TW201409049A - Vertical connecting module - Google Patents

Vertical connecting module Download PDF

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Publication number
TW201409049A
TW201409049A TW101129988A TW101129988A TW201409049A TW 201409049 A TW201409049 A TW 201409049A TW 101129988 A TW101129988 A TW 101129988A TW 101129988 A TW101129988 A TW 101129988A TW 201409049 A TW201409049 A TW 201409049A
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Taiwan
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detecting
connection module
detection
circuit board
connecting device
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TW101129988A
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Chinese (zh)
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Chih-Min Huang
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Lextar Electronics Corp
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Priority to TW101129988A priority Critical patent/TW201409049A/en
Priority to CN201210335684.1A priority patent/CN103592470A/en
Publication of TW201409049A publication Critical patent/TW201409049A/en

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Abstract

The present invention relates to a vertical connecting module. The module includes a connector disposed on a circuit board wherein the connector includes a set space and a plurality of conductive terminals which are electrical connected to the corresponding conductive structures of the circuit board; and a detection unit assembled on the connector wherein the detection unit includes a protective cover and a plurality of detection structures which are corresponding to the conductive terminals and a bottom-end thereof are electrical connected to the corresponding conductive terminals.

Description

直立式連接模組 Vertical connection module

本發明係為一種直立式連接模組,尤指一種應用於電路板上並以垂直式的探測方式對形成於其防護蓋上之檢測點進行對其電路板之快速電性檢測的直立式連接模組。 The invention relates to a vertical connection module, in particular to an upright connection applied to a circuit board and performing rapid electrical detection on a circuit board on a detection point formed on the protection cover in a vertical detection manner. Module.

發光二極體(Light Emitting Diode,簡稱LED)係為一種以半導體材料所製成的固態發光元件,具有體積小、發熱度低、高照明、耗電量小、適合量產與壽命長等性能,故目前業界於各種照明裝置或背光模組上,普遍多已採用發光二極體作為其光源之應用。也由於發光二極體的應用越來越廣泛,如何能夠提升發光二極體的發光效率以及改善其產品之製造良率,便成為重要的研發目標。 Light Emitting Diode (LED) is a solid-state light-emitting element made of semiconductor material. It has small volume, low heat generation, high illumination, low power consumption, suitable for mass production and long life. Therefore, at present, various lighting devices or backlight modules are widely used in the industry as light sources. Also, due to the increasing use of light-emitting diodes, how to improve the luminous efficiency of light-emitting diodes and improve the manufacturing yield of their products has become an important research and development goal.

就目前技術而言,製造完成的發光二極體需經過電性測試以檢測其元件之良窳,從而方能確保產品之品質。請參閱第一圖,係為習用之發光二極體產品之構造示意圖。就目前技術來說,完成製造之發光二極體產品係能以燈條(Light bar)的型式作呈現;如第一圖所示,也就是在呈現為長條形之一電路板10上以表面封裝黏著技術(Surface mount technology)將多顆發光二極體元件構成一個個的發光二極體燈條11排列設置於其上,並由亦安裝於該電路板上的一連接器(connector)12來對各發光二極體燈條11 進行發光與否之電連接點亮的電路控制。 As far as the current technology is concerned, the finished light-emitting diode needs to be electrically tested to detect the characteristics of its components, so as to ensure the quality of the product. Please refer to the first figure, which is a schematic diagram of the structure of a conventional light-emitting diode product. As far as the current technology is concerned, the finished light-emitting diode product can be presented in the form of a light bar; as shown in the first figure, that is, on a circuit board 10 which is formed as a long strip. A surface mount technology has a plurality of light emitting diode elements constituting a plurality of light emitting diode strips 11 arranged thereon, and a connector mounted on the circuit board. 12 pairs of light-emitting diode strips 11 A circuit control that illuminates or illuminates the electrical connection.

如第一圖所示,在該電路板10上設置有多個檢測點14,而該等檢測點14的數目係和所設置之發光二極體燈條11的數目有關;例如所設置的發光二極體燈條有四串,則其檢測點14可設置成四至五個。這些檢測點14並分別和該電路板10產生電連接,也就是能類似該連接器12的功能而可提供電連接以點亮對應的發光二極體燈條11。而就目前技術來說,所謂的電性檢測方式係由一熱測治具(未顯示於本圖)利用其所具有對應數目之金屬探針來和該等檢測點14作接觸;例如可採用垂直式的方式從電路板10的上方(top-view)往下探測,或採用水平式的方式從電路板10的側向(side-view)伸進探測,從而能觀察各燈條之元件是否正常發光而判斷其良窳情形。 As shown in the first figure, a plurality of detection points 14 are disposed on the circuit board 10, and the number of the detection points 14 is related to the number of the LED strips 11 provided; for example, the set illumination There are four strings of diode bars, and the detection points 14 can be set to four to five. These detection points 14 are electrically connected to the circuit board 10, respectively, that is, similar to the function of the connector 12, to provide an electrical connection to illuminate the corresponding LED strips 11. As far as the current technology is concerned, the so-called electrical detection method is performed by a thermal measuring fixture (not shown in the figure) with a corresponding number of metal probes for contacting the detecting points 14; for example, The vertical mode is detected from the top-view of the circuit board 10, or horizontally from the side-view of the circuit board 10, so that the components of each light bar can be observed. Normally illuminate and judge its good condition.

此外,這些檢測點14的設置位置通常都是根據其電路板10或發光二極體燈條11的尺寸或構造而作對應的建構;例如可在電路板所設計之電路結構以外的其他空間來作分散地設置,以使各個檢測點彼此之間具有足夠的安全距離與空間來提供檢測。是以,若所製造生產之各種發光二極體產品其電路板上的電路結構都不盡相同時,其上之檢測點的設置位置也都會有所不同。 In addition, the positions of the detection points 14 are generally configured according to the size or configuration of the circuit board 10 or the LED strips 11; for example, other spaces than the circuit structure designed by the board can be used. The settings are dispersed so that each detection point has a sufficient safety distance and space between each other to provide detection. Therefore, if the circuit structures on the circuit board of the various light-emitting diode products manufactured and manufactured are different, the setting positions of the detection points thereon will also be different.

如同一般設置於電路板上之相關電子元件,為檢測出其產品品質的良窳,所謂之檢測點便為製造上必要的構造設計。然而,這些設置位置不盡相同之檢測點,本身還有可能會因為電路板上的設置空間不足而造成其形成位置較不易被檢測,進而容易出現檢測上之誤判情形。除此之 外,所使用的熱測治具其探針之數目與形成位置必需和待檢測之檢測點相互對應;因此,除非是位於可容許的檢測偏差範圍內,對於這些檢測點的設置位置不盡相同之各種電路板而言,便必需個別地使用專門設計之熱測治具來進行檢測,其探針才能和對應之檢測點作接觸。是以,所使用之熱測治具的共用性便較不佳,進而會造成其生產成本的增加與檢測上之不便。 As with the related electronic components generally disposed on the circuit board, in order to detect the quality of the product, the so-called detection point is the necessary structural design for manufacturing. However, these detection points with different setting positions may themselves be less likely to be detected due to insufficient installation space on the circuit board, and thus the detection may be misjudged. In addition to this In addition, the number of probes used for the thermal test fixture and the position of formation must correspond to the detection points to be detected; therefore, the setting positions for these detection points are not the same unless they are within the allowable detection deviation range. For various circuit boards, it is necessary to individually use a specially designed thermal test fixture for detection, and the probe can be in contact with the corresponding detection point. Therefore, the commonness of the thermal test fixture used is relatively poor, which in turn causes an increase in production cost and inconvenience in detection.

本發明之目的在於提供一種直立式連接模組。藉由將直立式連接模組之連接器件設置於電路板上,並將直立式連接模組之檢測件安裝於連接器件上,從而使得電路板上可進行電接觸之測點位置能延伸至上方;也就是能進一步利用熱測治具以垂直式的探測方式對形成於檢測件之防護蓋上的檢測點進行快速電性檢測,使得檢測誤判之情形可有效減少,並能提升熱測治具之共用性。 It is an object of the present invention to provide an upright connection module. By placing the connecting device of the vertical connection module on the circuit board and mounting the detecting component of the vertical connection module on the connecting device, the measuring position of the electrical contact on the circuit board can be extended to the upper position. That is, the thermal test fixture can be further utilized to perform rapid electrical detection on the detection points formed on the protective cover of the test piece in a vertical detection manner, so that the detection of the false judgment can be effectively reduced, and the thermal test fixture can be improved. The sharing.

本發明係為一種直立式連接模組,包含有:一連接器件,用以設置於一電路板上,該連接器件係具有一容置空間和複數個導電端子,其中該等導電端子係對應於該電路板之導電結構,用以形成電連接;以及一檢測件,用以組裝於該連接器件上,該檢測件係具有一防護蓋和複數個檢測結構,其中該等檢測結構係對應於該等導電端子且該檢測結構之一底端係對應於導電端子形成電連接。 The present invention is an upright connection module, comprising: a connecting device for being disposed on a circuit board, the connecting device having an accommodating space and a plurality of conductive terminals, wherein the conductive terminals correspond to a conductive structure of the circuit board for forming an electrical connection; and a detecting member for assembling on the connecting device, the detecting member having a protective cover and a plurality of detecting structures, wherein the detecting structures correspond to the The conductive terminals and one of the bottom ends of the detecting structure form an electrical connection corresponding to the conductive terminals.

現以一較佳實施例進行本發明之實施說明。請同時參閱第二圖(a)和(b)。其中第二圖(a)係為本發明所提出之直立式連接模組20之一連接器件21和一檢測件24的組裝立體示意圖;第二圖(b)係為該直立式連接模組20之該連接器件21和該檢測件24的分解立體示意圖。如第二圖(a)和(b)所示,於此實施例中,該直立式連接模組20係包含有該連接器件21和該檢測件24,該檢測件24係用以組裝於該連接器件21上。詳細來說,該檢測件24具有一防護蓋25、複數個檢測結構26和一第一卡合構造27,該連接器件21具有一容置空間210、一第一頂面211和一第二卡合構造22,而完成該檢測件24與該連接器件21間之組裝的該防護蓋25係位於該第一頂面211上,且該等檢測結構26係伸入至該容置空間210中。 The description of the embodiments of the present invention will now be made in a preferred embodiment. Please also refer to the second figure (a) and (b). The second figure (a) is an assembled perspective view of the connecting device 21 and the detecting component 24 of the vertical connecting module 20 of the present invention; and the second drawing (b) is the vertical connecting module 20 An exploded perspective view of the connecting device 21 and the detecting member 24. As shown in the second embodiment (a) and (b), in the embodiment, the vertical connection module 20 includes the connecting device 21 and the detecting member 24, and the detecting member 24 is used for assembling the same. Connected to device 21. In detail, the detecting member 24 has a protective cover 25, a plurality of detecting structures 26 and a first engaging structure 27. The connecting device 21 has an accommodating space 210, a first top surface 211 and a second card. The protective cover 25 is formed on the first top surface 211, and the detecting structures 26 extend into the accommodating space 210.

承上所述,於此實施例中,本發明所提出之直立式連接模組20中的該連接器件21係用以設置於一電路板(如第三圖所示)30上;如第二圖(b)所示,該連接器件21還具有複數個導電端子23,而該等導電端子23係和設置在該電路板30上之相關導電結構(如第四圖所示)32相互對應,用以於該連接器件21完成在該電路板30上之設置後使該等導電端子23和所述之導電結構32形成電連接。進一步來說,本發明之直立式連接模組20中所設計的該連接器件21係可採用習用技術之直立式連接器元件,而該等導電端子23之設置數目與位置係對應於其電路板30上之導 電結構32,從而可藉由該連接器件21對其電路板30進行電路信號控制。 As described above, in the embodiment, the connecting device 21 in the vertical connection module 20 of the present invention is configured to be disposed on a circuit board (as shown in FIG. 3) 30; As shown in FIG. (b), the connecting device 21 further has a plurality of conductive terminals 23, and the conductive terminals 23 and the associated conductive structures (as shown in the fourth figure) 32 disposed on the circuit board 30 correspond to each other. After the connection device 21 is completed on the circuit board 30, the conductive terminals 23 and the conductive structure 32 are electrically connected. Further, the connecting device 21 designed in the vertical connection module 20 of the present invention can adopt a vertical connector component of the prior art, and the number and position of the conductive terminals 23 correspond to the circuit board thereof. Guide on 30 The electrical structure 32 is such that the circuit board 30 can be circuit-controlled by the connection device 21.

請再同時參閱第二圖(c),係為該檢測件24之側面示意圖。於此實施例中,該等檢測結構26之設置數目與位置係和該連接器件21之導電端子23相互對應,如第二圖(a)至(c)所示,便是以四個檢測結構26與四個導電端子23作舉例示意。此外,於此實施例中,各檢測結構26之一頂端261係露出於該防護蓋25之一第二頂面252上而形成設置數目與位置相互對應之檢測點251(如第二圖(a)所示)。而此部份之設計係可於該防護蓋25上形成出和該等檢測結構26之設置數目與位置相互對應之複數個檢測穿孔250,而該等檢測結構26便藉由該等檢測穿孔250而將其頂端261固設在該防護蓋25上,並使得所述之檢測點251對應設置於該等檢測穿孔250內。 Please refer to the second figure (c) at the same time, which is a schematic side view of the detecting member 24. In this embodiment, the number of the detecting structures 26 and the positional system and the conductive terminals 23 of the connecting device 21 correspond to each other. As shown in the second figures (a) to (c), the detecting structures are four detecting structures. 26 and four conductive terminals 23 are illustrated by way of example. In addition, in this embodiment, the top end 261 of each of the detecting structures 26 is exposed on one of the second top surfaces 252 of the protective cover 25 to form a detection point 251 corresponding to the number of positions and positions (such as the second figure (a). )))). The design of the portion is formed on the protective cover 25 by a plurality of detecting through holes 250 corresponding to the number and position of the detecting structures 26, and the detecting structures 26 are used to detect the through holes 250. The top end 261 is fixed on the protective cover 25, and the detecting point 251 is correspondingly disposed in the detecting through holes 250.

承上所述,於此實施例中,該第一卡合構造27係能以具可撓性之材質所製成。並如第二圖(c)所示,該第一卡合構造27係以一成對之結構形成在該防護蓋25下方的兩側,且其端緣可呈現為勾狀;而該連接器件21之該第二卡合構造22則可呈現為對應之凹槽,使得該第一卡合構造27能產生可撓之形變以進入該容置空間210後,並於該第二卡合構造22之處形成卡合,以使該檢測件24組裝於該連接器件21上。 As described above, in this embodiment, the first engaging structure 27 can be made of a flexible material. And as shown in the second figure (c), the first engaging structure 27 is formed on both sides of the protective cover 25 in a paired structure, and the end edge thereof may be in the shape of a hook; and the connecting device The second engaging structure 22 of the second engaging structure 22 can be represented as a corresponding groove, so that the first engaging structure 27 can be flexibly deformed to enter the accommodating space 210, and in the second engaging structure 22 A snap fit is formed to assemble the detecting member 24 to the connecting member 21.

進一步來說,為進行相關之電性檢測,該防護蓋25係以絕緣材質所構成,例如塑膠;而該第一卡合構造27係能和該防護蓋25以塑料一體成型的方式完成製造,並 藉由尺寸與形狀之設計,使其第一卡合構造27能產生可撓形變而完成與對應之第二卡合構造22的卡合,進而並還可經由施力而從其連接器件21上加以拆除。然而,於其他實施方式中係亦可採用其他習用結構之卡合設計來完成該檢測件24於該連接器件21上的穩固組裝。 Further, in order to perform the related electrical detection, the protective cover 25 is made of an insulating material, such as plastic, and the first engaging structure 27 can be manufactured integrally with the protective cover 25 in a plastic form. and By the design of the size and the shape, the first engaging structure 27 can be flexibly deformed to complete the engagement with the corresponding second engaging structure 22, and can also be connected to the device 21 via the force application. Remove it. However, in other embodiments, the snap-fit design of other conventional structures may be used to complete the secure assembly of the detecting member 24 on the connecting device 21.

請參閱第三圖,係為將本發明之直立式連接模組20應用於一電路板30上之示意圖。由上述內容可知,該直立式連接模組20係藉由該連接器件21而插入、設置於該電路板30上,而能對亦設置於該電路板30上之電子迴路組件進行控制。於此實施例中,如第三圖所示,設置於該電路板30上之電子迴路組件係以發光二極體燈條31作舉例說明。而在該電路板30上係設置有多個發光二極體燈條31;詳細來說,其發光二極體燈條31之設置數目係和該直立式連接模組20所設計之檢測點數目有所對應。此外,如第三圖所示,使用本發明之直立式連接模組20係無需在該電路板30上設計出相關之檢測點。 Please refer to the third figure, which is a schematic diagram of applying the vertical connection module 20 of the present invention to a circuit board 30. As can be seen from the above, the vertical connection module 20 is inserted into and disposed on the circuit board 30 by the connection device 21, and can control the electronic circuit component also disposed on the circuit board 30. In this embodiment, as shown in the third figure, the electronic circuit component disposed on the circuit board 30 is exemplified by the LED strip 31. A plurality of LED strips 31 are disposed on the circuit board 30; in detail, the number of the LED strips 31 is set and the number of detection points designed by the juxtaposition module 20 There is a correspondence. Moreover, as shown in the third figure, the use of the upright connection module 20 of the present invention eliminates the need to design associated detection points on the circuit board 30.

請再參閱第四圖,係為利用該直立式連接模組20進行電性檢測之示意圖。由上述內容可知,當該直立式連接模組20之該連接器件21設置於該電路板30上後,該連接器件21之該等導電端子23便能和該電路板30之對應的導電結構32形成電連接。同時,於此實施例中,該檢測件24之該等檢測結構26係以金屬材質所構成,使得在完成該檢測件24對該連接器件21之組裝後,伸入至該容置空間210中的各檢測結構26便能藉由其一底端262(如第二圖(c)所示)來和相互對應之導電端子23形成電連接, 進而使得該等檢測結構26和電路板30之導電結構32亦能形成電連接。換句話說,該等檢測結構26便呈現為一種延伸之檢測構造,而形成於該等檢測結構26之頂端261的對應檢測點251便可提供電性檢測。 Please refer to the fourth figure again for a schematic diagram of electrical detection using the vertical connection module 20. It can be seen from the above that when the connecting device 21 of the vertical connection module 20 is disposed on the circuit board 30, the conductive terminals 23 of the connecting device 21 and the corresponding conductive structure 32 of the circuit board 30. Form an electrical connection. At the same time, in the embodiment, the detecting structures 26 of the detecting member 24 are made of a metal material, so that after the detecting member 24 is assembled to the connecting device 21, the detecting member 26 is inserted into the accommodating space 210. Each of the detecting structures 26 can be electrically connected to the corresponding conductive terminals 23 by a bottom end 262 thereof (as shown in the second figure (c)). In turn, the sensing structures 26 and the conductive structures 32 of the circuit board 30 can also form an electrical connection. In other words, the detection structures 26 are presented as an extended detection configuration, and corresponding detection points 251 formed at the top end 261 of the detection structures 26 provide electrical detection.

如第四圖所示,本發明所提出之直立式連接模組20還包含一熱測治具28,而能進行如前所述之電性檢測。是以,所設計之該熱測治具28係具有對應於該等檢測結構26之複數個探針281。詳細來說,該等探針281之設置位置與數目係和該等檢測結構26相互對應;於此實施例中係以四個檢測結構作說明,因此該熱測治具28之探針數目便為四個。而針對本發明所提出之連接器件21與檢測件24,該熱測治具28係採用垂直式的方式從電路板30的上方(top-view)往下探測;也就是在各檢測點251、各探針281之位置、間距都相互對應的情形下,該熱測治具28進行相對於該電路板30之垂直方向上的移動而能對該等檢測點251皆同時形成接觸,從而可同時觀察各燈條的發光情形,而能一次性、快速地完成檢測。 As shown in the fourth figure, the upright connection module 20 of the present invention further includes a thermal test fixture 28 capable of performing electrical detection as described above. Therefore, the thermal test fixture 28 is designed to have a plurality of probes 281 corresponding to the detection structures 26. In detail, the positions and numbers of the probes 281 and the detecting structures 26 correspond to each other; in this embodiment, four detecting structures are used for description, so that the number of probes of the thermal measuring tool 28 is For four. For the connecting device 21 and the detecting member 24 proposed by the present invention, the thermal measuring tool 28 is vertically detected from the top-view of the circuit board 30; that is, at each detecting point 251, In the case where the positions and the pitches of the probes 281 correspond to each other, the thermal measuring tool 28 is moved in the vertical direction with respect to the circuit board 30, so that the detection points 251 can simultaneously form a contact, thereby simultaneously Observing the illumination of each light bar, the detection can be completed once and quickly.

承上所述,就目前技術來說,雖然除了可以利用設置於電路板上之習用檢測點作檢測以外,還可直接對所使用之連接器的導電端子進行電接觸以進行檢測;但由於這些導電端子之形成位置較不易從外部探測,使得熱測治具之探針在進行檢測時,便容易因為接觸上之誤差而產生誤判。然而,本發明所提出之直立式連接模組20的連接器件21與檢測件24使可進行電接觸之測點位置進一步地從電路板延伸至更上方,並外露於防護蓋25之表面上來進 行,使得所述之誤判情形將可有效地減少。 As described above, in the current technology, although the detection points disposed on the circuit board can be used for detection, the conductive terminals of the connectors used can be directly electrically contacted for detection; The position at which the conductive terminals are formed is less likely to be detected from the outside, so that when the probe of the thermal test tool is detected, it is easy to cause a misjudgment due to the error in the contact. However, the connecting device 21 and the detecting member 24 of the vertical connection module 20 of the present invention further extend the position of the measuring point capable of making electrical contact from the circuit board to the upper side and expose the surface of the protective cover 25 to enter. The line is such that the misjudgment situation can be effectively reduced.

再者,由於本發明之檢測件24上的檢測點251係對應於該連接器件21中的導電端子23,因此,於應用上若設置於不同電路板之連接器件係採用相同元件時,則包括檢測件24與熱測治具28兩元件便亦可重覆應用於這些電路板來進行檢測。另外,本發明的直立式連接模組於不同電路板上所設置的檢測點之數目可為不同,但於應用上係能以對應其檢測點數目之熱測治具來進行檢測。舉例來說,所使用之熱測治具可為四個探針或八個探針,在檢測件之檢測點設置位置相互對應的設計下,四個探針的熱測治具可對各種四個檢測點之檢測件進行檢測;同理,八個探針的熱測治具可對各種八個檢測點之檢測件進行檢測,使得本發明之直立式連接模組的共用性相較於習用技術能更加提升。 Furthermore, since the detecting point 251 on the detecting member 24 of the present invention corresponds to the conductive terminal 23 in the connecting device 21, if the connecting device disposed on different boards is used in the same component, the application includes Both the detecting member 24 and the thermal measuring fixture 28 can be repeatedly applied to these boards for detection. In addition, the number of detection points provided on the different circuit boards of the vertical connection module of the present invention may be different, but in application, the thermal test fixture corresponding to the number of detection points can be used for detection. For example, the thermal test fixture used may be four probes or eight probes, and the thermal probes of the four probes may be used for various fours under the design that the detection points of the detection members are disposed corresponding to each other. The detection components of the detection points are detected; similarly, the thermal probes of the eight probes can detect the detection components of the eight detection points, so that the sharing of the vertical connection modules of the present invention is compared with the conventional ones. Technology can be improved.

綜上所述,本發明所提出之直立式連接模組至少可達到下列幾點功效之增進:其一,本發明藉由檢測結構之設計而將電路板上可進行電接觸之測點位置(包括設置在電路板上且分散在各電子元件間的檢測點以及形成於連接器中的導電端子),進一步延伸至上方,從而可減少因空間不足所可能出現的檢測誤判情形,並能快速地完成檢測。其二,本發明的連接器件可採用習用技術之直立式連接器元件;而就目前技術來說,雖然大部份電路板的電路結構都不盡相同,但為有效進行對電路板之電路信號控制,習用直立式連接器元件的共用性設計係相對較高;因此,本發明藉由將檢測點之設置數目與位置皆對應於連接器件 之導電端子的方式,使得檢測上所使用的熱測治具之共用性可大幅提升,從而能有效減少生產成本與檢測之不便。是故,本發明能有效解決先前技術中所提出之相關問題,並能成功地達到本案發展之主要目的。 In summary, the upright connection module of the present invention can at least achieve the following enhancements: First, the present invention can detect the position of the measuring point on the circuit board by detecting the design of the structure ( The invention includes a detection point disposed on the circuit board and dispersed between the electronic components and a conductive terminal formed in the connector, and further extends to the upper portion, thereby reducing detection misjudgment which may occur due to insufficient space, and can quickly Complete the test. Secondly, the connecting device of the present invention can adopt the vertical connector component of the conventional technology; while in the current technology, although the circuit structure of most of the circuit boards is not the same, the circuit signal for the circuit board is effectively performed. Control, the common design of the conventional vertical connector components is relatively high; therefore, the present invention corresponds to the connecting device by setting the number and position of the detection points. The way of the conductive terminals makes the commonness of the thermal test fixtures used in the detection can be greatly improved, thereby effectively reducing the production cost and the inconvenience of detection. Therefore, the present invention can effectively solve the related problems raised in the prior art and can successfully achieve the main purpose of the development of the present case.

任何熟悉本技術領域的人員,可在運用與本發明相同目的之前提下,使用本發明所揭示的概念和實施例變化來作為設計和改進其他一些方法的基礎。這些變化、替代和改進不能背離申請專利範圍所界定的本發明的保護範圍。是故,本發明得由熟習此技藝之人士任施匠思而為諸般修飾,然皆不脫如附申請專利範圍所欲保護者。 Any person skilled in the art can make use of the concepts and embodiment variations disclosed herein to form a basis for designing and improving other methods. These variations, substitutions and improvements are not to be construed as a departure from the scope of the invention as defined by the appended claims. It is to be understood that the present invention may be modified by those skilled in the art and may be modified as described in the appended claims.

10‧‧‧電路板 10‧‧‧ boards

11‧‧‧發光二極體燈條 11‧‧‧Lighting diode strip

12‧‧‧連接器 12‧‧‧Connector

14‧‧‧檢測點 14‧‧‧Checkpoints

20‧‧‧直立式連接模組 20‧‧‧Vertical connection module

21‧‧‧連接器件 21‧‧‧Connecting devices

210‧‧‧容置空間 210‧‧‧ accommodating space

211‧‧‧第一頂面 211‧‧‧ first top surface

22‧‧‧第二卡合構造 22‧‧‧Second snap construction

23‧‧‧導電端子 23‧‧‧Electrical terminals

24‧‧‧檢測件 24‧‧‧Test pieces

25‧‧‧防護蓋 25‧‧‧ protective cover

250‧‧‧檢測穿孔 250‧‧‧Test perforation

251‧‧‧檢測點 251‧‧‧Checkpoint

252‧‧‧第二頂面 252‧‧‧Second top

26‧‧‧檢測結構 26‧‧‧Detection structure

261‧‧‧頂端 261‧‧‧Top

262‧‧‧底端 262‧‧‧ bottom

27‧‧‧第一卡合構造 27‧‧‧First engagement structure

28‧‧‧熱測治具 28‧‧‧Thermal fixture

281‧‧‧探針 281‧‧‧ probe

30‧‧‧電路板 30‧‧‧ boards

31‧‧‧發光二極體燈條 31‧‧‧Lighting diode strip

32‧‧‧導電結構 32‧‧‧Electrical structure

第一圖,係為習用之發光二極體產品之構造示意圖。 The first figure is a schematic diagram of the structure of a conventional light-emitting diode product.

第二圖(a),係為本發明之直立式連接模組20之連接器件21和檢測件24的組裝立體示意圖。 The second figure (a) is an assembled perspective view of the connecting device 21 and the detecting member 24 of the upright connection module 20 of the present invention.

第二圖(b),係為本發明之直立式連接模組20之連接器件21和檢測件24的分解立體示意圖。 The second figure (b) is an exploded perspective view of the connecting device 21 and the detecting member 24 of the upright connection module 20 of the present invention.

第二圖(c),係為檢測件24之側面示意圖。 The second figure (c) is a schematic side view of the detecting member 24.

第三圖,係為將本發明之直立式連接模組20應用於一電路板30上之示意圖。 The third figure is a schematic diagram of applying the upright connection module 20 of the present invention to a circuit board 30.

第四圖,係為利用直立式連接模組20進行電性檢測之示意圖。 The fourth figure is a schematic diagram of electrical detection using the vertical connection module 20.

21‧‧‧連接器件 21‧‧‧Connecting devices

210‧‧‧容置空間 210‧‧‧ accommodating space

22‧‧‧第二卡合構造 22‧‧‧Second snap construction

23‧‧‧導電端子 23‧‧‧Electrical terminals

24‧‧‧檢測件 24‧‧‧Test pieces

25‧‧‧防護蓋 25‧‧‧ protective cover

26‧‧‧檢測結構 26‧‧‧Detection structure

27‧‧‧第一卡合構造 27‧‧‧First engagement structure

Claims (10)

一種直立式連接模組,包含有:一連接器件,用以設置於一電路板上,該連接器件係具有一容置空間和複數個導電端子,其中該等導電端子係對應於該電路板之導電結構,用以形成電連接;以及一檢測件,用以組裝於該連接器件上,該檢測件係具有一防護蓋和複數個檢測結構,其中該等檢測結構係對應於該等導電端子且該檢測結構之一底端係對應於導電端子形成電連接。 An upright connection module includes: a connecting device for being disposed on a circuit board, the connecting device having an accommodating space and a plurality of conductive terminals, wherein the conductive terminals correspond to the circuit board a conductive structure for forming an electrical connection; and a detecting member for assembling to the connecting device, the detecting member having a protective cover and a plurality of detecting structures, wherein the detecting structures correspond to the conductive terminals One of the bottom ends of the detecting structure forms an electrical connection corresponding to the conductive terminals. 如申請專利範圍第1項所述之直立式連接模組,其中該連接器件係具有一第一頂面,而完成組裝之該防護蓋係位於該第一頂面上。 The upright connection module of claim 1, wherein the connecting device has a first top surface, and the protective cover is assembled on the first top surface. 如申請專利範圍第1項所述之直立式連接模組,其中該檢測結構之一頂端係露出於該防護蓋之一第二頂面上形成對應之檢測點以提供檢測。 The upright connection module of claim 1, wherein a top end of the detection structure is exposed on a second top surface of the protective cover to form a corresponding detection point to provide detection. 如申請專利範圍第3項所述之直立式連接模組,其中該防護蓋係具有對應於該等檢測結構之複數個檢測穿孔,而該等檢測點係對應設置於該等檢測穿孔內。 The upright connection module of claim 3, wherein the protective cover has a plurality of detecting through holes corresponding to the detecting structures, and the detecting points are correspondingly disposed in the detecting through holes. 如申請專利範圍第1項所述之直立式連接模組,更包含一熱測治具,用以進行相對於該電路板之垂直方向上的檢測。 The upright connection module of claim 1, further comprising a thermal test fixture for detecting in a vertical direction relative to the circuit board. 如申請專利範圍第5項所述之直立式連接模組,其中該熱測治具係具有對應於該等檢測結構之複數個探針。 The upright connection module of claim 5, wherein the thermal test fixture has a plurality of probes corresponding to the detection structures. 如申請專利範圍第5項所述之直立式連接模組,其中該熱測治具係對設置於該電路板上之至少一電子迴路組件進行檢測。 The upright connection module of claim 5, wherein the thermal test fixture detects at least one electronic circuit component disposed on the circuit board. 如申請專利範圍第7項所述之直立式連接模組,其中該電子迴路組件係為一發光二極體燈條。 The upright connection module of claim 7, wherein the electronic circuit component is a light-emitting diode light bar. 如申請專利範圍第1項所述之直立式連接模組,其中該檢測件係具有一第一卡合構造,而該連接器件係具有一第二卡合構造,該第一卡合構造係和該第二卡合構造相互對應而形成卡合,以使該檢測件組裝於該連接器件上。 The upright connection module of claim 1, wherein the detecting member has a first engaging structure, and the connecting device has a second engaging structure, the first engaging structure and The second engaging structures are coupled to each other to form a snap so that the detecting member is assembled to the connecting device. 如申請專利範圍第1項所述之直立式連接模組,其中該防護蓋係以絕緣材質所構成,而該等檢測結構係以金屬材質所構成。 The upright connection module according to claim 1, wherein the protective cover is made of an insulating material, and the detecting structures are made of a metal material.
TW101129988A 2012-08-17 2012-08-17 Vertical connecting module TW201409049A (en)

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