TW201347029A - Apparatus and method for processing flat substrate - Google Patents

Apparatus and method for processing flat substrate Download PDF

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TW201347029A
TW201347029A TW101141010A TW101141010A TW201347029A TW 201347029 A TW201347029 A TW 201347029A TW 101141010 A TW101141010 A TW 101141010A TW 101141010 A TW101141010 A TW 101141010A TW 201347029 A TW201347029 A TW 201347029A
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output
processing
transport
medium
nozzle
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TWI536444B (en
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Enrico Hauchwitz
Dietmar Bernauer
Florian Kaltenbach
Sebastian Patzig-Klein
Dirk Bareis
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Rena Gmbh
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306Chemical or electrical treatment, e.g. electrolytic etching
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67063Apparatus for fluid treatment for etching
    • H01L21/67075Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67063Apparatus for fluid treatment for etching
    • H01L21/67075Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers

Abstract

In an apparatus for processing a flat substrate in a continuous process, liquid treatment medium is filled into a trough container until reaching a preset liquid level. By means of transport device, the substrate can be guided through guide elements to pass the liquid treatment medium along the transport direction in the horizontal transport plane, such that at least one processing side of the substrate is immersed into the treatment medium. The treatment medium is able to circulate in the trough container by means of a circulating device. The circulating device includes a suction device and an output device. The treatment medium is extracted from the trough container through the suction device. The extracted treatment medium passes the output device to the trough container. An incident flow element is provided in the trough container below the height level of the transport plane. The output device of the circulating device includes plural outlet nozzles. The outlet nozzles are disposed below the height level of the incident flow element and designed such that each of the outlet nozzles aims explicitly toward the main part of the incident flow element for outputting the treatment medium. Also disclosed is a method for processing a flat substrate.

Description

用於處理平的襯底的設備和方法 Apparatus and method for processing a flat substrate

本發明涉及一種用於在連續的處理過程中處理平的襯底的設備,包括a)槽容器,所述槽容器用液態的處理介質填充直到一定液位;b)運輸裝置,借助於所述運輸裝置,襯底能夠通過引導元件在水準的運輸平面中沿運輸方向引導地運輸通過處理介質,使得襯底的至少一個處理側浸入到處理介質中;c)迴圈裝置,處理介質借助於所述迴圈裝置能夠在槽容器中迴圈,並且所述迴圈裝置包括抽吸裝置和輸出裝置,處理介質通過所述抽吸裝置從槽容器中抽出,抽出的處理介質通過所述輸出裝置又輸出到槽容器中。 The invention relates to a device for processing a flat substrate in a continuous process comprising a) a tank container filled with a liquid treatment medium until a certain liquid level; b) a transport device by means of said The transport device, the substrate can be transported through the processing medium in a transport direction in the transport plane of the level by the guiding element, such that at least one processing side of the substrate is immersed in the processing medium; c) the loop device, the processing medium The loop device can be looped in the tank container, and the loop device includes a suction device and an output device through which the treatment medium is withdrawn from the tank container, and the extracted processing medium passes through the output device Output to the slot container.

此外,本發明涉及一種用於處理平的襯底、尤其是用於半導體工業和太陽能工業的襯底的方法,其中a)襯底通過引導元件引導地在水準的運輸平面中沿運輸方向運輸通過液態的處理介質,使得襯底的至少一個處理側浸入到處理介質中;b)處理介質借助於迴圈裝置迴圈。 Furthermore, the invention relates to a method for processing a flat substrate, in particular for the semiconductor industry and the solar industry, wherein a) the substrate is guided by the guiding element to be transported in the transport direction in the transport plane of the level. The liquid processing medium is such that at least one processing side of the substrate is immersed in the processing medium; b) the processing medium is looped by means of a loop device.

這種處理設備和方法從市場中已知,並且例如在處理平的襯底時使用,如所述襯底在半導體和太陽能工業中例 如以矽片的形式、也就是說以所謂的晶圓、矽板和玻璃板的形式經受不同類型的濕法工藝。在本文中,尤其有興趣的是對所述襯底進行濕法化學的刻蝕處理。 Such processing apparatus and methods are known from the market and are used, for example, in the processing of flat substrates, such as in the semiconductor and solar industries. Different types of wet processes are carried out in the form of slabs, that is to say in the form of so-called wafers, rafts and glass sheets. Of particular interest herein is the wet chemical etching of the substrate.

對此,將其表面應當被改變的待處理的襯底輸送通過液體刻蝕處理介質。在刻蝕過程中,襯底的表面得到對其隨後的使用目的而言必要的特性。在此,例如運輸輥用作為供襯底在其通過處理介質期間的引導元件,所述襯底平放在所述運輸輥上。存在下述設備,其中將襯底在液位之下引導通過處理介質,同樣存在下述設備,其中將襯底一定程度漂浮在處理介質表面上地引導,使得所述襯底的上側未浸潤地從處理介質中突出。 In this regard, the substrate to be processed whose surface should be changed is conveyed through the liquid etching treatment medium. During the etching process, the surface of the substrate is characterized as necessary for its subsequent use. Here, for example, a transport roller is used as a guiding element for the substrate during its passage through the processing medium, said substrate being placed flat on said transport roller. There is a device in which a substrate is guided through a processing medium under a liquid level, as well as a device in which the substrate is floated to a certain extent on the surface of the treatment medium such that the upper side of the substrate is not wetted Stand out from the processing medium.

在化學的刻蝕處理中,總體上,在襯底位置處的處理介質的組分對刻蝕結果的品質而言是決定性的參數。在刻蝕過程期間,在襯底上除直接的反應產物之外也形成在實際的刻蝕過程之後的反應中形成的副產物。尤其地,在襯底上例如形成氧化氮NOx,所述氧化氮在緊鄰的襯底附近處起催化作用並且對均勻的蝕像而言也需要在襯底處的特定的濃度範圍。在槽容器中,通常在開始所述類型的已知設備中構成氧化氮NOx的濃度梯度,其中NOx濃度隨著槽深度的增加而降低。 In a chemical etching process, in general, the composition of the processing medium at the substrate location is a decisive parameter in terms of the quality of the etching results. During the etching process, by-products formed in the reaction after the actual etching process are formed on the substrate in addition to the direct reaction product. In particular, nitrogen oxide is formed on a substrate such as NO x, the catalytic oxide in the vicinity of the substrate immediately adjacent to and in terms of uniform corrosion as a specific need in the concentration range at the substrate. The groove vessel, typically constructed of NO x nitrogen oxide concentration gradient in the known apparatus of the type in which the NO x concentration increases as the groove depth decreases.

然而,當氧化氮NOx沒有從襯底中導出時,引起在襯底附近的局部的過飽和,這又導致在襯底上出現不均勻的蝕像。 However, when the nitrogen oxide NO x is not derived from the substrate, causing localized supersaturation in the vicinity of the substrate, which in turn lead to an uneven etched image on the substrate.

因為氧化氮NOx能夠從處理液體中逸出到高於液位 的大氣中,所以此外,當襯底上消耗的處理介質沒有由新鮮的處理介質更換時,在可能的生產停頓中刻蝕速度非常快地下降。當引起與生產相關的中斷時,必須在每次恢復處理時,在襯底上再建立氧化氮NOx的濃度,並且必須重新設定例如處理槽溫度和運輸速度的其他刻蝕參數。 Because nitrogen oxides NO x from the treatment liquid can escape into the atmosphere above the liquid level, so in addition, when the process medium consumption on the substrate is not replaced by a fresh treatment medium, in a possible production stop in etching speed Falling very quickly. When production-related causes an interrupt, it must be restored each time the process on a substrate and then create a concentration of NO x nitrogen oxides, and must be re-set process parameters such as other etch bath temperature and transport velocity.

由此,能夠引起刻蝕結果品質的明顯波動;同時,這在處理設備的下降的產量中體現出來。 Thereby, significant fluctuations in the quality of the etching result can be caused; at the same time, this is manifested in the reduced yield of the processing equipment.

為了實現在槽容器中均勻混合處理介質並且由此實現氧化氮NOx在處理介質中的均勻分佈,在已知的設備和方法中使用在處理槽中迴圈處理介質的迴圈裝置,由此,將反應產物和氧化氮NOx從處理位置導出並且尤其將氧化氮NOx均勻地分佈在處理槽中。 In order to achieve a uniform mixing treatment medium tank container and thereby to achieve uniform distribution of nitrogen oxides NO x in the processing medium, the processing apparatus used in the loop the loop tank treatment medium in the known apparatus and methods, whereby , the reaction product and nitrogen oxides NO x derived from the processing position and in particular the nitrogen oxide NO x uniformly distributed in the processing tank.

對此已知的是,經由輸出設備從下方朝向襯底輸出迴圈的處理介質,使得朝向兩個相鄰的引導元件之間的、例如兩個相鄰的運輸輥之間的中間空間輸出迴圈的處理介質的主要部分。然而,經驗示出,在此也仍引起蝕像的局部的不均勻性,並且在與生產相關的停頓中,迅速地失去浴活性。通過改變並重新設定例如為運輸速度或槽溫度的其他的工藝參數,能夠部分地抵消所述效應。然而,這在每次中斷之後是必要的,這導致每次必須重新評估刻蝕結果。工藝的設定過程能夠是非常耗費時間的並且每次需要幾分鐘。因此總體上,整個進程不是令人滿意的。 It is known for this purpose to output a processing medium of the loop from the bottom towards the substrate via the output device such that an intermediate space between two adjacent guide elements, for example between two adjacent transport rollers, is output back. The main part of the processing medium of the circle. However, experience has shown that localized inhomogeneities of the image are also caused here, and in the production-related pauses, the bath activity is rapidly lost. The effect can be partially offset by changing and resetting other process parameters such as transport speed or tank temperature. However, this is necessary after each interruption, which results in the need to re-evaluate the etching results each time. The process of setting up the process can be very time consuming and takes a few minutes each time. So overall, the whole process is not satisfactory.

本發明的目的是,實現開始提及類型的設備和方法,其中在處理位置快速地以及可靠地用未消耗的處理介質來更換消耗的處理介質,並且尤其地,確保處理介質的均勻混合並且由此確保氧化氮NOx在處理介質中的均勻分佈,而沒有引起上述困難或者至少減小了上述困難。 It is an object of the invention to achieve an apparatus and method of the type mentioned at the outset in which the spent processing medium is replaced quickly and reliably with an unconsumed processing medium at the processing position and, in particular, a uniform mixing of the processing medium is ensured and this ensure uniform distribution of nitrogen oxides nO x in the processing medium, without causing the above-described difficulties, or at least reduce the above difficulties.

所述目的在開始所述類型的設備中如下實現,d)迎流元件在槽容器中設置在低於運輸平面的高度水準上;e)迴圈裝置的輸出裝置包括輸出噴嘴,所述輸出噴嘴設置在低於迎流元件的高度水準上並且設計成,使得輸出噴嘴中的每一個都目的明確地朝向迎流元件的每一個輸出處理介質的主要部分。 The object is achieved in a device of the type mentioned at the outset, d) the upstream element is arranged in the tank container at a level below the transport level; e) the output device of the loop device comprises an output nozzle, said output nozzle It is disposed at a level below the level of the flow-through element and is designed such that each of the output nozzles specifically outputs a major portion of the processing medium toward each of the flow-through elements.

其中應當理解的是,儘管由確定的輸出噴嘴輸出的處理介質的一部分能夠流過迎流元件,而流動路徑沒有明顯地被迎流元件影響。然而,由確定的輸出噴嘴輸出的處理介質的主要部分目的明確地流到相關聯的迎流元件上,使得通過所述迎流元件隔斷迴圈的處理介質的直接的流動路徑。 It should be understood that although a portion of the processing medium output by the determined output nozzle is capable of flowing through the flow-through element, the flow path is not significantly affected by the flow-through element. However, the main part of the processing medium output by the determined output nozzle is desirably flowed onto the associated flow-facing element such that the direct flow path of the processing medium that interrupts the loop is interrupted by the upstream element.

本發明以如下知識為基礎,在該情況下能夠實現均勻的流型並且在處理位置處均勻地並有效地進行處理介質的更換,由此,尤其能夠實現氧化氮NOx在處理介質中的均勻分佈。 The present invention is based on the following knowledge, in this case can be achieved and a uniform flow pattern and effectively replace the process medium uniformly at the treatment position, whereby, in particular, nitrogen oxide NO x can be achieved even in the process medium distributed.

在此,尤其適宜的是,輸出噴嘴設置在從上方觀察位於迎流元件的淨輪廓之內的區域中,其中相應的淨輪廓通 過如下的迎流元件限定,相應的輸出噴嘴將處理介質輸出到所述迎流元件上。 In this case, it is particularly expedient if the output nozzle is arranged in a region which is situated from above in the clear contour of the flow-facing element, wherein the corresponding net contour is The flow-through element is defined by a corresponding output nozzle that outputs a treatment medium to the flow-through element.

在結構方面有利的是,輸出裝置包括多個帶有輸出開口的噴嘴條,其中每個輸出開口形成輸出噴嘴。 It is advantageous in terms of construction that the output device comprises a plurality of nozzle strips with output openings, wherein each output opening forms an output nozzle.

優選地,所述噴嘴條彼此平行並且平行於襯底運輸方向地設置。 Preferably, the nozzle strips are arranged parallel to one another and parallel to the transport direction of the substrate.

替選地,噴嘴條能夠垂直於運輸方向地設置。 Alternatively, the nozzle strip can be arranged perpendicular to the transport direction.

因此,在所有載入有處理介質的迎流元件處引起相同的或相似的流動效應,適宜的是,噴嘴條設置在共同的水平面中,也就是說相關的噴嘴條距迎流元件的距離相等。 Therefore, the same or similar flow effects are caused at all of the flow-facing elements loaded with the treatment medium, it is expedient if the nozzle strips are arranged in a common horizontal plane, that is to say that the associated nozzle strips are equidistant from the upstream elements. .

能夠有利的是,輸出裝置包括分別形成輸出噴嘴的多個的單獨噴嘴。 It can be advantageous if the output device comprises a plurality of individual nozzles which respectively form an output nozzle.

那麼,單獨噴嘴能夠單獨地或者以由兩個或多個單獨噴嘴組成的組的形式被輸送有迴圈的處理介質。由此,能夠在寬的範圍內調節處理槽中的流動分佈。 The individual nozzles can then be transported with a looped treatment medium either alone or in the form of a group consisting of two or more separate nozzles. Thereby, the flow distribution in the treatment tank can be adjusted over a wide range.

通常優選的是,能夠調節輸送給輸出裝置的迴圈的處理介質的體積流。 It is generally preferred to be able to adjust the volumetric flow of the treatment medium delivered to the loop of the output device.

迴圈裝置能夠設計成,使得a)總是以相同的體積流將迴圈的處理介質傳輸給全部的輸出噴嘴;或者b)能夠將處理介質的單獨的體積流輸送給各個輸出噴嘴或由兩個或多個輸出噴嘴組成的組,而與其餘的輸出噴嘴無關或者與由兩個或多個輸出噴嘴組成的其餘的組無 關。 The loop device can be designed such that a) always transports the looped processing medium to the entire output nozzle with the same volume flow; or b) can deliver a separate volumetric flow of the treatment medium to each output nozzle or by two a group consisting of one or more output nozzles, independent of the remaining output nozzles or with the remaining groups consisting of two or more output nozzles turn off.

在後一情況下,在槽容器中能夠實現對流動性能進行尤其精細的調節。 In the latter case, a particularly fine adjustment of the flow properties can be achieved in the tank container.

尤其有利的是,迎流元件由運輸裝置的引導元件形成。在該情況下,不需要其他的構件。這意味著,輸出裝置的輸出噴嘴目的明確地從下方朝運輸裝置的引導元件輸出處理介質。 It is particularly advantageous if the upstream element is formed by a guiding element of the transport device. In this case, no other components are required. This means that the output nozzle of the output device is intended to output the processing medium from the lower to the guiding element of the transport device.

如上已經說明的是,迎流元件能夠優選地構造成運輸輥,襯底平放到所述運輸輥上。 As already explained above, the upstream element can preferably be constructed as a transport roller onto which the substrate lies.

在開始所述類型的方法方面,上述目的通過以下內容實現,c)迴圈的處理介質的主要部分從低於迎流元件的高度水準目的明確地朝向迎流元件輸出,所述迎流元件本身在槽容器中設置在低於運輸平面的高度水準上。 In terms of the method of the type mentioned at the outset, the above object is achieved by c) that the main part of the processing medium of the loop is explicitly directed towards the upstream element from a height level lower than the upstream element, said upstream element itself Set in the tank container at a level below the transport plane.

該優點對應於上面針對處理設備闡明的優點。 This advantage corresponds to the advantages stated above for the processing device.

如同以上已經針對處理設備所討論的是,在所述方法中有利的是,處理介質從由上方觀察存在於迎流元件的淨輪廓之內的區域朝向相應的迎流元件輸出,其中每個淨輪廓通過如下的迎流元件限定,輸出噴嘴將處理介質輸出到所述迎流元件上。 As already discussed above for the processing device, it is advantageous in the method for the treatment medium to be output from the region which is situated above the net contour of the upstream element as viewed from above, towards the respective upstream element, wherein each The profile is defined by an upstream element that outputs a processing medium onto the upstream element.

在此,也適宜的是,引導元件用作為迎流元件。 In this case, it is also expedient for the guiding element to be used as an inflow element.

還優選的是,運輸輥用作為迎流元件,襯底平放到所述運輸輥上。 It is also preferred that the transport roller is used as a flow-through element and the substrate is laid flat onto the transport roller.

在圖1和2中,用於處理平的襯底的設備整體標記為2,其中示例地示出多個例如用於製造太陽能電池的矽板4。 In Figures 1 and 2, the apparatus for processing a flat substrate is generally labeled 2, wherein a plurality of rafts 4, for example for manufacturing solar cells, are exemplarily shown.

處理設備2包括槽容器6,用液態的處理介質10填充所述槽容器6直至一定液位8。槽容器在其第一端壁中具有水準的進料口12並且在其對置的第二端壁中具有水準的出料口14。借助於運輸裝置16,矽板4在水準位置中沿通過箭頭表示的運輸方向18運輸通過處理介質10,由此限定在圖1、3、6和7中表明的、水準的運輸平面20。在進料口12和出料口14處分別存在在此不進一步關注的密封裝置21,使得在那裏處理介質10不能夠向外滲透。這種密封裝置是自身已知的。 The treatment device 2 comprises a tank container 6 which is filled with a liquid treatment medium 10 up to a certain liquid level 8. The tank container has a level inlet port 12 in its first end wall and a level outlet port 14 in its opposite second end wall. By means of the transport device 16, the jaws 4 are transported through the treatment medium 10 in the transport position 18 indicated by the arrows in the level position, thereby defining the level of transport plane 20 indicated in Figures 1, 3, 6 and 7. At the feed opening 12 and the discharge opening 14, respectively, there is a sealing device 21 which is not of further concern here, so that the treatment medium 10 is not able to penetrate there. Such sealing devices are known per se.

液位8僅少量地、例如位於矽板4的上側22的0.1至10毫米之上。因此,矽板4在本實施例中在通過槽容器6時完全地浸入到處理介質10中。 The liquid level 8 is only a small amount, for example 0.1 to 10 mm above the upper side 22 of the seesaw 4. Therefore, the seesaw 4 is completely immersed in the treatment medium 10 when passing through the tank container 6 in this embodiment.

對此,作為引導元件的運輸裝置16包括下部的運輸輥24,在所述運輸輥24上,矽板4以其下側26平放在所述運輸輥上地運輸通過處理介質10。所述下側26是矽板4的應當經受刻蝕處理的處理側。 In this regard, the transport device 16 as a guiding element comprises a lower transport roller 24 on which the raft 4 is transported through the treatment medium 10 with its underside 26 lying flat on the transport roller. The lower side 26 is the treated side of the seesaw 4 that should be subjected to an etching process.

也能夠存在其他結構作為引導元件來代替運輸輥24,例如,也可以考慮簡單的滑移元件,矽板4平放在所述滑移元件上並且在通過處理介質10時,經由所述滑移元件移動矽板4。 It is also possible to have other structures as guiding elements instead of the transport roller 24, for example, a simple sliding element can also be considered, on which the jaws 4 lie flat and via the slip when passing through the processing medium 10 The component moves the seesaw 4.

在變型形式中,矽板4僅以其處理側26浸入到處理介質10中,而其上側22未浸潤地突出到位於處理介質10之上的大氣中。處理介質10的液位元8在該情況下相應較低。 In a variant, the jaw 4 is only immersed into the treatment medium 10 with its treatment side 26, while its upper side 22 protrudes unimpregnated into the atmosphere above the treatment medium 10. The level 8 of the treatment medium 10 is correspondingly lower in this case.

此外,運輸裝置16在本實施例中包括上部的運輸輥28,所述運輸輥28分別在矽板4的上側22上滾動。在此每隔一個下部的運輸輥24對置地設置一個上部的運輸輥28,使得襯底板4容納在所述滾輪對24、28之間。在圖中,相應地僅運輸輥24和28中的一些設有附圖標記。在圖2中透視地示出運輸輥28和24。 Furthermore, the transport device 16 in the present embodiment comprises an upper transport roller 28 which rolls on the upper side 22 of the jaw 4, respectively. Here, an upper transport roller 28 is arranged opposite each other for the lower transport roller 24, so that the substrate plate 4 is accommodated between the roller pairs 24, 28. In the figures, only some of the transport rollers 24 and 28 are accordingly provided with reference numerals. Transport rollers 28 and 24 are shown in perspective in FIG.

下部的和上部的運輸輥24和28沿橫向於運輸方向18的水平線延伸,並且本身在槽容器6之外安放在支承塊30中。上部的運輸輥28能夠借助於一個或多個在此沒有特意示出的馬達驅動。 The lower and upper transport rollers 24 and 28 extend in a horizontal line transverse to the transport direction 18 and are themselves placed in the support block 30 outside of the trough container 6. The upper transport roller 28 can be driven by means of one or more motors not specifically shown here.

運輸輥28同時用於,使矽板4總是平放在下部的運輸輥24上並且不向上升起矽板4。上部的輸送滾輪20安放成,使得所述輸送滾輪在一定範圍內可豎直地移動。必要時,例如上部的運輸輥28能夠是柔性的或者可豎直移動地安放。通過所述措施確保:上部的運輸輥28能夠使其豎直位置適應於矽板4的厚度差。 The transport rollers 28 are simultaneously used such that the jaws 4 are always placed flat on the lower transport roller 24 and are not raised upwards from the jaws 4. The upper conveying roller 20 is placed such that the conveying roller can move vertically within a certain range. If necessary, for example, the upper transport roller 28 can be flexible or can be placed vertically. It is ensured by the measures that the upper transport roller 28 is able to adapt its vertical position to the difference in thickness of the jaws 4.

為了實現處理介質10的以及由此氧化氮NOx在槽容器6中的開始所提及的均勻混合,處理設備2包括迴圈裝置32。借助於迴圈裝置32,從運輸輥24、28的區域吸出處理介質10,並且從下方再次輸出到仍位於槽容器6中 的處理介質10中。 In order to achieve a uniform mixing treatment medium and whereby nitrogen oxide NO x at the beginning of the cell container 6 mentioned, the processing device 10 includes a loop means 32 2. By means of the loop device 32, the treatment medium 10 is aspirated from the region of the transport rollers 24, 28 and is again output from below into the treatment medium 10 still in the tank container 6.

對此,迴圈裝置32包括抽吸裝置34和輸出裝置36,處理介質10通過所述抽吸裝置從槽容器6抽出,所述抽出的處理介質通過所述輸出裝置又輸出到槽容器6中。 In this regard, the loop device 32 comprises a suction device 34 and an output device 36, through which the treatment medium 10 is withdrawn from the tank container 6, the extracted process medium being again output to the tank container 6 via the output device .

迴圈單元屬於抽吸裝置34,所述迴圈單元在本實施例中以所謂的流料箱38的形式存在。所述迴圈單元經由多個進氣接管40--在本實施例中存在三個這種進氣接管40--從處理槽的區域抽出處理介質10,下部的運輸輥24設置在所述區域中。因此,流料箱38在矽板4的下側26附近從處理槽的區域中抽出處理介質10。 The loop unit belongs to a suction device 34, which in the present embodiment is in the form of a so-called flow box 38. The loop unit draws the process medium 10 from a region of the treatment tank via a plurality of intake nozzles 40 - in the present embodiment three such intake nozzles 40 - the lower transport roller 24 is disposed in the region in. Thus, the hopper 38 draws the treatment medium 10 from the area of the treatment tank near the lower side 26 of the raft 4.

流料箱38將所述抽出的處理介質10運送至輸出裝置36,所述輸出裝置36包括多個帶有多個輸出噴嘴44的噴嘴條42,其中每個所述輸出噴嘴通過噴嘴條42中的輸出開口46形成。在圖中僅一些噴嘴條42、輸出噴嘴44和輸出開口46設有附圖標記。 The flow box 38 carries the withdrawn processing medium 10 to an output device 36, the output device 36 comprising a plurality of nozzle strips 42 with a plurality of output nozzles 44, wherein each of the output nozzles passes through the nozzle strip 42 The output opening 46 is formed. Only some of the nozzle strips 42, output nozzles 44 and output openings 46 are provided with reference numerals in the figures.

噴嘴條42進而輸出噴嘴44設置在低於運輸輥24的高度水準上並且設計成,使得輸出噴嘴44中的每個將迴圈的處理介質10的通過箭頭表示的主要部分48目的明確地朝向下部的運輸輥24中的每個輸出。 The nozzle strips 42 and thus the output nozzles 44 are disposed at a lower level than the transport rollers 24 and are designed such that each of the output nozzles 44 purposely directs the main portion 48 of the processing medium 10 of the loop that is indicated by the arrow toward the lower portion. Each of the transport rollers 24 outputs.

如同開始已經提及地,在此應理解的是,儘管由確定的輸出噴嘴44輸出的處理介質10的一部分能夠流動到下部的運輸輥24之上的區域中並且因此流向矽板4,而沒有流到與所述輸出噴嘴44相關聯的下部的運輸輥24上。 然而,由確定的輸出噴嘴44輸出的處理介質10的主要部分40目的明確地流到相關聯的下部的運輸輥24上,使得通過下部的運輸輥24隔斷迴圈的處理介質10到矽板4的直接的流動路徑。 As already mentioned at the outset, it should be understood here that although a part of the treatment medium 10 output by the determined output nozzle 44 can flow into the area above the lower transport roller 24 and thus flow to the seesaw 4 without It flows onto the lower transport roller 24 associated with the output nozzle 44. However, the main portion 40 of the processing medium 10 output by the determined output nozzle 44 is desirably flown onto the associated lower transport roller 24 such that the processing medium 10 of the loop is interrupted by the lower transport roller 24 to the seesaw 4 The direct flow path.

在此,輸出噴嘴44在本實施例中設置成,使得輸出噴嘴44從上方觀察位於下部的運輸輥24的淨輪廓之內的區域中,所述淨輪廓通過如下的下部的運輸輥24限定,確定的輸出噴嘴44將處理介質10輸出到所述下部的運輸輥上。下部的運輸輥24的淨輪廓在圖1中通過虛線表明並且設有附圖標記50。由此,當輸出噴嘴44以相應的距離設置在運輸輥24之下時,處理介質從輸出噴嘴44出來遇到確定的下部的運輸輥24的角度始終能夠保持相對大。 Here, the output nozzle 44 is arranged in the present embodiment such that the output nozzle 44 is viewed from above in the region of the lower contour of the transport roller 24, which is defined by the lower transport roller 24 as follows, The determined output nozzle 44 outputs the processing medium 10 to the lower transport roller. The net profile of the lower transport roller 24 is indicated by dashed lines in FIG. 1 and is provided with the reference numeral 50. Thus, when the output nozzles 44 are disposed at a corresponding distance below the transport roller 24, the angle at which the process medium exits the output nozzle 44 from the determined lower portion of the transport roller 24 can always remain relatively large.

然而在沒有特意示出的處理設備2的變型形式中,只要迴圈的處理介質10的主要部分48以上述方式遇到相應的下部的運輸輥24,就也能夠將一些或全部的輸出噴嘴44設置在運輸輥24的相應的淨輪廓50之外。 However, in a variant of the treatment device 2 not specifically shown, it is also possible to have some or all of the output nozzles 44 as long as the main portion 48 of the looped process medium 10 encounters the corresponding lower transport roller 24 in the manner described above. It is disposed outside of the corresponding net contour 50 of the transport roller 24.

同樣不必在每個運輸輥24之下設置一個或多個輸出噴嘴44;同樣能夠存在不被迴圈的處理介質10流到的運輸輥24。因此,輸出噴嘴44例如能夠僅與每隔一個或每隔兩個下部的運輸輥24相關聯。 It is also not necessary to provide one or more output nozzles 44 below each transport roller 24; likewise there can be transport rollers 24 to which the process medium 10 that is not looped flows. Thus, the output nozzle 44 can, for example, be associated with only one or every other two lower transport rollers 24.

因此,一般來說,通過運輸輥24構成迎流元件,所述迎流元件在槽容器6中設置在運輸平面20之下並且輸出噴嘴44將處理介質10的主要部分48輸出到所述迎流 元件上。在一個變型形式中,迎流元件也能夠作為槽容器6中單獨的構件存在。這僅在圖1中通過虛線示出的迎流元件51來表明,所述迎流元件在那裏設置在運輸輥24之下。這種單獨的迎流元件51的幾何尺寸能夠是不同的。再次一般來說,當前重要的是,迎流元件設置在低於襯底的運輸平面20的高度水準上,並且輸出噴嘴44位於低於迎流元件的高度水準上,其中所述迎流元件可能獨立的迎流元件51或者引導元件例如運輸輥24。再次一般來說,所述淨輪廓50相應地是相應迎流元件51的淨輪廓。 Thus, in general, a flow-facing element is formed by the transport roller 24, which is arranged below the transport plane 20 in the tank container 6 and the output nozzle 44 outputs the main portion 48 of the treatment medium 10 to said upstream On the component. In a variant, the upstream element can also be present as a separate component in the tank container 6. This is only indicated in FIG. 1 by the flow-through element 51 shown by the dashed line, which is situated below the transport roller 24 there. The geometry of such a separate flow element 51 can be different. Again, in general, it is currently important that the current-carrying element is placed at a level below the transport plane 20 of the substrate, and that the output nozzle 44 is situated at a lower level than the upstream element, wherein the upstream element may A separate upstream element 51 or a guiding element such as a transport roller 24 is provided. Again generally speaking, the net profile 50 is correspondingly the net profile of the respective inflow element 51.

下面,現在再參考作為迎流元件的運輸輥24,其中為此所述的內容意義上也相應地適用於獨立的迎流元件。 In the following, reference is made to the transport roller 24 as the upstream element, which for this purpose also applies correspondingly to the individual flow-through element.

在圖3中示出處理設備2的未按照比例的斷面,其中能夠識別帶有設置在噴嘴條之上的運輸輥24的噴嘴條42的剖面,矽板4在所述運輸輥24上運輸。在所述噴嘴條42中,在每個運輸輥24之下,多個輸出噴嘴46沿所述的傳遞滾輪24的縱向方向分佈在噴嘴條42的環周上,使得處理介質扇形地朝向所述的運輸輥24輸出,其中流動扇面在運輸輥24的縱向方向上展開。這在圖3中通過相應的箭頭表明,其中並非全部的輸出開口46都具有附圖標記。 A non-proportional section of the treatment device 2 is shown in FIG. 3, in which a section of the nozzle strip 42 with a transport roller 24 arranged above the nozzle strip can be identified, on which the raft 4 is transported . In the nozzle strip 42, below each of the transport rollers 24, a plurality of output nozzles 46 are distributed along the longitudinal direction of the transfer roller 24 on the circumference of the nozzle strip 42, such that the process medium is fanned toward the The transport roller 24 is output with the flow sector unfolding in the longitudinal direction of the transport roller 24. This is indicated in Figure 3 by corresponding arrows, wherein not all of the output openings 46 have the reference numerals.

輸出開口46的數量能夠在大的範圍內變化。能夠總是分別僅存在唯一的輸出開口46,如同在圖2中的噴嘴條42中示出的那樣。輸出開口46的最大可能的數量尤其與所觀察的噴嘴條42的直徑以及各個輸出開口46的直徑 和彼此間的間距相關。 The number of output openings 46 can vary over a wide range. Only a single output opening 46 can always be present, respectively, as shown in the nozzle strip 42 of FIG. The maximum possible number of output openings 46 is particularly the diameter of the nozzle strip 42 as viewed and the diameter of each output opening 46. Related to the spacing between each other.

在實際中尤其證實:多個輸出開口46以超過160°的角度範圍設置和分佈,也就是說在始於垂線V的兩個方向上分別設置和分佈超過80°。然而,所述角度範圍也能夠被減小並且例如僅為120°。輸出開口46的分別對於特定的設備而言尤其有效的佈置能夠借助常見的機構通過試驗來確定。 In particular, it has been found in practice that the plurality of output openings 46 are arranged and distributed over an angular range of more than 160°, that is to say in the two directions starting from the vertical line V, respectively, and distributed over 80°. However, the angular range can also be reduced and is for example only 120°. The arrangement of the output openings 46, which are particularly effective for a particular device, can be determined experimentally by means of common mechanisms.

當迴圈的處理介質10現在從相應的輸出噴嘴44出來遇到下部的運輸輥24時,流動總體上被均勻化,其中中斷以及減小存在於從輸出噴嘴44中向上流動的處理介質10中的渦流。 When the looped process medium 10 now comes out of the corresponding output nozzle 44 and encounters the lower transport roller 24, the flow is generally homogenized, with interruptions and reductions present in the process medium 10 flowing upward from the output nozzle 44. Eddy current.

由此,迴圈的處理介質10均勻地流向在矽板4的下側26處的進行刻蝕處理的位置,並且整體上,在矽板4的區域中以及在處理介質10的液位8處形成均勻的流型。這通過圖4和5來表明。 Thereby, the looped process medium 10 flows uniformly to the position where the etching process is performed at the lower side 26 of the seesaw 4, and as a whole, in the region of the seesaw 4 and at the liquid level 8 of the process medium 10. Form a uniform flow pattern. This is illustrated by Figures 4 and 5.

在圖4中能夠識別在處理設備2中出現的在液位8處的流型;圖5示出在處理介質M的液位S處的流型,所述流型能夠在處理設備A中出現,所述處理設備從市場中已知並且在所述處理設備中,迴圈的處理介質M流入在此處的運輸輥T之間。 The flow pattern at the liquid level 8 occurring in the processing device 2 can be identified in FIG. 4; FIG. 5 shows the flow pattern at the liquid level S of the processing medium M, which can be present in the processing device A The treatment device is known from the market and in the treatment device, the looped treatment medium M flows between the transport rollers T here.

在後一情況中,當矽板4沒有堵塞路徑時,迴圈的處理介質M在相對於液位元S的直接路徑上流動。因此,在液位S處通過強的並且直接指向上方的流動而形成“流蘑菇頂”P,局部不期望的刻蝕和反應產物能夠聚集在所述 流蘑菇頂中,所述刻蝕和反應產物也影響到在刻蝕位置處的、即在矽板下側的處理介質的成分,使得生成的蝕像不具有期望的品質。 In the latter case, when the seesaw 4 has no blocked path, the looped processing medium M flows on a direct path with respect to the liquid level S. Thus, at the liquid level S, a "flowing mushroom top" P is formed by a strong and direct upward flow, locally undesirable etching and reaction products can be concentrated in said In the mushroom top, the etching and reaction products also affect the composition of the processing medium at the etched location, i.e., at the underside of the raft, such that the resulting etch does not have the desired quality.

相反地,圖4示出:如何通過帶有噴嘴條42的輸出裝置36產生均勻的流型,其中在處理介質10的液位8處的渦流是適度的,使得在此所述處理介質在上部的運輸輥28之間僅造成輕微的流突起部52。在此,處理介質10更均勻地在槽容器6中迴圈並且氧化氮NOx在處理介質10中均勻地分佈,使得保證高品質的刻蝕均勻性,如其在開始所闡述的那樣。 Conversely, Figure 4 shows how a uniform flow pattern is produced by the output device 36 with the nozzle strips 42, wherein the turbulence at the liquid level 8 of the treatment medium 10 is modest, such that the treatment medium is at the upper portion Only a slight flow projection 52 is created between the transport rollers 28. Here, the media processing loop 10 more uniformly in the groove 6 and the container nitrogen oxides NO x in the treatment medium 10 uniformly distributed, so that the uniformity of etching to ensure high quality, as is set forth above in the beginning.

流料箱38對每個噴嘴條42提供迴圈的處理介質10,所述處理介質穿流過相應的噴嘴條42並且經由位於所述噴嘴條42中的輸出開口46再次離開。由流料箱38輸送給輸出裝置38的迴圈的處理介質10的體積流能夠是可調節的。在此,流料箱38能夠設計成,使得將迴圈的處理介質10始終以相同的體積流輸送給全部的噴嘴條42。替選地,流料箱38也能夠設計成,使得處理介質10的單獨的體積流能夠輸送給每個噴嘴條42而與其餘的噴嘴條42無關。 The flow box 38 provides a loop of treatment medium 10 for each nozzle strip 42 that passes through a respective nozzle strip 42 and exits again via an output opening 46 located in the nozzle strip 42. The volumetric flow of the processing medium 10 delivered by the chute 38 to the loop of the output device 38 can be adjustable. Here, the flow box 38 can be designed such that the processing medium 10 of the loop is always delivered to all of the nozzle strips 42 in the same volume flow. Alternatively, the flow box 38 can also be designed such that a separate volume flow of the process medium 10 can be delivered to each nozzle strip 42 regardless of the remaining nozzle strips 42.

矽板4通常劃分成所謂的軌道,在所述軌道上設置之後的有效表面。在實際中,證實為尤其有利的是,輸出噴嘴44平行於所述軌道地分別相繼地設置,因此,噴嘴條42根據所述軌道平行於運輸方向18並且彼此平行地設置在共同水平面中。然而在沒有特意示出的變型形式中,噴 嘴條42例如也平行於下部的運輸輥24、或通常來說垂直於運輸方向18延伸,使得在確定的運輸輥24下存在噴嘴條42,其輸出噴嘴44因此將迴圈的處理介質10的主要部分48全部輸出到所述確定的運輸輥24上。 The seesaw 4 is generally divided into so-called tracks on which the subsequent effective surface is placed. In practice, it has proven to be particularly advantageous for the output nozzles 44 to be arranged one after the other in parallel with the rails, so that the nozzle strips 42 are arranged parallel to the transport direction 18 and parallel to one another in a common horizontal plane. However, in a variant that is not specifically shown, the spray The mouth strip 42 extends, for example, also parallel to the lower transport roller 24, or generally perpendicular to the transport direction 18, such that there is a nozzle strip 42 under the determined transport roller 24, the output nozzle 44 of which will loop the processing medium 10 The main portion 48 is all output to the determined transport roller 24.

在圖6和7中,現在示出修改的處理設備2’作為第二實施例。在所述處理設備中,相應於根據圖1至4的那些處理設備2中部件和構件的部件和構件具有相同的附圖標記,並且在意義上相應地適用上面的處理設備2的內容。 In Figs. 6 and 7, the modified processing device 2' is now shown as the second embodiment. In the processing device, the components and components corresponding to the components and components in the processing device 2 according to FIGS. 1 to 4 have the same reference numerals, and the contents of the above processing device 2 are correspondingly applied in the sense.

處理設備2’與處理設備2的不同之處在於修改的輸出裝置36。在所述處理設備2’中,輸出噴嘴44通過單獨噴嘴54形成,其中每個單獨噴嘴經由單獨的輸送通道56與流料箱38連接,其中僅一些單獨噴嘴設有附圖標記。以所述方式,迴圈的處理介質10能夠單獨地從流料箱38輸送給每個單獨噴嘴54。 The processing device 2' differs from the processing device 2 in the modified output device 36. In the treatment device 2', the output nozzles 44 are formed by separate nozzles 54, wherein each individual nozzle is connected to the flow box 38 via a separate delivery channel 56, of which only a few individual nozzles are provided with reference numerals. In the manner described, the looped process medium 10 can be separately delivered from the flow bin 38 to each individual nozzle 54.

在沒有特意示出的變型形式中,具有兩個或多個單獨噴嘴54的各個單獨噴嘴54的組也能夠分別經由相應的共同輸送管道輸送輸送有迴圈的處理介質10。 In a variant which is not specifically shown, the group of individual nozzles 54 with two or more individual nozzles 54 can also transport the treatment medium 10 to which the loops are fed via respective common conveying lines.

此外,單獨噴嘴54也能夠與一個或多個噴嘴條42組合地使用,如同其在處理設備2中所設置的。 Furthermore, the individual nozzles 54 can also be used in combination with one or more nozzle strips 42 as they are provided in the processing device 2.

M‧‧‧處理介質 M‧‧‧Processing media

S‧‧‧液位 S‧‧‧ liquid level

V‧‧‧垂線 V‧‧‧ vertical line

A‧‧‧處理設備 A‧‧‧Processing equipment

T‧‧‧運輸輥 T‧‧‧Transport roller

2‧‧‧處理設備 2‧‧‧Processing equipment

2’‧‧‧處理設備 2’‧‧‧Processing equipment

4‧‧‧矽板 4‧‧‧矽板

6‧‧‧槽容器 6‧‧‧Slot container

8‧‧‧液位 8‧‧‧ liquid level

10‧‧‧處理介質 10‧‧‧Processing media

12‧‧‧進料口 12‧‧‧ Feed inlet

14‧‧‧出料口 14‧‧‧Outlet

16‧‧‧運輸裝置 16‧‧‧Transportation device

18‧‧‧運輸方向 18‧‧‧Transportation direction

20‧‧‧運輸平面 20‧‧‧Transportation plane

21‧‧‧密封裝置 21‧‧‧ Sealing device

22‧‧‧上側 22‧‧‧Upper side

24‧‧‧運輸輥 24‧‧‧Transport roller

26‧‧‧下側、處理側 26‧‧‧lower side, treatment side

28‧‧‧運輸輥 28‧‧‧Transport roller

32‧‧‧迴圈裝置 32‧‧‧Circle device

34‧‧‧抽吸裝置 34‧‧‧Suction device

36‧‧‧輸出裝置 36‧‧‧Output device

38‧‧‧流料箱 38‧‧‧Stream box

40‧‧‧進氣接管 40‧‧‧Intake intake

42‧‧‧噴嘴條 42‧‧‧Nozzle strips

44‧‧‧輸出噴嘴 44‧‧‧ output nozzle

46‧‧‧輸出開口 46‧‧‧Output opening

48‧‧‧主要部分 48‧‧‧ main part

50‧‧‧標記、淨輪廓 50‧‧‧ mark, net outline

51‧‧‧迎流元件 51‧‧‧Inrush element

52‧‧‧流突起部 52‧‧‧Flow projections

54‧‧‧單獨噴嘴 54‧‧‧Single nozzle

以下將根據附圖詳細闡明本發明的實施例。其中示出: 圖1示出按照根據第一實施例的用於處理平的襯底的設備的根據圖2中的剖切線I-I的垂直剖面圖,其中存在迴圈裝置;圖2示出圖1的設備的沿著圖1的剖切線II-II剖開的剖面圖;圖3示出帶有多個輸出開口的噴嘴條的不按比例的剖面圖;圖4和5示出在根據本發明的設備中和在根據現有技術的設備中對槽表面上的流動情況進行比較的示意圖;圖6示出按照根據第二實施例的用於處理平襯底的設備的根據圖5中的剖切線IV-IV的垂直剖面圖;圖7示出圖4的設備的沿圖4的剖切線VII-VII剖開的剖面圖。 Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Which shows: 1 shows a vertical sectional view according to a section line II in FIG. 2 of an apparatus for processing a flat substrate according to a first embodiment, in which a loop device is present; FIG. 2 shows an edge of the apparatus of FIG. 1 is a cross-sectional view taken along line II-II of FIG. 1; FIG. 3 shows a disproportionate cross-sectional view of a nozzle strip with a plurality of output openings; FIGS. 4 and 5 show in the apparatus according to the present invention. A schematic diagram comparing the flow on the surface of the groove in a device according to the prior art; FIG. 6 shows a line according to section line IV-IV in FIG. 5 according to the apparatus for processing a flat substrate according to the second embodiment. Vertical cross-sectional view; Fig. 7 is a cross-sectional view of the apparatus of Fig. 4 taken along line VII-VII of Fig. 4.

2‧‧‧處理設備 2‧‧‧Processing equipment

2’‧‧‧處理設備 2’‧‧‧Processing equipment

4‧‧‧矽板 4‧‧‧矽板

6‧‧‧槽容器 6‧‧‧Slot container

8‧‧‧液位 8‧‧‧ liquid level

10‧‧‧處理介質 10‧‧‧Processing media

12‧‧‧進料口 12‧‧‧ Feed inlet

14‧‧‧出料口 14‧‧‧Outlet

16‧‧‧運輸裝置 16‧‧‧Transportation device

18‧‧‧運輸方向 18‧‧‧Transportation direction

20‧‧‧運輸平面 20‧‧‧Transportation plane

21‧‧‧密封裝置 21‧‧‧ Sealing device

22‧‧‧上側 22‧‧‧Upper side

24‧‧‧運輸輥 24‧‧‧Transport roller

26‧‧‧下側、處理側 26‧‧‧lower side, treatment side

28‧‧‧運輸輥 28‧‧‧Transport roller

32‧‧‧迴圈裝置 32‧‧‧Circle device

34‧‧‧抽吸裝置 34‧‧‧Suction device

36‧‧‧輸出裝置 36‧‧‧Output device

38‧‧‧流料箱 38‧‧‧Stream box

40‧‧‧進氣接管 40‧‧‧Intake intake

42‧‧‧噴嘴條 42‧‧‧Nozzle strips

44‧‧‧輸出噴嘴 44‧‧‧ output nozzle

46‧‧‧輸出開口 46‧‧‧Output opening

48‧‧‧主要部分 48‧‧‧ main part

50‧‧‧標記、淨輪廓 50‧‧‧ mark, net outline

51‧‧‧迎流元件 51‧‧‧Inrush element

Claims (16)

一種用於在連續的過程中處理平的襯底的設備,帶有a)槽容器(6),該槽容器用液態的處理介質(10)填充直到一定液位(8);b)運輸裝置(16),借助於該運輸裝置,襯底(4)能夠透過引導元件(24)在水準的運輸平面(20)中沿運輸方向(18)引導地運輸通過該處理介質(10),使得該襯底(4)的至少一個處理側(26)浸入到該處理介質(10)中;c)迴圈裝置(32),該處理介質(10)借助於該迴圈裝置能夠在該槽容器(6)中迴圈,並且該迴圈裝置包括抽吸裝置(34)和輸出裝置(36),透過該抽吸裝置將處理介質(10)從該槽容器(6)中抽出,抽出的該處理介質(10)透過該輸出裝置又輸出到該槽容器(6)中,其特徵在於,d)迎流元件(24;51)在該槽容器(6)中設置在低於該運輸平面(20)的高度水準上;e)該迴圈裝置(32)的該輸出裝置(36)包括輸出噴嘴(44),該輸出噴嘴設置在低於該迎流元件(24;51)的高度水準上並且設計成,使得該輸出噴嘴(44)中的每一個都目的明確地朝向該迎流元件(24;51)中的每一個輸出該處理介質(10)的主要部分(48)。 An apparatus for processing a flat substrate in a continuous process, with a) a tank container (6) filled with a liquid treatment medium (10) up to a certain liquid level (8); b) a transport device (16) by means of the transport device, the substrate (4) can be transported through the processing medium (10) in a transport direction (18) in a transport plane (20) through the guiding element (24), such that At least one processing side (26) of the substrate (4) is immersed in the processing medium (10); c) a looping device (32) by means of which the looping device can be 6) a middle loop, and the loop device comprises a suction device (34) and an output device (36) through which the treatment medium (10) is withdrawn from the tank container (6), the treatment being withdrawn The medium (10) is again output into the tank container (6) via the output device, characterized in that d) the flow-in element (24; 51) is arranged below the transport plane in the tank container (6) (20) a height level; e) the output device (36) of the loop device (32) includes an output nozzle (44) disposed at a level below the level of the flow element (24; 51) and design Thus, each of the output nozzles (44) purposely outputs a major portion (48) of the processing medium (10) toward each of the flow-through elements (24; 51). 根據申請專利範圍第1項所述的設備,其中,輸 出噴嘴設置在從上方觀察位於迎流元件(24;51)的淨輪廓(50)之內的區域中,其中相應的淨輪廓(50)透過如下的該迎流元件(24;51)限定,相應的輸出噴嘴(44)將該處理介質(10)輸出到該迎流元件上。 According to the device described in claim 1 of the patent application, wherein The outlet nozzle is arranged in a region from above which is situated within the clear contour (50) of the flow-facing element (24; 51), wherein the corresponding net contour (50) is defined by the upstream element (24; 51), A corresponding output nozzle (44) outputs the processing medium (10) to the flow-through element. 根據申請專利範圍第1項所述的設備,其中,該輸出裝置(36)具有多個帶有輸出開口(46)的噴嘴條(42),其中每個輸出開口(46)形成輸出噴嘴(44)。 The apparatus of claim 1, wherein the output device (36) has a plurality of nozzle strips (42) with output openings (46), wherein each output opening (46) forms an output nozzle (44) ). 根據申請專利範圍第3項所述的設備,其中,噴嘴條(42)彼此平行地並且平行於該襯底(4)的該運輸方向(18)設置。 The device according to claim 3, wherein the nozzle strips (42) are arranged parallel to each other and parallel to the transport direction (18) of the substrate (4). 根據申請專利範圍第3項所述的設備,其中,噴嘴條(42)垂直於該運輸方向(18)設置。 The device of claim 3, wherein the nozzle strip (42) is disposed perpendicular to the transport direction (18). 根據申請專利範圍第4項所述的設備,其中,噴嘴條(42)設置在共同的水平面中。 The apparatus of claim 4, wherein the nozzle strips (42) are disposed in a common horizontal plane. 根據申請專利範圍第1項所述的設備,其中,該輸出裝置(36)包括多個分別形成輸出噴嘴(44)的單獨噴嘴(54)。 The apparatus of claim 1, wherein the output device (36) includes a plurality of individual nozzles (54) that respectively form an output nozzle (44). 根據申請專利範圍第7項所述的設備,其中,該單獨噴嘴(54)能夠單獨地或者以由兩個或多個單獨噴嘴(54)組成的組的形式被輸送有迴圈的處理介質(10)。 The apparatus of claim 7, wherein the individual nozzles (54) are capable of being transported with a loop of processing medium either alone or in the form of a group consisting of two or more separate nozzles (54) ( 10). 根據申請專利範圍第1項所述的設備,其中,輸送給該輸出裝置(36)的迴圈的處理介質(10)的體積流是能夠調節的。 The apparatus of claim 1, wherein the volumetric flow of the treatment medium (10) delivered to the loop of the output device (36) is adjustable. 根據申請專利範圍第1項所述的設備,其中,該 迴圈裝置(32)設計成,使得a)將迴圈的處理介質(10)始終以相同的體積流輸送給全部輸出噴嘴(44);或者b)能夠將處理介質(10)的單獨的體積流輸送給各個輸出噴嘴(44)或由兩個或多個輸出噴嘴(44)組成的組,而與其餘的該輸出噴嘴(44)無關或者與由兩個或多個輸出噴嘴(44)組成的其餘的組無關。 The device according to claim 1, wherein the The loop device (32) is designed such that a) the looped processing medium (10) is always delivered to the entire output nozzle (44) in the same volume flow; or b) the individual volume of the processing medium (10) can be The flow is supplied to each of the output nozzles (44) or a group of two or more output nozzles (44), independent of the remaining output nozzles (44) or consisting of two or more output nozzles (44) The rest of the group has nothing to do with it. 根據申請專利範圍第1至10項之任一項所述的設備,其中,該迎流元件(24)透過該運輸裝置(16)的該引導元件(24)形成。 The device according to any one of the preceding claims, wherein the flow-through element (24) is formed by the guiding element (24) of the transport device (16). 根據申請專利範圍第11項所述的設備,其中,該迎流元件(24)構造成運輸輥(24),該襯底(4)平放在該運輸輥(24)上。 The device according to claim 11, wherein the oscillating member (24) is configured as a transport roller (24) which is placed flat on the transport roller (24). 一種用於處理平的襯底的方法,其中a)將該襯底(4)透過引導元件(24)在水準的運輸平面(20)中沿運輸方向(18)在連續的過程中引導地運輸通過液態的處理介質(10),使得該襯底(4)的至少一個處理側(26)浸入到該處理介質(10)中;b)該處理介質(10)借助於迴圈裝置(32)迴圈,其特徵在於,c)將迴圈的處理介質(10)的主要部分(48)從低於迎流元件(24;51)的高度水準目的明確地朝向該迎流元件(24;51)輸出,該迎流元件(24;51)本身在該槽 容器(6)中設置在低於該運輸平面(20)的高度水準上。 A method for processing a flat substrate, wherein a) the substrate (4) is transported in a continuous process in the transport direction (18) in the transport plane (20) through the guiding element (24) in the level transport plane (20) At least one processing side (26) of the substrate (4) is immersed in the processing medium (10) by a liquid processing medium (10); b) the processing medium (10) is by means of a loop device (32) The loop is characterized in that c) the main portion (48) of the looped processing medium (10) is clearly directed from the height level below the current-carrying element (24; 51) towards the upstream element (24; 51) Output, the current-facing element (24; 51) itself is in the slot The container (6) is placed at a level below the transport plane (20). 根據申請專利範圍第13項所述的方法,其中,從由上方觀察位於迎流元件(24)的淨輪廓(50)之內的區域中朝向相應的迎流元件(24)輸出處理介質(10),其中相應的淨輪廓(50)透過如下迎流元件(24)限定,處理介質(10)輸出到該迎流元件上。 The method according to claim 13 wherein the processing medium (10) is output towards the respective upstream element (24) from a region within the net profile (50) of the upstream element (24) as viewed from above. The corresponding net profile (50) is defined by the upstream element (24) to which the processing medium (10) is output. 根據申請專利範圍第13或14項所述的方法,其中,該引導元件(24)用作為迎流元件(24)。 The method of claim 13 or 14, wherein the guiding element (24) is used as an inflow element (24). 根據申請專利範圍第15項所述的方法,其中,運輸輥(24)用作為迎流元件(24),該襯底(4)平放在該運輸輥(24)上。 The method according to claim 15 wherein the transport roller (24) is used as a flow-through element (24) which is placed flat on the transport roller (24).
TW101141010A 2011-11-12 2012-11-05 Apparatus and method for processing flat substrates TWI536444B (en)

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DE102005062528A1 (en) * 2005-12-16 2007-06-21 Gebr. Schmid Gmbh & Co. Substrate e.g. silicon wafer, surface treatment e.g. layer removal, device, has conveyor arranged beneath transport level so that substrate contacts level to moisten surface with process medium in direct contact between conveyor and surface
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