TW201342683A - Distributor and coating device using the same - Google Patents
Distributor and coating device using the same Download PDFInfo
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- TW201342683A TW201342683A TW102121918A TW102121918A TW201342683A TW 201342683 A TW201342683 A TW 201342683A TW 102121918 A TW102121918 A TW 102121918A TW 102121918 A TW102121918 A TW 102121918A TW 201342683 A TW201342683 A TW 201342683A
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- 239000011248 coating agent Substances 0.000 title claims abstract description 30
- 238000000576 coating method Methods 0.000 title claims abstract description 30
- 238000005520 cutting process Methods 0.000 claims abstract description 54
- 239000000758 substrate Substances 0.000 claims abstract description 6
- 239000006185 dispersion Substances 0.000 claims description 66
- 238000009826 distribution Methods 0.000 description 10
- 239000010408 film Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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Abstract
Description
本發明是關於有機發光二極體顯示面板製造領域，尤其是關於一種分散板及具有該分散板的鍍膜裝置。 The present invention relates to the field of manufacturing organic light-emitting diode display panels, and more particularly to a dispersion plate and a coating device having the same.
近年來，有機發光二極體(OLED)技術越來越受到人們的關注，這是由於其自發光的原理，更易於製作輕薄、易攜帶的顯示或照明裝置。OLED除了具有陽極和陰極外，還具有包含在兩電極間的多層有機化合物。多層有機化合物各自具有不同的功能，有的用來傳輸電子和電洞，有的用來激發光子。 In recent years, organic light-emitting diode (OLED) technology has attracted more and more attention because of its self-luminous principle, making it easier to make a light, thin, portable display or illumination device. In addition to having an anode and a cathode, the OLED has a multilayer organic compound contained between the two electrodes. Multilayer organic compounds each have different functions, some for transporting electrons and holes, and some for exciting photons.
薄膜鍍膜是平面顯示器工藝中非常重要的一道工藝，對於工藝中各項參數的控制是相當嚴格。其中鍍膜的均勻度便是其中之一，而鍍膜裝置內氣體的分佈也會影響鍍膜的均勻度。 Thin film coating is a very important process in the flat panel display process, and the control of various parameters in the process is quite strict. Among them, the uniformity of the coating is one of them, and the distribution of gas in the coating device also affects the uniformity of the coating.
現有技術的鍍膜裝置中，分散板是設置於上電極裝置中，如圖1所示，現有技術的上電極裝置是一種三層式的結構，頂端是上電極2，頂端中心具有進氣孔(gas inlet)3，三層式結構中上邊的兩層分別是兩層分散板11、12，最下面的一層為簇射板4。 In the prior art coating apparatus, the dispersion plate is disposed in the upper electrode device. As shown in FIG. 1, the prior art upper electrode device is a three-layer structure, the top end is the upper electrode 2, and the top end has an air inlet hole ( Gas inlet) 3, the upper two layers of the three-layer structure are two-layer dispersion plates 11, 12, and the lowermost layer is the shower plate 4.
其中分散板11、12設計為金屬制的平板並帶有上 百或上千個的氣體孔10。為不影響氣體分散至下一層的時間，分散板11、12的厚度通常不超過10mm，並利用金屬或陶瓷材質的固定件將分散板11、12固定於上電極裝置的側壁。此種設計也大量的運用於等離子加強沈積設備的上電極，工藝溫度大概控制在攝氏400度。在如此高溫的狀態下，分散板11、12容易因為分散板本身受熱不夠均勻的情況下產生形變，變形的情況如圖2所示，也極有可能在固定處(分散板與上電極裝置側壁的固定處)產生變形。如此便會造成兩層分散板間的距離發生改變進而影響氣體的分佈，進而造成薄膜的不均勻。 The dispersing plates 11 and 12 are designed as metal plates and are provided with One hundred or thousands of gas holes 10. In order not to affect the time during which the gas is dispersed to the next layer, the thickness of the dispersion plates 11, 12 is usually not more than 10 mm, and the dispersion plates 11, 12 are fixed to the side walls of the upper electrode device by means of metal or ceramic fixing members. This design is also used in a large number of upper electrodes of plasma-enhanced deposition equipment, and the process temperature is controlled to approximately 400 degrees Celsius. In such a high temperature state, the dispersing plates 11, 12 are easily deformed because the dispersing plate itself is not sufficiently heated, and the deformation is as shown in Fig. 2, and it is also highly likely that it is at the fixing place (the dispersing plate and the upper electrode device side wall). The fixed point) is deformed. As a result, the distance between the two layers of the dispersion plate is changed to affect the distribution of the gas, thereby causing unevenness of the film.
本發明的目的為提供一種用於鍍膜裝置的分散板，以解決現有技術的鍍膜裝置中的分散板存在的容易變形，變形後影響氣體分佈，進而影響薄膜的膜厚均勻度的技術問題。 An object of the present invention is to provide a dispersing plate for a coating apparatus, which solves the technical problem that the dispersing plate in the prior art coating device is easily deformed, affects the gas distribution after deformation, and further affects the film thickness uniformity of the film.
本發明的另一目的為提供一種具有此分散板的鍍膜裝置。 Another object of the present invention is to provide a coating apparatus having such a dispersion plate.
本發明之一態樣提供了一種分散板，用於鍍膜裝置，分散板上具有有效區以及位於有效區週邊的無效區。有效區均勻設置有多個用於氣體通過的氣體孔。分散板的無效區則是與待鍍膜基板的無效區的位置相對應，用於分散板與外部裝置的連接，無效區具有多條切割線。 One aspect of the present invention provides a dispersion plate for a coating apparatus having an active area and an ineffective area located around the effective area. The effective area is uniformly provided with a plurality of gas holes for gas passage. The ineffective area of the dispersing plate corresponds to the position of the ineffective area of the substrate to be coated, and is used for the connection of the dispersing plate and the external device, and the ineffective area has a plurality of cutting lines.
於本發明之一或多個實施例中，分散板具有長邊和 短邊，長邊和短邊上分別具有多條切割線。 In one or more embodiments of the invention, the dispersion plate has a long side and The short side, the long side and the short side each have a plurality of cutting lines.
於本發明之一或多個實施例中，切割線是利用物理性加工在分散板邊緣切除部分的分散板所形成。 In one or more embodiments of the invention, the cutting line is formed by a dispersion plate that is physically machined at the edge of the edge of the dispersion plate.
於本發明之一或多個實施例中，位於長邊的切割線的長度為3~5mm，寬度為0.5~1 mm，數量為3~5條。 In one or more embodiments of the present invention, the length of the cutting line on the long side is 3 to 5 mm, the width is 0.5 to 1 mm, and the number is 3 to 5.
本於本發明之一或多個實施例中，位於短邊的切割線的長度為1~2mm，寬度為0.5~1 mm，數量為2~3條。 In one or more embodiments of the present invention, the length of the cutting line on the short side is 1 to 2 mm, the width is 0.5 to 1 mm, and the number is 2 to 3.
於本發明之一或多個實施例中，位於短邊的切割線垂直於位於長邊的切割線，且平行於長邊。 In one or more embodiments of the invention, the cutting line on the short side is perpendicular to the cutting line on the long side and parallel to the long side.
於本發明之一或多個實施例中，各切割線的延長線交於分散板的幾何中心。 In one or more embodiments of the invention, the extension of each cut line intersects the geometric center of the dispersion plate.
於本發明之一或多個實施例中，切割線在長邊上均勻分佈，切割線在短邊上均勻分佈。 In one or more embodiments of the invention, the cutting lines are evenly distributed over the long sides and the cutting lines are evenly distributed over the short sides.
於本發明之一或多個實施例中，位於長邊中部的切割線間距小於位於長邊兩側的切割線間距。 In one or more embodiments of the present invention, the pitch of the cutting lines in the middle of the long sides is smaller than the spacing of the cutting lines on both sides of the long sides.
本發明之另一態樣為一種具有前述之分散板的鍍膜裝置。 Another aspect of the invention is a coating apparatus having the aforementioned dispersion plate.
於本發明之一或多個實施例中，鍍膜裝置具有至少2層分散板。 In one or more embodiments of the invention, the coating apparatus has at least two layers of dispersion plates.
於本發明之一或多個實施例中，分散板的厚度小於10mm。 In one or more embodiments of the invention, the dispersion plate has a thickness of less than 10 mm.
本發明的分散板及具有該分散板的鍍膜裝置中，切割線的作用在於讓分散板變形時可有方向性，切割線可將變形方向調整為水平而非原先的垂直方向變形，可以減少 分散板變形，改善氣體分佈，增加上電極裝置內的氣體分佈穩定性，進而能夠提高鍍膜裝置的膜厚均勻性。 In the dispersion plate of the present invention and the coating device having the dispersion plate, the function of the cutting line is to make the dispersion plate deformable when it is deformed, and the cutting line can adjust the deformation direction to a level instead of the original vertical direction, which can be reduced. The dispersion plate is deformed, the gas distribution is improved, the gas distribution stability in the upper electrode device is increased, and the film thickness uniformity of the coating device can be improved.
1‧‧‧分散板 1‧‧‧Dispersion board
2‧‧‧上電極 2‧‧‧Upper electrode
3‧‧‧進氣孔 3‧‧‧Air intake
4‧‧‧簇射板 4‧‧‧Raining board
10‧‧‧氣體孔 10‧‧‧ gas hole
11、12‧‧‧分散板 11, 12‧‧‧Distribution board
15、16‧‧‧切割線 15, 16‧‧‧ cutting line
17‧‧‧固定件 17‧‧‧Fixed parts
圖1為常用的鍍膜裝置的上電極裝置的截面示意圖。 1 is a schematic cross-sectional view of an upper electrode device of a conventional coating device.
圖2為現有技術的分散板變形及其氣體分佈改變示意圖。 2 is a schematic view showing the deformation of the dispersion plate of the prior art and its gas distribution change.
圖3為本發明第一實施例的分散板的示意圖。 Fig. 3 is a schematic view of a dispersion plate according to a first embodiment of the present invention.
圖4為本發明第二實施例的分散板的示意圖。 Figure 4 is a schematic view of a dispersion plate according to a second embodiment of the present invention.
圖5為本發明實施例的分散板的氣流方向示意圖。 Fig. 5 is a schematic view showing a flow direction of a dispersion plate according to an embodiment of the present invention.
以下將以圖式及詳細說明清楚說明本發明之精神，任何所屬技術領域中具有通常知識者在瞭解本發明之較佳實施例後，當可由本發明所教示之技術，加以改變及修飾，其並不脫離本發明之精神與範圍。 The spirit and scope of the present invention will be apparent from the following description of the preferred embodiments of the invention. The spirit and scope of the invention are not departed.
本發明實施例的鍍膜裝置，具有本發明各實施例的分散板。本發明各實施例的分散板，均可應用於本發明實施例的鍍膜裝置。下面具體介紹本發明實施例的鍍膜裝置及本發明兩個實施例的分散板。 The coating apparatus of the embodiment of the present invention has the dispersion sheet of each embodiment of the present invention. The dispersion plate of each embodiment of the present invention can be applied to the coating device of the embodiment of the present invention. Hereinafter, the coating apparatus of the embodiment of the present invention and the dispersion sheet of the two embodiments of the present invention will be specifically described.
本發明實施例的鍍膜裝置，除分散板之外，其他部件可以與現有技術的鍍膜裝置中的相應部件相同。同樣，分散板也是設置於上電極裝置中，如圖1所示，本發明實 施例的鍍膜裝置的上電極裝置可以是一種多層式的結構，其分散板至少2層，例如為2-5層。 In the coating apparatus of the embodiment of the present invention, other components than the dispersion plate may be the same as the corresponding components in the prior art coating apparatus. Similarly, the dispersion plate is also disposed in the upper electrode device, as shown in FIG. The upper electrode device of the coating device of the embodiment may be a multi-layer structure having at least two layers of dispersion plates, for example, 2 to 5 layers.
如圖1所示，以兩層分散板11、12為例，上電極裝置的頂端是上電極2，其中心具有進氣孔(gas inlet)3，三層式結構中上邊的兩層分別是兩層分散板11、12，最下面的一層為簇射板4。 As shown in Fig. 1, taking two layers of dispersion plates 11, 12 as an example, the top end of the upper electrode device is the upper electrode 2, and the center has a gas inlet 3, and the upper two layers of the three-layer structure are respectively The two layers of the dispersion plates 11, 12 and the lowermost layer are the shower plates 4.
本發明各實施例的分散板，均設計為金屬制的平板並帶有上百或上千個的氣體孔10。為不影響氣體分散至下一層的時間，分散板的厚度通常不超過10mm，並利用金屬或陶瓷材質的固定件17將分散板固定於上電極裝置的側壁，如圖1和圖3所示。 The dispersion plates of the various embodiments of the present invention are each designed as a metal plate with hundreds or thousands of gas holes 10. In order not to affect the time during which the gas is dispersed to the next layer, the thickness of the dispersion plate is usually not more than 10 mm, and the dispersion plate is fixed to the side wall of the upper electrode device by a metal or ceramic fixing member 17, as shown in FIGS. 1 and 3.
以下分別介紹本發明分散板的兩個實施例。 Two embodiments of the dispersion plate of the present invention are separately described below.
本發明第一實施例的分散板：如圖3所示，分散板1具有有效區和無效區，其中有效區上均勻設置有多個用於氣體通過的氣體孔10，無效區位於有效區的週邊，分散板1的無效區與待鍍膜基板的無效區的位置相對應，無效區可用於分散板1與外部裝置(例如上電極裝置的側壁)的連接，在分散板1的無效區具有切割線15、16，具體的說是分散板1周邊的對應於待鍍膜玻璃基板無效區的位置，即距玻璃基板邊緣10mm範圍內具有切割線15、16。可以對分散板1進行物理性加工，在分散板1長短邊各切除部分分散板，而形成切割線15、16。也可以通過其他方法形成切割線15、16，也可以在形成分散板1時一體形成切割線15、16。 The dispersing plate of the first embodiment of the present invention: as shown in FIG. 3, the dispersing plate 1 has an effective area and an ineffective area, wherein a plurality of gas holes 10 for gas passage are uniformly disposed on the effective area, and the ineffective area is located in the effective area. In the periphery, the ineffective area of the dispersion plate 1 corresponds to the position of the ineffective area of the substrate to be coated, and the ineffective area can be used for the connection of the dispersion plate 1 with an external device (for example, the side wall of the upper electrode device), and has a cut in the ineffective area of the dispersion plate 1. The lines 15, 16 are specifically the positions of the periphery of the dispersion plate 1 corresponding to the ineffective area of the glass substrate to be coated, i.e., having cut lines 15, 16 within 10 mm from the edge of the glass substrate. The dispersion plate 1 can be physically processed, and a part of the dispersion plate is cut off at the long and short sides of the dispersion plate 1 to form cutting lines 15, 16. The cutting lines 15, 16 may be formed by other methods, or the cutting lines 15, 16 may be integrally formed when the dispersion sheet 1 is formed.
圖3中分散板1左右方向的邊為長邊，上下方向的邊為短邊，在長邊上形成有切割線16，在短邊上形成有切割線15。位於分散板1的長邊的切割線16的長度可為3~5mm，寬度可為0.5~1 mm，切割線的數量可為3~5條。位於分散板1的短邊的切割線15的長度可為1~2mm，寬度可為0.5~1 mm，切割線的數量可為2~3條。也就是說，長邊上的切割線16的長度通常大於短邊上的切割線15的長度，而寬度則通常相等。 In Fig. 3, the side in the left-right direction of the dispersion plate 1 is a long side, the side in the up-and-down direction is a short side, a cut line 16 is formed on the long side, and a cut line 15 is formed on the short side. The cutting line 16 located on the long side of the dispersion plate 1 may have a length of 3 to 5 mm, a width of 0.5 to 1 mm, and a number of cutting lines of 3 to 5. The cutting line 15 located on the short side of the dispersion plate 1 may have a length of 1 to 2 mm, a width of 0.5 to 1 mm, and a number of cutting lines of 2 to 3. That is, the length of the cutting line 16 on the long side is generally greater than the length of the cutting line 15 on the short side, and the width is generally equal.
如圖1所示，分散板1為矩形，本實施例中，長邊上的切割線16均互相平行，且短邊上的切割線15也互相平行。也即，長邊上的切割線16均垂直於長邊並平行於短邊，且短邊上的切割線15均垂直於短邊並平行於長邊。因此，位於短邊的切割線15垂直於位於長邊的切割線16，且平行於所述長邊。但本發明並不以此為限，各分割線也可以不互相平行，因此有以下的第二實施例。 As shown in Fig. 1, the dispersion plate 1 has a rectangular shape. In the present embodiment, the cutting lines 16 on the long sides are all parallel to each other, and the cutting lines 15 on the short sides are also parallel to each other. That is, the cutting lines 16 on the long sides are perpendicular to the long sides and parallel to the short sides, and the cutting lines 15 on the short sides are perpendicular to the short sides and parallel to the long sides. Therefore, the cutting line 15 on the short side is perpendicular to the cutting line 16 on the long side and parallel to the long side. However, the present invention is not limited thereto, and the dividing lines may not be parallel to each other, and therefore have the following second embodiment.
本發明第二實施例的分散板：本實施例中，分散板1的切割線15、16的位置、規格及其形成，均可與第一實施例的分散板1相同，與第一實施例的分散板1不同的是切割線15、16的走向，本實施例中，各切割線，包括長邊上的延長線16和短邊上的延長線15，均相交於分散板1的幾何中心。也就是說本實施例中，切割線15、16是呈放射狀分佈的。 Dispersing plate according to the second embodiment of the present invention: In the present embodiment, the position, specification and formation of the cutting lines 15 and 16 of the dispersing plate 1 can be the same as those of the dispersing plate 1 of the first embodiment, and the first embodiment The dispersing plate 1 differs in the course of the cutting lines 15, 16. In this embodiment, each of the cutting lines, including the extension line 16 on the long side and the extension line 15 on the short side, intersect at the geometric center of the dispersion plate 1. . That is to say, in the present embodiment, the cutting lines 15, 16 are radially distributed.
在上述的兩實施例中，切割線15、16，既可以是均勻分佈，也可以是非均勻分佈。如果是非均勻分佈，則 優選的是中間密，兩邊疏的分佈，也即位於所述長(短)邊中部的切割線間距小於位於所述長邊兩側的切割線間距。舉例來說，如果長邊上從左到右依次有A、B、C、D、E、F、G、H八條切割線，長邊的中點在D與E之間，則可以是距離DE<距離EF<距離FG<距離GH，距離DE<距離CD<距離BC<距離AB。並且可以左右對稱分佈。 In the above two embodiments, the cutting lines 15, 16 may be evenly distributed or non-uniformly distributed. If it is non-uniform, then Preferably, the intermediate density is distributed on both sides, that is, the cutting line spacing in the middle of the long (short) side is smaller than the cutting line spacing on both sides of the long side. For example, if there are eight cutting lines A, B, C, D, E, F, G, and H from left to right on the long side, the midpoint of the long side is between D and E, which can be the distance. DE < distance EF < distance FG < distance GH, distance DE < distance CD < distance BC < distance AB. And can be symmetrically distributed left and right.
本發明各實施例的分散板，開設切割線15、16後，並不影響通過固定件17將分散板1固定於上電極裝置的側壁。切割線15、16的作用在於讓分散板1變形時可有方向性，切割線15、16可將分散板1的變形方向調整為水平而非原先的垂直方向變形，如圖5所示，如此便不會造成分散板間距的改變，也不會影響氣體的分佈。可以減少分散板變形，改善氣體分佈，增加上電極裝置內的氣體分佈穩定性，進而能夠提高鍍膜裝置的膜厚均勻性。 The dispersion plate of each embodiment of the present invention does not affect the fixing of the dispersion plate 1 to the side wall of the upper electrode device by the fixing member 17 after the cutting lines 15 and 16 are opened. The cutting lines 15, 16 function to make the dispersion plate 1 deformable when directional, and the cutting lines 15, 16 can adjust the deformation direction of the dispersion plate 1 to be horizontal rather than the original vertical direction, as shown in FIG. This will not cause a change in the spacing of the dispersion plates and will not affect the distribution of the gas. The deformation of the dispersion plate can be reduced, the gas distribution can be improved, the gas distribution stability in the upper electrode device can be increased, and the film thickness uniformity of the coating device can be improved.
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何熟習此技藝者，在不脫離本發明之精神和範圍內，當可作各種之更動與潤飾，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and retouched without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.
1‧‧‧分散板 1‧‧‧Dispersion board
10‧‧‧氣體孔 10‧‧‧ gas hole
15、16‧‧‧切割線 15, 16‧‧‧ cutting line
17‧‧‧固定件 17‧‧‧Fixed parts
Claims (12)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310199717.9A CN103266310B (en) | 2013-05-24 | 2013-05-24 | Dispersing plate and film coating device provided with same |
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| TW201342683A true TW201342683A (en) | 2013-10-16 |
| TWI556487B TWI556487B (en) | 2016-11-01 |
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| JP (1) | JP5860920B2 (en) |
| KR (1) | KR20140138072A (en) |
| CN (1) | CN103266310B (en) |
| TW (1) | TWI556487B (en) |
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| AU5884400A (en) * | 1999-06-25 | 2001-01-31 | Vahid Saadat | Apparatus and methods for treating tissue |
| TWI584703B (en) * | 2014-08-22 | 2017-05-21 | 友達光電股份有限公司 | Display module substrate and manufacturing method thereof |
| CN109262743B (en) * | 2018-10-16 | 2020-11-03 | 苏州京浜光电科技股份有限公司 | Low-warpage processing technology of ultrathin resin optical filter |
| CN112530774B (en) * | 2019-09-17 | 2024-04-05 | 中微半导体设备(上海)股份有限公司 | Plasma processing apparatus |
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| JP4540250B2 (en) * | 2001-04-25 | 2010-09-08 | 信越化学工業株式会社 | Electrode plate for plasma device |
| JP4698251B2 (en) * | 2004-02-24 | 2011-06-08 | アプライド マテリアルズ インコーポレイテッド | Movable or flexible shower head mounting |
| JP2008506273A (en) * | 2004-07-12 | 2008-02-28 | アプライド マテリアルズ インコーポレイテッド | Control of plasma uniformity by gas diffuser curvature |
| EP1869691B1 (en) * | 2005-04-05 | 2009-12-16 | Panasonic Corporation | Gas shower plate for plasma processing apparatus |
| US20060269409A1 (en) * | 2005-05-27 | 2006-11-30 | Mitsubishi Heavy Industries, Ltd. | Gas turbine moving blade having a platform, a method of forming the moving blade, a sealing plate, and a gas turbine having these elements |
| JP4863074B2 (en) * | 2006-12-05 | 2012-01-25 | 三菱マテリアル株式会社 | Silicon electrode plate for plasma etching with excellent crack resistance |
| JP5035352B2 (en) * | 2007-11-29 | 2012-09-26 | 株式会社島津製作所 | Electrode for plasma process and plasma process apparatus |
| CN201148466Y (en) * | 2007-12-04 | 2008-11-12 | 郭铭书 | Film coating apparatus of dispersed plate having dispersed gas |
| US20100037823A1 (en) * | 2008-08-18 | 2010-02-18 | Applied Materials, Inc. | Showerhead and shadow frame |
| JP2010171244A (en) * | 2009-01-23 | 2010-08-05 | Fuji Electric Holdings Co Ltd | Plasma processing apparatus |
| CN102041484A (en) * | 2009-10-20 | 2011-05-04 | 财团法人工业技术研究院 | Gas distribution plate and device |
| JP5835722B2 (en) * | 2009-12-10 | 2015-12-24 | オルボテック エルティ ソラー，エルエルシー | Automatic ranking multi-directional serial processor |
| KR101306315B1 (en) * | 2011-01-11 | 2013-09-09 | 주식회사 디엠에스 | Apparatus for chemical vapor deposition |
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2013
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| Publication number | Publication date |
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| TWI556487B (en) | 2016-11-01 |
| CN103266310A (en) | 2013-08-28 |
| JP5860920B2 (en) | 2016-02-16 |
| CN103266310B (en) | 2015-05-20 |
| KR20140138072A (en) | 2014-12-03 |
| JP2014227606A (en) | 2014-12-08 |
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