TWI431736B - Lamp with heat-dissipating device - Google Patents

Description

Lamp heat sink

The present invention relates to a heat sink for a lamp, and more particularly to a heat sink for a lamp that is suitable for illumination of a light-emitting diode.

With the advancement of industrial technology, lighting technology, appliances, processes and methods have also been continuously developed and innovated. Among them, Light-Emitting Diode (LED) light source is the mainstream of current lighting technology. The low-power characteristics of the LEDs not only reduce the use of crude oil by power plants, but also significantly reduce the amount of carbon dioxide generated during power generation. They protect the earth's resources, prevent the greenhouse effect, and green the environment. The great contribution, in response to the demand for modern environmental protection, energy saving and carbon reduction, to gradually replace the traditional incandescent and fluorescent lighting industry, advanced countries have even legislatively supervised the replacement of public lighting facilities with more energy-efficient LED sources.

In order to increase the illumination and more illumination of the LED, it is applied to traffic lights, street lamps, and even indoor lighting in general homes and offices. It is often used to increase the area of the LED or to use multiple LEDs. The body is bundled to obtain high brightness, and this method is necessary to increase the overall current. However, the high heat problem associated with high currents is unavoidable, especially when using high-luminous power LEDs of more than six watts per watt, the reduction in luminance and lifetime loss due to high heat. The phenomenon is a problem that the industry has to face up to. For example, when the p-n junction temperature of the light-emitting diode is 75 degrees Celsius, The brightness is only 80% of the temperature at 25 degrees Celsius (standard operating temperature). If the temperature of the pn junction is 175 degrees Celsius, the brightness is only 40% when the temperature is 25 degrees Celsius. Similarly, the temperature at the pn junction is Precisely, when used at a working temperature of 75 degrees Celsius, the lifetime of the light-emitting diode is only 50% of that used at 50 degrees Celsius. If used at an operating temperature of 150 degrees Celsius, the lifetime of the light-emitting diode is only 50 degrees Celsius. 5% of the time used.

The effect of temperature on brightness is linear, but the effect on life is exponential, also based on the junction temperature. If it is kept below 50 °C, the LED has a lifetime of nearly 20,000 hours, and only 75 hours at 75 °C. There are 5,000 hours left at 100 ° C, 2,000 hours left at 125 ° C, and 1,000 hours left at 150 ° C. The above values show that when the temperature light is changed from 50 ° C to 2 times 100 ° C, the service life is reduced from 20,000 hours to 1/4 times 5,000 hours, which shows that the high temperature is extremely harmful to LDE.

Therefore, the high temperature working environment not only reduces the brightness of the light-emitting diode, but also greatly shortens the service life of the light-emitting diode, increases the waste of resources and the cost of purchase, and even fails to achieve the purpose of initial energy saving and carbon reduction. There is a need for immediate improvement.

The main purpose of the present invention is to provide a heat dissipating device for a lamp, which can solve the problem that the brightness of the conventional light-emitting diode is increased by increasing the current, and the high-temperature working environment caused by the high heat is easy to cause the brightness of the light-emitting diode to be reduced and used. The shortcomings of life decay.

Another object of the present invention is to provide a heat sink for a lamp, which is assisted by a heat conducting component, and a fluid transporting component drives a cooling fluid to circulate in a circulating flow path of the heat conducting component to accelerate the heat dissipation of the lighting device. Achieve the effect of maintaining the high brightness of the light-emitting diode and prolonging the service life.

In order to achieve the above object, the present invention provides a luminaire comprising a lighting device and a heat dissipating module, the heat dissipating module comprising at least: a pedestal; a heat conducting component coupled to the illuminating device and the pedestal for assisting The illuminating device dissipates heat, and the heat conducting component has a circulating flow path for a cooling fluid to flow in the circulating flow channel; and a fluid conveying component is detachably disposed on the pedestal for driving the cooling The fluid circulates in the circulating flow passage of the heat conducting component to dissipate the lighting device.

1‧‧‧Lighting

2‧‧‧Lighting device

3‧‧‧ Thermal Module

31‧‧‧ Pedestal

311‧‧‧Exit channel

3111, 3121‧‧‧ first end

3112, 3122‧‧‧ second end

312‧‧‧ Entrance Channel

313‧‧‧ positioning slot

32‧‧‧thermal components

321‧‧‧heating seat

3211‧‧‧Heat plate

32111‧‧‧Heat-absorbing parts

322‧‧‧Seal

323‧‧‧Internal catheter

324‧‧‧External catheter

33‧‧‧ Fluid delivery components

331‧‧‧ Entrance

332‧‧‧Export

34‧‧‧Circular runners

341‧‧‧Input runner

342‧‧‧Output runner

A-A‧‧‧ section tangential

Figure 1 is a schematic view of the structure of the lamp of the preferred embodiment of the present invention.

Fig. 2 is a schematic view showing the combination of the structures shown in Fig. 1.

Fig. 3 is a cross-sectional view taken along the line A-A of the structure shown in Fig. 2.

Figure 4A is a schematic view showing the structure of the micro-cylinder heat absorbing member of the heat absorbing plate of the preferred embodiment of the present invention.

FIG. 4B is a structural schematic view of the upright fin arrangement heat absorbing member of the heat absorbing plate of the preferred embodiment of the present invention.

Figure 5 is a schematic view of a circulation flow path of the preferred embodiment of the present invention.

Some exemplary embodiments embodying the features and advantages of the present invention are described in detail in the following description. It is to be understood that the present invention is capable of various modifications in the various aspects of the present invention, and the description and illustration are in the nature of

Please refer to FIG. 1 , which is a schematic diagram of a heat sink of a lamp according to a preferred embodiment of the present invention. As shown in Figure 1, the lamp 1 of this case is suitable for a light-emitting diode and includes at least a lighting device. The illuminating device 2 can be a light emitting diode (LED), and the heat dissipating module 3 includes at least a pedestal 31, a heat conducting component 32 and a fluid transporting component 33. The heat transfer component 32 is connected to the illumination device 2 and the base 31 for assisting the illumination device 2 to dissipate heat, and the heat conduction component 32 has a circulation flow path for the cooling fluid to flow in the circulation flow channel; the fluid delivery component 33 can be However, it is not limited to the piezoelectric pump, and can be detachably disposed on the base 31 for driving the cooling fluid to circulate in the circulation flow path of the heat conduction component 32, thereby accelerating the heat dissipation of the illumination device 2, thereby achieving the remaining illumination. The high brightness of the diode and the longevity. In addition, since the fluid delivery assembly 33 has the characteristics of being detachable, plugged and unplugged, when the fluid delivery assembly 33 is damaged or malfunctions, only the fluid delivery assembly 33 needs to be replaced, and the entire set of lamps 1 need not be replaced, thereby achieving the effect of reducing maintenance costs. .

Please refer to Fig. 1 and Fig. 2 and Fig. 3, Fig. 2 is a combination diagram of the structure shown in Fig. 1, and Fig. 3 is a cross-sectional view of the structure shown in Fig. 2, in some implementations. For example, the base 31 of the heat dissipation module 3 of the present invention further has an outlet passage 311, an inlet passage 312 and a positioning groove 313; the heat conduction assembly 32 further includes a heat conduction seat 321, a plurality of seals 322, an inner conduit 323 and an outer conduit 324; The fluid delivery assembly 33 further has an inlet 331 and an outlet 332. The heat conducting seat 321 is disposed at the bottom of the illuminating device 2, and is in contact with the illuminating device 2 and is thermally conductive, so that the heat energy generated by the illuminating device 2 is transmitted to the heat conducting seat 321 for heat exchange; the positioning groove of the base 31 The 313 is in communication with the first end 3111 of the outlet passage 311 and the first end 3121 of the inlet passage 312, and the positioning groove 313 of the base 31 is for positioning the fluid delivery assembly 33, and the fluid delivery assembly 33 is positioned at the base. When the positioning slot 313 of the seat 31 is located, the inlet 331 and the outlet 332 of the fluid delivery unit 33 are respectively connected to the first end portion 3111 of the outlet passage 311 and the first end portion 3121 of the inlet passage 312, and the connection is connected. In order to use, for example, a quick connector or a one-way valve to match the male-female connector, but not limited thereto.

In addition, the second end portion 3112 of the outlet passage 311 and the second end portion 3122 of the inlet passage 312 are respectively connected to the outer duct 324 and the inner duct 323, and the outer duct 324 may be a heat conductor such as a metal material, and the inner duct 323 is It can be a non-thermal conductor such as ceramic material, but not limited thereto. And the outer conduit 324 is sleeved outside the inner conduit 323 and at least partially covers the inner conduit 323 to form a circulation flow passage 34. In this embodiment, the circulation flow path 34 may include an input flow path 341 and an output flow path 342 for circulating cooling fluid in the flow path to accelerate the heat dissipation of the illumination device 2.

Please refer to FIG. 3, FIG. 4A and FIG. 4B. In this embodiment, the bottom of the heat conducting base 321 is provided with a heat absorbing plate. The heat absorbing plate 3211 is provided with a plurality of heat absorbing members 32111, wherein the inner duct 323 and the outer duct are provided. The other end of the 324 is connected to the heat conducting base 321 , and the heat absorbing plate 3211 of the heat conducting base 321 is connected to the input flow channel 341 and the output flow channel 342 (ie, the circulation flow channel 34 ), and the heat absorbing plate 3211 has a plurality of heat absorption layers. The member 32111 can be arranged in a structure such as a micro-cylinder, and the heat-absorbing members 32111 are alternately arranged with each other (as shown in FIG. 4A) or the structure of the vertical fin arrangement, and the heat-absorbing members 32111 are arranged in parallel with each other ( As shown in FIG. 4B, a heat dissipation channel through which the cooling fluid can flow is formed, but is not limited thereto.

According to the concept of the present invention, in order to avoid the overflow of the cooling fluid during the circulating flow, the sealing member 322 of the heat conducting component 32 may be disposed at the junction of the heat conducting seat 321 with the inner conduit 323 and the outer conduit 324, or may be disposed on the base 31 and the interior. The conduit 323 and the outer conduit 324 are connected to prevent the cooling fluid from overflowing outside the heat sink of the lamp of the present invention, but not limited thereto.

Please refer to FIG. 5 and cooperate with FIG. 3, wherein FIG. 5 is a schematic diagram of a circulation flow path of the preferred embodiment of the present invention. As shown in the figure, the lamp 1 of the present invention can be filled with a cooling fluid in the circulation flow path 34 in advance, and then pumped through the fluid delivery unit 33 to circulate in the circulation flow path 34 through the input flow path. The 341 flows to the heat absorbing plate 3211 and flows into the output flow path 342 through the passage formed by the plurality of heat absorbing members 32111, and then flows to the fluid delivery assembly 33 via the outlet passage 311, and is pressurized by the fluid delivery assembly 33, and then The cooling fluid is pushed into the input flow path 341 through the inlet passage 312 to form a closed circulating heat dissipation circuit, thereby continuously performing the heat dissipation of the illumination device 2.

In summary, the present invention provides a heat sink for a lamp that is circulated by a heat transfer component and a fluid transport component that drives a cooling fluid to circulate in a circulating flow path of the heat transfer component to solve the problem of increasing the current through the light-emitting diode. When the brightness is increased, the high-temperature working environment caused by the high heat is likely to cause the defects of the brightness reduction of the light-emitting diode and the decay of the service life, and accelerate the heat dissipation of the illumination device while maintaining the high brightness of the light-emitting diode. And extend the life and other effects.

The present invention has been described in detail by the above-described embodiments, and may be modified by those skilled in the art, without departing from the scope of the appended claims.

1‧‧‧Lighting

2‧‧‧Lighting device

3‧‧‧ Thermal Module

31‧‧‧ Pedestal

311‧‧‧Exit channel

312‧‧‧ Entrance Channel

313‧‧‧ positioning slot

32‧‧‧thermal components

321‧‧‧heating seat

322‧‧‧Seal

323‧‧‧Internal catheter

324‧‧‧External catheter

33‧‧‧ Fluid delivery components

331‧‧‧ Entrance

332‧‧‧Export

Claims (9)

A heat sink device has a lighting device and a heat dissipating module, the heat dissipating module at least comprising: a base; a heat conducting component connected to the lighting device and the base for assisting the lighting device to dissipate heat, The heat conducting component has a circulating flow path for a cooling fluid to flow in the circulating flow channel, and the heat conducting component comprises a heat conducting seat disposed at the bottom of the lighting device, the heat conducting block comprising a heat absorbing plate, the heat absorbing plate Having a plurality of heat absorbing members disposed in communication with the circulation flow path to form a heat dissipation passage for the cooling fluid to flow; and a fluid delivery assembly detachably disposed on the base for driving the cooling fluid The circulating flow path of the heat conducting component circulates to cause the lighting device to dissipate heat. The heat sink assembly of claim 1, wherein the heat conducting component comprises: an inner conduit connected to the heat conducting base and the base; and an outer conduit connected to the heat conducting base and the base And sleeved outside the inner conduit, at least partially covering the inner conduit, and forming the circulation flow passage. The heat sink assembly of claim 2, wherein the heat conducting component further comprises a plurality of sealing members disposed at the joint of the heat conducting seat and the inner conduit and the outer conduit, and disposed on the base and the inner portion The conduit and the outer conduit junction. The heat sink of the lamp of claim 1, wherein the plurality of heat absorbing members are arranged in a micro cylinder structure, and the heat absorbing members are staggered with each other. The heat sink of the lamp of claim 1, wherein the plurality of heat absorbing members are arranged in an upright fin arrangement, and the heat absorbing members are arranged in parallel with each other. The heat sink of the lamp of claim 2, wherein the outer conduit is a heat conductor, and the inner conduit is a non-thermal conductor. The heat sink of the lamp of claim 1, wherein the fluid transporting component is a piezoelectric pump having an inlet and an outlet for inputting and outputting the cooling fluid. The heat sink of the lamp of claim 7, wherein the circulating flow prop has an input flow path and an output flow path for inputting and outputting the cooling fluid. The heat sink of the lamp of claim 8, wherein the base includes an outlet passage, an inlet passage and a positioning slot, the outlet passage and the inlet passage respectively intersecting the input flow passage of the circulation flow passage and The output flow channel is in communication, the positioning groove is configured to be inserted into the fluid delivery assembly such that the inlet of the fluid delivery assembly communicates with the outlet passage, the outlet of the fluid delivery assembly communicates with the inlet passage to form a cooling fluid One of the closed circulation channels.