TW201344312A - Method for sealing two bonding substrates - Google Patents
Method for sealing two bonding substrates Download PDFInfo
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- TW201344312A TW201344312A TW101113438A TW101113438A TW201344312A TW 201344312 A TW201344312 A TW 201344312A TW 101113438 A TW101113438 A TW 101113438A TW 101113438 A TW101113438 A TW 101113438A TW 201344312 A TW201344312 A TW 201344312A
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Abstract
Description
本發明係關於一種封膠方法，尤指一種利用毛細原理對一雙層貼合基板的縫隙進行封膠的方法。The invention relates to a sealing method, in particular to a method for sealing a gap of a double-layer bonded substrate by using a capillary principle.
習知的面板封膠方法係利用人工的方式將一針筒內的密封膠注入兩玻璃基板周圍的縫隙，以封住該兩玻璃基板周圍的縫隙。然而，這種封膠方法不但會產生難以控制該針筒的針頭注入的深度的問題，而且該針筒的針頭也容易碰撞到該玻璃基板，而產生該針頭斷裂或是該玻璃基板受到損傷的問題。The conventional panel sealing method artificially injects a sealant in a syringe into a gap around the two glass substrates to seal the gap around the two glass substrates. However, this sealing method not only causes a problem that it is difficult to control the depth of needle injection of the syringe, but also the needle of the syringe easily collides with the glass substrate, and the needle is broken or the glass substrate is damaged. problem.
台灣第I357527號專利係提供一種封膠方法，其係先將一玻璃基板立置，並搭配一導引件接觸該玻璃基板的封膠邊緣以將其整平，接著再利用一點膠針筒於該玻璃基板之該封膠邊緣進行點膠作業。這種封膠方法係可降低該點膠針筒的針頭在點膠的過程中與該玻璃基板產生碰撞的機率。Taiwan Patent No. I357527 provides a method for sealing a glass substrate by first erecting a glass substrate and contacting a sealing edge of the glass substrate with a guiding member to level it, and then using a rubber syringe. Dispensing the edge of the sealant on the glass substrate. This method of sealing can reduce the probability of the needle of the dispensing cylinder colliding with the glass substrate during dispensing.
本發明係提供一種利用毛細作用的原理對一雙層貼合基板的邊緣進行封膠的封膠方法。The invention provides a sealing method for sealing the edge of a double-layer bonded substrate by the principle of capillary action.
該雙層貼合基板包括面對面的兩基板、夾於該兩基板之間的一結構層、以及夾於該兩基板之間且包圍住該結構層的一密封框膠，該密封框膠與該兩基板的邊緣之間係具有一毛細縫隙。The double-layered bonding substrate comprises two substrates facing each other, a structural layer sandwiched between the two substrates, and a sealing frame glue sandwiched between the two substrates and surrounding the structural layer, the sealing frame glue and the sealing layer There is a capillary gap between the edges of the two substrates.
該封膠方法包括提供提供一膠槽，該膠槽中容納有一膠液。接著，將該雙層貼合基板的邊緣接觸於該膠液的液面，以使該膠液沿該雙層貼合基板的毛細縫隙上升。並執行一固化作業，使填入該毛細縫隙中的膠液凝固，將該雙層貼合基板的邊緣封住。The method of encapsulation includes providing a glue tank containing a glue therein. Next, the edge of the double-layer bonded substrate is brought into contact with the liquid surface of the glue to raise the glue along the capillary gap of the double-layer bonded substrate. And performing a curing operation to solidify the glue filled in the capillary gap to seal the edge of the double-layer bonded substrate.
至於本發明的其它發明內容與更詳細的技術及功能說明，將揭露於隨後的說明。Other inventive aspects and more detailed technical and functional descriptions of the present invention are disclosed in the following description.
第一至三圖係為本發明之封膠方法的較佳實施利示意圖。本發明所提供之封膠方法係用以封住一雙層貼合基板1的邊緣，如第一圖所示。該雙層貼合基板1係可為一液晶面板，但並不以此為限。該雙層貼合基板1包括兩基板10、夾於該兩基板10之間的一結構層15、以及夾於該兩基板10之間且包圍住該結構層15的一密封框膠17。該密封框膠17與該兩基板15的邊緣之間係具有一毛細縫隙2，其寬度較佳係約5~7微米。此外，該兩基板10的厚度較佳約為0.5~0.7mm。The first to third figures are schematic diagrams of preferred embodiments of the encapsulation method of the present invention. The encapsulation method provided by the present invention is used to seal the edge of a double-layered bonded substrate 1, as shown in the first figure. The double-layered substrate 1 can be a liquid crystal panel, but is not limited thereto. The double-layered bonding substrate 1 includes two substrates 10 , a structural layer 15 sandwiched between the two substrates 10 , and a sealing frame seal 17 sandwiched between the two substrates 10 and surrounding the structural layer 15 . The seal sealant 17 and the edges of the two substrates 15 have a capillary slit 2, preferably having a width of about 5-7 microns. Further, the thickness of the two substrates 10 is preferably about 0.5 to 0.7 mm.
參閱第二圖，該封膠方法係先提供一膠槽3，該膠槽3中係容納有一膠液4。較佳地，該膠槽3更包括兩支撐部35延伸自其內壁面，且該膠液4的液面係大致齊平於該支撐部35的頂面，惟其介於該兩支撐部35之間的部分液面因表面張力的關係而會略為凸出，但整體而言並不會覆蓋到該支撐部35的頂面。此外，該膠液4較佳係可為一種照光硬化膠，例如：紫外線硬化樹脂(UV膠)，但並不以此為限。Referring to the second figure, the encapsulation method first provides a glue tank 3 in which a glue 4 is accommodated. Preferably, the glue groove 3 further includes two support portions 35 extending from the inner wall surface thereof, and the liquid surface of the glue liquid 4 is substantially flush with the top surface of the support portion 35, but the two support portions 35 are interposed therebetween. A part of the liquid surface is slightly convex due to the surface tension, but does not cover the top surface of the support portion 35 as a whole. In addition, the glue 4 is preferably an illuminating hardening adhesive, for example, an ultraviolet curing resin (UV adhesive), but is not limited thereto.
接著，並將如第一圖所示之雙層貼合基板1以立置的方式使其邊緣抵靠於該膠槽3的兩支撐部35的頂面且接觸於該膠槽3的膠液4的液面。此時，利用該雙層貼合基板1邊緣的毛細縫隙2本身所產生的毛細作用，使得該膠槽3中的膠液4被吸入到該雙層貼合基板1的毛細縫隙2中，並沿著該雙層貼合基板1的毛細縫隙2上升，如第三圖所示。值得注意的是，在該膠液4被吸入到該雙層貼合基板1的毛細縫隙2的同時，該膠槽3中的膠液4之液面高度係被保持在如同第二圖所示的液面高度，以使該膠液4可被持續地吸入該雙層貼合基板1邊緣的毛細縫隙2中。Then, the double-layered substrate 1 as shown in the first figure is placed in an upright manner so that the edge thereof abuts against the top surface of the two supporting portions 35 of the glue tank 3 and contacts the glue of the glue tank 3. 4 liquid level. At this time, the capillary action of the capillary slit 2 itself at the edge of the double-layer bonding substrate 1 causes the glue 4 in the glue tank 3 to be sucked into the capillary slit 2 of the double-layered bonding substrate 1, and The capillary gap 2 of the double-layered bonded substrate 1 rises as shown in the third figure. It should be noted that while the glue 4 is sucked into the capillary slit 2 of the double-layered substrate 1, the liquid level of the glue 4 in the glue tank 3 is maintained as shown in the second figure. The liquid level is such that the glue 4 can be continuously sucked into the capillary slit 2 at the edge of the double-layered substrate 1.
最後，再對填入該毛細縫隙2中的膠液4進行固化作業，使該膠液4凝固在該毛細縫隙2中，而將該雙層貼合基板1的邊緣封住，如第四圖所示。此外，由於該膠槽3內的膠液4的液面並未超過該支撐部35的頂面(第二圖)，故可避免該雙層貼合基板1的兩外側面100在該雙層貼合基板1的邊緣接觸到該膠槽3內的膠液4的液面時沾到該膠液4。Finally, the glue 4 filled in the capillary slit 2 is subjected to a curing operation to solidify the glue 4 in the capillary slit 2, and the edge of the double-layer bonded substrate 1 is sealed, as shown in the fourth figure. Shown. In addition, since the liquid surface of the glue 4 in the glue tank 3 does not exceed the top surface of the support portion 35 (second diagram), the two outer side surfaces 100 of the double-layered bonding substrate 1 can be avoided in the double layer. The glue 4 is adhered to when the edge of the bonded substrate 1 comes into contact with the liquid surface of the glue 4 in the glue tank 3.
相較於先前技術，由於本發明所提供的封膠方法是利用毛細作用的原理將該膠槽中的膠液吸入到該雙層貼合基板的毛細縫隙中。故，本發明的封膠方法可輕易達到將該雙層貼合基板的邊緣封住的目的，且可更有效地控制該膠液填入該毛細縫隙的深度，並避免該雙層貼合基板的邊緣受到外力撞擊而損壞的情形發生。Compared with the prior art, since the sealing method provided by the present invention utilizes the principle of capillary action, the glue in the glue tank is sucked into the capillary gap of the double-layered substrate. Therefore, the sealing method of the present invention can easily achieve the purpose of sealing the edge of the double-layered substrate, and can more effectively control the depth of the glue filling the capillary gap, and avoid the double-layer bonding substrate. The edge of the edge is damaged by an external impact.
無論如何，任何人都可以從上述說明獲得足夠教導，並據而了解本發明內容確實不同於先前技術，且具有產業上之利用性，及足具進步性。是本發明確已符合專利要件，爰依法提出申請。In any event, anyone can obtain sufficient teaching from the above description, and it is understood that the present invention is indeed different from the prior art, and is industrially usable and progressive. It is the invention that has indeed met the patent requirements and has filed an application in accordance with the law.
1．．．雙層貼合基板1. . . Double-layer bonded substrate
10．．．基板10. . . Substrate
15．．．結構層15. . . Structural layer
17．．．密封框膠17. . . Sealing frame glue
100．．．外側面100. . . Outer side
2．．．毛細縫隙2. . . Capillary gap
3．．．膠槽3. . . Plastic tank
35．．．支撐部35. . . Support
4．．．膠液4. . . Glue
第一圖為本發明之封膠方法用以封住的一雙層貼合基板及容納有一膠液的膠槽的立體示意圖。The first figure is a perspective view of a double-layered bonding substrate and a glue tank containing a glue for sealing by the sealing method of the present invention.
第二圖為本發明之封膠方法將該雙層貼合基板放入該膠槽的膠液之前的示意圖。The second figure is a schematic view of the sealing method of the present invention before the double-layered substrate is placed in the glue of the glue tank.
第三圖為本發明之封膠方法將該雙層貼合基板放入該膠槽的膠液之後的示意圖。The third figure is a schematic view of the sealing method of the present invention after the double-layered substrate is placed in the glue of the glue tank.
第四圖為被本發明之封膠方法封住一邊緣的雙層貼合基板的立體示意圖。The fourth figure is a perspective view of a two-layer bonded substrate sealed by an encapsulation method of the present invention.
1．．．雙層貼合基板1. . . Double-layer bonded substrate
10．．．基板10. . . Substrate
15．．．結構層15. . . Structural layer
17．．．密封框膠17. . . Sealing frame glue
100．．．外側面100. . . Outer side
2．．．毛細縫隙2. . . Capillary gap
3．．．膠槽3. . . Plastic tank
35．．．支撐部35. . . Support
4．．．膠液4. . . Glue
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101113438A TW201344312A (en) | 2012-04-16 | 2012-04-16 | Method for sealing two bonding substrates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101113438A TW201344312A (en) | 2012-04-16 | 2012-04-16 | Method for sealing two bonding substrates |
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| Publication Number | Publication Date |
|---|---|
| TW201344312A true TW201344312A (en) | 2013-11-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| TW101113438A TW201344312A (en) | 2012-04-16 | 2012-04-16 | Method for sealing two bonding substrates |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113000300A (en) * | 2021-02-26 | 2021-06-22 | 苏州希盟科技股份有限公司 | Dispensing method of fourth-side frameless display screen device |
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2012
- 2012-04-16 TW TW101113438A patent/TW201344312A/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113000300A (en) * | 2021-02-26 | 2021-06-22 | 苏州希盟科技股份有限公司 | Dispensing method of fourth-side frameless display screen device |
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