TW201408926A - LED lamp and processing method of circuit board thereof - Google Patents

LED lamp and processing method of circuit board thereof Download PDF

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TW201408926A
TW201408926A TW101130831A TW101130831A TW201408926A TW 201408926 A TW201408926 A TW 201408926A TW 101130831 A TW101130831 A TW 101130831A TW 101130831 A TW101130831 A TW 101130831A TW 201408926 A TW201408926 A TW 201408926A
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circuit board
light
layer
processing
emitting diode
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TW101130831A
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TWI498503B (en
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Ke-Long Shen
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Lsq Green Energy Co Ltd
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Abstract

The present invention relates to an LED lamp and a processing method of a circuit board thereof which arranges the circuit board of a circuit module on a lamp base, and a plurality of LEDs are electrically connected to the circuit board. Brightness enhancement films are mounted on the plurality of LEDs and an upper surface of the circuit board outside soldering points. The brightness enhancement films are formed by surface washing, adhering a shading layer and mounting it on a jigs, and forming a primer layer by dust removing and spray-coating, coating to form a metal layer plating, spray-coating to form a protection layer, and removing jig and proceeding the cleaning procedure. The primer layer is made by a predetermined ratio of polymer, polycyclohexane diisocyanate, propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether, ethylene glycol monoethyl ether acetate and a solvent. The light source emitted by the plurality of LEDs to the outside through the lamp shade can be enhanced by the brightness enhancement films from the light source reflected by the lamp shade to the lamp shade in addition to the light source emitting directly through the lamp shade to achieve the purpose of brightness enhancement.

Description

發光二極體燈具及其電路板加工方法 Light-emitting diode lamp and circuit board processing method thereof

本發明係提供一種發光二極體燈具及其電路板加工方法,尤指燈座上電路模組之電路板於複數發光二極體外部之上表面設有增光膜,讓燈罩反射之光源透過增光膜反射,再次朝燈罩照射,來增加複數發光二極體穿過燈罩照射至外部之光源亮度。 The invention provides a light-emitting diode lamp and a circuit board processing method thereof, in particular, a circuit board of a circuit module on a lamp socket is provided with a brightness enhancement film on the outer surface of the plurality of light-emitting diodes, so that the light source reflected by the lamp cover is filtered. The film is reflected and irradiated again to the lamp cover to increase the brightness of the light source that the plurality of light-emitting diodes are irradiated to the outside through the lamp cover.

按,照明設備可說是徹底地改變了全世界的生活方式,倘若我們生活當中沒有照明燈具,不論是在夜晚或天氣狀況不佳時,一切工作都將停擺,且若受限於照明,極有可能使房屋建築或生活的方式都將徹底改變,全人類也因此而無法進步外,仍繼續停留在較落後的年代。 According to the lighting equipment, it can be said that it has completely changed the way of life around the world. If there is no lighting in our life, whether it is at night or when the weather is not good, everything will stop, and if it is limited by lighting, It is possible that the way of building or living a house will be completely changed, and all human beings will not be able to make progress, and they will continue to stay in a relatively backward era.

而現今市面上所使用之照明設備,舉如日光燈、鎢絲燈甚至到現在廣為大眾所接受之省電燈泡等,皆已普遍應用於日常生活中,一般對照明的要求是確保照明設備安全運行,以防止人身或火災事故發生,並提高照明品質、節省用電,然而,就以螢光燈(即日光燈)而言,其發光原理係為利用電流通過二端電極後所產生之放射電子與燈管內之水銀原子相衝擊而激發出紫外光,此一紫外光再激發燈管壁上之螢光物質產生有可視光。 The lighting equipment used in the market today, such as fluorescent lamps, tungsten lamps and even the energy-saving bulbs widely accepted by the public, have been widely used in daily life. Generally, the requirement for lighting is to ensure the safe operation of lighting equipment. In order to prevent personal or fire accidents, and to improve the quality of lighting and save electricity, however, in the case of fluorescent lamps (ie fluorescent lamps), the principle of illumination is the use of radioactive electrons generated by the passage of current through the two-terminal electrodes. The mercury atom in the tube is impacted to excite ultraviolet light, which in turn excites the fluorescent material on the wall of the tube to produce visible light.

此外,隨著發光二極體的技術成熟及白光二極體的問世 ,便有許多廠商針對發光二極體的運用進行研發,藉此將發光二極體運用在一般照明上,然而發光二極體燈具在使用上需具有電路板以供發光二極體電性連接,一般發光二極體燈具之結構請參閱第八圖所示,其係於電路板A上裝設複數發光二極體A1,電路板A另側為裝設散熱元件A2,再於外部罩設有燈罩B,由於複數發光二極體A1所發射之光源需穿過燈罩B才可照射至外部,但一般燈罩B僅可讓70%光源穿過至外部,而剩餘之30%光源則被燈罩B反射而照射到電路板A上。 In addition, with the maturity of the light-emitting diodes and the advent of white light diodes Many manufacturers have developed R&D for the use of light-emitting diodes, so that the LEDs can be used for general illumination. However, the LEDs need to have a circuit board for the electrical connection of the LEDs. For the structure of the general light-emitting diode lamp, please refer to the eighth figure, which is provided with a plurality of light-emitting diodes A1 on the circuit board A, and the heat-dissipating component A2 on the other side of the circuit board A, and then the external cover There is a lampshade B. Since the light source emitted by the plurality of LEDs A1 needs to pass through the lampshade B to be irradiated to the outside, generally the lampshade B can only pass 70% of the light source to the outside, and the remaining 30% of the light source is covered by the lampshade. B reflects and illuminates the circuit board A.

由於發光二極體燈具在實際使用上,其亮度不足係為一極需解決之問題,但在許多發光二極體製造之技術都需要解決,才可讓發光二極體A1所發射光源之亮度提高,且技術面之問題解決了之後,其成本也是能不能夠量產之關鍵,是以,上述習用之發光二極體燈具,因具有諸多問題與缺失,此即為本發明人與從事此行業者所亟欲改善之目標所在。 Due to the practical use of the light-emitting diode lamp, the lack of brightness is a problem that needs to be solved. However, in many technologies for manufacturing the light-emitting diode, the brightness of the light source emitted by the light-emitting diode A1 can be made. After the improvement, and the technical problems are solved, the cost is also the key to the mass production. Therefore, the above-mentioned light-emitting diode lamps have many problems and defects, which is the inventor and engaged in this. The goal of the industry is to improve.

故,發明人有鑑於上述缺失,乃蒐集相關資料,經由多方評估及考量,並以從事於此行業累積之多年經驗,經由不斷試作及修改,始設計出此種可提昇照射亮度發光二極體燈具及其電路板加工方法的發明專利者。 Therefore, in view of the above-mentioned shortcomings, the inventors have collected relevant information, and through multi-party evaluation and consideration, and through years of experience in the industry, through continuous trial and modification, this design can be used to improve the illumination brightness LED. Inventor of the luminaire and its circuit board processing method.

本發明之主要目的乃在於,燈座上裝設有電路模組之電路板,電路板上為電性連接有複數發光二極體,且複數發光 二極體及其外部之電路板上表面為依序透過表面清洗、貼附遮蔽層、裝設於治具、除塵、噴塗形成底漆層、鍍設形成金屬層、噴塗形成保護層、拆離治具並進行清潔等程序形成有增光膜,底漆層為利用預定比例的聚合物、聚二異氰酸鹽環己烷、丙二醇甲醚醋酸酯、丙二醇甲醚、乙二醇乙醚醋酸酯及溶劑所調製而成,藉此讓複數發光二極體所發射且受燈罩反射之光源,在照射於增光膜後可再次反射至燈罩,以增加複數發光二極體所發射光源穿過燈罩之比例,便可減少燈具中發光二極體之裝設數量,且燈具所需耗費的電力也會隨之減少,進而達到提昇亮度、環保節能之目的。 The main purpose of the present invention is to provide a circuit board with a circuit module on the lamp holder, and the circuit board is electrically connected with a plurality of light-emitting diodes, and the plurality of light-emitting diodes The surface of the diode and its external circuit board is sequentially cleaned through the surface, attached to the shielding layer, installed in the fixture, dusted, sprayed to form a primer layer, plated to form a metal layer, sprayed to form a protective layer, and detached The fixture is cleaned and the like is formed with a brightness enhancement film, and the primer layer is a polymer in a predetermined ratio, polydiisocyanate cyclohexane, propylene glycol methyl ether acetate, propylene glycol methyl ether, ethylene glycol ethyl ether acetate, and The solvent is modulated, so that the light source emitted by the plurality of light-emitting diodes and reflected by the lamp cover can be reflected again to the lamp cover after being irradiated to the brightness-increasing film, so as to increase the proportion of the light source emitted by the plurality of light-emitting diodes passing through the lamp cover. The number of LEDs in the luminaire can be reduced, and the power required for the luminaires can be reduced, thereby achieving the purpose of improving brightness, environmental protection and energy saving.

本發明之次要目的乃在於,電路板於裝設複數發光二極體之前,透過表面清洗,並於電路板上複數發光二極體預定裝設位置及其周圍各焊點表面貼附遮蔽層,且將電路板裝設於治具之後先進行表面除塵處理,再於電路板表面依序設有底漆層、金屬層及保護層,並去除遮蔽層來連帶其上方底漆層、金屬層及保護層去除,便可形成增光膜。 The secondary object of the present invention is that the circuit board is cleaned through the surface before the installation of the plurality of light-emitting diodes, and the shielding layer is attached to the surface of each of the plurality of light-emitting diodes on the circuit board. And after the circuit board is installed in the fixture, the surface is dust-removed, and then the primer layer, the metal layer and the protective layer are sequentially disposed on the surface of the circuit board, and the shielding layer is removed to connect the primer layer and the metal layer above it. And the protective layer is removed to form a brightness enhancement film.

為達成上述目的及功效,本發明所採用之技術手段及其構造,茲繪圖就本發明之較佳實施例詳加說明其特徵與功能如下,俾利完全瞭解。 In order to achieve the above objects and effects, the technical means and the configuration of the present invention will be described in detail with reference to the preferred embodiments of the present invention.

請參閱第一、二、三、四、五、六圖所示,係為本發明較佳實施例增光膜之加工流程圖、電路板貼附遮蔽層之側視 剖面圖、電路板貼附遮蔽層及形成增光膜之側視剖面圖、立體外觀圖、立體分解圖、增光膜反射光源時之側視剖面圖,由圖中可以清楚看出,其係裝設於燈座1上電路模組2之電路板21,於裝設複數發光二極體22後形成增光膜23之加工方法,其加工步驟包括: Please refer to the first, second, third, fourth, fifth and sixth figures for the processing flow chart of the brightness enhancement film according to the preferred embodiment of the present invention, and the side view of the circuit board with the shielding layer attached thereto. A cross-sectional view of the cross-sectional view, the shielding layer attached to the circuit board, and a side cross-sectional view, a stereoscopic appearance view, an exploded perspective view, and a light-increasing film reflecting light source, which are clearly visible in the figure, are installed The processing method for forming the brightness enhancement film 23 after the plurality of LEDs 22 are mounted on the circuit board 21 of the circuit module 2 on the lamp holder 1 includes the following steps:

(600)電路板21及複數發光二極體22表面清洗。 (600) The surface of the circuit board 21 and the plurality of light-emitting diodes 22 are cleaned.

(601)於複數發光二極體22及其周圍之電路板21各焊點211表面貼附遮蔽層4。 (601) A shielding layer 4 is attached to the surface of each of the pads 211 of the plurality of light-emitting diodes 22 and the circuit board 21 therearound.

(602)電路板21裝設於治具5上。 (602) The circuit board 21 is mounted on the jig 5.

(603)進行表面除塵處理。 (603) Perform surface dust removal treatment.

(604)電路板21表面噴塗形成底漆層231。 (604) The surface of the circuit board 21 is sprayed to form a primer layer 231.

(605)底漆層231表面鍍設形成金屬層232。 (605) The surface of the primer layer 231 is plated to form a metal layer 232.

(606)金屬層232表面噴塗形成保護層233。 (606) The metal layer 232 is sprayed on the surface to form a protective layer 233.

(607)電路板21拆離治具5,並於去除遮蔽層4來連帶其上方底漆層231、金屬層232及保護層233去除後,再進行清潔。 (607) The circuit board 21 is detached from the jig 5, and after the removal of the shielding layer 4, the upper primer layer 231, the metal layer 232, and the protective layer 233 are removed, and then cleaned.

(608)包裝。 (608) Packaging.

由上述流程可得知,電路模組2之電路板21上於裝設複數發光二極體22後,可在複數發光二極體22外部之電路板21上加工形成增光膜23,其係透過表面清洗、貼附遮蔽層4及裝設於治具5後再進行表面除塵處理,之後便可透過噴塗底漆層231、真空蒸鍍或真空濺鍍金屬層232 及噴塗保護層233之步驟形成增光膜23,其底漆層24為利用20~40%聚合物(Polymer)、10~20%之聚二異氰酸鹽環己烷(Poly Hexamethylene Diisocyanate)、10~20%丙二醇甲醚醋酸酯(Propylene It can be seen from the above process that after the plurality of LEDs 22 are mounted on the circuit board 21 of the circuit module 2, the brightness enhancement film 23 can be formed on the circuit board 21 outside the plurality of LEDs 22, and the system is transparent. After the surface is cleaned, the shielding layer 4 is attached, and the surface is dust-removed after being installed in the jig 5, the metal layer 232 can be sprayed through the primer layer 231, vacuum evaporation or vacuum sputtering. And the step of spraying the protective layer 233 to form the brightness enhancement film 23, wherein the primer layer 24 is made of 20-40% polymer (Polymer), 10-20% poly Hexamethylene Diisocyanate, 10 ~20% propylene glycol methyl ether acetate (Propylene

Glycol Monomethyl Ether Acetate)、15~25%丙二醇甲醚(Propylene Glycol Monomethyl Ether)、10~20%乙二醇乙醚醋酸酯(Ethoxyethanol Acetate)及5~10%溶劑(Solvent)所調製而成,該金屬層25可為鋁或銀材質所製成,該保護層26則為利用漆材所製成,且其硬度為大於底漆層24,保護層26為隔離金屬層25,不僅可防止外部空氣接觸金屬層25使其氧化,更可達到防靜電、抗酸鹼及耐摩擦、刮傷等特性,電路板21拆離治具後便可進行包裝,如此即完成本發明之加工流程。 Glycol Monomethyl Ether Acetate), 15~25% Propylene Glycol Monomethyl Ether, 10~20% Ethoxyethanol Acetate and 5~10% Solvent (Solvent) The layer 25 can be made of aluminum or silver. The protective layer 26 is made of a paint material and has a hardness greater than the primer layer 24. The protective layer 26 is a barrier metal layer 25, which not only prevents external air contact. The metal layer 25 is oxidized to achieve antistatic, acid and alkali resistance, friction resistance, scratch resistance, etc., and the circuit board 21 can be packaged after being detached from the jig, thus completing the processing flow of the present invention.

上述之電路板21及複數發光二極體22表面清洗,可為壓縮空氣噴吹或純水沖洗等方式,讓電路板21及複數發光二極體22表面之灰塵、微粒可去除,而該除塵處理及清潔可透過壓縮空氣並噴出方式,將電路板21表面或增光膜23表面之灰塵、微粒吹離,則貼附遮蔽層4、噴塗形成底 漆層231及包裝時,便可避免灰塵或微粒影響處理效果,且包裝後之成品也會是乾淨無損的,包裝為利用塑膠片體或塑膠袋體包覆於成品外部,其可為一般包覆或真空包覆,主要是利用塑膠片體或塑膠袋體來隔離空氣,避免清理後之成品表面再次附著灰塵、微粒,又可避免在搬運、存放時因碰撞成品表面而損傷增光膜23,進而可提昇產品之品相及良率。 The surface of the circuit board 21 and the plurality of LEDs 22 can be cleaned by compressed air or pure water to remove dust and particles on the surface of the circuit board 21 and the plurality of LEDs 22, and the dust is removed. The treatment and cleaning can blow off the dust or particles on the surface of the circuit board 21 or the surface of the brightness enhancement film 23 through the compressed air and the discharge method, and then attach the shielding layer 4 and spray to form the bottom. When the paint layer 231 and the package are packaged, dust or particles can be prevented from affecting the treatment effect, and the finished product after packaging is also clean and non-destructive, and the package is covered with the plastic sheet body or the plastic bag body on the outside of the finished product, which can be a general package. Covering or vacuum coating, mainly using plastic sheet or plastic bag to isolate the air, to avoid dust and particles adhering to the surface of the finished product after cleaning, and to avoid damage to the brightness enhancement film 23 due to collision with the finished surface during handling and storage. In turn, the product's appearance and yield can be improved.

請參閱第四、五、六圖所示,係為本發明之立體外觀圖、立體分解圖、增光膜反射光源時之側視剖面圖,由圖中可以清楚看出,本發明不僅可使用於燈管型式之發光二極體燈具,亦可使用於燈泡型式之發光二極體燈具,以下僅以燈管型式之發光二極體燈具舉例進行說明,其發光二極體燈具為包括燈座1、電路模組2及燈罩3所組成,其中: Please refer to the fourth, fifth and sixth figures, which are side perspective views of the stereoscopic appearance, the exploded view, and the brightness enhancement film reflecting light source of the present invention. It can be clearly seen from the figure that the present invention can be used not only for the present invention. The light-emitting diode lamp of the lamp type can also be used for the light-emitting diode lamp of the bulb type. The following is only an example of the light-emitting diode lamp of the lamp type, and the light-emitting diode lamp includes the lamp holder 1 , the circuit module 2 and the lampshade 3 are composed of:

該燈座1為利用金屬材質製成,且燈座1於長形座體11之上表面111中央處凹設有容置槽112,容置槽112二側邊上方之座體11為朝中央處平行延伸有限位塊113,且朝上延伸後再朝相對外側彎折延伸有卡勾114,座體11二端並分別凹設有供接腳12插固之二凹槽115。 The socket 1 is made of a metal material, and the socket 1 is recessed with a receiving groove 112 at the center of the upper surface 111 of the elongated base 11. The base 11 above the two sides of the receiving slot 112 is facing toward the center. The finite block 113 is extended in parallel, and extends upwards and then extends to the opposite outer side to extend a hook 114. The two ends of the base 11 are respectively recessed with two grooves 115 for the pins 12 to be inserted.

該電路模組2為具有置入燈座1容置槽112中且二側表面受限位塊113止擋之電路板21,且於電路板21上表面電性連接有複數發光二極體22,且複數發光二極體22外部之電路板21上表面為設有增光膜23。 The circuit module 2 has a circuit board 21 that is placed in the receiving slot 112 of the socket 1 and has a stop on the two side surface limiting blocks 113. The upper surface of the circuit board 21 is electrically connected to the plurality of LEDs 22 The upper surface of the circuit board 21 outside the plurality of LEDs 22 is provided with a brightness enhancement film 23.

該燈罩3為裝設於燈座1座體11上表面111具容置槽112一側,且燈罩3二端為分別朝相對內側延伸有卡固於燈座1卡勾114之凸緣31,且燈罩3為利用透光或半透光之材質所製成。 The lamp cover 3 is disposed on the upper surface 111 of the base 11 of the socket base 1 and has a receiving groove 112. The two ends of the lamp cover 3 respectively extend toward the opposite inner side and have a flange 31 which is fastened to the socket 114 of the socket 1. And the lampshade 3 is made of a material that is transparent or semi-transparent.

上述之燈座1,其僅具收納電路模組2及裝設燈罩3之功能即可,其遠離電路模組2一側亦可成形有複數散熱鰭片,且材質可為鋁、鋁合金、鎂鋁合金等金屬材質所製成,非因此即侷限本發明之專利範圍,如利用其他修飾及等效結構變化,均應同理包含於本發明之專利範圍內,合予陳明。 The lamp holder 1 can only have the functions of accommodating the circuit module 2 and the lamp cover 3, and the plurality of heat dissipation fins can be formed on the side away from the circuit module 2, and the material can be aluminum or aluminum alloy. Metallic materials such as magnesium-aluminum alloys, etc., are not intended to limit the scope of the invention, and other modifications and equivalent structural changes are included in the scope of the patent of the present invention.

請參閱第四、五、六圖所示,係為本發明之立體外觀圖、立體分解圖、增光膜反射光源時之側視剖面圖,由圖中可以清楚看出,該發光二極體22之光照角度約為120°,且燈罩3之透光率為70%、反射率為30%,所以一般僅能有70%的光源穿過燈罩3朝外發射,但本發明透過複數發光二極體22周圍之增光膜23便可讓燈罩3反射之30%光源再次反射,如金屬層232使用反射率98%的銀材質製成,且30%光源中共有60%照射到金屬層232,則透過公式計算:30%x(1-(60%/98%))=11.7% Please refer to the fourth, fifth and sixth figures, which are side perspective views of the three-dimensional appearance, the three-dimensional exploded view and the light-increasing film reflecting light source of the present invention. It can be clearly seen from the figure that the light-emitting diode 22 The illumination angle is about 120°, and the light transmittance of the lampshade 3 is 70%, and the reflectivity is 30%. Therefore, generally only 70% of the light source can be emitted outward through the lampshade 3, but the present invention transmits the plurality of light-emitting diodes. The brightness enhancement film 23 around the body 22 can reflect the 30% light source reflected by the lamp cover 3 again. For example, the metal layer 232 is made of silver material having a reflectance of 98%, and 60% of the 30% light source is irradiated to the metal layer 232. Calculated by formula: 30% x (1-(60%/98%)) = 11.7%

11.7%x70%=8.19% 11.7%x70%=8.19%

70%+8.19%=78.19%所以利用增光膜23可讓11.7%的光再次照射到燈罩3 ,則穿過燈罩3朝外發射的該光源可為8.19%,便可讓78.19%的光源確實穿過燈罩3朝外照射,此外,因為增光膜23反射至燈罩3之光源又會被反射,且增光膜23又可對該光源作第二次的反射,透過此方式便可讓光源經過多次反射,所以,實際使用時其發光二極體22所發射之光源可有超過78.19%穿過燈罩3對外部進行照射。 70%+8.19%=78.19%, so that the light-increasing film 23 can make 11.7% of the light be irradiated to the lampshade 3 again. The light source that is emitted outward through the lampshade 3 can be 8.19%, so that 78.19% of the light source can be irradiated outward through the lampshade 3, and further, since the light source of the brightness enhancement film 23 is reflected to the lampshade 3, the light source is reflected again. The light-increasing film 23 can reflect the light source a second time. In this way, the light source can be reflected multiple times. Therefore, in actual use, the light source emitted by the light-emitting diode 22 can pass more than 78.19%. The globe 3 illuminates the outside.

而如金屬層232使用反射率85%的鋁材質製成,且30%光源中共有60%照射到金屬層232,則透過公式計算:30%x(1-(60%/85%))=9% For example, if the metal layer 232 is made of aluminum having a reflectance of 85%, and 60% of the 30% of the light source is irradiated to the metal layer 232, it is calculated by the formula: 30% x (1-(60%/85%))= 9%

9%x70%=6.3% 9%x70%=6.3%

70%+6.3%=76.3%所以,實際使用時其發光二極體22所發射之光源可有超過78.19%穿過燈罩3對外部進行照射。 70%+6.3%=76.3% Therefore, in actual use, the light source emitted by the light-emitting diode 22 may have more than 78.19% of the light passing through the lampshade 3 to illuminate the outside.

綜上所述,所以僅需對電路板21表面進行簡單加工形成增光膜23,便可提高光源的照射率,讓光源的亮度提昇,如此便可減少燈具中發光二極體22之裝設數量,且燈具所需耗費的電力也會隨之減少,進而達到環保節能之效果。 In summary, the simple processing of the surface of the circuit board 21 to form the brightness enhancement film 23 can improve the illumination rate of the light source and increase the brightness of the light source, thereby reducing the number of LEDs 22 installed in the lamp. And the power required for the lamps will also be reduced, thereby achieving the effect of environmental protection and energy saving.

請參閱第四、五、六、七圖所示,係為本發明之立體外觀圖、立體分解圖、增光膜反射光源時之側視剖面圖、另一實施例增光膜之加工流程圖,由圖中可以清楚看出,其係裝設於燈座1上電路模組2之電路板21,於裝設複數發光二 極體22之前形成增光膜23之加工方法,其加工步驟包括: Please refer to the fourth, fifth, sixth and seventh figures, which are a side view of the present invention, a perspective exploded view, a side view of the light-increasing film reflecting light source, and a processing flow chart of another embodiment of the brightness-increasing film. As can be clearly seen in the figure, it is mounted on the circuit board 21 of the circuit module 2 on the lamp holder 1, and is provided with a plurality of light-emitting diodes. A processing method for forming the brightness enhancement film 23 before the polar body 22, the processing steps of which include:

(700)電路板21表面清洗。 (700) The surface of the circuit board 21 is cleaned.

(701)於電路板21上複數發光二極體22預定裝設位置及其周圍各焊點211表面貼附遮蔽層4。 (701) The shielding layer 4 is attached to the surface of each of the plurality of soldering points 211 on the circuit board 21 at a predetermined mounting position and around the solder joints 211.

(702)電路板21裝設於治具5上。 (702) The circuit board 21 is mounted on the jig 5.

(703)進行表面除塵處理。 (703) Perform surface dust removal treatment.

(704)電路板21表面噴塗形成底漆層231。 (704) The surface of the circuit board 21 is sprayed to form a primer layer 231.

(705)底漆層231表面鍍設形成金屬層232。 (705) The surface of the primer layer 231 is plated to form a metal layer 232.

(706)金屬層232表面噴塗形成保護層233。 (706) The metal layer 232 is surface-sprayed to form a protective layer 233.

(707)電路板21拆離治具5,並於去除遮蔽層4來連帶其上方底漆層231、金屬層232及保護層233去除後,再進行清潔。 (707) The circuit board 21 is detached from the jig 5, and after the removal of the shielding layer 4, the upper primer layer 231, the metal layer 232, and the protective layer 233 are removed, and then cleaned.

(708)包裝。 (708) Packaging.

由於電路板21表面除了可於裝設複數發光二極體22後形成增光膜23,因為製程上的順序可隨著生產線的設置、加工難易度或搬運成本等考量而變更,所以電路板21亦可先形成增光膜23,而後再裝設複數發光二極體22。 Since the surface of the circuit board 21 can be formed with the light-increasing film 23 after the plurality of light-emitting diodes 22 are mounted, the order of the process can be changed according to the setting of the production line, the processing difficulty or the transportation cost, and the circuit board 21 is also changed. The light-increasing film 23 may be formed first, and then the plurality of light-emitting diodes 22 may be mounted.

故,本發明為主要針對發光二極體燈具及其電路板加工方法,而可於燈座1上裝設有電路模組2之電路板21,電路板21上為電性連接有複數發光二極體22,且複數發光二極體22外部之電路板21上表面為設有可對燈罩3所反 射光源再次朝外反射之增光膜23,其增光膜23為透過表面清洗、貼附遮蔽層4、裝設於治具5、除塵、形成底漆層231、金屬層232及保護層233等程序,讓複數發光二極體22發射光源被燈罩3反射後,可再透過增光膜23再次朝燈罩3反射,以增加複數發光二極體22穿過燈罩3之光源,藉此達到提昇亮度為主要保護重點,惟,以上所述僅為本發明之較佳實施例而已,非因此即侷限本發明之專利範圍,故舉凡運用本發明說明書及圖式內容所為之簡易修飾及等效結構變化,均應同理包含於本發明之專利範圍內,合予陳明。 Therefore, the present invention is mainly directed to a light-emitting diode lamp and a circuit board processing method thereof, and the circuit board 21 of the circuit module 2 can be mounted on the lamp holder 1 , and the circuit board 21 is electrically connected with a plurality of light-emitting diodes The upper body 22 and the upper surface of the circuit board 21 outside the plurality of LEDs 22 are provided to be opposite to the lamp cover 3 The brightness enhancement film 23 is further reflected outward by the light source, and the brightness enhancement film 23 is a process of cleaning the transmission surface, attaching the shielding layer 4, mounting the fixture 5, dusting, forming the primer layer 231, the metal layer 232, and the protective layer 233. After the light source of the plurality of light-emitting diodes 22 is reflected by the lamp cover 3, the light-receiving film 23 can be again reflected toward the lamp cover 3 to increase the light source of the plurality of light-emitting diodes 22 passing through the lamp cover 3, thereby achieving the improvement of brightness. The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the invention, so that the simple modifications and equivalent structural changes of the present specification and drawings are used. It should be included in the scope of the patent of the present invention and be combined with Chen Ming.

綜上所述,本發明上述之發光二極體燈具及其電路板加工方法於實施、操作時,為確實能達到其功效及目的,故本發明誠為一實用性優異之發明,為符合發明專利之申請要件,爰依法提出申請,盼 審委早日賜准本案,以保障發明人之辛苦研發,倘若 鈞局貴審委有任何稽疑,請不吝來函指示,發明人定當竭力配合,至感德便。 In summary, the above-described light-emitting diode lamp and its circuit board processing method of the present invention can achieve its efficacy and purpose during implementation and operation, so the invention is an invention with excellent practicability, in accordance with the invention. The application requirements of the patent, 提出 apply in accordance with the law, and hope that the trial committee will grant the case as soon as possible to protect the hard work of the inventor. If there is any doubt in the audit committee, please do not hesitate to give instructions, the inventor will try his best to cooperate. Debian.

1‧‧‧燈座 1‧‧‧ lamp holder

11‧‧‧座體 11‧‧‧

111‧‧‧上表面 111‧‧‧Upper surface

112‧‧‧容置槽 112‧‧‧ accommodating slots

113‧‧‧限位塊 113‧‧‧Limited blocks

114‧‧‧卡勾 114‧‧‧ hook

115‧‧‧凹槽 115‧‧‧ Groove

12‧‧‧接腳 12‧‧‧ pins

2‧‧‧電路模組 2‧‧‧ circuit module

21‧‧‧電路板 21‧‧‧ boards

211‧‧‧焊點 211‧‧‧ solder joints

22‧‧‧發光二極體 22‧‧‧Lighting diode

231‧‧‧底漆層 231‧‧‧primer layer

232‧‧‧金屬層 232‧‧‧metal layer

233‧‧‧保護層 233‧‧‧Protective layer

23‧‧‧增光膜 23‧‧‧Enhanced film

3‧‧‧燈罩 3‧‧‧shade

31‧‧‧凸緣 31‧‧‧Flange

4‧‧‧遮蔽層 4‧‧‧Shielding layer

5‧‧‧治具 5‧‧‧ fixture

第一圖 係為本發明較佳實施例增光膜之加工流程圖。 The first figure is a processing flow chart of the brightness enhancement film of the preferred embodiment of the present invention.

第二圖 係為本發明電路板貼附遮蔽層之側視剖面圖。 The second figure is a side cross-sectional view of the circuit board to which the shielding layer of the present invention is attached.

第三圖 係為本發明電路板貼附遮蔽層及形成增光膜之側視剖面圖。 The third figure is a side cross-sectional view of the circuit board to which the shielding layer is attached and the brightness enhancement film is formed.

第四圖 係為本發明之立體外觀圖。 The fourth figure is a three-dimensional appearance of the present invention.

第五圖 係為本發明之立體分解圖。 The fifth figure is a perspective exploded view of the present invention.

第六圖 係為本發明增光膜反射光源時之側視剖面圖。 Figure 6 is a side cross-sectional view showing the light-increasing film reflecting light source of the present invention.

第七圖 係為本發明另一實施例增光膜之加工流程圖。 Figure 7 is a flow chart showing the processing of a brightness enhancement film according to another embodiment of the present invention.

第八圖 係為習用之側視剖面圖。 The eighth figure is a side view of the conventional view.

Claims (10)

一種發光二極體燈具之電路板加工方法,尤指裝設於燈座上電路模組之電路板,於裝設複數發光二極體後形成增光膜之加工方法,其加工步驟包括:(A01)該電路板及該複數發光二極體表面清洗;(A02)於該複數發光二極體及其周圍之該電路板各焊點表面貼附遮蔽層;(A03)該電路板裝設於治具上;(A04)進行表面除塵處理;(A05)該電路板表面噴塗形成底漆層,底漆層為利用20~40%聚合物、10~20%之聚二異氰酸鹽環己烷、10~20%丙二醇甲醚醋酸酯、15~25%丙二醇甲醚、10~20%乙二醇乙醚醋酸酯及5~10%溶劑所調製而成;(A06)該底漆層表面鍍設形成金屬層;(A07)該金屬層表面噴塗形成保護層;(A08)該電路板拆離該治具,並於去除遮蔽層來連帶其上方底漆層、金屬層及保護層去除後,再進行清潔;(A09)包裝。 A circuit board processing method for a light-emitting diode lamp, in particular, a circuit board mounted on a circuit module of a lamp holder, and a processing method for forming a brightness enhancement film after installing a plurality of light-emitting diodes, the processing steps thereof include: (A01 The surface of the circuit board and the plurality of light-emitting diodes are cleaned; (A02) a shielding layer is attached to the surface of each of the plurality of light-emitting diodes and the periphery of the circuit board; (A03) the circuit board is installed in the treatment (A04) surface dust removal treatment; (A05) the surface of the circuit board is sprayed to form a primer layer, the primer layer is 20-40% polymer, 10-20% polyisocyanate cyclohexane , 10~20% propylene glycol methyl ether acetate, 15~25% propylene glycol methyl ether, 10~20% ethylene glycol ethyl ether acetate and 5~10% solvent; (A06) the surface of the primer layer is plated Forming a metal layer; (A07) spraying the surface of the metal layer to form a protective layer; (A08) the circuit board is detached from the fixture, and after removing the shielding layer to remove the primer layer, the metal layer and the protective layer, Clean; (A09) package. 如申請專利範圍第1項所述之發光二極體燈具之電路板加工方法,其中該金屬層可為鋁或銀材質所製成。 The method for processing a circuit board of a light-emitting diode lamp according to claim 1, wherein the metal layer is made of aluminum or silver. 如申請專利範圍第1項所述之發光二極體燈具之電路板加工方法,其中該保護層則為利用漆材所製成,且其硬度為大於該底漆層。 The method for processing a circuit board of a light-emitting diode lamp according to claim 1, wherein the protective layer is made of a paint material and has a hardness greater than the primer layer. 如申請專利範圍第1項所述之發光二極體燈具之電路板加工方法,其中該電路板拆離該治具並進行清潔後,為可進行包裝。 The method for processing a circuit board of a light-emitting diode lamp according to claim 1, wherein the circuit board is detachable from the fixture and cleaned for packaging. 如申請專利範圍第1項所述之發光二極體燈具之電路板加工方法,其中該步驟(A01)電路板及該複數發光二極體表面清洗,可為壓縮空氣噴吹或純水沖洗方式,步驟(A04)之表面除塵處理及(A08)之清潔,則為壓縮空氣並噴出方式。 The method for processing a circuit board of a light-emitting diode lamp according to the first aspect of the invention, wherein the step (A01) circuit board and the surface of the plurality of light-emitting diodes are cleaned by a compressed air blowing or a pure water washing method. The surface dust removal treatment of step (A04) and the cleaning of (A08) are compressed air and sprayed. 一種發光二極體燈具之電路板加工方法,尤指裝設於燈座上電路模組之電路板,於裝設複數發光二極體之前形成增光膜之加工方法,其加工步驟包括:(B01)電路板表面清洗;(B02)於電路板上複數發光二極體預定裝設位置及其周圍各焊點表面貼附遮蔽層;(B03)電路板裝設於治具上;(B04)進行表面除塵處理;(B05)電路板表面噴塗形成底漆層,底漆層為利用20~40%聚合物、10~20%之聚二異氰酸鹽環己烷、10~20%丙二醇甲醚醋酸酯、15 ~25%丙二醇甲醚、10~20%乙二醇乙醚醋酸酯及5~10%溶劑所調製而成;(B06)底漆層表面鍍設形成金屬層;(B07)金屬層表面噴塗形成保護層;(B08)電路板拆離治具,並於去除遮蔽層來連帶其上方底漆層、金屬層及保護層去除後,再進行清潔;(B09)包裝。 A circuit board processing method for a light-emitting diode lamp, in particular, a circuit board mounted on a circuit module of a lamp holder, and a processing method for forming a brightness enhancement film before installing a plurality of light-emitting diodes, the processing steps thereof include: (B01 (B02) cleaning the surface of the plurality of light-emitting diodes on the circuit board and attaching the shielding layer to the surface of each solder joint; (B03) the circuit board is mounted on the fixture; (B04) Surface dust removal treatment; (B05) The surface of the circuit board is sprayed to form a primer layer. The primer layer is made of 20-40% polymer, 10-20% polyisocyanate cyclohexane, 10-20% propylene glycol methyl ether. Acetate, 15 ~25% propylene glycol methyl ether, 10~20% ethylene glycol ethyl ether acetate and 5~10% solvent; (B06) the surface of the primer layer is plated to form a metal layer; (B07) the surface of the metal layer is sprayed to form protection (B08) The circuit board is detached from the fixture, and after removing the shielding layer, the primer layer, the metal layer and the protective layer are removed, and then cleaned; (B09) packaging. 如申請專利範圍第1項所述之發光二極體燈具之電路板加工方法,其中該金屬層可為鋁或銀材質所製成。 The method for processing a circuit board of a light-emitting diode lamp according to claim 1, wherein the metal layer is made of aluminum or silver. 如申請專利範圍第1項所述之發光二極體燈具之電路板加工方法,其中該保護層則為利用漆材所製成,且其硬度為大於該底漆層。 The method for processing a circuit board of a light-emitting diode lamp according to claim 1, wherein the protective layer is made of a paint material and has a hardness greater than the primer layer. 如申請專利範圍第1項所述之發光二極體燈具之電路板加工方法,其中該電路板拆離該治具並進行清潔後,為可進行包裝。 The method for processing a circuit board of a light-emitting diode lamp according to claim 1, wherein the circuit board is detachable from the fixture and cleaned for packaging. 如申請專利範圍第1項所述之發光二極體燈具之電路板加工方法,其中該步驟(B01)電路板表面清洗,可為壓縮空氣噴吹或純水沖洗方式,步驟(B04)之表面除塵處理及(B08)之清潔,則為壓縮空氣並噴出方式。 The method for processing a circuit board of a light-emitting diode lamp according to the first aspect of the invention, wherein the step (B01) of the circuit board surface cleaning may be a compressed air blowing or a pure water washing method, and the surface of the step (B04) For dust removal treatment and (B08) cleaning, it is compressed air and sprayed.
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