TW201351404A - Production method for multilayer optical recording medium - Google Patents

Production method for multilayer optical recording medium Download PDF

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Publication number
TW201351404A
TW201351404A TW102106365A TW102106365A TW201351404A TW 201351404 A TW201351404 A TW 201351404A TW 102106365 A TW102106365 A TW 102106365A TW 102106365 A TW102106365 A TW 102106365A TW 201351404 A TW201351404 A TW 201351404A
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Taiwan
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layer
adhesive
layered body
laminated
optical recording
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TW102106365A
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Chinese (zh)
Inventor
Masaharu Ito
Takuya Hayasaka
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Lintec Corp
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Publication of TW201351404A publication Critical patent/TW201351404A/en

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    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/24Record carriers characterised by shape, structure or physical properties, or by the selection of the material
    • G11B7/26Apparatus or processes specially adapted for the manufacture of record carriers
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/004Recording, reproducing or erasing methods; Read, write or erase circuits therefor
    • G11B7/0045Recording
    • G11B2007/00457Two photon recording
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/24Record carriers characterised by shape, structure or physical properties, or by the selection of the material
    • G11B7/241Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material
    • G11B7/252Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of layers other than recording layers
    • G11B7/253Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of layers other than recording layers of substrates
    • G11B2007/25303Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of layers other than recording layers of substrates comprising resins
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/004Recording, reproducing or erasing methods; Read, write or erase circuits therefor
    • G11B7/0045Recording
    • G11B7/00455Recording involving reflectivity, absorption or colour changes
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/24Record carriers characterised by shape, structure or physical properties, or by the selection of the material
    • G11B7/2403Layers; Shape, structure or physical properties thereof
    • G11B7/24035Recording layers
    • G11B7/24038Multiple laminated recording layers
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/24Record carriers characterised by shape, structure or physical properties, or by the selection of the material
    • G11B7/241Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material
    • G11B7/242Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of recording layers
    • G11B7/244Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of recording layers comprising organic materials only
    • G11B7/246Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of recording layers comprising organic materials only containing dyes

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Optical Record Carriers (AREA)
  • Laminated Bodies (AREA)
  • Optical Record Carriers And Manufacture Thereof (AREA)

Abstract

This invention provides a production method for multilayer optical recording medium (20) capable of reducing the likelihood of warpage. The method is to produce a laminated structure body (14), in which several unit laminated bodies (11), each including an adhesive layer (2) and an optical recording layer (1), are laminated on one side of the substrate (12), and the outer most unit laminated body, i.e. the farthest from the substrate (12), is laminated with a covering layer so as to constitute the laminated structure body (14). It is characterized in that the lamination process is to laminate a unit laminated body (11) and a covering layer (13) on the surface of adhesive laminated body (32) of the unit laminated body (11) located at the location farthest away from the substrate (12) of the adhesive structure (31) which includes the substrate (12) and at least one of the unit laminated body (11), and one of the group consisting of these laminated bodies is selected as attachment-layer body (33), and the attachment-layer body (33) layered on the adhesive structure (31) is created to have tensile stress. The lamination process includes: an attachment step for attaching the attachment-layer body (33) to the adhesive structure (31), a force-applying step for applying external force to the attachment-layer body (33), a direction-control step for controlling the direction in which the external force is applied to the attachment-layer body (33) during the force-applying step; and the direction-control step is a step for controlling the direction in which the external force is applied to the attachment-layer body (33) in such a manner that an inter-stress angle (R) of a first direction in the attachment-layer body (33) layered on the applied structure (31), which is the direction of a principal-in-plane component of the tensile stress from the external force, in relation to a second direction in the adhesive-layer body (32), which is the direction of a principal-in-plane component of the tensile stress thereof, is more than 0 degrees and less than 120 degrees.

Description

多層光記錄媒體之製造方法 Method for manufacturing multilayer optical recording medium

本發明係關於一種多層光記錄媒體之製造方法。 The present invention relates to a method of manufacturing a multilayer optical recording medium.

在近年來,光記錄媒體係在可以記錄大量之記錄資料之方面,受到注目,使用於各種之用途。在最近,以更進一步之記錄密度之提升來作為目標而提議呈三次元地記錄資料之方法(在以下,也稱為「多層光記錄法」。)。例如Y.Kawata們係報告在具有光聚合反應性之光反應性成分之光聚合物材料來進行多層光記錄之技術(例如參考非專利文獻1)。 In recent years, optical recording media have attracted attention in terms of being able to record a large amount of recorded data, and have been used for various purposes. Recently, a method of recording data in three dimensions (hereinafter, also referred to as "multilayer optical recording method") has been proposed with the aim of further increasing the density of recording. For example, Y. Kawata is a technique for performing multilayer optical recording on a photopolymer material having a photopolymerizable photoreactive component (for example, refer to Non-Patent Document 1).

適用於多層光記錄法之光媒體係例如記載於專利文獻1之多層光記錄媒體,多層光記錄媒體來包括之光記錄層數係有年年增加之傾向發生,在前述專利文獻1,揭示在實施例,具有20層之光記錄層之層積體。 The optical medium to be applied to the multilayer optical recording method is described, for example, in the multilayer optical recording medium of Patent Document 1, and the number of optical recording layers included in the multilayer optical recording medium tends to increase year by year, and Patent Document 1 discloses Example, a laminate having 20 layers of optical recording layers.

【先前技術文獻】 [Previous Technical Literature] 【專利文獻】 [Patent Literature]

【專利文獻1】日本特開2011-81860號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2011-81860

【非專利文獻】 [Non-patent literature]

【非專利文獻1】Appl. Opt., 35, 2466 (1966年) [Non-Patent Document 1] Appl. Opt., 35, 2466 (1966)

作為製造前述多層光記錄媒體之方法係提議:在基板呈無直接地設置記錄層,使用層積光記錄層和感壓接著劑層而組成之感壓接合性薄片來貼附於基板之方法。但是,在將使用此種薄片之方法予以採用之狀態下,在增加層積之薄片數之時,在媒體之主面(以平行於媒體之厚度方向之平行方向來作為法線之面)之內方向,殘留強烈之拉伸應力,有在媒體來發生彎曲之狀態發生。在其彎曲程度變大之時,擔心會由多層光記錄媒體,在使用再生裝置而再生資料之際,引起讀入之不良。 As a method of manufacturing the above-described multilayer optical recording medium, there is proposed a method in which a substrate is provided with a pressure-sensitive adhesive sheet composed of a laminated optical recording layer and a pressure-sensitive adhesive layer without directly providing a recording layer. However, in the state in which the method of using such a sheet is used, when the number of laminated sheets is increased, the main surface of the medium (the surface parallel to the thickness direction of the medium serves as the normal line) In the inner direction, a strong tensile stress remains, which occurs in a state where the medium is bent. When the degree of bending becomes large, there is a concern that the multilayer optical recording medium may cause a problem of reading when the data is reproduced by using the reproducing device.

本發明係有鑑於前述狀況而完成的,其課題係提供一種將減低彎曲發生之可能性之多層光記錄媒體予以製造之方法。 The present invention has been made in view of the above circumstances, and a problem thereof is to provide a method of manufacturing a multilayer optical recording medium which reduces the possibility of occurrence of warpage.

解決前述課題之本發明係提供一種多層光記錄媒體之製造方法(發明1),在第1,成為使得至少包括黏著劑層和光記錄層之單位層積體在基板之某一邊之面來層積複數個並且將於層積在最遠離於前述基板之最遠位置側之前述單位層積體來形成覆蓋層而組成之層積構造體予以包括之多層光記錄媒體之製造方法,其特徵在於:包括:由包括前述基板和至少一個之前述單位層積體之黏著構造體之前述基板開始,在成為位處於最遠位置側之前述單位層積體之黏著層積體側之面,層積前述單位層積體和前述覆蓋層以及由這些層積體而組 成之群組來選出之附設層狀體,同時,成為使得層積於前述黏著構造體之前述附設層狀體來具有拉伸應力之狀態之層積製程;該層積製程係包括:將前述附設層狀體來貼附於前述黏著構造體之貼附製程;在前述附設層狀體來賦予外力之施加製程;以及控制藉由該施加製程而在前述附設層狀體來賦予外力之方向之方向控制製程;前述方向控制製程係控制外力來賦予至前述附設層狀體之方向,而使得成為起因於層積在前述黏著構造體之前述附設層狀體之前述外力來造成之拉伸應力之主面內成分之方向之第1方向相對於成為前述黏著層積體具有之拉伸應力之主面內成分之方向之第2方向之應力間角度R,成為0°超過、120°以內之製程。 The present invention for solving the above problems provides a method for producing a multilayer optical recording medium (Invention 1). In the first aspect, a unit laminate including at least an adhesive layer and an optical recording layer is laminated on one side of a substrate. A method of manufacturing a multilayer optical recording medium comprising a plurality of laminated structures which are formed by laminating a unit layer laminated body which is formed on the farthest position side farthest from the substrate to form a cover layer, and is characterized in that: The method of laminating the surface of the adhesive layered body of the unit laminate which is the farthest position side from the substrate including the adhesive layer of the unit substrate and the at least one unit laminate Unit laminate and the aforementioned cover layer and grouped by these laminates a layered body to be selected from the group, and at the same time, a lamination process for laminating the attached layered body of the adhesive structure to have a tensile stress; the layering process includes: a lamination process to which the layered body is attached to the adhesive structure; an application process for applying an external force to the layered body; and a direction in which the external layer is applied to the layered body by the application process a direction control process; the direction control process controls the external force to be applied to the direction of the attached layered body, so that the tensile stress is caused by the external force of the attached layered body laminated on the adhesive structure. The first direction of the direction of the component in the main surface is equal to or less than 120° with respect to the inter-stress angle R in the second direction which is the direction of the component in the main surface of the tensile stress of the adhesive layer. .

在前述發明(發明1),在層積附設層狀體之時,控制賦予之外力,因此,可以將殘留於層積覆蓋層而得到之層積構造體之應力之集中予以降低。因此,可以藉由前述發明之實施而得到減低彎曲發生之可能性之多層光記錄媒體。 According to the invention (Invention 1), since the external force is controlled when the layered body is laminated, the concentration of the stress of the laminated structure obtained by laminating the cover layer can be reduced. Therefore, a multilayer optical recording medium capable of reducing the possibility of occurrence of warpage can be obtained by the implementation of the above invention.

在前述發明(發明1),最好是前述施加製程係在前述貼附製程之實施前、實施中和實施後之至少任何一種,對於前述附設層狀體,來賦予由張力和擠壓力之至少一種而組成之外力之製程(發明2)。 In the above invention (Invention 1), it is preferable that the application process is at least one of before, during, and after the execution of the attaching process, and the tension and the pressing force are imparted to the attached layered body. At least one process that constitutes an external force (Invention 2).

在前述發明(發明2),最好是前述施加製程係在相反於對向在前述附設層狀體之前述黏著層積體之對向面之相反側之面側,藉由外力賦予構件,來賦予外力,而使得前述附設層狀體,成為在主面內方向來具有拉伸應力之狀態之製程(發明3)。 In the above invention (Invention 2), it is preferable that the application process is performed by an external force imparting member on the side opposite to the opposite side of the opposing surface of the adhesive layered body of the attached layered body. The external force is applied, and the attached layered body is in a state in which tensile stress is applied in the direction of the main surface (Invention 3).

在前述發明(發明1至3),最好是前述黏著構造體係能夠以其主面之法線方向來作為旋轉軸而進行旋轉,作為前述方向控制製程係在旋轉前述黏著構造體之後,實施前述貼附製程(發明4)。 In the above invention (Inventions 1 to 3), it is preferable that the adhesive structure system is rotatable as a rotation axis in a normal direction of the main surface thereof, and the directional control process is performed after the rotation of the adhesive structure Attachment process (Invention 4).

在前述發明(發明1至4),最好是前述附設層狀體係能夠以前述黏著構造體之主面之法線方向來作為旋轉軸而進行旋轉,作為前述方向控制製程係在旋轉前述附設層狀體之後,實施前述貼附製程(發明5)。 In the above invention (Inventions 1 to 4), it is preferable that the attached layered system is rotatable as a rotation axis in a normal direction of a main surface of the adhesive structure, and the directional control process is to rotate the attachment layer After the shape, the above-described attaching process (Invention 5) is carried out.

在前述發明(發明1至5),最好是前述單位層積體係包括玻璃轉移溫度Tg為25℃以上之層之硬質層(發明6)。 In the above invention (Inventions 1 to 5), it is preferable that the unit laminated system includes a hard layer having a layer having a glass transition temperature Tg of 25 ° C or higher (Invention 6).

在前述發明(發明1至6),最好是在前述附設層狀體之至少一邊之面,層積剝離用材料,由前述附設層狀體,剝離前述剝離用材料,露出前述附設層狀體之一邊之面,藉由貼合該面以及相反於前述黏著層積體之前述基板之相反側之面,而使得前述附設層狀體,貼附於前述黏著構造體(發明7)。 In the above invention (Inventions 1 to 6), it is preferable that a material for peeling off is laminated on at least one side of the layered body, and the peeling material is peeled off from the attached layered body to expose the attached layered body. The surface of one of the sides is attached to the adhesive structure by the surface of the opposite side of the substrate on the opposite side of the adhesive laminate, and the attached layered body is attached to the adhesive structure (Invention 7).

在前述發明(發明1至7),最好是前述黏著構造體係在其黏著層積體側之面,層積剝離用材料,由前述黏著構造體,剝離前述剝離用材料,露出前述黏著層積體之一邊之面,藉由貼合該面以及前述附設層狀體之一邊之面,而使得前述附設層狀體,貼附於前述黏著構造體(發明8)。 In the above invention (Inventions 1 to 7), it is preferable that the adhesive structure system laminates a material for peeling off on the surface of the adhesive laminate side, and the adhesive structure is peeled off from the adhesive structure to expose the adhesive layer. The surface of one side of the body is bonded to the surface of one side of the layered body, and the attached layered body is attached to the above-mentioned adhesive structure (Invention 8).

在前述發明(發明1至8),最好是在前述層積製程,將預先進行切斷加工而具有對應於前述基板之形狀之前述附設層狀體,層積於前述黏著構造體(發明9)。 In the above-described invention (Inventions 1 to 8), it is preferable that the above-mentioned laminated structure is formed by the above-mentioned laminated structure in which the cutting process is performed in advance and has a shape corresponding to the shape of the substrate, and is laminated on the adhesive structure (Invention 9) ).

在前述發明(發明1至8),最好是具有:對於前 述附設層狀體,進行切斷加工而具有對應於前述基板之形狀之切斷製程(發明10)。 In the foregoing invention (Inventions 1 to 8), it is preferable to have: for the former The layered body is attached, and the cutting process is performed to have a cutting process corresponding to the shape of the substrate (Invention 10).

在前述發明(發明1至9),最好是前述貼附製程係沿著一定方向來搬送長尺之附設層狀體而貼附於前述黏著構造體之貼附製程(發明11)。 In the above invention (Inventions 1 to 9), it is preferable that the attaching process is to carry out a bonding process in which the long-side attached layered body is attached to the adhesive structure in a predetermined direction (Invention 11).

在本發明之製造方法,在層積附設層狀體之層積製程,在各附設層狀體,賦予外力,以具有拉伸應力之狀態,來層積附設層狀體。在此時,可以藉由控制其賦予之外力而將殘留於層積覆蓋層而得到之層積構造體之應力之集中予以降低。因此,可以藉由本發明之製造方法而得到減低彎曲發生之可能性之多層光記錄媒體。 In the manufacturing method of the present invention, a lamination process is performed by laminating a layered body, and an external force is applied to each of the layered bodies, and a layered body is laminated in a state of having tensile stress. At this time, the concentration of the stress of the laminated structure obtained by remaining the laminated cover layer can be reduced by controlling the external force. Therefore, a multilayer optical recording medium capable of reducing the possibility of occurrence of warpage can be obtained by the manufacturing method of the present invention.

1、52、54‧‧‧光記錄層 1, 52, 54‧‧‧ optical recording layer

2、55‧‧‧黏著劑層 2, 55‧‧ ‧ adhesive layer

3、51‧‧‧第1剝離用材料 3, 51‧‧‧1st stripping material

4、56‧‧‧第2剝離用材料 4, 56‧‧‧2nd peeling material

11、11-1、11-2、11-3、11-(n-1)、11-n、50‧‧‧單位層積體 11, 11-1, 11-2, 11-3, 11-(n-1), 11-n, 50‧‧‧ unit layer

12‧‧‧基板 12‧‧‧Substrate

13‧‧‧覆蓋層 13‧‧‧ Coverage

14‧‧‧層積構造體 14‧‧‧Layered structures

15‧‧‧黏著劑層 15‧‧‧Adhesive layer

20‧‧‧多層光記錄媒體 20‧‧‧Multilayer optical recording media

31‧‧‧黏著構造體 31‧‧‧Adhesive structures

32‧‧‧黏著層積體 32‧‧‧Adhesive laminate

32a‧‧‧相反於黏著層積體32之基板12之相反側之面 32a‧‧‧ opposite to the opposite side of the substrate 12 of the adhesive laminate 32

33‧‧‧附設層狀體 33‧‧‧With layered body

33a‧‧‧對向於單位層積體11-4之黏著層積體32之側之面 33a‧‧‧ facing the side of the adhesive laminate 32 of the unit laminate 11-4

33b‧‧‧相反於單位層積體11-4之面33a之相反側之面 33b‧‧‧ opposite to the opposite side of the face 33a of the unit laminate 11-4

34、35‧‧‧剝離用材料 34, 35‧‧‧ peeling materials

36‧‧‧黏著構造體31之主面之法線方向 36‧‧‧The normal direction of the main surface of the adhesive structure 31

37、37-1、37-2、37-3、37-4、37-5、37-6、37-7‧‧‧第1方向 37, 37-1, 37-2, 37-3, 37-4, 37-5, 37-6, 37-7‧‧‧1st direction

38、38-1、38-2‧‧‧第2方向 38, 38-1, 38-2‧‧‧2nd direction

41‧‧‧基台 41‧‧‧Abutment

42‧‧‧加壓用壓輥 42‧‧‧Pressure pressure roller

53‧‧‧支持層 53‧‧‧Support layer

60‧‧‧預先進行切斷加工而成為對應於基板之形狀之附設層狀體 60‧‧‧The cutting process is performed in advance to form an attached layered body corresponding to the shape of the substrate

圖1係本發明之一實施形態之單位層積體之一具體例之概略剖面圖。 Fig. 1 is a schematic cross-sectional view showing a specific example of a unit laminate according to an embodiment of the present invention.

圖2係本發明之一實施形態之多層光記錄媒體之二個具體例,也就是關於(a)在基板透過黏著劑層而層積單位層積體之狀態以及(b)在基板呈直接地層積單位層積體之狀態之概略剖面圖。 Fig. 2 is a view showing two specific examples of the multilayer optical recording medium according to the embodiment of the present invention, that is, (a) a state in which the unit laminate is laminated by the substrate through the adhesive layer; and (b) a direct layer on the substrate. A schematic cross-sectional view of the state of the product unit laminate.

圖3係呈概念地顯示本發明之一實施形態之層積構造體之層積製程之剖面圖。 Fig. 3 is a cross-sectional view conceptually showing a lamination process of a laminated structure according to an embodiment of the present invention.

圖4係呈概念地顯示本發明之一實施形態之方向控制製程之應力間角度R之設定方法之一例之立體圖,顯示在(a)企 圖旋轉基台而作為方向控制製程之狀態、(b)結束方向控制製程而設定應力間角度R之狀態以及(c)在貼附製程後而進行在進行施加製程之狀況下之施加製程之狀態之圖。 4 is a perspective view conceptually showing an example of a method of setting the inter-stress angle R of the direction control process according to an embodiment of the present invention, which is shown in (a) The state in which the base is rotated as a direction control process, (b) the end direction control process is set to the state of the inter-stress angle R, and (c) the state in which the process is applied after the application process is performed after the attaching process Picture.

圖5係呈概念地顯示本發明之一實施形態之方向控制製程之應力間角度R之設定方法之一例之立體圖,顯示在(a)企圖旋轉附設層狀體而作為方向控制製程之狀態、(b)結束方向控制製程而設定應力間角度R之狀態以及(c)在貼附製程後而結束在進行施加製程之狀況下之方向控制製程之狀態之圖。 5 is a perspective view conceptually showing an example of a method of setting the inter-stress angle R of the direction control process according to the embodiment of the present invention, and shows a state in which (a) an attempt is made to rotate the layered body as a direction control process, ( b) a state in which the direction control process is set to end the direction control process, and (c) a state in which the direction control process in the case where the application process is performed is completed after the attaching process.

圖6係由上面側開始觀看實施例1及實施例3之多層光記錄媒體之概略俯視圖,顯示構成該多層光記錄媒體之單位層積體及覆蓋層之各個之拉伸應力之面內方向之圖。 6 is a schematic plan view of the multilayer optical recording medium of the first embodiment and the third embodiment viewed from the upper side, showing the in-plane direction of the tensile stress of each of the unit laminate and the cover layer constituting the multilayer optical recording medium. Figure.

圖7係在實施例2而製作之單位層積體之概略剖面圖。 Fig. 7 is a schematic cross-sectional view showing a unit laminate produced in the second embodiment.

圖8係呈概念地顯示關於預先進行切斷加工而成為對應於基板之形狀之附設層狀體之2個具體例(a)和(b)之前視圖(i)及剖面圖(ii)。 Fig. 8 is a front view (i) and a cross-sectional view (ii) showing two specific examples (a) and (b) of an attached layered body which is subjected to a cutting process in advance and which has a shape corresponding to a substrate.

在以下,就本發明之實施形態而進行說明。 Hereinafter, embodiments of the present invention will be described.

1.單位層積體 Unit layer

本發明之一實施形態之多層光記錄媒體之製造方法係在其製造時,使用至少包括黏著劑層和光記錄層之單位層積體。 In the method for producing a multilayer optical recording medium according to an embodiment of the present invention, a unit laminate including at least an adhesive layer and an optical recording layer is used in the production.

單位層積體係只要是滿足前述構造上之要件的話,則並無限定具體之構造。可以是黏著劑層和光記錄層之層積體,並且,也可以是黏著劑層、光記錄層、黏著劑層和光記錄層以外之層按照該順序而進行層積之層積體。 The unit stratification system is not limited to a specific structure as long as it satisfies the above-mentioned structural requirements. It may be a laminate of an adhesive layer and an optical recording layer, and may be a laminate in which layers other than the adhesive layer, the optical recording layer, the adhesive layer, and the optical recording layer are laminated in this order.

(1)黏著劑層 (1) Adhesive layer

在本發明之單位層積體,可以在黏著劑層,最好是列舉(A)非硬化型黏著劑層和(B)能量硬化型黏著劑層之2種形態。 The unit laminate of the present invention may be in the form of an adhesive layer, preferably in the form of (A) a non-hardening type adhesive layer and (B) an energy-hardening type adhesive layer.

(A)非硬化型黏著劑層 (A) non-hardening adhesive layer

作為構成前述(1)之非硬化型黏著劑層之黏著劑係使用在製作層積構造體(細節係敘述於後面。)之際之貼合溫度而具有黏著性者,最好是使用也對於光記錄層而具有接合性者。由光學用途之方面來看的話,則作為此種黏著劑係最好是丙烯系黏著劑。 The adhesive which constitutes the non-curing adhesive layer of the above (1) is used for the adhesion temperature at the time of producing a laminated structure (details are described later), and it is preferable to use it. The optical recording layer has a bonding property. From the viewpoint of optical use, it is preferable that the adhesive is a propylene-based adhesive.

作為該丙烯系黏著劑係可以使用例如包含(甲基)丙烯酸酯共聚物和交聯劑者。此外,在本說明書,所謂(甲基)丙烯酸係表示丙烯酸和甲基丙烯酸之兩者。其他之類似用語也相同。 As the propylene-based adhesive system, for example, a (meth) acrylate copolymer and a crosslinking agent can be used. Further, in the present specification, the term "(meth)acrylic acid" means both of acrylic acid and methacrylic acid. Other similar terms are the same.

作為前述(甲基)丙烯酸酯系共聚物係最好是可以列舉烷基之碳數為1~20之(甲基)丙烯酸烷基酯單體和將具有活性氫之官能基予以包括之單體以及由於要求而使用之其他之單體之共聚物。 The (meth) acrylate-based copolymer is preferably an alkyl (meth) acrylate monomer having an alkyl group having 1 to 20 carbon atoms and a monomer including a functional group having an active hydrogen. And copolymers of other monomers used as required.

在此,作為烷基之碳數為1~20之(甲基)丙烯酸烷基酯單體之例子係列舉甲基(甲基)丙烯酸酯、乙基(甲基)丙烯酸酯、丙基(甲基)丙烯酸酯、n-丁基(甲基)丙烯酸酯、異丁基(甲基)丙烯酸酯、戊基(甲基)丙烯酸酯、己基(甲基)丙烯酸酯、環己基(甲基)丙烯酸酯、2-乙基己基(甲基)丙烯酸酯、異辛基(甲基)丙烯酸酯、癸基(甲 基)丙烯酸酯、月桂基(甲基)丙烯酸酯、肉豆蔻基(甲基)丙烯酸酯、棕櫚基(甲基)丙烯酸酯、硬脂醯基(甲基)丙烯酸酯等。這些係可以單獨地使用,並且,也可以組合2種以上而使用。 Here, examples of the alkyl (meth) acrylate monomer having an alkyl group having 1 to 20 carbon atoms include methyl (meth) acrylate, ethyl (meth) acrylate, and propyl (methyl). Acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, amyl (meth) acrylate, hexyl (meth) acrylate, cyclohexyl (meth) acrylate Ester, 2-ethylhexyl (meth) acrylate, isooctyl (meth) acrylate, fluorenyl (A) Acrylate, lauryl (meth) acrylate, myristyl (meth) acrylate, palmityl (meth) acrylate, stearyl methacrylate (meth) acrylate, and the like. These systems may be used singly or in combination of two or more.

另一方面,作為將具有活性氫之官能基予以包括之單體之例子係列舉2-羥基乙基(甲基)丙烯酸酯、2-羥基丙基(甲基)丙烯酸酯、3-羥基丙基(甲基)丙烯酸酯、2-羥基丁基(甲基)丙烯酸酯、3-羥基丁基(甲基)丙烯酸酯、4-羥基丁基(甲基)丙烯酸酯等之羥基烷基(甲基)丙烯酸酯;單甲基胺基乙基(甲基)丙烯酸酯、單乙基胺基乙基(甲基)丙烯酸酯、單甲基胺基丙基(甲基)丙烯酸酯、單乙基胺基丙基(甲基)丙烯酸酯等之單烷基胺基烷基(甲基)丙烯酸酯;丙烯酸、甲基丙烯酸、巴豆酸、順丁烯二酸、衣康酸、檸康酸等之乙烯性不飽和羧酸等。這些單體係可以單獨地使用,並且,也可以組合2種以上而使用。 On the other hand, as an example of a monomer including a functional group having an active hydrogen, a series of 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl group Hydroxyalkyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 3-hydroxybutyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, etc. Acrylate; monomethylaminoethyl (meth) acrylate, monoethylaminoethyl (meth) acrylate, monomethylaminopropyl (meth) acrylate, monoethylamine Monoalkylaminoalkyl (meth) acrylate such as propyl (meth) acrylate; ethylene of acrylic acid, methacrylic acid, crotonic acid, maleic acid, itaconic acid, citraconic acid, etc. Sexually unsaturated carboxylic acids and the like. These single systems may be used singly or in combination of two or more.

此外,作為由於要求而使用之其他之單體之例子係列舉乙酸乙烯、丙酸乙烯等之乙烯酯類;乙烯、丙烯、異丁烯等之烯烴類;氯乙烯、乙烯叉氯化物等之鹵化烯烴類;苯乙烯、α-甲基苯乙烯等之苯乙烯系單體;丁二烯、異戊二烯、氯丁二烯等之二烯系單體;丙烯腈、甲基丙烯腈等之腈系單體;丙烯醯胺、N-甲基丙烯醯胺、N,N-二甲基丙烯醯胺等之丙烯醯胺類等。這些係可以單獨地使用,並且,也可以組合2種以上而使用。 Further, examples of other monomers used as required include vinyl esters such as vinyl acetate and vinyl propionate; olefins such as ethylene, propylene, and isobutylene; and halogenated olefins such as vinyl chloride and vinylidene chloride. a styrene monomer such as styrene or α-methylstyrene; a diene monomer such as butadiene, isoprene or chloroprene; and a nitrile such as acrylonitrile or methacrylonitrile. Monomer; acrylamide such as acrylamide, N-methyl acrylamide, N,N-dimethyl decylamine or the like. These systems may be used singly or in combination of two or more.

在該丙烯系黏著劑,使用作為樹脂成分之(甲基) 丙烯酸酯系共聚物係就其共聚合形態而並無特別限制,可以是無規、嵌段、接枝共聚物之任何一種。此外,分子量係最好是以重量平均分子量而成為200,000~2,000,000之範圍。 In the propylene-based adhesive, (methyl) as a resin component is used. The acrylate-based copolymer is not particularly limited in its copolymerization form, and may be any of random, block, and graft copolymers. Further, the molecular weight is preferably in the range of 200,000 to 2,000,000 in terms of a weight average molecular weight.

此外,前述重量平均分子量係藉由凝膠滲透色譜法(GPC)而測定之聚苯乙烯換算值。 Further, the weight average molecular weight is a polystyrene-converted value measured by gel permeation chromatography (GPC).

在本發明,該(甲基)丙烯酸酯系共聚物係可以單獨地使用1種,並且,也可以組合2種以上而使用。 In the present invention, the (meth) acrylate-based copolymer may be used singly or in combination of two or more.

(B)能量硬化型黏著劑層 (B) Energy hardening adhesive layer

另一方面,構成能量硬化型黏著劑層之黏著劑係能量硬化型,在製作層積構造體之際之貼合溫度,具有黏著性,最好是也具有對於光記錄層之接合性,同時,藉由施加熱或光等之能量而進行硬化,增加硬度,具有不容易按壓得到之層積構造體而附著痕跡之機能。 On the other hand, the adhesive constituting the energy-curing adhesive layer is an energy-hardening type, and has adhesiveness at the bonding temperature at the time of producing the laminated structure, and preferably has adhesion to the optical recording layer, and at the same time It is hardened by applying energy such as heat or light to increase the hardness, and has a function of attaching a structure to the laminated structure which is not easily pressed.

作為此種能量硬化型黏著劑係如果是可以具有前述機能且使用於光學用途的話,則並無特別限制,可以由向來習知之能量硬化型黏著劑之中,適度地進行選擇及使用。 The energy-hardening type adhesive is not particularly limited as long as it can have the above-described functions and is used for optical applications, and can be appropriately selected and used among the conventional energy-hardening adhesives.

作為此種能量硬化型黏著劑係可以使用例如熱硬化型以及能量射線硬化型之黏著劑。此外,在能量硬化型黏著劑,有丙烯系、矽酮系、橡膠系等,但是,在本發明,由光學用途之方面來看的話,則最好是能量硬化型丙烯系黏著劑。作為能量射線係可以列舉紫外線或電子線。 As such an energy hardening type adhesive, for example, a thermosetting type and an energy ray hardening type adhesive can be used. Further, the energy-curing type adhesive is propylene-based, fluorenone-based or rubber-based. However, in the present invention, from the viewpoint of optical use, an energy-curable propylene-based adhesive is preferable. Examples of the energy ray system include ultraviolet rays or electron beams.

作為前述能量硬化型丙烯系黏著劑係可以列舉例如(a)包含黏著性丙烯系聚合物和能量硬化型聚合性寡聚物及/或聚合性單體以及由於要求之聚合起始劑之黏著劑、(b) 將導入在側鏈來具有聚合性雙鍵之能量硬化型官能基而組成之黏著性丙烯系聚合物(在以下,稱為「能量硬化型共聚物」。)以及由於要求之聚合起始劑予以包含之黏著劑等。 The energy-curable propylene-based adhesive agent may, for example, be (a) an adhesive comprising an adhesive propylene-based polymer and an energy-curable polymerizable oligomer and/or a polymerizable monomer and a polymerization initiator as required. (b) An adhesive propylene-based polymer (hereinafter referred to as "energy-curable copolymer") which is formed by introducing an energy-hardening functional group having a polymerizable double bond in a side chain, and a polymerization initiator as required Contains adhesives, etc.

在前述(a)之黏著劑,作為黏著性丙烯系聚合物係最好是可以列舉烷基之碳數為1~20之(甲基)丙烯酸烷基酯以及由於要求而使用之將具有活性氫之官能基予以包括之單體和其他單體之共聚物。就該(甲基)丙烯酸酯共聚物而言,正如顯示於構成前述(A)之黏著劑層之丙烯系黏著劑之說明。此外,在使用(甲基)丙烯酸酯系共聚物而作為能量硬化型黏著劑之樹脂成分之狀態下,分子量係最好是以重量平均分子量而成為30萬以上。 In the adhesive of the above (a), the adhesive propylene polymer is preferably an alkyl (meth) acrylate having an alkyl group having 1 to 20 carbon atoms and an active hydrogen which is used as required. The functional group includes a copolymer of a monomer and other monomers. The (meth) acrylate copolymer is as described in the propylene-based adhesive which is shown in the adhesive layer constituting the above (A). In the state in which the (meth) acrylate-based copolymer is used as the resin component of the energy-curing adhesive, the molecular weight is preferably 300,000 or more in terms of a weight average molecular weight.

此外,作為能量硬化型聚合性寡聚物係列舉例如聚酯丙烯酸酯系、環氧丙烯酸酯系、胺基甲酸乙酯丙烯酸酯系、聚醚丙烯酸酯系、聚丁二烯丙烯酸酯系、矽酮丙烯酸酯系等。 Further, examples of the energy curing type polymerizable oligomer include a polyester acrylate type, an epoxy acrylate type, an urethane acrylate type, a polyether acrylate type, a polybutadiene acrylate type, and a ruthenium. Ketone acrylates and the like.

在此,作為聚酯丙烯酸酯系寡聚物係可以藉由以(甲基)丙烯酸,來酯化例如以多元羧酸和多元醇之縮合來得到之兩末端具有羥基之聚酯寡聚物之羥基,或者是藉由以(甲基)丙烯酸,來酯化在多元羧酸加成環氧化物而得到之寡聚物之末端之羥基,來得到聚酯丙烯酸酯系寡聚物。 Here, as the polyester acrylate-based oligomer, a polyester oligo having a hydroxyl group at both terminals can be obtained by esterifying, for example, a condensation of a polyvalent carboxylic acid and a polyhydric alcohol with (meth)acrylic acid. The hydroxyl group is obtained by esterifying a hydroxyl group at the terminal of the oligomer obtained by adding an epoxide to the polyvalent carboxylic acid by (meth)acrylic acid to obtain a polyester acrylate-based oligomer.

環氧丙烯酸酯系寡聚物係可以藉由例如在比較低之分子量之雙酚型環氧樹脂或酚醛型環氧樹脂之環氧乙烷環,反應(甲基)丙烯酸,進行酯化,而得到環氧丙烯酸酯系寡聚物。此外,也可以使用藉由二鹼性羧酸酐而呈部分地變性 該環氧丙烯酸酯系寡聚物之羧基變性型之環氧丙烯酸酯寡聚物。 The epoxy acrylate oligomer can be esterified by reacting (meth)acrylic acid with, for example, a relatively low molecular weight bisphenol type epoxy resin or an oxirane ring of a novolac type epoxy resin. An epoxy acrylate oligomer was obtained. In addition, it is also possible to use partial denaturation by means of a dibasic carboxylic anhydride. A carboxyl-denatured epoxy acrylate oligomer of the epoxy acrylate-based oligomer.

胺基甲酸乙酯丙烯酸酯系寡聚物係可以藉由以(甲基)丙烯酸,來酯化例如以聚醚多元醇或聚酯多元醇和聚異氰酸酯之反應而得到之聚胺基甲酸乙酯寡聚物,來得到胺基甲酸乙酯丙烯酸酯系寡聚物,多元醇丙烯酸酯系寡聚物係可以藉由以(甲基)丙烯酸,來酯化聚醚多元醇之羥基,而得到多元醇丙烯酸酯系寡聚物。 The urethane acrylate oligomer can be obtained by esterifying, for example, a polyether polyol or a polyester polyol with a polyisocyanate by esterification with (meth)acrylic acid. a polymer to obtain a urethane acrylate oligomer, and a polyol acrylate oligomer can obtain a polyol by esterifying a hydroxyl group of a polyether polyol with (meth)acrylic acid Acrylate oligomer.

前述聚合性寡聚物之重量平均分子量係藉由GPC法而測定之標準聚甲基甲基丙烯酸酯之換算值,最好是在500~100,000、更加理想是1,000~70,000、甚至最好是3,000~40,000之範圍而進行選定。 The weight average molecular weight of the polymerizable oligomer is a converted value of a standard polymethyl methacrylate measured by a GPC method, preferably 500 to 100,000, more preferably 1,000 to 70,000, or even preferably 3,000. Selected within the range of ~40,000.

該聚合性寡聚物係可以單獨地使用1種,並且,也可以組合2種以上而使用。 One type of the polymerizable oligomer may be used alone or two or more types may be used in combination.

另一方面,作為能量硬化型聚合性單體係列舉例如環己基(甲基)丙烯酸酯、2-乙基己基(甲基)丙烯酸酯、月桂基(甲基)丙烯酸酯、硬脂醯(甲基)丙烯酸酯、異冰片(甲基)丙烯酸酯等之單官能性丙烯酸酯類、1,4-丁烷二醇二(甲基)丙烯酸酯、1,6-己烷二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、新戊二醇己二酸酯二(甲基)丙烯酸酯、羥基三甲基乙酸新戊二醇二(甲基)丙烯酸酯、二環芬太尼二(甲基)丙烯酸酯、己內酯變性二環戊烯基二(甲基)丙烯酸酯、環氧乙烷變性磷酸二(甲基)丙烯酸酯、烯丙基化環己基二(甲基)丙烯酸酯、 異氰酸酯二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、二季戊四醇三(甲基)丙烯酸酯、丙酸變性二季戊四醇三(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、環氧丙烷變性三羥甲基丙烷三(甲基)丙烯酸酯、三(丙烯醯氧基乙基)異氰酸酯、丙酸變性二季戊四醇五(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、己內酯變性二季戊四醇六(甲基)丙烯酸酯等之多官能性丙烯酸酯類。這些聚合性單體係可以使用1種,並且,也可以組合2種以上而使用。 On the other hand, examples of the energy curing type polymerizable monomer include cyclohexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, lauryl (meth) acrylate, and stearin (A). Monofunctional acrylates such as acrylates and isobornyl (meth)acrylates, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(methyl) Acrylate, neopentyl glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, neopentyl glycol adipate di(meth)acrylate, hydroxytrimethylacetate Pentyl glycol di(meth)acrylate, dicyclohexanyl di(meth)acrylate, caprolactone denaturing dicyclopentenyl di(meth)acrylate, ethylene oxide denaturing phosphate di(a) Acrylate, allylated cyclohexyl di(meth)acrylate, Isocyanate di(meth)acrylate, trimethylolpropane tri(meth)acrylate, dipentaerythritol tri(meth)acrylate, propionic acid denatured dipentaerythritol tri(meth)acrylate, pentaerythritol tris(methyl) Acrylate, propylene oxide-denatured trimethylolpropane tri(meth)acrylate, tris(propyleneoxyethyl)isocyanate, propionic acid-denatured dipentaerythritol penta(meth)acrylate, dipentaerythritol A polyfunctional acrylate such as acrylate or caprolactone denatured dipentaerythritol hexa(meth) acrylate. These polymerizable single-systems may be used alone or in combination of two or more.

此外,作為由於要求而使用之聚合起始劑係在能量硬化型黏著劑為熱硬化型之狀態下,使用有機過氧化物或偶氮基系化合物。作為有機過氧化物係列舉例如二-t-丁基過氧化物、t-博奇枯烯基過氧化物、二枯烯基過氧化物等之二烷基過氧化物類、乙醯基過氧化物、月桂醯過氧化物、苯醯過氧化物等之二醯基過氧化物類、甲基乙基甲酮過氧化物、環己酮過氧化物、3,3,5-三甲基環己酮過氧化物、甲基環己酮過氧化物等之酮過氧化物類、1,1-雙(t-丁基過氧化)環己烷等之過氧化酮縮醇類、t-丁基氫化過氧化物、枯烯氫化過氧化物、1,1,3,3-四甲基丁基氫化過氧化物、p-萜烷氫化過氧化物、二異丙基苯氫化過氧化物、2,5-二甲基己烷-2,5-二氫化過氧化物等之氫化過氧化物類、t-丁基過氧化乙酸酯、t-丁基過氧化-2-乙基己酸酯、t-丁基過氧化苯甲酸酯、t-丁基過氧化異丙基碳酸酯等之過氧化酯類等。 Further, as a polymerization initiator to be used as required, an organic peroxide or an azo-based compound is used in a state where the energy-curing adhesive is a thermosetting type. Examples of the organic peroxide series include dialkyl peroxides such as di-t-butyl peroxide, t-bochi cumyl peroxide, and dicumyl peroxide, and acetaminophen. Oxide-based peroxides such as oxides, lauryl peroxide, benzoquinone peroxide, methyl ethyl ketone peroxide, cyclohexanone peroxide, 3,3,5-trimethyl a ketone peroxide such as cyclohexanone peroxide or methylcyclohexanone peroxide, or a ketone condensate such as 1,1-bis(t-butylperoxy)cyclohexane, t- Butyl hydroperoxide, cumene hydroperoxide, 1,1,3,3-tetramethylbutyl hydroperoxide, p-decane hydroperoxide, diisopropylbenzene hydroperoxide Hydroperoxides such as 2,5-dimethylhexane-2,5-dihydroperoxide, t-butyl peroxyacetate, t-butylperoxy-2-ethylhexyl A peroxy ester such as an acid ester, t-butyl peroxybenzoate or t-butyl peroxy isopropyl carbonate.

此外,作為偶氮基系化合物係列舉2,2-偶氮二(4-甲氧基-2,4-二甲基戊腈)、2,2’-偶氮二(4-環丙基丙 腈)、2,2’-偶氮二(2,4-二甲基戊腈)、偶氮二異丁腈、2,2’-偶氮二(2-甲基丁腈)、1,1’-偶氮二(環己烷-1-腈)、2-(胺基甲醯偶氮基)異丁腈、2-苯基偶氮基-4-甲氧基-2,4-二甲基戊腈等。 Further, as an azo-based compound series, 2,2-azobis(4-methoxy-2,4-dimethylvaleronitrile), 2,2'-azobis(4-cyclopropylpropane) Nitrile), 2,2'-azobis(2,4-dimethylvaleronitrile), azobisisobutyronitrile, 2,2'-azobis(2-methylbutyronitrile), 1,1 '-Azobis(cyclohexane-1-carbonitrile), 2-(aminomethylmercaptoazo)isobutyronitrile, 2-phenylazo-4-methoxy-2,4-dimethyl Kevalonitrile and the like.

這些聚合起始劑係可以單獨地使用1種,並且,也可以組合2種以上而使用。 These polymerization initiators may be used alone or in combination of two or more.

另一方面,在能量硬化型黏著劑為能量射線硬化型之狀態下,作為能量射線係通常照射紫外線或電子線,但是,在照射紫外線之際,作為聚合起始劑係可以使用光聚合起始劑。作為該光聚合起始劑係列舉例如苯偶因、苯偶因甲基醚、苯偶因乙基醚、苯偶因異丙基醚、苯偶因-n-丁基醚、苯偶因異丁基醚、乙醯苯、二甲基胺基乙醯苯、2,2-二甲氧基-2-苯基乙醯苯、2,2-二乙氧基-2-苯基乙醯苯、2-羥基-2-甲基-1-苯基丙烷-1-酮、1-羥基環己基苯基酮、2-甲基-1-[4-(甲基硫代)苯基]-2-嗎啉-丙烷-1-酮、4-(2-羥基乙氧基)苯基-2(羥基-2-靜質量)酮、二苯甲酮、p-苯基二苯甲酮、4,4’-二乙基胺基二苯甲酮、二氯二苯甲酮、2-甲基蒽醌、2-乙基蒽醌、2-叔-丁基蒽醌、2-胺基蒽醌、2-甲基噻噸酮、2-乙基噻噸酮、2-氯噻噸酮、2,4-二甲基噻噸酮、2,4-二乙基噻噸酮、苄基二甲基酮縮醇、乙醯苯二甲基酮縮醇、p-二甲基胺安息香酸酯、低[2-羥基-2-甲基-1-[4-(1-丙烯基)苯基]丙烷]等。這些係可以使用1種,並且,也可以組合2種以上而使用。 On the other hand, in the state where the energy-hardening type adhesive is an energy ray-curable type, ultraviolet rays or electron beams are usually irradiated as an energy ray system, but when ultraviolet rays are irradiated, photopolymerization initiation can be used as a polymerization initiator. Agent. As the photopolymerization initiator series, for example, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin-n-butyl ether, benzoin Butyl ether, acetophenone, dimethylaminoethyl benzene, 2,2-dimethoxy-2-phenyl acetophenone, 2,2-diethoxy-2-phenyl acetophenone , 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1-[4-(methylthio)phenyl]-2 -morpholine-propan-1-one, 4-(2-hydroxyethoxy)phenyl-2(hydroxy-2-static) ketone, benzophenone, p-phenylbenzophenone, 4, 4'-diethylaminobenzophenone, dichlorobenzophenone, 2-methyloxime, 2-ethylhydrazine, 2-tert-butylhydrazine, 2-aminopurine, 2-methylthioxanthone, 2-ethylthioxanthone, 2-chlorothioxanthone, 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, benzyldimethyl Ketoacetal, acetophenone ketal, p-dimethylamine benzoate, low [2-hydroxy-2-methyl-1-[4-(1-propenyl)phenyl]propane ]Wait. These types may be used alone or in combination of two or more.

接著,在前述(b)之黏著劑,作為導入在側鏈來 具有聚合性雙鍵之能量硬化型官能基而組成之黏著性丙烯系聚合物係可以列舉例如在前述(a)之黏著劑來說明之黏著性丙烯系聚合物之聚合物鏈,導入-COOH、-NCO、環氧基、-OH、-NH2等之活性點,反應具有該活性點和聚合性雙鍵之化合物,導入在該黏著性丙烯系聚合物之側鏈來具有聚合性雙鍵之能量硬化型官能基而組成者。 Next, the adhesive agent of the above (b) is an adhesive propylene-based polymer which is formed by introducing an energy-hardening functional group having a polymerizable double bond in a side chain, and examples thereof include the adhesive of the above (a). The polymer chain of the adhesive propylene-based polymer is introduced, and an active point of -COOH, -NCO, epoxy group, -OH, -NH 2 or the like is introduced, and a compound having the active point and the polymerizable double bond is reacted and introduced into The side chain of the adhesive propylene-based polymer is composed of an energy-hardening functional group having a polymerizable double bond.

為了在黏著性丙烯系聚合物,導入前述活性點,因此,可以在製造該黏著性丙烯系聚合物之際,使得具有-COOH、-NCO、環氧基、-OH、-NH2等之官能基和聚合性雙鍵之單體或寡聚物,共存於反應系。 In order to introduce the above-mentioned active point into the adhesive propylene-based polymer, it is possible to have a function of -COOH, -NCO, epoxy group, -OH, -NH 2 or the like at the time of producing the adhesive propylene polymer. The monomer or oligomer of the group and the polymerizable double bond coexist in the reaction system.

具體地說,可以在製造於前述(a)之黏著劑來說明之黏著性丙烯系聚合物之際,在導入-COOH基之狀態下,使用(甲基)丙烯酸等,在導入-NCO基之狀態下,使用(甲基)丙烯醯氧基乙基異氰酸酯等,在導入環氧基之狀態下,使用環氧丙基(甲基)丙烯酸酯等,在導入-OH基之狀態下,使用2-羥基乙基(甲基)丙烯酸酯、1,6-己烷二醇單(甲基)丙烯酸酯等,在導入-NH2基之狀態下,使用N-甲基(甲基)丙烯醯胺等。 Specifically, in the case where the adhesive propylene-based polymer described in the above (a) is used as an adhesive, a (meth)acrylic acid or the like can be used in a state in which a -COOH group is introduced, and a -NCO group can be introduced. In the state where (meth)acryloxyethyl isocyanate or the like is used, a glycidyl (meth)acrylate or the like is used in a state in which an epoxy group is introduced, and in a state in which an -OH group is introduced, 2 is used. - hydroxyethyl (meth) acrylate, 1,6-hexane diol mono (meth) acrylate, etc., in the state of introducing -NH 2 group, using N-methyl (meth) acrylamide Wait.

作為具有反應於這些活性點之聚合性雙鍵之化合物係可以由例如(甲基)丙烯醯氧基乙基異氰酸酯、環氧丙基(甲基)丙烯酸酯、季戊四醇單(甲基)丙烯酸酯、二季戊四醇單(甲基)丙烯酸酯、三羥甲基丙烷單(甲基)丙烯酸酯等之中,配合活性點之種類而適度地選擇及使用。 The compound having a polymerizable double bond which reacts with these active sites may be, for example, (meth)acryloxyethyl isocyanate, epoxypropyl (meth)acrylate, pentaerythritol mono(meth)acrylate, Among the dipentaerythritol mono(meth)acrylate and trimethylolpropane mono(meth)acrylate, etc., it is appropriately selected and used in accordance with the type of the active site.

像這樣,得到在黏著性丙烯系聚合物之側鏈透過 前述活性點而導入具有聚合性雙鍵之能量硬化型官能基來組成之黏著性丙烯系聚合物。 In this way, the side chain of the adhesive propylene polymer is obtained. An adhesive propylene-based polymer composed of an energy-curable functional group having a polymerizable double bond is introduced as the active site.

此外,作為由於要求而使用之聚合起始劑係可以在該能量硬化型黏著劑為熱硬化型之狀態下,使用在前述(a)之黏著劑之說明來例舉之有機過氧化物或偶氮基系化合物。另一方面,可以在該能量硬化型黏著劑為能量射線硬化型且使用紫外線來作為能量射線之狀態下,使用在前述(a)之黏著劑之說明來例舉之光聚合起始劑。 Further, as a polymerization initiator to be used as required, an organic peroxide or an exemplified in the above description of the adhesive of (a) may be used in a state in which the energy-hardening adhesive is a thermosetting type. A nitrogen based compound. On the other hand, in the state in which the energy-hardening type adhesive is an energy ray-curable type and ultraviolet rays are used as an energy ray, the photopolymerization initiator which is exemplified in the above-mentioned (a) adhesive can be used.

可以在構成黏著劑層之黏著劑,在無損害本發明效果之範圍內,由於要求而添加交聯劑、黏著賦予劑、氧化防止劑、紫外線吸收劑、光安定劑、軟化劑、填充劑等。 The crosslinking agent, the adhesion-imparting agent, the oxidation inhibitor, the ultraviolet absorber, the light stabilizer, the softener, the filler, etc. may be added to the adhesive constituting the adhesive layer without impairing the effects of the present invention. .

作為前述交聯劑係列舉例如聚異氰酸酯化合物、環氧樹脂、三聚氰胺樹脂、尿素樹脂、二醛類、羥甲基聚合物、氮雜環丙烷系化合物、金屬螯合化合物、金屬醇鹽、金屬鹽等,但是,最好是使用不容易發生起因於黏著劑層之變色(黃變)之光透過率之變化之金屬螯合化合物。 Examples of the crosslinking agent include a polyisocyanate compound, an epoxy resin, a melamine resin, a urea resin, a dialdehyde, a methylol polymer, an aziridine compound, a metal chelate compound, a metal alkoxide, and a metal salt. Etc. However, it is preferable to use a metal chelate compound which does not easily cause a change in light transmittance due to discoloration (yellowing) of the adhesive layer.

在此,作為聚異氰酸酯化合物之例子係可以列舉甲代苯撐二異氰酸酯、二苯基甲烷二異氰酸酯、苯撐二甲基二異氰酸酯等之芳香族聚異氰酸酯、六亞甲基二異氰酸酯等之脂肪族聚異氰酸酯、異佛爾酮二異氰酸酯、加氫二苯基甲烷二異氰酸酯等之脂環式聚異氰酸酯等、以及這些之縮二脲體、異氰酸酯體、甚至成為和乙二醇、丙二醇、新戊二醇、三羥甲基丙烷、萞麻油等之含低分子活性氫化合物之反應物之加合體等。此外,作為金屬螯合化合物係可以列舉鋁螯合化合物等。這些 交聯劑係可以單獨地使用1種,並且,也可以組合2種以上而使用。在含有交聯劑之狀態下,為了促進其交聯反應之進行,因此,可以含有由有機金屬化合物等而組成之促進劑。 Here, examples of the polyisocyanate compound include aliphatic polyisocyanates such as phenylene diisocyanate, diphenylmethane diisocyanate, and phenylene diisocyanate, and aliphatic groups such as hexamethylene diisocyanate. An alicyclic polyisocyanate such as polyisocyanate, isophorone diisocyanate or hydrogenated diphenylmethane diisocyanate, and these biuret, isocyanate, or even ethylene glycol, propylene glycol, and neopentyl An adduct of a reactant containing a low molecular weight active hydrogen compound such as an alcohol, trimethylolpropane or castor oil. Further, examples of the metal chelate compound include an aluminum chelate compound and the like. These ones One type of the crosslinking agent may be used alone or two or more types may be used in combination. In the state containing a crosslinking agent, in order to accelerate the progress of the crosslinking reaction, an accelerator composed of an organometallic compound or the like may be contained.

黏著劑層之厚度係並無特別限制,但是,通常為1~30μm程度、最好是2~20μm。如果是此種厚度的話,則和光記錄層之接合狀態係變得良好。 The thickness of the adhesive layer is not particularly limited, but is usually from 1 to 30 μm, preferably from 2 to 20 μm. If it is such a thickness, the state of bonding with the optical recording layer becomes good.

(2)光記錄層 (2) Optical recording layer

就構成本發明之單位層積體來包括之光記錄層之材料而言,如果是可以包含感光材料(光反應性成分)的話,則並無特別限制,作為習知之光記錄媒體之光記錄層之構成材料係可以由知道之材料中,適度地選擇任意者而進行使用。作為此種材料係可以列舉例如單獨地製膜感光材料者或是在構成基體之材料來包含感光材料者。 The material constituting the optical recording layer to be included in the unit laminate of the present invention is not particularly limited as long as it can contain a photosensitive material (photoreactive component), and is an optical recording layer of a conventional optical recording medium. The constituent materials can be used by appropriately selecting any of the known materials. Examples of such a material include those obtained by separately forming a photosensitive material or materials constituting a substrate to contain a photosensitive material.

前述構成基體之材料係可以是無機材料,也可以是有機材料,但是,由該單位層積體之製造簡便性或材料之選擇種類之多寡等之方面來看的話,則最好是有機系之高分子材料。該高分子材料係可以是均聚物,也可以是共聚物,就其單體之種類、分子量、聚合形態等而言,並無特別限制。 The material constituting the substrate may be an inorganic material or an organic material. However, from the viewpoint of the ease of manufacture of the unit laminate or the type of material selected, it is preferably organic. Polymer Materials. The polymer material may be a homopolymer or a copolymer, and is not particularly limited in terms of the type, molecular weight, polymerization form, and the like of the monomer.

作為前述高分子材料之具體例係列舉各種之聚乙烯、乙烯/1-丁烯共聚物、乙烯/4-甲基-1-戊烯共聚物、乙烯/1-己烯共聚物、聚丙烯、乙烯/丙烯共聚物、丙烯/1-丁烯共聚物、聚1-丁烯、1-丁烯/4-甲基-1-戊烯共聚物、聚4-甲基-1-戊烯、聚3-甲基-1-丁烯、乙烯/環狀烯烴共聚物、環狀烯烴系樹脂等之聚烯烴類、乙烯/乙酸乙 烯共聚物、乙烯/丙烯酸共聚物或其金屬鹽、聚甲基甲基丙烯酸酯、脂環式丙烯樹脂等之聚(甲基)丙烯酸酯、聚乙烯對苯二甲酸酯、聚乙烯萘二甲酸酯等之聚酯系樹脂、聚全氟乙烯、全氟鏈烯基乙烯基醚聚合物等之氟系樹脂、聚苯乙烯、聚乙烯醇、聚碳酸酯、聚苯撐硫化物、聚醚碸、聚醯亞胺、聚苯撐氧化物、烯烴/N-取代馬來酸酐縮亞胺共聚物、烯丙基碳酸酯樹脂、環氧丙烯酸酯樹脂、胺基甲酸乙酯丙烯酸酯樹脂等。這些高分子材料係可以單獨地使用1種,並且,也可以組合2種以上而使用。 Specific examples of the polymer material include various polyethylenes, ethylene/1-butene copolymers, ethylene/4-methyl-1-pentene copolymers, ethylene/1-hexene copolymers, and polypropylene. Ethylene/propylene copolymer, propylene/1-butene copolymer, poly-1-butene, 1-butene/4-methyl-1-pentene copolymer, poly 4-methyl-1-pentene, poly Polyolefins such as 3-methyl-1-butene, ethylene/cyclic olefin copolymer, and cyclic olefin resin, ethylene/acetic acid B Poly(meth)acrylate, polyethylene terephthalate, polyethylene naphthalene, etc. of an olefin copolymer, an ethylene/acrylic acid copolymer or a metal salt thereof, a polymethyl methacrylate, an alicyclic propylene resin, or the like A polyester resin such as a formate or a fluorine-based resin such as a polyperfluoroethylene or a perfluoroalkenyl vinyl ether polymer, polystyrene, polyvinyl alcohol, polycarbonate, polyphenylene sulfide, or poly Ether oxime, polyimide, polyphenylene oxide, olefin/N-substituted maleic anhydride imide copolymer, allyl carbonate resin, epoxy acrylate resin, urethane acrylate resin, etc. . These polymer materials may be used alone or in combination of two or more.

另一方面,感光材料係可以對於前述基體,進行化學鍵結而成為主鏈或側鏈成分,並且,也可以僅分散或溶解於基體中。作為該感光材料係並無特別限制,但是,最好是使用多光子吸收性材料。 On the other hand, the photosensitive material may be chemically bonded to the above-mentioned substrate to form a main chain or a side chain component, or may be dispersed or dissolved only in the matrix. The photosensitive material system is not particularly limited, but a multiphoton absorption material is preferably used.

所謂多光子吸收性材料係表示具有同時吸收2個以上之光子而遷移至激發狀態之性質之化合物。即使是在其中,也由所謂呈實用地得到充分之記錄感度之觀點來看的話,則最好是包含2光子吸收剖面積為0.1GM以上之2光子吸收性材料,更加理想是特別包含100GM以上之2光子吸收性材料。作為此種材料係可以是例如單獨地構成多光子吸收性材料者或是例如藉由多光子吸收性材料和以來自激發之多光子吸收性材料之能量移動而引起變化之其他之反應性化合物來構成者、藉由配合需要而將這些練合於基體之材料來構成。 The multiphoton absorptive material is a compound having a property of simultaneously absorbing two or more photons and migrating to an excited state. In addition, it is preferable to include a photon absorption material having a 2-photon absorption cross-sectional area of 0.1 GM or more, and more preferably 100 GM or more, from the viewpoint of obtaining a sufficient recording sensitivity in practical use. 2 photon absorbing materials. Such a material may be, for example, a single photon absorbing material alone or a reactive compound such as a multiphoton absorbing material and a change in energy from the excited multiphoton absorbing material. The constructor is configured by combining the materials of the base body by the need of cooperation.

此外,前述「GM」係表示10-50cm4.smolecule-1.photon-1。前述構成基體之材料係可以是 無機材料,也可以是有機材料,但是,由單位層積體之製造簡便性或材料之選擇種類之多寡等之方面來看的話,則最好是有機系之高分子材料。該高分子材料係可以是均聚物,也可以是共聚物,就其單體之種類、分子量、聚合形態等而言,並無特別限制,列舉例如聚甲基甲基丙烯酸酯等。 In addition, the aforementioned "GM" system means 10 - 50 cm 4. s . Molecule -1. Photon -1 . The material constituting the substrate may be an inorganic material or an organic material. However, it is preferably an organic system because of the ease of manufacture of the unit laminate or the type of material selected. Molecular material. The polymer material may be a homopolymer or a copolymer, and the type, molecular weight, polymerization form, and the like of the monomer are not particularly limited, and examples thereof include polymethyl methacrylate.

前述多光子吸收性材料係可以對於前述基體,進行化學鍵結而成為主鏈或側鏈成分,並且,也可以僅分散或溶解於基體中。作為該多光子吸收性材料係並無特別限制,可以使用各種之化合物。列舉例如菁化合物、苯乙烯基化合物、吡喃鎓化合物、噻吡喃鎓化合物、份菁化合物、烯丙叉化合物、氧醇化合物、方酸菁化合物、菁化合物、香豆素化合物、吡喃化合物、醌化合物、蒽醌化合物、三苯基甲烷化合物、二苯基甲烷化合物、呫噸化合物、噻噸化合物、吩噻嗪化合物、偶氮基化合物、甲亞胺化合物、芴酮化合物、二芳基乙烯化合物、螺吡喃化合物、俘精酸酐化合物、二萘嵌苯化合物、多烯化合物、二苯基胺化合物、喹吖酮化合物、菁化合物、卜啉化合物、酞菁化合物、苯乙烯系化合物、苯撐乙烯撐化合物、三苯基胺系化合物、咔唑系化合物等之化合物。 The multiphoton absorbing material may be chemically bonded to the substrate to form a main chain or a side chain component, or may be dispersed or dissolved only in the matrix. The multiphoton absorptive material is not particularly limited, and various compounds can be used. For example, a cyanine compound, a styryl compound, a pyrylium compound, a thiopyranium compound, a phthalocyanine compound, an allyl compound, an oxy alcohol compound, a squaraine compound, a cyanine compound, a coumarin compound, a pyran compound, etc. , hydrazine compound, hydrazine compound, triphenylmethane compound, diphenylmethane compound, xanthene compound, thioxanthene compound, phenothiazine compound, azo compound, methylimine compound, anthrone compound, diaryl a vinyl compound, a spiropyran compound, a fulgide compound, a perylene compound, a polyene compound, a diphenylamine compound, a quinophthalone compound, a cyanine compound, a porphyrin compound, a phthalocyanine compound, a styrene compound, A compound such as a phenylene ethylene compound, a triphenylamine compound or an oxazole compound.

作為使用此種多光子吸收性化合物而記錄之方式係列舉例如使用正如含有偶氮基或C=C基、C=N基之化合物而藉由光呈異性化之材料、或者是正如(甲基)丙烯酸酯化合物而藉由光來引起聚合反應之材料、正如有機光色材料而藉由光來引起可逆之構造變化之材料、藉由光來引起電荷分布之有機折射材料等,而讀取折射率之調制之方式;使用藉由光來 改變螢光特性之材料,讀取螢光之方式;組合藉由光來產生酸之材料和酸發色性化合物或者是組合消色劑和消色性化合物,讀取吸收率之調制或折射率之調制之方式等。在這些記錄方式,多光子吸收性化合物本身係可以具有此種之光反應性,並且,也可以由藉著多光子之吸收而激發之多光子吸收性化合物,藉著能量移動至其他之反應性化合物之移動而引起反應。 As a series of recordings using such a multiphoton absorbing compound, for example, a material which is anisotropically light-like by using a compound containing an azo group or a C=C group or a C=N group, or just as (methyl) An acrylate compound, a material that causes polymerization by light, a material that causes reversible structural changes by light, such as an organic photochromic material, an organic refractive material that causes charge distribution by light, and the like, and read refraction Way of modulation; use by light a material that changes the fluorescence characteristics, a method of reading fluorescence; a combination of a material that generates an acid by light and an acid chromogenic compound or a combination of a decolorizer and a decolorizing compound, and a read modulation or refractive index The method of modulation, etc. In these recording modes, the multiphoton absorbing compound itself may have such photoreactivity, and may also be moved to other reactivity by energy by a multiphoton absorbing compound excited by absorption of multiphotons. The movement of the compound causes a reaction.

光記錄層之厚度係只要是可以發揮光記錄機能的話,則並無特別限定。通常為1~5000nm程度、最好是10~4000nm。 The thickness of the optical recording layer is not particularly limited as long as it can exhibit an optical recording function. It is usually from 1 to 5000 nm, preferably from 10 to 4000 nm.

本實施形態之單位層積體係可以配合需要而包括:用以補強該單位層積體之層、為了在多層光記錄媒體之內部來設置位置資訊而在表面具有凹凸來作為記錄坑孔及/或溝槽之位置資訊賦予層、以及光導波層、反射層、介電質層等之黏著劑層和光記錄層以外之層。在本實施形態,將像這樣之黏著劑層和光記錄層以外之層,總稱為「其他層」。 The unit laminated system of the present embodiment may include, as needed, a layer for reinforcing the unit laminate, and for providing positional information in the interior of the multilayer optical recording medium, having irregularities on the surface as recording pits and/or The position information imparting layer of the groove, and the adhesive layer such as the optical waveguide layer, the reflective layer, and the dielectric layer, and the layer other than the optical recording layer. In the present embodiment, layers other than the adhesive layer and the optical recording layer are collectively referred to as "other layers".

(3)硬質層 (3) Hard layer

在本實施形態,所謂「硬質層」係表示構成該硬質層之材料之玻璃轉移溫度Tg為25℃以上。由更加安定地保護光記錄層之觀點來看的話,則玻璃轉移溫度Tg係最好是30℃以上、更加理想是35℃以上。 In the present embodiment, the "hard layer" means that the glass transition temperature Tg of the material constituting the hard layer is 25 ° C or higher. From the viewpoint of more securely protecting the optical recording layer, the glass transition temperature Tg is preferably 30 ° C or higher, more preferably 35 ° C or higher.

硬質層之玻璃轉移溫度Tg之上限係並無特別限定,但是,由於組成而使得在製造過程之收縮程度也變大,因此,玻璃轉移溫度Tg係最好是400℃以下、更加理想是350℃以下。此外,硬質層係最好是儲存彈性率為107Pa以上、更 加理想是108Pa以上。此外,硬質層係最好是儲存彈性率為1012Pa以下、更加理想是1011Pa以下。 The upper limit of the glass transition temperature Tg of the hard layer is not particularly limited. However, since the degree of shrinkage in the production process is also large due to the composition, the glass transition temperature Tg is preferably 400 ° C or lower, more preferably 350 ° C. the following. Further, the hard layer system preferably has a storage modulus of 10 7 Pa or more, more preferably 10 8 Pa or more. Further, the hard layer system preferably has a storage modulus of 10 12 Pa or less, more preferably 10 11 Pa or less.

構成硬質層之材料係並無特別限定。在以下,將成為黏著劑層和光記錄層以外之層狀體(其他層)且由於單位層積體之補強目的而設置之硬質層,也稱為「支持層」。 The material constituting the hard layer is not particularly limited. Hereinafter, a hard layer which is a layered body (other layer) other than the adhesive layer and the optical recording layer and which is provided for the purpose of reinforcing the unit laminated body is also referred to as a "support layer".

作為由不同於構成黏著劑層之材料之不同材料而構成之硬質層係例舉由樹脂薄膜而組成者。作為賦予此種硬質層之樹脂係例舉聚氯乙烯(Tg:87℃)、聚苯乙烯(Tg:100℃)、聚醯胺6(Tg:50℃)、聚碳酸酯(Tg:150℃)、聚苯撐硫醚(Tg:126℃)、聚醚碸(Tg:230℃)、聚醯胺醯亞胺(Tg:275℃)、聚乳酸(Tg:57℃)、聚四氟乙烯(Tg:126℃)、聚氟化乙烯叉(Tg:35℃)、聚丁烯對苯二甲酸酯(Tg:50℃)、聚乙烯對苯二甲酸酯(Tg:69℃)、聚甲基甲基丙烯酸酯(Tg:100℃)、聚碸(Tg:180℃)、聚芳基化物(Tg:190℃)等。此外,硬質層係可以由習知之能量射線硬化型共聚物等之材料而形成。此外,包含像這樣材料之硬質層係也有成為後面敘述之覆蓋層之一種構成要素之狀態發生。 The hard layer which is composed of a different material different from the material constituting the adhesive layer is exemplified by a resin film. Examples of the resin to be imparted to the hard layer include polyvinyl chloride (Tg: 87 ° C), polystyrene (Tg: 100 ° C), polyamine 6 (Tg: 50 ° C), and polycarbonate (Tg: 150 ° C). ), polyphenylene sulfide (Tg: 126 ° C), polyether oxime (Tg: 230 ° C), polyamidoximine (Tg: 275 ° C), polylactic acid (Tg: 57 ° C), polytetrafluoroethylene (Tg: 126 ° C), polyvinyl fluoride fork (Tg: 35 ° C), polybutylene terephthalate (Tg: 50 ° C), polyethylene terephthalate (Tg: 69 ° C), Polymethyl methacrylate (Tg: 100 ° C), polyfluorene (Tg: 180 ° C), polyarylate (Tg: 190 ° C), and the like. Further, the hard layer may be formed of a material such as a conventional energy ray-curable copolymer. Further, a hard layer system containing such a material may also be in a state of being a constituent element of a coating layer described later.

單位層積體之黏著劑層及光記錄層、以及配合需要而設置之其他層之各個之配置關係也成為任意。層積黏著劑層和光記錄層而組成之單位層積體係在單位層積體之中,成為最單純之構造。在單位層積體來包括其他層之狀態下,其他層係可以層積於黏著劑層和光記錄層之間,並且,也可以層積在相反於光記錄層對向於黏著劑層之側之相反側之面。可以在單位層積體,層積複數個之其他層。單位層積體係最好是黏著劑 層來位處於至少一邊之最外層。 The arrangement relationship between the adhesive layer of the unit laminate and the optical recording layer, and other layers provided for the purpose of blending is also arbitrary. The unit laminated system composed of the laminated adhesive layer and the optical recording layer is the simplest structure among the unit laminated bodies. In the state where the unit laminate includes other layers, other layers may be laminated between the adhesive layer and the optical recording layer, and may be laminated on the side opposite to the adhesive layer opposite to the optical recording layer. The opposite side. It is possible to laminate a plurality of other layers in a unit layer. The unit stratification system is preferably an adhesive The layer is in the outermost layer on at least one side.

如果是顯示單位層積體可以得到之構造之具體例的話,則列舉以下之構造。 If it is a specific example which shows the structure which can be obtained by a unit laminated body, the following structures are mentioned.

按照記錄層、黏著劑層之順序而配置之單位層積體 . Unit layer body arranged in the order of the recording layer and the adhesive layer

按照黏著劑層、記錄層、黏著劑層之順序而配置之單位層積體 . Unit laminate according to the order of the adhesive layer, the recording layer, and the adhesive layer

按照記錄層、其他層、黏著劑層之順序而配置之單位層積體 . Unit layer body arranged in the order of recording layer, other layer, and adhesive layer

按照其他層、記錄層、黏著劑層之順序而配置之單位層積體 . Unit layer body arranged in the order of other layers, recording layers, and adhesive layers

按照黏著劑層、記錄層、其他層、黏著劑層之順序而配置之單位層積體 . Unit laminate according to the order of the adhesive layer, the recording layer, the other layer, and the adhesive layer

按照黏著劑層、其他層、記錄層、黏著劑層之順序而配置之單位層積體 . Unit laminate according to the order of the adhesive layer, other layers, recording layer, and adhesive layer

此外,如果是顯示單位層積體來包括支持層而作為其他層之狀態下之具體例的話,則列舉以下之構造。 In addition, in the case of a specific example in a state in which the unit layer is displayed to include the support layer and the other layer is used, the following structures are listed.

按照支持層、記錄層、支持層、黏著劑層之順序而配置之單位層積體 . Unit stratified body arranged in the order of support layer, recording layer, support layer, and adhesive layer

按照記錄層、支持層、記錄層、黏著劑層之順序而配置之單位層積體 . Unit layer body arranged in the order of the recording layer, the support layer, the recording layer, and the adhesive layer

按照記錄層、支持層、黏著劑層、記錄層、黏著劑層之順序而配置之單位層積體 . Unit layer body arranged in the order of the recording layer, the support layer, the adhesive layer, the recording layer, and the adhesive layer

按照記錄層、支持層、黏著劑層之順序而配置之單位層積體 . Unit layer body arranged in the order of the recording layer, the support layer, and the adhesive layer

按照支持層、記錄層、黏著劑層之順序而配置之單位層積體 . Unit layer body arranged in the order of support layer, recording layer, and adhesive layer

按照支持層、記錄層、支持層、記錄層、黏著劑層之順序而配置之單位層積體 . Unit layer body arranged in the order of support layer, recording layer, support layer, recording layer, and adhesive layer

按照黏著劑層、支持層、記錄層、支持層、黏著劑層之順序而配置之單位層積體 . Unit laminate according to the order of the adhesive layer, the support layer, the recording layer, the support layer, and the adhesive layer

按照黏著劑層、記錄層、支持層、記錄層、黏著劑層之順序而配置之單位層積體 . Unit layer body arranged in the order of the adhesive layer, the recording layer, the support layer, the recording layer, and the adhesive layer

按照黏著劑層、記錄層、支持層、黏著劑層、記錄層、黏著劑層之順序而配置之單位層積體 . Unit laminate according to the order of the adhesive layer, the recording layer, the support layer, the adhesive layer, the recording layer, and the adhesive layer

按照黏著劑層、記錄層、支持層、黏著劑層之順序而配置之單位層積體 . Unit laminate according to the order of the adhesive layer, the recording layer, the support layer, and the adhesive layer

按照黏著劑層、支持層、記錄層、支持層、記錄層、黏著劑層之順序而配置之單位層積體 . Unit layer body arranged in the order of the adhesive layer, the support layer, the recording layer, the support layer, the recording layer, and the adhesive layer

(4)剝離用材料 (4) Stripping materials

可以在單位層積體,直到使用時(貼附製程)為止,不限於黏著劑層側之面,可以設置剝離用材料,來作為用以保護記錄層等之表面之構件或者是作為用以製膜黏著劑層、記錄層等之各個層之載體。剝離用材料係只要是具有剝離性的話,則可以使用任意且具有此種剝離性之各種之合成樹脂薄膜,來作為剝離用材料。可以具體地列舉聚乙烯對苯二甲酸酯、聚丁烯對苯二甲酸酯、聚乙烯萘二甲酸酯等之聚酯薄膜、聚乙烯薄膜、聚丙烯薄膜、聚氯乙烯薄膜、聚偏氯乙烯薄膜、聚乙烯醇薄膜、乙烯-乙酸乙烯共聚物薄膜、聚苯乙烯薄膜、聚碳酸酯薄膜、聚甲基戊烯薄膜、聚碸薄膜、聚醚醚酮薄膜、聚醚碸薄膜、聚苯撐硫醚薄膜、聚醚醯亞胺薄膜、聚醯亞胺薄膜、氟樹脂薄膜、聚醯胺薄膜、丙烯樹脂薄膜、原菠烷系樹脂薄膜、環烯烴樹脂薄膜、乙酸纖維素樹脂等。剝離用材料之厚 度係並無特別限定,但是,通常為5~500μm、最好是10~200μm。 It is possible to provide a material for peeling off from the unit layer laminate to the surface on the side of the adhesive layer, and to provide a material for peeling off as a member for protecting the surface of the recording layer or the like. A carrier of each layer of a film adhesive layer, a recording layer, or the like. As long as the material for peeling is exfoliating, various synthetic resin films which have such releasability can be used as a material for peeling. Specific examples thereof include a polyester film of polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, a polyethylene film, a polypropylene film, a polyvinyl chloride film, and a poly a vinylidene chloride film, a polyvinyl alcohol film, an ethylene-vinyl acetate copolymer film, a polystyrene film, a polycarbonate film, a polymethylpentene film, a polyfluorene film, a polyetheretherketone film, a polyether film, Polyphenylene sulfide film, polyether quinone film, polyimine film, fluororesin film, polyamide film, acryl resin film, raw spinel resin film, cycloolefin resin film, cellulose acetate resin, etc. . Thickness of stripping material The degree system is not particularly limited, but is usually 5 to 500 μm, preferably 10 to 200 μm.

此外,剝離用材料係可以對於剝離用材料之基材,在相當於剝離用材料之剝離面側之側之面,進行剝離處理而得到剝離用材料。作為該狀態下之基材係例舉前述樹脂薄膜,並且,也例舉由優質紙等之紙系材料而組成者。作為剝離處理係列舉矽酮系剝離劑、聚丁二烯系剝離劑、氟樹脂系剝離劑、醇酸系剝離劑等之習知之剝離劑來塗佈於基材之至少一邊之面之方法。塗佈剝離劑而得到之剝離劑層之厚度係並無特別限定,可以由於要求而進行設定,但是,通常為0.05~50μm。此外,為了在塗佈剝離劑之前之基材之被處理面,提高和剝離劑層之密合性,因此,可以施行例如電暈放電處理、電漿放電處理、鉻酸處理、火焰處理、熱風處理、臭氧紫外線照射處理等。 In addition, the peeling material can be peeled off on the surface of the base material of the peeling material on the side corresponding to the peeling surface side of the peeling material, and the peeling material can be obtained. The resin film is exemplified as the substrate in this state, and is also composed of a paper-based material such as high-quality paper. The release treatment series is a method in which a conventional release agent such as an anthrone-based release agent, a polybutadiene-based release agent, a fluororesin-based release agent, or an alkyd-based release agent is applied to at least one side of a substrate. The thickness of the release agent layer obtained by applying the release agent is not particularly limited, and may be set as required, but is usually 0.05 to 50 μm. Further, in order to improve the adhesion to the surface of the substrate before the application of the release agent, for example, corona discharge treatment, plasma discharge treatment, chromic acid treatment, flame treatment, hot air can be performed. Treatment, ozone . UV irradiation treatment, etc.

剝離用材料之剝離力係最好是10~700mN/25mm。在剝離力位處於該範圍之時,在單位層積體,無造成過度之變形,可以露出其黏著劑層側之面,由提高作業性之觀點來看的話,則變得理想。更加理想之剝離力係30~500mN/25mm。 The peeling force of the material for peeling is preferably 10 to 700 mN/25 mm. When the peeling force is in this range, the unit laminated body is not excessively deformed, and the surface on the side of the adhesive layer can be exposed, which is preferable from the viewpoint of improving workability. The more ideal peeling force is 30~500mN/25mm.

此外,由單位層積體之光記錄層及各黏著劑層之厚度精度、以及處理性等之方面來看的話,則最好是以其兩面貼附於前述剝離用材料之狀態,來製造單位層積體,在使用時,適度地剝離這些剝離用材料。 In addition, in view of the thickness accuracy of the optical recording layer and the adhesive layer of the unit laminate, and the handleability, etc., it is preferable to manufacture the unit in a state in which both surfaces are attached to the peeling material. The laminate is appropriately peeled off from these peeling materials at the time of use.

此外,最好是在該剝離用材料之剝離面,無存在填充劑。 Further, it is preferable that the filler is not present on the peeling surface of the peeling material.

(5)單位層積體之製造方法 (5) Manufacturing method of unit laminate

單位層積體之製造方法係並無特別限定。可以適度地層積來構成單位層積體之各層。各層之層積方法係也無特別限定,可以藉由所謂濕式製程來形成,並且,也可以藉由所謂乾式製程來形成。 The manufacturing method of the unit laminate is not particularly limited. The layers of the unit laminate can be formed by lamination in a moderate manner. The layering method of each layer is also not particularly limited, and it can be formed by a so-called wet process, or can be formed by a so-called dry process.

在以下,作為包括單位層積體之層積體之製造方法之一例係說明圖1所示之單位層積體11之製造方法。 Hereinafter, a method of manufacturing the unit laminate 11 shown in Fig. 1 will be described as an example of a method of manufacturing a laminate including a unit laminate.

圖1所示之單位層積體11係由1層之光記錄層1和1層之黏著劑層2而組成之層積體,在該單位層積體11兩者之面,設置第1剝離用材料3和第2剝離用材料4。 The unit laminated body 11 shown in Fig. 1 is a laminated body composed of one layer of the optical recording layer 1 and one layer of the adhesive layer 2, and the first peeling is provided on the surface of both the unit laminated bodies 11 The material 3 and the second peeling material 4 were used.

作為製造單位層積體11之方法係並無特別限制,但是,作為製造圖1所示之層構造之單位層積體11之方法之具體例係可以使用例如以下顯示之方法。 The method for producing the unit laminate 11 is not particularly limited. However, as a specific example of the method for producing the unit laminate 11 of the layer structure shown in Fig. 1, for example, the method shown below can be used.

首先,在第1剝離用材料3之剝離面上,藉由習知之塗佈手段、例如刮刀塗佈法、壓輥塗佈法、桿條塗佈法、刮板塗佈法、模塗佈法、照相凹版印刷塗佈法等,而塗佈以適當之濃度來包含光記錄層形成用材料之塗佈液,使得乾燥塗膜之厚度成為規定之厚度,進行乾燥,形成光記錄層1,製作由光記錄層1和第1剝離用材料3而組成之第1層積體。 First, on the peeling surface of the first peeling material 3, a conventional coating means, for example, a doctor blade method, a roll coating method, a bar coating method, a blade coating method, or a die coating method a gravure coating method or the like, and coating a coating liquid containing a material for forming an optical recording layer at an appropriate concentration so that the thickness of the dried coating film has a predetermined thickness, and drying to form the optical recording layer 1 A first layered body composed of the optical recording layer 1 and the first peeling material 3.

另一方面,在第2剝離用材料4之剝離面上,藉由習知之方法、例如刮刀塗佈法、壓輥塗佈法、桿條塗佈法、刮板塗佈法、模塗佈法、照相凹版印刷塗佈法等,而塗佈用以形成黏著劑層2之塗佈液(溶媒係藉由黏著劑層之成分而適度地設定。),使得乾燥塗膜之厚度成為規定之厚度,進行乾燥, 製作由黏著劑層2和第2剝離用材料4而組成之第2層積體。 On the other hand, on the peeling surface of the second peeling material 4, a conventional method, for example, a doctor blade method, a roll coating method, a bar coating method, a blade coating method, or a die coating method a gravure coating method or the like, and coating a coating liquid for forming the adhesive layer 2 (the solvent is appropriately set by the composition of the adhesive layer), so that the thickness of the dried coating film becomes a prescribed thickness. , drying, A second laminate composed of the adhesive layer 2 and the second peeling material 4 was produced.

接著,藉由貼合第2層積體之黏著劑層2側之面和第1層積體之光記錄層1側之面,以橡膠壓輥等,來壓合得到之第1層積體和第2層積體之層積體,而得到設置剝離用材料3和剝離用材料4之圖1所示之構造之單位層積體11。 Then, the first laminate is obtained by laminating the surface of the second laminate on the side of the adhesive layer 2 and the surface of the first laminate on the side of the optical recording layer 1 by a rubber press or the like. With the laminate of the second laminate, the unit laminate 11 having the structure shown in Fig. 1 in which the release material 3 and the release material 4 are provided is obtained.

2.多層光記錄媒體 2. Multilayer optical recording media

本實施形態之多層光記錄媒體係前述單位層積體,在基板之某一邊之面,來層積複數個,並且,將於層積在最遠離於基板之最遠位置側之單位層積體來形成覆蓋層而組成之層積構造體予以包括。具體地說,多層光記錄媒體20係正如圖2所示,前述單位層積體之複數個、也就是單位層積體11-1、單位層積體11-2、’’’、單位層積體11-(n-1)、單位層積體11-n,在基板12之某一邊之面,來層積複數個,並且,將於層積在最遠離於基板12之最遠位置側(在圖1之上側)之單位層積體11-n來層積覆蓋層13而組成之層積構造體14予以包括,來作為基本構造。正如圖2所示,如果是層積構造體14也仍然直接地構成多層光記錄媒體20之狀態的話,則也有例如藉由在該層積構造體14之某一邊之面來形成印刷層等而得到多層光記錄媒體20之狀態發生。或者是正如後面之敘述,也有藉由對於構成層積構造體14之構件(單位層積體、覆蓋層等)來施行切斷加工而得到多層光記錄媒體20之狀態發生。 In the multilayer optical recording medium of the present embodiment, the unit laminated body is laminated on a plurality of sides of the substrate, and the unit laminated body to be laminated on the farthest position side farthest from the substrate. A laminated structure composed of a cover layer is included. Specifically, the multilayer optical recording medium 20 is as shown in Fig. 2, and the plurality of unit laminated bodies, that is, the unit laminated body 11-1, the unit laminated body 11-2, ''' , and the unit laminated product. The body 11-(n-1) and the unit layered body 11-n are laminated on the side of one side of the substrate 12, and will be laminated on the farthest side farthest from the substrate 12 ( The laminated structure 11 composed of the unit laminate 11-n on the upper side of Fig. 1 to laminate the cover layer 13 is included as a basic structure. As shown in FIG. 2, if the laminated structure 14 is still directly in the state of the multilayer optical recording medium 20, for example, a printed layer or the like is formed on one side of the laminated structure 14. The state in which the multilayer optical recording medium 20 is obtained occurs. Alternatively, as described later, the state in which the multilayer optical recording medium 20 is obtained by performing the cutting process on the members (unit laminate, cover layer, and the like) constituting the laminated structure 14 may be employed.

此外,圖2所示之層積構造體14係這個包括之單位層積體11-1至單位層積體11-n皆由光記錄層1和黏著劑 層2而組成,但是,並非限定於此。單位層積體係可以得到前述各種構造,可以在層積構造體14,包含包括不同構造之單位層積體。例如由單位層積體11-1至單位層積體11-n係包括由光記錄層1和黏著劑層2而組成之構造之單位層積體以及包括由支持層及光記錄層1和黏著劑層2而組成之構造之單位層積體,可以層積這些,層積之順序係可以配合作為目的之層積構造體而適度地選擇。 Further, the laminated structure 14 shown in Fig. 2 is composed of the unit laminated body 11-1 to the unit laminated body 11-n, and the optical recording layer 1 and the adhesive are used. It is composed of layer 2, but is not limited thereto. The unit laminate system can obtain the various configurations described above, and the laminate structure 14 can include a unit laminate including different structures. For example, the unit laminate 11-1 to the unit laminate 11-n includes a unit laminate composed of the optical recording layer 1 and the adhesive layer 2, and includes a support layer and an optical recording layer 1 and adhesion. The unit laminate of the structure in which the agent layer 2 is composed may be laminated, and the order of lamination may be appropriately selected in accordance with the intended laminated structure.

(1)基板 (1) Substrate

本實施形態之多層光記錄媒體20來包括之基板12之具體之形狀或組成係應該配合作為目的之多層光記錄媒體20而適度地設定。例如作為材質係列舉聚甲基甲基丙烯酸酯、聚碳酸酯、聚乙烯對苯二甲酸酯、聚烯烴類之樹脂系材料。此外,厚度為數十~數百μm且由主面側來觀看時之形狀係列舉具有在主面之中心部來包括厚度方向之貫通孔之環圈形狀之所謂光碟形狀。 The specific shape or composition of the substrate 12 included in the multilayer optical recording medium 20 of the present embodiment should be appropriately set in accordance with the intended multilayer optical recording medium 20. For example, as a material series, polymethyl methacrylate, polycarbonate, polyethylene terephthalate, and polyolefin resin materials are used. Further, the shape series having a thickness of several tens to several hundreds of μm and viewed from the main surface side has a so-called disc shape having a loop shape including a through hole in the thickness direction at the center portion of the main surface.

基板12係可以由一種類之構件而構成,並且,也可以由複數個之構件而構成。例如可以貼合複數個之由前述樹脂系材料而組成之薄片狀之構件。 The substrate 12 may be composed of one type of member, and may be composed of a plurality of members. For example, a plurality of sheet-like members composed of the above resin-based materials may be bonded.

(2)覆蓋層 (2) Cover layer

構成本實施形態之多層光記錄媒體20來包括之覆蓋層13之材料係並無特別限制,向來,可以由光記錄媒體之覆蓋層之中而適度地選擇來使用。作為其材質係例舉聚甲基甲基丙烯酸酯、聚碳酸酯、聚乙烯對苯二甲酸酯、聚烯烴類之塑膠薄膜(在以下,稱為塑膠薄膜。)。該塑膠薄膜之厚度係並 無特別限制,但是,通常為20~600μm程度、最好是20~150μm。此外,塑膠薄膜係最好是無延伸以及進行延伸處理後之應力緩和處理等之殘留於內部之應力變少,提高賦予至覆蓋層13之外力和位處於層積成為層積構造體14之一部分之狀態之覆蓋層13來具有之內部應力之主面內方向成分之相關性。 The material of the cover layer 13 which is included in the multilayer optical recording medium 20 of the present embodiment is not particularly limited, and may be appropriately selected and used from among the cover layers of the optical recording medium. Examples of the material thereof include polymethyl methacrylate, polycarbonate, polyethylene terephthalate, and polyolefin-based plastic films (hereinafter referred to as plastic films). The thickness of the plastic film is There is no particular limitation, but it is usually from 20 to 600 μm, preferably from 20 to 150 μm. Further, it is preferable that the plastic film is not stress-extended, and the stress relaxation treatment after the stretching treatment is less, and the stress remaining in the interior is less, and the force and the position imparted to the cover layer 13 are increased to be a part of the laminated structure 14 . The cover layer 13 in the state has a correlation with the component in the main plane of the internal stress.

覆蓋層13係可以由一種類之構件而構成,並且,也可以由複數個之構件而構成。例如可以層積複數片之前述塑膠薄膜。或者是可以在對向於覆蓋層13之單位層積體11之側之面,設置黏著劑層,也可以包括前述硬質層。此外,在圖2(a)所示之層積構造體14,就覆蓋層13無包括此種黏著劑層而層積於單位層積體11之黏著劑層2側之面之狀態,來進行顯示。正如圖2(b)所示,在覆蓋層13來層積黏著劑層15之狀態下,由黏著劑層15之保管安定性等之觀點來看的話,則可以直到層積成為層積構造體14之一部分為止,在覆蓋層13和黏著劑層15之層積體之黏著劑層15側之面,貼附剝離用材料。 The cover layer 13 may be composed of one type of member, and may be composed of a plurality of members. For example, a plurality of sheets of the aforementioned plastic film may be laminated. Alternatively, an adhesive layer may be provided on the side opposite to the unit laminate 11 of the cover layer 13, or the hard layer may be included. Further, in the laminated structure 14 shown in Fig. 2(a), the cover layer 13 is laminated on the side of the adhesive layer 2 of the unit laminate 11 without including such an adhesive layer. display. As shown in Fig. 2(b), in the state in which the adhesive layer 15 is laminated on the cover layer 13, from the viewpoint of storage stability of the adhesive layer 15, etc., it is possible to form a laminated structure until the layering The peeling material is attached to the surface of the layer of the cover layer 13 and the adhesive layer 15 on the side of the adhesive layer 15 in one part.

此外,在圖2(a)所示之層積構造體14,成為最下層之單位層積體11-1係透過黏著劑層15而層積於基板12,對向其光記錄層1側之面。本實施形態之層積構造體14之單位層積體11-1和基板12之關係,並非限定於此。例如圖2(b)所示,可以相對於基板12而使得單位層積體11-1,層積於基板12,來對向其黏著劑層2側之面,單位層積體11-1係可以藉由根據成為一種自己本身構成要素之黏著劑層2之黏著力而對於基板12,來進行固定。在該狀態下,在層積於 最遠離於基板12之最遠位置側之單位層積體11-n,透過黏著劑層15而層積覆蓋層13。 Further, in the laminated structure 14 shown in Fig. 2(a), the unit laminated body 11-1 which is the lowermost layer is laminated on the substrate 12 through the adhesive layer 15, and is opposed to the side of the optical recording layer 1 surface. The relationship between the unit laminated body 11-1 of the laminated structure 14 of the present embodiment and the substrate 12 is not limited thereto. For example, as shown in FIG. 2(b), the unit laminate 11-1 can be laminated on the substrate 12 with respect to the substrate 12 to face the surface of the adhesive layer 2, and the unit laminate 11-1 can be used. The substrate 12 can be fixed by the adhesion of the adhesive layer 2 which is a component of its own composition. In this state, in stratification The unit laminate 11-n which is farthest from the farthest position side of the substrate 12 is laminated on the cover layer 13 through the adhesive layer 15.

3.多層光記錄媒體之製造方法 3. Method for manufacturing multilayer optical recording medium

本實施形態之多層光記錄媒體之製造方法係以在基板12之上層積複數片之單位層積體11而在最後層積覆蓋層13之方法,來作為基本之製程(在以下,稱為「依序層積製程」。),在該方面,共通於先前技術之多層光記錄媒體之製造方法。 In the method of manufacturing a multilayer optical recording medium of the present embodiment, a method of laminating a plurality of unit laminates 11 on a substrate 12 and laminating a cover layer 13 at the end is used as a basic process (hereinafter referred to as " The sequential lamination process"), in this respect, is common to the manufacturing method of the prior art multilayer optical recording medium.

但是,向來,在藉由該依序層積製程而製造多層光記錄媒體之時,有起因於得到之多層光記錄媒體或其製造過程之層積構造體之主面方向之殘留應力而彎曲多層光記錄媒體或其製造過程之層積構造體之狀態發生。 However, when a multilayer optical recording medium is manufactured by the sequential lamination process, the multilayer optical recording medium has a residual stress which is caused by the residual surface stress of the laminated optical body of the obtained multilayer optical recording medium or the manufacturing process thereof The state of the laminated structure of the optical recording medium or its manufacturing process occurs.

為了解決該彎曲問題,因此,本實施形態之多層光記錄媒體之製造方法係在依序層積製程,包括以下說明之層積製程。 In order to solve the problem of the bending, the method of manufacturing the multilayer optical recording medium of the present embodiment is a sequential lamination process including the lamination process described below.

在說明本實施形態之製造方法時,在此,使用圖3而進行用語之定義。 In describing the manufacturing method of the present embodiment, the definition of the term is used here using FIG.

圖3係呈概念地顯示在由基板12和層積於其一邊之面之3個之單位層積體11-1、11-2及11-3而組成之構造體來層積第4個之單位層積體11-4之製程之中途狀態之剖面圖。 Fig. 3 is a structure in which the fourth layer is integrally formed on the substrate 12 and the unit laminates 11-1, 11-2, and 11-3 which are laminated on one side of the substrate 12, and is conceptually displayed. A cross-sectional view of the state in the process of the unit laminate 11-4.

(黏著構造體) (adhesive structure)

在本實施形態,將包括基板12和至少一個之單位層積體11之構造體,稱為黏著構造體31,在圖3,由基板12 和單位層積體11-1、11-2及11-3而組成之構造體係成為黏著構造體31。此外,將位處在最遠離於黏著構造體31之基板12之最遠位置側之單位層積體11,稱為黏著層積體32,在圖3,單位層積體11-3係成為黏著層積體32。 In the present embodiment, the structure including the substrate 12 and at least one unit laminate 11 is referred to as an adhesive structure 31, and in FIG. The structural system composed of the unit laminates 11-1, 11-2, and 11-3 serves as the adhesive structure 31. Further, the unit laminated body 11 located at the farthest position side of the substrate 12 farthest from the adhesive structure 31 is referred to as an adhesive laminated body 32, and in Fig. 3, the unit laminated body 11-3 is adhered. Laminated body 32.

此外,黏著構造體31係可以在其黏著層積體32側之面,層積剝離用材料(未圖示)。在該狀態下,可以藉著由黏著構造體31,來剝離其剝離用材料,露出黏著層積體32之一邊之面32a,貼合該面32a和附設層狀體33之一邊之面33b,而將附設層狀體33,貼附於黏著構造體31。可以藉由像這樣,黏著構造體31具有剝離用材料,而保護黏著層積體32之一邊之面32a。 Further, the adhesive structure 31 may be laminated with a material for peeling off (not shown) on the side of the adhesive laminate 32 side. In this state, the peeling material is peeled off by the adhesive structure 31, and the surface 32a of one side of the adhesive laminate 32 is exposed, and the surface 32a and the surface 33b of one side of the layered body 33 are attached. On the other hand, the layered body 33 is attached to the adhesive structure 31. By thus, the adhesive structure 31 has a material for peeling off, and the surface 32a of one side of the adhesive laminate 32 is protected.

(附設層狀體) (with layered body)

將層積於黏著層積體32之單位層積體,稱為附設層狀體33,在圖3,單位層積體11-4係成為附設層狀體33。 The unit laminated body laminated on the adhesive laminate 32 is referred to as an attached layered body 33. In FIG. 3, the unit laminated body 11-4 is a laminated layered body 33.

雖然無進行圖示,但是,附設層狀體33係應該層積於黏著層積體32之層狀體,因此,也有附設層狀體33成為覆蓋層之狀態發生。此外,可以在覆蓋層(包括黏著劑層之狀態係也正如前面之敘述),層積至少一個之單位層積體而組成。此外,附設層狀體33係可以層積複數個之單位層積體。在該狀態下,層積之複數個之單位層積體係可以相同,並且,也可以相互地不同。 Although not shown, the laminated layer 33 should be laminated on the layered body of the adhesive laminate 32. Therefore, the layered body 33 is also provided as a coating layer. Further, at least one unit laminate may be laminated to form a cover layer (the state including the adhesive layer as described above). Further, the layered body 33 may be laminated to form a plurality of unit laminates. In this state, the plurality of unit stack systems of the layers may be the same, and may be different from each other.

附設層狀體33之形狀係並無特別限定。正如圖3所示,可以是對應於基板12之形狀,並且,也可以正如圖4或圖5所示,具有長尺之形狀。在附設層狀體33為長尺之狀 態下,可以在附設層狀體33層積於黏著層積體32之後,切斷加工成為對應於基板12之形狀。 The shape of the layered body 33 is not particularly limited. As shown in FIG. 3, it may correspond to the shape of the substrate 12, and may also have a long-length shape as shown in FIG. 4 or FIG. The attached layered body 33 is long. In the state in which the laminated layer 33 is laminated on the adhesive layered body 32, it can be cut into a shape corresponding to the substrate 12.

此外,在圖3,單位層積體11-1~11-4係皆由光記錄層1和黏著劑層2而組成,但是,單位層積體係可以得到前述各種構造,並非限定於此。 In addition, in FIG. 3, the unit laminated bodies 11-1 to 11-4 are composed of the optical recording layer 1 and the adhesive layer 2, but the various structures described above can be obtained by the unit laminated system, and are not limited thereto.

此外,附設層狀體33係可以在附設層狀體33之至少一邊之面,層積剝離用材料(在圖3,成為剝離用材料34、35。)。可以藉由像這樣,附設層狀體33具有剝離用材料,而提高附設層狀體33之處理性,在對於其污染或黏著層積體32來進行層積之後,減低附設層狀體33呈剝離之可能性。在該狀態下,可以藉由在層積製程,剝離接近於對向在黏著層積體32之側之面之剝離用材料(在圖3,成為剝離用材料34。),露出對向於單位層積體11-4之黏著層積體32之側之面33b,貼合該面33b和相反於黏著層積體32之基板12之相反側之面32a,而將附設層狀體33,貼附於黏著層積體32。 In addition, the layered body 33 may be laminated on at least one side of the layered body 33 to be laminated (see FIG. 3 as the materials for peeling 34, 35). By providing the layered body 33 with the material for peeling as described above, it is possible to improve the rationality of the layered body 33, and after laminating the contaminated or adhered layered body 32, the attached layered body 33 is reduced. The possibility of stripping. In this state, the peeling material which is close to the surface facing the adhesive layered body 32 (in FIG. 3, the peeling material 34) can be peeled off by the lamination process to expose the opposing unit. The side surface 33b of the adhesive laminate 32 of the laminate 11-4 is bonded to the surface 33b and the surface 32a opposite to the substrate 12 of the adhesive laminate 32, and the layered body 33 is attached. Attached to the adhesive laminate 32.

本實施形態之多層光記錄媒體之製造方法係包括:由包括基板12和至少一個之前述單位層積體11之黏著構造體31之基板12開始,在成為位處於最遠位置側之單位層積體11(在圖3,成為單位層積體11-3。)之黏著層積體32側之面(也就是相反於對向在黏著層積體32之基板12之側之相反側之面32a),層積單位層積體11和覆蓋層13以及由這些層積體而組成之群組來選出之附設層狀體33(在圖3,成為單位層積體11-4。)在黏著構造體31之上,同時,成為使得層積於黏著構造體31之附設層狀體33來具有拉伸應力之狀態之 層積製程。 The method for producing a multilayer optical recording medium according to the present embodiment includes: starting from the substrate 12 including the substrate 12 and at least one of the adhesive structures 31 of the unit laminated body 11, and unit stacking at the farthest position side The surface of the body 11 (in Fig. 3, which becomes the unit laminate 11-3) on the side of the adhesive laminate 32 (i.e., opposite to the face 32a opposite to the side opposite to the substrate 12 of the adhesive laminate 32) The laminated unit laminate 11 and the cover layer 13 and the attached layered body 33 selected by the group of the laminates (in FIG. 3, the unit laminate 11-4) are in an adhesive structure. On the body 31, at the same time, it is in a state in which the laminated layer 33 is laminated on the adhesive structure 31 to have tensile stress. Lamination process.

(層積製程) (layering process)

在本實施形態之層積製程,在黏著構造體31之黏著層積體32側之面,層積附設層狀體33,同時,成為使得層積於黏著構造體31之附設層狀體33來具有拉伸應力之狀態。 In the lamination process of the present embodiment, the layered body 33 is laminated on the surface of the adhesive structure 31 on the side of the adhesive laminate 32, and the layered body 33 is laminated on the adhesive structure 31. It has a state of tensile stress.

為了成為此種狀態,因此,層積製程係作為構成該層積製程之副製程而包括:將附設層狀體33來貼附於黏著構造體31之貼附製程、賦予外力至附設層狀體33之施加製程、以及控制藉由施加製程而在附設層狀體33來賦予外力之方向之方向控制製程;這些製程之開始時期之相對關係,配合這些製程之具體內容而進行變化。在以下,就施加製程及方向控制製程而詳細地進行說明。 In order to be in such a state, the lamination process includes a process of attaching the layered body 33 to the adhesion structure 31 and attaching an external force to the attached layer body as a sub-process for constituting the lamination process. The application process of 33 and the control of the direction in which the direction of the external force is applied by attaching the layered body 33 by the application process are controlled; the relative relationship of the start times of these processes is changed in accordance with the specific contents of these processes. Hereinafter, the process and the direction control process will be described in detail.

(1)貼附製程 (1) Attachment process

貼附製程係附設層狀體33來貼附於黏著構造體31之製程。具體之貼附方法係任意,可以實施賦予張力同時進行貼附等而重複地進行貼附製程和施加製程。此外,在附設層狀體33為長尺之狀態下,貼附製程係最好是沿著一定之方向而搬送長尺之附設層狀體,貼附於前述黏著構造體31。 The attaching process is attached to the adhesive structure 31 by attaching the layered body 33. The specific attachment method is arbitrary, and the attachment process and the application process can be repeatedly performed by applying tension and attaching. In addition, in the state in which the layered body 33 is provided in a long length, the attaching process system preferably transports the attached layered body of a long length in a predetermined direction, and is attached to the adhesive structure 31.

(2)施加製程 (2) application process

施加製程係正如前面之敘述,包含外力賦予至附設層狀體33之外力賦予,能夠以該施加製程之實施,藉由層積附設層狀體33而成為具有滿足關於以下說明之應力間角度之條件之拉伸應力之狀態,來有效地防止起因於得到之多層光記錄媒體20或其製造過程之層積構造體14之主面方向之殘留應力而造成 之多層光記錄媒體20或其製造過程之層積構造體14之彎曲。 The application process is as described above, and the external force is applied to the additional layered body 33, and the application of the application process can be performed by laminating the layered body 33 to have an angle of stress satisfying the following description. The state of the tensile stress of the condition is effectively prevented from being caused by residual stress in the direction of the principal surface of the laminated optical structure 20 of the obtained multilayer optical recording medium 20 or its manufacturing process. The multilayer optical recording medium 20 or the bending of the laminated structure 14 of its manufacturing process.

(關於應力間角度之條件) (Conditions about the angle between stresses)

成為起因於位處在層積於黏著構造體31之狀態之附設層狀體33之藉由施加製程而賦予之外力來造成之拉伸應力之主面內成分之方向之第1方向(在本實施形態,僅稱為「第1方向」。)相對於成為黏著層積體32具有之拉伸應力之主面內成分之方向之第2方向(在本實施形態,僅稱為「第2方向」。)之應力間角度R係成為0°超過、120°以內。在以下,也將滿足該應力間角度之條件,稱為「條件1」。 The first direction in which the direction of the component in the principal surface of the tensile stress caused by the external force is applied to the attached layered body 33 which is in the state of being laminated on the adhesive structure 31 (in this case) The embodiment is simply referred to as the "first direction". The second direction is the direction of the component in the principal surface of the tensile stress that the adhesive layer 32 has (in the present embodiment, it is simply referred to as the "second direction". The inter-stress angle R is 0° over 120°. In the following, the condition that satisfies the angle between the stresses is also referred to as "condition 1".

為了像這樣,滿足條件1,因此,可以藉由控制應力間角度而降低殘留於層積構造體之應力之集中,可以有效地防止起因於層積構造體之主面方向之殘留應力而造成之多層光記錄媒體或其製造過程之層積構造體之彎曲。 In order to satisfy the condition 1 as described above, it is possible to reduce the concentration of the stress remaining in the laminated structure by controlling the angle between the stresses, and it is possible to effectively prevent the residual stress caused by the direction of the principal surface of the laminated structure. The bending of the laminated structure of the multilayer optical recording medium or its manufacturing process.

為了滿足條件,因此,藉由以施加製程,來賦予外力,而實現減低彎曲發生之光記錄媒體20之製造。 In order to satisfy the condition, the external force is applied by the application process, and the manufacture of the optical recording medium 20 for reducing the occurrence of bending is realized.

此外,正如後面之敘述,有可以藉由關於拉伸應力之外力之賦予方法而定義第1方向和第2方向來作為賦予至附設層狀體33之外力之方向矢量(也包含施加力之方向)之狀態發生。在該狀態下,條件1之應力間角度R係藉由賦予附設層狀體33之外力之方向矢量(第1方向)和成為位處在最遠離於黏著構造體31之前述基板之最遠位置側之前述單位層積體之黏著層積體32來賦予之外力之方向矢量(第2方向)而形成之角度,來定義條件1之應力間角度R。 Further, as will be described later, the first direction and the second direction may be defined by the method of imparting a force other than the tensile stress as the direction vector imparted to the external force of the attached layered body 33 (including the direction of the applied force). The state of the occurrence occurs. In this state, the inter-stress angle R of the condition 1 is the direction vector (the first direction) of the force applied to the layered body 33 and the farthest position of the substrate which is the farthest from the adhesive structure 31. The adhesion layer 32 of the unit laminated body on the side is given an angle formed by the direction vector (second direction) of the external force, and the inter-stress angle R of the condition 1 is defined.

多層光記錄媒體20或其製造過程之層積構造體14 之主面方向之殘留應力之大小係可以藉由使用X射線之繞射、以超音波來造成之聲音彈性法、以機械加工等而緩和應力來測定此時發生之歪斜之方法等之向來習知之手段,而測定殘留應力之大小。此外,在本實施形態,明白地顯示:在實際上,即使是無測定殘留應力,也在各層積製程,起因於因為賦予之外力而造成之層積構造體14之主面方向之殘留應力,彎曲多層光記錄媒體20,因此,可以藉由測定以本實施形態之製造方法來製造之多層光記錄媒體20之彎曲量,而判斷是否降低殘留應力之集中。 The multilayer optical recording medium 20 or the laminated structure 14 of the manufacturing process thereof The magnitude of the residual stress in the direction of the principal surface can be measured by using X-ray diffraction, acoustic elasticity by ultrasonic waves, stress reduction by machining, etc., and measuring the skew occurring at this time. The means of knowing, and measuring the magnitude of residual stress. Further, in the present embodiment, it is apparent that, in actuality, even in the case where no residual stress is measured, the respective lamination processes are caused by the residual stress in the main surface direction of the laminated structure 14 due to the external force applied. Since the multilayer optical recording medium 20 is bent, it is possible to determine whether or not to reduce the concentration of residual stress by measuring the amount of bending of the multilayer optical recording medium 20 manufactured by the manufacturing method of the present embodiment.

條件1係關於位處在層積於黏著構造體31之狀態之附設層狀體33之條件,因此,附設層狀體33來貼附於黏著構造體31之貼附製程之實施時期和成為施加製程而在黏著構造體31來賦予外力之時期之間之關係,成為任意。也就是說,藉由施加製程而造成之黏著構造體31之外力賦予係可以是在黏著構造體31來貼合附設層狀體33之貼附製程之實施前、貼附中途和貼附後之任何一種,並且,也可以在這些定時之複數個或全部,來賦予外力。 The condition 1 is a condition in which the layered body 33 is placed in the state of being laminated on the adhesive structure 31. Therefore, the layered body 33 is attached to the adhesion structure 31 and the application process is performed and applied. The relationship between the time when the external structure is applied to the adhesive structure 31 is arbitrary. In other words, the external force applying system of the adhesive structure 31 by the application process may be before, during, and after the attachment process of the adhesive structure 31 to attach the laminated layer 33. Any one, and it is also possible to give an external force at a plurality or all of these timings.

在施加製程而賦予之外力之種類係並無特別限定,但是,附設層狀體33係在主面內方向,具有拉伸應力,因此,最好是對於附設層狀體33,來賦予由張力和擠壓力之至少一種而組成之外力,更加理想是在施加製程而賦予之外力係張力和擠壓力之兩者。具體地說,例舉在貼附製程之實施前或實施中而施加於附設層狀體33之張力、在貼附製程之實施中或實施後而施加於附設層狀體33之擠壓力(具體地說,進行 擠壓同時其擠壓部來移動至附設層狀體33之主面內方向。)等。 The type of the external force to be applied is not particularly limited. However, since the laminated layer 33 is provided in the main surface direction and has a tensile stress, it is preferable to provide the tension to the layered body 33. An external force is formed by at least one of the pressing force, and it is more desirable to apply the process to impart both the external force tension and the pressing force. Specifically, the tension applied to the attached layered body 33 before or during the application of the attaching process, and the pressing force applied to the attached layered body 33 during or after the application of the attaching process are exemplified ( Specifically, proceed At the same time, the pressing portion thereof is moved to the main surface direction of the attached layered body 33. )Wait.

此外,施加製程係最好是對於相反在對向於附設層狀體33之黏著層積體32之對向面33a之相反側之面側33b,藉由外力賦予構件,來賦予外力至附設層狀體33,而使得附設層狀體33,成為在主面內方向來具有拉伸應力之狀態之製程。 Further, it is preferable that the application process is applied to the surface side 33b opposite to the opposite surface 33a of the adhesive laminate 32 to which the layered body 33 is attached, and the external force is applied to the member to impart an external force to the attached layer. The shape of the layered body 33 is a process in which the layered body 33 is provided in a state of having tensile stress in the direction of the main surface.

外力之大小係也只要是得到本發明之效果的話,則並無特別限定,但是,外力係最好是以主面內方向之張力換算(在以下相同)而成為0.02kgf/m以上、更加理想是0.04kgf/m以上。在外力過度高之狀態下,附設層狀體33所具有之拉伸應力係過度高,也有無法維持層積附設層狀體33之狀態之情況發生。因此,外力係最好是400kgf/m以下、更加理想是320kgf/m以下。 The external force is not particularly limited as long as the effect of the present invention is obtained. However, it is preferable that the external force is 0.02 kgf/m or more in terms of the tension in the main surface direction (the same applies hereinafter). It is 0.04kgf/m or more. In a state where the external force is excessively high, the tensile stress of the layered body 33 is excessively high, and the state in which the layered body 33 is laminated may not be maintained. Therefore, the external force is preferably 400 kgf/m or less, more preferably 320 kgf/m or less.

如果是關於張力而顯示具體例的話,則列舉藉由保持附設層狀體33之其主面內方向之至少一方向之兩端部,使得這些之保持部分,離開於其方向,而在附設層狀體33,來賦予張力之方法。該保持方法係變得任意,藉由拉伸力之賦予起始時期和層積作業之開始時期之間之關係而適度地設定。例如可以藉由使用例如夾子之保持手段,來保持附設層狀體33之兩端部,分離開這些保持手段,而在貼附製程之實施前,來賦予張力。或者是也可以在貼附製程之實施中,來賦予張力。具體地說,可以將相當於附設層狀體33之某一邊之端部之部分,來貼附於黏著構造體31,使得黏著構造體31成為保持手段之一方,使用夾子等之其他之保持手段,來保持其他邊之端 部,同時,賦予由貼附於黏著構造體31之部分來離開之張力,並且,將無貼附於附設層狀體33之殘留部分,來貼附於黏著構造體31。 If a specific example is shown with respect to the tension, the both end portions of at least one of the directions in the main surface of the attached layered body 33 are held so that the holding portions are separated from the direction and the attached layer The shape 33 is a method for imparting tension. This holding method is arbitrarily set, and is appropriately set by the relationship between the initial period of the stretching force and the start time of the stacking operation. For example, the holding portions of the layered body 33 can be held by using a holding means such as a clip, and the holding means can be separated to apply tension before the attachment process is carried out. Alternatively, tension can be imparted during the implementation of the attachment process. Specifically, a portion corresponding to an end portion of one side of the layered body 33 may be attached to the adhesive structure 31 such that the adhesive structure 31 is one of the holding means, and other holding means such as a clip is used. To keep the other side At the same time, the tension which is left by the portion attached to the adhesive structure 31 is given, and the remaining portion of the attached layered body 33 is not attached, and is attached to the adhesive structure 31.

如果即使是關於擠壓力也顯示具體例的話,則列舉藉由使用例如加壓滾輥之筒狀體來擠壓附設層狀體33而賦予擠壓力之方法。也就是說,作為在貼附製程之實施中及/或實施後而賦予擠壓力之方法係對於相反在對向於附設層狀體33之黏著層積體32之對向面33a之相反側之面33b(正如後面之敘述,在其面33b來貼附剝離用材料之狀態下,相反於對向在其剝離用材料之面33b之對向側之相反側之面),藉由筒狀體(壓輥)而加壓於主面之法線方向,同時,旋轉筒狀體(壓輥),並且,進行移動。結果,在附設層狀體33,賦予筒狀體(壓輥)之移動方向前方向之力,來作為外力(擠壓力)。 In the case where a specific example is shown with respect to the pressing force, a method of applying a pressing force by pressing the laminated layer body 33 by using a cylindrical body such as a pressure roller is exemplified. That is, the method of imparting the pressing force during and/or after the attachment process is opposite to the opposite side of the opposite face 33a of the adhesive laminate 32 to which the layered body 33 is attached. The surface 33b (as will be described later, in the state in which the peeling material is attached to the surface 33b, on the opposite side to the opposite side of the facing side of the surface 33b of the peeling material), by the cylindrical shape The body (pressing roller) is pressed against the normal direction of the main surface, and at the same time, the cylindrical body (pressing roller) is rotated and moved. As a result, the layered body 33 is attached to the force in the direction in which the tubular body (pressing roll) moves in the forward direction (extrusion force).

特別是基板12之形狀係正如前面之敘述,在成為例如一般之光碟基板之形狀之狀態下,在旋轉筒狀體(壓輥)同時進行移動之時,在基板12之端部附近,接合於筒狀體(壓輥)之附設層狀體33之面積變小,因此,賦予至附設層狀體33之外力容易變大。在此時,基板12之端部附近係具有相對高之拉伸應力。 In particular, the shape of the substrate 12 is bonded to the end portion of the substrate 12 when the rotating cylindrical body (pressing roller) is simultaneously moved in a state of, for example, a general optical disk substrate. Since the area of the layered body 33 to which the cylindrical body (pressing roll) is attached is small, the force applied to the attached layered body 33 is likely to increase. At this time, the vicinity of the end portion of the substrate 12 has a relatively high tensile stress.

(3)方向控制製程 (3) Direction control process

方向控制製程係設定附設層狀體33和黏著構造體31之至少一邊之位置而使得由第1方向和第2方向來形成之應力間角度R,滿足條件1之製程,只要是實現條件1的話,則具體之方法係並無特別限定。此外,實施方向控制製程之時期 和開始進行構成層積製程之其他製程(貼附製程和施加製程)之時期之關係,也成為任意。 The direction control process sets the position of at least one side of the laminated layer 33 and the adhesive structure 31 so that the inter-stress angle R formed by the first direction and the second direction satisfies the process of the condition 1, as long as the condition 1 is achieved. The specific method is not particularly limited. In addition, the period of implementation of the direction control process The relationship with the period of starting the other processes (attaching process and applying process) constituting the stratification process is also arbitrary.

列舉例如黏著構造體31能夠以其主面之法線方向,作為旋轉軸而進行旋轉,在旋轉黏著構造體31之後,實施貼附製程而作為方向控制製程之方法,來作為理想之一例。 For example, a method in which the adhesive structure 31 can be rotated as a rotation axis in the normal direction of the main surface thereof and the attachment process is performed after the rotation of the adhesive structure 31 is used as a direction control process is exemplified.

如果是使用圖4(a)及圖4(b)而具體地進行說明的話,則正如圖4(a)所示,以黏著構造體31之主面之法線方向36(在圖4(a)之上下方向),作為旋轉軸,一起旋轉固定基板12之基台41以及黏著構造體31,控制第2方向38而滿足前述條件1,進行方向控制製程。此外,37係表示第1方向,38係表示第2方向。在像這樣而實施方向控制製程之後,正如圖4(b)所示,進行前述附設層狀體33來貼附於前述黏著構造體31之貼附製程以及在前述附設層狀體33來賦予外力之施加製程。具體地說,將位處於第1方向37來賦予張力之狀態(也就是位處在實行施加製程之狀態)之附設層狀體33,貼附於黏著構造體31(貼附製程)。藉由像這樣而成為第1方向37和第2方向38來滿足條件1之狀態。 If it is specifically described using FIG. 4(a) and FIG. 4(b), as shown in FIG. 4(a), the normal direction 36 of the main surface of the adhesive structure 31 is used (in FIG. 4(a). In the upper and lower directions, the base 41 and the adhesive structure 31 of the fixed substrate 12 are rotated together as a rotating shaft, and the second direction 38 is controlled to satisfy the condition 1 described above, and the direction control process is performed. Further, 37 indicates the first direction, and 38 indicates the second direction. After performing the direction control process as described above, as shown in FIG. 4(b), the attachment process of attaching the layered body 33 to the adhesive structure 31 and the application of the layered body 33 to the external force are performed. Apply the process. Specifically, the attached layered body 33 in the state in which the tension is given in the first direction 37 (that is, the state in which the application process is performed) is attached to the adhesive structure 31 (attaching process). By setting the first direction 37 and the second direction 38 in this manner, the condition 1 is satisfied.

在圖4(a),施加製程係實施於貼附製程之前,但是,並非限定於此。在附設層狀體33開始進行外力之賦予而作為施加製程之定時係如果是藉由方向控制製程之實施而旋轉黏著構造體31之後的話,則可以是任何一種之定時(也就是貼附製程之實施前、實施中和實施後之任何一種)。例如圖4(c)所示,在施加製程為藉由使用加壓用壓輥42來進行加壓而賦予外力之製程之狀態下,在實施貼附製程之後,來實行施 加製程。 In FIG. 4(a), the application process is performed before the attaching process, but is not limited thereto. The timing at which the external layer is applied to the layered body 33 is applied as the timing of the application process. If the adhesive structure 31 is rotated by the direction control process, it can be any timing (that is, the attachment process). Any one before, during, and after implementation). For example, as shown in FIG. 4(c), in the state where the application process is a process of applying an external force by pressurization using the pressurizing pressure roller 42, the application process is performed after the attachment process is performed. Add process.

作為方向控制製程之理想之其他之具體例係也列舉附設層狀體33能夠以黏著構造體31之主面之法線方向,來作為旋轉軸而進行旋轉,在旋轉附設層狀體33而作為方向控制製程之後,來實施貼附製程之方法。具體地說,正如圖5(a)所示,在賦予外力之方向來作為第1方向37之時,藉由以黏著構造體31之主面之法線方向(在圖5之上下方向),來作為旋轉軸,旋轉附設層狀體33,而控制第1方向37,進行方向控制製程。像這樣,正如圖5(b)所示,在成為第1方向37和第2方向38滿足條件1之狀態之後,將附設層狀體33貼附於黏著構造體31。在該狀態下,正如圖5(b)所示,可以貼附預先在第1方向37來賦予張力之附設層狀體33,並且,正如圖5(c)所示,可以藉由使用加壓用壓輥42,來加壓附設層狀體33,同時,進行移動,而對於附設層狀體33,來賦予擠壓。 As another specific example of the directional control process, the laminated layer body 33 can be rotated as a rotation axis in the normal direction of the main surface of the adhesive structure 31, and the layered body 33 is attached as a rotation. After the direction control process, the method of attaching the process is implemented. Specifically, as shown in FIG. 5(a), when the direction in which the external force is applied is the first direction 37, the normal direction of the main surface of the adhesive structure 31 (in the upper and lower directions of FIG. 5) is As the rotating shaft, the layered body 33 is attached and rotated, and the first direction 37 is controlled to perform the direction control process. As shown in FIG. 5( b ), after the first direction 37 and the second direction 38 satisfy the condition 1 , the attached layered body 33 is attached to the adhesive structure 31 . In this state, as shown in FIG. 5(b), the attached layered body 33 which is previously biased in the first direction 37 can be attached, and as shown in FIG. 5(c), pressurization can be used. The layered body 33 is press-bonded by the pressure roller 42 while being moved, and the pressing is applied to the layered body 33.

此外,在圖4及圖5,長尺之附設層狀體33之厚度和黏著層積體32之厚度係不同,但是,在現實上,成為同等之厚度。此外,在圖4及圖5,黏著構造體31之單位層積體11和黏著構造體31係成為對應於基板12之形狀,但是,並非限定於此,正如在後面敘述之切斷製程而說明的,也可以是無對應於基板12之形狀。 Further, in FIGS. 4 and 5, the thickness of the layered body 33 attached to the long rule and the thickness of the adhesive laminate 32 are different, but in reality, they have the same thickness. In addition, in FIG. 4 and FIG. 5, the unit laminated body 11 and the adhesive structure 31 of the adhesive structure 31 correspond to the shape of the board|substrate 12, However, It is not limited to this, and is demonstrated by the cutting process mentioned later. It is also possible that there is no shape corresponding to the substrate 12.

在方向控制製程,更加具體地說,就設定應力間角度R來滿足條件1之方法之具體例而言,在以下,進行說明。 More specifically, a specific example of a method of setting the inter-stress angle R to satisfy the condition 1 in the direction control process will be described below.

(設定方法1) (Setting method 1)

層積於本實施形態之層積構造體14之單位層積體11和覆蓋層13(在本實施形態,總稱為「附設層狀體」。)之各個係設定應力間角度R而滿足以下之關係。也就是說,設定方法1係考慮層積附設層狀體之位置以及層積數而設定應力間角度R之方法。 Each of the unit laminate 11 and the cover layer 13 (in the present embodiment, collectively referred to as "attached layered body") of the laminated structure 14 of the present embodiment is set to have an inter-stress angle R and satisfies the following relationship. In other words, the setting method 1 is a method of setting the inter-stress angle R in consideration of the position and the number of laminations in which the layered body is laminated.

成為相對於黏著構造體31而層積第i個之附設層狀體i(但是,i係2至n之整數,n係層積構造體14之附設層狀體之總數。)來具有之拉伸應力之主面內成分之方向之第1方向相對於成為層積在對向於最接近於該附設層狀體i之最接近位置之附設層狀體中之基板12之側之附設層狀體(i-1)來具有之拉伸應力之主面內成分之方向之第2方向之應力間角度R1係滿足列之公式(I);R1=360°×m/n (I) The laminated layer i of the i-th layer is laminated with respect to the adhesive structure 31 (however, i is an integer of 2 to n, and the total number of layered bodies of the n-type laminated structure 14 is attached). The first direction of the direction of the component in the principal surface of the tensile stress is attached to the side of the substrate 12 which is laminated in the attached layered body closest to the closest position of the attached layered body i The inter-stress angle R1 in the second direction of the direction of the component in the principal surface of the tensile stress (i-1) satisfies the formula (I); R1 = 360° × m / n (I)

但是,m係1以上之整數。 However, m is an integer of 1 or more.

藉由像這樣設定,而無相互地重疊成為附設層狀體i來具有之拉伸應力之主面內成分之方向之第1方向,進行分散。可以藉此而降低殘留於層積構造體14之拉伸應力之集中,可以有效地防止起因於層積構造體之主面方向之殘留應力而造成之多層光記錄媒體或其製造過程之層積構造體之彎曲。此外,正如圖2(a)所示之層積構造體14,在層積於基板12和最接近於基板12之最接近位置之附設層狀體11-1之間之層狀體整體為黏著劑層15之狀態下,無設定應力間角度R1By setting as described above, the first direction in which the direction of the component in the main surface of the tensile stress is applied is not overlapped with each other, and the dispersion is performed. By this, the concentration of the tensile stress remaining in the laminated structure 14 can be reduced, and the lamination of the multilayer optical recording medium or its manufacturing process caused by the residual stress in the direction of the principal surface of the laminated structure can be effectively prevented. The curvature of the structure. Further, as shown in the laminated structure 14 shown in Fig. 2(a), the layered body which is laminated between the substrate 12 and the attached layered body 11-1 which is closest to the substrate 12 is adhered as a whole. In the state of the agent layer 15, there is no set inter-stress angle R 1 .

(設定方法2) (Setting method 2)

在單位層積體11具有硬質層之狀態下,單位層積體11來具有之拉伸應力係大幅度地依附於該硬質層來具有之拉伸應力。此外,大多是覆蓋層13或光記錄層1也具有高度之拉伸應力之狀態發生。也就是說,在單位層積體11具有硬質層之狀態下,藉由設定方法2而設定應力間角度R。 In the state in which the unit laminate 11 has a hard layer, the tensile stress per unit layer 11 is greatly dependent on the tensile stress of the hard layer. Further, most of the state in which the cover layer 13 or the optical recording layer 1 also has a high tensile stress occurs. In other words, in the state where the unit laminate 11 has a hard layer, the inter-stress angle R is set by the setting method 2.

於是,在以層積構造體14之覆蓋層13、光記錄層和硬質層之厚度總和來作為A且以第1附設層狀體來包括之覆蓋層、光記錄層和硬質層之總厚度來作為B1且以配置在最接近於第1附設層狀體之最接近位置之第2附設層狀體來包括之覆蓋層、光記錄層和硬質層之總厚度來作為B2之時,成為第1附設層狀體來具有之拉伸應力之主面內方向之第1方向相對於成為第2附設層狀體來具有之拉伸應力之主面內方向之第2方向而造成之應力間角度R2係可以在層積製程,設定應力間角度R而滿足下列之公式(Ⅱ)。 Then, the total thickness of the cover layer 13, the optical recording layer, and the hard layer of the laminated structure 14 is taken as the total thickness of the cover layer, the optical recording layer, and the hard layer including the first attached layered body. When B 1 is the B 2 and the total thickness of the cover layer, the optical recording layer, and the hard layer included in the second attached layered body closest to the closest position of the first attached layered body is B 2 , The first direction in which the first layer direction of the tensile stress is in the first direction of the tensile stress is caused by the second direction in the direction of the main surface of the tensile stress which is the second additional layered body. The angle R 2 can be set in the lamination process, and the inter-stress angle R is set to satisfy the following formula (II).

R2=180°×[(B1+B2)/A]/2 (Ⅱ) R 2 =180°×[(B 1 +B 2 )/A]/2 (II)

在該狀態下,考慮各個之附設層狀體來具有之硬質層厚度之影響,因此,得到呈更加地減低彎曲發生之可能性之層積構造體14。 In this state, the influence of the thickness of the hard layer on each of the attached layered bodies is considered. Therefore, the laminated structure 14 which is more likely to reduce the occurrence of bending is obtained.

此外,如果是前述第1附設層狀體和第2附設層狀體之間之關係來適用於黏著層積體32和附設層狀體33的話,則可以減少經過附設層狀體33之層積製程而得到之層積之附設層狀體33和黏著構造體31之層積體之殘留應力,因此,變得理想。 In addition, when the relationship between the first attached layered body and the second attached layered body is applied to the adhesive laminated body 32 and the laminated layered body 33, the lamination by the attached laminated body 33 can be reduced. It is preferable that the residual stress of the laminated body of the laminated layered body 33 and the adhesive structure 31 which are laminated by the process is obtained.

(4)附設層狀體之切斷製程 (4) Cutting process with attached layered body

就進行切斷加工而使得附設層狀體33來具有對應於基板12之形狀之切斷製程,進行說明。該切斷製程之實施時期和前述層積製程之實施時期之間之關係,成為任意。在以下,就關於這些實施時期呈不同之數個形態而進行例舉。 A cutting process in which the layered body 33 is provided to have a shape corresponding to the substrate 12 will be described. The relationship between the execution period of the cutting process and the execution period of the aforementioned lamination process is arbitrary. In the following, examples are made regarding the number of different forms of these implementation periods.

(4-1)在切斷製程後而進行層積製程之狀態 (4-1) The state of the stratification process after the process is cut off

在本實施形態,正如圖8所示,可以預先將附設層狀體33來切斷加工成為對應於基板12之形狀,製作具有要求形狀之附設層狀體60(切斷製程),接著,正如圖4(c)所示,將得到之具有要求形狀之附設層狀體60,層積於黏著層積體32(層積製程)。在該狀態下,也有可以藉由實施層積製程而完成多層光記錄媒體20之狀況發生。 In the present embodiment, as shown in FIG. 8, the layered body 33 is attached and cut into a shape corresponding to the substrate 12, and an attached layered body 60 having a desired shape is formed (cutting process). As shown in Fig. 4(c), the obtained laminated body 60 having a desired shape is laminated on the adhesive laminate 32 (layering process). In this state, there is also a possibility that the state of the multilayer optical recording medium 20 can be completed by performing a lamination process.

在此,就圖8而稍微詳細地進行說明。圖8係呈概念地顯示關於預先進行切斷加工而成為對應於基板之形狀之附設層狀體60之具體例之剖面圖。在圖8(a),預先進行切斷加工而具有對應於基板2之形狀之附設層狀體60之複數個係設置在長尺之剝離用材料35之某一邊之面。在圖8(a),於光記錄層1側之面,貼附於長尺之剝離用材料35而組成。另一方面,在圖8(b),相同於圖8(a)之狀態而使得預先進行切斷加工之附設層狀體60之複數個係設置在長尺之剝離用材料34之某一邊之面。在圖8(b),在黏著劑層2側之面,貼附長尺之剝離用材料34而組成。可以在相反於附設層狀體60之長尺之剝離用材料34、35側之相反側之面,貼附其他之剝離用材料,並且,也可以無貼附其他之剝離用材料。在貼附其他之剝離用材料之狀態下,其形狀係任意,可以正如長尺之剝離 用材料34、35而成為長尺,並且,也可以貼附對應於附設層狀體60之形狀之剝離用材料。藉由使用此種附設層狀體60而實現本實施形態之層積製程之生產性之提升。此外,圖8所示之附設層狀體60係對應於一般之光碟形狀而具有在主面之中心部來包括厚度方向之貫通孔之環圈形狀。 Here, a detailed description will be given with reference to Fig. 8 . FIG. 8 is a cross-sectional view conceptually showing a specific example of the attached layered body 60 corresponding to the shape of the substrate in advance. In Fig. 8(a), a plurality of the additional layered bodies 60 having the shape corresponding to the substrate 2 are cut in advance and provided on one side of the long-side peeling material 35. In Fig. 8(a), the surface on the side of the optical recording layer 1 is attached to the long-length peeling material 35. On the other hand, in Fig. 8(b), in the same manner as in the state of Fig. 8(a), a plurality of the attached layered bodies 60 which have been subjected to the cutting process in advance are provided on one side of the long-length peeling material 34. surface. In Fig. 8(b), a long-length peeling material 34 is attached to the surface of the adhesive layer 2 side. Other peeling materials may be attached to the surface opposite to the side of the peeling materials 34 and 35 on the long side of the layered body 60, and other peeling materials may not be attached. In the state in which other peeling materials are attached, the shape is arbitrary, and it can be peeled off like a long rule. The materials 34 and 35 are used as long pieces, and a material for peeling corresponding to the shape of the layered body 60 may be attached. The productivity of the lamination process of the present embodiment is improved by using such an attached layered body 60. In addition, the attached layered body 60 shown in FIG. 8 has a loop shape including a through hole in the thickness direction at the center portion of the main surface in accordance with a general optical disc shape.

(4-2)在層積製程後而進行切斷製程之狀態 (4-2) The state of the cutting process after the stratification process

此外,在本實施形態,正如圖4(b)、圖5等而顯示的,可以在將無具有對應於基板12之形狀之狀態之附設層狀體33來層積於黏著層積體32(層積製程)之後,實施對於層積在前述黏著構造體31之附設層狀體33來切斷加工成為對應於基板12之形狀之切斷製程。 Further, in the present embodiment, as shown in FIG. 4(b), FIG. 5 and the like, the laminated body 33 may be laminated on the adhesive layer 32 without the shape corresponding to the shape of the substrate 12. After the lamination process, a cutting process in which the layered body 33 is laminated on the adhesive structure 31 and cut into a shape corresponding to the substrate 12 is performed.

在此時,黏著層積體32係已經具有對應於基板12之形狀,僅附設層狀體33可以成為切斷加工之加工對象,並且,附設層狀體33和黏著層積體32也可以成為切斷加工之加工對象。在後者之狀態,於切斷製程,附設層狀體33和黏著層積體32係同時進行切斷加工而成為對應於基板12之形狀。 At this time, the adhesive laminate 32 has a shape corresponding to the substrate 12, and only the layered body 33 can be processed as a cutting process, and the attached layered body 33 and the adhesive laminate 32 can also be formed. Cut the processed object. In the latter state, in the cutting process, the layered body 33 and the adhesive layered body 32 are simultaneously cut and formed to have a shape corresponding to the substrate 12.

在附設層狀體33和黏著層積體32同時進行切斷加工之狀態下,在黏著層積體32和基板12之間也存在單位層積體之狀態(作為具體例係正如圖3所示,在形成黏著層積體32之單位層積體11-3之下層來存在單位層積體11-1及11-2之狀態。),這些單位層積體(圖3之單位層積體11-1及11-2)係也可以同時進行切斷加工。在此時,在附設層狀體33也包含覆蓋層13之狀態下,覆蓋層13係也可以同時進行切斷加工。可以藉由像這樣,在層積製程後,實施切斷製程, 而以1次之切斷加工,來同時對於附設層狀體33、黏著構造體31、單位層積體11和覆蓋層13,進行切斷加工。 In the state in which the layered body 33 and the adhesive layered body 32 are simultaneously cut, the state of the unit laminate is also present between the adhesive layered body 32 and the substrate 12 (as a specific example, as shown in FIG. 3) The state in which the unit laminates 11-1 and 11-2 are present under the unit laminate 11-3 of the adhesive laminate 32 is formed.), these unit laminates (the unit laminate 11 of Fig. 3) -1 and 11-2) can also be cut at the same time. At this time, in a state in which the cover layer body 33 is also included in the cover layer 13, the cover layer 13 may be simultaneously cut. By doing this, after the stratification process, the cutting process can be performed. On the other hand, the cutting process is performed once, and the layered body 33, the adhesive structure 31, the unit laminated body 11, and the cover layer 13 are simultaneously cut.

以上說明之實施形態係為了容易理解本發明而進行記載,並非為了限定本發明而進行記載。因此,揭示於前述實施形態之各要素係也包含屬於本發明之技術範圍之全部之設計變更或均等物之宗旨。 The embodiments described above are described in order to facilitate the understanding of the present invention and are not intended to limit the present invention. Therefore, the various elements disclosed in the above-described embodiments are intended to encompass all of the design changes and equivalents of the technical scope of the invention.

【實施例】 [Examples]

在以下,藉由實施例等而更加具體地說明本發明,但是,本發明之範圍係並非限定於這些實施例等。圖6係由上面側(載置基台之基板之面側)開始觀看實施例1之多層光記錄媒體之概略俯視圖,顯示各層積製程之第1方向和第2方向。 In the following, the present invention will be more specifically described by way of examples, but the scope of the invention is not limited to the examples and the like. Fig. 6 is a schematic plan view of the multilayer optical recording medium of the first embodiment viewed from the upper side (the surface side of the substrate on which the substrate is placed), and shows the first direction and the second direction of each of the lamination processes.

[實施例1] [Example 1] (1)光記錄層之形成 (1) Formation of optical recording layer

混合100質量份之聚甲基甲基丙烯酸酯、10質量份之成為光色材料之1,3,3-三甲基吲哚滿基-6’-硝基苯并二氫吡喃、500質量份之乙酸乙酯和490質量份之甲苯,調製固態成分濃度10質量%之塗佈液。 100 parts by mass of polymethyl methacrylate, 10 parts by mass of 1,3,3-trimethylindanyl-6'-nitrochroman, 500 masses as a photochromic material A portion of the ethyl acetate and 490 parts by mass of toluene were prepared to prepare a coating liquid having a solid concentration of 10% by mass.

在作為第1剝離用材料之厚度50μm之聚乙烯對苯二甲酸酯薄膜(東洋紡織公司製、PET50A4100)之單面,藉由照相凹版印刷塗佈法而塗佈前述塗佈液,在90℃,進行1分鐘之乾燥,形成厚度2μm之光記錄層。 The coating liquid was applied to the single surface of a polyethylene terephthalate film (manufactured by Toyobo Co., Ltd., PET 50A4100) having a thickness of 50 μm as the material for the first peeling, by a gravure coating method. At ° C, drying was performed for 1 minute to form an optical recording layer having a thickness of 2 μm.

(2)黏著劑層之形成 (2) Formation of adhesive layer

將30質量份之n-丁基丙烯酸酯聚合物(BA;Mw =50萬),溶解於100質量份之乙酸乙酯,調製固態成分濃度30質量%之塗佈液。 30 parts by mass of n-butyl acrylate polymer (BA; Mw = 500,000), dissolved in 100 parts by mass of ethyl acetate to prepare a coating liquid having a solid concentration of 30% by mass.

在作為第2剝離用材料之厚度38μm之聚乙烯對苯二甲酸酯薄膜(Toray股份有限公司製、PET38T-100)之單面來設置矽酮剝離層而組成之剝離用材料之剝離面,藉由刮刀塗敷器而塗佈前述塗佈液,在90℃,進行1分鐘之加熱乾燥,形成厚度8μm之黏著劑層。 a peeling surface of a peeling material which is formed by providing an oxime release layer on one side of a polyethylene terephthalate film (manufactured by Toray Co., Ltd., PET38T-100) having a thickness of 38 μm as a material for the second peeling material, The coating liquid was applied by a knife coater and heated at 90 ° C for 1 minute . It was dried to form an adhesive layer having a thickness of 8 μm.

(3)附設層狀體之製作 (3) Production of attached layered body

藉由合併在前述(2)所形成之黏著劑層面和在前述(1)所形成之光記錄層面,以2條之橡膠壓輥,來進行壓合,而將包括以該順序來層積第1剝離用材料、光記錄層、黏著劑層和第2剝離用材料而組成之單位層積體之長尺之附設層狀體予以製作。 By combining the adhesive layer formed in the above (2) and the optical recording layer formed in the above (1), press-bonding is performed by two rubber press rolls, and the stacking is performed in this order. A layered body having a long length of a unit laminate composed of a material for peeling, an optical recording layer, an adhesive layer, and a second peeling material is produced.

(4)黏著構造體之製作 (4) Production of adhesive structure

在具有以鉛直方向來作為旋轉軸之旋轉機構之基台上,夾緊5英吋之光碟形狀之厚度為1mm之聚碳酸酯製之基板(帝人化成公司製),而向上地露出其一邊之面。在基板呈露出之面,使用相同於前述(2)之塗佈液之相同材料,進行塗佈乾燥,而設置厚度40μm之黏著劑層。接著,沿著一定之方向而搬送在前述(3)所得到之長尺之附設層狀體,剝離第1剝離用材料而露出光記錄層之一邊之面。接著,藉由將附設層狀體,貼附於基板,以橡膠壓輥,來擠壓(以主面內方向之張力換算而成為5kgf/m)相反於附設層狀體之基板之相反側之面,同時,移動於其面內方向之一邊,而貼合相反於基板 上之黏著劑層之基板之相反側之露出之面和光記錄層之面,來使得附設層狀體,層積於基板。像這樣而得到具有以該順序來層積基板、黏著劑層和單位層積體之構造之黏著構造體。此外,在該時間點,在最遠離於該黏著構造體之基板之最遠位置面,貼附第2剝離用材料。接著,裁斷長尺之附設層狀體而使得黏著層積體,具有稍微大於5英吋光碟形狀之稍微大形狀。 A substrate made of polycarbonate (manufactured by Teijin Chemicals Co., Ltd.) having a thickness of 1 mm in a disk shape of 5 mm is clamped on a base having a rotating mechanism as a rotating shaft in a vertical direction, and one side is exposed upward. surface. On the exposed surface of the substrate, the same material as the coating liquid of the above (2) is used for coating . It was dried to provide an adhesive layer having a thickness of 40 μm. Then, the attached layered body of the long length obtained in the above (3) is conveyed in a predetermined direction, and the first peeling material is peeled off to expose the side of one side of the optical recording layer. Then, the attached layered body is attached to the substrate, and is pressed by a rubber press roll (5 kgf/m in terms of the tension in the main surface direction), and is opposite to the opposite side of the substrate on which the layered body is attached. And simultaneously, moving on one side of the in-plane direction, and bonding the exposed surface opposite to the opposite side of the substrate of the adhesive layer on the substrate and the surface of the optical recording layer, so that the laminated layer is laminated on the substrate . In this manner, an adhesive structure having a structure in which a substrate, an adhesive layer, and a unit laminate are laminated in this order is obtained. Further, at this point of time, the second peeling material is attached to the farthest position surface of the substrate farthest from the adhesive structure. Next, the attached layered body of the long rule is cut so that the adhesive laminate has a slightly larger shape slightly larger than the 5-inch disc shape.

(5)第1層積製程 (5) The first layer process

此外,在實施例1,將使用前述設定方法1之前述公式(I)而設定之應力間角度予以設定。為了使得應力間角度R,成為45°,因此,對於設置得到之黏著構造體之基台,由上面側開始觀看,沿著逆時針方向,來旋轉45°。也就是說,控制第2方向38。接著,剝離貼附於黏著構造體之最上面之第2剝離用材料而露出黏著劑層之一邊之面。另一方面,正如前面之敘述,沿著一定之方向而搬送製造之長尺之附設層狀體,剝離第1剝離用材料而露出光記錄層之一邊之面。接著,貼合露出黏著構造體之黏著劑層之面和露出附設層狀體之記錄層之面,在黏著構造體,貼合附設層狀體。接著,藉由以橡膠壓輥,來擠壓該附設層狀體之第2剝離用材料側之面,同時,移動於其面內方向之一邊,而壓合附設層狀體和黏著構造體,得到在黏著構造體來層積附設層狀體之層積體。在此,前述橡膠壓輥之移動方向係相同於前述(2)。 Further, in the first embodiment, the inter-stress angle set using the above formula (I) of the above-described setting method 1 is set. In order to make the inter-stress angle R 45°, the base of the provided adhesive structure is rotated by 45° in the counterclockwise direction as viewed from the upper side. That is, the second direction 38 is controlled. Next, the second peeling material attached to the uppermost surface of the adhesive structure is peeled off to expose the side of one side of the adhesive layer. On the other hand, as described above, the attached layered body of the long length to be manufactured is conveyed in a predetermined direction, and the first peeling material is peeled off to expose the side of one side of the optical recording layer. Next, the surface of the adhesive layer on which the adhesive structure is exposed is exposed and the surface of the recording layer on which the laminated layer is attached is exposed, and the laminated structure is bonded to the adhesive structure. Then, the surface of the second release material side of the layered body is pressed by a rubber press roll, and the layered body and the adhesive structure are press-fitted by moving one side of the in-plane direction. A laminate in which a layered body is laminated in an adhesive structure is obtained. Here, the moving direction of the rubber pressure roller is the same as (2) above.

結果,成為根據藉由該第1層積製程而賦予附設層狀體之外力來具有之拉伸應力之主面內方向之第1方向(在圖6之37-1)係相對於成為該層積製程之黏著層積體來具有之拉伸應 力之主面內方向之第2方向(在圖6之38-1),由上面側(載置基台之基板之面側)開始觀看,沿著順時針方向而成為45°之角度。像這樣,使得該層積製程之附設層狀體相對於黏著層積體之應力間角度R,成為45°(由上面開始觀看而使得順時針方向成為正值。)。接著,裁斷長尺之附設層狀體而使得到之層積體,具有稍微大於5英吋光碟形狀之稍微大形狀。 As a result, the first direction (37-1 in FIG. 6) of the main in-plane direction of the tensile stress which is provided by the external force applied to the layered body by the first lamination process is relative to the layer. Adhesive laminate of the integrated process The second direction in the direction of the main surface of the force (38-1 in Fig. 6) is viewed from the upper side (the surface side of the substrate on which the base is placed), and becomes an angle of 45° in the clockwise direction. In this manner, the inter-stress angle R of the laminated layered body of the lamination process with respect to the adhesive laminate is 45° (the clockwise direction becomes a positive value when viewed from above). Next, the attached layered body of the long rule is cut so that the laminated body has a slightly larger shape slightly larger than the 5-inch disc shape.

將由以上說明之基台之旋轉(方向控制製程)、附設層狀體和黏著構造體之貼附(貼附製程)以及附設層狀體之壓合(施加製程)而組成之一連串之製程,稱為第1層積製程。 A series of processes consisting of the rotation of the base (the direction control process), the attaching of the layered body and the adhesive structure (attachment process), and the lamination (application process) of the layered body are described. For the first layer of the process.

(6)第2至第6層積製程 (6) 2nd to 6th stacking process

藉由第1層積製程之實施,而得到在基板上按照該順序來配置黏著劑層和2層之單位層積體而組成之層積體。此外,在最遠離於該層積體之基板之最遠位置面,貼附第2剝離用材料。接著,為了使得應力間角度R,成為45°,因此,在對於基台而由上面側開始觀看且沿著逆時針方向來旋轉45°之後,以該層積體,作為黏著構造體,剝離貼附於黏著構造體之第2剝離用材料,相同於第1層積製程,沿著一定之方向而搬送長尺之附設層狀體,剝離貼附於附設層狀體之第1剝離用材料,在黏著構造體,貼合附設層狀體,並且,進行藉由壓輥之擠壓而造成之壓合。將該一連串之製程,稱為第2層積製程,將隨後接著進行之層積製程,稱為第3層積製程和第4層積製程。此外,即使不論是關於任何一種之層積製程,也在結束後,裁斷長尺之附設層狀體。 By the implementation of the first lamination process, a laminate in which the adhesive layer and the two-layer unit laminate are arranged in this order on the substrate is obtained. Further, the second peeling material is attached to the farthest position surface of the substrate farthest from the laminate. Then, in order to make the inter-stress angle R 45°, after the base is viewed from the upper side and rotated 45° in the counterclockwise direction, the laminated body is used as the adhesive structure. The second peeling material attached to the adhesive structure is the same as the first layering process, and the attached layered body is conveyed along a predetermined direction, and the first peeling material attached to the attached layered body is peeled off. In the adhesive structure, a layered body is attached and attached, and press-bonding by pressing of a press roll is performed. This series of processes, referred to as the second layering process, will be followed by the stratification process, referred to as the third stack process and the fourth stack process. In addition, even if it is about any one of the lamination processes, after the end, the attached layered body of the long rule is cut.

第2層積製程之結果係由上面側開始觀看,成為 根據賦予第2層積製程之附設層狀體之外力來具有之拉伸應力之主面內方向之第1方向(在圖6之37-2)和第2層積製程之黏著層積體來具有之拉伸應力之主面內方向之第2方向(在圖6之38-2)之間之應力間角度R,成為45°。 The result of the second layer process is viewed from the top side and becomes According to the first direction of the in-plane direction of the tensile stress (37-2 in FIG. 6) and the adhesion layer of the second lamination process, which are given to the external layer of the second lamination process, The inter-stress angle R between the second direction (38-2 in Fig. 6) of the main surface in the tensile stress is 45°.

相同於第2層積製程,持續地實施第3層積製程至第6層積製程。結果,由上面側開始觀看,在第1層積製程來層積之單位層積體而具有之拉伸應力之主面內方向(在圖6之37-1)相對於成為根據賦予第5層積製程之附設層狀體之外力來具有之拉伸應力之主面內方向之第1方向(在圖6之37-5)之角度係成為180°。此外,成為根據賦予第6層積製程之附設層狀體之外力來具有之拉伸應力之主面內方向之第1方向(在圖6之37-6)相對於最接近於基板之最接近位置之單位層積體來具有之拉伸應力之主面內方向(在圖6之37-1)之角度係成為270°。此外,在圖6,由第4層積製程至第7層積製程之第1方向(37-4至37-7)係由容易看見之觀點來看的話,則關於其方向而無進行顯示(省略箭號),但是,分別顯示於38-1、37-1至37-3之第1方向和平行於方向之方向係成為相反。 The third layer process is continuously performed to the sixth layer process in the same manner as the second layer process. As a result, the main in-plane direction (37-1 in FIG. 6) of the tensile stress which is laminated in the unit stacking process in the first layering process, as viewed from the upper side, is given to the fifth layer. The angle of the first direction (37-5 in Fig. 6) of the direction in which the tensile force is applied to the main surface of the tensile stress is 180°. In addition, the first direction (37-6 in FIG. 6) of the main in-plane direction of the tensile stress which is provided by the force applied to the external layered body of the sixth layering process is the closest to the closest to the substrate. The angle of the main in-plane direction of the tensile stress (the 37-1 in Fig. 6) of the unit laminate of the position is 270°. Further, in Fig. 6, the first direction (37-4 to 37-7) from the fourth layering process to the seventh layering process is displayed from the viewpoint of easy visibility, and the direction is not displayed ( The arrow is omitted, but the first direction shown in 38-1, 37-1 to 37-3, and the direction parallel to the direction are opposite.

(7)第7層積製程 (7) 7th layer process

由藉著第6層積製程而得到之黏著構造體(層積基板、黏著劑層和7層之單位層積體而組成,在最遠離於基板之最遠位置側之面,還貼附第2剝離用材料。),來剝離第2剝離用材料,露出在第6層積製程來層積之單位層積體之黏著劑層之面。另一方面,準備由成為厚度78μm之聚碳酸酯薄膜 且在某一邊之面來施行電暈處理(帝人股份有限公司製、Pureace)之塑膠薄膜而組成之覆蓋層,來作為附設層狀體。在由上面側開始觀看而沿著逆時針方向來旋轉黏著層積體45°之後,在黏著構造體,貼附覆蓋層而貼合黏著構造體之黏著劑層之露出之面和覆蓋層之進行電暈處理之面。在此時,在覆蓋層,無賦予特別之張力。在以下,進行藉由相同於第1層積製程之同樣之壓輥加壓而造成之壓合。結果,在最接近於基板之最接近位置之單位層積體來具有之拉伸應力之主面內方向(在圖6之38-1)相對於成為根據賦予覆蓋層之外力來具有之拉伸應力之主面內方向之第1方向(在圖6之37-7)之角度係成為-45°。 It consists of an adhesive structure (a laminated substrate, an adhesive layer, and a 7-layer unit laminate) obtained by the sixth layering process, and is attached to the surface farthest from the substrate. (2) The material for peeling is used to peel off the second peeling material, and the surface of the adhesive layer of the unit laminate laminated in the sixth layering process is exposed. On the other hand, a polycarbonate film having a thickness of 78 μm is prepared. On the other side, a cover layer composed of a corona film (Pureace made by Teijin Co., Ltd., Pureace) was applied as a layered body. After the adhesive laminate is rotated in the counterclockwise direction by 45° from the upper side, the exposed surface of the adhesive structure is attached to the adhesive structure, and the exposed surface of the adhesive layer and the cover layer are bonded to the adhesive structure. The surface of corona treatment. At this time, no special tension is imparted to the cover layer. In the following, press-bonding is performed by pressurization of the same press roll which is the same as the first lamination process. As a result, the main in-plane direction (38-1 in Fig. 6) of the tensile stress which is present in the unit laminated body closest to the closest position of the substrate is relative to the stretching which is based on the force applied to the covering layer. The angle of the first direction (37-7 in Fig. 6) of the direction of the main surface of the stress is -45.

(8)切斷製程 (8) cutting process

藉由以上說明之製程之實施,而得到按照該順序來層積基板、黏著劑層、7層之單位層積體和覆蓋層而組成之層積構造體。對於該層積構造體,進行沖裁加工,切斷成為5英吋之光碟形狀。 By the above-described process, a laminated structure composed of a substrate, an adhesive layer, a seven-layer unit laminate, and a cover layer in this order is obtained. The laminated structure was subjected to punching and cut into a disc shape of 5 inches.

結果,總括地切斷加工7層之單位層積體和覆蓋層之外徑,得到多層光記錄媒體。 As a result, the unit laminate of the seven layers and the outer diameter of the cover layer were collectively cut to obtain a multilayer optical recording medium.

該多層光記錄媒體係層積構造體之單位層積體和覆蓋層之總數n成為8,各個之第1方向相對於第2方向之應力間角度R係45°,因此,滿足前述公式(I)。 In the multilayer optical recording medium, the total number n of the unit laminated body and the covering layer of the laminated structure is 8, and each of the first directions is 45° with respect to the inter-stress angle R in the second direction. Therefore, the above formula (I) is satisfied. ).

[實施例2] [Embodiment 2] (1)光記錄層之形成 (1) Formation of optical recording layer

混合100質量份之聚甲基甲基丙烯酸酯、10質量 份之成為光色材料之1,3,3-三甲基吲哚滿基-6’-硝基苯并二氫吡喃、500質量份之乙酸乙酯和490質量份之甲苯,調製固態成分濃度10質量%之塗佈液。 Mix 100 parts by mass of polymethyl methacrylate, 10 mass a 1,3,3-trimethylindanyl-6'-nitrochroman, 500 parts by mass of ethyl acetate and 490 parts by mass of toluene as a photochromic material to prepare a solid component A coating liquid having a concentration of 10% by mass.

在作為第1剝離用材料之厚度50μm之聚乙烯對苯二甲酸酯薄膜(東洋紡織公司製、PET50A4100)之單面,藉由照相凹版印刷塗佈法而塗佈前述塗佈液,在90℃,進行1分鐘之乾燥,形成厚度2μm之光記錄層。 The coating liquid was applied to the single surface of a polyethylene terephthalate film (manufactured by Toyobo Co., Ltd., PET 50A4100) having a thickness of 50 μm as the material for the first peeling, by a gravure coating method. At ° C, drying was performed for 1 minute to form an optical recording layer having a thickness of 2 μm.

(2)黏著劑層之形成 (2) Formation of adhesive layer

將30質量份之n-丁基丙烯酸酯聚合物(BA;Mw=50萬),溶解於100質量份之乙酸乙酯,調製固態成分濃度30質量%之塗佈液。 30 parts by mass of n-butyl acrylate polymer (BA; Mw = 500,000) was dissolved in 100 parts by mass of ethyl acetate to prepare a coating liquid having a solid concentration of 30% by mass.

在作為第2剝離用材料之厚度38μm之聚乙烯對苯二甲酸酯薄膜(Toray股份有限公司製、PET38T-100)之單面來設置矽酮剝離層而組成之剝離用材料之剝離面,藉由刮刀塗敷器而塗佈前述塗佈液,在90℃,進行1分鐘之加熱乾燥,形成厚度8μm之黏著劑層。 a peeling surface of a peeling material which is formed by providing an oxime release layer on one side of a polyethylene terephthalate film (manufactured by Toray Co., Ltd., PET38T-100) having a thickness of 38 μm as a material for the second peeling material, The coating liquid was applied by a knife coater and heated at 90 ° C for 1 minute . It was dried to form an adhesive layer having a thickness of 8 μm.

(3)能量射線硬化型黏接著劑用塗佈液之形成 (3) Formation of coating liquid for energy ray hardening type adhesive

在以固態成分濃度來包含30重量%之丙烯酸n-丁基/丙烯酸共聚物(組成重量比80/20)之乙酸乙酯溶液,相對於前述共聚物中之丙烯酸成分100當量而添加30當量之2-甲基丙烯醯氧基乙基異氰酸酯,在氮氛圍下,進行48小時之反應,得到成為能量硬化性官能基之甲基丙烯醯基之平均側鏈導入率為9.2莫爾%且重量平均分子量為大約85萬之能量硬化型共聚物之溶液(A)。 30 parts by weight of an ethyl acetate solution containing 30% by weight of an n-butyl/acrylic acid copolymer of acrylic acid (composition weight ratio of 80/20) in a solid content concentration, relative to 100 equivalents of the acrylic acid component in the copolymer 2-Methyl propylene methoxyethyl isocyanate was reacted under a nitrogen atmosphere for 48 hours to obtain an average side chain introduction ratio of methacryl oxime group which is an energy hardening functional group of 9.2 mol% and a weight average A solution (A) of an energy hardening type copolymer having a molecular weight of about 850,000.

相對於100重量份之該能量硬化型共聚物溶液(A),加入作為光聚合起始劑之低(2-羥基-2-甲基-1-[4-(1-丙烯基)苯基]丙烷)(Lamberti spa公司製、商品名稱「ESCURE KIP150」)之3.0重量份以及作為交聯劑之異氰酸酯系交聯劑(東洋油墨製造公司製、商品名稱「Oribain BPS-8515」)之1.0重量份,調製能量射線硬化型黏接著劑之塗佈液。 To the low energy (2-hydroxy-2-methyl-1-[4-(1-propenyl)phenyl) as a photopolymerization initiator, relative to 100 parts by weight of the energy-hardening copolymer solution (A) 3.0 parts by weight of propane) (product name "ESCURE KIP150" manufactured by Lamberti Spa Co., Ltd.) and 1.0 part by weight of an isocyanate crosslinking agent (manufactured by Toyo Ink Co., Ltd., trade name "Oribain BPS-8515") as a crosslinking agent A coating liquid for modulating an energy ray-curable adhesive.

(4)單位層積體之製作 (4) Production of unit laminate

在前述(1)來形成之光記錄層面,藉由刮刀塗敷器而塗佈前述(3)來調製之塗佈液,在90℃,進行1分鐘之加熱乾燥,形成由能量射線硬化型黏接著劑而組成之層(在本說明書,也稱為「未硬化層」。)。未硬化層之厚度係20μm。 In the optical recording layer formed in the above (1), the coating liquid prepared by the above (3) is applied by a doctor blade applicator, and heated at 90 ° C for 1 minute . It is dried to form a layer composed of an energy ray-curable adhesive (also referred to as "unhardened layer" in the present specification). The thickness of the uncured layer is 20 μm.

接著,在相反於該未硬化層之光記錄層之相反側之露出之面,藉由刮刀塗敷器而塗佈在前述(1)來調製之光記錄層用之塗佈液,在90℃,進行1分鐘之乾燥,形成厚度2μm之光記錄層。 Next, the coating liquid for the optical recording layer prepared in the above (1) is applied by a doctor applicator on the exposed side opposite to the opposite side of the optical recording layer of the uncured layer, at 90 ° C. Drying was performed for 1 minute to form an optical recording layer having a thickness of 2 μm.

接著,藉由合併像這樣得到之光記錄層面和在前述(2)所形成之黏著劑層面,以2條之橡膠壓輥,來進行壓合,而將包括層積光記錄層和黏著劑層來組成之單位層積體之長尺之層積體予以製作。 Next, by combining the optical recording layer thus obtained and the adhesive layer formed in the above (2), press-bonding is performed by two rubber press rolls, and the laminated optical recording layer and the adhesive layer are included. The laminate of the long-length unit of the unit laminate is composed.

對於像這樣製作之層積體,由其第1剝離用材料側開始,使用高壓水銀燈(EYE GRAPHICS公司製、高壓水銀燈),照射500mJ/cm2光量之紫外線,將未硬化層予以硬化,得到圖7所示之按照該順序而層積第1剝離用材料51、光記錄層52、 支持層53、光記錄層54、黏著劑層55和第2剝離用材料56來組成之附設層狀體50。 In the laminate produced in this manner, a high-pressure mercury lamp (manufactured by EYE GRAPHICS Co., Ltd., a high-pressure mercury lamp) was used, and ultraviolet rays of a light amount of 500 mJ/cm 2 were irradiated to cure the uncured layer. The laminated layered body 50 composed of the first peeling material 51, the optical recording layer 52, the support layer 53, the optical recording layer 54, the adhesive layer 55, and the second peeling material 56 is laminated in this order. .

(5)應力間角度之設定 (5) Setting the angle between stresses

在藉由前述方法而製造之附設層狀體,還在本實施例,使用由成為厚度78μm之聚碳酸酯薄膜且在某一邊之面來施行電暈處理(帝人股份有限公司製、Pureace)之塑膠薄膜而組成之覆蓋層。因此,包含於這些之5個附設層狀體和覆蓋層之全部之硬質層之厚度總和係198μm(=(2+20+2)×5+78)。此外,包含於使用這些附設層狀體而製造之層積構造體之各附設層狀體之硬質層之總厚度係在附設層狀體由單位層積體而組成之狀態下,成為24μm(=2+20+2),在附設層狀體由覆蓋層而組成之狀態下,成為78μm。 In the present embodiment, a corrugated film (Pureace made by Teijin Co., Ltd., manufactured by Teijin Co., Ltd.) was used on the side of one side of the polycarbonate film having a thickness of 78 μm. A cover layer composed of a plastic film. Therefore, the total thickness of the hard layers included in all of the five attached layered bodies and the cover layer is 198 μm (= (2+20 + 2) × 5 + 78). In addition, the total thickness of the hard layer of each of the laminated layer bodies which are included in the laminated structure produced by using these laminated layered bodies is 24 μm in a state in which the laminated layered body is composed of a unit laminated body (= 2+20+2) is 78 μm in a state in which the layered body is composed of a coating layer.

因此,就第2至第5單位層積體而言,使用前述設定方法2之前述公式(Ⅱ),設定層積於各個之下層之第1至第4單位層積體之任何一個之間之應力間角度,結果,由第2至第5單位層積體為止之應力間角度係成為21.8°(=(180×(24+24)/2/198))。同樣地,覆蓋層和第5單位層積體之應力間角度係成為46.4°=(180×(78+24)/2/198))。 Therefore, the second to fifth unit laminates are stacked between any of the first to fourth unit laminates of the respective lower layers by using the above formula (II) of the above-described setting method 2. As a result of the inter-stress angle, the angle between the stresses from the second to fifth unit laminates was 21.8° (= (180 × 24 + 24) / 2 / 198)). Similarly, the angle between stresses of the cover layer and the fifth unit laminate is 46.4° = (180 × (78 + 24) / 2 / 198)).

(6)層積構造體之製作 (6) Production of laminated structure

使用藉由前述(5)而設定之應力間角度,相同於實施例1,設定基台之旋轉角度,同時,進行第2至第6層積製程,製作層積構造體,在最後,進行切斷製程,製作多層光記錄媒體。 Using the inter-stress angle set by the above (5), the rotation angle of the base is set in the same manner as in the first embodiment, and the second to sixth lamination processes are performed to form a laminated structure, and finally, the cutting is performed. The process is interrupted to produce a multilayer optical recording medium.

[實施例3] [Example 3] (1)黏著構造體之製作 (1) Production of adhesive structure

在具有以鉛直方向來作為旋轉軸之旋轉機構之基台上,夾緊5英吋之光碟形狀之厚度為1mm之聚碳酸酯製之基板(帝人化成公司製),而向上地露出其一邊之面。藉著由在實施例1來製作之長尺之附設層狀體開始,剝離第2剝離用材料而露出黏著劑層之一邊之面,將該面貼附於基板,以橡膠壓輥,來擠壓(以主面內方向之張力換算而成為5kgf/m)相反於附設層狀體之基板之相反側之面,同時,移動於其面內方向之一邊,而使得附設層狀體,層積於基板。像這樣而得到以該順序來層積基板和作為黏著層積體之附設層狀體之黏著構造體。此外,剝離在最遠離於該黏著構造體之基板之最遠位置面之第1剝離用材料。接著,裁斷長尺之附設層狀體而使得黏著層積體,具有稍微大於5英吋光碟形狀之稍微大形狀。 A substrate made of polycarbonate (manufactured by Teijin Chemicals Co., Ltd.) having a thickness of 1 mm in a disk shape of 5 mm is clamped on a base having a rotating mechanism as a rotating shaft in a vertical direction, and one side is exposed upward. surface. The second peeling material was peeled off by exposing the surface of one side of the adhesive layer, and the surface was attached to the substrate, and the rubber was pressed by a rubber press roll, starting from the layered body attached to the long ruler produced in Example 1. The pressure (5 kgf/m in terms of the tension in the direction of the main surface) is opposite to the surface on the opposite side of the substrate on which the layered body is attached, and is moved to one side of the in-plane direction, so that the layered body is laminated and laminated. On the substrate. In this way, an adhesive structure in which the substrate and the layered body as the adhesive laminate are laminated in this order are obtained. Further, the first peeling material which is the farthest position from the substrate of the adhesive structure is peeled off. Next, the attached layered body of the long rule is cut so that the adhesive laminate has a slightly larger shape slightly larger than the 5-inch disc shape.

(2)第1層積製程 (2) The first layer process

接著,相同於實施例1,為了使得應力間角度R,成為45°,因此,對於設置在前面之敘述來得到之黏著構造體之基台,沿著逆時針方向,來旋轉45°。接著,正如前面之敘述,沿著一定之方向而搬送製造之長尺之附設層狀體,剝離第2剝離用材料而露出黏著劑層之一邊之面。接著,貼合露出黏著構造體之光記錄層之面和露出附設層狀體之黏著劑層之面,在黏著構造體,貼合附設層狀體。接著,藉由以橡膠壓輥,來擠壓該附設層狀體之第1剝離用材料側之面,同時,移動於其面內方向之一邊,而壓合附設層狀體和黏著構造體,得到在黏著構造體來層積附設層狀體之層積體。在此,前述橡膠壓輥 之移動方向係相同於製作前述黏著構造體之際之橡膠壓輥之移動方向。藉由該第1層積製程之實施,而得到在基板上按照該順序來配置2層之單位層積體而組成之層積體。 Next, in the same manner as in the first embodiment, in order to make the inter-stress angle R 45°, the base of the adhesive structure obtained in the foregoing description is rotated by 45° in the counterclockwise direction. Next, as described above, the attached layered body of the long length to be manufactured is conveyed in a predetermined direction, and the second peeling material is peeled off to expose the side of one side of the adhesive layer. Next, the surface of the optical recording layer on which the adhesive structure is exposed is exposed and the surface of the adhesive layer on which the layered body is attached is exposed, and the laminated structure is bonded to the adhesive structure. Then, the surface of the first release material side of the layered body is pressed by a rubber press roll, and the layered body and the adhesive structure are press-fitted by moving one side of the in-plane direction. A laminate in which a layered body is laminated in an adhesive structure is obtained. Here, the aforementioned rubber pressure roller The moving direction is the same as the moving direction of the rubber pressure roller at the time of fabricating the aforementioned adhesive structure. By the implementation of the first layering process, a laminate in which two unit unit layers are arranged in this order on the substrate is obtained.

接著,剝離最遠離於該黏著構造體之基板之最遠位置面之第1剝離用材料。然後,裁斷長尺之附設層狀體而使得切斷後之附設層狀體,具有大於碟片形狀之形狀。 Next, the first peeling material which is farthest from the surface of the substrate of the adhesive structure is peeled off. Then, the attached layered body of the long rule is cut so that the attached layered body after cutting has a shape larger than the shape of the disk.

(3)第2層積製程至第6層積製程 (3) 2nd stack process to 6th stack process

接著,相同於前述第1層積製程而裁斷由第2層積製程至第6層積製程以及各層積製程後之長尺之附設層狀體。 Next, the attached layered body from the second layering process to the sixth layering process and the long length after each layering process is cut in the same manner as the first layering process.

(4)第7層積製程 (4) 7th layer process

使用相同於前述黏著劑層之塗佈液之相同材料,在第2剝離用材料之剝離面,藉由刮刀塗敷器而塗佈前述塗佈液,在90℃,進行1分鐘之加熱乾燥,形成厚度40μm之黏著劑層。另一方面,準備由成為厚度78μm之聚碳酸酯薄膜且在某一邊之面來施行電暈處理之塑膠薄膜(帝人股份有限公司製、Pureace)而組成之覆蓋層。貼附由前述黏著劑層和第2剝離用材料而組成之層積體之黏著劑層側之面以及準備之覆蓋層之施行電暈處理之面。接著,藉由以2條之橡膠壓輥,來壓合以該貼附而得到之層積體,來得到在由黏著劑層和覆蓋層而組成之附設層狀體來貼附第2剝離用材料之層積體。 Using the same material as the coating liquid of the above-mentioned adhesive layer, the coating liquid was applied to the peeling surface of the second peeling material by a knife coater, and heated at 90 ° C for 1 minute . It was dried to form an adhesive layer having a thickness of 40 μm. On the other hand, a cover layer composed of a plastic film (Pureace made by Teijin Co., Ltd.) which is a polycarbonate film having a thickness of 78 μm and which is subjected to corona treatment on one side is prepared. The surface on the side of the adhesive layer of the laminate composed of the pressure-sensitive adhesive layer and the second release material and the surface on which the prepared cover layer was subjected to corona treatment were attached. Then, the laminated body obtained by the attachment is press-bonded by two rubber press rolls to obtain the attached layered body composed of the adhesive layer and the cover layer, and the second peeling is attached. A layer of material.

接著,由藉著前述第6層積製程而得到之黏著構造體(層積基板和7層之單位層積體而組成,在最遠離於基板之最遠位置側之面,貼附第1剝離用材料。),來剝離第1剝離用材料, 露出在第6層積製程來層積之單位層積體之光記錄層側之面。接著,由上面側開始觀看而沿著逆時針方向,來旋轉黏著層積體45°。 Then, the adhesive structure (the laminated substrate and the unit laminate of 7 layers) which are obtained by the above-described sixth stacking process are formed, and the first peeling is attached to the surface farthest from the substrate. Using the material.), to peel off the first peeling material, The surface on the side of the optical recording layer of the unit laminate laminated in the sixth laminate process is exposed. Next, the adhesive laminate 45° was rotated in the counterclockwise direction from the upper side.

然後,剝離貼附於包括前述覆蓋層之附設層積體之第2剝離用材料,在黏著構造體,貼合附設層狀體,而貼合露出之附設層積體之黏著劑層側之面和最遠離於黏著構造體之基板之最遠位置面。在此時,在包括覆蓋層之附設層積體,無賦予特別之張力。在以下,相同於第1層積製程而對於層積在黏著構造體之附設層積體之覆蓋層側之面來進行。 Then, the second peeling material attached to the laminated body including the cover layer is peeled off, and the adhesive layer is bonded to the adhesive structure, and the exposed adhesive layer side surface is bonded to the exposed laminated body. And the farthest position of the substrate farthest from the adhesive structure. At this time, no special tension is imparted to the attached laminate including the cover layer. In the following, the first laminate process is performed on the surface of the cover layer side of the laminated body to which the adhesive structure is laminated.

(5)切斷製程 (5) cutting process

藉由以上之製程之實施,而得到按照該順序來層積基板、7層之單位層積體、黏著劑層和覆蓋層而組成之層積構造體。對於該層積構造體,進行沖裁加工,切斷成為5英吋之光碟形狀,得到多層光記錄媒體。 By the above process, a laminated structure composed of a substrate, a 7-layer unit laminate, an adhesive layer, and a cover layer in this order is obtained. This laminated structure was punched and cut into a disk shape of 5 inches to obtain a multilayer optical recording medium.

藉由以上之製造方法而製作之多層光記錄媒體係也相同於實施例1之多層光記錄媒體,將使用設定方法1之前述公式(I)而設定之應力間角度予以設定。也就是說,層積構造體之單位層積體和覆蓋層之總數n係成為8,各個之間之應力間角度R1係45°。 The multilayer optical recording medium produced by the above manufacturing method is also the same as the multilayer optical recording medium of the first embodiment, and the inter-stress angle set using the above formula (I) of the setting method 1 is set. That is, the total number n of the unit laminated body and the covering layer of the laminated structure is 8, and the inter-stress angle R 1 between each is 45°.

[實施例4] [Example 4]

除了在層積製程之前而進行切斷製程以外,其餘係相同於實施例2而製造多層光記錄媒體。具體地說,剝離附設層狀體之第1剝離用材料,由露出之光記錄層側,進行沖裁加工,僅將光記錄層、支持層和光記錄層,切斷加工成為5英 吋之光碟形狀。藉此而使得預先進行切斷加工來成為具有5英吋光碟形狀之附設層狀體(具有按照該順序而層積光記錄層、支持層和光記錄層之構造),得到設置於第2剝離用材料之一邊之面之附設層狀體。使用得到之附設層狀體,藉由相同於實施例2之同樣之應力間角度而實施層積製程,製作層積構造體,製作多層光記錄媒體。 A multilayer optical recording medium was produced in the same manner as in Example 2 except that the cutting process was carried out before the lamination process. Specifically, the first peeling material in which the layered body is attached is peeled off from the exposed light recording layer side, and only the optical recording layer, the support layer, and the optical recording layer are cut into 5 inches. The shape of the disc. By this, the cutting process is performed in advance to form an attached layered body having a 5-inch disc shape (having a structure in which the optical recording layer, the support layer, and the optical recording layer are laminated in this order), and is provided for the second peeling. A layered body is attached to one side of the material. Using the obtained layered body, a lamination process was carried out by the same inter-stress angle as in Example 2, and a laminated structure was produced to produce a multilayer optical recording medium.

[比較例1] [Comparative Example 1]

除了無進行應力間角度之設定,全部藉由相同之應力間角度而進行層積製程以外,其餘係藉由實施相同於實施例1之製造方法而製造多層光記錄媒體。也就是說,應力間角度R係0°。 A multilayer optical recording medium was produced by performing the same manufacturing method as in Example 1 except that the angle between the stresses was not set, and the lamination process was performed by the same inter-stress angle. That is to say, the angle R between stresses is 0°.

(試驗例1)彎曲之評價 (Test Example 1) Evaluation of bending

對於實施例之多層光記錄媒體以及比較例之多層光記錄媒體,藉由膜厚測定器(Cores公司製、Core9930a)而確認碟片之傾斜。如果是滿足輻射傾斜為±6°且切線傾斜為±3°的話,則判定無發生彎曲,如果是無滿足的話,則判定發生彎曲。 With respect to the multilayer optical recording medium of the example and the multilayer optical recording medium of the comparative example, the inclination of the disc was confirmed by a film thickness measuring instrument (Core9930a manufactured by Cores). If the radiation tilt is ±6° and the tangential tilt is ±3°, it is judged that no bending has occurred, and if it is not satisfied, it is judged that the bending has occurred.

將評價之結果,顯示於表1。 The results of the evaluation are shown in Table 1.

【產業上之可利用性】[Industrial Availability]

本發明係有用地生產彎曲少之多層光記錄媒體。 The present invention is useful for producing a multilayer optical recording medium having less curvature.

11-1、11-2、11-3、11-4‧‧‧單位層積體 11-1, 11-2, 11-3, 11-4‧‧‧ unit layer

12‧‧‧基板 12‧‧‧Substrate

31‧‧‧黏著構造體 31‧‧‧Adhesive structures

32‧‧‧黏著層積體 32‧‧‧Adhesive laminate

32a‧‧‧相反於黏著層積體32之基板12之相反側之面 32a‧‧‧ opposite to the opposite side of the substrate 12 of the adhesive laminate 32

33‧‧‧附設層狀體 33‧‧‧With layered body

33a‧‧‧對向於單位層積體11-4之黏著層積體32之側之面 33a‧‧‧ facing the side of the adhesive laminate 32 of the unit laminate 11-4

33b‧‧‧相反於單位層積體11-4之面33a之相反側之面 33b‧‧‧ opposite to the opposite side of the face 33a of the unit laminate 11-4

34、35‧‧‧剝離用材料 34, 35‧‧‧ peeling materials

Claims (11)

一種多層光記錄媒體之製造方法,使得至少包括黏著劑層和光記錄層之單位層積體在基板之一邊之面來層積複數個並且將於層積在最遠離於前述基板之最遠位置側之前述單位層積體來形成覆蓋層而組成之層積構造體予以包括,其特徵在於:包括:由包括前述基板和至少一個之前述單位層積體之黏著構造體之前述基板開始,在成為位處於最遠位置側之前述單位層積體之黏著層積體側之面,層積前述單位層積體和前述覆蓋層以及由這些層積體而組成之群組來選出之附設層狀體,同時,成為使得層積於前述黏著構造體之前述附設層狀體來具有拉伸應力之狀態之層積製程;該層積製程係包括:將前述附設層狀體來貼附於前述黏著構造體之貼附製程;在前述附設層狀體來賦予外力之施加製程;以及控制藉由該施加製程而在前述附設層狀體來賦予外力之方向之方向控制製程;前述方向控制製程係控制外力來賦予至前述附設層狀體之方向,而使得成為起因於層積在前述黏著構造體之前述附設層狀體之前述外力來造成之拉伸應力之主面內成分之方向之第1方向相對於成為前述黏著層積體具有之拉伸應力之主面內成分之方向之第2方向之應力間角度R,成為0°超過、120°以內之製程。 A method of manufacturing a multilayer optical recording medium, wherein a unit laminate including at least an adhesive layer and an optical recording layer is laminated on a side of one side of a substrate and is to be laminated on a farthest side farthest from the substrate The laminated structure comprising the unit layer formed by forming the coating layer, comprising: the substrate comprising the adhesive structure including the substrate and the at least one unit laminate; a layered body selected from the group consisting of the unit laminate and the cover layer and the group of the laminates on the side of the adhesive layered body of the unit laminate on the farthest position side And at the same time, a lamination process for laminating the attached layered body of the adhesive structure to have a tensile stress; the lamination process includes attaching the attached layered body to the adhesive structure a process for attaching a body; an application process for applying an external force to the layered body; and controlling a direction in which the external layer is applied to the layered body by the application process To the control process, the direction control process controls the external force to be applied to the direction in which the layered body is attached, so that the tensile stress is caused by the external force of the attached layered body laminated on the adhesive structure. The first direction of the direction of the component in the main surface is equal to or less than 120° with respect to the inter-stress angle R in the second direction which is the direction of the component in the main surface of the tensile stress of the adhesive layer. . 如申請專利範圍第1項之多層光記錄媒體之製造方法,其中,前述施加製程係在前述貼附製程之實施前、實施中和 實施後之至少任何一種,對於前述附設層狀體,來賦予由張力和擠壓力之至少一種而組成之外力之製程。 The method for manufacturing a multilayer optical recording medium according to the first aspect of the invention, wherein the application process is before, during, and after the implementation of the attaching process At least one of the above-described attached layered bodies is provided with a process of forming an external force by at least one of tension and pressing force. 如申請專利範圍第2項之多層光記錄媒體之製造方法,其中,前述施加製程係在相反於對向在前述附設層狀體之前述黏著層積體之對向面之相反側之面側,藉由外力賦予構件,來賦予外力,而使得前述附設層狀體,成為在主面內方向來具有拉伸應力之狀態之製程。 The method of manufacturing a multilayer optical recording medium according to the second aspect of the invention, wherein the application process is on a side opposite to a side opposite to a facing surface of the adhesive layered body of the attached layered body. The external force is applied to the member to impart an external force, and the attached layered body is subjected to a process of having a tensile stress in the direction of the main surface. 如申請專利範圍第1至3項中任一項之多層光記錄媒體之製造方法,其中,前述黏著構造體係能夠以其主面之法線方向來作為旋轉軸而進行旋轉,作為前述方向控制製程係在旋轉前述黏著構造體之後,實施前述貼附製程。 The method for producing a multilayer optical recording medium according to any one of claims 1 to 3, wherein the adhesive structure system is rotatable as a rotation axis in a normal direction of a main surface thereof as the directional control process After the rotation of the adhesive structure, the attachment process is performed. 如申請專利範圍第1至3項中任一項之多層光記錄媒體之製造方法,其中,前述附設層狀體係能夠以前述黏著構造體之主面之法線方向來作為旋轉軸而進行旋轉,作為前述方向控制製程係在旋轉前述附設層狀體之後,實施前述貼附製程。 The method for producing a multilayer optical recording medium according to any one of claims 1 to 3, wherein the attached layered system is rotatable as a rotation axis in a normal direction of a main surface of the adhesive structure. As the direction control process, after the above-described attached layered body is rotated, the above-described attaching process is performed. 如申請專利範圍第1至3項中任一項之多層光記錄媒體之製造方法,其中,前述單位層積體係包括玻璃轉移溫度Tg為25℃以上之層之硬質層。 The method for producing a multilayer optical recording medium according to any one of claims 1 to 3, wherein the unit laminated system includes a hard layer having a layer having a glass transition temperature Tg of 25 ° C or higher. 如申請專利範圍第1至3項中任一項之多層光記錄媒體之製造方法,其中,在前述附設層狀體之至少一邊之面,層積剝離用材料,由前述附設層狀體,剝離前述剝離用材料,露出前述附設層狀體之一邊之面,藉由貼合該面以及相反於前述黏著層積體之前述基板之相反側之面,而使得前述 附設層狀體,貼附於前述黏著構造體。 The method for producing a multilayer optical recording medium according to any one of the first to third aspects of the present invention, wherein a material for peeling off is laminated on at least one side of the layered body, and the layered body is peeled off from the layered body The peeling material exposes a surface of one side of the layered body, and the surface is opposite to the surface of the substrate opposite to the substrate of the adhesive layer A layered body is attached and attached to the above-mentioned adhesive structure. 如申請專利範圍第1至3項中任一項之多層光記錄媒體之製造方法,其中,前述黏著構造體係在其黏著層積體側之面,層積剝離用材料,由前述黏著構造體,剝離前述剝離用材料,露出前述黏著層積體之一邊之面,藉由貼合該面以及前述附設層狀體之一邊之面,而使得前述附設層狀體,貼附於前述黏著構造體。 The method for producing a multilayer optical recording medium according to any one of claims 1 to 3, wherein the adhesive structure system laminates a material for peeling off from the surface on the side of the adhesive laminate, and the adhesive structure is The peeling material is peeled off, and the surface of one side of the adhesive laminate is exposed, and the surface of one side of the layered body is bonded to the surface, and the attached layered body is attached to the adhesive structure. 如申請專利範圍第1至3項中任一項之多層光記錄媒體之製造方法,其中,在前述層積製程,將預先進行切斷加工而具有對應於前述基板之形狀之前述附設層狀體,層積於前述黏著構造體。 The method for producing a multilayer optical recording medium according to any one of claims 1 to 3, wherein the layering process is performed in advance, and the attached layered body having a shape corresponding to the substrate is formed in advance , laminated on the aforementioned adhesive structure. 如申請專利範圍第1至3項中任一項之多層光記錄媒體之製造方法,其中,具有:對於前述附設層狀體,進行切斷加工而具有對應於前述基板之形狀之切斷製程。 The method for producing a multilayer optical recording medium according to any one of claims 1 to 3, further comprising: a cutting process for cutting the attached layered body to have a shape corresponding to the substrate. 如申請專利範圍第1至3項中任一項之多層光記錄媒體之製造方法,其中,前述貼附製程係沿著一定方向來搬送長尺之附設層狀體而貼附於前述黏著構造體之貼附製程。 The method for producing a multilayer optical recording medium according to any one of claims 1 to 3, wherein the attaching process transports the attached layered body of a long length in a predetermined direction and attaches to the adhesive structure Attachment process.
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