TW201352054A - Plate limiting structure - Google Patents
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本發明是有關於一種基板限位結構，且特別是有關於一種應用於場發射顯示器（field emission display，FED）的基板組立製程的基板限位結構。
The present invention relates to a substrate limiting structure, and more particularly to a substrate limiting structure for a substrate assembly process applied to a field emission display (FED).
現有之場發射顯示器包括有上基板、邊框與下基板。邊框為口字形，其配置於上基板與下基板之間，且邊框的上、下表面係透過玻璃膠分別與上基板與下基板接合，於接合後，上基板、邊框與下基板共同界定出中空的封閉空間。此封閉空間用以容置相關元件，例如上基板位於封閉空間的一側面佈設有發射元件（emitter），下基板位於封閉空基的一側面佈設有磷光體（phosphor）。發射元件會發射電子束，電子束會打在對應的磷光體上，以激發磷光體而使其產生光。矩陣排列的複數發射元件，經過適當控制後，可以使對應的且同為矩陣排列的複數磷光體發出不同顏色與亮度的光，如此，便會在下基板的另一側面顯示出影像。由此可知，每一個發射元件與其相對應的磷光體之間的相對位置，需要高精度的對位，才能確保影像品質。
目前在上基板、邊框與下基板的組立與固化製程中，其保持高精度對位的方式係借助於精度控制器。現有之精度控制器包括有環形定位體、定位柱與銦球（indium ball），環形定位體的中央透設有對應於定位柱的定位孔，環形定位體的底部具有導流槽。首先將複數個環形定位體固定在下基板的上表面的週邊區域，再將銦球置入定位孔，隨後將定位柱置入定位孔，接著將邊框與上基板依序對位置放於下基板上。其中，邊框與上、下基板接合處的玻璃膠會造成間隙，其間距約等於銦球的高度，因而此時定位柱的下端被銦球抵持，而上端則剛好接合於上基板的下表面的週邊區域。玻璃膠為一種接著劑，因而下一步便是加熱使玻璃膠與上下基板接著。在加熱的過程中，銦球會逐漸熔化並由導流槽流出，定位柱會隨著銦球的熔化過程而逐漸下降，同時玻璃膠也會因受熱溢流而變薄，此時上基板會朝向下基板垂直下壓，因此上、下基板與邊框之間的間距會逐漸縮小，並且在這過程中，定位孔與定位柱會互相配合以限制上、下基板與邊框在水平方向上的相對位置。
由此觀之，現有的精度控制器需使用銦球，因此會支出較多的材料成本。並且，此種精度控制器會隨著上、下基板的組立而固定於上、下基板之間，難以回收再利用，因而每一次進行上、下基板與邊框的組立製程，都需消耗掉數個精度控制器，從而提高了製作成本。
Existing field emission displays include an upper substrate, a bezel, and a lower substrate. The frame is in the shape of a mouth, and is disposed between the upper substrate and the lower substrate, and the upper and lower surfaces of the frame are respectively bonded to the upper substrate and the lower substrate through the glass glue. After the bonding, the upper substrate, the frame and the lower substrate are jointly defined. Hollow enclosed space. The enclosed space is used for accommodating related components. For example, an upper substrate is disposed on one side of the closed space with an emitter, and a lower substrate is disposed on a side of the closed space to be provided with a phosphor. The emitting element emits an electron beam that strikes the corresponding phosphor to excite the phosphor to produce light. The plurality of radiating elements arranged in a matrix can be appropriately controlled to emit light of different colors and brightness by the corresponding plurality of phosphors arranged in a matrix, so that an image is displayed on the other side of the lower substrate. It can be seen that the relative position between each of the emitting elements and their corresponding phosphors requires high-precision alignment to ensure image quality.
At present, in the assembly and curing process of the upper substrate, the bezel and the lower substrate, the way of maintaining high precision alignment is by means of an accuracy controller. The existing precision controller includes an annular positioning body, a positioning post and an indium ball. The center of the annular positioning body is provided with a positioning hole corresponding to the positioning post, and the bottom of the annular positioning body has a guiding groove. Firstly, a plurality of annular positioning bodies are fixed on the peripheral area of the upper surface of the lower substrate, and the indium balls are placed in the positioning holes, and then the positioning post is placed into the positioning holes, and then the frame and the upper substrate are sequentially placed on the lower substrate. . Wherein, the glass glue at the joint between the frame and the upper and lower substrates causes a gap, which is approximately equal to the height of the indium ball, so that the lower end of the positioning post is resisted by the indium ball, and the upper end is just joined to the lower surface of the upper substrate. The surrounding area. The glass glue is an adhesive, so the next step is heating to bring the glass glue to the upper and lower substrates. During the heating process, the indium balls will gradually melt and flow out from the flow guiding groove, and the positioning column will gradually decrease with the melting process of the indium balls, and the glass glue will also be thinned by the heat overflow, and the upper substrate will be The lower substrate is vertically pressed downward, so the spacing between the upper and lower substrates and the frame is gradually reduced, and in the process, the positioning holes and the positioning posts cooperate to limit the relative orientation of the upper and lower substrates and the frame in the horizontal direction. position.
From this point of view, the existing precision controller needs to use indium balls, so it will cost more material costs. Moreover, such a precision controller is fixed between the upper and lower substrates in accordance with the assembly of the upper and lower substrates, and is difficult to be recycled and reused. Therefore, each time the assembly process of the upper and lower substrates and the bezel is performed, the number of the precision controllers is consumed. A precision controller that increases production costs.
有鑑於此，本發明的目的在提出一種基板限位結構，以期能取代現有的精度控制器，以節省材料成本，並且便於回收再利用。
為達到上述目的，本發明提出一種基板限位結構，適用於限制對組之上基板與下基板於水平方向上的相對位置，該基板限位結構包括主體與限位體。主體往第一方向延伸有第一板體且往第二方向延伸有第二板體，第一板體連接於第二板體且第一板體與第二板體大致呈L形。主體上透設有限位槽，限位體對應限位槽設置且限位體上端穿入限位槽。其中，限位體下端接合於下基板上，第一板體接合於上基板上，限位體抵持上基板的第一側表面，第二板體抵持下基板的第二側表面。
在本發明一實施例中，所述限位體上端的寬度大致等於所述限位槽的寬度。
在本發明一實施例中，所述第一方向與第二方向大致互相垂直。
在本發明一實施例中，所述限位體為柱體且沿第二方向延伸。
在本發明一實施例中，所述限位槽包括第一部份，第一部份位於第一板體且沿第一方向延伸。
在本發明一實施例中，所述限位槽更包括連接於所述第一部份之第二部份，第二部份位於所述第二板體且沿第二方向延伸。
在本發明一實施例中，所述第一板體接合於所述上基板的上表面的週邊區域，週邊區域相鄰於上基板之第一側表面。
在本發明一實施例中，所述下基板的上表面具有突出區，突出於所述上基板的第一側表面之外且相鄰於下基板之第二側表面，所述限位體下端接合於突出區。
在本發明一實施例中，所述第一板體與上基板的接合處，以及所述限位體與下基板的接合處，配置有光固化接著劑或熱固化接著劑。
在本發明一實施例中，所述第一板體透設有透光孔，透光孔的開口對應第一板體與上基板的接合處。
本發明所提出的一種基板限位結構，在上基板與下基板進行組立與固化時，透過主體和限位體的互相配合，使得在組立與固化的製程中可維持上基板與下基板於水平方向上的相對位置。本發明省略了銦球的使用，可節省材料支出，同時本發明的基板限位結構可便於回收再利用，從而降低了製作成本。
為讓本發明之目的、特徵和優點能使該領域具有通常知識者更易理解，下文舉一較佳實施例，並配合所附圖式，作詳細說明如下。
In view of this, the object of the present invention is to propose a substrate limiting structure, in order to replace the existing precision controller, to save material cost, and to facilitate recycling.
In order to achieve the above object, the present invention provides a substrate limiting structure, which is suitable for limiting the relative position of the upper substrate and the lower substrate in a horizontal direction. The substrate limiting structure includes a main body and a limiting body. The main body extends in a first direction with a first plate body and a second plate body extends in a second direction. The first plate body is connected to the second plate body and the first plate body and the second plate body are substantially L-shaped. A limiting slot is formed on the main body, and the limiting body is disposed corresponding to the limiting slot and the upper end of the limiting body penetrates into the limiting slot. The lower end of the limiting body is joined to the lower substrate, the first plate body is joined to the upper substrate, the limiting body abuts the first side surface of the upper substrate, and the second plate body abuts the second side surface of the lower substrate.
In an embodiment of the invention, the width of the upper end of the limiting body is substantially equal to the width of the limiting slot.
In an embodiment of the invention, the first direction and the second direction are substantially perpendicular to each other.
In an embodiment of the invention, the limiting body is a cylinder and extends in a second direction.
In an embodiment of the invention, the limiting slot includes a first portion, the first portion being located in the first plate and extending in the first direction.
In an embodiment of the invention, the limiting slot further includes a second portion connected to the first portion, and the second portion is located in the second plate and extends in the second direction.
In an embodiment of the invention, the first plate body is joined to a peripheral region of the upper surface of the upper substrate, and the peripheral region is adjacent to the first side surface of the upper substrate.
In an embodiment of the invention, the upper surface of the lower substrate has a protruding area protruding beyond the first side surface of the upper substrate and adjacent to the second side surface of the lower substrate, the lower end of the limiting body Engaged in the protruding area.
In an embodiment of the invention, the junction of the first plate and the upper substrate, and the junction of the limiting body and the lower substrate are disposed with a photocurable adhesive or a heat curing adhesive.
In an embodiment of the invention, the first plate body is provided with a light transmission hole, and the opening of the light transmission hole corresponds to a joint of the first plate body and the upper substrate.
The substrate limiting structure proposed by the present invention, when the upper substrate and the lower substrate are assembled and solidified, through the mutual cooperation of the main body and the limiting body, the upper substrate and the lower substrate can be maintained in the process of assembly and curing. The relative position in the direction. The invention omits the use of the indium sphere, which can save material expenditure, and at the same time, the substrate limiting structure of the invention can be easily recycled and reused, thereby reducing the manufacturing cost.
In order to make the objects, features, and advantages of the present invention more readily understood by those of ordinary skill in the art, the following description of the preferred embodiments and the accompanying drawings.
請同時參照圖1、圖2與圖3，圖1所繪示為本發明一較佳實施例之基板、邊框與基板限位結構的爆炸圖，圖2所繪示為本發明一較佳實施例之基板、邊框與基板限位結構的剖視圖，圖3所繪示為本發明一較佳實施例之基板、邊框與基板限位結構的局部立體圖。Referring to FIG. 1 , FIG. 2 and FIG. 3 , FIG. 1 is an exploded view of a substrate, a frame and a substrate limiting structure according to a preferred embodiment of the present invention, and FIG. 2 is a preferred embodiment of the present invention. 3 is a cross-sectional view of a substrate, a frame, and a substrate limiting structure. FIG. 3 is a partial perspective view of a substrate, a frame, and a substrate limiting structure according to a preferred embodiment of the present invention.
場發射顯示器包括有上基板10、邊框20與下基板30，上基板10具有第一上表面11與第一側表面12，下基板30具有第二上表面31與第二側表面32，其中第二上表面31還包括突出區33，突出區33係突出於第一側表面12之外且相鄰於第二側表面32。邊框20配置於下基板30的上方，上基板10配置於邊框20的上方，亦即邊框20被上基板10與下基板30夾持。The field emission display includes an upper substrate 10, a frame 20 and a lower substrate 30. The upper substrate 10 has a first upper surface 11 and a first side surface 12, and the lower substrate 30 has a second upper surface 31 and a second side surface 32, wherein The second upper surface 31 further includes a protruding portion 33 that protrudes beyond the first side surface 12 and adjacent to the second side surface 32. The frame 20 is disposed above the lower substrate 30, and the upper substrate 10 is disposed above the frame 20, that is, the frame 20 is sandwiched by the upper substrate 10 and the lower substrate 30.
基板限位結構包括有主體40與限位體42，且主體40與限位體42較佳採用熱膨脹係數近似於上基板10與下基板30的材料，例如陶瓷材質，但不限於此。主體40往第一方向延伸有第一板體401，且往第二方向延伸有第二板體402，第一方向與第二方向較佳的為互相垂直，在本實施例中，第一方向即為圖中所示的X方向，第二方向即為圖中所示的Y方向。第一板體401連接於第二板體402，且第一板體401與第二板體402大致呈L形。主體40上透設有限位槽41，限位槽41包括第一部份411與第二部份412，第一部份411位於第一板體401上且沿X方向延伸，第二部份412位於第二板體402上且沿Y方向延伸，第一部份411連接於第二部份412。限位體42係對應限位槽41設置，在本實施例中，限位體42為柱體且沿Y方向延伸，限位體42包括有上端421與下端422。The substrate limiting structure includes a main body 40 and a limiting body 42 . The main body 40 and the limiting body 42 preferably have a thermal expansion coefficient similar to that of the upper substrate 10 and the lower substrate 30 , such as a ceramic material, but are not limited thereto. The main body 40 has a first plate body 401 extending in a first direction, and a second plate body 402 extending in a second direction. The first direction and the second direction are preferably perpendicular to each other. In this embodiment, the first direction That is, the X direction shown in the drawing, and the second direction is the Y direction shown in the drawing. The first plate body 401 is coupled to the second plate body 402, and the first plate body 401 and the second plate body 402 are substantially L-shaped. The main body 40 is provided with a limiting slot 41. The limiting slot 41 includes a first portion 411 and a second portion 412. The first portion 411 is located on the first board 401 and extends in the X direction, and the second portion 412 Located on the second plate 402 and extending in the Y direction, the first portion 411 is coupled to the second portion 412. The limiting body 42 is disposed corresponding to the limiting slot 41. In the embodiment, the limiting body 42 is a cylinder and extends in the Y direction, and the limiting body 42 includes an upper end 421 and a lower end 422.
限位體42的上端421用以穿入限位槽41的第一部份411，限位體42的下端422用以接合於下基板30的突出區33，第一板體401用以接合於上基板10的第一上表面11的週邊區域，其中第一板體401與第一上表面11的接合處相鄰於第一側表面12。在本實施例中，下端422與突出區33的接合方式係透過耐高溫之接著劑44黏接，而第一板體401與第一上表面11的接合方式亦是透過耐高溫之接著劑44黏接，耐高溫之接著劑44例如是聚醯亞胺膠（polyimide，PI），於複數元件的接合處之間塗布接著劑44後，再以光照射之，接著劑44會因此而固化，並使得所述複數元件彼此固接。The upper end 421 of the limiting body 42 is used to penetrate the first portion 411 of the limiting slot 41. The lower end 422 of the limiting body 42 is used for engaging the protruding portion 33 of the lower substrate 30. The first board 401 is used for bonding. A peripheral region of the first upper surface 11 of the upper substrate 10, wherein a junction of the first plate 401 and the first upper surface 11 is adjacent to the first side surface 12. In the present embodiment, the bonding manner of the lower end 422 and the protruding portion 33 is adhered through the high temperature resistant adhesive 44, and the first plate 401 is joined to the first upper surface 11 by the high temperature resistant adhesive 44. The adhesive, high temperature resistant adhesive 44 is, for example, polyimide (PI), and after applying the adhesive 44 between the joints of the plurality of elements, the light is irradiated, and the adhesive 44 is cured. And the plurality of elements are fixed to each other.
第一板體401透設有透光孔43，透光孔43的開口對應第一板體401與上基板10的第一上表面11的接合處，光可透過透光孔43照射所述接合處，如此可使得第一板體401牢固的接合於第一上表面11。另外，光亦可透過限位槽41的第二部份412照射限位體42的下端422與突出區33的接合處，使限位體42牢固的接合於突出區33。另外，限位槽41的第一部份411於Z方向具有第一寬度413，限位體42的上端421具有第二寬度423，在本實施例中，第二寬度423即為限位體42的徑向直徑，並且，第一寬度413大致等於第二寬度423。The first plate body 401 is provided with a light transmission hole 43. The opening of the light transmission hole 43 corresponds to the joint of the first plate body 401 and the first upper surface 11 of the upper substrate 10, and the light can transmit the joint through the light transmission hole 43. Thus, the first plate 401 can be firmly joined to the first upper surface 11. In addition, the light can also pass through the second portion 412 of the limiting slot 41 to illuminate the junction of the lower end 422 of the limiting body 42 and the protruding portion 33, so that the limiting body 42 is firmly engaged with the protruding portion 33. In addition, the first portion 411 of the limiting slot 41 has a first width 413 in the Z direction, and the upper end 421 of the limiting body 42 has a second width 423. In this embodiment, the second width 423 is the limiting body 42. The radial diameter, and the first width 413 is substantially equal to the second width 423.
以下將詳細說明組立的過程：將邊框20的上、下表面塗布玻璃膠21；將邊框20與上基板10依序對位並置放於下基板30上；將兩個主體40接合於上基板10，亦即將第一板體401透過接著劑44黏接於第一上表面11的預定位置；將兩個限位體42接合於下基板30的預定位置，亦即將限位體42穿入限位槽41，使限位體42的上端421位於限位槽41的第一部份411，且限位體42的下端422透過接著劑44黏接於第二上表面31的突出區33；以光照射第一板體401與第一上表面11的接合處以及限位體42的下端422與突出區33的接合處，使接著劑44固化。The assembly process will be described in detail below: the upper and lower surfaces of the bezel 20 are coated with the glass paste 21; the bezel 20 and the upper substrate 10 are sequentially aligned and placed on the lower substrate 30; and the two main bodies 40 are bonded to the upper substrate 10 That is, the first plate body 401 is adhered to the predetermined position of the first upper surface 11 through the adhesive 44; the two limiting bodies 42 are joined to the predetermined position of the lower substrate 30, that is, the limiting body 42 is inserted into the limit position. The groove 41 is such that the upper end 421 of the limiting body 42 is located at the first portion 411 of the limiting groove 41, and the lower end 422 of the limiting body 42 is adhered to the protruding portion 33 of the second upper surface 31 through the adhesive 44; The junction of the first plate 401 and the first upper surface 11 and the junction of the lower end 422 of the stopper 42 and the protruding portion 33 are irradiated to cure the adhesive 44.
其中，限位體42會抵持上基板10的第一側表面12，第二板體402會抵持下基板30的第二側表面32，如此將可限制上基板10與下基板30於X方向的相對位移。另外，限位體42的上端421與限位槽41的第一部份411互相配合，將限制上基板10與下基板30於Z方向的相對位移。在之後加熱接著的製程中，當上基板10沿Y方向移動時，所述基板限位結構可限制上基板10與下基板30於水平方向，即X-Z平面上的相對位置。Wherein, the limiting body 42 will resist the first side surface 12 of the upper substrate 10, and the second plate 402 will abut the second side surface 32 of the lower substrate 30, so that the upper substrate 10 and the lower substrate 30 can be restricted to X. The relative displacement of the direction. In addition, the upper end 421 of the limiting body 42 and the first portion 411 of the limiting slot 41 cooperate to limit the relative displacement of the upper substrate 10 and the lower substrate 30 in the Z direction. In the subsequent heating process, when the upper substrate 10 is moved in the Y direction, the substrate stopper structure can restrict the relative positions of the upper substrate 10 and the lower substrate 30 in the horizontal direction, that is, in the X-Z plane.
請參照圖4，圖4所繪示為本發明另一較佳實施例之基板、邊框與基板限位結構的局部立體圖。圖4的上基板10、邊框20、下基板30與限位體42皆與圖3所示者相同，圖4與圖3的差異在於主體50的限位槽51。主體50包括有往X方向延伸的第一板體501與往Y方向延伸的第二板體502，限位槽51透設於第一板體501且對應於限位體42的上端421設置，限位槽51的開口為正方形且位於X方向與Z方向皆具有第一寬度513，第一寬度513與限位體42的上端421的第二寬度423大致相等，因此限位槽51與限位體42的上端421互相配合，可同時限制上基板10與下基板30於X方向與Z方向的相對位移。另外，第一板體501透設有第一透光孔531，第一透光孔531的作用與圖3所示的透光孔43相同，第二板體502透設有第二透光孔532，第二透光孔532則是取代圖3所示的限位槽41的第二部份412，以便讓光可以照射到限位體42與下基板30的接合處。在其他實施例中，限位槽的形狀亦可採用圓形開口或其餘可達到同樣功效的形狀，以及，所述接著劑44除聚醯亞胺膠外也可以用其他種類的耐高溫接著劑取代，例如以其他光固化接著劑或熱固化接著劑取代。Please refer to FIG. 4. FIG. 4 is a partial perspective view of a substrate, a frame and a substrate limiting structure according to another embodiment of the present invention. The upper substrate 10, the frame 20, the lower substrate 30, and the limiting body 42 of FIG. 4 are the same as those shown in FIG. 3. The difference between FIG. 4 and FIG. 3 lies in the limiting groove 51 of the main body 50. The main body 50 includes a first plate body 501 extending in the X direction and a second plate body 502 extending in the Y direction. The limiting slot 51 is disposed through the first plate body 501 and corresponding to the upper end 421 of the limiting body 42. The opening of the limiting slot 51 is square and has a first width 513 in both the X direction and the Z direction. The first width 513 is substantially equal to the second width 423 of the upper end 421 of the limiting body 42. Therefore, the limiting slot 51 and the limiting position The upper ends 421 of the bodies 42 cooperate with each other to simultaneously limit the relative displacement of the upper substrate 10 and the lower substrate 30 in the X direction and the Z direction. In addition, the first plate body 501 is provided with the first light transmission hole 531. The first light transmission hole 531 functions as the light transmission hole 43 shown in FIG. 3, and the second plate body 502 has the second light transmission hole. 532, the second light transmission hole 532 is a second portion 412 instead of the limiting groove 41 shown in FIG. 3, so that light can be irradiated to the joint of the limiting body 42 and the lower substrate 30. In other embodiments, the shape of the limiting groove may also adopt a circular opening or the other shape that can achieve the same effect, and the adhesive 44 may be used with other types of high temperature resistant adhesives in addition to the polyimide rubber. Instead, it is replaced, for example, with other photocurable adhesives or heat curing adhesives.
請同時參照圖2與圖5，圖5所繪示為本發明一較佳實施例之基板、邊框與基板限位結構的固化方式示意圖。將已對位組立的上基板10、邊框20與下基板30，連同主體40與限位體42，放置於治具60的固定座62上，治具60的彈性元件61會施力於上基板10，使其往下壓；接著將治具60放置於加熱箱70內進行加熱固化。在加熱過程中，玻璃膠21會溢流而變薄，使得邊框20與上基板10以及下基板30之間的間距211逐漸縮小，與此同時，主體40與限位體42互相配合，以限制上基板10與下基板30於X-Z方向的相對位移，直至最終完成上基板10、邊框20與下基板30的固化。Please refer to FIG. 2 and FIG. 5 simultaneously. FIG. 5 is a schematic diagram showing the curing manner of the substrate, the frame and the substrate limiting structure according to a preferred embodiment of the present invention. The upper substrate 10, the frame 20 and the lower substrate 30, which are aligned, are placed on the fixing base 62 of the jig 60 together with the main body 40 and the limiting body 42, and the elastic member 61 of the jig 60 is applied to the upper substrate. 10, pressing it down; then placing the jig 60 in the heating box 70 for heat curing. During the heating process, the glass glue 21 overflows and becomes thinner, so that the spacing 211 between the bezel 20 and the upper substrate 10 and the lower substrate 30 is gradually reduced, and at the same time, the main body 40 and the limiting body 42 cooperate to limit The relative displacement of the upper substrate 10 and the lower substrate 30 in the XZ direction until the final curing of the upper substrate 10, the bezel 20, and the lower substrate 30 is completed.
本發明所提出的一種基板限位結構，在上基板與下基板進行組立時，透過主體和限位體的互相配合，使得組立的過程中可維持上基板與下基板於水平方向上的相對位置。本發明省略了銦球的使用，可節省材料支出。另外，本發明的基板限位結構係設置於上基板與下基板的側邊，並不像現有的精度控制器是被夾於上基板與下基板之間，而是顯露於外，因此使用清潔液去除接著劑後即可簡單的回收再利用，從而降低了製作成本。The substrate limiting structure of the present invention can maintain the relative position of the upper substrate and the lower substrate in the horizontal direction during the assembly process when the upper substrate and the lower substrate are assembled, through the mutual cooperation of the main body and the limiting body. . The invention omits the use of indium balls and saves material expenditure. In addition, the substrate limiting structure of the present invention is disposed on the side of the upper substrate and the lower substrate, and is not exposed between the upper substrate and the lower substrate as in the prior art precision controller, but is exposed outside, so the cleaning is used. After the liquid is removed from the adhesive, it can be easily recycled and reused, thereby reducing the manufacturing cost.
雖然本發明已以較佳實施例揭露如上，然其並非用於限定本發明，任何熟習此技藝者，在不脫離本發明之精神和範圍內，當可作些許之更動與潤飾，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。While the present invention has been described above in terms of the preferred embodiments thereof, it is not intended to limit the invention, and the present invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application.
10．．．上基板10. . . Upper substrate
11．．．第一上表面11. . . First upper surface
12．．．第一側表面12. . . First side surface
20．．．邊框20. . . frame
21．．．玻璃膠twenty one. . . Glass glue
211．．．間距211. . . spacing
30．．．下基板30. . . Lower substrate
31．．．第二上表面31. . . Second upper surface
32．．．第二側表面32. . . Second side surface
33．．．突出區33. . . Prominent area
40、50．．．主體40, 50. . . main body
401、501．．．第一板體401, 501. . . First plate
402、502．．．第二板體402, 502. . . Second plate
41、51．．．限位槽41, 51. . . Limit slot
411．．．第一部份411. . . first part
412．．．第二部份412. . . Second part
413、513．．．第一寬度413, 513. . . First width
42．．．限位體42. . . Limit body
421．．．上端421. . . Upper end
422．．．下端422. . . Lower end
423．．．第二寬度423. . . Second width
43．．．透光孔43. . . Light transmission hole
44．．．接著劑44. . . Follower
531．．．第一透光孔531. . . First light transmission hole
532．．．第二透光孔532. . . Second light transmission hole
60．．．治具60. . . Fixture
61．．．彈性元件61. . . Elastic component
62．．．固定座62. . . Fixed seat
70．．．加熱箱70. . . Heating box
圖1所繪示為本發明一較佳實施例之基板、邊框與基板限位結構的爆炸圖。FIG. 1 is an exploded view of a substrate, a frame, and a substrate limiting structure according to a preferred embodiment of the present invention.
圖2所繪示為本發明一較佳實施例之基板、邊框與基板限位結構的剖視圖。2 is a cross-sectional view showing a substrate, a frame, and a substrate limiting structure according to a preferred embodiment of the present invention.
圖3所繪示為本發明一較佳實施例之基板、邊框與基板限位結構的局部立體圖。FIG. 3 is a partial perspective view of a substrate, a frame, and a substrate limiting structure according to a preferred embodiment of the present invention.
圖4所繪示為本發明另一較佳實施例之基板、邊框與基板限位結構的局部立體圖。FIG. 4 is a partial perspective view of a substrate, a frame, and a substrate limiting structure according to another preferred embodiment of the present invention.
圖5所繪示為本發明一較佳實施例之基板、邊框與基板限位結構的固化方式示意圖。FIG. 5 is a schematic diagram showing a curing manner of a substrate, a frame, and a substrate limiting structure according to a preferred embodiment of the present invention.
10．．．上基板10. . . Upper substrate
11．．．第一上表面11. . . First upper surface
12．．．第一側表面12. . . First side surface
20．．．邊框20. . . frame
30．．．下基板30. . . Lower substrate
31．．．第二上表面31. . . Second upper surface
32．．．第二側表面32. . . Second side surface
33．．．突出區33. . . Prominent area
40．．．主體40. . . main body
401．．．第一板體401. . . First plate
402．．．第二板體402. . . Second plate
41．．．限位槽41. . . Limit slot
411．．．第一部份411. . . first part
412．．．第二部份412. . . Second part
42．．．限位體42. . . Limit body
421．．．上端421. . . Upper end
422．．．下端422. . . Lower end
43．．．透光孔43. . . Light transmission hole
Claims (10)
一主體，往一第一方向延伸有一第一板體且往一第二方向延伸有一第二板體，該第一板體連接於該第二板體且該第一板體與該第二板體大致呈L形，該主體上透設有一限位槽；以及
一限位體，對應該限位槽設置且該限位體上端穿入該限位槽；
其中，該限位體下端接合於該下基板上，該第一板體接合於該上基板上，該限位體抵持該上基板的一第一側表面，該第二板體抵持該下基板的一第二側表面。The substrate limiting structure is adapted to limit the relative position of the upper substrate and the lower substrate in a horizontal direction of the pair of substrates. The substrate limiting structure comprises:
a main body, a first plate extending in a first direction and a second plate extending in a second direction, the first plate being coupled to the second plate and the first plate and the second plate The body is substantially L-shaped, the body is provided with a limiting slot; and a limiting body is disposed corresponding to the limiting slot and the upper end of the limiting body penetrates the limiting slot;
The lower end of the limiting body is bonded to the lower substrate, the first plate body is joined to the upper substrate, the limiting body abuts a first side surface of the upper substrate, and the second plate body abuts the a second side surface of the lower substrate.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
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| TW101120952A TWI596980B (en) | 2012-06-11 | 2012-06-11 | Plate limiting structure |
| CN201210327340.6A CN102842475B (en) | 2012-06-11 | 2012-09-06 | Substrate limiting structure |
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| TW101120952A TWI596980B (en) | 2012-06-11 | 2012-06-11 | Plate limiting structure |
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| TW201352054A true TW201352054A (en) | 2013-12-16 |
| TWI596980B TWI596980B (en) | 2017-08-21 |
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| TW476094B (en) * | 1998-09-08 | 2002-02-11 | Matsushita Electric Ind Co Ltd | A display panel and manufacturing method for the same including improved bonding agent application method |
| EP1542255A1 (en) * | 2002-07-15 | 2005-06-15 | Kabushiki Kaisha Toshiba | Image display device, image display device manufacturing method, and manufacturing device |
| JP2004265601A (en) * | 2003-01-10 | 2004-09-24 | Toshiba Corp | Image display device and its manufacturing method |
| WO2005086197A1 (en) * | 2004-03-10 | 2005-09-15 | Seoul National University Industry Foundation | Method of vacuum-sealing flat panel display using o-ring and flat panel display manufactured by the method |
| CN100529522C (en) * | 2006-06-07 | 2009-08-19 | 友达光电股份有限公司 | Backlight module, and plane lamp |
| TWM306301U (en) * | 2006-08-18 | 2007-02-11 | Teco Elec & Machinery Co Ltd | Assembly structure of a field-emission lamp with surface lamp holder |
| JP2010073413A (en) * | 2008-09-17 | 2010-04-02 | Canon Inc | Method of making vacuum container |
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| TWI596980B (en) | 2017-08-21 |
| CN102842475A (en) | 2012-12-26 |
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