TW201310909A - Semiconductor device - Google Patents

Abstract

A semiconductor device is provided, including a logic circuit that has decreased a leakage current occurred during standby operation. The semiconductor device includes a power supply portion, for supplying a first operation voltage or a second operation voltage smaller than the first operation voltage; a P-type low-threshold transistor Tp, for receiving the first or the second operation voltage from the power supply portion; and a N-type transistor Tn connected between the transistor Tp and a base potential. The transistors Tp, Tn construct a logic circuit generating an output signal Dout corresponding to a signal Din inputted to the gate. The power supply portion supplies the first operation voltage to the source of the transistor Tp during active operation, and supplies the second operation voltage to the source of the transistor Tp during standby operation. The second operation voltage is set so that the voltage vibration amplitude between gate and source of each transistor Tp, Tn is larger than the threshold value of the transistors Tp, Tn.

Description

Semiconductor device

The present invention relates to a semiconductor device including a logic circuit or a logic gate, and more particularly to a semiconductor device that reduces power consumption in a standby state.

For memory such as flash memory and dynamic memory, in addition to the need to achieve a finer design, the steps of the process are reduced in accordance with the requirements of large capacity, low price, and low power consumption. In order to meet the above requirements, some effects will be caused. For example, in the process of a single-layer polysilicon, the critical value of the P-channel metal oxide semiconductor transistor rises, resulting in difficulty in achieving high-speed operation. Therefore, in order to improve the above, a transistor having a low critical value can be added, for example. However, if the threshold value is decreased, even if the voltage Vgs between the gate and the source is 0 V, there is a phenomenon of a so-called leakage current, which causes power to be consumed. In general, if the threshold value is smaller, the leakage current will be larger, and the power consumption will be more obvious.

In Japanese Laid-Open Patent Publication No. 2004-147175, a power supply switching transistor in which a gate oxide film is provided between a gate oxide film gate and a power line having a low threshold value is proposed. In the standby state, a large reverse bias voltage is applied to the power switch transistor, thereby reducing the leakage current of the power switch transistor.

Figure 1 is a diagram illustrating a conventional circuit for reducing leakage current. This circuit is suitable for a clock-synchronized data transmission circuit such as an input/output data buffer. This data transmission circuit includes a clock generation circuit C1 and an output circuit C2. The clock generation circuit C1 generates the internal clock signal InCLK based on the external clock signal ExCLK. The output circuit C2 synchronously outputs data according to the internal clock signal InCLK. The clock generation circuit C1 described above includes a first CMOS inverter (P1, N1), a second CMOS inverter (P2, N2), a P-channel MOS transistor Qp, and an N-channel transistor Qn. The external clock signal ExCLK is input to the first CMOS inverter (P1, N1). The second CMOS inverter (P2, N2) is connected to the output of the first CMOS inverter and is output to the internal clock signal InCLK. The P-channel MOS transistor Qp is located between the power source Vcc and the transistor P1. The N-channel transistor Qn is located between the output of the first CMOS inverter and the ground electrode GND.

A power down signal P/D is applied to the gates of the transistors Qp, Qn, and the power interrupt signal P/D is at a low logic level (indicated by the "L" level) during the enabling operation, and During standby, it is in the High Logic Level (represented by the "H" level). The P-type channel transistors P1, P2 constituting the first CMOS inverter and the second CMOS inverter described above are composed of a transistor having a low critical value.

The output circuit C2 includes a third CMOS inverter (P3, N3), a fourth CMOS inverter (P4, N4), a P-type channel transistor P5, an N-type channel transistor N5, a P-type channel transistor Qp, and N-channel transistor Qn. The internal data is input to the third CMOS inverter (P3, N3). The fourth CMOS inverter (P4, N4) is connected to the output of the third CMOS inverter, and outputs the above internal data. The P-type channel transistor P5 and the N-type channel transistor N5 are respectively connected in series to the third CMOS inverter. The P-type channel transistor Qp is located between the transistor P5 and the power source Vcc. The N-channel transistor Qn is located between the output of the third CMOS inverter and the ground electrode GND.

Inverted internal clock signal Applied to the gate of the transistor P5, the internal clock signal InCLK is applied to the gate of the transistor N5. The power interruption signal P/D is applied to the gates of the transistors Qp, Qn. The P-type channel transistors P3, P4 constituting the third CMOS inverter, the fourth CMOS inverter, and the pulse-synchronized transistor P5 are composed of a transistor having a low critical value.

During the enable operation, the power interrupt signal P/D is at a logic low (L) level. Therefore, the transistor Qp is in an on state, and the power source Vcc is coupled to the first CMOS inverter and the third CMOS inverter. At this time, the transistor Qn is in a closed state. Therefore, the internal clock signal InCLK synchronized with the external clock signal ExCLK is output from the clock generation circuit C1. In addition, in the output circuit C2, when the internal clock signal InCLK connected to the transistors P5, N5 is at a logic low (L) level, the internal data is taken by the third CMOS inverter, and the fourth CMOS inverter will be The data of the logical value corresponding to the logical value of the input data is output.

If transitioning to the standby state, the power interrupt signal P/D will be at the logic high (H) level. Therefore, in the clock generating circuit C1, the transistor Qp is in the off state, and the power supply operating voltage Vcc will not supply the operating voltage to the transistor P1 having a low threshold. Further, the transistor Qn is in an on state, by which the internal clock signal InCLK output from the clock generating circuit C1 is fixed at a logic high (H) level. Further, in the output circuit C2, the power supply operating voltage Vcc will not supply the operating voltage to the transistor P3, and the transistor Qn will be in the on state, whereby the data output will be fixed at the high level.

As described above, in order to reduce the leakage current of the transistors P1, P3 having a low threshold value, the transistors Qp, Qn having a general critical value must be connected in series, and must be logically set in accordance with the power interruption signal P/D. In the above manner, high-speed operation can be realized by using transistors P1, P3 having a low threshold. On the other hand, due to the series transistors Qp, Qn, the channel widths of the transistor P1 and the transistor Qp and the transistor P3 and the transistor Qp are increased, so that in order to set the standby state, it is necessary to increase the logic portion. Big. Further, in the standby mode, since the output data is fixed at the high level, in the case of switching from the standby state to the enable state, the logic portion must be initialized, so that more time is required.

An object of the present invention is to solve the above problems and to provide a logic circuit semiconductor device including a leakage current when a standby state is lowered.

Moreover, it is an object of the present invention to provide a semiconductor device that can be switched from a standby state to an enabled state without delay.

The semiconductor device of the present invention includes: a first MOS transistor of a P-type channel, receiving at least a first operating voltage or a second operating voltage smaller than the first operating voltage; and a second MOS transistor of the N-type channel, at least connected Between the first MOS transistor and the reference potential, the first MOS transistor and the second MOS transistor constitute a logic circuit that generates an output signal corresponding to a signal input to the gate. Providing a first operating voltage to a source of the first MOS transistor when the operation is enabled, and providing a second operating voltage to a source of the first MOS transistor in a standby state, setting the second operating voltage such that The amplitude of the voltage between the gate and the source of each of the first MOS transistor and the second MOS transistor is greater than the threshold of the first MOS transistor and the second MOS transistor.

In a preferred embodiment, the semiconductor device further includes a selection circuit that selects a first operating voltage when enabled to operate and a second operating voltage when in a standby state. Selection Circuit In a preferred embodiment, the first operating voltage or the second operating voltage is selected based on a control signal from the outside. The semiconductor device may further include a generating circuit that receives the first operating voltage from the outside and generates the second operating voltage according to the first operating voltage. The semiconductor device may further include a generating circuit that receives the second operating voltage from the outside and generates the first operating voltage according to the second operating voltage.

The logic circuit may include: a first inverter circuit including the first MOS transistor and the second MOS transistor, and a first inverter circuit connected to the first MOS transistor and the second A second inverter circuit of the MOS transistor. The external clock signal is input to the first inverter circuit, and the second inverter circuit outputs an internal clock signal. The logic circuit can further include circuitry for inputting and outputting data in synchronization with the internal clock signal. The logic circuit may further include: a power supply portion supplying the first operating voltage or the second operating voltage, a third MOS transistor serially connected to the P-type channel between the power supply portion and the first MOS transistor, and serially a fourth MOS transistor connected to the N-type channel between the second transistor and the reference potential, the first clock signal being input to the gate of the third MOS transistor, and the first clock signal is inverted The two-clock signal is input to the gate of the fourth MOS transistor, and the data is input to the gates of the first MOS transistor and the second MOS transistor.

The semiconductor device further includes: a memory array forming a memory element for storing data, and a data output circuit coupled to the memory array, the data output circuit including the logic circuit. The standby state refers to a period during which a wafer enable signal is not input from the outside to the semiconductor device. In addition, the standby state refers to a fixed period in which the command operation is not performed after the wafer enable signal is input.

According to the present invention, in the standby state, a second operating voltage lower than the first operating voltage is supplied to the first MOS transistor, and thus, the first MOS transistor can be made as compared with when the first operating voltage is supplied. Leakage current is reduced. Moreover, the second operating voltage is set such that the amplitude of the voltage between the gate and the source of each of the first MOS transistor and the second MOS transistor is greater than the threshold values of the first MOS transistor and the second MOS transistor, Therefore, the logic level of the signal input to the logic circuit can be maintained. According to the above result, when the transition from the standby state to the enable state is performed, the logic circuit can be initialized without being able to be processed quickly. Further, since it is not necessary to insert a transistor for performing logic setting based on the power interruption signal into the logic circuit as in the related art, it is possible to achieve a high integration and miniaturization of the logic circuit.

The above and other objects, features and advantages of the present invention will become more <RTIgt;

Next, embodiments of the present invention will be described in detail with reference to the drawings.

Fig. 2 is a view showing a basic configuration of a logic circuit of a semiconductor device according to a first example of the present invention. The semiconductor device 100 of the first example, in a preferred embodiment, includes a CMOS logic circuit or a CMOS logic gate formed on a germanium substrate, and a CMOS inverter is exemplified herein as a typical example, but not limited thereto. .

The semiconductor device 100 includes a P-type channel MOS transistor Tp, an N-channel MOS transistor Tn, and a power supply portion 110 that supplies an operating voltage to the transistor Tp. The P-type channel transistor Tp is preferably a transistor having a low critical value, and therefore, for example, the thickness of the gate insulating film is made thinner than a general insulating film.

The power supply unit 110 supplies an operating voltage to the CMOS inverter in accordance with the operational state of the semiconductor device. In a preferred example, as shown in the table of FIG. 3, the power supply unit 110 sets the internal power supply Vcc(Int) to be the same as the external power supply Vcc(Ext) when the semiconductor device is enabled (Active). The operating voltage V1 is set to an operating voltage V2 (V1 > V2) lower than the operating voltage V1 of the external power supply Vcc (Ext) in the standby state (Idle). The power supply portion 110 may include a circuit for supplying the operating voltage V2 as the internal power source Vcc(Int), and may include, for example, a level conversion circuit, a DC DC converter, or the like.

For the CMOS inverter shown in FIG. 2, when the semiconductor device is enabled to operate, an operating voltage V1 of, for example, 1.8 V is supplied to the source of the P-channel transistor Tp. Since the transistor Tp has a low threshold value, the conduction state at the time of signal input of the logic low level is changed stably, and the switching operation at this time also becomes faster.

On the other hand, when the semiconductor device is in the standby state or the standby mode, the operating voltage V2 is supplied, for example, to 1.3 V to the source of the P-type transistor transistor Tp. At this time, it should be noted that the operating voltage V2 is set such that the voltage Vgs between the gate and the source of the transistor Tp is larger than the critical value of the transistors Tp, Tn. That is, the operating voltage V2 is set in such a manner that the logic state of the high level or low level of the signal input to the CMOS inverter can be maintained. Since the operating voltage V2 is lower than the operating voltage V1, the switching speed of the transistor Tp is slower than that during the enabling operation, but the leakage current when the transistor Tp is turned off can be reduced.

In the standby state, when the data Din input to the CMOS inverter is at a logic low level, the transistor Tp is turned on, the transistor Tn is turned off, and the output data Dout is at a logic high level. On the other hand, when the input data Din is at a logic high level, the transistor Tp is turned off, the transistor Tn is turned on, and the output data Dout is at a logic low level. Even in the standby state, the semiconductor device 100 can operate while maintaining the logic level. Therefore, when transitioning from the standby state to the enable state, it is not necessary to perform initialization necessary for the conventional logic circuit. The operation can be switched from the standby state to the enabled state without delay. Furthermore, the standby state may be defined based on an external signal applied to the semiconductor device, or may be determined based on the external signal whether the internal circuit of the semiconductor device is in a standby state. The standby state may include, for example, a mode in which the operation of the semiconductor device is stopped for a fixed period, a mode in which the operation speed is smaller than a normal operation speed, or a mode in which power consumption is smaller than a general power consumption. In addition, the operating voltages V1, V2 can be appropriately selected in accordance with the size, critical value, and other operational characteristics of the MOS transistor.

4(a) to 4(c) are diagrams showing other examples of the power supply unit 110. In the example shown in FIG. 4(a), the semiconductor device includes an external terminal 112 that inputs an external power source Vcc (Ext). The power supply unit 110 supplies the operation voltage V1 input from the external terminal 112 as the external power source Vcc (Ext). Moreover, the semiconductor device includes a voltage generating circuit 130 for generating an operating voltage V2 in accordance with an operating voltage V1 of the external power source Vcc(Ext). This voltage generating circuit 130 supplies the operating voltage V2 as an internal power source Vcc(Int).

Further, in the example shown in FIG. 4(b), the semiconductor device inputs the operation voltage V2 from the external terminal 112 as the external power source Vcc(Ext). Further, the voltage generating circuit 130A boosts the operating voltage V2 of the external power source Vcc(Ext) to generate the operating voltage V1 as the internal power source Vcc(Int). In the example shown in FIG. 4(c), the semiconductor device inputs the voltage Va from the external terminal 112 as the external power source Vcc(Ext). Further, the voltage generating circuit 130B generates operating voltages V1, V2 as internal power sources Vcc(Int) in accordance with the voltage Va. In addition to the above, the semiconductor device may input the operating voltages V1, V2 from the external terminals as the external power source Vcc (Ext), respectively.

Next, a second example of the present invention will be described with reference to Figs. 5(a) and 5(b). In the second example, the semiconductor device 100A includes a selection circuit 120 to switch the operating voltage V1 or V2 of the CMOS inverter. The selection circuit 120 receives the control signal CTL and supplies the operating voltage V1 or the operating voltage V2 to the source of the transistor Tp in accordance with the control signal CTL. The control signal CTL indicates whether the semiconductor device is in an enabled state or a standby state. That is, the selection circuit 120 supplies the high operation voltage V1 when it is in the enable state and the low operation voltage V2 when it is in the standby state.

FIG. 5(b) shows a preferred embodiment of the selection circuit 120. The selection circuit 120 includes a power supply rail PWR that supplies a voltage Vb from an external power source or an internal power source, a power rail PWR that supplies an operation voltage V1 or an operation voltage V2, and a resistor R that is connected between the power rail PWR1 and the power rail PWR2. And an MOS transistor TR of an N-type channel connected in parallel with the resistor R. The control signal CTL is connected to the gate of the transistor TR. When the operation is enabled, the transistor TR is turned on in response to the control signal CTL, and the operating voltage V1 is supplied to the power supply rail PWR2. On the other hand, in the standby state, the transistor TR is not turned on in response to the control signal CTL, and the operating voltage V2 (<V1) is supplied to the power supply rail PWR2. The selection circuit 120 can be constructed by a very simple structure.

Next, a schematic diagram of a circuit structure of a third example of the present invention will be described with reference to FIG. In the third example, the semiconductor device 100B includes a power supply unit 140 and a selection circuit 150. The power supply unit 140 is configured to provide an operating voltage V1 and an operating voltage V2. The selection circuit 150 receives the operation voltage V1 and the operation voltage V2 from the power supply unit 140, and selectively outputs one of the operation voltage V1 or the operation voltage V2 in accordance with the control signal CTL. As in the case of the first example, the power supply section 140 may include a voltage generating circuit that generates an internal power source Vcc(Int) based on an external power source Vcc(Ext) or an external power source. The selection circuit 150 selects the operating voltage V1 or the operating voltage V2 according to the control signal CTL, and supplies the selected operating voltage to the source of the transistor Tp. The control signal CTL indicates whether the semiconductor device 100B is in an enabled state or in a standby state. In the case of the present example, the selection circuit 150 may select only one of the operating voltage V1 or the operating voltage V2. Alternatively, the operating voltage V1 and the operating voltage V2 supplied from the power supply unit 140 may be shared by other circuits. .

Next, a schematic diagram of a circuit configuration of a fourth example of the present invention will be described with reference to FIG. The semiconductor device 100C of the fourth example includes a typical clock generation circuit that generates an internal clock signal InCLK based on the external clock signal ExCLK. The clock generation circuit includes a first CMOS inverter 160A and a second CMOS inverter 160B. The first CMOS inverter 160A is configured to receive the external clock signal ExCLK. The second CMOS inverter 160B receives the output of the first CMOS inverter 160A and converts it to the internal clock signal InCLK output. Similarly to the first to third examples, the power supply unit 110 that selectively supplies the operating voltage V1 or the operating voltage V2 is connected to the first CMOS inverter 160A and the second CMOS inverter 160B.

When operating in the enabled state, the operating voltage V1 is supplied to the transistor Tp having the low threshold value in the first CMOS inverter 160A and the second CMOS inverter 160B to perform high speed operation. With this architecture, the internal clock signal InCLK having a short delay time is output according to the external clock signal ExCLK. On the other hand, in the standby state, the operating voltage V2 is supplied to the transistor Tp having a low threshold, but since the operating voltage V2 is set, the amplitude of the voltage of the external clock signal ExCLK is larger than the critical value of the transistor Tp. Therefore, the first CMOS inverter 160A outputs the clock signal InCLK' which maintains the logic state of the external clock signal ExCLK, and the clock signal CLK' is input to the second CMOS inverter 160B. But even in this case, since the operating voltage V2 is set such that the amplitude of the clock signal CLK' is larger than the critical value of the transistor Tp, the second CMOS inverter 160B will maintain the logic of the clock signal CLK'. The internal clock signal InCLK of the state is output. On the other hand, since the operating voltage V2 is smaller than the operating voltage V1, it is possible to suppress the leakage current of the transistor Tp having a low threshold value in the standby state.

Next, a schematic diagram of a circuit configuration of a fifth example of the present invention will be described with reference to Figs. 8(a) and 8(b). The semiconductor device 100D of the fifth example includes a power supply unit 110 and a logic circuit 170. The power supply section 110 selectively supplies the operating voltage V1 or the operating voltage V2 to the logic circuit 170. This logic circuit 170 includes a CMOS logic gate having a low threshold P-channel MOS transistor and an N-channel MOS transistor. The logic circuit 170 receives the external clock signal ExCLK or the internal clock signal InCLK, receives the input data Din, and outputs the processed output data Dout synchronized with the clock signal. When operating in the enabled state, the operating voltage V1 is supplied to the logic circuit 170 for high speed operation by a transistor having a low threshold. In the standby state, the operating voltage V2 is provided to the logic circuit 170, which operates at a slower speed than the operation in the enabled state, but is synchronized with the clock signal and maintains the CMOS logic gate. The logic level information is output.

Fig. 8(b) is a circuit diagram showing a preferred embodiment of the logic circuit 170 of the fifth example. The logic circuit 170 includes an inverter, a P-type channel transistor Tp having a low threshold value, and an N-type channel transistor Tn, and a low-critical P-channel connected in series between the transistor Tp and the power supply unit 110. The type transistor Qp and the N-type transistor transistor Qn connected in series between the transistor Tn and the ground. Input data Din is input to the gate of transistor Tp and transistor Tn, inverted internal clock signal The gate is supplied to the gate of the transistor Qp, and the internal clock signal InCLK is supplied to the gate of the transistor Qn. When the operation is enabled, the operating voltage V1 is supplied to the transistor Qp, and the logic circuit 170 acquires the input data Din in synchronization with the internal clock signal, and outputs the output data Dout.

In the standby state, the operating voltage V2 is supplied to the transistor Qp, and therefore, the leakage current of the transistor Qp is reduced. On the other hand, since the operating voltage V2 is set such that the amplitude of the voltage of the internal clock signal is greater than the critical value of the transistor Qp, when the transistor Qp is turned on, the operating voltage V2 is supplied to the source of the transistor Tp. The transistor Tp is turned on or off corresponding to the logic state of the input material Din.

Next, a schematic diagram of a different circuit of a sixth example of the present invention will be described with reference to FIGS. 9 to 12. Fig. 9 shows a data output circuit 180 of the sixth example, which is applied, for example, to the NAND type flash memory 100E shown in Fig. 12. As shown in FIG. 12, the flash memory 100E includes a memory array 200, an input/output buffer 210, an address register 220, a data register 230, a controller 240, a word line selection circuit 250, and a page buffer/ The sensing circuit 260, the column selection circuit 270, and the internal voltage generating circuit 280.

The memory array 200 has a plurality of memory cells arranged in a matrix. The input/output buffer 210 is connected to the external input/output terminal I/O and holds input and output data. The address register 220 receives the address data from the input and output buffer 210. The controller 240 receives command data from the data register 230 or the input/output buffer 210 and controls each part based on the command. The word line selection circuit 250 decodes the row address information Ax from the address register 220, and selects a block and selects a word line based on the result of this decoding. The page buffer/sense circuit 260 is for sensing data read from the page selected by the word line selection circuit 250 or holding the write data written to the selected page. The column selection circuit 270 decodes the column address information Ay from the address register 220, and selects the bit line based on the result of this decoding. The internal voltage generating circuit 280 is used to generate the voltage necessary to read the data, program the data, and delete the data.

As explained in the example, the internal voltage generating circuit 280 supplies the operating voltages V1, V2 corresponding to the operation state of the enable state or the standby state. Although not shown here, the flash memory 100E can receive an external clock signal or generate a clock signal by a clock generation circuit.

The external input/output terminal I/O includes a plurality of terminals, and the plurality of terminals can share the address input terminal, the data input terminal, the data output terminal, and the command input terminal, and the command latch enable signal and the address latch are caused The enable signal, the wafer enable signal, the read enable signal, the write enable signal, and the output enable signal are input as an external control signal, and then the ready/busy signal is output.

The memory array 200 includes two memory banks 200L, 200R that are simultaneously accessible. The memory group 200L includes m blocks BLK(L)1, BLK(L)2, ..., BLK(L)m+1 in the column direction, and the memory group 200R includes m blocks BLK in the column direction ( R)1, BLK(R)2, ..., BLK(R)m+1. Each block of the memory group is connected to the n-bit bit line BL, and the NAND cell group in which a plurality of memory cells are connected in series is connected to each bit line BL.

Data is transferred between the input and output buffer 210 and the address register 220, the data register 230, and the controller 240. Commands, data, and address information transmitted from a memory controller (not shown) are supplied to the controller 240, the address register 220, and the data register 230 via the input/output buffer 210. Further, at the time of reading, the material read from the page buffer/sense circuit 260 is transferred to the input/output buffer 210 via the data register 230.

The controller 240 performs control based on the sequence of reading, programming, or deletion based on the command material received from the input/output buffer 210. The command data includes, for example, a read command, a program command, a delete command, a wafer enable signal CE, a write enable signal WE, a read enable signal RE, an address latch enable signal ALE, and a command latch enable signal. CLE, and output enable signal OE, and the like. For example, the controller 240 discriminates the address information and the written data based on the command data, and transmits the former to the word line selection circuit 250 or the column selection circuit 270 via the address register 220, and passes the latter to the data register 230. It is transferred to the page buffer/sense circuit 260.

The word line selection circuit 250 decodes the upper bit of the row address information from the address register 220, and selects each page in the selected pair of blocks in the two memory groups 200L, 200R. The page buffer/sense circuit 260 is coupled to the data register 230, transmits the read data to the data register 230 according to the read/write command, or receives the transferred write data from the data register 230. The column selection circuit 270 decodes the column address information Ay from the address register 220, and selects the data or bit line held in the page buffer/sense circuit 260 based on the decoding result.

The material output circuit 180 shown in FIG. 9 is applied to, for example, the input/output buffer 210. The data output circuit 180 includes a clock generation circuit C1 and a data output circuit C2. The clock generation circuit C1 generates an internal clock signal InCLK based on the external clock signal ExCLK. The data output circuit C2 is configured to output the data in synchronization with the internal clock generated by the clock generation circuit C1.

P1, P2, P3, P4, and P5 are low-value P-channel MOS transistors, and N1, N2, N3, N4, and N5 are N-channel MOS transistors.

Fig. 10(a) is a schematic diagram showing the operation waveforms of the data output circuit in which the threshold values Th1 of the transistors P1 to P5 are relatively high, and Fig. 10(b) is the lower threshold value Th2 of the transistors P1 to P5 as shown in Fig. 9 ( Schematic diagram of the operation waveform of the data output circuit of Th2<Th1). In the data output circuit having no low threshold value, the internal clock signal InCLK is generated from the external clock signal ExCLK after the delay time D1, and then the output data Dout is generated after the delay time D2 is passed from the internal clock signal InCLK. On the other hand, in the data output circuit 180 including the transistors P1 to P5 having low threshold values, the internal clock signal InCLK is generated in the delay time Da (Da < D1), and the delay is delayed from the internal clock signal InCLK. The data output Dout is generated in the time Db (Db < D2).

Fig. 11 shows an operation waveform when the material output circuit 180 shown in Fig. 9 is applied to the flash memory 100E. At time t1, if the wafer enable signal Output enable signal (both are low active) as an external control signal, and input to the flash memory 100E, the controller 240 responds to this by changing the control signal from a logic low level indicating a standby state to indicating that it is enabled. The logic high level of the state. The control signal is supplied to the various parts of the memory, and the internal voltage generating circuit 280 generates the operating voltage V1 in response to the control signal enabling the operation of Active, and supplies the operating voltage V1 to the data output circuit 180. Here, the internal voltage generating circuit 280 boosts the operating voltage V2 to generate an operating voltage V1 as the internal power source Vcc(Int).

The controller 240 outputs a control signal of the enable state during the processing period (t1-t2) corresponding to the command, during which the operation voltage V1 is supplied to the material output circuit 180. Therefore, the data output circuit 180 synchronizes with the clock signal CLK, and generates an output data Dout after a fixed delay time from the clock signal CLK. If the control signal is switched to the standby state, the internal voltage generating circuit 280 supplies the operating voltage V2 to the data output circuit 180 in response thereto. When the controller 240 has to perform high-speed processing in accordance with a predetermined operation sequence, the control signal is switched to the enable state during the period t3-t4 and the period t5-t6, during which the operating voltage V1 is supplied to the data output circuit. 180. When the control signal is in the standby state (period t2-t3, period t4-t5, and period t6-t7), the operating voltage V2 is supplied to the data output circuit 180, but since the clock generating circuit C1 maintains the logic of the clock signal CLK The state, therefore, even if the control signal is switched from the standby state to the enabled state, it is not necessary to initialize the data output circuit, thereby suppressing the delay time of the output data Dout.

The logic circuit illustrated in the example is an example, and the present invention is also applicable to CMOS logic gates or CMOS logic circuits other than the above. Moreover, the present invention is applicable not only to flash memory but also to dynamic random access memory, static random access memory, microcontroller, microprocessor, and special purpose integrated circuit (ASIC). Various semiconductor devices.

The preferred embodiments of the present invention have been described in detail, but the present invention is not limited to the specific embodiments, and various modifications and changes can be made without departing from the scope of the invention.

While the invention has been described above by way of a preferred embodiment, it is not intended to limit the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application.

100, 100A, 100B, 100C, 100D. . . Semiconductor device

100E. . . Flash memory

110, 140. . . Power supply department

112. . . External terminal

120, 150. . . Selection circuit

130, 130A, 130B. . . Voltage generating circuit

160A. . . First CMOS inverter

160B. . . Second CMOS inverter

170. . . Logic circuit

180. . . Data output circuit

200. . . Memory array

200L, 200R. . . Memory group

210. . . Input and output buffer

220. . . Address register

230. . . Data register

240. . . Controller

250. . . Word line selection circuit

260. . . Page buffer/sense circuit

270. . . Column selection circuit

280. . . Internal voltage generating circuit

Ax. . . Row address information

Ay. . . Column address information

BLK(L)1, BLK(L)2, BLK(L)m+1, BLK(R)1, BLK(R)2, BLK(R)m+1. . . Block

C1. . . Clock generation circuit

C2. . . Output circuit / data output circuit

CE. . . Wafer enable signal

CLK, CLK'. . . Clock signal

CTL. . . control signal

D1, D2, Da, Db. . . delay

Din. . . Input data / data / signal

Dout. . . Output data / output signal

ExCLK. . . External clock signal

InCLK. . . Internal clock signal

N1. . . N-channel MOS transistor / first CMOS inverter

N2. . . N-channel MOS transistor / second CMOS inverter

N3. . . N-channel MOS transistor / third CMOS inverter

N4. . . N-channel MOS transistor / fourth CMOS inverter

N5. . . N-type channel MOS transistor / N channel transistor / transistor

OE. . . Output enable signal

P/D. . . Power interruption signal

P1. . . Transistor / First CMOS Inverter / P-Channel Transistor / P-Channel MOS Transistor

P2. . . Second CMOS inverter / P type channel transistor / P type channel MOS transistor

P3. . . Third CMOS inverter / P type channel transistor / transistor / P type channel MOS transistor

P4. . . Fourth CMOS inverter / P type channel transistor / P type channel MOS transistor

P5. . . P-channel transistor/transistor/P-channel MOS transistor

PWR1, PWR2. . . Power rail

Qn. . . N-channel transistor/transistor

Qp. . . P-type channel transistor / P-type channel MOS transistor / transistor / P-type channel transistor

R. . . resistance

T1. . . time

Tn. . . N-channel MOS transistor / N-type transistor / transistor

Tp. . . P-channel MOS transistor / P-type transistor / transistor / P-channel transistor

TR. . . N-channel MOS transistor/transistor

V1, V1/V2. . . Operating voltage

V2. . . Operating voltage/voltage

Va, Vb. . . Voltage

Vcc. . . Power supply / operating voltage

Vcc(Ext). . . External power supply

Vcc(Int). . . Internal power supply

Fig. 1 is a schematic diagram showing the structure of a conventional logic circuit for reducing leakage current.

2 is a schematic structural view of a semiconductor device according to a first example of the present invention.

3 is a table showing the relationship between the operating voltage supplied from the voltage supply unit and the operating state.

4(a) to 4(c) are schematic views showing a preferred embodiment of the configuration of the power supply unit.

5(a) and 5(b) are schematic diagrams showing the structure of a semiconductor device according to a second example of the present invention.

Fig. 6 is a schematic structural view of a semiconductor device according to a third example of the present invention.

Fig. 7 is a schematic structural view of a semiconductor device according to a fourth example of the present invention.

8(a) and 8(b) are schematic diagrams showing the structure of a semiconductor device according to a fifth example of the present invention.

Figure 9 is a schematic view showing the structure of a semiconductor device according to a sixth example of the present invention.

Fig. 10(a) is a timing chart when the transistor is not at a low threshold value in the logic circuit of Fig. 1, and Fig. 10(b) is a timing chart when the transistor has a low threshold value in the logic circuit of Fig. 1. .

Figure 11 is a timing chart showing the flash memory of the data output circuit to which the sixth example of the present invention is applied.

Figure 12 is a block diagram showing the structure of a flash memory circuit to which the data output circuit of the sixth example of the present invention is applied.

100. . . Semiconductor device

110. . . Power supply department

Din. . . Input data / data / signal

Dout. . . Output data / output signal

Tn. . . N-channel MOS transistor / N-type transistor / transistor

Tp. . . P-type channel MOS transistor / P type transistor / transistor / P type channel transistor

Claims (12)

A semiconductor device comprising: a first MOS transistor of a P-type channel, receiving at least a first operating voltage or a second operating voltage smaller than the first operating voltage; and a second MOS transistor of the N-type channel, at least connected Between the first MOS transistor and a reference potential, the first MOS transistor and the second MOS transistor form a logic circuit corresponding to a signal input to the gate thereof to generate an output signal, characterized in that In the operation of the energy state, the first operating voltage is supplied to the source of the first MOS transistor, and the second operating voltage is supplied to the source of the first MOS transistor during operation in the standby state, The second operating voltage is set such that the amplitude of the voltage between the gate and the source of the first MOS transistor and the second MOS transistor is greater than the threshold of the first MOS transistor and the second MOS transistor value. The semiconductor device of claim 1, further comprising a selection circuit, wherein the selection circuit selects the first operating voltage during operation of the enabling state, and selects the second during operation of the standby state Operating voltage. The semiconductor device according to claim 2, wherein the selection circuit selects the first operating voltage or the second operating voltage based on a control signal from the outside. The semiconductor device according to any one of claims 1 to 3, further comprising a generating circuit that receives the first operating voltage from the outside and generates the second operation according to the first operating voltage Voltage. The semiconductor device according to any one of claims 1 to 3, further comprising a generating circuit that receives the second operating voltage from the outside and generates the first operating voltage according to the second operating voltage . The semiconductor device as claimed in claim 1, wherein the logic circuit comprises: a first inverter circuit including the first MOS transistor and the second MOS transistor, and is connected to the first inversion And comprising a second inverter circuit of the first MOS transistor and the second MOS transistor, an external clock signal is input to the first inverter circuit, and the second inverter circuit is internally The clock signal is output. The semiconductor device of claim 1, wherein the logic circuit further comprises a circuit for inputting and outputting data in synchronization with the internal clock signal. The semiconductor device of claim 1, wherein the logic circuit further comprises: a power supply unit that supplies the first operating voltage or the second operating voltage, and is connected in series to the power supply unit and the first MOS a third MOS transistor of a P-type channel between the transistors, and a fourth MOS transistor connected in series to the N-type channel between the second MOS transistor and the reference potential, the first clock signal is input to the a gate of the third MOS transistor, a second clock signal obtained by inverting the first clock signal is input to a gate of the fourth MOS transistor, and data is input to the first MOS transistor and the first The gate of two MOS transistors. The semiconductor device according to claim 1, further comprising a memory array forming a memory element for storing data, and a data output circuit connected to the memory array, wherein the data output circuit includes the logic Circuit. The semiconductor device according to claim 1, wherein the standby state refers to a period in which the wafer enable signal is not externally input to the semiconductor device. The semiconductor device according to claim 1, wherein the standby state is a fixed period in which a command operation is not performed after the wafer enable signal is input. The semiconductor device of claim 11, wherein the semiconductor device is a flash memory.