CN103943306B - Magnetic element and manufacturing method of magnetic element - Google Patents
Magnetic element and manufacturing method of magnetic element Download PDFInfo
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- CN103943306B CN103943306B CN201410091056.2A CN201410091056A CN103943306B CN 103943306 B CN103943306 B CN 103943306B CN 201410091056 A CN201410091056 A CN 201410091056A CN 103943306 B CN103943306 B CN 103943306B
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- magnetic core
- accepting groove
- conductive layer
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- conductive
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- 238000004519 manufacturing process Methods 0.000 title abstract description 5
- 229920005989 resin Polymers 0.000 claims abstract description 104
- 239000011347 resin Substances 0.000 claims abstract description 104
- 238000004804 winding Methods 0.000 claims abstract description 24
- 239000000463 material Substances 0.000 claims abstract description 15
- 239000004606 Fillers/Extenders Substances 0.000 claims description 64
- 239000000758 substrate Substances 0.000 claims description 60
- 239000004020 conductor Substances 0.000 claims description 44
- 230000004888 barrier function Effects 0.000 claims description 26
- 238000002360 preparation method Methods 0.000 claims description 20
- 238000007711 solidification Methods 0.000 claims description 9
- 230000008023 solidification Effects 0.000 claims description 9
- 230000035699 permeability Effects 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 5
- 239000000945 filler Substances 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 4
- 230000013011 mating Effects 0.000 claims description 4
- 239000011810 insulating material Substances 0.000 claims description 3
- QELJHCBNGDEXLD-UHFFFAOYSA-N nickel zinc Chemical compound [Ni].[Zn] QELJHCBNGDEXLD-UHFFFAOYSA-N 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 230000008569 process Effects 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 64
- 238000010586 diagram Methods 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 3
- 208000037656 Respiratory Sounds Diseases 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000011536 re-plating Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Abstract
The invention discloses a magnetic element. The magnetic element comprises resin padding, a base plate and a magnetic core. The resin padding covers the magnetic core and is buried in a containing groove in the base plate. The base plate is provided with a first conductive hole, a second conductive hole, a first conductive layer and a second conductive layer. The first conductive layer is provided with a first conductive wire, the second conductive layer is provided with a second conductive wire, and the first conductive wire, the first conductive hole, the second conductive wire and the second conductive hole are connected to form a coil winding the magnetic core. The invention further provides a manufacturing method of the magnetic element. The magnetic element is buried in the containing groove of the base plate, the resin padding wraps the magnetic core to protect the magnetic core, material cost is saved, and the reliability and consistency of the magnetic element are enhanced.
Description
Technical field
The present invention relates to magnetic element, more particularly to it is a kind of by the magnetic element being embedded in magnetic core in circuit board and its making
Method.
Background technology
Traditional magnetic element be using hand winding make, by artificial coiling, then carry out epoxy resin it is gluing and
Encapsulation, the BGA package that main form has the QFN encapsulation of quad flat non-pin, aerofoil profile or BGA forms corresponding magnetic
Property element, hand winding make magnetic element consistency of performance it is relatively low, meanwhile, in recent years with the increase of human cost, its into
This also can be accordingly increased.
Then, automated production becomes the focus of the area research, and automation SMD type magnetic device goes out therewith.Using
Automation SMD typically adopts UI core combination magnetic circuits, by carrying out Automated winding in U-shaped, by pin thermal compression welding, so
It is bonded into I pieces afterwards.The magnetic element of UI core combination magnetic circuits has leakage field risk, and its crosstalk and EMI performances are by element
Body and layout designs differentia influence are larger, the poor reliability of magnetic element.
The content of the invention
Embodiment of the present invention technical problem to be solved is, there is provided the magnetic unit being embedded in a kind of magnetic core in circuit board
Part and preparation method thereof.
To achieve these goals, embodiment of the present invention provides following technical scheme：
On the one hand, the present invention provides a kind of magnetic element, including magnetic core, and the magnetic element also includes that substrate and resin are filled out
Material, the substrate is provided with accepting groove and the first conductive hole and the second conductive hole, and the accepting groove includes the first side wall and the second side
Wall, the first side wall faces the second sidewall, and first conductive hole is near the first side wall and positioned at the collecting
The periphery of groove, second conductive hole near the second sidewall and near the accepting groove periphery, the resin extender with
The magnetic core is contained in the accepting groove, and the resin extender coats the magnetic core, and the substrate also includes that first is conductive
Layer and the second conductive layer, the magnetic core is located between first conductive layer and second conductive layer, first conductive layer
On set the first conductor wire, first conductor wire is electrically connected between first conductive hole and second conductive hole, described
The second conductor wire is set on second conductive layer, second conductor wire is electrically connected to first conductive hole with second conductive hole
Between, first conductor wire, first conductive hole, second conductor wire and second conductive hole connect to be formed jointly
Wind the coil of the magnetic core.
Wherein, the quantity of the coil is one, magnetic core described in the coil continuous winding.
Wherein, the quantity of the coil is at least two, and at least two interleaving coils arrangement winds the magnetic core.
Wherein, the quantity of the coil is at least two, and the magnetic core includes the first paragraph magnetic core and second being oppositely arranged
Section magnetic core, at least two coil be respectively wound around on institute's first paragraph magnetic core and the second segment magnetic core on.
Wherein, the distance between the magnetic core and the first side wall of the accepting groove and the magnetic core and the accepting groove
The distance between second sidewall at least one be more than 2mil（Mil）.
Wherein, the magnetic element also includes resin insulating barrier, and the resin insulating barrier is located at the resin extender and institute
State between the first conductive layer.
Wherein, the surface co-planar of the surface of the adjacent described resin insulating barrier of the resin extender and the substrate.
Wherein, the surface co-planar of the surface of adjacent described first conductive layer of the resin insulating barrier and the substrate.
Wherein, the initial permeability of the magnetic core is not less than 100, and the coefficient of expansion of the substrate is not higher than 300ppm, institute
The hardness for stating resin extender 30 is not higher than shore 90D.
Wherein, the material of the magnetic core is MnZn or nickel zinc or amorphous or metal-powder-core.
On the other hand, the present invention also provides a kind of preparation method of magnetic element, including：
Accepting groove, the shape of the accepting groove and the mating shapes of magnetic core are milled out in substrate；
Resin extender is filled to the accepting groove；
The magnetic core is imbedded in the accepting groove, the resin extender coats the magnetic core；
Solidify the resin extender；
The substrate is drilled and electroplated on the substrate, forms the first conductive hole and the second conductive hole, and formation first
Conductive layer and the second conductive layer, the magnetic core is located between first conductive layer and second conductive layer, the accepting groove
Including the first side wall and second sidewall, the first side wall faces the second sidewall, and first conductive hole is near described the
Side wall and positioned at the periphery of the accepting groove, second conductive hole is near institute's second sidewall and positioned at the accepting groove
Periphery；
Circuit is made on first conductive layer with second conductive layer, on first conductive layer first is formed
Conductor wire, forms the second conductor wire on second conductive layer, first conductor wire, first conductive hole, described
Two conductor wires and second conductive hole connect to form the coil for winding the magnetic core jointly.
Wherein, the quantity of the coil is one, magnetic core described in the coil continuous winding.
Wherein, the quantity of the coil is at least two, and at least two interleaving coils arrangement winds the magnetic core.
Wherein, the quantity of the coil is at least two, and the magnetic core includes the first paragraph magnetic core and second being oppositely arranged
Section magnetic core, at least two coil be respectively wound around on institute's first paragraph magnetic core and the second segment magnetic core on.
Wherein, solidify after the resin extender, also include：
If the resin extender after solidification is higher than the substrate surface, nog plate process is carried out so that in the accepting groove
Resin extender solidification after it is coplanar with the substrate；
If the resin extender after solidification is less than the substrate surface, exhausted in the surface coated with resins of the resin extender
Edge layer, first conductive layer is electroplated on the surface of the resin insulating barrier.
Wherein, the resin insulating barrier is liquid resin material, coats solidify afterwards.
Wherein, the resin insulating barrier is semi-solid preparation insulating materials, and in the form of pressing the resin extender is formed at
Between first conductive layer.
Wherein, the distance between the magnetic core and the first side wall of the accepting groove and the magnetic core and the accepting groove
The distance between second sidewall at least one be more than 2mil.
Wherein, the initial permeability of the magnetic core is not less than 100, and the coefficient of expansion of the substrate is not higher than 300ppm, institute
The hardness for stating resin extender 30 is not higher than shore 90D.
Wherein, the viscosity of the resin extender 30 is less than 20000cps.
The present invention also provides a kind of preparation method of magnetic element, including：
Accepting groove, the shape of the accepting groove and the mating shapes of magnetic core are milled out in substrate；
Resin extender is filled to the accepting groove；
The magnetic core is imbedded in the accepting groove；
Solidify the resin extender, the resin extender coats the magnetic core；
Increase resin insulating barrier on the surface of the substrate and the resin extender；
Drill on the substrate；
The substrate is electroplated, the first conductive hole and the second conductive hole is formed, and forms the first conductive layer and the second conductive layer,
The magnetic core is located between first conductive layer and second conductive layer, and the accepting groove includes the first side wall and the second side
Wall, the first side wall faces the second sidewall, and first conductive hole is near the first side wall and positioned at the collecting
The periphery of groove, second conductive hole is near the second sidewall and positioned at the periphery of the accepting groove；
Circuit is made on first conductive layer with second conductive layer, on first conductive layer first is formed
Conductor wire, forms the second conductor wire on second conductive layer, first conductor wire, first conductive hole, described
Two conductor wires and second conductive hole connect to form the coil for winding the magnetic core jointly.
The present invention in magnetic element by will be embedded in the accepting groove of substrate and using resin extender cladding magnetic core protection magnetic
Core, saves Material Cost, improves the reliability and uniformity of magnetic element.
Description of the drawings
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
The accompanying drawing to be used needed for having technology description is briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is the generalized section of the magnetic element that the present invention is provided；
Fig. 2 is the schematic diagram of the accepting groove opened up on substrate of the magnetic element that the present invention is provided；
Fig. 3 is the schematic diagram that coil is arranged around the magnetic core of the magnetic element that the present invention is provided；
Fig. 4 is the schematic diagram of the first embodiment of the mode of the coil winding of the magnetic element that the present invention is provided；
Fig. 5 is the schematic diagram of second embodiment of the mode of the coil winding of the magnetic element that the present invention is provided；
Fig. 6 is the schematic diagram of the third embodiment of the mode of the coil winding of the magnetic element that the present invention is provided；
Fig. 7 A to Fig. 7 F are the schematic diagrames of each step of the preparation method of the magnetic element that the present invention is provided.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than the embodiment of whole.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
Fig. 1, Fig. 2 and Fig. 3 are referred to, a kind of magnetic element 100 that the present invention is provided includes magnetic core 10, substrate 20 and resin
Filler 30, the substrate 20 is provided with the conductive hole 24 of accepting groove 22 and first and the second conductive hole 26.Fig. 2 show on the base plate 20
The schematic diagram of accepting groove 22 is opened up, four accepting grooves 22 are set on the substrate 20 shown in Fig. 2.The accepting groove 22 includes the first side wall
224 and second sidewall 226, the first side wall 224 faces second sidewall 226.First conductive hole 24 is near the first side wall
224 and positioned at the periphery of accepting groove 22, second conductive hole 26 is near the second sidewall 226 and positioned at the outer of accepting groove 22
Enclose, the resin extender 30 is contained in the accepting groove 22 with the magnetic core 10, and the resin extender 30 coats the magnetic
Core 10, the substrate 20 also includes the first conductive layer 23 and the second conductive layer 25, and the magnetic core 10 is located at first conductive layer
Between 23 and second conductive layer 25, the first conductor wire 232, first conductor wire 232 are set on first conductive layer 23
It is electrically connected between first conductive hole 24 and second conductive hole 26, on second conductive layer 25 the second conductor wire is set
252, second conductor wire 252 is electrically connected between first conductive hole 24 and second conductive hole 26, and described first
Jointly connection formation is twined for conductor wire 232, first conductive hole 24, second conductor wire 252 and second conductive hole 26
Around the coil of the magnetic core 10.In present embodiment, accepting groove 22 is shaped as annular.The shape of the annular accepting groove 22 can
Think that polygonal annular can also be for annular, the accepting groove 22 shown in Fig. 1 and Fig. 2 is polygonal annular, including four sides, works as collecting
Groove 22 is arranged when circularizing, and first conductive hole 24 is distributed in the area that the first side wall 224 is surrounded.
Fig. 3 show the schematic diagram that coil is arranged around magnetic core 10, and the first conductor wire 232 is spaced to be arranged in first
Conductive layer 23, the second conductor wire 252 is spaced to be arranged in the second conductive layer 25, the first conductor wire 232 and the second conductor wire 252
Formed by way of circuit printed line cabling, on the base plate 20 copper facing forms the first conductive layer 23 and the second conductive layer 25, then leads to
Overetched mode etches away part copper, so as to form the first conductor wire 232 and the second conductor wire 252.
The present invention coats magnetic by will be embedded in magnetic element 100 in the accepting groove 22 of substrate 20 and using resin extender 30
Core 10 protects magnetic core 10, and resin extender 30 is coated around magnetic core 10 and forms protective layer, in manufacturing process, resin extender 30
It is avoided that crackle occurs in magnetic core 10 as buffer protection layer.The first conductor wire 232, second that the present invention passes through setting on substrate 20
Connection between the conductive hole 24 of conductor wire 252 and first and the second conductive hole 26 forms the coil of winding magnetic core 10, saves thing
Material cost, meanwhile, improve the reliability and uniformity of magnetic element 100.
The coiling of the coil around magnetic core 10 determined according to different demands the quantity of coil and varying number coil it
Between arrangement mode.Fig. 4-Fig. 6 show the mode of three kinds of coil windings.
In embodiment as shown in Figure 4, the quantity of the coil W is one, magnetic core described in the coil W continuous windings
10。
In embodiment shown in Fig. 5 and Fig. 6, including two coil W1, W2.Wherein, Fig. 6 show：It is described two
Coil W1, the W2 staggered winding magnetic core 10, with the coil in the schematic diagram that the surrounding of magnetic core 10 shown in Fig. 3 arranges coil
Arrangement is identical.Wherein, Fig. 5 show：The magnetic core 10 includes first paragraph magnetic core 12 and the second segment magnetic core 14 being oppositely arranged, institute
State two coil W1, W2 is respectively wound around on institute first paragraph magnetic core 12 and on the second segment magnetic core 14.Make on the base plate 20
During the coil of varying number, the same layer of substrate 20 can be produced on, it is also possible to be produced on the different layers of substrate 20.The line
The quantity of circle can also be two or more, in Fig. 5 and Fig. 6 with two coils as illustrate, when coil quantity be two with
When upper, the mode of its winding is identical with the canoe of two coils, and the meaning of plural interleaving coils arrangement is exactly two
Coil more than individual is simultaneously wound around magnetic core 10.
In present embodiment, the distance between the magnetic core 10 and the first side wall 224 of the accepting groove 22 and the magnetic
The distance between core 10 and second sidewall 226 of the accepting groove 22 at least one be more than 2mil.
As shown in figure 1, the magnetic element 100 also includes resin insulating barrier 40, the resin insulating barrier 40 is located at described
Between resin extender 30 and first conductive layer 23.
In a kind of embodiment, surface and the substrate 20 of the adjacent described resin insulating barrier 40 of the resin extender 30
Surface co-planar.
In another embodiment, the surface of adjacent described first conductive layer 23 of the resin insulating barrier 40 and the base
The surface co-planar of plate 20.
The initial permeability of the magnetic core 10 that the present invention is provided is not less than 100, and the coefficient of expansion of the substrate 20 is not high
In 300ppm, the hardness of the resin extender 30 is not higher than shore 90D.
The material of the magnetic core 10 is MnZn or nickel zinc or amorphous or metal-powder-core.
On the other hand, the preparation method that the present invention also provides a kind of magnetic element 100, refers to Fig. 7 A to Fig. 7 F, magnetic
The preparation method of element 100 comprises the steps：
Accepting groove 22, the shape of the accepting groove 22 and the mating shapes of magnetic core 10, such as Fig. 7 A, figure are milled out in substrate 20
Shown in 7B and Fig. 2.In present embodiment, accepting groove 22 is shaped as annular.The shape of the annular accepting groove 22 can be many
Side annular can also be annular, and the accepting groove 22 shown in Fig. 1 and Fig. 2 is polygonal annular, including four sides, when accepting groove 22 sets
When being set to annular, first conductive hole 24 is distributed in the area that the first side wall 224 is surrounded.
As seen in figure 7 c, resin extender 30 is filled to the accepting groove 22；The magnetic core 10 is imbedded into the collecting
In groove 22, the resin extender 30 coats the magnetic core 10；Solidify the resin extender 30.
In other embodiment, it is also possible to first magnetic core 10 is imbedded in the accepting groove 22, then resin extender 30 is filled
The resin extender 30 is caused to coat the magnetic core 10 to the accepting groove 22.
As shown in Fig. 7 D and Fig. 7 E, the substrate 20 is drilled and electroplated on the substrate 20, form the first conductive hole 24
With the second conductive hole 26, and the first conductive layer 23 and the second conductive layer 25 are formed, the magnetic core 10 is located at first conductive layer
Between 23 and second conductive layer 25, the accepting groove 22 includes the first side wall 224 and second sidewall 226, the first side wall 224
In the face of second sidewall 226.First conductive hole 24 is described near the first side wall 224 and positioned at the periphery of accepting groove 22
Second conductive hole 26 is near the second sidewall 226 and positioned at the periphery of accepting groove 22.
As shown in Figure 7 F, circuit is made on first conductive layer 23 with second conductive layer 25, described first
The first conductor wire 232 is formed on conductive layer 23, the second conductor wire 252 is formed on second conductive layer 25, described first leads
Jointly connection forms winding for electric wire 232, first conductive hole 24, second conductor wire 252 and second conductive hole 26
The coil of the magnetic core 10.
Specifically, in a kind of embodiment, substrate 20 covers the sheet material of copper for two sides, and magnetic core 10 is imbedded into accepting groove 22 simultaneously
After solidified resin filler 30, first drill, re-plating substrate 20, after plating, the hole bored just forms the He of the first conductive hole 24
Second conductive hole 26, while forming the first conductive layer 23 and the second conductive layer 25 on the surface of substrate 20, then leads to overetched side
Formula forms the first conductor wire 232 and the second conductor wire 252 on the first conductive layer 23 and the second conductive layer 25.Another kind of embodiment party
In formula, substrate 20 covers the sheet material of copper for one side, and on the surface for not covering copper accepting groove 22 is made, and magnetic core 10 is imbedded into accepting groove 22
And after solidified resin filler 30, first opening up on the base plate 20 increases insulating resin layer, insulating resin on the individual surface of accepting groove 22
Layer covering substrate 20 and resin extender 30, then drill, followed by electroplating substrate 20, after plating, the hole bored just forms institute
The first conductive hole 24 and the second conductive hole 26 are stated, while forming the first conductive layer 23 and the second conductive layer on the surface of substrate 20
25, then leading to overetched mode, that the first conductor wire 232 and second is formed on the first conductive layer 23 and the second conductive layer 25 is conductive
Line 252.
The preparation method of the magnetic element 100 that the present invention is provided is by the collecting by substrate 20 is embedded in magnetic element 100
In groove 22 and using the cladding protection magnetic core 10 of magnetic core 10 of resin extender 30, resin extender 30 coats formation around magnetic core 10 and protects
Sheath, in manufacturing process, resin extender 30 is avoided that crackle occurs in magnetic core 10 as buffer protection layer.The present invention passes through substrate
The first conductor wire 232, the connection shape between the second conductor wire 252 and the first conductive hole 24 and the second conductive hole 26 arranged on 20
Into the coil of winding magnetic core 10, Material Cost is saved, meanwhile, improve the reliability and uniformity of magnetic element 100.
The coiling of the coil around magnetic core 10 determined according to different demands the quantity of coil and varying number coil it
Between arrangement mode.Fig. 4-Fig. 6 show the mode of three kinds of coil windings, respectively：The quantity of the coil W is one, institute
State magnetic core 10 described in coil W continuous windings；The quantity of the coil is two, described two coil W1, the staggered windings of W2
The magnetic core 10.The quantity of the coil is two, and the magnetic core 10 includes first paragraph magnetic core 12 and the second segment being oppositely arranged
Magnetic core 14, described two coil W1, W2 is respectively wound around on institute first paragraph magnetic core 12 and on the second segment magnetic core 14.The line
The quantity of circle can also be two or more, in Fig. 5 and Fig. 6 with two coils as illustrate, when coil quantity be two with
When upper, the mode of its winding is identical with the canoe of two coils.
The preparation method of the magnetic element 100 that the present invention is provided, after the resin extender 30 is solidified, also including following step
Suddenly：
If the resin extender 30 after solidification is higher than the surface of the substrate 20, nog plate process is carried out so that the collecting
Resin extender 30 in groove 22 is coplanar with the substrate 20 after solidifying；
If the resin extender 30 after solidification is less than the surface of the substrate 20, coat on the surface of the resin extender 30
Resin insulating barrier 40（As shown in Figure 1）, first conductive layer 23 electroplated on the surface of the resin insulating barrier 40, the resin
The surface co-planar of the surface of insulating barrier 40 and the substrate 20.
Specifically, make the method for the resin insulating barrier 40 according to the difference of the material of resin insulating barrier 40 include as
Lower two ways.The resin insulating barrier 40 is liquid resin material, coats solidify afterwards, that is, first by the insulation resin of liquid
The step of layer 40 is coated in the surface of resin extender 30 and is solidified again.The resin insulating barrier 40 is semi-solid preparation insulating materials, is adopted
It is formed between the resin extender 30 and first conductive layer 23 with the form of pressing.
During making accepting groove 22 on the base plate 20, with reference to the size of magnetic core 10 so that the size of accepting groove 22 is big
In the size of magnetic core 10, in present embodiment, the distance between the magnetic core 10 and the first side wall 224 of the accepting groove 22 and
The distance between the magnetic core 10 and second sidewall 226 of the accepting groove 22 at least one be more than 2mil.
The initial permeability of the magnetic core 10 is not less than 100, and the coefficient of expansion of the substrate 20 is not higher than 300ppm, described
The hardness of resin extender 30 is not higher than shore 90D.The viscosity of the resin extender 30 is less than 20000cps.
The present invention coats magnetic by will be embedded in magnetic element 100 in the accepting groove 22 of substrate 20 and using resin extender 30
Core 10 protects magnetic core 10, saves Material Cost, improves the reliability and uniformity of magnetic element 100.
Embodiments described above, does not constitute the restriction to the technical scheme protection domain.It is any in above-mentioned enforcement
Modification, equivalent and improvement made within the spirit and principle of mode etc., should be included in the protection model of the technical scheme
Within enclosing.
Claims (15)
1. a kind of magnetic element, including magnetic core, it is characterised in that the magnetic element also includes substrate and resin extender, described
Substrate is provided with accepting groove and the first conductive hole and the second conductive hole, and the accepting groove includes the first side wall and second sidewall, described
The first side wall faces the second sidewall, and first conductive hole is near the first side wall and positioned at the outer of the accepting groove
Enclose, second conductive hole is near the second sidewall and positioned at the periphery of the accepting groove, the resin extender and the magnetic
Core is contained in the accepting groove, and the resin extender coats the magnetic core, and the substrate also includes the first conductive layer and the
Two conductive layers, the magnetic core is located between first conductive layer and second conductive layer, and the is set on first conductive layer
One conductor wire, first conductor wire is electrically connected between first conductive hole and second conductive hole, and described second leads
The second conductor wire is set in electric layer, second conductor wire is electrically connected between first conductive hole and second conductive hole,
First conductor wire, first conductive hole, second conductor wire and second conductive hole connect to form winding jointly
The coil of the magnetic core, the quantity of the coil is at least two, and at least two interleaving coils arrangement winds the magnetic core,
The magnetic core includes the first paragraph magnetic core that is oppositely arranged and second segment magnetic core, and at least two coil is respectively wound around described the
On one section of magnetic core and on the second segment magnetic core.
2. magnetic element as claimed in claim 1, it is characterised in that between the first side wall of the magnetic core and the accepting groove
Distance and the distance between the magnetic core and the second sidewall of the accepting groove at least one be more than 2 mils.
3. magnetic element as claimed in claim 1, it is characterised in that the magnetic element also includes resin insulating barrier, described
Resin insulating barrier is located between the resin extender and first conductive layer.
4. magnetic element as claimed in claim 3, it is characterised in that the adjacent described resin insulating barrier of the resin extender
The surface co-planar of surface and the substrate.
5. magnetic element as claimed in claim 3, it is characterised in that adjacent described first conductive layer of the resin insulating barrier
Surface and the substrate surface co-planar.
6. magnetic element as claimed in claim 1, it is characterised in that the initial permeability of the magnetic core is not less than 100, described
The coefficient of expansion of substrate is not higher than 300ppm, and the hardness of the resin extender is not higher than shore 90D.
7. magnetic element as claimed in claim 6, it is characterised in that the material of the magnetic core be MnZn or nickel zinc or amorphous or
Metal-powder-core.
8. magnetic element as claimed in claim 1, it is characterised in that the accepting groove is shaped as polygonal annular or annulus
Shape.
9. a kind of preparation method of magnetic element, it is characterised in that include：
Accepting groove, the shape of the accepting groove and the mating shapes of magnetic core are milled out in substrate；
Resin extender is filled to the accepting groove；
The magnetic core is imbedded in the accepting groove；
Solidify the resin extender, the resin extender coats the magnetic core；
Drill and electroplate the substrate on the substrate, form the first conductive hole and the second conductive hole, and to form first conductive
Layer and the second conductive layer, the magnetic core is located between first conductive layer and second conductive layer, and the accepting groove includes
The first side wall and second sidewall, the first side wall faces the second sidewall, and first conductive hole is near first side
Wall and positioned at the periphery of the accepting groove, second conductive hole is near the second sidewall and positioned at the outer of the accepting groove
Enclose；
Circuit is made on first conductive layer with second conductive layer, first is formed on first conductive layer conductive
Line, forms the second conductor wire on second conductive layer, and first conductor wire, first conductive hole, described second are led
Electric wire and second conductive hole connect to form the coil for winding the magnetic core jointly, and the quantity of the coil is at least two,
At least two interleaving coils arrangement winds the magnetic core, and the magnetic core includes first paragraph magnetic core and the second segment being oppositely arranged
Magnetic core, at least two coil be respectively wound around on the first paragraph magnetic core and the second segment magnetic core on.
10. the preparation method of magnetic element as claimed in claim 9, it is characterised in that after the solidification resin extender, also wrap
Include：
If the resin extender after solidification is higher than the substrate surface, nog plate process is carried out so that the tree in the accepting groove
It is coplanar with the substrate after the solidification of fat filler；
If the resin extender after solidification is less than the substrate surface, in the surface coated with resins insulation of the resin extender
Layer, first conductive layer is electroplated on the surface of the resin insulating barrier.
The preparation method of 11. magnetic elements as claimed in claim 10, it is characterised in that the resin insulating barrier is liquid tree
Fat material, coats solidify afterwards.
The preparation method of 12. magnetic elements as claimed in claim 10, it is characterised in that the resin insulating barrier is semi-solid preparation
Insulating materials, is formed between the resin extender and first conductive layer in the form of pressing.
The preparation method of 13. magnetic elements as claimed in claim 9, it is characterised in that the magnetic core and the accepting groove
At least one is close more than 2 for the distance between the distance between the first side wall and the magnetic core and second sidewall of the accepting groove
Ear.
The preparation method of 14. magnetic elements as claimed in claim 9, it is characterised in that the initial permeability of the magnetic core is not
Less than 100, the coefficient of expansion of the substrate is not higher than 300ppm, and the hardness of the resin extender is not higher than shore 90D.
The preparation method of 15. magnetic elements as claimed in claim 9, it is characterised in that the viscosity of the resin extender 30 is not
More than 20000cps.
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| WO2016063762A1 (en) * | 2014-10-22 | 2016-04-28 | 株式会社村田製作所 | Coil component |
| US11277067B2 (en) | 2016-03-03 | 2022-03-15 | Delta Electronics, Inc. | Power module and manufacturing method thereof |
| CN109003779B (en) * | 2016-03-03 | 2021-04-09 | 台达电子企业管理（上海）有限公司 | Power module and method for manufacturing the same |
| US11450472B2 (en) | 2018-04-29 | 2022-09-20 | Shennan Circuits Co., Ltd. | Electromagnetic device and method for manufacturing the same |
| CN110415946A (en) * | 2018-04-29 | 2019-11-05 | 深南电路股份有限公司 | Electromagnetic component and its manufacturing method |
| CN109195327A (en) * | 2018-08-20 | 2019-01-11 | 深圳崇达多层线路板有限公司 | A method of magnetic potential surface crater and layering plate bursting are buried in solution |
| US12002615B2 (en) | 2018-11-02 | 2024-06-04 | Delta Electronics (Shanghai) Co., Ltd. | Magnetic element, manufacturing method of magnetic element, and power module |
| CN115359999A (en) | 2018-11-02 | 2022-11-18 | 台达电子企业管理（上海）有限公司 | Transformer module and power module |
| US11133750B2 (en) | 2018-11-02 | 2021-09-28 | Delta Electronics (Shanghai) Co., Ltd. | Power module |
| CN111145996A (en) | 2018-11-02 | 2020-05-12 | 台达电子企业管理（上海）有限公司 | Method for manufacturing magnetic element and magnetic element |
| CN109496083B (en) * | 2018-11-16 | 2021-01-05 | 西安微电子技术研究所 | Manufacturing method of buried inductor printed circuit board |
| CN113053642B (en) * | 2019-12-26 | 2024-06-07 | 深南电路股份有限公司 | Filter, manufacturing method thereof and electromagnetic element |
| CN114630504A (en) * | 2020-12-10 | 2022-06-14 | 深南电路股份有限公司 | Circuit board processing method and circuit board |
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