TW201316226A - 觸控面板及其製造方法 - Google Patents
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Abstract
一種觸控面板包括一基板、一透明導電層、一導電裝飾墊、一裝飾層以及一非透明導電層,透明導電層設置於基板,導電裝飾墊設置於透明導電層,裝飾層設置於透明導電層及導電裝飾墊並在導電裝飾墊上具有一開口,非透明導電層設置於裝飾層並透過開口與透明導電層電性連接。
Description
本發明係關於一種輸入面板及其製造方法,特別關於一種觸控面板及其製造方法。
各類型的觸控輸入裝置已廣泛應用於電子產品,例如:行動電話與平板電腦多以觸控面板作為輸入裝置,使用者可以方便地將手直接接觸輸入面板的表面來下達指令,或是在觸控面板的表面游移來操作鼠標或是進行手寫文字的輸入。與觸控面板搭配的顯示面板亦可顯示出虛擬按鍵供使用者點選,使用者可透過這些虛擬按鍵來輸入對應的相關文字。
一般來說,觸控面板一般分為電阻式、電容式、超音波式及紅外線式等多種類型,其中又以電阻式觸控面板的產品最多,電阻式觸控面板的設計主要又可區分為四線式、五線式、六線式、八線式等等。四線式觸控面板因為成本及技術層面較為成熟,目前已廣泛的生產與應用。
觸控面板包括一基板、在基板上形成的一線路層、絕緣層及軟性印刷電路板圖案等,然而,基板通常採用透明材質例如玻璃,位於基板邊緣的黏接用材料一般為透光材質,故其無法在視覺上遮住絕緣層及軟性印刷電路板圖案,使用者從基板側觀看觸控面板時仍會看到絕緣層及軟性印刷電路板圖案。為解決此視覺不美觀的問題,傳統技術需在殼體額外加上邊框,當觸控面板組裝於殼體內時,利用邊框將觸控面板不欲為人觀看到的部份(例如絕緣層及軟性印刷電路板圖案)遮住,這也造成產品的殼體必須保留額外邊框的缺點。
因此,如何提供一種觸控面板及其製造方法,使其中的邊緣線路在視覺上不會被使用者察覺,已成為一項重要的課題。
有鑑於上述課題,本發明之目的為提供一種避免邊緣線路視覺上露出的觸控面板及其製造方法。
為達上述目的,依據本發明之一種觸控面板包括一基板、一透明導電層、一導電裝飾墊、一裝飾層以及一非透明導電層,透明導電層設置於基板,裝飾墊設置於透明導電層,裝飾層設置於透明導電層及導電裝飾墊並在導電裝飾墊上具有一開口,非透明導電層設置於裝飾層並透過開口與透明導電層電性連接。
為達上述目的,依據本發明之一種觸控面板之製造方法,包括:於一基板上形成一透明導電層;於透明導電層上形成一導電裝飾墊;於導電裝飾墊上形成一裝飾層,其中裝飾層在導電裝飾墊上具有一開口;以及於裝飾層上形成一非透明導電層,其中非透明導電層透過開口與透明導電層電性連接。
在實施例中,導電裝飾墊完全遮住開口,導電裝飾墊之電導通能力優於裝飾層,導電裝飾墊之顏色近似於裝飾層之顏色。
在實施例中,非透明導電層之一部份係設置於開口;或者,在另一實施例中,觸控面板更包括一導電填充物,導電填充物設置於開口;或者,在另一實施例中,非透明導電層之一部份以及導電填充物係設置於開口。
在實施例中,透明導電層定義有一觸控感應線路。
在實施例中,觸控面板更包括一接腳以及一導電黏接物,導電黏接物黏接接腳與非透明導電層。
在實施例中,觸控面板係一電阻式觸控面板或一電容式觸控面板。
承上所述,本發明之觸控面板及其製造方法中,開口係供非透明導電層與透明導電層直接或間接電性連接用,且裝飾層的開口位於透明導電層上的導電裝飾墊之上,導電裝飾墊與裝飾層可遮蔽邊緣線路避免視覺上露出,使得邊緣線路在視覺上不會被使用者察覺。此外,利用本發明之觸控面板及其製造方法,可以僅使用單片基板,因而免除額外使用透明接著膠或玻璃蓋板之需要,利於產品薄型化。
以下將參照相關圖式,說明依本發明較佳實施例之一種觸控面板及其製造方法,其中相同的元件將以相同的參照符號加以說明。
圖1A至圖1C為本發明較佳實施例之觸控面板1之示意圖,如圖1A所示,一觸控面板1包括一基板10、一透明導電層11、一導電裝飾墊12以及一裝飾層13,透明導電層設置11於基板10,導電裝飾墊12設置於透明導電層11,裝飾層13設置於透明導電層11及導電裝飾墊12並在導電裝飾墊12上具有一開口131。
舉例來說,透明導電層11至裝飾層13可依據下述步驟依序形成於基板10上方:於基板10上形成透明導電層11;於透明導電層11上形成一導電裝飾墊12;以及於導電裝飾墊12上形成一裝飾層13,其中裝飾層13在導電裝飾墊12上具有一開口131。
透明導電層11經圖案化處理後定義出觸控感應線路,其材質例如是氧化銦錫(Indium tin oxide,ITO),裝飾層13之材質例如是絕緣材料。透明導電層11在觸控面板1的觸控輸入區上定義有複數個導線作為觸控感應線路,在觸控輸入區的透明導電層11未被裝飾層13所遮住。
基板10的外表面101係供使用者操作,使用者通常從外表面101觀看觸控面板1並於外表面101進行操作,觸控面板1的其餘各層結構及元件則設置於基板10的內表面102。
然後,如圖1B所示,觸控面板1包括一非透明導電層14,非透明導電層14設置於裝飾層13,並透過開口131與透明導電層11電性連接。非透明導電層14之材質係可為銀膠,其可經由網印設備搭配細線路之網版而定義出細線路,並印刷於裝飾層13上。非透明導電層14之一部份141係填入於開口131並與透明導電層11接觸連接。
舉例來說,在圖1A的各層形成之後,非透明導電層14係形成於裝飾層13上。導電裝飾墊12完全遮住開口131,導電裝飾墊12之電導通能力優於裝飾層13,故非透明導電層14與透明導電層11會經由導電裝飾墊12而非裝飾層13導通。
導電裝飾墊12之形狀可為任何形狀,其顏色可為任何顏色並不限定為特別的顏色。但以較佳效果來說,導電裝飾墊12之顏色近似於裝飾層13之顏色,因此,使用者從外表面101觀看觸控面板1並不容易察覺到導電裝飾墊12與裝飾層13之間的變化。非透明導電層14之一部份141係設置於開口131,在較佳的情況下,開口131應當填滿非透明導電層14之材料。即使開口131內沒有填滿非透明導電層14之材料,使得開口內部份的空間沒有填入任何東西,因此產生的色差仍不會被使用者察覺,這是因為導電裝飾墊12把開口131遮住,所以使用者從外表面101觀看觸控面板1並不會看到因開口131沒有填滿所造成的色差。
舉例來說,導電裝飾墊12之材質例如但不限於碳、奈米銅、奈米銀、或高分子導電樹脂等等,裝飾層13之材質例如但不限於具備絕緣性之各種顏色油墨(Ink)。
另外,非透明導電層14不會延伸超過裝飾層13,其材質可以是金屬。
如圖1C所示,觸控面板1更包括一絕緣層15、一導電黏接物16以及一接腳17,絕緣層15設置於非透明導電層14上,導電黏接物16黏接接腳17與非透明導電層14。
舉例來說,絕緣層15係以網版印刷方式覆蓋於非透明導電層14上,藉以保護非透明導電層14防止因暴露於空氣中造成氧化。接腳17可以是一軟性印刷電路板(Flexible Printed Circuit Board,FPC)的接腳,其係藉由導電黏接物16黏著固定於非透明導電層14上及絕緣層15旁,接腳17係透過導電黏接物16及非透明導電層14而與透明導電層11電性連接。導電黏接物16可以是異方性導電膜(Anisotropic Conductive Film,ACF)或異方性導電膠(Anisotropic Conductive Paste,簡稱ACP)。
圖2A及圖2B為本發明一較佳實施例之觸控面板1a之示意圖,如圖2A所示,透明導電層11設置於基板10,導電裝飾墊12設置於透明導電層11,裝飾層13設置於透明導電層11及導電裝飾墊12並在導電裝飾墊12上具有一開口131,一導電填充物18設置於開口131。透明導電層11、導電裝飾墊12及裝飾層13之結構及製造過程與圖1A類似。
然後,如圖2B所示,非透明導電層14設置於裝飾層13及導電填充物18上,也就是說,開口131係先填入導電填充物18之後,再形成非透明導電層14於裝飾層13及導電填充物18上。接著,類似於圖1C,絕緣層15設置於非透明導電層14上,導電黏接物16黏接接腳17與非透明導電層14。
圖3A及圖3B為本發明一較佳實施例之觸控面板1b之示意圖,如圖3A所示,透明導電層設置11於基板10,導電裝飾墊12設置於透明導電層11,裝飾層13設置於透明導電層11及導電裝飾墊12並在導電裝飾墊12上具有一開口131,導電填充物18設置於開口131但並未將開口131填滿。各層之結構及製造過程與圖1A類似。
然後,如圖3B所示,非透明導電層14設置於裝飾層13及導電填充物18上,且開口131內未被導電填充物18填入的空間係被填入非透明導電層14的一部分141a,也就是說,開口131係先填入導電填充物18之後,再形成非透明導電層14於裝飾層13及導電填充物18上,同時也將非透明導電層14填入開口131內未被填滿的空間。接著,類似於圖1C,絕緣層15設置於非透明導電層14上,導電黏接物16黏接接腳17與非透明導電層14。
不論如何,因基板10上設置有導電裝飾墊12,所以從外表面101觀看觸控面板1~1b都不會看到開口131、非透明導電層14、或導電填充物18。
在以上實施例中,觸控面板係一電阻式觸控面板或一電容式觸控面板,電容式觸控面板例如是投射電容式觸控面板。
在以上的實施例中,觸控面板1~1b可以是僅具一基板的面板。以前述觸控面板1~1b僅使用一層基板來說,面板內無需設置另一基板,故面板整體的厚度較薄,且厚度較薄亦使整體透光率可較佳。另外,因僅使用一層基板,無需黏貼兩片基板,不但不致發生因貼合程序造成良率下降的問題,故生產良率得以提高,且亦可減少貼合所需的製程及輔助材料例如透明接著膠或玻璃蓋板,因而可降低製造成本。此外,在製造成本上,亦因少用一片基板及光學膠層,故可使成本較低。
另外,在以上實施例中,觸控面板1~1b亦可以是具有至少二基板的面板,例如基板10與另一基板接合。以下將舉一例說明。
圖4為本發明一較佳實施例之觸控面板1c之示意圖,如圖4所示,觸控面板1c包括基板10、10a、透明導電層11、11a、導電裝飾墊12、12a、裝飾層13、13a、非透明導電層14、14a、絕緣層15、15a、導電黏接物16、16a、接腳17以及一透明絕緣層19,透明絕緣層19設置於透明導電層11、11a之間。由於基板10a、透明導電層11a、導電裝飾墊12a、裝飾層13a、非透明導電層14a、絕緣層15a及導電黏接物16a係與前述圖1A至1C的對應元件具有類似的結構及製造過程,故此不再贅述細節。
另外,裝飾層13a的開口131a亦可如圖2A填入導電填充物;或者,裝飾層13a的開口131a亦可如圖3A填入導電填充物及非透明導電層14a的一部分。
綜上所述,本發明之觸控面板及其製造方法中,開口係供非透明導電層與透明導電層直接或間接電性連接用,且裝飾層的開口位於透明導電層上的導電裝飾墊之上,導電裝飾墊與裝飾層可遮蔽邊緣線路避免視覺上露出,使得邊緣線路在視覺上不會被使用者察覺。此外,利用本發明之觸控面板及其製造方法,可以僅使用單片基板,因而免除額外使用透明接著膠或玻璃蓋板之需要,利於產品薄型化。
以上所述僅為舉例性,而非為限制性者。任何未脫離本發明之精神與範疇,而對其進行之等效修改或變更,均應包含於後附之申請專利範圍中。
1、1a~1c...觸控面板
10、10a...基板
101...外表面
102...內表面
11、11a...透明導電層
12、12a...導電裝飾墊
13、13a...裝飾層
131、131a...開口
14、14a...非透明導電層
141、141a...非透明導電層的一部分
15、15a...絕緣層
16、16a...導電黏接物
17...接腳
18...導電填充物
19...透明絕緣層
圖1A至圖1C為本發明較佳實施例之觸控面板之示意圖;
圖2A及圖2B為本發明一較佳實施例之觸控面板之示意圖;
圖3A及圖3B為本發明一較佳實施例之觸控面板之示意圖;以及
圖4為本發明一較佳實施例之觸控面板之示意圖。
1...觸控面板
10...基板
101...外表面
102...內表面
11...透明導電層
12...導電裝飾墊
13...裝飾層
131...開口
14...非透明導電層
141...非透明導電層的一部分
Claims (12)
- 一種觸控面板,包括:一基板;一透明導電層,設置於該基板;一導電裝飾墊,設置於該透明導電層;一裝飾層,設置於該透明導電層及該導電裝飾墊,在該導電裝飾墊上具有一開口;以及一非透明導電層,設置於該裝飾層,透過該開口與該透明導電層電性連接。
- 如申請專利範圍第1項所述之觸控面板,其中該導電裝飾墊完全遮住該開口。
- 如申請專利範圍第1項所述之觸控面板,其中該導電裝飾墊之電導通能力優於該裝飾層。
- 如申請專利範圍第1項所述之觸控面板,其中該導電裝飾墊之顏色近似於該裝飾層之顏色。
- 如申請專利範圍第1項所述之觸控面板,其中該導電裝飾墊之形狀為任何形狀,其顏色為任何顏色。
- 如申請專利範圍第1項所述之觸控面板,其中該導電裝飾墊之材質包括碳、奈米銅、奈米銀、或高分子導電樹脂,該裝飾層之材質包括具備絕緣性之各種顏色油墨。
- 如申請專利範圍第1項所述之觸控面板,其中該非透明導電層之一部份係設置於該開口。
- 如申請專利範圍第1項所述之觸控面板,更包括:一導電填充物,設置於該開口。
- 如申請專利範圍第1項所述之觸控面板,其中該透明導電層定義有一觸控感應線路。
- 如申請專利範圍第1項所述之觸控面板,更包括:一接腳;以及一導電黏接物,黏接該接腳與該非透明導電層。
- 如申請專利範圍第1項所述之觸控面板,其係一電阻式觸控面板或一電容式觸控面板。
- 一種觸控面板之製造方法,包括:於一基板上形成一透明導電層;於該透明導電層上形成一導電裝飾墊;於該導電裝飾墊上形成一裝飾層,其中該裝飾層在該導電裝飾墊上具有一開口;以及於該裝飾層上形成一非透明導電層,其中該非透明導電層透過該開口與該透明導電層電性連接。
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KR20120110054A KR101496884B1 (ko) | 2011-10-05 | 2012-10-04 | 터치 패널 및 그 제조 방법 |
US13/645,235 US8673425B2 (en) | 2011-10-05 | 2012-10-04 | Touch panel and manufacturing method thereof |
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