TW201339601A - Built-in substrate inspection method - Google Patents

Abstract

To provide an inspection method for built-in substrates that can effectively eliminate the effects of parasitic capacitance and the like between the wires of the inspection tool, and the effects of static capacitance between the wires in the built-in substrate, enabling accurate inspection of an inspection-target section within the built-in substrate. In the case where a capacitor C1 is chosen as a part for inspection, probes P1, P2, and P5 through P7, which contact inspection sites D1 and D2 designated as first selected inspection sites and inspection sites D5 to D7 designated as first potential adjustment inspection sites, are connected electrically to a first output terminal of a power supply section. Furthermore, a probe P4 which contacts an inspection site D4 designated as a second selected inspection site is connected electrically to a second output terminal of the power supply section 4. Moreover, probes P3 and P8 through P10 which contact inspection sites D3 and D8 through D10 designated as unrelated inspection sites are connected electrically to ground potential.

Description

Inspection method for built-in parts substrate

The present invention relates to a plurality of inspection target portions formed by an electronic component or an electronic component including an electronic component provided in a component substrate, via a probe that is in contact with a plurality of inspection points provided on a surface of the component substrate. An inspection method of an internal component substrate for inspecting electrical characteristics of the inspection target portion, wherein the internal component substrate is provided with an electronic component having an impedance.

At present, an internal component substrate (also referred to as an embedded substrate) in which electronic components such as capacitors and resistors are provided has been popularized, and it is extremely necessary to determine an inspection method for electronic components built in a component substrate. Since the built-in component substrate itself is a new product, there is no prior art that can be called a conventional technique regarding the current state of such inspection methods. Therefore, the inspection method and problems existing by the inventors of the present application and the like before the present invention is proposed are described herein.

The case where the inspection is performed on the built-in component substrate 1 schematically shown in FIG. 1 will be described as an example. The built-in component substrate 1 is formed by laminating a plurality of (here, three-layer) substrates 1a to 1c, and has a plurality of electronic components having impedances therein (here, three capacitors C1~). C3 and two resistors R1, R2). Further, ten inspection points D1 to D10 are provided on the upper and lower surfaces of the built-in component substrate 1, and the probes P1 to P10 of the inspection device are in contact with the respective inspection points D1 to D10 at the time of inspection. Here, in the case of collectively referred to as checkpoints D1 to D10 and probes P1 to P10, the symbols "D" and "P" are used, respectively. In addition, the capacitors C1 to C3 and the resistors R1 and R2, which are collectively referred to as built-in electronic components, are collectively referred to. In this case, it is called an electronic part. In addition, a case where the capacitors C1 to C3 and the resistors R1 and R2 are individually and independently set as the inspection target portion will be described.

FIG. 2 is a wiring diagram schematically showing an electrical connection relationship between an electronic component, a wiring pattern, and a checkpoint provided on the built-in component substrate 1. As shown in FIG. 2, three independent networks N1 to N3 exist in the built-in component substrate 1. Capacitors C1 to C3, resistor R1 and checkpoints D1, D2, D4 to D7 belong to network N1, resistor R2 and checkpoints D8, D9 belong to network N2, and checkpoints D3, D10 belong to network N3.

With respect to such electronic components (capacitors C1 to C3, resistors R1 and R2) built in the component substrate 1, the previously proposed inspection method includes, for example, a capacitor C1, a capacitor C2, a capacitor C3, and a resistor. The order of R1 and resistor R2 is checked. In the inspection step for the capacitor C1, the inspection power (for example, an alternating current, a direct current fluctuation current, an alternating current voltage, or a direct current fluctuation voltage) is supplied to the capacitor C1 via the inspection points D1, D4 and the probes P1, P4 respectively contacting them. The electrical characteristics of the capacitor C1 are detected via the check points D1, D4 and the probes P1, P4 respectively contacting them, and whether or not the capacitor C1 is good is judged based on the detection result. As the detection of the electrical characteristics of the capacitor C1, for example, the potential difference between the check points D1, D4 and the current flowing between the check points D1, D4 are detected, and the impedance of the capacitor C1 is detected based on these detected values. During the inspection of the capacitor C1, the probe P that is in contact with the inspection point D (ie, the inspection points D2, D3, D5 to D10) other than the inspection points D1, D4 (ie, probes P2, P3, P5 to P10) It is in an electrical disconnection state.

Next, in the inspection of the capacitor C2, the inspection power is supplied to the capacitor C2 via the inspection points D1, D5 and the probes P1, P5 respectively contacting them, via the inspection points D1, D5 and the probes P1 respectively contacting them. P5 detects the electrical characteristics (for example, impedance) of the capacitor C2, and determines whether the capacitor C2 is good or not based on the detection result. At this time, the probe P that is in contact with the inspection point D other than the inspection points D1, D5 is in an electrically disconnected state.

Similarly, in the inspection of the capacitor C3, the supply of the inspection power and the inspection of the electric characteristics of the capacitor C3 are performed via the inspection points D1, D7 and the probes P1, P7 respectively contacting them. Measurement. At this time, the probe P that is in contact with the inspection point D other than the inspection points D1, D7 is in an electrically disconnected state. Further, in the inspection of the resistor R1, the supply of the inspection power and the detection of the electrical characteristics for the resistor R1 are performed via the inspection points D2, D6 and the probes P2, P6 respectively contacting them. At this time, the probe P that is in contact with the inspection point D other than the inspection points D2 and D6 is in an electrically disconnected state. Further, in the inspection of the resistor R2, the supply of the inspection power and the detection of the electrical characteristics for the resistor R2 are performed via the inspection points D8, D9 and the probes P8, P9 respectively contacting them. At this time, the probe P that is in contact with the inspection point D other than the inspection points D8 and D9 is in an electrically disconnected state.

However, it is known that in such a previously proposed inspection method, there are the following two problems.

(a) At the time of inspection, the probe P is in contact with all the inspection points D of the built-in component substrate 1, and the wiring in the inspection jig is connected to the circuit in the built-in component substrate 1 via the probe P and the inspection point D. . However, in the aforementioned previously proposed inspection method, the influence on the circuit in the built-in component substrate 1 which is generated when the probe P is brought into contact with the inspection point D of the built-in component substrate 1 is not considered (for example, the inspection jig) When the electrical characteristics of the electronic components in the component substrate 1 are detected, the influence of the parasitic capacitance between the wires in the inspection jig cannot be eliminated. problem.

(b) The influence of the electrostatic capacitance generated between the wirings in the component substrate 1 is not taken into consideration, and when the electrical characteristics of the electronic components provided in the component substrate 1 are detected, there is a possibility that the internal components cannot be eliminated. A problem of the influence of electrostatic capacitance or the like between the wirings in the component substrate 1.

In addition, as a conventional technical document related to the inspection method of the built-in component substrate, for example, Patent Document 1 is known.

[Practical Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2007-309814

Therefore, the problem to be solved by the present invention is to provide an inspection method for a built-in component substrate, which can effectively eliminate parasitic capacitance between wirings in an inspection jig connected to a checkpoint of a built-in component substrate via a probe. The influence of the capacitance and the capacitance between the wirings in the component substrate are inspected, and the inspection target portion including the electronic component in the component substrate or the circuit including the electronic component is accurately inspected.

In order to solve the above problems, a first aspect of the present invention is an inspection method of a built-in component substrate, and a plurality of inspection target portions including an electronic component provided in a component substrate or a circuit including the electronic component. The electrical characteristics of the inspection target portion are detected via a probe that is in contact with a plurality of inspection points provided on the surface of the built-in component substrate, and the built-in component substrate is provided with an electronic component having an impedance, and the inspection of the internal component substrate The method includes the steps of: selecting one of the plurality of inspection target portions in the internal component substrate to sequentially select one of the inspection target portions as the inspection target portion; and selecting the inspection target from the plurality of inspection points A checkpoint belonging to the same network is set as an associated checkpoint, and a checkpoint other than the checkpoint is set as a non-associated checkpoint; and the related checkpoint is inserted without the electronic component The associated checkpoint connected to either side of the wiring portion of the object portion is set as the first selected checkpoint, and will be connected to the other side without passing through the electronic component. The associated checkpoint is set as the second selected checkpoint, and the associated checkpoint connected to the first selected checkpoint via the electronic component other than the focused inspection target is set as the first checkpoint a potential adjustment checkpoint, wherein the associated checkpoint connected to the second selected checkpoint via the electronic component other than the inspection target portion is set as a second potential adjustment checkpoint, and is associated with the checkpoint The first selection check point and the probe contacted by the first potential adjustment check point are electrically connected to a first output terminal of the pair of first and second output terminals of the power supply unit that outputs the inspection power, so that The second selection checkpoint and the probe contacted by the second potential adjustment checkpoint are electrically connected to the second output terminal of the power supply unit, and electrically connect the probe in contact with the non-associated checkpoint to a predetermined reference potential a step of connecting, by the probe in contact with the first selection check point and the second selected check point, the power supply unit supplies the inspection power to the inspection target unit, and is provided by the predetermined Special The step of detecting the electrical characteristics of the target portion to be detected by the sex detecting unit and the step of determining whether the target portion to be inspected is good or not based on the detection result of the electrical characteristic detecting unit.

Further, in the second aspect of the present invention, in the inspection method of the component substrate according to the first aspect of the invention, the inspection target portion is selected from the plurality of inspection target portions in the internal component substrate. In this step, when the inspection of the target inspection target unit selected at the time is completed and the next inspection target unit is to be selected, the inspection target unit belonging to the same network as the inspection target unit whose inspection is completed is preferentially selected as the attention. Check the object section.

According to the inspection method of the built-in component substrate according to the first aspect of the present invention, when the inspection target portion selected in order from the plurality of inspection target portions in the internal component substrate is inspected, a plurality of inspections are performed. A checkpoint that belongs to the same network as the target area to be inspected is set as an associated checkpoint, and other checkpoints are set as non-associated checkpoints. The related checkpoint that is connected to either side of the wiring portion into which the inspection target portion is inserted without passing through the electronic component is set as the first selected inspection point, and will not pass through the electronic The associated checkpoint connected to the other side of the part is set as the second selected checkpoint, and the association of the remaining checkpoints with the electronic component other than the focused inspection target section is connected to the first selected checkpoint The checkpoint is set as the first potential adjustment checkpoint, and the related checkpoint connected to the second selected checkpoint via the electronic component other than the inspection target section is set as the second potential adjustment checkpoint. Further, a probe that is in contact with the first selection checkpoint and the first potential adjustment checkpoint in the associated checkpoint and a first output terminal of the pair of first and second output terminals that output the power supply section of the check power Electrically connecting the probe in contact with the second selected checkpoint and the second potential adjustment checkpoint to the second output terminal of the power supply section, and electrically connecting the probe in contact with the non-associated checkpoint to a predetermined reference potential . The power supply unit supplies the inspection power to the inspection target unit via the probe that is in contact with the first selection inspection point and the second selection inspection point, and the electrical characteristics of the attention detection target unit are detected by the predetermined electrical characteristic detection unit, and are detected according to the detection. As a result, it is judged whether or not the inspection target portion is good.

Therefore, when the inspection target portion is inspected in each inspection step, the power supply unit is The first or second output terminal applies a potential or applies to all of the probes other than the wiring portion for supplying the inspection power to the inspection target portion and the wiring portion of the built-in component substrate and the wiring portion of the built-in component substrate. The established reference potential. Therefore, it is possible to effectively eliminate the influence of the parasitic capacitance or the like between the wirings in the inspection jig connected to the inspection point of the built-in component substrate via the probe, and the influence of the electrostatic capacitance between the wirings in the internal component substrate. It is also possible to perform an accurate inspection of the inspection target portion in each inspection step.

In addition, when the inspection target portion is inspected in each inspection step, the first or second output terminal of the power supply unit is applied via the probe to another inspection target portion or electronic component belonging to the same network as the inspection target portion. The potential is such that the potentials on both sides of the wiring portion into which the inspection target portion or the electronic component is inserted become equal. Further, for a network different from the inspection target portion, a predetermined reference potential is applied to all the inspection points belonging to the network. Therefore, when the inspection target portion is inspected in each of the inspection steps, the electronic component and the wiring portion other than the wiring portion for supplying the inspection power to the component to be inspected are included in the component to be inspected in the component substrate. No current flows. Therefore, it is possible to prevent the influence of the current flowing through the electronic component or the like other than the inspection target portion from affecting the inspection of the inspection target portion in the form of crosstalk or the like, and it is possible to perform a more accurate inspection of the inspection target portion.

In addition, there is a case where the preferred output level of the inspection power supplied to the attention inspection unit in each inspection step differs depending on the type of the inspection target portion, and the electronic component provided in the substrate 1 may be present. The allowable applied potential difference or supply current also varies depending on each electronic component. In this regard, in the inspection method according to the present embodiment, when the inspection target portion is inspected, since no current flows through the electronic component other than the inspection target portion, it is possible to prevent the inspection process from being performed in each inspection step. The other electronic components other than the selected inspection target portion are deteriorated by the supply of the inspection power, and the output level of the inspection power corresponding to the inspection target portion can be set.

Further, according to the inspection method of the built-in component substrate according to the second aspect of the present invention, in the step of selecting the inspection target portion from among the plurality of inspection target portions in the internal component substrate, the focus selected at the time is selected. The inspection of the inspection target section ends and the next inspection inspection target section is selected. In the case of the inspection target unit that belongs to the same network as the inspection target unit that has been checked, the inspection target unit is selected as the inspection target unit. Therefore, the switching operation between the probe, the power supply unit, the electrical characteristic inspection unit, and the predetermined reference potential can be made efficient with the switching of the target unit to be inspected in each inspection step, and the efficiency of the inspection can be improved. High speed.

1‧‧‧ Built-in parts substrate

1a~1c‧‧‧Substrate

2‧‧‧Substrate inspection device

3‧‧‧Connection Switching Department

4‧‧‧Power Department

4a‧‧‧First output terminal

4b‧‧‧second output terminal

5‧‧‧potential difference detection department

6‧‧‧ Current Detection Department

7‧‧‧Control Department

C1~C6‧‧‧ capacitor

D1~D12‧‧‧Checkpoint

N1~N3‧‧‧Network

P1~P12‧‧‧ probe

R1, R2‧‧‧ resistors

SW1~SW3‧‧‧Switching elements

SWG1~SWG10‧‧‧ switch group

1 is a schematic structural view of an internal component substrate to which an internal component substrate inspection method according to an embodiment of the present invention is applied.

2 is a wiring diagram schematically showing an electrical connection relationship between an electronic component, a wiring pattern, and a checkpoint provided on the built-in component substrate of FIG. 1.

3 is a view showing an electrical configuration of a substrate inspection device used in the built-in component substrate inspection method according to the embodiment of the present invention.

4 is a view showing a state in which the probe is connected to the power supply unit and the ground potential when the capacitor C1 in the component substrate is inspected.

FIG. 5 is a view showing a state in which the probe is connected to the power supply unit and the ground potential when the capacitor C2 in the component substrate is inspected.

FIG. 6 is a view showing a state in which the probe is connected to the power supply unit and the ground potential when the resistor R1 in the component substrate is inspected.

FIG. 7 is a view showing a state in which the probe is connected to the power supply unit and the ground potential when the capacitor C3 in the component substrate is inspected.

8 is a view showing a state in which the probe is connected to the power supply unit and the ground potential when the resistor R2 in the component substrate is inspected.

FIG. 9 is a view for explaining an inspection method in a case where the circuit configuration in the built-in component substrate of FIG. 1 is partially changed.

FIG. 10 is a view for explaining an inspection method in the case where the capacitors C1 in the built-in component substrate of FIG. 1 are replaced by two capacitors C5 and C6 connected in series.

A method of inspecting an internal component substrate (hereinafter simply referred to as "substrate") according to an embodiment of the present invention (hereinafter simply referred to as "inspection method") will be described with reference to FIG. 1 to FIG. In addition, the description of the portions of the structure of the substrate 1 shown in FIGS. 1 and 2 that have been described in the prior "prior art" is omitted.

In the inspection method according to the present embodiment, the electronic component or the electronic component including the electronic component provided in the substrate 1 is set as the inspection target portion, and the inspection target portion is inspected. However, in the case of the circuit configuration in the substrate 1 shown in FIG. 1, each of the electronic components (capacitors C1 to C3 and resistors R1, R2) built in the substrate 1 can be inspected one by one and independently. Therefore, each electronic component is set as a single inspection target unit. In addition, an example in which the entire circuit including a plurality of electronic components is collectively examined will be described later with reference to FIG. 10 .

First, the configuration of the substrate inspection device 2 used in the inspection method according to the present embodiment will be described with reference to Fig. 3 . As shown in FIG. 3, the substrate inspection apparatus 2 includes an inspection jig (not shown) having probes P1 to P10, a connection switching unit 3, a power supply unit 4, a potential difference detecting unit 5, a current detecting unit 6, and a control unit 7. . Further, the potential difference detecting unit 5 and the current detecting unit 6 correspond to the electric characteristic detecting unit according to the present invention. Further, in the present embodiment, the potential difference detecting unit 5 and the current detecting unit 6 are used to detect the electrical characteristics of the electronic component housed in the substrate 1, but the output voltage value or the output current value of the power source unit 4 is When it is known that one of potential difference detection or current detection is not necessary, one of the potential difference detecting unit 5 and the current detecting unit 6 may be omitted.

The inspection jig includes: an upper inspection jig having probes P1 to P3 that can be in contact with the inspection points D1 to D3 of the upper surface of the substrate 1 of FIG. 1; and a lower inspection jig having a lower surface comparable to the substrate 1 Checkpoints D4~D10 contact probes P4~P10. At the time of inspection, the probes P1 to P3 of the upper inspection jig and the probes P4 to P10 of the lower inspection jig may be in contact with the corresponding inspection points D1 to D10 of the substrate 1.

The connection switching unit 3 is configured to include a switch group provided for each probe P In the SWG1 to SWG10, the first and second output terminals 4a and 4b of the probe P and the power supply unit 4, the ground potential as a predetermined reference potential, the potential difference detecting unit 5, and the current detecting unit are switched by the control of the control unit 7. 6 electrical connection relationship. Each of the switch groups SWG1 to SWG10 includes three switching elements (for example, semiconductor switching elements) SW1 to SW3 that are turned on and off by the control unit 7. When the switching element SW1 is turned on, the corresponding probe P is connected to the first output terminal 4a of the power supply unit 4 via the switching element SW1. When the switching element SW2 is turned on, the corresponding probe P is connected to the second output terminal 4b of the power supply unit 4 via the switching element SW2. When the switching element SW3 is turned on, the corresponding probe P is connected to the ground potential via the switching element SW3.

The power supply unit 4 outputs inspection power for inspection by the control of the control unit 7, and has paired first and second output terminals 4a and 4b that output inspection power. As the inspection power output from the power supply unit 4, an alternating current (for example, an alternating current constant current), an alternating current voltage (for example, an alternating current constant voltage), a direct current fluctuation current whose output current value changes periodically, or an output voltage value may be periodically changed. DC fluctuation voltage. In the present embodiment, for example, an alternating current constant current is output as the inspection power. Further, the output potential of the second output terminal 4b may be fixed to a predetermined potential, for example, a ground potential. In this case, the output potential of the first output terminal 4a changes with respect to the predetermined potential of the second output terminal 4b. In addition, the symbols of "+" and "-" in FIG. 3 and FIGS. 4 to 10 to be described later are for facilitating understanding of the connection relationship with the first and second output terminals 4a, 4b, and the first sum. The polarity of the second output terminals 4a, 4b is independent.

As a modification of the power supply unit 4, the power supply unit 4 may switch the output level of the inspection power or the like by the control of the control unit 7 in accordance with the electronic component to be inspected.

The potential difference detecting unit 5 detects a potential difference applied to the electronic component to be inspected by the power supply unit 4 via the probe P, and supplies the detection result to the control unit 7. In the present embodiment, the probe P used for detecting the potential difference of the potential difference detecting unit 5 and the probe P for supplying the inspection power of the power source unit 4 to the inspection target unit in the substrate 1 are shared. In the case of the so-called four-terminal measurement method, the probe P for detecting the potential difference may be additionally connected to each of the inspection points D, and the probe P for detecting the potential difference may be additionally added to each of the inspection points. D contact. in In this case, a switching element is added to the connection switching unit 3, and the switching element is inserted between the probe P for detecting potential difference and the potential difference detecting unit 5, and whether or not the probe P for any potential difference detection is caused to have a potential difference The state in which the detecting unit 5 is connected is switched. In this case, the potential difference detecting unit 5 detects a potential difference between any one of the inspection points D connected via the probe P and a predetermined reference potential (for example, a ground potential).

The current detecting unit 6 is inserted into the wiring of the first output terminal 4a or the second output terminal 4b (the second output terminal 4b in the present embodiment) of the power supply unit 4 via the connection switching unit 3 toward the probe P. The current supplied to the electronic component to be inspected by the power supply unit 4 is detected via the probe P, and the detection result is supplied to the control unit 7.

The control unit 7 performs control of the substrate inspection device 2 and inspection processing of each electronic component of the substrate 1. The details of the inspection process of the control unit 7 will be described in detail below with reference to FIGS. 4 to 8.

First, in the order of inspection of a plurality of electronic components (inspection target portions) provided in the substrate 1, one of the plurality of electronic components is sequentially selected as the inspection target portion; and in each inspection step, Check in order one by one. When the inspection of the electronic component selected as the inspection target portion is completed, the next electronic component is selected as the inspection target portion. At this time, the inspection target unit belonging to the same network as the inspection target unit that has been checked is preferentially selected as the next inspection target unit. In principle, all electronic parts are inspected in order. In the present embodiment, in the configuration of the substrate 1 shown in FIGS. 1 and 2, the inspection is performed in the order of the capacitor C1, the capacitor C2, the resistor R1, the capacitor C3, and the resistor R2.

When the inspection target portion is selected in each inspection step, the inspection point D belonging to the same network as the electronic component set as the inspection target portion among the plurality of inspection points D provided on the substrate 1 is associated with Checkpoints and checkpoint D other than this is set as a non-associated checkpoint.

For example, when the capacitor C1 is selected as the inspection target portion, the checkpoints D1, D2, D4 to D7 belonging to the same network N1 as the capacitor C1 are set as the associated checkpoints, and belong to the network N1. Checkpoints D3 and D8 to D10 of different networks N2 and N3 are set as non-associated checkpoints.

Next, the related checkpoint in the associated checkpoint that is connected to either side of the wiring portion into which the inspection target portion is inserted without using another electronic component is set as the first selected checkpoint, and will not be The associated checkpoint connected to the other side via other electronic components is set as the second checkpoint. At the same time, the related checkpoint connected to the first selected checkpoint via the electronic component other than the inspection target component among the remaining related checkpoints is set as the first potential adjustment checkpoint, and the target checkpoint is passed through the attention check component. The associated checkpoint connected to the second selected checkpoint other than the electronic component is set as the second potential adjustment checkpoint.

For example, when the capacitor C1 is selected as the inspection target portion and the inspection points D1, D2, D4 to D7 are the related inspection points, among the related inspection points (check points D1, D2, D4 to D7), An associated checkpoint (for example, checkpoints D1, D2) connected to either side of a wiring portion (refer to FIG. 4) in which the capacitor C1 is inserted without using other electronic components is set as the first selected checkpoint, An associated checkpoint (e.g., checkpoint D4) that is connected to the other side without passing through other electronic components is set as the second selected checkpoint. In addition, among the remaining related checkpoints (checkpoints D5 to D7), the first selection check is performed via electronic components other than the inspection target portion (capacitor C1) (here, capacitors C2, C3 and resistor R1). The related checkpoints (checkpoints D5 to D7) to which the points (checkpoints D1, D2) are connected are set as the first potential adjustment checkpoint. In the circuit configuration of FIGS. 1 and 2, in the case where the capacitor C1 is selected as the inspection target portion, there is no checkpoint D corresponding to the second potential adjustment checkpoint. In this regard, the same applies to the case where the other capacitors C2 and C3 and the resistors R1 and R2 are selected as the inspection target portion. A configuration example of a circuit having a checkpoint D corresponding to the second potential adjustment checkpoint will be described in detail below with reference to FIG.

Next, returning to the configuration of FIG. 2, the state of each of the switching elements SW1 to SW3 of each of the switch groups SWG1 to SWG10 of the connection switching unit 3 is switched, so that the first selection check point and the first potential adjustment in the associated checkpoint are switched. The probe P that is in contact with the inspection point is electrically connected to the first output terminal 4a of the power supply unit 4 via the connection switching unit 3. Further, the probe P that is in contact with the second selection check point and the second potential adjustment check point is electrically connected to the second output terminal 4b of the power supply unit 4 via the connection switching unit 3. Pick up. Further, the probe P that is in contact with the non-related inspection point is electrically connected to the ground potential via the connection switching unit 3.

For example, when the capacitor C1 is set as the inspection target portion, as shown by the symbols "+", "-", and "GND" in FIG. 4, the checkpoint D1 is set as the first selection checkpoint. The probes P1, P2, and P5 to P7 that are in contact with the inspection points D5 to D7 set as the first potential adjustment check point are electrically connected to the first output terminal 4a of the power supply unit 4 via the connection switching unit 3. Further, the probe P4 that is in contact with the inspection point D4 set as the second selection check point is electrically connected to the second output terminal 4b of the power supply unit 4 via the connection switching unit 3. Further, the probes P3 and P8 to P10 that are in contact with the inspection points D3 and D8 to D10 that are set as non-related inspection points are electrically connected to the ground potential via the connection switching unit 3.

Then, the probe power supplied from the power supply unit 4 to the inspection target unit is supplied from the power supply unit 4 via the probe P that is in contact with the first selection inspection point and the second selection inspection point, and the potential difference detection unit 5 applies the potential difference applied to the inspection target unit. The value is detected, and the current value applied to the inspection target unit is detected by the current detecting unit 6. For example, when the capacitor C1 is selected as the inspection target portion, the supply of the inspection power to the capacitor C1, the detection of the potential difference value by the potential difference detection unit 5, and the detection based on the probes P1, P2 and the probe P4 are performed. The detection of the supply current value by the current detecting unit 6.

Then, based on the detection results of the potential difference detecting unit 5 and the current detecting unit 6, the control unit 7 determines whether or not the subject to be inspected is good. In this case, for example, the impedance of the inspection target portion is derived based on the potential difference value applied to the target unit to be inspected and the current value applied to the target unit to be inspected by the current detecting unit 6 detected by the potential difference detecting unit 5, and By comparing the derived impedance with the evaluation reference value, it is determined whether or not the subject to be inspected is good. When the inspection target portion is a capacitor or a circuit including a capacitor, the electrostatic capacitance of the inspection target portion may be derived based on the detected potential difference value, current value, or the like, and whether or not the electrostatic capacitance is determined based on the electrostatic capacitance.

When the inspection of the inspection target portion is completed, the next inspection target portion is selected as the attention. The inspection target unit is inspected and the inspection of the next inspection inspection target unit is performed.

Hereinafter, with reference to FIG. 5 to FIG. 8 , in the case where the electronic components (capacitors C2 and C3 and the resistors R1 and R2) other than the capacitor C1 are selected as the inspection target portion, the electric power of the inspection point D and the probe P is checked. The connection is explained.

When the capacitor C2 is selected as the inspection target portion, as shown in FIG. 5, the inspection points D1, D2, D4 to D7 belonging to the network N1 are set as the related inspection points, and the other inspection points D3 and D8 are set. ~D10 is set to a non-associated checkpoint. Among the related checkpoints (checkpoints D1, D2, D4 to D7), for example, checkpoints D1, D2 are set as the first selected checkpoint, checkpoint D5 is set as the second selected checkpoint, checkpoints D4, D6, D7 is set to the first potential adjustment checkpoint. Corresponding to this, the probes P1, P2, P4, P6, and P7 are electrically connected to the first output terminal 4a of the power supply unit 4, and the probe P5 is electrically connected to the second output terminal 4b of the power supply unit 4, and the probes P3 and P8 are connected. P10 is electrically connected to the ground potential. The supply of the inspection power to the capacitor C2, the detection of the potential difference value by the potential difference detecting unit 5, and the detection of the supply current value by the current detecting unit 6 are performed via the probes P1, P2 and the probe P5.

When the resistor R1 is set as the target unit to be inspected, as shown in FIG. 6, the checkpoints D1, D2, D4 to D7 belonging to the network N1 are set as related checkpoints, and other checkpoints D3, D8~D10 are set as non-associated checkpoints. Among the related checkpoints (checkpoints D1, D2, D4 to D7), for example, checkpoints D1, D2 are set as the first selected checkpoint, checkpoint D6 is set as the second selected checkpoint, checkpoints D4, D5, D7 is set to the first potential adjustment checkpoint. Corresponding to this, the probes P1, P2, P4, P5, and P7 are electrically connected to the first output terminal 4a of the power supply unit 4, and the probe P6 is electrically connected to the second output terminal 4b of the power supply unit 4, and the probes P3 and P8 are connected. P10 is electrically connected to the ground potential. The supply of the inspection power to the resistor R1, the detection of the potential difference value by the potential difference detecting unit 5, and the detection of the supply current value by the current detecting unit 6 are performed via the probes P1, P2 and the probe P6.

When the capacitor C3 is set as the inspection target portion, as shown in FIG. 7, the inspection points D1, D2, D4 to D7 belonging to the network N1 are set as related inspection points, and other inspection points D3, D8~D10 are set as non-associated checkpoints. In the related checkpoints (checkpoints D1, D2, D4 to D7), for example, the checkpoints D1, D2 are set as the first selected checkpoint, the checkpoint D7 is set as the second selected checkpoint, and the checkpoints D4 to D6 are Set to the first potential adjustment checkpoint. Corresponding to this, the probes P1, P2, P4 to P6 are electrically connected to the first output terminal 4a of the power supply unit 4, and the probe P7 is electrically connected to the second output terminal 4b of the power supply unit 4, and the probes P3, P8 to P10 are The ground potential is electrically connected. The supply of the inspection power to the capacitor C3, the detection of the potential difference value by the potential difference detecting unit 5, and the detection of the supply current value by the current detecting unit 6 are performed via the probes P1, P2 and the probe P7.

When the resistor R2, which is the last inspection target, is set as the inspection target unit, as shown in FIG. 8, the inspection points D8 and D9 belonging to the network N2 are set as the related inspection points, and the other inspection points D1. ~D7, D10 are set to non-associated checkpoints. Among the related checkpoints (checkpoints D8, D9), for example, the checkpoint D8 is set as the first selected checkpoint, and the checkpoint D9 is set as the second selected checkpoint. Corresponding to this, the probe P8 is electrically connected to the first output terminal 4a of the power supply unit 4, the probe P9 is electrically connected to the second output terminal 4b of the power supply unit 4, and the probes P1 to P7 and P10 are electrically connected to the ground potential. The supply of the inspection power to the resistor R2, the detection of the potential difference value by the potential difference detecting unit 5, and the detection of the supply current value by the current detecting unit 6 are performed via the probe P8 and the probe P9.

As described above, when the inspection target portion is inspected in each inspection step, all the probes P and the substrate 1 other than the wiring portion in the inspection probe and the wiring portion in the substrate 1 are supplied to the inspection target portion. The wiring portion in the inner portion is supplied with a potential from the first or second output terminals 4a and 4b of the power supply unit 4 or a predetermined reference potential (in the present embodiment, a ground potential). Therefore, the influence of the parasitic capacitance or the like between the wirings in the inspection jig connected to the inspection point D of the substrate 1 via the probe P and the influence of the electrostatic capacitance between the wirings in the substrate 1 can be effectively eliminated. In each inspection step, the inspection target portion is accurately inspected.

In addition, when the inspection target portion is inspected in each inspection step, the first inspection unit or the electronic component belonging to the same network N1 to N3 as the inspection target portion is applied, and the first or the power supply unit 4 is applied via the probe P. The potentials of the second output terminals 4a, 4b are such that the potentials on both sides of the wiring portion into which the inspection target portion or the electronic component is inserted become equal. In addition, targeting Note that the networks N1 to N3 having different inspection target portions apply a predetermined reference potential (ground potential in the present embodiment) to all the inspection points D belonging to the networks N1 to N3. Therefore, when the inspection target portion is inspected in each inspection step, the electronic component and the wiring portion other than the wiring portion for supplying the inspection power to the inspection target portion are not flown in the inspection target portion in the substrate 1. Overcurrent. Therefore, it is possible to prevent the influence of the current flowing through the electronic component or the like other than the inspection target portion from affecting the inspection of the inspection target portion in the form of crosstalk or the like, and it is possible to perform a more accurate inspection of the inspection target portion.

In addition, there is a case where the preferred output level of the inspection power supplied to the attention inspection unit in each inspection step differs depending on the type of the inspection target portion, and the electronic components provided in the substrate 1 are also present. It is allowed to apply a potential difference or supply current depending on each electronic component. In this regard, in the inspection method according to the present embodiment, when the inspection target portion is inspected, no current flows through the electronic components other than the inspection target portion, so that it can be prevented from being set in each inspection step. The other electronic components other than the inspection target portion are deteriorated by the supply of the inspection power, and the output level of the inspection power corresponding to the inspection target portion can be set.

In addition, as described above, when the inspection of the electronic component selected as the inspection target portion is completed in each inspection step, and the next inspection target portion is selected, the inspection is performed on the same network as the inspection target portion after the inspection is completed. The object portion is preferentially selected as the next attention check target portion. Therefore, it is possible to improve the switching operation between the probe P and the power supply unit 4 and the like by the connection switching unit 3 in accordance with the switching of the target unit to be inspected in each of the inspection steps, and it is possible to improve the efficiency of the inspection. And high speed.

Hereinafter, the inspection method of the present embodiment will be additionally described with reference to the circuit configurations of FIGS. 9 and 10 in which the circuit configuration of the substrate 1 shown in FIGS. 1 and 2 is partially changed.

In the circuit configuration shown in Figs. 1 and 2 described above, when any one of the inspection target portions is inspected, only one second selection checkpoint is set, and there is no second potential adjustment checkpoint. As a supplement to this, referring to FIG. 9, for setting a plurality of second selection checkpoints and having a second power The bit adjustment checkpoint is described as an example.

In the circuit configuration shown in FIG. 9, a case where the capacitor C1 is selected as the inspection target portion will be described. In this case, when the checkpoints D1, D2 in the associated checkpoints (checkpoints D1, D2, D4~D7, D11, D12) are set as the first checkpoint, the checkpoints D4, D12 are set to Second, choose a checkpoint. Among the remaining related checkpoints (checkpoints D5 to D7, D11), checkpoints D5 to D7 are set as the first potential adjustment checkpoint, and checkpoint D11 is set as the second potential adjustment checkpoint.

Further, in the circuit configuration shown in FIG. 9, in the case where the capacitor C4 is selected as the inspection target portion, the checkpoint D11 in the associated checkpoint (checkpoints D1, D2, D4 to D7, D11, D12) When it is set as the first selection checkpoint, the checkpoints D4 and D12 are set as the second selection checkpoint. The remaining associated checkpoints (checkpoints D1, D2, D5~D7) are set to the second potential adjustment checkpoint. In this case, there is no first potential adjustment checkpoint.

Further, as another circuit configuration, in the case where the capacitor C1 of FIG. 1 is replaced by two capacitors C5 and C6 connected in series as in the example shown in FIG. 10, the capacitors C5 and C6 cannot be individually inspected. In this case, a circuit in which the capacitors C5 and C6 connected in series are collectively integrated is used as an inspection target unit.

1‧‧‧ Built-in parts substrate

1a~1c‧‧‧Substrate

C1~C3‧‧‧ capacitor

D1~D10‧‧‧Checkpoint

P1~P10‧‧‧ probe

R1, R2‧‧‧ resistors

Claims (2)

An inspection method for a built-in component substrate, wherein a plurality of inspection target portions including an electronic component provided in an internal component substrate or a circuit including the electronic component are disposed on a surface of the built-in component substrate The probe that is in contact with the inspection point detects the electrical characteristics of the inspection target portion, and the built-in component substrate is provided with an electronic component having an impedance, and the inspection method of the internal component substrate is characterized in that the method includes the following steps: Among the plurality of inspection target portions in the component substrate, one of the plurality of inspection target portions is selected as the inspection target portion in order, and the inspection points belonging to the same network as the inspection target portion of the plurality of inspection points are set as a step of setting a checkpoint other than the checkpoint to a non-associated checkpoint; and in the side of the interconnected checkpoint that does not pass through the electronic component and the wiring portion into which the target component of interest is inserted The associated checkpoint connected to either side of the side is set as the first selected checkpoint, and the associated checkpoint connected to the other side without the electronic component is set to the second Selecting a checkpoint, and setting an associated checkpoint connected to the first selected checkpoint via the electronic component other than the target of the inspection target as a first potential adjustment checkpoint An associated checkpoint connected to the electronic component other than the inspection target portion and connected to the second selected checkpoint is set as a second potential adjustment checkpoint, and the first selected checkpoint in the associated checkpoint is The probe that is in contact with the first potential adjustment checkpoint is electrically connected to the first output terminal of the pair of first and second output terminals of the power supply unit that outputs the inspection power, so that the second selection checkpoint and the first a step of electrically connecting the probe contacted by the two potential adjustment check points to the second output terminal of the power supply portion, and electrically connecting the probe in contact with the non-associated checkpoint to a predetermined reference potential; via the first selection The inspection point and the probe that is in contact with the second selection inspection point, the power supply unit supplies the inspection power to the inspection target unit, and the attention detection is detected by a predetermined electrical characteristic detection unit. Step electrical characteristics like portion; and a step based on the detection result of the electrical characteristic detector determines that the attention of the inspection target portion is good. In the method of inspecting the component substrate in the first aspect of the patent application, in the step of selecting the component to be inspected from among the plurality of inspection target portions in the component substrate, The inspection of the selected inspection target section ends and is selected When the next inspection target unit is selected, the inspection target unit that belongs to the same network as the inspection target unit that has been checked is preferentially selected as the inspection target unit.