TW201408926A - 發光二極體燈具及其電路板加工方法 - Google Patents

發光二極體燈具及其電路板加工方法 Download PDF

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Publication number
TW201408926A
TW201408926A TW101130831A TW101130831A TW201408926A TW 201408926 A TW201408926 A TW 201408926A TW 101130831 A TW101130831 A TW 101130831A TW 101130831 A TW101130831 A TW 101130831A TW 201408926 A TW201408926 A TW 201408926A
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TW
Taiwan
Prior art keywords
circuit board
light
layer
processing
emitting diode
Prior art date
Application number
TW101130831A
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English (en)
Chinese (zh)
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TWI498503B (https=
Inventor
Ke-Long Shen
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Lsq Green Energy Co Ltd
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Publication date
Application filed by Lsq Green Energy Co Ltd filed Critical Lsq Green Energy Co Ltd
Priority to TW101130831A priority Critical patent/TW201408926A/zh
Publication of TW201408926A publication Critical patent/TW201408926A/zh
Application granted granted Critical
Publication of TWI498503B publication Critical patent/TWI498503B/zh

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  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
TW101130831A 2012-08-24 2012-08-24 發光二極體燈具及其電路板加工方法 TW201408926A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW101130831A TW201408926A (zh) 2012-08-24 2012-08-24 發光二極體燈具及其電路板加工方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW101130831A TW201408926A (zh) 2012-08-24 2012-08-24 發光二極體燈具及其電路板加工方法

Publications (2)

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TW201408926A true TW201408926A (zh) 2014-03-01
TWI498503B TWI498503B (https=) 2015-09-01

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TW101130831A TW201408926A (zh) 2012-08-24 2012-08-24 發光二極體燈具及其電路板加工方法

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Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070014018A1 (en) * 2004-12-30 2007-01-18 Wheatley John A Internal components of optical device comprising hardcoat
TWI256737B (en) * 2005-05-19 2006-06-11 Pi-Fu Yang One-block light-emitting device and manufacturing method thereof
WO2007050484A1 (en) * 2005-10-24 2007-05-03 3M Innovative Properties Company Method of making light emitting device having a molded encapsulant
US20070269586A1 (en) * 2006-05-17 2007-11-22 3M Innovative Properties Company Method of making light emitting device with silicon-containing composition
KR101161600B1 (ko) * 2007-10-22 2012-07-03 가부시키가이샤 닛폰 쇼쿠바이 편광판, 그 제조 방법, 광학 필름 및 화상 표시 장치
JP5591477B2 (ja) * 2008-03-13 2014-09-17 日東電工株式会社 光学部材用粘着剤組成物、光学部材用粘着剤層、粘着型光学部材、透明導電性積層体、タッチパネルおよび画像表示装置
JP5379410B2 (ja) * 2008-03-14 2013-12-25 日東電工株式会社 光学フィルム用粘着剤組成物、粘着型光学フィルムおよび画像表示装置
TW201114603A (en) * 2009-10-16 2011-05-01 Wintek Corp Complex sheet structure and cover lens assembly used in a touch panel

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Publication number Publication date
TWI498503B (https=) 2015-09-01

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