TW201401948A - An electrically conductive circuit device and manufacturing method - Google Patents

Abstract

A circuit device includes: a substrate having an insulative upper surface; a hydrophobic anti-plating layer of a hydrophobic material formed on the upper surface of the substrate and having at least one patterned through-hole for exposing a plating portion of the upper surface of the substrate; an active metal layer formed on the plating portion of the upper surface of the substrate and disposed in the patterned through-hole in the hydrophobic anti-plating layer; and an electroless deposited metal layer electroless deposited on the active metal layer.

Description

Conductive line device and manufacturing method thereof

The present invention relates to a conductive wiring device and a method of fabricating the same, and more particularly to a conductive wiring device having a patterned circuit embedded in a hydrophobic plating resist.

A circuit board is disclosed in U.S. Patent Publication No. 2010/0243149. The circuit board includes a first insulating layer, a second insulating layer laminated with the first insulating layer and having patterned holes, and a patterned conductive layer formed on the first insulating layer and located in the holes a glue layer, and a metal deposition layer formed on the patterned conductive adhesive layer. The patterned conductive adhesive layer is formed by printing a solvent-based adhesive to a designated area of the first insulating layer and then drying and solidifying. The solvent-based rubber material comprises a dispersion solvent and active metal particles dispersed in the dispersion solvent. After forming the patterned conductive adhesive layer, a non-hydrophobic insulating resin and the first insulating layer are heat-compressed to cover the patterned conductive adhesive layer, and then a trench is formed in the non-hydrophobic insulating resin, thereby The insulating layer forms the second insulating layer. The non-hydrophobic insulating resin has a high viscosity to fix the patterned conductive adhesive layer.

U.S. Patent No. 4,865,873 discloses a method of making a circuit pattern on a substrate of a circuit board. The method comprises forming an insulating layer on a substrate, forming a water soluble layer on the insulating layer, forming a through hole through the insulating layer and the water soluble layer by laser etching, wherein the water can be A solvent-activated coating layer is formed on the solution layer and the via hole wall to form an electroless metal layer on the catalyst activation coating by electroless plating, and to remove the water-soluble layer. by Forming the circuit pattern so as to protrude from the insulating layer has a negative influence on the subsequent assembly of the electronic component on the circuit board. In addition to this, the method requires the step of forming the water soluble layer and removing the water soluble layer to avoid formation of the electroless metal layer on the insulating layer.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a conductive line device and a method of fabricating the same.

Thus, a conductive circuit device of the present invention comprises: a substrate having an insulating upper surface; a hydrophobic plating layer formed of a hydrophobic material formed on the insulating upper surface and having at least one perforation. The perforation exposes a plating region of the upper surface of the insulating; an active metal layer is formed on the plating region and located in the through hole; and an electroless metal layer is electrolessly plated on the active metal layer. The invention also provides a method of making the electrically conductive line device.

Moreover, the method of manufacturing a conductive circuit device of the present invention comprises: (a) forming a hydrophobic anti-plating layer made of a hydrophobic material on an insulating upper surface of a substrate; (b) laser etching Forming a perforation on the hydrophobic anti-plating layer to expose a plating region of the insulating upper surface; (c) contacting the electroplating region of the insulating upper surface of the substrate on which the hydrophobic anti-plating layer is formed, with an active metal aqueous solution, Etching the electroplated region of the upper surface of the insulating layer with the active metal solution, thereby forming an active metal layer on the electroplated region of the insulating upper surface; and (d) forming an electroless plating on the active metal layer Electroplated metal layer.

The effect of the invention is to utilize a hydrophobicity formed with patterned perforations The anti-plating layer can form a reactive metal layer which is required for electroless plating on a substrate simply and efficiently, and thereby can form a circuit pattern embedded in the hydrophobic anti-plating layer.

The foregoing and other objects, features, and advantages of the invention are set forth in the <RTIgt;

8 and 9 show a conductive line device 100, such as an antenna, in accordance with a preferred embodiment. The conductive circuit device 100 comprises: an insulating substrate 2 having an insulating upper surface 21; a hydrophobic plating resist 3 formed of a hydrophobic material, formed on the insulating upper surface 21, and having a distance from the base The upper surface 31 of the insulating upper surface 21 of the material 2 and the at least one through hole 32 exposing a plating region 211 of the insulating upper surface 21; an active metal layer 4 formed on the plating region 211 and located in the through hole 32; and an electroless metal layer 5, electrolessly plated on the active metal layer 4 to define a circuit pattern and having an upper surface 51. In the preferred embodiment, the upper surface 51 of the electroless metal layer 5 is substantially flush with the upper surface 31 of the hydrophobic plating resist 3 such that the upper surface 51 of the electroless metal layer 5 is substantially The upper surface 31 of the hydrophobic plating resist 3 is joined to form a continuous plane. The preferred embodiment can also be easily modified such that the upper surface 51 of the electroless metal layer 5 and the upper surface 31 of the hydrophobic plating layer 3 are curved, such that the upper surface 51 of the electroless metal layer 5 is substantially The ground is connected to the upper surface 31 of the hydrophobic plating resist 3 to form a continuous curved surface. Optionally, the upper surface 51 of the electroless metal layer 5 is lower than the hydrophobic plating resistance The upper surface 31 of the layer 3. Still alternatively, the circuit pattern may further comprise a plated metal layer (not shown) plated on the electroless metal layer.

Preferably, the hydrophobic material is a hydrophobic resin or a wax.

Preferably, the hydrophobic resin is one selected from the group consisting of polycarbonate, polydimethyloxane adipate diamine, polypropylene, and the like. More preferably, the polycarbonate has a molecular weight of from 1,000 to 4,000, the polydimethyl oxyalkylene adipate diamine has a molecular weight of from 1,000 to 4,000, and the polypropylene has a molecular weight of from 1,000 to 4,000.

Preferably, the wax material comprises a wax and an inorganic oxide selected from the group consisting of ceria, titania, magnesia, zirconia and the like. More preferably, the wax comprises 60-95% by weight wax and 5-40% by weight inorganic oxide. Preferably, the wax has a melting point below 60 °C.

Preferably, the substrate 2 is made of a mixture selected from the group consisting of polycarbonate, acrylate resin and propylene-butadiene-styrene resin, and a mixture of polycarbonate and propylene-butadiene-styrene resin. to make.

Preferably, the active metal is selected from the group consisting of palladium, rhodium, platinum, rhodium, iridium, gold, nickel, iron, and the like.

Preferably, the material of the electroless metal layer 5 is selected from one of copper, gold, silver and nickel.

1-7 illustrate a method of fabricating the electrically conductive line device 100 in accordance with a preferred embodiment. The method comprises: (a) forming a hydrophobic anti-plating layer 3 made of a hydrophobic material on an insulating upper surface 21 of an insulating substrate 2 (as shown in FIGS. 1 and 2); (b) using a laser Etching method forms a through hole 32 on the hydrophobic anti-plating layer 3 to expose a plating region 211 of the insulating upper surface 21 (as shown in FIG. 3 (c) contacting the plating region 211 of the insulating upper surface 21 of the substrate 2 on which the hydrophobic plating resist 3 is formed with an active metal aqueous solution 6 such that the plating region 211 of the insulating upper surface 21 is coated with the active metal The aqueous solution 6 is wetted, whereby an active metal layer 4 is formed on the plating region 211 of the insulating upper surface 21 (as shown in FIGS. 4 and 6). Because of the hydrophobicity, the upper surface 31 of the hydrophobic plating resist 3 is not It is wetted by the active metal aqueous solution 6; and (d) an electroless metal layer 5 is formed on the active metal layer 4 by electroless plating (as shown in Fig. 7).

In the preferred embodiment, the step (c) is performed by immersing the substrate 2 on which the hydrophobic anti-plating layer 3 is formed in the active metal aqueous solution 6, and then extracting from the active metal aqueous solution 6 (eg, Figure 4-6), washed, dried and finished. Alternatively, the step (c) is carried out by spraying the aqueous active metal solution 6 onto the substrate 2 on which the hydrophobic plating resist 3 is formed. The manner in which the active metal layer is formed is well known, and is disclosed in, for example, U.S. Patent Nos. 4,898,648, 5,086,966, and 6,325,910, the disclosures of each of which are hereby incorporated by reference.

Preferably, the active metal aqueous solution 6 has a palladium concentration of 10 to 70 ppm and is a Pd-Tin colloid solution.

Preferably, the hydrophobic anti-plating layer 3 has a dark color to facilitate laser etching for focusing. Preferably, the laser etching of the hydrophobic anti-plating layer 3 is accomplished using yttrium aluminum garnet laser light. The operating conditions of the laser light are: 4-10 W laser power, 5-30 KHz power frequency, and 1-7% power density. Because laser etching a metal layer is well known, for example U.S. Patent No. 4,898,648 and the earlier publication No. 13/035, 531, the entire disclosure of which is hereby incorporated by reference.

When the electroless plating solution is a copper electroless plating solution to form the electroless plating metal layer 5 on the active metal layer 4, the electroless plating system is operated at a temperature of 50 to 55 ° C and a process time of 2 to 5 minutes ( Processing time). When the electroless plating solution is a nickel electroless plating solution to form the electroless plating metal layer 5 on the active metal layer 4, the electroless plating system is operated at a temperature of 40 to 45 ° C and a process time of 2 to 5 minutes.

The present invention can form the active metal layer 4 required for electroless plating on a substrate 2 simply and efficiently by forming the hydrophobic anti-plating layer 3 with the patterned through holes 32, and thereby forming an embedded in the hydrophobicity. The circuit pattern of the plating resist 3.

The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.

100‧‧‧Electrical wiring device

2‧‧‧Insulating substrate

21‧‧‧Insulated upper surface

211‧‧‧ plating area

3‧‧‧Durable anti-plating

31‧‧‧ upper surface

32‧‧‧Perforation

4‧‧‧Active metal layer

5‧‧‧Electroless metal layer

51‧‧‧ upper surface

6‧‧‧Active metal solution

1-7 are schematic views showing successive steps of a method of fabricating a conductive line device according to a preferred embodiment of the present invention; and FIG. 8 is a perspective view showing a conductive line device according to a preferred embodiment of the present invention; and FIG. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing the structure of a conductive wiring device in accordance with a preferred embodiment of the present invention.

100‧‧‧Electrical wiring device

2‧‧‧Insulating substrate

21‧‧‧Insulated upper surface

3‧‧‧Durable anti-plating

31‧‧‧ upper surface

32‧‧‧Perforation

5‧‧‧Electroless metal layer

51‧‧‧ upper surface

Claims (23)

A conductive circuit device comprising: a substrate having an insulating upper surface; a hydrophobic plating layer formed of a hydrophobic material formed on the insulating upper surface and having at least one perforation, the perforation exposing the An electroplating region on the upper surface of the insulating layer; an active metal layer formed on the electroplating region and located in the perforation; and an electroless metal layer not plated on the active metal layer. The conductive circuit device of claim 1, wherein the hydrophobic plating layer has an upper surface away from an insulating upper surface of the substrate, the electroless metal layer having an upper surface, the electroless metal layer The upper surface is substantially joined to the upper surface of the hydrophobic plating layer to form a continuous plane. The conductive circuit device according to claim 1, wherein the hydrophobic material is a hydrophobic resin selected from the group consisting of polycarbonate and polydimethyl siloxane adipic acid diamine. One of the combinations of polypropylene, and the like. The conductive circuit device according to claim 3, wherein the polycarbonate has a molecular weight of 1000-4000, and the polydimethyloxane adipate diamine has a molecular weight of 1000-4000. The polypropylene has a molecular weight of from 1,000 to 4,000. The conductive circuit device according to claim 1, wherein the hydrophobic material is a wax material. The conductive circuit device according to claim 5, wherein the wax material comprises a wax and an inorganic oxide selected from the group consisting of cerium oxide, titanium oxide, magnesium oxide, zirconium oxide and the like. One. The conductive wiring device according to claim 6, wherein the wax material comprises 60-95 wt% wax and 5-40 wt% inorganic oxide. The conductive wiring device according to claim 6, wherein the wax has a melting point lower than 60 °C. The conductive circuit device according to claim 1, wherein the substrate is composed of a mixture selected from the group consisting of polycarbonate, acrylate resin and propylene-butadiene-styrene resin, and polycarbonate and propylene. Made of a mixture of butadiene-styrene resins. The conductive circuit device according to claim 1, wherein the active metal is one selected from the group consisting of palladium, rhodium, platinum, rhodium, iridium, gold, nickel, iron, and the like. The conductive circuit device according to claim 1, wherein the material of the electroless metal layer is one selected from the group consisting of copper, gold, silver, and nickel. A method of manufacturing a conductive wiring device comprising: (a) forming a hydrophobic plating layer made of a hydrophobic material on an insulating upper surface of a substrate; (b) performing the hydrophobic etching in a laser etching manner Forming a perforation on the plating resist to expose a plating region of the upper surface of the insulating layer; (c) contacting an electroplating region of the insulating upper surface of the substrate on which the hydrophobic anti-plating layer is formed with an active metal aqueous solution such that the insulating layer Surface The plating zone is wetted by the active metal solution to form an active metal layer on the plating region of the insulating upper surface; and (d) an electroless metal layer is formed on the active metal layer by electroless plating. The method according to claim 12, wherein the step (c) is performed by immersing the substrate in which the hydrophobic anti-plating layer is formed in the active metal aqueous solution, and then extracting from the active metal aqueous solution. carry out. The method of claim 12, wherein the hydrophobic material is a hydrophobic resin selected from the group consisting of polycarbonate, polydimethyl siloxane, diammonium adipate, and poly One of propylene, and combinations thereof. According to the method of claim 14, wherein the polycarbonate has a molecular weight of 1000 to 4000, and the polydimethyloxane adipate diamine has a molecular weight of 1000 to 4000, Polypropylene has a molecular weight of from 1000 to 4000. The method of claim 12, wherein the hydrophobic material is a wax material. The method of claim 16, wherein the wax material comprises a wax and an inorganic oxide selected from the group consisting of cerium oxide, titanium dioxide, magnesium oxide, zirconium oxide, and the like. . The method of claim 17, wherein the wax material comprises 60-95 wt% wax and 5-40 wt% inorganic oxide. According to the method of claim 17, wherein the wax There is a melting point below 60 °C. The method of claim 12, wherein the substrate is a mixture selected from the group consisting of polycarbonate, acrylate resin and propylene-butadiene-styrene resin, and polycarbonate and propylene-butyl Made of a mixture of ene-styrene resins. The method of claim 12, wherein the active metal is selected from the group consisting of palladium, rhodium, platinum, rhodium, iridium, gold, nickel, iron, and the like. The method of claim 12, wherein the material of the electroless metal layer is one selected from the group consisting of copper, gold, silver, and nickel. The method of claim 12, wherein the hydrophobic plating layer has a dark color.