TW201406863A - Polyorganometallosiloxane, curable polymer composition, cured product thereof, and optical semiconductor device - Google Patents

Polyorganometallosiloxane, curable polymer composition, cured product thereof, and optical semiconductor device Download PDF

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TW201406863A
TW201406863A TW102123346A TW102123346A TW201406863A TW 201406863 A TW201406863 A TW 201406863A TW 102123346 A TW102123346 A TW 102123346A TW 102123346 A TW102123346 A TW 102123346A TW 201406863 A TW201406863 A TW 201406863A
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polymer composition
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curable polymer
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Tadashi Okawa
Kazuhiro Nishijima
Kazuhiko Kojima
Haruhiko Furukawa
Masaaki Amako
Nan-Guo Liu
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Dow Corning
Dow Corning Toray Co Ltd
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    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
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    • C08L83/14Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
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    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
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Abstract

A polyorganometallosiloxane comprising a metalloxy unit represented by general formula (1): M1Ox/2 (where M1 is an atom of group 4A or group 5A of the periodic table, and ''x'' is the valency of M1), a metalloxy unit represented by general formula (2): M2Oy/2 (where M2 is an atom of group 2A or group 2B of the periodic table, and ''y'' is the valency of M2), and an organosiloxane unit represented by general formula (3): R1aSiO(4-a)/2 (where R1 is an alkyl group, an alkenyl group, a phenyl group, an aralkyl group, or a hydrogen atom, and ''a'' is a number satisfying: 0 < a ≤ 3), and a curable polymer composition which contains this polyorganometallosiloxane and is cured by a hydrosilylation reaction to form a cured product with a high refractive index, high visible light transmittance, and excellent heat resistance and moisture resistance.

Description

聚有機金屬矽氧烷、可固化聚合物組成物,其固化產物及光學半導體裝置 Polyorganometalloxane, curable polymer composition, cured product thereof and optical semiconductor device

本發明係關於聚有機金屬矽氧烷、含有該聚有機金屬矽氧烷之可固化聚合物組成物、該組成物之固化產物及使用該組成物之光學半導體裝置。 The present invention relates to a polyorganometalloxane, a curable polymer composition containing the polyorganometalloxane, a cured product of the composition, and an optical semiconductor device using the composition.

業內需要具有高折射率及極佳長期穩定性特徵(例如可見光透射率、耐熱性及耐濕性)之材料作為用於諸如LED等光學半導體裝置之密封劑。已提議將以下組成物作為該密封劑:樹脂組成物,其包含主要包括由RmMO(x-m)/2表示之單元之聚雜矽氧烷樹脂(其中M係選自第四至第六週期中屬於週期表之第2A族至第5A族之原子之群之原子,R表示選自以下各項之基團:氫原子、羥基、胺基或經取代或未經取代之脂肪族基團、脂環族基團、芳基、雜環基團或該等基團經由氧鍵結至M原子之基團,x表示M原子之化合價,且「m」表示0或1至x-1之整數)(參見以下專利文件1);以及可固化組成物,其包含分子中具有至少2個烯基之甲矽烷基化聚金屬矽氧烷、分子中具有至少2個鍵結矽之氫原子且不具有矽氧烷鍵之化合物及固化觸媒(參見以下專利文件2)。 Materials having high refractive index and excellent long-term stability characteristics such as visible light transmittance, heat resistance, and moisture resistance are required in the industry as a sealant for optical semiconductor devices such as LEDs. The following composition has been proposed as the sealant: a resin composition comprising a polypyridoxane resin mainly comprising a unit represented by R m MO (xm)/2 (wherein M is selected from the fourth to sixth cycles) An atom belonging to the group of atoms of Groups 2A to 5A of the periodic table, and R represents a group selected from a hydrogen atom, a hydroxyl group, an amine group or a substituted or unsubstituted aliphatic group, An alicyclic group, an aryl group, a heterocyclic group or a group bonded to a group of an M atom via an oxygen, x represents a valence of the M atom, and "m" represents an integer of 0 or 1 to x-1 (See Patent Document 1 below); and a curable composition comprising a formazanylated polymetalloxane having at least 2 alkenyl groups in the molecule, a hydrogen atom having at least 2 bonded ruthenium in the molecule and not A compound having a decane bond and a curing catalyst (see Patent Document 2 below).

然而,該等密封劑之問題在於,所得固化產物之耐熱性及耐濕性不充足,此致使固化產物變色從而導致在高溫或高濕之條件下變色或機械強度降低。亦存在之問題在於,當嘗試提高密封劑之折射率時,固化產物變得堅硬且易碎,此導致不充足之穩定性及機械特徵。 However, such a sealant has a problem in that heat resistance and moisture resistance of the resulting cured product are insufficient, which causes discoloration of the cured product to cause discoloration or deterioration of mechanical strength under conditions of high temperature or high humidity. A problem also exists in that when attempting to increase the refractive index of the sealant, the cured product becomes hard and brittle, which results in insufficient stability and mechanical characteristics.

專利文件1:日本未審查專利申請公開案第2000-235103A號。 Patent Document 1: Japanese Unexamined Patent Application Publication No. 2000-235103A.

專利文件2:日本未審查專利申請公開案第2009-173910A號。 Patent Document 2: Japanese Unexamined Patent Application Publication No. 2009-173910A.

本發明之目標係提供具有高折射率及極佳耐熱性、耐濕性以及與有機聚合物之相容性之聚有機金屬矽氧烷。本發明之另一目標係提供可固化聚合物組成物,其係藉由矽氫化反應固化從而形成具有高折射率以及極佳可見光透射率、耐熱性及耐濕性之固化產物。本發明之另一目標係提供具有高折射率以及極佳可見光透射率、耐熱性及耐濕性之固化產物。本發明之再一目標係提供使用此可固化聚合物組成物之高度可靠之光學半導體裝置。 The object of the present invention is to provide a polyorganometalloxane having a high refractive index and excellent heat resistance, moisture resistance and compatibility with an organic polymer. Another object of the present invention is to provide a curable polymer composition which is cured by a hydrogenation reaction to form a cured product having a high refractive index and excellent visible light transmittance, heat resistance and moisture resistance. Another object of the present invention is to provide a cured product having a high refractive index and excellent visible light transmittance, heat resistance and moisture resistance. Still another object of the present invention is to provide a highly reliable optical semiconductor device using the curable polymer composition.

本發明聚有機金屬矽氧烷包含由以下通式(1)表示之金屬氧基單元:M1Ox/2 The polyorganometalloxane of the present invention contains a metal oxy unit represented by the following general formula (1): M 1 O x/2

(其中M1係週期表之第4A族或第5A族之原子,且「x」係M1之化合價);由以下通式(2)表示之金屬氧基單元:M2Oy/2 (wherein M 1 is an atom of Group 4A or Group 5A of the periodic table, and "x" is a valence of M 1 ); a metal oxy unit represented by the following formula (2): M 2 O y/2

(其中M2係週期表之第2A族或第2B族之原子,且「y」係M2之化合價);及由以下通式(3)表示之有機矽氧烷單元:R1 aSiO(4-a)/2 (wherein M 2 is an atom of Group 2A or Group 2B of the periodic table, and "y" is a valence of M 2 ); and an organic oxirane unit represented by the following formula (3): R 1 a SiO ( 4-a)/2

(其中R1係烷基、烯基、芳基、芳烷基或氫原子,且「a」係滿 足:0<a3之數值)。 (wherein R 1 is an alkyl group, an alkenyl group, an aryl group, an arylalkyl group or a hydrogen atom, and "a" is satisfied: 0 < a 3 values).

此外,本發明可固化聚合物組成物含有上述聚有機金屬矽氧烷且係藉由矽氫化反應固化。 Further, the curable polymer composition of the present invention contains the above polyorganometalloxane and is cured by a hydrogenation reaction.

此外,本發明固化產物係藉由固化可固化聚合物組成物形成。 Further, the cured product of the present invention is formed by curing a curable polymer composition.

另外,本發明光學半導體裝置係藉由利用上述可固化聚合物組成物之固化產物覆蓋或密封光學半導體元件形成。 Further, the optical semiconductor device of the present invention is formed by covering or sealing an optical semiconductor element with a cured product of the above-mentioned curable polymer composition.

發明效應Invention effect

本發明聚有機金屬矽氧烷具有高折射率及極佳耐熱性、耐濕性及與有機聚合物之相容性。此外,本發明可固化聚合物組成物係藉由矽氫化反應固化從而形成具有高折射率及極佳可見光透射率、耐熱性及耐濕性之固化產物。此外,本發明固化產物具有高折射率及極佳可見光透射率、耐熱性及耐濕性。此外,本發明光學半導體裝置展現極佳可靠性。 The polyorganometalloxane of the present invention has a high refractive index and excellent heat resistance, moisture resistance and compatibility with an organic polymer. Further, the curable polymer composition of the present invention is cured by a hydrogenation reaction to form a cured product having a high refractive index and excellent visible light transmittance, heat resistance and moisture resistance. Further, the cured product of the present invention has a high refractive index and excellent visible light transmittance, heat resistance and moisture resistance. Further, the optical semiconductor device of the present invention exhibits excellent reliability.

1‧‧‧聚鄰苯二甲醯胺(PPA)樹脂殼 1‧‧‧Polyphthalic acid (PPA) resin shell

2‧‧‧LED晶片 2‧‧‧LED chip

3‧‧‧內部引線 3‧‧‧Internal leads

4‧‧‧接合線 4‧‧‧bonding line

5‧‧‧可固化聚合物組成物之固化產物 5‧‧‧Curing product of curable polymer composition

圖1係為本發明光學半導體裝置之實例之LED之橫剖面圖。 1 is a cross-sectional view of an LED of an example of an optical semiconductor device of the present invention.

首先,將詳細闡述本發明聚有機金屬矽氧烷。 First, the polyorganometalloxane of the present invention will be explained in detail.

本發明聚有機金屬矽氧烷包含由通式(1):M1Ox/2表示之金屬氧基單元、由通式(2):M2Oy/2表示之金屬氧基單元,及由通式(3):R1 aSiO(4-a)/2表示之有機矽氧烷單元。 The polyorganometalloxane of the present invention comprises a metal oxy unit represented by the formula (1): M 1 O x/2 , a metal oxy unit represented by the formula (2): M 2 O y/2 , and An organooxane unit represented by the formula (3): R 1 a SiO (4-a)/2 .

由通式(1)表示之金屬氧基單元係提高本發明聚有機金屬矽氧烷之折射率之單元。在通式(1)中,M1係週期表之第4A族或第5A族之原子。特定而言,M1係選自第4A族之原子(例如Ti、Zr及Hf)或第5A族之原子(例如V、Nb及Ta)之原子,且較佳地係Ti或Zr。在通式(1)中,「x」表示M1之化合價,其端視原子類型而有所不同,且係1至7之整數。例如,Ti之化合價係3或4,且Zr或Hf之化合價係4。 The metal oxy unit represented by the formula (1) is a unit for increasing the refractive index of the polyorganometalloxane of the present invention. In the formula (1), M 1 is an atom of Group 4A or Group 5A of the periodic table. In particular, M 1 is an atom selected from atoms of Group 4A (eg, Ti, Zr, and Hf) or atoms of Group 5A (eg, V, Nb, and Ta), and is preferably Ti or Zr. In the general formula (1), "x" represents a valence of M 1 , and its terminal differs depending on the atom type, and is an integer of 1 to 7. For example, the valence of Ti is 3 or 4, and the valence of Zr or Hf is 4.

由通式(2)表示之金屬氧基單元係改良本發明聚有機金屬矽氧烷之耐熱性及耐濕性之單元。在通式(2)中,M2係週期表之第2A族或第2B族之原子。特定而言,M2係選自第2A族之原子(例如Ca、Sr及Ba)或第2B族之原子(例如Zn、Cd及Hg)之原子。為確保極佳耐熱性,M2較佳地係Zn、Ca或Ba,且甚至更佳地係Zn。在通式(2)中,「y」表示M2之化合價,其端視原子類型而有所不同,且係1至7之整數。例如,Zn、Ca及Ba之化合價係2。 The metal oxy unit represented by the formula (2) is a unit for improving the heat resistance and moisture resistance of the polyorganometalloxane of the present invention. In the formula (2), M 2 is an atom of Group 2A or Group 2B of the periodic table. In particular, M 2 is an atom selected from atoms of Group 2A (eg, Ca, Sr, and Ba) or atoms of Group 2B (eg, Zn, Cd, and Hg). In order to ensure excellent heat resistance, M 2 is preferably Zn, Ca or Ba, and even more preferably Zn. In the general formula (2), "y" represents a valence of M 2 , and its terminal differs depending on the atom type, and is an integer of 1 to 7. For example, the valence of Zn, Ca, and Ba is 2.

由通式(3)表示之有機矽氧烷單元係改良本發明聚有機金屬矽氧烷之耐熱性、耐濕性及與有機聚合物之相容性之單元。在通式(3)中,R1係烷基、烯基、芳基、芳烷基或氫原子。R1之烷基之實例包括甲基、乙基、丙基及丁基。在該等基團中,較佳者係甲基。Rl之烯基之實例包括乙烯基、烯丙基及丁烯基。在該等基團中,較佳者係乙烯基。R1之芳基之實例包括苯基、萘基、蒽基、菲基、芘基及該等芳基之氫原子經諸如甲基或乙基等烷基取代之芳基;烷氧基,例如甲氧基或乙氧基;或鹵素原子,例如氯原子或溴原子。在該等基團中,較佳者係苯基及萘基。R1之芳烷基之實例包括萘基乙基、萘基丙基、蒽基乙基、菲基乙基、芘基乙基,及芳烷基之氫原子經諸如甲基或乙基等烷基取代之該等芳烷基;烷氧基,例如甲氧基或乙氧基;或鹵素原子,例如氯原子或溴原子。由於可使本發明聚有機金屬矽氧烷具有矽氫化反應性,故較佳者係分子中至少一個R1係烯基或氫原子。 The organooxane unit represented by the formula (3) is a unit for improving the heat resistance, moisture resistance and compatibility with the organic polymer of the polyorganometalloxane of the present invention. In the formula (3), R 1 is an alkyl group, an alkenyl group, an aryl group, an arylalkyl group or a hydrogen atom. Examples of the alkyl group of R 1 include a methyl group, an ethyl group, a propyl group, and a butyl group. Among these groups, a methyl group is preferred. Examples of the alkenyl group of R l include a vinyl group, an allyl group, and a butenyl group. Among these groups, preferred are vinyl groups. Examples of the aryl group of R 1 include a phenyl group, a naphthyl group, an anthracenyl group, a phenanthryl group, a fluorenyl group, and an aryl group in which a hydrogen atom of the aryl group is substituted with an alkyl group such as a methyl group or an ethyl group; an alkoxy group, for example a methoxy or ethoxy group; or a halogen atom such as a chlorine atom or a bromine atom. Among these groups, preferred are phenyl and naphthyl groups. Examples of the aralkyl group of R 1 include a naphthylethyl group, a naphthylpropyl group, a decylethyl group, a phenanthrylethyl group, a decylethyl group, and a hydrogen atom of an aralkyl group via an alkane such as a methyl group or an ethyl group. The aralkyl group is substituted; an alkoxy group such as a methoxy group or an ethoxy group; or a halogen atom such as a chlorine atom or a bromine atom. Since the polyorganometalloxane of the present invention can have a hydrazine hydrogenation reactivity, it is preferably at least one R 1 -alkenyl group or a hydrogen atom in the molecule.

在通式(3)中,「a」係滿足:0<a3之數值且較佳地係滿足:1<a3之數值,從而使得聚有機金屬矽氧烷之折射率較大且使得與有機聚合物之相容性改良。 In the general formula (3), "a" is satisfied: 0 < a The value of 3 is preferably satisfied: 1 < a A value of 3 such that the polyorganometalloxane has a large refractive index and improved compatibility with the organic polymer.

在本發明聚有機金屬矽氧烷中,由通式(1)表示之金屬氧基單元、由通式(2)表示之金屬氧基單元及由通式(3)表示之矽氧烷單元之各別含量並不特別受限制,但由通式(1)表示之金屬氧基單元之含量 對由通式(3)表示之矽氧烷單元之含量之比率較佳地在0.01:1至99:1範圍內且甚至更佳地在0.01:1至19:1範圍內。此外,由通式(2)表示之金屬氧基單元之含量對由通式(3)表示之矽氧烷單元之含量之比率較佳地在0.01:1至19:1範圍內且甚至更佳地在0.01:1至9:1範圍內。此乃因當由通式(1)表示之金屬氧基單元之含量小於或等於上述範圍之下限時,聚有機金屬矽氧烷之折射率降低,且當該含量大於或等於上述範圍之上限時,聚有機金屬矽氧烷與有機聚合物之相容性降低。此外,當由通式(2)表示之金屬氧基單元之含量小於或等於上述範圍之下限時,聚有機金屬矽氧烷之耐熱性及耐濕性降低,且當該含量大於或等於上述範圍之上限時,聚有機金屬矽氧烷之折射率降低且與有機聚合物之相容性降低。 In the polyorganometalloxane of the present invention, the metal oxy unit represented by the formula (1), the metal oxy unit represented by the formula (2), and the oxirane unit represented by the formula (3) The respective content is not particularly limited, but the content of the metal oxy unit represented by the general formula (1) The ratio of the content of the oxoxane unit represented by the general formula (3) is preferably in the range of 0.01:1 to 99:1 and even more preferably in the range of 0.01:1 to 19:1. Further, the ratio of the content of the metal oxy unit represented by the general formula (2) to the content of the oxoxane unit represented by the general formula (3) is preferably in the range of 0.01:1 to 19:1 and is even better. The ground is in the range of 0.01:1 to 9:1. This is because when the content of the metal oxy unit represented by the general formula (1) is less than or equal to the lower limit of the above range, the refractive index of the polyorganometalloxane is lowered, and when the content is greater than or equal to the upper limit of the above range The compatibility of the polyorganometalloxane with the organic polymer is lowered. Further, when the content of the metal oxy unit represented by the general formula (2) is less than or equal to the lower limit of the above range, the heat resistance and moisture resistance of the polyorganometalloxane are lowered, and when the content is greater than or equal to the above range At the upper limit, the refractive index of the polyorganometalloxane is lowered and the compatibility with the organic polymer is lowered.

產生本發明之此聚有機金屬矽氧烷之方法並不受限制,但實例係使以下各項與溶劑(例如水或醇)一起進行水解並實施縮合反應之方法:由通式(4)表示之金屬化合物M1 b(X)c The method for producing the polyorganometalloxane of the present invention is not limited, but an example is a method in which the following is hydrolyzed together with a solvent (for example, water or an alcohol) and a condensation reaction is carried out: represented by the general formula (4) Metal compound M 1 b (X) c

(其中M1係週期表之第4A族或第5A族之原子,X係羥基或可水解基團,且「b」及「c」係滿足:(M1之化合價)×b=(X之化合價)×c之數值);由通式(5)表示之金屬化合物:M2 d(Y)e (wherein M 1 is an atom of Group 4A or Group 5A of the periodic table, X is a hydroxyl group or a hydrolyzable group, and "b" and "c" satisfy: (the valence of M 1 ) × b = (X The valence value) is a numerical compound represented by the general formula (5): M 2 d (Y) e

(其中M2係週期表之第2A族或第2B族之原子,Y係可水解基團,且「d」及「e」係滿足:(M2之化合價)×d=(Y之化合價)×e之數值);及由通式(6)表示之有機矽烷化合物:R1 aSiZ(4-a) (wherein M 2 is an atom of Group 2A or Group 2B of the periodic table, Y is a hydrolyzable group, and "d" and "e" satisfy: (valence of M 2 ) × d = (valence of Y) The value of ×e); and the organodecane compound represented by the general formula (6): R 1 a SiZ (4-a)

(其中R1係烷基、烯基、芳基、芳烷基或氫原子,Z係羥基或可水 解基團,且「a」係滿足:0<a3之數值)。 (wherein R 1 is an alkyl group, an alkenyl group, an aryl group, an arylalkyl group or a hydrogen atom, a Z-based hydroxyl group or a hydrolyzable group, and "a" is satisfied: 0 < a 3 values).

在通式(4)中,M1係週期表之第4A族或第5A族之原子,其實例係與彼等上述原子相同之原子。在通式(4)中,X係羥基或可水解基團。X之可水解基團之實例包括烷氧基,例如甲氧基及乙氧基;烯氧基,例如異丙烯氧基;醯氧基,例如乙醯氧基;鹵素基團,例如氯及溴;硫酸基團;(有機)磺酸基團,例如甲磺酸基團及十三烷基苄磺酸基團;磷酸基團、(有機)膦酸基團及硝酸基團。在通式(4)中,「b」及「c」係滿足以下條件之數值:(M1之化合價)×b=(X之化合價)×c。 In the general formula (4), the M 1 is an atom of Group 4A or Group 5A of the periodic table, and examples thereof are the same as those of the above atoms. In the formula (4), an X-based hydroxyl group or a hydrolyzable group. Examples of the hydrolyzable group of X include alkoxy groups such as methoxy group and ethoxy group; alkenyloxy group such as isopropenyloxy group; decyloxy group such as ethoxy group; halogen group such as chlorine and bromine Sulfate group; (organic) sulfonic acid group, such as methanesulfonic acid group and tridecylbenzylsulfonic acid group; phosphoric acid group, (organo)phosphonic acid group and nitric acid group. In the general formula (4), "b" and "c" are values satisfying the following conditions: (valence of M 1 ) × b = (valence of X) × c.

由通式(4)表示之該金屬化合物之實例包括(但不限於)氫氧化鋯、氫氧化鉿、氫氧化鉭、烷氧化鈦、烷氧化鋯、烷氧化鉿、烷氧化釩、烷氧化鈮、烷氧化鉭、乙酸鈦、乙酸鋯、乙酸鉿、乙酸釩、乙酸鈮、乙酸鉭、甲基丙烯酸鋯、氯化鈦、氯化鋯、氯化鉿、氯化釩、氯化鈮、氯化鉭、硫酸鈦、硫酸鋯、硫酸釩、硝酸鋯、硝酸鉿、硝酸鉭、甲磺酸鈦、十三烷基苄基鈦、磷酸鈦及膦酸鈦。 Examples of the metal compound represented by the general formula (4) include, but are not limited to, zirconium hydroxide, cesium hydroxide, cesium hydroxide, titanium alkoxide, zirconium alkoxide, cerium alkoxide, vanadium alkoxide, cerium alkoxide. , alkoxide, titanium acetate, zirconium acetate, barium acetate, vanadium acetate, barium acetate, barium acetate, zirconium methacrylate, titanium chloride, zirconium chloride, barium chloride, vanadium chloride, barium chloride, chlorination Barium, titanium sulfate, zirconium sulfate, vanadium sulfate, zirconium nitrate, cerium nitrate, cerium nitrate, titanium methanesulfonate, tridecylbenzyl titanium, titanium phosphate and titanium phosphonate.

在通式(5)中,M2係週期表之第2A族或第2B族之原子,其實例係與彼等上述原子相同之原子。在通式(5)中,Y係可水解基團,其實例係與上述X之彼等可水解基團相同之可水解基團。在通式(5)中,「d」及「e」係滿足以下條件之數值:(M2之化合價)×d=(Y之化合價)×e。 In the general formula (5), the atom of Group 2A or Group 2B of the M 2 periodic table, examples of which are the same atoms as those of the above atoms. In the formula (5), a Y-based hydrolyzable group, an example of which is the same hydrolyzable group as the above-mentioned hydrolyzable groups of X. In the general formula (5), "d" and "e" are values satisfying the following conditions: (valence of M 2 ) × d = (valence of Y) × e.

由通式(5)表示之該金屬化合物之實例包括(但不限於)氫氧化鈣、氫氧化鍶、氫氧化鋇、氫氧化鋅、氫氧化鎘、乙酸鈣、乙酸鍶、乙酸鋇、乙酸鋅、乙酸鎘、乙酸汞、乙醯丙酮鈣、乙醯丙酮鍶、乙醯丙酮鋇、氯化鈣、氯化鍶、氯化鋇、氯化鋅、氯化鎘、氯化汞、硝酸鈣、硝酸鍶、硝酸鋇、硝酸鋅、硝酸鎘及硝酸汞。 Examples of the metal compound represented by the general formula (5) include, but are not limited to, calcium hydroxide, barium hydroxide, barium hydroxide, zinc hydroxide, cadmium hydroxide, calcium acetate, barium acetate, barium acetate, zinc acetate. , cadmium acetate, mercury acetate, calcium acetonate, acetonacetone oxime, acetoacetone oxime, calcium chloride, barium chloride, barium chloride, zinc chloride, cadmium chloride, mercury chloride, calcium nitrate, nitric acid Antimony, cerium nitrate, zinc nitrate, cadmium nitrate and mercury nitrate.

在通式(6)中,R1係烷基、烯基、芳基、芳烷基或氫原子,其實例係與上述彼等基團相同之基團。在通式(6)中,Z係羥基或可水解基團,其實例係與上述X之彼等可水解基團相同之可水解基團。在通式(6)中,「a」係0<a3範圍內之數值。 In the formula (6), R 1 is an alkyl group, an alkenyl group, an aryl group, an arylalkyl group or a hydrogen atom, and examples thereof are the same as those of the above-mentioned groups. In the formula (6), a Z-based hydroxyl group or a hydrolyzable group is exemplified by the same hydrolyzable group as the above-mentioned X hydrolyzable groups. In the general formula (6), "a" is 0 < a 3 values in the range.

由通式(6)表示之該有機矽烷化合物之實例包括(但不限於)三甲基甲氧基矽烷、三甲基乙氧基矽烷、乙烯基二甲基甲氧基矽烷、乙烯基二甲基乙氧基矽烷、二苯基甲基甲氧基矽烷、二苯基甲基乙氧基矽烷、二甲基二甲氧基矽烷、二甲基二乙氧基矽烷、甲基乙烯基二甲氧基矽烷、甲基乙烯基二乙氧基矽烷、甲基苯基二甲氧基矽烷、甲基苯基二乙氧基矽烷、甲基氯丙基二甲氧基矽烷、甲基三甲氧基矽烷、乙基三甲氧基矽烷、乙烯基三甲氧基矽烷、苯基三甲氧基矽烷、氯丙基三甲氧基矽烷、1-萘基三甲氧基矽烷、乙烯基二甲基矽醇及二苯基甲基矽醇。 Examples of the organodecane compound represented by the general formula (6) include, but are not limited to, trimethylmethoxydecane, trimethylethoxydecane, vinyldimethylmethoxydecane, and vinyl dimethicone. Ethoxy decane, diphenylmethyl methoxy decane, diphenylmethyl ethoxy decane, dimethyl dimethoxy decane, dimethyl diethoxy decane, methyl vinyl dimethyl Oxy decane, methyl vinyl diethoxy decane, methyl phenyl dimethoxy decane, methyl phenyl diethoxy decane, methyl chloro propyl dimethoxy decane, methyl trimethoxy Decane, ethyltrimethoxydecane, vinyltrimethoxydecane, phenyltrimethoxydecane, chloropropyltrimethoxydecane, 1-naphthyltrimethoxydecane,vinyldimethylnonanol and diphenyl Methyl decyl alcohol.

在上述產生方法中,由通式(4)表示之金屬化合物、由通式(5)表示之金屬化合物及由通式(6)表示之有機矽烷化合物之添加量並不受限制,但其較佳地係由通式(1)表示之金屬氧基單元、由通式(2)表示之金屬氧基單元及由通式(3)表示之矽氧烷單元在所得聚有機金屬矽氧烷中之含量在上述範圍內之量。 In the above production method, the amount of the metal compound represented by the formula (4), the metal compound represented by the formula (5), and the organodecane compound represented by the formula (6) is not limited, but Preferably, the metal oxy unit represented by the formula (1), the metal oxy unit represented by the formula (2), and the oxirane unit represented by the formula (3) are in the obtained polyorganometalloxane. The amount is in the range of the above range.

此外,在上述產生方法中,水解在室溫或在熱量下進行,但自反應速率之觀點來看,較佳者係添加酸或鹼作為觸媒。可用酸之實例包括鹽酸、乙酸、甲酸、硝酸、草酸、硫酸及磷酸。此外,可用鹼之實例包括有機鹼化合物,例如三乙胺、二乙胺、單乙醇胺、二乙醇胺、三乙醇胺、氨水、氫氧化四甲銨、具有胺基之烷氧基矽烷及胺基丙基三甲氧基矽烷。 Further, in the above production method, the hydrolysis is carried out at room temperature or under heat, but from the viewpoint of the reaction rate, it is preferred to add an acid or a base as a catalyst. Examples of useful acids include hydrochloric acid, acetic acid, formic acid, nitric acid, oxalic acid, sulfuric acid, and phosphoric acid. Further, examples of the usable base include organic base compounds such as triethylamine, diethylamine, monoethanolamine, diethanolamine, triethanolamine, aqueous ammonia, tetramethylammonium hydroxide, alkoxydecane having an amine group, and aminopropyl group. Trimethoxydecane.

接下來將詳細解釋本發明可固化聚合物組成物。 Next, the curable polymer composition of the present invention will be explained in detail.

本發明可固化聚合物組成物含有上述聚有機金屬矽氧烷且係藉 由矽氫化反應固化。該可固化聚合物組成物之實例係包含以下各項者:(A)分子中具有至少2個烯基之有機聚矽氧烷;(B)分子中具有至少2個鍵結矽之氫原子之有機聚矽氧烷;(C)矽氫化反應觸媒;及(D)包含由以下通式(1)表示之金屬氧基單元之聚有機金屬矽氧烷:M1Ox/2 The curable polymer composition of the present invention contains the above polyorganometalloxane and is cured by a hydrogenation reaction. Examples of the curable polymer composition include: (A) an organopolyoxyalkylene having at least 2 alkenyl groups in the molecule; (B) a hydrogen atom having at least 2 bonded fluorenes in the molecule. An organopolyoxane; (C) a hydrogenation reaction catalyst; and (D) a polyorganometalloxane comprising a metal oxy unit represented by the following formula (1): M 1 O x/2

(其中M1係週期表之第4A族或第5A族之原子,且「x」係M1之化合價);由以下通式(2)表示之金屬氧基單元:M2Oy/2 (wherein M 1 is an atom of Group 4A or Group 5A of the periodic table, and "x" is a valence of M 1 ); a metal oxy unit represented by the following formula (2): M 2 O y/2

(其中M2係週期表之第2A族或第2B族之原子,且「y」係M2之化合價);及由以下通式(3)表示之有機矽氧烷單元:R1 aSiO(4-a)/2 (wherein M 2 is an atom of Group 2A or Group 2B of the periodic table, and "y" is a valence of M 2 ); and an organic oxirane unit represented by the following formula (3): R 1 a SiO ( 4-a)/2

(其中R1係烷基、烯基、芳基、芳烷基或氫原子,且「a」係滿足:0<a3之數值)。 (wherein R 1 is an alkyl group, an alkenyl group, an aryl group, an arylalkyl group or a hydrogen atom, and "a" is satisfied: 0 < a 3 values).

組份(A)係分子中具有至少2個烯基之有機聚矽氧烷。組份(A)中之烯基之實例包括乙烯基、烯丙基、丁烯基、戊烯基、己烯基及庚烯基。在該等基團中,較佳者係乙烯基。組份(A)中除烯基以外鍵結至矽原子之基團之實例包括烷基、芳基及芳烷基。烷基之實例包括甲基、乙基、丙基及丁基。在該等基團中,較佳者係甲基。芳基之實例包括苯基、萘基、蒽基、菲基、芘基及芳基之氫原子經諸如甲基或乙基等烷基取代之該等芳基;烷氧基,例如甲氧基或乙氧基;或鹵素原子,例如氯原子或溴原子。在該等基團中,較佳者係苯基及萘基。芳 烷基之實例包括萘基乙基、萘基丙基、蒽基乙基、菲基乙基、芘基乙基,及芳烷基之氫原子經諸如甲基或乙基等烷基取代之該等芳烷基;烷氧基,例如甲氧基或乙氧基;或鹵素原子,例如氯原子或溴原子。自提高組份(A)之折射率之目標之觀點來看,組份(A)較佳地具有芳基或芳烷基,且甚至更佳地在組份(A)中除烯基以外具有苯基或萘基作為鍵結至矽原子之基團。 Component (A) is an organopolyoxane having at least 2 alkenyl groups in the molecule. Examples of the alkenyl group in the component (A) include a vinyl group, an allyl group, a butenyl group, a pentenyl group, a hexenyl group, and a heptenyl group. Among these groups, preferred are vinyl groups. Examples of the group bonded to the halogen atom other than the alkenyl group in the component (A) include an alkyl group, an aryl group, and an aralkyl group. Examples of the alkyl group include a methyl group, an ethyl group, a propyl group, and a butyl group. Among these groups, a methyl group is preferred. Examples of the aryl group include the aryl group in which a hydrogen atom of a phenyl group, a naphthyl group, an anthracenyl group, a phenanthryl group, a fluorenyl group and an aryl group is substituted with an alkyl group such as a methyl group or an ethyl group; an alkoxy group such as a methoxy group; Or an ethoxy group; or a halogen atom such as a chlorine atom or a bromine atom. Among these groups, preferred are phenyl and naphthyl groups. Fang Examples of the alkyl group include a naphthylethyl group, a naphthylpropyl group, a decylethyl group, a phenanthrylethyl group, a decylethyl group, and a hydrogen atom of an aralkyl group substituted with an alkyl group such as a methyl group or an ethyl group. An aralkyl group; an alkoxy group such as a methoxy group or an ethoxy group; or a halogen atom such as a chlorine atom or a bromine atom. From the viewpoint of the objective of increasing the refractive index of the component (A), the component (A) preferably has an aryl group or an aralkyl group, and even more preferably has a group other than the alkenyl group in the component (A). A phenyl or naphthyl group serves as a group bonded to a ruthenium atom.

該組份(A)之實例包含包括由通式:R'3SiO1/2表示之矽氧烷單元及由通式:R'R"SiO2/2表示之矽氧烷單元之有機聚矽氧烷;包括由通式:R'3SiO1/2表示之矽氧烷單元及由通式:R'R"SiO2/2及通式:R'2SiO2/2表示之矽氧烷單元之有機聚矽氧烷;包括由通式:R'2R"SiO1/2表示之矽氧烷單元及由通式:R'2SiO2/2表示之矽氧烷單元之有機聚矽氧烷;包括由通式:R'2R"SiO1/2表示之矽氧烷單元、由通式:R'2SiO2/2表示之矽氧烷單元及由通式:R'R"SiO2/2表示之矽氧烷單元之有機聚矽氧烷;包括由通式:R'2R"SiO1/2表示之矽氧烷單元及由通式:R'SiO3/2表示之矽氧烷單元之有機聚矽氧烷;包括由通式:R'3SiO1/2表示之矽氧烷單元及由通式:R"SiO3/2表示之矽氧烷單元之有機聚矽氧烷;包括由通式:R'3SiO1/2表示之矽氧烷單元、由通式:R"SiO3/2表示之矽氧烷單元及由通式:R'SiO3/2表示之矽氧烷單元之有機聚矽氧烷;包括由通式:R'2R"SiO1/2表示之矽氧烷單元、由通式:R'2SiO2/2表示之矽氧烷單元及由通式:R'SiO3/2表示之矽氧烷單元之有機聚矽氧烷;包括由通式:R'2R"SiO1/2表示之矽氧烷單元、由通式:R'2SiO2/2表示之矽氧烷單元及由通式:R'SiO3/2表示之矽氧烷單元之有機聚矽氧烷;包括由通式:R'R"SiO2/2表示之矽氧烷單元及由式:R'SiO3/2表示之矽氧烷單元之有機聚矽氧烷;包括由通式:R'2R"SiO1/2表示之矽氧烷單元及由式:SiO4/2表示之矽氧烷單元之有機聚矽氧烷;包括由通式:R'3SiO1/2表示之矽氧烷單元、由通式:R'2R"SiO1/2 表示之矽氧烷單元及由式:SiO4/2表示之矽氧烷單元之有機聚矽氧烷;及其兩種或更多種類型之混合物。在上述各式中,R'係烷基、芳基或芳烷基,其實例係與上述彼等基團相同之基團。在上述各式中,R"係烯基,其實例係與上述彼等基團相同之基團。 Examples of the component (A) include an organopolyfluorene unit represented by the general formula: R' 3 SiO 1/2 and an organic polyfluorene represented by the general formula: R'R"SiO 2/2 . Oxyalkane; comprising a oxoxane unit represented by the formula: R' 3 SiO 1/2 and a decane represented by the formula: R'R"SiO 2/2 and the formula: R' 2 SiO 2/2 a unit of an organopolyoxane; comprising a fluorinated alkane unit represented by the formula: R' 2 R"SiO 1/2 and an organopoly unit represented by the formula: R' 2 SiO 2/2 Oxystane; comprising a oxoxane unit represented by the formula: R' 2 R"SiO 1/2 , a oxoxane unit represented by the formula: R' 2 SiO 2/2 and a formula: R'R" An organopolyoxane of a oxoxane unit represented by SiO 2/2 ; comprising a fluorinated alkane unit represented by the formula: R' 2 R"SiO 1/2 and represented by the formula: R'SiO 3/2 An organopolyoxane of a oxoxane unit; comprising a fluorinated alkane unit represented by the general formula: R' 3 SiO 1/2 and an organic polyfluorene represented by the general formula: R"SiO 3/2 oxyalkyl; comprises the formula: Si siloxane units R "SiO 3/2 and represented by the general formula of:: silicon siloxane units R '3 SiO 1/2 of represented by the general formula R'SiO 3/2 Silicon Silicon organopolysiloxane alumoxane the alumoxane shows the unit; comprises the formula: 'Silicon siloxane units 2 R "SiO 1/2 of represented by the general formula: R' R 2 SiO 2/2 siloxane represents of silicon a unit and an organopolyoxane of the oxirane unit represented by the formula: R'SiO 3/2 ; comprising a oxoxane unit represented by the formula: R' 2 R"SiO 1/2 , by the formula: a fluorinated alkane unit represented by R' 2 SiO 2/2 and an organopolyoxyalkylene represented by the formula: R'SiO 3/2 ; comprising the formula: R'R"SiO 2/2 a oxoxane unit and an organopolyoxane represented by the formula: R'SiO 3/2; and a oxoxane unit represented by the formula: R' 2 R"SiO 1/2 An organopolyoxane of the oxirane unit represented by the formula: SiO 4/2 ; comprising a oxoxane unit represented by the formula: R' 3 SiO 1/2 , of the formula: R' 2 R"SiO 1 a oxoxane unit represented by /2 and an organopolyoxane of the oxirane unit represented by the formula: SiO 4/2 ; and a mixture of two or more types thereof. In the above formula, the R' system An alkyl group, an aryl group or an aralkyl group, examples of which are the same groups as the above-mentioned groups. In the above formulas, R" Alkenyl group, examples of the above-described system the same groups their group.

組份(B)係分子中具有至少兩個鍵結矽之氫原子之有機聚矽氧烷。組份(B)中除氫原子以外之鍵結至矽原子之基團之實例包括烷基、芳基及芳烷基,其實例係與上述彼等基團相同之基團。自提高組份(B)之折射率之目標之觀點來看,組份(B)較佳地具有芳基或芳烷基,且甚至更佳地在組份(B)中除氫原子以外具有苯基或萘基作為鍵結至矽原子之基團。 Component (B) is an organopolyoxane having at least two hydrogen atoms bonded to the molecule in the molecule. Examples of the group bonded to the halogen atom other than the hydrogen atom in the component (B) include an alkyl group, an aryl group and an aralkyl group, and examples thereof are the same groups as the above-mentioned groups. From the viewpoint of the objective of increasing the refractive index of the component (B), the component (B) preferably has an aryl group or an aralkyl group, and even more preferably has a hydrogen atom other than the hydrogen atom in the component (B). A phenyl or naphthyl group serves as a group bonded to a ruthenium atom.

該組份(B)之實例包含包括由通式:R'3SiO1/2表示之矽氧烷單元及由通式:R'HSiO2/2表示之矽氧烷單元之有機聚矽氧烷;包括由通式:R'3SiO1/2表示之矽氧烷單元及由通式:R'HSiO2/2及通式:R'2SiO2/2表示之矽氧烷單元之有機聚矽氧烷;包括由通式:R'2HSiO1/2表示之矽氧烷單元及由通式:R'2SiO2/2表示之矽氧烷單元之有機聚矽氧烷;包括由通式:R'2HSiO1/2表示之矽氧烷單元、由通式:R'2SiO2/2表示之矽氧烷單元及由通式:R'HSiO2/2表示之矽氧烷單元之有機聚矽氧烷;包括由通式:R'2HSiO1/2表示之矽氧烷單元及由通式:R'SiO3/2表示之矽氧烷單元之有機聚矽氧烷;包括由通式:R'3SiO1/2表示之矽氧烷單元及由通式:HSiO3/2表示之矽氧烷單元之有機聚矽氧烷;包括由通式:R'3SiO1/2表示之矽氧烷單元、由通式:HSiO3/2表示之矽氧烷單元及由通式:R'SiO3/2表示之矽氧烷單元之有機聚矽氧烷;包括由通式:R'2HSiO1/2表示之矽氧烷單元、由通式:R'2SiO2/2表示之矽氧烷單元及由通式:R'SiO3/2表示之矽氧烷單元之有機聚矽氧烷;包括由通式:R'HSiO2/2表示之矽氧烷單元及由式:R'SiO3/2表示之矽氧烷單元之有機聚矽氧烷;包括由通式:R'2HSiO1/2表示之矽氧烷單元及 由式:SiO4/2表示之矽氧烷單元之有機聚矽氧烷;包括由通式:R'3SiO1/2表示之矽氧烷單元、由通式:R'2HSiO1/2表示之矽氧烷單元及由式:SiO4/2表示之矽氧烷單元之有機聚矽氧烷;其兩種或更多種類型之混合物。在上述各式中,R'係烷基、芳基或芳烷基,其實例係與上述彼等基團相同之基團。 Examples of the component (B) include an organopolyoxane unit represented by the general formula: R' 3 SiO 1/2 and an oxoxane unit represented by the formula: R'HSiO 2/2 . a polyoxane unit represented by the formula: R' 3 SiO 1/2 and an organopoly group represented by the formula: R'HSiO 2/2 and a fluorinated alkane unit represented by the formula: R' 2 SiO 2/2 a siloxane comprising: a fluorinated alkane unit represented by the formula: R' 2 HSiO 1/2 and an organopolyoxyalkylene represented by the formula: R' 2 SiO 2/2 ; Formula: R' 2 HSiO 1/2 represents a oxoxane unit, a oxirane unit represented by the formula: R' 2 SiO 2/2 and a fluoran oxide unit represented by the formula: R'HSiO 2/2 An organopolyoxane; comprising a oxoxane unit represented by the general formula: R' 2 HSiO 1/2 and an organopolyoxyalkylene represented by the oxirane unit represented by the formula: R'SiO 3/2 ; a oxoxane unit represented by the general formula: R' 3 SiO 1/2 and an organopolyoxyalkylene represented by the oxirane unit represented by the formula: HSiO 3/2 ; including the general formula: R' 3 SiO 1/ 2 is a oxoxane unit, a oxoxane unit represented by the formula: HSiO 3/2 and represented by the formula: R'SiO 3/2 An organopolyoxane of a oxoxane unit; comprising a oxoxane unit represented by the formula: R' 2 HSiO 1/2 , a oxoxane unit represented by the formula: R' 2 SiO 2/2 An organopolyoxane of the oxoxane unit represented by R'SiO 3/2 ; comprising a oxoxane unit represented by the formula: R'HSiO 2/2 and represented by the formula: R'SiO 3/2 An organopolyoxane of a oxoxane unit; comprising a oxoxane unit represented by the formula: R' 2 HSiO 1/2 and an organopolyoxyalkylene represented by the oxime unit represented by the formula: SiO 4/2 ; The invention includes a oxoxane unit represented by the general formula: R' 3 SiO 1/2 , a fluoran oxide unit represented by the formula: R' 2 HSiO 1/2 and a siloxane unit represented by the formula: SiO 4/2 . An organopolyoxane; a mixture of two or more types thereof. In the above formulae, R' is an alkyl group, an aryl group or an aralkyl group, and examples thereof are the same groups as the above-mentioned groups.

組份(C)係矽氫化反應觸媒,其特定實例包括基於鉑之觸媒、基於銠之觸媒及基於鈀之觸媒。組份(C)較佳地係基於鉑之觸媒,以使可顯著加速本發明組成物之固化。基於鉑之觸媒之實例包括鉑細粉、氫氯鉑酸、氫氯鉑酸之醇溶液、鉑-烯基矽氧烷錯合物、鉑-烯烴錯合物及鉑-羰基錯合物,且較佳者係鉑-烯基矽氧烷錯合物。 Component (C) is a hydrogenation reaction catalyst, and specific examples thereof include a platinum-based catalyst, a rhodium-based catalyst, and a palladium-based catalyst. Component (C) is preferably based on a platinum catalyst so that the curing of the composition of the invention can be significantly accelerated. Examples of platinum-based catalysts include platinum fine powder, hydrochloroplatinic acid, an alcohol solution of chloroplatinic acid, a platinum-alkenyl alkoxylate complex, a platinum-olefin complex, and a platinum-carbonyl complex. More preferably, it is a platinum-alkenyl alkoxylate complex.

組份(D)係包含由通式(1):M1Ox/2表示之金屬氧基單元、由通式(2):M2Oy/2表示之金屬氧基單元及由通式(3):R1 aSiO(4-a)/2表示之有機矽氧烷單元之聚有機金屬矽氧烷。組份(D)係如上所述。當組份(D)係分子中至少一個R1係烯基之聚有機金屬矽氧烷時,組份(D)可與組份(B)中之鍵結矽之氫原子發生矽氫化反應。當組份(D)係分子中之至少一個R1係氫原子之聚有機金屬矽氧烷時,組份(D)可與組份(A)中之烯基發生矽氫化反應。 Component (D) contains a metal oxy unit represented by the general formula (1): M 1 O x/2 , a metal oxy unit represented by the general formula (2): M 2 O y/2 , and a general formula (3): Polyorganometalloxane of an organooxane unit represented by R 1 a SiO (4-a)/2 . Component (D) is as described above. When component (D) is a polyorganometalloxane of at least one R 1 alkenyl group in the molecule, component (D) may undergo a hydrazine hydrogenation reaction with a hydrogen atom bonded to the group in (B). When component (D) is a polyorganometalloxane of at least one R 1 -based hydrogen atom in the molecule, component (D) may undergo a hydrazine hydrogenation reaction with the alkenyl group in component (A).

組份(B)之含量並不特別受限制,但當組份(D)不含有烯基及鍵結矽之氫原子時,該含量較佳地係使得組份(B)中之鍵結矽之氫原子相對於組份(A)中總計1mol之烯基在0.2mol至5mol範圍內且甚至更佳地在0.5mol至2mol範圍內之量。當組份(D)具有烯基時,該含量較佳地係使得組份(B)中之鍵結矽之氫原子相對於組份(A)及組份(D)中之總計1mol之烯基在0.2mol至5mol範圍內且甚至更佳地在0.5mol至2mol範圍內之量。另外,當組份(D)具有鍵結矽之氫原子時,該含量較佳地係使得組份(B)及組份(D)中之鍵結矽之總氫原子相對於組份(A)中總計1mol之烯基在0.2mol至5mol範圍內且甚至更佳地在0.5mol至 2mol範圍內之量。此乃因當組份(B)之含量大於或等於上述範圍之下限時,所得組成物之固化變得較充分,且當該含量小於或等於上述範圍之上限時,所得固化產物之物理特徵改良。 The content of the component (B) is not particularly limited, but when the component (D) does not contain an alkenyl group and a hydrogen atom bonded to the oxime, the content is preferably such that the bond in the component (B) is 矽The hydrogen atom is in an amount ranging from 0.2 mol to 5 mol and even more preferably from 0.5 mol to 2 mol, relative to the total of 1 mol of the alkenyl group in the component (A). When the component (D) has an alkenyl group, the content is preferably such that the hydrogen atom bonded to the oxime in the component (B) is a total of 1 mol of the olefin in the component (A) and the component (D). The amount is in the range of from 0.2 mol to 5 mol and even more preferably in the range of from 0.5 mol to 2 mol. Further, when the component (D) has a hydrogen atom bonded to ruthenium, the content is preferably such that the total hydrogen atom of the bonded ruthenium in the component (B) and the component (D) is relative to the component (A) a total of 1 mol of alkenyl in the range of 0.2 mol to 5 mol and even more preferably 0.5 mol to Amount within the range of 2 mol. This is because when the content of the component (B) is greater than or equal to the lower limit of the above range, the curing of the obtained composition becomes sufficient, and when the content is less than or equal to the upper limit of the above range, the physical properties of the obtained cured product are improved. .

組份(C)之含量並不特別受限制,只要可加速組成物之固化即可。特定而言,該含量較佳地係使得組份(C)中之觸媒金屬相對於組成物以重量單位計在0.01ppm至500ppm範圍內、甚至更佳地在0.01ppm至100ppm範圍內、且再甚至更佳地在0.01ppm至50ppm範圍內之量。 The content of the component (C) is not particularly limited as long as the curing of the composition can be accelerated. In particular, the content is preferably such that the catalytic metal in the component (C) is in the range of 0.01 ppm to 500 ppm, more preferably in the range of 0.01 ppm to 100 ppm, by weight, relative to the composition, and Even more preferably in an amount ranging from 0.01 ppm to 50 ppm.

組份(D)之含量並不特別受限制,但其較佳地為組份(A)、組份(B)及組份(D)之總量之1wt.%至99wt.%且甚至更佳地10wt.%至90wt.%。此乃因當組份(D)之含量小於下限時,折射率不充足,且當該含量大於上限時,所得固化產物變得易碎。 The content of the component (D) is not particularly limited, but it is preferably from 1 wt.% to 99 wt.% of the total amount of the component (A), the component (B) and the component (D) and even more Preferably 10%.% to 90wt.%. This is because when the content of the component (D) is less than the lower limit, the refractive index is insufficient, and when the content is more than the upper limit, the resulting cured product becomes brittle.

本發明之另一可固化聚合物組成物之實例係包含以下各項之可固化聚合物組成物:(E)包含由以下通式(1)表示之金屬氧基單元之聚有機金屬矽氧烷:M1Ox/2 An example of another curable polymer composition of the present invention is a curable polymer composition comprising: (E) a polyorganometalloxane comprising a metal oxy unit represented by the following general formula (1) :M 1 O x/2

(其中M1係週期表之第4A族或第5A族之原子,且「x」係M1之化合價);由以下通式(2)表示之金屬氧基單元:M2Oy/2 (wherein M 1 is an atom of Group 4A or Group 5A of the periodic table, and "x" is a valence of M 1 ); a metal oxy unit represented by the following formula (2): M 2 O y/2

(其中M2係週期表之第2A族或第2B族之原子,且「y」係M2之化合價);及由以下通式(3)表示之有機矽氧烷單元:R1 aSiO(4-a)/2 (wherein M 2 is an atom of Group 2A or Group 2B of the periodic table, and "y" is a valence of M 2 ); and an organic oxirane unit represented by the following formula (3): R 1 a SiO ( 4-a)/2

(其中R1係烷基、烯基、含芳族基團之基團或氫原子,且「a」係 滿足:0<a3之數值);其中分子中至少兩個R1係烯基;(B)分子中具有至少2個鍵結矽之氫基團之有機聚矽氧烷;及(C)矽氫化反應觸媒。 (wherein R 1 is an alkyl group, an alkenyl group, an aromatic group-containing group or a hydrogen atom, and "a" is satisfied: 0 < a a value of 3); wherein at least two R 1 are alkenyl groups in the molecule; (B) an organopolyoxyalkylene having at least 2 hydrogen groups bonded to the molecule; and (C) a hydrogenation reaction catalyst.

組份(E)係包含由通式(1):M1Ox/2表示之金屬氧基單元、由通式(2):M2Oy/2表示之金屬氧基單元及由通式(3):R1 aSiO(4-a)/2表示之有機矽氧烷單元之聚有機金屬矽氧烷,其中分子中至少兩個R1係烯基。組份(E)係如上所述。由於組份(E)之分子中具有至少兩個烯基,故組份(E)可與組份(B)中之鍵結矽之氫原子發生矽氫化反應。 Component (E) includes a metal oxy unit represented by the general formula (1): M 1 O x/2 , a metal oxy unit represented by the general formula (2): M 2 O y/2 , and a general formula (3): Polyorganometalloxane of an organooxane unit represented by R 1 a SiO (4-a)/2 , wherein at least two R 1 -alkenyl groups in the molecule. Component (E) is as described above. Since component (E) has at least two alkenyl groups in the molecule, component (E) can undergo a hydrogenation reaction with a hydrogen atom bonded to the group in component (B).

組份(B)係分子中具有至少兩個鍵結矽之氫原子之有機聚矽氧烷,其實例與上述彼等實例相同。 Component (B) is an organopolyoxyalkylene having at least two hydrogen atoms bonded to the molecule in the molecule, examples of which are the same as those of the above examples.

組份(C)係矽氫化反應觸媒,其實例與上述彼等實例相同。 Component (C) is a hydrogenation reaction catalyst, and examples thereof are the same as those of the above examples.

組份(B)之含量並不特別受限制,但其較佳地係使得該組份中之鍵結矽之氫原子相對於組份(E)中之1mol之烯基在0.2mol至5mol範圍內及甚至更佳地在0.5mol至2mol範圍內之量。此乃因當組份(B)之含量大於或等於上述範圍之下限時,所得組成物之固化變得較充分,且當該含量小於或等於上述範圍之上限時,所得固化產物之物理特徵改良。 The content of the component (B) is not particularly limited, but it is preferably such that the hydrogen atom of the bonded oxime in the component is in the range of 0.2 mol to 5 mol with respect to 1 mol of the alkenyl group in the component (E). Within and even more preferably in an amount ranging from 0.5 mol to 2 mol. This is because when the content of the component (B) is greater than or equal to the lower limit of the above range, the curing of the obtained composition becomes sufficient, and when the content is less than or equal to the upper limit of the above range, the physical properties of the obtained cured product are improved. .

組份(C)之含量並不特別受限制,只要可加速組成物之固化即可。特定而言,該含量較佳地係使得組份(C)中之觸媒金屬相對於組成物以重量單位計在0.01ppm至500ppm範圍內、甚至更佳地在0.01ppm至100ppm範圍內、且再甚至更佳地在0.01ppm至50ppm範圍內之量。 The content of the component (C) is not particularly limited as long as the curing of the composition can be accelerated. In particular, the content is preferably such that the catalytic metal in the component (C) is in the range of 0.01 ppm to 500 ppm, more preferably in the range of 0.01 ppm to 100 ppm, by weight, relative to the composition, and Even more preferably in an amount ranging from 0.01 ppm to 50 ppm.

該本發明可固化聚合物組成物亦可含有(F)磷光體作為另一可選組份。此組份(F)之實例包括廣泛用於發光二極體(LED)中之黃色、紅色、綠色及藍色發光磷光體,例如氧化物磷光體、氮氧化物磷光體、 氮化物磷光體、硫化物磷光體、氧硫化物磷光體及兩種或更多種類型之該等磷光體之混合物。氧化物磷光體之實例包括含有鈰離子之基於釔、鋁及石榴石之YAG綠色至黃色發光磷光體、含有鈰離子之基於鋱、鋁及石榴石之TAG黃色發光磷光體,及含有鈰或銪離子之綠色至黃色矽酸鹽發光磷光體。氮氧化物磷光體之實例包括含有銪離子之基於矽、鋁、氧及氮之紅色至綠色矽鋁氮氧化物(sialon)發光磷光體。氮化物磷光體之實例包括含有銪離子之基於鈣、鍶、鋁、矽及氮之CASN紅色發光磷光體。硫化物磷光體之實例包括含有銅離子或鋁離子之基於ZnS之綠色磷光體。氧硫化物磷光體之實例包括含有銪離子之基於Y2O2S之紅色發光磷光體。 The curable polymer composition of the present invention may also contain (F) a phosphor as another optional component. Examples of this component (F) include yellow, red, green, and blue light-emitting phosphors widely used in light-emitting diodes (LEDs), such as oxide phosphors, oxynitride phosphors, nitride phosphors, A mixture of a sulfide phosphor, an oxysulfide phosphor, and two or more types of such phosphors. Examples of oxide phosphors include YAG green to yellow luminescent phosphors based on yttrium, aluminum and garnet containing cerium ions, TAG yellow luminescent phosphors based on cerium, aluminum and garnet containing cerium ions, and cerium or lanthanum containing cerium or lanthanum The green to yellow citrate luminescent phosphor of the ion. Examples of oxynitride phosphors include red to green sialon luminescent phosphors based on cerium, aluminum, oxygen and nitrogen containing cerium ions. Examples of nitride phosphors include CASN red luminescent phosphors based on calcium, cerium, aluminum, cerium and nitrogen containing cerium ions. Examples of the sulfide phosphor include a ZnS-based green phosphor containing copper ions or aluminum ions. Examples of the oxysulfide phosphor include a Y 2 O 2 S-based red light-emitting phosphor containing barium ions.

組份(F)之含量並不特別受限制,但其於該組成物中較佳地在0.1wt.%至70wt.%範圍內且甚至更佳地在1wt.%至20wt.%範圍內。 The content of the component (F) is not particularly limited, but it is preferably in the range of from 0.1 wt.% to 70 wt.% and even more preferably from 1 wt.% to 20 wt.% in the composition.

本發明可固化聚合物組成物亦可含有用於改良該組成物之黏附之增黏劑。分子中具有至少一個鍵結至矽原子之烷氧基之有機矽化合物較適宜作為此增黏劑。此烷氧基之實例包括甲氧基、乙氧基、丙氧基、丁氧基及甲氧基乙氧基。在該等基團中,尤佳者係甲氧基。此有機矽化合物中除鍵結至矽原子之烷氧基以外之基團之實例包括經取代或未經取代之單價烴基團,例如烷基、烯基、芳基、芳烷基及鹵代烷基;含環氧基之單價有機基團,例如3-縮水甘油氧基丙基、4-縮水甘油氧基丁基或類似縮水甘油氧基烷基;2-(3,4-環氧基環己基)乙基、3-(3,4-環氧基環己基)丙基或類似環氧基環己基烷基;4-環氧乙烷基丁基、8-環氧乙烷基辛基或類似環氧乙烷基烷基;含丙烯酸基之單價有機基團,例如3-甲基丙烯醯氧基丙基;及氫原子。此有機矽化合物較佳地具有鍵結矽之烯基或鍵結矽之氫原子。此有機矽化合物亦較佳地在分子中具有至少一個含有環氧基之單價有機基團,以使可良好黏附至各種基礎材料。該有機矽化合物之實例包括有機矽烷化合物、有機 矽氧烷寡聚物及矽酸烷基酯。此有機矽氧烷寡聚物或矽酸烷基酯之分子結構之實例包括直鏈結構、部分具支鏈之直鏈結構、具支鏈結構、環狀結構及網狀結構。在該等結構中,尤佳者係直鏈、具支鏈及網狀結構。該有機矽化合物之實例包括矽烷化合物,例如3-縮水甘油氧基丙基三甲氧基矽烷、2-(3,4-環氧基環己基)乙基三甲氧基矽烷及3-甲基丙烯醯氧基丙基三甲氧基矽烷;以下化合物之混合物:分子中具有鍵結矽之烯基或鍵結矽之氫原子及鍵結矽之烷氧基中之至少一者之矽氧烷化合物、具有至少一個鍵結矽之烷氧基之矽烷化合物或矽氧烷化合物及分子中具有鍵結矽之羥基及鍵結矽之烯基中之至少一者之矽氧烷化合物;聚矽酸甲基酯;聚矽酸乙基酯;以及含有環氧基之聚矽酸乙基酯。 The curable polymer composition of the present invention may also contain a tackifier for improving the adhesion of the composition. An organic ruthenium compound having at least one alkoxy group bonded to a ruthenium atom in the molecule is suitable as the tackifier. Examples of the alkoxy group include a methoxy group, an ethoxy group, a propoxy group, a butoxy group, and a methoxyethoxy group. Among these groups, a methoxy group is preferred. Examples of the group other than the alkoxy group bonded to the ruthenium atom in the organic ruthenium compound include a substituted or unsubstituted monovalent hydrocarbon group such as an alkyl group, an alkenyl group, an aryl group, an arylalkyl group and a halogenated alkyl group; A monovalent organic group containing an epoxy group, such as 3-glycidoxypropyl, 4-glycidoxybutyl or a similar glycidoxyalkyl group; 2-(3,4-epoxycyclohexyl) Ethyl, 3-(3,4-epoxycyclohexyl)propyl or similar epoxycyclohexylalkyl; 4-oxiranylbutyl, 8-oxiranyloctyl or similar ring An oxyethanealkyl group; a monovalent organic group containing an acrylic group, such as 3-methylpropenyloxypropyl; and a hydrogen atom. The organic ruthenium compound preferably has a hydrogen atom bonded to an alkenyl group or a bonded ruthenium. The organogermanium compound also preferably has at least one monovalent organic group containing an epoxy group in the molecule to allow good adhesion to various base materials. Examples of the organic ruthenium compound include organic decane compounds, organic A siloxane oligomer and an alkyl phthalate. Examples of the molecular structure of the organic siloxane oxide oligomer or alkyl phthalate include a linear structure, a partially branched linear structure, a branched structure, a cyclic structure, and a network structure. Among these structures, a preferred one is a linear, branched, and network structure. Examples of the organic phosphonium compound include a decane compound such as 3-glycidoxypropyltrimethoxydecane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxydecane, and 3-methylpropene oxime. a oxypropyltrimethoxydecane; a mixture of the following compounds: a oxoxane compound having at least one of a hydrogen atom bonded to hydrazine or a hydrogen atom bonded to hydrazine in the molecule and an alkoxy group bonded to hydrazine; a at least one alkoxy group-containing decane compound or a decane compound and a siloxane compound having at least one of a hydrazine having a bonded hydrazine and a hydrazine bonded in the molecule; a polymethyl phthalate Polyethyl phthalate; and polyethyl phthalate containing an epoxy group.

此增黏劑之含量並不特別受限制,但其較佳地在每100重量份數之總組成物0.01重量份數至10重量份數範圍內。 The content of the tackifier is not particularly limited, but it is preferably in the range of 0.01 part by weight to 10 parts by weight per 100 parts by weight of the total composition.

可將例如以下反應抑制劑作為可選組份納入本發明可固化聚合物組成物中:炔醇,例如2-甲基-3-丁炔-2-醇、3,5-二甲基-1-己炔-3-醇或2-苯基-3-丁炔-2-醇;烯炔化合物,例如3-甲基-3-戊烯-1-炔或3,5-二甲基-3-己烯-1-炔;或1,3,5,7-四甲基-1,3,5,7-四乙烯基環四矽氧烷、1,3,5,7-四甲基-1,3,5,7-四己烯基環四矽氧烷或苯并三唑。 For example, the following reaction inhibitors may be included as optional components in the curable polymer composition of the present invention: an alkynol such as 2-methyl-3-butyn-2-ol, 3,5-dimethyl-1 -hexyn-3-ol or 2-phenyl-3-butyn-2-ol; an enyne compound such as 3-methyl-3-penten-1-yne or 3,5-dimethyl-3 -hexene-1-yne; or 1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetraoxane, 1,3,5,7-tetramethyl- 1,3,5,7-tetrahexenylcyclotetraoxane or benzotriazole.

反應抑制劑之含量並不受限制,但其較佳地為每100重量份數之本發明組成物0.0001重量份數至5重量份數。 The content of the reaction inhibitor is not limited, but it is preferably 0.0001 part by weight to 5 parts by weight per 100 parts by weight of the composition of the invention.

可將以下成份以不損害本發明之目標之含量作為可選組份納入本發明可固化聚合物組成物中:無機填料,例如二氧化矽、玻璃、氧化鋁或氧化鋅;聚甲基丙烯酸酯樹脂及諸如此類之有機樹脂細粉;耐熱劑、染料、顏料、阻燃劑、溶劑及諸如此類。 The following ingredients may be included as an optional component in the curable polymer composition of the present invention in an amount which does not impair the object of the present invention: an inorganic filler such as ceria, glass, alumina or zinc oxide; polymethacrylate Resin and the like; fine powder of organic resin; heat resistant agent, dye, pigment, flame retardant, solvent and the like.

本發明可固化聚合物組成物可使固化在室溫下或在加熱下進行,但較佳者係加熱該組成物以達成快速固化。加熱溫度較佳地為 50℃至200℃。 The curable polymer composition of the present invention allows curing to be carried out at room temperature or under heating, but it is preferred to heat the composition to achieve rapid curing. The heating temperature is preferably 50 ° C to 200 ° C.

本發明之此可固化聚合物組成物可用作黏附劑、灌封劑、保護劑、塗覆劑、底部填充劑用於電氣/電子應用,或用作模製劑。具體而言,該組成物因該組成物之光學透射率較高而尤其適合作為用於光學應用中之半導體元件之黏附劑、灌封劑、保護劑、塗覆劑、底部填充劑,用於透鏡之模製劑,或諸如此類。 The curable polymer composition of the present invention can be used as an adhesive, a potting agent, a protective agent, a coating agent, an underfill for electrical/electronic applications, or as a molding. Specifically, the composition is particularly suitable as an adhesive, a potting agent, a protective agent, a coating agent, an underfill for a semiconductor element used in optical applications due to a high optical transmittance of the composition, and is used for a molding of a lens, or the like.

接下來將詳細解釋本發明固化產物。 Next, the cured product of the present invention will be explained in detail.

本發明固化產物係藉由固化可固化聚合物組成物形成。該本發明固化產物之形狀並不特別受限制,且可將該固化產物處置成固化產物覆蓋或密封光學半導體元件或諸如此類之狀態。此外,可將本發明固化產物處置成為獨立的產物,其實例包括片狀產物及膜狀產物。 The cured product of the present invention is formed by curing a curable polymer composition. The shape of the cured product of the present invention is not particularly limited, and the cured product can be disposed to a state in which the cured product covers or seals the optical semiconductor element or the like. Further, the cured product of the present invention can be disposed as an independent product, and examples thereof include a tabular product and a film-like product.

現在將詳細解釋本發明光學半導體裝置。 The optical semiconductor device of the present invention will now be explained in detail.

此裝置之特徵在於,光學半導體元件係由上述可固化聚合物組成物之固化產物覆蓋或密封。此光學半導體元件之實例係發光二極體(LED)晶片。該光學半導體裝置之實例包括發光二極體(LED)、光耦合器及CCD。 The device is characterized in that the optical semiconductor element is covered or sealed by the cured product of the above curable polymer composition. An example of such an optical semiconductor component is a light emitting diode (LED) wafer. Examples of the optical semiconductor device include a light emitting diode (LED), an optical coupler, and a CCD.

圖1顯示表面安裝型LED之橫剖面圖,該表面安裝型LED係本發明光學半導體裝置之一個實例。在圖1中所圖解說明之LED中,LED晶片1係晶粒接合至引線框2,且LED晶片1及引線框3係藉由接合線4線接合。此LED晶片1係藉由上述可固化聚合物組成物之固化產物5覆蓋。 Fig. 1 shows a cross-sectional view of a surface mount type LED which is an example of the optical semiconductor device of the present invention. In the LED illustrated in FIG. 1, the LED chip 1 is die bonded to the lead frame 2, and the LED chip 1 and the lead frame 3 are bonded by wire bonding wires. This LED wafer 1 is covered by the cured product 5 of the above curable polymer composition.

生產圖1中所圖解說明之表面安裝型LED之方法之實例係以下方法:將LED晶片1晶粒接合至引線框2,利用金接合線4線接合LED晶片1及引線框3,將上述可固化聚合物組成物施加至LED晶片1,且然後藉由在50℃至200℃下加熱來固化組成物。 An example of a method of producing the surface mount type LED illustrated in FIG. 1 is a method of bonding an LED chip 1 to a lead frame 2, bonding the LED chip 1 and the lead frame 3 by a gold bonding wire 4, and the above The cured polymer composition is applied to the LED wafer 1, and then the composition is cured by heating at 50 ° C to 200 ° C.

實例 Instance

將使用實際實例來進一步詳細解釋本發明之聚有機金屬矽氧烷、可固化聚合物組成物、固化產物及光學半導體裝置。聚有機金屬矽氧烷、可固化聚合物組成物及固化產物之特徵係如下來量測。在實際實例中,Vi表示乙烯基,Me表示甲基,Ph表示苯基,且Naph表示萘基。 The polyorganometalloxane, the curable polymer composition, the cured product, and the optical semiconductor device of the present invention will be explained in further detail using practical examples. The characteristics of the polyorganometalloxane, the curable polymer composition, and the cured product are measured as follows. In a practical example, Vi represents a vinyl group, Me represents a methyl group, Ph represents a phenyl group, and Naph represents a naphthyl group.

聚有機金屬矽氧烷之折射率:利用聚苯基甲基矽氧烷(25℃下之黏度,折射率:1.545)溶解聚有機金屬矽氧烷,以便達成所要求濃度(體積%),並根據混合物之折射率計算折射率。 Refractive index of polyorganometalloxane: polyorganometalloxane is dissolved by polyphenylmethyloxane (viscosity at 25 ° C, refractive index: 1.545) to achieve the desired concentration (% by volume), and The refractive index is calculated from the refractive index of the mixture.

固化產物之外觀:固化產物之透明度係以目測方式來證實。 Appearance of the cured product: The transparency of the cured product was confirmed by visual inspection.

固化產物之折射率:固化產物之折射率係使用稜鏡式耦合方法來量測。使用632.8nm雷射光源來量測。 Refractive index of the cured product: The refractive index of the cured product was measured using a 稜鏡-coupled method. A 632.8 nm laser source was used for the measurement.

固化產物之耐熱性:外觀係在將固化產物於烘箱中及150℃下靜置100小時後來證實。 Heat resistance of cured product: Appearance was confirmed after the cured product was allowed to stand in an oven at 150 ° C for 100 hours.

固化產物之耐濕性:外觀係在將固化產物於恒溫、高濕烘箱(85℃,相對濕度:85%)中靜置一週後來證實。 Moisture resistance of cured product: Appearance was confirmed by allowing the cured product to stand in a constant temperature, high humidity oven (85 ° C, relative humidity: 85%) for one week.

參考實例1 Reference example 1

首先,將10g(40.3mmol)1-萘基三甲氧基矽烷、2.7g(26.4mmol)乙烯基二甲基矽醇、5.8g(27.1mmol)二苯基甲基矽醇、20g甲苯及0.04g(0.71mmol)氫氧化鉀裝載至反應容器中,並加熱回流一小時。然後,將該混合物冷卻至室溫,並添加1.2g(66.6mmol)水與10g甲醇之混合物。在常壓下蒸餾混合物,同時加熱直至反應溫度達到 120℃為止,並使該混合物在此溫度下反應2小時。然後將混合物冷卻至室溫,並藉由添加0.08g(1.3mmol)乙酸實施中和反應。在過濾出所產生之鹽後,在減壓下自所得澄清溶液去除低沸點物質同時加熱,且獲得14.3g無色澄清的黏性液體(產率:94%)。 First, 10 g (40.3 mmol) of 1-naphthyltrimethoxynonane, 2.7 g (26.4 mmol) of vinyl dimethyl decyl alcohol, 5.8 g (27.1 mmol) of diphenylmethyl decyl alcohol, 20 g of toluene, and 0.04 g (0.71 mmol) potassium hydroxide was loaded into the reaction vessel and heated to reflux for one hour. Then, the mixture was cooled to room temperature, and a mixture of 1.2 g (66.6 mmol) of water and 10 g of methanol was added. Distill the mixture under normal pressure while heating until the reaction temperature reaches The mixture was allowed to react at this temperature for 2 hours at 120 °C. The mixture was then cooled to room temperature, and a neutralization reaction was carried out by adding 0.08 g (1.3 mmol) of acetic acid. After the resulting salt was filtered off, the low-boiling substance was removed from the resulting clear solution under reduced pressure while heating, and 14.3 g of a colorless, clear, viscous liquid was obtained (yield: 94%).

作為NMR分析之結果,確定此液體係由以下平均單元式表示之有機聚矽氧烷:(ViMe2SiO1/2)0.28(Ph2MeSiO1/2)0.28(NaphSiO3/2)0.44 As a result of NMR analysis, the organic polyoxane represented by the following average unit formula was determined: (ViMe 2 SiO 1/2 ) 0.28 (Ph 2 MeSiO 1/2 ) 0.28 (NaphSiO 3/2 ) 0.44

此有機聚矽氧烷之重量平均分子量(Mw)為1,000,分散度(Mw/Mn)為1.05,且折射率為1.603。 The organic polyoxyalkylene had a weight average molecular weight (Mw) of 1,000, a degree of dispersion (Mw/Mn) of 1.05, and a refractive index of 1.603.

參考實例2 Reference example 2

首先,將10g(40.3mmol)1-萘基三甲氧基矽烷、4.2g(13.5mmol)1,3-二乙烯基-1,3-二苯基二甲基二矽氧烷及20g甲苯裝載至反應容器中,且預先混合,裝載2.2g(122.1mmol)水及10g甲醇。然後,裝載0.069g(0.46mmol)三氟甲磺酸同時攪拌並加熱回流2小時。然後在常壓下蒸餾混合物,同時加熱直至溫度達到85℃為止,並使該混合物在此溫度下反應1小時。然後,裝載0.06g(1.1mmol)氫氧化鉀。在常壓下蒸餾混合物,同時加熱直至反應溫度達到120℃為止,並使該混合物在此溫度下反應1小時。將混合物冷卻至室溫,並藉由添加0.09g(1.5mmol)乙酸實施中和反應。在過濾出所產生之鹽後,在減壓下自所得澄清溶液去除低沸點物質同時加熱,且獲得10.3g無色澄清的黏度超過10,000Pa.s之黏性液體(產率:90.4%)。 First, 10 g (40.3 mmol) of 1-naphthyltrimethoxynonane, 4.2 g (13.5 mmol) of 1,3-divinyl-1,3-diphenyldimethyldioxane and 20 g of toluene were loaded to The reaction vessel was premixed and charged with 2.2 g (122.1 mmol) of water and 10 g of methanol. Then, 0.069 g (0.46 mmol) of trifluoromethanesulfonic acid was charged while stirring and heating under reflux for 2 hours. Then, the mixture was distilled under normal pressure while heating until the temperature reached 85 ° C, and the mixture was allowed to react at this temperature for 1 hour. Then, 0.06 g (1.1 mmol) of potassium hydroxide was loaded. The mixture was distilled under normal pressure while heating until the reaction temperature reached 120 ° C, and the mixture was allowed to react at this temperature for 1 hour. The mixture was cooled to room temperature, and a neutralization reaction was carried out by adding 0.09 g (1.5 mmol) of acetic acid. After filtering out the salt produced, the low-boiling substance was removed from the obtained clear solution under reduced pressure while heating, and 10.3 g of a colorless clarified viscosity of more than 10,000 Pa was obtained. Viscous liquid of s (yield: 90.4%).

作為NMR分析之結果,確定此黏性液體係由以下平均單元式表示之有機聚矽氧烷:(MeViPhSiO1/2)0.40(NaphSiO3/2)0.60 As a result of NMR analysis, the organic polyoxane represented by the following average unit formula was determined: (MeViPhSiO 1/2 ) 0.40 (NaphSiO 3/2 ) 0.60

此有機聚矽氧烷之重量平均分子量(Mw)為1,000,分散度(Mw/Mn)為1.08,且折射率為1.622。 The organic polyoxyalkylene had a weight average molecular weight (Mw) of 1,000, a degree of dispersion (Mw/Mn) of 1.08, and a refractive index of 1.622.

實際實例1 Practical example 1

首先,混合49.3g(0.173mol)四異丙氧基鈦、15g乙醇、45g甲苯及10.01g(0.046mol)二水合乙酸鋅,且另外添加24.1g(0.099mol)二苯基二甲氧基矽烷。然後,將11.5g 0.1N稀鹽酸與64.0g乙醇之混合物緩慢滴加至混合物中,且在滴加完成後,將混合物在室溫下攪拌1小時。然後,將混合物加熱回流1小時。在減壓下蒸餾溶劑同時加熱,獲得33.5g折射率為1.670之無色固體(產率:92%)。 First, 49.3 g (0.173 mol) of titanium tetraisopropoxide, 15 g of ethanol, 45 g of toluene, and 10.01 g (0.046 mol) of zinc acetate dihydrate were mixed, and 24.1 g (0.099 mol) of diphenyldimethoxydecane was additionally added. . Then, a mixture of 11.5 g of 0.1 N diluted hydrochloric acid and 64.0 g of ethanol was slowly added dropwise to the mixture, and after completion of the dropwise addition, the mixture was stirred at room temperature for 1 hour. Then, the mixture was heated to reflux for 1 hour. The solvent was distilled under reduced pressure while heating to obtain 33.5 g of a colorless solid (yield: 92%) having a refractive index of 1.670.

藉由NMR測得此固體之烷氧基甲矽烷基之反應速率為99.4mol%,且經確定該固體係金屬氧基單元(M1):金屬氧基單元(M2):有機矽氧烷單元之莫耳比率TiO4/2:ZnO2/2:Ph2SiO2/2=0.55:0.15:0.30(=1.83:0.50:1)之聚有機金屬矽氧烷(1)。 The reaction rate of the solid alkoxycarbenyl group was determined by NMR to be 99.4 mol%, and the solid metal oxy unit (M 1 ) was determined: metal oxy unit (M 2 ): organic decane The polyorganometalloxane (1) of the unit molar ratio TiO 4/2 : ZnO 2/2 : Ph 2 SiO 2/2 = 0.55: 0.15: 0.30 (=1.83: 0.50:1).

將所得聚有機金屬矽氧烷(1)在烘箱中及220℃下加熱1小時,但僅觀察到略微變黃。 The obtained polyorganometalloxane (1) was heated in an oven at 220 ° C for 1 hour, but only a slight yellowing was observed.

實際實例2 Practical example 2

首先,混合81.9g(0.175mol)四丙氧基鋯之70wt.%正丙醇溶液、30g乙醇、90g甲苯及10.1g(0.046mol)二水合乙酸鋅,且另外添加24.1g(0.099mol)二苯基二甲氧基矽烷。然後,將9.1g 0.1N稀鹽酸與82.0g乙醇之混合物緩慢滴加至溶液中。在滴加完成後,將混合物在室溫下攪拌1小時。然後,將混合物加熱回流1小時。在減壓下蒸餾溶劑同時加熱,且獲得441.9g折射率為1.647之無色固體(產率:94.5%)。 First, 81.9 g (0.175 mol) of a 70 wt.% n-propanol solution of tetrapropoxy zirconium, 30 g of ethanol, 90 g of toluene, and 10.1 g (0.046 mol) of zinc acetate dihydrate were mixed, and an additional 24.1 g (0.099 mol) of two was added. Phenyldimethoxydecane. Then, a mixture of 9.1 g of 0.1 N diluted hydrochloric acid and 82.0 g of ethanol was slowly added dropwise to the solution. After the dropwise addition was completed, the mixture was stirred at room temperature for 1 hour. Then, the mixture was heated to reflux for 1 hour. The solvent was distilled while heating under reduced pressure, and 441.9 g of a colorless solid (yield: 94.5%) having a refractive index of 1.647 was obtained.

藉由NMR測得此固體之烷氧基甲矽烷基之反應速率為99.1mol%,且經確定該固體係金屬氧基單元(M1):金屬氧基單元(M2):有機矽氧烷單元之重量莫耳比率ZrO4/2:ZnO2/2:Ph2SiO2/2=0.55:0.15:0.30(=1.83:0.50:1)之聚有機金屬矽氧烷(2)。 The reaction rate of the alkoxycarbenyl group of the solid was determined by NMR to be 99.1 mol%, and the solid metal oxy unit (M 1 ) was determined: metal oxy unit (M 2 ): organic decane The weight of the unit molar ratio ZrO 4/2 : ZnO 2/2 : Ph 2 SiO 2/2 = 0.55: 0.15: 0.30 (=1.83: 0.50:1) of the polyorganometalloxane (2).

將所得聚有機金屬矽氧烷(2)在烘箱中及220℃下加熱1小時,但 未觀察到絲毫變色。 The obtained polyorganometalloxane (2) was heated in an oven at 220 ° C for 1 hour, but No discoloration was observed.

實際實例3 Practical example 3

首先,將0.88g(4.0mmol)二水合氯化鋅裝載至20g甲苯與10g乙醇之經混合溶液中並加以攪拌。當將2.87g(10.1mmol)四異丙基鈦添加至溶液中並攪拌時,獲得無色澄清溶液。然後,裝載2g含0.76g(3.53mmol)二苯基甲基矽醇之甲苯溶液,並將其在室溫下攪拌30分鐘。然後,將0.39g(21.6mmol)水與2g乙醇之混合物緩慢滴加至溶液中。在滴加完成後,逐漸加熱溶液,並藉由蒸餾去除低沸點物質。當反應溶液之溫度達到110℃時,停止蒸餾,並在110℃下實施熱老化1小時。因此,獲得14g有機金屬矽氧烷(3)之甲苯溶液,且固體濃度為13.3wt.%。 First, 0.88 g (4.0 mmol) of zinc chloride dihydrate was loaded into a mixed solution of 20 g of toluene and 10 g of ethanol and stirred. When 2.87 g (10.1 mmol) of tetraisopropyltitanium was added to the solution and stirred, a colorless clear solution was obtained. Then, 2 g of a toluene solution containing 0.76 g (3.53 mmol) of diphenylmethylnonanol was charged, and it was stirred at room temperature for 30 minutes. Then, a mixture of 0.39 g (21.6 mmol) of water and 2 g of ethanol was slowly added dropwise to the solution. After the completion of the dropwise addition, the solution was gradually heated, and the low-boiling substance was removed by distillation. When the temperature of the reaction solution reached 110 ° C, the distillation was stopped, and heat aging was performed at 110 ° C for 1 hour. Thus, 14 g of a toluene solution of an organometallic oxane (3) was obtained with a solid concentration of 13.3 wt.%.

此有機金屬矽氧烷(3)中金屬氧基單元(M1):金屬氧基單元(M2):有機矽氧烷單元之莫耳比率為TiO4/2:ZnO2/2:Ph2MeSiO1/2=0.57:0.23:0.20(=2.85:1.15:1)。 The metal oxy unit (M 1 ): the metal oxy unit (M 2 ): the organooxane unit molar ratio of the organometallic fluorene ( 3 ) is TiO 4/2 : ZnO 2/2 : Ph 2 MeSiO 1/2 = 0.57: 0.23: 0.20 (= 2.85: 1.15: 1).

實際實例4 Practical example 4

首先,將0.88g(4.0mmol)二水合氯化鋅裝載至20g甲苯與10g乙醇之經混合溶液中並加以攪拌。當將2.87g(10.0mmol)四異丙基鈦添加至溶液中並加以攪拌時,獲得無色澄清溶液。然後,裝載2g含0.57g(2.65mmol)二苯基甲基矽醇之甲苯溶液,並將其在室溫下攪拌30分鐘。然後,將0.40g(22.3mmol)水與2g乙醇之混合物緩慢滴加至溶液中。在滴加完成後,逐漸加熱溶液,並藉由蒸餾去除低沸點物質。當反應溶液之溫度達到110℃時,停止蒸餾,並在110℃下實施熱老化1小時。因此,獲得14.4g聚有機金屬矽氧烷(4)之甲苯溶液,且固體濃度為11.7wt.%。此聚有機金屬矽氧烷(4)中金屬氧基單元(M1):金屬氧基單元(M2):有機矽氧烷單元之莫耳比率為TiO4/2:ZnO2/2:Ph2MeSiO1/2=0.61:0.24:0.15(=4.07:1.60:1)。 First, 0.88 g (4.0 mmol) of zinc chloride dihydrate was loaded into a mixed solution of 20 g of toluene and 10 g of ethanol and stirred. When 2.87 g (10.0 mmol) of tetraisopropyltitanium was added to the solution and stirred, a colorless clear solution was obtained. Then, 2 g of a toluene solution containing 0.57 g (2.65 mmol) of diphenylmethylnonanol was charged, and it was stirred at room temperature for 30 minutes. Then, a mixture of 0.40 g (22.3 mmol) of water and 2 g of ethanol was slowly added dropwise to the solution. After the completion of the dropwise addition, the solution was gradually heated, and the low-boiling substance was removed by distillation. When the temperature of the reaction solution reached 110 ° C, the distillation was stopped, and heat aging was performed at 110 ° C for 1 hour. Thus, 14.4 g of a toluene solution of polyorganometalloxane (4) was obtained with a solid concentration of 11.7 wt.%. The metal oxy unit (M 1 ): the metal oxy unit (M 2 ): the organooxane unit molar ratio of the organoorganometal fluorene (4) is TiO 4/2 : ZnO 2/2 : Ph 2 MeSiO 1/2 = 0.61: 0.24: 0.15 (= 4.07: 1.60: 1).

比較實例1 Comparative example 1

以與實際實例1相同之方式實施反應,只是不使用實際實例1之乙酸鋅。然而,當在添加0.1N稀鹽酸後加熱反應混合物時,混合物失去流動性,且發生膠凝。 The reaction was carried out in the same manner as in Practical Example 1, except that the zinc acetate of Practical Example 1 was not used. However, when the reaction mixture was heated after the addition of 0.1 N of dilute hydrochloric acid, the mixture lost fluidity and gelation occurred.

比較實例2 Comparative example 2

在不使用實際實例1之乙酸鋅之情況下,無任何膠凝之相應聚有機金屬矽氧烷(5)可藉由將0.1N稀鹽酸之量自11.5g降低至8g來製備。 In the case where zinc acetate of Practical Example 1 was not used, the corresponding polyorganometalloxane (5) without any gelation can be prepared by reducing the amount of 0.1 N dilute hydrochloric acid from 11.5 g to 8 g.

然而,當以與實際實例1相同之方式將此聚有機金屬矽氧烷(5)在烘箱中及220℃下加熱1小時時,溶液變為黑褐色。 However, when the polyorganometalloxane (5) was heated in an oven at 220 ° C for 1 hour in the same manner as in Practical Example 1, the solution turned dark brown.

實際實例5至7 Practical examples 5 to 7

將乙烯基二甲基矽醇添加至於實際實例1中製得之聚有機金屬矽氧烷(1)之50wt.%甲苯溶液中,以形成表1中顯示之各別負載組成物,並將溶液在80℃下加熱3小時。 Vinyl dimethyl decyl alcohol was added to a 50 wt.% toluene solution of polyorganometalloxane (1) prepared in Practical Example 1 to form respective load compositions shown in Table 1, and the solution was Heat at 80 ° C for 3 hours.

然後,在減壓下蒸餾溶劑同時加熱,以製備聚有機金屬矽氧烷(6)至(8)。該等聚有機金屬矽氧烷中金屬氧基單元(M1):金屬氧基單元(M2):有機矽氧烷單元之莫耳比率顯示於表1中。 Then, the solvent was distilled while being reduced under reduced pressure to prepare polyorganometalloxanes (6) to (8). The molar ratio of the metal oxy unit (M 1 ):metal oxy unit (M 2 ):organooxane unit in the polyorganometalloxane is shown in Table 1.

實際實例8 Practical example 8

將乙烯基二甲基矽醇添加至於實際實例2中製得之聚有機金屬矽氧烷(2)之50wt.%甲苯溶液中,以形成表1中顯示之各別裝載組成物,並將溶液在80℃下加熱3小時。 Vinyl dimethyl sterol was added to a 50 wt.% toluene solution of the polyorganometalloxane (2) prepared in Practical Example 2 to form the respective loaded compositions shown in Table 1, and the solution was Heat at 80 ° C for 3 hours.

然後,在減壓下蒸餾溶劑同時加熱,以製備聚有機金屬矽氧烷(9)。該等聚有機金屬矽氧烷中金屬氧基單元(M1):金屬氧基單元(M2):有機矽氧烷單元之莫耳比率顯示於表1中。 Then, the solvent was distilled while being reduced under reduced pressure to prepare a polyorganometalloxane (9). The molar ratio of the metal oxy unit (M 1 ):metal oxy unit (M 2 ):organooxane unit in the polyorganometalloxane is shown in Table 1.

實際實例9至12及比較實例3 Practical Examples 9 to 12 and Comparative Example 3

將聚有機金屬矽氧烷(15wt.%甲苯溶液)、乙烯基官能聚有機矽氧烷及SiH官能聚有機矽氧烷以表2中顯示之混合比率混合。然後,將1,3-二乙烯基四甲基二矽氧烷鉑錯合物以鉑金屬相對於固體含量以重量單位計為2ppm之量混合,以便製備可固化聚合物組成物之溶液。 A polyorganometalloxane (15 wt.% solution in toluene), a vinyl functional polyorganosiloxane and a SiH functional polyorganosiloxane were mixed at the mixing ratios shown in Table 2. Then, the 1,3-divinyltetramethyldioxane platinum complex was mixed in an amount of 2 ppm by weight of the platinum metal with respect to the solid content to prepare a solution of the curable polymer composition.

將此可固化聚合物組成物之溶液滴加至玻璃板上,並將其在40℃下靜置整個晝夜以蒸發甲苯,並獲得無色澄清固體膜。然後,將該膜在150℃下加熱1小時以獲得無色澄清固化產物。根據當將產物浸沒於甲苯中時不溶解之事實證實,產物確實固化。 A solution of this curable polymer composition was added dropwise to a glass plate, and it was allowed to stand at 40 ° C throughout the day and night to evaporate toluene, and a colorless clear solid film was obtained. Then, the film was heated at 150 ° C for 1 hour to obtain a colorless clarified cured product. According to the fact that the product did not dissolve when immersed in toluene, the product did solidify.

可固化聚合物組成物及其固化產物之評估結果顯示於表2中。表2中之SiH/Vi比率表示,每1mol之可固化聚合物組成物中乙烯基官能聚有機矽氧烷中之總乙烯基,SiH官能聚有機矽氧烷中鍵結矽之氫原子之莫耳數。 The evaluation results of the curable polymer composition and its cured product are shown in Table 2. The SiH/Vi ratio in Table 2 indicates the total vinyl group in the vinyl functional polyorganosiloxane, and the hydrogen atom bonded to the SiH functional polyorganosiloxane in the 1 mol of the curable polymer composition. The number of ears.

實際實例13至23 Practical examples 13 to 23

將聚有機金屬矽氧烷(15wt.%甲苯溶液)、乙烯基官能聚有機矽氧烷及SiH官能聚有機矽氧烷以表3至5中顯示之混合比率混合。然後,以鉑金屬相對於固體含量以重量單位計為2ppm之量混合1,3-二乙烯基四甲基二矽氧烷鉑錯合物,以便製備可固化聚合物組成物之溶液。 A polyorganometalloxane (15 wt.% solution in toluene), a vinyl functional polyorganosiloxane and a SiH functional polyorganosiloxane were mixed at the mixing ratios shown in Tables 3 to 5. Then, a 1,3-divinyltetramethyldioxanane platinum complex was mixed in an amount of 2 ppm by weight based on the platinum metal relative to the solid content to prepare a solution of the curable polymer composition.

將此可固化聚合物組成物之溶液滴加至玻璃板上,並將其在40℃下靜置整個晝夜以蒸發甲苯,且獲得無色澄清固體膜。然後,將該膜在150℃下加熱1小時以獲得無色澄清固化產物。根據當將產物浸沒於甲苯中時不溶解之事實證實,產物確實固化。 A solution of this curable polymer composition was added dropwise to a glass plate, and it was allowed to stand at 40 ° C throughout the day and night to evaporate toluene, and a colorless clear solid film was obtained. Then, the film was heated at 150 ° C for 1 hour to obtain a colorless clarified cured product. According to the fact that the product did not dissolve when immersed in toluene, the product did solidify.

可固化聚合物組成物及其固化產物之評估結果顯示於表3至5中。表3至5中之SiH/Vi比率表示,每1mol之可固化聚合物組成物中聚有機金屬矽氧烷及乙烯基官能聚有機矽氧烷中之總乙烯基,SiH官能聚有機矽氧烷中鍵結矽之氫原子之莫耳數。 The evaluation results of the curable polymer composition and the cured product thereof are shown in Tables 3 to 5. The SiH/Vi ratios in Tables 3 to 5 represent the total vinyl groups in the polyorganometalloxane and the vinyl functional polyorganosiloxane, and the SiH functional polyorganosiloxane, per 1 mol of the curable polymer composition. The number of moles of hydrogen atoms in the middle bond.

實際實例24 Practical example 24 表面安裝型發光二極體(LED)之生產 Production of surface mount light-emitting diodes (LEDs)

將Bridgelux公司製得之每一側上量測1mm×1mm之MKO4545C LED晶片2安裝於I-Chiun Precision Industry有限公司製得之每一側上量測5mm×5mm之TTI-5074 LED引線框上,該引線框之周邊由聚鄰苯二甲醯胺(PPA)樹脂殼1嚢封。然後,藉由厚度為1.5mil之金接合線4電連接LED晶片2及內部引線3。 The MKO4545C LED chip 2 measuring 1 mm × 1 mm on each side of Bridgelux was mounted on each side of I-Chiun Precision Industry Co., Ltd. to measure a 5 mm × 5 mm TTI-5074 LED lead frame. The periphery of the lead frame is sealed with a polyphthalamide (PPA) resin shell. Then, the LED chip 2 and the internal leads 3 are electrically connected by a gold bonding wire 4 having a thickness of 1.5 mils.

然後,混合3g於實際實例14中製得之可固化聚合物組成物及0.105g由Intermatix公司製得之基於鋱-鋁-石榴石之螢光物質(產品名稱:NTAG4851)以製備密封劑。在將此密封劑脫氣後,使用分配器將14.3mg密封劑注入聚鄰苯二甲醯胺(PPA)樹脂殼1中,並藉由將其在150℃下加熱1小時固化,從而形成圖1中所圖解說明之表面安裝型發光二極體(LED)。 Then, 3 g of the curable polymer composition obtained in Practical Example 14 and 0.105 g of a yttrium-aluminum-garnet-based fluorescent substance (product name: NTAG4851) manufactured by Intermatix Co., Ltd. were mixed to prepare a sealant. After deaeration of the sealant, 14.3 mg of a sealant was injected into a polyphthalamide (PPA) resin case 1 using a dispenser, and cured by heating at 150 ° C for 1 hour to form a pattern. Surface mount type light emitting diode (LED) as illustrated in 1.

工業應用性 Industrial applicability

本發明聚有機金屬矽氧烷係藉由矽氫化反應固化而形成具有高折射率以及極佳可見光透射率、耐熱性及耐濕性之固化產物,且因此可用作用於電氣/電子應用之黏附劑、封裝劑、保護性塗覆劑或底部填充劑。具體而言,可見光透射率較高,此使得該產物適宜作為用於LED元件之密封劑或覆蓋劑或作為透鏡形成材料。 The polyorganometalloxane of the present invention is cured by a hydrogenation reaction to form a cured product having a high refractive index and excellent visible light transmittance, heat resistance and moisture resistance, and thus can be used as an adhesive for electrical/electronic applications. , encapsulant, protective coating or underfill. Specifically, the visible light transmittance is high, which makes the product suitable as a sealant or a covering agent for an LED element or as a lens forming material.

1‧‧‧聚鄰苯二甲醯胺(PPA)樹脂殼 1‧‧‧Polyphthalic acid (PPA) resin shell

2‧‧‧LED晶片 2‧‧‧LED chip

3‧‧‧內部引線 3‧‧‧Internal leads

4‧‧‧接合線 4‧‧‧bonding line

5‧‧‧可固化聚合物組成物之固化產物 5‧‧‧Curing product of curable polymer composition

Claims (10)

一種聚有機金屬矽氧烷,其包含由以下通式(1)表示之金屬氧基單元:M1Ox/2其中M1係週期表之第4A族或第5A族之原子,且「x」係M1之化合價;由以下通式(2)表示之金屬氧基單元:M2Oy/2其中M2係週期表之第2A族或第2B族之原子,且「y」係M2之化合價;及由以下通式(3)表示之有機矽氧烷單元:R1 aSiO(4-a)/2其中R1係烷基、烯基、芳基、芳烷基或氫原子,且「a」係滿足:0<a3之數值。 A polyorganometalloxane comprising a metal oxy unit represented by the following formula (1): M 1 O x/2 wherein the atom of Group 4A or Group 5A of the M 1 periodic table, and “x a valence of M 1 ; a metal oxy unit represented by the following formula (2): M 2 O y/2 wherein the M 2 is an atom of Group 2A or Group 2B of the periodic table, and "y" is M a valence of 2 ; and an organooxane unit represented by the following formula (3): R 1 a SiO (4-a)/2 wherein R 1 is an alkyl group, an alkenyl group, an aryl group, an arylalkyl group or a hydrogen atom. And "a" is satisfied: 0<a The value of 3. 如請求項1之聚有機金屬矽氧烷,其中M1係選自由Ti及Zr組成之群之原子,且M2係選自由Zn、Ca及Ba組成之群之原子。 The polyorganometalloxane of claim 1, wherein M 1 is selected from the group consisting of atoms of Ti and Zr, and M 2 is selected from the group consisting of Zn, Ca and Ba. 如請求項1之聚有機金屬矽氧烷,其中由通式(1)表示之該金屬氧基單元之含量對由通式(3)表示之該矽氧烷單元之含量之比率為0.01:1至99:1,且由通式(2)表示之該金屬氧基單元之含量對由通式(3)表示之該矽氧烷單元之含量之比率為0.01:1至19:1。 The polyorganometalloxane of claim 1, wherein the ratio of the content of the metal oxy unit represented by the general formula (1) to the content of the oxirane unit represented by the general formula (3) is 0.01:1. The ratio of the content of the metal oxy unit represented by the general formula (2) to the content of the oxirane unit represented by the general formula (3) is from 99:1 to 19:1. 一種可矽氫化反應固化之可固化聚合物組成物,該組成物包含如請求項1至3中任一項之聚有機金屬矽氧烷。 A curable polymer composition curable by a hydrogenation reaction, the composition comprising the polyorganometalloxane of any one of claims 1 to 3. 如請求項4之可固化聚合物組成物,其包含以下組份(A)、組份(B)、組份(C)及組份(D):(A)每一分子中具有至少2個烯基之有機聚矽氧烷; (B)分子中具有至少2個鍵結矽之氫原子之有機聚矽氧烷;(C)矽氫化反應觸媒;及(D)如請求項1至3中任一項之聚有機金屬矽氧烷。 The curable polymer composition of claim 4, which comprises the following components (A), component (B), component (C), and component (D): (A) having at least 2 in each molecule Alkenyl organopolyoxane; (B) an organopolyoxane having at least 2 bonded hydrogen atoms in the molecule; (C) a hydrogenation reaction catalyst; and (D) a polyorganometallic ruthenium according to any one of claims 1 to 3. Oxytomane. 如請求項4之可固化聚合物組成物,其包含以下組份(E)、組份(B)及組份(C):(E)如請求項1至3中任一項之聚有機金屬矽氧烷,其中分子中之至少兩個R1係烯基;(B)分子中具有至少兩個鍵結矽之氫基團之有機聚矽氧烷;及(C)矽氫化反應觸媒。 The curable polymer composition of claim 4, comprising the following component (E), component (B), and component (C): (E) the polyorganometallic according to any one of claims 1 to 3. a oxane, wherein at least two R 1 -alkenyl groups in the molecule; (B) an organopolyoxane having at least two hydrogen groups bonded to the molecule; and (C) a hydrogenation reaction catalyst. 如請求項4之可固化聚合物組成物,其進一步包含(F)磷光體。 The curable polymer composition of claim 4, which further comprises (F) a phosphor. 一種固化產物,其係藉由固化如請求項4之可固化聚合物組成物形成。 A cured product formed by curing a curable polymer composition as claimed in claim 4. 一種光學半導體裝置,其係藉由利用如請求項4之可固化聚合物組成物之固化產物覆蓋或密封光學半導體元件形成。 An optical semiconductor device formed by covering or sealing an optical semiconductor element with a cured product of the curable polymer composition as claimed in claim 4. 如請求項7之可固化聚合物組成物,其中組份(F)係基於該可固化聚合物組成物之總重量以0.1wt.%至70wt.%之量存在。 The curable polymer composition of claim 7, wherein component (F) is present in an amount of from 0.1 wt.% to 70 wt.%, based on the total weight of the curable polymer composition.
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TWI634160B (en) * 2016-04-19 2018-09-01 Kcc公司 Organic-silicon metal composites, curable organopolysiloxane composition comprising thereof, and optical material comprising the composition
CN108546410A (en) * 2018-03-31 2018-09-18 长春物恒新技术有限公司 A kind of high-temperature resistant single-component RTV fluorocarbon silicone rubber
TWI758469B (en) * 2017-04-27 2022-03-21 日商信越化學工業股份有限公司 Addition-hardening polysiloxane composition, method for producing the composition, cured polysiloxane, and optical element

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JP2000235103A (en) 1999-02-16 2000-08-29 Konica Corp Optical device, optical lens and optical hardening resin composition having high refractive index
JP5625210B2 (en) 2007-12-27 2014-11-19 ナガセケムテックス株式会社 Curable composition
WO2012088439A1 (en) * 2010-12-22 2012-06-28 Dow Corning Corporation Polyheterosiloxane composition including lanthanide metal

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Publication number Priority date Publication date Assignee Title
TWI634160B (en) * 2016-04-19 2018-09-01 Kcc公司 Organic-silicon metal composites, curable organopolysiloxane composition comprising thereof, and optical material comprising the composition
TWI758469B (en) * 2017-04-27 2022-03-21 日商信越化學工業股份有限公司 Addition-hardening polysiloxane composition, method for producing the composition, cured polysiloxane, and optical element
CN108546410A (en) * 2018-03-31 2018-09-18 长春物恒新技术有限公司 A kind of high-temperature resistant single-component RTV fluorocarbon silicone rubber

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