TW201408926A - LED lamp and processing method of circuit board thereof - Google Patents

Abstract

The present invention relates to an LED lamp and a processing method of a circuit board thereof which arranges the circuit board of a circuit module on a lamp base, and a plurality of LEDs are electrically connected to the circuit board. Brightness enhancement films are mounted on the plurality of LEDs and an upper surface of the circuit board outside soldering points. The brightness enhancement films are formed by surface washing, adhering a shading layer and mounting it on a jigs, and forming a primer layer by dust removing and spray-coating, coating to form a metal layer plating, spray-coating to form a protection layer, and removing jig and proceeding the cleaning procedure. The primer layer is made by a predetermined ratio of polymer, polycyclohexane diisocyanate, propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether, ethylene glycol monoethyl ether acetate and a solvent. The light source emitted by the plurality of LEDs to the outside through the lamp shade can be enhanced by the brightness enhancement films from the light source reflected by the lamp shade to the lamp shade in addition to the light source emitting directly through the lamp shade to achieve the purpose of brightness enhancement.

Description

Light-emitting diode lamp and circuit board processing method thereof

The invention provides a light-emitting diode lamp and a circuit board processing method thereof, in particular, a circuit board of a circuit module on a lamp socket is provided with a brightness enhancement film on the outer surface of the plurality of light-emitting diodes, so that the light source reflected by the lamp cover is filtered. The film is reflected and irradiated again to the lamp cover to increase the brightness of the light source that the plurality of light-emitting diodes are irradiated to the outside through the lamp cover.

According to the lighting equipment, it can be said that it has completely changed the way of life around the world. If there is no lighting in our life, whether it is at night or when the weather is not good, everything will stop, and if it is limited by lighting, It is possible that the way of building or living a house will be completely changed, and all human beings will not be able to make progress, and they will continue to stay in a relatively backward era.

The lighting equipment used in the market today, such as fluorescent lamps, tungsten lamps and even the energy-saving bulbs widely accepted by the public, have been widely used in daily life. Generally, the requirement for lighting is to ensure the safe operation of lighting equipment. In order to prevent personal or fire accidents, and to improve the quality of lighting and save electricity, however, in the case of fluorescent lamps (ie fluorescent lamps), the principle of illumination is the use of radioactive electrons generated by the passage of current through the two-terminal electrodes. The mercury atom in the tube is impacted to excite ultraviolet light, which in turn excites the fluorescent material on the wall of the tube to produce visible light.

In addition, with the maturity of the light-emitting diodes and the advent of white light diodes Many manufacturers have developed R&D for the use of light-emitting diodes, so that the LEDs can be used for general illumination. However, the LEDs need to have a circuit board for the electrical connection of the LEDs. For the structure of the general light-emitting diode lamp, please refer to the eighth figure, which is provided with a plurality of light-emitting diodes A1 on the circuit board A, and the heat-dissipating component A2 on the other side of the circuit board A, and then the external cover There is a lampshade B. Since the light source emitted by the plurality of LEDs A1 needs to pass through the lampshade B to be irradiated to the outside, generally the lampshade B can only pass 70% of the light source to the outside, and the remaining 30% of the light source is covered by the lampshade. B reflects and illuminates the circuit board A.

Due to the practical use of the light-emitting diode lamp, the lack of brightness is a problem that needs to be solved. However, in many technologies for manufacturing the light-emitting diode, the brightness of the light source emitted by the light-emitting diode A1 can be made. After the improvement, and the technical problems are solved, the cost is also the key to the mass production. Therefore, the above-mentioned light-emitting diode lamps have many problems and defects, which is the inventor and engaged in this. The goal of the industry is to improve.

Therefore, in view of the above-mentioned shortcomings, the inventors have collected relevant information, and through multi-party evaluation and consideration, and through years of experience in the industry, through continuous trial and modification, this design can be used to improve the illumination brightness LED. Inventor of the luminaire and its circuit board processing method.

The main purpose of the present invention is to provide a circuit board with a circuit module on the lamp holder, and the circuit board is electrically connected with a plurality of light-emitting diodes, and the plurality of light-emitting diodes The surface of the diode and its external circuit board is sequentially cleaned through the surface, attached to the shielding layer, installed in the fixture, dusted, sprayed to form a primer layer, plated to form a metal layer, sprayed to form a protective layer, and detached The fixture is cleaned and the like is formed with a brightness enhancement film, and the primer layer is a polymer in a predetermined ratio, polydiisocyanate cyclohexane, propylene glycol methyl ether acetate, propylene glycol methyl ether, ethylene glycol ethyl ether acetate, and The solvent is modulated, so that the light source emitted by the plurality of light-emitting diodes and reflected by the lamp cover can be reflected again to the lamp cover after being irradiated to the brightness-increasing film, so as to increase the proportion of the light source emitted by the plurality of light-emitting diodes passing through the lamp cover. The number of LEDs in the luminaire can be reduced, and the power required for the luminaires can be reduced, thereby achieving the purpose of improving brightness, environmental protection and energy saving.

The secondary object of the present invention is that the circuit board is cleaned through the surface before the installation of the plurality of light-emitting diodes, and the shielding layer is attached to the surface of each of the plurality of light-emitting diodes on the circuit board. And after the circuit board is installed in the fixture, the surface is dust-removed, and then the primer layer, the metal layer and the protective layer are sequentially disposed on the surface of the circuit board, and the shielding layer is removed to connect the primer layer and the metal layer above it. And the protective layer is removed to form a brightness enhancement film.

In order to achieve the above objects and effects, the technical means and the configuration of the present invention will be described in detail with reference to the preferred embodiments of the present invention.

Please refer to the first, second, third, fourth, fifth and sixth figures for the processing flow chart of the brightness enhancement film according to the preferred embodiment of the present invention, and the side view of the circuit board with the shielding layer attached thereto. A cross-sectional view of the cross-sectional view, the shielding layer attached to the circuit board, and a side cross-sectional view, a stereoscopic appearance view, an exploded perspective view, and a light-increasing film reflecting light source, which are clearly visible in the figure, are installed The processing method for forming the brightness enhancement film 23 after the plurality of LEDs 22 are mounted on the circuit board 21 of the circuit module 2 on the lamp holder 1 includes the following steps:

(600) The surface of the circuit board 21 and the plurality of light-emitting diodes 22 are cleaned.

(601) A shielding layer 4 is attached to the surface of each of the pads 211 of the plurality of light-emitting diodes 22 and the circuit board 21 therearound.

(602) The circuit board 21 is mounted on the jig 5.

(603) Perform surface dust removal treatment.

(604) The surface of the circuit board 21 is sprayed to form a primer layer 231.

(605) The surface of the primer layer 231 is plated to form a metal layer 232.

(606) The metal layer 232 is sprayed on the surface to form a protective layer 233.

(607) The circuit board 21 is detached from the jig 5, and after the removal of the shielding layer 4, the upper primer layer 231, the metal layer 232, and the protective layer 233 are removed, and then cleaned.

(608) Packaging.

It can be seen from the above process that after the plurality of LEDs 22 are mounted on the circuit board 21 of the circuit module 2, the brightness enhancement film 23 can be formed on the circuit board 21 outside the plurality of LEDs 22, and the system is transparent. After the surface is cleaned, the shielding layer 4 is attached, and the surface is dust-removed after being installed in the jig 5, the metal layer 232 can be sprayed through the primer layer 231, vacuum evaporation or vacuum sputtering. And the step of spraying the protective layer 233 to form the brightness enhancement film 23, wherein the primer layer 24 is made of 20-40% polymer (Polymer), 10-20% poly Hexamethylene Diisocyanate, 10 ~20% propylene glycol methyl ether acetate (Propylene

Glycol Monomethyl Ether Acetate), 15~25% Propylene Glycol Monomethyl Ether, 10~20% Ethoxyethanol Acetate and 5~10% Solvent (Solvent) The layer 25 can be made of aluminum or silver. The protective layer 26 is made of a paint material and has a hardness greater than the primer layer 24. The protective layer 26 is a barrier metal layer 25, which not only prevents external air contact. The metal layer 25 is oxidized to achieve antistatic, acid and alkali resistance, friction resistance, scratch resistance, etc., and the circuit board 21 can be packaged after being detached from the jig, thus completing the processing flow of the present invention.

The surface of the circuit board 21 and the plurality of LEDs 22 can be cleaned by compressed air or pure water to remove dust and particles on the surface of the circuit board 21 and the plurality of LEDs 22, and the dust is removed. The treatment and cleaning can blow off the dust or particles on the surface of the circuit board 21 or the surface of the brightness enhancement film 23 through the compressed air and the discharge method, and then attach the shielding layer 4 and spray to form the bottom. When the paint layer 231 and the package are packaged, dust or particles can be prevented from affecting the treatment effect, and the finished product after packaging is also clean and non-destructive, and the package is covered with the plastic sheet body or the plastic bag body on the outside of the finished product, which can be a general package. Covering or vacuum coating, mainly using plastic sheet or plastic bag to isolate the air, to avoid dust and particles adhering to the surface of the finished product after cleaning, and to avoid damage to the brightness enhancement film 23 due to collision with the finished surface during handling and storage. In turn, the product's appearance and yield can be improved.

Please refer to the fourth, fifth and sixth figures, which are side perspective views of the stereoscopic appearance, the exploded view, and the brightness enhancement film reflecting light source of the present invention. It can be clearly seen from the figure that the present invention can be used not only for the present invention. The light-emitting diode lamp of the lamp type can also be used for the light-emitting diode lamp of the bulb type. The following is only an example of the light-emitting diode lamp of the lamp type, and the light-emitting diode lamp includes the lamp holder 1 , the circuit module 2 and the lampshade 3 are composed of:

The socket 1 is made of a metal material, and the socket 1 is recessed with a receiving groove 112 at the center of the upper surface 111 of the elongated base 11. The base 11 above the two sides of the receiving slot 112 is facing toward the center. The finite block 113 is extended in parallel, and extends upwards and then extends to the opposite outer side to extend a hook 114. The two ends of the base 11 are respectively recessed with two grooves 115 for the pins 12 to be inserted.

The circuit module 2 has a circuit board 21 that is placed in the receiving slot 112 of the socket 1 and has a stop on the two side surface limiting blocks 113. The upper surface of the circuit board 21 is electrically connected to the plurality of LEDs 22 The upper surface of the circuit board 21 outside the plurality of LEDs 22 is provided with a brightness enhancement film 23.

The lamp cover 3 is disposed on the upper surface 111 of the base 11 of the socket base 1 and has a receiving groove 112. The two ends of the lamp cover 3 respectively extend toward the opposite inner side and have a flange 31 which is fastened to the socket 114 of the socket 1. And the lampshade 3 is made of a material that is transparent or semi-transparent.

The lamp holder 1 can only have the functions of accommodating the circuit module 2 and the lamp cover 3, and the plurality of heat dissipation fins can be formed on the side away from the circuit module 2, and the material can be aluminum or aluminum alloy. Metallic materials such as magnesium-aluminum alloys, etc., are not intended to limit the scope of the invention, and other modifications and equivalent structural changes are included in the scope of the patent of the present invention.

Please refer to the fourth, fifth and sixth figures, which are side perspective views of the three-dimensional appearance, the three-dimensional exploded view and the light-increasing film reflecting light source of the present invention. It can be clearly seen from the figure that the light-emitting diode 22 The illumination angle is about 120°, and the light transmittance of the lampshade 3 is 70%, and the reflectivity is 30%. Therefore, generally only 70% of the light source can be emitted outward through the lampshade 3, but the present invention transmits the plurality of light-emitting diodes. The brightness enhancement film 23 around the body 22 can reflect the 30% light source reflected by the lamp cover 3 again. For example, the metal layer 232 is made of silver material having a reflectance of 98%, and 60% of the 30% light source is irradiated to the metal layer 232. Calculated by formula: 30% x (1-(60%/98%)) = 11.7%

11.7%x70%=8.19%

70%+8.19%=78.19%, so that the light-increasing film 23 can make 11.7% of the light be irradiated to the lampshade 3 again. The light source that is emitted outward through the lampshade 3 can be 8.19%, so that 78.19% of the light source can be irradiated outward through the lampshade 3, and further, since the light source of the brightness enhancement film 23 is reflected to the lampshade 3, the light source is reflected again. The light-increasing film 23 can reflect the light source a second time. In this way, the light source can be reflected multiple times. Therefore, in actual use, the light source emitted by the light-emitting diode 22 can pass more than 78.19%. The globe 3 illuminates the outside.

For example, if the metal layer 232 is made of aluminum having a reflectance of 85%, and 60% of the 30% of the light source is irradiated to the metal layer 232, it is calculated by the formula: 30% x (1-(60%/85%))= 9%

9%x70%=6.3%

70%+6.3%=76.3% Therefore, in actual use, the light source emitted by the light-emitting diode 22 may have more than 78.19% of the light passing through the lampshade 3 to illuminate the outside.

In summary, the simple processing of the surface of the circuit board 21 to form the brightness enhancement film 23 can improve the illumination rate of the light source and increase the brightness of the light source, thereby reducing the number of LEDs 22 installed in the lamp. And the power required for the lamps will also be reduced, thereby achieving the effect of environmental protection and energy saving.

Please refer to the fourth, fifth, sixth and seventh figures, which are a side view of the present invention, a perspective exploded view, a side view of the light-increasing film reflecting light source, and a processing flow chart of another embodiment of the brightness-increasing film. As can be clearly seen in the figure, it is mounted on the circuit board 21 of the circuit module 2 on the lamp holder 1, and is provided with a plurality of light-emitting diodes. A processing method for forming the brightness enhancement film 23 before the polar body 22, the processing steps of which include:

(700) The surface of the circuit board 21 is cleaned.

(701) The shielding layer 4 is attached to the surface of each of the plurality of soldering points 211 on the circuit board 21 at a predetermined mounting position and around the solder joints 211.

(702) The circuit board 21 is mounted on the jig 5.

(703) Perform surface dust removal treatment.

(704) The surface of the circuit board 21 is sprayed to form a primer layer 231.

(705) The surface of the primer layer 231 is plated to form a metal layer 232.

(706) The metal layer 232 is surface-sprayed to form a protective layer 233.

(707) The circuit board 21 is detached from the jig 5, and after the removal of the shielding layer 4, the upper primer layer 231, the metal layer 232, and the protective layer 233 are removed, and then cleaned.

(708) Packaging.

Since the surface of the circuit board 21 can be formed with the light-increasing film 23 after the plurality of light-emitting diodes 22 are mounted, the order of the process can be changed according to the setting of the production line, the processing difficulty or the transportation cost, and the circuit board 21 is also changed. The light-increasing film 23 may be formed first, and then the plurality of light-emitting diodes 22 may be mounted.

Therefore, the present invention is mainly directed to a light-emitting diode lamp and a circuit board processing method thereof, and the circuit board 21 of the circuit module 2 can be mounted on the lamp holder 1 , and the circuit board 21 is electrically connected with a plurality of light-emitting diodes The upper body 22 and the upper surface of the circuit board 21 outside the plurality of LEDs 22 are provided to be opposite to the lamp cover 3 The brightness enhancement film 23 is further reflected outward by the light source, and the brightness enhancement film 23 is a process of cleaning the transmission surface, attaching the shielding layer 4, mounting the fixture 5, dusting, forming the primer layer 231, the metal layer 232, and the protective layer 233. After the light source of the plurality of light-emitting diodes 22 is reflected by the lamp cover 3, the light-receiving film 23 can be again reflected toward the lamp cover 3 to increase the light source of the plurality of light-emitting diodes 22 passing through the lamp cover 3, thereby achieving the improvement of brightness. The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the invention, so that the simple modifications and equivalent structural changes of the present specification and drawings are used. It should be included in the scope of the patent of the present invention and be combined with Chen Ming.

In summary, the above-described light-emitting diode lamp and its circuit board processing method of the present invention can achieve its efficacy and purpose during implementation and operation, so the invention is an invention with excellent practicability, in accordance with the invention. The application requirements of the patent, 提出 apply in accordance with the law, and hope that the trial committee will grant the case as soon as possible to protect the hard work of the inventor. If there is any doubt in the audit committee, please do not hesitate to give instructions, the inventor will try his best to cooperate. Debian.

1‧‧‧ lamp holder

11‧‧‧

111‧‧‧Upper surface

112‧‧‧ accommodating slots

113‧‧‧Limited blocks

114‧‧‧ hook

115‧‧‧ Groove

12‧‧‧ pins

2‧‧‧ circuit module

21‧‧‧ boards

211‧‧‧ solder joints

22‧‧‧Lighting diode

231‧‧‧primer layer

232‧‧‧metal layer

233‧‧‧Protective layer

23‧‧‧Enhanced film

3‧‧‧shade

31‧‧‧Flange

4‧‧‧Shielding layer

5‧‧‧ fixture

The first figure is a processing flow chart of the brightness enhancement film of the preferred embodiment of the present invention.

The second figure is a side cross-sectional view of the circuit board to which the shielding layer of the present invention is attached.

The third figure is a side cross-sectional view of the circuit board to which the shielding layer is attached and the brightness enhancement film is formed.

The fourth figure is a three-dimensional appearance of the present invention.

The fifth figure is a perspective exploded view of the present invention.

Figure 6 is a side cross-sectional view showing the light-increasing film reflecting light source of the present invention.

Figure 7 is a flow chart showing the processing of a brightness enhancement film according to another embodiment of the present invention.

The eighth figure is a side view of the conventional view.

Claims (10)

A circuit board processing method for a light-emitting diode lamp, in particular, a circuit board mounted on a circuit module of a lamp holder, and a processing method for forming a brightness enhancement film after installing a plurality of light-emitting diodes, the processing steps thereof include: (A01 The surface of the circuit board and the plurality of light-emitting diodes are cleaned; (A02) a shielding layer is attached to the surface of each of the plurality of light-emitting diodes and the periphery of the circuit board; (A03) the circuit board is installed in the treatment (A04) surface dust removal treatment; (A05) the surface of the circuit board is sprayed to form a primer layer, the primer layer is 20-40% polymer, 10-20% polyisocyanate cyclohexane , 10~20% propylene glycol methyl ether acetate, 15~25% propylene glycol methyl ether, 10~20% ethylene glycol ethyl ether acetate and 5~10% solvent; (A06) the surface of the primer layer is plated Forming a metal layer; (A07) spraying the surface of the metal layer to form a protective layer; (A08) the circuit board is detached from the fixture, and after removing the shielding layer to remove the primer layer, the metal layer and the protective layer, Clean; (A09) package. The method for processing a circuit board of a light-emitting diode lamp according to claim 1, wherein the metal layer is made of aluminum or silver. The method for processing a circuit board of a light-emitting diode lamp according to claim 1, wherein the protective layer is made of a paint material and has a hardness greater than the primer layer. The method for processing a circuit board of a light-emitting diode lamp according to claim 1, wherein the circuit board is detachable from the fixture and cleaned for packaging. The method for processing a circuit board of a light-emitting diode lamp according to the first aspect of the invention, wherein the step (A01) circuit board and the surface of the plurality of light-emitting diodes are cleaned by a compressed air blowing or a pure water washing method. The surface dust removal treatment of step (A04) and the cleaning of (A08) are compressed air and sprayed. A circuit board processing method for a light-emitting diode lamp, in particular, a circuit board mounted on a circuit module of a lamp holder, and a processing method for forming a brightness enhancement film before installing a plurality of light-emitting diodes, the processing steps thereof include: (B01 (B02) cleaning the surface of the plurality of light-emitting diodes on the circuit board and attaching the shielding layer to the surface of each solder joint; (B03) the circuit board is mounted on the fixture; (B04) Surface dust removal treatment; (B05) The surface of the circuit board is sprayed to form a primer layer. The primer layer is made of 20-40% polymer, 10-20% polyisocyanate cyclohexane, 10-20% propylene glycol methyl ether. Acetate, 15 ~25% propylene glycol methyl ether, 10~20% ethylene glycol ethyl ether acetate and 5~10% solvent; (B06) the surface of the primer layer is plated to form a metal layer; (B07) the surface of the metal layer is sprayed to form protection (B08) The circuit board is detached from the fixture, and after removing the shielding layer, the primer layer, the metal layer and the protective layer are removed, and then cleaned; (B09) packaging. The method for processing a circuit board of a light-emitting diode lamp according to claim 1, wherein the metal layer is made of aluminum or silver. The method for processing a circuit board of a light-emitting diode lamp according to claim 1, wherein the protective layer is made of a paint material and has a hardness greater than the primer layer. The method for processing a circuit board of a light-emitting diode lamp according to claim 1, wherein the circuit board is detachable from the fixture and cleaned for packaging. The method for processing a circuit board of a light-emitting diode lamp according to the first aspect of the invention, wherein the step (B01) of the circuit board surface cleaning may be a compressed air blowing or a pure water washing method, and the surface of the step (B04) For dust removal treatment and (B08) cleaning, it is compressed air and sprayed.