TW201340812A - Planar electronic device and method for manufacturing - Google Patents

Abstract

A method of manufacturing a planar board substrate (220) for receiving a magnetic core comprises steps of providing a cover layer (222) having a layer side (262), providing a base layer (224) having first and second sides (252, 254), the base layer including a material hole (250) that extends completely through the base layer between the first and second sides, coupling the cover layer and the base layer to each other along the first side and the layer side, the cover layer extending over at least a portion of the material hole, and providing a dielectric member (226) within the material hole, wherein a core-holding channel (272) exists between the dielectric member and the base layer, the core-holding channel extending circumferentially around the dielectric member and configured to have the magnetic core (288, 488, 588) therein.

Description

Flat electronic device and manufacturing method

The invention relates to electronic devices such as transformers, inductors, balancers, couplers or filters.

Some known electronic devices include a planar body, such as a circuit board, that includes one or more magnetic elements that are constructed in the planar body. The magnetic element can include a ferrite core having a conductive winding extending around the ferrite core. Some of these magnetic elements contain two conductive windings that are not conductively connected to each other. For example, the conductive windings may not be physically or mechanically connected, so current cannot flow directly through the conductive winding to the other conductive winding. A current flowing through a conductive winding generates a magnetic field in the magnetic core and the other conductive winding, and a magnetic field in the other conductive winding generates a current. The electrical performance of the device is determined by various parameters, such as the ratio of the number of turns in the first winding to the number of turns in the second winding, the shape of the first and/or second winding, the first The impedance of one and the second winding, with other similar parameters.

A program for making certain known planar electronic devices includes drilling or edging a planar plate substrate. More specifically, the planar plate substrate may comprise a plurality of substrate layers (eg, FR-4 and other printed circuit board form materials). Portions of the substrate layers can be removed using controlled depth edging. In a controlled deep edging mode, a drill bit can be moved along a predetermined path to remove substrate material and provide a recess or pocket in the planar plate substrate. The groove does not extend completely The planar plate substrate is passed through. After the recess is formed, a magnetic core (e.g., a ferrite core) can be loaded into the recess. While a sufficient depth of embossing may be provided during the manufacture of the planar electronic device in a controlled depth edging manner, in some cases the controlled depth edging may result in a significant increase in the cost of the planar electronic device.

There is a need to reduce the cost of manufacturing planar plate substrates.

According to the present invention, a method of manufacturing a planar plate substrate for receiving a magnetic core comprises the steps of providing a cover layer having a layer side, providing a base layer having a first side and a second side, The base layer includes a material hole extending completely through the base layer between the first side and the second side, and the cover layer and the base layer are bonded to each other along the first side and the layer side, the covering The layer extends over at least a portion of the material void and provides a dielectric component in the material void, wherein a core support channel exists between the dielectric component and the base layer, the core support channel surrounding the A dielectric element extends around and is configured to have the magnetic core therein.

100‧‧‧Magnetic array

102‧‧‧Magnetic components

104‧‧‧ Plate substrate

106‧‧‧Upper conductor

108‧‧‧ thickness dimensions

110‧‧‧Lower side

112‧‧‧ upper side

114‧‧‧through holes

116‧‧‧Electronic devices

150‧‧‧Material Holes

200‧‧‧ magnetic core

202‧‧‧First circuit

204‧‧‧Second circuit

206‧‧‧First conduction loop

208‧‧‧second conduction loop

210‧‧‧ coil

220‧‧‧ plate substrate

222‧‧‧ Coverage

223‧‧‧ interface

224‧‧‧Basic layer

226‧‧‧Dielectric components

227‧‧" interface

230‧‧‧ board manufacturing components

232‧‧‧First mold structure

234‧‧‧Second mold structure

236‧‧‧ joint surface

238‧‧‧ joint surface

240‧‧‧ platform

241‧‧‧External surroundings

242‧‧‧ surrounding surface

244‧‧‧Component pocket

246‧‧‧Internal surface

248‧‧‧ interior surroundings

250‧‧‧Material Holes

252‧‧‧ first side

254‧‧‧ second side

256‧‧‧ thickness size

258‧‧‧ thickness size

260‧‧‧ first side

262‧‧‧ second side

264‧‧‧ thickness size

268‧‧‧Component surface

270‧‧ height

272‧‧‧core support channel

276‧‧‧ facing the inner surface

277‧‧‧ facing the outer surface

278‧‧‧ bottom surface

280‧‧‧Width size

282‧‧‧Internal alignment features

283‧‧‧Bevel

284‧‧‧ External alignment features

285‧‧‧Bevel

288‧‧‧ magnetic core

290‧‧‧ gap

291‧‧‧ gap

292‧‧‧ gap

320‧‧‧ plate substrate

322‧‧‧ Coverage

324‧‧‧A base layer

324‧‧‧B base layer

330‧‧‧Board manufacturing components

332‧‧‧First mold structure

334‧‧‧Second mold structure

336‧‧‧ joint surface

338‧‧‧ joint surface

340‧‧‧A side

340‧‧‧B side

342‧‧‧A side

342‧‧‧B side

344‧‧‧ layer side

346‧‧‧ layer side

348‧‧‧Material Holes

348‧‧‧A material hole

348‧‧‧B material hole

350‧‧‧Material Holes

350‧‧‧A material hole

350‧‧‧B material hole

352A‧‧‧Basic Extension

352B‧‧‧Basic Extension

354A‧‧‧ dielectric components

354B‧‧‧ dielectric components

356A‧‧‧Contact

356B‧‧‧Contacts

372‧‧‧core support channel

373‧‧‧Dielectric components

374‧‧‧Material Holes

376‧‧‧ granules

416‧‧‧Flat electronic devices

420‧‧‧ plate substrate

422‧‧‧ Coverage

424‧‧‧Basic layer

440‧‧‧ first side

442‧‧‧ second side

450‧‧‧Material Holes

472‧‧‧Packaging materials

474‧‧‧ substrate layer

476‧‧‧Upper conductive layer

478‧‧‧lower conductive layer

480‧‧‧through the hole

482‧‧‧through the hole

484‧‧‧Transmission through hole

486‧‧‧Transmission through hole

488‧‧‧ magnetic core

490‧‧‧core cavity

491‧‧‧Dielectric components

492‧‧‧Upper conductor

494‧‧‧lower conductor

516‧‧‧Flat electronic devices

520‧‧‧ plate substrate

522‧‧‧ Coverage

523‧‧‧ alignment features

524‧‧‧Basic layer

525‧‧‧ edge

527‧‧‧Slope

540‧‧‧ first side

542‧‧‧ second side

550‧‧‧ material holes

551‧‧ Covering the hole

572‧‧‧Packaging materials

574‧‧‧ substrate layer

575‧‧‧ substrate layer

576‧‧‧Upper conductive layer

578‧‧‧lower conductive layer

580‧‧‧through the hole

582‧‧‧through the hole

584‧‧‧through holes

586‧‧‧through hole

588‧‧‧ magnetic core

590‧‧‧core cavity

591‧‧‧Dielectric components

592‧‧‧Upper conductor

594‧‧‧lower conductor

700‧‧‧ method

702‧‧‧Steps

704‧‧‧Steps

706‧‧‧Steps

708‧‧ steps

710‧‧ steps

712‧‧‧Steps

714‧‧‧Steps

800‧‧‧ hollow drill bit

802‧‧‧ shaft

804‧‧‧Drill end

806‧‧‧ shaft recess

808‧‧‧Drill wall

810‧‧‧ plate substrate

812‧‧‧ stage

813‧‧‧ stage

814‧‧‧core support channel

820‧‧‧Forstner drill bit

822‧‧‧ shaft

824‧‧‧Drill end

826‧‧‧ edge

828‧‧‧Shaped arms

830‧‧‧Shaped arms

832‧‧‧ plate substrate

834‧‧‧ stage

836‧‧‧Material Holes

840‧‧‧ stage

The first figure is a perspective view of a planar electronic device having an array of magnetic elements.

The second figure is a top view of the magnetic components of the electronic device shown in the first figure.

The third figure is an exploded view of a board manufacturing assembly and a planar plate substrate in accordance with an embodiment.

The fourth figure is a cross section of the manufacturing assembly and the plate substrate of the third figure during a layering process.

The fifth figure is an enlarged cross section of the plate substrate of the third figure, which illustrates a core support channel.

The sixth drawing is an enlarged plan view of the plate substrate of the third figure, which illustrates the core support passage.

The seventh figure is an enlarged cross section of the plate substrate, and the figure shows a magnetic core in the core support channel.

Figure 8 is an exploded view of a panel fabrication assembly and a planar plate substrate in accordance with an embodiment.

The ninth drawing is a top plan view of the plate substrate of the eighth figure.

The tenth figure is an enlarged cross section of the plate substrate of the eighth figure before a substrate removal process.

Figure 11 is an enlarged cross-sectional view of the plate substrate of Figure 8 after a substrate removal procedure.

Figure 12 is an exploded view of a planar plate substrate formed in accordance with an embodiment.

Figure 13 is a cross-sectional view of a planar electronic device formed according to an embodiment, the planar electronic device comprising the plate substrate of the twelfth figure.

Figure 14 is an exploded view of a planar plate substrate formed in accordance with an embodiment.

Figure 15 is a cross-sectional view of a planar electronic device formed according to an embodiment, the planar electronic device comprising the plate substrate of Figure 14.

Figure 16 is a flow chart depicting a method of fabricating a planar plate substrate in accordance with various embodiments.

Figure 17 is a perspective view of a hollow drill bit that can be used during the manufacture of a planar plate substrate.

Figure 18 illustrates the planar plate substrate at the different stages of manufacture using the hollow drill bit.

Figure 19 is a perspective view of a Forstner drill bit that can be used during the manufacture of a planar plate substrate.

Figure 20 illustrates the planar plate substrate at different stages of manufacture using the Forstner bit.

One or more embodiments described herein provide a plurality of flat panel electronic devices including a plurality of planar plate substrates supporting a plurality of magnetic components, such as a plurality of planar transformers. The magnetic elements may comprise a plurality of magnetic cores (e.g., ferrite material bodies) embedded in the corresponding plate-like substrate. The magnetic elements may also include a plurality of conductive windings or conductive loops wound around the cores. The plate substrate may have a composition similar to that of a printed circuit board (PCB) and include a plurality of substrate layers. The substrate layers may comprise a base layer (or first layer) and a cover layer (or second layer). The base layer can have holes extending through one or more of the materials, the size and shape of which are used to receive the individual cores. The cover layer may extend along one side of the base layer and completely cover the holes of the material or only partially cover the holes of the materials. In a particular embodiment, the holes of the material extend completely through the base layer.

The planar plate substrate is configured to support the cores in a predetermined manner (e.g., in a predetermined direction and/or position relative to the base layer). The base and/or cover layer can include a plurality of alignment features that cause the cores to be positioned within the plate substrate. For example, in some embodiments, the base layer can include a plurality of alignment features that at least partially define the holes of the material and engage the core when the core is loaded into the hole of the material. In some embodiments, the cover layer can also be configured to support the cores. In the particular embodiment, the cover layer can be a central layer. For example, the cover layer can comprise a plurality of cover holes that are smaller in size than the cores. When a magnetic core is loaded into the hole of the material aligned with a cover hole, the core can engage an edge defining one of the cover holes. The edge can support the core in a predetermined manner.

In the planar electronic device, the cores can be encapsulated in a low stress adhesive, such as a low stress epoxy, which is expected to provide a suitable electrical environment. In a hardening stage, the epoxy resin is essentially solid, deflectable, and/or elastic. The elastic and/or deflectable properties of the hardened epoxy resin can be It differs depending on the hardening medium and/or composition used for the epoxy resin. One or more layers of conductive material on or in one of the planar plate-like substrates, and a plurality of conductive through-holes extending through the plate-like substrate, may provide a magnetic element, such as a transformer.

The first figure is a perspective view of a particular embodiment of a planar electronic device 116 having an array 100 of magnetic elements 102. The magnetic elements 102 illustrated in the first figure are transformer devices. Alternatively, the magnetic elements 102 can be or can include another electronic device or component such as an inductor, a filter, a balancer, a coupler, and the like. The magnetic elements 102 can comprise a magnetic core, such as a ferrite body or other magnetic material. The magnetic elements 102 can be located in a planar dielectric or non-conductive plate substrate 104. The magnetic elements 102 are generally oval in shape and may have other shapes, such as a circular shape.

The plate substrate 104 has a thickness dimension 108 measured between a first or lower side 110 of the plate substrate 104 and a second or upper side 112. As used herein, the terms "below" or "above" are used to indicate the opposite sides of the plate substrate 104. The use of the terms "below" and "above" does not limit or require a single, specific orientation of the plate substrate 104. For example, the plate substrate 104 can be flipped such that the upper side 112 is below the lower side 110.

For each magnetic element 102, a plurality of upper conductors 106 are located on the upper side 112 of the plate substrate 104, and a plurality of lower conductors (not shown) are located on the lower side 110 of the plate substrate 104. The lower conductors may have the same size and/or shape as the upper conductors 106. The plate substrate 104 includes a plurality of through holes 114 extending through the plate substrate 104 between the lower side and the upper sides 110 and 112 of the plate substrate 104. The through holes 114 are filled or plated with a conductive material to provide a plurality of conductive paths through the plate substrate 104. The opposite ends of each of the through holes 114 are electrically connected to the conductors 106 and the lower conductors on the plate substrate 104. The through holes 114, the upper conductors 106, and the lower conductors form a plurality of loops or winding conduction paths that are wound around the magnetic core 200 (shown in the second figure) located in the plate substrate 104 many times.

The second figure is a top view of the two magnetic elements 102 shown in the first figure. For each of the magnetic elements 102, the upper conductors 106 are conductively connected to the through holes 114 at the opposite sides of the upper conductors 106. As described above, the through holes 114 include a conductive material and are conductively connected to the lower conductors (not shown) on the lower side 110 (first view) of the plate substrate 104.

The conductive paths formed by the upper conductors 106, the through holes 114, and the lower conductors may be referred to as first and second conductive loops 206, 208 that extend around the core 200. Each of the reference numerals 206, 208 in the second figure refers to a dashed box that encloses the different conductive loops of the same magnetic element 102. Each of the conductive loops 206, 208 includes a plurality of turns 210 around the core 200. The combination of the conductive loops 206, 208 and the magnetic core 200 forms the magnetic element 102. The conductive loops 206, 208 that wind the same core 200 are not conductively connected to each other. In one embodiment, the first conduction loop 206 of the magnetic element 102 receives power from a first circuit 202. The second conductive loop 208 of the same magnetic component 102 can be conductively coupled to a second circuit 204.

The first and second conductive loops 206, 208 can be inductively coupled to each other by the magnetic core 200 such that current through the first conductive loop 206 is inductively transmitted to the second conductive loop 208. For example, a varying current through the first conduction loop 206 can produce a varying magnetic current in the magnetic core 200. The varying magnetic current creates a varying magnetic field in the second conductive loop 208. The varying magnetic field induces a varying electromotive force or voltage in the second conduction loop 208. The second conduction loop 208 transmits the formed voltage to the second circuit 204.

Figures 3 through 16 depict various planar plate substrates that can be used with a planar electronic device, such as the electronic device 116 shown in the first figure. The planar plate substrates can be configured to support a plurality of magnetic components, such as a transformer. The third to sixteenth figures also illustrate various methods by which such plate-like substrates can be fabricated. As used herein, the term "planar plate substrate" encompasses a subsequently modified plate substrate. For example, as shown in the third to the sixteenth Each of the planar plate substrates can be removed (eg, by drilling, stamping, or etching) or added (eg, by adding other substrate layers, packaging materials, or other electronic materials) to the substrate material, and adding Modifications are made by etching the conductive material. In other words, the planar plate substrates described herein may require additional modifications before being suitable for use in a planar electronic device.

The third figure is an exploded view of various elements of a planar plate substrate 220 that can be used to fabricate the plate substrate 220. As shown, the planar plate substrate 220 can include a cover layer 222, a base layer 224, and a plurality of dielectric elements 226. As shown, a board manufacturing assembly 230 can include first and second mold or extruded structures 232, 234. The board manufacturing assembly 230 can be used by a layered compression process or as a layered compression process to combine a plurality of substrate layers, such as the cover and substrate layers 222, 224. In the particular embodiment, the first and second mold structures 232, 234 comprise a rigid material. For example, the first and second mold structures can be steel or aluminum flat sheets or panel molded flat sheets. The plates can be smooth surfaces without defects and have the same size and shape as a set of composite layers. During the panel stamping process, the plates may be in contact with the layer to transmit a positive force and provide a smooth surface over the formed layered structure. The first and second mold structures 232, 234 are configured to resist the pressure and heat generated by the board layering process.

The first and second mold structures 232, 234 respectively include engagement surfaces 236, 238 that are configured to interface with the plate substrate 220 and compress the plate substrate 220. The bonding surfaces 236, 238 face each other and are configured such that the cover layer 222, the base layer 224, and the dielectric elements 226 are positioned therebetween. In the particular embodiment, the engagement surface 236 is planar. However, the bonding surface 236 can be the shape required to fabricate the plate substrate 220.

The second mold structure 234 includes a plurality of platforms 240 that are coupled to and project from the engagement surface 238. In some embodiments, the second mold structure 234 is a single continuous structure such that the joint surface 238 is formed of the same material (eg, steel, aluminum, and the like) as the platforms 240. The platforms 240 are substantially upright relative to the engagement surface 238. For example, each of the platforms 240 has an outer or peripheral surface 242 that extends perpendicular to the engagement surface 238 and faces away from the corresponding platform 240. In other embodiments, however, the peripheral surface 242 can extend obliquely relative to the engagement surface 238. In addition to the portions of the platform 240 that are convex, the engagement surface 238 can be substantially completely flat.

Each platform 240 has an outer perimeter 241 defined by the surrounding surface 242. The outer perimeter 241 can include a curved profile when viewed directly down the engagement surface 238. For example, in the particular embodiment, the peripheral surface 242 has a shape that causes the outer perimeter 241 to form a completely circular shape. However, the outer perimeter 241 of the platform 240 can have other shapes that include a curved profile. For example, the outer perimeter 241 can be substantially circular, semi-circular, oval, and the like. Additionally, the curved profile can include an outer perimeter 241 that is partially curved and other portions are linear. Likewise, while the platforms 240 have the same shape in the particular embodiment, other embodiments may include platforms having different shapes. For example, one platform 240 can be circular while the other platform can be oval or square.

Also shown in the third figure is that each of the platforms has a component pocket 244. The component pocket 244 is completely surrounded by the corresponding platform 240 and is open in a direction away from the engagement surface 238. In the particular embodiment, the component pockets 244 are sized and shaped to receive the corresponding dielectric components 226. Each of the component pockets 244 is defined by a corresponding inner or inner side surface 246 (illustrated in the fourth figure) of the corresponding platform 240. The interior surface 246 can define an interior perimeter 248. The inner perimeter 248 can have a similar shape to the outer perimeter 241 (eg, the inner and outer perimeters 248, 241 can be circular or different sized squares of different sizes). In other embodiments, the inner and outer perimeters 248, 241 can be of different shapes.

The cover layer 222 includes a substrate material for fabricating one of the circuit boards. It is to be understood that the substrate layer such as the cover layer 222 and the base layer 224 may comprise a plurality of stacked substrate layers (eg, a plurality of sub-layers). The substrate material may comprise or may be formed of a dielectric material such as a glass filled ring suitable for a printed circuit board (PCB). An oxyresin (for example, FR-4), a thermosetting material or a thermoplastic material. The substrate material can be an alternating layer of fully hardened substrate and uncured B-stage material unless the materials are thermoplastic or fluid phase thermoset materials. The base layer 224 thickness dimension 256 can be a single thick layer or a plurality of prepreg sheets or alternating layers of a similar pattern. Other rigid or semi-rigid materials can be used. The cover layer 222 includes opposing first and second layer sides 260, 262 and a thickness dimension 264 extending therebetween. In the particular embodiment, the cover layer 222 can be formed prior to stacking onto the base layer 224. In other embodiments, however, the cover layer 222 can be formed overlying the base layer 224. For example, a viscous polymer material can be dispersed along the base layer 224 and then hardened to form the cover layer 222. In the particular embodiment, the cover layer 222 is a continuous body that does not contain any holes.

The base layer 224 also includes a substrate material that can be the same as described above for the cover layer 222. The base layer 224 has first and second sides 252, 254 and a thickness dimension 256 extending therebetween. The first and second sides 252, 254 may also be referred to as the layer side or the base side. As shown, the base layer 224 includes a plurality of material holes 250. The material apertures 250 can be formed in a plurality of channels extending completely through the base layer 224 between the first and second sides 252, 254. In the particular embodiment illustrated in the third figure, the material apertures 250 are sized and shaped to receive a plurality of corresponding platforms 240.

The material holes 250 can be formed by removing the substrate material of the base layer 224. For example, the material holes 250 can be formed, for example, by stamping the base layer 224 during a precision stamping process. When the base layer 224 is stamped to form the material holes 250, the base layer 224 is positioned between a punch (not shown) and a corresponding mold (not shown). The punch has an end portion that is the same size and shape as the hole required for the material hole 250. The mold generally includes a recess or pocket sized and shaped to receive the stamped material and the end of the punch. With the base layer 224 positioned between the punch and the mold, the punch is driven through the base layer 224 into the mold. The punch cuts the base layer 224 The substrate material, thereby forming the material holes 250.

In the particular embodiment of stamping the base layer 224, one of the material apertures 250 defining the inner surface 276 (illustrated in the fifth figure) is a shear surface. More specifically, the inwardly facing surface 276 can exhibit qualities, properties, and/or characteristics associated with the sheared surface. The base layer 224 can accept multiple separate stampings from the same punch to form the plurality of material apertures 250. In other embodiments, a plurality of punches can be used simultaneously to simultaneously form the material holes 250. For example, a multi-head machine can drive the plurality of punches into a corresponding plurality of molds to simultaneously produce a plurality of material holes 250.

However, the material holes 250 can be formed in other ways. For example, the holes 250 of the material may be formed by drilling or edging. The drilling action can be performed using a hollow drill bit, a Forstner drill bit or a standard PCB drill bit. When using the edging method, it is recommended to use a standard drill bit, although other drill bits can be used. In the particular embodiment, the inwardly facing surface 276 defining the material aperture 250 is a drilled surface. In other embodiments, the material holes 250 are formed by etching the base layer 224 such that the material holes 250 are defined by the etched surfaces. The etching action can be performed by reactive ion etching (RIE) or plasma etching. In either case, the inward facing surface 276 can exhibit qualities, properties, and/or characteristics associated with how the material aperture 250 is formed. The method of forming the holes 250 of the materials (e.g., stamping, drilling, etching, and the like) can be confirmed immediately after inspection of the plate substrate or subsequently formed electronic device. The manner in which the plate substrate or the electronic device is inspected can be performed using a scanning electron microscope (SEM) or other microscope.

The dielectric elements 226 have shapes and sizes that can be mounted in a plurality of corresponding pockets 244 of the mold structure 234. For example, the shape of the dielectric elements 226 can be similar to the shape defined by the interior perimeter 248. However, the dimensions of the dielectric elements 226 may be slightly smaller than the dimensions of the corresponding component pockets 244. The thickness dimension 258 of the dielectric element 226 can be substantially equal to the thickness dimension of the base layer 224 256. In some embodiments, the dielectric elements 226 are formed from substrate material removed from the base layer 224. For example, a substrate material from which the base layer 224 is stamped to form one of the material holes 250 can also be used as one of the dielectric elements 226.

In some embodiments, a fluid phase material such as a thermosetting resin or a thermoplastic resin may be used, and a preferred material instead of a pre-hardened C-stage material such as FR-4 may be used. The fluid resin may have no glass and flow into the mold structure 234 to define the desired dimensions in the gaps.

The fourth figure is a cross section of various components of the plate substrate 220 during a layering process. As shown, the cover layer 222 is stacked relative to the base layer 224. More specifically, the first side 252 of the base layer 224 interfaces with the layer side 262 of the cover layer 222. The dielectric elements 226 are located in the corresponding component pockets 244 and have individual component faces 268 that interface with the cover layer 222 layer side 262. In the particular embodiment, the thickness dimensions 256, 258 are substantially equal to the height 270 of the platform 240. In other embodiments, the thickness dimension 258 and the thickness dimension 256 can be greater or less than the height 270 of the base layer 224, and the dielectric elements 226 still have the ability to be coupled to the cover layer 222.

The cover and the base layers 222, 224 can be aligned in a predetermined manner when stacked relative to one another. One or both of the first and second mold structures 232, 234 may include a plurality of panel alignment features (not shown) that engage the cover and base layers 222, 224. For example, the second mold structure 234 can include a plurality of struts (not shown) that are received by the base layer 224 and a plurality of corresponding channels (not shown) of the cover layer 222. The channels may be located along the cover and base layers 222, 224 and/or toward the middle of the cover and base layers 222, 224.

The overlay and base layers 222, 224 can be connected to each other during a layering procedure. For example, a B-stage or semi-cured sheet (not shown) may be positioned along one of the interface 223 between the cover and base layers 222, 224 and one of the interfaces 227 between the cover layer 222 and the dielectric elements 226. When the cover layer 222 is opposite the base layer 224 The sheets may become part of the cover and/or the base layers 222, 224 when stacked on each other. The sheets may be heat treated and pressure treated to harden the sheets and the base layer 224 is joined (e.g., bonded) to the cover layer 222. Vacuum can be applied if needed. Thus, even if the base layer 224 and the dielectric elements 226 are separate or separate components, the base layer 224 and the dielectric elements 226 can be connected to the overlay simultaneously (eg, during the same layering procedure). Layer 222. However, the above is merely an exemplary method for layering the cover and base layers 222, 224 and the dielectric element 226 to each other. These elements can be connected together using similar or different procedures.

The fifth and sixth figures are enlarged views of the plate substrate 220, which illustrate in detail the case of a material hole 250 after the base layer 224 and the dielectric elements 226 are connected to the cover layer 222. The fifth drawing is a cross section of the portion of the plate substrate 220, and the sixth drawing is a top plan view thereof. It should be noted that the fifth and sixth figures are reversed with respect to the third and fourth figures. As described, a core support channel 272 is formed when the dielectric component 226 is provided to the material aperture 250. The core support channel 272 is present between the dielectric element 226 and the base layer 224. The core support channel 272 is defined by the inner surface 276-278 and includes one of the base layer 224 facing the inner surface 276, one of the dielectric elements 226 facing the outer surface 277 and being defined by the cover layer 222 Bottom surface 278. The core support channel 272 has a width dimension 280 (fifth view) extending between the inwardly facing surface 276 and the outwardly facing surface 277. In some embodiments, the width dimension 280 through the core support channel 272 is substantially identical. In other embodiments, however, the width dimension 280 of the core support channel 272 can vary.

The core support channel 272 is configured to have a magnetic core 288 (illustrated in the seventh diagram) therein, which may be identical to the magnetic core 200 (second figure). The core support channel 272 extends around the dielectric element 226. In the particular embodiment, the core support channel 272 extends completely around the dielectric element 226 in a substantially circular path such that the core support channel 272 is in the shape of a donut. However, not The specific embodiments shown in the fifth and sixth figures are defined. As used herein, the term "around the circumference" includes the core support channel 272 extending substantially only around a portion of the dielectric element 226. For example, the core support channel 272 can form a C-shaped arc that extends at least about half about the dielectric element 226. In addition, the word "around the circumference" does not need to be a circular path or a curved path, but may include other shapes. For example, the core support channel 272 can extend around the dielectric element 226 along a path that is square, rectangular or polygonal.

In some cases, the core support channel 272 may not be suitable for receiving the magnetic core 288 after the cover and base layers 222, 224 are connected to each other. For example, the core support channel 272 may have an improper size or may have unwanted material in the core support channel 272, such as resin flowing into the core support channel 272 during layering, or having a removal procedure An uneven surface caused by (for example, stamping). In such cases, the core support channel 272 can be etched or drilled (or edging) to properly trim the core support channel 272 shape, or to remove unwanted material. For example, at least one of the inwardly facing surface 276, the outwardly facing surface 277, or the bottom surface 278 has a substrate material removed therefrom. In some embodiments, the width dimension 280 may increase due to material removal procedures, such as by drilling, etching, and the like.

The seventh figure is an enlarged cross section of the plate substrate 220, which illustrates the magnetic core 288 located in the core support channel 272. The core support channel 272 can include internal and external alignment features 282, 284 that at least partially define the material aperture 250 or the core support channel 272. The alignment features 282, 284 may be formed by the material removal procedures described above (e.g., by etching or drilling the interior surfaces 276-278) or by individual material removal procedures. In some cases, only one (or a majority) portion of the inner surface 276-278 is etched or drilled, such that the portion facing the inner surface 276 and the outwardly facing surface 277 can remain from the hole 250 forming the material. The surface quality of the program. For example, at least one portion of the inwardly facing surface 276 can be one of the shearing surfaces formed when the base layer 224 is stamped to form the material aperture 250, and the other portion of the inwardly facing surface 276 can be a Drill the surface.

The alignment features 282, 284 are shaped to provide the core 288 with a central positioning effect when the magnetic core 288 is placed in the core support channel 272. The alignment features 282, 284 can extend toward the magnetic core 288. In the particular embodiment, the alignment feature 282 includes a ramp 283 extending between the outwardly facing surface 277 and the bottom surface 278. The alignment feature 284 includes a slope 285 extending between the inwardly facing surface 276 and the bottom surface 278. In other embodiments, however, the alignment features 282, 284 can have other configurations.

The alignment features 282, 284 can reduce the tolerances of the manufacturing process associated with the positioning of the magnetic core 288. The alignment features 282, 284 can cause individual gaps 290, 291 to exist between the core 288 and the inwardly facing surface 276 and the outwardly facing surface 277. There may also be a gap 292 between the core 288 and the bottom surface 278. In subsequent procedures, the gaps 290-292 may contribute to the flow of the encapsulating material and allow the magnetic core 288 to expand and/or contract during heating and compression associated with the layering.

The eighth drawing is an exploded view of various components of a planar plate substrate 320 and a plate manufacturing assembly 330 that can be used to fabricate the plate substrate 320. As shown, the plate substrate 320 can include a cover layer 322 and one or more base layers 324A, 324B. The cover layer 322 and the base layers 324A, 324B may comprise the same substrate material as described above for the cover layer 222 (third diagram) and the base layer 224 (third diagram), and/or fabricated in the same manner . The base layer 324A has opposing layer sides 340A, 342A, and the base layer 324B has opposing layer sides 340B, 342B. The cover layer 322 has opposing layer sides 344, 346.

Each of the base layers 324A, 324B includes a plurality of material holes 348, 350. The material holes 348, 350 extend completely through the corresponding base layer 324A or 324B. In the particular embodiment, the base layers 324A, 324B each include a plurality of material hole pairs 348A, 350A and 348B, 350B. In the particular embodiment, the material holes 348A, 350A and the material holes 348B, 350B are semi-circular and face the pair of other material holes. However in other implementations In one example, a single material hole that is almost completely extended can be used. For example, the single material hole can be C-shaped or have a path that is almost a complete circle. The material holes 348A, 350A and 348B, 350B can be fabricated in the same manner as described above for the material holes 250 (third figure). For example, the material holes 348A, 350A and 348B, 350B may be formed by stamping, drilling, and/or etching. The material holes 348A, 350A along the base layer 324A may have the same pattern as the material holes 348B, 350B along the base layer 324B. Thus, when the base layers 324A, 324B are stacked relative to each other, the material holes 348A of the base layer 324A are aligned with the material holes 348B of the base layer 324B, and the material holes 350A of the base layer 324A The material is aligned with the material hole 350B of the base layer 324B.

The substrate material of the base layers 324A, 324B may comprise or be formed of a dielectric material such as a glass filled epoxy (eg, FR-4) suitable for a printed circuit board (PCB), a thermoset material, or Thermoplastic material. The substrate material can be an alternating layer of fully hardened substrate and uncured B-stage material unless the materials are thermoplastic or fluid phase thermoset materials. The thickness of the base layer can be a single thick layer or a plurality of semi-cured sheets or alternating layers of similar type. Other rigid or semi-rigid materials can be used.

When the material holes are formed in pairs 348A, 350A, a corresponding base extension 352A can also be formed. When the material hole pairs 348B, 350B are formed, a corresponding base extension 352B can also be formed. In the specific implementation, each of the base extensions 352A, 352B extends between the corresponding pair of material holes 348A, 350A and 348B, 350B, respectively. The material holes 348A, 350A are separated from each other by the base extension 352A, and the material holes 348B, 350B are separated from each other by the base extension 352B. However, a base extension can also be formed when only a single material hole is formed. As described above, for example, if the material hole is C-shaped or if the material hole forms almost a complete circle, a base extension can be defined by the single material hole.

As shown, the panel manufacturing assembly 330 can include first and second mold or extruded structures 332, 334. As with the board fabrication assembly 230 (figure 3), the first and second mold structures 332, 334 comprise a rigid material and are configured to resist the pressure and heat associated with the board layering process. The first and second mold structures 332, 334 respectively include engagement surfaces 336, 338 that are configured to interface with the elements of the plate substrate 320 and squeeze them together. The joint surfaces 336, 338 face each other with the cover layer 322 and the base layers 324A, 324B therebetween. In the particular embodiment, the engagement surfaces 336, 338 are substantially planar.

The overlay and base layers 322, 324A, 324B can be connected to each other using the same method described above for the overlay and base layers 222, 224 (third map). For example, the overlay and base layers 322, 324A, 324B can be connected to one another during a layering process. The cover and base layers 322, 324A, 324B can be stacked and aligned relative to one another such that each of the base extensions 352A of the base layer 324A is aligned with a corresponding base extension 352B of the base layer 324B. Prior to stacking, a B-stage or semi-cured sheet (not shown) can be positioned so that one sheet can be positioned along one interface between the cover layer 322 and the base layer 324A, while another sheet is along the One interface between the base layers 324A, 324B. The sheets may be heat treated and pressure treated to harden the sheets, and the base layers 324A, 324B are joined to each other (e.g., bonded), and the cover layer 322 is attached to the base layer 324A. At this point, the aligned base extensions 352A, 352B of the base layers 324A, 324B can be bonded to each other.

The ninth and tenth views respectively include a plan view and a cross section of the plate substrate 320 before a material removal operation. The ninth and tenth views are reversed with respect to the eighth figure, so that the ninth figure is a plan view of the layer side 342B, and the tenth figure has the cover layer 322 at the bottom of the figure. For the tenth figure, the base extensions 352A, 352B of the base layers 324A, 324B are stacked and connected to each other. In an exemplary embodiment, the base extension 352A includes a dielectric component 354A. Electrical component 354A is coupled to the remainder of base layer 324A via one or more contacts 356A. Similarly, the base extension 352B includes a dielectric component 354B that is coupled to the remainder of the base layer 324B via one or more contacts 356B. For purposes of description, the dielectric element 354B for a base extension 352B and the contacts 356B are also illustrated in the ninth diagram.

For the tenth figure, after the cover and base layers 322, 324A, 324B are connected to each other, the contacts 356A, 356B can be removed by a material removal operation. As a specific example, a drill bit can be inserted into the two alignment material holes 348 as shown in the tenth figure and edged around a path to remove the contacts 356A, 356B. In this case, since the two contacts are removed from each of the base layers 324A, 324B, a total of four contacts 356A, 356B are removed.

The eleventh figure shows the same viewing angle as the tenth figure, but shows that the contacts 356A, 356B (thirth figure) have been removed. For the eleventh figure, a core support channel 372 is present around the stacked dielectric elements 354A, 354B. When the dielectric elements 354A, 354B are stacked and connected as shown in FIG. 11, the dielectric elements 354A, 354B can be considered as a single dielectric element 373 surrounded by the core support channel 372. The core support channel 372 can be identical to the core support channel 272 (fifth figure) and extends around the dielectric element 373. After removing the contacts 356A, 356B, the material holes 348, 350 (eighth view) become a single material hole 374.

The material holes 374 may not be of appropriate size and may have other unwanted materials therein, such as particles 376. The particles 376 may be formed by the resin flowing to the material holes 374 during the layering. The particles 376 may also be a result of the manufacturing process for making the holes 348, 350 (Fig. 8) of the materials. To remove the particles 376, most of the surface defined by the core support channel 372 can be further etched or drilled to properly trim the shape of the core support channel 372 and the material hole 374, or to remove any unwanted s material. In an alternative embodiment, the particles 376 are also removed when the contacts 356A, 356B are removed (also That is, removed during the same substrate removal).

The eighth to eleventh drawings depict one embodiment in which the two base layers 324A, 324B are stacked and connected to each other. In other embodiments, however, only a single base layer may be used, or alternatively more than two base layers may be stacked relative to one another. Further in other embodiments, each of the base extensions can include a single joint. The base layers are configured to be identical, so the contacts are stacked for each other. Alternatively, the contacts may have different positions, so the contacts are not stacked directly above each other. In the particular embodiment, the drill bit may only need to remove a single joint at the same time, rather than removing the two stack contacts, for example, at the same time.

Figure 12 is an exploded view of a planar plate substrate 420 formed in accordance with an embodiment. The plate substrate 420 includes a cover layer 422 and a base layer 424. The base layer 424 has opposing first and second layer sides 440, 442 and includes a plurality of material apertures 450 extending therethrough. The material holes 450 can be formed as described above for the material holes 150 (third image) and 348, 350 (eighth view). In the particular embodiment, the cover layer 422 is a continuous sheet that does not have holes. The cover and base layers 422, 424 may be formed from a substrate material such as the substrate material described above for the cover layer 222 (third figure) and the base layer 224 (third figure). The overlay and base layers 422, 424 can be joined together in a layering procedure as described above. The substrate material may comprise or be formed from a dielectric material such as a glass filled epoxy (e.g., FR-4) suitable for use in a printed circuit board (PCB), a thermoset material, or a thermoplastic material. The substrate material can be an alternating layer of fully hardened substrate and uncured B-stage material unless the materials are thermoplastic or fluid phase thermoset materials. The thickness of the base layer can be a single thick layer or a plurality of semi-cured sheets or alternating layers of similar type. Other rigid or semi-rigid materials can be used.

The thirteenth diagram illustrates a cross-section of a portion of a planar electronic device 416 that includes the plate substrate 420. After the plate substrate 420 is formed, a magnetic core 488 can be placed in the material hole 450. The core 488 can have a circular or oval-like shape that surrounds a core aperture 490. The core 488 Inserted through the second side 422 into the material aperture 450. Although not shown, the base layer 424 and/or the cover layer 422 can include a plurality of alignment features that are configured to support the magnetic core 488 in a predetermined location in the material aperture 450. The alignment features can be formed in the same manner as described above by drilling or etching the base layer 424 and/or the substrate material of the cover layer 422.

Once the magnetic core 488 is placed in the material hole 450, a resilient and non-conductive encapsulating material 472 is deposited in the material hole 450. The encapsulating material 472 flows into the core cavity 490 and encapsulates the magnetic core 488. The encapsulating material 472 can be hardened such that the encapsulating material 472 hardens and completely surrounds the magnetic core 488. Accordingly, a dielectric element 491 is formed in the core cavity 490.

As shown in the thirteenth figure, another substrate layer 474 can be formed on the second side 442. Conductive layers 476, 478 can then be bonded to the substrate layer 474 and the cover layer 422, respectively, by an insulative adhesion. The plurality of through holes 480 are then drilled through the upper conductive layer 476, the substrate layer 474, the base layer 424, the cover layer 422, and the lower conductive layer 478. The through holes 480, 482 are then cleaned and plated with a conductive material to provide a plurality of conductive through vias 484, 486. The conductive layers 476, 478 are then etched to provide a plurality of upper conductors 492 along the substrate layer 474 and a plurality of lower conductors 494 are provided along the cover layer 422.

Although not shown, other modifications and/or features may be added to the planar electronic device 416. For example, the electronic device 416 can then be coated with an insulating material as shown in FIG.

Figure 14 is an exploded view of a planar plate substrate 520 formed in accordance with an embodiment. The plate substrate 520 includes a cover layer 522 and a base layer 524. The base layer 524 has opposing first and second layer sides 540, 542 and includes a plurality of material apertures 550 extending therethrough. The cover and base layers 522, 524 and the cover of the thirteenth view are similar or identical to the base layers 422, 424. However, the cover layer 522 can have a plurality of cover apertures 551 that extend completely through the cover layer 522. The shape and location of the cover holes 551 may be the same as the holes of the material of the base layer 524 The 550 is similar. More specifically, the cover holes 551 are smaller in size and shape than the holes 550 of the materials. The overlay and base layers 522, 524 can be connected to one another via a layering procedure as described above.

The fifteenth diagram illustrates a cross-section of a portion of a planar electronic device 516 that includes the plate substrate 520. As shown, the cover layer 522 can have an alignment feature 523. For example, the alignment feature 523 can define an edge 525 of the cover aperture 551. In a particular embodiment, the edge 525 is formed to have a bevel 527. The edge 525 can be formed by drilling and/or etching. The edge 525 is sized to support a magnetic core 588 in a predetermined position.

A substrate layer 575 comprising a sheet of continuous substrate material can be attached to the cover layer 522 during a layering process, thereby covering the cover aperture 551. The magnetic core 588 can be inserted into the material aperture 550 through the second side 542 and positioned on the slope 527. The core 588 can have a circular or oval-like shape that surrounds a core aperture 590.

Where the core 588 is located in the material aperture 550, a resilient and non-conductive encapsulating material 572 can be deposited in the material aperture 550. The encapsulating material 572 flows into the core cavity 590 and encloses the magnetic core 588. When the encapsulating material 572 is hardened, a dielectric member 591 is formed in the core cavity 590.

As shown in the fifteenth figure, another substrate layer 574 can be formed on the second side 542. Conductive layers 576, 578 can then be bonded to the substrate layer 574 and the substrate layer 575, respectively, by an insulative adhesion. A plurality of through holes 580 are then drilled through the upper conductive layer 576, the substrate layer 574, the base layer 524, the cover layer 522, the substrate layer 575, and the lower conductive layer 578. A plurality of through holes 582 are then drilled through the upper conductive layer 576, the substrate layer 574, the base layer 524, the dielectric element 591, the substrate layer 575, and the lower conductive layer 578. The through holes 580, 582 are then cleaned and plated using a conductive material to provide a plurality of conductive through vias 584, 586. The conductive layers 576, 578 are then etched to provide a plurality of upper conductors 592 along the substrate layer 574 and a plurality of lower conductors 594 are provided along the substrate layer 575.

The fourteenth and fifteenth drawings depict an embodiment in which the cover layer 522 has a plurality of cover holes 551 before the cover layer 522 is layered with the base layer 524. In other embodiments, the cover layer 522 may not have any cover holes 551 prior to layering. Instead, the cover layer 522 and the base layer 524 may be layered together to form a structure similar to the plate substrate 420 (twelfth view). Once joined together, in a substrate removal operation (e.g., stamping, drilling, or etching) as described above, a plurality of covering holes similar to the covering holes 551 are formed. In some embodiments, the ramp 527 can be formed during the substrate removal procedure. The processing of the plate substrate 520 can then be performed in the same manner as described above for the fourteenth and fifteenth drawings.

Figure 16 is a flow diagram of a method 700 of fabricating a planar electronic device, such as for fabricating the planar electronic device 116 (first image), 416 (thirteenth image) and 516 (fifteenth image). The initial operation of the method 700 can include fabricating a planar plate substrate. For example, the planar plate substrate may be the same with the plate substrate 104 (first image) or the plate substrate 220 (third image), 320 (eighth image), 420 (twelfth image) and 520 (tenth The four figures are the same. The method can be applied to various specific embodiments, such as the specific embodiments described above with respect to the third to fifteenth figures. Although the flowchart includes a plurality of arrows indicating the sequence of operations of the method 700, the method 700 need not be performed in some order of operations illustrated, but may be performed before, after, or at the same time as other operations.

The method 700 includes providing a cover layer at step 702 and providing a base layer having at least one material hole extending completely through itself at step 704. The operational step 704 of providing a base layer can include supplying a base layer of a preformed material void, or alternatively the method 700 can include first supplying a base layer and then forming the material void. Various substrate removal operations can be applied to form the material holes, such as the stamping, drilling (or edging) or etching operations described above. In some embodiments, the cover layer can also have a plurality of cover holes extending completely through itself, such as the cover layer 522 (fourteenth view). The covering hole may be formed in advance, or the square Method 700 can include the step of forming the cover hole.

The method 700 also includes the step 706 of connecting the cover layer to the base layer to each other. For example, the base layer can have first and second sides, and the cover layer can have one side. The base and cover layer may be connected to each other along the first side and the layer side. The cover layer can at least partially cover the material void. In some embodiments, the cover layer can completely cover the material holes.

The method 700 also includes providing a dielectric component in the material hole in step 708 and loading a magnetic core into the material hole in step 710. The step 710 of loading the magnetic core can be performed before or after the step 708 of providing the dielectric element. For example, the third to fifteenth figures describe various methods of providing the dielectric element at step 708. For example, for the third to seventh figures, the dielectric element 226 can be provided when the cover layer 222 and the base layer 224 are connected to each other at step 706. The core support channel 272 can also be formed at the same time and then adjusted with a selective substrate material removal operation. For the eighth to eleventh views, the dielectric element 373 can be provided when the contacts 356A, 356B are removed from the material hole 374. Where the contacts 356A, 356B are removed, the core support channel 372 is present between the dielectric element 373 and the base layers 324A, 324B.

For the twelfth to thirteenth figures, the dielectric element 491 can be provided after the magnetic core loading step 710. More specifically, an elastic and non-conductive encapsulating material 472 can be deposited in the material cavity 450 having the magnetic core 488. The encapsulating material 472 can flow into the core cavity 490 of the magnetic core 488. The dielectric element 491 is provided when the encapsulating material 472 is hardened. As in the above example, a core support channel may be present between the base layer 424 and the dielectric element 491. The core support channel extends around the periphery of the dielectric element 491.

The method 700 also includes the step 712 of embedding the magnetic core into one of the encapsulating materials of the material void. For the specific embodiments of the third to seventh embodiments, the magnetic core 288 can be provided after the dielectric element 266 is formed and embedded by depositing a resilient and non-conductive encapsulating material. Similarly, the dielectric element 373 can be formed Thereafter, a core similar to the core 288 (Fig. 7) is provided in the core support channel 372 (Fig. 11) and then embedded by depositing a resilient and non-conductive encapsulating material. For the specific embodiments of the twelfth to fifteenth embodiments, the magnetic core is embedded while the dielectric element is provided. The method 700 is also included in step 714 to form one or more conduction loops around the magnetic core as described above.

Seventeenth and eighteenth aspects depict an alternative method of fabricating a planar electronic device, and more particularly, an alternative method of providing a plurality of material holes and/or core support channels in a substrate. In the specific embodiments of the third to sixteenth embodiments, the material holes and the core support channels are formed by stacking a plurality of substrate layers, wherein at least one of the substrate layers already contains a hole. However, the specific embodiments of the seventeenth and eighteenth aspects may include directly removing the substrate material from a layered planar plate substrate. After forming the holes of the material, a planar electronic device can then be formed as described above.

Figure 17 is a perspective view of a hollow drill bit 800. As shown, the hollow drill bit 800 includes a shaft 802 having a drill bit end 804. The bit end 804 includes a shaft pocket 806 that extends into a depth (not shown) of the shaft 802. The shaft 802 includes a drill wall portion 808 that defines the shaft pocket 806. One of the inner surfaces of the drill wall portion 808 defines an inner diameter D _I1 and one of the outer surfaces of the drill wall portion 808 defines an outer diameter D _O1 . The inner and outer surfaces at the bit end 804 are roughened to aid in the drilling of the plate substrate.

The eighteenth figure shows a plate substrate 810 at one of various manufacturing stages. At stage 812, the plate substrate 810 has been drilled using the drill bit 800 (Fig. 17). In some embodiments, the bit end 804 can be cooled and lubricated using water or a coolant (Fig. 17). When the plate substrate 810 comprises epoxy glass fiber, the drill bit 800 can be a diamond bit. After the plate substrate 810 is drilled, a core support channel 814 is formed. The core support passage 814 has an outer diameter D _O2 that is substantially the same as the outer diameter D _O1 of the drill bit 800 and has an inner diameter D _I2 that is substantially the same as the inner diameter D _{I1 of} the drill bit 800. The drill bit 800 can remove 80% to 100% of the substrate material that needs to be removed to form the desired core support channel 814 at any location. However, if the drill bit 800 cannot remove 100% of the substrate material that needs to be removed to form the desired core support channel 814, the plate substrate 810 would require a conventional drill bit at stage 813 (i.e., not used) A hollow drill bit) for subsequent drilling. The size of the core support channel 814 can be effectively increased due to this selective drilling.

Figure 19 is a perspective view of a Forstner drill bit 820. As shown, the Forstner bit 820 includes a shaft 822 and a bit end 824 coupled to the shaft 822. The bit end 824 includes a major edge 826 and a pair of arcuate arms 828, 830 extending from the opposite end of the main edge 826 in a circumferential manner. The outer surfaces of the arcuate arms 828, 830 define an outer diameter D _{O3 of} the bit end 824.

The twenty-fifth figure shows one of the plate substrates 832 at different stages of manufacture. At stage 834, the plate substrate plate 832 has been drilled using the drill bit 820 (Fig. 19). After the plate substrate 832 is drilled, a material hole 836 is formed. The material aperture 836 has an outer diameter D _O4 that is substantially the same as the outer diameter D _{O3 of} the drill bit 820. The drill bit 820 can remove 80% to 100% of the substrate material that needs to be removed to form the desired material void 836 at any location. However, if the drill bit 820 cannot remove 100% of the substrate material that needs to be removed to form the desired material hole 836, the plate substrate 832 would need to be subsequently drilled at stage 840 using a conventional drill bit. The size of the material hole 836 can be effectively increased due to the selective drilling.

After forming the core support passage 814 (Fig. 18), a magnetic core is loaded into the core support passage 814, and a planar electronic device is manufactured in the same manner as described above. After forming the material hole 836 (p. twentieth), a magnetic core can be loaded into the material hole 836 and a planar electronic device can be fabricated in the same manner as described above. In some embodiments, the material removal procedure used can be confirmed after inspection of the interior surfaces defining the core support channel 814 or the material aperture 836. Thus the surfaces can have features such as a hollow drill bit drilled surface or a Forstner bit drilled surface.

100‧‧‧Magnetic array

102‧‧‧Magnetic components

104‧‧‧ Plate substrate

106‧‧‧Upper conductor

108‧‧‧ thickness dimensions

110‧‧‧Lower side

112‧‧‧ upper side

114‧‧‧through holes

116‧‧‧Electronic devices

Claims (15)

A method of manufacturing a planar plate substrate for receiving a magnetic core, the method comprising the steps of: providing a cover layer having a layer side; providing a base layer having a first side and a second side, the base The layer includes a material hole extending completely through the base layer between the first side and the second side; the cover layer and the base layer are bonded to each other along the first side and the layer side, the cover layer Extendingly covering at least a portion of the material hole; and providing a dielectric component in the material hole, wherein a core support channel exists between the dielectric component and the base layer, the core support channel surrounding the dielectric The component extends around and is configured to have the magnetic core therein. The method of claim 1, further comprising loading the magnetic core through the second side into the hole of the material, the magnetic core extending around the dielectric element. The method of claim 2, further comprising embedding the magnetic core in a packaging material deposited in the material hole and forming one or more conduction loops around the magnetic core, such as A conductive loop extends through the dielectric element and the base layer. The method of claim 1, wherein the material hole is formed by stamping the base layer. The method of claim 1, further comprising simultaneously punching a plurality of holes of the material in the base layer. The method of claim 1, wherein the base layer comprises the plurality of material holes, the cover layer extending over at least a portion of the holes of the material. The method of claim 1, wherein the core support channel is defined by one of the base layer facing the inner surface and one of the dielectric elements facing the outer surface, The outwardly facing surface faces the inwardly facing surface, at least a portion of the inwardly facing surface and/or at least a portion of the inwardly facing surface is severed. The method of claim 1, wherein the core support passage is defined by one of the base layer facing the inner surface and one of the dielectric members facing the outer surface, the outwardly facing surface facing the inwardly facing surface, The core support channel is partially defined by one or more alignment features that are configured to engage the magnetic core in the core support channel. The method of claim 1, wherein the core support passage is defined by one of the base layer facing the inner surface and one of the dielectric members facing the outer surface, the outwardly facing surface facing the inwardly facing surface, The method further includes drilling at least a portion of at least the inwardly facing surface and the outwardly facing surface. The method of claim 9, wherein the drilling comprises providing a bevel alignment feature configured to engage the magnetic core. The method of claim 1, further comprising loading the base layer on a mold structure comprising a joint surface and a platform projecting from the joint surface, the platform surrounding a component recess, wherein The platform is sized and shaped to be received by the material aperture of the base layer, and the component recess is sized and shaped to receive the dielectric component. The method of claim 11, wherein the bonding of the cover layer to the base layer comprises bonding the cover layer to the dielectric element and to the base layer. The method of claim 1, wherein the dielectric component is bonded to the base layer through a joint, wherein the providing the dielectric component comprises removing the joint. The method of claim 1, wherein the cover layer comprises a cover hole, and when the cover layer is combined with the base layer, the cover hole is aligned with the material hole, the cover hole having a hole smaller than the material hole size. The method of claim 14, wherein the method further comprises The base layer is bonded together to form the covering hole.