TW201403126A - Scanning system - Google Patents
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Abstract
Description
本發明是有關一種掃描系統,特別是一種包含兩種不同光學系統之透鏡模組之掃描系統。 The present invention relates to a scanning system, and more particularly to a scanning system comprising lens modules of two different optical systems.
請參照圖1,習知之掃描系統是利用桿透鏡(rod lens)模組11將來自物件10之光線會聚至影像感測器12,例如接觸式影像感測器(Contact Image Sensor,CIS)。此掃描系統所形成的數位影像相當於以近乎垂直物件10之視角觀測物件10的每一個位置,因此,圖1所示之掃描系統可應用於掃描平面物件(例如文件)或立體物件(例如紡織品、包含電子元件之電路板等)。 Referring to FIG. 1, a conventional scanning system uses a rod lens module 11 to condense light from an object 10 to an image sensor 12, such as a contact image sensor (CIS). The digital image formed by the scanning system is equivalent to observing each position of the object 10 from the perspective of the near vertical object 10. Therefore, the scanning system shown in Fig. 1 can be applied to scanning planar objects (such as documents) or three-dimensional objects (such as textiles). , a circuit board containing electronic components, etc.).
然而,受限於桿透鏡模組11以及影像感測器12的寬度,圖1所示之掃描系統之掃描寬度無法任意調整,且無法提高局部物件10之影像解折度。此外,影像感測器12大多為客製化零件,而非大量製造之標準規格,因此影像感測器12之取得成本相對較高,尤其是彩色之影像感測器。 However, limited by the width of the rod lens module 11 and the image sensor 12, the scanning width of the scanning system shown in FIG. 1 cannot be arbitrarily adjusted, and the image unfolding degree of the local object 10 cannot be improved. In addition, the image sensor 12 is mostly a customized component rather than a standard specification for mass production, so the image sensor 12 is relatively expensive to obtain, especially a color image sensor.
請參照圖2,一種影像擷取系統則是利用單鏡頭(single lens)模組21將來自物件20之光線會聚至影像感測器22。一般而言,適當設計之單鏡頭模組21可與任意規格之影像感測器22搭配使用,因此,可選擇使用的影像感測器22較多,取得成本因而相對較低。然而,如圖2所示,物件20中偏離單透頭模組21的位置形成較大的觀測視角,因此,應用於立體物件時,上述影像擷取系統可能無法取得物件20之凹部或凸部之頂端影像。 Referring to FIG. 2 , an image capture system converges light from the object 20 to the image sensor 22 by using a single lens module 21 . In general, a properly designed single lens module 21 can be used with any size of image sensor 22. Therefore, there are many image sensors 22 that can be selectively used, and the cost is relatively low. However, as shown in FIG. 2, the position of the object 20 deviating from the single-head module 21 forms a large viewing angle. Therefore, when applied to a three-dimensional object, the image capturing system may not be able to obtain the concave or convex portion of the object 20. The top image.
綜上所述,如何應用單透鏡之光學系統取得近乎垂直物件之視角之數位影像便是目前極需努力的目標。 In summary, how to apply a single-lens optical system to obtain a digital image with a near-vertical object view is currently an urgent task.
本發明提供一種掃描系統,其是利用多個並排配置之透鏡之光學模組,例如桿透鏡陣列,將來自物件之光線會聚至一成像表面以形成一平面化之光學影像,接著再利用單鏡頭光學系統之光學模組以及影像感測器擷取成像表面上之光學影像以形成一觀測視角近乎垂直物件之數位影像。 The present invention provides a scanning system that utilizes a plurality of optical modules of a side-by-side configuration lens, such as a rod lens array, to converge light from an object onto an imaging surface to form a planarized optical image, and then utilize a single lens The optical module of the optical system and the image sensor capture the optical image on the imaging surface to form a digital image of the near-vertical object of the observed viewing angle.
本發明一實施例之掃描系統包含一成像表面、一第一光學模組、一影像感測器以及一第二光學模組。第一光學模組用以會聚反射或透射自一物件之一第一光線,並將第一光線投射至成像表面以形成一光學影像,其中第一光學模組包含多個第一透鏡,且多個第一透鏡並排配置,使多個第一透鏡之一光軸彼此平行。影像感測器用以擷取成像表面上之光學影像,以形成一數位影像。第二光學模組設置於成像表面以及影像感測器之間,用以會聚光學影像之一第二光線至影像感測器,其中第二光學模組包含同軸配置之多個第二透鏡。 A scanning system according to an embodiment of the invention includes an imaging surface, a first optical module, an image sensor, and a second optical module. The first optical module is configured to condense or transmit a first light from one of the objects, and project the first light onto the imaging surface to form an optical image, wherein the first optical module includes a plurality of first lenses, and The first lenses are arranged side by side such that the optical axes of one of the plurality of first lenses are parallel to each other. The image sensor is used to capture an optical image on the imaging surface to form a digital image. The second optical module is disposed between the imaging surface and the image sensor for collecting a second light of the optical image to the image sensor, wherein the second optical module comprises a plurality of second lenses disposed coaxially.
以下藉由具體實施例配合所附的圖式詳加說明,當更容易瞭解本發明之目的、技術內容、特點及其所達成之功效。 The purpose, technical contents, features, and effects achieved by the present invention will become more apparent from the detailed description of the appended claims.
請參照圖3以及圖4,以說明本發明之一實施例之掃描系統,其中圖3為與掃描方向A垂直之側視示意圖;圖4為與掃描方向(垂直紙面)平行之側視示意圖。本發明之掃描系統包含一第一光學模組31、一成像表面32、一第二光學模組33以及一影像感測器34。第一光學模組31用以會聚來自一物件30之一第一光線30R,並將第一光線30R投射至成像表面32以形成一光學影像。舉例而言,成像表面32可為一具有散射性質之粗化表面或摻雜散射材料之透光屏幕等。 Referring to FIG. 3 and FIG. 4, a scanning system according to an embodiment of the present invention is illustrated, wherein FIG. 3 is a side view perpendicular to the scanning direction A; and FIG. 4 is a side view parallel to the scanning direction (vertical paper surface). The scanning system of the present invention comprises a first optical module 31, an imaging surface 32, a second optical module 33 and an image sensor 34. The first optical module 31 is configured to concentrate a first light 30R from an object 30 and project the first light 30R onto the imaging surface 32 to form an optical image. For example, imaging surface 32 can be a roughened surface having scattering properties or a light transmissive screen doped with a scattering material, and the like.
第一光線30R可為透射物件30或經物件30反射之光線。舉例而言,於圖3所示之實施例中,本發明之掃描系統包含一光源35,其與 該第一光學模組31分別設置於物件30之相對側。光源35用以提供一照明光至物件30。因此,光源35所發出之光線透射過物件30而形成第一光線30R,第一光線30R再入射至第一光學模組31。但不限於此,光源35’亦可與第一光學模組31設置於物件30之相同側,使得光源35’所發出之光線經由物件30反射形成第一光線30R,第一光線30R再入射至第一光學模組31。於一實施例中,光源35、35’可為一發光二極體、一冷陰極螢光燈(Cold Cathode Fluorescent Lamp,CCFL)或其它型式之光源。 The first light 30R can be a light that is transmitted through the object 30 or reflected by the object 30. For example, in the embodiment shown in FIG. 3, the scanning system of the present invention includes a light source 35, which The first optical modules 31 are respectively disposed on opposite sides of the object 30. The light source 35 is used to provide an illumination light to the object 30. Therefore, the light emitted by the light source 35 is transmitted through the object 30 to form the first light 30R, and the first light 30R is incident on the first optical module 31. However, the light source 35' may be disposed on the same side of the object 30 as the first optical module 31, so that the light emitted by the light source 35' is reflected by the object 30 to form the first light 30R, and the first light 30R is incident on the first light 30R. The first optical module 31. In one embodiment, the light source 35, 35' can be a light emitting diode, a Cold Cathode Fluorescent Lamp (CCFL) or other type of light source.
於一實施例中,第一光學模組31包含多個第一透鏡31a。多個第一透鏡31a為並排配置,亦即第一透鏡31a之一光軸彼此平行。舉例而言,第一光學模組31可為一桿透鏡陣列(rod lens array)。依據此結構,成像表面32上所形成之光學影像中,對應於物件30每一個位置的觀測視角皆近乎垂直於物件30。 In an embodiment, the first optical module 31 includes a plurality of first lenses 31a. The plurality of first lenses 31a are arranged side by side, that is, one of the optical axes of the first lens 31a is parallel to each other. For example, the first optical module 31 can be a rod lens array. According to this configuration, in the optical image formed on the imaging surface 32, the viewing angle corresponding to each position of the object 30 is nearly perpendicular to the object 30.
接續上述說明,第二光學模組33設置於成像表面32以及影像感測器34之間。第二光學模組33用以會聚成像表面32上之光學影像之一第二光線32R至影像感測器34。如此,影像感測器34擷取成像表面32上之光學影像以形成一數位影像。於一實施例中,第二光學模組33包含同軸配置之多個第二透鏡33a、33b。舉例而言,第二光學模組33可為一單鏡頭光學系統之取像鏡頭。較佳者,第二光學模組33可為一變焦鏡頭。如此,本發明之掃描系統可藉由調整第二光學模組33以改變投射至影像感測器34之數位影像之放大率。換言之,使用者可藉由調整第二光學模組33以掃描物件30之局部區域,進而取得局部區域之較高解析度之數位影像。或者,藉由多次局部掃描物件30,再經影像處理以取得完整物件30之較高解析度之數位影像。需注意者,圖3以及圖4所示之實施例是以第一光學模組31以及第二光學模組33之光軸彼此平行作說明。但不限於此,第一光學模組31之光軸以及第二光學模組33之光軸可依據設計需求而具有一夾角。 Following the above description, the second optical module 33 is disposed between the imaging surface 32 and the image sensor 34. The second optical module 33 is configured to converge the second light 32R of the optical image on the imaging surface 32 to the image sensor 34. As such, image sensor 34 captures the optical image on imaging surface 32 to form a digital image. In one embodiment, the second optical module 33 includes a plurality of second lenses 33a, 33b disposed coaxially. For example, the second optical module 33 can be an image taking lens of a single lens optical system. Preferably, the second optical module 33 can be a zoom lens. As such, the scanning system of the present invention can change the magnification of the digital image projected to the image sensor 34 by adjusting the second optical module 33. In other words, the user can adjust the partial area of the object 30 by adjusting the second optical module 33 to obtain a higher resolution digital image of the local area. Alternatively, by performing a plurality of partial scans of the object 30, image processing is performed to obtain a higher resolution digital image of the complete object 30. It should be noted that the embodiments shown in FIG. 3 and FIG. 4 are described in which the optical axes of the first optical module 31 and the second optical module 33 are parallel to each other. However, the optical axis of the first optical module 31 and the optical axis of the second optical module 33 may have an included angle according to design requirements.
依據上述結構,適當設計之第二光學模組33可與多種規格之影像 感測器34搭配使用,換言之,設計者有較多影像感測器34之種類可選擇使用,以降低取得影像感測器34的成本。於一實施例中,影像感測器可為一線性感測器(linear sensor)。舉例而言,影像感測器可為電荷耦合元件(Charge Coupled Device,CCD)或互補式金屬氧化物半導體(Complementary Metal Oxide Semiconductor,CMOS)感測器。 According to the above structure, the appropriately designed second optical module 33 can be combined with various specifications of the image. The sensor 34 is used in combination, in other words, the designer has a plurality of types of image sensors 34 that can be selectively used to reduce the cost of acquiring the image sensor 34. In an embodiment, the image sensor can be a linear sensor. For example, the image sensor can be a Charge Coupled Device (CCD) or a Complementary Metal Oxide Semiconductor (CMOS) sensor.
於一實施例中,本發明之掃描系統包含一驅動模組(未圖示)。驅動模組可驅動第一光學模組31以及物件30沿一掃描方向A相對移動。舉例而言,驅動模組可與第一光學模組31連接,以驅動第一光學模組31沿掃描方向A掃描靜止之物件30。或者,驅動模組與一平台連接,以驅動平台沿一掃描方向A移動。物件30放置於平台上即可隨著平台移動並通過靜止之第一光學模組31之掃描區域以進行掃描作業。於一實施例中,驅動模組可為一步進馬達。 In one embodiment, the scanning system of the present invention includes a drive module (not shown). The driving module can drive the first optical module 31 and the object 30 to relatively move in a scanning direction A. For example, the driving module can be connected to the first optical module 31 to drive the first optical module 31 to scan the stationary object 30 in the scanning direction A. Alternatively, the drive module is coupled to a platform to drive the platform to move in a scan direction A. The object 30 is placed on the platform to move along with the platform and pass through the scanning area of the stationary first optical module 31 for scanning operations. In an embodiment, the driving module can be a stepping motor.
圖3以及圖4所示之實施例中,第一光學模組31以及第二光學模組33是設置於成像表面32之相異側,亦即第一光學模組31所會聚之光線透射成像表面32,再入射至第二光學模組33。但不限於此,請參照圖5,於一實施例中,第一光學模組31以及第二光學模組33是設置於成像表面32之相同側。因此,第一光學模組31所會聚之光線是經由成像表面32反射,再入射至第二光學模組33。 In the embodiment shown in FIG. 3 and FIG. 4, the first optical module 31 and the second optical module 33 are disposed on opposite sides of the imaging surface 32, that is, the light transmitted by the first optical module 31 is transmitted and imaged. The surface 32 is incident on the second optical module 33. However, referring to FIG. 5 , in an embodiment, the first optical module 31 and the second optical module 33 are disposed on the same side of the imaging surface 32 . Therefore, the light concentrated by the first optical module 31 is reflected by the imaging surface 32 and then incident on the second optical module 33.
請參照圖6a,於一實施例中,本發明之掃描系統包含一反射元件36,其設置於成像表面32以及第二光學模組33之間。反射元件36可反射來自成像表面32之第二光線32R,使第二光線32R以彎折的路徑入射至第二光學模組33。如圖6a所示,第一光線30R以及第二光線32R之光軸彼此呈垂直。因此,藉由反射元件36可增加本發明之掃描系統之設計彈性。需注意者,依據實際設計需求,反射元件36可為多個,如圖6b所示,以進一步增加本發明之掃描系統之設計彈性。 Referring to FIG. 6a, in one embodiment, the scanning system of the present invention includes a reflective element 36 disposed between the imaging surface 32 and the second optical module 33. The reflective element 36 reflects the second ray 32R from the imaging surface 32 such that the second ray 32R is incident on the second optical module 33 in a bent path. As shown in FIG. 6a, the optical axes of the first ray 30R and the second ray 32R are perpendicular to each other. Therefore, the design flexibility of the scanning system of the present invention can be increased by the reflective member 36. It should be noted that depending on actual design requirements, there may be multiple reflective elements 36, as shown in FIG. 6b, to further increase the design flexibility of the scanning system of the present invention.
請參照圖7,於一實施例中,本發明之掃描系統包含一可控制光圈37,其設置於第二光學模組33以及影像感測器34之間。可控制光圈37可用以調整進入影像感測器34之第二光線32R之光強度,或 者可防止一外部光線入射至影像感測器34。 Referring to FIG. 7 , in an embodiment, the scanning system of the present invention includes a controllable aperture 37 disposed between the second optical module 33 and the image sensor 34 . The control aperture 37 can be used to adjust the intensity of the light entering the second light 32R of the image sensor 34, or An external light can be prevented from entering the image sensor 34.
綜合上述,本發明之掃描系統是利用多個並排配置之透鏡之第一光學模組,例如桿透鏡陣列,將來自物件之光線會聚至一成像表面以形成一平面化之光學影像,接著再利用單鏡頭光學系統之第二光學模組以及影像感測器擷取成像表面上之光學影像。因此,本發明之掃描系統採用單鏡頭光學系統之第二光學模組仍可獲得觀測視角近乎垂直物件之數位影像。此外,藉由調整第二光學模組之取像範圍即可改變系統之掃描寬度,而不需更換影像感測器。換言之,不同型式之掃描系統可以採用同一種規格之影像感測器,不僅降低取得元件的成本,亦可降低元件的管理成本。採用變焦之第二光學模組更可獲得物件局部之較高解析度之數位影像。 In summary, the scanning system of the present invention utilizes a plurality of first optical modules arranged side by side, such as a rod lens array, to converge light from an object onto an imaging surface to form a planarized optical image, and then reuse The second optical module of the single lens optical system and the image sensor capture optical images on the imaging surface. Therefore, the scanning system of the present invention can still obtain a digital image of a near-vertical object with an observation angle of view using the second optical module of the single-lens optical system. In addition, the scanning width of the system can be changed by adjusting the imaging range of the second optical module without replacing the image sensor. In other words, different types of scanning systems can use the same type of image sensor, which not only reduces the cost of acquiring components, but also reduces the management cost of components. The second optical module with zooming can obtain a higher resolution digital image of the object.
以上所述之實施例僅是為說明本發明之技術思想及特點,其目的在使熟習此項技藝之人士能夠瞭解本發明之內容並據以實施,當不能以之限定本發明之專利範圍,即大凡依本發明所揭示之精神所作之均等變化或修飾,仍應涵蓋在本發明之專利範圍內。 The embodiments described above are only intended to illustrate the technical idea and the features of the present invention, and the purpose of the present invention is to enable those skilled in the art to understand the contents of the present invention and to implement the present invention. That is, the equivalent variations or modifications made by the spirit of the present invention should still be included in the scope of the present invention.
10、20‧‧‧物件 10, 20‧‧‧ objects
11‧‧‧桿透鏡模組 11‧‧‧ rod lens module
12、22‧‧‧影像感測器 12, 22‧‧‧ image sensor
21‧‧‧單鏡頭模組 21‧‧‧Single lens module
30‧‧‧物件 30‧‧‧ objects
30R‧‧‧第一光線 30R‧‧‧First light
31‧‧‧第一光學模組 31‧‧‧First optical module
31a‧‧‧第一透鏡 31a‧‧‧first lens
32‧‧‧成像表面 32‧‧‧ imaging surface
32R‧‧‧第二光線 32R‧‧‧second light
33‧‧‧第二光學模組 33‧‧‧Second optical module
33a、33b‧‧‧第二透鏡 33a, 33b‧‧‧ second lens
34‧‧‧影像感測器 34‧‧‧Image Sensor
35、35’‧‧‧光源 35, 35' ‧ ‧ light source
36‧‧‧反射元件 36‧‧‧reflecting elements
37‧‧‧可控制光圈 37‧‧‧Control aperture
A‧‧‧掃描方向 A‧‧‧ scan direction
圖1為一示意圖,顯示習知之掃描系統。 Figure 1 is a schematic diagram showing a conventional scanning system.
圖2為一示意圖,顯示習知之影像擷取系統。 Figure 2 is a schematic diagram showing a conventional image capture system.
圖3為一示意圖,顯示本發明第一實施例之掃描系統。 Figure 3 is a schematic view showing the scanning system of the first embodiment of the present invention.
圖4為一示意圖,顯示本發明第一實施例之掃描系統。 Figure 4 is a schematic view showing the scanning system of the first embodiment of the present invention.
圖5為一示意圖,顯示本發明第二實施例之掃描系統。 Figure 5 is a schematic view showing a scanning system of a second embodiment of the present invention.
圖6a為一示意圖,顯示本發明第三實施例之掃描系統。 Figure 6a is a schematic view showing a scanning system of a third embodiment of the present invention.
圖6b為一示意圖,顯示本發明第四實施例之掃描系統。 Figure 6b is a schematic view showing a scanning system of a fourth embodiment of the present invention.
圖7為一示意圖,顯示本發明第五實施例之掃描系統。 Figure 7 is a schematic view showing a scanning system of a fifth embodiment of the present invention.
30‧‧‧物件 30‧‧‧ objects
30R‧‧‧第一光線 30R‧‧‧First light
31‧‧‧第一光學模組 31‧‧‧First optical module
31a‧‧‧第一透鏡 31a‧‧‧first lens
32‧‧‧成像表面 32‧‧‧ imaging surface
32R‧‧‧第二光線 32R‧‧‧second light
33‧‧‧第二光學模組 33‧‧‧Second optical module
33a、33b‧‧‧第二透鏡 33a, 33b‧‧‧ second lens
34‧‧‧影像感測器 34‧‧‧Image Sensor
35‧‧‧光源 35‧‧‧Light source
Claims (12)
Priority Applications (1)
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TW101125241A TWI451128B (en) | 2012-07-13 | 2012-07-13 | Scanning system |
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TW101125241A TWI451128B (en) | 2012-07-13 | 2012-07-13 | Scanning system |
Publications (2)
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TW201403126A true TW201403126A (en) | 2014-01-16 |
TWI451128B TWI451128B (en) | 2014-09-01 |
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TW101125241A TWI451128B (en) | 2012-07-13 | 2012-07-13 | Scanning system |
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TW (1) | TWI451128B (en) |
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Publication number | Priority date | Publication date | Assignee | Title |
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JP2001174606A (en) * | 1999-12-20 | 2001-06-29 | Nippon Sheet Glass Co Ltd | Image forming optical device |
TW200906165A (en) * | 2007-07-16 | 2009-02-01 | E Pin Optical Industry Co Ltd | Optical scanning module with linear complementary metal oxide semiconductor (CMOS) image sensor |
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