TW201347990A - Manufacturing method and application of surface substrate - Google Patents
Manufacturing method and application of surface substrate Download PDFInfo
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- TW201347990A TW201347990A TW101118221A TW101118221A TW201347990A TW 201347990 A TW201347990 A TW 201347990A TW 101118221 A TW101118221 A TW 101118221A TW 101118221 A TW101118221 A TW 101118221A TW 201347990 A TW201347990 A TW 201347990A
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Description
本發明係為一種關於表面基材之製造方法及將表面基材結合於物品表面者。The present invention is directed to a method of making a surface substrate and bonding the surface substrate to the surface of the article.
按,傳統的板狀基材圖樣,大都是直接利用印刷機在該板狀基材的表面印刷圖樣而成,因此,該圖樣所呈現之效果為單純的平面式,而且在色彩上雖清晰但卻無法產生光彩炫目效果,導致此種平面式的圖樣已無法完全符合消費大眾之需求,並容易為市場所淘汰。於是如何能使板狀基材圖樣所呈現之效果獲得消費大眾的青睞,且在市場上佔有一席之地,令該板狀基材圖樣具有立體或炫光煥彩之效果,已成為相關業者積極研發之方向。According to the traditional plate-shaped substrate pattern, most of the drawings are directly printed on the surface of the plate-shaped substrate by using a printing machine. Therefore, the effect of the pattern is a simple flat type, and the color is clear but However, it does not produce dazzling effects, which makes this flat pattern not fully meet the needs of the consumer, and is easily eliminated by the market. So how can the effect of the plate-like substrate pattern be favored by the consumers, and it has a place in the market, so that the plate-like substrate pattern has the effect of three-dimensional or glare, and has become an active research and development of related companies. direction.
本發明之其一主要目的,係提供一種表面基材之製造方法,該方法包括:分別在第一及第二夾制層的一表面經電極處理形成毛細孔表層,在第一及第二夾制層的另一表面施以底漆(primer)處理形成結合層,於第二夾制層的毛細孔表層上蒸鍍一鋁膜層;另第一夾制層的毛細孔表層淋膜成型一紋路成型層,紋路成型層與鋁膜層連結;夾制層的結合層下再經塗膠形成塗膠層後與底板貼合以形成表面基材半成品,接著對表面基材半成品熱壓以形成凹凸紋路表面,於凹凸紋路表面上印刷油墨與覆設保護材,以分別形成印刷層與保護層之步驟。A main object of the present invention is to provide a method for manufacturing a surface substrate, comprising: forming a capillary surface layer on a surface of each of the first and second sandwich layers by electrode treatment, in the first and second clips The other surface of the layer is subjected to a primer treatment to form a bonding layer, and an aluminum film layer is evaporated on the surface of the capillary layer of the second interlayer; and the capillary layer of the first interlayer is formed by lamination The grain forming layer is connected with the aluminum film layer; the bonding layer of the sandwich layer is further coated with glue to form a rubberized layer, and then bonded to the bottom plate to form a surface substrate semi-finished product, and then the surface substrate semi-finished product is hot pressed to form The embossed surface is a step of printing ink on the surface of the embossed surface and covering the protective material to form a printed layer and a protective layer, respectively.
本發明之其二主要目的,係提供一種經上述步驟所形成之表面基材的應用,係將該表面基材結合於物品表面,該物品可為容器、簿本、電子設備外殼,而結合的方式則採模內成型或黏著覆貼或加熱貼合等任意方式。The second main object of the present invention is to provide an application of the surface substrate formed by the above steps, which is to bond the surface substrate to the surface of the article, and the article can be a container, a book, an electronic device casing, and combined The method is any method such as in-mold molding or adhesive coating or heating bonding.
其中,該表面基材半成品製作凹凸紋路之技術,是採用將一表面具有圖樣紋路之金屬板加熱,並將該金屬板壓置該表面基材半成品,如此即能在該表面基材半成品上產生凹凸紋路。Wherein, the surface substrate semi-finished product is manufactured by using a metal plate having a pattern texture on a surface thereof, and pressing the metal plate to press the surface substrate semi-finished product, so that the surface substrate semi-finished product can be produced on the surface substrate. Concave lines.
其中,該金屬板表面之圖樣紋路的成型,是於該金屬板上顯影所需之圖樣,再蝕刻金屬板表面以得所需之凹凸紋路圖樣。Wherein, the pattern of the surface of the metal plate is formed by drawing a pattern required on the metal plate, and then etching the surface of the metal plate to obtain a desired pattern of the concave and convex lines.
其中,該金屬板上之凹凸紋路圖樣的成型,亦可採用雷射雕刻技術來達成。Among them, the formation of the concave and convex pattern on the metal plate can also be achieved by laser engraving technology.
為令本發明所運用之技術內容、發明目的及其達成之功效有更完整且清楚的揭露,茲於下詳細說明之,並請一併參閱所揭之圖式及圖號:For a more complete and clear disclosure of the technical content, the purpose of the invention and the effects thereof achieved by the present invention, it is explained in detail below, and please refer to the drawings and drawings:
請參第一圖,為本發明之表面基材的結構剖視圖。該表面基材(1)為一層狀結構膜層,其由下而上依序包括:一底板(11)、一塗膠層(12)、一其上下表面分別具有毛細孔表層(131)與結合層(132)之第一夾制層(13)、一淋膜層(14)、一鋁膜層(16)、一其上下表面分別具有結合層(171)與毛細孔表層(172)之第二夾制層(17)、一印刷層(18)、一保護層(19)。Referring to the first drawing, it is a structural sectional view of a surface substrate of the present invention. The surface substrate (1) is a layered structural film layer comprising, in order from bottom to top, a bottom plate (11), a glue layer (12), and a top surface of the capillary layer (131). The first sandwich layer (13), the first coating layer (14), the aluminum film layer (16), and the upper and lower surfaces thereof have a bonding layer (171) and a capillary surface layer (172). The second sandwich layer (17), a printed layer (18), and a protective layer (19).
請參第二、三圖,分別為本發明之表面基材的製造步驟流程圖與流程方塊圖。該表面基材(1)的製造方法,至少包括以下步驟:Please refer to the second and third figures, which are respectively a flow chart and a flow block diagram of the manufacturing steps of the surface substrate of the present invention. The method for manufacturing the surface substrate (1) comprises at least the following steps:
步驟A之一-電極處理(S11):將一第一夾制層(13)的上表面經電極處理,使其上表面形成一具有複數多凹凸孔隙之毛細孔表層(131);其中,該第一夾制層(13)之材質是選用PET;Step A - Electrode treatment (S11): The upper surface of a first sandwich layer (13) is subjected to electrode treatment to form a capillary surface layer (131) having a plurality of embossed pores on the upper surface thereof; The material of the first sandwich layer (13) is PET;
步驟A之二-塗佈處理(S12):將該第一夾制層(13)的下表面經底漆(primer)塗佈處理,使其下表面形成一結合層(132);Step A bis-coating treatment (S12): the lower surface of the first sandwich layer (13) is subjected to a primer coating treatment to form a bonding layer (132) on the lower surface thereof;
步驟A之三-淋膜處理(S13):於該第一夾制層(13)之毛細孔表層(131)上淋膜軟質塑膠材料形成一淋膜層(14);其中,該軟質塑膠材料為PE;Step A-3 - Laminating treatment (S13): coating a soft plastic material on the capillary layer (131) of the first sandwich layer (13) to form a coating layer (14); wherein the soft plastic material For PE;
步驟B之一-電極處理(S21):將一第二夾制層(17)的下表面經電極處理,使其下表面形成一具有複數多凹凸孔隙之毛細孔表層(172);其中,該第二夾制層(17)之材質是選用PET;Step B - Electrode treatment (S21): The lower surface of a second sandwich layer (17) is subjected to electrode treatment to form a capillary surface layer (172) having a plurality of concave and convex pores on the lower surface thereof; The material of the second sandwich layer (17) is PET;
步驟B之二-塗佈處理(S22):將該第二夾制層(17)的上表面經底漆(primer)塗佈處理,使其上表面形成一結合層(171);Step B bis - coating treatment (S22): the upper surface of the second sandwich layer (17) is subjected to a primer coating treatment to form a bonding layer (171) on the upper surface thereof;
步驟B之三-蒸鍍處理(S23):於該第二夾制層(17)之毛細孔表層(172)上蒸鍍鋁材以在該毛細孔表層(172)的表面形成一鋁膜層(16);Step B-3 - evaporation treatment (S23): depositing an aluminum material on the capillary surface layer (172) of the second sandwich layer (17) to form an aluminum film layer on the surface of the capillary surface layer (172) (16);
步驟C-結合處理(S3):於完成步驟A之一~三之第一夾制層(13)的淋膜層(14)上對應黏覆經步驟B之一~三之第二夾制層(17)的鋁膜層(16),以結合完成步驟A之一~三的第一夾制層(13)與完成步驟B之一~三之第二夾制層(17);Step C-bonding treatment (S3): corresponding to the second sandwich layer of one to three of step B on the coating layer (14) of the first sandwich layer (13) of steps A to III The aluminum film layer (16) of (17) is combined with the first sandwich layer (13) which completes one to three of step A and the second sandwich layer (17) which completes one to three of step B;
步驟D-塗膠處理(S4):於該第一夾制層(13)的結合層(132)塗覆一塗膠層(12);Step D-coating treatment (S4): coating a bonding layer (132) of the first sandwich layer (13) with a glue layer (12);
步驟E-黏合處理(S5):將一底板(11)覆設於該第一夾制層(13)的結合層(132)上,並透過在該結合層(132)上所塗覆之塗膠層(12)與該底板(11)連結貼合,以形成一表面基材半成品;Step E-adhesive treatment (S5): a bottom plate (11) is coated on the bonding layer (132) of the first sandwich layer (13), and is coated by coating on the bonding layer (132). a glue layer (12) is bonded to the bottom plate (11) to form a surface substrate semi-finished product;
步驟F-成型紋路處理(S6):將該表面基材半成品經一專用機加熱加壓,以在該第二夾制層(17)之結合層(171)上形成凹凸紋路表面(L),且該凹凸紋路表面(L)所形成之紋路深度可深及該淋膜層(14);Step F-forming texture processing (S6): heating and pressing the surface substrate semi-finished product through a special machine to form a concave-convex surface (L) on the bonding layer (171) of the second sandwich layer (17), And the embossed surface (L) can form a deep depth of the coating layer (14);
步驟G-印刷處理(S7):於該凹凸紋路表面(L)上印刷油墨,以形成一對應該凹凸紋路表面(L)之紋路走勢之印刷層(18);Step G-printing process (S7): printing ink on the embossed surface (L) to form a pair of printed layers (18) that should follow the grain path of the embossed surface (L);
步驟H-保護處理(S8):於該印刷層(18)上在塗覆一層保護塗料,以形成一保護層(19);Step H-protective treatment (S8): applying a protective coating on the printed layer (18) to form a protective layer (19);
依據上述步驟實施,即可形成本發明之表面基材(1)。其中,步驟A之一~三與步驟B之一~三是各自實施之步驟,並無區分先後順序,且步驟A之一的電極處理與步驟A之二的塗佈處理,以及且步驟B之一的電極處理與步驟B之二的塗佈處理的先後順序是可以對調的。According to the above steps, the surface substrate (1) of the present invention can be formed. Wherein, one of the steps A to 3 and one of the steps B to 3 are the steps of the respective implementation, and there is no prioritization, and the electrode treatment of one of the steps A and the coating process of the second step A, and the step B The order of the electrode treatment of one and the coating process of the second step can be reversed.
又,上述在步驟F之壓紋處理中,於該表面基材半成品之第二夾制層(17)的結合層(171)上形成凹凸紋路表面(L)的製作技術,於下再進一步說明:Further, in the embossing process of the step F described above, a technique for forming the concave-convex surface (L) on the bonding layer (171) of the second sandwich layer (17) of the surface substrate semi-finished product is further described below. :
是先取一金屬板,於該金屬板上顯影所需之圖樣,再蝕刻金屬板表面以得所需之凹凸紋路圖樣,如此即完成在金屬板表面製版動作,接著將該金屬板安置於專用機,並對該金屬板加熱,當將該表面基材半成品進入該專用機時,便利用該金屬板對之加壓加熱,即能在該表面基材半成品上產生凹凸紋路。First, a metal plate is taken, and the desired pattern is developed on the metal plate, and then the surface of the metal plate is etched to obtain a desired embossed pattern, so that the plate-making operation on the surface of the metal plate is completed, and then the metal plate is placed on a special machine. And heating the metal plate, when the surface substrate semi-finished product enters the special machine, it is convenient to press and heat the metal plate, that is, the concave and convex lines can be generated on the surface substrate semi-finished product.
而上述該金屬板上之凹凸紋路圖樣的成型,亦可採用雷射雕刻技術來達成。The forming of the concave-convex pattern on the metal plate can also be achieved by laser engraving.
另,依據上述本發明之步驟所製作成型之表面基材(1)可應用結合於物品的表面;其中,該物品可為如杯子、盤子、箱子等等之類的容器,或是筆記、簿本之封面,或是如手機、平板電腦等等之類的電子設備外殼;而該表面基材(1)與物品表面結合的方式,則可採用模內成型技術或黏著覆貼技術或加熱貼合技術等任意方式。In addition, the surface substrate (1) formed according to the above steps of the present invention can be applied to the surface of the article; wherein the article can be a container such as a cup, a plate, a box or the like, or a note or a book. The cover of the present, or an electronic device casing such as a mobile phone, a tablet computer, etc.; and the surface substrate (1) is combined with the surface of the article by using an in-mold forming technique or an adhesive covering technique or a heating paste. Any method such as technology.
以上所舉者僅係本發明之部份實施例,並非用以限制本發明,致依本發明之創意精神及特徵,稍加變化修飾而成者,亦應包括在本專利範圍之內。The above is only a part of the embodiments of the present invention, and is not intended to limit the present invention. It is intended to be included in the scope of the present invention.
綜上所述,本發明實施例確能達到所預期之使用功效,又其所揭露之具體技術手段,不僅未曾見諸於同類產品中,亦未曾公開於申請前,誠已完全符合專利法之規定與要求,爰依法提出發明專利之申請,懇請惠予審查,並賜准專利,則實感德便。In summary, the embodiments of the present invention can achieve the expected use efficiency, and the specific technical means disclosed therein have not been seen in similar products, nor have they been disclosed before the application, and have completely complied with the patent law. The regulations and requirements, the application for invention patents in accordance with the law, and the application for review, and the grant of patents, are truly sensible.
(1)...表面基材(1). . . Surface substrate
(11)...底板(11). . . Bottom plate
(12)...塗膠層(12). . . Glue layer
(13)...第一夾制層(13). . . First sandwich layer
(131)...毛細孔表層(131). . . Capillary surface
(132)...結合層(132). . . Bonding layer
(14)...淋膜層(14). . . Laminating layer
(15)...黏著層(15). . . Adhesive layer
(16)...鋁膜層(16). . . Aluminum film
(17)...第二夾制層(17). . . Second sandwich layer
(171)...結合層(171). . . Bonding layer
(172)...毛細孔表層(172). . . Capillary surface
(18)...印刷層(18). . . Printed layer
(19)...保護層(19). . . The protective layer
(S11)...電極處理(S11). . . Electrode treatment
(S12)...塗佈處理(S12). . . Coating treatment
(S13)...淋膜處理(S13). . . Lamination treatment
(S21)...電極處理(S21). . . Electrode treatment
(S22)...塗佈處理(S22). . . Coating treatment
(S23)...蒸鍍處理(S23). . . Evaporation treatment
(S3)...結合處理(S3). . . Combined processing
(S4)...塗膠處理(S4). . . Gluing treatment
(S5)...黏合處理(S5). . . Adhesive treatment
(S6)...成型紋路處理(S6). . . Molding processing
(S7)...印刷處理(S7). . . Printing processing
(S8)...保護處理(S8). . . Protection process
(L)...凹凸紋路表面(L). . . Concave road surface
第一圖:本發明之表面基材的結構剖視圖First drawing: sectional view of the structure of the surface substrate of the present invention
第二圖:本發明之表面基材的製造步驟流程圖Second: Flow chart of the manufacturing steps of the surface substrate of the present invention
第三圖:本發明之表面基材的製造步驟流程方塊圖Third: Flow chart of the manufacturing steps of the surface substrate of the present invention
(S11)...電極處理(S11). . . Electrode treatment
(S12)...塗佈處理(S12). . . Coating treatment
(S13)...淋膜處理(S13). . . Lamination treatment
(S21)...電極處理(S21). . . Electrode treatment
(S22)...塗佈處理(S22). . . Coating treatment
(S23)...蒸鍍處理(S23). . . Evaporation treatment
(S3)...結合處理(S3). . . Combined processing
(S4)...塗膠處理(S4). . . Gluing treatment
(S5)...黏合處理(S5). . . Adhesive treatment
(S6)...成型紋路處理(S6). . . Molding processing
(S7)...印刷處理(S7). . . Printing processing
(S8)...保護處理(S8). . . Protection process
Claims (10)
步驟A之一(電極):將一第一夾制層的上表面經電極處理,使之形成一毛細孔表層;
步驟A之二(塗佈):將該第一夾制層的下表面經底漆塗佈處理形成一結合層;
步驟A之三(淋膜):於該毛細孔表層上淋膜軟質塑膠材料形成一淋膜層;
步驟B之一(電極):將一第二夾制層的下表面經電極處理,使其形成一毛細孔表層;
步驟B之二(塗佈):將該第二夾制層的上表面經底漆塗佈處理後形成一結合層;
步驟B之三(蒸鍍):於該第二夾制層之毛細孔表層上蒸鍍鋁材以形成一鋁膜層;
步驟C(結合):將該淋膜層與該鋁膜層對應黏覆,以結合完成步驟A之一~三的第一夾制層與完成步驟B之一~三之第二夾制層;
步驟D(塗膠):於該第一夾制層的結合層塗覆一塗膠層,或是在一底板表面上塗覆一塗膠層;
步驟E(黏合):將該底板覆設於該第一夾制層的結合層上,以透過該塗膠層將該第一夾制層與該底板連結貼合形成一表面基材半成品;
步驟F(成型紋路):令該表面基材半成品經一機器加熱加壓,以在該第二夾制層之結合層上形成凹凸紋路表面;
步驟G(印刷):於該凹凸紋路表面上印刷油墨,以形成一對應該凹凸紋路表面之紋路走勢之印刷層;
步驟H(保護):於該印刷層上塗覆保護塗料,以形成一保護層。A method of manufacturing a surface substrate, the steps of which include:
One of the steps A (electrode): the upper surface of a first sandwich layer is treated by an electrode to form a capillary surface layer;
Step A bis (coating): the lower surface of the first sandwich layer is subjected to primer coating treatment to form a bonding layer;
Step A (leaf coating): coating a soft plastic material on the surface of the capillary to form a coating layer;
One step B (electrode): the lower surface of a second sandwich layer is treated by an electrode to form a capillary surface layer;
Step B bis (coating): the upper surface of the second sandwich layer is subjected to a primer coating treatment to form a bonding layer;
Step B (evaporation): depositing an aluminum material on the surface of the capillary layer of the second sandwich layer to form an aluminum film layer;
Step C (combination): the laminating layer is correspondingly bonded to the aluminum film layer to combine the first sandwich layer which completes one of the steps A to III and the second sandwich layer which completes one to three of the step B;
Step D (gluing): applying a glue layer to the bonding layer of the first sandwich layer, or applying a glue layer on the surface of the bottom plate;
Step E (bonding): the bottom plate is coated on the bonding layer of the first sandwich layer, and the first sandwich layer is bonded to the bottom plate through the adhesive layer to form a surface substrate semi-finished product;
Step F (forming texture): the surface substrate semi-finished product is heated and pressurized by a machine to form a concave and convex grain surface on the bonding layer of the second sandwich layer;
Step G (printing): printing ink on the surface of the embossed grain to form a pair of printed layers which should be textured by the surface of the embossed grain;
Step H (Protection): A protective coating is applied to the printed layer to form a protective layer.
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TW101118221A TWI492843B (en) | 2012-05-22 | 2012-05-22 | Manufacturing method and application of surface substrate |
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TW101118221A TWI492843B (en) | 2012-05-22 | 2012-05-22 | Manufacturing method and application of surface substrate |
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TW201347990A true TW201347990A (en) | 2013-12-01 |
TWI492843B TWI492843B (en) | 2015-07-21 |
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TW101118221A TWI492843B (en) | 2012-05-22 | 2012-05-22 | Manufacturing method and application of surface substrate |
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JPS5586626A (en) * | 1978-12-25 | 1980-06-30 | Toppan Printing Co Ltd | Manufacture of decorative metallic sheet |
JPH02232238A (en) * | 1989-03-04 | 1990-09-14 | Tokuyama Soda Co Ltd | Production of sheet |
TWI226866B (en) * | 2003-12-03 | 2005-01-21 | Guo-Gung Gan | Color-printed biaxially drawn polypropylene film, color-printed biaxially drawn polypropylene pearlescent synthetic paper and package box from composite of cardboard or corrugated paper with the same |
TW201144065A (en) * | 2010-06-11 | 2011-12-16 | hui-xiong Xu | Manufacturing method for embossed release paper and structure thereof |
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