃基板111貼合於以此方式製造而成之第1支撐構造體112之第1黏著層114而製造。作為貼合方法,例如,可列舉使用加壓室之非接觸式壓接方法、使用輥或壓機之接觸式壓接方法。關於第2積層體12,亦能以基本上相同之方式製造。 The first laminated body 11 is produced by, for example, releasably bonding the first glass substrate 111 to the first support structure 112. The first support structure 112 is produced by, for example, applying a curable polysiloxane resin composition as the first adhesive layer 114 to the first support plate 113 and curing the curable polysiloxane resin composition. The first laminated body 11 is produced by, for example, bonding the first glass substrate 111 to the first adhesive layer 114 of the first support structure 112 manufactured in this manner. Examples of the bonding method include a non-contact compression bonding method using a pressure chamber, and a contact compression bonding method using a roller or a press. The second laminated body 12 can also be produced in substantially the same manner.

於第1積層體11中之第1玻璃基板111及第2積層體12中之第2玻璃基板121各自之形成區域,根據液晶顯示方式,且視需要形成絕緣膜、透明電極膜、薄膜電晶體(TFT)或薄膜二極體(TFD)等開關元件、彩色濾光片(CF)等(圖案化步驟)。又,以可排列液晶分子之方式印刷聚醯亞胺膜等配向膜,並形成用以配向之溝槽(摩擦步驟)。 In the respective formation regions of the first glass substrate 111 in the first multilayer body 11 and the second glass substrate 121 in the second multilayer body 12, an insulating film, a transparent electrode film, and a thin-film transistor are formed according to the liquid crystal display method as necessary. (TFT) or thin film diode (TFD), switching elements, color filters (CF), etc. (patterning step). In addition, an alignment film such as a polyfluorene film is printed so that liquid crystal molecules can be aligned, and grooves for alignment are formed (friction step).

(液晶顯示面板用構件) (Member for liquid crystal display panel)

自密封構造體10剝離第1支撐構造體112及第2支撐構造體122而製造液晶顯示面板用構件20。 The first support structure 112 and the second support structure 122 are peeled from the sealing structure 10 to manufacture a member 20 for a liquid crystal display panel.

第1支撐構造體112自密封構造體10之剝離可藉由如下方法等進行:例如,於液晶顯示面板用構件20及第1支撐構造體112之一端部、尤其是角部之界面插入銳利之刃具狀者,賦予剝離之契機後,對該插入部分吹送水與壓縮空氣之混合流體。剝離較佳為例如圖3所示般自液晶顯示面板用構件20與第1支撐構造體112之一端部、尤其是角部朝向對向之角部緩慢地進行。 The peeling of the first supporting structure 112 from the sealing structure 10 can be performed by, for example, inserting a sharp one into the interface between the liquid crystal display panel member 20 and one of the ends of the first supporting structure 112, especially the corner. The blade-shaped person gives a chance of peeling, and then blows a mixed fluid of water and compressed air to the insertion portion. The peeling is preferably performed slowly from one end portion of the member 20 for the liquid crystal display panel and the first support structure 112, especially the corner portion toward the corner portion facing the opposite portion, as shown in FIG. 3.

較佳為,以利用複數個真空吸附墊真空吸附密封構造體10之兩面,於該狀態下向液晶顯示面板用構件20與第1支撐構造體112之一端部、尤其是角部之界面插入銳利之刃具狀者,自該插入部分緩慢地剝離第1支撐構造體112之方式,以提昇吸附有第1支撐構造體112之真空吸附墊之方式使其移動而進行。 Preferably, the two surfaces of the structural body 10 are vacuum-sealed by a plurality of vacuum suction pads, and in this state, sharp edges are inserted into an interface between one end portion of the liquid crystal display panel member 20 and the first support structure 112, particularly a corner portion. In the case of a blade, the first support structure 112 is slowly peeled off from the insertion portion, and the vacuum suction pad on which the first support structure 112 is adsorbed is lifted and moved.

關於第2支撐構造體122自密封構造體10(液晶顯示面板用構件20)之剝離,亦可以基本上相同之方式進行。 The peeling of the second supporting structure 122 from the sealing structure 10 (the member 20 for a liquid crystal display panel) can also be performed in substantially the same manner.

於採用液晶滴加貼合方式之情形時,在所製造之液晶顯示面板用構件20各自之成為液晶顯示面板之密封部13填充有液晶。因此,於例如形成有複數個密封部13之情形時,可藉由切分成各個密封部13而製造液晶顯示面板。 When the liquid crystal dropping and bonding method is adopted, each of the manufactured liquid crystal display panel members 20 is a sealing portion 13 that becomes a liquid crystal display panel and is filled with liquid crystal. Therefore, in the case where a plurality of sealing portions 13 are formed, for example, the liquid crystal display panel can be manufactured by cutting into each sealing portion 13.

又,於液晶注入方式之情形時,通常於所製造之液晶顯示面板用構件20各自之成為液晶顯示面板之密封部13未填充液晶。因此,對密封部13注入液晶而製成液晶顯示面板。具體而言,例如,以液晶顯示面板用構件20之狀態注入液晶,其後,切分成各個密封部13而製成液晶顯示面板。又,例如,亦可於將液晶顯示面板用構件20切分成各個密封部13後,對各個密封部13注入液晶而製成液晶顯示面板,或亦可於將液晶顯示面板用構件20切分成包含若干個密封部13之特定大小後,對各個密封部13注入液晶,進而切分成各個密封部13而製成液晶顯示面板。 In the case of the liquid crystal injection method, the liquid crystal display panel is generally not filled with the sealing portion 13 of each of the manufactured liquid crystal display panel members 20 as a liquid crystal display panel. Therefore, liquid crystal is injected into the sealing portion 13 to form a liquid crystal display panel. Specifically, for example, liquid crystal is injected in the state of the member 20 for a liquid crystal display panel, and thereafter, the liquid crystal display panel is produced by being cut into individual sealing portions 13. Alternatively, for example, the liquid crystal display panel member 20 may be cut into individual sealing portions 13 and then liquid crystal may be injected into each of the sealing portions 13 to form a liquid crystal display panel. Alternatively, the liquid crystal display panel member 20 may be divided into After a certain size of the plurality of sealing portions 13, liquid crystal is injected into each of the sealing portions 13, and then the liquid crystal display panel is manufactured by being divided into each of the sealing portions 13.

以此方式製造之液晶顯示面板可用作各種電子機器之顯示部。作為電子機器,例如,可列舉:可攜式電話、筆記型電腦等個人電腦、PDA(Personal Digital Assistants,個人數位助理)等可攜式資訊機器、工作站、數位靜態相機、數位視訊攝影機、車輛用監視器、液晶電視、汽車導航裝置、電子記事本、計算器、POS(point-of-sale,銷售點)終端機等。 The liquid crystal display panel manufactured in this way can be used as a display portion of various electronic devices. Examples of the electronic device include personal computers such as portable phones and notebook computers, portable information devices such as PDAs (Personal Digital Assistants), workstations, digital still cameras, digital video cameras, and vehicles Monitors, LCD TVs, car navigation devices, electronic notebooks, calculators, point-of-sale (POS) terminals, etc.

再者,液晶顯示面板可製成透過型、反射型、或半透過型、及單色或彩色之各種液晶顯示面板。又,可製成被動矩陣型、主動矩陣型之各種液晶顯示面板。 In addition, the liquid crystal display panel can be made of a transmissive type, a reflective type, or a semi-transmissive type, and various monochrome or color liquid crystal display panels. In addition, it can be made into various liquid crystal display panels of passive matrix type and active matrix type.

<第2實施形態> <Second Embodiment>

以下,參照圖式對密封構造體之第2實施形態進行具體說明。 Hereinafter, a second embodiment of the seal structure will be specifically described with reference to the drawings.

圖4、5係表示密封構造體之第2實施形態之一例之俯視圖及A-A線剖面圖。 4 and 5 are a plan view and an A-A cross-sectional view showing an example of the second embodiment of the sealed structure.

密封構造體200係用於製造液晶顯示面板用構件20者,如圖4及5所示般於一部分具有成為液晶顯示面板用構件20之部分。密封構造體200包含第1積層體11、第2積層體12、密封部13及接著部14。 The sealing structure 200 is used for manufacturing the member 20 for a liquid crystal display panel, and as shown in FIGS. 4 and 5, it has a part which becomes the member 20 for a liquid crystal display panel. The sealing structure 200 includes a first laminated body 11, a second laminated body 12, a sealing portion 13, and an adhesive portion 14.

若為密封構造體200之形態,則可進一步抑制自密封構造體剝離1對支撐構造體時之成為液晶顯示面板用構件之部分之損傷。 In the form of the sealing structure 200, it is possible to further suppress damage to a portion that becomes a member for a liquid crystal display panel when a pair of supporting structures is peeled from the sealing structure.

具體而言,於自密封構造體之各個玻璃基板剝離支撐構造體時,於密封部附近不同於該密封部而設置有接著部,藉此可減少局部地施加至密封部之應力,從而可抑制密封部之剝離、即玻璃基板與密封部之剝離。又,藉由在密封部附近不同於該密封部地設置接著部,亦可減少局部地施加至玻璃基板之應力,從而亦可抑制玻璃基板之破損。 Specifically, when the support structure is peeled off from each of the glass substrates of the sealing structure, a bonding portion is provided in the vicinity of the sealing portion, which is different from the sealing portion, so that the stress locally applied to the sealing portion can be reduced, and the suppression can be suppressed. The peeling of the sealing portion, that is, the peeling of the glass substrate and the sealing portion. Moreover, by providing a bonding portion different from the sealing portion in the vicinity of the sealing portion, it is also possible to reduce stress locally applied to the glass substrate, and also to suppress damage to the glass substrate.

圖4及5所示之密封構造體200除具備接著部14之方面以外,具有與圖1所示之密封構造體10相同之構成,故而對相同之構成要素標註相同之參照符號而省略其說明,主要對接著部14進行說明。 The seal structure 200 shown in FIGS. 4 and 5 has the same structure as the seal structure 10 shown in FIG. 1 except that the seal structure 200 includes the bonding portion 14. Therefore, the same reference numerals are given to the same constituent elements and the description thereof is omitted. The following description mainly discusses the bonding section 14.

接著部14係設為如下形狀及配置:於密封部13之外側接著第1積層體11與第2積層體12,於自密封構造體10剝離第1支撐構造體112或第2支撐構造體122時,可抑制成為液晶顯示面板用構件20之部分之損傷、具體而言為密封部13之剝離以及第1玻璃基板111及第2玻璃基板121之損傷。即,只要為可抑制剝離時之成為液晶顯示面板用構件20 之部分之損傷者,則接著部14之形狀或配置等並無特別限制。 The bonding portion 14 has a shape and arrangement in which the first laminated body 11 and the second laminated body 12 are adhered to the outside of the sealing portion 13, and the first supporting structure 112 or the second supporting structure 122 is peeled from the self-sealing structure 10. In this case, damage to the portion that becomes the member 20 for the liquid crystal display panel, specifically, peeling of the sealing portion 13 and damage to the first glass substrate 111 and the second glass substrate 121 can be suppressed. That is, as long as it can suppress the peeling, it will become the member 20 for liquid crystal display panels. If the part is damaged, the shape or arrangement of the bonding portion 14 is not particularly limited.

接著部14只要能接著第1玻璃基板111與第2玻璃基板121則無特別限制,使環氧系樹脂等接著材料硬化而形成。 The bonding portion 14 is not particularly limited as long as it can bond the first glass substrate 111 and the second glass substrate 121, and is formed by curing a bonding material such as an epoxy resin.

接著部14係例如圖4所示般沿著密封部13呈直線狀設置。例如,於密封構造體200為長方形狀之情形時,於密封構造體200之長邊與鄰接於該長邊之密封部13之間以沿密封構造體200之長邊方向延伸之方式設置,並且於密封構造體200之短邊方向上之密封部13彼此之間以沿密封構造體200之長邊方向延伸之方式設置。 The adhering portion 14 is provided linearly along the sealing portion 13 as shown in FIG. 4. For example, when the sealing structure 200 is rectangular, it is provided between the long side of the sealing structure 200 and the sealing portion 13 adjacent to the long side so as to extend in the longitudinal direction of the sealing structure 200, and The seal portions 13 in the short-side direction of the seal structure 200 are provided so as to extend in the long-side direction of the seal structure 200.

於設置直線狀之接著部14之情形時,較佳為於密封構造體200之長邊方向上,於與設置有密封部13之區域相同之區域以相同之長度進行設置,或者設置於較其長之區域。具體而言,如圖4所示,於在密封構造體200之長邊方向上設置有3個密封部13之情形時,較佳為於與設置有該等3個密封部13之區域相同之區域以相同之長度、或較其長地進行設置。藉由設置成此種區域及長度,例如,如圖6所示般自1個角部剝離第2支撐構造體122時,剝離邊界線L位於密封部13上,同時亦位於接著部14上,可抑制僅對密封部13之一部分局部地施加應力,從而可抑制密封部13之剝離以及第1玻璃基板111及第2玻璃基板121之破損。 When the linear bonding portion 14 is provided, it is preferable to provide the same length in the long side direction of the sealing structure 200 in the same area as the area in which the sealing portion 13 is provided, or in a longer area. Long area. Specifically, as shown in FIG. 4, in a case where three seal portions 13 are provided in the longitudinal direction of the seal structure 200, it is preferable to be the same as the area where the three seal portions 13 are provided. The zones are set with the same length or longer. By setting such a region and length, for example, when the second support structure 122 is peeled from one corner as shown in FIG. 6, the peeling boundary line L is located on the sealing portion 13 and also on the bonding portion 14. It is possible to suppress local stress from being applied to only a part of the sealing portion 13, and to suppress peeling of the sealing portion 13 and damage to the first glass substrate 111 and the second glass substrate 121.

又,於設置密封部13或接著部14之情形時,較佳為將位於最外周部之密封部13或接著部14之任一者與積層體端邊相隔之距離設置於10 mm之範圍內。藉由縮短與積層體端邊相隔之距離,可有效地抑制密封部13之剝離以及第1玻璃基板111及第2玻璃基板121之破損。位於最外周部之密封部13或接著部14與積層體端邊相隔之距離更佳為5 mm之範圍內,進而較佳為3 mm之範圍內。 When the sealing portion 13 or the bonding portion 14 is provided, it is preferable to set a distance between any one of the sealing portion 13 or the bonding portion 14 located at the outermost peripheral portion and the end of the laminated body within a range of 10 mm. . By shortening the distance from the edge of the laminated body, peeling of the sealing portion 13 and damage of the first glass substrate 111 and the second glass substrate 121 can be effectively suppressed. The distance between the sealing portion 13 or the bonding portion 14 located at the outermost peripheral portion and the end of the laminated body is preferably within a range of 5 mm, and further preferably within a range of 3 mm.

又,於設置直線狀之接著部14之情形時,設置於密封構造體200之長邊與鄰接於該長邊之密封部13之間之接著部14較佳為與密封部13 相隔之距離係設置於10 mm之範圍內。藉由縮短密封部13至接著部14之距離,可有效地抑制密封部13之剝離以及第1玻璃基板111及第2玻璃基板121之破損。與密封部13相隔之距離更佳為5 mm之範圍內,進而較佳為3 mm之範圍內。再者,與密封部13相隔之距離並不需要固定,亦可於直線狀之接著部14之長度方向上不同,但較佳為整體上成為上述範圍內。又,密封部13至接著部14之距離越近越好,接著部14亦可設置成與密封部13接觸。此處,密封部13至接著部14之距離係設為密封部13之側面部與接著部14之側面部之間之距離。 When a linear bonding portion 14 is provided, the bonding portion 14 provided between the long side of the sealing structure 200 and the sealing portion 13 adjacent to the long side is preferably the sealing portion 13. The separation distance is set within a range of 10 mm. By shortening the distance between the sealing portion 13 and the bonding portion 14, peeling of the sealing portion 13 and breakage of the first glass substrate 111 and the second glass substrate 121 can be effectively suppressed. The distance from the sealing portion 13 is more preferably within a range of 5 mm, and even more preferably within a range of 3 mm. In addition, the distance from the sealing portion 13 does not need to be fixed, and may be different in the length direction of the linear bonding portion 14, but it is preferably within the above range as a whole. The closer the distance from the sealing portion 13 to the bonding portion 14 is, the better, and the bonding portion 14 may be provided in contact with the sealing portion 13. Here, the distance between the sealing portion 13 and the bonding portion 14 is the distance between the side surface portion of the sealing portion 13 and the side surface portion of the bonding portion 14.

於設置直線狀之接著部14之情形時,較佳為至少設置於密封構造體200之長邊與鄰接於該長邊之密封部13之間,但較佳為亦設置於密封構造體200之短邊方向上之密封部13彼此之間。再者,於在密封構造體200之短邊方向上設置有3個以上之密封部13之情形時,較佳為設置於所有密封部13彼此之間。關於設置於密封構造體200之短邊方向上之密封部13彼此之間之接著部14,就使對位於接著部14之兩側之密封部13之應力均等之觀點而言,較佳為設置於密封部13彼此之中央部分。 In the case where the linear bonding portion 14 is provided, it is preferably provided at least between the long side of the sealing structure 200 and the sealing portion 13 adjacent to the long side, but it is also preferably provided in the sealing structure 200. The seal portions 13 in the short-side direction are between each other. When three or more seal portions 13 are provided in the short-side direction of the seal structure 200, it is preferable to provide the seal portions 13 between all the seal portions 13. As for the bonding portion 14 provided between the sealing portions 13 in the short-side direction of the sealing structure 200, it is preferable to provide the bonding portion 14 with equal stress to the sealing portions 13 on both sides of the bonding portion 14. In the central portion of each of the sealing portions 13.

直線狀之接著部14之寬度較佳為0.08 mm以上。藉由將寬度設為0.08 mm以上,可藉由接著部14有效地接著第1玻璃基板111與第2玻璃基板121,且可有效地抑制密封部之剝離以及玻璃基板之破損。寬度更佳為0.1 mm以上,進而較佳為0.5 mm以上。寬度通常只要為0.1 mm左右即可充分地接著第1玻璃基板111與第2玻璃基板121,就生產性等觀點而言,較佳為5 mm以下,更佳為3 mm以下。 The width of the linear bonding portion 14 is preferably 0.08 mm or more. By setting the width to be 0.08 mm or more, the first glass substrate 111 and the second glass substrate 121 can be effectively bonded by the bonding portion 14, and peeling of the sealing portion and breakage of the glass substrate can be effectively suppressed. The width is more preferably 0.1 mm or more, and still more preferably 0.5 mm or more. The width is usually about 0.1 mm, and the first glass substrate 111 and the second glass substrate 121 can be sufficiently adhered. From the viewpoint of productivity, it is preferably 5 mm or less, and more preferably 3 mm or less.

密封構造體200滿足以下之式(1)及(2)。 The sealing structure 200 satisfies the following expressions (1) and (2).

式(1) {(X1×Y1)+(Z1×W1)}/(A1×B1)>1 Formula (1) {(X1 × Y1) + (Z1 × W1)} / (A1 × B1)> 1

式(2) {(X2×Y2)+(Z2×W2)}/(A2×B2)>1 Equation (2) {(X2 × Y2) + (Z2 × W2)} / (A2 × B2)> 1

式(1)中,X1、Y1、A1及B1之定義如上所述。 In the formula (1), the definitions of X1, Y1, A1, and B1 are as described above.

式(1)中,Z1表示接著部14與第1玻璃基板111之間之剝離強度(N/mm)。剝離強度之測定方法並無特別限制,可使用SAICAS等公知之測定裝置進行測定。作為Z1,只要滿足上述關係則其值並無特別限制,就可進一步抑制支撐構造體之剝離時之密封部之剝離或玻璃基板之損傷之方面而言,較佳為0.10 N/mm以上,更佳為0.15 N/mm以上。上限並無特別限制。 In the formula (1), Z1 represents a peel strength (N / mm) between the bonding portion 14 and the first glass substrate 111. The method for measuring the peel strength is not particularly limited, and it can be measured using a known measuring device such as SAICAS. As Z1, as long as the above relationship is satisfied, the value is not particularly limited, and from the viewpoint of further suppressing the peeling of the sealing portion or the damage of the glass substrate during the peeling of the support structure, it is preferably 0.10 N / mm or more, more It is preferably at least 0.15 N / mm. The upper limit is not particularly limited.

W1表示接著部14與第1玻璃基板111之總接觸面積(mm2)。於圖4及5所示之接著部14之情形時,意指3個直線狀之接著部14與第1玻璃基板11接觸之面積之總和。換言之,相當於圖4中之接著部14所占之總面積。 W1 represents the total contact area (mm 2 ) of the bonding portion 14 and the first glass substrate 111. In the case of the bonding portion 14 shown in FIGS. 4 and 5, it means the sum of the areas where the three linear bonding portions 14 contact the first glass substrate 11. In other words, it corresponds to the total area occupied by the bonding portion 14 in FIG. 4.

藉由使密封構造體200滿足式(1)之關係,可於自密封構造體200剝離第1支撐構造體112時,抑制密封部13之剝離或第1玻璃基板111之損傷。 When the sealing structure 200 satisfies the relationship of the formula (1), when the first support structure 112 is peeled from the sealing structure 200, peeling of the sealing portion 13 or damage to the first glass substrate 111 can be suppressed.

若僅控制密封部13與第1玻璃基板111之間之剝離強度、接著部14與第1玻璃基板111之間之剝離強度、及第1玻璃基板111與第1支撐構造體112之間之剝離強度的差,則於剝離第1支撐構造體112時,無法充分地抑制密封部13之剝離或第1玻璃基板111之損傷。推測其原因在於:剝離第1支撐構造體112時之應力不僅波及至局部的部分,而且波及至整個面。本發明者等人想到密封部13與第1玻璃基板111之總接觸面積、接著部14與第1玻璃基板121之總接觸面積、及第1玻璃基板111與第1支撐構造體112之總接觸面積會對表現所期望之效果發揮重要作用,從而發現滿足式(1)之關係較為重要。亦即,於式(1)中,將密封部13與第1玻璃基板111之間之剝離強度X1乘以接觸面積Y1所得之值及接著部14與第1玻璃基板121之間之剝離強度Z1乘以接觸面積W1所得之值的總和與第1玻璃基板111與第1支撐構造體112之間之剝離強度A1乘以接觸面積B1所得之值進行比較,若其值超過特定值,則意為 可抑制密封部之剝離或玻璃基板之損傷。 If only the peel strength between the sealing portion 13 and the first glass substrate 111, the peel strength between the bonding portion 14 and the first glass substrate 111, and the peel between the first glass substrate 111 and the first support structure 112 are controlled. When the strength is poor, when the first support structure 112 is peeled off, peeling of the sealing portion 13 or damage to the first glass substrate 111 cannot be sufficiently suppressed. The reason for this is presumably that the stress when peeling off the first support structure 112 not only spread to a local part but also spread to the entire surface. The inventors thought of the total contact area of the sealing portion 13 and the first glass substrate 111, the total contact area of the bonding portion 14 and the first glass substrate 121, and the total contact of the first glass substrate 111 and the first support structure 112. The area plays an important role in the performance of the desired effect, so it is found that the relationship satisfying the formula (1) is more important. That is, in Equation (1), the value obtained by multiplying the peeling strength X1 between the sealing portion 13 and the first glass substrate 111 by the contact area Y1 and the peeling strength Z1 between the bonding portion 14 and the first glass substrate 121 The total value multiplied by the contact area W1 is compared with the value obtained by multiplying the peel strength A1 between the first glass substrate 111 and the first support structure 112 by the contact area B1. If the value exceeds a specific value, it means that It is possible to suppress peeling of the sealing portion or damage to the glass substrate.

再者,於式(1)中,雖然{(X1×Y1)+(Z1×W1)}/(A1×B1)超過1,但就可進一步抑制密封部之剝離或玻璃基板之損傷之方面而言,較佳為1.1以上,更佳為1.4以上。再者,上限並無特別限制,但10以下之情形較多。 Furthermore, in the formula (1), although {(X1 × Y1) + (Z1 × W1)} / (A1 × B1) exceeds 1, it is possible to further suppress the peeling of the sealing portion or the damage of the glass substrate. In other words, it is preferably 1.1 or more, and more preferably 1.4 or more. The upper limit is not particularly limited, but there are many cases where the upper limit is 10 or less.

又,藉由使密封構造體200滿足式(2)之關係,可於自密封構造體200剝離第2支撐構造體122時,抑制密封部13之剝離或第2玻璃基板121之損傷。 Further, by satisfying the relationship of the formula (2) with the sealing structure 200, when the second support structure 122 is peeled from the sealing structure 200, peeling of the sealing portion 13 or damage to the second glass substrate 121 can be suppressed.

式(2)中,X2、Y2、A2及B2之定義如上所述。 In the formula (2), the definitions of X2, Y2, A2, and B2 are as described above.

式(2)中,Z2表示接著部14與第2玻璃基板121之間之剝離強度(N/mm)。剝離強度之測定方法並無特別限制,可使用SAICAS等公知之測定裝置進行測定。Z2之較佳態樣與Z1之較佳態樣同義。 In the formula (2), Z2 represents the peeling strength (N / mm) between the bonding portion 14 and the second glass substrate 121. The method for measuring the peel strength is not particularly limited, and it can be measured using a known measuring device such as SAICAS. The preferred aspect of Z2 is synonymous with the preferred aspect of Z1.

W2表示接著部14與第1玻璃基板121之總接觸面積(mm2)。於圖4及5所示之接著部14之情形時,意指3個直線狀之接著部14與第2玻璃基板121接觸之面積之總和。 W2 represents the total contact area (mm 2 ) of the bonding portion 14 and the first glass substrate 121. In the case of the bonding portion 14 shown in FIGS. 4 and 5, it means the sum of the areas where the three linear bonding portions 14 contact the second glass substrate 121.

進而,於式(2)中,雖然{(X2×Y2)+(Z2×W2)}/(A2×B2)超過1,但就可進一步抑制密封部之剝離或玻璃基板之損傷之方面而言,較佳為1.1以上,更佳為1.4以上。再者,上限並無特別限制,但10以下之情形較多。 Furthermore, in the formula (2), although {(X2 × Y2) + (Z2 × W2)} / (A2 × B2) exceeds 1, in terms of further suppressing the peeling of the sealing portion or the damage of the glass substrate Is preferably 1.1 or more, and more preferably 1.4 or more. The upper limit is not particularly limited, but there are many cases where the upper limit is 10 or less.

又,於密封構造體200中,就可進一步抑制密封部之剝離或玻璃基板之損傷之方面而言,X1/A1或X2/A2較佳為5~100,更佳為10~100。 In addition, in the sealing structure 200, X1 / A1 or X2 / A2 is preferably 5 to 100, and more preferably 10 to 100 in terms of further suppressing the peeling of the sealing portion or damage to the glass substrate.

又,於密封構造體200中,就可進一步抑制密封部之剝離或玻璃基板之損傷之方面而言,Z1/A1或Z2/A2較佳為5~100,更佳為10~100。 In addition, in the sealing structure 200, Z1 / A1 or Z2 / A2 is preferably 5 to 100, and more preferably 10 to 100, in terms of further suppressing peeling of the sealing portion or damage to the glass substrate.

又,於密封構造體200中,就可進一步抑制密封部之剝離或玻璃 基板之損傷之方面而言,Y1/B1或Y2/B2較佳為5~100,更佳為10~100。 Further, in the sealing structure 200, peeling of the sealing portion and glass can be further suppressed. In terms of damage to the substrate, Y1 / B1 or Y2 / B2 is preferably 5 to 100, and more preferably 10 to 100.

進而,於密封構造體200中,就可進一步抑制密封部之剝離或玻璃基板之損傷之方面而言,W1/B1或W2/B2較佳為5~100,更佳為10~100。 Furthermore, in the sealing structure 200, W1 / B1 or W2 / B2 is preferably 5 to 100, and more preferably 10 to 100 in terms of further suppressing the peeling of the sealing portion or damage to the glass substrate.

(密封構造體之製造方法) (Manufacturing method of sealed structure)

密封構造體200之製造方法並無特別限制,可利用公知之方法進行製造。例如,於製造第1積層體11及第2積層體12後,以包圍第1積層體11中之第1玻璃基板111或第2積層體12中之第2玻璃基板121之形成區域之方式塗佈成為密封部13之密封材料,並且將成為接著部14之接著材料塗佈成其外側之特定形狀。其後,於採用液晶滴加貼合方式之情形時,於在形成區域滴加液晶後,介隔密封材料、及液晶而積層第1積層體11與第2積層體12。又,於採用液晶注入方式之情形時,介隔密封材料及接著材料積層第1積層體11與第2積層體12。 The manufacturing method of the sealing structure 200 is not particularly limited, and it can be manufactured by a known method. For example, after the first laminated body 11 and the second laminated body 12 are manufactured, they are applied so as to surround the formation area of the first glass substrate 111 in the first laminated body 11 or the second glass substrate 121 in the second laminated body 12. The cloth serves as a sealing material for the sealing portion 13, and the adhesive material serving as the bonding portion 14 is coated in a specific shape on the outside thereof. Then, when a liquid crystal dropping and bonding method is adopted, after the liquid crystal is dropped in the formation region, the first laminated body 11 and the second laminated body 12 are laminated with the sealing material and the liquid crystal interposed therebetween. When a liquid crystal injection method is used, the first laminated body 11 and the second laminated body 12 are laminated with a sealing material and an adhesive material interposed therebetween.

再者,密封材料及接著材料之塗佈方法並無特別限制,既可使用分注器或噴墨裝置進行描繪,亦可藉由網版印刷進行印刷。再者,作為密封材料及接著材料,並不限於環氧系樹脂,亦可為例如紫外線硬化型環氧改性丙烯酸系樹脂等。 Furthermore, the coating method of the sealing material and the adhesive material is not particularly limited, and it can be drawn using a dispenser or an inkjet device, or printed by screen printing. In addition, the sealing material and the bonding material are not limited to epoxy resins, and may be, for example, UV-curable epoxy-modified acrylic resins.

密封部13及接著部14既可以相同之材料形成,亦可以不同之材料形成。 The sealing portion 13 and the bonding portion 14 may be formed of the same material or may be formed of different materials.

於第1積層體11及第2積層體12之積層後進行密封材料及接著材料之硬化。密封材料及接著材料之硬化可根據密封材料及接著材料之硬化方式而採用最佳之硬化方法,例如,於使用環氧系樹脂等作為密封材料及接著材料之情形時藉由加熱進行硬化,於使用紫外線硬化型環氧改性丙烯酸系樹脂等作為密封材料及接著材料之情形時藉由照射紫外線進行硬化。於密封材料與接著材料中硬化方式不同之情形時,亦 可分為2次以上之步驟進行硬化。 After the first laminated body 11 and the second laminated body 12 are laminated, the sealing material and the adhesive material are hardened. The hardening of the sealing material and the bonding material can be performed according to the hardening method of the sealing material and the bonding material. For example, when an epoxy resin or the like is used as the sealing material and the bonding material, the hardening is performed by heating. When a UV-curable epoxy-modified acrylic resin or the like is used as a sealing material and an adhesive material, curing is performed by irradiating ultraviolet rays. When the hardening method in the sealing material and the bonding material is different, It can be hardened in two or more steps.

接著部14之形成較佳為與密封部13之形成同時進行。具體而言,較佳為與成為密封部13之密封材料之塗佈同時地進行成為接著部14之接著材料之塗佈,介隔密封材料及接著材料之塗佈物積層第1積層體11與第2積層體12,並進行加熱等使兩者硬化。尤佳為將用於形成密封部13之密封材料、與用於形成接著部14之接著材料設為包含相同材料者,並使用同一裝置以同一步驟進行密封材料及接著材料之塗佈。藉由利用此種方法,可有效率地形成接著部14。 The formation of the bonding portion 14 is preferably performed simultaneously with the formation of the sealing portion 13. Specifically, it is preferable that the application of the adhesive material to be the bonding portion 14 is performed simultaneously with the application of the sealing material to be the sealing portion 13, and the first laminated body 11 and the coating material of the sealing material and the adhesive are laminated. The second laminated body 12 is hardened by heating or the like. It is particularly preferable that the sealing material for forming the sealing portion 13 and the adhesive material for forming the bonding portion 14 include the same material, and the sealing material and the bonding material are applied in the same step using the same device. By using this method, the bonding portion 14 can be efficiently formed.

再者,密封材料與接著材料可不必將兩者塗佈於第1積層體11中之第1玻璃基板111或第2積層體12中之第2玻璃基板121之一者而形成,亦可相互獨立地塗佈而形成。例如,亦可於第1積層體11中之第1玻璃基板111塗佈密封材料,於第2積層體12中之第2玻璃基板121塗佈接著材料,亦可設為相反之狀態。 Furthermore, the sealing material and the bonding material may be formed without coating both of the first glass substrate 111 in the first laminated body 11 or the second glass substrate 121 in the second laminated body 12, or they may be formed on each other. Formed independently. For example, the first glass substrate 111 in the first multilayer body 11 may be coated with a sealing material, and the second glass substrate 121 in the second multilayer body 12 may be coated with an adhesive material, or may be set to the opposite state.

自密封構造體200剝離第1支撐構造體112及第2支撐構造體122而製造液晶顯示面板用構件20。剝離之方法可以與第1實施形態相同之程序進行。 The first support structure 112 and the second support structure 122 are peeled from the sealing structure 200 to manufacture a member 20 for a liquid crystal display panel. The method of peeling can be performed in the same procedure as in the first embodiment.

更具體而言,例如,如圖6所示般自一端側剝離第1支撐構造體112。具體而言,自密封構造體200之1個角部朝向對向之角部之方向緩慢地進行剝離。此時,藉由在密封部13之附近設置接著部14,已剝離之部分與即將被剝離之部分之邊界線且易於施加應力之剝離邊界線L位於密封部13上,同時亦位於附近之接著部14上。藉此,可抑制應力僅局部地施加至密封部13之一部分,從而可抑制密封部13之剝離,具體而言,可抑制第1玻璃基板111與密封部13之剝離、第2玻璃基板121與密封部13之剝離。同樣地,亦可抑制應力局部地施加至第1玻璃基板111及第2玻璃基板121,從而亦可抑制第1玻璃基板111及第2玻璃基板121之破損。再者,對於剝離第2支撐構造體122之情形,亦可基 本上以相同之方式進行,又,可獲得相同之效果。 More specifically, for example, as shown in FIG. 6, the 1st support structure 112 is peeled from one end side. Specifically, one corner portion of the self-sealing structure 200 is gradually peeled toward the opposite corner portion. At this time, by providing the bonding portion 14 near the sealing portion 13, a boundary line between the peeled portion and the portion to be peeled off and a stress-prone peeling boundary line L is located on the sealing portion 13, and is also located near the bonding portion.部 14 上。 On the part 14. Thereby, it is possible to suppress the stress from only being applied locally to a part of the sealing portion 13, so that peeling of the sealing portion 13 can be suppressed, and specifically, peeling of the first glass substrate 111 and the sealing portion 13, and second glass substrate 121 and The sealing portion 13 is peeled. Similarly, it is possible to suppress the stress from being locally applied to the first glass substrate 111 and the second glass substrate 121, and also to suppress the damage of the first glass substrate 111 and the second glass substrate 121. In addition, when the second support structure 122 is peeled off, This is done in the same way, and the same effect can be obtained.

再者,通常,接著部14係設為不需要之部分,自密封部13切除並丟棄。 In addition, normally, the adhesive part 14 is an unnecessary part, and is cut out from the sealing part 13 and discarded.

圖7係表示密封構造體10之變化例之俯視圖,尤其係表示接著部14之變化例之俯視圖。 FIG. 7 is a plan view showing a modified example of the seal structure 10, and particularly a plan view showing a modified example of the bonding portion 14. FIG.

關於該密封構造體300,接著部14以外之構成、即第1積層體11、第2積層體12、及密封部13之構成與圖4、5所示之密封構造體200相同。關於該密封構造體300,不同之處在於:接著部14係以包圍複數個密封部13之整體之方式沿著第1積層體11及第2積層體12之周緣部進行設置。 Regarding the sealing structure 300, the structures other than the bonding portion 14, that is, the structures of the first laminated body 11, the second laminated body 12, and the sealing portion 13 are the same as those of the sealing structure 200 shown in Figs. This sealing structure 300 is different in that the adhesive portion 14 is provided along the peripheral edge portions of the first laminated body 11 and the second laminated body 12 so as to surround the entirety of the plurality of sealed portions 13.

藉由以包圍複數個密封部13之整體之方式設置框狀之接著部14,如圖6所示之剝離邊界線L亦會位於密封部13上之同時亦位於接著部14上,可抑制應力僅局部地施加至密封部13之一部分,從而可抑制密封部13之剝離,具體而言,可抑制第1玻璃基板111與密封部13之剝離、第2玻璃基板121與密封部13之剝離。同樣地,亦可抑制應力局部地施加至第1玻璃基板111及第2玻璃基板121,從而亦可抑制第1玻璃基板111及第2玻璃基板121之破損。 By providing the frame-shaped bonding portion 14 so as to surround the entirety of the plurality of sealing portions 13, the peeling boundary line L shown in FIG. 6 will also be located on the sealing portion 13 and also on the bonding portion 14, which can suppress stress. By only partially applying to a portion of the sealing portion 13, peeling of the sealing portion 13 can be suppressed, and specifically, peeling of the first glass substrate 111 and the sealing portion 13 and peeling of the second glass substrate 121 and the sealing portion 13 can be suppressed. Similarly, it is possible to suppress the stress from being locally applied to the first glass substrate 111 and the second glass substrate 121, and also to suppress the damage of the first glass substrate 111 and the second glass substrate 121.

於設置框狀之接著部14之情形時,設置於密封構造體10之長邊與鄰接於該長邊之密封部13之間之接著部14較佳為與密封部13相隔之距離係設置於10 mm之範圍內。藉由縮短密封部13至接著部14之距離,可有效地抑制密封部13之剝離以及第1玻璃基板111及第2玻璃基板121之破損。與密封部13相隔之距離更佳為5 mm之範圍內,進而較佳為3 mm之範圍內。再者,與密封部13相隔之距離未必需要固定,亦可於接著部14之長度方向上不同,但較佳為整體上成為上述範圍內。 When a frame-shaped bonding portion 14 is provided, the bonding portion 14 provided between the long side of the sealing structure 10 and the sealing portion 13 adjacent to the long side is preferably provided at a distance from the sealing portion 13. Within 10 mm. By shortening the distance between the sealing portion 13 and the bonding portion 14, peeling of the sealing portion 13 and breakage of the first glass substrate 111 and the second glass substrate 121 can be effectively suppressed. The distance from the sealing portion 13 is more preferably within a range of 5 mm, and even more preferably within a range of 3 mm. Moreover, the distance from the sealing portion 13 does not necessarily need to be fixed, and may be different in the length direction of the bonding portion 14, but it is preferably within the above range as a whole.

又,於設置框狀之接著部14之情形時,較佳為將位於最外周部 之接著部14與積層體端邊相隔之距離設置於10 mm之範圍內。藉由縮短與積層體端邊相隔之距離,可有效地抑制密封部13之剝離以及第1玻璃基板111及第2玻璃基板121之破損。框狀之接著部14與積層體端邊相隔之距離更佳為5 mm之範圍內,進而較佳為3 mm之範圍內。 In the case where the frame-shaped bonding portion 14 is provided, it is preferably located at the outermost peripheral portion. The distance between the bonding portion 14 and the end of the laminated body is set within a range of 10 mm. By shortening the distance from the edge of the laminated body, peeling of the sealing portion 13 and damage of the first glass substrate 111 and the second glass substrate 121 can be effectively suppressed. The distance between the frame-shaped bonding portion 14 and the end of the laminated body is preferably within a range of 5 mm, and more preferably within a range of 3 mm.

又,設置於密封構造體10之短邊與鄰接於該短邊之密封部13之間之接著部14較佳為與密封部13相隔之距離係設置於10 mm之範圍內。藉由縮短密封部13至接著部14之距離,可有效地抑制密封部13之剝離以及第1玻璃基板111及第2玻璃基板121之破損。與密封部13相隔之距離更佳為5 mm之範圍內,進而較佳為3 mm之範圍內。再者,與密封部13相隔之距離未必需要固定,亦可於接著部14之長度方向上不同,但較佳為整體上成為上述範圍內。 The distance between the bonding portion 14 provided between the short side of the sealing structure 10 and the sealing portion 13 adjacent to the short side is preferably set within a range of 10 mm. By shortening the distance between the sealing portion 13 and the bonding portion 14, peeling of the sealing portion 13 and breakage of the first glass substrate 111 and the second glass substrate 121 can be effectively suppressed. The distance from the sealing portion 13 is more preferably within a range of 5 mm, and even more preferably within a range of 3 mm. Moreover, the distance from the sealing portion 13 does not necessarily need to be fixed, and may be different in the length direction of the bonding portion 14, but it is preferably within the above range as a whole.

框狀之接著部14之寬度較佳為0.08 mm以上。藉由將寬度設為0.08 mm以上,可藉由接著部14有效地接著第1玻璃基板111與第2玻璃基板121,且可有效地抑制密封部13之剝離以及第1玻璃基板111及第2玻璃基板121之破損。寬度更佳為0.1 mm以上,進而較佳為0.5 mm以上。寬度通常只要為0.1 mm左右即可充分地接著第1玻璃基板111與第2玻璃基板121,就生產性等觀點而言,較佳為5 mm以下,更佳為3 mm以下。 The width of the frame-shaped bonding portion 14 is preferably 0.08 mm or more. By setting the width to 0.08 mm or more, the first glass substrate 111 and the second glass substrate 121 can be effectively bonded by the bonding portion 14, and peeling of the sealing portion 13 and the first glass substrate 111 and the second glass can be effectively suppressed. The glass substrate 121 is damaged. The width is more preferably 0.1 mm or more, and still more preferably 0.5 mm or more. The width is usually about 0.1 mm, and the first glass substrate 111 and the second glass substrate 121 can be sufficiently adhered. From the viewpoint of productivity, it is preferably 5 mm or less, and more preferably 3 mm or less.

圖8係表示密封構造體10之另一變化例之俯視圖,尤其係表示接著部14之變化例之俯視圖。 FIG. 8 is a plan view showing another modified example of the seal structure 10, and particularly a plan view showing a modified example of the bonding portion 14.

關於該密封構造體400,接著部14以外之構成、即第1積層體11、第2積層體12、及密封部13之構成亦與圖4、5所示之密封構造體100相同。關於該密封構造體400,不同之處在於接著部14係以包圍複數個密封部13之各者之方式設置。 This seal structure 400 is also the same as the seal structure 100 shown in FIGS. 4 and 5 in the structures other than the bonding portion 14, that is, the structures of the first laminated body 11, the second laminated body 12, and the sealing portion 13. This sealing structure 400 is different in that the bonding portion 14 is provided so as to surround each of the plurality of sealing portions 13.

藉由以包圍複數個密封部13之各者之方式設置框狀之接著部14,如圖3所示之剝離邊界線L亦會位於密封部13上之同時亦位於接著 部14上,可抑制應力僅局部地施加至密封部13之一部分,從而可抑制密封部13之剝離,具體而言,可抑制第1玻璃基板111與密封部13之剝離、第2玻璃基板121與密封部13之剝離。同樣地,亦可抑制應力局部地施加至第1玻璃基板111及第2玻璃基板121,從而亦可抑制第1玻璃基板111及第2玻璃基板121之破損。尤其,藉由以包圍複數個密封部13之各者之方式設置框狀之接著部14,與設置其他形狀之接著部14之情形相比,可有效地抑制密封部13之剝離以及第1玻璃基板111及第2玻璃基板121之破損。 By arranging the frame-shaped bonding portion 14 so as to surround each of the plurality of sealing portions 13, the peeling boundary line L shown in FIG. 3 will also be located on the sealing portion 13 as well as at the same time. In the portion 14, stress can be suppressed only locally applied to a part of the sealing portion 13, so that peeling of the sealing portion 13 can be suppressed. Specifically, peeling of the first glass substrate 111 and the sealing portion 13, and second glass substrate 121 can be suppressed. Delamination from the sealing portion 13. Similarly, it is possible to suppress the stress from being locally applied to the first glass substrate 111 and the second glass substrate 121, and also to suppress the damage of the first glass substrate 111 and the second glass substrate 121. In particular, by providing the frame-shaped bonding portion 14 so as to surround each of the plurality of sealing portions 13, the peeling of the sealing portion 13 and the first glass can be effectively suppressed compared with the case where the bonding portions 14 of other shapes are provided. The substrate 111 and the second glass substrate 121 are damaged.

於設置如上所述之框狀之接著部14之情形時,接著部14較佳為與密封部13相隔之距離係設置於10 mm之範圍內。藉由縮短密封部13至接著部14之距離,可有效地抑制密封部13之剝離以及第1玻璃基板111及第2玻璃基板121之破損。與密封部13相隔之距離更佳為5 mm之範圍內,進而較佳為3 mm之範圍內。再者,與密封部13相隔之距離未必需要固定,亦可於接著部14之長度方向(周向)上不同,但較佳為整體上成為上述範圍內。 When the frame-shaped bonding portion 14 is provided as described above, the distance between the bonding portion 14 and the sealing portion 13 is preferably set within a range of 10 mm. By shortening the distance between the sealing portion 13 and the bonding portion 14, peeling of the sealing portion 13 and breakage of the first glass substrate 111 and the second glass substrate 121 can be effectively suppressed. The distance from the sealing portion 13 is more preferably within a range of 5 mm, and even more preferably within a range of 3 mm. In addition, the distance from the sealing portion 13 does not necessarily need to be fixed, and may be different in the longitudinal direction (circumferential direction) of the bonding portion 14, but it is preferably within the above range as a whole.

又,於設置如上所述之框狀之接著部14之情形時,較佳為將位於最外周部之接著部14與積層體端邊相隔之距離設置於10 mm之範圍內。藉由縮短與積層體端邊相隔之距離,可有效地抑制密封部13之剝離以及第1玻璃基板111及第2玻璃基板121之破損。如上所述之框狀之接著部14與積層體端邊相隔之距離更佳為5 mm之範圍內,進而較佳為3 mm之範圍內。 When the frame-shaped bonding portion 14 is provided as described above, the distance between the bonding portion 14 located at the outermost peripheral portion and the end of the laminated body is preferably set within a range of 10 mm. By shortening the distance from the edge of the laminated body, peeling of the sealing portion 13 and damage of the first glass substrate 111 and the second glass substrate 121 can be effectively suppressed. As described above, the distance between the frame-shaped bonding portion 14 and the end of the laminated body is preferably within a range of 5 mm, and more preferably within a range of 3 mm.

框狀之接著部14之寬度較佳為0.08 mm以上。藉由將寬度設為0.08 mm以上,可藉由接著部14有效地接著第1玻璃基板111與第2玻璃基板121,且可有效地抑制密封部13之剝離以及第1玻璃基板111及第2玻璃基板121之破損。寬度更佳為0.1 mm以上,進而較佳為0.5 mm以上。寬度通常只要為0.1 mm左右即可充分地接著第1玻璃基板111與第 2玻璃基板121,就生產性等觀點而言,較佳為5 mm以下,更佳為3 mm以下。 The width of the frame-shaped bonding portion 14 is preferably 0.08 mm or more. By setting the width to 0.08 mm or more, the first glass substrate 111 and the second glass substrate 121 can be effectively bonded by the bonding portion 14, and peeling of the sealing portion 13 and the first glass substrate 111 and the second glass can be effectively suppressed. The glass substrate 121 is damaged. The width is more preferably 0.1 mm or more, and still more preferably 0.5 mm or more. As long as the width is usually about 0.1 mm, the first glass substrate 111 and the first glass substrate From the viewpoint of productivity and the like, the glass substrate 121 is preferably 5 mm or less, and more preferably 3 mm or less.

以上,對接著部14之代表性形狀等進行了說明,但接著部14之形狀等只要為可於自密封構造體10剝離第1支撐構造體112及第2支撐構造體122時抑制成為液晶顯示面板用構件20之部分之損傷、具體而言為密封部13之剝離以及第1玻璃基板111及第2玻璃基板121之損傷的形狀及配置等,則無特別限制。 The representative shape and the like of the bonding portion 14 have been described above, but the shape and the like of the bonding portion 14 can be suppressed from becoming a liquid crystal display when the first support structure 112 and the second support structure 122 can be peeled off from the self-sealing structure 10. Damage to the part of the panel member 20, specifically the peeling of the sealing portion 13, and the shape and arrangement of the damage to the first glass substrate 111 and the second glass substrate 121 are not particularly limited.

例如,接著部14並不限定於如圖7所示之包圍複數個密封部13之整體者、或如圖8所示之包圍各個密封部13者,亦可為僅包圍複數個密封部13中之鄰接之一部分密封部13者,或亦可為設置於複數個密封部13彼此之間之格子狀,並且可視需要且根據密封部13之個數或配置組合如上所述之各形狀。又,直線狀或框狀之接著部14未必需要由連續之線狀部分構成,亦可由虛線狀等不連續之線狀部分構成。 For example, the bonding portion 14 is not limited to those that surround the entirety of the plurality of sealing portions 13 as shown in FIG. 7, or that surrounds each of the sealing portions 13 as shown in FIG. 8, and may include only the plurality of sealing portions 13. Adjacent portions of the sealing portion 13 may be in a grid shape provided between the plurality of sealing portions 13 and may be in the shape described above according to the number or arrangement of the sealing portions 13 as required. Further, the linear or frame-shaped bonding portion 14 does not necessarily need to be composed of a continuous linear portion, and may be formed of a discontinuous linear portion such as a dotted line.

以上,對實施形態之液晶顯示面板用構件之製造方法進行了說明,但可在不違反本發明之主旨之限度內,且視需要適當變更其構成。例如,作為密封構造體,並不限定於具有如圖所示之個數之密封部者,亦可為進而具有多個密封部者。根據具有多個密封部者,可更有效率地製造液晶顯示面板。又,於設置複數個密封部之情形時,關於各個密封部之大小或配置等亦不限定於如圖所示之大小或配置等,可適當變更。進而,接著部可對應於此種密封部之大小或配置等而適當變更大小或配置等。 The manufacturing method of the member for a liquid crystal display panel according to the embodiment has been described above, but the configuration can be appropriately changed as necessary without departing from the spirit of the present invention. For example, the seal structure is not limited to those having a number of seal portions as shown in the figure, and may be a plurality of seal portions. With a plurality of sealing portions, a liquid crystal display panel can be manufactured more efficiently. In the case where a plurality of seal portions are provided, the size or arrangement of each seal portion is not limited to the size, arrangement, etc. as shown in the figure, and may be appropriately changed. Furthermore, the size, arrangement, etc. of the adhesive portion can be appropriately changed in accordance with the size, arrangement, etc. of such a seal portion.

[實施例] [Example]

以下,藉由實施例等對本發明進行具體說明,但本發明並不限定於該等之例。 Hereinafter, the present invention will be specifically described using examples and the like, but the present invention is not limited to these examples.

於以下之實施例及比較例中,作為玻璃基板,使用由無鹼硼矽酸玻璃構成之玻璃板(縱170 mm、橫125 mm、板厚0.3 mm、線膨脹係 數38×10-7/℃,旭硝子公司製造之商品名「AN100」)。又,作為支撐板,使用同樣由無鹼硼矽酸玻璃構成之玻璃板(縱170 mm、橫125 mm、板厚0.4 mm、線膨脹係數38×10-7/℃,旭硝子公司製造之商品名「AN100」)。 In the following examples and comparative examples, as the glass substrate, a glass plate made of alkali-free borosilicate glass (170 mm in length, 125 mm in width, 0.3 mm in thickness, and linear expansion coefficient of 38 × 10 -7 / ° C) was used. , Trade name "AN100" manufactured by Asahi Glass Co., Ltd.). A glass plate (trade name, manufactured of longitudinal 170 mm, transverse 125 mm, thickness 0.4 mm, a linear expansion coefficient 38 × 10 -7 / ℃, Asahi Glass Co., and, as a support plate, constituted of using the same alkali-free boron-silicate glass "AN100").

<實施例1> <Example 1>

對支撐板之一主面進行純水清洗,其後進行UV(ultraviolet,紫外線)清洗而使其淨化。 One main surface of the support plate is cleaned with pure water, and then UV (ultraviolet) is cleaned to purify it.

其次,將作為成分(A)之直鏈狀乙烯基甲基聚矽氧烷(「VDT-127」,25℃下之黏度700-800 cP(厘泊):Azmax製造,有機聚矽氧烷1 mol中之乙烯基之mol%:0.325)、與作為成分(B)之直鏈狀甲基氫聚矽氧烷(「HMS-301」,25℃下之黏度25-35 cP(厘泊):Azmax製造,1分子內之鍵結於矽原子之氫原子數:8個)以所有乙烯基與所有鍵結於矽原子之氫原子之莫耳比(氫原子/乙烯基)成為0.9之方式混合,且相對於該矽氧烷混合物100重量份,混合作為成分(C)之以下述式(1)表示之具有乙炔系不飽和基之矽化合物1質量份。 Next, as a component (A), a linear vinyl methyl polysiloxane ("VDT-127", viscosity 700-800 cP (centipoise) at 25 ° C: made by Azmax, organic polysiloxane 1 mol% of vinyl group in mol: 0.325), and linear methylhydropolysiloxane ("HMS-301", viscosity 25-35 cP (centipoise) at 25 ° C) as component (B): Manufactured by Azmax, the number of hydrogen atoms bonded to silicon atoms in one molecule: 8) mixed so that the molar ratio of all vinyl groups to all hydrogen atoms bonded to silicon atoms (hydrogen / vinyl group) becomes 0.9 1 part by mass of a silicon compound having an acetylene-based unsaturated group represented by the following formula (1) as a component (C) is mixed with 100 parts by weight of the siloxane mixture.

HC≡C-C(CH3)2-O-Si(CH3)3 式(1) HC≡CC (CH 3 ) 2 -O-Si (CH 3 ) 3 Formula (1)

繼而,相對於成分(A)、成分(B)及成分(C)之合計量,以按鉑換算鉑金屬濃度成為100 ppm之方式添加鉑系觸媒(Shin-Etsu Silicone股份有限公司製造,CAT-PL-56)而獲得有機聚矽氧烷組合物之混合液。 Next, a platinum-based catalyst was added so that the platinum-converted platinum metal concentration became 100 ppm based on the total amount of component (A), component (B), and component (C) (manufactured by Shin-Etsu Silicone Co., Ltd., CAT -PL-56) to obtain a mixed solution of an organopolysiloxane composition.

藉由模具塗佈機將所獲得之混合液塗佈於之前經淨化之支撐板之第1主面上(速度5 mm/s、GAP(間隙)150 μm、塗佈壓95 kPa)。其後,將塗佈於支撐板上之混合物(樹脂層形成用組合物層)於室溫下靜置10分鐘後,於大氣中以180℃使其加熱硬化60分鐘,從而於支撐板之整個面上形成厚度15 μm之硬化聚矽氧樹脂層而獲得支撐構造體A(第1支撐構造體)。 The obtained mixed solution was applied to a first main surface of a previously purified support plate by a mold coater (speed 5 mm / s, GAP (gap) 150 μm, application pressure 95 kPa). Thereafter, the mixture (the composition layer for forming a resin layer) applied on the support plate was allowed to stand at room temperature for 10 minutes, and then heated and cured at 180 ° C. for 60 minutes in the air, so as to cover the entire support plate. A hardened silicone resin layer having a thickness of 15 μm was formed on the surface to obtain a support structure A (first support structure).

其次,對玻璃基板之一主面進行純水清洗,其後進行UV清洗而 使其淨化。 Next, one main surface of the glass substrate is cleaned with pure water, and then UV cleaned. Make it clean.

其後,使支撐構造體A與玻璃基板位置對準後,使用真空加壓裝置,於室溫下使玻璃基板之第1主面與支撐構造體A之硬化聚矽氧樹脂層之剝離性表面密接而獲得積層體A(第1積層體)。 Then, after aligning the position of the support structure A with the glass substrate, the first main surface of the glass substrate and the peelable surface of the hardened silicone resin layer of the support structure A were made at room temperature using a vacuum pressing device. Laminated body A (first laminated body) was obtained by close contact.

其次,藉由與上述程序相同之程序,獲得另一個積層體B(第2積層體)。 Next, another laminated body B (second laminated body) was obtained by the same procedure as the above-mentioned procedure.

繼而,於積層體A之玻璃基板A之主面側,藉由分注法將密封用樹脂液以成為與圖4所示之密封部13相同形狀之方式描繪成框狀。 Next, on the main surface side of the glass substrate A of the laminated body A, the sealing resin liquid was drawn into a frame shape by a dispensing method so as to have the same shape as the sealing portion 13 shown in FIG. 4.

進而,於積層體A之玻璃基板A之主面側,藉由分注法將接著用樹脂液以成為與圖4所示之接著部14相同形狀之方式描繪成直線狀。其後,以積層體A之玻璃基板A與積層體B之玻璃基板B對向之方式,使積層體A與積層體B貼合,並使其等熱硬化而獲得密封構造體1。 Furthermore, on the main surface side of the glass substrate A of the laminated body A, the resin liquid for bonding is drawn in a linear shape so as to have the same shape as the bonding portion 14 shown in FIG. 4 by a dispensing method. Thereafter, the laminated substrate A and the laminated substrate B are opposed to each other such that the glass substrate A of the laminated substrate A and the glass substrate B of the laminated substrate B face each other, and are then heat-hardened to obtain the sealed structure 1.

再者,密封部之寬度及接著部之寬度分別為0.08 mm及0.08 mm。 Furthermore, the width of the sealing portion and the width of the bonding portion were 0.08 mm and 0.08 mm, respectively.

密封構造體1中,藉由SAICAS(DAIPLA WINTES公司製造)對密封部與一玻璃基板A之間之剝離強度進行測定,結果為0.11 N/mm。又,密封部與一玻璃A之總接觸面積為960 mm2In the sealing structure 1, the peel strength between the sealing portion and a glass substrate A was measured by SAICAS (manufactured by DAIPLA WINTES), and it was 0.11 N / mm. The total contact area between the sealing portion and a glass A was 960 mm 2 .

密封構造體1中,藉由SAICAS(DAIPLA WINTES公司製造)對接著部與一玻璃基板A之間之剝離強度進行測定,結果為0.11 N/mm。又,接著部與一玻璃基板A之總接觸面積為408 mm2In the sealing structure 1, the peel strength between the bonding portion and a glass substrate A was measured by SAICAS (manufactured by DAIPLA WINTES), and it was 0.11 N / mm. In addition, the total contact area between the bonding portion and a glass substrate A was 408 mm 2 .

密封構造體1中,藉由SAICAS(DAIPLA WINTES公司製造)對一玻璃基板A與支撐構造體A之間之剝離強度進行測定,結果為0.007 N/mm。又,一玻璃基板A與支撐構造體A之總接觸面積為21250 mm2In the seal structure 1, the peel strength between a glass substrate A and the support structure A was measured by SAICAS (manufactured by DAIPLA WINTES), and it was 0.007 N / mm. The total contact area of a glass substrate A and the support structure A is 21,250 mm 2 .

再者,密封構造體1中,密封部與一玻璃基板B之間之剝離強度及總接觸面積、接著部與一玻璃基板B之間之剝離強度及總接觸面 積、以及一玻璃基板B與支撐構造體B之間之剝離強度及總接觸面積之數值分別與密封部與一玻璃基板A之間之剝離強度及總接觸面積、接著部與一玻璃基板A之間之剝離強度及總接觸面積、以及一玻璃基板A與支撐構造體A之間之剝離強度及總接觸面積之數值相同。 Furthermore, in the sealing structure 1, the peeling strength and the total contact area between the sealing portion and a glass substrate B, and the peeling strength and the total contact surface between the bonding portion and a glass substrate B. And the peel strength and total contact area between a glass substrate B and the support structure B, and the peel strength and total contact area between the sealing portion and a glass substrate A, and the adhesion between the bonding portion and a glass substrate A, respectively. The values of the peel strength and the total contact area between the glass substrate A and the support structure A are the same.

根據上述數值,{(X1×Y1)+(Z1×W1)}/(A1×B1)及{(X2×Y2)+(Z2×W2)}/(A2×B2)之值為1.01。 Based on the above values, the value of {(X1 × Y1) + (Z1 × W1)} / (A1 × B1) and {(X2 × Y2) + (Z2 × W2)} / (A2 × B2) is 1.01.

使所獲得之密封構造體1之積層體B側真空吸附於壓盤後,於密封構造體1之角隅部之玻璃基板A與硬化聚矽氧樹脂層之界面插入厚度0.1 mm之不鏽鋼製刃具,將支撐構造體A自密封構造體1分離。 After the side of the laminated body B of the obtained sealed structure 1 was vacuum-adsorbed on the platen, a stainless steel cutting tool having a thickness of 0.1 mm was inserted at the interface between the glass substrate A of the corner portion of the sealed structure 1 and the cured silicone layer The support structure A is separated from the seal structure 1.

其後,進而按照相同之程序,自將支撐構造體A分離後之密封構造體分離支撐構造體B,從而獲得液晶顯示面板用構件。 Thereafter, according to the same procedure, the support structure B is separated from the sealing structure after the support structure A is separated, thereby obtaining a member for a liquid crystal display panel.

於分離支撐構造體A及支撐構造體B時,雖在密封部與玻璃基板A或玻璃基板B之間觀察到輕微之剝離,但在實用上不存在問題,未產生玻璃基板A及玻璃基板B之破壞。 When the support structure A and the support structure B were separated, although slight peeling was observed between the sealing portion and the glass substrate A or the glass substrate B, there was no practical problem, and the glass substrate A and the glass substrate B were not generated. Destruction.

<實施例2> <Example 2>

以使密封部與一玻璃基板A(及另一玻璃基板B)之總接觸面積成為1200 mm2之方式,將密封部之寬度變更為0.1 mm,除此以外,按照與實施例1相同之程序製造液晶顯示面板用構件。 The width of the sealing portion was changed to 0.1 mm so that the total contact area between the sealing portion and one glass substrate A (and the other glass substrate B) was 1200 mm 2. The procedure was the same as that of Example 1 except that the width of the sealing portion was changed to 0.1 mm. Manufacture of a member for a liquid crystal display panel.

於實施例2中,{(X1×Y1)+(Z1×W1)}/(A1×B1)及{(X2×Y2)+(Z2×W2)}/(A2×B2)之值為1.19。 In Example 2, the value of {(X1 × Y1) + (Z1 × W1)} / (A1 × B1) and {(X2 × Y2) + (Z2 × W2)} / (A2 × B2) is 1.19.

再者,於分離支撐構造體A及支撐構造體B時,雖在密封部與玻璃基板A或B之間觀察到輕微之剝離,但在實用上不存在問題,未產生玻璃基板A及B之破壞。 Furthermore, when the support structure A and the support structure B were separated, although slight peeling was observed between the sealing portion and the glass substrate A or B, there was no practical problem, and the glass substrates A and B did not occur. damage.

<實施例3> <Example 3>

以使接著部與一玻璃基板A(及另一玻璃基板B)之總接觸面積成為510 mm2之方式,將接著部之寬度變更為0.1 mm,除此以外,按照 與實施例1相同之程序製造液晶顯示面板用構件。 The width of the bonding portion was changed to 0.1 mm so that the total contact area between the bonding portion and one glass substrate A (and the other glass substrate B) was 510 mm 2. The procedure was the same as that of Example 1 except that the width of the bonding portion was changed to 0.1 mm. Manufacture of a member for a liquid crystal display panel.

於實施例3中,{(X1×Y1)+(Z1×W1)}/(A1×B1)及{(X2×Y2)+(Z2×W2)}/(A2×B2)之值為1.09。 In Example 3, the value of {(X1 × Y1) + (Z1 × W1)} / (A1 × B1) and {(X2 × Y2) + (Z2 × W2)} / (A2 × B2) was 1.09.

再者,於分離支撐構造體A及支撐構造體B時,雖在密封部與玻璃基板A或B之間觀察到輕微之剝離,但在實用上不存在問題,未產生玻璃基板A及B之破壞。 Furthermore, when the support structure A and the support structure B were separated, although slight peeling was observed between the sealing portion and the glass substrate A or B, there was no practical problem, and the glass substrates A and B did not occur. damage.

<實施例4> <Example 4>

以使密封部與一玻璃基板A(及另一玻璃基板B)之總接觸面積成為6000 mm2之方式,將密封部之寬度變更為0.5 mm,以使接著部與一玻璃基板A(及另一玻璃基板B)之總接觸面積成為2550 mm2之方式,將接著部之寬度變更為0.5 mm,除此以外,按照與實施例1相同之程序製造液晶顯示面板用構件。 The width of the sealing portion was changed to 0.5 mm so that the total contact area of the sealing portion and one glass substrate A (and the other glass substrate B) was 6000 mm 2 so that the bonding portion and one glass substrate A (and another A glass substrate B) was manufactured in the same manner as in Example 1 except that the total contact area was 2550 mm 2 and the width of the bonding portion was changed to 0.5 mm.

於實施例4中,{(X1×Y1)+(Z1×W1)}/(A1×B1)及{(X2×Y2)+(Z2×W2)}/(A2×B2)之值為6.32。 In Embodiment 4, the value of {(X1 × Y1) + (Z1 × W1)} / (A1 × B1) and {(X2 × Y2) + (Z2 × W2)} / (A2 × B2) has a value of 6.32.

再者,於分離支撐構造體A及支撐構造體B時,未產生密封部與玻璃基板A或B之剝離、或玻璃基板A及B之破壞。 In addition, when the support structure A and the support structure B were separated, no peeling of the sealing portion from the glass substrate A or B or damage to the glass substrates A and B occurred.

<實施例5> <Example 5>

變更密封用樹脂液之種類,將密封部與一玻璃基板A(及另一玻璃基板B)之間之剝離強度變更為0.17 N/mm,除此以外,按照與實施例1相同之程序製造液晶顯示面板用構件。 Except changing the type of the resin liquid for sealing, and changing the peel strength between the sealing portion and one glass substrate A (and the other glass substrate B) to 0.17 N / mm, a liquid crystal was produced according to the same procedure as in Example 1. Components for display panels.

於實施例5中,{(X1×Y1)+(Z1×W1)}/(A1×B1)及{(X2×Y2)+(Z2×W2)}/(A2×B2)之值為1.40。 In Example 5, the value of {(X1 × Y1) + (Z1 × W1)} / (A1 × B1) and {(X2 × Y2) + (Z2 × W2)} / (A2 × B2) is 1.40.

再者,於分離支撐構造體A及支撐構造體B時,未產生密封部與玻璃基板A或B之剝離、或玻璃基板A及B之破壞。 In addition, when the support structure A and the support structure B were separated, no peeling of the sealing portion from the glass substrate A or B or damage to the glass substrates A and B occurred.

<實施例6> <Example 6>

變更接著用樹脂液之種類,將接著部與一玻璃基板A(及另一玻 璃基板B)之間之剝離強度變更為0.17 N/mm,除此以外,按照與實施例1相同之程序製造液晶顯示面板用構件。 Change the type of resin liquid used for bonding, and connect the bonding part to a glass substrate A (and another glass Except that the peel strength between the glass substrates B) was changed to 0.17 N / mm, a member for a liquid crystal display panel was produced according to the same procedure as in Example 1.

於實施例6中,{(X1×Y1)+(Z1×W1)}/(A1×B1)及{(X2×Y2)+(Z2×W2)}/(A2×B2)之值為1.18。 In Embodiment 6, the value of {(X1 × Y1) + (Z1 × W1)} / (A1 × B1) and {(X2 × Y2) + (Z2 × W2)} / (A2 × B2) is 1.18.

再者,於分離支撐構造體A及支撐構造體B時,雖在密封部與玻璃基板A或B之間觀察到輕微之剝離,但在實用上不存在問題,未產生玻璃基板A及B之破壞。 Furthermore, when the support structure A and the support structure B were separated, although slight peeling was observed between the sealing portion and the glass substrate A or B, there was no practical problem, and the glass substrates A and B were not damage.

<比較例1> <Comparative example 1>

以使密封部與一玻璃基板A(及另一玻璃基板B)之總接觸面積成為600 mm2之方式,將密封部之寬度變更為0.05 mm,除此以外,按照與實施例1相同之程序製造液晶顯示面板用構件。 The width of the sealing portion was changed to 0.05 mm so that the total contact area of the sealing portion and one glass substrate A (and the other glass substrate B) was 600 mm 2 , and the procedure was the same as that of Example 1 Manufacture of a member for a liquid crystal display panel.

於比較例1中,{(X1×Y1)+(Z1×W1)}/(A1×B1)及{(X2×Y2)+(Z2×W2)}/(A2×B2)之值為0.75。 In Comparative Example 1, the value of {(X1 × Y1) + (Z1 × W1)} / (A1 × B1) and {(X2 × Y2) + (Z2 × W2)} / (A2 × B2) was 0.75.

再者,於分離支撐構造體A及支撐構造體B時,產生有密封部與玻璃基板A或B之剝離、或者玻璃基板A或B之破壞。 In addition, when the support structure A and the support structure B are separated, peeling of the sealing portion from the glass substrate A or B or damage to the glass substrate A or B occurs.

<比較例2> <Comparative example 2>

以使接著部與一玻璃基板A(及另一玻璃基板B)之總接觸面積成為255 mm2之方式,將接著部之寬度變更為0.05 mm,除此以外,按照與實施例1相同之程序製造液晶顯示面板用構件。 The width of the bonding portion was changed to 0.05 mm so that the total contact area between the bonding portion and one glass substrate A (and the other glass substrate B) was 255 mm 2. The procedure was the same as that of Example 1 except that the width of the bonding portion was changed to 0.05 mm 2. Manufacture of a member for a liquid crystal display panel.

於比較例2中,{(X1×Y1)+(Z1×W1)}/(A1×B1)及{(X2×Y2)+(Z2×W2)}/(A2×B2)之值為0.90。 In Comparative Example 2, the value of {(X1 × Y1) + (Z1 × W1)} / (A1 × B1) and {(X2 × Y2) + (Z2 × W2)} / (A2 × B2) was 0.90.

再者,於分離支撐構造體A及支撐構造體B時,產生有密封部與玻璃基板A或B之剝離、或者玻璃基板A或B之破壞。 In addition, when the support structure A and the support structure B are separated, peeling of the sealing portion from the glass substrate A or B or damage to the glass substrate A or B occurs.

<比較例3> <Comparative example 3>

變更密封用樹脂液之種類,將密封部與一玻璃基板A(及另一玻璃基板B)之間之剝離強度變更為0.08 N/mm,除此以外,按照與實施 例1相同之程序製造液晶顯示面板用構件。 Change the type of sealing resin liquid, and change the peel strength between the sealing part and one glass substrate A (and the other glass substrate B) to 0.08 N / mm. A member for a liquid crystal display panel was manufactured by the same procedure as in Example 1.

於比較例3中,{(X1×Y1)+(Z1×W1)}/(A1×B1)及{(X2×Y2)+(Z2×W2)}/(A2×B2)之值為0.82。 In Comparative Example 3, the value of {(X1 × Y1) + (Z1 × W1)} / (A1 × B1) and {(X2 × Y2) + (Z2 × W2)} / (A2 × B2) was 0.82.

再者,於分離支撐構造體A及支撐構造體B時,產生有密封部與玻璃基板A或B之剝離、或者玻璃基板A或B之破壞。 In addition, when the support structure A and the support structure B are separated, peeling of the sealing portion from the glass substrate A or B or damage to the glass substrate A or B occurs.

<比較例4> <Comparative Example 4>

變更接著用樹脂液之種類,將接著部與一玻璃基板A(及另一玻璃基板B)之間之剝離強度變更為0.08 N/mm,除此以外,按照與實施例1相同之程序製造液晶顯示面板用構件。 The liquid crystal was produced by the same procedure as in Example 1 except that the type of the resin liquid to be used was changed, and the peel strength between the adhesive part and one glass substrate A (and the other glass substrate B) was changed to 0.08 N / mm. Components for display panels.

於比較例4中,{(X1×Y1)+(Z1×W1)}/(A1×B1)及{(X2×Y2)+(Z2×W2)}/(A2×B2)之值為0.93。 In Comparative Example 4, the value of {(X1 × Y1) + (Z1 × W1)} / (A1 × B1) and {(X2 × Y2) + (Z2 × W2)} / (A2 × B2) was 0.93.

再者,於分離支撐構造體A及支撐構造體B時,產生有密封部與玻璃基板A或B之剝離、或者玻璃基板A或B之破壞。 In addition, when the support structure A and the support structure B are separated, peeling of the sealing portion from the glass substrate A or B or damage to the glass substrate A or B occurs.

將上述實施例及比較例之結果匯總示於表1。 The results of the above examples and comparative examples are summarized in Table 1.

表1中,「剝離強度X」一欄表示密封部與玻璃基板A(或玻璃基板B)之間之剝離強度(N/mm),「總接觸面積Y」一欄表示密封部與玻璃基板A(或玻璃基板B)之總接觸面積(mm2),「剝離強度Z」一欄表示接著部與玻璃基板A(或玻璃基板B)之間之剝離強度(N/mm),「總接觸面積W」一欄表示密封部與玻璃基板A(或玻璃基板B)之總接觸面積(mm2),「剝離強度A」一欄表示玻璃基板A(或玻璃基板B)與支撐構造體A(或支撐構造體B)之間之剝離強度(N/mm),「總接觸面積B」一欄表示玻璃基板A(或玻璃基板B)與支撐構造體A(或支撐構造體B)之總接觸面積(mm2),「式(1)」一欄表示「(X1×Y1)+(Z1×W1)}/(A1×B1)」之結果,「式(2)」一欄表示「(X2×Y2)+(Z2×W2)}/(A2×B2)」之結果。 In Table 1, the column "Peel Strength X" indicates the peel strength (N / mm) between the sealing portion and the glass substrate A (or glass substrate B), and the column "Total Contact Area Y" indicates the sealing portion and the glass substrate A. (Or glass substrate B) total contact area (mm 2 ), the column "peeling strength Z" indicates the peel strength (N / mm) between the bonding part and glass substrate A (or glass substrate B), "total contact area The column “W” indicates the total contact area (mm 2 ) between the sealing portion and the glass substrate A (or the glass substrate B), and the column “Peeling strength A” indicates the glass substrate A (or the glass substrate B) and the support structure A (or Peel strength (N / mm) between supporting structures B), the column "Total contact area B" indicates the total contact area between glass substrate A (or glass substrate B) and supporting structure A (or supporting structure B) (mm 2 ), the column of “Formula (1)” indicates the result of “(X1 × Y1) + (Z1 × W1)} / (A1 × B1)”, and the column of “Formula (2)” indicates “(X2 × Y2) + (Z2 × W2)} / (A2 × B2) ”.

又,表1中之剝離結果係按照以下基準而得者。於實用上,必須為「○」、「◎」。 The peeling results in Table 1 were obtained based on the following criteria. Practically, it must be "○" and "◎".

「◎」:未產生密封部與玻璃基板A或B之剝離、或者玻璃基板A或B之破壞 "◎": No peeling of the sealing portion from the glass substrate A or B, or damage to the glass substrate A or B

「○」:在密封部與玻璃基板A或B之間觀察到輕微之剝離,但於實用上不存在問題 "○": A slight peeling was observed between the sealing portion and the glass substrate A or B, but there was no problem in practical use

「×」產生有密封部與玻璃基板A或B之剝離、或者玻璃基板A或B之破壞。 "×" peeled off the sealing part and the glass substrate A or B, or the glass substrate A or B was broken.

由上述表1可確認,於滿足式(1)及式(2)之關係之密封構造體中,密封部與玻璃基板之間之剝離、或玻璃基板之破損得到抑制。尤其,經確認若式(1)及式(2)之值為1.40以上,則剝離進一步受到抑制。 From Table 1 above, it can be confirmed that in the sealing structure that satisfies the relationship of the formulas (1) and (2), peeling between the sealing portion and the glass substrate or damage to the glass substrate is suppressed. In particular, it was confirmed that if the values of the formulas (1) and (2) are 1.40 or more, peeling is further suppressed.

另一方面,於不滿足式(1)或式(2)之關係之比較例1~4中,產生有密封部與玻璃基板之間之剝離、或玻璃基板之破損。 On the other hand, in Comparative Examples 1 to 4 that did not satisfy the relationship of Expression (1) or Expression (2), peeling between the sealing portion and the glass substrate or damage to the glass substrate occurred.

以上,對本發明之一實施形態進行了說明,但本發明並不限制於上述實施形態。可於不脫離本發明之範圍之前提下,對上述實施形態施加各種變形及置換。 As mentioned above, although one Embodiment of this invention was described, this invention is not limited to the said embodiment. Without departing from the scope of the present invention, various modifications and substitutions can be added to the above-mentioned embodiments.

本申請案係基於2012年10月9日提出申請之日本專利申請案2012-224448,其內容係以參照之形式併入本文中。 This application is based on Japanese Patent Application No. 2012-224448 filed on October 9, 2012, the contents of which are incorporated herein by reference.

10‧‧‧密封構造體 10‧‧‧Sealed structure

11‧‧‧第1積層體 11‧‧‧The first laminated body

13‧‧‧密封部 13‧‧‧Sealing Department

Claims (15)

一種密封構造體,其係用於製造液晶顯示面板用構件者,且包含:第1積層體,其具有板厚為0.3mm以下之第1玻璃基板及與上述第1玻璃基板可剝離地貼合之第1支撐構造體;第2積層體,其具有板厚為0.3mm以下之第2玻璃基板及與上述第2玻璃基板可剝離地貼合之第2支撐構造體;及密封部,其於上述第1積層體及上述第2積層體之間以包圍成為液晶顯示面板之形成區域之方式設置;且上述第1玻璃基板及上述第2玻璃基板對向,且滿足以下之關係式(1)及式(2):式(1)(X1×Y1)/(A1×B1)≧1.4 式(2)(X2×Y2)/(A2×B2)≧1.4(式(1)中,X1表示上述密封部與上述第1玻璃基板之間之剝離強度(N/mm),Y1表示上述密封部與上述第1玻璃基板之總接觸面積(mm2),A1表示上述第1玻璃基板與上述第1支撐構造體之間之剝離強度(N/mm),B1表示上述第1玻璃基板與上述第1支撐構造體之總接觸面積(mm2);式(2)中,X2表示上述密封部與上述第2玻璃基板之間之剝離強度(N/mm),Y2表示上述密封部與上述第2玻璃基板之總接觸面積(mm2),A2表示上述第2玻璃基板與上述第2支撐構造體之間之剝離強度(N/mm),B2表示上述第2玻璃基板與上述第2支撐構造體之總接觸面積(mm2))。 A sealing structure, which is used for manufacturing a member for a liquid crystal display panel, and includes a first laminated body having a first glass substrate having a thickness of 0.3 mm or less and a peelable bonding with the first glass substrate. A first support structure; a second laminated body having a second glass substrate having a thickness of 0.3 mm or less and a second support structure releasably bonded to the second glass substrate; and a sealing portion, The first laminated body and the second laminated body are arranged so as to surround the formation area of the liquid crystal display panel; and the first glass substrate and the second glass substrate are opposed to each other and satisfy the following relational expression (1) And formula (2): formula (1) (X1 × Y1) / (A1 × B1) ≧ 1.4 formula (2) (X2 × Y2) / (A2 × B2) ≧ 1.4 (in formula (1), X1 represents the above Peel strength (N / mm) between the sealing portion and the first glass substrate, Y1 represents the total contact area (mm 2 ) between the sealing portion and the first glass substrate, and A1 represents the first glass substrate and the first glass substrate. the peel strength between the support structure (N / mm), B1 denotes the total contact area of the first glass substrate and the structure of the first support (2 mm); the formula (2) , X2 represents the sealing portion and the peel strength (N / mm) between the second glass substrate 2, Y2 represents the total contact area (mm 2) of the sealing portion and the second glass substrate, A2 represents the second glass substrate 2 The peel strength (N / mm) with the second support structure, B2 represents the total contact area (mm 2 ) between the second glass substrate and the second support structure. 如請求項1之密封構造體,其進而包含:接著部,其以任意構成之形式接著上述第1積層體及上號第2積 層體;且上述第1玻璃基板及上述第2玻璃基板對向,且滿足以下之關係式(1)及式(2):式(1){(X1×Y1)+(Z1×W1)}/(A1×B1)≧1.4 式(2){(X2×Y2)+(Z2×W2)}/(A2×B2)≧1.4(式(1)中,X1、Y1、A1、B1與請求項1相同,Z1表示上述接著部與上述第1玻璃基板之間之剝離強度(N/mm),W1表示上述接著部與上述第1玻璃基板之總接觸面積(mm2);式(2)中,X2、Y2、A2、B2與請求項1相同,Z2表示上述接著部與上述第2玻璃基板之間之剝離強度(N/mm),W2表示上述接著部與上述第2玻璃基板之總接觸面積(mm2))。 For example, the sealing structure of claim 1 further includes: an adhering unit that adjoins the first laminated body and the second laminated body in an arbitrary configuration; and the first glass substrate and the second glass substrate face each other. And satisfy the following relational expressions (1) and (2): Formula (1) {(X1 × Y1) + (Z1 × W1)} / (A1 × B1) ≧ 1.4 Formula (2) {(X2 × Y2 ) + (Z2 × W2)} / (A2 × B2) ≧ 1.4 (In the formula (1), X1, Y1, A1, and B1 are the same as the request item 1, and Z1 represents the distance between the bonding portion and the first glass substrate. Peel strength (N / mm), W1 represents the total contact area (mm 2 ) of the bonding portion and the first glass substrate; in formula (2), X2, Y2, A2, and B2 are the same as those in claim 1, and Z2 represents the above The peeling strength (N / mm) between the bonding portion and the second glass substrate, and W2 represents a total contact area (mm 2 ) between the bonding portion and the second glass substrate. 如請求項1之密封構造體,其中上述第1支撐構造體包含第1支撐板及設置於上述第1支撐板之一側之主面之第1硬化聚矽氧樹脂層,上述第1玻璃基板與上述第1硬化聚矽氧樹脂層可剝離地貼合,上述第2支撐構造體包含第2支撐板及設置於上述第2支撐板之一側之主面之第2硬化聚矽氧樹脂層,上述第2玻璃基板與上述第2硬化聚矽氧樹脂層可剝離地貼合。 The sealing structure of claim 1, wherein the first supporting structure includes a first supporting plate and a first hardened silicone resin layer provided on a main surface of one side of the first supporting plate, and the first glass substrate. Removably bonded to the first hardened silicone layer, and the second support structure includes a second support plate and a second hardened silicone layer provided on a main surface of one side of the second support plate. The second glass substrate and the second hardened silicone resin layer are releasably attached. 如請求項1之密封構造體,其包含複數個上述密封部。 The sealing structure according to claim 1 includes a plurality of the above-mentioned sealing portions. 如請求項2之密封構造體,其包含複數個上述密封部。 The sealing structure according to claim 2 includes a plurality of the above-mentioned sealing portions. 如請求項3之密封構造體,其包含複數個上述密封部。 The sealing structure according to claim 3 includes a plurality of the above-mentioned sealing portions. 如請求項5之密封構造體,其中上述接著部係沿著上述密封部呈直線狀設置。 The sealing structure according to claim 5, wherein the bonding portion is provided linearly along the sealing portion. 如請求項5之密封構造體,其中上述接著部係以包圍上述複數個密封部之整體之方式設置。 The sealing structure according to claim 5, wherein the bonding portion is provided so as to surround the entirety of the plurality of sealing portions. 如請求項5之密封構造體,其中上述接著部係以包圍上述複數個 密封部之各者之方式設置。 The sealing structure according to claim 5, wherein the above-mentioned bonding portion surrounds the above-mentioned plurality Each of the sealing portions is provided. 如請求項1至9中任一項之密封構造體,其中上述第1玻璃基板及上述第2玻璃基板具有縱730mm×橫920mm以上之大小。 The sealed structure according to any one of claims 1 to 9, wherein the first glass substrate and the second glass substrate have a size of 730 mm in length × 920 mm in width. 如請求項1至9中任一項之密封構造體,其中上述第1玻璃基板及/或上述第2玻璃基板由無鹼玻璃構成。 The sealing structure according to any one of claims 1 to 9, wherein the first glass substrate and / or the second glass substrate is made of an alkali-free glass. 如請求項11之密封構造體,其中上述第1玻璃基板及/或上述第2玻璃基板由以氧化物基準之質量百分率表示含有下述成分之無鹼玻璃構成:SiO2:50~66% Al2O3:10.5~24% B2O3:0~12% MgO:0~8% CaO:0~14.5% SrO:0~24% BaO:0~13.5% MgO+CaO+SrO+BaO:9~29.5% ZnO:0~5%。 The sealing structure according to claim 11, wherein the first glass substrate and / or the second glass substrate are made of alkali-free glass containing the following components in terms of mass percentage based on oxides: SiO 2 : 50 to 66% Al 2 O 3 : 10.5 ~ 24% B 2 O 3 : 0 ~ 12% MgO: 0 ~ 8% CaO: 0 ~ 14.5% SrO: 0 ~ 24% BaO: 0 ~ 13.5% MgO + CaO + SrO + BaO: 9 ~ 29.5% ZnO: 0 ~ 5%. 如請求項11之密封構造體,其中上述第1玻璃基板及/或上述第2玻璃基板由以氧化物基準之質量百分率表示含有下述成分之無鹼玻璃構成:SiO2:58~66% Al2O3:15~22% B2O3:5~12% MgO:0~8% CaO:0~9% SrO:3~12.5% BaO:0~2% MgO+CaO+SrO+BaO:9~18% ZnO:0~2%。 The sealing structure according to claim 11, wherein the first glass substrate and / or the second glass substrate are composed of an alkali-free glass containing the following components in terms of a mass percentage of an oxide basis: SiO 2 : 58 to 66% Al 2 O 3 : 15 ~ 22% B 2 O 3 : 5 ~ 12% MgO: 0 ~ 8% CaO: 0 ~ 9% SrO: 3 ~ 12.5% BaO: 0 ~ 2% MgO + CaO + SrO + BaO: 9 ~ 18% ZnO: 0 ~ 2%. 一種液晶顯示面板用構件之製造方法,其包括剝離步驟,該剝離步驟係自如請求項1至13中任一項之密封構造體剝離上述第1支撐構造體及上述第2支撐構造體。 A method for manufacturing a member for a liquid crystal display panel, comprising a peeling step of peeling off the first support structure and the second support structure from the sealing structure according to any one of claims 1 to 13. 如請求項14之液晶顯示面板用構件之製造方法,其中於上述剝離步驟中,上述第1支撐構造體及上述第2支撐構造體自上述密封構造體之剝離係自上述密封構造體之一端部緩慢地進行。 The method for manufacturing a member for a liquid crystal display panel according to claim 14, wherein in the peeling step, the peeling of the first supporting structure and the second supporting structure from the sealed structure is from one end of the sealed structure. 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