TW201407646A - Mass production method of metal plate resistors and the product thereof - Google Patents

Abstract

The present invention mainly provides a mass production method of metal plate resistors comprising: a stamping step, a thick-film forming step, a cut step, a heat dissipation sheet connection step, and an insulating layer forming step. Plurality of resistor bodies with cut groove and predetermined resistance values can be stamped from a rectangular metal plate. After the thick-film electrode coated film is formed by electroform, metal plate resistors with precise resistance values are mass-produced by stamping, connecting to heat dissipation sheet and coating insulating material. The p-resent invention also provides metal plate resistors with no resistance values shifting due to heat during the operations by the mass production method.

Description

Mass production method of metal plate resistor and product thereof

The present invention relates to a method of fabricating a passive component, and more particularly to a mass production method of a metal resistor and a product thereof.

Referring to FIG. 1, the metal plate resistor 1 is a passive component that is soldered to a high current, high power environment, such as the PC board 100, to provide a predetermined resistance value, also known as Current Sensing Resistors. The invention generally includes a plate-shaped resistor body 11 and an electrode 12 having a C-shaped cross section sandwiching the two short sides of the resistor body 11 , and covering the resistor body 11 and the two electrodes 12 and exposing at least one surface of the two electrodes 12 . The soldering is adhered to, for example, the coating layer 13 on the PC board 100. In summary, when the existing metal plate resistor 1 is in use, the exposed surface of the two electrode 12 uncoated layer is soldered to, for example, the PC board 100 by soldering, that is, the resistor body 11 itself can be provided. The resistance is predetermined to exert a predetermined effect.

Referring to FIG. 2 and FIG. 3, however, since the metal plate resistor 1 is first cut out of the resistor body 11 and the coating layer 13 is applied, as shown in FIG. 2, the two thin metal sheets 14 are soldered one by one. After the resistor body is bent into a C-shaped electrode 12, or as shown in FIG. 3, the two thin metal sheets 14' bent into a C-shape are welded to the resistor body 11 to form the two electrodes 12, and the fabrication is completed. Therefore, there will be a problem that the thin metal sheets 14, 14' need to be bent one by one and cannot be mass-produced. At the same time, the electrode 12 formed by the thin metal sheets 14, 14' and formed by welding will have the electrode 12 itself and the resistor. The body 11 has poor adhesion and the solder joint structure is relatively poor. The problem of instability, and such a situation will lead to a potential problem in which the resistance of the metal plate resistor 1 is increased due to the generation of heat and the accuracy is affected.

Accordingly, it is an object of the present invention to provide a new process for mass production of metal plate resistors that are simple, mass-produced with accurate resistance and structural integrity.

Further, another object of the present invention is to provide a metal plate resistor having an accurate and structurally stable resistance value which is mass-produced in a new process.

Therefore, the mass production method of the metal plate resistor of the present invention comprises a punching step, a thick film forming step, a cutting step, a heat sink connecting step, and an insulating layer forming step.

The punching step punches the long rectangular metal piece into a plurality of equally spaced slots in a short side direction of the parallel long rectangular metal piece, and punches the long rectangular metal piece in parallel with the long side direction of the long rectangular metal piece Cutting a plurality of slits, wherein one end of each groove communicates with one of the grooves, and a metal sheet structure having at least all grooves between the adjacent two grooves defines a resistor body, and the The first half of the majority of the resistor body.

The thick film forming step uses a conductor material to form an electrode coating film which is formed in a C-shaped cross section and has two long sides of the first semi-finished product and is connected to the resistive body along the two long sides of the first semi-finished product. The second half of the finished product.

The cutting step respectively cuts the second semi-finished product along a plurality of slots of the second semi-finished product, and obtains a plurality of resistor bodies each including at least one groove, and two electrodes connected to the resistor body and having a C-shaped cross section. Semi-finished metal plate resistors.

The heat sink connecting step is applied to the resistor body of the metal plate resistor semi-finished product by a polymer material having high heat conduction property, and the heat sink is made of a material having a high heat conduction property, respectively, by the polymer material. a resistor body is connected to each of the plurality of resistor bodies including at least one of the trenches, a connecting layer formed on the resistor body, a heat sink connected to the connecting layer, and at least one surface and the heat sink The metal plate resistance of the coplanar electrode is the next product.

In the insulating layer forming step, the coating material made of an insulating material is formed on the metal plate resistance secondary product by forming at least one surface of each of the metal plate resistance secondary products to form an insulating layer, and a plurality of metal plates are obtained. resistance.

In addition, a metal plate resistor of the present invention comprises a resistor body, two electrodes, a connection layer, a heat sink, and an insulating layer.

The resistor body has a rectangular metal sheet structure composed of any one of a metal and an alloy, and at least one slit formed from one of the long sides of the metal sheet structure to the other long side.

The two electrodes are made of a conductor material and respectively cover the two short sides of the metal piece structure in a C-shaped cross section.

The connection layer is composed of a polymer material having high heat conduction characteristics and covers a peripheral surface of the metal piece structure which is not covered by the two electrodes.

The heat sink is connected to the metal sheet structure by the connection layer with a surface substantially equal to the height of the two electrodes.

The insulating layer is made of an insulating material to cover the resistor body, the two electrodes, the connecting layer, and the heat sink, and expose at least one surface of the two electrodes.

The utility model has the advantages that the mass production method comprising the punching step, the thick film forming step, the cutting step, the heat sink connecting step, and the insulating layer forming step is proposed, and the metal sheet can be punched out from the long rectangular shape, including most of A resistor body having a predetermined resistance and a resistive body having a predetermined resistance is formed by electroforming a thick film of the electrode, and after cutting, connecting the heat sink, and coating the insulating material, the metal plate resistor having a precise resistance is easily mass-produced.

The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments.

Referring to FIG. 4 and FIG. 9, a preferred embodiment of a method for mass-producing a metal plate resistor includes a die cutting step 31, a thick film forming step 32, a cutting step 33, and a heat sink connecting step 34. And an insulating layer forming step 35, and the metal plate resistor 55 can be mass-produced.

Referring to FIG. 4 and FIG. 5, first, the punching step 31 is performed to prepare a long rectangular metal piece 40, and the long rectangular metal piece 40 is punched out and cut out in a direction parallel to the short side direction of the long rectangular metal piece 40. The equidistant groove 41 and the long rectangular metal piece 40 are punched out of the plurality of slits 42 in parallel with the longitudinal direction of the long rectangular metal piece 40, wherein one end of each groove 42 and one of the grooves 41 are formed therein. The first semi-finished product 51 having a plurality of resistive bodies 44 is formed by interconnecting the metal sheet structure 43 having at least all of the grooves 42 between the adjacent two through grooves 41. In the present example and the illustration, the two slits 42 are connected to a through groove 41, and a slit 42 located between the two slits 42 communicates with the other opposite side of the groove 41, and a total of three slits 42 are made. Explain, by this, The metal piece structure 43 is divided into successively inverted S-shaped current paths to determine the range of resistance values of the fabricated metal plate resistors 55.

It should be particularly noted that the punching step 31 performed by the present invention is formed by punching only the inner structure of the long rectangular metal piece 40 to form the through grooves 41 and the slits 42 without the long rectangular metal piece 40. The periphery is die cut inwardly, thereby maintaining the maximum structural strength of the long rectangular metal sheet 40 and reducing the accumulation of subsequent mechanical tolerances.

Referring to FIG. 4 and FIG. 6, the thick film forming step 32 is further performed, and the two long sides of the first semi-finished product 51 are respectively covered with a conductor material along the two long sides of the first semi-finished product 51 to form a two-section C-shaped shape. An electrode coating film 45 connected to the resistor body 44 is used to obtain a second semi-finished product 52. In particular, the thick film forming step 32 is to form the two-electrode plating film 45 mainly composed of copper by electroforming. The two-electrode plating film 45 is formed to have a larger predetermined thickness, and can be closely connected with the long rectangular metal piece 40, thereby avoiding the subsequent occurrence of heat due to heat generation due to poor adhesion between the two materials. The problem of increased value error and accuracy is affected.

Referring to FIG. 4 and FIG. 7, the cutting step 33 is performed, and the second semi-finished product 52 is cut along the plurality of slots 41 of the second semi-finished product 52, respectively, and the plurality of the plurality of trenches 42 and a metal are respectively formed. The resistor body 44 of the sheet structure 43 and the metal plate resistor blank 53 of the electrode 46 connected to the resistor body 44 and having a C-shaped cross section. It should be added that, in this step, the metal plate resistor semi-finished product 53 can be trimmed by grinding wheel grinding and/or laser trimming to have an accurate resistance value.

Referring to FIG. 4 and FIG. 8 , the heat sink connection step 34 is followed by A polymer material having high heat conduction characteristics, in this case, a thermoplastic polypropylene, is applied to the resistor body 44 of the metal plate resistor semi-finished product 53, and the polymer material is mostly made of a material having high heat conduction characteristics. Heat sinks 48 made of, for example, copper, aluminum, copper alloy, or aluminum alloy are respectively connected to each of the resistor bodies 44, wherein the coating thickness of the polymer material and the thickness of the heat sinks 48 are matched with each other to make a connection. The heat sink 48 and the electrode 46 are substantially coplanar, and the appearance of the original is flat. The resistor body 44 having at least all the grooves 42 and a connecting layer 47 formed on the resistor body 44 are respectively formed. A heat sink 48 connected to the connection layer 47, and a metal plate resistance secondary 54 of at least one electrode 46 having a surface coplanar with the heat sink 48.

Referring to FIG. 4 and FIG. 9, finally, the insulating layer forming step is performed, and the coating material made of an insulating material is formed on the resistance of the metal plate in such a manner that at least one surface of each of the two-electrode resistance secondary products 54 is exposed. The finished product 54 is formed into an insulating layer 49, which is capable of mass production of a plurality of metal plate resistors 55.

It can be seen from the above description that the mass production method of the metal plate resistor of the present invention mainly proposes a process which is different from the existing metal plate resistor 1 and starts from the long rectangular metal piece 40 as a raw material, and punches out a plurality of slots 41 and cuts. The groove 42 defines a resistor body 44 including a plurality of slits 42 and having a predetermined resistance value on the premise of causing minimal structural strength damage to the metal sheet 40, and then forming a thick film electrode coating 45 by electroforming, and then passing through The metal sheet resistance 55 having a precise resistance value can be mass-produced by cutting, connecting the heat sink 48 with the connection layer 47, and coating the insulating material to form the insulating layer 49. Compared with the existing process, not only the improvement of the existing process must be made by shrinking the thin metal sheets 14 and 14' The electrode 12 is re-welded to the electrode 12 and the like, and the structure of each part of the fabricated metal plate resistor 55 is good in adhesion and stable in structure, and the resistance value is not generated in use due to heat generation. The error is increased and the accuracy is affected.

In addition, the present invention directly incorporates the heat sink connection step 34 in the process, and the heat sink 48 is adhered to the resistor body 44 to assist the heat conduction of the component, and can further conduct heat away from the component itself in use, maintaining an accurate resistance value. range.

In summary, the present invention mainly proposes a new and complete method for mass production of metal plate resistors, mass-produces and accurately mass-produces a metal plate resistor 55 having a heat sink, compared with the existing metal plate resistor 1 and In terms of the manufacturing method, the metal plate resistor 55 produced by the invention has the heat sink 48 added, and the heat dissipation is fast in use, the temperature is low, the resistance value drift is low, and the resistance characteristic is more accurate, and the process must be improved one by one. The concave-folded metal foil is used to make electrodes, and the electrode is welded, and the like, and the production process can be easily mass-produced. Therefore, the production cost can be effectively reduced, and thus the product precision can be improved, and the competitiveness of the market can be greatly improved. The purpose of the invention.

The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.

100‧‧‧PC board

1‧‧‧Metal plate resistance

11‧‧‧Resistive body

12‧‧‧ electrodes

13‧‧‧coating layer

14, 14'‧‧‧metal pieces

31‧‧‧punching steps

32‧‧‧ Thick film formation steps

33‧‧‧ cutting steps

34‧‧‧ Heat sink connection steps

35‧‧‧Insulation layer formation steps

40‧‧‧metal pieces

41‧‧‧through slot

42‧‧‧cutting trench

43‧‧‧Metal sheet structure

44‧‧‧Resistive body

45‧‧‧electrode coating

46‧‧‧ electrodes

47‧‧‧Connection layer

48‧‧‧ Heat sink

49‧‧‧Insulation

51‧‧‧First semi-finished product

52‧‧‧second semi-finished products

53‧‧‧Metal plate resistor semi-finished products

54‧‧‧Metal plate resistance secondary products

55‧‧‧Metal plate resistance

1 is a side view showing a conventional metal plate resistor; FIG. 2 is a schematic view showing a process of fabricating a conventional metal plate resistor; 3 is a schematic view showing another manufacturing process of the conventional metal plate resistor; FIG. 4 is a flow chart showing a preferred embodiment of the mass production method of the metal plate resistor of the present invention; FIG. 5 is a schematic view showing the implementation A first semi-finished product having a plurality of resistive bodies is obtained by a punching step of a preferred embodiment of the mass production method of the metal plate resistor of the present invention; and FIG. 6 is a schematic view showing a mass production method of the metal plate resistor of the present invention. A thick film forming step of the preferred embodiment produces a second semi-finished product; and FIG. 7 is a schematic view showing a cutting step of a preferred embodiment of the mass production method of the metal plate resistor of the present invention to obtain a plurality of metal plate resistors. a semi-finished product; FIG. 8 is a schematic view showing a heat sink connection step of a preferred embodiment of the mass production method of the metal plate resistor of the present invention to obtain a plurality of metal plate resistance secondary products; and FIG. 9 is a schematic view showing the metal of the present invention A plurality of metal plate resistors are produced by an insulating layer forming step of the preferred embodiment of the mass production method of the plate resistor.

31‧‧‧punching steps

32‧‧‧ Thick film formation steps

33‧‧‧ cutting steps

34‧‧‧ Heat sink connection steps

35‧‧‧Insulation layer formation steps

55‧‧‧Metal plate resistance

Claims (10)

A method for mass production of a metal plate resistor, comprising: a punching step of punching the long rectangular metal piece into a plurality of equally spaced slots in a short side direction of a parallel rectangular metal piece, and paralleling the long rectangular metal The long rectangular direction of the sheet is punched out of the plurality of slits, wherein one end of each groove communicates with one of the grooves, and the metal piece having at least all the grooves between the adjacent two grooves The structure defines a resistor body to produce a first semi-finished product having a plurality of resistor bodies; a thick film forming step of coating the conductor material with a two-section C-shape along the two long sides of the first semi-finished product The second semi-finished product of the first half of the finished product is coated with the electrode connected to the resistor body to obtain a second semi-finished product; and a cutting step is performed to cut the second semi-finished product along a plurality of slots of the second semi-finished product to obtain a majority Each has a resistor body including at least all trenches, and a metal plate resistor semi-finished product connecting the resistor body and having a C-shaped electrode; a heat sink connection step for using a heat transfer characteristic The molecular material is coated on the resistor body of the metal plate resistor semi-finished product, and the heat sink sheets made of a material having high heat conduction characteristics are respectively connected to each of the resistor bodies, and the majority of the resistors are respectively included. a resistor body having at least all trenches, a connection layer formed on the resistor body, a heat sink connected to the connection layer, and a metal plate resistance secondary product of at least one electrode having a surface coplanar with the heat sink; And an insulating layer forming step, wherein the coating material made of an insulating material is formed in such a manner that at least one surface of each of the metal plate resistance secondary products is exposed The metal plate resistors are formed into an insulating layer to produce a plurality of metal plate resistors. The mass production method of the metal plate resistor according to the first aspect of the invention, wherein the thick film forming step is to form the two-electrode plating film mainly composed of copper by electroforming. The method for mass production of a metal plate resistor according to claim 2, wherein the cutting step is to trim the metal plate resistor semi-finished products by at least one of grinding wheel grinding and laser trimming. The mass production method of the metal plate resistor according to claim 3, wherein the heat sink connection step is performed by applying thermoplastic polypropylene to the metal plate resistor blanks to connect the heat sinks. The mass production method of the metal plate resistor according to claim 4, wherein the heat sink is selected from the group consisting of copper, aluminum, and the like, and the thickness is substantially equal to the electrode coating. thickness. A metal plate resistor comprising: a resistor body having a rectangular metal sheet structure composed of any one of a metal and an alloy, and at least one cut from one of the long sides of the metal sheet structure to the other long side a second electrode, which is composed of a conductor material and respectively covers a short side portion of the metal sheet structure in a C-shaped cross section; a connecting layer composed of a polymer material having high heat conduction characteristics and covering the metal sheet a peripheral surface of the structure not covered by the two electrodes; a heat sink by which the surface layer is substantially connected to the metal sheet structure with the height of the two electrodes; and An insulating layer is formed of an insulating material to cover the resistor body, the two electrodes, the connecting layer, and the heat sink and expose at least one surface of the two electrodes. The metal plate resistor according to claim 6, wherein the two electrodes are formed by electroforming and composed of copper as a main component. The metal plate resistor according to claim 7, wherein the resistor body is ground by a grinding wheel, and at least one of the methods of laser trimming is trimmed to have a predetermined resistance value. The metal plate resistor according to claim 8 wherein the connecting layer is made of thermoplastic polypropylene. The metal plate resistor according to claim 9, wherein the heat sink is selected from the group consisting of copper, aluminum, and the like, and the thickness is substantially equal to the thickness of the two electrodes.