TW200906165A - Optical scanning module with linear complementary metal oxide semiconductor (CMOS) image sensor - Google Patents
Optical scanning module with linear complementary metal oxide semiconductor (CMOS) image sensor Download PDFInfo
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200906165 321、322、323 .反射鏡片(reflection mirror) 33 :聚焦鏡片組(focus lens group) 34 ·線性 CMOS 影像感測元件(i inear· CMOS image sensor) 八、 本案若有化學式時,請揭示最能顯示發明特徵 的化學式:(無) 九、 發明說明: 【發明所屬之技術領域】200906165 321, 322, 323. Reflection mirror 33: Focus lens group 34 · Linear CMOS image sensor (i inear· CMOS image sensor) 8. If there is a chemical formula in this case, please reveal the most Chemical formula showing the characteristics of the invention: (none) IX. Description of the invention: [Technical field to which the invention pertains]
Ο 本發明係有關一種影像系統之光學掃瞄裝置,尤指一 種利用線性互補式金氧半導體影像感測元件(linear CM0S image sensor)構成之光學掃瞒模組(〇pticai scanning module) ’以可應用於影像系統如掃瞄器或多功能事務機 等。 【先前技術】 目刖在影像系統(imaging system)中,係以光線掃 瞒物體並再轉換成電子信號而加以應用,如掃瞄器 (scanner)、列印機(printer)、傳真機(fax machine)、 或整合影印、掃瞄、列印、傳真為一體之多功能事務機 (MPF ’ multi-function printer)為最常見;這些影像 系統大都具有光學掃瞄模組(〇ptical scanning module),其作用方式主要為:掃瞄模組内設有一光源, ,光源可發出光線射至待掃瞄或列印的圖片或文字上,再 藉衫像感測元件(image sensor,或稱影像感光器)接 ^反射之光線’而得到對應於圖樣上的電子訊號;其中該 光學掃猫模組使用的影像感測元件主要有兩種,一是光電 ,口 衫像感測元件 CCD (Charge Coupled Device );另一 :接觸式影像感測元件Cis (Contact Image Sensor); =掃描严質上看’ CCD影像感測元件由於發展時間長,技 術成熟’可得到較小的信號對雜訊S/N比 200906165 (signa卜to-noise ratio),因此CCD影像感測元件之掃 描品質要比CIS影像感測元件好;而CIS影像感測元件有 成本低、輕巧和超薄等特點,適合於空間比較擁擠的環 境,而且不需調節及熱機,所以啟動比CCD影像感測元件 快。 參照圖1所示,其係先前技術中一 CCD光學掃瞄模組 (CCDM)之結構示意圖,其係以光電耦合元件cCD(Charge Coupled Device )構成之CCD光學掃瞄模組(CCDM,CCD module)卜其光源11為達最佳效果一般是使用冷陰極螢 ζ) 光燈管(CCFL、F1 uorescent)發出白光,經由一窄長的 孔徑(Aperture)(圖中未示)照射於待掃瞄物件1〇上, 其反射光可經由反射鏡片12及聚焦鏡片13而聚焦成像於 CCD影像感測元件16上。CCD影像感測元件16是半導體 1C元件的一種,採用半導體的製程製作,其解析度較不受 製程影響,因此可隨需要做成高、中、低解析度的感測元 件。由於CCD影像感測元件16的長度比一般待掃瞄物件 10 (如文件或圖片)的寬度短很多,掃描時必須使用反射 鏡片12及聚焦鏡片13將圖像縮小,才能完整地掃描。對 於A4尺寸的待掃瞄物件1〇反射光線後,經反射鏡片12 J 與聚焦鏡片13至CCD影像感測元件16,其焦距(F〇cus Length)約為1公尺,雖景深d〇F (depth of focus)較大 可以掃瞄有點摺皺的紙張,但相對也使CCDM 1體積較大; 又由於CCD影像感測元件16相較於待掃瞒物件1 〇小,需 要將待掃瞄物件10相對位置聚焦到CCD影像感測元件16 上’而增加了在組裝上調整的必要性;但CCD影像感測元 件16可接受低雜訊比s/N,故色彩較豐富,如 JP2006-067504、US2004/263915 等所揭露。 該CCD影像感測元件16發展上有陣列cCD(array CCD) 及線性CCD(linear CCD),這些利用CCD影像感測元件16 200906165 構成的光學掃瞄模組CCDM主要的問題在於:該CCD影像 感測元件16需要額外的電子元件,才能將CCD影像感測 元件16轉換後的類比信號轉成數位信號而傳輸至外界使 用’此稱為影像擷取的後端功能;此影像擷取的後端功能 所需的元件如圖3,若要以低壓差動(LVDS,Low VoltageThe present invention relates to an optical scanning device for an image system, and more particularly to an optical squeegee module (〇pticai scanning module) constructed by a linear complementary CMOS image sensor. Used in imaging systems such as scanners or multifunction machines. [Prior Art] It is used in an imaging system to apply a light broom and convert it into an electronic signal, such as a scanner, printer, or fax machine. Machines, or integrated photocopying, scanning, printing, and faxing (MPF 'multi-function printers) are the most common; most of these imaging systems have optical scanning modules (〇ptical scanning modules). The mode of action is mainly: a light source is arranged in the scanning module, and the light source can emit light to the picture or text to be scanned or printed, and then the image sensor or image sensor is used. The optical signal corresponding to the pattern is obtained by the reflection of the light ray. The image sensing component used in the optical sniffer module has two main types: one is photoelectric, and the hood is like a sensing component CCD (Charge Coupled Device) ); another: contact image sensing component Cis (Contact Image Sensor); = scanning strictly see 'CCD image sensing components due to long development time, mature technology' can get smaller signal to noise S/N ratio is 200906165 (signa to-noise ratio), so the scanning quality of CCD image sensing components is better than CIS image sensing components; and CIS image sensing components are low cost, light and ultra-thin, suitable for In a more crowded environment, and no need to adjust and heat, so start faster than CCD image sensing components. Referring to FIG. 1 , it is a schematic diagram of a CCD optical scanning module (CCDM) in the prior art, which is a CCD optical scanning module (CCDM, CCD module) formed by a photoelectric coupling component cCD (Charge Coupled Device). The light source 11 is generally used to emit white light by using a cold cathode fluorescent lamp (CCFL, F1 uorescent), and is irradiated to be scanned through a narrow aperture (not shown). On the object 1 , the reflected light can be focused and imaged on the CCD image sensing element 16 via the reflective lens 12 and the focusing lens 13 . The CCD image sensing element 16 is a type of semiconductor 1C element, which is fabricated by a semiconductor process, and its resolution is less affected by the process, so that high, medium, and low resolution sensing elements can be formed as needed. Since the length of the CCD image sensing element 16 is much shorter than the width of the object 10 to be scanned (such as a document or a picture), the image must be reduced by using the reflecting lens 12 and the focusing lens 13 during scanning to be completely scanned. After the reflected light is reflected by the A4 size object to be scanned, the focal length (F〇cus Length) of the reflective lens 12 J and the focusing lens 13 to the CCD image sensing element 16 is about 1 meter, although the depth of field d〇F (depth of focus) can scan a little wrinkled paper, but relatively makes the CCDM 1 larger; and because the CCD image sensing element 16 is smaller than the object to be bounced 1, the object to be scanned needs to be scanned. 10 relative position focusing on the CCD image sensing element 16' increases the necessity of adjustment in assembly; but the CCD image sensing element 16 can accept a low noise ratio s/N, so the color is rich, such as JP2006-067504 , US2004/263915, etc. are disclosed. The CCD image sensing component 16 has an array of cCD (array CCD) and a linear CCD (linear CCD). The main problem of the optical scanning module CCDM using the CCD image sensing component 16 200906165 is that the CCD image is sensed. The measuring component 16 requires additional electronic components to convert the analog signal converted by the CCD image sensing component 16 into a digital signal for transmission to the outside world. This is called the back end function of image capturing; the rear end of the image capturing The components required for the function are shown in Figure 3. If low voltage differential (LVDS, Low Voltage)
Differential Signaling)數位格式傳輸至外界,該a/D 類比數位轉換/傳輸器15則包括:時序器14、發射器 (Emitter)153、A/D轉換單元151及LVDS傳送單元152 ; CCD影像感測元件16受時序器μ控制產生的電子信號先 〇 經由發射器153發出類比信號,而A/D轉換單元151以將 ' 此類比信號轉換成數位信號,而LVDS傳送單元152將此 數位仏號以LVDS數位格式的信號經由接頭161向外界傳 輸,由於CCD影像感測元件16不能與這些影像操取後端 的元件做到整合為一,故增加複雜度及降低可靠度,也相 對增加成本’使CCDM在發展上受到阻礙。Differential Signaling) is transmitted to the outside world. The a/D analog-to-digital converter/transmitter 15 includes: a sequencer 14, an emitter (Emitter) 153, an A/D conversion unit 151, and an LVDS transmission unit 152; CCD image sensing The electronic signal generated by the element 16 is controlled by the timing device μ to emit an analog signal via the transmitter 153, and the A/D conversion unit 151 converts the analog signal into a digital signal, and the LVDS transmission unit 152 sets the digital signal to The signal of the LVDS digital format is transmitted to the outside through the connector 161. Since the CCD image sensing component 16 cannot be integrated with the components of the image processing back end, the complexity and reliability are reduced, and the cost is relatively increased. It is hindered in development.
參照圖2所示,其係先前技術中一 CIS光學掃瞄模組 (CISM)之結構示意圖,其係以接觸式影像感測器cIS (contact image sensor)構成之CIS光學掃^模会 (CISM,CIS module) 2,其光源21大多是以發光二極體 LED (light—emitting diodes)形成的線性光源(Hnear light source),LED線性光源21是直接將LED晶片 間隔黏著在一長條形印刷線路板上,LED晶片 : 經由導光板(light guide)(圖中未示)折射後,形昭 度均勻的線性光源,以確保光線可分佈射出至待掃猫^ 20上,光線經由待掃瞄物件2〇反射後先經過一棱 (rod lens) 22而再成像於CIS影像感測元件23 、見 CIS影像感測元件23可將此掃瞄光線轉變成電 經由外加的時序器24與A/D類比數位轉換/傳輸琴^ 數位格式傳輸至外界使用,而得到對應於待掃瞄物件加 200906165 之圖片,文字上彩色或黑白灰階變化的電子數位訊號。如 圖4所不,是以一陣列CSIM (Array CSIM)為例說明, 類比數位轉換/傳輸器25若要以低壓差動(LVDS)數位格式 傳輸至^卜界,則影像擷取後端的元件包含:時序器24、水 平解碼單元232、垂直解碼單元233、A/D轉換單元251 與LVDSJ專送單元253;時序器24產生的時序信號驅動水 平解碼單元232將CIS影像感測元件23的水平電子信號 經由A/D轉換單元251與1^〇)8傳送單元253轉換成^^3 數位格式的信號向外界傳輸;在下一個時序,時序器24 0 產生的時序信號驅動垂直解碼單元233將垂直電子信號經 由A/D轉換單元251與LVDS傳送單元253轉換成LVDS數 位格式的信號向外界傳輸;如US2005/0145701、 US7,166,827 、 US2003/0076552 、 US2007/0035785 、 US6, 827, 269所揭露等。 在光學考慮上,由於柱狀透鏡(r〇d iens) 22是由一 排小口徑的漸變折射率柱狀透鏡(radiai gradient in(|ex lens)構成’每個透鏡的折射率沿徑向逐漸改變,使柱狀 透鏡22具有成像的功能。整個柱狀透鏡22能將待掃瞄物 件20之圖片或文字以1:1的比例成像於CIS影像感測元 ^ 件23 ’也就是CIS影像感測元件23之長度須與待掃瞄物 件20同長度;另,柱狀透鏡22成像的優點為光路徑短, 但缺點是景深小,因此掃瞄時,待掃瞄物件(如圖片或文 字物件)必須貼著掃瞄器之特定平面,也要求待掃瞄物件 必須比較平整,也就是當待掃瞄物件上有不平整處(如圖 片或文字物件之表面有凹凸落差時),則内凹處之成像會 形成黑色部分,相對地更難以發展成掃瞄立體物件;因此 如CN200620175613發展CCDM或CSIM使用的鏡頭,如 US6, 111,244發展長景深的影像掃瞄裝置,運用透鏡與反 射鏡組合,使掃瞄光線能成像於CIS影像感測元件23'上 200906165 以具有良好的景深。 另一方面’CIS影像感測元件23可以互補式金氧半導 體 CMOS (Complementary Metal-Oxide- Semiconductor) 邏輯製程製造’而有陣列CMOS影像感測元件(Array CMOS image sensor ’或稱為面型CMOS影像感測元件Area CMOS image sensor)與線性CMOS影像感測元件(Linear CMOS image sensor)之使用’其中,陣列CMOS影像感測元件一 般是應用於手機照相模組,不同於本發明之影像光學掃瞄 模組;而如 US2007/0024926 、 US2007/0045510 與 〇 TW00490977 ’揭露利用陣列CMOS影像感測元件於影像擷 取裝置;如 US7,113,215 、US2005/0145701 及 US2003/0146994揭露發展CMOS用於影像感測元件的技 術,但在電子信號傳輸仍要外加類比數位轉換器與傳輸 器;US2002/0096623揭露線性CMOS影像感測元件裝置; US2002/0096625揭露線性CMOS影像感測元件傳輸資料的 方法’使得線性CMOS影像感測元件可實現於影像的感測。 由於線性CMOS影像感測元件因為是線性的,所以只 有一列感光元件,使得它的運作速度比陣列CMOS影像感 C; 測元件還快;加上線性CMOS影像感測元件的低耗能特性, 可有效減輕可攜式電子產品在功率上的負擔;因此,發展 一能解決降低耗電、速度高、便於將電子信號傳輸至外界 的光學掃瞄模組’乃為迫切需求。 再,,對於多功能事務機等使用需求,掃瞄後的電子 信號要能方便、快速的傳輸至其他使用,且線性CM〇s影 像感測元件可與影像擷取後端的功能,如ADC (類 轉換)、DSP(數位信號處理器)、解碼(Enc〇der)、界面 (Interface)整合為一單晶片(s〇c,systein 〇n chip),有 助於解決傳輸界面整合與傳輸便利性,因此應發展一能簡 200906165 易、高可靠度且能與線性CMOS影像感測元件結合的傳輸 方式,也為需要突破的問題。 【發明内容】 鑑於習知技術在線性CCDM存在掃瞄資訊傳輸上可靠 度低、成本高的問題;在CISM甚至使用CMOS影像感測元 件則有景深小、S/N比過低的缺點與限制及傳輸仍要外加 類比數位轉換器與傳輸器的不便;因此,本發明主要目的 乃在於提供一種線性互補式金氧半導體(CM〇s)影像光學掃瞄 杈組(Optical Scanning Module with Linear CMOS Image 〇 Sensor)(以下簡稱:線性CMOSM),其係包含:一可發出 掃瞄光線的光源、一反射鏡片組、一聚焦鏡片組、及一 CMOS影像感測元件且其中至少包含一線性互補式金氧半 導體(CMOS)影像感測單元(image sensor unit),其中 該光源可使用冷陰極螢光燈管(CCFL,Fluorescent)或 氙(Xe)氣燈管或直下式發光二極體(LED)為任一光源, 光源發出光線後照射於待掃瞄物件上,待掃瞒物件反射其 光線成為掃瞄光線’再經反射鏡片組及聚焦鏡片組而聚焦 射至該線性CMOS影像感測元件上並轉換成電子信號,再 藉該線性CMOS影像感測單元所具有之類比/數位轉換功 能,以通用匯流排(USB)或低壓差動(LVDS)信號傳輸 至外界,藉以達成高速掃猫、低失真率、具景深及傳輸方 便之需求。 a ' * +本發明所揭露之線性互補式金氧半導體(CM〇s)影像光學 掃猫模組(Optical Sc疆ing Module with Linear CMOS ImageReferring to FIG. 2, it is a schematic structural diagram of a CIS optical scanning module (CISM) in the prior art, which is a CIS optical scanning mode (CISM) composed of a contact image sensor cIS (contact image sensor). , CIS module) 2, the light source 21 is mostly a light source (light source) formed by a light source (Hnear light source), the LED linear light source 21 is directly bonded to the LED wafer in a long strip printing On the circuit board, the LED chip: after being refracted through a light guide (not shown), a linear light source with a uniform shape to ensure that the light can be distributed and emitted to the cat to be scanned, and the light is scanned. After the object 2 is reflected, it is first imaged through the rod lens 22 and then imaged on the CIS image sensing element 23, and the CIS image sensing element 23 can convert the scanned light into electricity via the applied sequencer 24 and A/. The D-class digital-to-digital conversion/transfer piano digital format is transmitted to the outside world, and an electronic digital signal corresponding to the image to be scanned and 200906165 is obtained, and the text is colored or black and white. As shown in FIG. 4, an array CSIM (Array CSIM) is taken as an example. If the analog-to-digital conversion/transporter 25 is to be transmitted to the boundary in a low-voltage differential (LVDS) digital format, the image captures the components at the back end. Including: a sequencer 24, a horizontal decoding unit 232, a vertical decoding unit 233, an A/D conversion unit 251, and an LVDSJ dedicated unit 253; the timing signal generated by the sequencer 24 drives the horizontal decoding unit 232 to level the CIS image sensing element 23. The electronic signal is converted to a signal of the ^3 digital format via the A/D conversion unit 251 and the transmission unit 253 to the outside; at the next timing, the timing signal generated by the sequencer 24 drives the vertical decoding unit 233 to be vertical. The electronic signal is converted to a signal of the LVDS digit format via the A/D conversion unit 251 and the LVDS transmission unit 253, and is transmitted to the outside; as disclosed in US2005/0145701, US 7,166,827, US 2003/0076552, US 2007/0035785, US 6, 827, 269, etc. . In optical considerations, since the lenticular lens 22 is composed of a row of small-diameter gradient index lenticular lenses (radius gradient in (|ex lens)', the refractive index of each lens gradually increases in the radial direction. The lenticular lens 22 has a function of imaging. The entire lenticular lens 22 can image the picture or text of the object to be scanned 20 in a 1:1 ratio to the CIS image sensing element 23', that is, the CIS image sense. The length of the measuring element 23 must be the same length as the object to be scanned 20; in addition, the advantage of the imaging of the lenticular lens 22 is that the optical path is short, but the disadvantage is that the depth of field is small, so when scanning, the object to be scanned (such as a picture or a text object) ) must be attached to the specific plane of the scanner, and also requires that the object to be scanned must be relatively flat, that is, when there is unevenness on the object to be scanned (such as when the surface of the picture or text object has unevenness), then the concave The imaging will form a black part, which is relatively more difficult to develop into a scanning three-dimensional object; therefore, such as CN200620175613 develops a lens used by CCDM or CSIM, such as US6, 111, 244 to develop a long depth of field image scanning device, using lenses and mirrors In combination, the scanning light can be imaged on the CIS image sensing element 23'200906165 to have a good depth of field. On the other hand, the 'CIS image sensing element 23 can be complementary CMOS (Complementary Metal-Oxide- Semiconductor) logic Process manufacturing' has an array CMOS image sensor (or CMOS image sensor or CMOS image sensor) and a linear CMOS image sensor. The array CMOS image sensing component is generally applied to a mobile phone camera module, which is different from the image optical scanning module of the present invention; and such as US2007/0024926, US2007/0045510 and 〇TW00490977 'exposing the use of array CMOS image sensing components for images A device for image sensing components is disclosed in US Patent Application Publication No. 7,113,215, US 2005/0145701, and US 2003/0146994, but analog digital converters and transmitters are still added to electronic signal transmission; US 2002/0096623 discloses linear CMOS Image sensing component device; US2002/0096625 discloses a method for transmitting data by a linear CMOS image sensing component The linear CMOS image sensing element can realize the sensing of the image. Since the linear CMOS image sensing element is linear, there is only one column of photosensitive elements, so that its operation speed is faster than the array CMOS image sensing C; In addition, the low energy consumption of the linear CMOS image sensing component can effectively reduce the power burden of the portable electronic product; therefore, the development can solve the problem of reducing power consumption, high speed, and convenient transmission of electronic signals to the outside world. The scanning module' is an urgent need. Furthermore, for the use of MFPs, the scanned electronic signals can be easily and quickly transferred to other uses, and the linear CM〇s image sensing components can be used with the image capture backend functions, such as ADC ( Class conversion), DSP (digital signal processor), decoding (Enc〇der), interface (Interface) integrated into a single chip (s〇c, systein 〇n chip), help to solve the transmission interface integration and transmission convenience Therefore, it is necessary to develop a transmission method that can be easily and highly reliable and can be combined with a linear CMOS image sensing element, and is also a problem that needs to be broken. SUMMARY OF THE INVENTION The conventional technology has the problems of low reliability and high cost in the scanning information transmission in the linear CCDM. In CISM, even the CMOS image sensing element has the disadvantages and limitations of small depth of field and low S/N ratio. And the transmission still has the inconvenience of adding an analog digital converter and a transmitter; therefore, the main object of the present invention is to provide a linear complementary CMOS image (Optical Scanning Module with Linear CMOS Image). 〇Sensor) (hereinafter referred to as linear CMOSM), comprising: a light source capable of emitting scanning light, a reflecting lens group, a focusing lens group, and a CMOS image sensing element and including at least one linear complementary gold An oxygen semiconductor (CMOS) image sensor unit, wherein the light source can be a cold cathode fluorescent lamp (CCFL, Fluorescent) or a xenon (Xe) gas tube or a direct type light emitting diode (LED). Any light source, the light source emits light and then illuminates the object to be scanned, and the object to be bounce reflects the light to become the scanning light', and then gathers through the reflecting lens group and the focusing lens group. The linear CMOS image sensing element is incident on the linear CMOS image sensing element and converted into an electronic signal, and the analog/digital conversion function of the linear CMOS image sensing unit is transmitted by a universal bus (USB) or low voltage differential (LVDS) signal. To the outside world, to achieve high-speed sweeping cat, low distortion rate, depth of field and convenient transmission. a ' * + linear complementary metal oxide semiconductor (CM〇s) image optical scanning cat module disclosed in the present invention (Optical Sc Xinjiang ing Module with Linear CMOS Image
Sensor)(以下簡稱:線性CM0SM),主要係由:一可發出 掃猫光線的光源(light source )、一反射鏡片組 (reflection mirror group)、一聚焦鏡片組(f〇cus lens grοιιρ)、及一線性CM0S影像感測元件(丨inear CM〇s丨贴狀 sensor)所構成,其中該線性CM〇s影像感測元件至少包 200906165Sensor) (hereinafter referred to as linear CM0SM), mainly consists of: a light source that emits a cat's light, a reflection mirror group, a focusing lens group (f〇cus lens grοιιρ), and A linear CMOS image sensing component (丨inear CM〇s丨 状 sensor), wherein the linear CM 〇 image sensing component at least 200906165
含一線性互補式金氧半導體影像感測單元(線性CMOS image sensor unit);該反射鏡片組與聚焦鏡片組可依光 路安排’而藉由反射鏡片組之反射作用與聚焦鏡片組之聚 焦作用’可使原為1 : 1對應設計的線性CMOS影像感測元 件有效縮小長度,且使景深DOF ( depth of focus)加大’ 以提高線性CMOS影像感測元件對掃瞄光線的識別程度; 又該線性CMOS影像感測元件可以整合線性CMOS影像感測 單元與其他電子信號傳輸與轉換功能電路成以一單晶片 系統(S0C ’ System 〇n a Chip)構成,也就是使線性CMOS 影像感測早元與其他相關單元如時序產生單元、A/D類比 數位信號轉換單元、及LVDS轉換傳輸單元(LVDS transmission unit)或 USB 轉換傳輸單元(USB transmission unit)或 AD 轉換傳輸單元(AD transmission unit),整合在一個半導體晶片上,藉以使該一線性CM〇s 影像感測元件同時具有類比數位轉換Wnal〇g DigitalA linear complementary CMOS image sensor unit is included; the reflective lens group and the focusing lens group can be arranged according to the optical path and the focusing effect of the focusing lens group by the reflection of the reflecting lens group The linear CMOS image sensing component originally designed for 1:1 can be effectively reduced in length and the DOF (depth of focus) is increased to improve the recognition degree of the scanning ray by the linear CMOS image sensing component; The linear CMOS image sensing component can be integrated with a linear CMOS image sensing unit and other electronic signal transmission and conversion function circuits to form a single chip system (S0C 'System 〇na Chip), that is, to make linear CMOS image sensing early and Other related units such as a timing generation unit, an A/D analog-to-digital signal conversion unit, and an LVDS transmission unit or a USB transmission unit or an AD transmission unit are integrated in On a semiconductor wafer, the linear CM s image sensing element has analog digital conversion at the same time. g Digital
Converter)或通用匯流排 USB (Universal Serial Bus) 傳輸或低壓差動介面(LVDS);藉此,使本發明之線性 CM0SM達成尚速掃瞒、低失真率與傳輸方便之需求。 【實施方式】 參照圖5所示,本發明之線性互補式金氧半導體(CM〇s) 影像光學知站模組(Optical Scanning Module with Ϊ inpar (IIDS Image Sensor)(以下簡稱:線性CMOSM) 3,主要包含:一 光源31,可發出光線311(Li ght)而射向待掃猫物件go, 若為應用於掃瞄的目的,基本上是發出白色的光線但也不 限於白色光線;當光線311照射於待掃瞄物件3〇 I並反 射為掃瞄光線 312 (Reflected scanning light); —反射 鏡片組(reflection mirror group) 32,係由丄個或數 個反射鏡片(ref lection mirror)如圖示之反射^ 32卜322、323所組成,藉以使由待掃瞄物件3〇反射1掃 200906165 瞄光線312依預定之光路行進並射向後續之聚焦鏡片組 33 ; —聚焦鏡片組(focus lens group) 33,係由一個或 數個透鏡所組成,藉以使由反射鏡片組32出射之掃瞄光 線312聚焦;一線性CMOS影像感測元件(linear CMOS image sensor unit) 34,藉以將經聚焦鏡片組33聚焦後 的掃瞄光線轉變成電子信號,並將該電子信號轉換為數位 格式傳輸至外界使用;藉以達成縮小光學掃瞄模組體積、 提高解析度、降低失真率(Optical Distort ion)之目的。 參照圖6、圖7或圖8所示,由於該線性CMOS影像感 測元件(1 inear CMOS image sensor) 34可設計以單晶片 構成,故該線性CMOS影像感測元件(1 i near CMOS i mage sensor) 34進一步可包含:一線性CMOS影像感測單元 (linear CMOS image sensor unit) 341、一時序產生單 元(timing generator unit) 342、一 A/D 類比數位信號 轉換單元(A/D analog-digital converter) 343、及一 LVDS(低壓差動)轉換傳輸單元(LVDS transmission unit) 344 (如圖6所示)或一 USB (通用串列匯流排)轉換傳輸 單元(USB transmission unit )345(如圖 7 所示)或 A/D(類 比數位)轉換傳輸單元(A/D transmission unit) 346 (如 圖8所示);其中,線性CMOS影像感測單元341,用以將 成像的掃瞄光線312轉換成電子信號;時序產生單元342 用以產生時序以控制線性CMOS影像感測元件341進行取 樣;A/D類比數位信號轉換單元343用以將該取樣後的電 子信號轉換成數位信號;而不同類型之轉換傳輸單元,如 LVDS轉換傳輸單元344 (如圖6所示)或USB轉換傳輸單 元345 (如圖7所示)或A/D轉換傳輸單元346 (如圖8 所示),用以將該數位信號轉成數位格式以傳輸至外界; 又該線性CMOS影像感測元件34係以單晶片(S0C)構成, 可藉以達成降低成本、縮小體積、高製造性、高可靠度的 200906165 效果,藉此,待掃瞄物件 儲存、列印或投像以還原待掃猫物之信號,可為 <第一實施例:> 原貌。 參考圖5所示,1你腺 CM0SM) 3運用於一個'文件掃^月^光學掃瞄模組(線性 大小的文件,置n 3«為一 A4 明之線性CM0SM 3,主要包人.二 知瞄機内設有本發 光線311 (light)並照射於,寺掃;,可發出 瞄物件30反射為掃瞄光線312 ( 2 30 •,經由待掃 〇 32 該反射鏡片組32係由第一反“片^1 ’本實施例中 及第三反射鏡323所組成;掃^線31^二反射鏡322 射鏡321,第一反射鏡321將該掃T射於第一反 J射謂,第二反射鏡322將以==^ 第三反射鏡323,使掃目苗光線31 =於 藉由該反射鏡片組32的安排,佶疋之先路仃進, 内行進,藉以縮小本發明光1掃^ ;?於有限空間 之體積;又掃猫光請經3 G路進後可照射至聚焦鏡片組33: 二個或數個光學透鏡組成1造成不同倍率,於本實施例 為二片光學透鏡所構成,係由二個玻璃鏡片與一片塑膝鏡 片組合為聚焦鏡片組33,以600dpi的解析度規格,設計 反射鏡片組32將掃瞎光線312以八倍率至十倍率聚焦; 由於聚焦鏡片組33可將掃瞄光線312縮短其^度二^可 修正像差而於線性CMOS影像感測元件34上成像;此成像 的長度即可小於A4文件的寬度且又不會降低解析度;而 線性CMOS影像感測元件34可將成像後的掃瞄光線312轉 變成電子信號。 200906165Converter) or Universal Bus (USB) transmission or low voltage differential interface (LVDS); thereby, the linear CM0SM of the present invention achieves the need for fast broom, low distortion and convenient transmission. [Embodiment] Referring to FIG. 5, the linear complementary MOS semiconductor optical imaging module (Optical Scanning Module with Ϊ inpar (IIDS Image Sensor) (hereinafter referred to as linear CMOS M) 3 The main method comprises: a light source 31, which emits light 311 (Li ght) and is directed to the cat object to be scanned. If it is used for scanning purposes, it basically emits white light but is not limited to white light; 311 is irradiated to the object to be scanned 3〇I and reflected as a scanned light 312 (reflected scanning light); - a reflection mirror group 32, which is represented by one or several reflective mirrors The reflection reflection 32 32 322, 323 is formed, so that the object to be scanned 3 〇 reflection 1 sweep 200906165 sight ray 312 travels according to the predetermined optical path and is directed to the subsequent focusing lens group 33; Group 33, consisting of one or several lenses, for focusing the scanning ray 312 emitted by the reflecting lens group 32; a linear CMOS image sensor unit 34, thereby The focusing light of the focusing lens group 33 is converted into an electronic signal, and the electronic signal is converted into a digital format for transmission to the outside world; thereby reducing the volume of the optical scanning module, improving the resolution, and reducing the distortion rate (Optical Distortion) The purpose of the present invention is as shown in FIG. 6, FIG. 7 or FIG. 8. Since the linear CMOS image sensor 34 can be designed as a single wafer, the linear CMOS image sensing element (1 i) The CMOS i mage sensor 34 further includes a linear CMOS image sensor unit 341, a timing generator unit 342, and an A/D analog digital signal conversion unit (A/). D analog-digital converter) 343, and an LVDS (low-voltage differential) conversion unit (LVDS transmission unit) 344 (shown in Figure 6) or a USB (universal serial bus) conversion transmission unit (USB transmission unit) 345 (shown in Figure 7) or A/D (A/D transmission unit) 346 (shown in Figure 8); wherein the linear CMOS image sensing unit 341, for converting the imaged scanning light 312 into an electronic signal; the timing generating unit 342 is configured to generate timing to control the linear CMOS image sensing component 341 for sampling; and the A/D analog digital signal converting unit 343 is configured to sample the sampling The subsequent electronic signals are converted into digital signals; and different types of conversion transmission units, such as LVDS conversion transmission unit 344 (shown in Figure 6) or USB conversion transmission unit 345 (shown in Figure 7) or A/D conversion transmission unit 346 (shown in FIG. 8), for converting the digital signal into a digital format for transmission to the outside; and the linear CMOS image sensing component 34 is formed by a single chip (S0C), thereby achieving cost reduction and volume reduction. The highly manufacturable and highly reliable effect of the 200906165, whereby the object to be scanned is stored, printed or projected to restore the signal of the cat to be scanned, which may be <first embodiment: > original. Referring to Figure 5, 1 gland CM0SM) 3 is applied to a 'file scan ^ ^ ^ optical scanning module (linear size of the file, set n 3 « for an A4 Ming linear CM0SM 3, the main package. Second knowledge The lighter 311 (light) is disposed in the aiming machine and is irradiated to the temple sweep; the sight object 30 can be emitted as the scanning light 312 (2 30 •, via the to-be-scanned 32, the reflective lens group 32 is blocked by the first "Piece ^1' is composed of the third mirror 323 in this embodiment; the sweeping line 31^two mirror 322 is irradiated to the mirror 321 , and the first mirror 321 is irradiated to the first anti-J shot, the first The second mirror 322 will use the ==^ third mirror 323 to make the sweeping light 31 = by the arrangement of the reflecting lens group 32, and the first path is advanced, and the inner traveling is performed, thereby reducing the light of the present invention. Sweep the volume of the space in a limited space; sweep the cat light through the 3 G path and then illuminate the focusing lens group 33: Two or several optical lenses are composed of 1 to cause different magnifications. In this embodiment, two pieces of optics are used. The lens is composed of two glass lenses and a piece of plastic knee lens combined into a focusing lens group 33, designed to reflect at a resolution of 600 dpi. The group 32 focuses the buff ray 312 at an eight-fold to ten-fold rate; since the focusing lens group 33 can shorten the scanning ray 312 by correcting the aberration and imaging the linear CMOS image sensing element 34; The length of the image can be less than the width of the A4 file without degrading the resolution; and the linear CMOS image sensing element 34 can convert the imaged scanned light 312 into an electrical signal.
參照圖6所示,線性CM0S影像感測元件(linearCM0S image sensor) 34係由一線性CMOS影像感測單元(1 inear CMOS image sensor unit) 341、一 時序產生單元 342、一 A/D類比數位信號轉換單元343、及一 LVDS轉換傳輸單元 344所構成;該時序產生單元342用以產生時序以控制線 性CMOS影像感測單元341進行取樣;在不同的應用上, 該時序產生單元342可由外部輸入的時序所取代,也就是 使用外部輸入的時序來控制線性CMOS影像感測單元341 進行取樣;A/D類比數位信號轉換單元343將該取樣後的 電子信號轉換成數位信號;LVDS轉換傳輸單元344可將該 ’ 數位信號轉成LVDS數位格式並傳輸至外界;線性CMOS影 像感,元件34可以單晶片所構成,藉以將線性CM〇s影像 ^測單元34卜時序產生單元342、A/D類比數位信號轉換 單元343、LVDS轉換傳輸單元344整合在一個半導體晶片 上,形成一單晶片(S0C)。 參照圖9所示,CLK為時序產生單元342產生的時序 信號,GBST為整體啟動驅動信號(G1〇bal start pulse), SO為掃瞄結束驅動信號(j;nd 〇f Scan puise),ν〇υτ 類比影像輸出電壓(Analog Vide0 output v〇ltage)的 U 信號,在本實施例中,使用ΛΜΙ Semiconductor,S產σ PI6050D,其為600dpi解析度的線性CM〇s影像感測單元^ 例如,當時序產生單元342產生時序(或外部^入日^ 號)於第55個時序時,啟動影像感測,此相當11〇個^ 作用像素(inactive pixel) ;啟動後172個時序進行^ 感測,此相當344個作用像素(active pixei);也就是 一個時序時間中產生二個像素。Referring to FIG. 6, the linear CMOS image sensor 34 is composed of a linear CMOS image sensor unit 341, a timing generating unit 342, and an A/D analog digital signal. The conversion unit 343 and an LVDS conversion transmission unit 344 are configured; the timing generation unit 342 is configured to generate timing to control the linear CMOS image sensing unit 341 to perform sampling; in different applications, the timing generation unit 342 can be externally input. The timing is replaced, that is, the timing of the external input is used to control the linear CMOS image sensing unit 341 for sampling; the A/D analog digital signal conversion unit 343 converts the sampled electronic signal into a digital signal; the LVDS conversion transmission unit 344 can Converting the 'digital signal into LVDS digit format and transmitting it to the outside world; linear CMOS image sensing, component 34 can be composed of a single chip, thereby linear CM 〇s image measuring unit 34 timing generating unit 342, A/D analog digital The signal conversion unit 343 and the LVDS conversion transmission unit 344 are integrated on one semiconductor wafer to form a single wafer (S0C). Referring to FIG. 9, CLK is a timing signal generated by the timing generating unit 342, GBST is an overall start driving signal (G1〇bal start pulse), and SO is a scanning end driving signal (j; nd 〇f Scan puise), ν〇 Υτ analog image output voltage (Analog Vide0 output v〇ltage) U signal, in this embodiment, using ΛΜΙ Semiconductor, S produces σ PI6050D, which is a 600 dpi resolution linear CM 〇 s image sensing unit ^ For example, The sequence generation unit 342 generates the timing (or external ^^ day number) at the 55th timing, and initiates image sensing, which is equivalent to 11 inactive pixels; 172 timings after the activation are performed, This is equivalent to 344 active pixels (active pixei); that is, two pixels are generated in one timing time.
對於其他應用上,如圖7所示,可將上述之LVDS 換傳輸單元344更換為USB轉換傳輸單元345,則USB輟 換傳輸單元345可將該數位信號轉換成USB數位格式並傳 12 200906165 輸至外界;或如圖8所示,可將上述之LVDs轉換傳輪單 元344更換為A/D轉換傳輸單元346,則A/D轉換傳輪單 元346可將該數位信號轉成a/D數位格式益傳輸至外界。 於本實施例中,由於聚焦鏡片組33係由三片透鏡組 成,第一片透鏡可為非球面玻璃鏡片,第二片透鏡可為球 面玻璃鏡片、第三片透鏡可為球面塑膠鏡片,藉以構成約 八倍倍率之焦距比,使原丨:丨的掃瞄光線可藉反射鏡片 組32與聚焦鏡片組33而縮小寬度,俾可使用更小的線性 CMOS影像感測單元341 ;在本實施例中,掃瞄物體為一 A4 Ο 大小的文件’其寬度為297mm,若以習知CISM而言,其使 ,之CIS影像感測元件之器長度至少為297mm ;若以具有 二個反射鏡片所組成的反射鏡片組32與三片聚焦鏡片所 組成的八倍縮小倍率之聚焦鏡片組33,則該線性CM〇s影 像感測單元341之長度將可縮小至60mm以下;藉以有效 縮小本發明之線性CMOS影像感測元件34中該線性CMOS 影像感測單元341的長度,並因使用反射鏡片組3之數個 反射鏡片使光路折射而可有效縮小光學掃瞄模組的體 積’此為本發明之功效之一。 Q 對於待掃瞄物件30為反射式物件時,掃瞄光線311 照射於待掃目苗物體後反射成掃猫光線312,經由反射鏡片 組32多次反射後,其在左右二側存在有光學位差,此時 若聚焦鏡片組33之光學透鏡能利用短後焦距(sh〇rt back focal length)比之透鏡片組成,可將該光學位差予以修 正’成為與待掃瞄物件接近之掃瞄,可提高掃瞄之解析 度,此為本發明之另一功效。 在本實施例中,線性CMOS影像感測單元341可由CMOS 邏輯或DRAM等製程製造,其由許多光電二極體所組成, 母個光電二極體可接受光線而轉成電子信號,可稱為畫素 13 200906165For other applications, as shown in FIG. 7, the LVDS conversion transmission unit 344 can be replaced with the USB conversion transmission unit 345, and the USB conversion transmission unit 345 can convert the digital signal into a USB digital format and transmit 12 200906165. To the outside; or as shown in FIG. 8, the LVDs conversion transmission unit 344 can be replaced with the A/D conversion transmission unit 346, and the A/D conversion transmission unit 346 can convert the digital signal into an a/D digit. The format benefits are transmitted to the outside world. In this embodiment, since the focusing lens group 33 is composed of three lenses, the first lens may be an aspherical glass lens, the second lens may be a spherical glass lens, and the third lens may be a spherical plastic lens. Forming a focal length ratio of about eight times magnification, so that the scanning light of the original 丨: 丨 can be reduced in width by the reflecting lens group 32 and the focusing lens group 33, and a smaller linear CMOS image sensing unit 341 can be used; In the example, the scanning object is an A4 大小 size file whose width is 297 mm. If the conventional CISM is used, the length of the CIS image sensing element is at least 297 mm; if there are two reflective lenses The length of the linear CM s image sensing unit 341 can be reduced to less than 60 mm by the focusing lens group 33 composed of the reflecting lens group 32 and the three focusing lenses, thereby effectively reducing the present invention. The length of the linear CMOS image sensing unit 341 in the linear CMOS image sensing element 34, and the optical path is refracted by using a plurality of reflecting lenses of the reflecting lens group 3 to effectively reduce the volume of the optical scanning module' This is one of the effects of the present invention. When the object to be scanned 30 is a reflective object, the scanning light 311 is reflected on the object to be scanned and reflected into the illuminating light 312. After being reflected by the reflecting lens group 32, the optical light is present on the left and right sides. The position difference, if the optical lens of the focusing lens group 33 can be composed of a short lens focal length (sh〇rt back focal length), the optical aberration can be corrected to become a scan close to the object to be scanned. The aiming can improve the resolution of the scanning, which is another effect of the invention. In this embodiment, the linear CMOS image sensing unit 341 can be fabricated by a process such as CMOS logic or DRAM, which is composed of a plurality of photodiodes, and the female photodiodes can receive light and turn into electronic signals, which can be called Picture 13 200906165
Oixel),當光電二極體在單為面積愈多,其晝素愈高; 由於光電二極體是受光線強弱而送出電子信號,射入光線 的強度或明暗分別直接影響送出電子信號的鑑別程度,亦 即'3素的品質,當射入線性CMOS影像感測單元341的掃 $光線312之像差小,反應出來的電子信號偏差就小,即 晝素解析度(res〇luti〇n)也就高;本發明利用一聚焦鏡片 級33與一線性CMOS影像感測元件34配合組成,可將掃 吗光線312聚焦於線性CMOS影像感測元件34上成像,不 ^因成像縮小、像差失真,而喪失解析度’可改善習知技 Γ) 術因利用CIS影像感測元件致景深小、解析度低的缺點, 此為本發明再一功效。 • 另在本實施例中,線性CMOS影像感測元件34可將線 性CMOS影像感測單元341、時序產生單元342、A/D類比 g位信號轉換單元343、轉換傳輸單元(344、345或346) 整合為一單晶片(S〇C、System on Chip)封裝,可提高元 =的可靠度並降低成本、並簡易將掃瞄之電子信號以數位 式用LVDS、USB或A/D數位格式傳輸至其他裝置使用, 此為本發明又一功效。 ^ <第二實施例〉 參照圖10所示,本發明之光學掃瞄模組(線性CM0SM) 可進一步將§玄聚焦鏡片組33更換為由一自動對焦鏡片 =(AFzoominglens) 35 與一 AF 控制單元 351 構成,藉 ^ AF控制單元351以自動調整自動對焦鏡片組(AF 0〇ming lens) 35之聚焦點,藉以增進線性CM〇SM 3使用 f便性,更可避免因待掃瞄物件3〇 (如圖所示一立體物 _)的表面不平整而失真。自動對焦鏡片組35包含至少 固ί鏡群,其中至少一個透鏡群可移動,並經由該AF ι制單兀351 (AF Controller)控制透鏡群的移動,藉由 200906165 透鏡群之間相對移動所產生間距之變化,以將 312自動對焦於聚焦點並在線性CM0S影像感剛晦光, 上成像。本發明使用之自動對焦鏡片組可設計 ^ 群’其第一透鏡群為負屈光’包含二個負屈光之j 成第一透鏡群;第二透鏡群為正屈光,包含二個兄片以構Oixel), the more the photodiode is in a single area, the higher the quality of the element; since the photodiode is subjected to the light intensity and sends out an electronic signal, the intensity or brightness of the incoming light directly affects the identification of the sent electronic signal. The degree, that is, the quality of the '3', when the aberration of the scanning $ray 312 injected into the linear CMOS image sensing unit 341 is small, the deviation of the reflected electronic signal is small, that is, the resolution of the pixel (res〇luti〇n) The present invention utilizes a focusing lens stage 33 that is combined with a linear CMOS image sensing element 34 to focus the scanning light 312 on the linear CMOS image sensing element 34 for imaging. Poor distortion, and loss of resolution 'can improve the conventional technique." The use of CIS image sensing elements has the disadvantages of small depth of field and low resolution, which is another effect of the present invention. In the present embodiment, the linear CMOS image sensing element 34 can be a linear CMOS image sensing unit 341, a timing generating unit 342, an A/D analog g bit signal converting unit 343, and a conversion transmitting unit (344, 345, or 346). Integrated into a single chip (S〇C, System on Chip) package, which can improve the reliability and cost of the unit, and easily transmit the electronic signals of the scan in digital form in LVDS, USB or A/D digital format. Used to other devices, this is another effect of the present invention. ^ Second Embodiment> Referring to FIG. 10, the optical scanning module (linear CM0SM) of the present invention can further replace the § 聚焦 focus lens group 33 with an AF lens = (AFzoominglens) 35 and an AF. The control unit 351 is configured to automatically adjust the focus point of the AF lens (AF 0 ming lens) 35 by using the AF control unit 351, thereby improving the linear CM 〇 SM 3 using the convenience, and avoiding the object to be scanned. The surface of 3〇 (one solid object _ as shown) is uneven and distorted. The autofocus lens group 35 includes at least one lens group, wherein at least one lens group is movable, and the movement of the lens group is controlled via the AF 兀 351 (AF Controller), which is generated by the relative movement between the lens groups of 200906165 The pitch is varied to focus 312 on the focus point and image on the linear CMOS image. The autofocus lens set used in the present invention can be designed such that the first lens group has a negative refractive power and includes two negative refractive rays into a first lens group; the second lens group is positive refractive power, including two brothers. Piece
片以構成第二透鏡群;藉由第二透鏡群的 距,使掃瞄光線312調整聚焦,以最佳化成像於 影像感測單元341,藉此安排可掃瞄立體的待掃物gOS Ο Ο 當掃瞄不平整的文件或立體的待掃瞄物 311照射於不同距離的待掃瞄物件表面,其反崎,光線 不同,掃瞄光線312經由反射鏡片組32之反射=位置, 性CMOS影像感測單元341上成像的位置會產生^承於白 動對焦鏡片組(AF zooming lens) 35可藉AF和二一 351的控制功能,將此不同掃瞒位置之掃“光線二= 其聚焦點,而仍可於線性CMOS影像感測單元生二 像,此為本發明之可應用的功效。 *晰成 <第三實施例> 本發明之線性CM0SM 3所使用之光源31並不會如 =螢或光源??限制’該光源、31可選擇使用 ίΐ ΐί ί: 或氙(Xe)氣燈或直下式led中為 光源’此為本發明可應用的另一功效。 冷陰極榮光燈管(CCFL)為光源31時,該光 f 31係包含一 CCFL燈管及一窄長的孔徑(aperture), 光源31之長度可設為待掃瞄物件掃 width);該aFL燈管為水銀放電燈管,=^本:= ’其結構是在燈管内塗佈可發出白光的榮光劑,並 ^存>、許惰性氣體及核,當燈f 電流,水銀分 被電子撞擊便會產生紫外線,螢光劑吸吹紫外線後,即 15 200906165 可發出自光;該冑The sheet is configured to form a second lens group; the scanning light 312 is adjusted in focus by the distance of the second lens group to be optimally imaged on the image sensing unit 341, thereby arranging the scanable stereoscopic object gOS Ο Ο When scanning an uneven document or a stereoscopic object to be scanned 311 is irradiated on the surface of the object to be scanned at different distances, the anti-snag, the light is different, and the scanning light 312 is reflected by the reflection lens group 32=position, sex CMOS The position of the image sensing unit 341 is generated by the AF zooming lens 35. The AF and the two-one 351 can be used to control the position of the different brooms. Point, and still can be imaged by the linear CMOS image sensing unit, which is an applicable effect of the present invention. *Conformation <Third Embodiment> The light source 31 used in the linear CM0SM 3 of the present invention is not Will be like = firefly or light source?? Limit 'the light source, 31 can choose to use ίΐ ΐί ί: or 氙 (Xe) gas light or direct type led in the light source 'this is another effect that can be applied in the invention. Cold cathode glory When the light pipe (CCFL) is the light source 31, the light f 31 includes a CCF. L lamp and a narrow aperture, the length of the light source 31 can be set to scan the width of the object to be scanned; the aFL tube is a mercury discharge lamp, =^ this: = 'the structure is in the tube The inside is coated with a glory agent that emits white light, and is stored with an inert gas and a nucleus. When the lamp f current, the mercury component is excited by the electron to generate ultraviolet rays, and the fluorescent agent absorbs the ultraviolet ray, that is, 15 200906165 Self-lighting
光線通過而形成細條^ 啊_)可使aFL發出的 瞄寬度;光線照射於;樁^線,該光線為待掃瞄物件之掃 經由反射鏡片組件上^反射為_光線,再 影像感剛元件 34轉換聚焦,再由線性⑽S 含-氙光源31時,該光源31係包 Ο ϋ (Xe)氣燈常以混人顏Λ田寬度(SCanni吨width);氙 充之惰性氣體,1 ;fe . Xe : NF3 =1GG : 2 : 1為填 500w,效率較高;出5⑽脈衝,亦即平均功率可達 氣燈發出的光線通隸(aperture)可使氤(Xe) 於待掃瞄g = J = f細條狀的光線,該光線再照射 盥聚隹妒〇〇反射為知瞄光線,再經由反射鏡片組32 i換’再由線性⑽S影像感測元件34 當選擇以LED為光源31時,該光源31可為一直下式 線性^ED ,直下式線性LED線性是將一個或數個lED晶 片以等間隔方式直接黏著在一長條形的印刷線路板上,該 LED晶片是利用電能直接轉化為光能的原理,在半導體内 正負極端子施加電壓,當電流通過,使電子與電洞相結合 時,剩餘能量便以光的形式釋放;當光線經由LED線性發 光體發出後,可採直下(或某一定向)射出至待掃瞄物件 上,經待掃瞄物件反射為掃瞄光線,再經由反射鏡片組32 與聚焦鏡片組33聚焦’再由線性CMOS影像感測元件34 轉變成電子信號。 本發明使用線性CMOS影像感測元件與光學元件所構 成的線性CM0SM,與習知CCDM或CISM比較,至少可達到 下列優點: 200906165 <1>、本發明之線性CM0SM與習知CISM比較, 明之線性CM0SM具有降低成本、體積小、高解析度、較低 的失真(Optical Distortion )、高製造性(Μ productivity)、及尚可靠度(scanning 之優點。 ” <2>、本發明之線性CM〇SM與習知CISM比較, 明之線性CM0SM具有電子信號傳輸性更高之優點,且可彈 性使用不同光源,也就是使用光源之選擇較不受限制。 < 3>、本發明之線性CM0SM與習知設有柱狀透鏡(r〇d I lens)之CISM比較,由於該習知CISMi掃描光線經由 掃瞄物件反射後先經過一柱狀透鏡(r〇d lens)而再 於CIS影像感測元件上(如圖2所示),而因該柱狀透鏡 致該習知CISM不具有景深d〇f (depth 〇f focus)效率, 影響習知CISM之使用效率,而本發明之線性cm〇sm 有景深(DOF)效率。 =4>、在習知CSIM中,當使用線性LED為光源時須 ^用V光板(light guide),使LED晶片發出之光線先經 该導光板折射以形成照度均勻的線性光源,藉以確保光 〇 J可均勻分佈出射至待掃瞄物件上,但因使用導光板會相 低LED光源使用率,也就是光線經該導光板後會降低 2又致衫響掃描速度;然而若欲加快掃描速度,則led ί源之亮度須加強(加強LED光源之功率),卻相對容易 $熱,造成習知CSIM之使用困擾;而本發明線性cM〇SM 可藉其、中反射鏡片組與聚焦鏡片組之光學設計以充份利 用光線並於線性CMOS影像感測元件上成像,因此可省略 $知CISM中的導光板,進一步提高光源利用率,並達到 掃描速度提昇的目的。 以上所述僅為本發明的較佳實施例,對本發明而言僅 17 200906165 是說明性的,而非限制性的;本專業技術人員理解,在本 發明權利要求所限定的精神和範圍内可對其進行許多改 變、修改、甚至等效變更’但都將落入本發明的保護範圍 内。 【圖式簡單說明】 圖1係先前技術CCDM之示意圖。 圖2係先前技術CISM之示意圖。 圖3係先前技術CCDM之功能塊解圖。 圖4係先前技術CISM之功能塊解圖。 Γ) 圖5係本發明之實施例之示意圖。 圖6係本發明之實施例使用LVDS傳輸之功能塊解圖。 圖7係本發明之實施例使用USB傳輸之功能塊解圖。 圖8係本發明之實施例使用ad傳輸之功能塊解圖。 圖9係本發明之實施例之時序圖。 圖10係本發明之第二實施例之示意圖。 【主要元件符號說明】 3 :光學掃瞄模組(線性CM0SM) 31 :光源(light source) Q 311 :光線(light) 312 :掃猫光線(scanning light) 32 :反射鏡片組(refiecti〇n mirror group) 321、322、323 :反射鏡片(reflection mirror) 33 :聚焦鏡片組(focus iens gr0Up) 331、332、333 :光學透鏡(focus lens) 34 :線性 CMOS 影像感測元件(1 inear CMOS image sensor) 341 :線性 CMOS 影像感測單元(linear CMOS image sensor unit) 342 :時序產生單元(timing generator unit) 343 : A/D類比數位信號轉換單元(A/D analog-digital 200906165The light passes through to form a thin strip ^ ah _) can make the aFL emit the width of the aim; the light is irradiated; the pile ^ line, the light is the scan of the object to be scanned through the reflective lens assembly ^ reflected as _ light, then the image sense component 34 conversion focus, and then by linear (10) S - 氙 source 31, the source 31 is packaged ϋ X (Xe) gas lamp is often mixed with the width of the field (SCanni ton width); filling inert gas, 1 ; Xe : NF3 =1GG : 2 : 1 is filled with 500w, the efficiency is higher; 5 (10) pulses, that is, the average power can reach the light emitted by the gas lamp, the 氤 (Xe) can be scanned for g = J = f thin strip of light, which is then reflected by the condensed condensed light to be the visible light, and then replaced by the reflective lens group 32 i. Then by the linear (10) S image sensing element 34 when the LED is selected as the light source 31 The light source 31 can be a linear type immediately below. The linear linear LED linearly directly bonds one or several lED wafers at an equal interval to an elongated printed circuit board. The LED chip is directly powered by electric energy. The principle of conversion to light energy, applying voltage to the positive and negative terminals of the semiconductor, when the current is passed When the electrons are combined with the holes, the remaining energy is released in the form of light; when the light is emitted through the LED linear illuminator, it can be shot down (or a certain orientation) to the object to be scanned, after being scanned. The aiming object is reflected as a scanning light, and then focused by the reflecting lens group 32 and the focusing lens group 33 to be converted into an electronic signal by the linear CMOS image sensing element 34. The present invention uses a linear CMOS system composed of a linear CMOS image sensing element and an optical element. Compared with the conventional CCDM or CISM, at least the following advantages can be achieved: 200906165 <1>, the linear CM0SM of the present invention is compared with the conventional CISM, Linear CM0SM has the advantages of reduced cost, small size, high resolution, low distortion, high productivity, and reliability (scanning advantage.) <2>, linear CM of the present invention Compared with the conventional CISM, the linear CM0SM has the advantages of higher electronic signal transmission, and can flexibly use different light sources, that is, the choice of using the light source is not limited. <3>, the linear CM0SM of the present invention It is known to provide a CISM comparison of a cylindrical lens (r〇d I lens). Since the conventional CISMi scanning light is reflected by the scanning object, it passes through a cylindrical lens and then senses the CIS image. On the component (as shown in FIG. 2), the conventional CISM does not have the depth of field (df) efficiency due to the lenticular lens, which affects the efficiency of the conventional CISM, and the linear cm〇 of the present invention. Sm has depth of field (DOF) efficiency. =4> In the conventional CSIM, when using a linear LED as a light source, a light guide must be used to illuminate the light emitted by the LED chip through the light guide plate to form an illuminance. A uniform linear light source ensures that the diaphragm J can be evenly distributed to the object to be scanned, but the use of the light guide plate will result in a lower LED light source usage, that is, the light will be lowered after passing through the light guide plate. Speed; however, if you want to speed up the scanning speed, the brightness of the LED source must be strengthened (enhance the power of the LED light source), but it is relatively easy to heat, causing the use of the conventional CSIM; and the linear cM〇SM of the present invention can be used by The optical design of the middle reflecting lens group and the focusing lens group is to fully utilize the light and image on the linear CMOS image sensing element, so that the light guide plate in the CISM can be omitted, the light source utilization rate is further improved, and the scanning speed is improved. The above description is only a preferred embodiment of the present invention, and only 17 200906165 is illustrative and not limiting for the present invention; those skilled in the art understand that the rights of the present invention Many changes, modifications, and even equivalents may be made in the spirit and scope of the invention, which are intended to fall within the scope of the present invention. [FIG. 1 is a schematic diagram of a prior art CCDM. 2 is a schematic diagram of a prior art CISM. Figure 3 is a functional block diagram of a prior art CCDM. Figure 4 is a functional block diagram of a prior art CISM. Figure 5 is a schematic diagram of an embodiment of the present invention. Figure 6 is a functional block diagram of an embodiment of the present invention using LVDS transmission. Figure 7 is a functional block diagram of a USB transmission using an embodiment of the present invention. Figure 8 is a functional block diagram of an embodiment of the present invention using ad transmission. Figure 9 is a timing diagram of an embodiment of the present invention. Figure 10 is a schematic illustration of a second embodiment of the present invention. [Main component symbol description] 3 : Optical scanning module (linear CM0SM) 31 : Light source Q 311 : Light 312 : Scanning light 32 : Reflective lens group (refiecti〇n mirror Group) 321, 322, 323: reflection mirror 33: focus lens group (focus iens gr0Up) 331, 332, 333: optical lens (focus lens) 34: linear CMOS image sensing element (1 inear CMOS image sensor 341 : Linear CMOS image sensor unit 342 : Timing generator unit 343 : A/D analog digital signal conversion unit (A/D analog-digital 200906165
converter) 344 : LVDS 轉換傳輸單元(LVDS transmission unit) 345 : USB 轉換傳輸單元(USB transmission unit) 346 : AD 轉換傳輸單元(AD transmission unit) 35:自動變焦鏡頭(AF zooming lens) 351 : AF 控制單元(AF controller) 19Converter) 344 : LVDS transmission unit 345 : USB transmission unit 346 : AD transmission unit 35 : AF zooming lens 351 : AF control unit (AF controller) 19
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI395473B (en) * | 2009-10-09 | 2013-05-01 | Altek Corp | Automatic focusing system and method under low-illumination |
TWI451128B (en) * | 2012-07-13 | 2014-09-01 | Shanghai Microtek Technology Co Ltd | Scanning system |
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TWI395473B (en) * | 2009-10-09 | 2013-05-01 | Altek Corp | Automatic focusing system and method under low-illumination |
TWI451128B (en) * | 2012-07-13 | 2014-09-01 | Shanghai Microtek Technology Co Ltd | Scanning system |
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