TW201343012A - Method for supporting flexible substrate and structure of composite substrate - Google Patents

Abstract

In one exemplary embodiment, a method for supporting flexible substrate is adopting a manner of fulfilling free static charge on a surface of a substrate carrier at a determined value; closing the substrate carrier to the flexibly substrate for bonding by the free static charge; and sealing the surrounding of the flexible substrate with sealant to prevent static charge leaking such that the substrate carrier tightly supports the flexible substrate.

Description

Method for supporting flexible substrate and structure of composite substrate

The present disclosure relates to a method of supporting a flexible substrate and a structure of a composite substrate.

Soft electronics covers a wide range of technologies. From the application point of view, it can be divided into logic and memory components, displays, solar cells, light sources and other products. Soft electronic technology is characterized by the use of flexible substrates, including metal, plastic, paper, and even ultra-thin glass, which makes the product flexible, and can be applied to the roll-to-roll (R2R) process for mass production. The substrate operation mode suitable for the R2R manufacturing process is very important, and the relationship between various devices and substrate transfer affects the measurement rate and product quality. For example: substrate movement accuracy, alignment control accuracy, prevention of substrate surface collapse, and flexible substrate transfer and back-end processing technology remains to be developed. Generally, the manufacturing process of the back surface of the flexible substrate is time consuming and increases the material cost, and neither the plastic substrate nor the thin glass is insufficient in rigidity due to its inherent rigidity, and it is difficult to maintain a high yield in the process. Therefore, in combination with the low cost and yield stability of the flexible substrate back-end process material, a rigid carrier or carrier is required to support the flexible substrate for processing in the post-production process.

Traditionally, tape is applied to the periphery of a flexible substrate, electrostatic adsorption is simply applied, or a flexible substrate is attached to the carrier. However, these methods cannot effectively prevent the flexible substrate and the supported carrier from remaining after undergoing various photovoltaic device processes. High yield and economic efficiency of production. In order to efficiently carry out the flexible substrate in the process flow of the sheet processing, various photovoltaic elements are generally fabricated on a flexible substrate using a sheet process and equipment. The adsorption or adhesion of the carrier and the flexible substrate is an extremely important step, and the adhesion and flatness directly affect the yield of the flexible substrate.

A schematic diagram of the first A diagram and the first B diagram illustrates the prior process of the sheet-like process and equipment of the flexible substrate. As shown in FIG. A, the tape-shaped flexible substrate 110 uses the roll-to-roll roller 120 to wind the tape-shaped flexible substrate 110, and then passes through a plurality of cleaning processes, for example, by chemical cleaning 130, deionized water cleaning 140. , and air drying 150 steps to prepare for cutting. As shown in FIG. B, after the tape-shaped flexible substrate 110 is subjected to a multi-pass cleaning process, the tape-shaped flexible substrate 110 is cut by the laser to become the sheet-like flexible substrate 170.

There are many related literatures or techniques for adsorbing or adhering a carrier to a flexible substrate. For example, there is a literature on the use of a flexible liquid crystal display to make a process on a hard board. This is done by drawing a groove on the hard board and applying the adhesive on the hard board under vacuum. The adhesive is hardened to produce an adhesive effect, and finally the soft display can be used to perform the subsequent processing on the hard board. This method facilitates the processing of the flexible substrate, but in the end it is not easy to remove the flexible substrate.

One documentary technique reveals that an adhesive layer is formed by means of assembly. The area of the adhesive layer is larger than that of the flexible substrate of the photovoltaic element, and the area of the desired area is selected by means of cutting. The adhesive layer is transparent, so that the adhesive layer is transparent. After the photovoltaic element is fabricated, it can be directly coated on the surface or assembled in the post-production process.

Another technique in the literature is to use solder to connect the upper and lower substrates, thereby conducting the wires and bonding the substrate, and the electrode contacts are insulated by insulating materials between the two substrates.

In the prior art, the carrier substrate is adsorbed or adhered to a flexible substrate to support the flexible substrate for subsequent processing. However, since the adhesion and flatness of the carrier and the flexible substrate are not good, it is not easy to effectively subject the carrier and the flexible substrate to various post-production processes to maintain high yield, and it is not easy to remove the flexible substrate. Therefore, there is a need for a method for directly adsorbing a carrier and a flexible substrate to closely support the flexible substrate, and to make a diversified and large number of module products in conjunction with the R2R manufacturing process, and to easily remove the flexible substrate and control the heavy work. In order to facilitate the processing of the post-production process.

The embodiments of the present disclosure can provide a method of supporting a flexible substrate and a structure of a composite substrate.

In one embodiment, the disclosed subject matter relates to a method of supporting a flexible substrate, the method comprising: causing a carrier to carry a mean free electron; the carrier carrying a mean free electron, the carrier Adjacent to the flexible substrate, the soft substrate is adsorbed by the free electrons; and the periphery of the flexible substrate is sealed with an adhesive material to prevent the free electrons from overflowing, so that the carrier plate closely supports the flexible substrate.

In another example, the disclosed subject matter relates to a composite substrate structure comprising a carrier, a flexible substrate, free electrons, and an adhesive material. A surface of the carrier carries a mean free electron, and the soft substrate is adsorbed by the free electrons, and the periphery of the flexible substrate is sealed with the adhesive material.

The above and other advantages of the present disclosure will be described in detail below with reference to the following drawings, detailed description of the embodiments, and claims.

The flexible substrate is used to fabricate photovoltaic elements on a flexible substrate using a sheet process and equipment in a process flow for sheet processing. Since the flexible substrate is insufficient in rigidity, a rigid carrier or carrier plate is required to support the flexible substrate for processing in the subsequent stage manufacturing process.

The present disclosure provides a technique for supporting a flexible substrate. This technique directly utilizes a free electron adsorption method to enable the carrier to closely support the flexible substrate. The carrier plate is closely adhered to the flexible substrate and can be fabricated in the back stage to eliminate the free electrons, so that the flexible substrate can be easily removed and the processing operation can be facilitated.

The second figure is a flow chart of an embodiment of a composite substrate structure in accordance with the present disclosure. Referring to the second figure, a carrier carries a mean free electron (step 210). After the carrier carries a mean free electron, the carrier is placed adjacent to the flexible substrate, and the flexible substrate is freely adsorbed by the electron. (Step 220), the periphery of the flexible substrate is sealed with an adhesive material to prevent the free electron charge from overflowing, so that the carrier plate closely supports the flexible substrate (step 230).

The third A and third B are cross-sectional views of an embodiment of the composite substrate structure according to the present disclosure to illustrate a method of supporting the flexible substrate 320 by the carrier 310. Referring to FIG. 3A, the surface of the carrier 310 is first carried with a mean free electron 360, and then the carrier 310 is brought close to the flexible substrate 320 to adsorb the flexible substrate 320 with the free electrons 360. The free electrons 360 will cause the surface of the flexible substrate 320 and the carrier 310 to generate polarized charges 350 opposite to the free electrons 360 electrodes, so that the carrier 310 and the flexible substrate 320 are closely attracted together. The manner in which the surface of the carrier 310 carries a mean free electron 360 is, for example, via a resident. The manner in which the carrier 310 is brought close to the flexible substrate 320 is, for example, tilted down so that the flexible substrate 320 and the carrier 310 are gradually and uniformly adhered. The approach to the flexible substrate is, for example, by using a movable arm 330 to hold the carrier 310 to control the proximity of the flexible substrate 320. In addition, in order to enhance the adsorptivity, the mean value of the free electrons 360 on the surface of the flexible substrate 320 can be adjusted to be greater than 300 mV. The carrier 310 is, for example, one of the aforementioned ones of glass, metal plate, hard plastic plate, and ceramic plate. The flexible substrate 320 is, for example, one of the above-described soft glass, a soft plastic substrate, and a flexible metal plate having a thickness of less than 100 μm.

Referring to FIG. 3B, the periphery of the flexible substrate 320 is sealed with an adhesive material 340. The adhesive material 340 prevents the free electrons 360 from overflowing, thereby allowing the carrier 310 to closely adsorb and support the flexible substrate 320, so that the back-end process can be performed. The effect of processing. The flexible substrate 320, which is closely supported by the carrier 310, undergoes various photo-electric component fabrication processes, and the fabrication process can include multiple high temperature and acidic process processes. The adhesive material 340 is, for example, one of the above-mentioned organic adhesive material, inorganic adhesive material, single adhesive material, and metal adhesive material.

The fourth figure is a top view of an embodiment of a composite substrate structure in accordance with the present disclosure. The fifth figure is a side view of an embodiment of a composite substrate structure in accordance with the present disclosure. Referring to the fourth and fifth figures, the composite substrate structure includes a carrier 310, a flexible substrate 320, an adhesive material 340, and free electrons 360. In the composite substrate structure, the carrier 310 has free electrons 360 thereon, a soft substrate 320 thereon, and an adhesive material 340 around the flexible substrate 320 to prevent the flexible substrate 320 from dissipating the free electrons 360 during various fabrication processes.

6A to 6C are cross-sectional views showing an embodiment of the composite substrate structure according to the present disclosure, showing how to remove the process-treated flexible substrate. Referring to FIG. 6A, after the flexible substrate 320 closely supported by the carrier 310 is subjected to various photo-electric component fabrication processes, the photovoltaic component 610 has been fabricated on the flexible substrate 320, and the laser-processed soft substrate 320 is laser-cut 620 to remove the softness. Adhesive 340 around the substrate 320.

Referring to FIG. 6B, a voltage 630 is again applied to the carrier 310, and the free electrons 360 on the carrier 310 and the polarized charges 350 on the flexible substrate 320 are removed, so that the carrier 310 can be separated and processed. The flexible substrate 320 is removed, and the flexible substrate 320 that has been processed by the process is removed. It is worth noting that the voltage 630 is not limited to a positive voltage or a negative voltage, but may also be a ground voltage.

Referring to the sixth C diagram, the removed flexible substrate 320 that has been processed may be placed on the support layer 640 in the cassette to facilitate the subsequent transport of the flexible substrate 320.

The composite substrate is formed by adsorbing the carrier plate and the flexible substrate through a free electron. The composite substrate is formed by tilting the slab so that the free electrons of the carrier adsorb the soft substrate.

In summary, the embodiments of the present disclosure provide a method for supporting a flexible substrate and a structure of a composite substrate, and at least have the following features: the carrier plate and the flexible substrate are adsorbed by a free electron to closely support the flexible substrate. The carrier and the flexible substrate are closely adsorbed by the free electrons, and the free electrons are removed after the process, and the flexible substrate is easily removed, so that the manufacturing process can be controlled to be reworked.

The above is only the embodiment of the disclosure, and the scope of the disclosure is not limited thereto. All changes and modifications made to the scope of the patent application of the present invention are intended to fall within the scope of the invention.

110. . . Tape-shaped flexible substrate

120. . . Roll-to-roll wheel

130. . . Chemical cleaning

140. . . Deionized water cleaning

150. . . Air drying

160. . . Laser cutting

170. . . Sheet-like flexible substrate

210. . . Having a carrier carrying a mean free electron

220. . . After the carrier carries a mean free electron, the carrier is placed adjacent to the flexible substrate, and the flexible substrate is freely adsorbed by the electron.

230. . . The periphery of the flexible substrate is sealed with an adhesive material to prevent the free electrons from overflowing, so that the carrier plate closely supports the flexible substrate

310. . . Carrier board

320. . . Flexible substrate

330. . . Active arm

340. . . Adhesive material

350. . . Polarized charge

360. . . Free electron

610. . . Optoelectronic component

620. . . Laser cutting

630. . . Actuating a voltage

640. . . Support layer

The first A picture and the first B picture are schematic diagrams of an example of the prior process of the sheet process and equipment.

The second figure is a flow chart of an embodiment of a composite substrate structure in accordance with the present disclosure.

3A and 3B are cross-sectional views of an embodiment of a composite substrate structure in accordance with the present disclosure.

The fourth figure is a top view of an embodiment of a composite substrate structure in accordance with the present disclosure.

The fifth figure is a side view of an embodiment of a composite substrate structure in accordance with the present disclosure.

6A through 6C are cross-sectional views in accordance with an embodiment of the present disclosure.

210. . . Having a carrier carrying a mean free electron

220. . . After the carrier carries a mean free electron, the carrier is placed adjacent to the flexible substrate, and the flexible substrate is freely adsorbed by the electron.

230. . . Sealing the periphery of the flexible substrate with an adhesive material to avoid the free electron overflow, so that the carrier plate closely supports the flexible substrate

Claims (17)

A method for supporting a flexible substrate, the method comprising: carrying a carrier with a mean free electron; after the carrier carries an average of the free electrons, bringing the carrier closer to the flexible substrate and adsorbing the free electrons The flexible substrate; and sealing the periphery of the flexible substrate with an adhesive material to prevent the free electrons from overflowing, so that the carrier closely supports the flexible substrate. The method of claim 1, wherein the carrier carries a mean free electron via a resident. The method of claim 1, wherein the carrier is placed adjacent to the flexible substrate by tilting the flexible substrate toward the carrier. The method of claim 3, wherein the carrier is placed adjacent to the flexible substrate by a movable arm to attract the carrier to control the proximity of the flexible substrate. The method of claim 1, wherein the carrier is one of the foregoing ones of a glass, a metal plate, a hard plastic plate, and a ceramic plate. The method of claim 1, wherein the flexible substrate is a soft glass. The method of claim 6, wherein the soft glass has a thickness of less than 100 μm. The method of claim 1, wherein the flexible substrate is one of the foregoing of a flexible plastic substrate and a flexible metal plate. The method of claim 1, wherein the adhesive material is one of an organic adhesive material, an inorganic adhesive material, a monomer adhesive material, and a metal adhesive material. The method of claim 1, wherein the mean value of the free electrons is at least 300 mV. The method of claim 1, further comprising: cutting the flexible substrate with a laser to remove the adhesive material around the flexible substrate. The method of claim 11, further comprising: driving a voltage to remove the free electrons; and separating the carrier and the flexible substrate. A composite substrate structure comprises: a carrier plate carrying a mean free electron; a flexible substrate adsorbed to the carrier through the free electron; and an adhesive material covering the periphery of the flexible substrate and covering at the same time The carrier board. The structure of claim 13, wherein the mean value of the free electrons is at least 300 mV. The structure of claim 13, wherein the carrier plate is one of the foregoing ones of a glass, a metal plate, a hard plastic plate, and a ceramic plate. The structure of claim 13, wherein the flexible substrate is one of the foregoing ones of a soft glass, a soft plastic substrate, and a soft metal plate. The method of claim 13, wherein the adhesive material is one of an organic adhesive material, an inorganic adhesive material, a monomer adhesive material, and a metal adhesive material.