TW201312849A - Manufacturing process of laminated type balun - Google Patents

Abstract

The present invention provides a manufacturing process of laminated type balun, which includes the following steps: preparing a first lower conductive layer unit on a lower substrate, wherein the first lower conductive layer unit includes a first lower insulating layer and a first lower conductor segment; preparing a first middle conductive layer on the first lower conductive layer, wherein the first middle conductive layer unit includes a first middle insulating layer and a first middle conductor segment, and the first middle conductive layer unit is made by first cutting a through hole in the insulating material, and then disposing the conductive material within the through hole, and the insulating material and the conductive material may respectively form the first middle insulating layer and the first middle conductor segment; and, preparing a first upper conductive layer unit, a second lower conductive layer unit, a second middle conductive layer unit, a second upper conductive layer unit, and an upper substrate. The present invention employs the layer-by-layer manufacturing process, which needs no precise alignment for manufacturing to reduce the manufacturing difficulty and cost.

Description

Stacked balanced unbalanced converter process

The invention relates to a balanced unbalanced converter process, in particular to a laminated balanced unbalanced converter process.

A LTCC (Low Temperature Co-fired Ceramic) process is mentioned in the master's thesis of the successful university "Using composite materials to realize miniaturized semi-lumped low-temperature ceramic co-fired balanced unbalanced converter". This type of process is a structure in which a ceramic material is added to a ceramic glass to form a three-dimensional space after lamination, and the structure can be used as an element or a substrate. The main steps of this process are to first perform the filling operation on the plurality of ceramic green sheets to become the ceramic substrate, and then align and stack the ceramic substrates, and finally perform the cutting, co-firing, and finishing processes to complete the finished product. However, such a process has the following disadvantages: in the process of alignment and stacking, it is necessary to precisely adjust the position of the ceramic substrates, otherwise the ceramic substrates cannot be accurately connected to each other. Due to the relatively high precision required for such a process, the difficulty in applying this process is greatly increased, and the production cost is greatly increased.

Accordingly, it is an object of the present invention to provide a layered balanced balun process which is easy to prepare.

Therefore, the laminated unbalanced converter process of the present invention comprises the steps of: (A) preparing a substrate, and (B) preparing a first lower conductive layer unit on the lower substrate, the first lower conductive layer unit having a a first lower insulating layer and a first lower wire segment disposed on the first lower insulating layer, (C) preparing at least one first intermediate conductive layer unit on the first lower conductive layer unit, the first conductive layer The layer unit has a first intermediate insulating layer, and a first middle wire segment disposed on the first intermediate insulating layer and electrically connected to the first lower wire segment. The manufacturing process of the first conductive layer unit is first Digging a hole through the insulating material, and then placing a conductive material in the through hole, the insulating material and the conductive material respectively forming the first intermediate insulating layer and the first middle wire segment, and (D) the first conductive layer unit Forming a first upper conductive layer unit, the first upper conductive layer unit having a first upper insulating layer, and a first upper conductive line disposed on the first upper insulating layer and electrically connected to the first middle conductive portion a segment, (E) preparing a first on the first upper conductive layer unit a lower conductive layer unit, the second lower conductive layer unit has a second lower insulating layer and a second lower wire segment disposed on the second lower insulating layer, and (F) is prepared on the second lower conductive layer unit At least one second conductive layer unit, the second conductive layer unit has a second intermediate insulating layer, and a second intermediate conductor disposed on the second intermediate insulating layer and electrically connected to the second lower conductive segment The manufacturing process of the second conductive layer unit is to first dig a hole through the insulating material, and then place a conductive material in the through hole, and the insulating material and the conductive material respectively form the second intermediate insulating layer and the second middle portion a wire segment, (G) preparing a second upper conductive layer unit on the second conductive layer unit, the second upper conductive layer unit having a second upper insulating layer, and a second upper insulating layer disposed on the second conductive layer a second upper wire segment electrically connected to the second middle wire segment, (H) preparing an upper substrate on the second upper conductive layer unit, the lower substrate, the first lower conductive layer unit, and the first middle conductive layer Layer unit, the first upper conductive layer unit, the second lower conductive layer The second conductive layer unit, the second upper conductive layer unit, the upper substrate constitute a monomer to be processed, and (I) sintering four conductive ends on the single body, so that the conductive ends are respectively associated with the single The first lower wire segment, the first upper wire segment, the second lower wire segment, and the second upper wire segment of the body are electrically connected.

Accordingly, it is another object of the present invention to provide a layered balanced balun process which is easy to prepare.

Therefore, the process of the laminated balanced unbalanced converter of the present invention comprises the steps of: (A) preparing a substrate, and (B) preparing a plurality of first lower conductive layer units on the lower substrate, wherein the first lower conductive layer units respectively Having a first lower insulating layer and a first lower wire segment disposed on the first lower insulating layer, (C) preparing at least one first intermediate conductive layer unit on the first lower conductive layer units, The first intermediate conductive layer unit has a first intermediate insulating layer and a first intermediate conductive segment disposed on the first intermediate insulating layer and electrically connected to the first lower conductive segment, the first conductive layer The manufacturing process of the unit is to first dig a hole through the insulating material, and then place a conductive material in the through hole, and the insulating material and the conductive material respectively form the first intermediate insulating layer and the first middle wire segment, wherein (D) Forming a first upper conductive layer unit on each of the first conductive layer units, the first upper conductive layer units respectively having a first upper insulating layer, and one disposed on the first upper insulating layer and the first a first upper wire segment electrically connected to the middle wire segment, ( E) preparing a plurality of second lower conductive layer units on the first upper conductive layer units, wherein the second lower conductive layer units respectively have a second lower insulating layer and a second insulating layer disposed on the second lower insulating layer a second lower conductive layer, (F) respectively preparing at least one second intermediate conductive layer unit on the second lower conductive layer unit, wherein the second middle conductive layer units respectively have a second intermediate insulating layer, and one is disposed on a second intermediate conductor segment electrically connected to the second lower conductor segment and the second intermediate conductor segment is formed by first digging a hole in the insulating material and then placing the conductive material on the second intermediate conductor segment In the perforation, the insulating material and the conductive material respectively form the second intermediate insulating layer and the second intermediate conducting segment, and (G) preparing a second upper conductive layer unit on the second intermediate conductive layer units, respectively The second upper conductive layer unit respectively has a second upper insulating layer, and a second upper wire segment disposed on the second upper insulating layer and electrically connected to the second middle wire segment, (H) in the second Preparing an upper substrate on the upper conductive layer unit, the lower substrate, the first a conductive layer unit, the first intermediate conductive layer unit, the first upper conductive layer unit, the second lower conductive layer unit, the second middle conductive layer unit, the second upper conductive layer unit, The upper substrate constitutes a body to be processed, (I) the body is cut into a plurality of monomers in the longitudinal direction, and (J) the four conductive ends are respectively sintered on the monomers, so that the conductive ends are respectively associated with the single The first lower wire segment, the first upper wire segment, the second lower wire segment, and the second upper wire segment are electrically connected.

The effect of the invention is that, by layer-by-layer sequential preparation, the layers can be easily aligned to make the layers be designed to be turned on, and a relatively high precision alignment technique is not required, thereby greatly reducing the production cost.

The above and other technical features, features, and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments.

Before the present invention is described in detail, it is noted that in the following description, similar elements are denoted by the same reference numerals.

Referring to Figures 1, 2 and 3, a first preferred embodiment of the laminated balanced balun process of the present invention comprises the steps of: in a step 100, preparing a substrate 1.

In a step 101, a first lower conductive layer unit 2 is prepared on the lower substrate 1 by screen printing, the first lower conductive layer unit 2 has a first lower insulating layer 21, and one is screen-printed. The first lower wire segment 22 disposed on the first lower insulation layer 21 is prepared in a manner.

In a step 102, a first medium conductive layer unit 3 is prepared on the first lower conductive layer unit 2 by screen printing, and the first middle conductive layer unit 3 has a first intermediate insulating layer 31, and a A first intermediate wire segment 32 disposed on the first intermediate insulating layer 31 and electrically connected to the first lower wire segment 22 is prepared by screen printing.

The manufacturing process of the first conductive layer unit 3 is to first dig a through hole 301 of the insulating material 300, and then the conductive material 400 is disposed in the through hole 301, and the insulating material 300 and the conductive material 400 respectively form the first intermediate insulating layer. 31 and the first middle wire segment 32.

In a step 103, a first upper conductive layer unit 4 is prepared on the first conductive layer unit 3 by screen printing, and the first upper conductive layer unit 4 has a first upper insulating layer 41, and a A first upper wire segment 42 disposed on the first upper insulating layer 41 and connected to the first intermediate wire electrical segment 32 is prepared in a screen printing manner.

In a step 104, a second lower conductive layer unit 5 is formed on the first upper conductive layer unit 4 by screen printing, and the second lower conductive layer unit 5 has a second lower insulating layer 51, and a The second lower wire segment 52 disposed on the second lower insulating layer 51 is prepared by screen printing.

In a step 105, a second intermediate conductive layer unit 6 is prepared on the second lower conductive layer unit 5 by screen printing, and the second middle conductive layer unit 6 has a second intermediate insulating layer 61, and a A second intermediate wire segment 62 disposed on the second intermediate insulating layer 61 and electrically connected to the second lower wire segment 52 is prepared by screen printing.

The manufacturing process of the second conductive layer unit 6 is to first dig the insulating material 300 into a through hole 301, and then the conductive material 400 is disposed in the through hole 301, and the insulating material 300 and the conductive material 400 respectively form the second intermediate insulating layer. 61 and the second middle wire segment 62.

In a step 106, a second upper conductive layer unit 7 is formed on the second conductive layer unit 6 by screen printing, and the second upper conductive layer unit 7 has a second upper insulating layer 71, and a A second upper wire segment 72 disposed on the second upper insulating layer 71 and electrically connected to the second intermediate wire segment 62 is prepared by screen printing.

In a step 107, an upper substrate 8 is prepared on the second upper conductive layer unit 7, the lower substrate 1, the first lower conductive layer unit 2, the first middle conductive layer unit 3, and the first upper conductive layer. The layer unit 4, the second lower conductive layer unit 5, the second middle conductive layer unit 6, the second upper conductive layer unit 7, and the upper substrate 8 constitute a monomer 500 to be processed.

In a step 108, four conductive ends 9 are sintered on the cell 500 such that the conductive ends 9 are respectively associated with the first lower wire segment 22, the first upper wire segment 42, and the second lower wire segment of the cell 500. 52. The second upper wire segment 72 is electrically connected, and the conductive terminals 9 are plated with a metal.

It is to be noted that the first lower insulating layer 21, the first intermediate insulating layer 31, the first upper insulating layer 41, the second lower insulating layer 51, the second intermediate insulating layer 61 and the second upper insulating layer 71 are Made of glass ceramic, the first lower wire segment 22, the first middle wire segment 32, the first upper wire segment 42, the second lower wire segment 52, the second middle wire segment 62, the second upper wire segment 72, and the like The conductive end 9 is made of silver, the insulating material 300 is glass ceramic, and the conductive material 400 is silver.

In addition, it is worth mentioning that the first lower insulating layer 21 is integral with the lower substrate 1.

Referring to FIG. 4, the second preferred embodiment of the laminated balanced balun process of the present invention is substantially the same as the first preferred embodiment of the component and the assembly method, except that in the second preferred embodiment, In step 104, the second lower conductive layer unit 5 is located on the first lower conductive layer unit 2, and in the step 105, the second middle conductive layer unit 6 is located on the first middle conductive layer unit 3, where In step 106, the second upper conductive layer unit 7 is located on the first upper conductive layer unit 4. Further, in the second preferred embodiment, the step 102 and the step 104 are alternately performed to prepare a plurality of The first middle conductive layer unit 3 and the plurality of second middle conductive layer units 6 are formed on the second lower conductive layer unit 5 and the second middle conductive layer unit 6 . The second middle wire segment 62 is also formed in the first middle conductive layer unit 3 and the first upper conductive layer unit 4.

Referring to FIG. 5, a third preferred embodiment of the laminated balanced balun process of the present invention is substantially the same as the first preferred embodiment of the component and the assembly method, except that in the third preferred embodiment, In step 101 to step 106, the first lower conductive layer unit 2, the first middle conductive layer unit 3, the first upper conductive layer unit 4, the second lower conductive layer unit 5, and the second middle conductive Each of the layer unit 6 and the second lower conductive layer unit 7 further includes a core portion 600 which is connected to each other in the longitudinal direction to form a block shape.

Referring to FIG. 6 , FIG. 7 and FIG. 8 , the fourth preferred embodiment of the laminated balanced balun process of the present invention is substantially the same as the first preferred embodiment of the component and the assembly method, and the difference lies in the fourth preferred embodiment. In the embodiment, from step 200 to step 208, a plurality of lower substrates 1, a first lower conductive layer unit 2, a first middle conductive layer unit 3, a first upper conductive layer unit 4, and a second lower conductive layer unit are simultaneously prepared at one time. 5. The second intermediate conductive layer unit 6, the second upper conductive layer unit 7, and the upper substrate 8 constitute a body 700 to be processed. Then, in a step 208, the body 700 is cut into a plurality of cells 500.

In summary, the balanced unbalanced converter is fabricated by layer-by-layer preparation, which avoids high-precision alignment operations as in the prior art, and can be produced without precise alignment, thereby greatly reducing production. The difficulty of saving the production cost makes it possible to achieve the object of the present invention.

The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.

1. . . Lower substrate

2. . . First lower conductive unit

twenty one. . . First lower insulation layer

twenty two. . . First lower wire segment

3. . . First medium conductive unit

31. . . First intermediate insulation

32. . . First middle wire segment

4. . . First upper conductive unit

41. . . First upper insulating layer

42. . . First upper wire segment

5. . . Second lower conductive unit

51. . . Second lower insulation layer

52. . . Second lower wire segment

6. . . Second conductive unit

61. . . Second intermediate insulation

62. . . Second middle wire segment

7. . . Second upper conductive unit

71. . . Second upper insulating layer

72. . . Second upper wire segment

8. . . Upper substrate

9. . . Conductive end

100. . . step

101. . . step

102. . . step

103. . . step

104. . . step

105. . . step

106. . . step

107. . . step

108. . . step

200. . . step

201. . . step

202. . . step

203. . . step

204. . . step

205. . . step

206. . . step

207. . . step

208. . . step

209. . . step

300. . . Insulation Materials

301. . . perforation

400. . . Conductive material

500. . . monomer

600. . . Iron core

700. . . Ontology

1 is a flow chart of a first preferred embodiment of a process for a laminated balanced balun of the present invention;

Figure 2 is a flow chart illustrating the flow of the first preferred embodiment continuing from Figure 1;

Figure 3 is an exploded perspective view of the first preferred embodiment illustrating the preparation from bottom to top;

Figure 4 is an exploded perspective view showing the second preferred embodiment of the process of the laminated balanced balun of the present invention, illustrating the preparation from bottom to top;

Figure 5 is an exploded perspective view showing the third preferred embodiment of the process of the laminated balanced balun of the present invention, illustrating the preparation from bottom to top.

6 is a flow chart showing a fourth preferred embodiment of the process of the laminated balanced balun of the present invention;

Figure 7 is a flow chart showing the flow of Figure 4 of the fourth preferred embodiment; and

Figure 8 is an exploded perspective view of the fourth preferred embodiment illustrating the cutting of a body into a plurality of cells.

1. . . Lower substrate

2. . . First lower conductive unit

twenty one. . . First lower insulation layer

twenty two. . . First lower wire segment

3. . . First medium conductive unit

31. . . First intermediate insulation

32. . . First middle wire segment

4. . . First upper conductive unit

41. . . First upper insulating layer

42. . . First upper wire segment

5. . . Second lower conductive unit

51. . . Second lower insulation layer

52. . . Second lower wire segment

6. . . Second conductive unit

61. . . Second intermediate insulation

62. . . Second middle wire segment

7. . . Second upper conductive unit

71. . . Second upper insulating layer

72. . . Second upper wire segment

8. . . Upper substrate

9. . . Conductive end

300. . . Insulation Materials

301. . . perforation

400. . . Conductive material

500. . . monomer

Claims (10)

A laminated balanced unbalanced converter process comprising the steps of: (A) preparing a substrate; (B) preparing a first lower conductive layer unit on the lower substrate, the first lower conductive layer unit having a first lower layer An insulating layer and a first lower wire segment disposed on the first lower insulating layer; (C) preparing at least one first intermediate conductive layer unit on the first lower conductive layer unit, the first conductive layer unit having a first intermediate insulating layer, and a first middle wire segment disposed on the first intermediate insulating layer and electrically connected to the first lower wire segment, the first middle conductive layer unit is manufactured by firstly insulating the material Digging a through hole, then placing a conductive material in the through hole, the insulating material and the conductive material respectively forming the first intermediate insulating layer and the first middle wire segment; (D) preparing a first conductive layer unit on the first conductive layer unit a first upper conductive layer unit having a first upper insulating layer and a first upper wire segment disposed on the first upper insulating layer and electrically connected to the first middle wire segment; E) preparing a second lower conductive layer on the first upper conductive layer unit a second lower conductive layer unit having a second lower insulating layer and a second lower wire segment disposed on the second lower insulating layer; (F) preparing at least one of the second lower conductive layer unit a second conductive layer unit, the second middle conductive layer unit has a second intermediate insulating layer, and a second middle wire segment disposed on the second intermediate insulating layer and electrically connected to the second lower wire segment, The manufacturing process of the second conductive layer unit is to first dig a hole in the insulating material, and then place the conductive material in the through hole, and the insulating material and the conductive material respectively form the second intermediate insulating layer and the second middle wire segment; (G) preparing a second upper conductive layer unit on the second conductive layer unit, the second upper conductive layer unit has a second upper insulating layer, and a second upper insulating layer is disposed on the second upper insulating layer a second upper wire segment electrically connected to the wire segment; (H) preparing an upper substrate on the second upper conductive layer unit, the lower substrate, the first lower conductive layer unit, the first middle conductive layer unit, The first upper conductive layer unit, the second lower conductive layer unit, the first a medium conductive layer unit, the second upper conductive layer unit, the upper substrate constitutes a monomer to be processed; and (I) sintering four conductive ends on the monomer, respectively, the conductive ends are respectively associated with the monomer The lower wire segment, the first upper wire segment, the second lower wire segment, and the second upper wire segment are electrically connected. According to the laminated balanced unbalanced converter process of claim 1, in the step (E), the second lower conductive layer unit is located on the first upper conductive layer unit. According to the layered balanced unbalanced converter process of claim 1, in the step (E), the second lower conductive layer unit is located on the first lower conductive layer unit, in the step (F) The second middle conductive layer unit is located on the first middle conductive layer unit, and in the step (G), the second upper conductive layer unit is located on the first upper conductive layer unit. The step (C) and the step (F) are alternately performed according to the layered balanced unbalanced converter process described in claim 3, and a plurality of first conductive layer units and a plurality of second conductive layer units are prepared. The first middle wire segment is further formed on the second lower conductive layer unit and the second middle conductive layer unit, and the second middle wire segments are further formed on the first middle conductive layer unit and the first Upper conductive layer unit. According to the layered balanced unbalanced converter process of claim 4, in the step (B) to the step (G), the first upper conductive layer unit, the first middle conductive layer unit, the The first lower conductive layer unit, the second upper conductive layer unit, the second middle conductive layer unit, and the second lower conductive layer unit respectively further comprise a core portion, and the core portions are connected to each other in the longitudinal direction to form a block body shape. According to the layered balanced unbalanced converter process described in claim 1, in the step (B) to the step (G), the first upper conductive layer unit is prepared by printing, and the first intermediate a conductive layer unit, the first lower conductive layer unit, the second upper conductive layer unit, the second middle conductive layer unit, and the second lower conductive layer unit. According to the laminated balanced unbalanced converter process described in claim 6, in the step (B) to the step (G), the printing method is screen printing. According to the laminated balanced unbalanced converter process described in claim 1, after the step (I), there is a step (J) in which the conductive ends are made of a metal. Perform electroplating. According to the laminated balanced unbalanced converter process of claim 1, in the step (B) to the step (G), the first lower insulating layer, the first intermediate insulating layer, and the first upper insulating layer The second lower insulating layer, the second intermediate insulating layer and the second upper insulating layer are made of glass ceramic, the first lower wire segment, the first middle wire segment, the first upper wire segment, the second lower wire segment, The second middle wire segment, the second upper wire segment and the conductive ends are made of silver, the insulating material is glass ceramic, and the conductive material is silver. A laminated balanced unbalanced converter process comprising the steps of: (A) preparing a substrate; (B) preparing a plurality of first lower conductive layer units on the lower substrate, the first lower conductive layer units respectively having a first a first insulating layer and a first lower conductive line disposed on the first lower insulating layer; (C) preparing at least one first conductive layer unit on the first lower conductive layer unit, the first The middle conductive layer units respectively have a first intermediate insulating layer, and a first middle wire segment disposed on the first intermediate insulating layer and electrically connected to the first lower wire segment, the first middle conductive layer unit being fabricated The process is to first dig a hole through the insulating material, and then place a conductive material in the through hole, the insulating material and the conductive material respectively form the first intermediate insulating layer and the first middle wire segment; (D) at the first Forming a first upper conductive layer unit on the middle conductive layer unit, the first upper conductive layer units respectively have a first upper insulating layer, and a first upper insulating layer disposed on the first upper insulating layer and the first upper conductive layer First upper wire segment electrically connected; (E) at the same Forming a plurality of second lower conductive layer units on an upper conductive layer unit, wherein the second lower conductive layer units respectively have a second lower insulating layer and a second lower conductive portion disposed on the second lower insulating layer; F) preparing at least one second intermediate conductive layer unit on the second lower conductive layer unit, wherein the second middle conductive layer units respectively have a second intermediate insulating layer, and one of the second intermediate insulating layers is disposed on the second intermediate insulating layer a second middle wire segment electrically connected to the second lower wire segment, wherein the second conductive layer unit is manufactured by first digging a hole in the insulating material, and then placing a conductive material in the through hole, the insulating material And the conductive material respectively forms the second intermediate insulating layer and the second middle conductive segment; (G) respectively preparing a second upper conductive layer unit on the second conductive layer unit, the second upper conductive layer unit Each has a second upper insulating layer, and a second upper wire segment disposed on the second upper insulating layer and electrically connected to the second middle wire segment; (H) being prepared on the second upper conductive layer unit An upper substrate, the lower substrate, the first lower conductive layer a first intermediate conductive layer unit, the first upper conductive layer unit, the second lower conductive layer unit, the second middle conductive layer unit, the second upper conductive layer unit, the upper substrate Forming a body to be processed; (I) cutting the body into a plurality of monomers in a longitudinal direction; and (J) sintering the four conductive ends on the monomers, respectively, so that the conductive ends are respectively associated with the monomer The lower wire segment, the first upper wire segment, the second lower wire segment, and the second upper wire segment are electrically connected.