TW201325823A - Grinding tool and manufacturing method thereof - Google Patents
Grinding tool and manufacturing method thereof Download PDFInfo
- Publication number
- TW201325823A TW201325823A TW100149697A TW100149697A TW201325823A TW 201325823 A TW201325823 A TW 201325823A TW 100149697 A TW100149697 A TW 100149697A TW 100149697 A TW100149697 A TW 100149697A TW 201325823 A TW201325823 A TW 201325823A
- Authority
- TW
- Taiwan
- Prior art keywords
- grinding
- layer
- grinding layer
- processing
- tool
- Prior art date
Links
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
本發明係有關於一種工具及其製作方法，特別是指一種磨削工具及其製作方法。
The invention relates to a tool and a manufacturing method thereof, in particular to a grinding tool and a manufacturing method thereof.
放電加工有別於傳統機械加工，可達到精確控制材料的移除量，使加工精度符合加工需求。因放電加工之電極與工件間未接觸，所以放電加工時工件無切削加工應力，因此放電加工不受工件材料之強度、硬度、韌性等機械性質所影響，以廣泛地應用於難切削材料的加工件上，更可加工各種難加工材料與外形複雜的精密零組件。
請參閱第一圖，此圖揭示利用柱狀工具電極1’對工件2’進行放電加工，以形成一穿孔21’於工件2’上。工件2’在放電加工之後，加工表面經過高溫熔融致使周圍的加工液因而汽化、膨脹並產生極大的壓力，將熔融狀態的材料沖離，達到材料去除的目的。但沒有被沖離的熔融金屬也因受絕緣液的冷卻作用而凝固，殘留在工件2’之表面形成再鑄層與放電痕。且在一般實際的放電穿孔加工，會因為加工屑排出過程中，在側邊發生二次放電現象，工件2’上之穿孔21’的剖面形狀呈錐狀，因此放電加工仍無法達到高形狀精度之要求。
所以於放電加工後必須對工件2’上之穿孔21’進行研磨，改善工件2’上之穿孔21’的剖面形狀，以達到高形狀精度之要求。對工件2’上之穿孔21’進行研磨係利用一磨削工具，習知磨削工具例如中華民國專利第I309594號之「懸臂式超精密微型研磨工具」，該懸臂式超精密微型研磨工具係包括一微型基軸，該微型基軸之一端係由一微型夾頭所夾持，其另一端係以金屬結合劑結合微米或奈米級之磨料，並經微線切割放電加工方式，切割成懸臂式造型。此專利所提供之研磨工具於製作上較為複雜，而且該研磨工具之磨料密度相同，僅能對工件作粗加工或精加工，不能使用同一研磨工具同時對工件作粗加工及精加工，必須更換另一研磨工具，如此於更換研磨工具時必須再次對位工件，造成使用者於使用上之不便，且容易因為對位不準確而影響工件之加工品質，甚至工件成為不良品而需淘汰，如此即會增加成本以及降低加工效率。
另外中華民國專利申請號第096112202號之「微型球狀磨削結構之製造方法」，其亦提供一種磨削工具，該微型球狀磨削結構係包含一微球工具軸，該微球工具軸之一端具有一球狀物，該球狀物可黏結複數研磨顆粒。雖然此專利所提供之磨削結構於製作上簡單，但與上篇專利有一樣的問題，即無法使用同一研磨工具同時對工件作粗加工及精加工，必須更換另一研磨工具等問題，導致使用者於使用上之不便。
為了解決上述之問題，本發明提供一種磨削工具及其製作方法，本發明之磨削工具的製作方法簡單，而且磨削工具可同時對工件進行粗加工及精加工，不需更換磨削工具，增加使用上之方便性及磨削效率，且減少對位所產生之誤差，所以經磨削後之工件可達到高形狀精度之需求。
EDM is different from traditional machining, which can accurately control the removal of materials, so that the machining accuracy meets the processing requirements. Since the electrode for electrical discharge machining is not in contact with the workpiece, the workpiece has no machining stress during electrical discharge machining. Therefore, the electrical discharge machining is not affected by mechanical properties such as strength, hardness, and toughness of the workpiece material, and is widely used for processing of difficult-to-cut materials. On the piece, it can process a variety of difficult parts and complex components with complex shapes.
Referring to the first figure, this figure discloses that the workpiece 2' is subjected to electrical discharge machining using the cylindrical tool electrode 1' to form a through hole 21' on the workpiece 2'. After the electric discharge machining of the workpiece 2', the processed surface is melted at a high temperature, so that the surrounding working fluid is vaporized, expanded, and generates a great pressure, and the molten material is washed away to achieve the purpose of material removal. However, the molten metal which has not been washed away is also solidified by the cooling action of the insulating liquid, and remains on the surface of the workpiece 2' to form a recast layer and a discharge mark. Moreover, in the actual actual discharge perforation processing, a secondary discharge phenomenon occurs on the side during the discharge of the machining waste, and the cross-sectional shape of the perforation 21' on the workpiece 2' is tapered, so that the electric discharge machining cannot achieve high shape accuracy. Requirements.
Therefore, after the electrical discharge machining, the through hole 21' on the workpiece 2' must be ground to improve the cross-sectional shape of the through hole 21' on the workpiece 2' to achieve high shape accuracy. Grinding the perforation 21' on the workpiece 2' utilizes a grinding tool such as the "cantilever type ultra-precision micro-grinding tool" of the Republic of China Patent No. I309594, which is a cantilever type ultra-precision micro-grinding tool system. The utility model comprises a micro base shaft, wherein one end of the micro base shaft is clamped by a micro chuck, and the other end is combined with a micro- or nano-grade abrasive by a metal bond, and is cut into a cantilever type by micro-wire cutting and electric discharge machining. modeling. The grinding tool provided by this patent is complicated in production, and the abrasive material has the same abrasive density, and can only rough or finish the workpiece. The same grinding tool cannot be used for roughing and finishing the workpiece at the same time, and must be replaced. Another grinding tool, such that when the grinding tool is replaced, the workpiece must be aligned again, which causes inconvenience to the user, and it is easy to affect the processing quality of the workpiece due to inaccurate alignment, and even the workpiece becomes a defective product and needs to be eliminated. This will increase costs and reduce processing efficiency.
In addition, the "manufacturing method of a micro-spherical grinding structure" of the Republic of China Patent Application No. 096112202 also provides a grinding tool comprising a microsphere tool shaft, the microsphere tool shaft One end has a ball that can bond a plurality of abrasive particles. Although the grinding structure provided by this patent is simple in production, it has the same problem as the previous patent, that is, it is impossible to use the same grinding tool for roughing and finishing the workpiece at the same time, and it is necessary to replace another grinding tool and the like, resulting in problems. The user is inconvenient to use.
In order to solve the above problems, the present invention provides a grinding tool and a manufacturing method thereof. The grinding tool of the present invention has a simple manufacturing method, and the grinding tool can simultaneously rough and finish the workpiece without replacing the grinding tool. , increasing the convenience of use and grinding efficiency, and reducing the error caused by the alignment, so the workpiece after grinding can achieve the high shape accuracy requirements.
本發明之目的，在於提供一種磨削工具及其製作方法，磨削工具可同時對加工件作粗加工及精加工，不需要更換其他磨削工具，增加使用上之便利性，並可提升磨削速率，且減少對位所產生之誤差，使磨削後之加工件達到高形狀精度及高表面品質之需求。
本發明之目的，在於提供一種磨削工具及其製作方法，磨削工具容易製作，以降低製作成本，並可依據使用者需求製作。
本發明提供一種磨削工具，係包含：一工具載體，其具有一第一加工部及一第二加工部，該第二加工部位於該第一加工部之下方；一第一磨削層，其設置於該第一加工部；以及一第二磨削層，其設置於該第二加工部；其中，於該第一磨削層與該第二磨削層之加工線速度相同之下，該第一磨削層之單位面積的磨削加工量不同於該第二磨削層之單位面積的磨削加工量。
本發明提供一種磨削工具之製作方法，係包含：提供一工具載體，該工具載體具有一第一加工部及一第二加工部，該第二加工部位於該第一加工部之下方；形成一第一磨削層於該第一加工部；以及形成一第二磨削層於該第二加工部；其中，於該第一磨削層與該第二磨削層之加工線速度相同之下，該第一磨削層之單位面積的磨削加工量不同於該第二磨削層之單位面積的磨削加工量。
The object of the present invention is to provide a grinding tool and a manufacturing method thereof. The grinding tool can rough and finish the workpiece at the same time, without replacing other grinding tools, increasing the convenience of use, and lifting the grinding machine. Cutting rate, and reducing the error caused by the alignment, so that the workpiece after grinding achieves high shape accuracy and high surface quality.
The object of the present invention is to provide a grinding tool and a manufacturing method thereof, which are easy to manufacture, to reduce the manufacturing cost, and can be made according to user requirements.
The present invention provides a grinding tool comprising: a tool carrier having a first processing portion and a second processing portion, the second processing portion being located below the first processing portion; a first grinding layer, Provided in the first processing portion; and a second grinding layer disposed in the second processing portion; wherein, under the processing line speed of the first grinding layer and the second grinding layer, The amount of grinding per unit area of the first grinding layer is different from the amount of grinding per unit area of the second grinding layer.
The present invention provides a method of manufacturing a grinding tool, comprising: providing a tool carrier, the tool carrier having a first processing portion and a second processing portion, the second processing portion being located below the first processing portion; forming a first grinding layer is disposed on the first processing portion; and a second grinding layer is formed on the second processing portion; wherein the processing speed of the first grinding layer and the second grinding layer is the same Next, the grinding amount per unit area of the first grinding layer is different from the grinding amount per unit area of the second grinding layer.
茲為使對本發明之結構特徵及所達成之功效有更進一步之瞭解與認識，謹佐以較佳之實施例及配合詳細之說明，說明如後：
習知磨削工具無法同時對加工件作粗加工及精加工，必須更換不同磨削工具，於更換磨削工具時又須重新對位加工件，導致使用上之不便，且容易因為對位不準確而影響加工件之加工品質，如此即會增加成本及降低加工效率。因此本發明提供一種磨削工具，可同時對加工件作粗加工及精加工，不需更換磨削工具，因此不會產生重新對位之問題，提升使用上之便利性，並可提升磨削速率，且減少對位所產生之誤差，使磨削後之加工件可達到高形狀精度及高表面品質之需求。
請參閱第二圖及第三圖，係本發明之第一實施例之結構圖及流程圖。如圖所示，本實施例提供一種磨削工具1，其製作方法係先執行步驟S10，準備一工具載體10，工具載體10具有一第一加工部1011及一第二加工部1012，第二加工部1012與第一加工部1011相鄰，第二加工部1012並位於第一加工部1011之下方。接著執行步驟S12，工具載體10之第一加工部1011進行複合電沉積加工，而形成一第一磨削層11於第一加工部1011上(第一加工部1011及第二加工部1012同時具有第一磨削層11)。最後執行步驟S14，工具載體10之第二加工部1012進行複合電沉積加工，形成一第二磨削層12於第二加工部1012上(此時再於第二加工部1012上之第一磨削層11在形成一第二磨削層12)。由上述製作方法形成本實施例之磨削工具1。
本實施例之第一磨削層11及第二磨削層12係利用複合電沉積加工方式分別形成於工具載體10之第一加工部1011及第二加工部1012，進行複合電沉積加工所使用之電沉積液係含有擬鍍金屬的離子(例如:鎳離子)及複數研磨粒(例如:鑽石)。當對工具載體10之第一加工部1011進行複合電沉積加工時(步驟S12)，會使第一固著層111形成時，同時嵌合研磨粒112 於其上，以形成第一磨削層11於第一加工部1011上。然後對工具載體10之第二加工部1012進行複合電沉積加工時(步驟S14)，如上所述以形成第二磨削層12於第二加工部1012。
本實施例之磨削工具1於使用時可將工具1旋轉或上下往復位移，以對一加工件表面作磨削加工，當磨削加工主要是藉由旋轉磨削工具1而讓第一磨削層11與第二磨削層12於旋轉時分別產生一加工線速度時，第一磨削層11之該些第一研磨粒112與第二磨削層12之該些第二研磨粒122即會因為工具1之加工線速度而對加工件作磨削加工。本發明之磨削工具1利用第一磨削層11與第二磨削層12分別對加工件作磨削加工。若在第一磨削層11與第二磨削層12分別對加工件作磨削加工時，分別控制磨削工具1之轉速，而讓第一磨削層11與第二磨削層12使用相同加工線速度對加工件作磨削加工下，第一磨削層11的單位面積之磨削加工量不同於第二磨削層12的單位面積之磨削加工量。
本實施例是控制第一磨削層11之單位面積的該些第一研磨粒112之分布密度不同於第二磨削層12之單位面積的該些第二研磨粒122之分布密度，而讓第一磨削層11之單位面積的磨削加工量不同於第二磨削層12之單位面積的磨削加工量，如此第一磨削層11及第二磨削層12可分別對一加工件作不同程度之磨削加工。
而本實施例之第一磨削層11之單位面積的磨削加工量小於第二磨削層12之單位面積的磨削加工量，即表示第二磨削層12之單位面積的該些研磨粒122之分布密度較低，所以第二磨削層12之單位面積的該些第二研磨粒122呈稀疏地排列，因此每一第二研磨粒122與加工件之接觸面積大，可磨削加工件較多的材料而具有較大的磨削加工量，即表示位於第二加工部1012之第二磨削層12可對加工件作粗加工；相對地，也表示第一磨削層11之單位面積的該些第一研磨粒112之分布密度較高，所以第一磨削層11之單位面積的該些第一研磨粒112呈密集地排列，因此每一第一研磨粒112與加工件之接觸面積小，可磨削加工件較少的材料而具有較小的磨削加工量，即表示第一加工部1012之第一磨削層11可對加工件作精加工。
使第一磨削層11之單位面積的該些第一研磨粒112與第二磨削層12之單位面積的該些第二研磨粒122之分布密度不同，本實施例主要控制每次進行複合電沉積加工之加工時間長短或加工電流大小而決定。舉例說明，復參閱第三圖，當執行步驟S12時，對工具載體10之第一加工部1011進行複合電沉積加工於一第一預定時間，以形成第一磨削層11於第一加工部1011。當執行步驟S14，對工具載體10之第二加工部1012進行複合電沉積加工於一第二預定時間，以形成第二磨削層12於第二加工部1012。第一預定時間與第二預定時間不同，使第一磨削層11之單位面積的該些第一研磨粒112及第二磨削層12之單位面積的該些第二研磨粒122的沉積數量不同，進而使第一磨削層11之單位面積的該些第一研磨粒112及第二磨削層12之單位面積的該些第二研磨粒122的分布密度不同。當第一預定時間大於第二預定時間時，第一磨削層11之單位面積的該些第一研磨粒112之數量會大於第二磨削層12之單位面積的該些第二研磨粒122之數量，所以因沉積於第一加工部1011而形成第一磨削層11之單位面積的該些第一研磨粒112之數量多，而使該些第一研磨粒112於第一磨削層11之單位面積上呈密集排列，以使該些第一研磨粒112分布於第一磨削層11之單位面積的密度較高。而因沉積於第二加工部1012而形成第二磨削層12之單位面積的該些第二研磨粒122之數量少，而使該些第二研磨粒122於第二磨削層12之單位面積上呈稀疏排列，以使該些第二研磨粒122分布於第二磨削層12的單位面積之密度較低。
上述提及控制進行複合電沉積加工之加工電流亦可控制第一磨削層11之單位面積的該些第一研磨粒112與第二磨削層12之單位面積的該些第二研磨粒122之分布密度。比如，施加一第一加工電流之狀態下執行步驟S12，施加一第二加工電流之狀態下執行步驟S14，其中第一加工電流及第二加工電流係施加於工具載體10。第一加工電流不同於第二加工電流，以控制沉積於第一磨削層11之單位面積的該些第一研磨粒112與沉積於第二磨削層12之單位面積的該些第二研磨粒122的數量。當第一加工電流大於第二加工電流時，第一磨削層11之單位面積的該些第一研磨粒112之數量大於第二磨削層12之單位面積的該些研磨粒122之數量，即表示第一磨削層11之單位面積的該些第一研磨粒112之分布密度大於第二磨削層12之單位面積的該些第二研磨粒122之分布密度，或者電沉積時間加長，亦可增加第一研磨粒112之分布密度。
由上述可知，本實施例之磨削工具1可同時對加工件作不同程度之磨削加工，即表示可同時對加工件作粗加工及精加工，於磨削過程中無須更換其他磨削工具，增加使用上之便利性。習知技術容易因為對位不準確而影響加工件之加工品質，甚至加工件成為不良品而需淘汰，如此即會增加成本以及降低加工效率，然而本發明之磨削工具1因無須更換其他磨削工具，所以可有效解決上述習知技術的問題。而上述皆以第一磨削層11之單位面積的磨削加工量小於第二磨削層12之單位面積的磨削加工量為例，當然第一磨削層11之單位面積的磨削加工量可大於第二磨削層12之單位面積的磨削加工量，於此不再贅述。
上述實施例揭露使用複合電沉積加工方式形成第一磨削層11及第二磨削層12，然而本發明亦可利用其他方式形成第一磨削層11及第二磨削層12，於此不再贅述。此外，除了控制每次複合電沉積加工之加工時間或加工電流，亦可控制每次複合電沉積加工所使用之電沉積液內的該些研磨粒之粒徑大小，使第一磨削層11之單位面積的磨削加工量不同於第二磨削層12之單位面積的磨削加工量，例如：欲使第一磨削層11之單位面積的磨削加工量小於第二磨削層12之單位面積的磨削加工量，所以第一磨削層11所使用之電沉積液內的該些第一研磨粒112之粒徑必須小於形成第二磨削層12，因此可用不同槽體內具有不同粒徑研磨粒之電沉積液，以分別電沉積形成第一磨削層11及第二磨削層12，如此在大粒徑之電沉積電流大於小粒徑之電沉積電流。
請一併參閱第四A及四B圖，係本發明之第一實施例之A-A’方向及B-B’方向(第二圖)之剖面圖。如圖所示，本實施例之工具載體10的第一加工部1011與第二加工部1012係呈階梯狀，即第二加工部1012之橫向截面積小於第一加工部1011之橫向截面積(參閱第四B圖，圖中只繪製位於第一加工部1011之第一磨削層11及位於第二加工部1012之第二磨削層12的橫向截面，以便於比對兩者之橫向截面積)。從第四A圖可知，第二磨削層12覆蓋於第一磨削層11，復參閱第三圖，其主要於執行步驟S12以形成第一磨削層11於第一加工部1011時，更形成第一磨削層11於第二加工部1012之表面，而執行步驟S14時，第二磨削層12會形成於位於第二加工部1012之第一磨削層11的表面。
再參閱第五A及五B圖，係本發明之第一實施例之使用狀態圖。如圖所示，本實施例之磨削工具1主要用於磨削經放電加工後之穿孔21(形成於一加工件2)，因經過放電加工後之穿孔21係無法達到所要求的精度，例如欲成形之穿孔21為相同直徑之圓形穿孔，而放電加工所形成之穿孔21的內壁係相對穿孔21之中心向內傾斜，而並未與加工件2之表面呈垂直，即穿孔21的截面形狀呈錐狀，所以並未達到所預計的精度，因此必須透過磨削加工穿孔21的內壁，使其與加工件2之表面呈垂直，且穿孔21的截面形狀為圓形，所以本實施例之磨削工具1之工具載體10呈棒狀，其橫向截面之形狀為圓形，即第一加工部1011及第二加工部1012之橫向截面之形狀皆為圓形，如此形成於第一加工部1011之第一磨削層11及形成於第二加工部1012之第二磨削層12方能沿著穿孔21的內壁作磨削加工。
然，第二加工部1012先進入穿孔21內，而工具載體10會被帶動旋轉且同時被往穿孔21送進，而對穿孔21的內壁作粗加工(即磨削加工，參閱第五A圖)，因第二磨削層12之單位面積的磨削加工量大於第一磨削層11之單位面積的磨削加工量，所以第二磨削層12對穿孔21的內壁之磨削量較大，可先將穿孔21之內壁磨削成與加工件2表面垂直，而穿孔21之內徑接近預計的內徑要求。
當使用第二磨削層12對穿孔21完成修整後，再進一步進給旋轉之第一加工部1011至穿孔21內(參閱第五B圖)，以對穿孔21的內壁作精加工，因第一磨削層11之單位面積的磨削加工量小於第二磨削層12之單位面積的磨削加工量，所以第一磨削層11對穿孔21的內壁之磨削量較小，而對穿孔21之內壁作表面處理，以降低穿孔21之內壁的表面粗度，使穿孔21之內壁達到高表面品質，又可達到高形狀精度，且修整穿孔21的內徑到預計的內徑要求。
所以於此實施態樣中明顯可知，本實施例之磨削工具1可同時作粗加工及精加工，而且於磨削過程中無須更換磨削工具，如此減少更換磨削工具必須重新對位之問題產生。而本實施例之磨削工具1之第一加工部1011及第二加工部1012係與工具載體10一體成型，第一加工部1011及第二加工部1012串接於工具載體10。另本實施例之磨削工具1僅設置兩個加工部，當然磨削工具1可設置兩個以上之加工部，於相同加工線速度下每一加工部之磨削層的單位面積之磨削加工量可不同，且每一加工部可相互串接，並串接於工具載體10。若利用電沉積加工製作磨削工具1時，磨削層之單位面積的磨削加工量可依據形成磨削層之時間或加工電流而控制，如此可依據使用者之需求設定磨削層之磨削加工量，並控制形成磨削層之時間或加工電流形成磨削層，並使磨削層之磨削加工量符合使用者之需求。而使用者有多種磨削程度可選擇，以使加工件達到高形狀精度及高表面品質。
然上述揭露磨削工具1可用於磨削圓形穿孔21，當然穿孔21之截面形狀改變成正方形、三角形或任何幾何形狀(即異形孔)，磨削工具1之橫向截面形狀可隨穿孔21之截面形狀而改變。或者以與穿孔21之截面形狀相似，如此即可沿著穿孔21之內壁作磨削加工，所以磨削工具1之橫向截面形狀可為正方形、三角形或幾何形狀，以對非圓形之穿孔21(即異形孔)進行磨削加工。
請參閱第六圖，係本發明之第一實施例之另一使用狀態圖。如圖所示，本實施例之磨削工具1除了磨削穿孔之外，亦可修整加工件2之邊緣，加工件2之邊緣於前處理時產生毛邊、加工件2之邊緣傾斜或者欲改變加工件2之形狀，皆可透過本實施例磨削工具1沿著加工件2之邊緣作旋轉運動，以磨削加工件2，進而修整加工件2之邊緣或形狀，並分別執行粗加工與精加工。因此可知，本發明之磨削工具1可應用於多方面之磨削加工，而具有多加工用途，而並非僅能用於磨削孔洞。
請參閱第七圖及第八A至八C圖，係本發明之第二實施例之剖面圖及使用狀態圖。如圖所示，本實施例與上述實施例不同在於，本實施例之磨削工具1更具有一導電部10131，導電部10131可直接形成於工具載體10之第二加工部1012或者位於第二加工部1012下方之加工部。而本實施例之導電部10131係以形成於位於第二加工部1012下方之一第三加工部1013為例進行說明，復參閱第三圖，當執行步驟S12時，第一磨削層11形成於工具載體10之所有加工部，即形成於第一加工部1011、第二加工部1012及第三加工部1013。然後執行步驟S14時，第二磨削層12形成於位於第二加工部1012及第三加工部1013之第一磨削層11，最後僅須去除位於第三加工部1013之第一磨削層11及第二磨削層12，以形成導電部10131於第三加工部1013，且導電部10131位在第二加工部1012之第一磨削層11與第二磨削層12的下方，即位於工具載體10的最末端。導電部10131之橫向截面積等於或小於第二加工部1012的橫向截面積。而本實施例係以導電部10131之橫向截面積等於第二加工部1012之橫向截面積為例。當然本實施例之工具載體10也可不設置第三加工部1013，直接去除第二加工部1012之部分第一磨削層11及第二磨削層12而形成導電部10131於第二加工部1012之末端，於此不再贅述。
當為加工一穿孔時，此導電部10131係可利用本身與工件產生導電之方法及三點(或多點)定位圓心之方式以定位該磨削工具1於預加工之穿孔圓心上，因導電部10131之中心與第一加工部1011及第二加工部1012之中心於一直線上，所以導電部10131完成定位後，使第一加工部1011及第二加工部1012之中心亦對準穿孔21之中心。而導電部10131主要利用三點定位方式進行定位，當導電部10131與穿孔21之側壁的接觸時，導電部10131產生一電訊號，並傳送電訊號至後端的一定位裝置(圖未示)，定位裝置依據電訊號定位導電部10131，進而完成磨削工具1之定位(請參閱八A圖)，然後接著利用位於第二加工部1012之第二磨削層12對穿孔21作粗加工(請參閱八B圖)，最後利用位於第一加工部1011之第一磨削層11對穿孔21作精加工(請參閱八C圖)，如此從穿孔21形成至完成磨削修整皆使用同一工具，省略更換放電加工之工具電極為磨削工具之過程，進而免除磨削工具1對位穿孔之步驟，於使用上更為便利，最重要的是不需要重新對位，所以完全可以避免對位誤差，而提高磨削加工的品質。
綜上所述，本發明提供一種磨削工具，其具有位於第一加工部之第一磨削層及位於第二加工部之第二磨削層，而於第一磨削層第一磨削層及第二磨削層之磨削加工量不同，即表示可對加工件同時作不同程度之磨削加工，於磨削過程無須更換磨削工具，如此省略更換磨削工具及磨削工具對位之過程，大幅提升使用上之便利性，並提升磨削效率，進而使經磨削加工後之加工件達到高形狀精度及高表面品質之需求。此外，本發明之磨削工具的製作方法簡單，也可以依據使用者需求製作。
In order to provide a better understanding and understanding of the structural features and the efficiencies of the present invention, the preferred embodiments and the detailed description are described as follows:
Conventional grinding tools can not rough and finish the workpiece at the same time. Different grinding tools must be replaced. When the grinding tool is replaced, the workpiece must be realigned, which makes the use inconvenient and easy because of the alignment. Accurate and affect the processing quality of the workpiece, which will increase the cost and reduce the processing efficiency. Therefore, the present invention provides a grinding tool which can rough and finish the workpiece at the same time without replacing the grinding tool, so that the problem of realignment is not caused, the convenience in use is improved, and the grinding can be improved. The rate and the error caused by the alignment are reduced, so that the workpiece after grinding can meet the requirements of high shape accuracy and high surface quality.
Please refer to the second and third figures, which are structural diagrams and flowcharts of the first embodiment of the present invention. As shown in the figure, the present embodiment provides a grinding tool 1 which is firstly executed in step S10 to prepare a tool carrier 10. The tool carrier 10 has a first processing portion 1011 and a second processing portion 1012. The processed portion 1012 is adjacent to the first processed portion 1011, and the second processed portion 1012 is located below the first processed portion 1011. Next, in step S12, the first processing portion 1011 of the tool carrier 10 performs a composite electrodeposition process to form a first grinding layer 11 on the first processing portion 1011 (the first processing portion 1011 and the second processing portion 1012 have both First grinding layer 11). Finally, in step S14, the second processing part 1012 of the tool carrier 10 performs a composite electrodeposition process to form a second grinding layer 12 on the second processing part 1012 (at this time, the first grinding on the second processing part 1012). The layer 11 is forming a second grinding layer 12). The grinding tool 1 of the present embodiment is formed by the above manufacturing method.
The first grinding layer 11 and the second grinding layer 12 of the present embodiment are respectively formed on the first processed portion 1011 and the second processed portion 1012 of the tool carrier 10 by a composite electrodeposition processing method, and are used for composite electrodeposition processing. The electrodeposition liquid contains ions to be plated with metal (for example, nickel ions) and a plurality of abrasive grains (for example, diamonds). When the first processing portion 1011 of the tool carrier 10 is subjected to composite electrodeposition processing (step S12), the first fixing layer 111 is formed while the abrasive grains 112 are simultaneously fitted thereon to form the first grinding layer. 11 is on the first processing portion 1011. Then, when the second processed portion 1012 of the tool carrier 10 is subjected to composite electrodeposition processing (step S14), the second grinding layer 12 is formed in the second processed portion 1012 as described above.
The grinding tool 1 of the embodiment can rotate the tool 1 or reciprocate up and down in use to grind the surface of a workpiece. When the grinding process is mainly performed by rotating the grinding tool 1 When the cutting layer 11 and the second grinding layer 12 respectively generate a processing linear velocity, the first abrasive grains 112 of the first grinding layer 11 and the second abrasive grains 122 of the second grinding layer 12 are respectively generated. That is, the workpiece is ground by the processing line speed of the tool 1. The grinding tool 1 of the present invention grinds the workpiece by the first grinding layer 11 and the second grinding layer 12, respectively. When the first grinding layer 11 and the second grinding layer 12 respectively grind the workpiece, the rotation speed of the grinding tool 1 is separately controlled, and the first grinding layer 11 and the second grinding layer 12 are used. Under the same processing line speed, the grinding amount per unit area of the first grinding layer 11 is different from the grinding amount per unit area of the second grinding layer 12 under the grinding process of the workpiece.
In this embodiment, the distribution density of the first abrasive grains 112 per unit area of the first grinding layer 11 is different from the distribution density of the second abrasive grains 122 per unit area of the second grinding layer 12, and The grinding amount per unit area of the first grinding layer 11 is different from the grinding amount per unit area of the second grinding layer 12, so that the first grinding layer 11 and the second grinding layer 12 can be processed separately Parts are ground to varying degrees.
The grinding amount per unit area of the first grinding layer 11 of the present embodiment is smaller than the grinding amount per unit area of the second grinding layer 12, that is, the grinding amount per unit area of the second grinding layer 12. The distribution density of the particles 122 is low, so that the second abrasive grains 122 per unit area of the second grinding layer 12 are sparsely arranged, so that the contact area of each of the second abrasive grains 122 and the workpiece is large and can be ground. The material having a large number of workpieces has a large amount of grinding processing, that is, the second grinding layer 12 located at the second processing portion 1012 can roughen the workpiece; and relatively, the first grinding layer 11 is also indicated. The distribution density of the first abrasive grains 112 per unit area is high, so the first abrasive grains 112 per unit area of the first grinding layer 11 are densely arranged, so each first abrasive grain 112 and processing The contact area of the piece is small, and the material with less workpiece can be ground to have a smaller amount of grinding, that is, the first grinding layer 11 of the first processed portion 1012 can finish the workpiece.
The distribution density of the first abrasive grains 112 per unit area of the first grinding layer 11 and the second abrasive grains 122 of the second grinding layer 12 are different, and the embodiment mainly controls the compounding each time. The processing time of the electrodeposition processing or the processing current is determined. For example, referring to the third figure, when step S12 is performed, the first processing portion 1011 of the tool carrier 10 is subjected to composite electrodeposition processing for a first predetermined time to form the first grinding layer 11 in the first processing portion. 1011. When step S14 is performed, the second processing portion 1012 of the tool carrier 10 is subjected to composite electrodeposition processing for a second predetermined time to form the second grinding layer 12 at the second processing portion 1012. The first predetermined time is different from the second predetermined time, and the deposition amount of the second abrasive particles 122 per unit area of the first abrasive grain 112 and the second grinding layer 12 per unit area of the first grinding layer 11 The distribution density of the second abrasive grains 122 per unit area of the first abrasive grains 112 and the second grinding layer 12 per unit area of the first grinding layer 11 is different. When the first predetermined time is greater than the second predetermined time, the number of the first abrasive particles 112 per unit area of the first grinding layer 11 may be greater than the second abrasive particles 122 per unit area of the second grinding layer 12 The number of the first abrasive grains 112 per unit area of the first grinding layer 11 formed by the first processing portion 1011 is increased, and the first abrasive particles 112 are applied to the first grinding layer. The unit area of 11 is densely arranged such that the density of the unit area of the first abrasive grains 112 distributed over the first grinding layer 11 is high. The number of the second abrasive grains 122 per unit area of the second grinding layer 12 formed by the second processing portion 1012 is small, and the second abrasive particles 122 are disposed in the unit of the second grinding layer 12. The areas are sparsely arranged such that the density of the second abrasive grains 122 distributed over the unit area of the second grinding layer 12 is low.
The above-mentioned control current for controlling the composite electrodeposition processing may also control the second abrasive grains 122 per unit area of the first abrasive grains 112 and the second grinding layer 12 per unit area of the first grinding layer 11 . Distribution density. For example, in a state where a first machining current is applied, step S12 is performed, and in a state where a second machining current is applied, step S14 is performed, wherein the first machining current and the second machining current are applied to the tool carrier 10. The first machining current is different from the second machining current to control the first abrasive particles 112 per unit area deposited on the first grinding layer 11 and the second polishing portions per unit area deposited on the second grinding layer 12 The number of granules 122. When the first machining current is greater than the second machining current, the number of the first abrasive particles 112 per unit area of the first grinding layer 11 is greater than the number of the abrasive particles 122 per unit area of the second grinding layer 12, That is, the distribution density of the first abrasive grains 112 per unit area of the first grinding layer 11 is greater than the distribution density of the second abrasive grains 122 per unit area of the second grinding layer 12, or the electrodeposition time is lengthened. The distribution density of the first abrasive particles 112 can also be increased.
It can be seen from the above that the grinding tool 1 of the embodiment can simultaneously grind the workpiece to different degrees, that is, the workpiece can be roughed and finished at the same time, and no other grinding tools need to be replaced during the grinding process. Increase the convenience of use. The prior art is easy to affect the processing quality of the workpiece due to inaccurate alignment, and even the workpiece becomes a defective product and needs to be eliminated, which increases the cost and reduces the processing efficiency. However, the grinding tool 1 of the present invention does not need to replace other grinding. The tool is cut, so that the problems of the above-mentioned conventional techniques can be effectively solved. In the above, the grinding processing amount per unit area of the first grinding layer 11 is smaller than the grinding processing amount per unit area of the second grinding layer 12, and of course, the grinding processing per unit area of the first grinding layer 11 is performed. The amount of grinding may be greater than the amount of grinding per unit area of the second grinding layer 12, and will not be described herein.
The above embodiment discloses that the first grinding layer 11 and the second grinding layer 12 are formed by a composite electrodeposition processing method. However, the first grinding layer 11 and the second grinding layer 12 may be formed by other methods in the present invention. No longer. In addition, in addition to controlling the processing time or processing current of each composite electrodeposition process, the particle size of the abrasive grains in the electrodeposition liquid used in each composite electrodeposition process can be controlled to make the first grinding layer 11 The amount of grinding per unit area is different from the amount of grinding per unit area of the second grinding layer 12, for example, the amount of grinding per unit area of the first grinding layer 11 is smaller than that of the second grinding layer 12 The grinding amount per unit area, so the first abrasive grains 112 in the electrodeposition liquid used in the first grinding layer 11 must have a smaller particle diameter than the second grinding layer 12, and thus can be used in different grooves. The electrodeposition liquid of the abrasive grains of different particle sizes is separately electrodeposited to form the first grinding layer 11 and the second grinding layer 12, such that the electrodeposition current at a large particle diameter is larger than the electrodeposition current of the small particle diameter.
Please refer to the fourth and fourth B drawings, which are cross-sectional views of the A-A' direction and the BB' direction (second drawing) of the first embodiment of the present invention. As shown in the figure, the first processed portion 1011 and the second processed portion 1012 of the tool carrier 10 of the present embodiment are stepped, that is, the transverse cross-sectional area of the second processed portion 1012 is smaller than the transverse cross-sectional area of the first processed portion 1011 ( Referring to FIG. 4B, only the transverse section of the first grinding layer 11 at the first processing portion 1011 and the second grinding layer 12 at the second processing portion 1012 are drawn so as to compare the transverse sections of the two. area). It can be seen from the fourth A diagram that the second grinding layer 12 covers the first grinding layer 11 and refers to the third figure, which is mainly when the step S12 is performed to form the first grinding layer 11 on the first processing portion 1011. The first grinding layer 11 is further formed on the surface of the second processed portion 1012, and when the step S14 is performed, the second grinding layer 12 is formed on the surface of the first grinding layer 11 of the second processed portion 1012.
Referring again to Figures 5A and 5B, there is shown a state of use of the first embodiment of the present invention. As shown in the figure, the grinding tool 1 of the present embodiment is mainly used for grinding the through-hole 21 after the electric discharge machining (formed in a workpiece 2), and the perforation 21 after the electric discharge machining cannot achieve the required precision. For example, the perforations 21 to be formed are circular perforations of the same diameter, and the inner walls of the perforations 21 formed by the electric discharge machining are inclined inwardly with respect to the center of the perforations 21, and are not perpendicular to the surface of the workpiece 2, that is, the perforations 21 Since the cross-sectional shape is tapered, the accuracy is not achieved. Therefore, the inner wall of the perforation 21 must be ground by grinding to be perpendicular to the surface of the workpiece 2, and the cross-sectional shape of the perforation 21 is circular. The tool carrier 10 of the grinding tool 1 of the present embodiment has a rod shape, and the shape of the transverse cross section is circular, that is, the shape of the transverse cross section of the first processed portion 1011 and the second processed portion 1012 is circular, thus being formed in The first grinding layer 11 of the first processed portion 1011 and the second grinding layer 12 formed at the second processed portion 1012 can be ground along the inner wall of the through hole 21.
However, the second processing portion 1012 first enters the through hole 21, and the tool carrier 10 is rotated and simultaneously fed into the through hole 21, and the inner wall of the through hole 21 is roughed (ie, grounded, see fifth A). In the drawing, since the grinding amount per unit area of the second grinding layer 12 is larger than the grinding amount per unit area of the first grinding layer 11, the second grinding layer 12 grinds the inner wall of the perforation 21 The larger the amount, the inner wall of the perforation 21 can be first ground perpendicular to the surface of the workpiece 2, and the inner diameter of the perforation 21 is close to the expected inner diameter requirement.
After the through hole 21 is trimmed using the second grinding layer 12, the rotated first processed portion 1011 is further fed into the through hole 21 (see FIG. 5B) to finish the inner wall of the through hole 21, because The amount of grinding per unit area of the first grinding layer 11 is smaller than the amount of grinding per unit area of the second grinding layer 12, so that the first grinding layer 11 has a smaller amount of grinding of the inner wall of the perforation 21, The inner wall of the perforation 21 is surface-treated to reduce the surface roughness of the inner wall of the perforation 21, so that the inner wall of the perforation 21 achieves high surface quality, and high shape precision can be achieved, and the inner diameter of the perforation 21 is trimmed to the expected Inner diameter requirements.
Therefore, it is apparent in this embodiment that the grinding tool 1 of the embodiment can be used for roughing and finishing at the same time, and the grinding tool does not need to be replaced during the grinding process, so that the replacement of the grinding tool must be realigned. The problem arises. On the other hand, the first processed portion 1011 and the second processed portion 1012 of the grinding tool 1 of the present embodiment are integrally formed with the tool carrier 10, and the first processed portion 1011 and the second processed portion 1012 are connected in series to the tool carrier 10. In addition, the grinding tool 1 of the present embodiment is provided with only two processing portions. Of course, the grinding tool 1 can be provided with two or more processing portions for grinding the unit area of the grinding layer of each processing portion at the same processing linear velocity. The processing amount can be different, and each processing portion can be connected in series with each other and connected in series to the tool carrier 10. When the grinding tool 1 is produced by electrodeposition processing, the grinding amount per unit area of the grinding layer can be controlled according to the time of forming the grinding layer or the machining current, so that the grinding layer can be set according to the needs of the user. The amount of cutting is controlled, and the time for forming the grinding layer or the machining current is controlled to form a grinding layer, and the grinding amount of the grinding layer is made to meet the needs of the user. The user has a variety of grinding levels to achieve high shape accuracy and high surface quality.
However, it is disclosed above that the grinding tool 1 can be used to grind the circular perforations 21, of course, the cross-sectional shape of the perforations 21 is changed to a square, a triangle or any geometric shape (ie, a shaped hole), and the transverse cross-sectional shape of the grinding tool 1 can follow the perforation 21 Change in cross-sectional shape. Or similar to the cross-sectional shape of the perforation 21, so that the inner wall of the perforation 21 can be ground, so that the transverse cross-sectional shape of the grinding tool 1 can be square, triangular or geometric to perforate the non-circular shape. 21 (ie shaped hole) is ground.
Please refer to the sixth figure, which is another use state diagram of the first embodiment of the present invention. As shown in the figure, in addition to grinding the perforations, the grinding tool 1 of the present embodiment can also trim the edge of the workpiece 2. The edge of the workpiece 2 is burred during the pre-treatment, the edge of the workpiece 2 is inclined or is to be changed. The shape of the workpiece 2 can be rotated by the grinding tool 1 along the edge of the workpiece 2 to grind the workpiece 2, thereby trimming the edge or shape of the workpiece 2, and performing roughing and respectively. finishing. Therefore, it can be seen that the grinding tool 1 of the present invention can be applied to various aspects of grinding processing, and has multiple processing uses, and is not only capable of grinding holes.
7 and 8A to 8C are cross-sectional views and state of use diagrams of a second embodiment of the present invention. As shown in the figure, the embodiment is different from the above embodiment in that the grinding tool 1 of the embodiment further has a conductive portion 10131. The conductive portion 10131 can be directly formed on the second processing portion 1012 of the tool carrier 10 or in the second. a processed portion below the processed portion 1012. The conductive portion 10131 of the present embodiment is described as an example of the third processed portion 1013 formed under the second processed portion 1012. Referring to the third figure, when the step S12 is performed, the first grinding layer 11 is formed. All of the processed portions of the tool carrier 10 are formed in the first processed portion 1011, the second processed portion 1012, and the third processed portion 1013. Then, when step S14 is performed, the second grinding layer 12 is formed on the first grinding layer 11 located in the second processing portion 1012 and the third processing portion 1013, and finally only the first grinding layer located in the third processing portion 1013 has to be removed. 11 and the second grinding layer 12 to form the conductive portion 10131 in the third processed portion 1013, and the conductive portion 10131 is located below the first grinding layer 11 and the second grinding layer 12 of the second processed portion 1012, that is, Located at the very end of the tool carrier 10. The lateral cross-sectional area of the conductive portion 10131 is equal to or smaller than the lateral cross-sectional area of the second processed portion 1012. In this embodiment, the lateral cross-sectional area of the conductive portion 10131 is equal to the lateral cross-sectional area of the second processed portion 1012. Of course, the tool carrier 10 of the embodiment may not be provided with the third processing portion 1013, and the first grinding layer 11 and the second grinding layer 12 of the second processing portion 1012 may be directly removed to form the conductive portion 10131 in the second processing portion 1012. The end of this is not repeated here.
When a perforation is processed, the conductive portion 10131 can position the grinding tool 1 on the pre-machined perforation center by means of a method of self-conducting with the workpiece and three points (or multiple points) to locate the center of the hole. The center of the portion 10131 is aligned with the center of the first processed portion 1011 and the second processed portion 1012. Therefore, after the conductive portion 10131 is positioned, the centers of the first processed portion 1011 and the second processed portion 1012 are also aligned with the through holes 21 center. The conductive portion 10131 is mainly positioned by using a three-point positioning method. When the conductive portion 10131 is in contact with the sidewall of the through hole 21, the conductive portion 10131 generates an electrical signal and transmits a signal to a positioning device (not shown) at the rear end. The positioning device positions the conductive portion 10131 according to the electric signal, thereby completing the positioning of the grinding tool 1 (refer to FIG. 8A), and then roughing the through hole 21 by using the second grinding layer 12 located at the second processing portion 1012 (please Referring to FIG. 8B), the perforation 21 is finally finished by the first grinding layer 11 located at the first processing portion 1011 (refer to FIG. 8C), so that the same tool is used from the formation of the through hole 21 to the completion of the grinding and dressing. The process of replacing the tool electrode of the electric discharge machining is the process of grinding the tool, thereby eliminating the step of the perforation of the grinding tool 1 in the alignment, which is more convenient in use, and most importantly, no realignment is required, so the alignment error can be completely avoided. And improve the quality of grinding processing.
In summary, the present invention provides a grinding tool having a first grinding layer at a first processing portion and a second grinding layer at a second processing portion, and first grinding at the first grinding layer. The grinding amount of the layer and the second grinding layer is different, which means that the workpiece can be ground to different degrees at the same time, and the grinding tool does not need to be replaced during the grinding process, so the replacement of the grinding tool and the grinding tool pair is omitted. The process of positioning greatly enhances the convenience of use and improves the grinding efficiency, so that the workpiece after grinding has high shape precision and high surface quality. In addition, the grinding tool of the present invention is simple to manufacture and can be made according to user requirements.
1’．．．工具電極1'. . . Tool electrode
2’．．．工件2'. . . Workpiece
21’．．．穿孔twenty one'. . . perforation
1．．．磨削工具1. . . Grinding tool
10．．．工具載體10. . . Tool carrier
1011．．．第一加工部1011. . . First processing department
1012．．．第二加工部1012. . . Second processing department
1013．．．第三加工部1013. . . Third processing department
10131．．．導電部10131. . . Conductive part
11．．．第一磨削層11. . . First grinding layer
111．．．第一固著層111. . . First fixation layer
112．．．第一研磨粒112. . . First abrasive grain
12．．．第二磨削層12. . . Second grinding layer
121．．．第二固著層121. . . Second fixation layer
122．．．第二研磨粒122. . . Second abrasive grain
2．．．加工件2. . . Machined parts
21．．．穿孔twenty one. . . perforation
第一圖係為習知放電加工之示意圖；
第二圖係為本發明之第一實施例之結構圖；
第三圖係為本發明之第一實施例之流程圖；
第四A及四B圖係為本發明之第一實施例之剖面圖；
第五A及五B圖係為本發明之第一實施例之使用狀態圖；
第六圖係為本發明之第一實施例之另一使用狀態圖；
第七圖係為本發明之第二實施例之剖面圖；以及
第八A至八C圖係為本發明之第二實施例之使用狀態圖。
The first figure is a schematic diagram of conventional electrical discharge machining;
The second drawing is a structural view of the first embodiment of the present invention;
The third drawing is a flow chart of the first embodiment of the present invention;
4A and 4B are cross-sectional views of the first embodiment of the present invention;
The fifth and fifth B diagrams are diagrams of the use state of the first embodiment of the present invention;
Figure 6 is another use state diagram of the first embodiment of the present invention;
The seventh drawing is a cross-sectional view of a second embodiment of the present invention; and the eighth through eighth embodiments are diagrams showing the state of use of the second embodiment of the present invention.
1．．．磨削工具1. . . Grinding tool
10．．．工具載體10. . . Tool carrier
1011．．．第一加工部1011. . . First processing department
1012．．．第二加工部1012. . . Second processing department
11．．．第一磨削層11. . . First grinding layer
111．．．第一固著層111. . . First fixation layer
112．．．第一研磨粒112. . . First abrasive grain
12．．．第二磨削層12. . . Second grinding layer
121．．．第二固著層121. . . Second fixation layer
122．．．第二研磨粒122. . . Second abrasive grain
Claims (10)
一工具載體，具有一第一加工部及一第二加工部，該第二加工部位於該第一加工部之下方；
一第一磨削層，設置於該第一加工部；以及
一第二磨削層，設置於該第二加工部；
其中，於該第一磨削層與該第二磨削層之加工線速度相同之下，該第一磨削層之單位面積的磨削加工量不同於該第二磨削層之單位面積的磨削加工量。A grinding tool comprising:
a tool carrier having a first processing portion and a second processing portion, the second processing portion being located below the first processing portion;
a first grinding layer is disposed on the first processing portion; and a second grinding layer is disposed on the second processing portion;
Wherein, under the same processing linear velocity of the first grinding layer and the second grinding layer, the grinding amount per unit area of the first grinding layer is different from the unit area of the second grinding layer Grinding processing volume.
一固著層，設置於該工具載體；以及
複數研磨粒，固著於該固著層上；
其中該第一磨削層之單位面積的該些研磨粒的排列密度大於該第二磨削層之單位面積的該些研磨粒的排列密度。The grinding tool of claim 1, wherein the first grinding layer and the second grinding layer respectively comprise:
a fixing layer disposed on the tool carrier; and a plurality of abrasive grains fixed to the fixing layer;
The arrangement density of the abrasive grains per unit area of the first grinding layer is greater than the arrangement density of the abrasive grains per unit area of the second grinding layer.
一固著層，設置於該工具載體；以及
複數研磨粒，固著於該固著層上；
其中該第一磨削層之該些研磨粒之粒徑小於該第二磨削層的該些研磨粒之粒徑。The grinding tool of claim 1, wherein the first grinding layer and the second grinding layer respectively comprise:
a fixing layer disposed on the tool carrier; and a plurality of abrasive grains fixed to the fixing layer;
The particle size of the abrasive grains of the first grinding layer is smaller than the particle size of the abrasive grains of the second grinding layer.
一導電部，位於該第二磨削層之下方，其中該導電部之橫向截面積等於或小於該第二加工部的橫向截面積。For example, the grinding tool described in claim 1 of the patent scope further includes:
a conductive portion located below the second grinding layer, wherein the conductive portion has a transverse cross-sectional area equal to or smaller than a transverse cross-sectional area of the second processed portion.
提供一工具載體，該工具載體具有一第一加工部及一第二加工部，該第二加工部位於該第一加工部之下方；
形成一第一磨削層於該第一加工部；以及
形成一第二磨削層於該第二加工部；
其中，於該第一磨削層與該第二磨削層之加工線速度相同之下，該第一磨削層之單位面積的磨削加工量不同於該第二磨削層之單位面積的磨削加工量。A method for manufacturing a grinding tool, comprising:
Providing a tool carrier having a first processing portion and a second processing portion, the second processing portion being located below the first processing portion;
Forming a first grinding layer on the first processing portion; and forming a second grinding layer in the second processing portion;
Wherein, under the same processing linear velocity of the first grinding layer and the second grinding layer, the grinding amount per unit area of the first grinding layer is different from the unit area of the second grinding layer Grinding processing volume.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100149697A TW201325823A (en) | 2011-12-30 | 2011-12-30 | Grinding tool and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100149697A TW201325823A (en) | 2011-12-30 | 2011-12-30 | Grinding tool and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201325823A true TW201325823A (en) | 2013-07-01 |
| TWI476074B TWI476074B (en) | 2015-03-11 |
Family
ID=49224659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100149697A TW201325823A (en) | 2011-12-30 | 2011-12-30 | Grinding tool and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW201325823A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107243847A (en) * | 2017-07-20 | 2017-10-13 | 江苏苏北砂轮厂有限公司 | A kind of cylindrical mounted point of trough of belt |
| CN113613841A (en) * | 2019-03-28 | 2021-11-05 | 住友电气工业株式会社 | Cutting tool and method for manufacturing optical fiber preform |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH079349A (en) * | 1993-06-30 | 1995-01-13 | Nachi Fujikoshi Corp | Compound abrasive grain tool |
| JPH10223613A (en) * | 1997-02-10 | 1998-08-21 | Mitsubishi Materials Corp | Formation of narrow through hole of silicon electrode plate for plasma etching |
-
2011
- 2011-12-30 TW TW100149697A patent/TW201325823A/en unknown
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107243847A (en) * | 2017-07-20 | 2017-10-13 | 江苏苏北砂轮厂有限公司 | A kind of cylindrical mounted point of trough of belt |
| CN113613841A (en) * | 2019-03-28 | 2021-11-05 | 住友电气工业株式会社 | Cutting tool and method for manufacturing optical fiber preform |
| CN113613841B (en) * | 2019-03-28 | 2024-03-26 | 住友电气工业株式会社 | Cutting tool and method for manufacturing optical fiber preform |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI476074B (en) | 2015-03-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102303221B (en) | Method for processing female die with large square hole | |
| CN102357688B (en) | Electrical discharge machining method of die inserted block for forming microstructure | |
| CN100402232C (en) | Carbide alloy metal saw production process | |
| CN102501152A (en) | Integrated superfine, precise and mirror grinding method for surface of micro-structural array | |
| JP7061371B2 (en) | Machine parts and their applications in cutting | |
| CN103302367B (en) | A kind of external spiral structure sinker electric discharge machining method | |
| WO2019237910A1 (en) | Rough-and-fine integrated progressive grinding method for non-slewing optical array | |
| CN103991039A (en) | Method for machining rotor of screw compressor through formation CBN grinding wheel | |
| CN103192127B (en) | Based on the clip type form cutter dish of B2 type diamond coatings blade | |
| CN102350533A (en) | Small ball-end milling cutter for finish machining | |
| JP2016112678A (en) | Diamond sintered compact ball end mill and manufacturing method therefor | |
| CN105478925A (en) | Improved technology for machining thread ring gages | |
| CN113953988B (en) | Grinding wheel with controllable abrasive particle spacing and ordered arrangement and preparation method thereof | |
| US10232491B2 (en) | Retruing of a grinding wheel using EDM machine | |
| CN103769960B (en) | A kind of manufacture method with the ball cutter of micro-cutting sword array structure | |
| CN103991040A (en) | Method for machining engine valve molding CBN grinding wheel | |
| CN102152193B (en) | Method for grinding superhard mini-hemispheric coupling parts | |
| CN101323083A (en) | Technique for preparing machine holding carbide alloy rack type gear shaper cutter | |
| TW201325823A (en) | Grinding tool and manufacturing method thereof | |
| Yan et al. | Fabrication of polycrystalline diamond wheels by micro wire-EDM using a novel pulse generator | |
| CN104475887A (en) | Electric spark grinding machining method for low-rigidity circular conical surface rod part | |
| CN105108251B (en) | A kind of combined machining method of micro-mould | |
| EP3463732A1 (en) | Retruing of a grinding wheel using edm machine | |
| CN112676766B (en) | Efficient machining method for titanium alloy shell parts based on zero programming | |
| CN113263401A (en) | Machining method of punch spare parts |