TW201309966A - LED lamp and water-cooling module thereof - Google Patents

Abstract

A led lamp is disclosed and comprises a lighting portion and a water-cooling module. The water-cooling module comprises a heat conducting base, a fluid transmission assembly and a heat conducting assembly. The heat conducting base contacts with the lighting portion, the fluid transmission assembly drives the cooling fluid to circulate and has a heat-absorbable plate with a plurality of heat-absorbable protrusion, and the heat conducting assembly communicates with the heat conducting base and the fluid transmission assembly to form a circulation channel, thereby the cooling fluid circulates inside the circulation channel so as to dissipate heat which absorbing from the lighting portion by the heat conducting base.

Description

Light-emitting diode lighting device and water-cooling heat-dissipating module thereof

The present invention relates to a water-cooled heat-dissipating module, and more particularly to a light-emitting diode lighting device suitable for light-emitting diode lighting and a water-cooling heat-dissipating module thereof.

With the advancement of industrial technology, lighting technology, appliances, processes and methods have also been continuously developed and innovated. Among them, Light-Emitting Diode (LED) light source is the mainstream of current lighting technology. The low-power characteristics of the LEDs not only reduce the use of crude oil by power plants, but also significantly reduce the amount of carbon dioxide generated during power generation. They protect the earth's resources, prevent the greenhouse effect, and green the environment. The great contribution, in response to the demand for modern environmental protection, energy saving and carbon reduction, to gradually replace the traditional incandescent and fluorescent lighting industry, advanced countries have even legislatively supervised the replacement of public lighting facilities with more energy-efficient LED sources.

In order to increase the illumination and more illumination of the LED, it is applied to traffic lights, street lamps, and even indoor lighting in general homes and offices. It is often used to increase the area of the LED or to use multiple LEDs. The body is bundled to obtain high brightness, and this method is necessary to increase the overall current. However, the high heat problem associated with high currents is unavoidable, especially when using high-luminous power LEDs of more than six watts per watt, the reduction in luminance and lifetime loss due to high heat. The phenomenon is a problem that the industry has to face up to. For example, when the pn junction temperature of the light-emitting diode is 75 degrees Celsius, the brightness is only 80% of the temperature at 25 degrees Celsius (standard operating temperature), if the temperature of the pn junction is in Celsius At 175 degrees, the brightness is only 40% at 25 degrees Celsius; similarly, when the temperature is pn junction, when the temperature is 75 degrees Celsius, the life of the LED is only 50 degrees Celsius. 50% of the light, if used at an operating temperature of 150 degrees Celsius, the life of the light-emitting diode is only 5% at 50 degrees Celsius.

The effect of temperature on brightness is linear, but the effect on life is exponential, also based on the junction temperature. If it is kept below 50 °C, the LED has a lifetime of nearly 20,000 hours, and only 75 hours at 75 °C. There are 5,000 hours left at 100 ° C, 2,000 hours left at 125 ° C, and 1,000 hours left at 150 ° C. The above numerical values show that when the temperature light is changed from 50 ° C to 2 times 100 ° C, the service life is reduced from 20,000 hours to 1/4 times 5,000 hours, and it is understood that the high temperature is extremely harmful to the LED.

Therefore, the high temperature working environment not only reduces the brightness of the light-emitting diode, but also greatly shortens the service life of the light-emitting diode lighting device, increases the waste of resources and the cost of purchase, and even fails to achieve the initial energy saving and carbon reduction. The purpose of the improvement is necessary for immediate improvement.

The main purpose of the present invention is to provide a light-emitting diode lighting device, which can solve the problem that the brightness of the conventional light-emitting diode is increased by increasing the current, and the high-temperature working environment caused by the high heat is easy to cause the brightness of the light-emitting diode to be reduced. And the shortcomings of the service life decay.

Another object of the present invention is to provide a water-cooling heat dissipating module, wherein a fluid conveying component drives a cooling fluid to circulate in a circulating flow passage in a heat conducting seat, a heat conducting component, and a fluid conveying component to accelerate the lighting of the LED. The device cools and dissipates heat, thereby achieving the effects of maintaining high brightness of the light-emitting diode and prolonging the service life.

In order to achieve the above object, a broader embodiment of the present invention provides a light-emitting diode lighting device, comprising: a lighting component and a water-cooling heat-dissipating module, the water-cooling heat-dissipating module comprising at least: a heat conducting seat, in contact with the lighting component; and the fluid conveying An assembly for driving a cooling fluid circulating flow, having a heat absorbing plate member having a plurality of heat absorbing blocks; and a heat conducting component communicating with the heat conducting seat and the fluid conveying assembly to form a circulation flow path for The cooling fluid flows in the circulation flow path, so that the heat energy generated by the illumination component is absorbed by the heat conduction seat, and then circulated by the cooling fluid in the circulation flow path for water cooling.

In order to achieve the above object, another broad aspect of the present invention is a water-cooling heat dissipation module, which is suitable for a light-emitting diode lighting device. The light-emitting diode lighting device has a lighting component, and the water-cooling heat-dissipating module includes at least: heat conduction. a seat, in contact with the lighting component; a fluid transporting assembly for driving the cooling fluid to circulate, having a heat absorbing plate member having a plurality of heat absorbing blocks; and a heat conducting component connected to the heat conducting seat and the fluid transporting component To form a circulation flow path for the cooling fluid to flow in the circulation flow path, so that the thermal energy generated by the illumination component is absorbed by the heat transfer seat, and then circulated by the cooling fluid in the circulation flow path for water cooling.

Some exemplary embodiments embodying the features and advantages of the present invention are described in detail in the following description. It is to be understood that the present invention is capable of various modifications in the various aspects of the present invention, and the description and illustration are in the nature of

Please refer to FIGS. 1A and 1B , which are schematic views of the exploded structure and assembly structure of the LED lighting device with a water-cooling heat dissipation module according to a preferred embodiment of the present invention. As shown in FIGS. 1A and 1B, the light-emitting diode lighting device 1 of the present invention includes at least an illumination member 2 and a water-cooling heat dissipation module 3, and the illumination member 2 is provided with a plurality of light-emitting diodes (LEDs) as a light source. For providing illumination, the water-cooling heat dissipation module 3 is connected to the illumination component 2 for dissipating heat from the illumination component 2. The water-cooling heat dissipation module 3 includes a heat-conducting base 31, a heat-conducting component 32, and a fluid-transporting component 33. One end of the heat-conducting seat 31 is attached to the high-heat-generating lighting component 2 for absorbing the heat energy generated by the lighting component 2, The thermally conductive component 32 in communication with the thermally conductive seat 31 is transferred to the fluid delivery assembly 33.

In some embodiments, the thermally conductive component 32 includes at least two circulating conduits 321, 322, one end of which is in communication with the thermally conductive seat 31 and the other end is associated with the inlet passage 338a and the outlet passage of the fluid delivery assembly 33. The 338b is connected to form a circulation flow path, and the circulation flow path disposed in the heat conduction seat 31, the heat conduction component 32, and the fluid delivery device 33 can be communicated through the communication flow so that the cooling fluid flows in the circulation flow path. The heat energy produced by component 2 is carried into fluid delivery assembly 33 for heat dissipation.

As well, the fluid delivery assembly 33 can be, but is not limited to, a piezoelectric pump for driving cooling fluid to circulate within the circulation channels of the thermally conductive seat 31 and the thermally conductive assembly 32, and in other embodiments, on the fluid delivery assembly 33. An active heat dissipating device, for example, a fan 330, may be disposed on the heat absorbing plate member 331 of the fluid transporting assembly 33 for actively dissipating heat from the heat absorbing plate member 331 to accelerate the lighting component. 2 heat dissipation, thereby achieving the effect of maintaining the high brightness of the light-emitting diode and prolonging the service life. In addition, since the fluid transport assembly 33 has detachable characteristics, when the fluid transport assembly 33 is damaged or malfunctions, only the fluid transport assembly 33 needs to be replaced, and the entire set of the light-emitting diode lighting device 1 is not required to be replaced, thereby reducing maintenance costs. The effect.

Please refer to FIG. 1A, FIG. 2A and FIG. 2B simultaneously. FIG. 2A and FIG. 2B are schematic diagrams showing the front and back exploded structures of the heat conducting seat of the light emitting diode lighting device shown in FIG. 1A. As shown in FIG. 1A, the heat conducting seat 31 is disposed at the bottom of the illuminating member 2, and is in contact with the illuminating member 2 and is thermally conducted, so that the heat energy generated by the illuminating member 2 is transmitted to the heat conducting seat 31 for heat exchange. Referring to FIGS. 2A and 2B , the heat transfer seat 31 has a body 310 and a heat conductive cover 311 . The heat conductive cover 311 has an inner surface 311 a and an outer surface 311 b . The outer surface 311 b corresponds to the illumination component 2 for the illumination component. 2 is attached thereto, and the heat of the illumination member 2 is transferred to the heat transfer seat 31. The inner surface 311a corresponds to the body 310, and the inner surface 311a has a plurality of heat absorbing blocks 311c, but is not limited thereto.

The main body 310 has an inlet 310a and an outlet 310b for correspondingly connecting with the circulation ducts 321 and 322 of the heat-conducting component 32, and further has a receiving portion 310c on the inner side of the body 310, when the heat-conducting cover 311 is assembled with the body 310. The plurality of heat absorbing blocks 311c on the inner surface 311a of the heat conductive cover 311 can be accommodated in the accommodating portion 310c of the body 310. The accommodating portion 310c is in communication with the inlet 310a and the outlet 310b. When the cooling liquid flows into the accommodating portion 310c via the circulation conduit 321 of the heat-conducting component 32 and the inlet 310a of the heat-conducting base 31, the heat-conducting portion 310c can be thermally conductive. The plurality of heat absorbing blocks 311c on the inner surface 311a of the cover 311 exchange heat, and the heat-carrying cooling liquid can then flow out of the heat conducting seat 31 from the outlet 310b, and is transferred from the circulation conduit 322 of the heat-conducting component 32 to the fluid transporting assembly 33. Loop in.

Please refer to FIGS. 3A and 3B , which are schematic diagrams showing the front and back exploded structures of the fluid transport assembly of the LED lighting device shown in FIG. 1A , respectively. As shown, the fluid transport assembly 33 is sequentially from top to bottom by a cover 337, an actuating device 336, a valve body cover 335, a circuit board 334, a valve body film 333, a valve body seat 332, and a heat absorbing plate member 331. composition. The valve body film 333 is disposed between the valve body seat 332 and the valve body cover 335, and the valve body film 333 and the valve body seat 332 and the valve body cover body 335 are stacked on each other, and the valve body cover is assembled. The corresponding position on the body 335 is further provided with an actuating device 336. The actuating device 336 is assembled from a vibrating membrane 336a and an actuator 336b for driving the fluid transport assembly 33, and in the unactuated state, the vibrating membrane 336a is separated from the valve body cap 335 to The definition forms a pressure chamber 335c. In addition, in the embodiment, the bottom of the valve body seat 332 of the fluid transport assembly 33 further has a liquid storage chamber 332a for temporarily storing the fluid, and the heat sink device 31 can be associated with the heat sink device 31 to promote heat dissipation. In other embodiments, the fluid transport assembly 33 can further have an active heat sink, such as a fan 330, which can be disposed corresponding to the heat absorbing plate member 331 for actively dissipating heat from the heat absorbing plate member 331. In this embodiment, when the fan 330 and the heat absorbing plate member 331 are combined with the structure of the cover body 337, the actuating device 336, the valve body cover 335, and the valve body seat 332, the assembly of the fluid transport assembly 33 can be completed. At the same time, a fluid circuit device can be formed together with the heat conducting seat 31 and the heat conducting component 32.

The valve body seat 332 has an inlet passage 338a and an outlet passage 338b. The fluid is transferred to the opening 332b of the valve body seat 332 via the inlet passage 338a, and then transferred to the valve body film 333. And an outlet temporary storage chamber between the valve body film 333 and the valve body seat 332 for temporarily storing the fluid, and flowing the fluid through the opening 332c and the outlet temporary cavity when the fluid is transported downward from the valve body film 333. It is further transported downward into the liquid storage chamber 332a, and finally discharged from the liquid storage chamber 332a to the outlet passage 338b of the valve body seat 332 to be discharged.

Please also refer to FIGS. 3A and 3B , the valve body film 333 is mainly a sheet structure having substantially the same thickness, and has a plurality of hollow valve switches thereon, including a first valve switch and a second valve switch, in this embodiment. The first valve opening relationship is an inlet valve structure 333a, and the second valve opening relationship is an outlet valve structure 333b, wherein the inlet valve structure 333a has an inlet valve piece and a plurality of hollow holes provided around the periphery of the inlet valve piece. In addition, there is an extension between the holes that is connected to the inlet valve plate. Similarly, the outlet valve structure 333b also has a structure such as an outlet valve piece, a hollow hole provided around the periphery of the outlet valve piece, and an extension connected to the outlet valve piece. The valve body cover 335 has an inlet valve passage 335a and an outlet valve passage 335b corresponding to the inlet valve structure 333a and the outlet valve structure 333b, respectively, and has an inlet temporary cavity between the valve body film 333 and the valve body cover 335. . And having a pressure chamber 335c disposed on a surface of the valve body cover 335 corresponding to the actuator 336b of the actuator 336, the pressure chamber 335c communicating with the inlet temporary chamber via the inlet valve passage 335a, and At the same time, it is in communication with the outlet valve passage 335b.

In the present embodiment, when the actuator 336 is driven by a voltage to cause bending deformation, the volume of the pressure chamber 335c is caused to change, thereby generating a pressure difference to push the fluid, causing the fluid to flow from the inlet passage 338a on the valve body seat 332. Through the inlet valve structure 333a of the valve body film 333, enter the pressure chamber 335c, and flow from the outlet valve structure 333b of the valve body film 333 to the liquid storage chamber 332a of the valve body seat 332, and along the heat absorbing plate member 331 The flow passage 331e (shown as shown in Fig. 4A) flows and is discharged by the outlet passage 338b of the valve body seat 332, thereby achieving the purpose of causing water cooling and cooling of the cooling fluid circulation.

Please refer to FIGS. 4A and 4B, which are schematic diagrams of the front and back structures of the heat absorbing plate member of the fluid transporting assembly shown in FIG. 3A, respectively. As shown, the heat absorbing plate member 331 is substantially a plate-like structure, and the heat absorbing plate member 331 has a first surface 331a and a second surface 331c corresponding to the first surface 331a. A plurality of heat absorbing blocks 331b and 331d are respectively disposed on the first surface 331a and the second surface 331c. In this embodiment, the heat absorbing block 331b on the first surface 331a may be, but not limited to, an upright fin structure. And each heat absorbing block 331b is arranged in parallel with each other to define a plurality of flow channels 331e, so that the fluid can flow in the plurality of flow channels 331e, and in the process of flowing and adjacent heat absorbing blocks 331b is in contact. In some embodiments, the heat absorbing block 331b is made of a heat absorbing material, such as a metal material, but not limited thereto, so that the fluid can transfer heat to the contact heat absorbing process during contact with the heat absorbing block 331b. On block 331b, the crucible is cooled by water. In other embodiments, the heat absorbing block 331d on the second surface 331c may be, but is not limited to, a micro-cylinder structure.

Please refer to the figures 3A, 3B, 4A and 4B. In this embodiment, the heat absorbing plate member 331 can be assembled with the liquid storage chamber 332a of the valve body seat 332, but not limited thereto, and the first surface is not limited thereto. 331a corresponds to the liquid storage chamber 332a of the valve body seat 332, that is, the heat absorbing block 331b thereon can be engaged in the liquid storage chamber 332a, so that when the fluid flows into the liquid storage chamber 332a, it needs to flow through a plurality of The flow path 331e between the heat absorbing blocks 331b is subjected to heat exchange and is discharged from the outlet passage 338b of the valve body seat 332. The second surface 331c of the heat absorbing plate member 331 is an air contact surface, and the fan 330 is correspondingly assembled thereon to forcibly dissipate heat from the heat absorbing plate member 331.

In addition, in some embodiments, the structure of the valve body seat 332, the valve body cover 335, and the like of the fluid transport assembly 33 may be formed of a heat-absorbing material, such as a metal material, but not limited thereto. The heat exchange can be performed during the transportation of the fluid between the valve body seat 332 and the valve body cover 335, and the heat dissipation can be further promoted.

Please refer to FIG. 5 , which is a schematic diagram of a light-emitting diode lighting device and a water-cooling heat-dissipating module thereof applied to a headlight according to a preferred embodiment of the present invention. In this embodiment, the light-emitting diode lighting device 1 of the present invention is applied to a head-mounted headlight, that is, a water-cooled light-emitting diode headlight 10, but the application is not limited thereto. It is said that the light-emitting diode lighting device 1 with a water-cooling heat-dissipating module can be widely applied to bicycle lights, flashlights or automobile headlights, etc., and is not limited thereto.

1. . . Light-emitting diode lighting device

10. . . Water-cooled LED headlights

2. . . Lighting component

20. . . Fixed structure

3. . . Water cooling module

31. . . Thermal conduction seat

310. . . Ontology

310a. . . Entrance

310b. . . Export

310c. . . Housing

311. . . Thermal cover

311a. . . The inner surface

311b. . . The outer surface

311c, 331b, 331d. . . Heat absorbing block

32. . . Thermal component

321, 322. . . Circulatory catheter

323. . . power cable

33. . . Fluid delivery assembly

330. . . fan

331. . . Heat absorbing plate

331a. . . First surface

331c. . . Second surface

331e. . . aisle

332. . . Valve seat

332a. . . Liquid storage chamber

332b, 332c. . . Opening

333. . . Body film

333a. . . Inlet valve structure

333b. . . Outlet valve structure

334. . . Circuit board

335. . . Body cover

335a. . . Inlet valve passage

335b. . . Outlet valve passage

335c. . . Pressure chamber

336. . . Actuating device

336a. . . Vibration film

336b. . . Actuator

337. . . Cover

338a. . . Entrance channel

338b. . . Exit channel

4. . . Carrying the body

FIG. 1A is an exploded structure of a light-emitting diode lighting device with a water-cooling heat dissipation module according to a preferred embodiment of the present invention.

Figure 1B: It is a schematic diagram of the assembled structure of Figure 1A.

Fig. 2A is a front exploded view showing the thermal conductive seat of the light-emitting diode lighting device shown in Fig. 1A.

Fig. 2B is a schematic view showing the back side decomposition structure of Fig. 2A.

Fig. 3A is a front exploded view showing the fluid transporting assembly of the light-emitting diode lighting device shown in Fig. 1A.

Fig. 3B is a schematic view showing the back side decomposition structure of Fig. 3A.

Fig. 4A is a front structural view showing the heat absorbing plate member of the fluid transporting assembly shown in Fig. 3A.

Figure 4B: This is a schematic view of the back structure of Figure 4A.

Fig. 5 is a schematic view showing the application of the light-emitting diode lighting device and the water-cooling heat-dissipating module of the preferred embodiment of the present invention to a headlight.

1. . . Light-emitting diode lighting device

2. . . Lighting component

20. . . Fixed structure

3. . . Water cooling module

31. . . Thermal conduction seat

32. . . Thermal component

321, 322. . . Circulatory catheter

33. . . Fluid delivery assembly

330. . . fan

331. . . Heat absorbing plate

338a. . . Entrance channel

338b. . . Exit channel

Claims (9)

A light emitting diode lighting device comprising:
a lighting component; and a water cooling module, comprising at least:
a thermally conductive seat in contact with the illumination component;
a fluid transporting assembly for driving a cooling fluid to circulate, having a heat absorbing plate member, wherein the heat absorbing plate member has a plurality of heat absorbing blocks; and a heat conducting component communicating with the heat conducting seat and the fluid transporting component A circulating flow path is formed for the cooling fluid to flow in the circulating flow path, so that the heat energy generated by the lighting component is absorbed by the heat conducting seat, and then the cooling fluid in the circulating flow channel is circulated for water cooling. The illuminating diode illuminating device of claim 1, wherein the fluid transporting component is a piezoelectric pump having an inlet passage and an outlet passage for inputting and outputting the cooling fluid. The illuminating diode illuminating device of claim 2, wherein the heat conducting component has at least two circulating conduits, one end of the at least two circulating conduits being in communication with the thermally conductive seat, and the other end being respectively associated with the fluid conveying device The inlet passage and the outlet passage are in communication. The light-emitting diode lighting device of claim 1, wherein the heat-conducting base further comprises a body and a heat-conducting cover body, the heat-conducting cover body having an inner surface and an outer surface, the outer surface being coupled to the illumination The components are correspondingly arranged, the inner surface corresponds to the body, and the inner surface further has a plurality of heat absorption blocks. The light-emitting diode lighting device of claim 4, wherein the body has an inlet, an outlet, and a receiving portion, the inlet and the outlet are in communication with the heat-conducting component, and the receiving portion is Corresponding to a plurality of heat absorbing blocks that accommodate the inner surface of the heat conductive cover. The light-emitting diode lighting device of claim 1, wherein the heat-absorbing block is an upright fin structure or a micro-cylindrical structure. The illuminating diode device of claim 1, wherein the fluid conveying device further comprises an active heat dissipating device for actively dissipating heat from the heat absorbing plate member. The illuminating diode illuminating device according to claim 1, wherein the illuminating diode illuminating device is applied to at least one of a headlight, a bicycle lamp, a flashlight, and a car headlight. The invention relates to a water-cooling heat-dissipating module, which is suitable for a light-emitting diode lighting device. The light-emitting diode lighting device has a lighting component, and the water-cooling heat-dissipating module comprises at least:
a thermally conductive seat in contact with the illumination component;
a fluid transporting assembly for driving a cooling fluid to circulate, having a heat absorbing plate member, wherein the heat absorbing plate member has a plurality of heat absorbing blocks; and a heat conducting component communicating with the heat conducting seat and the fluid transporting component A circulating flow path is formed for the cooling fluid to flow in the circulating flow path, so that the heat energy generated by the lighting component is absorbed by the heat conducting seat, and then the cooling fluid in the circulating flow channel is circulated for water cooling.