TW201317101A - Diamond wire saw - Google Patents

Abstract

The present invention provides a diamond wire saw, which comprises a wire material, and a coating material covering the outer surface of the wire material. With the total weight percentage of coating material as 100%, the coating material contains diamond abrasive grains of 3wt-30wt%, and binder of 70-97wt%. With the total weight percentage of binder as 100%, the binder contains copper of 0.2wt-0.8wt%, silver of 1wt-4wt%, tin of 75wt-90wt%, welding flux of balanced amount, and unavoidable impurities. With better binding of the binder with the diamond abrasive grains, after the coating material is hardened and formed on the wire material, the diamond abrasive grains are not easily detached, so as to extend the service life of the diamond wire saw.

Description

Diamond wire saw

The present invention relates to a cutting tool, and more particularly to a diamond wire saw.

In the past, in the semiconductor industry, the use of an internal circular saw was mostly used to cut a twin crystal column. However, as the diameter of the wafer is increasing, it is not enough to meet the inner diameter of the inner circular saw. Needed, so gradually developed the so-called diamond wire saw cutting technology, is to fix most of the diamond abrasive particles on a steel wire to make a diamond wire saw, due to the hardness, wear resistance, compressive strength, thermal conductivity, corrosion resistance of the diamond They are superior to other metal materials, so diamonds are widely used as abrasives, and diamond wire saws have lower cost, less wafer cut loss, and good surface finish quality.

Usually, a bonding agent is used to fix the diamond abrasive grains on the steel wire. According to the use of the bonding agent and the manufacturing method, the diamond diamond saw can be roughly divided into three types of diamond wire saws. The form of the combination of the grain and the steel wire is not the same. Referring to Fig. 1, Fig. 2 and Fig. 3, respectively, the cross section of the resin diamond wire saw 11, the electroplated diamond wire saw 12, and the brazed diamond wire saw 13 are shown.

In the resin diamond wire saw 11, the resin 111 has poor grip on the diamond abrasive grains 112, and during the cutting process, the diamond abrasive grains 112 are often knocked off during the processing to make the resin diamond wire saw 11 The cutting ability is lost, so the service life of the resin diamond wire saw 11 is not long.

In the electroplated diamond wire saw 12, a plating solution containing nickel is placed in a diamond abrasive grain 121, and nickel is plated on the surface of the steel wire 122 by electroplating, and the diamond abrasive grains 121 are buried in a nickel plating layer. In 123, but the gripping force of the diamond abrasive grains 121 is also insufficient, and the density of the diamond abrasive grains 121 is not controlled, and there are often a region in which a plurality of diamond abrasive grains 121 are distributed, and another region is completely free of diamond abrasive grains 121. .

In the brazed diamond wire saw 13, since a high manufacturing temperature is required, and the high temperature affects the material properties such as the tensile strength of the steel wire 131, there is a problem that the cut steel wire 131 is easily broken, and the inside of the diamond abrasive grain 132 It is also susceptible to damage due to high temperatures.

Accordingly, it is an object of the present invention to provide a diamond wire saw having a good grip and a long service life of diamond abrasive grains.

Thus, the diamond wire saw of the present invention comprises a wire and a covering material coated on the outer surface of the wire.

The coated material comprises 3 wt% to 30 wt% of diamond abrasive grains, and 70 to 97 wt% of the binder, based on 100% by weight of the total weight of the coated material, and the adhesive has 0.2 wt% based on 100% by weight of the total weight of the adhesive. ~0.8wt% copper, 1wt~4wt% silver, 75wt~90wt% tin, flushing flux, and unavoidable impurities.

The invention has the advantages that the bonding agent has better bonding property with the diamond abrasive grains, and when the covering material is hardened and formed on the wire, the diamond abrasive grains are not easily peeled off, thereby improving the diamond wire. The service life of the saw.

The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments.

Referring to Fig. 4, a preferred embodiment of a diamond wire saw of the present invention comprises a wire 2 and a covering material 3 coated on the outer surface of the wire 2.

The covering material 3 comprises 3 wt% to 30 wt% of diamond abrasive grains 31, and 70 to 97 wt% of the binder 32, based on 100% by weight of the total weight percentage of the covering material 3, based on 100% by weight of the total weight of the adhesive 32. The binder 32 has 0.2 wt to 0.8 wt% of copper, 1 wt% to 4 wt% of silver, 75 wt% to 90 wt% of tin, a flush amount of flux, and unavoidable impurities.

Preferably, the wire 2 is a copper wire comprising 10% by weight of diamond abrasive particles 31, and 90% by weight of a binder 32, wherein the adhesive 32 has 0.5% by weight of copper and 3% by weight of silver. 84% by weight of tin, 12% by weight of flux, and unavoidable impurities, wherein the surface of the diamond abrasive grains 31 is further plated with copper, titanium or nickel, and is combined with the adhesive 32.

It should be noted that the proportion and size of the diamond abrasive grains 31 shown in FIG. 4 are only for convenience of indication and description, and are not drawn in actual occupation ratio and size.

In the manufacturing, the adhesive 32 of the covering material 3 is heated to a liquid state and mixed into the diamond abrasive grains 31 to form a liquid coating material 32, and the liquid coating material 3 is adhered to the outer surface of the wire 2, and finally The covering material 3 is baked at a temperature of 150 ° C to 350 ° C to cure the adhesive 32 of the covering material 3 on the wire 2, and the diamond abrasive grains 31 are also formed on the surface of the wire 2 .

Since the melting point of the adhesive 32 is not high, it is not necessary to use a high-temperature manufacturing environment, that is, the adhesive 32 can be made into a liquid state, so that the wire 2 or the covering material 3 can be prevented from being heated due to high temperature when it is adhered to the wire 2 . The problem of deterioration is generated, and in addition, the adhesive 32 has good bonding property with the diamond abrasive grains 31, so that when the adhesive 32 is cured, the diamond abrasive grains 31 can be firmly adhered to the wire. 2 the surface.

As described above, in the present invention, after the covering material 3 is shaped and hardened, the diamond abrasive grains 31 are firmly fixed to the wire 2, and the diamond abrasive grains 31 are not easily peeled off when the cutting is used, and the diamond wire is allowed to fall off. The use time of the saw is lengthened, so that the object of the present invention can be achieved.

The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.

2. . . Wire

3. . . Covering material

31. . . Diamond abrasive

32. . . Adhesive

Figure 1 is a cross-sectional view showing a conventional resin diamond wire saw;

Figure 2 is a cross-sectional view showing a conventional electroplated diamond wire saw;

Figure 3 is a cross-sectional view showing a conventional brazing diamond wire saw; and

Figure 4 is a cross-sectional view showing a preferred embodiment of the diamond wire saw of the present invention.

2. . . Wire

3. . . Covering material

31. . . Diamond abrasive

32. . . Adhesive

Claims (3)

A diamond wire saw comprising: a wire; and a covering material coated on an outer surface of the wire, the covering material comprising 3wt to 30wt% of diamond abrasive grains, and 70~97wt%, based on 100% of the covering material The binder has a total weight percentage of 100% by weight of the binder, and the binder has 0.2 wt-0.8 wt% of copper, 1 wt% to 4 wt% of silver, 75 wt-90 wt% of tin, a flush amount of flux, and Avoid impurities. The diamond wire saw according to claim 1, wherein the adhesive has 0.5 wt% of copper, 3 wt% of silver, 84 wt% of tin, 12 wt% of flux, and unavoidable impurities. A diamond wire saw according to claim 1, wherein the wire is made of copper.