TW201336592A - Adhesive providing apparatus and adhesive providing method - Google Patents

Adhesive providing apparatus and adhesive providing method Download PDF

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TW201336592A
TW201336592A TW101108284A TW101108284A TW201336592A TW 201336592 A TW201336592 A TW 201336592A TW 101108284 A TW101108284 A TW 101108284A TW 101108284 A TW101108284 A TW 101108284A TW 201336592 A TW201336592 A TW 201336592A
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adhesive
pseudo
supply
workpiece
hardening
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TW101108284A
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TWI490049B (en
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Haruka Narita
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Shibaura Mechatronics Corp
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Abstract

The invention provides an adhesive providing apparatus and an adhesive providing method for preventing the adhesive from running and ensuring uniform adhering thickness. The adhesive providing apparatus provides an adhesive R to at least one workpiece of a pair of workpieces S1 and S2, which construct a display apparatus. The adhesive providing apparatus includes a providing portion 10 for providing the adhesive R to a surface of a workpiece in a way of spreading a surface, and a pseudo harden processing portion 11 for pseudo hardening a part or all of the adhesive R as a providing process executed by the providing portion 10.

Description

接著劑供給裝置以及接著劑供給方法 Subsequent agent supply device and adhesive supply method

本發明是有關於例如對如下的技術進行改良所得的接著劑供給裝置以及接著劑供給方法,上述技術為了將構成顯示裝置的一對工件(workpiece)予以貼合,而將接著劑供給到工件。 The present invention relates to, for example, an adhesive supply device and an adhesive supply method obtained by modifying a technique in which a pair of workpieces constituting a display device are bonded together, and an adhesive is supplied to a workpiece.

一般而言,對液晶模組(module)、操作用的觸控面板(touch panel)、以及保護表面的保護面板(覆蓋面板(cover panel))等進行積層,藉此來構成液晶顯示器(display)。上述液晶模組、觸控面板、以及保護面板等(以下,稱為工件)是被組裝入液晶顯示器的框體。 In general, a liquid crystal display (module), a touch panel for operation, and a protective panel (cover panel) for protecting a surface are laminated to form a liquid crystal display (display). . The liquid crystal module, the touch panel, the protective panel, and the like (hereinafter referred to as a workpiece) are frames that are incorporated in the liquid crystal display.

為了將上述工件予以貼合,已有使用接著片(sheet)的方法與使用樹脂接著劑的方法。接著片與接著劑相比較、價格較高,且需要剝離紙的剝離等的步驟。因此,根據近年來的削減成本的要求等,使用接著劑來進行的貼合成為主流。 In order to bond the above-mentioned workpieces, a method of using a sheet and a method of using a resin adhesive have been known. Next, the sheet is higher in price than the adhesive, and a step of peeling off the paper or the like is required. Therefore, according to the demand for cost reduction in recent years, etc., the sticking using the adhesive agent is the mainstream.

又,若空氣層進入到積層的各工件之間,則液晶的顯示面的視認性會因外光反射而下降。為了應付上述情形,當將各工件予以貼合時,藉由接著劑來將各工件之間(間隙(gap))予以填埋,藉此來形成接著層。 Further, when the air layer enters between the stacked workpieces, the visibility of the display surface of the liquid crystal is lowered by the external light reflection. In order to cope with the above, when the workpieces are bonded together, the gaps between the workpieces (gap) are filled by an adhesive to form an adhesive layer.

上述接著層作為各工件之間的間隔件(spacer),具有保護工件的功能。又,由於液晶顯示器的大型化等,工件的面積亦變大,且容易產生變形。因此,為了將變形予以 吸收而保護工件,接著層所需的厚度存在增加的傾向。例如,需要數百微米(μm)的厚度。 The above-mentioned adhesive layer functions as a spacer between the workpieces and protects the workpiece. Moreover, the size of the workpiece is also increased due to the increase in size of the liquid crystal display, and the deformation is likely to occur. Therefore, in order to Absorbing and protecting the workpiece, there is a tendency for the thickness of the layer to increase. For example, a thickness of several hundred micrometers (μm) is required.

若要確保上述厚度,則必需的接著劑的量會增加。如此一來,供給到工件的接著劑會流動,從而容易自工件溢出。因此,考慮使用流動少的高黏度的樹脂(resin)的方法。然而,即便於上述情形,若未嚴密地對接著劑的塗佈位置等製程(process)條件進行調整,則存在如下的情形,即,當進行貼合時,接著劑會自規定的區域溢出。 To ensure the above thickness, the amount of the necessary adhesive will increase. As a result, the adhesive supplied to the workpiece flows, so that it is easy to overflow from the workpiece. Therefore, a method of using a resin having a low viscosity and a high viscosity is considered. However, even in the above case, if the process conditions such as the application position of the adhesive are not closely adjusted, there is a case where the adhesive overflows from the predetermined region when the bonding is performed.

為了應付該情形,存在如下的密封(seal)方式,該密封方式是預先藉由高黏度的樹脂、假硬化樹脂等,在對於塗佈區域進行規定的外周形成密封件(參照專利文獻1)。呈框狀地將樹脂的接著劑塗佈至工件,使該接著劑假硬化,藉此來形成密封件,且將樹脂的接著劑填充至內側,以將工件予以貼合。對於上述密封方式而言,由於在外周存在密封件,因此,可防止由貼合時的接著劑的流動所引起的溢出。 In order to cope with this, there is a seal method in which a seal is formed on a predetermined outer circumference of a coating region by a high-viscosity resin or a pseudo-curing resin (see Patent Document 1). The adhesive of the resin is applied to the workpiece in a frame shape, and the adhesive is pseudo-hardened, whereby a seal is formed, and an adhesive of the resin is filled to the inside to bond the workpiece. In the sealing method described above, since the seal is present on the outer circumference, it is possible to prevent the overflow due to the flow of the adhesive at the time of bonding.

[先前技術文獻] [Previous Technical Literature]

[專利文獻] [Patent Literature]

[專利文獻1]日本專利特開2010-66711號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2010-66711

然而,在上述密封方式所形成的密封件、與填充至內部的接著劑之間,有可能會殘留有邊界。例如,對於液晶顯示器等的顯示裝置而言,若先硬化的密封件、與內部的接著劑的邊界進入到使用者(user)的視野範圍內,則有礙於畫面的視認性。然而,根據畫面的大型化的要求、與 構件本身的小型化的要求,難以於工件的視野範圍外,充分地確保用於密封件的空間。 However, there is a possibility that a boundary remains between the seal formed by the above sealing method and the adhesive filled in the inside. For example, in a display device such as a liquid crystal display, if the boundary between the first cured seal and the internal adhesive enters the field of view of the user, the visibility of the screen is hindered. However, according to the requirements of the enlargement of the screen, The requirement for miniaturization of the member itself makes it difficult to sufficiently secure the space for the seal outside the field of view of the workpiece.

又,例如,若過分地促進密封件的接著劑的硬化,則接著劑會失去緩衝性(cushion)或黏著性。如此一來,當進行貼合時,存在如下的可能性,即,上下的工件不匹配,貼合厚度的均一性受損。 Further, for example, if the adhesion of the adhesive of the sealing member is excessively promoted, the adhesive may lose cushioning or adhesion. As a result, when the bonding is performed, there is a possibility that the upper and lower workpieces do not match, and the uniformity of the thickness of the bonding is impaired.

本發明是為了解決如上所述的先前技術的問題點而提出的發明,本發明的目的在於:提供如下的接著劑供給裝置以及接著劑供給方法,該接著劑供給裝置以及接著劑供給方法可防止接著劑的流動,從而確保均一的貼合厚度。 The present invention has been made to solve the above problems of the prior art, and an object of the present invention is to provide an adhesive supply device and an adhesive supply method which are capable of preventing the adhesive supply device and the adhesive supply method. The flow of the agent then ensures a uniform fit thickness.

為了實現上述目的,本發明是一種接著劑供給裝置,該接著劑供給裝置將接著劑供給到構成顯示裝置的一對工件中的至少一個工件,上述接著劑供給裝置包括:供給部,以呈面狀地分散(spread)的方式,將接著劑供給到工件的一面;以及假硬化處理部,隨著由上述供給部進行的供給,使供給的接著劑的一部分或全部進行假硬化。 In order to achieve the above object, the present invention is an adhesive supply device that supplies an adhesive to at least one of a pair of workpieces constituting a display device, the adhesive supply device including: a supply portion to face In a form of spreading, the adhesive is supplied to one surface of the workpiece, and the dummy hardening portion is subjected to false hardening by a part or all of the supplied adhesive in accordance with the supply by the supply unit.

於如上所述的發明中,以呈面狀地分散的方式,將接著劑供給到工件的一面,並且使該接著劑假硬化,因此,接著劑的流動受到抑制,可防止塗佈形狀的走樣,或可防止上述接著劑朝向工件外溢出。又,由於在供給過程中,使上述接著劑假硬化,因此,可使製程時間(tact time)縮短。而且,藉由假硬化來維持著接著劑的緩衝性以及黏著性。因此,貼合時的接著力無問題,可確保均一的貼合 厚度。又,由於在接著劑中不存在邊界,因此,顯示裝置中的視野範圍的視認性不會受損。而且,無需在裝備用於密封件的單元之後,分別準備且供給用以製成密封件的接著劑與內部填充用的接著劑,因此,可使製程時間縮短,亦可節約成本。 In the invention as described above, the adhesive is supplied to one side of the workpiece in a planar manner, and the adhesive is pseudo-hardened. Therefore, the flow of the adhesive is suppressed, and the coating shape can be prevented from being aliased. Or it may prevent the above-mentioned adhesive from overflowing toward the outside of the workpiece. Further, since the above-mentioned adhesive is pseudo-hardened during the supply process, the process time (tact time) can be shortened. Moreover, the cushioning property and adhesiveness of the adhesive are maintained by the pseudo hardening. Therefore, there is no problem with the adhesion at the time of bonding, and a uniform fit can be ensured. thickness. Moreover, since there is no boundary in the adhesive, the visibility of the field of view in the display device is not impaired. Moreover, it is not necessary to separately prepare and supply the adhesive for forming the seal and the adhesive for internal filling after the unit for the seal is provided, so that the process time can be shortened and the cost can be saved.

其他形態為,上述假硬化處理部是設置為:能夠與上述供給部一併移動。 In another aspect, the pseudo-hardening processing unit is provided to be movable together with the supply unit.

於如上所述的形態中,使假硬化處理部與供給部一併移動,藉此,可隨著接著劑的供給而進行假硬化。 In the above-described embodiment, the pseudo-hardening treatment portion is moved together with the supply portion, whereby the pseudo-hardening can be performed in accordance with the supply of the adhesive.

其他形態為,上述假硬化處理部是設置為:獨立於上述供給部而能夠移動。 In another aspect, the pseudo-hardening processing unit is provided to be movable independently of the supply unit.

於如上所述的形態中,藉由獨立於供給部而能夠移動,可使所期望的範圍假硬化。又,可根據供給的接著劑的分散情況,按照適當的時序(timing)進行假硬化。 In the above-described form, it is possible to move by being independent of the supply portion, and the desired range can be pseudo-hardened. Further, the pseudo hardening can be performed according to an appropriate timing according to the dispersion of the supplied adhesive.

其他形態是,上述接著劑為利用電磁波的照射而硬化的接著劑,上述假硬化處理部包括:照射部,上述照射部將電磁波照射至接著劑。 In another aspect, the adhesive agent is an adhesive that is cured by irradiation with electromagnetic waves, and the pseudo-curing treatment unit includes an irradiation unit that irradiates electromagnetic waves to the adhesive.

於如上所述的形態中,可藉由照射部的照射來容易地進行假硬化。 In the above-described form, the pseudo hardening can be easily performed by the irradiation of the irradiation portion.

其他形態是,上述接著劑為紫外線硬化型的樹脂,上述照射部包括:紫外線照射裝置,上述紫外線照射裝置於大氣中、將紫外線照射至接著劑。 In another aspect, the adhesive agent is an ultraviolet curable resin, and the irradiation unit includes an ultraviolet irradiation device that irradiates ultraviolet rays to the adhesive in the atmosphere.

於如上所述的形態中,於大氣中照射紫外線,藉此,可利用氧抑制等而容易地實現假硬化。 In the above-described form, ultraviolet rays are irradiated to the atmosphere, whereby the pseudo-hardening can be easily achieved by oxygen suppression or the like.

其他形態為,可變地設置電磁波的照射範圍。 In other forms, the irradiation range of the electromagnetic wave is variably set.

於如上所述的形態中,可藉由改變照射範圍而僅使所期望的區域進行假硬化。 In the above-described form, only the desired region can be pseudo-hardened by changing the irradiation range.

再者,亦可掌握上述各形態作為接著劑供給方法的發明。 Furthermore, it is also possible to grasp the above-described respective aspects as an invention of the adhesive supply method.

以上,如說明所述,根據本發明,可提供如下的接著劑供給裝置以及接著劑供給方法,該接著劑供給裝置以及接著劑供給方法可防止接著劑的流動,從而確保均一的貼合厚度。 As described above, according to the present invention, it is possible to provide an adhesive supply device and an adhesive supply method which can prevent the flow of the adhesive and ensure a uniform bonding thickness.

參照圖式,具體地對本發明的實施的形態(以下稱為實施形態)進行說明。 The embodiment (hereinafter referred to as an embodiment) of the present invention will be specifically described with reference to the drawings.

[A.構成] [A. Composition]

首先,對本實施形態的接著劑供給裝置(以下,稱為本裝置)的構成進行說明。如圖1(A)~圖1(B)、以及圖2(A)~圖2(B)所示,本裝置包括:接著劑供給部1、與貼合部2等。作為貼合對象的工件S1、S2例如成為:液晶顯示器的觸控面板與保護面板那樣地、構成顯示裝置的工件。又,工件S1是設置為:藉由搬送部3而於上述接著劑供給部1及貼合部2之間可以移動。 First, the configuration of the adhesive supply device (hereinafter referred to as the present device) of the present embodiment will be described. As shown in FIGS. 1(A) to 1(B) and FIGS. 2(A) to 2(B), the device includes an adhesive supply unit 1, a bonding unit 2, and the like. The workpieces S1 and S2 to be bonded together are, for example, a workpiece constituting a display device such as a touch panel of a liquid crystal display and a protective panel. Further, the workpiece S1 is provided to be movable between the adhesive supply unit 1 and the bonding unit 2 by the conveying unit 3.

作為本實施形態中所使用的接著劑,例如,可考慮使用紫外線(Ultraviolet,UV)硬化樹脂。接著劑供給部1包括:供給部10、與假硬化處理部11等。例如,供給部 10包括:分配器(dispenser),該分配器使收容於儲槽(tank)T的接著劑R經由配管而滴下至工件S1。例如,分配器藉由掃描裝置(未圖示)而構成為可以移動。 As the adhesive used in the present embodiment, for example, an ultraviolet (UV) curing resin can be considered. The adhesive supply unit 1 includes a supply unit 10, a pseudo-hardening unit 11, and the like. For example, the supply department 10 includes a dispenser that drops the adhesive R accommodated in the tank T to the workpiece S1 via a pipe. For example, the dispenser is configured to be movable by a scanning device (not shown).

例如,假硬化處理部11包括照射部,該照射部將來自未圖示的UV光源的UV光,經由光纖(optical fiber)而照射至接著劑R。再者,亦可將照射部本身作為光源。 For example, the pseudo-hardening treatment unit 11 includes an irradiation unit that irradiates UV light from a UV light source (not shown) to the adhesive R via an optical fiber. Furthermore, the illuminating unit itself can also be used as a light source.

例如,上述照射部包括光學構件,該光學構件呈點狀或細線狀地進行照射。例如,可適用聚光透鏡(lens)、狹縫(slit)等來作為光學構件。除了可藉由對光源強度進行調整來調整照射強度之外,亦可藉由上述光學構件來調整照射強度。亦可藉由上述光學構件來對照射口徑、照射寬度等進行調整。 For example, the irradiation unit includes an optical member that is irradiated in a dot shape or a thin line shape. For example, a condensing lens, a slit, or the like can be applied as the optical member. In addition to adjusting the intensity of the illumination by adjusting the intensity of the light source, the illumination intensity can also be adjusted by the optical member described above. The irradiation aperture, the irradiation width, and the like can also be adjusted by the optical member.

照射部於大氣中進行照射,以利用氧抑制(oxygen inhibition)等來使接著劑R的硬化達到假硬化(廣泛地包含殘留有半硬化等的未硬化部分的狀態)。 The irradiation unit is irradiated in the atmosphere to cause the curing of the adhesive R to be pseudo-hardened by oxygen inhibition or the like (a state in which an unhardened portion such as semi-hardening remains is widely included).

硬化處理部11例如安裝於供給部10,且設置為:隨著供給部10的移動、而朝著接著劑R的供給方向可以移動。又,假硬化處理部11設置為:藉由掃描裝置(未圖示),朝著與供給部10的移動方向(供給方向)為正交的方向而可以移動。藉由掃描裝置或升降機構,而將假硬化處理部11設置為可以升降,可藉由上述升降來對照射部的照射強度、照射口徑、以及照射寬度等進行調整。 The hardening treatment unit 11 is attached to the supply unit 10, for example, and is movable in the supply direction of the adhesive R as the supply unit 10 moves. Further, the pseudo-hardening processing unit 11 is provided to be movable in a direction orthogonal to the moving direction (supply direction) of the supply unit 10 by a scanner (not shown). The pseudo-hardening treatment unit 11 is provided so as to be movable up and down by the scanner or the elevating mechanism, and the irradiation intensity, the irradiation aperture, the irradiation width, and the like of the irradiation unit can be adjusted by the above-described raising and lowering.

如圖2(A)、圖2(B)所示,貼合部2包括貼合裝置20,該貼合裝置20將工件S2貼合於工件S1的接著劑R。 例如,貼合裝置20包括:真空腔室(chamber)21、與按壓裝置22等。 As shown in FIGS. 2(A) and 2(B), the bonding unit 2 includes a bonding apparatus 20 that bonds the workpiece S2 to the adhesive R of the workpiece S1. For example, the bonding device 20 includes a vacuum chamber 21, a pressing device 22, and the like.

真空腔室21為如下的腔室,該腔室將被貼合的工件S1、S2的周圍予以覆蓋,且將與搬送部3之間的部分予以密閉,藉此來構成真空室。作為真空源(減壓裝置)的減壓泵(pump)(未圖示)是經由配管而連接於真空腔室21。又,真空腔室21是設置為:藉由未圖示的升降機構而可以升降。 The vacuum chamber 21 is a chamber that covers the periphery of the workpieces S1 and S2 to be bonded, and seals a portion between the workpieces S1 and S2 to form a vacuum chamber. A vacuum pump (not shown) as a vacuum source (pressure reducing device) is connected to the vacuum chamber 21 via a pipe. Further, the vacuum chamber 21 is provided to be movable up and down by an elevating mechanism (not shown).

按壓裝置22是如下的裝置,該裝置對工件S2進行按壓,藉此來將工件S2貼合於工件S1。例如,該按壓裝置22包含:保持著工件S2的保持部、與使保持部升降的升降機構等。 The pressing device 22 is a device that presses the workpiece S2, thereby bonding the workpiece S2 to the workpiece S1. For example, the pressing device 22 includes a holding portion that holds the workpiece S2, an elevating mechanism that moves the holding portion up and down, and the like.

搬送部3包括搬送裝置30,該搬送裝置30將工件S1自接著劑供給部1朝向貼合部2進行搬送。作為搬送裝置30,例如可考慮:轉盤(turntable)、輸送帶(conveyor)等及其驅動機構。然而,只要是能夠於上述各部分之間搬送工件的裝置,則亦可為任何裝置。上述搬送裝置30是以載置於載置部31的狀態,來搬送工件S1。 The transport unit 3 includes a transport device 30 that transports the workpiece S1 from the adhesive supply unit 1 toward the bonding unit 2 . As the conveying device 30, for example, a turntable, a conveyor, and the like, and a drive mechanism thereof can be considered. However, any device may be used as long as it can transport the workpiece between the above parts. The conveyance device 30 conveys the workpiece S1 in a state of being placed on the placing unit 31.

[B.作用] [B. Function]

參照圖1(A)、圖1(B)~圖5,對具有如上所述的構成的本實施形態的作用進行說明。再者,圖3(A)、圖3(B)中的假硬化處理部11的位置及角度,只不過是用以對作用進行說明的簡單的顯示。 The operation of this embodiment having the above configuration will be described with reference to Fig. 1 (A) and Figs. 1(B) to 5 . Further, the positions and angles of the pseudo-hardening portion 11 in FIGS. 3(A) and 3(B) are merely simple displays for explaining the action.

首先,如圖1(A)、圖1(B)所示,搬送裝置30是 自前一步驟,將載置於載置部31的工件S1搬送到接著劑供給部1。於接著劑供給部1中,如圖1(A)、圖3(A)所示,供給部10是呈面狀地將接著劑R供給到工件S1的一面。 First, as shown in FIG. 1(A) and FIG. 1(B), the conveying device 30 is From the previous step, the workpiece S1 placed on the placing portion 31 is transferred to the adhesive supply unit 1. In the adhesive supply unit 1, as shown in FIGS. 1(A) and 3(A), the supply unit 10 is a surface in which the adhesive R is supplied to the workpiece S1 in a planar manner.

例如,如圖4所示,將接著劑R自分配器的噴嘴(nozzle)供給(塗佈、滴下)到工件S1。利用掃描裝置來使上述分配器移動,藉此,以遍及工件S1的大範圍的區域的方式,開始供給接著劑R。 For example, as shown in FIG. 4, the adhesive R is supplied (coated, dripped) from the nozzle of the dispenser to the workpiece S1. The dispenser is moved by the scanning device, whereby the supply of the adhesive R is started so as to extend over a wide area of the workpiece S1.

再者,只要呈貼合所需的面狀來塗佈接著劑R即可。例如,可以遍及工件的整個一面的方式進行塗佈,亦可存在一部分未被塗佈的區域。又,即使以「遍及整體」的方式進行塗佈時,不一定必須使接著劑完全到達面的邊緣。即使存在接著劑稍微未到達邊緣的部分,亦可稱為接著劑遍及整體。 Further, the adhesive R may be applied as long as it is in the desired planar shape. For example, the coating may be applied over the entire surface of the workpiece, or a portion of the uncoated region may be present. Further, even when the coating is performed "over the whole", it is not always necessary to completely reach the edge of the surface. Even if there is a portion where the adhesive does not slightly reach the edge, it may be referred to as an adhesive throughout the whole.

例如,當如下述的圖5的工件S2的一側那樣,即使接著劑R稍微未到達面的邊緣時,亦包含在所說的「遍及整體」這一概念中。亦即,例如,即使供給到工件S1的接著劑R的端部,處於圖5的工件S2的邊緣與接著劑R的端部的關係之類的狀態,亦可稱為「遍及整體」。 For example, as in the side of the workpiece S2 of Fig. 5 described below, even if the adhesive R does not slightly reach the edge of the surface, it is included in the concept of "overall". That is, for example, even in the end portion of the adhesive R supplied to the workpiece S1, the state of the relationship between the edge of the workpiece S2 of FIG. 5 and the end of the adhesive R may be referred to as "overall".

與供給部10一併移動的假硬化處理部11是:自照射部將UV光逐步照射至接著劑R。例如,假硬化處理部11一面與供給部10同時朝向塗佈方向移動,且一面藉由掃描裝置而在與上述塗佈方向為正交的方向上往返移動。藉此,如圖1(B)、圖3(B)、以及圖4所示般,將UV光 逐步照射到已塗佈的接著劑R的整個面。 The pseudo-hardening treatment portion 11 that moves together with the supply unit 10 is to gradually irradiate the UV light to the adhesive R from the irradiation portion. For example, the pseudo-hardening treatment unit 11 moves toward the application direction simultaneously with the supply unit 10, and reciprocates in a direction orthogonal to the application direction by the scanning device. Thereby, as shown in FIG. 1(B), FIG. 3(B), and FIG. 4, UV light is used. The entire surface of the applied adhesive R is gradually irradiated.

由於在大氣中照射UV光,所以,硬化的進行因氧抑制等而變慢,從而可獲得適度的假硬化狀態的假硬化部H。如此一來,一面將接著劑R供給到工件S1的端部為止,且一面將已供給的接著劑R的整體設為假硬化部H。 Since the UV light is irradiated in the atmosphere, the progress of the hardening is slowed by oxygen suppression or the like, and the pseudo-hardened portion H in an appropriate pseudo-hardened state can be obtained. In this manner, the entire adhesive R is supplied to the end portion of the workpiece S1, and the entire supplied adhesive R is set as the dummy hardened portion H.

然後,搬送裝置30將供給有接著劑R的工件S1搬送到貼合部2。於貼合部2中,如圖2(A)所示,將工件S2保持於按壓裝置22、且真空腔室21下降,使得工件S1、S2的周圍密閉。接著,減壓泵工作,藉此,開始對真空腔室21內進行減壓(排氣)。 Then, the transport device 30 transports the workpiece S1 to which the adhesive R is supplied to the bonding unit 2. In the bonding unit 2, as shown in FIG. 2(A), the workpiece S2 is held by the pressing device 22, and the vacuum chamber 21 is lowered to seal the periphery of the workpieces S1 and S2. Next, the pressure reducing pump is operated, whereby the pressure reduction (exhaust) in the vacuum chamber 21 is started.

抽真空完成之後,按壓裝置22下降,藉此,將工件S2擠壓於工件S1(圖2(B))。此時,整個接著劑R成為假硬化部H,因此,由擠壓引起的流動受到抑制,另一方面,上述整個接著劑R維持著緩衝性。因此,貼合時的應變等被吸收,從而可實現貼合厚度的均一性。又,假硬化部H維持著表面的黏著性,因此,對於工件S2的接著力毫無問題。 After the evacuation is completed, the pressing device 22 is lowered, whereby the workpiece S2 is pressed against the workpiece S1 (Fig. 2(B)). At this time, since the entire adhesive R becomes the pseudo-hardened portion H, the flow caused by the pressing is suppressed, and on the other hand, the entire adhesive R maintains the cushioning property. Therefore, the strain or the like at the time of bonding is absorbed, so that the uniformity of the thickness of the bonding can be achieved. Further, since the dummy hardened portion H maintains the adhesion of the surface, there is no problem with the adhesion of the workpiece S2.

然後,藉由排氣路徑的開放等來破壞真空,真空腔室21上升,藉此,已貼合的工件S1、S2處於大氣中。而且,搬送裝置30將工件S1、S2自貼合部2搬出到下一步驟。例如,搬送裝置30使工件S1、S2移動至硬化部,該硬化部藉由UV光的照射來使接著劑R真正硬化。 Then, the vacuum is broken by the opening of the exhaust path or the like, and the vacuum chamber 21 is raised, whereby the bonded workpieces S1 and S2 are in the atmosphere. Further, the transport device 30 carries the workpieces S1 and S2 from the bonding unit 2 to the next step. For example, the conveying device 30 moves the workpieces S1 and S2 to the curing portion, which is used to cure the adhesive R by the irradiation of UV light.

[C.效果] [C. Effect]

若根據如上所述的本實施形態,可獲得如下所述的效 果。亦即,以於工件S1的一面呈面狀地分散的方式來供給接著劑R,並且使該接著劑R形成假硬化部H,因此,可防止接著劑R流動。又,由於隨著接著劑R的供給而形成假硬化部H,因此,與在塗佈完成之後進行硬化處理的情形相比較,可使製程時間縮短。而且,由於假硬化部H維持著緩衝性,因此,貼合時的應變等被吸收,從而可形成均一的接著層。 According to the embodiment as described above, the following effects can be obtained. fruit. In other words, the adhesive R is supplied so that one surface of the workpiece S1 is dispersed in a planar manner, and the adhesive R is formed into the pseudo hardened portion H. Therefore, the flow of the adhesive R can be prevented. Moreover, since the pseudo-hardened portion H is formed with the supply of the adhesive R, the process time can be shortened as compared with the case where the hardening treatment is performed after the coating is completed. Further, since the pseudo-hardened portion H maintains the cushioning property, strain or the like at the time of bonding is absorbed, and a uniform adhesive layer can be formed.

將相同的接著劑R供給到整個面之後,將整個面設為假硬化部H,因此,例如,如圖5所示,邊界不會殘留於使用者的視野範圍W內,而不會對畫面的視認性產生影響。無需分別準備且供給密封用的接著劑與內部填充用的接著劑,因此,於該方面亦可使製程時間縮短,且亦可節約成本。 After the same adhesive R is supplied to the entire surface, the entire surface is set as the dummy hardened portion H. Therefore, for example, as shown in FIG. 5, the boundary does not remain in the visual field range W of the user, and the screen is not present. The visibility of the image has an impact. It is not necessary to separately prepare and supply an adhesive for sealing and an adhesive for internal filling, and therefore, in this respect, the process time can be shortened and cost can be saved.

此外,例如,一般當進行真空貼合時,存在如下的情形,即,由於未硬化的接著劑R所產生的逸出氣體(outgas)而導致抽真空的速度下降。然而,於本實施形態中,由於將接著劑R設為假硬化部H,因此,可抑制逸出氣體的產生,從而可防止抽真空的速度下降。 Further, for example, generally, when vacuum bonding is performed, there is a case where the speed of evacuation is lowered due to the outgas generated by the unhardened adhesive R. However, in the present embodiment, since the adhesive R is set as the pseudo-hardened portion H, generation of the escape gas can be suppressed, and the speed of evacuation can be prevented from being lowered.

[D.其他實施形態] [D. Other embodiments]

本發明並不限定於如上所述的實施形態。例如,藉由掃描裝置,來將假硬化處理部11設置成:獨立於供給部10而能夠移動的方式,藉此,亦能夠交替地進行接著劑R的塗佈與假硬化。 The present invention is not limited to the embodiments described above. For example, the dummy hardening processing unit 11 is provided so as to be movable independently of the supply unit 10 by the scanning device, whereby the application and the false curing of the adhesive R can be alternately performed.

例如,如圖6(A)所示,供給部10移動規定量,將 接著劑R塗佈至工件S1之後,暫時停止。接著,如圖6(B)所示,假硬化處理部11的照射部一面將UV光照射到已塗佈的接著劑R、且一面移動,藉此,將接著劑R設為假硬化部H。 For example, as shown in FIG. 6(A), the supply unit 10 moves by a predetermined amount and will After the application agent R is applied to the workpiece S1, it is temporarily stopped. Then, as shown in FIG. 6(B), the irradiation portion of the pseudo-hardening treatment portion 11 is irradiated with the applied adhesive R while moving the UV light, whereby the adhesive R is set as the pseudo-hardened portion H. .

接著,如圖6(C)所示,供給部10移動規定量,將接著劑R塗佈至工件S1之後,暫時停止。接著,如圖6(D)所示,假硬化處理部11的照射部一面將UV光照射到已塗佈的接著劑R、且一面移動,藉此,將接著劑R設為假硬化部H。 Next, as shown in FIG. 6(C), the supply unit 10 is moved by a predetermined amount, and after the application agent R is applied to the workpiece S1, it is temporarily stopped. Then, as shown in FIG. 6(D), the irradiation portion of the pseudo-hardening treatment portion 11 is irradiated with the applied adhesive R while moving, and the adhesive R is set as the pseudo-hardened portion H. .

將以上的步驟予以重複,藉此,可將接著劑R供給到工件S1,並且可形成假硬化部H。藉此,可於如下的狀態下,使接著劑R假硬化,上述狀態是指在供給該接著劑R之後,該接著劑R的分散以某種程度變得穩定。 The above steps are repeated, whereby the adhesive R can be supplied to the workpiece S1, and the pseudo hardened portion H can be formed. Thereby, the adhesive R can be pseudo-hardened in the following state, which means that the dispersion of the adhesive R is stabilized to some extent after the supply of the adhesive R.

又,如圖7(A)、圖7(B)以及圖8(A)~圖8(D)所示,可考慮將如下的長條(bar)狀的照射部使用於假硬化處理部11,上述長條狀的照射部呈線狀地照射出UV光。於圖7(A)、圖7(B)中,與圖3(A)、圖3(B)同樣地,假硬化處理部11一面與供給部10一併移動,且一面照射出UV光。藉此,可使驅動部分減少,且可高速地進行接著劑R的塗佈與假硬化。 Further, as shown in FIG. 7(A), FIG. 7(B), and FIG. 8(A) to FIG. 8(D), it is conceivable to use the following bar-shaped irradiation unit in the pseudo-hardening processing unit 11 The long-shaped irradiation portion is irradiated with UV light in a line shape. In FIGS. 7(A) and 7(B), similarly to FIGS. 3(A) and 3(B), the pseudo-hardening treatment unit 11 moves together with the supply unit 10 and emits UV light. Thereby, the driving portion can be reduced, and the application and the pseudo hardening of the adhesive R can be performed at high speed.

圖8(A)~圖8(D)為如下的一個例子,該一個例子是指:藉由掃描裝置,來將長條狀的照射裝置、即假硬化處理部11設置成:獨立於供給部10而能夠移動的方式。根據該形態,與圖6(A)~圖6(D)同樣地,可交替地 進行塗佈與假硬化。即使於該情形時,亦可高速地進行用於假硬化的UV光的照射。 8(A) to 8(D) are examples in which the long-shaped irradiation device, that is, the pseudo-hardening processing portion 11, is provided by the scanning device so as to be independent of the supply portion. 10 ways to move. According to this aspect, similarly to FIGS. 6(A) to 6(D), it is possible to alternately Coating and pseudo hardening are carried out. Even in this case, irradiation of UV light for pseudo hardening can be performed at high speed.

再者,如圖6(A)~圖6(D)以及圖8(A)~圖8(D)所示,當將假硬化處理部11設置成:獨立於供給部10而能夠移動的方式時,或者當使假硬化處理部11與供給部10的間隔擴大時,可使塗佈與假硬化具有時間差。例如,藉由供給部10來連續地(不停地)供給接著劑R,並且藉由假硬化處理部11來連續地(不停地)使該接著劑R假硬化,對接著劑R的供給開始與假硬化處理部11的假硬化開始設置時間差,藉此,可於接著劑R充分地呈面狀地分散之後,才使該接著劑R假硬化。 Further, as shown in FIGS. 6(A) to 6(D) and FIGS. 8(A) to 8(D), the pseudo-hardening processing unit 11 is provided so as to be movable independently of the supply unit 10. At the time, or when the interval between the pseudo-hardening treatment portion 11 and the supply portion 10 is increased, there is a time difference between the coating and the pseudo-hardening. For example, the supply unit 10 continuously supplies (continuously) the adhesive R, and the adhesive R is continuously (continuously) pseudo-hardened by the pseudo-hardening treatment portion 11, and the supply of the adhesive R is continuously provided. The time difference from the start of the pseudo hardening of the pseudo-hardening treatment portion 11 is started, whereby the adhesive R can be pseudo-hardened after the adhesive R is sufficiently dispersed in a planar shape.

又,如圖9(A)、圖9(B)~圖12(A)、圖12(B)所示,可於接著劑R的一部分形成假硬化部H,從而防止接著劑R流動。例如,圖9(A)、圖9(B)為如下的形態,即,藉由供給部10來供給接著劑,並且一面使多個(亦可為單個)假硬化處理部11沿著接著劑R的塗佈區域的邊緣移動,一面照射出UV光。藉此,可將塗佈區域的邊緣設為框狀的假硬化部而防止流動。 Further, as shown in FIGS. 9(A), 9(B) to 12(A) and 12(B), the pseudo-hardened portion H can be formed in a part of the adhesive R to prevent the flow of the adhesive R. For example, FIG. 9(A) and FIG. 9(B) are forms in which an adhesive is supplied by the supply unit 10, and a plurality of (may be single) pseudo-hardening treatment portions 11 are provided along the adhesive. The edge of the coated region of R moves and emits UV light. Thereby, the edge of the coating region can be made into a frame-shaped pseudo-hardened portion to prevent the flow.

而且,亦存在使用長條狀的假硬化處理部11的形態。例如,如圖10(A)所示,以於接著劑R的塗佈區域的開始端與結束端,遍布塗佈區域的整個寬度的方式,對假硬化處理部11的UV光的照射範圍進行設定。如圖10(B)所示,以於開始端與結束端之間,僅對塗佈區域的兩端進行照射的方式而進行設定。 Further, there is also a form in which the long-shaped pseudo-hardening treatment portion 11 is used. For example, as shown in FIG. 10(A), the irradiation range of the UV light of the pseudo-hardening treatment portion 11 is performed so as to extend the entire width of the application region around the start end and the end end of the application region of the adhesive R. set up. As shown in FIG. 10(B), the setting between the start end and the end end is performed only by irradiating both ends of the application region.

對配置於長條的長度方向的多個光源是否發光或照射部是否發光進行控制,藉此,可實現如上所述的照射區域的變更。又,亦可藉由設置擋閘(shutter)、光罩(mask)等的遮蔽部來將如上所述的照射區域予以變更,上述遮蔽部能夠實現:選擇性地將照射範圍予以變更。藉此,可將接著劑R的塗佈區域的邊緣設為框狀的假硬化部H而防止流動。 It is possible to control the irradiation region as described above by controlling whether or not a plurality of light sources arranged in the longitudinal direction of the strip emit light or whether the illuminating portion emits light. Further, the irradiation region as described above may be changed by providing a shielding portion such as a shutter or a mask, and the shielding portion may selectively change the irradiation range. Thereby, the edge of the application region of the adhesive R can be made into a frame-shaped pseudo-hardened portion H to prevent the flow.

再者,假硬化部H不一定必須形成為框狀。如圖11(A)~圖11(D)所示,即便形成於接著劑R的塗佈區域的至少一部分的邊緣,亦可獲得防止流動的效果。 Further, the dummy hardened portion H does not necessarily have to be formed in a frame shape. As shown in FIGS. 11(A) to 11(D), even if it is formed on the edge of at least a part of the application region of the adhesive R, the effect of preventing the flow can be obtained.

如此一來,藉由電磁波的照射而形成假硬化部H的區域,可設為非常狹窄的範圍。藉此,可使假硬化部H與未硬化部的邊界處於圖4所示的視野範圍W之外。 As a result, the region in which the pseudo-hardened portion H is formed by the irradiation of electromagnetic waves can be set to a very narrow range. Thereby, the boundary between the pseudo hardened portion H and the uncured portion can be made outside the field of view W shown in FIG.

而且,如圖12(A)、圖12(B)所示,亦可於塗佈區域,呈多條線狀、及多個點狀等地形成假硬化部H。此可以如下的方式實現,即,每當如圖4的假硬化處理部11的照射部移動時進行照射,或對如圖7(A)、圖7(B)的長條狀的照射部的發光或遮蔽的時序進行控制。即使於該情形時,只不過是使呈面狀地同時供給的相同的接著劑的一部分進行假硬化,因此,幾乎不會殘留有能夠被看到的邊界。 Further, as shown in FIG. 12(A) and FIG. 12(B), the pseudo-hardened portion H may be formed in a plurality of lines, a plurality of dots, or the like in the application region. This can be achieved in such a manner that the irradiation is performed every time the irradiation portion of the pseudo-hardening processing portion 11 of FIG. 4 moves, or the elongated irradiation portion of FIGS. 7(A) and 7(B) is used. The timing of illumination or shading is controlled. Even in this case, only a part of the same adhesive which is simultaneously supplied in a planar shape is pseudo-hardened, so that a boundary which can be seen is hardly left.

對於假硬化的形態而言,可假硬化為方形、圓形、橢圓形、其他多邊形、以及曲線圓形等特定的形狀,或亦可離散地進行假硬化。假硬化的區域不一定構成為封閉的區 域。如上所述,可為直線狀,亦可為彎曲線狀、曲線狀。 The form of the pseudo-hardening may be pseudo-hardened into a specific shape such as a square, a circle, an ellipse, another polygon, and a curved circle, or may be pseudo-hardened discretely. The area of false hardening does not necessarily constitute a closed area area. As described above, it may be linear, or may be curved or curved.

再者,於本發明中,所謂「隨著由供給部進行的供給、而進行假硬化」,至少只要在自接著劑的供給開始到供給結束為止的期間(供給過程中),開始進行假硬化處理即可。接著劑只要可呈面狀地供給到工件的一面即可,上述接著劑可供給到工件的整個一面,亦可供給到工件的一面的一部分。 In the present invention, "false hardening is performed along with the supply by the supply unit", and at least the period from the start of the supply of the adhesive to the end of the supply (during the supply) is started. Just handle it. The adhesive may be supplied to one surface of the workpiece in a planar manner, and the adhesive may be supplied to the entire surface of the workpiece or may be supplied to a part of one surface of the workpiece.

又,對於接著劑的供給部的構成、供給方法而言,只要能夠以呈面狀地遍及工件的一面的方式進行塗佈即可。當使供給部進行掃描而呈線狀地進行塗佈時,自由地以任何方式進行移動,例如:上下地移動,前後左右地移動,旋轉地移動。如圖13所示,供給部10亦可呈多條線狀地塗佈接著劑R。於該情形時,亦可使多個獨立的分配器相連。此外,可適用藉由輥(roller)來進行塗佈的裝置、藉由刮刀(squeegee)來進行塗佈的裝置、以及進行旋轉(spin)塗佈的裝置等各種裝置。 In addition, the configuration and supply method of the supply portion of the adhesive may be applied so as to extend over one surface of the workpiece in a planar manner. When the supply unit is scanned and applied in a line shape, it is freely moved in any manner, for example, moving up and down, moving forward and backward, and moving rotationally. As shown in FIG. 13, the supply part 10 may apply the adhesive agent R in a plurality of lines. In this case, a plurality of independent dispensers can also be connected. Further, various devices such as a device for coating by a roller, a device for coating by a squeegee, and a device for performing spin coating can be applied.

使用的接著劑的種類並不限定於紫外線硬化型的樹脂。一般適用因電磁波或熱的照射而硬化的樹脂,可適用現在或將來能夠利用的所有的接著劑。於該情形時,根據接著劑的種類,將假硬化處理部改換為照射裝置、加熱裝置、以及乾燥裝置等。 The type of the adhesive to be used is not limited to the ultraviolet curable resin. Generally, a resin which is hardened by electromagnetic waves or heat irradiation is applied, and all of the adhesives which can be used now or in the future can be applied. In this case, the pseudo-hardening treatment unit is changed to an irradiation device, a heating device, a drying device, or the like depending on the type of the adhesive.

又,關於貼合部、搬送部,亦可適用目前或將來能夠利用的所有的方法、裝置。例如,關於貼合部,保持著工件的構造例如亦可為機械夾盤(mechanical chuck)、靜電 夾盤、真空夾盤、以及黏著夾盤等的任何構造。進行真空貼合的空間可為:由下側的構件升降而進行密閉、開放的構造,亦可為僅使工件的通路開閉的構造。而且,不一定採用真空貼合裝置,亦可採用在大氣中進行貼合的裝置。 Further, all the methods and devices that can be used currently or in the future can be applied to the bonding unit and the transport unit. For example, regarding the bonding portion, the structure in which the workpiece is held may be, for example, a mechanical chuck or a static electricity. Any configuration of chucks, vacuum chucks, and adhesive chucks. The space for vacuum bonding may be a structure in which the lower member is lifted and lowered to be closed and opened, or a structure in which only the passage of the workpiece is opened and closed. Further, a vacuum bonding device is not necessarily used, and a device for bonding in the atmosphere may be used.

搬送裝置例如亦可為轉盤、輸送帶、進給機構等的任何構造。載置部例如可考慮採用基座(susceptor)等,但只要作為可對工件進行支持的支持體而發揮功能,則亦可為任何材質、形狀。並不限於在水平方向上進行支持。工件的搬送方法亦並不限定於載置於載置部的情形。亦可直接載置於移動台上。再者,亦可由作業人員利用手動作業來使工件移動。 The conveying device may be, for example, any structure such as a turntable, a conveyor belt, a feeding mechanism, or the like. For example, a susceptor or the like may be used as the mounting portion. However, any material or shape may be used as long as it functions as a support that can support the workpiece. It is not limited to support in the horizontal direction. The method of transferring the workpiece is not limited to the case of being placed on the placing portion. It can also be placed directly on the mobile station. Furthermore, it is also possible for the worker to use a manual operation to move the workpiece.

又,作為貼合對象的工件只要是如覆蓋面板與液晶模組般構成顯示裝置的工件,且是將接著劑呈面狀地塗佈於一面來進行貼合,則不論該工件的大小、形狀、及材質等如何。不僅可適用於將接著劑供給到一個工件的情形,而且亦可適用於將接著劑供給到兩個工件的情形。於該情形下,當將接著劑供給到兩個工件時,可僅使一個工件的接著劑假硬化,亦可使兩個工件的接著劑均假硬化。 In addition, the workpiece to be bonded is a workpiece that forms a display device like a cover panel and a liquid crystal module, and the adhesive is applied to one surface and bonded to each other, regardless of the size or shape of the workpiece. And materials, etc. Not only can it be applied to the case where the adhesive is supplied to one workpiece, but it can also be applied to the case where the adhesive is supplied to two workpieces. In this case, when the adhesive is supplied to the two workpieces, only the adhesive of one workpiece may be pseudo-hardened, and the adhesive of both workpieces may be pseudo-hardened.

1‧‧‧接著劑供給部 1‧‧‧Adhesive Supply Department

2‧‧‧貼合部 2‧‧‧Fitting Department

3‧‧‧搬送部 3‧‧‧Transportation Department

10‧‧‧供給部 10‧‧‧Supply Department

11‧‧‧假硬化處理部 11‧‧‧False hardening treatment department

20‧‧‧貼合裝置 20‧‧‧Fitting device

21‧‧‧真空腔室 21‧‧‧vacuum chamber

22‧‧‧按壓裝置 22‧‧‧ Pressing device

30‧‧‧搬送裝置 30‧‧‧Transporting device

31‧‧‧載置部 31‧‧‧Loading Department

H‧‧‧假硬化部 H‧‧‧False hardening department

R‧‧‧接著劑 R‧‧‧Binder

S1、S2‧‧‧工件 S1, S2‧‧‧ workpiece

T‧‧‧儲槽 T‧‧‧ storage tank

W‧‧‧視野範圍 W‧‧ Scope of view

圖1(A)是表示本發明的一個實施形態中的接著劑供給開始時的說明圖,圖1(B)是表示接著劑供給結束時的說明圖。 Fig. 1(A) is an explanatory view showing the start of supply of the adhesive in the embodiment of the present invention, and Fig. 1(B) is an explanatory view showing the end of supply of the adhesive.

圖2(A)是表示圖1(A)、圖1(B)的實施形態中的貼合部的抽真空時的說明圖,圖2(B)是表示貼合時的 說明圖。 FIG. 2(A) is an explanatory view showing a vacuuming process of the bonding portion in the embodiment of FIGS. 1(A) and 1(B), and FIG. 2(B) is a view showing a state in which the bonding is performed. Illustrating.

圖3(A)、圖3(B)是表示於圖1(A)、圖1(B)的實施形態中,在塗佈接著劑之後立即進行假硬化處理的形態的說明圖。 (A) and (B) of FIG. 1 are explanatory views showing a state in which the pseudo-hardening treatment is performed immediately after the application of the adhesive agent in the embodiment of FIGS. 1(A) and 1(B).

圖4是表示圖1(A)、圖1(B)的實施形態中的供給部與假硬化處理部的立體圖。 Fig. 4 is a perspective view showing a supply unit and a pseudo-hardening treatment unit in the embodiment of Figs. 1(A) and 1(B).

圖5是表示圖1(A)、圖1(B)的實施形態中的接著劑與視野範圍的關係的剖面圖。 Fig. 5 is a cross-sectional view showing a relationship between an adhesive and a field of view in the embodiment of Figs. 1(A) and 1(B).

圖6(A)~圖6(D)是表示於圖1(A)、圖1(B)的實施形態中,交替地進行接著劑的塗佈與假硬化處理的形態的說明圖。 (A) to (D) of FIG. 1 are explanatory views showing a form in which the application of the adhesive and the pseudo-hardening treatment are alternately performed in the embodiment of FIGS. 1(A) and 1(B).

圖7(A)、圖7(B)是表示於使用長條狀的假硬化處理部的一個實施形態中,在塗佈接著劑之後立即進行假硬化的形態的說明圖。 (A) and (B) of FIG. 7 are explanatory views showing a form in which pseudo-hardening is performed immediately after application of an adhesive agent in an embodiment in which a long-length pseudo-hardening treatment portion is used.

圖8(A)~圖8(D)是表示於使用長條狀的假硬化處理部的一個實施形態中,交替地進行接著劑的塗佈與假硬化處理的形態的說明圖。 (A) to (D) of FIG. 8 are explanatory views showing a form in which the application of the adhesive and the pseudo-hardening treatment are alternately performed in one embodiment in which the strip-shaped pseudo-hardening treatment portion is used.

圖9(A)、圖9(B)是表示藉由假硬化處理部,呈框狀地進行假硬化處理的一例的說明圖。 (A) and (B) of FIG. 9 are explanatory views showing an example in which the pseudo-hardening treatment is performed in a frame shape by the pseudo-hardening treatment unit.

圖10(A)、圖10(B)是表示藉由假硬化處理部,呈框狀地進行假硬化處理的一例的說明圖。 (A) and (B) of FIG. 10 are explanatory views showing an example of performing a pseudo-hardening treatment in a frame shape by a pseudo-hardening treatment unit.

圖11(A)~圖11(D)是表示藉由假硬化處理部,呈直線狀地進行假硬化處理的一例的說明圖。 (A) to (D) of FIG. 11 are explanatory views showing an example in which the pseudo-hardening treatment is performed linearly by the pseudo-hardening treatment unit.

圖12(A)是表示藉由假硬化處理部,呈多條線狀地 進行假硬化處理的一例的說明圖,圖12(B)是表示藉由假硬化處理部,呈多個點狀地進行假硬化處理的一例的說明圖。 Fig. 12(A) shows a plurality of linear shapes by a pseudo-hardening treatment unit FIG. 12(B) is an explanatory view showing an example in which a pseudo-hardening treatment is performed in a plurality of dots by the pseudo-hardening treatment unit.

圖13是表示呈多條線狀地供給接著劑的供給部的一例的立體圖。 FIG. 13 is a perspective view showing an example of a supply unit that supplies an adhesive in a plurality of lines.

1‧‧‧接著劑供給部 1‧‧‧Adhesive Supply Department

3‧‧‧搬送部 3‧‧‧Transportation Department

10‧‧‧供給部 10‧‧‧Supply Department

11‧‧‧假硬化處理部 11‧‧‧False hardening treatment department

30‧‧‧搬送裝置 30‧‧‧Transporting device

31‧‧‧載置部 31‧‧‧Loading Department

H‧‧‧假硬化部 H‧‧‧False hardening department

R‧‧‧接著劑 R‧‧‧Binder

S1‧‧‧工件 S1‧‧‧ workpiece

T‧‧‧儲槽 T‧‧‧ storage tank

Claims (8)

一種接著劑供給裝置,將接著劑供給到構成顯示裝置的一對工件中的至少一個工件,上述接著劑供給裝置包括:供給部,以呈面狀地分散的方式,將上述接著劑供給到上述工件的一面;以及假硬化處理部,隨著由上述供給部所進行的供給,使供給的上述接著劑的一部分或全部進行假硬化。 An adhesive supply device that supplies an adhesive to at least one of a pair of workpieces constituting a display device, wherein the adhesive supply device includes a supply portion that supplies the adhesive to the above-described manner in a planar manner One surface of the workpiece and the pseudo-hardening treatment portion are pseudo-cured by a part or all of the supplied adhesive in accordance with the supply by the supply unit. 如申請專利範圍第1項所述的接著劑供給裝置,其中,上述假硬化處理部是設置為:能夠與上述供給部一併移動。 The adhesive supply device according to the first aspect of the invention, wherein the false-hardening treatment unit is provided to be movable together with the supply unit. 如申請專利範圍第1項所述的接著劑供給裝置,其中,上述假硬化處理部是設置為:獨立於上述供給部而能夠移動。 The adhesive supply device according to the first aspect of the invention, wherein the false-hardening treatment unit is provided to be movable independently of the supply unit. 如申請專利範圍第1項所述的接著劑供給裝置,其中,上述接著劑為利用電磁波的照射而硬化的接著劑,上述假硬化處理部包括:照射部,上述照射部將上述電磁波照射至上述接著劑。 The adhesive supply device according to claim 1, wherein the adhesive agent is an adhesive that is cured by irradiation with electromagnetic waves, and the pseudo-curing treatment unit includes an irradiation unit that irradiates the electromagnetic wave to the electromagnetic wave. Follow-up agent. 如申請專利範圍第4項所述的接著劑供給裝置,其中,上述接著劑為紫外線硬化型的樹脂, 上述照射部包括:紫外線照射裝置,上述紫外線照射裝置於大氣中、將紫外線照射至上述接著劑。 The adhesive supply device according to claim 4, wherein the adhesive is an ultraviolet curable resin. The irradiation unit includes an ultraviolet irradiation device that irradiates ultraviolet rays to the adhesive in the air. 如申請專利範圍第4項或第5項所述的接著劑供給裝置,其中,可變地設置上述電磁波的照射範圍。 The adhesive supply device according to Item 4 or 5, wherein the irradiation range of the electromagnetic wave is variably provided. 一種接著劑供給方法,將接著劑供給到構成顯示裝置的一對工件,上述接著劑供給方法包括:以呈面狀地分散的方式,將上述接著劑供給到至少一個上述工件的一面;且使供給的上述接著劑的一部分或全部進行假硬化。 An adhesive supply method of supplying an adhesive to a pair of workpieces constituting a display device, wherein the adhesive supply method includes: supplying the adhesive to one side of at least one of the workpieces in a planar manner; and Some or all of the above-mentioned adhesives supplied are pseudo-hardened. 如申請專利範圍第7項所述的接著劑供給方法,其中,上述接著劑與上述工件發生接觸時的時點及假硬化開始時的時點存在時間差,以使上述接著劑呈面狀地分散之後才進行假硬化。 The method of supplying an adhesive according to claim 7, wherein a time difference between the time when the adhesive is in contact with the workpiece and the time when the dummy hardening starts is such that the adhesive is dispersed in a planar manner. Perform false hardening.
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