TW201407239A - Electronic device - Google Patents
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- TW201407239A TW201407239A TW101129623A TW101129623A TW201407239A TW 201407239 A TW201407239 A TW 201407239A TW 101129623 A TW101129623 A TW 101129623A TW 101129623 A TW101129623 A TW 101129623A TW 201407239 A TW201407239 A TW 201407239A
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Abstract
Description
本發明係關於一種電子裝置，特別是一種具有軟性電路基材穿設框體的電子裝置。 The present invention relates to an electronic device, and more particularly to an electronic device having a flexible circuit substrate piercing frame.
針對多媒體社會之急速進步，多半受惠於半導體元件或顯示裝置之快速發展。就顯示元件而言，陰極顯示管(或稱映像管，Cathode Ray Tube，CRT)因具有優異之顯示品質及經濟性而一直獨佔了顯示器市場。然而，CRT有體積過大與消耗過多能源的問題，對於高畫質、低消耗電功率、薄型量產、低電壓驅動、體積小等要求而言，CRT式的顯示器顯然無法達成此要求。針對此一點，液晶顯示器(Liquid Crystal Display，簡稱LCD)將有很大的優勢，而LCD已經廣泛地應用於中、小型可攜式電視、影像電話、攝錄放影機、筆記型電腦、桌上型顯示器、平板電腦以及投影彩色電視等。 For the rapid advancement of the multimedia society, most of them benefit from the rapid development of semiconductor components or display devices. In terms of display elements, cathode display tubes (or cathode tubes, Cathode Ray Tubes, CRTs) have consistently dominated the display market due to their superior display quality and economy. However, CRTs have the problem of excessive volume and excessive energy consumption. For high image quality, low power consumption, thin mass production, low voltage driving, small size, etc., CRT-type displays obviously cannot achieve this requirement. In view of this, liquid crystal display (LCD) will have great advantages, and LCD has been widely used in small and medium-sized portable TVs, video phones, video recorders, notebook computers, and tables. Top-size displays, tablets, and projection color TVs.
一般而言，液晶顯示器需要背光模組以提供光源，背光模組係包含一框體以及容設於框體內的光源模組。框體具有一破孔，破孔用以供光源模組的一軟排線穿設，因此破孔的開孔尺寸係對應於軟排線的寬度及厚度。然而於實務上，顯示模組的軟排線並非都是直線延伸的，譬如軟排線可能是具有彎曲的外形。如此一來，破孔的開孔尺寸勢必要相對增大，以使得具有彎曲外形的軟排線能夠順利穿過。但相對的，破孔的開孔尺寸一但增大，將使 得框體的剛性強度下降，造成液晶顯示器之框體結構強度不足的問題。 In general, a liquid crystal display requires a backlight module to provide a light source, and the backlight module includes a frame and a light source module housed in the frame. The frame body has a hole, and the hole is used for a soft line of the light source module. Therefore, the size of the hole of the hole corresponds to the width and thickness of the line. However, in practice, the flexible cable of the display module does not all extend in a straight line, for example, the flexible cable may have a curved shape. As a result, the opening size of the hole must be relatively increased, so that the flexible wire having the curved shape can pass smoothly. But the opposite, the size of the hole in the hole is increased, it will make The rigidity of the frame is lowered, resulting in a problem of insufficient strength of the frame structure of the liquid crystal display.
本發明在於提供一種電子裝置，藉以提升框體的結構強度。 The present invention provides an electronic device for improving the structural strength of a frame.
本發明所揭露之電子裝置，包含一軟性電路基材及一框體。軟性電路基材包含一本體以及自本體延伸的一分支部，分支部具有依序相連的一第一段、一彎曲段及一第二段。第一段連接本體，第一段具有一端緣連接彎曲段的一彎曲內緣。第一段的端緣與本體具有一交點，交點與彎曲段的最大距離定義為一迴轉半徑。框體包含一底板以及豎立於底板一端的一側板。側板上具有一第一破孔，底板具有一第二破孔及一第三破孔。第二破孔連接第一破孔，第三破孔連接第二破孔，且第三破孔位於第二破孔相對於第一破孔的一端。軟性電路基材的本體位於底板上，分支部穿設第一破孔。其中，第一破孔的長度大於或等於第一段的寬度，第一破孔的寬度大於或等於第一段的厚度，第二破孔的長度大於或等於第一段的寬度，第三破孔的長度大於或等於迴轉半徑，第三破孔的寬度大於或等於分支部的最大厚度。 The electronic device disclosed in the present invention comprises a flexible circuit substrate and a frame. The flexible circuit substrate comprises a body and a branch extending from the body, the branch portion having a first segment, a curved segment and a second segment sequentially connected. The first section connects the body, and the first section has a curved inner edge connecting one end edge to the curved section. The end edge of the first segment has an intersection with the body, and the maximum distance between the intersection and the curved segment is defined as a radius of gyration. The frame comprises a bottom plate and a side plate erected at one end of the bottom plate. The side plate has a first hole, and the bottom plate has a second hole and a third hole. The second hole is connected to the first hole, the third hole is connected to the second hole, and the third hole is located at one end of the second hole relative to the first hole. The body of the flexible circuit substrate is located on the bottom plate, and the branch portion is provided with the first hole. The length of the first hole is greater than or equal to the width of the first segment, the width of the first hole is greater than or equal to the thickness of the first segment, and the length of the second hole is greater than or equal to the width of the first segment, and the third is broken. The length of the hole is greater than or equal to the radius of gyration, and the width of the third hole is greater than or equal to the maximum thickness of the branch portion.
根據上述本發明所揭露之電子裝置，係藉由第一破孔、第二破孔及第三破孔的特殊相對位置之設置，且第一破孔的長度大於或等於第一段的寬度，第一破孔的寬度大於或等於第一段的厚度，第二破孔的長度大於或等於第一段的寬度，第三破孔的長度大於或等於迴轉半徑，第三破孔的寬度大於或等於分支部的最大 厚度。並且，第三破孔可與側板保持一距離。如此，令軟性電路基材的分支部能夠順利穿設第一破孔，並可同時兼顧框體的結構強度。 According to the above described electronic device of the present invention, the first relative hole, the second hole and the third hole are disposed at a specific relative position, and the length of the first hole is greater than or equal to the width of the first segment. The width of the first hole is greater than or equal to the thickness of the first segment, the length of the second hole is greater than or equal to the width of the first segment, the length of the third hole is greater than or equal to the radius of gyration, and the width of the third hole is greater than or Equal to the maximum branch thickness. Also, the third hole can be kept at a distance from the side plate. In this way, the branch portion of the flexible circuit substrate can be smoothly passed through the first hole, and the structural strength of the frame can be simultaneously considered.
有關本發明的特徵、實作與功效，茲配合圖式作最佳實施例詳細說明如下。 The features, implementations, and utilities of the present invention are described in detail below with reference to the drawings.
請參照第1圖至第3圖，第1圖係為根據本發明一實施例之電子裝置的局部立體結構圖，第2圖係為根據第1圖之電子裝置的結構分解圖，第3圖係為根據第1圖之電子裝置的結構側視圖。 1 to 3, FIG. 1 is a partial perspective structural view of an electronic device according to an embodiment of the present invention, and FIG. 2 is an exploded view of the electronic device according to FIG. 1, FIG. It is a side view of the structure of the electronic device according to Fig. 1.
本實施例之電子裝置10，以係以顯示器內的背光模組為例，但不以此為限。本實施例之電子裝置10適用於其他具有軟性電路基材穿設框體之結構的裝置。 The electronic device 10 of the present embodiment is exemplified by a backlight module in the display, but is not limited thereto. The electronic device 10 of the present embodiment is suitable for other devices having a structure in which a flexible circuit substrate is pierced.
電子裝置10可包含一框體11、一軟性電路基材12及一導光板13。框體11包含一底板111以及豎立於底板111一端的一側板112。並且，在本實施例中，框體11可另包含一頂板113，頂板113連接側板112相對於底板111的一端。更進一步來說，底板111與頂板113分別連接側板112的相對兩端，且側板112實質上可垂直底板111及頂板113，底板111與頂板113實質上為平行。 The electronic device 10 can include a frame 11 , a flexible circuit substrate 12 , and a light guide plate 13 . The frame 11 includes a bottom plate 111 and a side plate 112 standing at one end of the bottom plate 111. Moreover, in the embodiment, the frame 11 may further include a top plate 113, and the top plate 113 connects one end of the side plate 112 with respect to the bottom plate 111. Furthermore, the bottom plate 111 and the top plate 113 are respectively connected to opposite ends of the side plate 112, and the side plate 112 is substantially perpendicular to the bottom plate 111 and the top plate 113, and the bottom plate 111 and the top plate 113 are substantially parallel.
側板112上具有一第一破孔1101，底板111具有一第二破孔1102及一第三破孔1103。第二破孔1102連接第一破孔1101，第三破孔1103連接第二破孔1102，且第三破孔1103位於第二破孔1102相對於第一破孔1101的一端。進一步來說，第二破孔1102 係介於第一破孔1101與第三破孔1103之間，且第三破孔1103與側板112保持一距離。並且，第二破孔1102的延伸方向(係實質上垂直於側板112)與第三破孔1103的延伸方向(係實質上平行於側板112)實質上正交。 The side plate 112 has a first hole 1101, and the bottom plate 111 has a second hole 1102 and a third hole 1103. The second hole 1102 is connected to the first hole 1101 , the third hole 1103 is connected to the second hole 1102 , and the third hole 1103 is located at one end of the second hole 1102 relative to the first hole 1101 . Further, the second hole 1102 The first hole 1101 and the third hole 1103 are between the third hole 1103 and the third hole 1103 is kept at a distance from the side plate 112. Moreover, the extending direction of the second hole 1102 (which is substantially perpendicular to the side plate 112) and the extending direction of the third hole 1103 (which are substantially parallel to the side plate 112) are substantially orthogonal.
軟性電路基材12可為一軟性印刷電路板(Flexible Printed Circuit，FPC)，其包含一本體121以及自本體121延伸的一分支部122。本體121具有相對的一第一表面1211與一第二表面1212。本體121可另包含複數個發光元件1213，發光元件1213例如可以是但不限於發光二極體，這些發光元件1213配置於第二表面1212上。 The flexible circuit substrate 12 can be a flexible printed circuit (FPC) including a body 121 and a branch portion 122 extending from the body 121. The body 121 has a first surface 1211 and a second surface 1212 opposite to each other. The body 121 can further include a plurality of light-emitting elements 1213. The light-emitting elements 1213 can be, for example, but not limited to, light-emitting diodes. The light-emitting elements 1213 are disposed on the second surface 1212.
分支部122具有依序相連的一第一段1221、一彎曲段1223及一第二段1222，意即分支部122係為一彎曲的外型。進一步來說，分支部122的第一段1221係朝垂直於本體121的方向A延伸至彎曲段1223，第二段1222由彎曲段1223而朝平行於本體121的方向B延伸。因此，使得第一段1221的延伸方向與第二段1222的延伸方向實質上正交。此外，在本實施例中，軟性電路基材12可另包含一連接部123，分支部122介於連接部123與本體121之間，意即連接部123連接於分支部122相對本體121之一端。進一步來說，連接部123的表面例如可設置有多個導電片1231，使連接部123可作為一電性接頭。連接部123用以連接一驅動板材(未繪示)，驅動板材譬如可以是顯示器內的一驅動電路板。 The branch portion 122 has a first segment 1221, a curved segment 1223 and a second segment 1222 connected in sequence, that is, the branch portion 122 is a curved shape. Further, the first segment 1221 of the branch portion 122 extends toward the curved portion 1223 in a direction A perpendicular to the body 121, and the second segment 1222 extends from the curved portion 1223 toward the direction B parallel to the body 121. Therefore, the extending direction of the first segment 1221 is made substantially orthogonal to the extending direction of the second segment 1222. In addition, in the embodiment, the flexible circuit substrate 12 may further include a connecting portion 123. The branch portion 122 is interposed between the connecting portion 123 and the body 121, that is, the connecting portion 123 is connected to the branch portion 122 opposite to the body 121. . Further, the surface of the connecting portion 123 can be provided with a plurality of conductive sheets 1231, for example, so that the connecting portion 123 can serve as an electrical connector. The connecting portion 123 is connected to a driving plate (not shown), and the driving plate can be, for example, a driving circuit board in the display.
此外，在本實施例中，軟性電路基材12的本體121、分支部 122及連接部123可以是一體成形，且本體121、分支部122及連接部123也可具有相同的厚度，但上述一體成形以及厚度的特徵非用以限定本發明。在其他實施例中，本體121、分支部122及連接部123也可非一體成形而以搭接的方式電性相連，且本體121、分支部122及連接部123的厚度也可相異。 Further, in the present embodiment, the body 121 and the branch portion of the flexible circuit substrate 12 are provided. The connecting portion 123 and the connecting portion 123 may be integrally formed, and the body 121, the branch portion 122, and the connecting portion 123 may have the same thickness, but the above-described integral forming and thickness features are not intended to limit the present invention. In other embodiments, the body 121, the branch portion 122, and the connecting portion 123 may not be integrally formed and electrically connected in an overlapping manner, and the thickness of the body 121, the branch portion 122, and the connecting portion 123 may also be different.
此外，本實施例之軟性電路基材12的本體121係位於框體11的底板111上，且第一表面1211面對底板111。軟性電路基材12的分支部122穿設側板112的第一破孔1101，使得本體121位於框體11內，而大部分的分支部122與連接部123位於框體11外。 In addition, the body 121 of the flexible circuit substrate 12 of the present embodiment is located on the bottom plate 111 of the frame 11, and the first surface 1211 faces the bottom plate 111. The branch portion 122 of the flexible circuit substrate 12 is disposed through the first hole 1101 of the side plate 112 such that the body 121 is located in the frame 11 and most of the branch portion 122 and the connecting portion 123 are located outside the frame 11.
此外，本實施例之導光板13可包含一底面132、一側面133及一頂面131。頂面131與底面132位於導光板13的相對兩側，側面133介於頂面131與底面132之間，且側面133的相對兩端分別連接頂面131與底面132。在本實施例中，頂面131與底面132實質上係平行，側面133實質上正交於頂面131與底面132。導光板13配置於框體11的底板111上，且底面132面對框體11的底板111，側面133面對這些發光元件1213。此外，框體11的頂板113疊置於導光板13的部分頂面131上，使得導光板13的一端被夾設於頂板113與底板111之間而達到挾持固定的效果。並且，藉由框體11的頂板113疊置並遮蔽導光板13的部分頂面131，可避免發生漏光的現象。 In addition, the light guide plate 13 of the embodiment may include a bottom surface 132, a side surface 133, and a top surface 131. The top surface 131 and the bottom surface 132 are located on opposite sides of the light guide plate 13 , the side surface 133 is between the top surface 131 and the bottom surface 132 , and the opposite ends of the side surface 133 are respectively connected to the top surface 131 and the bottom surface 132 . In the present embodiment, the top surface 131 and the bottom surface 132 are substantially parallel, and the side surface 133 is substantially orthogonal to the top surface 131 and the bottom surface 132. The light guide plate 13 is disposed on the bottom plate 111 of the frame 11, and the bottom surface 132 faces the bottom plate 111 of the frame 11, and the side surface 133 faces the light-emitting elements 1213. In addition, the top plate 113 of the frame 11 is stacked on a portion of the top surface 131 of the light guide plate 13, so that one end of the light guide plate 13 is sandwiched between the top plate 113 and the bottom plate 111 to achieve the effect of holding and fixing. Moreover, by stacking and shielding the partial top surface 131 of the light guide plate 13 by the top plate 113 of the frame 11, the phenomenon of light leakage can be avoided.
請接著參照第4A圖並同時搭配第2圖，第4A圖係為根據第2圖之軟性電路基材的上視圖。 Please refer to FIG. 4A and FIG. 2 together. FIG. 4A is a top view of the flexible circuit substrate according to FIG. 2.
詳細來說，本實施例之軟性電路基材12的分支部122的彎曲段1223具有相對的一彎曲內緣1225及一彎曲外緣1226，彎曲內緣1225的長度小於彎曲外緣1226的長度。其中，本實施例之彎曲內緣1225與彎曲外緣1226係分別為一直角側邊，但彎曲內緣1225與彎曲外緣1226的外型非用以限定本發明。舉例來說，在另一實施例中，軟性電路基材12a的彎曲段1223a之彎曲內緣1225a與彎曲外緣1226a也可以分別是一弧形邊，如第4B圖所示。或者，在另一實施例中，軟性電路基材12b的彎曲段1223b之彎曲內緣1225b與彎曲外緣1226b也可以分別是一斜邊，如第4C圖所示。 In detail, the curved section 1223 of the branch portion 122 of the flexible circuit substrate 12 of the present embodiment has an opposite curved inner edge 1225 and a curved outer edge 1226, and the length of the curved inner edge 1225 is smaller than the length of the curved outer edge 1226. The curved inner edge 1225 and the curved outer edge 1226 of the present embodiment are respectively right-angled sides, but the outer shape of the curved inner edge 1225 and the curved outer edge 1226 are not intended to limit the present invention. For example, in another embodiment, the curved inner edge 1225a and the curved outer edge 1226a of the curved section 1223a of the flexible circuit substrate 12a may also be a curved edge, respectively, as shown in FIG. 4B. Alternatively, in another embodiment, the curved inner edge 1225b and the curved outer edge 1226b of the curved section 1223b of the flexible circuit substrate 12b may also be a beveled edge, respectively, as shown in FIG. 4C.
此外，本實施例之第一段1221具有一端緣1227連接彎曲段1223的彎曲內緣1225，且端緣1227與本體121具有一交點1228。進一步來說，交點1228即為端緣1227相交於本體121之處。交點1228與彎曲段1223的最大距離定義為一迴轉半徑R。進一步來說，本實施例之彎曲段1223距離交點1228最遠的位置係位於彎曲段1223的彎曲外緣1226上。此外，迴轉半徑R的尺寸係對應於第三破孔1103的尺寸，至於尺寸的對應關係將於後續進行詳述。 In addition, the first segment 1221 of the present embodiment has a curved inner edge 1225 connecting the one end edge 1227 to the curved portion 1223, and the end edge 1227 has an intersection 1228 with the body 121. Further, the intersection 1228 is where the end edge 1227 intersects the body 121. The maximum distance between the intersection 1228 and the curved section 1223 is defined as a radius of gyration R. Further, the position of the curved section 1223 of the present embodiment that is furthest from the intersection 1228 is located on the curved outer edge 1226 of the curved section 1223. Further, the size of the radius of gyration R corresponds to the size of the third hole 1103, and the correspondence of the dimensions will be described later in detail.
請接著參照第5圖至第7圖並同時搭配第2圖及第4A圖，第5圖係為根據第2圖之框體的正視圖，第6圖係為根據第2圖之框體的下視圖，第7圖係為根據第2圖之框體的上視圖。 Please refer to Fig. 5 to Fig. 7 together with Fig. 2 and Fig. 4A, Fig. 5 is a front view of the frame according to Fig. 2, and Fig. 6 is a frame according to Fig. 2 The lower view, Fig. 7 is a top view of the frame according to Fig. 2.
詳細來說，在本實施例中，第一破孔1101的長度L1大於或等於分支部122之第一段1221的寬度W0，第一破孔1101的寬度 W1大於或等於分支部122之第一段1221的厚度，以令第一段1221能夠順利穿設第一破孔1101而避免產生干涉。 In detail, in the embodiment, the length L1 of the first hole 1101 is greater than or equal to the width W0 of the first segment 1221 of the branch portion 122, and the width of the first hole 1101. W1 is greater than or equal to the thickness of the first segment 1221 of the branch portion 122, so that the first segment 1221 can smoothly pass through the first hole 1101 to avoid interference.
此外，第二破孔1102的長度L2大於或等於分支部122之第一段1221的寬度W0。並且較佳的，第二破孔1102的長度L2實質上等於第一破孔1101的長度L1。如此，可提供軟性電路基材12於組裝時的定位效果，以避免軟性電路基材12的偏移而提升作業員於組裝時的速度。並且，頂板113的寬度W4可小於第二破孔1102的寬度W2(如第7圖所示)，使得作業員俯視框體11時即可看見第二破孔1102的位置，以利於作為組裝軟性電路基材12的定位依據。 Further, the length L2 of the second hole 1102 is greater than or equal to the width W0 of the first segment 1221 of the branch portion 122. And preferably, the length L2 of the second hole 1102 is substantially equal to the length L1 of the first hole 1101. In this way, the positioning effect of the flexible circuit substrate 12 at the time of assembly can be provided, thereby avoiding the offset of the flexible circuit substrate 12 and improving the speed of the operator at the time of assembly. Moreover, the width W4 of the top plate 113 can be smaller than the width W2 of the second hole 1102 (as shown in FIG. 7), so that the operator can see the position of the second hole 1102 when looking down the frame body 11 to facilitate assembly softness. The positioning of the circuit substrate 12 is based on.
此外，以第6圖為視角來看，第三破孔1103係朝第二破孔1102的左側延伸，且第三破孔1103的延伸方向與第二破孔1102的延伸方向實質上正交。需注意的是，第三破孔1103相對第二破孔1102的延伸方向非用以限定本發明。舉例來說，在其他實施例中，第三破孔1103也可朝第二破孔1102的右側延伸(如第8圖所示)，或者第三破孔1103也可朝第二破孔1102的左右兩側延伸(如第9圖所示)。並且，本實施例之第三破孔1103的長度L3大於或等於迴轉半徑R，第三破孔1103的寬度W3大於或等於分支部122及連接部123的最大厚度。如此，以令分支部122及連接部123於組裝過程中皆能夠順利穿過第三破孔1103。至於軟性電路基材12的分支部122如何透過第一破孔1101、第二破孔1102及第三破孔1103的設置而順利穿設於第一破孔1101，將於後續進行描述。 Further, from the perspective of FIG. 6, the third hole 1103 extends toward the left side of the second hole 1102, and the extending direction of the third hole 1103 is substantially orthogonal to the extending direction of the second hole 1102. It should be noted that the direction in which the third hole 1103 extends relative to the second hole 1102 is not intended to limit the present invention. For example, in other embodiments, the third hole 1103 may also extend toward the right side of the second hole 1102 (as shown in FIG. 8), or the third hole 1103 may also face the second hole 1102. Extend the left and right sides (as shown in Figure 9). Moreover, the length L3 of the third hole 1103 of the embodiment is greater than or equal to the radius of gyration R, and the width W3 of the third hole 1103 is greater than or equal to the maximum thickness of the branch portion 122 and the connecting portion 123. In this way, the branch portion 122 and the connecting portion 123 can smoothly pass through the third hole 1103 during assembly. How the branch portion 122 of the flexible circuit substrate 12 passes through the first hole 1101, the second hole 1102, and the third hole 1103 is smoothly passed through the first hole 1101, which will be described later.
請接著參照第10A圖至第10D圖，第10A圖至第10D圖為本發明之軟性電路基材組裝於框體的示意圖。 Please refer to FIG. 10A to FIG. 10D. FIG. 10A to FIG. 10D are schematic diagrams showing the assembly of the flexible circuit substrate of the present invention in the frame.
當作業員欲將軟性電路基材12組設於框體11時，係先將軟性電路基材12以斜插的方式而將分支部122之第二段1222連同連接部123穿過底板111上的第三破孔1103，如第10A圖所示。 When the operator wants to assemble the flexible circuit substrate 12 to the frame 11, the second circuit portion 1222 of the branch portion 122 and the connecting portion 123 are passed through the bottom plate 111 by obliquely inserting the flexible circuit substrate 12 first. The third hole 1103 is as shown in Fig. 10A.
接著將分支部122之第一段1221的交點1228抵靠於第三破孔1103的端邊，並以交點1228為旋轉圓心而令軟性電路基材12逆時針旋轉，如第10B圖所示。 Next, the intersection 1228 of the first segment 1221 of the branch portion 122 is abutted against the end edge of the third hole 1103, and the flexible circuit substrate 12 is rotated counterclockwise with the intersection 1228 as the center of rotation, as shown in FIG. 10B.
此時，由於第三破孔1103的長度L3大於或等於迴轉半徑R，因此分支部122的彎曲段1223於旋轉過程中並不會與底板111產生干涉，使得軟性電路基材12能夠轉正而令分支部122的第一段1221及彎曲段1223皆能順利穿過第三破孔1103，如第10C圖所示。 At this time, since the length L3 of the third hole 1103 is greater than or equal to the radius gyration R, the curved portion 1223 of the branch portion 122 does not interfere with the bottom plate 111 during the rotation, so that the flexible circuit substrate 12 can be turned positive. The first segment 1221 and the curved segment 1223 of the branch portion 122 can smoothly pass through the third hole 1103 as shown in FIG. 10C.
接著，使分支部122之第一段1221沿著第二破孔1102而朝第一破孔1101位移，以使分支部122之第一段1221穿設出第一破孔1101，以完成組裝，如第10D圖所示。 Next, the first segment 1221 of the branch portion 122 is displaced along the second hole 1102 toward the first hole 1101, so that the first segment 1221 of the branch portion 122 is passed through the first hole 1101 to complete the assembly. As shown in Figure 10D.
進一步來說，本實施例係藉由第三破孔1103相較於第一破孔1101及第二破孔1102具有較長的長度，以供分支部122的第一段1221及彎曲段1223能夠順利穿設。並且，藉由第二破孔1102的設置，使分支部122之第一段1221能夠沿著第二破孔1102而位移至第一破孔1101，而達到第一段1221能夠順利穿設出第一破孔1101的功效。如此一來，雖第三破孔1103具有較長的長度，但由 於第三破孔1103係與側板112保持一距離，因此較不會降低整體框體11的結構強度。相較於習知框體只於側板開設較大且較長的單一破孔來供具有彎曲造型的軟排線穿設，使得習知框體的結構強度大幅降低，本實施例之框體11的破孔結構確實能夠有效提升整體框體11的結構強度。 Further, in the embodiment, the third hole 1103 has a longer length than the first hole 1101 and the second hole 1102, so that the first segment 1221 and the curved segment 1223 of the branch portion 122 can Smoothly dressed. And, by providing the second hole 1102, the first segment 1221 of the branch portion 122 can be displaced along the second hole 1102 to the first hole 1101, and the first segment 1221 can be smoothly disposed. The effect of a broken hole 1101. As a result, although the third hole 1103 has a longer length, The third hole 1103 is kept at a distance from the side plate 112, so that the structural strength of the entire frame 11 is not lowered. Compared with the conventional frame, only a large and long single hole is formed in the side plate for the flexible cable with a curved shape, so that the structural strength of the conventional frame is greatly reduced, and the frame 11 of the embodiment is reduced. The perforated structure can effectively improve the structural strength of the entire frame 11.
根據上述一實施例之電子裝置，係藉由第一破孔、第二破孔及第三破孔的特殊相對位置之設置，且第一破孔的長度大於或等於第一段的寬度，第一破孔的寬度大於或等於第一段的厚度，第二破孔的長度大於或等於第一段的寬度，第三破孔的長度大於或等於迴轉半徑，第三破孔的寬度大於或等於分支部的最大厚度。並且，第三破孔可與側板保持一距離。如此，令軟性電路基材的分支部能夠順利穿設第一破孔，並可同時兼顧框體的結構強度。 The electronic device according to the above embodiment is configured by the special relative positions of the first hole, the second hole and the third hole, and the length of the first hole is greater than or equal to the width of the first segment, The width of a broken hole is greater than or equal to the thickness of the first segment, the length of the second hole is greater than or equal to the width of the first segment, the length of the third hole is greater than or equal to the radius of gyration, and the width of the third hole is greater than or equal to The maximum thickness of the branch. Also, the third hole can be kept at a distance from the side plate. In this way, the branch portion of the flexible circuit substrate can be smoothly passed through the first hole, and the structural strength of the frame can be simultaneously considered.
雖然本發明以前述之較佳實施例揭露如上，然其並非用以限定本發明，任何熟習相像技藝者，在不脫離本發明之精神和範圍內，當可作些許之更動與潤飾，因此本發明之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。 While the present invention has been described above in terms of the preferred embodiments thereof, it is not intended to limit the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The patent protection scope of the invention is subject to the definition of the scope of the patent application attached to the specification.
10‧‧‧電子裝置 10‧‧‧Electronic devices
11‧‧‧框體 11‧‧‧ frame
1101‧‧‧第一破孔 1101‧‧‧ first hole
1102‧‧‧第二破孔 1102‧‧‧Second hole
1103‧‧‧第三破孔 1103‧‧‧ third hole
111‧‧‧底板 111‧‧‧floor
112‧‧‧側板 112‧‧‧ side panels
113‧‧‧頂板 113‧‧‧ top board
12‧‧‧軟性電路基材 12‧‧‧Soft circuit substrate
12a‧‧‧軟性電路基材 12a‧‧‧Soft circuit substrate
12b‧‧‧軟性電路基材 12b‧‧‧Soft circuit substrate
121‧‧‧本體 121‧‧‧Ontology
1211‧‧‧第一表面 1211‧‧‧ first surface
1212‧‧‧第二表面 1212‧‧‧ second surface
1213‧‧‧發光元件 1213‧‧‧Lighting elements
122‧‧‧分支部 122‧‧‧ Branch
1221‧‧‧第一段 First paragraph of 1221‧‧
1222‧‧‧第二段 1222‧‧‧ second paragraph
1223‧‧‧彎曲段 1223‧‧‧Bend section
1223a‧‧‧彎曲段 1223a‧‧‧Bend section
1223b‧‧‧彎曲段 1223b‧‧‧Bend section
1225‧‧‧彎曲內緣 1225‧‧‧Bending inner edge
1225a‧‧‧彎曲內緣 1225a‧‧‧Bend inner edge
1225b‧‧‧彎曲內緣 1225b‧‧‧Bending inner edge
1226‧‧‧彎曲外緣 1226‧‧‧Bending rim
1226a‧‧‧彎曲外緣 1226a‧‧‧Bend rim
1226b‧‧‧彎曲外緣 1226b‧‧‧Bending rim
1227‧‧‧端緣 1227‧‧‧ edge
1228‧‧‧交點 1228‧‧‧ intersection
123‧‧‧連接部 123‧‧‧Connecting Department
1231‧‧‧導電片 1231‧‧‧Conductor
13‧‧‧導光板 13‧‧‧Light guide plate
131‧‧‧頂面 131‧‧‧ top surface
132‧‧‧底面 132‧‧‧ bottom
133‧‧‧側面 133‧‧‧ side
第1圖係為根據本發明一實施例之電子裝置的局部立體結構圖。 1 is a partial perspective structural view of an electronic device according to an embodiment of the present invention.
第2圖係為根據第1圖之電子裝置的結構分解圖。 Fig. 2 is an exploded perspective view showing the electronic device according to Fig. 1.
第3圖係為根據第1圖之電子裝置的結構側視圖。 Fig. 3 is a side view showing the structure of the electronic device according to Fig. 1.
第4A圖係為根據第2圖之軟性電路基材的上視圖。 Fig. 4A is a top view of the flexible circuit substrate according to Fig. 2.
第4B圖係為根據本發明另一實施例之軟性電路基材的上視圖。 Figure 4B is a top view of a flexible circuit substrate in accordance with another embodiment of the present invention.
第4C圖係為根據本發明另一實施例之軟性電路基材的上視圖。 Figure 4C is a top view of a flexible circuit substrate in accordance with another embodiment of the present invention.
第5圖係為根據第2圖之框體的正視圖。 Fig. 5 is a front view of the frame according to Fig. 2.
第6圖係為根據第2圖之框體的下視圖。 Figure 6 is a bottom view of the frame according to Figure 2.
第7圖係為根據第2圖之框體的上視圖。 Figure 7 is a top view of the frame according to Figure 2.
第8圖係為根據本發明另一實施例之框體的下視圖。 Figure 8 is a bottom view of a frame according to another embodiment of the present invention.
第9圖係為根據本發明另一實施例之框體的下視圖。 Figure 9 is a bottom view of a frame according to another embodiment of the present invention.
第10A圖至第10D圖為本發明之軟性電路基材組裝於框體的示意圖。 10A to 10D are schematic views showing the assembly of the flexible circuit substrate of the present invention in a frame.
10‧‧‧電子裝置 10‧‧‧Electronic devices
11‧‧‧框體 11‧‧‧ frame
1101‧‧‧第一破孔 1101‧‧‧ first hole
1102‧‧‧第二破孔 1102‧‧‧Second hole
1103‧‧‧第三破孔 1103‧‧‧ third hole
111‧‧‧底板 111‧‧‧floor
112‧‧‧側板 112‧‧‧ side panels
113‧‧‧頂板 113‧‧‧ top board
12‧‧‧軟性電路基材 12‧‧‧Soft circuit substrate
121‧‧‧本體 121‧‧‧Ontology
1211‧‧‧第一表面 1211‧‧‧ first surface
1212‧‧‧第二表面 1212‧‧‧ second surface
1213‧‧‧發光元件 1213‧‧‧Lighting elements
122‧‧‧分支部 122‧‧‧ Branch
1221‧‧‧第一段 First paragraph of 1221‧‧
1222‧‧‧第二段 1222‧‧‧ second paragraph
1223‧‧‧彎曲段 1223‧‧‧Bend section
123‧‧‧連接部 123‧‧‧Connecting Department
1231‧‧‧導電片 1231‧‧‧Conductor
13‧‧‧導光板 13‧‧‧Light guide plate
131‧‧‧頂面 131‧‧‧ top surface
132‧‧‧底面 132‧‧‧ bottom
133‧‧‧側面 133‧‧‧ side
Claims (12)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101129623A TWI481934B (en) | 2012-08-15 | 2012-08-15 | Electronic device |
| CN201210407758.8A CN102914908B (en) | 2012-08-15 | 2012-10-24 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101129623A TWI481934B (en) | 2012-08-15 | 2012-08-15 | Electronic device |
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| Publication Number | Publication Date |
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| TW201407239A true TW201407239A (en) | 2014-02-16 |
| TWI481934B TWI481934B (en) | 2015-04-21 |
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| KR101122216B1 (en) * | 2004-11-29 | 2012-03-19 | 삼성전자주식회사 | Backlight assembly and display apparatus having the same |
| CN100414371C (en) * | 2005-10-21 | 2008-08-27 | 群康科技(深圳)有限公司 | Liquid crystal display apparatus |
| CN100365477C (en) * | 2006-02-16 | 2008-01-30 | 友达光电股份有限公司 | Planar display device |
| JP2008084790A (en) * | 2006-09-28 | 2008-04-10 | Kofu Casio Co Ltd | Surface light source device and image display module employing it |
| TWM321112U (en) * | 2007-05-04 | 2007-10-21 | Innolux Display Corp | Backlight module and liquid crystal display device |
| TWM327033U (en) * | 2007-08-10 | 2008-02-11 | Innolux Display Corp | Liquid crystal display device |
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| TWI481934B (en) | 2015-04-21 |
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