TW201330984A - Abrasive tool and manufacturing method thereof - Google Patents

Abstract

An abrasive tool and its manufacturing method are disclosed, the manufacturing method comprising the steps of disposing a polymer material layer on a conductive substrate, wherein the polymer material layer is disposed with a plurality of pores based upon pattern definitions of a polygon or a polar array; at the same time, enhancing the wettability of a plurality of abrasive particles by utilizing chemical surface treatment method; disposing at least two abrasive particles in each pore; then, fixing the particles in the pore by a composite platting layer; and finally, removing the polymer material layer to form a surface having a plurality of abrasive regions on the conductive substrate. The invention utilizes the pores through pattern definition to plan the area, pitch, and distributed density of the abrasive regions, and the adhesion ability of the abrasive particles is improved by chemical surface treatment to greatly enhance its manufacturing quality.

Description

Grinding tool and method of manufacturing same

The invention belongs to the field of polishing technology in a wafer manufacturing process, and particularly relates to an abrasive tool capable of greatly improving wafer polishing efficiency and flattening work quality and a manufacturing method thereof.

According to the evolution of the times and the competition in the high-tech electronic consumer market, in order to accumulate more dense lines on a smaller area, the oxide layer and the metal layer of the wafer surface Planarization technology is also becoming more important. Since the integrated circuit line width on the wafer is continuously miniaturized, in order to solve the problem of focusing difficulty caused by the height difference in the lithography process, the wafer is generally planarized by Chemical Mechanical Polishing (CMP). The surface, the equipment required for CMP includes a polishing plate having a polishing pad, and a wafer carrier that fixes the wafer and applies pressure, and the wafer carrier utilizes Vacuuming and sucking the back side of the wafer, and utilizing the relative movement between the polishing pad of the polishing platform and the wafer carrier, while performing flattening operation by adding a slurry to generate an appropriate chemical reaction, The oxide layer and the metal layer of the wafer are polished and smoothed, which effectively reduces the design layout limitation, increases the pattern density, reduces the defect density, and improves the process yield.

However, after grinding for a period of time, the surface pattern and surface roughness of the polishing pad may cause debris of the wafer to be ground due to mechanical action of continuous polishing, or a metal layer on the polishing liquid and the wafer. The chemical product is generated, and the product or debris is deposited on the surface of the polishing pad by grinding action, resulting in an increase in the contact area between the surface of the wafer and the polishing pad, so that the space in which the slurry stays is reduced, resulting in a low leveling effect. Therefore, it needs to be trimmed by a grinding tool. Because these diamond tools are arranged on a disc-shaped substrate, they are also called "Diamond Disk", which is used for intermittent or synchronous. Trimming the surface of the polishing pad to maintain the rough surface of the polishing pad and restore its polishing effect and prolong its life, greatly improve the efficiency of wafer polishing and flattening work quality, and eliminate the problem of chip formation after CMP process .

Please refer to Figures 1 and 2 for a schematic view of the structure of a conventional abrasive tool and a partial enlarged photograph of it under an electron microscope. As shown in the figure, the abrasive tool 1 comprises a metal substrate 11 and a plurality of abrasive particles 12 are bonded to one of the solder layers 13 on the surface of the metal substrate 11 by means of alloy brazing. Since the abrasive particles 12 are fixed to the metal substrate 11 in an irregular manner in a random arrangement, the arrangement of the abrasive particles 12 is uneven and unevenly distributed, so that the grinding force of each of the abrasive particles 12 is different. And the insufficient adhesion strength of the brazing is likely to cause the problem of the falling off of the abrasive particles 12, which affects the service life of the abrasive tool 1 and its grinding characteristics.

遂Proposing that a sieve having one of the fixed meshes is mounted on the metal substrate 11 so that the abrasive particles 12 are regularly positioned according to the arrangement of the mesh, and then the abrasive particles 12 are fixed by the sintering process of the alloy powder. On the metal substrate 11, for example, U.S. Patent Nos. 4,925,457 and 5,092,910, "Abrasive tool and method for making", disclose an abrasive tool 1 made by using a screen to render the abrasive particles 12 in a regular arrangement pattern and a sintering process thereof. There is also a method of forming a polishing tool for a chemical mechanical polishing pad, such as the method of locating the abrasive particles 12 by a computer vision inspection system, which is regularly implanted on the metal substrate 11 as in the Republic of China Patent No. 436375. . Or, as in the Republic of China Patent No. 412461, "Diamond Discs for Machining Wafer Pads and Methods of Making Same", and Republic of China Patent No. 394723, "Abrasive Tools with Regularly Arranged Abrasive Particles and Their Manufacturing Methods", have been disclosed The abrasive particles 12 are characterized by regular or uniform distribution. However, the use of the screen is limited by the physical size of the mesh, and currently cannot be applied to the small-sized abrasive particles 12; on the other hand, since the above process has to undergo a sintering process, the sintering temperature is about 1050 ° C, which causes these The abrasive particles 12 are carbonized or even broken, and the size distribution, arrangement or distribution density of the abrasive particles 12 has only a single form, and cannot be adjusted according to the application surface, so how to treat the polishing pad The optimized design of the abrasive particles 12 has been the goal of the industry.

In view of the above, an object of the present invention is to provide a method for manufacturing an abrasive tool, which is a pattern of a plurality of abrasive grains formed by etching or exposure development, such as a pattern shape. One of the grinding tools is optimized by setting a pattern definition such as pitch, particle size, protrusion height, and uniformity.

A second object of the present invention is to provide a method for manufacturing an abrasive tool, which uses a chemical surface treatment method to first surface-modify the abrasive particles to further improve adhesion during fixation, thereby avoiding shedding during use. Happening.

Another object of the present invention is to provide a method for manufacturing an abrasive tool, which is fixed on a conductive substrate by a composite plating layer by means of low temperature electroforming to prevent the abrasive particles from being heated due to high temperature. The carbonization problem that arises.

In order to achieve the above object, a method for manufacturing an abrasive tool according to the present invention includes: providing a conductive substrate; and providing a polymer material layer on the conductive substrate, wherein the polymer material layer is defined according to a pattern of a polygon or an annular array. a plurality of holes are formed, the holes are completely penetrated to the conductive material layer to reach the conductive substrate; and the plurality of abrasive particles are surface-modified by a chemical surface treatment method to provide the abrasive particles with high wettability; And at least two or more of the abrasive particles are disposed in the respective holes; a composite plating layer is disposed in the holes to fix the abrasive particles in the holes; and the polymer material layer is removed to form a hole A surface having a plurality of abrasive regions in a polygonal or annular array.

In one embodiment, the holes are selected from one of a method such as exposure development, micro etching, embossing, screen printing, dot ink or hot pressing, and are disposed on the polymer material layer, and the hole is The thickness of the polymer material layer may be determined by 1/2 to 1/3 times the diameter of the abrasive particles, so the range may be 5 to 180 μm, and the specific embodiment of the present invention is 75 μm. The conductive substrate is selected from the group consisting of a metal material, a conductive ceramic material or a high-hardness plastic material having a highly conductive material on the surface, and the metal material is selected from the group consisting of stainless steel, aluminum alloy, titanium alloy or alloy steel. In one case, the conductive ceramic material is selected from one of, for example, an oxide ceramic, a carbide ceramic or a nitride ceramic.

Wherein, in the step of "surface-modifying a plurality of abrasive particles by a chemical surface treatment method to provide high wettability of the abrasive particles", the mixed liquid is immersed by HF + H ₂ SO ₄ to improve the The wettability of the abrasive particles.

Wherein, in the step of "removing the polymer material layer to form a surface having a plurality of polishing regions having a polygonal or annular array", it is selected from one of methods such as electron bombardment or organic solvent dissolution. The polymer material layer is removed.

An object of the present invention is to provide an abrasive tool which is produced by the above-described manufacturing method, and which is not easily peeled off during use, and the arrangement of the polished surfaces thereof, such as a pattern shape and a pitch (pitch) ), particle size, protrusion height, and uniformity are all optimal settings.

In order to achieve the above object, the polishing tool of the present invention comprises: a conductive substrate; a plurality of composite plating layers are disposed on the conductive substrate according to a pattern definition of a polygon or an annular array, the composite plating layer protruding from the conductive substrate And a plurality of abrasive particles are disposed on the composite plating layer in an amount of at least two or more, and a polishing surface is formed on the conductive substrate.

In one embodiment, the composite plating layer is a cylindrical structure, and the abrasive particles are selected from one of, for example, diamond, carbide ceramic powder, oxide ceramic powder or nitride ceramic powder, and the particle size thereof is Between 10 nm and 500 microns.

In summary, the present invention has the following beneficial effects: the manufacturing method of the grinding tool of the present invention mainly utilizes, for example, a pattern shape, a pitch, a particle size, and a protrusion height. Height) and uniformity and other graphic definition molding techniques (including etching or exposure development) and low-temperature electroforming (electroplating) methods. At the same time, these abrasive particles have high wettability after being chemically surface-modified, which not only improves the Composite coating and adhesion between the abrasive particles. Moreover, since the abrasive particles are fixed to the substrate without using a high-temperature process of conventional sintering, problems such as breakage and carbonization of the abrasive particles are avoided. In addition, the pattern defining forming method used in the present invention can perform various adjustments on the array patterns of the holes according to requirements, such as the distribution density of the holes, the opening size of the holes, and the adjacent The spacing of the holes, or the distribution of the holes, and the like, so that the grinding tool produced by the present invention can have a change in distribution density, a change in different particles, and a good arrangement in the formation of the abrasive surface. Achieving high-efficiency grinding quality is not achieved by conventional manufacturing methods. Each hole is composed of a plurality of abrasive particles combined with a composite coating layer, which can increase the grinding area and effectively reduce the load of a single abrasive particle. The wear of the abrasive particles is reduced to increase the useful life of the abrasive tool.

In order for your review board to have a clear understanding of the contents of the present invention, please refer to the following description.

Please refer to FIGS. 3, 4-9, which are flowcharts of steps of a preferred embodiment of the present invention, and a schematic diagram of states corresponding to the respective steps. As shown in the figure, the manufacturing method of the grinding tool of the present invention comprises the following steps:

S01: Providing a conductive substrate 2. The conductive substrate 2 is selected from, for example, a metal material, a ceramic material, or a high-hardness plastic material (such as a PCB) having a highly conductive material on its surface. It should be noted that the metal material is selected from one of, for example, stainless steel, aluminum alloy, titanium alloy or alloy steel, or the ceramic material is selected from one of oxide ceramics, carbide ceramics or nitride ceramics. In other words, the material of the conductive substrate 2 is not limited, but must have a certain hardness to support the forward pressure generated during the grinding operation, and the surface must have good electrical conductivity characteristics, as shown in FIG. In the conductive substrate 2 of the invention, a nickel substrate is used, and it is made into a disk-shaped structure.

S02: a polymer material layer 3 is disposed on the conductive substrate 2, and the polymer material layer 3 is provided with a plurality of holes 31 according to a pattern definition of a polygon or an annular array, and the holes 31 completely penetrate the height The molecular material layer 3 reaches the conductive substrate 2. The holes 31 as shown in FIG. 5 are selected from one of, for example, exposure development, micro-etching, embossing, screen printing, dot ink or hot pressing, in an annular array arrangement, by the center. The outward radiation is arranged equidistantly on the polymer material layer 3, and the thickness of the polymer material layer 3 is 75 μm. It should be noted that the polymer material layer 3 is selected from, for example, a photosensitive polymer material or a plastic material, and the most common one is a photoresist or a heat-sensitive plastic, which has characteristics such as easy molding and easy removal. In other words, in the specific implementation of the present invention, the polymer material layer 3 is pre-coated on one surface of the conductive substrate 2, and the polymer material layer 3 is etched by an etching method to form the holes 31; First, a photoresist is coated on one surface of the conductive substrate 2, and after curing, the holes 31 are formed on the photoresist by exposure and development and wet etching; or the pre-opening is used. One polymer material layer 3 of one of the holes 31 is fixed to one surface of the conductive substrate 2. The array of holes formed by the holes 31 can be formed into a regular array of holes on the surface of the conductive substrate 2, and the shape and spacing can be freely adjusted. For example, the opening size of each hole 31 can be based on the particles of the abrasive particles. The diameter of the hole 31 is adjusted from 1 to 1.5 times. In the embodiment of the present invention, the opening size of the holes 31 is preferably 130 to 300 μm.

S03: Surface-modifying a plurality of abrasive particles 4 by a chemical surface treatment method to impart high wettability to the abrasive particles 4. As shown in Fig. 6, the present invention enhances the wettability of the abrasive particles 4 by a mixed liquid immersion treatment of HF + H ₂ SO ₄ . It should be noted that the abrasive particles 4 are selected from one of, for example, a diamond, a carbide ceramic powder, an oxide ceramic powder or a nitride ceramic powder, and the abrasive particles 4 have a particle size range of 10 nm. Between 500 microns and micrometers of diamond particles are used in the present invention.

S04: At least two or more of the abrasive particles 4 are disposed in the respective holes 31. As shown in Fig. 7, this step mainly involves placing the abrasive particles 4 into the respective holes 31 in a plurality of forms. In the present invention, five abrasive particles 4 are disposed in each of the holes 31.

S05: A composite plating layer 5 is disposed in the holes 31 to fix the abrasive particles 4 in the holes 31. As shown in FIG. 8, the present invention utilizes a method of low temperature electroforming (ie, electroplating), and the composite plating layer 5 is filled in a contact position between the abrasive particles 4 and the conductive substrate 2, and the composite plating layer 5 is utilized. Coating a portion (lower half) of the abrasive particles 4 to expose the portions of the abrasive particles 4 to the outside as a function of grinding, wherein the electrical isolation step necessary in the electroforming process is common knowledge I will not repeat them here. It should be noted that the present invention is not limited to the fixing method, and other methods such as an electroless plating method, a physical vapor deposition method (PVD), a thermal buried method, or a chemical vapor deposition method (CVD) may be implemented in the present invention. And according to various practical applications, the composite plating layer 5 is selected from metal materials (such as: titanium, copper, aluminum, etc.), ceramic materials, composite materials or metal materials.

S06: removing the polymer material layer 3 to form a surface having a plurality of polishing regions in a polygonal or annular array. As shown in FIG. 9, the means for removing the polymer material layer 3 of the present invention is selected from one of methods such as electron bombardment or organic solvent dissolution, to remove the polymer material layer 3, leaving only For the composite plating layer 5, the polishing particles 4, and the conductive substrate 2, refer to FIG. 10, which is a structure of the polishing tool according to the preferred embodiment of the present invention under an electron microscope. As shown in the figure, the polishing tool comprises the conductive substrate 2, the composite plating layer 5 and the abrasive particles 4, wherein the composite plating layer 5 and the abrasive particles 4 are arranged according to a pattern definition. It is used as a polishing surface, and some areas of the conductive substrate 2 do not have the composite plating layer 5 and the abrasive particles 4 as the polishing area during the polishing operation, and the exposed area of the conductive substrate 2 is left. It is a hollow part and can be used to improve the chip removal ability during grinding in the operation of the grinding operation.

In one embodiment, the composite plating layer 5 is a cylindrical structure. In summary, the present invention has the following advantages:

1. The process steps used in the present invention are all low temperature processes, including a pattern-defined molding technique and a low-temperature electroforming process, thereby avoiding the carbonization effect of the abrasive particles 4, thereby further improving the grinding tool of the present invention. characteristic.

2. The pattern defining molding technique used in the present invention can form the holes 31 required for the polymer material layer 3 on the surface of the conductive substrate 2 according to requirements, and the arrangement manner can be determined according to the requirements of the practical application surface. Adjustment, for example, the size of the spacing between the abrasive particles 4, the smaller size of the abrasive particles 4 on the conductive substrate 2, or the distribution design of various patterns, etc., can be adjusted to improve the actual Grinding ability when applied.

3. The present invention can also utilize the manner in which the holes 31 of the polymer material layer 3 are disposed, and the thickness of the composite plating layers 5, to control the arrangement of the abrasive particles 4, the amount of the abrasive particles 4, and the uniformity thereof. The grinding efficiency and speed become predictable, and the manufacturing quality can be controlled.

However, the above description is only for the preferred embodiment of the present invention, and is not intended to limit the scope of the practice of the present invention, so that it is common knowledge in the art or equivalent or easy to be familiar with the technology. Variations and modifications made by those skilled in the art without departing from the spirit and scope of the invention are intended to be included within the scope of the invention.

[Practical]

1. . . Grinding tool

11. . . Metal substrate

12. . . Abrasive particles

13. . . Solder layer

【this invention】

S01~S06. . . step

2. . . Conductive substrate

3. . . Polymer layer

31. . . Hole

4. . . Abrasive particles

5. . . Composite coating

Figure 1 is a schematic view showing the structure of a conventional grinding tool.

Figure 2 is a partial enlarged photograph of a conventional abrasive tool under an electron microscope.

Figure 3 is a flow chart showing the steps of a preferred embodiment of the present invention.

Fig. 4 is a schematic diagram showing the state corresponding to step S01.

Fig. 5 is a schematic diagram showing the state corresponding to step S02.

Fig. 6 is a schematic diagram showing the state corresponding to step S03.

Fig. 7 is a schematic diagram showing the state corresponding to step S04.

Figure 8 is a schematic diagram showing the state corresponding to step S05.

Figure 9 is a schematic diagram showing the state corresponding to step S06.

Figure 10 is a partially enlarged photograph of the abrasive tool of the preferred embodiment of the present invention under an electron microscope.

S01～S06. . . step

Claims (10)

A method for manufacturing an abrasive tool, comprising: providing a conductive substrate; providing a polymer material layer on the conductive substrate, wherein the polymer material layer is provided with a plurality of holes according to a pattern definition of a polygon or an annular array, The holes are completely penetrated the polymer material layer to reach the conductive substrate; the surface of the plurality of abrasive particles is surface-modified by a chemical surface treatment method to provide the abrasive particles with high wettability; Grown particles are disposed in the respective holes; a composite plating layer is disposed in the holes to fix the abrasive particles in the holes; and the polymer material layer is removed to form a plurality of layers having a polygonal or circular array a surface of the abrasive area. The manufacturing method of the grinding tool according to the first aspect of the invention, wherein the holes are selected from one of a method such as exposure development, micro etching, imprinting, screen printing, dot ink or hot pressing, And disposed on the polymer material layer. The method for producing a polishing tool according to claim 1, wherein the thickness of the polymer material layer is in a range of 1/2 to 1/3 times the polishing particles, and the range is 5 to 180 μm. The method for producing an abrasive tool according to claim 1, wherein in the step of "surface-modifying a plurality of abrasive particles by a chemical surface treatment method to provide high wettability of the abrasive particles", The wettability of the abrasive particles is improved by a mixed liquid soaking treatment of HF + H ₂ SO ₄ . The method for manufacturing an abrasive tool according to claim 1, wherein in the step of "removing the polymer material layer to form a surface having a plurality of polishing regions having a polygonal or annular array", The polymer material layer is removed from one of methods such as electron bombardment or organic solvent dissolution. The method for manufacturing an abrasive tool according to claim 1, wherein the conductive substrate is one selected from the group consisting of a metal material, a ceramic material, or a high-hardness plastic material having a highly conductive material on the surface. The method for manufacturing an abrasive tool according to claim 6, wherein the metal material is one selected from the group consisting of stainless steel, aluminum alloy, titanium alloy or alloy steel, and the ceramic material is selected from, for example, an oxide ceramic. One of carbide carbide or nitride ceramics. An abrasive tool obtained by the manufacturing method of claim 1, comprising: a conductive substrate; a plurality of composite plating layers disposed on the conductive substrate according to a pattern definition of a polygon or a circular array, The composite plating layer protrudes from the surface of the conductive substrate; and a plurality of abrasive particles are disposed on the composite plating layer in an amount of at least two or more, and a polishing surface is formed on the conductive substrate. The abrasive tool of claim 8, wherein the composite coating is a cylindrical structure. The abrasive tool according to claim 8, wherein the abrasive particles are selected from the group consisting of diamond, carbide ceramic powder, oxide ceramic powder or nitride ceramic powder, and the particle size is 10 nm to 500 microns.