TW201407815A - AC light-emitting device - Google Patents
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Abstract
Description
本發明係有關一種交流發光裝置,特別是一種使用垂直堆疊磊晶結構的交流發光裝置。The present invention relates to an alternating current lighting device, and more particularly to an alternating current lighting device using a vertically stacked epitaxial structure.
交流發光二極體模組可直接被交流電源所驅動,不需要使用直流電壓轉換器。於正半週期時,部分的發光二極體會導通發光,而另一部分的發光二極體則不導通;於負半週期時,則發光二極體的導通情形剛好相反。The AC LED module can be directly driven by AC power without the need for a DC voltage converter. During the positive half cycle, part of the light-emitting diode will conduct light, while the other part of the light-emitting diode will not conduct; in the negative half cycle, the light-emitting diode will be turned on exactly the opposite.
交流發光二極體模組一般係採平面陣列設計,亦即將所有發光二極體於水平方向相鄰設置於基板上。由於在某一時間點,僅有部分的發光二極體被點亮,另一部分則是閒置的,使得平均發光亮度無法提高,或者造成電路面積的浪費。The AC LED module is generally designed with a planar array, that is, all the LEDs are disposed adjacent to each other in the horizontal direction. At a certain point in time, only part of the light-emitting diodes are lit, and the other part is idle, so that the average light-emitting brightness cannot be increased, or the circuit area is wasted.
因此亟需提出一種新穎的交流發光裝置,用以提高發光亮度或者減少電路面積。Therefore, it is urgent to propose a novel AC illuminating device for improving the illuminating brightness or reducing the circuit area.
鑑於上述,本發明實施例提出一種交流發光裝置,其使用垂直堆疊磊晶結構的發光單元,且使用穿隧接面層以電性耦合垂直相鄰的磊晶結構。In view of the above, embodiments of the present invention provide an alternating current illuminating device that uses a vertically stacked epitaxial structure of light emitting cells and uses a tunneling junction layer to electrically couple vertically adjacent epitaxial structures.
根據本發明實施例,交流發光裝置包含基板、複數發光單元及至少一導電層。該些發光單元分別位於基板上,每ㄧ發光單元包含第一發光次單元、第二發光次單元及穿隧接面層。其中穿隧接面層位於第一發光次單元及第二發光次單元之間,用以電性耦合第一發光次單元及第二發光次單元。導電層電性連接該些發光單元,使得同一發光單元的第一發光次單元及第二發光次單元依交流電源正、負半週期電壓的驅動而輪流發光。According to an embodiment of the invention, an alternating current lighting device includes a substrate, a plurality of light emitting units, and at least one conductive layer. The light emitting units are respectively disposed on the substrate, and each of the light emitting units includes a first light emitting sub-unit, a second light emitting sub-unit, and a tunneling junction layer. The tunneling junction layer is located between the first illuminating sub-unit and the second illuminating sub-unit for electrically coupling the first illuminating sub-unit and the second illuminating sub-unit. The conductive layer is electrically connected to the light-emitting units such that the first light-emitting sub-unit and the second light-emitting sub-unit of the same light-emitting unit are alternately driven to emit light according to the driving of the positive and negative half-cycle voltages of the alternating current power source.
第一A圖至第一D圖顯示本發明第一實施例之交流發光裝置100,其中,第一A圖及第一B圖分別顯示交流發光裝置100受到交流電源正半週期電壓驅動時的剖面圖及等效電路圖,第一C圖及第一D圖分別顯示交流發光裝置100受到交流電源負半週期電壓驅動時的剖面圖及等效電路圖。1A through 1D show an AC illumination device 100 according to a first embodiment of the present invention, wherein the first A diagram and the first B diagram respectively show a cross section of the AC illumination device 100 when it is driven by a positive half cycle voltage of an AC power source. The figure and the equivalent circuit diagram, the first C picture and the first D picture respectively show a cross-sectional view and an equivalent circuit diagram when the AC light-emitting device 100 is driven by the negative half-cycle voltage of the AC power source.
如第一A圖所示,交流發光裝置100包含複數發光單元1(圖示六個),分別位於基板10上(磊晶形成於基板10上或是置換基板而形成)。每ㄧ發光單元1包含垂直堆疊的第一發光次單元11及第二發光次單元12,以及位於第一發光次單元11及第二發光次單元12之間的穿隧接面層13,用以電性耦合第一發光次單元11及第二發光次單元12。As shown in FIG. A, the AC light-emitting device 100 includes a plurality of light-emitting units 1 (six shown) on the substrate 10 (either formed on the substrate 10 or replaced with a substrate). Each of the illuminating units 1 includes a first illuminating sub-unit 11 and a second illuminating sub-unit 12 that are vertically stacked, and a tunneling junction layer 13 between the first illuminating sub-unit 11 and the second illuminating sub-unit 12 for The first illuminating sub-unit 11 and the second illuminating sub-unit 12 are electrically coupled.
第一發光次單元11包含至少一磊晶結構(亦即發光二極體),每ㄧ磊晶結構包含有第一摻雜層111、發光層112及第二摻雜層113,其中發光層112位於第一摻雜層111與第二摻雜層113之間,且第一摻雜層111與第二摻雜層113的電性相反(例如第一摻雜層111為n型摻雜,第二摻雜層113為p型摻雜,也可以是相反的情形)。類似的情形,第二發光次單元12包含至少一磊晶結構,每ㄧ磊晶結構包含有第一摻雜層121、發光層122及第二摻雜層123,其中發光層122位於第一摻雜層121與第二摻雜層123之間,且第一摻雜層121與第二摻雜層123的電性相反(例如第一摻雜層121為n型摻雜,第二摻雜層123為p型摻雜,也可以是相反的情形)。藉此,穿隧接面層13電性耦合第一發光次單元11之第二摻雜層113以及第二發光次單元12之第一摻雜層121。The first illuminating sub-unit 11 includes at least one epitaxial structure (ie, a light emitting diode), and each ㄧ epitaxial structure includes a first doping layer 111, a luminescent layer 112, and a second doping layer 113, wherein the luminescent layer 112 The first doped layer 111 is electrically opposite to the second doped layer 113 (for example, the first doped layer 111 is n-type doped, The two doped layer 113 is p-type doped, and may be the opposite case). In a similar manner, the second illuminating sub-unit 12 includes at least one epitaxial structure, and each ㄧ epitaxial structure includes a first doping layer 121, a luminescent layer 122, and a second doping layer 123, wherein the luminescent layer 122 is located in the first doping Between the impurity layer 121 and the second doping layer 123, and the electrical properties of the first doping layer 121 and the second doping layer 123 are opposite (for example, the first doping layer 121 is n-type doped, the second doping layer 123 is p-type doping, and the opposite can also be the case). Thereby, the tunnel junction layer 13 is electrically coupled to the second doping layer 113 of the first illuminating sub-unit 11 and the first doping layer 121 of the second illuminating sub-unit 12 .
第一A圖所示的第一發光次單元11與第二發光次單元12各包含一磊晶結構,然而第一發光次單元11或第二發光次單元12也可包含多個磊晶結構,用以達到所需的順向偏壓或者所需的發光亮度。第二圖例示第一A圖的另一種發光單元1,其中第一發光次單元11包含有二磊晶結構11A及11B,該二磊晶結構11A、11B之間使用穿隧接面層11C以電性耦合。The first illuminating sub-unit 11 and the second illuminating sub-unit 12 shown in FIG. 1A each include an epitaxial structure, but the first illuminating sub-unit 11 or the second illuminating sub-unit 12 may also include a plurality of epitaxial structures. Used to achieve the desired forward bias or desired illuminance. The second figure illustrates another illumination unit 1 of FIG. A, wherein the first illumination sub-unit 11 includes two epitaxial structures 11A and 11B, and the tunnel junction layer 11C is used between the two epitaxial structures 11A and 11B. Electrical coupling.
在本實施例中,如第一A圖所示,相鄰發光單元1之間的電性連接有二種型式。第一種電性連接型式為並聯之電性連接型式,用以將相鄰二發光單元1(如第一A圖所示左一及左二之發光單元)個別的中間節點予以電性連接,本說明書所稱“中間節點”係指第一發光次單元11與第二發光次單元12之間互有電性耦合的區域,例如第一發光次單元11的第二摻雜層113及第二發光次單元12的第一摻雜層121,藉由穿隧接面層13而互有電性耦合之關係。第二種電性連接型式為交錯(crossover)之電性連接型式,用以將相鄰二發光單元1(如第一A圖所示左二及左三之發光單元)的所有外部電極予以電性連接,本說明書所稱“外部電極”係指與第一/第二發光次單元11/12最靠近外部(或最遠離穿隧接面層13)之摻雜層接觸的電極。例如,與第二發光次單元12之第二摻雜層123接觸的電極124,或者與第一發光次單元11之第一摻雜層111接觸的電極114。至於與其他摻雜層接觸的電極,在本說明書中稱為“內部電極”。上述之並聯電性連接型式及交錯電性連接型式交替使用於相鄰發光單元1之間,因而形成本實施例之並聯交流發光裝置100。In this embodiment, as shown in FIG. A, there are two types of electrical connections between adjacent light-emitting units 1. The first type of electrical connection is a parallel electrical connection type for electrically connecting the adjacent intermediate nodes of the adjacent two illumination units 1 (such as the left and left illumination units shown in FIG. A). The term "intermediate node" as used herein refers to a region in which the first illuminating subunit 11 and the second illuminating subunit 12 are electrically coupled to each other, such as the second doping layer 113 and the second of the first illuminating subunit 11. The first doped layer 121 of the illuminating sub-unit 12 is electrically coupled to each other by the tunnel junction layer 13. The second electrical connection type is a crossover electrical connection type for electrically charging all external electrodes of the adjacent two illumination units 1 (such as the left and left illumination units shown in FIG. The term "external electrode" as used in this specification refers to an electrode that is in contact with the doped layer of the first/second illuminating subunit 11/12 closest to the outside (or farthest from the tunneling junction layer 13). For example, the electrode 124 that is in contact with the second doping layer 123 of the second illuminating subunit 12, or the electrode 114 that is in contact with the first doping layer 111 of the first illuminating subunit 11. As for the electrode in contact with other doped layers, it is referred to as "internal electrode" in this specification. The above-described parallel electrical connection type and interleaved electrical connection type are alternately used between adjacent light-emitting units 1, thereby forming the parallel alternating current light-emitting device 100 of the present embodiment.
上述第一種電性連接型式(亦即並聯電性連接型式)有以下幾種實施結構。如第三A圖所示,使用第一導電層14將相鄰二發光單元1位於中間節點之相應摻雜層(例如圖示第二發光次單元12的第一摻雜層121)予以電性耦合。在另一變化實施例中(如第三B圖所示),第一導電層14更藉由相鄰第二發光次單元12之第一摻雜層121的內部電極進行電性耦合。相鄰二發光單元1之間位於第一導電層14下方的區域則填充以第一絕緣層15,其材質可以為聚合物(polymer)、陶瓷材料(例如二氧化矽)或其任意組合。於本實施例之一範例中,第一絕緣層15為聚合物,因具有較佳的間隙填充特性,可形成厚度均勻(沒有空隙)的結構。此外,第一導電層14及第一絕緣層15的截面形狀不一定是矩形的,也可以為多角形的截面,如第三C圖所示。第三D圖顯示第一種電性連接型式的另一種實施結構。在本實施結構中,第一導電層14將相鄰二發光單元1位於中間節點之相應摻雜層(例如圖示第一發光次單元11的第二摻雜層113)予以電性耦合。The first electrical connection type (that is, the parallel electrical connection type) has the following implementation structures. As shown in FIG. 3A, the first conductive layer 14 is used to electrically connect the adjacent two light-emitting units 1 to the corresponding doped layers of the intermediate nodes (for example, the first doped layer 121 of the second light-emitting sub-unit 12 is illustrated). coupling. In another variant embodiment (as shown in FIG. 3B), the first conductive layer 14 is further electrically coupled by the internal electrodes of the first doped layer 121 of the adjacent second illuminating sub-units 12. A region between the adjacent two light-emitting units 1 under the first conductive layer 14 is filled with a first insulating layer 15, which may be made of a polymer, a ceramic material such as cerium oxide, or any combination thereof. In an example of the present embodiment, the first insulating layer 15 is a polymer, and has a gap filling property to form a uniform thickness (without voids). In addition, the cross-sectional shape of the first conductive layer 14 and the first insulating layer 15 is not necessarily rectangular, and may be a polygonal cross section, as shown in FIG. 3C. The third D diagram shows another implementation of the first electrical connection type. In the present embodiment, the first conductive layer 14 electrically couples the adjacent doped layers of the adjacent two light emitting units 1 at the intermediate nodes (for example, the second doped layer 113 of the first light emitting sub-unit 11).
上述第二種電性連接型式(亦即交錯電性連接型式)的實施結構如第一A圖所示,使用第二導電層16將相鄰二發光單元1(如第一A圖所示左二及左三之發光單元)的所有(共四個)外部電極114及124予以電性連接。此外,第二導電層16與發光單元1的側壁之間包含有第二絕緣層17。The implementation structure of the second electrical connection type (that is, the interleaved electrical connection type) is as shown in FIG. 1A, and the second conductive layer 16 is used to connect the adjacent two light-emitting units 1 (as shown in FIG. All (four of the total) external electrodes 114 and 124 of the second and left third light-emitting units are electrically connected. Further, a second insulating layer 17 is included between the second conductive layer 16 and the sidewall of the light emitting unit 1.
本實施例的一範例中,穿隧接面層13包含四族元素與氮元素,亦即,由至少一個四族元素與氮元素所組成的化合物,且該四族元素與該氮元素的原子數占該穿隧接面層總原子數百分比的50%以上。本實施例的另一範例中,穿隧接面層13可採用低溫(例如400~1000℃)製程,其形成溫度小於相鄰磊晶結構(例如第一發光次單元11及第二發光次單元12)的形成溫度。In an example of this embodiment, the tunnel junction layer 13 comprises a group of four elements and a nitrogen element, that is, a compound composed of at least one group of four elements and a nitrogen element, and the group of elements and atoms of the nitrogen element The number accounts for more than 50% of the total atomic percentage of the tunneling junction layer. In another example of the embodiment, the tunnel junction layer 13 can be processed at a low temperature (for example, 400 to 1000 ° C), and the formation temperature is lower than the adjacent epitaxial structure (for example, the first illumination sub-unit 11 and the second illumination sub-unit). 12) Formation temperature.
本實施例的又一範例中,穿隧接面層13可為一種缺陷誘導(defect-induced)結構,其提供的缺陷密度可大於成長層(亦即穿隧接面層13的底部)之缺陷密度的五倍以上。In still another example of this embodiment, the tunnel junction layer 13 can be a defect-induced structure that provides a defect density greater than a defect of the growth layer (ie, the bottom of the tunnel junction layer 13). More than five times the density.
本實施例的再一範例中,穿隧接面層13可為多層結構,較佳厚度小於或等於30奈米。穿隧接面層13可為無摻雜,或者是摻雜濃度小於相鄰磊晶結構(例如第一發光次單元11及第二發光次單元12)的摻雜濃度。本實施例的再一範例中,穿隧接面層13可摻雜有碳元素,其摻雜濃度大於1017原子/立方公分,較佳範圍為1018~1020原子/立方公分。In still another example of this embodiment, the tunnel junction layer 13 may have a multi-layer structure, preferably having a thickness of less than or equal to 30 nm. The tunneling junction layer 13 may be undoped or have a doping concentration that is less than a doping concentration of adjacent epitaxial structures (eg, the first illuminating sub-element 11 and the second illuminating sub-element 12). In still another example of this embodiment, the tunnel junction layer 13 may be doped with carbon, and its doping concentration is greater than 10 17 atoms/cm 3 , and preferably ranges from 10 18 to 10 20 atoms/cm 3 .
第四A圖至第四D圖顯示本發明第二實施例之交流發光裝置400,其中,第四A圖及第四B圖分別顯示交流發光裝置400受到交流電源正半週期電壓驅動時的剖面圖及等效電路圖,第四C圖及第四D圖分別顯示交流發光裝置400受到交流電源負半週期電壓驅動時的剖面圖及等效電路圖。4A to 4D are diagrams showing an AC illumination device 400 according to a second embodiment of the present invention, wherein the fourth A diagram and the fourth B diagram respectively show a cross section of the AC illumination device 400 when it is driven by a positive half cycle voltage of an AC power source. The figure and the equivalent circuit diagram, the fourth C picture and the fourth D picture respectively show a cross-sectional view and an equivalent circuit diagram when the AC light-emitting device 400 is driven by the negative half-cycle voltage of the AC power source.
如第四A圖所示,交流發光裝置400包含複數發光單元1(圖示三個),分別位於基板10上(磊晶形成於基板10上或是置換基板而形成)。每ㄧ發光單元1的結構類似於第一實施例,因此使用相同的元件符號,其細節不再贅述。As shown in FIG. 4A, the AC light-emitting device 400 includes a plurality of light-emitting units 1 (three shown) which are respectively disposed on the substrate 10 (either epitaxially formed on the substrate 10 or replaced with a substrate). The structure of each of the light-emitting units 1 is similar to that of the first embodiment, and therefore the same reference numerals are used, and the details thereof will not be described again.
在本實施例中,如第四A圖所示,相鄰發光單元1之間的電性連接為串/並聯之電性連接型式,用以將一發光單元1(如第四A圖所示左二之發光單元)的第一及第二發光次單元11及12之外部電極114及124予以串聯,再與相鄰發光單元1(如第四A圖所示左一之發光單元)位於中間節點的內部電極125進行並聯。如第四A圖所示,外部電極114及124串聯後係與第二發光次單元12之第一摻雜層121接觸的內部電極125進行並聯。第五圖顯示另一種變化實施例,外部電極114及124串聯後係與第一發光次單元11之第二摻雜層113接觸的內部電極115進行並聯。In this embodiment, as shown in FIG. 4A, the electrical connection between the adjacent light-emitting units 1 is a series/parallel electrical connection type for using a light-emitting unit 1 (as shown in FIG. 4A). The external electrodes 114 and 124 of the first and second illuminating sub-units 11 and 12 of the left second illuminating unit are connected in series, and are adjacent to the adjacent illuminating unit 1 (such as the left illuminating unit shown in FIG. 4A). The internal electrodes 125 of the nodes are connected in parallel. As shown in FIG. 4A, the external electrodes 114 and 124 are connected in series and are connected in parallel to the internal electrodes 125 which are in contact with the first doping layer 121 of the second illuminating sub-unit 12. The fifth figure shows another variant embodiment in which the external electrodes 114 and 124 are connected in series and the internal electrodes 115 in contact with the second doping layer 113 of the first illuminating sub-unit 11 are connected in parallel.
在本實施例中,如第四A圖或第五圖所示,使用導電層18將一發光單元1的外部電極114、124與相鄰發光單元1的內部電極125或115予以電性耦合。換句話說,相鄰發光單元1之間共有(僅有)三個電極(亦即,二外部電極與一內部電極)互相電性耦合。此外,導電層18與發光單元1的側壁之間包含有絕緣層19。In the present embodiment, as shown in FIG. 4A or FIG. 5, the external electrodes 114, 124 of one light-emitting unit 1 are electrically coupled to the internal electrodes 125 or 115 of the adjacent light-emitting units 1 using the conductive layer 18. In other words, there are (only) three electrodes (ie, two external electrodes and one internal electrode) electrically coupled to each other between adjacent light-emitting units 1. Further, an insulating layer 19 is included between the conductive layer 18 and the sidewall of the light emitting unit 1.
以上所述僅為本發明之較佳實施例而已,並非用以限定本發明之申請專利範圍;凡其它未脫離發明所揭示之精神下所完成之等效改變或修飾,均應包含在下述之申請專利範圍內。The above description is only the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention; all other equivalent changes or modifications which are not departing from the spirit of the invention should be included in the following Within the scope of the patent application.
100...交流發光裝置100. . . AC illuminator
400...交流發光裝置400. . . AC illuminator
1...發光單元1. . . Light unit
10...基板10. . . Substrate
11...第一發光次單元11. . . First illuminating subunit
11A...磊晶結構11A. . . Epitaxial structure
11B...磊晶結構11B. . . Epitaxial structure
11C...穿隧接面層11C. . . Tunneling layer
111...第一摻雜層111. . . First doped layer
112...發光層112. . . Luminous layer
113...第二摻雜層113. . . Second doped layer
114...電極114. . . electrode
115...電極115. . . electrode
12...第二發光次單元12. . . Second illuminating subunit
121...第一摻雜層121. . . First doped layer
122...發光層122. . . Luminous layer
123...第二摻雜層123. . . Second doped layer
124...電極124. . . electrode
125...電極125. . . electrode
13...穿隧接面層13. . . Tunneling layer
14...第一導電層14. . . First conductive layer
15...第一絕緣層15. . . First insulating layer
16...第二導電層16. . . Second conductive layer
17...第二絕緣層17. . . Second insulating layer
18...導電層18. . . Conductive layer
19...絕緣層19. . . Insulation
第一A圖至第一D圖顯示本發明第一實施例之交流發光裝置。
第二圖例示第一A圖的另一種發光單元。
第三A圖至第三D圖顯示第一實施例之並聯電性連接型式的實施結構。
第四A圖至第四D圖顯示本發明第二實施例之交流發光裝置。
第五圖顯示本發明第二實施例的變化型。The first to first D diagrams show the alternating current illumination device of the first embodiment of the present invention.
The second figure illustrates another illumination unit of the first A diagram.
The third to third figures D show the implementation structure of the parallel electrical connection type of the first embodiment.
4A to 4D are views showing an alternating current light emitting device according to a second embodiment of the present invention.
The fifth figure shows a variation of the second embodiment of the present invention.
100...交流發光裝置100. . . AC illuminator
1...發光單元1. . . Light unit
10...基板10. . . Substrate
11...第一發光次單元11. . . First illuminating subunit
111...第一摻雜層111. . . First doped layer
112...發光層112. . . Luminous layer
113...第二摻雜層113. . . Second doped layer
114...電極114. . . electrode
12...第二發光次單元12. . . Second illuminating subunit
121...第一摻雜層121. . . First doped layer
122...發光層122. . . Luminous layer
123...第二摻雜層123. . . Second doped layer
124...電極124. . . electrode
13...穿隧接面層13. . . Tunneling layer
14...第一導電層14. . . First conductive layer
15...第一絕緣層15. . . First insulating layer
16...第二導電層16. . . Second conductive layer
17...第二絕緣層17. . . Second insulating layer
Claims (17)
一基板;
複數發光單元,分別位於該基板上,每ㄧ該發光單元包含:
一第一發光次單元;
一第二發光次單元;及
一穿隧接面層;
其中該穿隧接面層位於該第一發光次單元及該第二發光次單元之間,用以電性耦合該第一發光次單元及該第二發光次單元;及
至少一導電層,電性連接該些發光單元,使得同一該發光單元的第一發光次單元及第二發光次單元依交流電源正、負半週期電壓的驅動而輪流發光。An AC lighting device comprising:
a substrate;
A plurality of light emitting units are respectively disposed on the substrate, and each of the light emitting units comprises:
a first illuminating subunit;
a second illuminating subunit; and a tunneling junction layer;
The tunneling junction layer is located between the first illuminating sub-unit and the second illuminating sub-unit for electrically coupling the first illuminating sub-unit and the second illuminating sub-unit; and at least one conductive layer, The light-emitting units are connected to each other such that the first light-emitting sub-unit and the second light-emitting sub-unit of the same light-emitting unit are alternately driven to emit light according to the driving of the positive and negative half-cycle voltages of the alternating current power source.
一第一摻雜層;
一發光層;及
一第二摻雜層;
其中該發光層位於該第一摻雜層與該第二摻雜層之間,且該第一摻雜層與該第二摻雜層的電性相反,藉此,該穿隧接面層電性耦合該第一發光次單元之第二摻雜層以及該第二發光次單元之第一摻雜層。The illuminating device of claim 1, wherein the first illuminating subunit or the second illuminating subunit comprises at least one epitaxial structure, and each epitaxial structure comprises:
a first doped layer;
a light emitting layer; and a second doped layer;
Wherein the light emitting layer is located between the first doped layer and the second doped layer, and the first doped layer and the second doped layer are electrically opposite, whereby the tunneling junction layer is electrically The second doped layer of the first illuminating subunit and the first doped layer of the second illuminating subunit are coupled.
一第一導電層,將該相鄰二發光單元位於該中間節點之相應摻雜層予以電性耦合;及
一第一絕緣層,位於該相鄰二發光單元之間且位於該第一導電層下方。The AC lighting device of claim 3, wherein the parallel electrical connection mechanism comprises:
a first conductive layer electrically coupled to the corresponding doped layer of the adjacent two light emitting units; and a first insulating layer between the adjacent two light emitting units and located at the first conductive layer Below.
一第二導電層,將該相鄰二發光單元的所有外部電極予以電性連接;及
一第二絕緣層,位於該第二導電層與該發光單元的側壁之間。The AC lighting device of claim 8, wherein the interleaved electrical connection mechanism comprises:
a second conductive layer electrically connecting all the external electrodes of the adjacent two light emitting units; and a second insulating layer between the second conductive layer and the sidewall of the light emitting unit.
一導電層,用以將某一該發光單元的第一及第二發光次單元之外部電極予以串聯,再與相鄰一該發光單元位於中間節點的內部電極進行並聯;及
一絕緣層,位於該導電層與該發光單元的側壁之間。The illuminating device of claim 2, wherein the adjacent two illuminating units have a series/parallel electrical connection mechanism, comprising:
a conductive layer for connecting the external electrodes of the first and second illuminating sub-units of one of the illuminating units in series, and then connected in parallel with the internal electrodes of the adjacent one of the illuminating units at the intermediate node; and an insulating layer located at The conductive layer is between the sidewall of the light emitting unit.
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TWI769622B (en) * | 2019-12-23 | 2022-07-01 | 美商亮銳公司 | Iii-nitride multi-wavelength led arrays |
US11404473B2 (en) | 2019-12-23 | 2022-08-02 | Lumileds Llc | III-nitride multi-wavelength LED arrays |
US11631786B2 (en) | 2020-11-12 | 2023-04-18 | Lumileds Llc | III-nitride multi-wavelength LED arrays with etch stop layer |
US11923398B2 (en) | 2019-12-23 | 2024-03-05 | Lumileds Llc | III-nitride multi-wavelength LED arrays |
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TW200849548A (en) * | 2007-06-05 | 2008-12-16 | Lite On Technology Corp | Light emitting element, manufacturing method thereof and light emitting module using the same |
KR102098563B1 (en) * | 2010-06-25 | 2020-04-08 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Light-emitting element, light-emitting device, display, and electronic device |
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Cited By (6)
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TWI769622B (en) * | 2019-12-23 | 2022-07-01 | 美商亮銳公司 | Iii-nitride multi-wavelength led arrays |
US11404473B2 (en) | 2019-12-23 | 2022-08-02 | Lumileds Llc | III-nitride multi-wavelength LED arrays |
US11923398B2 (en) | 2019-12-23 | 2024-03-05 | Lumileds Llc | III-nitride multi-wavelength LED arrays |
US11923401B2 (en) | 2019-12-23 | 2024-03-05 | Lumileds Llc | III-nitride multi-wavelength LED arrays |
US11631786B2 (en) | 2020-11-12 | 2023-04-18 | Lumileds Llc | III-nitride multi-wavelength LED arrays with etch stop layer |
US11961941B2 (en) | 2020-11-12 | 2024-04-16 | Lumileds Llc | III-nitride multi-wavelength LED arrays with etch stop layer |
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