TW201411084A - Cooling apparatus - Google Patents

Cooling apparatus Download PDF

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Publication number
TW201411084A
TW201411084A TW101133084A TW101133084A TW201411084A TW 201411084 A TW201411084 A TW 201411084A TW 101133084 A TW101133084 A TW 101133084A TW 101133084 A TW101133084 A TW 101133084A TW 201411084 A TW201411084 A TW 201411084A
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TW
Taiwan
Prior art keywords
cooling device
carrier
cooling
flat
coolant
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Application number
TW101133084A
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Chinese (zh)
Inventor
Chia-Ming Liu
Lien-Tai Chen
Tsing-Tang Song
Chin-Tien Yang
Szu-Ju Li
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Ind Tech Res Inst
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Publication date
Application filed by Ind Tech Res Inst filed Critical Ind Tech Res Inst
Priority to TW101133084A priority Critical patent/TW201411084A/en
Priority to CN201210459094.XA priority patent/CN103673448A/en
Priority to US13/965,897 priority patent/US20140069613A1/en
Publication of TW201411084A publication Critical patent/TW201411084A/en

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00Tubular elements; Assemblies of tubular elements
    • F28F1/10Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F27/00Control arrangements or safety devices specially adapted for heat-exchange or heat-transfer apparatus
    • F28F27/02Control arrangements or safety devices specially adapted for heat-exchange or heat-transfer apparatus for controlling the distribution of heat-exchange media between different channels
    • AHUMAN NECESSITIES
    • A41WEARING APPAREL
    • A41DOUTERWEAR; PROTECTIVE GARMENTS; ACCESSORIES
    • A41D13/00Professional, industrial or sporting protective garments, e.g. surgeons' gowns or garments protecting against blows or punches
    • A41D13/002Professional, industrial or sporting protective garments, e.g. surgeons' gowns or garments protecting against blows or punches with controlled internal environment
    • A41D13/005Professional, industrial or sporting protective garments, e.g. surgeons' gowns or garments protecting against blows or punches with controlled internal environment with controlled temperature
    • A41D13/0053Cooled garments
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25DREFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D3/00Devices using other cold materials; Devices using cold-storage bodies
    • F25D3/005Devices using other cold materials; Devices using cold-storage bodies combined with heat exchangers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00Tubular elements; Assemblies of tubular elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25DREFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D2400/00General features of, or devices for refrigerators, cold rooms, ice-boxes, or for cooling or freezing apparatus not covered by any other subclass
    • F25D2400/26Refrigerating devices for cooling wearing apparel, e.g. garments, hats, shoes or gloves

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Geometry (AREA)
  • Physical Education & Sports Medicine (AREA)
  • Textile Engineering (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Thermotherapy And Cooling Therapy Devices (AREA)
  • Mattresses And Other Support Structures For Chairs And Beds (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The disclosure is a cooling apparatus, which comprises a carrier and a flat-plate cooling pipe. The flat-plate cooling pipe is constituted of high thermal conductivity material and disposed on the carrier, and it comprises a pipe potion and flat-plate potion. The pipe potion has a through hole to transmit cooling liquid. The flat-plate potion is attached on the carrier, so as to enable the cooling liquid to exchange heat by big touch area between the flat-plate potion and the carrier. Therefore, the disclosure can enhance the exchange efficiency of the cooling apparatus and reduce the temperature of the carrier effectively.

Description

冷卻裝置 Cooling device

本揭露係關於一種冷卻裝置,特別是有關於一種具有冷卻導管之冷卻裝置。 The present disclosure relates to a cooling device, and more particularly to a cooling device having a cooling conduit.

近年來人們對於水冷式冷卻裝置的需求日益擴大,相關的產品如冷卻衣、冷卻被褥或冷卻床墊等亦是蓬勃發展。 In recent years, there has been an increasing demand for water-cooled cooling devices, and related products such as cooling clothes, cooling bedding or cooling mattresses are also booming.

習知技術揭露有一種冷卻裝置(如冷卻衣),其係於載體(如衣物)內附加水管,並將冷卻液(如冰水)填充於水管內,再利用貯水器貯存該冷卻液,另藉由唧筒抽吸該冷卻液,使該冷卻液於該水管內作循環流動,並使該冷卻液與該載體(或人體)進行熱交換,進而降低該載體(或人體)之溫度。 The prior art discloses a cooling device (such as a cooling coat) that attaches a water pipe to a carrier (such as laundry), and fills a coolant (such as ice water) in the water pipe, and then stores the coolant by using a water reservoir, and The coolant is pumped by the cylinder to circulate the coolant in the water pipe, and the coolant is exchanged with the carrier (or the human body) to lower the temperature of the carrier (or human body).

但是,該冷卻裝置係使用普通的水管,而該水管與該載體的接觸面積較小,且該水管係由一般的導熱材料所製成,致使該水管與該載體(或人體)間的熱交換效率較差。 However, the cooling device uses a common water pipe, and the water pipe has a small contact area with the carrier, and the water pipe is made of a general heat conductive material, so that heat exchange between the water pipe and the carrier (or human body) is caused. Inefficient.

再者,該冷卻裝置之貯水器內係貯存如冰水等冷卻液,由於該冷卻液的持續時間較短,使得該冷卻裝置無法使用較長的時間。同時,當冰全部溶化為水後,該冷卻液的溫度會快速提升,導致該冷卻裝置之溫度的波動幅度過大。 Further, the water storage device of the cooling device stores a cooling liquid such as ice water, and the cooling device cannot be used for a long time because of the short duration of the cooling liquid. At the same time, when the ice is completely dissolved into water, the temperature of the coolant rapidly increases, causing the temperature of the cooling device to fluctuate excessively.

因此,如何解決上述習知技術的缺失,遂成為本領域技術人員的重要課題。 Therefore, how to solve the above-mentioned shortcomings of the prior art has become an important issue for those skilled in the art.

本揭露提供一種冷卻裝置,其包括載體以及平板式冷卻導管。平板式冷卻導管係利用高導熱材料構成,係設置於該載體上,並包括導管部以及平板部,該導管部係具有導通孔以傳導冷卻液,而平板部係貼覆於載體上,使導通孔內之冷卻液藉由平板部與載體間之大接觸面積進行熱交換,同時利用冷源膠體對導通孔內之冷卻液進行熱交換,以提高冷卻裝置之熱交換效率,並可有效降低載體之溫度。 The present disclosure provides a cooling device that includes a carrier and a plate cooling conduit. The flat type cooling duct is composed of a high heat conductive material, and is disposed on the carrier, and includes a duct portion and a flat plate portion, the duct portion has a through hole for conducting the cooling liquid, and the flat plate portion is attached to the carrier to be electrically connected. The cooling liquid in the hole is heat-exchanged by the large contact area between the flat plate portion and the carrier, and the cooling liquid in the conduction hole is exchanged by the cold source colloid to improve the heat exchange efficiency of the cooling device, and the carrier can be effectively reduced. The temperature.

以下藉由特定的具體實施形態說明本揭露之實施方式,熟悉此技術之人士可由本說明書所揭示之內容輕易地了解本揭露之其他優點與功效,亦可藉由其他不同的具體實施形態加以施行或應用。 The embodiments of the present disclosure are described in the following specific embodiments, and those skilled in the art can easily understand other advantages and functions of the disclosure by the contents disclosed in the specification, and can also be implemented by other different embodiments. Or application.

第1A圖係繪示本揭露之冷卻裝置100的平面示意圖,第1B圖係繪示第1A圖中冷卻裝置100之平板式冷卻導管120於連線AA的剖面示意圖。 1A is a plan view showing the cooling device 100 of the present disclosure, and FIG. 1B is a schematic cross-sectional view showing the flat cooling duct 120 of the cooling device 100 in FIG. 1A along the line AA.

如圖所示,冷卻裝置100係包括載體110以及平板式冷卻導管120。該載體110可為衣物、被褥、床墊、椅墊、坐墊或背墊等物品。 As shown, the cooling device 100 includes a carrier 110 and a plate cooling conduit 120. The carrier 110 can be an item such as a garment, a bedding, a mattress, a seat cushion, a cushion or a back cushion.

該平板式冷卻導管120係由高導熱材料所構成,亦可由軟性材料混合該高導熱材料所構成。該高導熱材料可為金屬材料(如金屬粉末)、奈米材料或導熱碳材等。 The flat type cooling duct 120 is made of a highly heat conductive material, and may be composed of a soft material mixed with the high heat conductive material. The highly thermally conductive material may be a metal material such as a metal powder, a nano material or a heat conductive carbon material.

該軟性材料可為矽膠、乳膠、橡膠、矽膠玻纖、尼龍、鐵氟龍、聚氨酯(polyurethane;PU)、聚乙烯(polyethylene;PE)、聚丙烯(polypropylene;PP)、聚氯 乙烯(polyyinyl chloride;PVC)、聚偏二氟乙烯(polyvinylidene difluoride;PVDF)、全氟烷氧基碳氟化合物(perfluoroalkoxy fluorocarbon resin;PFA)、聚全氟乙丙烯(perfluorinated ethylene-propylene;FEP)或丙烯-丁二烯-苯乙烯樹脂(acrylonitrile-butadience styrene platics;ABS)等。 The soft material can be silicone, latex, rubber, silicone fiberglass, nylon, Teflon, polyurethane (PU), polyethylene (PE), polypropylene (PP), polychlorinated Polyyinyl chloride (PVC), polyvinylidene difluoride (PVDF), perfluoroalkoxy fluorocarbon resin (PFA), perfluorinated ethylene-propylene (FEP) or Acrylonitrile-butadience styrene platics (ABS) and the like.

該平板式冷卻導管120具有可撓性,係設置於該載體110之內部或表面上,並包括一體成型或相互結合而成之導管部121與平板部122。該導管部121之截面形狀可為圓形或橢圓形,該平板部122之截面形狀可為長方形。 The flat type cooling duct 120 has flexibility and is disposed on the inside or the surface of the carrier 110, and includes a duct portion 121 and a flat plate portion 122 which are integrally formed or combined with each other. The cross-sectional shape of the duct portion 121 may be circular or elliptical, and the cross-sectional shape of the flat portion 122 may be a rectangle.

該導管部121與該平板部122係蜿蜒於該載體110之表面或內部,該導管部121亦可延伸至該載體110之外部並形成迴路。 The conduit portion 121 and the flat portion 122 are tied to the surface or inside of the carrier 110. The conduit portion 121 may also extend outside the carrier 110 to form a loop.

該導管部121係具有導通孔123,用以傳導冷卻液,使該冷卻液於該導管部121之導通孔123內作循環流動。該冷卻液可為水、冰水或其混合物,該混合物可為抗凍劑或顏料等。 The duct portion 121 has a through hole 123 for conducting a coolant to circulate the coolant in the through hole 123 of the duct portion 121. The coolant may be water, ice water or a mixture thereof, and the mixture may be an antifreeze or a pigment or the like.

該平板部122係貼覆或結合於該載體110之表面或內部,使該冷卻液藉由該平板部122與該載體110間之大接觸面積進行熱交換,以提高該平板式冷卻導管120之熱交換效率。因此,當使用者使用該冷卻裝置100時,該平板式冷卻導管120及其導通孔123內之冷卻液可與該載體110及該使用者之身體進行熱交換,進而降低該載體110之溫度及該使用者之體溫。 The flat plate portion 122 is attached or bonded to the surface or the inside of the carrier 110, so that the cooling liquid exchanges heat with the large contact area between the flat plate portion 122 and the carrier 110 to improve the flat cooling duct 120. Heat exchange efficiency. Therefore, when the user uses the cooling device 100, the cooling liquid in the flat cooling duct 120 and the through hole 123 can exchange heat with the carrier 110 and the body of the user, thereby reducing the temperature of the carrier 110 and The body temperature of the user.

該冷卻裝置100可包括容器130以及冷源膠體131。該容器130可為貯水器,係用以容置該冷源膠體131與水132,該導管部121係通過該容器130,並與該冷源膠體131或水132相接觸。 The cooling device 100 can include a container 130 and a cold source gel 131. The container 130 can be a water reservoir for accommodating the cold source colloid 131 and the water 132. The conduit portion 121 passes through the container 130 and is in contact with the cold source colloid 131 or the water 132.

該冷源膠體131可包覆於包覆物133內,該包覆物133可放置於水132中,該冷源膠體131係用以與該導通孔123內之冷卻液進行熱交換,以降低該冷卻液之溫度上升斜率或速度,或降低該冷卻液之溫度。 The cold source colloid 131 can be coated in the covering 133, and the covering 133 can be placed in the water 132. The cold source colloid 131 is used for heat exchange with the cooling liquid in the through hole 123 to reduce The temperature of the coolant rises by a slope or velocity, or decreases the temperature of the coolant.

該冷源膠體131係具有高分子與氣泡,故其熱傳性極差,因此可透過該冷源膠體131的低熱傳性質,提高該冷卻裝置100之持續時間,並延長該冷卻裝置100之使用時間。 Since the cold source colloid 131 has a polymer and a gas bubble, the heat transfer property is extremely poor, so that the low heat transfer property of the cold source colloid 131 can be passed, the duration of the cooling device 100 can be increased, and the use of the cooling device 100 can be extended. time.

該冷源膠體131可為水添加增稠劑,該增稠劑之成分可為聚維酮(polyvinyl pyrrolidone;PVP)、丙烯酸聚合物(carbopol)、纖維素、纖維素澱粉、洋菜粉、海藻酸鈉或幾丁聚醣等。 The cold source colloid 131 may be a water added thickener, and the thickener may be composed of polyvinyl pyrrolidone (PVP), carbopol, cellulose, cellulose starch, seaweed powder, seaweed. Sodium or chitosan, etc.

該冷卻裝置100可包括控制單元140,係連接該導管部121,並可設置於該載體110之外部或內部。該控制單元140可為控制器、切換器、開關元件或馬達,係用以開啟或關閉該冷卻液於該導管部121內之循環流動,或用以調整該冷卻液於該導管部121內之循環方向,例如順時鐘之循環方向124或逆時鐘之循環方向125。 The cooling device 100 can include a control unit 140 that is coupled to the conduit portion 121 and can be disposed outside or inside the carrier 110. The control unit 140 can be a controller, a switch, a switching element or a motor for turning on or off the circulating flow of the coolant in the duct portion 121 or for adjusting the coolant in the duct portion 121. The direction of the loop, such as the clockwise direction 124 of the clock or the cyclic direction 125 of the counterclockwise.

第2圖係繪示本揭露具高導熱材料之平板式冷卻導管與其他冷卻方式相比較的溫度變化曲線圖。 Figure 2 is a graph showing temperature changes of a flat plate cooling duct with high thermal conductivity compared to other cooling methods.

如圖所示,可對一載體作溫度量測,起始溫度為溫度35℃。僅透過空氣對載體的冷卻方式,載體之溫度變化曲線151的溫度下降速度最慢。再者,利用水管對載體的冷卻方式,載體之溫度變化曲線152的溫度下降速度較空氣快。 As shown, a carrier can be measured for temperature at an initial temperature of 35 °C. The temperature of the temperature change curve 151 of the carrier is the slowest by the cooling mode of the carrier only by the air. Furthermore, by means of the cooling method of the water pipe to the carrier, the temperature of the carrier temperature curve 152 is lowered faster than the air.

另外,利用不具高導熱材料的平板式冷卻導管對載體的冷卻方式,載體之溫度變化曲線153的溫度下降速度又較水管快。最後,利用本揭露具高導熱材料之平板式冷卻導管對載體的冷卻方式,載體之溫度變化曲線154的溫度下降速度最快。舉例而言,如第二圖所示,其所使用的高導熱材料為鋁粉,而軟質材料為矽膠,其中,鋁粉的添加比例為30%,矽膠熱傳導係數可由原本的0.7 W/m-k上升至1.4W/m-k。鋁粉的添加比例最高可到達70%,而熱傳係數可達2.6 W/m-k。再者,上述之高導熱材料亦可為Al、AU、Ag、Cu、AlN、Al2O3、SiC、BeO、鑽石粉末、碳材、graphite、silicon、silica、BN或其混合材料,亦可為上述材料經奈米化後之材料或其混合;該些高導熱材料之熱傳係數可介於0.5-1500 W/m-k之間,而較佳的高導熱材料之熱傳係數為50 w/m-k以上,才能使平板式冷卻導管達到較高的熱交換效率。 In addition, by using a flat type cooling duct without a high heat conductive material to cool the carrier, the temperature change curve 153 of the carrier is lowered faster than the water pipe. Finally, by using the flat cooling duct with high thermal conductivity material to cool the carrier, the temperature change curve 154 of the carrier has the fastest temperature drop rate. For example, as shown in the second figure, the high thermal conductivity material used is aluminum powder, and the soft material is silicone rubber, wherein the addition ratio of aluminum powder is 30%, and the thermal conductivity of the rubber can be increased from the original 0.7 W/mk. To 1.4W/mk. The aluminum powder can be added up to 70% and the heat transfer coefficient can reach 2.6 W/m-k. Furthermore, the above high thermal conductive material may also be Al, AU, Ag, Cu, AlN, Al2O3, SiC, BeO, diamond powder, carbon material, graphite, silicon, silica, BN or a mixture thereof, or the above materials. The material after nanocrystallization or a mixture thereof; the heat transfer coefficient of the high thermal conductive materials may be between 0.5 and 1500 W/mk, and the heat transfer coefficient of the preferred high thermal conductive material is 50 w/mk or more. In order to achieve a higher heat exchange efficiency of the flat cooling duct.

第3圖係繪示本揭露之冷源膠體與冰相比較的溫度變化曲線圖。 Figure 3 is a graph showing the temperature change of the cold source colloid of the present disclosure compared with ice.

如圖所示,當使用250克的冰與100克的水作溫度量測時,在純水相變化(冰與水共存)之過程中,溫度變化曲 線161之溫度上升斜率171較小,但在相變化結束(冰全部溶化為水)後,溫度變化曲線161之溫度上升斜率172則快速變大。 As shown in the figure, when using 250 grams of ice and 100 grams of water for temperature measurement, the temperature changes during the pure water phase change (ice and water coexist) The temperature rise slope 171 of the line 161 is small, but after the phase change is completed (the ice is completely dissolved into water), the temperature rise slope 172 of the temperature change curve 161 rapidly increases.

但是,在本揭露之冷源膠體中,當使用250克的冷源膠體與100克的水作溫度量測時,溫度變化曲線162之溫度上升斜率173則較為趨緩,不會產生太大的變化,故可降低溫度之波動幅度。 However, in the cold source colloid of the present disclosure, when 250 g of cold source colloid and 100 g of water are used for temperature measurement, the temperature rise slope 173 of the temperature change curve 162 is slower and does not cause too much Changes can reduce the fluctuation of temperature.

綜上所述,本揭露之冷卻裝置至少具有下列的功效: In summary, the cooling device of the present disclosure has at least the following effects:

(1)利用高導熱材料構成該平板式冷卻導管,並將該平板部貼覆於該載體上,使該導通孔內之冷卻液藉由該平板部與該載體間之大接觸面積進行熱交換,以提高該平板式冷卻導管之熱交換效率,進而降低該載體之溫度與人體之體溫。 (1) constituting the flat-plate cooling duct by a highly thermally conductive material, and attaching the flat plate portion to the carrier, so that the coolant in the via hole is heat-exchanged by a large contact area between the flat plate portion and the carrier In order to improve the heat exchange efficiency of the flat cooling duct, thereby reducing the temperature of the carrier and the body temperature of the human body.

(2)利用該冷源膠體對該導通孔內之冷卻液進行熱交換,以降低該冷卻液之溫度上升斜率或速度,或降低該冷卻液之溫度。同時,透過該冷源膠體的低熱傳性質,可提高該冷卻裝置之持續時間,並降低溫度的波動幅度。 (2) The cold source colloid is used to exchange heat between the coolant in the via hole to lower the temperature rise slope or velocity of the coolant or to lower the temperature of the coolant. At the same time, the low heat transfer property of the cold source colloid can increase the duration of the cooling device and reduce the fluctuation range of the temperature.

(3)利用該控制單元開啟或關閉該冷卻液於該導管部內之循環流動,或調整該冷卻液於該導管部內之循環方向,可提升該冷卻裝置之持續時間及熱交換效率。 (3) The control unit is used to open or close the circulation flow of the coolant in the duct portion, or adjust the circulation direction of the coolant in the duct portion, thereby improving the duration of the cooling device and the heat exchange efficiency.

上述實施形態僅例示性說明本揭露之原理、特點及其功效,並非用以限制本揭露之可實施範疇,任何熟習此項技藝之人士均可在不違背本揭露之精神及範疇下,對上述實施形態進行修飾與改變。任何運用本揭露所揭示內容而 完成之等效改變及修飾,均仍應為下述之申請專利範圍所涵蓋。因此,本揭露之權利保護範圍,應如後述之申請專利範圍所列。 The above-described embodiments are merely illustrative of the principles, features, and functions of the present disclosure, and are not intended to limit the scope of the present disclosure. Any person skilled in the art can practice the above without departing from the spirit and scope of the disclosure. The embodiment is modified and changed. Any use of the disclosure of this disclosure Equivalent changes and modifications to the completion should still be covered by the scope of the patent application below. Therefore, the scope of protection of the present disclosure should be as set forth in the scope of the patent application described later.

100‧‧‧冷卻裝置 100‧‧‧Cooling device

110‧‧‧載體 110‧‧‧ Carrier

120‧‧‧平板式冷卻導管 120‧‧‧Plate cooling duct

121‧‧‧導管部 121‧‧‧Tube Department

122‧‧‧平板部 122‧‧‧ Flat section

123‧‧‧導通孔 123‧‧‧Through hole

124、125‧‧‧循環方向 124, 125‧‧ ‧ circulation direction

130‧‧‧容器 130‧‧‧ Container

131‧‧‧冷源膠體 131‧‧‧cold source colloid

132‧‧‧水 132‧‧‧ water

133‧‧‧包覆物 133‧‧‧Wraps

140‧‧‧控制單元 140‧‧‧Control unit

151、152、153、154、161、162‧‧‧溫度變化曲線 151, 152, 153, 154, 161, 162 ‧ ‧ temperature curve

171、172、173‧‧‧溫度上升斜率 171, 172, 173‧‧‧ temperature rise slope

AA‧‧‧連線 AA‧‧‧ connection

第1A圖係繪示本揭露之冷卻裝置的平面示意圖;第1B圖係繪示本揭露第1A圖中冷卻裝置之平板式冷卻導管於連線AA的剖面示意圖;第2圖係繪示本揭露具高導熱材料之平板式冷卻導管與其他冷卻方式相比較的溫度變化曲線圖;以及第3圖係繪示本揭露之冷源膠體與冰相比較的溫度變化曲線圖。 1A is a schematic plan view of a cooling device according to the present disclosure; FIG. 1B is a schematic cross-sectional view showing a flat cooling duct of the cooling device of FIG. 1A in a line AA; FIG. 2 is a schematic view showing the disclosure A graph of the temperature change of a flat-plate cooling duct with a highly thermally conductive material compared to other cooling methods; and Figure 3 is a graph showing the temperature profile of the cold source colloid of the present disclosure compared to ice.

100‧‧‧冷卻裝置 100‧‧‧Cooling device

110‧‧‧載體 110‧‧‧ Carrier

120‧‧‧平板式冷卻導管 120‧‧‧Plate cooling duct

121‧‧‧導管部 121‧‧‧Tube Department

122‧‧‧平板部 122‧‧‧ Flat section

123‧‧‧導通孔 123‧‧‧Through hole

124、125‧‧‧循環方向 124, 125‧‧ ‧ circulation direction

130‧‧‧容器 130‧‧‧ Container

131‧‧‧冷源膠體 131‧‧‧cold source colloid

132‧‧‧水 132‧‧‧ water

133‧‧‧包覆物 133‧‧‧Wraps

140‧‧‧控制單元 140‧‧‧Control unit

AA‧‧‧連線 AA‧‧‧ connection

Claims (10)

一種冷卻裝置,其包括:載體;以及平板式冷卻導管,由高導熱材料所構成,係設置於該載體上或該載體內,並包括:導管部,係具有導通孔,用以傳導冷卻液;以及平板部,係貼覆於該載體,使該冷卻液藉由該平板部與該載體間之接觸面積進行熱交換。 A cooling device comprising: a carrier; and a flat cooling duct composed of a highly thermally conductive material disposed on or in the carrier, and comprising: a conduit portion having a through hole for conducting a coolant; And a flat portion attached to the carrier to exchange heat between the flat portion and the contact area of the support. 如申請專利範圍第1項所述之冷卻裝置,其中,該載體係為衣物、被褥、床墊、椅墊、坐墊或背墊。 The cooling device of claim 1, wherein the carrier is a garment, a bedding, a mattress, a seat cushion, a seat cushion or a back cushion. 如申請專利範圍第1項所述之冷卻裝置,其中,該平板式冷卻導管係由軟性材料混合該高導熱材料所構成。 The cooling device according to claim 1, wherein the flat cooling duct is composed of a soft material mixed with the high heat conductive material. 如申請專利範圍第3項所述之冷卻裝置,其中,該軟性材料係為矽膠、乳膠、橡膠、矽膠玻纖、尼龍、鐵氟龍、聚氨酯(PU)、聚乙烯(PE)、聚丙烯(PP)、聚氯乙烯(PVC)、聚偏二氟乙烯(PVDF)、全氟烷氧基碳氟化合物(PFA)、聚全氟乙丙烯(FEP)或丙烯-丁二烯-苯乙烯樹脂(ABS)。 The cooling device according to claim 3, wherein the soft material is silicone, latex, rubber, silicone fiber, nylon, Teflon, polyurethane (PU), polyethylene (PE), polypropylene ( PP), polyvinyl chloride (PVC), polyvinylidene fluoride (PVDF), perfluoroalkoxy fluorocarbon (PFA), polyperfluoroethylene propylene (FEP) or propylene-butadiene-styrene resin ( ABS). 如申請專利範圍第1項所述之冷卻裝置,其中,該高導熱材料係為Al、AU、Ag、Cu、AlN、Al2O3、SiC、BeO、鑽石粉末、碳材、graphite、silicon、silica、BN或其混合材料,或為經奈米化後之Al、AU、Ag、Cu、AlN、 Al2O3、SiC、BeO、鑽石粉末、碳材、graphite、silicon、silica、BN或其混合材料。 The cooling device according to claim 1, wherein the high thermal conductivity material is Al, AU, Ag, Cu, AlN, Al2O3, SiC, BeO, diamond powder, carbon material, graphite, silicon, silica, BN. Or a mixed material thereof, or after nanocrystallization, Al, AU, Ag, Cu, AlN, Al2O3, SiC, BeO, diamond powder, carbon material, graphite, silicon, silica, BN or a mixture thereof. 如申請專利範圍第1項所述之冷卻裝置,其中,該導管部之截面形狀係為圓形或橢圓形,該平板部之截面形狀係為長方形。 The cooling device according to claim 1, wherein the cross-sectional shape of the duct portion is circular or elliptical, and the cross-sectional shape of the flat portion is rectangular. 如申請專利範圍第1項所述之冷卻裝置,其中,該冷卻液係為水、冰水或其混合物。 The cooling device according to claim 1, wherein the cooling liquid is water, ice water or a mixture thereof. 如申請專利範圍第1項所述之冷卻裝置,復包括冷源膠體,係用以與該導通孔內之冷卻液進行熱交換。 The cooling device according to claim 1, further comprising a cold source colloid for heat exchange with the coolant in the via hole. 如申請專利範圍第8項所述之冷卻裝置,復包括容器,係用以容置該冷源膠體,該導管部通過該容器。 The cooling device of claim 8, further comprising a container for accommodating the cold source colloid, the conduit portion passing through the container. 如申請專利範圍第1項所述之冷卻裝置,復包括控制單元,係連接該導管部,用以開啟或關閉該冷卻液於該導管部內之循環流動,或用以調整該冷卻液於該導管部內之循環方向。 The cooling device according to claim 1, further comprising a control unit connected to the conduit portion for opening or closing a circulating flow of the coolant in the conduit portion, or for adjusting the coolant to the conduit The direction of circulation within the department.
TW101133084A 2012-09-11 2012-09-11 Cooling apparatus TW201411084A (en)

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US13/965,897 US20140069613A1 (en) 2012-09-11 2013-08-13 Cooling apparatus having a cooling conduit

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US6105659A (en) * 1996-09-12 2000-08-22 Jaro Technologies, Inc. Rechargeable thermal battery for latent energy storage and transfer
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