TW201343770A - Epoxy resin composite material, adhesive sheet and circuit substrate - Google Patents

Abstract

The present disclosure relates to an epoxy resin composite material. The epoxy resin composite material contains epoxy resin, polyester modified by a dimmer acid, and barium titanate. A weight content of the barium titanate in the epoxy resin composite material is in a range from 18.252% to 22.308%. The dielectric constant of the epoxy resin composite material is in a range from 22 to 27.5. The present invention also provides an adhesive sheet made by the epoxy resin composite material and a circuit substrate using the adhesive sheet.

Description

Epoxy resin composite material, film and circuit board

The present invention relates to the field of composite materials, and in particular to an epoxy resin composite material having flexibility and high dielectric constant, a film made of the epoxy resin composite material, and a circuit substrate made of the film.

With the continuous development of science and technology, ultra-small mobile phones, portable calculators and automotive electronic products have put forward higher requirements for miniaturization and light weight of products. In order to meet this demand, the degree of circuit integration in electronic products is constantly increasing, and the pattern of printed circuits is becoming increasingly high-density. The conductor width, conductor spacing, and via size of the circuit are also becoming smaller and smaller. Therefore, Flexible Printed Circuit (FPC, also known as soft board, flexible circuit board or flexible circuit board) gradually replaces the rigid circuit with its excellent properties such as lightness, toughness, flexibility and line fineness. Board or circuit board modules are increasingly used for electrical connections between various electronic components.

At present, the high molecular weight polymer which is commonly used for bonding films between multilayer wiring boards has a low dielectric constant, so that the dielectric constant of the film is also low, and the insulation of the film is also poor. As the flexible printed circuit board is continuously thinned, the less insulative film is easy to form a path between the two circuit layers of the circuit board that do not need to be connected, thereby easily connecting the electronic components that do not need to be connected, thereby affecting the various electronic components on the circuit board. The components work properly. In addition, the polymer is mostly a hard material and is easily brittle, which is difficult to apply to a flexible printed circuit board.

Therefore, it is necessary to provide an epoxy resin composite material having flexibility and a high dielectric constant, a film made of the epoxy resin composite material, and a circuit substrate obtained using the film.

Hereinafter, an epoxy resin composite material, a film, and a circuit substrate will be described by way of examples.

An epoxy resin composite material comprising an epoxy resin, an acid-terminated dimer acid-modified polyester, and barium titanate. The barium titanate accounts for 18.252% to 22.308% by weight of the epoxy resin composite. The epoxy resin composite has a dielectric constant of 22 to 27.5. The epoxy resin composite has a viscosity of from 50,000 cps to 100,000 cps.

An epoxy resin composite material comprising an epoxy resin, an acid-terminated dimer acid-modified polyester, a barium titanate, a hardener, a solvent, a catalyst, and an antifoaming agent. The epoxy resin accounts for 9.12% to 11.154% by weight of the epoxy resin composite. The acid group-terminated dimer acid-modified polyester accounts for 6.84% to 7.76% by weight of the epoxy resin composite. The barium titanate accounts for 18.252% to 22.308% by weight of the epoxy resin composite. The epoxy resin composite has a dielectric constant of 22 to 27.5. The epoxy resin composite has a viscosity of from 50,000 cps to 100,000 cps.

A film comprising a bonded release substrate layer and an epoxy composite layer. The epoxy resin composite layer is made by baking an epoxy resin composite material. The epoxy resin composite material includes an epoxy resin, an acid-terminated dimer acid-modified polyester, and barium titanate. The barium titanate accounts for 18.252% to 22.308% by weight of the epoxy resin composite. The epoxy resin composite has a dielectric constant of 22 to 27.5. The epoxy resin composite has a viscosity of from 50,000 cps to 100,000 cps.

A circuit substrate comprising a first flexible substrate, a second flexible substrate, and an epoxy resin composite layer bonded between the first flexible substrate and the second flexible substrate. The epoxy resin composite material layer is made of an epoxy resin composite material by baking and pressing. The epoxy resin composite material includes an epoxy resin, an acid-terminated dimer acid-modified polyester, and barium titanate. The barium titanate accounts for 18.252% to 22.308% by weight of the epoxy resin composite. The epoxy resin composite has a dielectric constant of 22 to 27.5. The epoxy resin composite has a viscosity of from 50,000 cps to 100,000 cps.

Compared with the prior art, the epoxy resin composite material provided by the technical solution uniformly disperses barium titanate in the middle and has a high dielectric constant. The epoxy resin and the acid-terminated dimer acid-modified polyester contained in the epoxy resin composite material have good flexibility and adhesion. Thus, the epoxy resin composite can be used as a flexible high dielectric constant film material for flexible circuit boards.

The epoxy resin composite material provided by the present technical solution, the film made of the epoxy resin composite material, and the circuit substrate obtained by using the film are further described in detail below with reference to the embodiments.

A first embodiment of the present invention provides an epoxy resin composite material. The epoxy resin composite has a viscosity of from 50,000 cps to 100,000 cps. The epoxy resin composite material mainly consists of a first colloid, a second colloid, a hardener, and a catalyst.

The first colloid includes an epoxy resin, a solvent, and an antifoaming agent.

The epoxy resin may be a bisphenol A type epoxy resin. The epoxy resin is present in the epoxy resin composite in an amount of from about 9.126% to 11.154%, preferably 10.14% by weight.

The solvent is Dipropylene Glycol Monomethyl Ether, and the solvent is contained in the epoxy resin composite in an amount of about 54.738% to 66.902%, preferably 60.82%. The solvent is used to dissolve the epoxy resin to form a uniform liquid dispersion.

The antifoaming agent is used to eliminate the foam in the above liquid dispersion system, and the defoaming agent is contained in the epoxy resin composite in an amount of about 0.459% to 0.561% by weight, preferably 0.51% by weight. The antifoaming agent may be a commercially available decane coupling agent A-187.

The second colloid includes barium titanate and an acid group-terminated dimer acid-modified polyester.

The barium titanate is an inorganic substance having a high dielectric constant for increasing the dielectric constant of the epoxy resin composite. The barium titanate is present in the epoxy resin composite in an amount of from about 18.252% to 22.308%, preferably 20.28%. The content of barium titanate in the composite material can be determined according to the dielectric properties of the composite material according to actual needs.

The acid-terminated dimer acid-modified polyester is supplied by UNIQEMA, and the weight percentage of the epoxy resin composite is from 6.84% to 7.76%, preferably 7.6%. In the present embodiment, the acid-terminated dimer acid-modified polyester is UCN06.001 supplied by UNIQEMA.

The hardener is a hardener for a polyamine-based epoxy resin for hardening the composite material. In the present embodiment, the hardener used is TOHMIDE 225-X supplied by Sanhe Synthetic Co., Ltd. The hardener is present in the epoxy resin composite in an amount of from about 0.423% to about 0.517%, preferably 0.47% by weight.

The catalyst is 2-heptadecylimidazole. The catalyst is present in the epoxy resin composite in an amount of from about 0.172% to about 0.198% by weight, preferably 0.18% by weight.

In the epoxy resin composite material provided by the technical solution, the epoxy resin has a weight percentage of about 10.14%, and the acid group-terminated dimer acid modified polyester has a weight percentage of about 7.06%. The barium titanate has a weight percentage of about 20.28%, the hardener has a weight percentage of about 0.47%, the catalyst has a weight percentage of about 0.18%, and the solvent has a weight percentage of about 60.82%. The weight percentage of the foaming agent is about 0.51%.

Referring to FIG. 1, the manufacturing method of the epoxy resin composite material comprises the following steps:

In the first step, an epoxy resin, a solvent and an antifoaming agent are mixed to obtain a first colloid. Specifically, first, the epoxy resin is dissolved in a solvent such as dipropylene glycol monomethyl ether at room temperature to obtain a solution; secondly, an antifoaming agent is added to the solution and stirred for about 3 hours to 4 hours, preferably 3.5. The first colloid is obtained by eliminating bubbles in the solution and completely dissolving the epoxy resin, the solvent, and the antifoaming agent. In the present embodiment, the epoxy resin used is a bisphenol A type epoxy resin. Of course, the epoxy resin used is not limited to the bisphenol A type epoxy resin provided in this embodiment, and it may also be other types of epoxy resins.

In the second step, barium titanate is added to the acid-terminated dimer acid-modified polyester to be stirred to obtain a second colloid. Specifically, barium titanate is added to the acid group-terminated dimer acid-modified polyester and stirred for about 3 hours to 3.5 hours, preferably 3 hours, to obtain a second colloid.

In the third step, the hardener, the catalyst, the first colloid and the second colloid are mixed and ground and dispersed to obtain an epoxy resin composite material.

In this embodiment, the first colloid, the second colloid, the hardener, and the catalyst are ground and dispersed by a three-roller type grinding and dispersing machine. The first colloid, the second colloid, the hardener, and the catalyst are placed in a three-roll type grinding and dispersing machine according to the respective contents described above, and a three-roll type grinding and dispersing machine is started to perform grinding and dispersing, thereby making the solid components in the above components uniform. Dispersed in the liquid component to form a uniformly dispersed epoxy resin composite. In this embodiment, in the above components, the epoxy resin has a weight percentage of about 10.14%, and the acid-terminated dimer acid-modified polyester has a weight percentage of about 7.06%. The barium titanate has a weight percentage of about 20.28%, the hardener has a weight percentage of about 0.47%, the catalyst has a weight percentage of about 0.18%, and the solvent has a weight percentage of about 60.82%. The weight percentage of the agent is about 0.51%.

In order to obtain different high dielectric constant epoxy resin composite materials, it can be controlled by changing the amount of barium titanate used in the feeding. When the barium titanate accounts for between 18.252% and 22.308% by weight of the composite, the epoxy resin composite has a dielectric constant of 22 to 27.5. Among them, the higher the content of barium titanate in the epoxy resin composite material, the higher the dielectric constant of the epoxy resin composite material.

The epoxy resin composite material produced by the method has a dielectric constant of between 22 and 27.5, is an epoxy resin composite material having a high dielectric constant, and the barium titanate is dispersed in the epoxy resin and the In the acid-terminated dimer acid-modified polyester, the viscosity of the epoxy resin composite having barium titanate is from 50,000 cps to 100,000 cps, that is, the epoxy resin composite material has not only High dielectric constant with good flexibility and adhesion.

The epoxy resin composite material provided by the technical solution uniformly disperses barium titanate in the middle and has a high dielectric constant. The epoxy resin and the acid-terminated dimer acid-modified polyester contained in the epoxy resin composite material have good flexibility and adhesion. Thus, the epoxy resin composite can be used as a flexible high dielectric constant film material for flexible circuit boards. The epoxy resin composite material manufacturing method provided by the technical solution can uniformly disperse barium titanate in the epoxy resin and the acid group-terminated dimer acid-modified polyester, and has the advantages of simple operation and easy realization.

Referring to FIG. 2, a film 10 according to a second embodiment of the present invention includes a release substrate layer 11, an epoxy resin composite layer 12, and a release liner 13 which are sequentially stacked.

The release substrate layer 11 is used to carry the epoxy resin composite layer 12. The release substrate layer 11 may be a PET release film, that is, the substrate is PET, and one or two opposite surfaces of the substrate are coated with a material such as eucalyptus to form a single-sided or double-sided release surface. The release surface is capable of adhering to the epoxy resin composite layer 12 formed thereon, but is also easy to separate the release substrate layer 11 from the epoxy composite layer 12. In the present embodiment, the release substrate layer 11 employs a single-sided PET release film having a first release surface 110. The material of the release substrate layer 11 is not limited to the PET release film provided in the present embodiment, and may be other materials having a release surface such as a release paper or the like. The release paper may be slick paper or coated paper.

The release barrier layer 13 is used to protect the epoxy resin composite layer 12. The film 10 may also not include the release liner 13 when the produced film 10 does not need to be transported or stored for a long time. The material of the release barrier layer 13 may be the same as that of the release substrate layer 11, that is, it may be a PET release film, which may also be other materials having a release surface, such as various release papers and the like. The release spacer 13 has a second release surface 130, and the second release surface 130 and the epoxy composite layer 12 are in contact with each other, so that when the multilayer film 10 is stacked on each other during transport or storage, the release is isolated. Layer 13 can isolate film 10 in contact with each other to avoid sticking to each other. Moreover, during the transportation and storage process, the release substrate layer 11 and the release barrier layer 13 can also isolate the epoxy resin composite layer 12 from the outside to prevent the epoxy resin composite layer 12 from being contaminated or moisture absorbing.

The epoxy resin composite layer 12 is used for insulation and bonding. The thickness of the epoxy resin composite layer 12 can be set according to actual needs. The epoxy resin composite layer 12 is disposed between the first release surface 110 of the release substrate layer 11 and the second release surface 130 of the release liner 13. The epoxy composite layer 12 has opposing first and second surfaces 120, 121. The first surface 120 is in contact with the release substrate layer 11. The second surface 121 is in contact with the release spacer 13 . The epoxy resin composite layer 12 is formed by baking the epoxy resin composite material provided in the first embodiment. The epoxy resin composite layer 12 is mainly composed of an epoxy resin, an acid group-terminated dimer acid-modified polyester, barium titanate, a hardener, a catalyst, a solvent, and an antifoaming agent, and is preferably in a semi-cured state.

Referring to FIG. 3 together, the method for manufacturing the film 10 includes the following steps:

In a first step, a release substrate layer 11 is provided having a first release surface 110. In the present embodiment, the release substrate layer 11 is a PET release film.

In the second step, the epoxy resin composite material in the first embodiment is provided, and the epoxy resin composite material is coated on the surface of the release substrate layer 11 to form an epoxy resin composite material layer 12.

In the present embodiment, a liquid epoxy resin composite material is applied to the first release surface 110 of the release substrate layer 11 by a slit coater to form an epoxy resin composite material layer 12. In the present embodiment, since the coating is performed by the slit coater, the thickness of the formed epoxy resin composite material layer 12 can be controlled to be satisfactory and the coating layer is uniform. The epoxy composite layer 12 has opposing first and second surfaces 120, 121. The first surface 120 is in contact with the first release surface 110 of the release substrate layer 11. The second surface 121 is away from the release substrate layer 11.

In the third step, the epoxy resin composite layer 12 is baked to volatilize most of the solvent in the epoxy resin composite layer 12. In this embodiment, during the baking process of the epoxy resin composite layer 12, the baking is continued for about 18 to 22 minutes, preferably 20 minutes, and the temperature maintained during baking is about 72 degrees Celsius to 88. Celsius, preferably 80 degrees Celsius. By performing the baking treatment, the dipropylene glycol monomethyl ether in the epoxy resin composite layer 12 is volatilized by 95% to 99%, preferably 98%.

It will be appreciated that the duration of the bake and the temperature maintained during bake can be determined based on the actual thickness of the epoxy composite layer 12. When the thickness of the epoxy resin composite layer 12 is large, the treatment time may be appropriately extended or the temperature may be appropriately increased, and when the thickness of the epoxy resin composite layer 12 is small, the treatment time may be appropriately shortened or the temperature is appropriate. It is lowered to ensure that most of the dipropylene glycol monomethyl ether in the epoxy resin composite layer 12 can be volatilized.

In the fourth step, the epoxy resin composite material layer 12 after baking is attached to the surface of the release substrate layer 11 (ie, the second surface 121) to adhere to the release barrier layer 13.

The release barrier 13 is used to protect the epoxy composite layer 12 during storage and transportation. The release barrier layer 13 may be a release PET film or a variety of release papers. The release spacer 13 has a second release surface 130. The second release surface 130 and the second surface 121 of the epoxy resin composite layer 12 are adhered to each other such that the epoxy resin composite layer 12 is adhered to the first release layer of the release substrate layer 11 . The surface 110 is between the second release surface 130 of the release liner 13. It will be understood by those skilled in the art that when the formed film 10 is directly used for circuit board fabrication, the release surface layer may not be attached to the second surface 121 of the epoxy resin composite layer 12. 13.

After this step, the film 10 can be further cut to form the film 10 into a desired shape for ease of use. When the formed film 10 is not directly applied, the film 10 can be stored in a low temperature environment, and the stored temperature can be about 5 degrees Celsius.

Referring to FIG. 4 , a circuit substrate 200 according to a third embodiment of the present invention includes a first flexible substrate 201 , a second flexible substrate 203 , and a first flexible substrate 201 and a second flexible substrate 203 . Between the epoxy resin composite layer 205.

The first flexible substrate 201 and the second flexible substrate 203 may be single-sided flexible copper clad laminates. The first flexible substrate 201 includes a first conductive layer 2011 and a first insulating layer 2013 that are bonded together. The second flexible substrate 203 includes a second conductive layer 2031 and a second insulating layer 2033 that are bonded together.

The first conductive layer 2011 and the second conductive layer 2031 are both used to form a conductive pattern for signal transmission and processing. The most common materials for the first conductive layer 2011 and the second conductive layer 2031 are copper and copper alloys, but may also be aluminum, aluminum alloys, silver, silver alloys or other conductive materials.

The first insulating layer 2013 and the second insulating layer 2033 are both used to support the corresponding conductive layers, both of which are composed of a flexible material. The most common material of the first insulating layer 2013 and the second insulating layer 2033 is Polyimide (PI), but it may also be polyethylene terephtalate (PET) or polynaphthalene. Polyethylene naphthalate (PEN).

The epoxy composite layer 205 is a flexible layer of high dielectric material for bonding the first insulating layer 2013 and the second insulating layer 2033. The epoxy resin composite layer 205 is made of the epoxy resin composite material provided by the first embodiment. The epoxy resin composite layer 205 includes an acid-terminated dimer acid-modified polyester-modified epoxy resin, barium titanate, a hardener, a catalyst, a solvent, and an antifoaming agent. It is of course also understood by those skilled in the art that the first flexible substrate 201 and the second flexible substrate 203 can also be double-sided copper clad laminates. In this case, the epoxy resin composite layer 205 can be bonded to the first layer. Two copper faces of the flexible substrate 201 and the second flexible substrate 203.

The manufacturing method of the circuit substrate 200 as described above includes the following steps:

Referring to FIG. 5, in a first step, the first flexible substrate 201 is provided. The first flexible substrate 201 includes a first conductive layer 2011 and a first insulating layer 2013.

Referring to FIG. 6, the second step, the film 10 in the second embodiment is provided, and the release spacer 13 is removed from the epoxy composite layer 12.

Referring to FIG. 7, in the third step, the epoxy resin composite layer 12 is layered on the first insulating layer 2013, and the epoxy resin composite layer 12 is in contact with the first insulating layer 2013.

The release substrate layer 11 needs to be removed from the epoxy composite layer 12 prior to subsequent steps. Specifically, the release substrate layer 11 may be removed from the epoxy resin composite layer 12 before the epoxy resin composite material layer 12 is stacked on the first insulation layer 2013, or may be epoxy resin. After the composite material layer 12 is stacked on the first insulating layer 2013, the release substrate layer 11 is removed from the epoxy resin composite layer 12.

Referring to FIG. 8 and FIG. 9, the fourth step is to provide the second flexible substrate 203 and stack the second flexible substrate 203 on the epoxy composite layer 205 such that the second insulating layer 2033 and the ring The oxy-resin composite layer 205 is in contact.

In the fifth step, the first flexible substrate 201, the second flexible substrate 203, and the epoxy composite layer 12 are pressed together, so that the epoxy composite layer 12 is cured and bonded to the first insulating layer 2013 and the second insulation. The layer 2033 is thereby obtained as a circuit substrate 200 having an epoxy resin composite layer 205 (see FIG. 4). The epoxy resin composite layer 205 includes an acid-terminated dimer acid-modified polyester-modified epoxy resin.

The curing means that the acid-terminated dimer acid-modified polyester in the epoxy resin composite layer 12 is polymerized with the epoxy resin to form an acid group at a temperature of about 150 to 170 degrees Celsius. The blocked dimer acid-modified polyester modified epoxy resin, that is, the epoxy group at the end of the epoxy resin reacts with the carboxyl group at the terminal of the acid-terminated dimer acid-modified polyester to form an ester group, thereby obtaining A process comprising a polymer of alternating units of alternating epoxy resin repeating units and acid-terminated dimer acid-modified polyesters.

In the present embodiment, when the pressing is performed, the pressing temperature is about 150 degrees Celsius to 170 degrees Celsius, preferably 160 degrees Celsius, and the pressing time is about 2.5 hours to 3.5 hours, preferably 3 hours, thereby making the epoxy resin composite material Layer 12 becomes a more flexible epoxy resin composite layer 205.

Specifically, during the pressing process, the acid-terminated dimer acid-modified polyester in the epoxy resin composite layer 12 is polymerized with the epoxy resin to form an acid-terminated dimer acid-modified polyester modified. The epoxy resin, that is, the epoxy group at the end of the epoxy resin reacts with the carboxyl group at the terminal of the acid-terminated dimer acid-modified polyester to form an ester group, thereby obtaining an alternating epoxy resin repeating unit and an acid. A polymer of a repeating unit of a base-terminated dimer acid-modified polyester. The acid-terminated dimer acid-modified polyester-modified epoxy resin has better flexibility than the epoxy resin before the polymerization and the acid-terminated dimer acid-modified polyester. Further, under the bonding condition, the epoxy resin composite material layer 205 is bonded to the first insulating layer 2013 and the second insulating layer 2033, thereby obtaining the circuit substrate 200 as a whole. The circuit board produced by the present technical solution can meet the test standards of mechanical properties, chemical properties, physical properties, and electrical characteristics of IPC-TM-650.

The circuit substrate provided by the technical solution has an epoxy resin composite layer disposed between two adjacent conductive layers, and the epoxy resin composite layer has a high dielectric constant due to uniform dispersion of barium titanate. When the two conductive layers of the circuit substrate are formed to form a conductive line, the epoxy resin composite material layer can have better insulation properties. Moreover, the epoxy resin composite layer has good flexibility, can increase the flexural performance of the flexible circuit board, and can reduce the production cost of the circuit board.

However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

10. . . film

11. . . Release substrate layer

12. . . Epoxy resin composite layer

13. . . Release barrier

110. . . First release surface

130. . . Second release surface

120. . . First surface

121. . . Second surface

200. . . Circuit substrate

201. . . First flexible substrate

203. . . Second flexible substrate

205. . . Epoxy resin composite layer

2011. . . First conductive layer

2013. . . First insulating layer

2031. . . Second conductive layer

2033. . . Second insulating layer

1 is a flow chart of a method for fabricating an epoxy resin composite material according to a first embodiment of the present invention.

2 is a schematic cross-sectional view of a film provided by a second embodiment of the present invention.

Figure 3 is a flow chart showing the method of fabricating the film of Figure 2.

4 is a schematic cross-sectional view showing a circuit substrate according to a third embodiment of the present invention.

Figure 5 is a cross-sectional view of a first flexible substrate provided by a third embodiment of the present invention.

Figure 6 is a cross-sectional view of a film with a release liner removed in accordance with a third embodiment of the present invention.

7 is a cross-sectional view of the third embodiment of the present invention, after the epoxy resin composite material layer of the film of FIG. 6 is aligned on the first insulating layer of the first flexible substrate of FIG. 5.

Figure 8 is a cross-sectional view of a second flexible substrate provided by a third embodiment of the present invention.

9 is a cross-sectional view showing the second insulating layer of the second flexible substrate of FIG. 8 being aligned on the epoxy resin composite layer of FIG. 7 according to a third embodiment of the present invention.

Claims (13)

An epoxy resin composite material comprising an epoxy resin, an acid-terminated dimer acid-modified polyester, and barium titanate, and the weight percentage of the barium titanate in the epoxy resin composite material From 18.252% to 22.308%, the epoxy resin composite has a dielectric constant of 22 to 27.5, and the epoxy resin composite has a viscosity of 50,000 cps to 100,000 cps. The epoxy resin composite material according to claim 1, wherein the epoxy resin accounts for 9.12% to 11.154% by weight of the epoxy resin composite material. The epoxy resin composite material according to claim 1, wherein the acid-terminated dimer acid-modified polyester accounts for 6.84% by weight of the epoxy resin composite material. To 7.76%. The epoxy resin composite material according to claim 1, wherein the epoxy resin composite material composite further comprises a hardener, a solvent, a catalyst, and an antifoaming agent. The epoxy resin composite material according to claim 4, wherein the hardener is a hardener for a polyamine-based epoxy resin, and the hardener is used in the epoxy resin composite material. The percentage is 0.423% to 0.517%, the solvent is dipropylene glycol monomethyl ether, and the solvent accounts for 54.738% to 66.902% by weight of the epoxy resin composite, and the catalyst is 2-heptadecylimidazole, the catalyst is present in the epoxy resin composite in an amount of 0.172% to 0.198% by weight, the antifoaming agent is a decane coupling agent, the defoaming agent The weight percentage of the epoxy resin composite is 0.459% to 0.561%. An epoxy resin composite material comprising an epoxy resin, an acid-terminated dimer acid-modified polyester, a barium titanate, a hardener, a solvent, a catalyst, and an antifoaming agent, wherein the epoxy resin is in the ring The weight percentage of the oxygen resin composite material is 9.126% to 11.154%, and the weight percentage of the acid group-terminated dimer acid modified polyester in the epoxy resin composite material is 6.84. % to 7.76%, the weight percentage of the barium titanate in the epoxy resin composite material is 18.252% to 22.308%, and the dielectric constant of the epoxy resin composite material is 22 to 27.5, the ring The oxyresin composite has a viscosity of from 50,000 cps to 100,000 cps. The epoxy resin composite material according to claim 6, wherein the hardener is a hardener for a polyamine-based epoxy resin, and the hardener is occupied by the epoxy resin composite material. The weight percentage is 0.423% to 0.517%, the solvent is dipropylene glycol monomethyl ether, and the solvent accounts for 54.738% to 66.902% by weight of the epoxy resin composite, the catalyst Is 2-heptadecylimidazole, the catalyst is present in the epoxy resin composite in a weight percentage of 0.172% to 0.198%, the antifoaming agent is a decane coupling agent, the defoaming agent The weight percentage of the agent in the epoxy resin composite is from 0.459% to 0.561%. A film comprising a release substrate layer, the improvement being that the film further comprises an epoxy resin composite prepared by baking the epoxy resin composite material according to any one of claims 1-7. a material layer, the epoxy resin composite layer being attached to the release substrate layer. The film of claim 8, wherein the epoxy resin composite layer is an epoxy resin composite material according to any one of claims 1 to 7 at 72 degrees Celsius to 88 degrees Celsius. Made by baking after 18 minutes to 22 minutes, the epoxy resin composite layer is in a semi-cured state. The film of claim 8, wherein the film further comprises a release liner, the epoxy composite layer being located between the release substrate layer and the release liner. A circuit substrate comprising a first flexible substrate and a second flexible substrate, wherein the circuit substrate further comprises an epoxy resin bonded between the first flexible substrate and the second flexible substrate The composite material layer is produced by baking and pressing the epoxy resin composite material according to any one of claims 1 to 7. The circuit board according to claim 11, wherein the epoxy resin composite material layer is an epoxy resin composite material according to any one of claims 1 to 7 before 72 degrees Celsius to 88 degrees Celsius. Next, baking is performed for 18 minutes to 22 minutes; after baking, it is made at a temperature of 150 degrees Celsius to 170 degrees Celsius and pressed for 2.5 hours to 3.5 hours, and the epoxy resin composite material is in a cured state. The circuit substrate of claim 11, wherein the first flexible substrate comprises a first insulating layer and a first conductive layer, and the second flexible substrate comprises a second insulating layer. And a second conductive layer, the epoxy resin composite layer being located between the first insulating layer and the second insulating layer.