CN202938545U - Refrigeration system and chair and bed both employing same - Google Patents
Refrigeration system and chair and bed both employing same Download PDFInfo
- Publication number
- CN202938545U CN202938545U CN 201220551899 CN201220551899U CN202938545U CN 202938545 U CN202938545 U CN 202938545U CN 201220551899 CN201220551899 CN 201220551899 CN 201220551899 U CN201220551899 U CN 201220551899U CN 202938545 U CN202938545 U CN 202938545U
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- refrigeration system
- radiator
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- cold
- cold dish
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Abstract
The utility model relates to a refrigeration system and a chair and a bed both employing the same. The refrigeration system comprises a semiconductor refrigeration piece, a cold gathering disc, a radiator and a heat dissipation fan, wherein a lower heat preservation layer is arranged at the bottom of the cold gathering disc; the cold face of the semiconductor refrigeration piece passes the lower heat preservation layer and is pasted with the cold gathering disc; and the refrigeration system is characterized in that a plurality of bulges are formed at the bottom of the radiator, the heat dissipation fan is fixed at the end parts of the bulges of the radiator, and the cold gathering disc is made of copper or aluminium, and takes the shape of a bell mouth. The refrigeration system realizes refrigeration through the semiconductor refrigeration piece, and is safe, energy-saving, low in cost, compact in structure and convenient for use.
Description
Technical field
The utility model relates to a kind of semiconductor chilling plate refrigeration system and application thereof.
Background technology
Semiconductor chilling plate is an instrument that heat is transmitted.When the thermocouple centering be coupled to when a N-type semiconductor material and P-type semiconductor material has electric current to pass through, between two ends, will produce transfer of heat, heat will be transferred to the other end from an end, thereby produce the temperature difference, forms cold and hot end.But semiconductor self will produce heat while existing resistance to work as electric current through semiconductor, thereby can affect heat transmission.And the heat between two pole plates also can carry out reverse heat by air and semi-conducting material self and transmits.When cold and hot end reaches a fixed difference difference, when the amount of these two kinds heat transmission equates, will reach an equalization point, just reverse heat transmission is cancelled out each other.Now the temperature of cold and hot end just can not continue to change.In order to reach lower temperature, the temperature that can take the modes such as heat radiation to reduce hot junction realizes.The effect of fan and fin is mainly the hot-side heat dissipation for cooling piece.Usually the temperature difference of the cold and hot end of semiconductor chilling plate can reach between 40～65 degree, if reduce hot-side temperature by the mode of active heat removal, that cold junction temperature also can descend accordingly, thereby reaches lower temperature.
Adopt the refrigeration system that semiconductor chilling plate is made to there is noiseless, friction, do not need cold-producing medium, volume is little, lightweight, energy-saving safe, with low cost, compact conformation, the convenient advantage of using.At present, aspect electronic device, medicine equipment, household electrical appliance, be widely used.The problems such as but semiconductor refrigeration system now on the market mostly exists radiating rate slower, and refrigerating efficiency is lower.
The utility model content
The utility model purpose is to provide a kind of refrigeration system, slower to solve radiating rate, the problem that refrigerating efficiency is low.
For achieving the above object, the utility model provides a kind of refrigeration system, a kind of refrigeration system, comprise semiconductor chilling plate, poly-cold dish, radiator, radiator fan, wherein lower heat-insulation layer is arranged at the bottom of poly-cold dish, the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate is affixed through lower heat-insulation layer and poly-cold dish, hot side and the radiator of semiconductor chilling plate are affixed, it is characterized in that, the bottom of described radiator comprises several projections, radiator fan is fixed in the end of the projection of radiator, and the material of poly-cold dish is copper or aluminium, gathers the bell mouth shape that is shaped as of cold dish.
Preferably, also comprise temperature sensor, temperature sensor is installed on the bottom of poly-cold dish, and temperature sensor is connected with semiconductor chilling plate by control circuit.
Preferably, radiator top is airtight container, and liquid is housed in airtight container.
Preferably, upper heat-insulation layer is arranged at the top of poly-cold dish.
Preferably, aluminium or rivet made of copper are arranged on heat-insulation layer.
Preferably, semiconductor chilling plate is at least one.
Further application as above-mentioned refrigeration system, one or more refrigeration systems can be fixed on to the bottom of seat or the back side of the chair back, the bottom that also can one or more refrigeration systems be fixed on mattress, reduce the temperature of seat or the chair back or mattress in time, is applicable to using summer.
The utlity model has following beneficial effect: (1) heat radiation is very fast, and refrigerating efficiency is high; (2) conduction efficiency is high, and poly-cold dish makes to be made of aluminum or copper, and conduction efficiency is higher, easily processes, is difficult for corrosion, and relative cost is moderate.(3) top of poly-cold dish arranges heat-insulation layer, hinders poly-cold dish and directly contacts with outside air, poly-cold better effects if.(4) refrigerating capacity is controlled, after connecting temperature sensor, and the signal that can send to control circuit according to the variations in temperature of environment, thereby the refrigerating capacity of control cooling piece.
Except purpose described above, feature and advantage, the utility model also has other purpose, feature and advantage.Below, with reference to figure, the utility model is described in further detail.
The accompanying drawing explanation
The accompanying drawing that forms the application's a part is used to provide further understanding of the present utility model, and schematic description and description of the present utility model, for explaining the utility model, does not form improper restriction of the present utility model.In the accompanying drawings:
Fig. 1 is the schematic diagram of the utility model preferred embodiment;
Fig. 2 is the schematic diagram of the utility model preferred embodiment radiator;
Fig. 3 is the schematic diagram of the poly-cold dish of the utility model preferred embodiment;
Fig. 4 is the schematic diagram of the utility model preferred embodiment;
Fig. 5 is the schematic diagram of the utility model preferred embodiment.
Description of symbols:
1, semiconductor chilling plate; 2, poly-cold dish; 3, radiator; 4, radiator fan;
5, lower heat-insulation layer; 6, projection; 7, upper heat-insulation layer.
The specific embodiment
Below in conjunction with accompanying drawing, embodiment of the present utility model is elaborated, but the multitude of different ways that the utility model can limit and cover according to claim is implemented.
Referring to Fig. 1, Fig. 2 and Fig. 3, a kind of refrigeration system, comprise semiconductor chilling plate 1, poly-cold dish 2, radiator 3, radiator fan 4, wherein lower heat-insulation layer 5 is arranged at the bottom of poly-cold dish 2, the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate 1 is affixed with poly-cold dish 2 through lower heat-insulation layer 5, the hot side of semiconductor chilling plate 1 and radiator 3 are affixed, radiator 3 one ends are plane, the other end is several projections 6, radiator fan 4 is fixed in the end of the projection 6 of radiator 3, the material of poly-cold dish 2 is copper or aluminium, after semiconductor chilling plate 1 energising, the side of refrigeration passes to poly-cold dish 2 by the refrigerating capacity of generation, can effectively prevent that because lower heat-insulation layer 5 is arranged at the bottom of gathering cold dish 2 refrigerating capacity runs off, the heat that the hot side of semiconductor chilling plate 1 produces discharges in time by radiator 3 and radiator fan 4, so that the temperature of the hot side of semiconductor chilling plate 1 descends in time.And poly-cold dish 2 makes to be made of aluminum or copper, the refrigerating capacity conduction efficiency is higher, and poly-cold dish 2 easily processes, is difficult for corrosion with ining addition, and the advantage that relative cost is moderate, gather cold dish 2 to can be bell mouth shape, up big and down small, can conduct more uniformly temperature.For reaching reasonable cold effect processed, the semiconductor chilling plate 1 in refrigeration system also can be used a plurality of.
Can also do further improvement to above-described embodiment, the bottom of poly-cold dish 2 fills a temperature sensor, temperature sensor is connected with semiconductor chilling plate 1 by control circuit, temperature sensor can send signal to control circuit according to the variation of environment temperature like this, thereby control the voltage swing of cooling piece, reach the effect that increases or subtract of controlling refrigerating capacity.
In order to obtain better effect, heat-insulation layer 5 on can also increasing at the top of poly-cold dish 2, hinder poly-cold dish 2 and directly contact with outside air, makes poly-cold effect better; Aluminium or rivet made of copper can also be installed on upper heat-insulation layer 5, and aluminium or rivet thermal diffusivity made of copper are relatively good, and when upper heat-insulation layer 5 contacts with heat, a part of heat can shed heat by rivet, the radiating efficiency of raising.
Find through experiment, airtight container is made in radiator 3 tops, liquid is housed in airtight container, the heat of cooling piece is the liquid absorption of sealed container first, again heat is reached to projection 6 ends of radiator 3, then by radiator fan 4 fast by heat to flowing in air, radiating efficiency is higher.
The application also provides a kind of chair that comprises above-mentioned refrigeration system, and one or more refrigeration systems are fixed on to the seat bottom of chair or the back side of the chair back, can reduce in time the temperature of seat or the chair back, is applicable to using summer.
The application also provides a kind of bed that comprises above-mentioned refrigeration system, one or more refrigeration systems is fixed on to the mattress base of bed, can reduce in time the temperature of mattress, is applicable to using summer.
The foregoing is only preferred embodiment of the present utility model, be not limited to the utility model, for a person skilled in the art, the utility model can have various modifications and variations.All within spirit of the present utility model and principle, any modification of doing, be equal to replacement, improvement etc., within all should being included in protection domain of the present utility model.
Claims (10)
1. a refrigeration system, comprise semiconductor chilling plate, poly-cold dish, radiator, radiator fan, wherein lower heat-insulation layer is arranged at the bottom of poly-cold dish, the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate is affixed through lower heat-insulation layer and poly-cold dish, and hot side and the radiator of semiconductor chilling plate are affixed, and it is characterized in that, the bottom of described radiator comprises several projections, radiator fan is fixed in the end of the projection of radiator, and the material of poly-cold dish is copper or aluminium, gathers the bell mouth shape that is shaped as of cold dish.
2. refrigeration system according to claim 1, characterized by further comprising temperature sensor, and temperature sensor is installed on the bottom of poly-cold dish, and temperature sensor is connected with semiconductor chilling plate by control circuit.
3. refrigeration system according to claim 1 and 2, is characterized in that described radiator top is airtight container, and liquid is housed in airtight container.
4. refrigeration system according to claim 1 and 2, is characterized in that upper heat-insulation layer is arranged at the top of described poly-cold dish.
5. refrigeration system according to claim 4, is characterized in that on described upper heat-insulation layer having aluminium or rivet made of copper.
6. refrigeration system according to claim 5, is characterized in that, semiconductor chilling plate is at least one.
7. a chair that comprises refrigeration system as claimed in claim 1, is characterized in that, refrigeration system is fixed on the bottom of seat or the back side of the chair back.
8. chair according to claim 7, is characterized in that, described refrigeration system is at least one.
9. a bed that comprises refrigeration system as claimed in claim 1, is characterized in that, refrigeration system is fixed on the bottom of mattress.
10. according to claim 9, its spy is that described refrigeration system is at least one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220551899 CN202938545U (en) | 2012-10-25 | 2012-10-25 | Refrigeration system and chair and bed both employing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220551899 CN202938545U (en) | 2012-10-25 | 2012-10-25 | Refrigeration system and chair and bed both employing same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202938545U true CN202938545U (en) | 2013-05-15 |
Family
ID=48322781
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220551899 Expired - Fee Related CN202938545U (en) | 2012-10-25 | 2012-10-25 | Refrigeration system and chair and bed both employing same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202938545U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106263787A (en) * | 2016-09-25 | 2017-01-04 | 长沙清莲网络科技有限公司 | Refrigeration-type multifunctional bed board |
-
2012
- 2012-10-25 CN CN 201220551899 patent/CN202938545U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106263787A (en) * | 2016-09-25 | 2017-01-04 | 长沙清莲网络科技有限公司 | Refrigeration-type multifunctional bed board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130515 Termination date: 20131025 |