TW201318922A - Method for preventing pack-out in pumping system - Google Patents
Method for preventing pack-out in pumping system Download PDFInfo
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- TW201318922A TW201318922A TW101133545A TW101133545A TW201318922A TW 201318922 A TW201318922 A TW 201318922A TW 101133545 A TW101133545 A TW 101133545A TW 101133545 A TW101133545 A TW 101133545A TW 201318922 A TW201318922 A TW 201318922A
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- Prior art keywords
- pump
- heater
- pumping
- mixed
- period
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- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000005086 pumping Methods 0.000 title claims abstract description 27
- 239000000463 material Substances 0.000 claims abstract description 51
- 239000012943 hotmelt Substances 0.000 claims abstract description 30
- 230000000694 effects Effects 0.000 claims abstract description 11
- 238000012544 monitoring process Methods 0.000 claims abstract description 5
- 239000000155 melt Substances 0.000 claims abstract 2
- 238000004891 communication Methods 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 9
- 230000003213 activating effect Effects 0.000 claims description 2
- 239000000203 mixture Substances 0.000 description 50
- 239000012530 fluid Substances 0.000 description 39
- 239000007788 liquid Substances 0.000 description 12
- 239000004831 Hot glue Substances 0.000 description 11
- 239000002245 particle Substances 0.000 description 11
- 239000011344 liquid material Substances 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000003463 adsorbent Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000011859 microparticle Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 239000011343 solid material Substances 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 239000012768 molten material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B15/00—Pumps adapted to handle specific fluids, e.g. by selection of specific materials for pumps or pump parts
- F04B15/02—Pumps adapted to handle specific fluids, e.g. by selection of specific materials for pumps or pump parts the fluids being viscous or non-homogeneous
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B23/00—Pumping installations or systems
- F04B23/02—Pumping installations or systems having reservoirs
- F04B23/025—Pumping installations or systems having reservoirs the pump being located directly adjacent the reservoir
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B49/00—Control, e.g. of pump delivery, or pump pressure of, or safety measures for, machines, pumps, or pumping installations, not otherwise provided for, or of interest apart from, groups F04B1/00 - F04B47/00
- F04B49/06—Control using electricity
- F04B49/065—Control using electricity and making use of computers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B53/00—Component parts, details or accessories not provided for in, or of interest apart from, groups F04B1/00 - F04B23/00 or F04B39/00 - F04B47/00
- F04B53/08—Cooling; Heating; Preventing freezing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1042—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material provided with means for heating or cooling the liquid or other fluent material in the supplying means upstream of the applying apparatus
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B2201/00—Pump parameters
- F04B2201/02—Piston parameters
- F04B2201/0201—Position of the piston
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Coating Apparatus (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Loading And Unloading Of Fuel Tanks Or Ships (AREA)
Abstract
Description
本發明一般而言係關於用於熱熔材料之泵送系統,諸如用以施配封裝中所使用之黏合劑之彼等泵送系統。更特定而言,本發明係關於用於操作用於施配混合熱熔材料之泵送系統之控制方法。 The present invention relates generally to pumping systems for hot melt materials, such as their pumping systems for dispensing adhesives used in packaging. More particularly, the present invention relates to a control method for operating a pumping system for dispensing a mixed hot melt material.
熱熔系統習用地操作以熔化固體聚合物顆粒,之後,使經熔化液體顆粒進入至一泵系統中以路由至一施配器。此等系統需要沿著自用於未經加熱顆粒之一裝料斗至該施配器之整個路線加熱經熔化液體。此需要在該系統中使用多個加熱器。舉例而言,一裝料斗、一泵及一歧管經組態於具備加熱之一單個單元中,且一加熱軟管將該歧管連接至一施配器。加熱器增加此等系統之電力消耗,藉此增加操作之成本。熱熔技術之近來進展已涉及使用混合組合物(其中一異質分散之聚合微粒懸浮於一吸附液體組份中),諸如受讓於H.B.Fuller公司的Stumphauzer等人之美國專利第7,285,583號中所闡述。在用於此等混合組合物之施配系統中,在施配之前(通常恰好在進入至一施配器中之前)不將熱施加至組合物,如受讓於H.B.Fuller公司的Stumphauzer等人之美國專利第7,221,859號中所闡述。 The hot melt system is conventionally operated to melt solid polymer particles, after which the molten liquid particles are passed to a pump system for routing to a dispenser. These systems require heating the molten liquid along the entire route from one of the unheated hoppers to the dispenser. This requires the use of multiple heaters in the system. For example, a hopper, a pump, and a manifold are configured in a single unit with heating, and a heated hose connects the manifold to a dispenser. Heaters increase the power consumption of such systems, thereby increasing the cost of operation. Recent advances in the hot melt technology have been directed to the use of a mixed composition in which a heterogeneously dispersed polymeric microparticle is suspended in an adsorbent liquid component, as described in U.S. Patent No. 7,285,583, issued to <RTIgt;Stumphauzer et al. . In a dispensing system for such mixed compositions, no heat is applied to the composition prior to dispensing (usually just prior to entering the dispenser), such as by Stumphauzer et al. of HB Fuller. U.S. Patent No. 7,221,859.
混合組合物施配單元經歷稱作「擠滿」之一現象,其中液體組份自泵送單元排空且固體聚合微粒留於泵中。當使泵送系統處於一待用模式(其中該泵經加壓,但不泵送經 熔化材料)中時,泵內之壓力可致使液體組份穿過密封件回流至泵之低壓區域且洩漏。在僅固體微粒剩餘之情況下,泵機構具有鎖定之一趨勢。因此需要維護以移除致使生產線延遲之堵塞微粒。已經發展以解決擠滿之先前技術系統已涉及透過泵在一回饋環路中連續再循環材料以避免液體組份之回流,甚至當不施配經熔化材料時。通常,在再循環環路中提供一孔口以維持用於施配之背壓,但彼准許某些流動再循環。此等系統增加總體系統之複雜度且已增加電力需求,藉此首先消除混合組合物熱熔系統之某些益處。因此,存在對經改良熱熔施配系統之一要求。 The mixed composition dispensing unit undergoes a phenomenon known as "crowding" in which the liquid component is evacuated from the pumping unit and the solid polymeric particles are retained in the pump. When the pumping system is placed in a standby mode (where the pump is pressurized but not pumped When the material is melted, the pressure within the pump can cause the liquid component to flow back through the seal to the low pressure region of the pump and leak. In the case where only solid particles remain, the pump mechanism has a tendency to lock. Maintenance is therefore required to remove clogging particles that cause delays in the production line. Prior art systems that have been developed to address crowding have involved continuously recycling material through a pump in a feedback loop to avoid backflow of liquid components, even when no molten material is dispensed. Typically, an orifice is provided in the recirculation loop to maintain the back pressure for dispensing, but it permits some flow recirculation. These systems increase the complexity of the overall system and have increased power requirements, thereby first eliminating some of the benefits of the hybrid composition hot melt system. Therefore, there is a need for one of the improved hot melt dispensing systems.
本發明係針對一種用於在用於泵送混合熱熔材料之一系統中避免擠滿的方法。該方法包括:監視泵送混合熱熔材料之一泵之活動;在一不活動臨限位準處關斷熔化所泵送混合熱熔材料之一加熱器;及洩放泵壓力。 The present invention is directed to a method for avoiding crowding in a system for pumping a mixed hot melt material. The method includes: monitoring the activity of a pump pumping one of the mixed hot melt materials; shutting down one of the heaters pumping the mixed hot melt material at an inactive threshold level; and releasing the pump pressure.
圖1係包含與一混合熱熔組合物一起使用之泵總成12、加熱器14及施配器16之熱熔施配系統10之一示意圖。泵總成12藉由流體管線18流體連接至加熱器14。泵總成12藉由通信線路20電子連接至加熱器14。加熱器14係在聯結器22處連接至施配器16。 1 is a schematic illustration of a hot melt dispensing system 10 including a pump assembly 12, a heater 14 and a dispenser 16 for use with a mixed hot melt composition. The pump assembly 12 is fluidly coupled to the heater 14 by a fluid line 18. Pump assembly 12 is electronically coupled to heater 14 via communication line 20. Heater 14 is coupled to dispenser 16 at coupler 22.
參考圖2更詳細闡述之泵總成12包括提供至加熱器14之一液體材料之一原動流之一機械泵。在所闡述實施例中,該液體材料包括一混合熱熔黏合劑組合物(「混合組合 物」),該混合熱熔黏合劑組合物包括懸浮於一吸附液體組份中之一異質分散聚合微粒,諸如Stumphauzer等人之美國專利第7,285,583號中所闡述。然而,本發明可與施配任何類型之混合組合物(其中固體粒子混合於一液體材料中)之泵送系統一起使用。泵總成12內之電子器件操作泵以將所期望流量之混合材料提供至加熱器14。電子器件亦操作加熱器14以提供必要量之熱輸出以熔化熱熔黏合劑組合物內之分散聚合微粒,藉此活化一黏合劑材料。在一項實施例中,加熱器14包括一直列式加熱器,其中聯結器22不間斷地將流體管線18接合至施配器16之出口閥。舉例而言,加熱器14可包括如Stumphauzer等人之美國專利第7,221,859號中所闡述之一直列式加熱器。熱熔黏合劑之經熔化混合物流動至能夠以一受控方式施加黏合劑之施配器16中。施配器16可包括直接人工操作之一手持槍或由作為一自動化程序之部分之一控制器操作之一模組。因此,在一特定應用中,熱熔膠可施加至諸如封裝、盒子及諸如此類之彼等表面之表面。 The pump assembly 12, described in greater detail with respect to FIG. 2, includes a mechanical pump that provides one of the motive flow of one of the liquid materials to the heater 14. In the illustrated embodiment, the liquid material comprises a mixed hot melt adhesive composition ("mixed combination The mixed hot-melt adhesive composition comprises a hetero-dispersed polymeric microparticle suspended in an adsorbent liquid component, as described in U.S. Patent No. 7,285,583 to Stumpuuzer et al. However, the invention can be used with pumping systems that dispense any type of mixed composition in which solid particles are mixed in a liquid material. The electronics within the pump assembly 12 operate the pump to provide the desired flow of mixed material to the heater 14. The electronics also operate the heater 14 to provide the necessary amount of heat output to melt the dispersed polymeric particles within the hot melt adhesive composition thereby activating the binder material. In one embodiment, the heater 14 includes an in-line heater in which the coupler 22 uninterruptedly engages the fluid line 18 to the outlet valve of the dispenser 16. For example, the heater 14 can include a heater of the type as set forth in U.S. Patent No. 7,221,859 to Stumpuuzer et al. The molten mixture of hot melt adhesive flows into a dispenser 16 that is capable of applying the adhesive in a controlled manner. The dispenser 16 can include a hand-held gun that is directly manually operated or a module that is operated by a controller that is part of an automated program. Thus, in a particular application, hot melt adhesive can be applied to surfaces such as packages, boxes, and the like.
在周圍室溫下,液體材料係充分黏的以在泵壓力下自泵系統12流動至加熱器14。因此,流體管線18既不加熱亦不隔熱。加熱器14提供將混合組合物活化成一同質、黏的熱熔膠所需之所有熱輸入。熱熔膠亦在來自泵系統12之壓力下自加熱器14穿過聯結器22流動至施配器16。加熱器14提供充分熱輸出且以適當方式連接至施配器16以使得來自加熱器14之熱維持混合組合物在施配器16內處於一經熔化狀 態中。然而,在其他實施例中,施配器16具備單獨加熱元件。此外,在某些組態中,聯結器22可包含係加熱的軟管或諸如此類。可使用如此項技術中習知之任何直列式加熱系統,諸如電阻式加熱元件。在此等實施例中,彼等加熱器相對於本發明以類似於加熱器14之一方式受控制。因此,施配器16接納處於準備應用之一狀況下之混合組合物。此一系統由於消除如此項技術中習知的貫穿整個泵系統且在施配器外加熱混合組合物之需要而優於先前技術固體顆粒系統。 At ambient room temperature, the liquid material is sufficiently viscous to flow from the pump system 12 to the heater 14 at pump pressure. Therefore, the fluid line 18 is neither heated nor insulated. Heater 14 provides all of the heat input required to activate the mixed composition into a homogenous, viscous hot melt adhesive. The hot melt adhesive also flows from the heater 14 through the coupler 22 to the dispenser 16 under pressure from the pump system 12. The heater 14 provides sufficient heat output and is coupled to the dispenser 16 in a suitable manner such that the heat from the heater 14 maintains the mixed composition in the dispenser 16 in a melted state. In the state. However, in other embodiments, the dispenser 16 is provided with a separate heating element. Moreover, in some configurations, the coupler 22 can include a heated hose or the like. Any inline heating system as is known in the art, such as resistive heating elements, can be used. In such embodiments, the heaters are controlled relative to the present invention in a manner similar to one of the heaters 14. Thus, the dispenser 16 receives the mixed composition in one of the conditions for preparation. This system is superior to prior art solid particle systems in that it eliminates the need in the art to pass through the entire pump system and heat the mixed composition outside the dispenser.
熱熔施配系統10因此可經連續或不間斷操作以施配熱熔膠同時僅需要在加熱器14與施配器16之間活化少量混合組合物。經活化(經加熱)混合組合物在冷卻至室溫之後旋即變成一同質固體材料。可將固體材料重新熔化成熱熔膠,但不可回復至如最初提供之混合組合物。因此,不期望任何經加熱及經活化混合組合物往回流動至流體管線18或泵系統12中。在一習用先前技術系統中,此一發生將需要加熱經活化混合組合物進入至其中之系統之任何組件以排出經凝固膠。只要先前技術系統在短間隔中係連續使用或不間斷地使用,通常不會發生此情況。然而,若使先前技術系統閒置達一段時間,則來自加熱器之經活化混合組合物可往回遷移至其中其可凝固且堵塞該系統之一流體管線中。此外,此等系統可單獨經受一擠滿狀況。本發明提供用於避免發生擠滿狀況之系統10之一控制方法,藉此避免來自加熱器14之經活化混合組合物透過系統10往回遷移。 The hot melt dispensing system 10 can thus be subjected to continuous or uninterrupted operation to dispense hot melt adhesive while only requiring a small amount of mixed composition to be activated between the heater 14 and the dispenser 16. The activated (heated) mixed composition immediately turns into a homogeneous solid material after cooling to room temperature. The solid material can be remelted into a hot melt adhesive, but cannot be reverted to the mixed composition as originally provided. Therefore, it is undesirable for any heated and activated mixed composition to flow back into fluid line 18 or pump system 12. In a conventional prior art system, this occurrence would require heating any component of the system into which the activated mixed composition enters to expel the coagulated gel. This usually does not occur as long as the prior art system is used continuously or uninterruptedly in short intervals. However, if the prior art system is left idle for a period of time, the activated mixed composition from the heater can migrate back to where it can solidify and plug one of the fluid lines of the system. In addition, these systems can be individually subjected to a full charge condition. The present invention provides a method of controlling one of the systems 10 for avoiding a crowded condition whereby the activated mixed composition from the heater 14 is prevented from migrating back through the system 10.
圖2係展示混合材料容器24、裝料斗26、馬達28、泵30、流體出口區塊32、釋放閥33及執行對熱熔施配系統10之控制之電子器件34之互連之圖1之泵總成12之一示意圖。泵30包含入口36、出口38以及流體管線40及42。釋放閥33定位於連接流體出口區塊32與裝料斗26之回流管線44內。電子器件34包含連接至位置感測器46、釋放閥33及馬達28之通信線路20。 2 is a diagram showing the interconnection of the mixed material container 24, the hopper 26, the motor 28, the pump 30, the fluid outlet block 32, the relief valve 33, and the electronics 34 that perform control of the hot melt dispensing system 10. A schematic of one of the pump assemblies 12. Pump 30 includes an inlet 36, an outlet 38, and fluid lines 40 and 42. The relief valve 33 is positioned within the return line 44 that connects the fluid outlet block 32 to the hopper 26. Electronic device 34 includes communication circuitry 20 that is coupled to position sensor 46, relief valve 33, and motor 28.
泵30包括用於對來自裝料斗26之液體材料加壓之一泵。泵30可包括如此項技術中習知之任何習用泵。舉例而言,在一項實施例中,泵30可包括一正排量泵(諸如一隔膜泵或一線性排量活塞泵)。泵30由馬達28驅動,馬達28可包括如此項技術中習知之任何習用馬達。舉例而言,馬達28可包括使一軸件旋轉以用於為泵30供電之一氣動馬達或一電動馬達。電子器件34基於一操作員輸入或一程式化排程選擇性地操作馬達28以驅動泵30。 Pump 30 includes a pump for pressurizing liquid material from hopper 26. Pump 30 can include any conventional pump as is known in the art. For example, in one embodiment, pump 30 can include a positive displacement pump (such as a diaphragm pump or a linear displacement piston pump). Pump 30 is driven by motor 28, which may include any conventional motor known in the art. For example, motor 28 may include a pneumatic motor or an electric motor that rotates a shaft member for powering pump 30. Electronic device 34 selectively operates motor 28 to drive pump 30 based on an operator input or a stylized schedule.
泵30之入口36(諸如)藉由流體管線40流體耦合至裝料斗26。裝料斗26包括固持熱熔材料容器24且將材料引導至泵30之入口36之一容器或收容器。舉例而言,裝料斗26可具有一漏斗形狀或可具有用以灌注泵30之一單獨泵。如上文所提及,熱熔材料容器24包括一混合組合物,該混合組合物包括懸浮於一吸收液體組份中之一異質分散聚合微粒。在一項實施例中,材料容器24包括可放置至裝料斗26中或於其上之一襯袋盒封裝。泵30之出口38藉由流體管線42流體耦合至流體出口區塊32。流體出口區塊32包括接納來自 泵30之流體且將經加壓流體引導至流體管線18及回流管線44之一流體歧管。流體管線18延伸至一加熱器及施配器(諸如加熱器14及施配器16(圖1))。回流管線44延伸至材料裝料斗26。穿過回流管線44之流量由可由電子器件34選擇性地操作之釋放閥33控制。 The inlet 36 of the pump 30 is fluidly coupled to the hopper 26 by a fluid line 40, such as. The hopper 26 includes a container or receptacle that holds the hot melt material container 24 and directs material to the inlet 36 of the pump 30. For example, the hopper 26 can have a funnel shape or can have a separate pump to prime the pump 30. As mentioned above, the hot melt material container 24 includes a mixed composition comprising one of the heterogeneously dispersed polymeric particles suspended in an absorbent liquid component. In one embodiment, the material container 24 includes a liner bag package that can be placed into or on the hopper 26. The outlet 38 of the pump 30 is fluidly coupled to the fluid outlet block 32 by a fluid line 42. Fluid outlet block 32 includes receiving from The fluid of pump 30 directs the pressurized fluid to a fluid manifold of fluid line 18 and return line 44. Fluid line 18 extends to a heater and dispenser such as heater 14 and dispenser 16 (Fig. 1). The return line 44 extends to the material hopper 26. The flow through the return line 44 is controlled by a release valve 33 that is selectively operable by the electronics 34.
電子器件34通常以一自動化方式操作熱熔施配系統10。如此,電子器件34包括包含如此項技術中所習知之一處理器、記憶體、圖形顯示器、使用者介面、記憶體及諸如此類之一電腦系統。在正常或典型操作狀況下,電子器件34維持系統10處於一狀態中以使得可在施配器處施配經活化(經加熱)混合組合物。在此等狀況下,馬達28係作用中的從而維持泵30處於一經加壓、操作狀態中。如此,泵30接納來自裝料斗26之未經加壓流體且維持出口38下游之經加壓流體。此外,電子器件34啟動加熱器14以使得產生熱或熱輸出。因此,由泵30推動至施配器16之混合組合物首先通過加熱器14。加熱器14之熱輸出致使液體組份內之懸浮聚合微粒熔化,藉此形成熱熔膠。因此,經加壓及未經加熱混合組合物經向上提供至加熱器14,且經加壓及經加熱混合組合物經提供至加熱器14及施配器16。施配器16可因此經人工或自動操作以分佈經活化混合組合物。 Electronic device 34 typically operates hot melt dispensing system 10 in an automated manner. As such, electronic device 34 includes a computer system including one of the processors, memory, graphics display, user interface, memory, and the like as is known in the art. Under normal or typical operating conditions, electronic device 34 maintains system 10 in a state such that the activated (heated) mixing composition can be dispensed at the dispenser. Under these conditions, the motor 28 is active to maintain the pump 30 in a pressurized, operational state. As such, the pump 30 receives the unpressurized fluid from the hopper 26 and maintains the pressurized fluid downstream of the outlet 38. In addition, electronic device 34 activates heater 14 to cause a heat or heat output. Therefore, the mixed composition pushed by the pump 30 to the dispenser 16 first passes through the heater 14. The heat output of the heater 14 causes the suspended polymeric particles in the liquid component to melt, thereby forming a hot melt adhesive. Accordingly, the pressurized and unheated mixed composition is supplied upward to the heater 14, and the pressurized and heated mixed composition is supplied to the heater 14 and the dispenser 16. The dispenser 16 can thus be manually or automatically operated to distribute the activated mixed composition.
但當未正施配經活化混合組合物時,有時使系統10處於正常操作之狀況下(諸如在馬達28及加熱器14操作之情況下)。若不預期使用系統10達一段延長時間,諸如在一天或一製造輪班結束時,通常期望關閉整個系統。(諸如)介 於施配操作之間的短不活動週期對系統10之操作不具有一影響。然而,若在不施配任何流體之情況下使系統10通電達一段延長時間,則系統10可經歷稱作「擠滿」之一現象,其中泵30變得塞滿混合組合物中之未經熔化之聚合微粒。當維持泵30處於其中入口36與出口38之間存在一壓力差之一狀態中時發生此一現象。該壓力差可致使混合組合物之液體組份穿過系統(尤其穿過泵30之密封件)回流。 However, when the activated mixed composition is not being dispensed, the system 10 is sometimes placed under normal operating conditions (such as in the case of motor 28 and heater 14 operation). If the system 10 is not expected to be used for an extended period of time, such as at the end of a day or a manufacturing shift, it is generally desirable to shut down the entire system. (such as) The short inactivity period between the dispensing operations does not have an effect on the operation of system 10. However, if system 10 is energized for a prolonged period of time without the application of any fluid, system 10 may experience a phenomenon known as "crowding," in which pump 30 becomes filled with the mixed composition. Melted polymeric particles. This phenomenon occurs when the pump 30 is maintained in a state in which there is a pressure difference between the inlet 36 and the outlet 38. This pressure differential can cause the liquid component of the mixed composition to flow back through the system, particularly through the seal of pump 30.
在先前技術系統中,泵可變得滯塞,且經加熱混合組合物可自加熱器回流至一流體管線中。一旦該經加熱混合組合物自加熱器移動遠離,其即在一段時間後凝固,因此堵塞流體管線。此致使系統係不可操作的,藉此浪費生產時間。需要維護系統以自加熱器上游之流體管線移除經凝固混合組合物。經凝固混合組合物可藉助熱重新熔化,但一旦其在流體管線內已遷移距加熱器足夠遠,即必須引入一外部熱源以自先前技術系統移除經凝固混合組合物。在本發明中,電子器件34執行一操作演算法以避免泵30在不施配流體之情況下在壓力下操作達一段延長時間。 In prior art systems, the pump can become stagnant and the heated mixed composition can be returned from the heater to a fluid line. Once the heated mixed composition moves away from the heater, it solidifies after a period of time, thus plugging the fluid line. This makes the system inoperable, thereby wasting production time. A maintenance system is required to remove the coagulated mixed composition from the fluid line upstream of the heater. The coagulated mixed composition can be remelted by heat, but once it has migrated far enough away from the heater within the fluid line, an external heat source must be introduced to remove the coagulated mixed composition from prior art systems. In the present invention, electronic device 34 performs an operational algorithm to prevent pump 30 from operating under pressure for a prolonged period of time without dispensing a fluid.
圖3係概述圖2之電子器件34執行以在泵30中避免擠滿之一方法之一方塊圖。在步驟100處,啟動熱熔施配系統10以開始施配經活化混合組合物或熱熔膠之程序。特定而言,電子器件34經由通信線路20發送一信號至加熱器14。加熱器14然後活化施配器16內之混合組合物。在一項實施例中,加熱器14直接耦合至施配器16中之一出口閥以使得加熱器14僅活化立即準備被施配之混合組合物。如所提 及,電子器件34亦發送一信號至系統10中所使用之任何其他加熱器。加熱器14上游之管線18內之混合組合物保持未經熔化。在步驟105處,(諸如)藉由電子器件34經由通信線路20發送一信號至馬達28來啟動泵30。因此,泵30經操作以將經加壓混合組合物送出至流體出口區塊32及施配器16。如此,系統10準備施配經活化混合材料。 3 is a block diagram summarizing one of the methods by which electronic device 34 of FIG. 2 performs to avoid crowding in pump 30. At step 100, the hot melt dispensing system 10 is activated to begin the process of dispensing the activated mixed composition or hot melt adhesive. In particular, electronic device 34 transmits a signal to heater 14 via communication line 20. The heater 14 then activates the mixed composition within the dispenser 16. In one embodiment, the heater 14 is directly coupled to one of the outlet valves of the dispenser 16 such that the heater 14 activates only the mixed composition that is ready to be dispensed. As mentioned And, electronic device 34 also sends a signal to any other heater used in system 10. The mixed composition in line 18 upstream of heater 14 remains unmelted. At step 105, pump 30 is started, such as by electronic device 34 transmitting a signal to motor 28 via communication line 20. Accordingly, pump 30 is operative to deliver the pressurized mixed composition to fluid outlet block 32 and dispenser 16. As such, system 10 is ready to dispense the activated mixed material.
在步驟110處,電子器件34針對活動監視泵30。特定而言,電子器件34透過通信線路20與耦合至泵30之位置感測器46通信。位置感測器46判定泵30之一組件之移動,此提供是否正發生作用中泵送之一指示。舉例而言,位置感測器46可監視用以使一線性排量活塞泵位移之一活塞軸件之位置。另一選擇係,可藉由監視施配器16之活動而間接監視泵30之活動。因此,施配器16之一觸發器、啟動桿或噴嘴可具備一運動感測器或位置感測器。因此,在步驟110處,電子器件34連續監視泵30以偵測活動。電子器件34維持當泵30中之移動停止時起動之一計數器或時鐘。在所闡述之實施例中,電子器件34維持判定泵30之不活動的兩個臨限位準之一單個時鐘。在其他實施例中,電子器件34包含各自個別地判定一個臨限位準之兩個單獨時鐘。 At step 110, the electronic device 34 monitors the pump 30 for activity. In particular, electronic device 34 communicates with position sensor 46 coupled to pump 30 via communication line 20. Position sensor 46 determines the movement of one of the components of pump 30, which provides an indication of whether an active pumping is occurring. For example, position sensor 46 can monitor the position of one of the piston shaft members to displace a linear displacement piston pump. Alternatively, the activity of the pump 30 can be indirectly monitored by monitoring the activity of the dispenser 16. Thus, one of the triggers, actuating levers or nozzles of the dispenser 16 can be provided with a motion sensor or position sensor. Thus, at step 110, electronic device 34 continuously monitors pump 30 to detect activity. The electronic device 34 maintains a counter or clock that is activated when the movement in the pump 30 is stopped. In the illustrated embodiment, electronic device 34 maintains a single clock that determines one of two threshold levels of inactivity of pump 30. In other embodiments, electronic device 34 includes two separate clocks that each individually determine a threshold level.
在步驟120處,在電子器件34判定泵30已閒置一第一臨限位準(稱為一「閒置」臨限位準)之後,電子器件34使系統10處於一待用模式中。在該待用模式中,電子器件34經由通信線路20發送命令加熱器14減少熱輸出之一信號至加熱器14。熱輸出經調低至避免混合材料被活化之一位準, 藉此提供經降低能量輸出之成本節省。熱輸出位準經維持於足夠高以當再次期望或需要系統10之操作時允許加熱器14迅速回升至操作溫度。當已知系統10將再次用於一段短時間(諸如在一維護操作或一經排程中斷之完成之後)時,可在一第一臨限位準處起動待用模式。可由系統10之一操作員在電子器件34處設定及調整第一臨限位準之時間限制。 At step 120, after the electronic device 34 determines that the pump 30 has been idle for a first threshold level (referred to as an "idle" threshold level, the electronic device 34 places the system 10 in an inactive mode. In the standby mode, the electronic device 34 sends a command to the heater 14 via the communication line 20 to reduce the signal of the heat output to the heater 14. The heat output is reduced to avoid one level of activation of the mixed material, This provides a cost savings with reduced energy output. The heat output level is maintained high enough to allow the heater 14 to quickly rise back to the operating temperature when the operation of the system 10 is again desired or desired. When it is known that system 10 will be used again for a short period of time (such as after a maintenance operation or completion of a scheduled interruption), the standby mode can be initiated at a first threshold level. The time limit of the first threshold level can be set and adjusted by the operator of one of the systems 10 at the electronic device 34.
當在待用模式中時,電子器件34繼續監視泵30之不活動。在步驟130處,若一額外時間量超越第一「閒置」臨限值以使得達到一第二臨限位準或「不活動」臨限值,則電子器件34開始關閉系統10之組件。首先,在步驟150處關閉加熱器14或使其斷電。在步驟160處,藉由電子器件34關閉泵30或使其斷電。特定而言,電子器件34命令馬達28及加熱器14停止操作。馬達28之不活動致使泵30不再主動產生入口36與出口38之間的一壓力差,藉此消除在其下可發生擠滿之狀況。加熱器14之不活動避免額外混合組合物之熔化。在步驟170中,在已過去一足夠時間長度之後,加熱器14內之混合組合物最終冷卻至其中發生凝固之一溫度。如此,加熱器14內之經凝固混合組合物可在啟動加熱器14之後旋即經重新熔化,但流體管線18中離加熱器14不遠之混合材料保持未經活化而處於一懸浮液體狀態中。因此,避免經活化混合組合物往回漂流或遷移至流體管線18或泵總成12中。在步驟180處,泵30經減壓以允許剩餘於系統10(諸如管線42及44)中之任何殘餘經加壓混合 組合物經向回汲極至裝料斗26。特定而言,電子器件34發送命令釋放閥33打開之一信號至該閥。釋放閥33可包括任何適合之自動化關斷閥。由於已經活化之所有混合材料將在冷卻之後旋即在加熱器14內凝固,僅未經活化之混合組合物將在閥33打開時自流體管線18回流至流體出口區塊32、管線42及泵30中。如此,使系統10完全處於其中不發生泵送及加熱且無施配係可能的之一停用模式中。在此一狀態中,避免在泵30中發生混合組合物之液體組份之往回遷移,此乃因橫跨入口36與出口38不存在壓力差。如此,避免經活化混合組合物進入其中來自加熱器14之熱係不可用之系統10。此外,避免泵30之擠滿。 While in the standby mode, electronics 34 continues to monitor the inactivity of pump 30. At step 130, if an additional amount of time exceeds the first "idle" threshold such that a second threshold level or "inactive" threshold is reached, the electronic device 34 begins to shut down the components of the system 10. First, the heater 14 is turned off or powered down at step 150. At step 160, pump 30 is turned off or powered down by electronics 34. In particular, electronic device 34 commands motor 28 and heater 14 to cease operation. Inactivity of the motor 28 causes the pump 30 to no longer actively create a pressure differential between the inlet 36 and the outlet 38, thereby eliminating the condition under which the crowd can occur. Inactivity of the heater 14 avoids melting of the additional mixed composition. In step 170, after a sufficient length of time has elapsed, the mixed composition within heater 14 is ultimately cooled to a temperature at which solidification occurs. As such, the coagulated mixing composition within the heater 14 can be remelted immediately after the heater 14 is activated, but the mixed material in the fluid line 18 that is not far from the heater 14 remains unactivated in a suspended liquid state. Thus, the activated mixed composition is prevented from drifting back or migrating into the fluid line 18 or pump assembly 12. At step 180, pump 30 is depressurized to allow any residual remaining in system 10 (such as lines 42 and 44) to be pressurized. The composition is turned back to the hopper 26 via the back. In particular, the electronic device 34 sends a command release valve 33 to open a signal to the valve. The relief valve 33 can include any suitable automated shut-off valve. Since all of the mixed materials that have been activated will solidify in the heater 14 immediately after cooling, only the unactivated mixed composition will return from the fluid line 18 to the fluid outlet block 32, line 42 and pump 30 when the valve 33 is open. in. As such, the system 10 is fully in one of the deactivated modes in which no pumping and heating occurs and no dispensing system is possible. In this state, the migration back of the liquid component of the mixed composition in the pump 30 is avoided because there is no pressure differential across the inlet 36 and the outlet 38. As such, the system 10 in which the activated mixed composition enters the heat system from which the heater 14 is not available is avoided. In addition, the pump 30 is prevented from being crowded.
在步驟190處,電子器件34重新啟動系統10。特定而言,恢復至泵30及加熱器14之電力。此外,釋放閥33返回至一閉合狀態。在一項實施例中,在一操作員將一指示提供至電子器件34之後重新啟動系統10。在另一實施例中,作為一預程式化排程之部分,電子器件34重新啟動系統10。舉例而言,電子器件34可將系統10置於待用模式中且然後在已使系統10運行之後在一輪班之結束時將其置於停用模式中。電子器件34可然後在下一輪班開始時使系統10返回至一操作狀態。 At step 190, the electronic device 34 restarts the system 10. Specifically, the power to the pump 30 and the heater 14 is restored. Further, the release valve 33 returns to a closed state. In one embodiment, system 10 is restarted after an operator provides an indication to electronic device 34. In another embodiment, the electronic device 34 restarts the system 10 as part of a pre-programmed schedule. For example, electronic device 34 can place system 10 in an inactive mode and then place it in a deactivated mode at the end of a shift after system 10 has been run. The electronic device 34 can then return the system 10 to an operational state at the beginning of the next shift.
儘管已參考較佳實施例闡述本發明,但熟習此項技術者將認識到可在不背離本發明之精神及範疇之情況下做出形式及細節上之改變。 While the invention has been described with respect to the preferred embodiments, the embodiments of the invention
10‧‧‧熱熔施配系統/系統 10‧‧‧Hot melt dispensing system/system
12‧‧‧泵總成/泵系統 12‧‧‧Pump assembly/pump system
14‧‧‧加熱器 14‧‧‧heater
16‧‧‧施配器 16‧‧‧ dispenser
18‧‧‧流體管線/管線 18‧‧‧Fluid line/pipeline
20‧‧‧通信線路 20‧‧‧Communication lines
22‧‧‧聯結器 22‧‧‧Connector
24‧‧‧混合材料容器/熱熔材料容器/材料容器 24‧‧‧Mixed material container/hot melt material container/material container
26‧‧‧裝料斗/材料裝料斗 26‧‧‧Loading hopper/material loading hopper
28‧‧‧馬達 28‧‧‧Motor
30‧‧‧泵 30‧‧‧ pump
32‧‧‧流體出口區塊 32‧‧‧Fluid export block
33‧‧‧釋放閥/閥 33‧‧‧Release valve/valve
34‧‧‧電子器件 34‧‧‧Electronic devices
36‧‧‧入口 36‧‧‧ Entrance
38‧‧‧出口 38‧‧‧Export
40‧‧‧流體管線 40‧‧‧ fluid pipeline
42‧‧‧流體管線/線 42‧‧‧Fluid line/line
44‧‧‧回流管線/線 44‧‧‧Return line/line
46‧‧‧位置感測器 46‧‧‧ position sensor
圖1係包含與一混合熱熔組合物一起使用之一泵總成、加熱器及施配槍之一熱熔施配系統之一示意圖。 BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic illustration of one of a hot melt dispensing system comprising a pump assembly, a heater and a dispensing gun for use with a mixed hot melt composition.
圖2係展示一混合材料容器、一裝料斗、一氣動馬達、一泵、一流體出口區塊、一釋放閥及執行對熱熔施配系統之控制之電子器件之互連之圖1之泵總成之一示意圖。 2 is a pump of FIG. 1 showing a hybrid material container, a hopper, a pneumatic motor, a pump, a fluid outlet block, a release valve, and an interconnect that performs control of the hot melt dispensing system. A schematic diagram of the assembly.
圖3係概述圖2之電子器件執行以在泵總成中避免擠滿之一方法之一方塊圖。 3 is a block diagram summarizing one of the methods by which the electronic device of FIG. 2 performs to avoid crowding in the pump assembly.
10‧‧‧熱熔施配系統/系統 10‧‧‧Hot melt dispensing system/system
12‧‧‧泵總成/泵系統 12‧‧‧Pump assembly/pump system
14‧‧‧加熱器 14‧‧‧heater
16‧‧‧施配器 16‧‧‧ dispenser
18‧‧‧流體管線/管線 18‧‧‧Fluid line/pipeline
20‧‧‧通信線路 20‧‧‧Communication lines
24‧‧‧混合材料容器/熱熔材料容器/材料容器 24‧‧‧Mixed material container/hot melt material container/material container
26‧‧‧裝料斗/材料裝料斗 26‧‧‧Loading hopper/material loading hopper
28‧‧‧馬達 28‧‧‧Motor
30‧‧‧泵 30‧‧‧ pump
32‧‧‧流體出口區塊 32‧‧‧Fluid export block
33‧‧‧釋放閥/閥 33‧‧‧Release valve/valve
34‧‧‧電子器件 34‧‧‧Electronic devices
36‧‧‧入口 36‧‧‧ Entrance
38‧‧‧出口 38‧‧‧Export
40‧‧‧流體管線 40‧‧‧ fluid pipeline
42‧‧‧流體管線/管線 42‧‧‧Fluid line/pipeline
44‧‧‧回流管線/管線 44‧‧‧Return line/pipeline
46‧‧‧位置感測器 46‧‧‧ position sensor
Claims (25)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161533904P | 2011-09-13 | 2011-09-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW201318922A true TW201318922A (en) | 2013-05-16 |
Family
ID=47883959
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101133545A TW201318922A (en) | 2011-09-13 | 2012-09-13 | Method for preventing pack-out in pumping system |
Country Status (6)
Country | Link |
---|---|
US (1) | US20140193277A1 (en) |
EP (1) | EP2755775A4 (en) |
KR (1) | KR20140063681A (en) |
CN (1) | CN103826759A (en) |
TW (1) | TW201318922A (en) |
WO (1) | WO2013040147A2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10046351B2 (en) | 2014-07-14 | 2018-08-14 | Graco Minnesota Inc. | Material dispense tracking and control |
EP3546071B1 (en) * | 2018-03-27 | 2022-01-19 | Robatech AG | Device for intermittently applying a flowable substance and method for applying such a substance |
CN109530119B (en) * | 2018-11-01 | 2020-10-09 | 河南中南工业有限责任公司 | Adhesive spraying method |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4545504A (en) * | 1983-01-31 | 1985-10-08 | Monsanto Company | Hot melt adhesive delivery system |
US4613062A (en) * | 1984-04-17 | 1986-09-23 | Continental Can Company, Inc. | Hot melt material dispenser |
DE3624844A1 (en) * | 1986-07-23 | 1988-01-28 | Josef Schucker | TEMPERATURE DEVICE FOR LIQUID ADHESIVES |
US5814790A (en) * | 1995-10-04 | 1998-09-29 | Nordson Corporation | Apparatus and method for liquifying thermoplastic material |
US5862986A (en) * | 1996-07-16 | 1999-01-26 | Illinois Tool Works, Inc. | Hot melt adhesive applicator with metering gear-driven head |
US6131770A (en) * | 1998-10-15 | 2000-10-17 | Nordson Corporation | Hot melt delivery system |
DE69905756T2 (en) * | 1998-12-03 | 2004-02-19 | Nordson Corp., Westlake | SYSTEM FOR APPLYING HOT-MELT MATERIALS WITH A HIGH-TEMPERATURE-RESISTANT PRESSURE CONTROL AND A HEATED, RECIRCULATING DISTRIBUTOR |
EP1567769A1 (en) * | 2002-11-19 | 2005-08-31 | Empresa Brasileira De Compressores S/A - Embraco | A control system for the movement of a piston |
US7607750B2 (en) * | 2004-09-27 | 2009-10-27 | Seiko Epson Corporation | Pump control mechanism, printer incorporating the same, and pump control method |
US20060144860A1 (en) * | 2005-01-03 | 2006-07-06 | O'keefe Patrick J Jr | Two channel electronic temperature controller |
DE102006039839B4 (en) * | 2006-08-25 | 2019-11-28 | Baumer Hhs Gmbh | Hot glue application system and method for controlling and monitoring the hot glue application system |
US8272537B2 (en) * | 2008-04-17 | 2012-09-25 | Nordson Corporation | Valveless liquid dispenser |
KR20150079693A (en) * | 2012-10-25 | 2015-07-08 | 그라코 미네소타 인크. | Power management for hot melt dispensing systems |
-
2012
- 2012-09-13 EP EP12830923.4A patent/EP2755775A4/en not_active Withdrawn
- 2012-09-13 KR KR1020147006325A patent/KR20140063681A/en not_active Application Discontinuation
- 2012-09-13 US US14/123,715 patent/US20140193277A1/en not_active Abandoned
- 2012-09-13 WO PCT/US2012/055048 patent/WO2013040147A2/en active Application Filing
- 2012-09-13 CN CN201280044403.5A patent/CN103826759A/en active Pending
- 2012-09-13 TW TW101133545A patent/TW201318922A/en unknown
Also Published As
Publication number | Publication date |
---|---|
WO2013040147A2 (en) | 2013-03-21 |
EP2755775A4 (en) | 2015-04-01 |
KR20140063681A (en) | 2014-05-27 |
WO2013040147A3 (en) | 2013-05-10 |
US20140193277A1 (en) | 2014-07-10 |
EP2755775A2 (en) | 2014-07-23 |
CN103826759A (en) | 2014-05-28 |
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