TW201409085A - Lens array, lens arrange manufacturing method and optical element manufacturing method - Google Patents
Lens array, lens arrange manufacturing method and optical element manufacturing method Download PDFInfo
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
- G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
- G02B19/0061—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED
- G02B19/0066—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED in the form of an LED array
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/00009—Production of simple or compound lenses
- B29D11/00278—Lenticular sheets
- B29D11/00307—Producing lens wafers
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
- G02B13/0085—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
- G02B19/0009—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having refractive surfaces only
- G02B19/0014—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having refractive surfaces only at least one surface having optical power
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0012—Arrays characterised by the manufacturing method
- G02B3/0031—Replication or moulding, e.g. hot embossing, UV-casting, injection moulding
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0037—Arrays characterized by the distribution or form of lenses
- G02B3/0056—Arrays characterized by the distribution or form of lenses arranged along two different directions in a plane, e.g. honeycomb arrangement of lenses
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/02—Simple or compound lenses with non-spherical faces
- G02B3/08—Simple or compound lenses with non-spherical faces with discontinuous faces, e.g. Fresnel lens
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Abstract
Description
本發明係關於一種透鏡陣列、透鏡陣列之製造方法及光學元件之製造方法,特別是關於一種適用於光學元件之大量生產的透鏡陣列、透鏡陣列之製造方法及光學元件之製造方法。 The present invention relates to a lens array, a method of manufacturing a lens array, and a method of manufacturing an optical element, and more particularly to a lens array, a method of manufacturing a lens array, and a method of manufacturing an optical element, which are suitable for mass production of optical elements.
例如,在裝著有攝像裝置用透鏡的狀態下,若使模組的外部端子與其他的電路基板連接時的焊接成為使用有回焊步驟的自動安裝則可提高作業效率,因此,近年來,為了能夠耐回流焊接(reflow soldering),而要求具有充分的耐熱性之透鏡。具體而言,回焊爐內的溫度係為了促使焊料再熔融,最高溫度被設定為260℃以上,其後伴隨著溫度降低焊料成分會固化而使模組的外部端子(電接點)連接於電子電路基板上之導體墊,同時亦達成機械性的連接。基於上述之先前技術,逐漸強烈要求耐回流焊接之具有充分的耐熱性之透鏡。另一方面,亦期望以低成本製造多數的透鏡。以低成本製造多數的透鏡之方法,已知有製造於透鏡基板形成了複數之透鏡的晶圓級透鏡陣 列,切斷該透鏡基板使複數之透鏡各自分離藉以將透鏡模組進行量產的方法。 For example, in the state in which the lens for the imaging device is mounted, the welding when the external terminal of the module is connected to another circuit board is automatically mounted by using the reflow step, so that work efficiency can be improved. In order to be able to withstand reflow soldering, a lens having sufficient heat resistance is required. Specifically, the temperature in the reflow furnace is set to 260 ° C or higher in order to promote remelting of the solder, and then the solder component is solidified with the temperature decrease, and the external terminal (electrical contact) of the module is connected to The conductor pads on the electronic circuit board also achieve a mechanical connection. Based on the above prior art, there is a growing demand for a lens having sufficient heat resistance against reflow soldering. On the other hand, it is also desired to manufacture a large number of lenses at low cost. A wafer-level lens array in which a plurality of lenses are formed on a lens substrate is known as a method of manufacturing a plurality of lenses at low cost. The method of cutting the lens substrate to separate the plurality of lenses to mass-produce the lens module.
例如,於專利文獻1中係提案有:於以光學玻璃所形成的透鏡之兩面,直接接著以硬化性樹脂材料所形成的透鏡之接合型複合透鏡。然而,本方法係成為使硬化性樹脂材料接著於玻璃表面的構造,於將透鏡予以個片化時係需要使用有切割刀片的切割。切割係需要專用裝置,且工時(tact)需要十數分鐘左右,因而導致高成本。此外,由於切割時會產生粉屑,因此切割後必須洗淨,且若要成為能夠連微米尺度之塵埃都除去,則需要相當高級的設備,而導致成本更高。 For example, Patent Document 1 proposes a joint type composite lens in which a lens formed of a curable resin material is directly bonded to both surfaces of a lens formed of optical glass. However, this method is a structure in which the curable resin material is adhered to the surface of the glass, and it is necessary to use a cutting blade with a cutting blade when the lens is formed into a sheet. The cutting system requires a dedicated device, and the tact takes about ten minutes, resulting in high cost. In addition, since dust is generated during cutting, it must be washed after cutting, and if it is to be removed by dust of a micron size, relatively advanced equipment is required, resulting in higher cost.
此外,近年來,附相機的行動終端等之攝像性能的提昇雖顯著,但特別是在被攝體為暗的情況中,拍攝鮮明的影像係為困難。因此,最近,藉由閃光等之輔助光源單元,朝向被攝體射出輔助光的方式逐漸發展。輔助光源單元,已知有例如將LED作為光源,使來自LED的射出光通過透鏡以控制該照射角,而將適合攝像的被攝體之範圍加以照明者。然而,可以說是在考量以低成本製造透鏡時,期望將樹脂材料予以成形而製作透鏡。在此,以低成本製造多數之透鏡的方法,已知有製造於透鏡基板形成了複數之透鏡的晶圓級透鏡陣列,切斷該透鏡基板使複數之透鏡各自分離藉以將透鏡模組進行量產的方法。例如,於專利文獻3中係提案有:在將晶圓級透鏡陣列予以成形,並透過間隔物來層合之後,進行切割而將透鏡予以個 片化的方法。 Further, in recent years, although the improvement of the imaging performance of a camera-equipped mobile terminal or the like is remarkable, particularly in the case where the subject is dark, it is difficult to capture a clear image. Therefore, recently, an auxiliary light source unit such as a flash has gradually developed a method of emitting auxiliary light toward a subject. As the auxiliary light source unit, for example, an LED is used as a light source, and the emitted light from the LED is passed through the lens to control the illumination angle, and the range of the subject suitable for imaging is illuminated. However, it can be said that when a lens is manufactured at a low cost, it is desirable to form a resin by molding a resin material. Here, in a method of manufacturing a plurality of lenses at low cost, a wafer-level lens array in which a plurality of lenses are formed on a lens substrate is known, and the lens substrate is cut to separate the plurality of lenses to thereby measure the amount of the lens module. Production method. For example, Patent Document 3 proposes: after forming a wafer-level lens array and laminating it through a spacer, cutting is performed to give a lens Slice method.
被稱為相機模組的攝像裝置搭載於行動終端,被搭載於作為行動電話機或PDA(Personal Digital Assistant)等之小型化且薄型的電子機器的行動終端,藉此不僅是聲音資訊連影像資訊亦能互相傳送至遠方。此等攝像裝置所使用的攝像元件,係使用CCD型影像感測器或CMOS型影像感測器等之固體攝像元件,近年來,亦邁向攝像元件之高像素化,且謀求高解析、高性能化。另一方面,用以將被攝體像形成於此等攝像元件上的攝像用之透鏡,係為了低成本化,而使用有以可低價大量生產之樹脂材料所形成的透鏡,藉此加工性亦良好且得到非球面形狀,而能夠對應高性能化的要求。此外,行動終端之輔助光源單元所使用的透鏡亦期望高精準度且低成本地進行製造。在此,以低成本製造多數之透鏡的方法,已知有製造於平行平面玻璃板形成了複數之透鏡的透鏡陣列,切斷該玻璃板使複數之透鏡各自分離藉以將透鏡進行量產的方法。例如,於專利文獻1中係提案有:以上述製法將透鏡陣列予以成形,進行切割而將透鏡予以個片化的方法。 An image pickup device called a camera module is mounted on a mobile terminal and is mounted on a mobile terminal that is a small and thin electronic device such as a mobile phone or a PDA (Personal Digital Assistant). Can be transmitted to each other in the distance. In the image pickup device used in the image pickup device, a solid-state image sensor such as a CCD image sensor or a CMOS image sensor is used, and in recent years, the image sensor has been increased in pixel size, and high resolution and high resolution have been sought. Performance. On the other hand, in order to reduce the cost, a lens for imaging which is formed on an image pickup element such as a subject image is processed by using a lens formed of a resin material which can be mass-produced at a low price. The properties are also good and the aspherical shape is obtained, which is compatible with the requirements for high performance. In addition, the lens used for the auxiliary light source unit of the mobile terminal is also expected to be manufactured with high precision and at low cost. Here, a method of manufacturing a plurality of lenses at low cost is known, and a lens array in which a plurality of lenses are formed on a parallel plane glass plate is known, and a method of cutting the glass plates to separate the plurality of lenses to mass-produce the lenses is known. . For example, Patent Document 1 proposes a method of forming a lens array by the above-described manufacturing method, and performing dicing to form a lens.
[專利文獻1]日本專利第3926380號說明書 [Patent Document 1] Japanese Patent No. 3926380
[專利文獻2]日本特開2009-084442號公報 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2009-084442
[專利文獻3]日本特開2011-113075號公報 [Patent Document 3] Japanese Patent Laid-Open Publication No. 2011-113075
[專利文獻4]日本特開2002-264140號公報 [Patent Document 4] Japanese Patent Laid-Open Publication No. 2002-264140
於專利文獻2中係提案有:將多層薄片予以半切割的步驟。切割位置的決定位置,雖有另外設置決定位置用孔,並將該孔作為決定位置用而使銷通過,再進行切割的方式,但有著需要決定位置鑽孔之步驟、需要決定位置鑽孔用刃、以及在半切割刃側需要決定位置銷的課題,因而導致步驟之複雜化與必要構件、裝置之高度化。此外,若增加步驟,則決定位置會因重疊而有精準度不佳的傾向。此外,需要孔、銷用的空間,而有於製品上產生浪費的部分之問題。再者,專利文獻2並非對應於以高精準度為必須之透鏡的製造者。 Patent Document 2 proposes a step of half-cutting a multilayer sheet. The position at which the cutting position is determined is a method in which a hole for determining the position is additionally provided, and the hole is used as a determined position to pass the pin and then cut. However, there is a need to determine the position drilling, and it is necessary to determine the position drilling. The blade and the problem of the position pin need to be determined on the side of the semi-cutting edge, which complicates the steps and heightens the necessary components and devices. In addition, if the steps are added, it is determined that the position tends to be poor due to the overlap. In addition, there is a need for a space for holes and pins, and there is a problem that a waste portion is generated on the product. Further, Patent Document 2 does not correspond to a manufacturer of a lens which is necessary for high precision.
於如專利文獻1、3般之切割裝置為大規模且高價,並且需要高精準度決定位置的情況中,在追加該機構而變得更為高價的同時步驟亦變得複雜。切割步驟本身亦因逐行依序進行,因此耗費時間而給予生產性的影響過大,且切割圖型實質上亦受限於格子狀,因此有透鏡形狀受到限制的問題。除此之外,於切割中會產生細小的切屑,因此洗淨步驟變得不可或缺,洗淨液亦被作為消耗品而必須耗費精神進行處理。亦即,藉由專利文獻1、3的技術所製造之透鏡,係生產性不佳而導致成本增加。除此之 外,藉由切割所切斷的透鏡,與光源組合時會有以下的問題。最近,攝像裝置的像素數係成為如同800萬像素、1200萬像素一般的高度化發展中,於輔助光源單元中,透鏡之光軸與光源之中心的偏心精準度亦需要提昇精準度。但,在藉由切割而加以個片化的透鏡外形中,由於會依存於切割刀片之刃厚度等,而產生某種程度的誤差,因此在將該透鏡與光源組裝時,若將透鏡外形作為基準面而進行決定位置,則在透鏡之光軸與光源中心之間會產生偏心參差,不符規格之製品會增加,而成為使良率惡化之重要原因。 In the case where the cutting device as in Patent Documents 1 and 3 is large-scale and expensive, and it is necessary to determine the position with high precision, the step is complicated by the addition of the mechanism and the price is increased. The cutting step itself is also performed in a row-by-row manner, so that it takes time to give an excessive influence on productivity, and the cutting pattern is substantially limited to a lattice shape, so that there is a problem that the lens shape is limited. In addition to this, fine chips are generated during the cutting, so the washing step becomes indispensable, and the washing liquid is also consumed as a consumable and must be handled with great care. That is, the lens manufactured by the techniques of Patent Documents 1 and 3 is inferior in productivity and causes an increase in cost. In addition to this In addition, by cutting the cut lens, the following problems occur when combined with a light source. Recently, the number of pixels of the image pickup device has become an advanced development as in the case of 8 million pixels and 12 million pixels. In the auxiliary light source unit, the eccentricity accuracy of the optical axis of the lens and the center of the light source also needs to be improved. However, in the shape of the lens which is sliced by dicing, since a certain degree of error occurs depending on the thickness of the blade of the dicing blade, etc., when the lens is assembled with the light source, the lens profile is taken as When the reference position is determined, an eccentricity is generated between the optical axis of the lens and the center of the light source, and the product that does not conform to the specification increases, which is an important cause of deterioration in yield.
相對於專利文獻1、3之技術,基於與先前技術完全相異之觀點,嘗試有對於透鏡陣列不依賴耗費精神之切割而藉由切斷予以個片化。然而,本發明者發現:即使能夠藉由將透鏡陣列割斷來實現透鏡部之個片化,依據樹脂的狀況,也會有因其之脆弱性而在切斷面處產生碎裂或碎屑而產生外觀不良之虞。此外,本發明者亦發現:切斷時之塵埃會附著在透鏡表面,起因於此,會有產生進一步的外觀不良之虞。然而,即使想要藉由樹脂的改良來解決該問題,於先前技術中,也並未對於具體的解決策略有所揭示。例如,在專利文獻4中,菲涅耳透鏡(Fresnel lens)之成形用樹脂,雖記載有在熱硬化型樹脂中添加界面活性劑的內容,但並未提及關於其用途或含量之內容,基本上,菲涅耳透鏡並未準備藉由割斷來製造。 With respect to the techniques of Patent Documents 1 and 3, based on the point of view that is completely different from the prior art, attempts have been made to cut the lens array by cutting it off without undue mentality. However, the present inventors have found that even if the lens portion can be sliced by cutting the lens array, depending on the condition of the resin, cracks or chips may be generated at the cut surface due to the fragility thereof. Produces a flaw in appearance. Further, the inventors have found that dust adheres to the surface of the lens at the time of cutting, and this causes a further appearance defect. However, even if it is desired to solve the problem by the improvement of the resin, in the prior art, no specific solution strategy has been disclosed. For example, in Patent Document 4, a resin for molding a Fresnel lens has a content in which a surfactant is added to a thermosetting resin, but there is no mention about the use or content thereof. Basically, the Fresnel lens is not intended to be manufactured by cutting.
本發明係鑑於該先前技術之問題點而完成者 ,其目的係提供一種能夠以低成本大量生產光學元件的透鏡陣列、透鏡陣列之製造方法及光學元件之製造方法。 The present invention has been completed in view of the problems of the prior art. The object of the invention is to provide a lens array capable of mass-producing optical elements at low cost, a method of manufacturing a lens array, and a method of manufacturing an optical element.
於申請專利範圍第1項所記載之透鏡陣列,係具備排列成陣列狀之複數透鏡部,且具備有:前述複數透鏡部與包圍前述各透鏡部之周圍的凹部為一體成形之樹脂製透鏡層、以及可與前述透鏡層裝脫地接合之黏著薄片,前述透鏡層係以前述凹部為界並在能夠各別脫離的狀態下被接合於前述黏著薄片。 The lens array according to the first aspect of the invention includes the plurality of lens portions arranged in an array, and the resin lens layer integrally formed by the plurality of lens portions and the concave portion surrounding the periphery of each of the lens portions And an adhesive sheet that can be detachably bonded to the lens layer, wherein the lens layer is bonded to the adhesive sheet in a state in which the concave portions are bounded by the concave portion.
於申請專利範圍第2項所記載之透鏡陣列,於申請專利範圍第1項之發明中,前述凹部係至少具有底部為V狀剖面的溝槽,係以可割斷的方式形成前述溝槽。 In the lens array according to the first aspect of the invention, the concave portion has a groove having a V-shaped cross section at the bottom, and the groove is formed in a severable manner.
申請專利範圍第3項所記載之透鏡陣列,於申請專利範圍第2項之發明中,於前述凹部的V狀剖面中之挾角係20°~60°。 The lens array according to claim 3, wherein in the invention of claim 2, the angle of the V-shaped cross section of the recess is 20 to 60 degrees.
申請專利範圍第4項所記載之透鏡陣列,於申請專利範圍第2項或第3項之發明中,於前述溝槽的底部之前述透鏡陣列的最小厚度係為20μm~150μm。 The lens array according to claim 4, wherein in the invention of claim 2 or 3, the minimum thickness of the lens array at the bottom of the trench is 20 μm to 150 μm.
申請專利範圍第5項所記載之透鏡陣列,於申請專利範圍第2項~第4項中任一項之發明中,前述凹部係進一步具有決定位置用之基準面,且前述透鏡部與前述基準面係藉由模而一體成形。 The lens array according to any one of claims 2 to 4, wherein the concave portion further has a reference surface for determining a position, and the lens portion and the reference The dough is integrally formed by a mold.
申請專利範圍第6項所記載之透鏡陣列,於 申請專利範圍第5項之發明中,前述基準面係由前述V狀剖面的溝槽之斜面所構成。 Applying the lens array described in item 6 of the patent scope, In the invention of claim 5, the reference surface is formed by a slope of the groove of the V-shaped cross section.
申請專利範圍第7項所記載之透鏡陣列,於申請專利範圍第5項之發明中,前述基準面係由鄰接於前述溝槽所形成的缺口所構成。 In the lens array according to claim 5, in the invention of claim 5, the reference surface is formed by a notch formed adjacent to the groove.
申請專利範圍第8項所記載之透鏡陣列,於申請專利範圍第2項~第7項中任一項之發明中,構成前述透鏡陣列的樹脂係為能量硬化性樹脂。 In the lens array according to any one of the second to seventh aspects of the invention, the resin constituting the lens array is an energy curable resin.
申請專利範圍第9項所記載之透鏡陣列,於申請專利範圍第2項~第8項中任一項之發明中,前述透鏡層係由使用模來將能量硬化性樹脂組成物加以成形的能量硬化性樹脂所構成,該能量硬化性樹脂組成物係含有聚合性單體、以及具有與前述聚合性組成物之官能基進行化學反應而形成鍵結的官能基,且數量平均分子量1000~50000之改質聚矽氧。 In the invention of any one of the second to eighth aspects of the invention, the lens layer is an energy for forming an energy curable resin composition by using a mold. The energy curable resin composition contains a polymerizable monomer and a functional group having a chemical reaction with a functional group of the polymerizable composition to form a bond, and has a number average molecular weight of 1,000 to 50,000. Modification of polyoxane.
申請專利範圍第10項所記載之透鏡陣列,於申請專利範圍第9項之發明中,於前述改質聚矽氧係數量平均分子量為1000~30000。 The lens array according to claim 10, wherein in the invention of claim 9, the average molecular weight of the modified polysiloxane coefficient is from 1,000 to 30,000.
申請專利範圍第11項所記載之透鏡陣列,於申請專利範圍第9項或第10項之發明中,於前述能量硬化性樹脂組成物之前述改質聚矽氧的含量係0.5~10重量%。 The lens array according to claim 11, wherein in the invention of claim 9 or 10, the content of the modified polyfluorene oxide in the energy curable resin composition is 0.5 to 10% by weight. .
申請專利範圍第12項所記載之透鏡陣列,於申請專利範圍第9項~第11項中任一項之發明中,前述 改質聚矽氧係具有2官能以上之官能基。 The lens array according to claim 12, wherein in the invention of any one of claim 9 to 11, the aforementioned The modified polyoxygenated system has a functional group having two or more functional groups.
申請專利範圍第13項所記載之透鏡陣列,於申請專利範圍第9項~第12項中任一項之發明中,前述能量硬化性樹脂係為紫外線硬化性樹脂或熱硬化性樹脂。 In the invention of any one of the inventions, the energy curable resin is an ultraviolet curable resin or a thermosetting resin.
申請專利範圍第14項所記載之透鏡陣列,於申請專利範圍第9項~第13項中任一項之發明中,前述能量硬化性樹脂係為環氧系能量硬化性樹脂或丙烯酸系能量硬化性樹脂。 In the invention according to any one of claims 9 to 13, wherein the energy curable resin is an epoxy energy curable resin or an acrylic energy hardening. Resin.
申請專利範圍第15項所記載之透鏡陣列,於申請專利範圍1項之發明中,於前述透鏡層中係於前述凹部的底部形成有切入部,且至少一部分之前述切入部到達前述黏著薄片,但並未貫穿前述黏著薄片。 The lens array according to claim 15 of the invention, wherein in the lens layer, a cut portion is formed in a bottom portion of the concave portion, and at least a part of the cut portion reaches the adhesive sheet. However, it does not penetrate the aforementioned adhesive sheet.
申請專利範圍第16項所記載之透鏡陣列,於申請專利範圍15項之發明中,前述透鏡層係於前述凹部具有V溝槽,前述V溝槽的角度為30°~60°,且前述切入部係形成於前述V溝槽的底部。 The lens array according to claim 16 of the invention, wherein the lens layer has a V groove in the concave portion, the V groove has an angle of 30° to 60°, and the cutting in The part is formed at the bottom of the aforementioned V-groove.
申請專利範圍第17項所記載之透鏡陣列,於申請專利範圍第15項或第16項之發明中,構成前述透鏡陣列的樹脂係為能量硬化性樹脂。 In the lens array according to the fifteenth or sixteenth aspect of the invention, the resin constituting the lens array is an energy curable resin.
申請專利範圍第18項所記載之透鏡陣列,於申請專利範圍第15項~第17項中任一項之發明中,前述黏著薄片與前述透鏡層之間具有樹脂層,前述切入部係貫穿前述樹脂層,但並未貫穿前述黏著薄片。 The lens array according to any one of claims 15 to 17, wherein the adhesive sheet and the lens layer have a resin layer, and the cut-in portion penetrates through the foregoing The resin layer does not penetrate the aforementioned adhesive sheet.
申請專利範圍第19項所記載之透鏡陣列,於 申請專利範圍第18項之發明中,於前述樹脂層之與前述透鏡層相反側的面係塗佈有透明無機層。 Applying for the lens array described in item 19 of the patent scope, In the invention of claim 18, the surface of the resin layer opposite to the lens layer is coated with a transparent inorganic layer.
申請專利範圍第20項所記載之透鏡陣列,於申請專利範圍第1項~第19項中任一項之發明中,前述透鏡部係排列成一列。 The lens array according to any one of claims 1 to 19, wherein the lens portions are arranged in a line.
申請專利範圍第21項所記載之透鏡陣列,於申請專利範圍第1項~第20項中任一項之發明中,前述透鏡部係光軸方向剖面為閃電(blaze)形狀。 The lens array according to any one of claims 1 to 20, wherein the lens portion has a blaze shape in the optical axis direction.
申請專利範圍第22項所記載之透鏡陣列,於申請專利範圍第1項~第21項中任一項之發明中,前述透鏡部的背面係為平面。 The lens array according to any one of the first to twenty-first aspects of the invention, wherein the back surface of the lens portion is a flat surface.
申請專利範圍第23項所記載之透鏡陣列之製造方法,係具有形成排列成陣列狀之複數透鏡部的樹脂製透鏡層之透鏡陣列之製造方法,其特徵為,使用具有轉印面的模來將樹脂予以成形,再從模脫模,而製作前述透鏡層,該轉印面係包含對應於前述複數透鏡部之第1部位、以及包圍前述第1部位的周圍之凸狀第2部位,將能夠裝脫的黏著薄片接合於前述成形物,且接合有前述黏著薄片的前述透鏡層之前述各透鏡部係以前述凹部為界而成為能夠各別脫離的狀態。 The method for producing a lens array according to claim 23, wherein the method of manufacturing a lens array having a resin lens layer in which a plurality of lens portions arranged in an array are formed is characterized in that a mold having a transfer surface is used The resin is molded and released from the mold to form the lens layer, and the transfer surface includes a first portion corresponding to the plurality of lens portions and a convex second portion surrounding the periphery of the first portion, and is capable of being mounted The detached adhesive sheet is bonded to the molded article, and each of the lens portions of the lens layer to which the adhesive sheet is bonded is in a state of being detachable from each other by the concave portion.
申請專利範圍第24項所記載之透鏡陣列之製造方法,於申請專利範圍第23項之發明中,藉由前述成形而形成能夠割斷的深度之凹部,藉以使接合有前述黏著薄片的前述透鏡層之前述各透鏡部以前述凹部為界而成為 能夠各別脫離的狀態。 The method of manufacturing a lens array according to claim 24, wherein in the invention of claim 23, the recessed portion having a depth that can be cut is formed by the forming, whereby the lens layer to which the adhesive sheet is bonded is formed Each of the lens portions is defined by the concave portion A state that can be separated from each other.
申請專利範圍第25項所記載之透鏡陣列之製造方法,於申請專利範圍第23項之發明中,以藉由前述溝槽一邊導引一邊插入切斷刀,且至少一部分到達前述黏著薄片,但不貫穿前述黏著薄片的方式形成切入部,藉以使前述透鏡層之前述各透鏡部以前述凹部為界而成為能夠各別脫離的狀態。 The method of manufacturing a lens array according to claim 25, wherein in the invention of claim 23, the cutting blade is inserted while being guided by the groove, and at least a part of the adhesive sheet is reached. The cut portion is formed so as not to penetrate the adhesive sheet, so that the respective lens portions of the lens layer can be separated from each other by the concave portion.
申請專利範圍第26項所記載之光學元件之製造方法,其係沿著前述溝槽割斷如申請專利範圍第2項~第14項中任一項所記載之透鏡陣列,而將每一前述透鏡部予以個片化。 The method of manufacturing an optical element according to claim 26, wherein the lens array according to any one of claims 2 to 14 is cut along the groove, and each of the lenses is The Ministry will be sliced.
申請專利範圍第27項所記載之光學元件之製造方法,於申請專利範圍第26項之發明中,前述割斷係藉由於相鄰接之前述透鏡部彼此分離的方向賦予前述透鏡陣列力量而進行。 In the invention of claim 26, in the invention of claim 26, the cutting is performed by applying a force to the lens array in a direction in which the adjacent lens portions are separated from each other.
申請專利範圍第28項所記載之光學元件之製造方法,其係將前述透鏡層從如申請專利範圍第15項~第18項中任一項所記載之透鏡陣列的前述黏著薄片剝離而取出。 The method of producing an optical element according to the invention of claim 28, wherein the lens layer is peeled off from the adhesive sheet of the lens array according to any one of claims 15 to 18.
接著,針對本發明之較佳的構造進行說明。 Next, a preferred configuration of the present invention will be described.
本發明之透鏡陣列係以形成有排列成陣列狀的複數透鏡部之樹脂製透鏡層、以及與前述透鏡層接合之樹脂製基底層所構成的透鏡陣列薄片,其特徵為,於前述透鏡層係於前述透鏡部的周圍形成有切入部,且至少一部 分的前述切入部係到達前述基底層,但並未貫穿前述基底層。 The lens array of the present invention is a lens array sheet comprising a resin lens layer formed with a plurality of lens portions arranged in an array and a resin base layer bonded to the lens layer, wherein the lens layer is a cut-in portion is formed around the lens portion, and at least one portion is formed The aforementioned cut-in portion reaches the base layer but does not penetrate the base layer.
若使用專利文獻1等所揭示的透鏡陣列,則由於能夠暫時製造較多的透鏡,因此生產性優異。但,將如此之透鏡陣列予以個片化時必須進行切割。切割大多在辨識對準符號等之記號而決定位置之後進行,故可列舉需要附對準符號決定位置功能的切碎機(dicer)的情況、為了逐行進行切割而為延長工時的情況、以及必須將切屑洗淨的情況等阻礙生產性的主要原因。 When the lens array disclosed in Patent Document 1 or the like is used, since a large number of lenses can be temporarily produced, productivity is excellent. However, cutting must be performed when such a lens array is sliced. Since the cutting is performed after the position of the alignment symbol or the like is recognized and the position is determined, the case where the dicer is required to determine the position function by the alignment symbol, and the case where the cutting is performed line by line to extend the working time, In addition, it is necessary to wash the chips, and the main reason for hindering productivity.
相對於此,若依據本發明,則於前述透鏡層係於透鏡部的周圍形成有切入部,且至少一部分的前述切入部係到達前述基底層,但並未貫穿前述基底層,因此前述透鏡部對於前述基底層幾乎可僅以其之間的黏著力加以保持,藉此,可容易地將前述透鏡層剝離成各透鏡部每一者,因而,可以短的工時予以精準度佳地個片化,且就省卻洗淨步驟的觀點而言具有優勢,而能夠以低成本大量生產光學元件。 On the other hand, according to the present invention, the lens layer is formed with a cut portion around the lens portion, and at least a part of the cut portion reaches the base layer, but the base portion is not penetrated. The base layer can be held by almost only the adhesive force therebetween, whereby the lens layer can be easily peeled off into each of the lens portions, so that the sheet can be accurately prepared with a short working time. It is advantageous in terms of eliminating the washing step, and it is possible to mass-produce optical components at low cost.
前述透鏡層係具有形成於前述透鏡部的周圍之V溝槽,且前述V溝槽的角度為30~60°,前述切入部係以形成於前述V溝槽的底部為佳。若於前述透鏡部的周圍形成V溝槽,進而前述V溝槽的角度為30~60°,則由於可順利地導引插入前述V溝槽的切斷刀,因此確保數μ尺度的決定位置精準度,同時可形成前述切入部。 The lens layer has a V-groove formed around the lens portion, and the V-groove has an angle of 30 to 60°, and the cut-in portion is preferably formed at a bottom portion of the V-groove. When the V-groove is formed around the lens portion, and the angle of the V-groove is 30 to 60°, the cutting blade inserted into the V-groove can be smoothly guided, thereby ensuring the determination position of the number μ scale. Accuracy, at the same time can form the aforementioned cut-in portion.
前述透鏡部的外形係以圓形為佳。由於前述 透鏡部的外形圓滑,因此具有不易因衝孔步驟或熱衝擊等而發生龜裂的優點,此外,攝像單元等模組化時的強度優異。 The outer shape of the lens portion is preferably a circular shape. Due to the foregoing Since the outer shape of the lens portion is smooth, there is an advantage that it is less likely to be cracked by a punching step, a thermal shock, or the like, and the image unit or the like is excellent in strength when modularized.
前述透鏡部的外形係以矩形為佳。藉此可使相鄰接之前述透鏡部的外形一致,因此,從前述透鏡陣列薄片切取之後,並無原料浪費而為佳。此外,亦具有使通過的光呈四角形狀進行照射而容易控制的優點。 The shape of the aforementioned lens portion is preferably a rectangle. Thereby, the outer shape of the adjacent lens portions can be made uniform. Therefore, it is preferable that no material is wasted after cutting out the lens array sheet. In addition, there is an advantage that the light that passes through is irradiated in a square shape and is easily controlled.
前述透鏡部的外形係以多角形為佳。藉此可使相鄰接之前述透鏡部的外形一致,從前述透鏡陣列薄片切取之後,並無原料浪費而為佳。此外,亦具有使通過的光呈多角形狀進行照射而容易控制的優點。 The shape of the aforementioned lens portion is preferably a polygonal shape. Thereby, the outer shape of the adjacent lens portions can be made uniform, and it is preferable that the raw material is not wasted after the lens array sheet is cut out. Further, it has an advantage that the light that passes through is irradiated in a polygonal shape and is easily controlled.
前述透鏡部係以排列成一列為佳。藉此可與半導體組裝步驟相同處理,而能夠藉由機器人將透鏡部從透鏡陣列薄片取出。 It is preferable that the aforementioned lens portions are arranged in a line. Thereby, the same processing as the semiconductor assembly step can be performed, and the lens portion can be taken out from the lens array sheet by the robot.
前述透鏡部係以排列成格子狀為佳。可由1片透鏡陣列薄片取出多數的透鏡部,且可使生產性提昇而降低成本。 It is preferable that the lens portions are arranged in a lattice shape. A large number of lens portions can be taken out from one lens array sheet, and productivity can be improved to reduce cost.
前述透鏡部係排列成複數列,相鄰接的列之前述透鏡部彼此係以於列方向相交錯為佳。樹脂塗佈、成形裝置之適用方面,有時會期望使透鏡陣列薄片的外形接近圓形。於此情況中,若將前述透鏡部排列成複數列,使相鄰接的列之前述透鏡部彼此在列方向交錯,則可增加1片透鏡陣列薄片中之透鏡部的數量,且可使生產性提昇而降低成本。 The lens portions are arranged in a plurality of rows, and the lens portions of the adjacent rows are preferably interlaced in the column direction. In the application of the resin coating and molding apparatus, it is sometimes desirable to make the outer shape of the lens array sheet nearly circular. In this case, if the lens portions are arranged in a plurality of rows and the lens portions of the adjacent columns are staggered in the column direction, the number of lens portions in one lens array sheet can be increased, and production can be performed. Increased sexuality and reduced costs.
前述透鏡層係以由能量硬化性樹脂所形成為佳。以紫外線硬化性樹脂或熱硬化性樹脂所代表的能量硬化性樹脂,係回焊耐性、環境信賴性優異。此外,即使就光學面精準度的觀點而言收縮率亦低,而可構成精準度佳的透鏡面。 The lens layer is preferably formed of an energy curable resin. The energy curable resin represented by the ultraviolet curable resin or the thermosetting resin is excellent in reflow resistance and environmental reliability. In addition, even if the optical surface accuracy is low, the shrinkage rate is low, and a lens surface with good precision can be formed.
前述基底層係以1層為佳。藉此,成為所謂單片狀的光學元件,由於在光軸方向不具有界面,因此光學特性優異。此外,由於在界面並無發生剝離因此環境信賴性亦會提高。進而,可防止成形時之收縮變形、翹曲。 The aforementioned substrate layer is preferably one layer. As a result, the optical element is a monolithic optical element, and since it does not have an interface in the optical axis direction, it is excellent in optical characteristics. In addition, since there is no peeling at the interface, the environmental reliability is also improved. Further, shrinkage deformation and warpage at the time of molding can be prevented.
前述基底層較佳為由聚醯亞胺樹脂、TAC、PET、丙烯酸樹脂及環氧樹脂中任一者所形成。此等材料係具有耐熱性,於成形後必須進行退火的情況中,可不需將透鏡部予以個片化而在透鏡陣列薄片的狀態下進行。進而,由於可以同形態進行透鏡部之成形、切割、退火、檢查、乃至出貨,因此生產性優異。 The base layer is preferably formed of any one of a polyimide resin, TAC, PET, an acrylic resin, and an epoxy resin. These materials are heat-resistant, and in the case where annealing is required after molding, the lens portion can be formed in a state of the lens array sheet without being formed into a sheet. Further, since the lens portion can be formed, cut, annealed, inspected, or even shipped in the same manner, the productivity is excellent.
前述基底層係具有第1樹脂層與第2樹脂層,前述切入部係以貫穿前述第1樹脂層,但不貫穿前述第2樹脂層為佳。藉此,雖成為2層狀之透鏡部,但在使用於例如輔助光源單元之類的情況中,可將排氣少而環境信賴性高的原料使用於接近光源的第2樹脂層,而可提昇作為輔助光源單元之信賴性。 The base layer has a first resin layer and a second resin layer, and the cut portion penetrates the first resin layer, but it is preferably not penetrated through the second resin layer. In this case, the lens portion is a two-layered lens. However, when used in, for example, an auxiliary light source unit, a material having a small amount of exhaust gas and high environmental reliability can be used for the second resin layer close to the light source. Improve the reliability of the auxiliary light source unit.
於前述基底層之前述第1樹脂層中,較佳為於與前述透鏡層之相反側的面塗佈有透明無機層。藉由於前述第1樹脂層中之與前述透鏡層相反側的面側,塗佈透 明無機層,而可抑制在前述光學元件被配置於發光元件的前面而使用的情況中發生排氣。透明無機層係指具有玻璃、DLC(類鑽碳)等。 In the first resin layer of the underlayer, it is preferable that a surface of the opposite side of the lens layer is coated with a transparent inorganic layer. By coating the surface side of the first resin layer opposite to the lens layer, the coating is transparent The inorganic layer can be prevented from being vented when the optical element is disposed in front of the light-emitting element. The transparent inorganic layer means having glass, DLC (Drilling Carbon), or the like.
前述基底層之前述第2樹脂層較佳為由聚醯亞胺樹脂、TAC、PET、丙烯酸樹脂及環氧樹脂中任一者所形成。此等材料係具有耐熱性,於成形後必須進行退火的情況中,可不需將透鏡部予以個片化而在透鏡陣列薄片的狀態下進行。進而,由於可以同形態進行透鏡部之成形、切割、退火、檢查、乃至出貨,因此生產性優異。此外,能夠將前述基底層延伸而拆下透鏡部,且可使用與以往之半導體組裝步驟相同的系統。 The second resin layer of the underlayer is preferably formed of any one of a polyimide resin, TAC, PET, an acrylic resin, and an epoxy resin. These materials are heat-resistant, and in the case where annealing is required after molding, the lens portion can be formed in a state of the lens array sheet without being formed into a sheet. Further, since the lens portion can be formed, cut, annealed, inspected, or even shipped in the same manner, the productivity is excellent. Further, the base layer can be extended to remove the lens portion, and the same system as the conventional semiconductor assembly step can be used.
本發明之光學元件之製造方法係由以形成有排列成陣列狀的複數透鏡部之樹脂製透鏡層、以及與前述透鏡層接合之樹脂製基底層所構成的透鏡陣列薄片,裁切成各透鏡部每一者藉以形成光學元件的光學元件之造方法,其特徵為具備:賦予前述基底層上透鏡材料,並按壓模具,藉此與前述複數之透鏡部一起於各透鏡部的周圍形成溝槽之步驟、以藉由前述溝槽一邊導引一邊插入切斷刀,且至少一部分到達前述基底層,但並未貫穿前述基底層的方式形成切入部之步驟、以及於每一前述切入部切離前述透鏡部之步驟。 The optical element manufacturing method of the present invention is obtained by cutting a lens array sheet formed of a resin lens layer formed with a plurality of lens portions arranged in an array and a resin base layer bonded to the lens layer. Each of the methods for forming an optical element for forming an optical element, comprising: providing a lens material on the base layer and pressing a mold, thereby forming a groove around each lens portion together with the plurality of lens portions a step of inserting a cutting blade while guiding the groove, and at least partially reaching the base layer, but forming a cut portion so as not to penetrate the base layer, and cutting away from each of the cut portions The step of the aforementioned lens portion.
若依據本發明,則藉由前述溝槽一邊導引一邊插入切斷刀,藉此而可形成經高精準度決定位置的切入部。進而,於前述透鏡層中形成有切入部,至少一部分的 前述切入部係到達前述基底層,但並未貫穿前述基底層,因此前述透鏡部對於前述基底層幾乎可僅以其之間的黏著力加以保持,藉此,可容易地將前述透鏡層剝離成各透鏡部每一者,因而,可以短的工時予以精準度佳地個片化,且就省卻洗淨步驟的觀點而言具有優勢,而能夠以低成本大量生產光學元件。 According to the present invention, the cutting blade is inserted while guiding the groove, whereby the cut portion having the position with high accuracy can be formed. Further, a cut-in portion is formed in the lens layer, at least a part of The cutting portion reaches the base layer, but does not penetrate the base layer. Therefore, the lens portion can be held by the adhesion between the base layer and the base layer, whereby the lens layer can be easily peeled off. Each of the lens portions can be accurately sliced with a short working time, and is advantageous in terms of eliminating the washing step, and can mass-produce the optical element at low cost.
前述切斷刀係於與插入方向交叉的方向,成為能夠對於前述透鏡陣列薄片而相對移動,前述切斷刀的前端角度係20~55°,且以較前述V溝槽角度更小5°以上為佳。藉由使切斷刀的前端角度較V溝槽角度更小5°以上,而容易進行朝V溝槽內之插入,且即使切斷刀的前端位置有些許偏移,切斷刀亦會沿著V溝槽壁面引導而順利地導引至切斷位置,可確保數μ尺度的決定位置精準度。此外,藉由將切斷刀的前端角度設為20°以上而可確保刀的耐久性。 The cutting blade is relatively movable in the direction intersecting with the insertion direction, and the cutting blade has a front end angle of 20 to 55° and a smaller angle of 5° or more from the V groove angle. It is better. By making the front end angle of the cutting blade smaller than the V groove angle by 5° or more, it is easy to insert into the V groove, and even if the cutting blade front end position is slightly offset, the cutting blade will follow Guided by the wall surface of the V-groove and smoothly guided to the cutting position, the positional accuracy of the number of μ scales can be ensured. Further, the durability of the blade can be ensured by setting the tip end angle of the cutting blade to 20° or more.
透鏡部形狀之代表例係可為以閃電(blaze)形狀、非球面、變形面、多項式所展現的自由曲面。此外,透鏡部的尺寸係以 0.5~5mm為佳。厚度係以將最大厚度設為0.05~1mm之範圍為佳。透鏡層的材料係作為「能量硬化性樹脂材料」而使用光硬化性樹脂材料或熱硬化性樹脂材料等之硬化後具有透明性的硬化性樹脂材料。具體而言,以使用以熱或紫外線進行硬化的環氧系樹脂、丙烯酸系樹脂為佳。藉由以如此之硬化性樹脂來構成透鏡部,而可具備光學性能,同時具備耐回焊性與耐熱衝擊性 。與基底層(設為2層時係第1樹脂層)之線膨脹係數差係以100×10-6以下為佳。進而,與基底層(設為2層時係第1樹脂層)之線膨脹係數差係以50×10-6以下為更佳。 A representative example of the shape of the lens portion may be a free curved surface exhibited by a blaze shape, an aspherical surface, a deformed surface, and a polynomial. In addition, the size of the lens portion is 0.5~5mm is preferred. The thickness is preferably in a range in which the maximum thickness is set to 0.05 to 1 mm. The material of the lens layer is a curable resin material which is transparent after curing such as a photocurable resin material or a thermosetting resin material. Specifically, an epoxy resin or an acrylic resin which is cured by heat or ultraviolet rays is preferably used. By constituting the lens portion with such a curable resin, it is possible to provide optical performance and to have reflow resistance and thermal shock resistance. The difference in linear expansion coefficient from the underlayer (the first resin layer in the case of two layers) is preferably 100 × 10 -6 or less. Further, the difference in linear expansion coefficient from the underlayer (the first resin layer in the case of two layers) is preferably 50 × 10 -6 or less.
於將基底層設為2層時之透鏡層側的第1樹脂層係以由具有透明性之聚醯亞胺所構成為佳。此樹脂係兼具耐熱性與透明性,相較於玻璃,其之與由能量硬化性樹脂所構成的透鏡部之線膨脹特性的差較小,並且相較於丙烯酸樹脂等吸濕性較低,因此,作為構成輔助光源單元用之光學元件的第1樹脂層乃為較佳者。市售者係可使用Mitsubishi Gas Chemical股份有限公司製Neopulim、JSR股份有限公司製LUCERA等。第1樹脂層之透鏡部側面的平滑度係以Ra 0.1nm~10nm之鏡面為佳。此外,較佳為第1樹脂層之透鏡部側面的平滑度為Ra 0.1μm~10μm之具有微小的凹凸之面,藉由錨定效應而提昇接合力。第1樹脂層之透明性方面,穿透率較佳為在可見光區域為85%以上。第1樹脂層的厚度係以0.05~0.5mm為佳。於第1樹脂層中,為了提高與透鏡部之密著性,以在透鏡部形成之前,先進行前處理為佳。前處理係可列舉:由紫外線照射及藉由此紫外線所產生的臭氧所致之活性化處理、電暈放電等之氧電漿處理、由離子蝕刻所致之活性化處理、矽氧偶合處理等。發光元件係包含LED。基底層(設為2層時係第2樹脂層)係以由聚醯亞胺樹脂或TAC或PET或丙烯酸樹脂或環氧樹脂所形成為佳。 It is preferable that the first resin layer on the lens layer side when the base layer is two layers is made of a polyimide having transparency. This resin has both heat resistance and transparency, and the difference from the linear expansion property of the lens portion composed of the energy curable resin is smaller than that of the glass, and the hygroscopicity is lower than that of the acrylic resin. Therefore, the first resin layer as the optical element constituting the auxiliary light source unit is preferable. Commercially available, Neopulim manufactured by Mitsubishi Gas Chemical Co., Ltd., and LUCERA manufactured by JSR Co., Ltd. can be used. The smoothness of the side surface of the lens portion of the first resin layer is preferably a mirror surface having a Ra of 0.1 nm to 10 nm. Further, it is preferable that the smoothness of the side surface of the lens portion of the first resin layer is a surface having minute irregularities of Ra 0.1 μm to 10 μm, and the bonding force is increased by the anchoring effect. In terms of transparency of the first resin layer, the transmittance is preferably 85% or more in the visible light region. The thickness of the first resin layer is preferably 0.05 to 0.5 mm. In order to improve the adhesion to the lens portion in the first resin layer, it is preferred to perform pretreatment before forming the lens portion. Examples of the pretreatment include an activation treatment by ultraviolet irradiation, ozone by the ultraviolet light, an oxygen plasma treatment such as corona discharge, an activation treatment by ion etching, an oxygen coupling treatment, and the like. . The light emitting element comprises an LED. The base layer (the second resin layer when the two layers are provided) is preferably formed of a polyimide resin, TAC or PET, or an acrylic resin or an epoxy resin.
本發明之透鏡陣列係被使用來製造組裝於攝 像用輔助光源單元的光學元件,且為形成有排列成陣列狀的複數之透鏡部的樹脂製透鏡陣列,其特徵為,於相鄰接的前述透鏡部間係形成有至少底部為V狀剖面的溝槽、以及決定位置用之基準面,且前述透鏡部與前述基準面係藉由模而一體成形。 The lens array of the present invention is used to manufacture and assemble A resin lens array in which an optical element of an auxiliary light source unit is formed and a plurality of lens portions arranged in an array are formed, wherein at least a V-shaped cross section is formed between the adjacent lens portions. The groove and the reference surface for determining the position, and the lens portion and the reference surface are integrally formed by a mold.
若依據本發明,則於前述透鏡陣列中,於相鄰接的前述透鏡部間係形成有至少底部為V狀剖面的溝槽,因此,可將前述溝槽的底部作為起點而割斷樹脂製之前述透鏡陣列,藉此不需依賴切割而容易以低成本實現前述透鏡部之個片化。 According to the invention, in the lens array, a groove having at least a V-shaped cross section is formed between the adjacent lens portions. Therefore, the bottom of the groove can be used as a starting point to cut the resin. In the lens array described above, it is easy to realize the singulation of the aforementioned lens portion at low cost without depending on the dicing.
在此,於將前述透鏡部予以個片化時,雖亦考慮例如沿著前述溝槽而進行切割,但若藉由切割而切離前述透鏡部則會產生毛邊(burr),因此於欲利用切斷面作為決定位置用之基準面的情況中,會因毛邊而阻礙決定位置,變得難以利用切斷面作為決定位置用之基準面。此外,若增加前述溝槽所具備的寬度,進一步設置切割加工用空間(100μm左右),則會導致不必要的部分增加。因而,會使前述各透鏡部的外徑受到限制,或者若欲充分確保前述透鏡部之外徑,則會使各個前述透鏡部大型化而導致前述透鏡陣列整體尺寸增大,亦產生生產性惡化的問題。由於若增加不需要的部分則會導致原料使用量的增大,因此若使用較為高價的能量硬化性樹脂,則亦產生導致透鏡單價提高的問題。相對於此,若依據本發明,則可將前述溝槽的底部作為起點而割斷前述透鏡陣列,藉此可解 決上述2個問題。而且,不進行切割,而變得不需要在辨識對準符號等的記號並進行決定位置之後進行的精密且高價之切割裝置,此外,可避免必須逐列切斷之切割加工的長工時。此外,由於亦不需要將因切割加工所產生的切屑進行洗淨(洗淨液係廢棄)之步驟,因此可得到生產性提昇的大優點。 Here, when the lens portion is formed into a sheet, it is considered that, for example, cutting is performed along the groove. However, if the lens portion is cut away from the lens portion, a burr is generated, and thus the burr is used. When the cut surface is used as the reference surface for determining the position, the position is determined by the burrs, and it is difficult to use the cut surface as the reference surface for determining the position. Further, when the width of the groove is increased and the space for cutting processing (about 100 μm) is further provided, an unnecessary portion is increased. Therefore, the outer diameter of each of the lens portions is restricted, or if the outer diameter of the lens portion is sufficiently secured, the size of each of the lens portions is increased, and the overall size of the lens array is increased, and productivity is deteriorated. The problem. If an unnecessary portion is added, the amount of raw material used is increased. Therefore, when a relatively expensive energy-curable resin is used, there is also a problem that the unit price of the lens is increased. On the other hand, according to the present invention, the lens array can be cut by using the bottom of the groove as a starting point, thereby being solvable The above two questions are resolved. Further, since the cutting is not performed, it is not necessary to perform a precise and expensive cutting device which is performed after the symbol of the alignment symbol or the like is recognized and the position is determined, and the long working time of the cutting process which must be cut one by one can be avoided. Further, since it is not necessary to clean the chips generated by the cutting process (the washing liquid is discarded), the advantage of productivity improvement can be obtained.
此外,在將從前述透鏡陣列沿著前述溝槽加以個片化的透鏡部與輔助光源組合而製作輔助光源單元時,前述透鏡部與前述基準面,係藉由模而一體成形,因此,可使用前述基準面來精準度佳地進行於前述透鏡部與前述輔助光源之決定位置。 Further, when the auxiliary light source unit is formed by combining the lens portion which is formed by dicing the lens array along the groove and the auxiliary light source, the lens portion and the reference surface are integrally formed by a mold, and therefore, The predetermined reference surface is used to accurately determine the position of the lens portion and the auxiliary light source.
於前述溝槽的V狀剖面中之挾角係以20°~60°為佳。在此,為了精準度佳地進行割斷而對於前述挾角的角度條件進行規定。只要前述挾角為20°以上,則用以將前述溝槽予以成形的模之凸狀轉印部便不會變得過細,而可確保模的強度及耐久性。另一方面,只要前述挾角為60°以下,則前述溝槽的光軸方向投影面積便不會變得過大,而無需限制前述透鏡部的外徑,進而,於藉由割斷而進行個片化時,在前述溝槽之偏離最內部的部分係不易產生割斷,且具有剖面會容易成為銳利的優點。另外,雖亦可使成形所使用的模為低價的樹脂製,但由於相較於金屬製的模時會有使用時間變短的傾向,因此期望將前述挾角的下限值提高(例如30°以上)而確保耐久性。 The corner angle in the V-shaped cross section of the groove is preferably 20° to 60°. Here, the angular condition of the above-mentioned corner is defined in order to perform cutting with high precision. When the corner angle is 20 or more, the convex transfer portion of the mold for molding the groove does not become too thin, and the strength and durability of the mold can be ensured. On the other hand, if the corner angle is 60 or less, the projected area of the groove in the optical axis direction does not become excessively large, and it is not necessary to limit the outer diameter of the lens portion, and further, the sheet is cut by cutting. At the time of the formation, the portion in which the groove is deviated from the innermost portion is less likely to be cut, and the cross section is likely to be sharp. Further, although the mold used for molding may be made of a low-cost resin, the use time may be shortened compared to a metal mold, and therefore it is desirable to increase the lower limit of the above-described corner angle (for example, 30° or more) to ensure durability.
前述基準面係以由前述V狀剖面的溝槽之斜 面所構成為佳。藉此,模的脫模性會提高,而使前述透鏡陣列之成形變得容易。 The aforementioned reference plane is inclined by the groove of the aforementioned V-shaped cross section The composition of the face is better. Thereby, the mold release property of the mold is improved, and the formation of the aforementioned lens array is facilitated.
前述基準面係以由鄰接於前述溝槽所形成的缺口所構成為佳。若將前述基準面設為與V字剖面不同的缺口面,例如光軸平行面,則在將前述透鏡陣列予以個片化之後,容易利用前述基準面而把持小尺寸之前述透鏡部,組裝性優異。 Preferably, the reference surface is formed by a notch formed adjacent to the groove. When the reference plane is a notch surface different from the V-shaped cross section, for example, an optical axis parallel surface, after the lens array is formed into a sheet, it is easy to hold the lens portion of a small size by the reference surface, and assembly is possible. Excellent.
於前述溝槽的底部之前述透鏡陣列的最小厚度係以20μm~150μm為佳。若將前述透鏡陣列的最小厚度設為20μm以上,則於將前述透鏡陣列進行脫模時或者搬運時等,即使不刻意對前述透鏡陣列施加力量也不易潰散,處理性優異。另一方面,若將前述透鏡陣列的最小厚度設為150μm以下,則於藉由割斷來將前述透鏡陣列予以個片化時,在前述溝槽之偏離最內部的部分不易產生割斷,且具有剖面會容易變成銳利的優點。 The minimum thickness of the aforementioned lens array at the bottom of the aforementioned trench is preferably 20 μm to 150 μm. When the minimum thickness of the lens array is 20 μm or more, when the lens array is released from the mold or during transportation, the lens array is not easily broken even if it is not intentionally applied to the lens array, and the handleability is excellent. On the other hand, when the minimum thickness of the lens array is 150 μm or less, when the lens array is sliced by cutting, the portion of the groove that is deviated from the innermost portion is less likely to be cut and has a cross section. It will easily become a sharp advantage.
前述透鏡部的外形係以圓形為佳。藉由將經個片化的前述透鏡部組裝於輔助光源單元,而可將射出光控制成圓形狀。 The outer shape of the lens portion is preferably a circular shape. The emitted light can be controlled to have a circular shape by assembling the sliced lens portion to the auxiliary light source unit.
前述透鏡部的外形係以矩形為佳。藉由將經個片化的前述透鏡部組裝於輔助光源單元,可將射出光控制成矩形狀而為佳。此外,將前述透鏡陣列予以個片化後,變成浪費的樹脂減少,而可謀求成本低減。 The shape of the aforementioned lens portion is preferably a rectangle. It is preferable that the emitted light is controlled in a rectangular shape by assembling the individualized lens portions to the auxiliary light source unit. Further, by singulating the aforementioned lens array, the amount of waste resin is reduced, and the cost can be reduced.
前述透鏡部的外形係以多角形為佳。藉由將經個片化的前述透鏡部組裝於輔助光源單元,而可將射出 光控制成多角形狀。 The shape of the aforementioned lens portion is preferably a polygonal shape. The lens can be emitted by assembling the singulated lens portion to the auxiliary light source unit The light is controlled into a polygonal shape.
前述透鏡部係以排列成一列為佳。藉此可以與半導體組裝步驟相同的步驟製造前述透鏡部,使用用以把持經個片化之前述透鏡部的機器人等而變得容易實現製造步驟之自動化。 It is preferable that the aforementioned lens portions are arranged in a line. Thereby, the lens portion can be manufactured in the same steps as the semiconductor assembly step, and the robot can be easily automated by using a robot or the like for holding the sliced lens portion.
前述透鏡部係以排列成格子狀為佳。可由1片透鏡陣列製造多數之前述透鏡部,使生產性提昇而謀求成本低減。 It is preferable that the lens portions are arranged in a lattice shape. A large number of the aforementioned lens portions can be manufactured by one lens array, and the productivity is improved to reduce the cost.
構成前述透鏡陣列的樹脂係以能量硬化性樹脂為佳。能量硬化性樹脂係於輔助光源單元製作時,在供用以將前述透鏡部與光源一起進行安裝之回焊步驟時所需的耐熱性、或環境信賴性優異。此外,由於硬化時之收縮率低,因此就確保前述透鏡部之光學面精準度的觀點而言亦為理想。進而,亦具有割斷性優異的優點。 The resin constituting the lens array is preferably an energy curable resin. The energy curable resin is excellent in heat resistance or environmental reliability required for the reflow step of mounting the lens portion together with the light source when the auxiliary light source unit is fabricated. Further, since the shrinkage ratio at the time of curing is low, it is also preferable from the viewpoint of ensuring the accuracy of the optical surface of the lens portion. Further, it also has an advantage of excellent cutting property.
前述透鏡部的背面係以平面為佳。藉此可將模形狀予以簡化,而謀求成本低減。 The back surface of the lens portion is preferably a flat surface. Thereby, the shape of the mold can be simplified, and the cost can be reduced.
較佳為對於前述平面部實施SiO2塗佈。藉由對於前述平面部實施SiO2塗佈,可在組裝於輔助光源單元之後,抑制排氣的發生,而抑制對光源的影響。 It is preferable to apply SiO 2 to the plane portion. By performing SiO 2 coating on the planar portion, it is possible to suppress the occurrence of exhaust gas after being assembled in the auxiliary light source unit, and to suppress the influence on the light source.
較佳為對於前述平面部實施抗反射塗佈。藉由對於前述平面部實施抗反射塗佈,可在組裝於輔助光源單元之後,讓來自光源的射出光有效率地穿透。 It is preferable to apply anti-reflection coating to the planar portion. By performing anti-reflection coating on the planar portion, the emitted light from the light source can be efficiently penetrated after being assembled in the auxiliary light source unit.
較佳為使可撓性樹脂薄片密著於前述平面部。藉由使可撓性樹脂薄片密著於前述平面部,於藉由割斷 將前述透鏡陣列予以個片化時,前述透鏡部不會分散而落下,而處理性優異。 Preferably, the flexible resin sheet is adhered to the flat portion. By cutting the flexible resin sheet to the plane portion, by cutting When the lens array is formed into a sheet, the lens portion is not dispersed and falls, and the handleability is excellent.
本發明之透鏡陣列之製造方法,係使用來製造組裝於攝像用之輔助光源單元的光學元件之透鏡陣列之製造方法,其特徵為具有:在具有排列成透鏡狀的透鏡轉印部及設於前述透鏡轉印部間的凸狀轉印部之成形模、與對向模之間配置具有流動性的樹脂材料之步驟;使前述樹脂材料在前述成形模與對向模之間固化之步驟;將前述成形模與前述對向模脫模,藉以將具有藉由前述透鏡轉印部所轉印之透鏡部、藉由前述凸狀轉印部的前端側所轉印之V狀剖面的溝槽、以及藉由前述凸狀轉印部的側面所轉印之決定位置用基準面的透鏡陣列取出之步驟。 A method of manufacturing a lens array according to the present invention is a method of manufacturing a lens array using an optical element incorporated in an auxiliary light source unit for imaging, characterized in that it has a lens transfer portion arranged in a lens shape and is provided on a step of disposing a molding material having a fluidity between the lens transfer portion and a facing mold, and a step of curing the resin material between the molding die and the opposing mold; The molding die is released from the opposing mold, and the lens portion having the lens transfer portion transferred by the lens transfer portion and the V-shaped cross section transferred by the front end side of the convex transfer portion are grooved. And a step of taking out the lens array on which the position of the reference surface transferred by the side surface of the convex transfer portion is removed.
依據本發明,於藉由使具有前述流動性之樹脂材料固化所成形的透鏡陣列中,係於藉由前述透鏡轉印部所轉印的透鏡部間,形成有藉由前述凸狀轉印部的前端側所轉印之至少底部為V狀剖面的溝槽,因此,可將前述溝槽的底部作為起點而割斷前述透鏡陣列,藉此不需依賴切割而容易以低成本實現前述透鏡部之個片化。 According to the invention, in the lens array formed by curing the resin material having the fluidity described above, the convex portion is formed by the convex portion between the lens portions transferred by the lens transfer portion At least the bottom portion of the front end side is a groove having a V-shaped cross section. Therefore, the lens array can be cut by using the bottom of the groove as a starting point, thereby facilitating the realization of the lens portion at low cost without depending on cutting. Sliced.
此外,由於藉由前述透鏡轉印部所轉印的透鏡部、與藉由前述凸狀轉印部之側面所轉印的決定位置用基準面,係藉由模而一體成形,因此在將從前述透鏡陣列而沿著前述溝槽作了個片化的透鏡部與輔助光源組合而製造出輔助光源單元時,可使用前述基準面來精準度佳地進行前述透鏡部與前述輔助光源之決定位置。 Further, since the lens portion transferred by the lens transfer portion and the reference surface for determining the position transferred by the side surface of the convex transfer portion are integrally molded by the mold, the When the lens array is combined with the auxiliary light source to form the auxiliary light source unit along the groove array, the reference plane can be used to accurately determine the position of the lens portion and the auxiliary light source. .
較佳為沿著前述溝槽割斷藉由前述製造方法所製造的透鏡陣列,而將每一前述透鏡部予以個片化。由於將前述透鏡陣列予以個片化時不需依賴切割,因此不會產生毛邊等的缺陷。 Preferably, each of the aforementioned lens portions is sliced by cutting the lens array manufactured by the above-described manufacturing method along the groove. Since it is not necessary to rely on the cutting when the lens array is sliced, defects such as burrs are not generated.
前述割斷較佳為藉由於相鄰接之前述透鏡部彼此分離的方向賦予前述透鏡陣列力量而進行。藉此,在最脆弱的前述溝槽之底部產生割斷,而可容易地將前述透鏡陣列予以個片化。 The cutting is preferably performed by imparting force to the lens array in a direction in which the adjacent lens portions are separated from each other. Thereby, the cutting is caused at the bottom of the most fragile groove, and the aforementioned lens array can be easily sliced.
本發明之輔助光源單元,其特徵係將藉由前述製造方法所製造的光學元件與輔助光源,使用前述基準面來決定位置而加以組裝。藉此儘管為高精準度卻可提供低價的輔助光源單元。 The auxiliary light source unit of the present invention is characterized in that the optical element and the auxiliary light source manufactured by the above-described manufacturing method are assembled using the reference surface to determine the position. This provides a low-cost auxiliary light source unit for high precision.
本發明之另一透鏡陣列之製造方法,其特徵為具有:藉由使用模來將能量硬化性樹脂組成物加以成形,而得到於排列成陣列狀的複數透鏡部、與相鄰接的前述透鏡部間形成有割斷用的溝槽之能量硬化性樹脂製的透鏡陣列之步驟,該能量硬化性樹脂組成物係含有聚合性單體之能量硬化性樹脂組成物,且為具有與前述聚合性組成物之官能基產生化學反應而形成鍵結的官能基,且含有數量平均分子量1000~50000之改質聚矽氧的能量硬化性樹脂組成物。 Another method of manufacturing a lens array according to the present invention is characterized in that: the energy curable resin composition is molded by using a mold to obtain a plurality of lens portions arranged in an array, and the adjacent lenses a step of forming a lens array made of an energy curable resin having a groove for cutting, the energy curable resin composition containing an energy curable resin composition of a polymerizable monomer, and having a polymerizable composition as described above The functional group of the substance chemically reacts to form a bonded functional group, and contains an energy curable resin composition of a modified polyfluorene oxide having a number average molecular weight of 1,000 to 50,000.
本發明者們係銳意研究的結果發現:於將前述透鏡陣列模成形時,藉由使用具有與能量硬化性樹脂之官能基產生化學反應而形成鍵結的官能基,且含有數量平 均分子量500~50000之改質聚矽氧的前述能量硬化性樹脂,而賦予前述能量硬化性樹脂前述改質聚矽氧特有的柔軟性,而提昇碎屑耐性。進而,藉由添加前述改質聚矽氧,而提高前述透鏡陣列表面之導電性,且減弱摩擦,藉此由於不易積蓄靜電,因此亦觀察到塵埃附著之減輕。 As a result of intensive studies, the present inventors have found that when the lens array is molded, a functional group which forms a bond by chemical reaction with a functional group of an energy curable resin is used, and the amount is flat. The energy curable resin having a modified molecular weight of 500 to 50,000, which imparts a molecular weight of 500 to 50,000, imparts flexibility to the energy curable resin to the modified polyfluorene, thereby improving chip resistance. Further, by adding the modified polyfluorene oxide, the conductivity of the surface of the lens array is improved, and the friction is weakened, whereby the static electricity is less likely to accumulate, and therefore the dust adhesion is also observed to be reduced.
亦即,若改質聚矽氧具有與前述能量硬化性樹脂之官能基產生化學反應而形成鍵結的官能基,且數量平均分子量為500~50000,則由於改質聚矽氧會直接被納入樹脂之有機鏈中,因此賦予柔軟性的效果會變大。此外,改質聚矽氧的含量及官能基數越多,越容易與樹脂官能基產生反應,而納入有機鏈中。順帶一提,若改質聚矽氧的數量平均分子量未達500,則樹脂硬化時容易揮發,會產生揮發成分而產生排氣的問題。另一方面,若改質聚矽氧的數量平均分子量超過50000,則黏度會變高,而使樹脂之溶解性惡化。若改質聚矽氧的數量平均分子量為500~50000,則可抑制該缺陷。 That is, if the modified polyfluorene oxide has a functional group which chemically reacts with the functional group of the energy curable resin to form a bond, and the number average molecular weight is 500 to 50,000, since the modified polyfluorene is directly incorporated In the organic chain of the resin, the effect of imparting flexibility is increased. Further, the more the content of the modified polyfluorene oxygen and the number of functional groups, the easier it is to react with the resin functional group, and it is incorporated into the organic chain. Incidentally, if the number average molecular weight of the modified polyfluorene is less than 500, the resin is easily volatilized when it is cured, and a volatile component is generated to cause exhaust gas. On the other hand, if the number average molecular weight of the modified polyfluorene oxygen exceeds 50,000, the viscosity becomes high and the solubility of the resin is deteriorated. If the number average molecular weight of the modified polyfluorene is from 500 to 50,000, the defect can be suppressed.
前述改質聚矽氧係以數量平均分子量為1000~30000為佳。藉此會進一步提昇碎屑特性,並提高塵埃附著減輕效果。 The modified polyfluorinated oxygen system preferably has a number average molecular weight of from 1,000 to 30,000. This will further improve the characteristics of the debris and improve the dust adhesion reduction effect.
前述能量硬化性樹脂組成物之前述改質聚矽氧的含量係以0.5~10重量%為佳。若前述改質聚矽氧的含量為0.5重量%以上,則可確保樹脂之充分的柔軟性,且氣泡之抑制效果亦高,因此,特別是在形成菲涅耳透鏡等時為有效。另一方面,若前述改質聚矽氧的含量為10 重量%以下,則可確保樹脂之耐熱性,因此,適合於例如供於用以將透鏡部與輔助光源或攝像元件一起進行安裝之回焊步驟。此外,在使用於輔助光源單元的透鏡之情況中,成為能夠耐受來自輔助光源的熱。 The content of the modified polyfluorene oxygen in the energy curable resin composition is preferably 0.5 to 10% by weight. When the content of the modified polyfluorene oxide is 0.5% by weight or more, sufficient flexibility of the resin can be ensured, and the effect of suppressing bubbles is also high. Therefore, it is effective particularly when a Fresnel lens or the like is formed. On the other hand, if the content of the modified polyfluorene is 10 When the weight is less than or equal to 100%, the heat resistance of the resin can be ensured. Therefore, it is suitable for, for example, a reflow step for mounting the lens portion together with the auxiliary light source or the image pickup element. Further, in the case of a lens used for the auxiliary light source unit, it is possible to withstand heat from the auxiliary light source.
前述改質聚矽氧係以具有2官能以上之官能基為佳。改質聚矽氧的含量、官能基數越多,則越容易與樹脂官能基產生反應,且越能納入樹脂骨架內。但,過度的添加會導致耐熱性之劣化,因此,改質聚矽氧的含量係以10重量%以下為佳。 The modified polyfluorinated oxygen is preferably a functional group having two or more functional groups. The more the content of the modified polyfluorene oxygen and the number of functional groups, the easier it is to react with the resin functional group, and the more it can be incorporated into the resin skeleton. However, excessive addition causes deterioration of heat resistance, and therefore, the content of the modified polyfluorene is preferably 10% by weight or less.
前述能量硬化性樹脂係以紫外線硬化性樹脂或熱硬化性樹脂為佳。此等樹脂係供用以將前述透鏡部與攝像元件或光源一起進行安裝之回焊步驟時所需的耐熱性或環境信賴性優異。此外,由於硬化時之收縮率低,因此就確保前述透鏡部的光學面精準度的觀點而言亦較為理想。 The energy curable resin is preferably an ultraviolet curable resin or a thermosetting resin. These resins are excellent in heat resistance and environmental reliability required for the reflow step of mounting the lens portion together with the image pickup element or the light source. Further, since the shrinkage ratio at the time of curing is low, it is also preferable from the viewpoint of ensuring the accuracy of the optical surface of the lens portion.
前述能量硬化性樹脂係以環氧系能量硬化性樹脂或丙烯酸系能量硬化性樹脂為佳。此等之樹脂係光學特性優異,且具有較容易取得的優點。 The energy curable resin is preferably an epoxy-based energy curable resin or an acrylic energy curable resin. These resins are excellent in optical characteristics and have advantages that are easily obtained.
前述模係以樹脂製為佳。藉此,由於可從母模將模轉印成形,因此僅製成1個母模,便可複製複數個模,而可減低模製造成本。另外,前述模係以PDMS製為佳。 The aforementioned mold system is preferably made of a resin. Thereby, since the mold can be transferred and formed from the master mold, only one master mold can be produced, and a plurality of molds can be reproduced, and the mold manufacturing cost can be reduced. Further, the aforementioned mold system is preferably made of PDMS.
前述透鏡部係以光軸方向剖面為閃電形狀為佳。若依據本發明之製造方法,則藉由使前述能量硬化性 樹脂含有前述改質聚矽氧,亦可期待硬化時之氣泡抑制效果,因此特別適用於如菲涅耳透鏡等,光軸方向剖面為閃電形狀之類的透鏡。 It is preferable that the lens portion has a lightning-like cross section in the optical axis direction. According to the manufacturing method of the present invention, by the aforementioned energy hardening property The resin contains the modified polyfluorene oxygen, and can also be expected to have a bubble suppressing effect at the time of curing. Therefore, it is particularly suitable for a lens such as a Fresnel lens or the like, and has a lightning-like cross section in the optical axis direction.
於前述透鏡陣列之前述透鏡部的背面側為平面,較佳為將可撓性樹脂薄片密著於前述平面。藉由使可撓性樹脂薄片密著於前述平面,而於藉由割斷將前述透鏡陣列予以個片化時,前述透鏡部不會分散而落下,而處理性優異。 The back surface side of the lens portion of the lens array is a flat surface, and it is preferable that the flexible resin sheet is adhered to the flat surface. When the flexible resin sheet is adhered to the flat surface and the lens array is formed by cutting, the lens portion is not dispersed and falls, and the handleability is excellent.
較佳為沿著前述溝槽割斷藉由前述製造方法所製造的透鏡陣列,而將每一前述透鏡部予以個片化。藉由將上述樹脂作為原料,而可抑制割斷時之碎屑或塵埃的產生,並且以較少的工程數大量且低價製造光學元件。 Preferably, each of the aforementioned lens portions is sliced by cutting the lens array manufactured by the above-described manufacturing method along the groove. By using the above-mentioned resin as a raw material, it is possible to suppress the generation of debris or dust at the time of cutting, and to manufacture an optical element in a large amount and at a low cost with a small number of engineering.
前述割斷較佳為藉由於相鄰接之前述透鏡部彼此分離的方向賦予前述透鏡陣列力量而進行。藉此,在最脆弱的前述溝槽之底部產生割斷,而可容易地將前述透鏡陣列予以個片化。 The cutting is preferably performed by imparting force to the lens array in a direction in which the adjacent lens portions are separated from each other. Thereby, the cutting is caused at the bottom of the most fragile groove, and the aforementioned lens array can be easily sliced.
本發明之光學元件,其特徵為藉由前述製造方法所製造。 The optical element of the present invention is characterized by being manufactured by the aforementioned manufacturing method.
能量硬化性樹脂係可使用光硬化性樹脂或熱硬化性樹脂。 As the energy curable resin, a photocurable resin or a thermosetting resin can be used.
於光硬化性樹脂或熱硬化性樹脂的例子中,係包含丙烯酸樹脂或烯丙基酯樹脂、乙烯系樹脂、環氧系樹脂等。作為能量硬化性樹脂組成物之丙烯酸樹脂材料或烯丙基酯樹脂材料、乙烯系樹脂材料,係包含能藉由光聚合起始劑之自由基聚合所硬化的聚合性單體與光聚合起始劑。此外,作為能量硬化性樹脂組成物之環氧系樹脂材料,係包含能藉由光聚合起始劑之陽離子聚合或陰離子聚合所硬化的聚合性單體與光聚合起始劑。以下,針對聚合性組成物(樹脂材料)及光聚合起始劑進行說明。 Examples of the photocurable resin or the thermosetting resin include an acrylic resin, an allyl ester resin, a vinyl resin, an epoxy resin, and the like. The acrylic resin material or the allyl ester resin material or the ethylene resin material as the energy curable resin composition contains a polymerizable monomer which can be hardened by radical polymerization of a photopolymerization initiator and a photopolymerization initiation. Agent. Further, the epoxy resin material as the energy curable resin composition contains a polymerizable monomer and a photopolymerization initiator which can be cured by cationic polymerization or anionic polymerization of a photopolymerization initiator. Hereinafter, a polymerizable composition (resin material) and a photopolymerization initiator will be described.
作為丙烯酸樹脂材料使用的(甲基)丙烯酸酯之種類並無特別限定。於(甲基)丙烯酸酯的例子中係可包含酯(甲基)丙烯酸酯、胺甲酸酯(甲基)丙烯酸酯、環氧(甲基)丙烯酸酯、醚(甲基)丙烯酸酯、烷基(甲基)丙烯酸酯、伸烷基(甲基)丙烯酸酯、具有芳香環之(甲基)丙烯酸酯、多官能(甲基)丙烯酸酯、具有脂環式結構之(甲基)丙烯酸酯。此等係可單獨使用,亦可將2種以上組合使用。 The type of the (meth) acrylate used as the acrylic resin material is not particularly limited. In the case of the (meth) acrylate, an ester (meth) acrylate, a urethane (meth) acrylate, an epoxy (meth) acrylate, an ether (meth) acrylate, an alkane may be contained. (meth) acrylate, alkyl (meth) acrylate, (meth) acrylate having an aromatic ring, polyfunctional (meth) acrylate, (meth) acrylate having an alicyclic structure . These may be used alone or in combination of two or more.
此等之中係以具有脂環式結構之(甲基)丙烯酸酯為佳。脂環式結構亦可為含有氧原子或氮原子之脂環式結構。於如此之(甲基)丙烯酸酯的例子中係可包含:環己基(甲基)丙烯酸酯、環戊基(甲基)丙烯酸酯、環庚基(甲基)丙烯酸酯、雙環庚基(甲基)丙烯酸酯、 三環癸基(甲基)丙烯酸酯、三環癸烷二甲醇(甲基)丙烯酸酯、或異莰基(甲基)丙烯酸酯、氫化雙酚類之二(甲基)丙烯酸酯等。此外,具有脂環式結構之(甲基)丙烯酸酯當中,亦以具有金剛烷骨架者特別佳。於如此之(甲基)丙烯酸酯的例子中,係包含2-烷基-2-金剛烷基(甲基)丙烯酸酯(參照日本特開2002-193883號公報)、金剛烷基二(甲基)丙烯酸酯(參照日本特開昭57-500785號公報)、金剛烷基二羧酸二烯丙基(參照日本特開昭60-100537號公報)、全氟金剛烷基丙烯酸酯(參照日本特開2004-123687號公報)、2-甲基-2-金剛烷基甲基丙烯酸(新中村化學工業股份有限公司)、1,3-金剛烷二醇二丙烯酸酯、1,3,5-金剛烷三醇三丙烯酸酯、不飽和羧酸金剛烷基酯(參照日本特開2000-119220號公報)、3,3’-二烷氧基羰基-1,1’雙金剛烷(參照日本特開2001-253835號公報)、1,1’-雙金剛烷化合物(參照美國專利第3342880號說明書)、四金剛烷(參照日本特開2006-169177號公報)、2-烷基-2-羥基金剛烷、2-伸烷基金剛烷、1,3-金剛烷二羧酸二-tert-丁基等不具芳香環之具有金剛烷骨架的硬化性樹脂(參照日本特開2001-322950號公報)、雙(羥基苯基)金剛烷類或雙(縮水甘油氧苯基)金剛烷(參照日本特開平11-35522號公報及日本特開平10-130371號公報)等。 Among these, (meth) acrylate having an alicyclic structure is preferred. The alicyclic structure may also be an alicyclic structure containing an oxygen atom or a nitrogen atom. In the case of such a (meth) acrylate, it may include: cyclohexyl (meth) acrylate, cyclopentyl (meth) acrylate, cycloheptyl (meth) acrylate, bicycloheptyl (A) Acrylate, Tricyclodecyl (meth) acrylate, tricyclodecane dimethanol (meth) acrylate, or isodecyl (meth) acrylate, hydrogenated bisphenol bis (meth) acrylate, and the like. Further, among the (meth) acrylates having an alicyclic structure, those having an adamantane skeleton are particularly preferable. In the case of such a (meth) acrylate, 2-alkyl-2-adamantyl (meth) acrylate (refer to JP-A-2002-193883), adamantyl bis (methyl) Acrylate (refer to Japanese Laid-Open Patent Publication No. SHO 57-500785), adamantyl adamantyl dicarboxylate (refer to JP-A-60-100537), and perfluoroadamantyl acrylate (refer to Japanese special) JP-A-2004-123687), 2-methyl-2-adamantyl methacrylic acid (Xinzhongcun Chemical Industry Co., Ltd.), 1,3-adamantanediol diacrylate, 1,3,5-gold Alkanol triol triacrylate, unsaturated adamantyl carboxylate (refer to JP-A-2000-119220), 3,3'-dialkoxycarbonyl-1,1' bisadamantane (refer to Japan Special Edition) JP-A-2001-253835), 1,1'-bisadamantane compound (refer to the specification of U.S. Patent No. 3,342,880), tetraamantane (refer to JP-A-2006-169177), 2-alkyl-2-hydroxyaluminum A curable resin having an adamantane skeleton having no aromatic ring, such as an alkane, a 2-alkylalkyladamantane or a 1,3-adamantane dicarboxylic acid di-tert-butyl group (refer to Japanese Patent Laid-Open Publication No. 2001-322950) Reported), bis (hydroxyphenyl) adamantanes or bis (glycidyl oxyphenyl) adamantane (refer to Japanese Patent Laid-Open Publication No. 11-35522 and Japanese Patent Publication Laid-Open No. 10-130371) and the like.
此外,丙烯酸樹脂材料亦可含有(甲基)丙烯酸酯或多官能(甲基)丙烯酸酯等之其他的反應性單體 。於如此之(甲基)丙烯酸酯的例子中係包含:甲基丙烯酸酯、甲基丙烯酸甲酯、n-丁基丙烯酸酯、n-丁基甲基丙烯酸酯、2-乙基己基丙烯酸酯、2-乙基己基甲基丙烯酸酯、異丁基丙烯酸酯、異丁基甲基丙烯酸酯、tert-丁基丙烯酸酯、tert-丁基甲基丙烯酸酯、苯基丙烯酸酯、苯基甲基丙烯酸酯、苄基丙烯酸酯、苄基甲基丙烯酸酯、環己基丙烯酸酯、環己基甲基丙烯酸酯等。此外,於多官能(甲基)丙烯酸酯的例子中係包含:三羥甲基丙烷三(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、二季戊四醇五(甲基)丙烯酸酯、二季戊四醇四(甲基)丙烯酸酯、二季戊四醇三(甲基)丙烯酸酯、三季戊四醇八(甲基)丙烯酸酯、三季戊四醇七(甲基)丙烯酸酯、三季戊四醇六(甲基)丙烯酸酯、三季戊四醇五(甲基)丙烯酸酯、三季戊四醇四(甲基)丙烯酸酯、三季戊四醇三(甲基)丙烯酸酯等。 Further, the acrylic resin material may contain other reactive monomers such as (meth) acrylate or polyfunctional (meth) acrylate. . In the case of such a (meth) acrylate, it includes: methacrylate, methyl methacrylate, n-butyl acrylate, n-butyl methacrylate, 2-ethylhexyl acrylate, 2- Ethylhexyl methacrylate, isobutyl acrylate, isobutyl methacrylate, tert-butyl acrylate, tert-butyl methacrylate, phenyl acrylate, phenyl methacrylate, benzyl acrylate , benzyl methacrylate, cyclohexyl acrylate, cyclohexyl methacrylate, and the like. Further, in the example of the polyfunctional (meth) acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol Hexa (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol tetra (meth) acrylate, dipentaerythritol tri (meth) acrylate, tripentaerythritol octa (meth) acrylate, tripentaerythritol Hexa (meth) acrylate, tripentaerythritol hexa (meth) acrylate, tripentaerythritol penta (meth) acrylate, tripentaerythritol tetra (meth) acrylate, tripentaerythritol tri (meth) acrylate, and the like.
烯丙基酯樹脂材料係為具有烯丙基,且藉由自由基聚合而硬化的樹脂材料。烯丙基酯樹脂材料之種類並無特別限定。於烯丙基酯樹脂材料的例子中係包含:不含芳香環之含溴(甲基)烯丙基酯樹脂(參照日本特開2003-66201號公報)、烯丙基(甲基)丙烯酸酯樹脂(參照日本特開平5-286896號公報)、烯丙基酯樹脂(參照日本特開平 5-286896號公報、日本特開2003-66201號公報)等。 The allyl ester resin material is a resin material having an allyl group and hardened by radical polymerization. The type of the allyl ester resin material is not particularly limited. In the example of the allyl ester resin material, the bromine-containing (meth) allyl ester resin containing no aromatic ring (refer to JP-A-2003-66201), allyl (meth) acrylate Resin (refer to Japanese Laid-Open Patent Publication No. Hei 5-286896) and allyl ester resin (refer to JP-A Kaiping, Japan) Japanese Laid-Open Patent Publication No. Hei 5-286896, No. 2003-66201, and the like.
乙烯系樹脂材料的種類係只要可形成透明的樹脂硬化物之物則無特別限定。聚乙烯系樹脂之單體係以一般式CH2=CH-R所表示。於聚乙烯系樹脂的例子中係包含:聚氯乙烯或聚苯乙烯等。聚乙烯系樹脂係以R中含有芳香族的芳香族系乙烯樹脂為佳。尤其,更佳為單體1分子中具有2個以上之乙烯基的二乙烯系樹脂。此等係可單獨使用,亦可將2種以上組合使用。 The type of the vinyl resin material is not particularly limited as long as it can form a transparent resin cured product. The single system of the polyethylene resin is represented by the general formula CH2=CH-R. Examples of the polyethylene-based resin include polyvinyl chloride, polystyrene, and the like. The polyethylene resin is preferably an aromatic vinyl resin containing an aromatic group in R. In particular, a divinyl resin having two or more vinyl groups in one molecule of the monomer is more preferable. These may be used alone or in combination of two or more.
環氧系樹脂材料的種類係只要具有環氧基,且光或藉由光及熱而聚合硬化者則無特別限定。硬化起始劑係可使用酸酐、陽離子產生劑、陰離子產生劑等。環氧系樹脂係由於硬化收縮率低,因此就使成形精準度提昇的觀點而言為佳。 The type of the epoxy resin material is not particularly limited as long as it has an epoxy group and is light-polymerized or cured by light and heat. As the hardening initiator, an acid anhydride, a cation generating agent, an anion generating agent or the like can be used. Since the epoxy resin has a low curing shrinkage ratio, it is preferable from the viewpoint of improving the molding accuracy.
於環氧系樹脂的例子中係包含:酚醛清漆酚型環氧樹脂、聯苯型環氧樹脂、二雙環戊二烯型環氧樹脂。更具體而言係可例示有將雙酚F二縮水甘油醚、雙酚A二縮水甘油醚、2,2’-雙(4-縮水甘油基氧基環己基)丙烷、3,4-環氧環己基甲基-3,4-環氧環己烷羧酸酯、乙烯環己烯二氧化物、2-(3,4-環氧環己基)-5,5-螺-(3,4-環氧環己烷)-1,3-二噁烷、雙(3,4-環氧環己基)己二酸酯、 1,2-環丙烷二羧酸雙縮水甘油酯等聚合者。 Examples of the epoxy resin include a novolac phenol epoxy resin, a biphenyl epoxy resin, and a dicyclopentadiene epoxy resin. More specifically, bisphenol F diglycidyl ether, bisphenol A diglycidyl ether, 2,2'-bis(4-glycidyloxycyclohexyl)propane, 3,4-epoxy Cyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, ethylene cyclohexene dioxide, 2-(3,4-epoxycyclohexyl)-5,5-spiro-(3,4- Epoxycyclohexane)-1,3-dioxane, bis(3,4-epoxycyclohexyl) adipate, A polymer such as 1,2-cyclopropanedicarboxylic acid bisglycidyl ester.
光聚合起始劑的種類,基本上係因應聚合成組成物(樹脂材料)的種類加以選擇。光聚合起始劑的種類係只要於紫外域(400nm以下)的波長具有極大吸收,且在該紫外域的波長產生自由基、陽離子或陰離子者則無特別限定。另外,於選擇光聚合起始劑時,係以考量使在使用波長域的光穿透率降低,並且考慮吸光度對於硬化光(紫外線)成為適當的值為佳。 The type of the photopolymerization initiator is basically selected in accordance with the kind of the composition (resin material) to be polymerized. The type of the photopolymerization initiator is not particularly limited as long as it has a maximum absorption at a wavelength in the ultraviolet region (400 nm or less) and generates a radical, a cation or an anion at a wavelength in the ultraviolet region. Further, when the photopolymerization initiator is selected, the light transmittance in the wavelength range of use is lowered in consideration of the value, and it is preferable that the absorbance is appropriate for the hardened light (ultraviolet light).
產生自由基的光聚合起始劑係可使用分子內開裂型起始劑及抽氫反應型起始劑中任一者。於分子內開裂型起始劑中係具有:安息香醚衍生型、苯乙酮型、醯基膦氧化物型等。於苯乙酮型的例子中係包含:苄基縮酮、α-羥基苯乙酮、α-胺基苯乙酮等。於醯基膦氧化物型的例子中係具有:雙醯基膦氧化物(BAPO)、單醯基膦氧化物(MAPO)等。於抽氫反應型起始劑中係具有:二苯基酮型、胺型、噻噸酮型等。 As the photopolymerization initiator which generates a radical, any of an intramolecular cracking type initiator and a hydrogen absorption reaction type initiator can be used. The intramolecular cracking type initiator has a benzoin ether-derived type, an acetophenone type, a mercaptophosphine oxide type, and the like. Examples of the acetophenone type include a benzyl ketal, an α-hydroxyacetophenone, an α-aminoacetophenone, and the like. Examples of the mercaptophosphine oxide type include bis-decylphosphine oxide (BAPO), monodecylphosphine oxide (MAPO), and the like. The hydrogen extraction reaction type initiator has a diphenyl ketone type, an amine type, a thioxanthone type, and the like.
在此,若考慮為了使用於透鏡部而使樹脂不黃變的情況等,則α-羥基苯乙酮係以使用DAROCURE 1173、IRGACURE 184、IRGACURE 127(皆為汽巴.日本股份有限公司)等為佳。此外,α-胺基苯乙酮係以使用IRGACURE 907、IRGACURE 369(皆為汽巴.日本股份有限公司)等為佳。 Here, in consideration of the case where the resin is not yellowed in order to be used in the lens portion, the α-hydroxyacetophenone is DAROCURE 1173, IRGACURE 184, IRGACURE 127 (all are Ciba. Japan Co., Ltd.), and the like. It is better. Further, the α-aminoacetophenone is preferably IRGACURE 907 or IRGACURE 369 (all are Ciba. Japan Co., Ltd.).
此外,產生自由基的光聚合起始劑亦以使用具有UV照射後進行光褪色(photobleaching)的效果之光聚合起始劑為佳。於如此之光聚合起始劑的例子係包含醯基膦氧化物等。使用具有光褪色效果的光聚合起始劑時,伴隨光反應,光聚合起始劑之吸收帶會消失(光褪色),藉此可使硬化光到達樹脂之更深部,以促進樹脂的內部硬化。於醯基膦氧化物的例子中係包含:MAPO之2,4,6-三甲基苯甲醯基-二苯基-膦氧化物(DAROCUR TPO)、或BAPO之雙(2,4,6-三甲基苯甲醯基)-苯基膦氧化物(IRGACURE 819)、或二茂鈦化合物之IRGACURE 784(皆為汽巴.日本股份有限公司)等。尤其,DAROCUR TPO或IRGACURE 819等由於會伴隨光反應而成為無色,因此作為透鏡用途更為理想。 Further, a photopolymerization initiator which generates a radical is also preferably a photopolymerization initiator which has an effect of performing photobleaching after UV irradiation. Examples of such photopolymerization initiators include mercaptophosphine oxides and the like. When a photopolymerization initiator having a photofading effect is used, the absorption band of the photopolymerization initiator disappears (light fading) accompanying the photoreaction, whereby the hardened light reaches the deeper portion of the resin to promote internal hardening of the resin. . In the case of the mercaptophosphine oxide, 2,4,6-trimethylbenzimidyl-diphenyl-phosphine oxide (DAROCUR TPO) of MAPO, or double of BAPO (2,4,6) -Trimethylbenzhydryl)-phenylphosphine oxide (IRGACURE 819), or IRGACURE 784 of a titanocene compound (all are Ciba. Japan Co., Ltd.) and the like. In particular, DAROCUR TPO or IRGACURE 819 is colorless due to photoreaction, and therefore is more preferable as a lens.
於產生陽離子之光聚合起始劑中係具有:鋶鹽、錪鹽、重氮鹽、二茂鐵鹽等。於鋶鹽的例子中係包含:CYRACURE UVI-6976、UVI-6992(皆為Dow Chemical公司)、SUN-aid SI-60L、SI-80L(三新化學工業股份有限公司)、ADEKA OPTOMER SP-150、SP-170(股份有限公司ADEKA)、Uvacure1590(DAICEL UCB股份有限公司)等。於錪鹽的例子中係包含:UV9380C(Momentive Performance Materials Japan聯合公司)、IRGACURE 250(汽巴.日本股份有限公司)等。 The photopolymerization initiator which produces a cation has an onium salt, a phosphonium salt, a diazonium salt, a ferrocene salt or the like. Examples of the yttrium salt include: CYRACURE UVI-6976, UVI-6992 (all are Dow Chemical), SUN-aid SI-60L, SI-80L (Sanshin Chemical Industry Co., Ltd.), ADEKA OPTOMER SP-150 , SP-170 (company ADEKA), Uvacure 1590 (DAICEL UCB Co., Ltd.), etc. Examples of the sulfonium salt include UV9380C (Momentive Performance Materials Japan Co., Ltd.), IRGACURE 250 (Ciba. Japan Co., Ltd.), and the like.
於產生陰離子之光聚合起始劑中係具有:烷基鋰、胺甲酸酯衍生物、肟酯衍生物、光胺產生劑等。 The photopolymerization initiator which produces an anion has an alkyllithium, a carbamate derivative, an oxime ester derivative, a photoamine generator, and the like.
光聚合起始劑之添加量,相對於光硬化性樹脂材料(樹脂材料及光聚合起始劑),較佳為0.001質量%~5質量%之範圍內,更佳為0.01質量%~3質量%之範圍內,特別佳為0.05質量%~1質量%之範圍內。 The amount of the photopolymerization initiator to be added is preferably in the range of 0.001% by mass to 5% by mass, more preferably 0.01% by mass to 3% by mass based on the photocurable resin material (resin material and photopolymerization initiator). Within the range of %, particularly preferably in the range of 0.05% by mass to 1% by mass.
熱聚合起始劑係可列舉例如:二異丙基苯氫過氧化物、1,1,3,3-四甲基丁基氫過氧化物、異丙苯氫過氧化物、tert-己基氫過氧化物、tert-丁基氫過氧化物等之氫過氧化物類、α,α’-雙(tert-丁基過氧基-m-異丙基)苯、二(cumyl)過氧化物、2,5-二甲基-2,5-雙(tert-丁基過氧基)己烷、tert-丁基基過氧化物、二-tert-丁基過氧化物、2,5-二甲基-2,5-雙(tert-丁基過氧基)己烷-3等之二烷基過氧化物類;酮過氧化物類、過氧縮酮類、二醯基過氧化物類、過氧化二碳酸酯類、過氧化酯類等之有機過氧化物、或者2,2’-偶氮二異丁腈、1,1’-(環己烷-1-腈)、2,2’-偶氮二(2-環丙基丙腈)、2,2’-偶氮二(2,4-二甲基戊腈)等之偶氮化合物等。 The thermal polymerization initiator may, for example, be diisopropylbenzene hydroperoxide, 1,1,3,3-tetramethylbutyl hydroperoxide, cumene hydroperoxide or tert-hexyl hydrogen. Hydroperoxides such as peroxides, tert-butyl hydroperoxides, α,α'-bis(tert-butylperoxy-m-isopropyl)benzene, (cumyl) peroxide, 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexane, tert-butyl a dialkyl peroxide such as a base peroxide, a di-tert-butyl peroxide or a 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexane-3 An organic peroxide such as a ketone peroxide, a peroxyketal, a dimercapto peroxide, a peroxydicarbonate or a peroxyester, or 2,2'-azobisisobutyl Nitrile, 1,1'-(cyclohexane-1-carbonitrile), 2,2'-azobis(2-cyclopropylpropionitrile), 2,2'-azobis(2,4-dimethyl An azo compound or the like such as valeronitrile.
上述熱陽離子硬化劑係可列舉例如:具有至少1個烷基之銨鹽、鋶鹽、錪鹽、重氮鹽、三氟化硼.三乙基胺錯合物等。此等鹽類之對陰離子係可列舉例如:SbF6 -、PF6 -、AsF6 -、BF4 -、肆(五氟)硼酸鹽、三氟甲磺酸鹽、甲磺酸鹽、三氟乙酸鹽、乙酸鹽、磺酸鹽、甲苯磺酸鹽、硝酸鹽等陰離子。 The thermal cationic hardener may, for example, be an ammonium salt having at least one alkyl group, a phosphonium salt, a phosphonium salt, a diazonium salt or a boron trifluoride. Triethylamine complex and the like. Examples of the counter anion of these salts include, for example, SbF 6 - , PF 6 - , AsF 6 - , BF 4 - , decyl (pentafluoro) borate, trifluoromethanesulfonate, methanesulfonate, trifluoro Anions such as acetates, acetates, sulfonates, tosylates, nitrates, and the like.
於聚矽氧中,將有機基導入側鏈、末端者稱為改質聚矽氧,且藉由被取代之有機基的鍵結位置而大致分類成4種類的結構。此外,亦藉由所導入之有機基的性質而分類成反應性聚矽氧與非反應性聚矽氧。例如,環氧改質聚矽氧係指將聚矽氧之甲基的一部分取代成含環氧基之烷基者。在此,使用具有與能量硬化性樹脂之官能基產生化學反應而形成鍵結的官能基之改質聚矽氧。例如於環氧樹脂之情況中,可使用環氧改質聚矽氧、聚酯改質聚矽氧、胺改質聚矽氧等。丙烯酸樹脂之情況中,可使用甲基丙烯酸改質聚矽氧、或羧基改質聚矽氧。 In the polyoxymethylene, the organic group is introduced into the side chain and the terminal is referred to as a modified polyfluorene oxygen, and is roughly classified into four types of structures by the bonding positions of the substituted organic groups. In addition, it is classified into reactive polyfluorene and non-reactive polyoxane by the nature of the introduced organic group. For example, epoxy modified polyoxymethylene refers to a group in which a part of a methyl group of polyoxymethylene is substituted with an alkyl group containing an epoxy group. Here, modified polyoxane having a functional group which chemically reacts with a functional group of an energy-curable resin to form a bond is used. For example, in the case of an epoxy resin, an epoxy-modified polyfluorene oxide, a polyester-modified polyfluorene oxide, an amine-modified polyfluorene oxide, or the like can be used. In the case of an acrylic resin, methacrylic acid modified polyfluorene oxide or carboxyl modified polyoxyl oxide can be used.
聚矽氧系化合物之較佳的例子係可列舉:包含複數個二甲基矽烷氧基單元作為重複單元,且於化合物鏈之末端及/側鏈具有取代基者。亦可於包含二甲基矽烷氧基作為重複單元的化合物鏈中含有二甲基矽烷氧基以外之結構單元。取代基係可相同或相異,且以複數個為佳。較佳之取代基的例子係可列舉含有聚醚基、烷基、芳基、芳氧基、丙烯醯基、甲基丙烯醯基、乙烯基、芳基、桂皮醯基、環氧基、環氧丙烷基、羥基、氟烷基、聚氧伸烷基、羧基、胺基等之基。 Preferable examples of the polyoxymethylene compound include a plurality of dimethyl decyloxy units as a repeating unit and a substituent at the terminal and/or side chains of the compound chain. A structural unit other than dimethyl nonyloxy group may be contained in the compound chain containing a dimethyl nonyloxy group as a repeating unit. The substituent groups may be the same or different, and a plurality of substituents are preferred. Examples of preferred substituents include polyether groups, alkyl groups, aryl groups, aryloxy groups, acryl groups, methacryl groups, vinyl groups, aryl groups, cinnamyl groups, epoxy groups, and epoxy groups. a group of a propane group, a hydroxyl group, a fluoroalkyl group, a polyoxyalkylene group, a carboxyl group, an amine group or the like.
改質聚矽氧之數量平均分子量雖設為1000以上、50000以下,但以1000~30000為更佳,以1000~20000再更佳,以2000~20000又再更佳。在此,數量平 均分子量(Mn)之測量係使用將四氫呋喃作為展開溶劑的凝膠滲透層析法(GPC),作為聚苯乙烯換算所求出的值。於本說明書中,係使用GPC測量裝置HLC-8020(TOSOH公司製)、及GPC管柱(依以下的順序通過):TSK guard column HXL-H、TSK gel GMHXL(×2)、TSK gel G2000HXL(以上為TOSOH公司製),將測量溶劑設為四氫呋喃,以測量溫度40℃的條件所測量出的值。若改質聚矽氧之數量平均分子量過小,則添加於能量硬化性樹脂組成物時,賦予最終所得到之硬化後的能量硬化性樹脂之柔軟性會不足,變得容易在割斷時產生碎屑。此外,若改質聚矽氧之數量平均分子量過小,則添加於能量硬化性樹脂組成物時,會有損及最終所得到之硬化後的能量硬化性樹脂之柔軟性,或使原本樹脂組成物之調整或處理變得困難的問題。因此,於本發明中,就不易產生上述問題,並且可較為容易取得的觀點而言,使用具有上述數值範圍的數量平均分子量之改質聚矽氧。 The number average molecular weight of the modified polyoxane is set to 1000 or more and 50,000 or less, but more preferably from 1,000 to 30,000, more preferably from 1,000 to 20,000, still more preferably from 2,000 to 20,000. Here, the quantity is flat The measurement of the average molecular weight (Mn) was carried out by gel permeation chromatography (GPC) using tetrahydrofuran as a developing solvent, and the value was determined in terms of polystyrene. In the present specification, the GPC measuring device HLC-8020 (manufactured by TOSOH Co., Ltd.) and the GPC column (passed in the following order) are used: TSK guard column HXL-H, TSK gel GMHXL (×2), TSK gel G2000HXL ( The above is a value measured by the condition that the measurement solvent is tetrahydrofuran and the temperature is 40 ° C. When the number average molecular weight of the modified polyfluorene is too small, when added to the energy curable resin composition, the softness of the energy curable resin obtained after the curing is insufficient, and it is easy to generate chips at the time of cutting. . Further, when the number average molecular weight of the modified polyfluorene is too small, the addition of the energy curable resin composition may impair the flexibility of the finally obtained hardened energy curable resin, or may cause the original resin composition. The problem of adjustment or processing becomes difficult. Therefore, in the present invention, the above problem is less likely to occur, and from the viewpoint of being easily obtainable, the modified polyfluorene oxide having the number average molecular weight in the above numerical range is used.
對於聚矽氧系化合物之聚矽氧原子含量雖無特別限制,但以相對於能量硬化性樹脂組成物全體為0.5~10質量%為佳。 The content of the polyfluorene oxygen atom of the polyoxymethylene compound is not particularly limited, but is preferably 0.5 to 10% by mass based on the total amount of the energy curable resin composition.
較佳之聚矽氧系化合物的例子雖可列舉:信越化學工業(股)製之“X-22-174DX”、“X-22-2426”、“X-22-164B”、“X22-164C”、“X-22-170DX”、“X-22-176D”、“X-22-1821”(以上為商品名);CHISSO(股)製之“FM-0725”、“FM-7725”、“FM- 4421”、“FM-5521”、“FM-6621”、“FM-1121”(以上為商品名);Gelest製之“DMS-U22”、“RMS-033”、“RMS-083”、“UMS-182”、“DMS-H21”、“DMS-H31”、“HMS-301”、“FMS121”、“FMS123”、“FMS131”、“FMS141”、“FMS221”(以上為商品名);Dow Corning Toray(股)製之“SH200”、“DC11PA”、“SH28PA”、“ST80PA”、“ST86PA”、“ST97PA”、“SH550”、“SH710”、“L7604”、“FZ-2105”、“FZ2123”、“FZ2162”、“FZ-2191”、“FZ2203”、“FZ-2207”、“FZ-3704”、“FZ-3736”、“FZ-3501”、“FZ-3789”、“L-77”、“L-720”、“L-7001”、“L-7002”、“L-7604”、“Y-7006”、“SS-2801”、“SS-2802”、“SS-2803”、“SS-2804”、“SS-2805”(以上為商品名);Momentive Performance Materials Japan製之“TSF400”、“TSF401”、“TSF410”、“TSF433”、“TSF4450”、“TSF4460”(以上為商品名)等但並不限定於此等。 Examples of preferred polyoxo-oxygen compounds include "X-22-174DX", "X-22-2426", "X-22-164B", and "X22-164C" manufactured by Shin-Etsu Chemical Co., Ltd. "X-22-170DX", "X-22-176D", "X-22-1821" (above is the trade name); "FM-0725", "FM-7725", "CHISSO" FM- 4421", "FM-5521", "FM-6621", "FM-1121" (above is the trade name); "DMS-U22", "RMS-033", "RMS-083", "UMS" by Gelest -182", "DMS-H21", "DMS-H31", "HMS-301", "FMS121", "FMS123", "FMS131", "FMS141", "FMS221" (above); Dow Corning "SH200", "DC11PA", "SH28PA", "ST80PA", "ST86PA", "ST97PA", "SH550", "SH710", "L7604", "FZ-2105", "FZ2123" manufactured by Toray Co., Ltd. ", FZ2162", "FZ-2191", "FZ2203", "FZ-2207", "FZ-3704", "FZ-3736", "FZ-3501", "FZ-3789", "L-77" ", L-720", "L-7001", "L-7002", "L-7604", "Y-7006", "SS-2801", "SS-2802", "SS-2803", "SS-2804" and "SS-2805" (the above are trade names); "TSF400", "TSF401", "TSF410", "TSF433", "TSF4450", "TSF4460" manufactured by Momentive Performance Materials Japan (above The product name) is not limited to this.
若依據本發明,則可提供一種能夠以低成本大量生產光學元件的透鏡陣列、透鏡陣列之製造方法及光學元件之製造方法。 According to the present invention, it is possible to provide a lens array capable of mass-producing an optical element at a low cost, a method of manufacturing a lens array, and a method of manufacturing an optical element.
10‧‧‧輔助光源單元 10‧‧‧Auxiliary light source unit
11‧‧‧基板 11‧‧‧Substrate
12‧‧‧光源 12‧‧‧Light source
13‧‧‧光學元件 13‧‧‧Optical components
13B‧‧‧透鏡部 13B‧‧‧Lens Department
13C‧‧‧基準面 13C‧‧‧ datum
13V‧‧‧V溝槽、谷部 13V‧‧‧V groove, valley
13a‧‧‧平行平板 13a‧‧‧parallel plate
13b‧‧‧光穿透部 13b‧‧‧Light penetration
13c‧‧‧輪帶部 13c‧‧‧ wheel belt
13cx‧‧‧扇部 13cx‧‧‧ sector
13cy‧‧‧扇部 13cy‧‧‧ sector
14‧‧‧間隔物 14‧‧‧ spacers
14a‧‧‧內周面 14a‧‧‧ inner circumference
50‧‧‧攝像裝置 50‧‧‧ camera device
60‧‧‧操作鈕 60‧‧‧ operation button
100‧‧‧行動電話機 100‧‧‧Mobile phone
BK‧‧‧底板 BK‧‧‧ bottom plate
C‧‧‧切斷刀 C‧‧‧cutting knife
HB‧‧‧焊球 HB‧‧‧ solder balls
IM‧‧‧成形體 IM‧‧‧formed body
LA‧‧‧透鏡陣列 LA‧‧‧Lens Array
M‧‧‧模具 M‧‧‧Mold
Ma‧‧‧轉印面 Ma‧‧·Transfer surface
Mb‧‧‧隆起部 Mb‧‧‧ Uplift
OPx‧‧‧光軸外側面 OPx‧‧‧ optical axis outer side
OPy‧‧‧光軸外側面 OPy‧‧‧ outside of the optical axis
PL‧‧‧樹脂 PL‧‧‧Resin
M1、M1’、M1”‧‧‧模 M1, M1’, M1”
M2‧‧‧對向模 M2‧‧‧ opposite mode
M1a‧‧‧透鏡轉印部 M1a‧‧‧Lens Transfer Department
M1b‧‧‧凸狀轉印部 M1b‧‧‧ convex transfer part
[第1圖]係使用第1實施形態之製造方法所製造的光學元件之輔助光源單元10的立體圖。 [Fig. 1] is a perspective view of an auxiliary light source unit 10 of an optical element manufactured by the manufacturing method of the first embodiment.
[第2圖]係由射出面側觀看輔助光源單元10的圖。 [Fig. 2] A view of the auxiliary light source unit 10 viewed from the exit surface side.
[第3圖]係以III-III線切斷第2圖之構造而朝箭頭方向觀看的圖。 [Fig. 3] A view in which the structure of Fig. 2 is cut along the line III-III and viewed in the direction of the arrow.
[第4圖]係輔助光源單元10的透視立體圖。 [Fig. 4] is a perspective perspective view of the auxiliary light source unit 10.
[第5圖]係作為將輔助光源單元10與攝像裝置50相鄰接而設置的行動終端之一例的行動電話機100的外觀圖,(a)為表面,(b)為背面。 [Fig. 5] is an external view of a mobile phone 100 as an example of a mobile terminal provided adjacent to the auxiliary light source unit 10 and the imaging device 50, wherein (a) is a surface and (b) is a back surface.
[第6圖]係顯示輔助光源單元之製造步驟(a)~(h)的圖。 [Fig. 6] is a view showing manufacturing steps (a) to (h) of the auxiliary light source unit.
[第7圖]係顯示切斷刀被彈性支撐之狀態的圖,且(a)顯示切斷刀C的前端被導引至適當的切斷位置之前,及(b)顯示切斷刀C的前端被導引至適當的切斷位置之後。 [Fig. 7] is a view showing a state in which the cutting blade is elastically supported, and (a) shows that the leading end of the cutting blade C is guided to an appropriate cutting position, and (b) shows the cutting blade C. The front end is guided to the appropriate cut position.
[第8圖]係顯示基底層為1層之例的圖,且(a)顯示直接形成於底板BK上之透鏡部13B的圖,(b)顯示具有此透鏡部13B之輔助光源單元的圖。 [Fig. 8] is a view showing an example in which the base layer is one layer, and (a) is a view showing the lens portion 13B formed directly on the bottom plate BK, and (b) is a view showing the auxiliary light source unit having the lens portion 13B. .
[第9圖]係顯示透鏡陣列薄片之一例的立體圖。 [Fig. 9] is a perspective view showing an example of a lens array sheet.
[第10圖]係顯示透鏡陣列薄片之其他例的立體圖。 Fig. 10 is a perspective view showing another example of the lens array sheet.
[第11圖]雖顯示透鏡陣列薄片之另一例的立體圖,但谷部係省略圖示。 [Fig. 11] Although a perspective view showing another example of the lens array sheet is shown, the valley portion is omitted.
[第12圖]係顯示變形例之具有透鏡部之透鏡陣列薄 片的俯視圖。 [Fig. 12] shows a lens array thin film having a lens portion according to a modification Top view of the piece.
[第13圖]係於第2實施形態中,於透鏡陣列之成形所使用之模的剖面圖。 Fig. 13 is a cross-sectional view showing a mold used for molding a lens array in the second embodiment.
[第14圖]係顯示透鏡陣列之製造步驟(a)~(g)的圖。 [Fig. 14] is a view showing manufacturing steps (a) to (g) of the lens array.
[第15圖](a)係顯示將輔助光源單元進行組裝之步驟的圖,(b)係輔助光源單元之剖面圖。 [Fig. 15] (a) is a view showing a step of assembling the auxiliary light source unit, and (b) is a cross-sectional view of the auxiliary light source unit.
[第16圖](a)係顯示變形例之模M1’的一部分、與藉此所形成之透鏡陣列LA的一部分的圖,(b)係變形例之輔助光源單元的剖面圖。 [Fig. 16] (a) is a view showing a part of a mold M1' of a modification and a part of a lens array LA formed thereby, and (b) is a cross-sectional view of an auxiliary light source unit according to a modification.
[第17圖](a)係形成有不需要部分之透鏡陣列的立體圖,(b)係以XB-XB線切斷(a)之構造而朝箭頭方向觀看的圖,(c)係將不需要部分割斷後之透鏡陣列的立體圖。 [Fig. 17] (a) is a perspective view of a lens array in which an unnecessary portion is formed, (b) is a view in which the structure is cut in the direction of the arrow by the XB-XB line (a), and (c) is not A perspective view of the lens array after the partial division is required.
[第18圖]係顯示其他實施形態的透鏡陣列之製造步驟(a)~(e)的圖。 [Fig. 18] Fig. 18 is a view showing manufacturing steps (a) to (e) of the lens array of another embodiment.
[第19圖]係顯示將排列成1列的透鏡部剝離之狀態的立體圖。 [Fig. 19] is a perspective view showing a state in which the lens portions arranged in one row are peeled off.
[第20圖]係變形例之透鏡陣列的立體圖。 [Fig. 20] A perspective view of a lens array according to a modification.
[第21圖]係變形例之透鏡陣列的剖面圖。 [21] Fig. 21 is a cross-sectional view of a lens array according to a modification.
以下,一邊參照所添附的圖式,一邊說明本發明之實施形態。另外,圖式之尺寸比率係為了方便說明 而較為誇大,會有與實際之比例有所差異的情況。 Hereinafter, embodiments of the present invention will be described with reference to the attached drawings. In addition, the dimensional ratio of the schema is for convenience of explanation. More exaggerated, there will be a difference between the actual ratio.
第1圖係使用本實施形態之製造方法所製造的光學元件之輔助光源單元10的立體圖。第2圖係由射出面側觀看第1圖所示之輔助光源單元10的圖。第3圖係以III-III線切斷第2圖之構造而朝箭頭方向觀看的圖。第4圖係第1圖所示之輔助光源單元10的透視立體圖。另外,將光學元件的光軸方向設為Z方向,將垂直於Z方向的方向設為X方向,將垂直於Z方向與X方向的方向設為Y方向。 Fig. 1 is a perspective view of an auxiliary light source unit 10 of an optical element manufactured by the manufacturing method of the present embodiment. Fig. 2 is a view of the auxiliary light source unit 10 shown in Fig. 1 viewed from the exit surface side. Fig. 3 is a view in which the structure of Fig. 2 is cut along the line III-III and viewed in the direction of the arrow. Fig. 4 is a perspective perspective view of the auxiliary light source unit 10 shown in Fig. 1. Further, the optical axis direction of the optical element is set to the Z direction, the direction perpendicular to the Z direction is referred to as the X direction, and the direction perpendicular to the Z direction and the X direction is referred to as the Y direction.
如第2圖、第3圖所示般,本實施形態之輔助光源單元10,係由安裝於矩形狀的基板11之面且作為發光元件的LED光源12、設置於LED光源12的光射出側且外形為矩形狀的光學元件13、以及配置於LED光源12與光學元件13之間且作為保持構件的間隔物14所構成。間隔物14係如第4圖所示般,外形為四方筒狀且內形為圓筒狀,利用接著劑將其下端固定於基板11的上面,利用接著劑將其上端固定於光學元件13的下面。間隔物14的內周面14a係成為擴散面(白色塗裝面)。 As shown in FIG. 2 and FIG. 3, the auxiliary light source unit 10 of the present embodiment is an LED light source 12 that is mounted on the surface of the rectangular substrate 11 and is a light-emitting element, and is provided on the light-emitting side of the LED light source 12. The optical element 13 having a rectangular outer shape and a spacer 14 disposed between the LED light source 12 and the optical element 13 as a holding member are formed. The spacer 14 has a rectangular outer shape and a cylindrical inner shape as shown in Fig. 4, and its lower end is fixed to the upper surface of the substrate 11 by an adhesive, and its upper end is fixed to the optical element 13 by an adhesive. below. The inner circumferential surface 14a of the spacer 14 is a diffusion surface (white coating surface).
基板11係由基板主體、絕緣層、以及配線圖型所概略構成,該基板主體係由鋁所構成,該絕緣層係層合於基板主體上,該配線圖型係由形成於絕緣層上的Cu等之導體所構成。於配線圖型係連接有構成LED光源12 的LED晶片。 The substrate 11 is roughly constituted by a substrate main body, an insulating layer, and a wiring pattern. The main substrate of the substrate is made of aluminum. The insulating layer is laminated on the substrate main body, and the wiring pattern is formed on the insulating layer. A conductor made of Cu or the like. Connected to the wiring pattern to form the LED light source 12 LED chip.
作為輔助光源之LED光源12係構成為:LED晶片藉由矩形平板狀之模具成型的含螢光體之透明樹脂體(含螢光體之透明樹脂)所完全被覆,且來自LED晶片所射出的光皆會通過含螢光體之透明樹脂體。藉由此構造而成為例如,使用藍色發光二極體作為LED晶片,且使用黃色螢光體作為含螢光體之透明樹脂中所含有的螢光體,藉此而可射出白色光。另外,LED晶片,較佳為於X方向與Y方向分別具有邊的矩形狀。 The LED light source 12 as an auxiliary light source is configured such that the LED wafer is completely covered by a phosphor-containing transparent resin body (translucent resin containing a phosphor) formed by a rectangular flat mold, and is emitted from the LED wafer. Light passes through the transparent resin body containing the phosphor. With this configuration, for example, a blue light-emitting diode is used as the LED wafer, and a yellow phosphor is used as the phosphor contained in the phosphor-containing transparent resin, whereby white light can be emitted. Further, the LED chip preferably has a rectangular shape with sides in the X direction and the Y direction.
光學元件13,係於平行平板13a上(光射出側)中,形成設置於中央部的圓形之平面狀(或者球面或非球面狀)的光穿透部13b、與包圍光穿透部13b的周邊之閃電型的輪帶部13c而成。於輪帶部13c的周圍係形成有後述之V溝槽13V的斜面。使光學元件13的光軸通過光穿透部13b的中心。光學元件13之製造方法係稍後敘述。 The optical element 13 is formed on a parallel flat plate 13a (light emitting side), and forms a circular planar (or spherical or aspherical) light transmitting portion 13b and a surrounding light transmitting portion 13b provided at the center portion. The surrounding lightning-type belt portion 13c is formed. A slope of a V-groove 13V, which will be described later, is formed around the belt portion 13c. The optical axis of the optical element 13 is passed through the center of the light transmitting portion 13b. The manufacturing method of the optical element 13 will be described later.
如第2圖所示般,輪帶部13c係於周方向分割成4個,且具有挾持光穿透部13b而於X方向相對向的(第1之)一對扇部13cx、與挾持光穿透部13b而於Y方向相對向,且被包挾於一對扇部13cx的(第2之)一對扇部13cy。扇部13cx、13cy係彼此相接。如第3圖所示般,一對扇部13cx係以光軸為中心,具有具備光軸側面IPx與光軸外側面OPx的複數第1部分輪帶RPx,而一對扇部13cy係以光軸為中心,具有具備光軸側面IPy與 光軸外側面OPy的複數第2部分輪帶RPy。於本實施形態中,第1部分輪帶RPx的高度d1與第2部分輪帶RPy的高度d2係相等。 As shown in Fig. 2, the belt portion 13c is divided into four in the circumferential direction, and has a pair of first (13) portions of the fan portion 13cx that are opposed to each other in the X direction. The penetrating portion 13b faces in the Y direction and is wrapped around the pair of fan portions 13cy of the pair of the fan portions 13cx. The sectors 13cx and 13cy are in contact with each other. As shown in Fig. 3, the pair of fan portions 13cx have a plurality of first partial belt RPx including an optical axis side surface IPx and an optical axis outer side surface OPx around the optical axis, and the pair of fan portions 13cy are lighted. The axis is centered and has an optical axis side IPy and The second partial portion of the optical axis outer side OPy is RPy. In the present embodiment, the height d1 of the first partial belt RPx is equal to the height d2 of the second partial belt RPy.
另外,於第3圖中雖為了便於圖示,扇部13cx、13cy係以彼此相對向的方式顯示,但實際上,扇部13cx、13cy彼此並非相對向。此外,於光學元件13的光射出側,係為了辨識(第1之)一對扇部13cx、與(第2之)一對扇部13cy而形成有識別符號(無圖示)。此識別符號,係用以表示將此輔助光源單元與攝像裝置一起組入機器時之輪帶部的方向(於本例中係一對扇部13cy之某個方向),且於組入時可確認X方向與Y方向,而防止朝錯誤的方向組入者。此外,亦可取代將後述之由2層所構成的基底層之內的第1樹脂層設為平行平板13a,成為包含相當於平行平板13a的部位而與透鏡部一體成形。 Further, in the third drawing, the fan portions 13cx and 13cy are displayed to face each other for convenience of illustration, but actually, the fan portions 13cx and 13cy are not opposed to each other. Further, on the light emitting side of the optical element 13, an identification code (not shown) is formed to recognize the (first) pair of the sector 13cx and the (second) pair of sectors 13cy. The identification symbol is used to indicate the direction of the belt portion when the auxiliary light source unit is incorporated into the machine together with the image pickup device (in this example, a certain direction of the pair of sectors 13cy), and can be incorporated when being incorporated. Confirm the X direction and the Y direction to prevent the group from entering the wrong direction. In addition, the first resin layer in the underlying layer composed of two layers, which will be described later, may be formed as a parallel flat plate 13a, and the portion corresponding to the parallel flat plate 13a may be integrally formed with the lens portion.
第5圖(a)(b)係作為將本實施形態之輔助光源單元10鄰接於攝像裝置50而設置的行動終端之一例之行動電話機100的外觀圖。第5圖所示的行動電話機100,係經由鉸鏈73而連結作為外殼之上框體71與下框體72,該上框體71係具備顯示畫面D1及D2,該下框體72係具備作為輸入部的操作鈕60。攝像裝置50及輔助光元單元10,係內建於上框體71內之顯示畫面D2的下方,且以輔助光源單元10從上框體71的外表面側射出而將被攝體反射的光進入攝像裝置50之方式配置。另外,此攝像裝置的位置亦可配置於上框體71內的顯示畫面D2之 上方或側面。此外,行動電話機當然不限於摺疊式。另外,行動電話機係包含智慧型手機等。 (a) and (b) of FIG. 5 are external views of a mobile phone 100 as an example of a mobile terminal provided with the auxiliary light source unit 10 of the present embodiment adjacent to the imaging device 50. The mobile phone 100 shown in FIG. 5 is connected to the outer casing upper body 71 and the lower casing 72 via a hinge 73. The upper casing 71 includes display screens D1 and D2, and the lower casing 72 is provided as a lower casing 72. The operation button 60 of the input unit. The imaging device 50 and the auxiliary light element unit 10 are built in the lower side of the display screen D2 in the upper housing 71, and the auxiliary light source unit 10 emits light reflected from the outer surface side of the upper housing 71 to reflect the subject. It is configured to enter the imaging device 50. In addition, the position of the imaging device may be disposed on the display screen D2 in the upper housing 71. Top or side. Further, the mobile phone is of course not limited to folding. In addition, the mobile phone system includes a smart phone or the like.
將本實施形態之輔助光源單元10搭載於行動電話機100的情況中,使X方向成為攝像元件之短邊方向(垂直方向),使Y方向成為攝像元件之長邊方向(水平方向)。於使用攝像裝置50進行被攝體之攝像時,輔助光源單元10會發出光。此時,從LED光源射出,且通過光學元件13之光穿透部13b的光線,係當光穿透部13b為平面時會直接行進,為彎曲面時會因應該彎曲面被折射而行進。 When the auxiliary light source unit 10 of the present embodiment is mounted on the mobile phone 100, the X direction is the short side direction (vertical direction) of the imaging element, and the Y direction is the longitudinal direction (horizontal direction) of the imaging element. When the imaging of the subject is performed using the imaging device 50, the auxiliary light source unit 10 emits light. At this time, the light that is emitted from the LED light source and passes through the light transmitting portion 13b of the optical element 13 travels directly when the light transmitting portion 13b is a flat surface, and travels when the curved surface is refracted.
另一方面,入射至光學元件13而通過平行平板13a的光線當中,入射至一對扇部13cx的光線係在第1部分輪帶RPx的光軸外側面OPx折射之後,朝向被攝體射出。此外,入射至光學元件13而通過平行平板13a的光線當中,入射至一對扇部13cy的光線係在第2部分輪帶RPy的光軸外側面OPy折射之後,朝向被攝體射出。藉由從輔助光源單元10所射出的光線,可進行與攝像畫面配合的照射。 On the other hand, among the light rays that have entered the optical element 13 and passed through the parallel flat plate 13a, the light rays incident on the pair of fan portions 13cx are refracted toward the optical axis outer side surface OPx of the first partial wheel RPx, and are then emitted toward the subject. Further, among the light rays that have entered the optical element 13 and passed through the parallel flat plate 13a, the light rays incident on the pair of fan portions 13cy are refracted toward the optical axis outer side surface OPy of the second partial wheel RPy, and are then emitted toward the subject. Irradiation with the imaging screen can be performed by the light emitted from the auxiliary light source unit 10.
接著,參照第6圖,針對輔助光源單元之製造步驟進行說明。於本實施形態使用的切斷刀裝置CA,係如第7圖(a)所示般,具有複數切斷刀C,藉由彈簧機構SP從兩側予以彈性支撐,成為能夠在與對於被固定在無圖示的 治具之成形體IM進行插入的方向(第7圖(a)中為上下方向)交叉之方向移動。 Next, a manufacturing procedure of the auxiliary light source unit will be described with reference to Fig. 6 . The cutting blade device CA used in the present embodiment has a plurality of cutting blades C as shown in Fig. 7(a), and is elastically supported from both sides by a spring mechanism SP, so that it can be fixed in the pair. In the absence of illustration The direction in which the molded body IM of the jig is inserted (the vertical direction in Fig. 7(a)) moves in a direction intersecting.
如第6圖(a)所示般,模具M的轉印面係包含與複數透鏡部13B相對應的第1部位、與包圍第1部位的周圍之凸狀的第2部位。亦即,對於模具M以覆蓋轉印面Ma及隆起部Mb的方式賦予樹脂PL(在此係紫外線硬化性之環氧樹脂),該模具M係具有與構成光學元件13之透鏡部13B的光穿透部13b以及輪帶部13c相對應的複數轉印面Ma、以及配置於轉印面Ma之間的楔狀隆起部Mb。 As shown in Fig. 6(a), the transfer surface of the mold M includes a first portion corresponding to the plurality of lens portions 13B and a second portion surrounding the convex portion surrounding the first portion. In other words, the mold M is provided with a resin PL (here, an ultraviolet curable epoxy resin) covering the transfer surface Ma and the raised portion Mb, and the mold M has light passing through the lens portion 13B constituting the optical element 13. The translucent portion 13b and the belt portion 13c correspond to the plurality of transfer surfaces Ma and the wedge-shaped raised portions Mb disposed between the transfer surfaces Ma.
對於與此平行而以黏著劑等貼附於底板(基底層之第2樹脂層)BK的大型平行平板13a(基底層之第1樹脂層:在此係聚醯亞胺製)之表面,藉由紫外線照射及因此紫外線照射所產生的臭氧氣體、氧電漿或離子蝕刻而進行活性化處理。 The surface of the large parallel flat plate 13a (the first resin layer of the base layer: made of polyimine) which is attached to the bottom plate (the second resin layer of the base layer) BK by an adhesive or the like in parallel with this is borrowed. The activation treatment is carried out by ultraviolet light irradiation and thus ozone gas, oxygen plasma or ion etching generated by ultraviolet irradiation.
接著,如第6圖(b)所示般,將平行平板13a之經活性化處理的表面,朝向模具M上所賦予的樹脂PL上作載置,在該狀態下從外部照射紫外線,藉此使樹脂PL硬化,而與平行平板13a一體化。然後,將成形體IM從模具M一體地脫模。 Then, as shown in Fig. 6(b), the activated surface of the parallel flat plate 13a is placed on the resin PL applied to the mold M, and ultraviolet rays are irradiated from the outside in this state. The resin PL is hardened and integrated with the parallel flat plate 13a. Then, the formed body IM is integrally released from the mold M.
經脫模的成形體IM,係於貼附在由聚醯亞胺樹脂、TAC、PET、丙烯酸樹脂及環氧樹脂中任一者所成形的底板BK之平行平板13a上,以特定的間隔配置有複數之透鏡部13B(透鏡層),此外,於透鏡部13B之間, 係形成有與隆起部Mb相對應的複數之剖面V字型的谷部(V溝槽)13V。谷部13V的角度係以30~60°為佳。因此,如第6圖(c)(d)所示般,使間距與谷部13V相配合的複數之切斷刀C與成形體IM相對峙,有力地相對移動。切斷刀C係如第7圖(a)(b)所示般,藉由切斷刀裝置CA一體地保持,藉由彈簧機構SP予以彈性支撐,因此,切斷刀C的前端可於藉由谷部13V導引到適當的切斷位置時自由地移動。另外,切斷刀C的前端角度θ為20~55°,若較谷部13V的溝槽角度小5°以上,則會變得容易插入V溝槽內,且即使切斷刀的前端位置有些許偏移,切斷刀亦會被引導至V溝槽壁面而導引至切斷位置,故為佳。此外,藉由將切斷刀的前端角度設為20°以上而可確保刀的耐久性。 The mold release molded body IM is attached to the parallel flat plate 13a of the bottom plate BK formed of any one of a polyimide resin, a TAC, a PET, an acrylic resin, and an epoxy resin, and is disposed at a specific interval. There are a plurality of lens portions 13B (lens layers), and further, between the lens portions 13B, A plurality of V-shaped valley portions (V grooves) 13V corresponding to the ridge portion Mb are formed. The angle of the 13V of the valley is preferably 30~60°. Therefore, as shown in Fig. 6 (c) and (d), the plurality of cutting blades C having the pitch and the valley portion 13V are opposed to each other and strongly moved relative to each other. The cutting blade C is integrally held by the cutting blade device CA as shown in Fig. 7 (a) and (b), and is elastically supported by the spring mechanism SP. Therefore, the front end of the cutting blade C can be borrowed. It is free to move when guided by the trough 13V to an appropriate cutting position. Further, the cutting edge angle θ of the cutting blade C is 20 to 55°, and if the groove angle of the valley portion 13V is smaller than 5°, it is easy to insert into the V groove, and even if the cutting blade has a front end position, It is preferable that the cutting blade is guided to the V-groove wall surface and guided to the cutting position. Further, the durability of the blade can be ensured by setting the tip end angle of the cutting blade to 20° or more.
切斷刀C的前端雖會進入平行平板13a,穿越過此,而到達底板BK,但在底板BK的途中便會停止(亦可一部分貫穿)。由以上所述方式而製作具有形成有複數透鏡部之樹脂製透鏡層、以及與透鏡層接合之樹脂製基底層,且於透鏡層係於透鏡部的周圍形成有切入部,該切入部係到達基底層,但並未貫穿基底層的透鏡陣列薄片。如上所述,只要使切斷刀C的前端在底板BK的途中停止,則如第6圖(e)所示般,雖切斷刀C退避之後於谷部13V的底部會產生切入部SL,但經切斷的平行平板13a僅利用與底板BK之間的黏著力便可固定,於搬運時等不易脫落,因此處理性優異。 Although the leading end of the cutting blade C enters the parallel flat plate 13a, it passes through this and reaches the bottom plate BK, but stops (or partially penetrates) in the middle of the bottom plate BK. In the above-described manner, a resin lens layer having a plurality of lens portions and a resin base layer bonded to the lens layer are formed, and a cut portion is formed around the lens layer in the lens layer, and the cut portion is reached. The base layer, but does not penetrate the lens array sheet of the base layer. As described above, as long as the tip end of the cutting blade C is stopped in the middle of the bottom plate BK, as shown in Fig. 6(e), the cutting portion SL is generated at the bottom of the valley portion 13V after the cutting blade C is retracted. However, the cut parallel flat plate 13a can be fixed only by the adhesive force with the bottom plate BK, and is not easily peeled off during transportation, and is therefore excellent in handleability.
另一方面,被移送至輔助光源單元之組裝步驟之後,如第6圖(f)所示般,由於在谷部13V的底部具有切入部SL,因此可沿著切入部SL容易地各別將平行平板13a與透鏡部13B一起從底板BK剝離,進而,如第6圖(g)所示般,藉由與安裝有間隔物14及LED光源12的基板11固定,而完成輔助光源單元10。所完成的輔助光源單元10,係如第6圖(h)所示般,於基板11的背面附著有焊球HB,移送至無圖示的回焊步驟,而安裝於行動終端等。 On the other hand, after the assembly step of being transferred to the auxiliary light source unit, as shown in FIG. 6(f), since the cut portion SL is provided at the bottom of the valley portion 13V, it is easy to separately follow the cut portion SL. The parallel flat plate 13a is peeled off from the bottom plate BK together with the lens portion 13B, and as shown in Fig. 6(g), the auxiliary light source unit 10 is completed by being fixed to the substrate 11 on which the spacer 14 and the LED light source 12 are attached. The auxiliary light source unit 10 is attached to the back surface of the substrate 11 as shown in Fig. 6(h), and is transferred to a reflow step (not shown) to be attached to a mobile terminal or the like.
於以上的實施形態中,雖顯示以2層構成基底層的例子,但基底層亦可僅為1層。具體而言,如第8圖(a)所示般,亦可於作為基底層之底板BK上直接形成作為透鏡層之透鏡部13B。此時,切斷刀係貫穿透鏡層但在基底層的途中停止。透鏡部13B係從底板BK剝離,如第8圖(b)所示般,直接安裝於間隔物14而成為輔助光源單元。 In the above embodiment, an example in which the underlayer is formed in two layers is shown, but the underlayer may be only one layer. Specifically, as shown in Fig. 8(a), the lens portion 13B as a lens layer can be directly formed on the bottom plate BK as the base layer. At this time, the cutting blade penetrates the lens layer but stops in the middle of the base layer. The lens portion 13B is peeled off from the bottom plate BK, and is directly attached to the spacer 14 as shown in Fig. 8(b) to be an auxiliary light source unit.
此外,透鏡陣列薄片亦可以使透鏡部13B排列成1列的方式形成。第9圖,係顯示從於形成為1列的成形體IM形成有上述切入部的透鏡陣列薄片,使用機器人RB將經排列的透鏡部13B從端部開始剝離而移送至組裝步驟的狀態。 Further, the lens array sheet may be formed such that the lens portions 13B are arranged in a line. In the ninth aspect, the lens array sheet in which the above-described cut-in portion is formed from the molded body IM formed in one row is displayed, and the aligned lens portion 13B is peeled off from the end portion by the robot RB and transferred to the assembly step.
另一方面,透鏡陣列薄片亦可以使透鏡部13B排列成矩陣狀的方式形成。第10圖,係使透鏡部13B形成為矩陣狀的成形體IM之立體圖。如上所述,使 透鏡部13B排列成矩陣狀的成形體IM裝入切入部SL的情況中,如第10圖所示般,亦可使用將切斷刀C排列成格子狀的切斷裝置。藉由縱橫的切斷刀C同時侵入透鏡部13B之間的谷部13V,而可同時形成切入部SL。 On the other hand, the lens array sheet may be formed such that the lens portions 13B are arranged in a matrix. Fig. 10 is a perspective view showing a molded body IM in which the lens portions 13B are formed in a matrix. As mentioned above, make In the case where the molded body IM in which the lens portions 13B are arranged in a matrix is incorporated in the cut-in portion SL, as shown in Fig. 10, a cutting device in which the cutting blades C are arranged in a lattice shape may be used. The cutting portion SL can be simultaneously formed by the cutting blade C of the longitudinal and lateral directions simultaneously invading the valley portion 13V between the lens portions 13B.
另外,如第11圖所示般,亦可配置為於底板BK上將透鏡部13B排列成複數列,且相鄰接的列之透鏡部13B彼此在列方向錯開。藉此,可將透鏡部13B以近似圓形的狀態形成,而便於處理,故為佳。 Further, as shown in Fig. 11, the lens portion 13B may be arranged in a plurality of rows on the bottom plate BK, and the lens portions 13B of the adjacent rows may be shifted in the column direction. Thereby, the lens portion 13B can be formed in an approximately circular state, which is preferable because it is easy to handle.
進而,如第12圖(a)所示般,透鏡部13B的外形係可為圓形。此時,藉由以銷狀物突出透鏡部13B的背面側,而可將該透鏡部13B從底板BK取出。或者,如第12圖(b)所示般,透鏡部13B的外形係可為矩形,如第12圖(c)所示般,亦可為多角形。任一者皆以使透鏡部13B捲曲的方式來設置谷部13V,藉由與該谷部13V相對應的切斷刀C來形成上述切入部而形成透鏡陣列薄片。 Further, as shown in Fig. 12(a), the outer shape of the lens portion 13B may be circular. At this time, the lens portion 13B can be taken out from the bottom plate BK by protruding the back side of the lens portion 13B with a pin. Alternatively, as shown in Fig. 12(b), the lens portion 13B may have a rectangular outer shape, and may have a polygonal shape as shown in Fig. 12(c). In either case, the valley portion 13V is provided so that the lens portion 13B is curled, and the cut portion is formed by the cutting blade C corresponding to the valley portion 13V to form the lens array sheet.
如上所述,於透鏡層中以包圍透鏡部13B的周圍之方式所形成的V字型谷部(V溝槽)13V係構成凹部。基底層係具有例如平行平板13a與底板BK之2層,並接合於透鏡層,成為能夠將平行平板13a從底板BK剝離。例如,底板BK係作為薄片而能夠裝脫地與透鏡層接合。此外,有時亦將附黏著薄片的透鏡陣列稱為透鏡陣列薄片(或者,透鏡薄片)。 As described above, the V-shaped valley portion (V-groove) 13V formed to surround the periphery of the lens portion 13B in the lens layer constitutes a concave portion. The base layer has, for example, two layers of the parallel flat plate 13a and the bottom plate BK, and is bonded to the lens layer so that the parallel flat plate 13a can be peeled off from the bottom plate BK. For example, the bottom plate BK is detachably joined to the lens layer as a sheet. Further, a lens array to which an adhesive sheet is attached is sometimes referred to as a lens array sheet (or a lens sheet).
本實施形態之輔助光源單元10係與第1圖~第4圖所示者相同構造,與第5圖(a)(b)相同地,可於行動電話機100中與攝像裝置50相鄰接而設置,並具有相同的功能。輔助光源單元10之光學元件13係可如下所述方式由透鏡陣列製造。 The auxiliary light source unit 10 of the present embodiment has the same structure as that shown in Figs. 1 to 4, and can be adjacent to the imaging device 50 in the mobile phone 100 as in the fifth (a) and (b). Set up and have the same functionality. The optical element 13 of the auxiliary light source unit 10 can be fabricated from a lens array in the manner described below.
參照附圖,針對透鏡陣列之製造步驟進行說明。將本實施形態所使用的模顯示於第13圖。另外,透鏡部的個數係無關於圖面皆為任意。於第13圖中,模M1係於其上面,作為轉印面而具有複數透鏡轉印部M1a(第1部位)以及楔狀之凸狀轉印部M1b(第2部位),該複數透鏡轉印部M1a係與光學元件13之光穿透部13b與輪帶部13c(以下,稱為透鏡部13B)相對應;該楔狀之凸狀轉印部M1b係形成於透鏡轉印部M1a間。凸狀轉印部M1b的角度θ為20°~60°。 The manufacturing steps of the lens array will be described with reference to the drawings. The mold used in the present embodiment is shown in Fig. 13. Further, the number of the lens portions is not arbitrary with respect to the drawings. In Fig. 13, a mold M1 is attached thereto, and has a plurality of lens transfer portions M1a (first portion) and a wedge-shaped convex transfer portion M1b (second portion) as a transfer surface, and the plurality of lens transfer The portion M1a and the light transmitting portion 13b of the optical element 13 correspond to the belt portion 13c (hereinafter referred to as a lens portion 13B); the wedge-shaped convex portion M1b is formed between the lens transfer portions M1a. The angle θ of the convex transfer portion M1b is 20° to 60°.
透鏡轉印部M1a與凸狀轉印部M1b係藉由一次夾持加工而形成,因此,透鏡轉印部M1a的中心、與至凸狀轉印部M1b的前端為止之長邊方向的距離a,係精準度佳且均等地形成。另外,所謂一次夾持加工係指於模的原料為金屬等的情況中,在將該模的原料固定於加工裝置之夾具的狀態下,進行切削加工(亦有切削工具不同的情況),當模的原料為樹脂等且為將母模轉印所形成者時 ,係指在將母模的原料固定於加工裝置之夾具的狀態下,進行切削加工。凸狀轉印部M1b的高度係高於透鏡轉印部M1a之輪帶形成部分的高度(相當於第1部分輪帶RPx的高度d1、第2部分輪帶RPy的高度d2)。 Since the lens transfer portion M1a and the convex transfer portion M1b are formed by one-time nip processing, the distance between the center of the lens transfer portion M1a and the longitudinal direction of the front end of the convex transfer portion M1b is a. It is formed with excellent precision and equal. In the case where the raw material of the mold is made of metal or the like, the material of the mold is fixed to the jig of the processing apparatus, and the cutting process is performed (there are also different cutting tools). The raw material of the mold is a resin or the like and is formed when the master mold is transferred. It means that the cutting process is performed in a state in which the raw material of the master mold is fixed to the jig of the processing apparatus. The height of the convex transfer portion M1b is higher than the height of the belt forming portion of the lens transfer portion M1a (corresponding to the height d1 of the first partial belt RPx and the height d2 of the second partial belt RPy).
接著,參照第14圖,針對透鏡陣列之製造步驟進行說明。首先,如第14圖(a)所示般,對於具有透鏡轉印部M1a與凸狀轉印部M1b的模M1,以包覆透鏡轉印部M1a與凸狀轉印部M1b的方式賦予未硬化之能量硬化性樹脂PL(在此係使用未硬化之紫外線硬化性環氧樹脂)。 Next, a manufacturing procedure of the lens array will be described with reference to Fig. 14. First, as shown in Fig. 14 (a), the mold M1 having the lens transfer portion M1a and the convex transfer portion M1b is coated with the lens transfer portion M1a and the convex transfer portion M1b. The hardened energy curable resin PL (herein, an uncured ultraviolet curable epoxy resin is used).
接著,如第14圖(b)所示般,將作為透明的平行平板之對向模M2的下面,載置於賦予模M1上之未硬化的樹脂PL上,在該狀態下從外部照射紫外線,藉以使未硬化的樹脂PL硬化。藉此,使硬化性樹脂製之透鏡陣列LA成形。另外,雖亦可於平板狀之對向模M2賦予未硬化的樹脂,但就更確實地防止於成形後之透鏡陣列LA產生氣泡的觀點而言,以如第14圖(a)所示般,於具有透鏡轉印部M1a與凸狀轉印部M1b的模M1賦予未硬化的樹脂為佳。此外,用以使樹脂硬化的光照射雖只要從透明的對向模M2側進行即可,但模M1為透明時係可從模M1側進行光照射,亦可從模M1與對向模M2之兩方進行光照射。熱硬化性樹脂之情況中只要藉由以適當的硬化溫度進行加熱所需的時間而進行硬化即可。其後,雖將透鏡陣列LA脫模,但脫模圖型係具有以下之樣態(i) ~(iii),將各自的優點一併進行說明。 Next, as shown in Fig. 14(b), the lower surface of the opposing mold M2 which is a transparent parallel flat plate is placed on the uncured resin PL which is applied to the mold M1, and ultraviolet rays are irradiated from the outside in this state. In order to harden the uncured resin PL. Thereby, the lens array LA made of a curable resin is molded. Further, although the uncured resin may be applied to the flat opposing mold M2, it is more surely prevented from generating bubbles in the lens array LA after molding, as shown in Fig. 14(a). It is preferable to impart an uncured resin to the mold M1 having the lens transfer portion M1a and the convex transfer portion M1b. Further, the light irradiation for curing the resin may be performed from the transparent opposite mold M2 side, but when the mold M1 is transparent, light irradiation from the mold M1 side may be performed, or the mold M1 and the opposite mold M2 may be used. Both of them are illuminated by light. In the case of the thermosetting resin, it is only necessary to cure by heating at a suitable curing temperature. Thereafter, although the lens array LA is demolded, the demold pattern has the following pattern (i) ~(iii), each of the advantages will be explained together.
(i)首先從對向模M2脫模,接著將模M1脫模。 (i) First, the mold M2 is released from the mold, and then the mold M1 is released.
由於成形後,對向模M2係存在於重力加速度方向上方,因此若先從對向模M2脫模則容易進行作業。 Since the opposing mold M2 is present in the direction of the gravitational acceleration after the forming, it is easy to work if it is first released from the opposing mold M2.
(ii)首先從模M1脫模,接著將對向模M2脫模。 (ii) First demolding from the mold M1, followed by demolding the opposing mold M2.
由於具有透鏡轉印部M1a之模M1的脫模較為困難,因此在脫模時之力道下透鏡陣列LA容易破裂。因此,藉由在於透鏡陣列LA貼附有對向模M2的狀態下將模M1脫模,而可抑制透鏡陣列LA破裂。另外,由於對向模M2的脫模容易,因此,於脫模時透鏡陣列LA破裂的疑慮較低。 Since the mold M1 having the lens transfer portion M1a is difficult to release, the lens array LA is easily broken at the time of demolding. Therefore, by releasing the mold M1 in a state in which the opposite mode M2 is attached to the lens array LA, the lens array LA can be suppressed from being broken. Further, since the mold release M2 is easily released, the problem that the lens array LA is broken at the time of demolding is low.
(iii)將模M1與對向模M2同時脫模。 (iii) Simultaneously demolding the mold M1 and the opposite mold M2.
藉此可減低步驟時間。 This can reduce the step time.
如第14圖(c)所示般,經脫模的透鏡陣列LA係於藉由透鏡轉印部M1a所轉印的透鏡部13B之間,形成有與凸狀轉印部M1b相對應的複數剖面V字型之谷部(V溝槽)13V。後述之基準面13C係形成於凸狀轉印部M1b的斜面。谷部13V的角度係20°~60°。另外,藉由對向模M2所轉印的透鏡陣列LA之背面係為平面。透鏡陣列LA的高度d係0.1mm~0.5mm,V溝槽13V之最內部的厚度h係20μm~150μm(參照第18圖(c))。另外,若將d增厚,則由於透鏡陣列LA變得不易變形而使脫模性變差,因此以增大其厚度h為佳。在此,亦可藉 由其他步驟,將SiO2塗膜或抗反射塗膜(例如250μm以下的凹凸膜)成膜於透鏡陣列LA的背面。 As shown in Fig. 14 (c), the mold release lens array LA is formed between the lens portions 13B transferred by the lens transfer portion M1a, and a plurality of corresponding portions corresponding to the convex transfer portion M1b are formed. The valley of the V-shaped section (V-groove) is 13V. The reference surface 13C to be described later is formed on the inclined surface of the convex transfer portion M1b. The angle of the 13V of the valley is 20°~60°. Further, the back surface of the lens array LA transferred by the opposing mold M2 is flat. The height d of the lens array LA is 0.1 mm to 0.5 mm, and the innermost thickness h of the V-groove 13V is 20 μm to 150 μm (see Fig. 18(c)). Further, when d is thickened, since the lens array LA is less likely to be deformed and the mold release property is deteriorated, it is preferable to increase the thickness h. Here, the SiO 2 coating film or the antireflection coating film (for example, an uneven film of 250 μm or less) may be formed on the back surface of the lens array LA by another step.
接著,如第14圖(c)所示般,將作為黏著薄片之可撓性樹脂薄片PS,使用在後步驟中容易剝離之例如紫外線硬化接著劑等貼附於透鏡陣列LA的背面。可撓性樹脂薄片PS,係可使用例如附UV硬化黏著劑之聚烯烴膠帶UHP-1525M3(電氣化學工業公司製)。可撓性樹脂薄片PS之延展性係以超過100%且130%以下者較為理想。 Then, as shown in FIG. 14(c), the flexible resin sheet PS as an adhesive sheet is attached to the back surface of the lens array LA by, for example, an ultraviolet curing adhesive which is easily peeled off in the subsequent step. For the flexible resin sheet PS, for example, a polyolefin tape UHP-1525M3 (manufactured by Denki Kagaku Co., Ltd.) with a UV-curable adhesive can be used. The ductility of the flexible resin sheet PS is preferably more than 100% and not more than 130%.
如上所述,可撓性樹脂薄片PS係作為薄片而能夠裝脫地與透鏡陣列LA接合。其後,在第14圖(d)~(f)中任一所示的步驟中,藉由賦予可撓性樹脂薄片PS力量而將透鏡陣列LA予以個片化。 As described above, the flexible resin sheet PS is detachably bonded to the lens array LA as a sheet. Thereafter, in the step shown in any one of Figs. 14(d) to (f), the lens array LA is formed into a sheet by imparting strength to the flexible resin sheet PS.
於第14圖(d)所示的例子中,藉由朝可撓性樹脂薄片PS側彎曲使透鏡陣列LA產生彎曲應力,而可在最為脆弱之V溝槽13V的最內部產生割斷。 In the example shown in Fig. 14(d), the lens array LA is subjected to bending stress by bending toward the side of the flexible resin sheet PS, and the cut can be caused in the innermost portion of the most fragile V-groove 13V.
於第14圖(e)所示的例子中,藉由從透鏡部13B的背後按壓可撓性樹脂薄片PS使透鏡陣列LA產生彎曲應力,而可在最為脆弱之V溝槽13V的最內部產生割斷。此乃適合於透鏡部13B的外徑為圓形狀的情況(參照第12圖(a))。 In the example shown in Fig. 14(e), the lens array LA is subjected to bending stress by pressing the flexible resin sheet PS from the back of the lens portion 13B, and can be generated at the innermost portion of the most fragile V-groove 13V. Cut off. This is suitable when the outer diameter of the lens portion 13B is a circular shape (see Fig. 12(a)).
於第14圖(f)所示的例子中,藉由在兩側(或在對角線上)拉扯可撓性樹脂薄片PS使透鏡陣列LA產生彎曲應力,而可在最為脆弱之V溝槽13V的最內部 產生割斷。此外,最外周之不需要部分LAb係相對於相鄰接的透鏡部13B而同時被割斷。此乃適合於透鏡陣列13B的外徑為多角形狀的情況(參照第12圖(c))。 In the example shown in Fig. 14(f), the lens array LA is subjected to bending stress by pulling the flexible resin sheet PS on both sides (or on the diagonal line), and the most fragile V-groove 13V is available. Innermost Produce a cut. Further, the outer peripheral unnecessary portion LAb is simultaneously cut with respect to the adjacent lens portion 13B. This is suitable for the case where the outer diameter of the lens array 13B is a polygonal shape (refer to Fig. 12(c)).
另外,亦可於透鏡陣列LA,在進行用以促進硬化性樹脂之硬化的特定熱處理之後,貼附可撓性樹脂薄片PS,或在貼附有可撓性樹脂薄片PS之後,進行上述特定熱處理。 In addition, after the specific heat treatment for promoting the hardening of the curable resin is performed on the lens array LA, the flexible resin sheet PS may be attached, or after the flexible resin sheet PS is attached, the specific heat treatment described above may be performed. .
依據本實施形態,於藉由使未硬化之紫外線硬化樹脂PL硬化所形成的透鏡陣列LA,係形成有V溝槽13V,因此,可將V溝槽13V的底部作為起點而割斷透鏡陣列LA,藉此不需依賴切割而容易以低成本實現透鏡13之個片化。經個片化的透鏡13,若在貼附於可撓性樹脂薄片PS的狀態下被搬運等,則不會破裂而容易處理。 According to the present embodiment, since the V-groove 13V is formed in the lens array LA formed by curing the uncured ultraviolet curable resin PL, the lens array LA can be cut by using the bottom of the V-groove 13V as a starting point. Thereby, it is easy to realize the singulation of the lens 13 at low cost without relying on cutting. When the sheet lens 13 is conveyed in a state of being attached to the flexible resin sheet PS, it is easy to handle without being broken.
經過以上的步驟,而使第14圖(g)所示之作為光學元件的透鏡13予以個片化。透鏡13係具有作為光學面之透鏡部13B、以及其周圍之錐狀基準面13C。基準面13C係以使與透鏡部13B之光軸成為所期望的位置關係之方式精準度佳地形成。 Through the above steps, the lens 13 as an optical element shown in Fig. 14(g) is sliced. The lens 13 has a lens portion 13B as an optical surface and a tapered reference surface 13C around the lens portion 13B. The reference surface 13C is formed accurately so as to have a desired positional relationship with the optical axis of the lens portion 13B.
對於輔助光源單元之安裝步驟進行說明。如第15圖(a)所示般,能夠在3維方向移動的吸附裝置VD,其中空吸附部VDa係被連接於負壓泵P,該中空吸附部VDa係具有與基準面13C相對應的錐面。藉由使負壓泵P動作,而使吸附部VDa內成為負壓,因此藉由使 吸附部VDa接觸透鏡13之錐面基準面13C,吸附裝置VD係可將透鏡13吸附保持。 The installation steps of the auxiliary light source unit will be described. As shown in Fig. 15 (a), the adsorption device VD capable of moving in the three-dimensional direction, wherein the empty adsorption portion VDa is connected to the negative pressure pump P, the hollow adsorption portion VDa having the corresponding reference surface 13C tapered surface. By operating the negative pressure pump P, the inside of the adsorption portion VDa becomes a negative pressure, so The adsorption portion VDa contacts the tapered surface reference surface 13C of the lens 13, and the adsorption device VD can adsorb and hold the lens 13.
吸附裝置VD之3維位置係可精準度佳地控制。因而,如第15圖(b)所示般,預先將安裝有間隔物14及LED光源12的基板11配置於特定位置,藉此而將吸附裝置VD進行位置控制,可在相對於LED光源12(例如,對於LED光源12的中心)使透鏡13的光軸一致之狀態下,將透鏡13的背面載置於間隔物14上。然後,利用接著劑加以固定,藉此而完成輔助光源單元10。所完成的輔助光源單元10,係於基板11的背面附著有焊球,移送至無圖示的回焊步驟,而安裝於行動終端等。 The 3-dimensional position of the adsorption device VD is precisely controlled. Therefore, as shown in FIG. 15(b), the substrate 11 on which the spacer 14 and the LED light source 12 are mounted is placed at a specific position in advance, whereby the adsorption device VD is positionally controlled so as to be relative to the LED light source 12. The back surface of the lens 13 is placed on the spacer 14 in a state where the optical axes of the lenses 13 are aligned (for example, with respect to the center of the LED light source 12). Then, it is fixed by an adhesive, whereby the auxiliary light source unit 10 is completed. The completed auxiliary light source unit 10 is attached to the back surface of the substrate 11 with solder balls, transferred to a reflow step (not shown), and attached to a mobile terminal or the like.
若依據本實施形態,則於所成形的透鏡13中,藉由凸狀鏡轉印M1b而使透鏡部13B與基準面13C一體成形,因此,於將從透鏡陣列LA沿著V溝槽13V而經個片化的透鏡13與LED光源12組合,而製作輔助光源單元時,可使用基準面13C來精準度佳地進行透鏡13與LED光源12之決定位置。另外,於本實施形態中,構成透鏡陣列的樹脂,雖使用紫外線硬化性樹脂,但即使是其他的光硬化性樹脂亦無妨。此外,亦可為熱硬化性樹脂等其他的能量硬化性樹脂。於此情況中,只要是代替光而將於熱或放射線等效果所需的能量照射至未硬化的樹脂而產生硬化反應即可。能量硬化性樹脂係於輔助光源單元製作時,在供用以將前述透鏡部與光源一起安裝之回焊步驟時所需的耐熱性、或環境信賴性優異。此外,由於硬化時之 收縮率低,因此就確保前述透鏡部的光學面精準度的觀點而言亦為理想。進而,亦具有割斷性優異的優點。亦能夠將熱硬化性樹脂作為透鏡陣列的材料使用。熱硬化性樹脂係相較於能量硬化性樹脂,較為低價,且種類豐富,具有容易選擇適於所要求的方式之樹脂等的優點。使用熱塑性樹脂時,將樹脂加熱而熔融,在具有流動性的狀態下供給至模中。 According to the present embodiment, the lens portion 13B is integrally formed with the reference surface 13C by the convex mirror transfer M1b in the formed lens 13, so that the lens array LA is along the V groove 13V. When the individual lens unit 13 is combined with the LED light source 12 to produce the auxiliary light source unit, the reference position 13C can be used to accurately determine the position of the lens 13 and the LED light source 12. Further, in the present embodiment, the resin constituting the lens array is an ultraviolet curable resin, but it may be any other photocurable resin. Further, it may be another energy curable resin such as a thermosetting resin. In this case, the hardening reaction may be generated by irradiating the uncured resin with energy required for effects such as heat or radiation instead of light. The energy curable resin is excellent in heat resistance or environmental reliability required for the reflow step of mounting the lens portion together with the light source when the auxiliary light source unit is fabricated. In addition, due to hardening Since the shrinkage ratio is low, it is also preferable from the viewpoint of ensuring the accuracy of the optical surface of the lens portion. Further, it also has an advantage of excellent cutting property. It is also possible to use a thermosetting resin as a material of the lens array. The thermosetting resin is relatively inexpensive compared to the energy curable resin, and has a wide variety of types, and has an advantage that it is easy to select a resin suitable for a desired method. When a thermoplastic resin is used, the resin is heated and melted, and supplied to the mold in a fluid state.
接著,針對本實施形態之變形例進行說明。於第16圖(a)中,上下顛倒的模M1’係與上述相同地,具有作為轉印面之透鏡轉印部M1a(第1部位)、以及其周圍之凸狀轉印部M1b(第2部位)。凸狀轉印部M1b係具有前端的凸部M1c、以及由2個平行面所構成的根部側之平行部M1d。藉由模M1’將未硬化之紫外線硬化性樹脂PL轉印成形,而於透鏡部13B的周圍形成有作為基準面之平行溝狀之缺口13D、與小的V溝槽13V。以與上述實施形態所說明者相同的順序,如第17圖(b)所示在V溝槽13V的最內部(箭頭C’)進行割斷,將透鏡陣列予以個片化。 Next, a modification of this embodiment will be described. In the same manner as described above, the mold M1' that is upside down is provided with a lens transfer portion M1a (first portion) as a transfer surface and a convex transfer portion M1b around the same (second). Part). The convex transfer portion M1b has a convex portion M1c having a distal end and a parallel portion M1d on the root side composed of two parallel surfaces. The uncured ultraviolet curable resin PL is transferred and formed by the mold M1', and a parallel groove-shaped notch 13D as a reference surface and a small V-groove 13V are formed around the lens portion 13B. In the same order as described in the above embodiment, as shown in Fig. 17(b), the inside of the V-groove 13V (arrow C') is cut, and the lens array is sliced.
於本發明中,雖將包含溝槽與決定位置之基準面的全體作為凹部,但於第16圖(a)中,係藉由V溝槽13V、基準面13D、以及與基準面13D相連接的錐面全體而構成凹部。 In the present invention, the entire groove including the reference surface of the groove and the determined position is used as the concave portion. However, in FIG. 16(a), the V groove 13V, the reference surface 13D, and the reference surface 13D are connected. The entire conical surface constitutes a concave portion.
於輔助光源單元之組裝步驟中,如第16圖(b)所示般,準備具有與缺口13D相對應的決定位置部 15a之托架15,以使缺口13D卡合並且抵接於決定位置部15a的方式,將透鏡13收容於托架15內,使接著劑B流入托架15與透鏡13的側面之間,藉由接著劑B而進行固定。其後,於安裝有LED光源12的基板11,與托架15一起將透鏡13進行安裝,藉以完成輔助光源單元。另外,由於缺口13D為平行面,因此即使不使用具有吸附機構之高價的夾持裝置,也可利用機器人的把持臂等較為低價的把持裝置進行機械性且輕易地把持,藉此而可減低成本。 In the assembly step of the auxiliary light source unit, as shown in FIG. 16(b), the determination position portion corresponding to the notch 13D is prepared. The bracket 15 of 15a is such that the notch 13D is engaged and abuts against the position determining portion 15a, the lens 13 is housed in the bracket 15, and the adhesive B flows between the bracket 15 and the side surface of the lens 13, Fixed by the adhesive B. Thereafter, the lens 11 is mounted together with the carrier 15 on the substrate 11 on which the LED light source 12 is mounted, thereby completing the auxiliary light source unit. Further, since the notch 13D is a parallel surface, it can be mechanically and easily held by a relatively low-cost gripping device such as a grip arm of a robot without using a high-priced gripping device having an adsorption mechanism. cost.
另外,如第17圖(a)所示般,會有在成形時,未硬化之紫外線硬化樹脂溢出於透鏡陣列LA的周圍而硬化,形成大的毛邊狀之不需要部LAb的情況。然而,如第17圖(b)所示般,於最外周的透鏡部13B之周圍,係形成有藉由凸狀轉印部M1b所轉印的V溝槽13V,因此,在V溝槽13V的最內部(箭頭C’)容易產生割斷,如第17圖(c)所示般,可將周圍之不需要部LAb從透鏡陣列LA容易地切離。 In addition, as shown in Fig. 17 (a), the uncured ultraviolet curable resin may be hardened around the lens array LA at the time of molding, and a large burr-shaped unnecessary portion LAb may be formed. However, as shown in Fig. 17(b), the V-groove 13V transferred by the convex transfer portion M1b is formed around the outermost peripheral lens portion 13B, and therefore, the V-groove 13V is formed. The innermost portion (arrow C') is easily cut, and as shown in Fig. 17(c), the surrounding unnecessary portion LAb can be easily cut away from the lens array LA.
接著,參照附圖,針對透鏡陣列之製造步驟的其他例子進行說明。本例所使用的M1”雖具有與上述本實施形態之模M1相同的形狀,但相異之處在於設有閘M1g。對向模M2係為共通。所使用的樹脂雖除能量硬化性樹脂以外,亦可為熱塑性樹脂,但為硬化後或固化後能夠割斷者。 Next, another example of the manufacturing steps of the lens array will be described with reference to the drawings. The M1" used in this example has the same shape as the mold M1 of the above-described embodiment, but the difference is that the gate M1g is provided. The opposing mold M2 is common. The resin used is energy-hardening resin. In addition, it may be a thermoplastic resin, but it can be cut after curing or after curing.
如第18圖(a)所示般,將模M1”與對向模M2脫模之後,經由閘M1g,將未硬化之紫外線硬化樹脂PL填充於內部之空腔CV內。接著,如第18圖(b)所示般,藉由從外部照射紫外線,而使空腔CV內之未硬化的紫外線硬化樹脂PL硬化。第18圖(c)係經由閘M1g於空腔CV內填充未硬化的樹脂PL之後供給後之影像圖。 As shown in Fig. 18(a), after the mold M1" and the opposing mold M2 are released from the mold, the uncured ultraviolet curable resin PL is filled in the inner cavity CV via the gate M1g. Next, as in the 18th. As shown in Fig. 2(b), the uncured ultraviolet curable resin PL in the cavity CV is cured by irradiating ultraviolet rays from the outside. Fig. 18(c) is filled with unhardened in the cavity CV via the gate M1g. The image after the resin PL is supplied.
進而,如第18圖(d)所示般,雖藉由打開模而取出透鏡陣列LA,但於該透鏡陣列LA係形成有與閘M1g相對應的澆道部LAa,因此,如第18圖(e)所示般,以切割器CT切割澆道部LAa。然後,藉由經過與第14圖(c)以後相同的步驟,而可將透鏡予以個片化。 Further, as shown in FIG. 18(d), the lens array LA is taken out by opening the mold, but the runner portion LAa corresponding to the gate M1g is formed in the lens array LA, and therefore, as shown in FIG. As shown in (e), the runner portion LAa is cut by the cutter CT. Then, the lens can be sliced by the same steps as those after (c) of Fig. 14.
此外,透鏡陣列LA亦可以使透鏡部13B排列成1列的方式形成。第19圖,係顯示使用機器人RB,於可撓性樹脂薄片PS上以使排列成1列的透鏡13朝可撓性樹脂薄片PS側傾斜的方式從端部逐一剝離、組裝而移送至步驟的狀態。可與第19圖所示的步驟同時進行透鏡的割斷,亦可在第19圖所示的步驟之前,預先割斷透鏡13。如第19圖所示之透鏡13排列成一列的附可撓性樹脂薄片PS之透鏡陣列LA,亦可從如第17圖(c)所示之透鏡排列成二維狀的透鏡陣列,進行透鏡之割斷及可撓性樹脂薄片PS之切割而切出1列份的透鏡陣列者。 Further, the lens array LA may be formed such that the lens portions 13B are arranged in a line. In the case of the flexible resin sheet PS, the lens 13 which is arranged in a line is peeled off from the end portion one by one, and is assembled and transferred to the step. status. The lens can be cut simultaneously with the step shown in Fig. 19, and the lens 13 can be cut in advance before the step shown in Fig. 19. The lens 13 shown in Fig. 19 is arranged in a line of lens arrays LA with flexible resin sheets PS, and lenses may be arranged in a two-dimensional lens array from lenses as shown in Fig. 17(c). The cut and the flexible resin sheet PS are cut to cut out one column of the lens array.
另一方面,透鏡陣列LA亦可如第17圖所示般,以使透鏡部13B排列成矩陣狀的方式形成。 On the other hand, the lens array LA may be formed such that the lens portions 13B are arranged in a matrix as shown in FIG.
此外,如第20圖所示般,亦可於可撓性樹脂 薄片PS上透鏡部13B排列成複數列,以使相鄰接的列之透鏡部13B彼此在列方向錯開的方式進行配置。藉此,由於可將透鏡部13B在近似圓形的狀態下形成,因此將未硬化的樹脂供給至模時能配合圓形擴大的特性,使所浪費使用的樹脂量減少。此外,亦具有變得容易利用既存的製造機器之優點。另外,V溝槽13V係予以簡化而圖示出。 In addition, as shown in Figure 20, it can also be used in flexible resins. The lens portion 13B on the sheet PS is arranged in a plurality of rows so that the lens portions 13B of the adjacent rows are arranged in the column direction. Thereby, since the lens portion 13B can be formed in a substantially circular state, when the uncured resin is supplied to the mold, the circular expansion property can be matched, and the amount of resin to be wasted can be reduced. In addition, it also has the advantage of making it easy to utilize existing manufacturing machines. In addition, the V-groove 13V is simplified and illustrated.
進而,與上述第12圖(a)相同地,透鏡部13B的外形亦可為圓形。此時,藉由於透鏡陣列LA中以銷狀者突出透鏡部13B的背面側,而可割斷該透鏡部13B(參照第14圖(e))。或者,與第12圖(b)相同地,透鏡部13B的外形亦可為矩形,與第12圖(c)相同地亦可為多角形(在此係緊密配置有六角形的例子)。於透鏡陣列LA中透鏡部13B的外形為矩形時,亦可為第14圖(d)~(f)中任一者之割斷樣態。 Further, similarly to the above-described Fig. 12(a), the outer shape of the lens portion 13B may be circular. At this time, the lens portion 13B can be cut by protruding the back side of the lens portion 13B in the lens array LA (see FIG. 14(e)). Alternatively, the lens portion 13B may have a rectangular outer shape as in the case of Fig. 12(b), and may have a polygonal shape as in Fig. 12(c) (an example in which a hexagonal shape is closely arranged). When the outer shape of the lens portion 13B in the lens array LA is a rectangle, it may be a cut form of any one of FIGS. 14(d) to (f).
第21圖係顯示變形例之透鏡陣列LA的圖。於本例中,於V溝槽13V的背面側,對向設置其他的V溝槽13U。藉此,容易展現割斷精準度,割斷方向亦不拘,且具有邊緣變成銳利的優點。 Fig. 21 is a view showing a lens array LA of a modification. In this example, on the back side of the V-groove 13V, another V-groove 13U is provided in the opposite direction. Thereby, it is easy to exhibit the cutting accuracy, the cutting direction is also unconstrained, and the edge has a sharp advantage.
本實施形態係關於第1圖~第4圖所示之輔助光源單元10的光學元件13,其製造方法雖如上所述般,能夠使用第13圖的模,以與第14圖(a)~(g)之各步驟相同的方式實施,但所使用的能量硬化性樹脂係含有特定的改 質聚矽氧。 In the present embodiment, the optical element 13 of the auxiliary light source unit 10 shown in Figs. 1 to 4 can be used as described above, and the mold of Fig. 13 can be used as shown in Fig. 14(a). Each step of (g) is carried out in the same manner, but the energy-hardening resin used contains a specific modification. Poly-oxygen.
若依據本實施形態,則藉由使用含有特定之改質聚矽氧的能量硬化性樹脂,而賦予改質聚矽氧特有的柔軟性,因此,會提昇樹脂割斷時之碎屑耐性。除此之外,藉由添加特定之改質聚矽氧,而提高透鏡陣列LA表面之導電性,且減弱摩擦,藉此由於不易於樹脂積蓄靜電,因此可減輕塵埃附著。 According to the present embodiment, the flexibility of the modified polyfluorene is imparted by using an energy curable resin containing a specific modified polyfluorene oxide, so that the chip resistance at the time of resin cutting is improved. In addition, by adding a specific modified polyfluorene oxide, the conductivity of the surface of the lens array LA is improved, and the friction is weakened, whereby the static electricity is not easily accumulated in the resin, so that dust adhesion can be alleviated.
以下,說明本發明之實施例。本發明者係於後述之樹脂材料中,分別添加後述之改質聚矽氧,而調製實施例與比較例3之樹脂組成物,以供後述之評估。另外,比較例1、2係不添加改質聚矽氧。以下,顯示改質聚矽氧添加時之樹脂材料的化學式。 Hereinafter, embodiments of the invention will be described. The inventors of the present invention prepared the resin composition of the examples and the comparative example 3 by adding the modified polyfluorene oxide described later to the resin material described later, for evaluation as described later. Further, in Comparative Examples 1 and 2, modified polyfluorene oxygen was not added. Hereinafter, the chemical formula of the resin material at the time of addition of the modified polyfluorene oxygen is shown.
於第18圖之模M1與穿透性之對向模M2之間挾持未硬化之樹脂PL,透過對向模M2而照射UV,或者放入烘箱進行加熱,藉以使樹脂材料PL硬化,藉由從模M1及對向模M2脫模,而製成透鏡陣列,其係由於9×9之陣列狀81個部位具有軸上厚度為0.35mm,高度70μm及間距0.1mm之複數輪帶結構與 0.5mm的圓形平坦部之透鏡部、以及於透鏡部間形成割斷用的角度30°、溝槽底部厚度50μm之V溝槽。將所形成的透鏡陣列貼附於可撓性樹脂薄片,使薄片變形而進行割斷,將透鏡予以個片化。 The unhardened resin PL is held between the mold M1 of FIG. 18 and the penetrating opposite mold M2, irradiated with UV by the opposite mold M2, or heated in an oven to harden the resin material PL by The mold array is demolded from the mold M1 and the opposite mold M2, and the lens array is formed by a plurality of belt structures having an on-axis thickness of 0.35 mm, a height of 70 μm, and a pitch of 0.1 mm. A lens portion having a circular flat portion of 0.5 mm and a V-groove having an angle of 30° for cutting and a thickness of 50 μm at the bottom of the groove are formed between the lens portions. The formed lens array was attached to a flexible resin sheet, and the sheet was deformed and cut, and the lens was sliced.
.光硬化性環氧樹脂組成物:於雙酚A二縮水甘油醚中以成為組成物全體之0.1重量%的方式添加作為光聚合起始劑之芳香族鋶鹽(CYRACURE UVI-6976;Dow Chemical公司)者 . Photocurable epoxy resin composition: an aromatic sulfonium salt as a photopolymerization initiator (CYRACURE UVI-6976; Dow Chemical Co., Ltd.) is added as a photopolymerization initiator to bisphenol A diglycidyl ether in an amount of 0.1% by weight of the entire composition. )By
.熱硬化性環氧樹脂組成物:於雙酚A二縮水甘油醚中以成為組成物全體之0.1重量%的方式添加作為熱聚合起始劑之芳香族鋶鹽(SUN-aid SI-110L;三新化學股份有限公司)者 . Thermosetting epoxy resin composition: an aromatic sulfonium salt (SUN-aid SI-110L; three as a thermal polymerization initiator) is added to bisphenol A diglycidyl ether in an amount of 0.1% by weight of the entire composition. New Chemical Co., Ltd.)
.光硬化性丙烯酸樹脂組成物:於環己基(甲基)丙烯酸酯中以成為組成物全體之0.1重量%的方式添加作為光聚合起始劑之α-羥苯乙酮(IRGACURE 907;汽巴.日本股份有限公司)者 . Photocurable acrylic resin composition: α-hydroxyacetophenone (IRGACURE 907; Ciba.) as a photopolymerization initiator was added to cyclohexyl (meth) acrylate in an amount of 0.1% by weight of the total composition. Japan Co., Ltd.)
.熱硬化性丙烯酸樹脂組成物:於環己基(甲基)丙烯酸酯中以成為組成物全體之0.1重量%的方式添加作為熱聚合起始劑之α、α’-偶氮二異丁腈(AIBN;大塚化學股份有限公司)者 . Thermosetting Acrylic Resin Composition: α,α'-azobisisobutyronitrile (AIBN) as a thermal polymerization initiator added to cyclohexyl (meth) acrylate as 0.1% by weight of the entire composition ; Otsuka Chemical Co., Ltd.)
[比較例1~5、實施例1~8].芳香族鋶鹽 [Comparative Examples 1 to 5, Examples 1 to 8]. Aromatic sulfonium salt
[比較例6、7、實施例9、11~15].α-羥苯乙酮 [Comparative Examples 6, 7, and Examples 9, 11 to 15]. --hydroxyacetophenone
[實施例10].α、α’-偶氮二異丁腈 [Example 10]. α,α'-azobisisobutyronitrile
.多官能苯基:甲基苯基聚矽氧(KF-54;信越化學工業股份有限公司、Mn=2800) . Polyfunctional phenyl: methyl phenyl polyfluorene (KF-54; Shin-Etsu Chemical Co., Ltd., Mn = 2800)
.單官能環氧基:單末端型環氧改質聚矽氧(X-22-173DX;信越化學工業股份有限公司、Mn=4600) . Monofunctional epoxy group: single-end epoxy modified polyfluorene (X-22-173DX; Shin-Etsu Chemical Co., Ltd., Mn=4600)
.多官能環氧基A:側鏈兩末端型環氧改質聚矽氧(X-22-9002;信越化學工業股份有限公司、Mn=7800) . Polyfunctional epoxy group A: side chain two-end type epoxy modified polyfluorene (X-22-9002; Shin-Etsu Chemical Co., Ltd., Mn=7800)
.單官能甲基丙烯基:單末端型甲基丙烯酸改質聚矽氧(X-22-2426;信越化學工業股份有限公司、Mn=12000) . Monofunctional methacryl group: single-end methacrylic acid modified polyfluorene (X-22-2426; Shin-Etsu Chemical Co., Ltd., Mn=12000)
.多官能甲基丙烯基A:兩末端型甲基丙烯酸改質聚矽氧(X-22-164C;信越化學工業股份有限公司、Mn=2400) . Polyfunctional methacryl-based A: two-terminal methacrylic acid modified polyfluorene (X-22-164C; Shin-Etsu Chemical Co., Ltd., Mn=2400)
.多官能甲基丙烯基B:兩末端型甲基丙烯酸改質聚矽氧(X-22-164;信越化學工業股份有限公司、Mn=860) . Polyfunctional methacryl B: two-terminal methacrylic acid modified polyoxo (X-22-164; Shin-Etsu Chemical Co., Ltd., Mn=860)
針對光硬化性環氧樹脂,係於室溫中,使用水銀燈以 20mW的強度照射紫外線300秒鐘使其硬化。針對熱硬化性環氧樹脂,係使用大氣烘箱以90℃的溫度加熱60分鐘使其硬化。針對光硬化性丙烯酸樹脂,係於室溫中,使用水銀燈以20mW的強度照射紫外線100秒鐘使其硬化。針對熱硬化性丙烯酸樹脂,係使用大氣烘箱以90℃的溫度加熱30分鐘使其硬化。 For photocurable epoxy resins, use a mercury lamp at room temperature The intensity of 20 mW was irradiated with ultraviolet rays for 300 seconds to harden it. The thermosetting epoxy resin was cured by heating at 90 ° C for 60 minutes using an atmospheric oven. The photocurable acrylic resin was cured by irradiating ultraviolet rays with a mercury lamp at a strength of 20 mW for 100 seconds at room temperature. The thermosetting acrylic resin was cured by heating at 90 ° C for 30 minutes using an atmospheric oven.
藉由顯微鏡觀察經個片化的81個透鏡之割斷面,若發生200μm以上之碎屑的透鏡未達全體的5%則視為◎,若5%以上且未達10%則視為○,若10%以上且未達20%則視為△,若20%以上則視為×。 When the sliced surface of the 81 lenses is observed by a microscope, if the lens having a chip of 200 μm or more does not reach 5% of the total, it is regarded as ◎, and if it is 5% or more and less than 10%, it is regarded as ○. If it is 10% or more and less than 20%, it is regarded as △, and if it is 20% or more, it is regarded as ×.
藉由顯微鏡觀察經個片化的81個透鏡表面,若附著100μm以上之異物的透鏡未達全體的5%則視為◎,若5%以上且未達10%則視為○,若10%以上且未達20%則視為△,若20%以上則視為×。 When the lens surface of the 81 lenses is observed by a microscope, if the lens having a foreign matter of 100 μm or more is less than 5% of the total, it is regarded as ◎, and if it is 5% or more and less than 10%, it is regarded as ○, if 10% If it is less than 20%, it is regarded as △, and if it is 20% or more, it is regarded as ×.
藉由顯微鏡觀察經個片化的81個透鏡,若每1個透鏡發生10個以上氣泡的透鏡未達全體的5%則視為◎,若5%以上且未達10%則視為○,若10%以上且未達20 %則視為△,若20%以上則視為×。 When 81 lenses are formed by a microscope, if the lens of 10 or more bubbles per lens does not reach 5% of the total, it is regarded as ◎, and if it is 5% or more and less than 10%, it is regarded as ○. If 10% or more and less than 20 % is regarded as △, and if it is 20% or more, it is regarded as ×.
經個片化的81個透鏡內,切取3個投入耐熱試驗(100℃ 500h)中,測量出試驗前後的穿透率(測定機係分光光度計U-4100;Hitachi High-Tech製)。接著,若耐熱試驗前後之450nm穿透率變動未達5%則視為◎,若5%以上且未達10%則視為○,若10%以上且未達15%則視為△,若15%以上則視為×。 Among the 81 lenses which were sliced, three were subjected to a heat resistance test (100 ° C for 500 h), and the transmittance before and after the test (measuring system spectrophotometer U-4100; manufactured by Hitachi High-Tech) was measured. Then, if the change in the transmittance of 450 nm before and after the heat resistance test is less than 5%, it is regarded as ◎, and if it is 5% or more and less than 10%, it is regarded as ○, and if it is 10% or more and less than 15%, it is regarded as Δ. More than 15% is regarded as ×.
將評估結果彙整顯示於表1。依據表1的評估結果可知:比較例1、2雖「耐熱性」為◎,但「割斷耐性」、「異物附著」、「氣泡」係為實用上不適合的水準,且不適合以割斷所致之個片化。可知:比較例3、4、6係所添加的改質聚矽氧之官能基與樹脂之官能基不同,雖「氣泡」為◎,但「割斷耐性」係為實用上不適合的水準,且相同地不適合以割斷所致之個片化。比較例5、7係可推測因改質聚矽氧之數量平均分子量小而無法賦予硬化後之樹脂充分的柔軟性,「異物附著」、「氣泡」雖為良好,但「耐熱性」雖能夠實用但略低,且「割斷耐性」係為實用上不適合的水準。 The summary of the evaluation results is shown in Table 1. According to the evaluation results of Table 1, it is understood that in Comparative Examples 1 and 2, the "heat resistance" is ◎, but the "cutting resistance", "foreign matter adhesion", and "bubble" are practically unsuitable standards, and are not suitable for cutting. Sliced. It can be seen that the functional groups of the modified polyfluorene added in Comparative Examples 3, 4, and 6 are different from the functional groups of the resin, and the "bubble" is ◎, but the "cutting resistance" is a practically unsuitable level and the same. The land is not suitable for the fragmentation caused by the cut. In Comparative Examples 5 and 7, it is presumed that the number average molecular weight of the modified polyfluorene oxide is small, and it is not possible to impart sufficient flexibility to the resin after curing. Although "foreign matter adhesion" and "bubble" are good, "heat resistance" can be Practical but slightly lower, and "cutting tolerance" is a practically unsuitable level.
相對於此可知:所添加的改質聚矽氧之官能基與樹脂之官能基相同的實施例1~15,「割斷耐性」、「異物附著」、「氣泡」、「耐熱性」中任一者皆為能夠實用的水準之△以上的評估,特別是改質聚矽氧的含量為1.2~9.3重量%之範圍的實施例,「割斷耐性」、「異物附著」、「氣泡」、「耐熱性」皆為○以上的評估。 On the other hand, in Examples 1 to 15 in which the functional group of the modified polyfluorene added was the same as the functional group of the resin, "cutting resistance", "foreign matter adhesion", "bubble", and "heat resistance" were either All of them are evaluations of a practical level of Δ or more, particularly examples in which the content of the modified polyfluorene oxide is in the range of 1.2 to 9.3 wt%, "cutting resistance", "foreign matter adhesion", "bubble", "heat resistance". "Essence" is an evaluation of ○ or more.
本發明並非限定於說明書所記載之實施形態、實施例,包含其他的實施例、變形例之內容乃身為本領域之該業者可從本說明書所記載之實施形態或實施例或技術思想得以明瞭。例如,依據本發明所製造的光學元件亦可為攝像透鏡。 The present invention is not limited to the embodiments and examples described in the specification, and the contents of other embodiments and modifications are included in the description of the embodiments, embodiments, or technical concepts described in the specification. . For example, an optical element manufactured in accordance with the present invention may also be an imaging lens.
11‧‧‧基板 11‧‧‧Substrate
12‧‧‧光源 12‧‧‧Light source
13B‧‧‧透鏡部 13B‧‧‧Lens Department
13V‧‧‧V溝槽、谷部 13V‧‧‧V groove, valley
13a‧‧‧平行平板 13a‧‧‧parallel plate
14‧‧‧間隔物 14‧‧‧ spacers
BK‧‧‧底板 BK‧‧‧ bottom plate
C‧‧‧切斷刀 C‧‧‧cutting knife
HB‧‧‧焊球 HB‧‧‧ solder balls
IM‧‧‧成形體 IM‧‧‧formed body
M‧‧‧模具 M‧‧‧Mold
Ma‧‧‧轉印面 Ma‧‧·Transfer surface
Mb‧‧‧隆起部 Mb‧‧‧ Uplift
PL‧‧‧樹脂 PL‧‧‧Resin
SL‧‧‧切入部 SL‧‧‧cutting department
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CN107768485A (en) * | 2016-08-18 | 2018-03-06 | 天正国际精密机械股份有限公司 | The cutting mechanism of solar energy LED |
TWI666782B (en) * | 2018-01-09 | 2019-07-21 | 奇景光電股份有限公司 | Projecting system, small right angle prism mirrors, and method for fabricating small right angle prism mirrors |
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JP2017120364A (en) * | 2015-12-28 | 2017-07-06 | 奇景光電股▲ふん▼有限公司 | Projector, electronic apparatus having the projector, and manufacturing method related thereto |
DE112016006902T5 (en) * | 2016-05-24 | 2019-02-21 | Olympus Corporation | Production method of an optical unit for endoscopes, optical unit for endoscopes and endoscope |
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CN110007379A (en) * | 2019-04-19 | 2019-07-12 | 豪威光电子科技(上海)有限公司 | Optical lens mould group and forming method thereof |
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CN107768485B (en) * | 2016-08-18 | 2019-07-30 | 天正国际精密机械股份有限公司 | The cutting mechanism of solar energy LED |
TWI666782B (en) * | 2018-01-09 | 2019-07-21 | 奇景光電股份有限公司 | Projecting system, small right angle prism mirrors, and method for fabricating small right angle prism mirrors |
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