TW201306972A - Process for the production of valve metal powders - Google Patents
Process for the production of valve metal powders Download PDFInfo
- Publication number
- TW201306972A TW201306972A TW101142130A TW101142130A TW201306972A TW 201306972 A TW201306972 A TW 201306972A TW 101142130 A TW101142130 A TW 101142130A TW 101142130 A TW101142130 A TW 101142130A TW 201306972 A TW201306972 A TW 201306972A
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- Taiwan
- Prior art keywords
- powder
- metal
- ppm
- μfv
- surface area
- Prior art date
Links
- 239000000843 powder Substances 0.000 title claims abstract description 78
- 239000002184 metal Substances 0.000 title abstract description 49
- 229910052751 metal Inorganic materials 0.000 title abstract description 47
- 238000000034 method Methods 0.000 title abstract description 12
- 238000004519 manufacturing process Methods 0.000 title abstract description 8
- 230000008569 process Effects 0.000 title abstract description 7
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims abstract description 12
- 238000003825 pressing Methods 0.000 claims description 10
- 238000005245 sintering Methods 0.000 claims description 9
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 3
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 239000011651 chromium Substances 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052700 potassium Inorganic materials 0.000 claims description 3
- 239000011591 potassium Substances 0.000 claims description 3
- 229910052708 sodium Inorganic materials 0.000 claims description 3
- 239000011734 sodium Substances 0.000 claims description 3
- 229910052797 bismuth Inorganic materials 0.000 claims description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 2
- 239000003990 capacitor Substances 0.000 abstract description 21
- 229910052987 metal hydride Inorganic materials 0.000 abstract description 14
- 150000004681 metal hydrides Chemical class 0.000 abstract description 14
- 229910052715 tantalum Inorganic materials 0.000 abstract description 4
- 150000002739 metals Chemical class 0.000 abstract description 3
- 239000010405 anode material Substances 0.000 abstract description 2
- 239000002245 particle Substances 0.000 description 21
- 238000009826 distribution Methods 0.000 description 17
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 16
- 239000011777 magnesium Substances 0.000 description 15
- 238000006722 reduction reaction Methods 0.000 description 15
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 14
- 229910052749 magnesium Inorganic materials 0.000 description 14
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 13
- 229910052707 ruthenium Inorganic materials 0.000 description 13
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 12
- 239000007789 gas Substances 0.000 description 12
- 239000001301 oxygen Substances 0.000 description 12
- 229910052760 oxygen Inorganic materials 0.000 description 12
- 230000009467 reduction Effects 0.000 description 11
- 238000006392 deoxygenation reaction Methods 0.000 description 10
- 239000012159 carrier gas Substances 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 8
- 239000011148 porous material Substances 0.000 description 8
- 239000011164 primary particle Substances 0.000 description 8
- 229910052786 argon Inorganic materials 0.000 description 7
- 238000001878 scanning electron micrograph Methods 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 239000010419 fine particle Substances 0.000 description 5
- 229910052684 Cerium Inorganic materials 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 229910052758 niobium Inorganic materials 0.000 description 3
- 239000010955 niobium Substances 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 238000002161 passivation Methods 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 229910052720 vanadium Inorganic materials 0.000 description 3
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000003570 air Substances 0.000 description 2
- 239000012080 ambient air Substances 0.000 description 2
- LJCFOYOSGPHIOO-UHFFFAOYSA-N antimony pentoxide Chemical compound O=[Sb](=O)O[Sb](=O)=O LJCFOYOSGPHIOO-UHFFFAOYSA-N 0.000 description 2
- 229910052788 barium Inorganic materials 0.000 description 2
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- 239000011575 calcium Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 150000004678 hydrides Chemical class 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 229910012375 magnesium hydride Inorganic materials 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- 229910000000 metal hydroxide Inorganic materials 0.000 description 2
- 150000004692 metal hydroxides Chemical class 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 229910052712 strontium Inorganic materials 0.000 description 2
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000005303 weighing Methods 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 229910052792 caesium Inorganic materials 0.000 description 1
- TVFDJXOCXUVLDH-UHFFFAOYSA-N caesium atom Chemical compound [Cs] TVFDJXOCXUVLDH-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- MNNHAPBLZZVQHP-UHFFFAOYSA-N diammonium hydrogen phosphate Chemical compound [NH4+].[NH4+].OP([O-])([O-])=O MNNHAPBLZZVQHP-UHFFFAOYSA-N 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000002848 electrochemical method Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000012705 liquid precursor Substances 0.000 description 1
- MIVBAHRSNUNMPP-UHFFFAOYSA-N manganese(2+);dinitrate Chemical compound [Mn+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O MIVBAHRSNUNMPP-UHFFFAOYSA-N 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000012702 metal oxide precursor Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052754 neon Inorganic materials 0.000 description 1
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229940110728 nitrogen / oxygen Drugs 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 239000005518 polymer electrolyte Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920000128 polypyrrole Polymers 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- -1 potassium hexafluoroantimonate Chemical compound 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000011163 secondary particle Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
- H01G9/052—Sintered electrodes
- H01G9/0525—Powder therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
- B22F9/20—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from solid metal compounds
- B22F9/22—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from solid metal compounds using gaseous reductors
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B34/00—Obtaining refractory metals
- C22B34/10—Obtaining titanium, zirconium or hafnium
- C22B34/12—Obtaining titanium or titanium compounds from ores or scrap by metallurgical processing; preparation of titanium compounds from other titanium compounds see C01G23/00 - C01G23/08
- C22B34/1204—Obtaining titanium or titanium compounds from ores or scrap by metallurgical processing; preparation of titanium compounds from other titanium compounds see C01G23/00 - C01G23/08 preliminary treatment of ores or scrap to eliminate non- titanium constituents, e.g. iron, without attacking the titanium constituent
- C22B34/1209—Obtaining titanium or titanium compounds from ores or scrap by metallurgical processing; preparation of titanium compounds from other titanium compounds see C01G23/00 - C01G23/08 preliminary treatment of ores or scrap to eliminate non- titanium constituents, e.g. iron, without attacking the titanium constituent by dry processes, e.g. with selective chlorination of iron or with formation of a titanium bearing slag
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B34/00—Obtaining refractory metals
- C22B34/20—Obtaining niobium, tantalum or vanadium
- C22B34/24—Obtaining niobium or tantalum
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B4/00—Electrothermal treatment of ores or metallurgical products for obtaining metals or alloys
- C22B4/08—Apparatus
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B5/00—General methods of reducing to metals
- C22B5/02—Dry methods smelting of sulfides or formation of mattes
- C22B5/10—Dry methods smelting of sulfides or formation of mattes by solid carbonaceous reducing agents
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B5/00—General methods of reducing to metals
- C22B5/02—Dry methods smelting of sulfides or formation of mattes
- C22B5/12—Dry methods smelting of sulfides or formation of mattes by gases
- C22B5/14—Dry methods smelting of sulfides or formation of mattes by gases fluidised material
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B5/00—General methods of reducing to metals
- C22B5/02—Dry methods smelting of sulfides or formation of mattes
- C22B5/18—Reducing step-by-step
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B9/00—General processes of refining or remelting of metals; Apparatus for electroslag or arc remelting of metals
- C22B9/05—Refining by treating with gases, e.g. gas flushing also refining by means of a material generating gas in situ
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
- B22F2998/10—Processes characterised by the sequence of their steps
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Geology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Geochemistry & Mineralogy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Powder Metallurgy (AREA)
- Manufacture And Refinement Of Metals (AREA)
Abstract
Description
本發明關於一種經由還原金屬及/或金屬氫化物,自對應的初級粉末製造具有高比表面積之閥金屬粉末的方法,以及關於一種製造適用於作為高比電容之電解電容器用陽極材料之鉭粉末的方法。 The present invention relates to a method for producing a valve metal powder having a high specific surface area from a corresponding primary powder via a reduced metal and/or a metal hydride, and to a tantalum powder for producing an anode material for an electrolytic capacitor as a high specific capacitance. Methods.
適用於作為還原金屬者為鎂、鈣、鋇及/或鑭及/或其氫化物,尤其鎂。 Suitable as reducing metals are magnesium, calcium, barium and/or barium and/or their hydrides, especially magnesium.
根據本發明,鈦、鋯、鉿、釩、鈮、鉭、鉬及/或鎢(較佳為鈮及/或鉭)之細微粒粉末,尤其鉭粉,係用作初級粉末。 According to the invention, fine particle powders of titanium, zirconium, hafnium, vanadium, niobium, tantalum, molybdenum and/or tungsten, preferably niobium and/or tantalum, especially niobium powder, are used as primary powders.
本發明將特別地針對供製造電容器用之鉭粉末的製法說明如下。 The present invention will be specifically described below with respect to a process for producing a tantalum powder for use in a capacitor.
就具有極大活性的電容器表面且因而具有適用於行動通信電子裝置之密實結構之固態電解電容器而言,經由利用其安定性(“閥金屬”)、較高的介電常數以及絕緣的五氧化物層(可經由電化學方法產生之具有極均勻的層厚度者),係廣泛地使用具有五氧化鈮及五氧化鉭障壁施於對應導電載體之電容器。對應的五氧化物之金屬前驅體係用作載體。載體(於同一時間形成電容器電極之一(陽極))則包含經由燒結細微粒初級結構所製成之高孔隙海綿狀結構,或已成為海綿狀二級結構。載體結構的表面經電解氧化(“形成”)為五氧化物,其中五氧化物層的厚度係透過電解氧化反應之最大電壓(“形成電 壓”)測定。相對電極係藉著以硝酸錳(經熱轉化為二氧化錳)或以聚合物電解質液態前驅體浸漬海綿狀結構且接著進行聚合反應而製得;因而製得的導電聚合物通常為聚吡咯、聚苯胺或聚噻吩。電極之電接點係透過鉭或鈮絲網(係於製造載體結構期間燒結)而形成於一側上,並且金屬電容器覆蓋物對於絲網而言是絕緣的。 For solid electrolytic capacitors with extremely active capacitor surfaces and thus having a dense structure suitable for mobile communication electronics, by utilizing their stability ("valve metal"), higher dielectric constant, and insulating pentoxide A layer (which can be produced by an electrochemical method having a very uniform layer thickness) is widely used as a capacitor having a ruthenium pentoxide and a ruthenium pentoxide barrier applied to a corresponding conductive carrier. A corresponding metal oxide precursor system of pentoxide is used as the carrier. The carrier (forming one of the capacitor electrodes (anode) at the same time) contains a high-porosity sponge-like structure made through the sintered fine-particle primary structure, or has become a sponge-like secondary structure. The surface of the support structure is electrolytically oxidized ("formed") into a pentoxide, wherein the thickness of the pentoxide layer is the maximum voltage that is transmitted through the electrolytic oxidation reaction ("forming electricity Pressed.) The opposite electrode is prepared by impregnating a sponge structure with manganese nitrate (thermally converted to manganese dioxide) or a polymer electrolyte liquid precursor followed by polymerization; thus producing a conductive polymer Usually polypyrrole, polyaniline or polythiophene. The electrical contacts of the electrodes are formed on one side through a tantalum or tantalum wire (sintered during the manufacture of the carrier structure), and the metal capacitor cover is for the wire mesh Insulation.
電容器的電容C係根據下式計算而得:C=(F˙ε)/(d˙VF) The capacitance C of the capacitor is calculated according to the following formula: C = ( F ̇ ε) / (d ̇ V F )
其中F為電容器表面,ε為介電常數,d為每V形成電壓之絕緣層厚度,以及VF為形成電壓。五氧化鉭的介電常數ε為27,並且每伏特形成電壓層厚度成長率為18埃/伏特。由於金屬和五氧化物之不同密度,五氧化物層係於形成期間以約1/3之比例成長於原始金屬結構中,以及以約2/3之比例成長於金屬結構上。因成長的五氧化物層之故,孔隙變得較小,直到變成阻塞的或密閉孔隙形成為止,其中陰極可能無法形成。因此,此處有活性電容器表面之損失。當損失愈大時,則形成電壓(即五氧化物層厚度)愈大。理想上,陽極結構的最小孔隙以及其通道斷面比五氧化物層厚度(以選定的形成電壓所形成者)大了數倍。 Where F is the surface of the capacitor, ε is the dielectric constant, d is the thickness of the insulating layer forming a voltage per V, and V F is the forming voltage. The dielectric constant ε of ruthenium pentoxide is 27, and the voltage layer thickness growth rate per volt is 18 angstroms/volt. Due to the different densities of the metal and the pentoxide, the pentoxide layer grows in the original metal structure at a ratio of about 1/3 during formation and grows on the metal structure at a ratio of about 2/3. Due to the growing pentoxide layer, the pores become smaller until they become blocked or closed pores, in which the cathode may not form. Therefore, there is a loss of the surface of the active capacitor. The greater the loss, the greater the voltage (i.e., the thickness of the pentoxide layer) is formed. Ideally, the minimum pore size of the anode structure and its channel cross-section are several times larger than the thickness of the five oxide layer (formed by the selected formation voltage).
具有比表面積4至20平方公尺/克之細微粒鉭初級粉末係經由使七氟鉭酸鉀還原而製得(透過鹼氯金屬中之鹼金屬),或更近期則得自細微粒氧化物(透過氣相還原金屬或金屬氫化物,尤其鎂),或經由來自鉭塊(透過真空中之電子束或氫氣下還原之氧化物,於藉氫飽和作用脆化之後製得(“碎 片”))之化學粉碎作用。 The fine particle 钽 primary powder having a specific surface area of 4 to 20 m 2 /g is obtained by reducing potassium hexafluoroantimonate (transsorbed alkali metal in an alkali chloride metal) or, more recently, from fine particle oxide ( Reduction of metal or metal hydrides, in particular magnesium, by gas phase, or by embrittlement from a mass of cesium (electron beam or electron reduction under vacuum), after embrittlement by hydrogen saturation ("crushed The chemical pulverization effect of the film ")).
此等初級粉末通常仍展現許多缺點,因為根據今日的標準,其仍不適用於製造電容器。因此,其通常於低於1000℃之溫度下歷經還原處理(“脫氧反應”),視情況於高溫處理之後進行,俾使初級和二級結構安定化。就此方面而論,初級粉末係於一或多個階段中與高理想配比量(代表殘餘氧含量)之細微粒鎂混合,並且於脫氧溫度700°至1000℃下,於保護氣體下加熱若干小時。於脫氧期間,除去殘餘氧氣,初級顆粒結構變得均勻,並且有利地影響二級顆粒結構,尤其針對孔隙結構及安定性而言。初級顆粒之變粗以及比表面積之減少,係與脫氧反應有關,其中脫氧反應愈明顯則初級顆粒的比表面積愈大。因此,製造適用於電容器製造之具有比表面積超過3平方公尺/克之鉭粉末,是不可能的。此理由在於粉末係於脫氧期間與液態鎂接觸,因此,可能無法控制脫氧期間之脫氧速率及局部溫度。明顯地,具有損失孔隙率之局部化過熱及局部化明顯燒結現象,因脫氧期間釋放熱量而出現。 These primary powders still typically exhibit a number of disadvantages because they are still not suitable for the manufacture of capacitors according to today's standards. Therefore, it is usually subjected to a reduction treatment ("deoxygenation reaction") at a temperature lower than 1000 ° C, as the case may be after the high temperature treatment, and the primary and secondary structures are stabilized. In this respect, the primary powder is mixed with fine particulate magnesium of high stoichiometric amount (representing residual oxygen content) in one or more stages and heated under a protective gas at a deoxidation temperature of 700° to 1000°C. hour. During deoxygenation, residual oxygen is removed, the primary particle structure becomes uniform, and the secondary particle structure is advantageously affected, especially in terms of pore structure and stability. The coarsening of the primary particles and the decrease in the specific surface area are related to the deoxidation reaction, wherein the more the deoxygenation reaction is, the larger the specific surface area of the primary particles is. Therefore, it is impossible to manufacture a tantalum powder having a specific surface area exceeding 3 m 2 /g which is suitable for capacitor manufacturing. The reason for this is that the powder is in contact with liquid magnesium during deoxidation, and therefore, the deoxidation rate and local temperature during deoxidation may not be controlled. Obviously, localized overheating with localized porosity and localized significant sintering phenomena occur due to the release of heat during deoxidation.
由於陽極壓製物件之燒結作用及形成,因而有明顯的活性電容器表面損失,故甚至在最小的必要燒結溫度1200℃下,可於形成電壓16伏特下,從具有比表面積3平方公尺/克之粉末製造具有比電容為至多150,000 μFV/克之電容器(相當於活性電容器面積為1平方公尺/克)。 Due to the sintering action and formation of the anode pressed article, there is obvious surface loss of the active capacitor, so even at a minimum necessary sintering temperature of 1200 ° C, a powder having a specific surface area of 3 square meters / gram can be formed at a voltage of 16 volts. Capacitors having a specific capacitance of at most 150,000 μFV/gram (equivalent to an active capacitor area of 1 square meter/gram) were fabricated.
此刻頃發現,倘若避免金屬粉末與液態鎂之接觸,並且 控制還原金屬的蒸氣壓,則於脫氧期間初級結構變粗現象可大大地降低。特別地,頃發現於脫氧期間之比表面積(根據ASTM D 3663,Brunauer、Emmett及Teller“BET”測定)係減少小於二分之一。此外,可避免因還原金屬所生之非蒸發性殘餘不純物。 At this moment, it was found that if metal powder was avoided from contact with liquid magnesium, and By controlling the vapor pressure of the reduced metal, the coarsening of the primary structure during deoxidation can be greatly reduced. In particular, the specific surface area (as determined by ASTM D 3663, Brunauer, Emmett and Teller "BET") found during deoxygenation was reduced by less than one-half. In addition, non-evaporable residual impurities due to the reduced metal can be avoided.
再者,孔隙結構明顯有利地受到影響,故電容器表面損失因形成之緣故而保持低的,因而可製得具有極高比電容之電容器。 Furthermore, the pore structure is significantly and advantageously affected, so that the surface loss of the capacitor is kept low due to the formation, so that a capacitor having a very high specific capacitance can be obtained.
本發明提供具有比表面積為4至8平方公尺/克之鉭粉末,其係於以壓製密度為5克/立方公分壓製及於1210℃燒結超過10分鐘以後,於形成10伏特之形成電壓後具有電容為220,000至350,000 μFV/克。 The present invention provides a niobium powder having a specific surface area of 4 to 8 m 2 /g, which is pressed at a pressing density of 5 g/cm 3 and sintered at 1210 ° C for more than 10 minutes, after forming a voltage of 10 volts. The capacitance is 220,000 to 350,000 μFV/g.
本發明亦提供具有比表面積為3.5至6平方公尺/克之鉭粉末,其係於以壓製密度為5克/立方公分壓製及於1210℃燒結超過10分鐘以後,於形成10伏特之形成電壓後具有比電容為180,000至250,000 μFV/克。 The present invention also provides a tantalum powder having a specific surface area of 3.5 to 6 square meters per gram after pressing at a pressing density of 5 g/cm 3 and sintering at 1210 ° C for more than 10 minutes, after forming a voltage of 10 volts. It has a specific capacitance of 180,000 to 250,000 μFV/g.
本發明進一步提供具有比表面積為3.5至6平方公尺/克之鉭粉末,其係於以壓製密度為5克/立方公分壓製及於1210℃燒結超過10分鐘以後,於形成10伏特之形成電壓後具有電容為200,000至300,000 μFV/克,並且於形成16伏特之形成電壓後具有電容為180,000至250,000 μFV/克。就此方面而論,於每一例子中,較低比電容係以具有較低比表面積之粉末製得,並且於每一例子中,較高比電容係以具有較高比表面積之粉末製得。於每一例子中之中間數值係以中間數值 之比表面積製得。倘若使用較高燒結溫度,例如達到1250℃,則因較大燒結程度之故,可製得稍低的比電容。 The present invention further provides a niobium powder having a specific surface area of 3.5 to 6 m 2 /g, which is pressed at a pressing density of 5 g/cm 3 and sintered at 1210 ° C for more than 10 minutes, after forming a voltage of 10 volts. It has a capacitance of 200,000 to 300,000 μFV/gram and has a capacitance of 180,000 to 250,000 μFV/gram after forming a voltage of 16 volts. In this regard, in each case, the lower specific capacitance was made with a powder having a lower specific surface area, and in each case, the higher specific capacitance was made with a powder having a higher specific surface area. The intermediate values in each example are intermediate values The specific surface area is obtained. If a higher sintering temperature is used, for example up to 1250 ° C, a slightly lower specific capacitance can be obtained due to the greater degree of sintering.
本發明亦提供一種經由還原金屬及/或金屬氫化物使閥金屬粉末之脫氧方法,其特徵在於脫氧反應係於欲脫氧之金屬粉末與液態還原金屬/金屬氫化物不接觸下進行。 The present invention also provides a method for deoxidizing a valve metal powder via a reducing metal and/or a metal hydride, characterized in that the deoxidation reaction is carried out without contacting the metal powder to be deoxidized with the liquid reducing metal/metal hydride.
脫氧反應較佳係於還原金屬/金屬氫化物的蒸氣分壓為5至110 hPa下進行。 The deoxygenation reaction is preferably carried out at a vapor partial pressure of the reduced metal/metal hydride of from 5 to 110 hPa.
再者,還原金屬的蒸氣分壓較佳為小於100 hPa,特佳為介於30與80 hPa之間。 Further, the vapor partial pressure of the reducing metal is preferably less than 100 hPa, particularly preferably between 30 and 80 hPa.
根據本發明,金屬粉末及還原金屬/金屬氫化物係置於反應器中之分開位置處,使得還原金屬/金屬氫化物與金屬粉末僅透過氣相接觸。還原金屬/金屬氫化物的蒸氣分壓係受其溫度控制。 According to the present invention, the metal powder and the reduced metal/metal hydride are placed at separate locations in the reactor such that the reduced metal/metal hydride is in contact with the metal powder only through the gas phase. The vapor partial pressure of the reduced metal/metal hydride is controlled by its temperature.
金屬粉末的溫度(“脫氧溫度”)較佳應保持於介於680°與880℃之間,特佳為介於690°與800℃之間,更特佳為低於760℃。於較低的金屬粉末溫度下,有效脫氧反應所需的時間不必要地提高。倘若金屬粉末的較佳溫度超過達到大的程度,則有過度初級顆粒變粗之風險。 The temperature of the metal powder ("deoxidation temperature") should preferably be maintained between 680 and 880 °C, particularly preferably between 690 and 800 °C, and even more preferably below 760 °C. At lower metal powder temperatures, the time required for an effective deoxygenation reaction is unnecessarily increased. If the preferred temperature of the metal powder exceeds a large extent, there is a risk that the excessive primary particles become thicker.
倘若金屬/金屬氫氧化物的蒸氣壓位於脫氧溫度所需的範圍內,則可均勻地溫控其中容納金屬粉末及還原金屬/金屬氫氧化物於不同場所之反應器。 If the vapor pressure of the metal/metal hydroxide is within the range required for the deoxidation temperature, the reactor in which the metal powder and the reduced metal/metal hydroxide are accommodated in different places can be uniformly temperature-controlled.
鎂及/或氫化鎂較佳係用作還原金屬。 Magnesium and/or magnesium hydride are preferably used as the reducing metal.
較佳地,惰性載氣緩慢地流經脫氧反應。反應器中之氣體壓力較佳為50至500 hPa,特佳為100至450 hPa,最特佳 為200至400 hPa。 Preferably, the inert carrier gas slowly flows through the deoxygenation reaction. The gas pressure in the reactor is preferably from 50 to 500 hPa, particularly preferably from 100 to 450 hPa, most preferably It is 200 to 400 hPa.
惰性氣體,例如氦氣、氖氣、氬氣或其混合物,係適用於作為載氣。少量添加氫氣可能是有利的。載氣較佳係於引入反應器之前或期間預熱至反應器溫度,故得以避免還原金屬之蒸氣凝結。 An inert gas such as helium, neon, argon or a mixture thereof is suitable for use as a carrier gas. It may be advantageous to add a small amount of hydrogen. The carrier gas is preferably preheated to the reactor temperature before or during introduction into the reactor so that vapor condensation of the reducing metal is avoided.
圖1係示意地顯示一種較佳可用於進行根據本發明之脫氧方法之反應器。反應器1包含二個透過連接通道6而相連的反應器空間2和3。含有初級粉末之坩堝4則放置於反應器空間2中。反應器空間3含有具有欲汽化的還原金屬/金屬氫化物之坩堝5。反應器空間2和3以及連接通道6較佳具有加熱構件7、8和9,以供調整溫度T1、T2和T3。還原金屬/金屬氫化物係在溫度T3汽化。通道6中之溫度T2係選擇使得可信賴地防止還原金屬/金屬氫化物之凝結作用者。惰性載氣10則供入反應器空間3中,俾傳送還原金屬/金屬氫化物蒸氣,並且自反應器空間2取出,同時保持壓力P。 BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic representation of a reactor which is preferably useful for carrying out the deoxygenation process according to the present invention. The reactor 1 comprises two reactor spaces 2 and 3 connected by a connecting passage 6. The crucible 4 containing the primary powder is placed in the reactor space 2. The reactor space 3 contains a crucible 5 having a reduced metal/metal hydride to be vaporized. The reactor spaces 2 and 3 and the connecting passage 6 preferably have heating members 7, 8 and 9 for adjusting the temperatures T 1 , T 2 and T 3 . Reducing metal / metal hydride-based 3 vaporization temperature T. 6 in the channel select lines such that the temperature T 2 prevented the reduction reliable metal / metal hydride of condensate actors. The inert carrier gas 10 is fed to the reactor space 3, which transports the reduced metal/metal hydride vapor and is withdrawn from the reactor space 2 while maintaining the pressure P.
根據本發明之脫氧方法可有利地用於所有金屬粉末。然而,具有高比表面積為4至20平方公尺/克(特佳為6至15平方公尺/克)之高燒結活性的鉭初級粉末為較佳。然而,此方法亦可用於附聚的初級粉末,亦即在高真空中熱處理之初級粉末。 The deoxidation method according to the present invention can be advantageously applied to all metal powders. However, a high sintering activity cerium primary powder having a high specific surface area of 4 to 20 m 2 /g (particularly preferably 6 to 15 m 2 /g) is preferred. However, this method can also be used for agglomerated primary powders, that is, primary powders that are heat treated in a high vacuum.
再者,較佳的金屬初級粉末具有根據ASTM B 822(Malvern MasterSizer Sμ儀器)之比粒度分布(二級結構)的特徵在於D10為3至25微米、D50為15至80微米及D90為50至280微米者,其中D10、D50及D90代表10、50(中位 數)及90重量%之粒度分布。於脫氧反應中,初級粉末的粒度分布實質上保持不變。一般而言,根據ASTM B 822之比粒度分布的特徵在於D10為3至50微米、D50為15至150微米及D90為50至400微米。 Further, the preferred metal primary powder has a specific particle size distribution (secondary structure) according to ASTM B 822 (Malvern MasterSizer Sμ instrument) characterized by D10 of 3 to 25 μm, D50 of 15 to 80 μm, and D90 of 50 to 280 micron, of which D10, D50 and D90 represent 10, 50 (median Number) and a particle size distribution of 90% by weight. In the deoxygenation reaction, the particle size distribution of the primary powder remains substantially unchanged. In general, the specific particle size distribution according to ASTM B 822 is characterized by D10 of 3 to 50 microns, D50 of 15 to 150 microns, and D90 of 50 to 400 microns.
特佳的金屬初級粉末係非根據上述公開揭示的申請案製得,其係經由使細微粒氧化物粉末還原,透過蒸氣的還原金屬(例如鋁、鎂、鈣、鋇及/或鑭及/或其氫化物,尤其鎂)於惰性載氣下進行,其中還原反應係於還原金屬/金屬氫化物之蒸氣分壓為5至110 hPa(較佳為小於80 hPa,特佳為介於8與50 hPa之間),且於載氣氣壓為50至800 hPa(較佳為小於600 hPa,特佳為介於100與500 hPa之間)下進行。 Particularly preferred metal primary powders are produced in accordance with the above-disclosed application by reducing the fine particulate oxide powder, vapor-reducing reducing metals (eg, aluminum, magnesium, calcium, strontium and/or strontium and/or The hydride, especially magnesium, is carried out under an inert carrier gas, wherein the reduction is based on a reduced partial pressure of the reduced metal/metal hydride of from 5 to 110 hPa (preferably less than 80 hPa, particularly preferably between 8 and 50) Between hPa) and at a carrier gas pressure of 50 to 800 hPa (preferably less than 600 hPa, particularly preferably between 100 and 500 hPa).
就五氧化鉭粉末而言,較佳係使用具有根據ASTM B 822(Malvern MasterSizer Sμ儀器)之比粒度分布在於D10為2至70微米、D50為15至200微米及D90為80至430微米以及根據ASTM D 3663之比表面積(BET)為0.05至0.5平方公尺/克之多孔性海綿狀粉末。 In the case of ruthenium pentoxide powder, it is preferred to use a specific particle size distribution according to ASTM B 822 (Malvern MasterSizer Sμ instrument) of D10 of 2 to 70 μm, D50 of 15 to 200 μm and D90 of 80 to 430 μm and according to ASTM D 3663 has a specific surface area (BET) of from 0.05 to 0.5 m 2 /g of porous sponge-like powder.
就五氧化鉭粉末而言,較佳係使用具有根據ASTM B 822(Malvern MasterSizer Sμ儀器)之比粒度分布在於D10為2至30微米、D50為15至175微米及D90為80至320微米以及根據ASTM D 3663之比表面積(BET)為0.05至0.5平方公尺/克之多孔性海綿狀粉末。 In the case of ruthenium pentoxide powder, it is preferred to use a specific particle size distribution according to ASTM B 822 (Malvern MasterSizer Sμ instrument) of D10 of 2 to 30 μm, D50 of 15 to 175 μm and D90 of 80 to 320 μm and according to ASTM D 3663 has a specific surface area (BET) of from 0.05 to 0.5 m 2 /g of porous sponge-like powder.
使用此較佳還原方法,溫度可降至680°至880℃,而不會明顯地延長還原時間。當使用具有初級粒度(於球形初級顆粒之情形下,係為直徑,於非球形初級顆粒之情形下,則為 最小尺度)為0.1至5微米之氧化鉭粉末或鈮粉末附聚物粉末時,還原時間介於6與12小時(較佳為至多9小時)是足夠的。 最後但並非最不重要的是,較低反應溫度提供非微不足道的省能效果,並且有助於防護供還原反應用所需之製程技術裝置。可獲得具特別有利的二級結構之金屬初級粉末。 With this preferred reduction method, the temperature can be lowered to 680° to 880°C without significantly prolonging the reduction time. When using a primary particle size (in the case of spherical primary particles, the diameter is in the case of non-spherical primary particles, then When the minimum scale) is 0.1 to 5 μm of cerium oxide powder or cerium powder agglomerate powder, a reduction time of 6 and 12 hours (preferably up to 9 hours) is sufficient. Last but not least, lower reaction temperatures provide a non-trivial energy saving effect and help protect the process technology equipment required for the reduction reaction. A metal primary powder having a particularly advantageous secondary structure can be obtained.
於完成還原反應之後,經由控制逐漸引入氧氣於反應器中使粉末顆粒表面氧化(於冷卻至100℃以下溫度之後)以及以酸和水洗出所形成之還原金屬的氧化物,進行所生成的金屬初級粉末之鈍化作用。 After the completion of the reduction reaction, the surface of the powder particles is gradually oxidized in the reactor by control (after cooling to a temperature below 100 ° C), and the oxide of the formed metal is washed out with acid and water to carry out the generated metal primary. Passivation of the powder.
就此方面而論,大體上製得具有比表面積至多20平方公尺/克,較佳為6至15平方公尺/克,特佳為8至14平方公尺/克之鉭粉末,同時維持具有極佳的顆粒機械安定性之初氧化物粒度分布。 In this respect, it is generally produced to have a specific surface area of up to 20 square meters per gram, preferably 6 to 15 square meters per gram, particularly preferably 8 to 14 square meters per gram, while maintaining excellent properties. The particle size distribution of the initial mechanical stability of the particles.
於鈍化之後之鉭初級粉末的氧含量為約3000微克/平方公尺,尤其2400微克/平方公尺至4500微克/平方公尺,或2500微克/平方公尺至3600微克/平方公尺,或2600微克/平方公尺至3100微克/平方公尺,尤其小於3000微克/平方公尺。 The primary powder after passivation has an oxygen content of about 3000 micrograms per square meter, especially 2400 micrograms per square meter to 4500 micrograms per square meter, or 2500 micrograms per square meter to 3600 micrograms per square meter, or 2600 micrograms per square meter to 3100 micrograms per square meter, especially less than 3000 micrograms per square meter.
根據本發明之粉末的氮含量,在大多數例子中為100 ppm至10,000 ppm,或400 ppm至7,500 ppm,或400 ppm至5,000 ppm,尤其400 ppm至3,000 ppm。氧及氮含量係有利地以氮/氧測定儀,型號TC 501-645(Leco Instrum GmbH)測定之。 The nitrogen content of the powder according to the invention is, in most cases, from 100 ppm to 10,000 ppm, or from 400 ppm to 7,500 ppm, or from 400 ppm to 5,000 ppm, especially from 400 ppm to 3,000 ppm. The oxygen and nitrogen contents are advantageously determined by a nitrogen/oxygen analyzer, model TC 501-645 (Leco Instrum GmbH).
根據本發明之粉末的磷含量,在大多數例子中為10 ppm至400 ppm,或10 ppm至250 ppm,或10 ppm至200 ppm, 尤其10 ppm至150 ppm。 The phosphorus content of the powder according to the invention is, in most cases, from 10 ppm to 400 ppm, or from 10 ppm to 250 ppm, or from 10 ppm to 200 ppm, Especially 10 ppm to 150 ppm.
熟知本技藝之人士當可明白如何特定地調整氮或磷含量。 Those skilled in the art will understand how to specifically adjust the nitrogen or phosphorus content.
經由壓製形成陽極結構,於1200°至1250℃下燒結陽極結構形成陽極體以及形成及連接相對電極,根據本發明製得之具有大比表面積之鉭粉末適用於依本身已知的方式製造具有比電容在100,000至350,000 μFV/克範圍內之電解電容器。製自根據本發明粉末之未燒結陽極體具有壓縮強度為1公斤至11公斤,或2公斤至8公斤,或2公斤至6公斤,尤其為1公斤至4公斤。製自根據本發明粉末之燒結陽極體具有壓縮強度為大於10公斤,或大於20公斤,或大於30公斤,尤其大於40公斤。燒結或未燒結的陽極之壓縮強度係以Prominent公司,型號”Promi 3001”之測試儀器測得。為了測定未燒結陽極的壓縮強度,使用稱重為500毫克且具有直徑5.1毫米和長度4.95毫米之圓柱形陽極,其係未使用嵌入式絲網,而以壓製密度5.0克/立方公分壓製之。 Forming the anode structure via pressing, sintering the anode structure at 1200° to 1250° C. to form an anode body, and forming and connecting the opposite electrode, the tantalum powder having a large specific surface area prepared according to the present invention is suitable for manufacturing in a manner known per se. Electrolytic capacitors with capacitances in the range of 100,000 to 350,000 μFV/gram. The unsintered anode body made from the powder according to the invention has a compressive strength of from 1 kg to 11 kg, or from 2 kg to 8 kg, or from 2 kg to 6 kg, especially from 1 kg to 4 kg. The sintered anode body made from the powder according to the invention has a compressive strength of more than 10 kg, or more than 20 kg, or more than 30 kg, especially more than 40 kg. The compressive strength of the sintered or unsintered anode was measured using a test instrument of the model "Promi 3001" by Prominent. In order to determine the compressive strength of the unsintered anode, a cylindrical anode weighing 500 mg and having a diameter of 5.1 mm and a length of 4.95 mm was used, which was pressed without using a built-in screen and pressed at a density of 5.0 g/cm 3 .
為了測定燒結陽極的壓縮強度,使用稱重為140毫克且具有直徑3.0毫米和長度3.96毫米之圓柱形陽極,以嵌入式絲網以壓製密度5.0克/立方公分壓製之,接著於高真空中(10-4毫巴),於1210℃下燒結10分鐘。 In order to determine the compressive strength of the sintered anode, a cylindrical anode weighing 140 mg and having a diameter of 3.0 mm and a length of 3.96 mm was used, and the embedded screen was pressed at a pressing density of 5.0 g/cm 3 , followed by a high vacuum ( 10 -4 mbar), sintered at 1210 ° C for 10 minutes.
較佳的鉭粉末為極純的,尤其就不純物含量(可能對殘餘電流有不良影響者)而言:鈉和鉀的總含量小於5 ppm,較佳為小於2 ppm,並且鐵、鉻和鎳的總含量小於25 ppm,較佳為小於15 ppm。 Preferred niobium powders are extremely pure, especially in the case of impure content (possibly having an adverse effect on residual current): total sodium and potassium content is less than 5 ppm, preferably less than 2 ppm, and iron, chromium and nickel The total content is less than 25 ppm, preferably less than 15 ppm.
較佳的鉭粉末之體積密度係於25至35克/立方英吋之範圍內,此對於加工為電容器而言是有利的。 The preferred bulk density of the tantalum powder is in the range of 25 to 35 grams per cubic inch, which is advantageous for processing into capacitors.
粉末的流動性(Hall流體)小於150秒/25克,或100秒/25克,或50秒/25克,尤其是35秒/25克。流動性係於如圖5所示之裝置中測得。該裝置包含流體漏斗1,其中25克樣品係添加於此。流體漏斗具有直徑50.5毫米之上開口5、直徑3.8毫米之下開口6、45.6毫米之高度差4以及30.8°之斜角7。此漏斗係固定於具有開關2之振動器3,其中振動器3的振動速率是可調整的。針對測試,振動速率為每秒38.5次振動。 The flowability of the powder (Hall fluid) is less than 150 seconds / 25 grams, or 100 seconds / 25 grams, or 50 seconds / 25 grams, especially 35 seconds / 25 grams. The fluidity was measured in a device as shown in FIG. The device contained a fluid funnel 1 in which 25 grams of sample was added. The fluid funnel has an opening 5 having a diameter of 50.5 mm, an opening 6 having a diameter of 3.8 mm, a height difference 4 of 45.6 mm, and an oblique angle 7 of 30.8. This funnel is fixed to the vibrator 3 having the switch 2, wherein the vibration rate of the vibrator 3 is adjustable. For the test, the vibration rate was 38.5 vibrations per second.
根據本發明之粉末亦具有經由ASTM B 300-02測定之FSSS值(Fisher Sub Sieve Sizer)為0.1微米至4微米,或0.5微米至3微米,或0.5微米至2.5微米,尤其0.8微米至2.2微米。 The powder according to the invention also has a FSSS value (Fisher Sub Sieve Sizer) determined by ASTM B 300-02 of from 0.1 micron to 4 microns, or from 0.5 microns to 3 microns, or from 0.5 microns to 2.5 microns, especially from 0.8 microns to 2.2 microns. .
製自此等粉末之燒結陽極(圓柱形、壓製密度5.0克/立方公分,直徑5.10毫米,長度4.95毫米,重量500克,於1210℃下,於10-4毫巴下燒結10分鐘)的孔隙分布展現出一或多個極大值,係位於粒度範圍為0.05微米至10微米,或0.05微米至5微米,或0.05微米至3微米,或0.05微米至1微米(一種來自Micrometrics公司之儀器,”Auto Pore III”連同測量軟體”Auto Pore IV”係用於測定孔隙粒度分布)。 Porosity of sintered anodes of these powders (cylindrical, pressed density 5.0 g/cm 3 , diameter 5.10 mm, length 4.95 mm, weight 500 g, sintered at 1010 ° C for 10 minutes at 10 -4 mbar) The distribution exhibits one or more maxima at a particle size ranging from 0.05 microns to 10 microns, or 0.05 microns to 5 microns, or 0.05 microns to 3 microns, or 0.05 microns to 1 micron (a device from Micrometrics, Inc.) Auto Pore III" along with the measurement software "Auto Pore IV" is used to determine the pore size distribution).
於本發明之一變型中,根據本發明之脫氧粉末具有體積密度(bulk density)為25克/立方英吋至32克/立方英吋、比表面積為5平方公尺/克至8平方公尺/克,以及具有根據ASTM B 822(Malvern MasterSizer Sμ儀器)特徵在於D10為30至40 微米、D50為120至135微米及D90為240至265微米之比粒度分布(二級結構),其中D10、D50及D90代表10、50(中位數)及90重量%之粒度分布,並且比電容在10伏特形成時為280,000至340,000 μFV/克,且在16伏特形成時為230,000至280,000 μFV/克。殘餘電流為0.4 nA/μFV至0.65 nA/μFV(10伏特形成電壓)及0.4 nA/μFV至0.5 nA/μFV(16伏特形成電壓)。 In a variation of the present invention, the deoxidized powder according to the present invention has a bulk density of 25 g/cubic inch to 32 g/cubic inch and a specific surface area of 5 square meters/gram to 8 square meters. / gram, and has a characteristic according to ASTM B 822 (Malvern MasterSizer Sμ instrument) that D10 is 30 to 40 Micron, D50 is 120 to 135 microns and D90 is 240 to 265 microns specific particle size distribution (secondary structure), where D10, D50 and D90 represent 10, 50 (median) and 90% by weight of the particle size distribution, and The capacitance is 280,000 to 340,000 μFV/gram at 10 volts and 230,000 to 280,000 μFV/gram at 16 volts. The residual current was 0.4 nA/μFV to 0.65 nA/μFV (10 volt forming voltage) and 0.4 nA/μFV to 0.5 nA/μFV (16 volt forming voltage).
於本發明之另一變型中,根據本發明之脫氧粉末具有體積密度為25克/立方英吋至35克/立方英吋、比表面積為1.9平方公尺/克至7.8平方公尺/克,以及具有根據ASTM B 822(Malvern MasterSizer Sμ儀器)特徵在於D10為14至20微米、D50為29至47微米及D90為51至87微米之比粒度分布(二級結構),其中D10、D50及D90代表10、50(中位數)及90重量%之粒度分布,並且比電容在10伏特形成時為125,000至344,000 μFV/克,或150,000至320,000 μFV/克,或180,000至310,000 μFV/克,且在16伏特形成時為120,000至245,000 μFV/克。殘餘電流為0.4 nA/μFV至0.98 nA/μFV,或0.4 nA/μFV至小於0.9 nA/μFV(10伏特形成電壓)及0.4 nA/μFV至0.75 nA/μFV(16伏特形成電壓)。 In another variation of the invention, the deoxidized powder according to the present invention has a bulk density of from 25 g/cubic to 35 g/cubic inch and a specific surface area of from 1.9 to 200 square meters per gram. And having a particle size distribution (secondary structure) characterized by D10 of 14 to 20 microns, D50 of 29 to 47 microns, and D90 of 51 to 87 microns according to ASTM B 822 (Malvern MasterSizer Sμ instrument), wherein D10, D50 and D90 Represents a particle size distribution of 10, 50 (median) and 90% by weight, and a specific capacitance of 125,000 to 344,000 μFV/gram, or 150,000 to 320,000 μFV/gram, or 180,000 to 310,000 μFV/gram when formed at 10 volts, and It is 120,000 to 245,000 μFV/g when formed at 16 volts. The residual current is 0.4 nA/μFV to 0.98 nA/μFV, or 0.4 nA/μFV to less than 0.9 nA/μFV (10 volt forming voltage) and 0.4 nA/μFV to 0.75 nA/μFV (16 volt forming voltage).
以下實施例係用以說明本發明。所列舉之文獻參考資料係合併於本案以供參考,因而構成本說明書之一部分。 The following examples are intended to illustrate the invention. The cited literature references are incorporated herein by reference in its entirety for all purposes in the present disclosure.
針對實施例1至9(初級粉末1至9),使用具有根據ASTM B 822(Malvern MasterSizer Sμ儀器)之比粒度分布對應於D10值為17.8微米、對應於D50值為34.9微米及對應於D90值為71.3微米,以及根據ASTM D 3663之比表面積(BET)為0.14平方公尺/克之細分散微粒、部分燒結的原始五氧化鉭。粉末的個別顆粒是具高度多孔性的,並且具有粗糙的球形。由掃描式電子顯微照相圖可發現,顆粒係由具有平均直徑2.4微米(自掃描式電子顯微照相圖目視測定)之粗糙球形初級顆粒的高燒結附聚物所組成。圖2顯示原始五氧化物的掃描式電子顯微照相圖。 For Examples 1 to 9 (primary powders 1 to 9), the use of a specific particle size distribution according to ASTM B 822 (Malvern MasterSizer Sμ instrument) corresponds to a D10 value of 17.8 microns, a D50 value of 34.9 microns and a corresponding D90 value. It is 71.3 micrometers, and finely dispersed fine particles of 0.14 square meters per gram according to ASTM D 3663, partially sintered raw ruthenium pentoxide. The individual particles of the powder are highly porous and have a rough spherical shape. From the scanning electron micrograph, it was found that the particles were composed of highly sintered agglomerates of coarse spherical primary particles having an average diameter of 2.4 μm (visible from a scanning electron photomicrograph). Figure 2 shows a scanning electron micrograph of the original pentoxide.
於實施例10至12中(初級粉末10至12),不規則形狀以及顆粒分布特徵在於D10=32.4微米、D50=138.7微米及D90=264.8微米之對應的材料係用作起始材料。比表面積為0.12平方公尺/克。將原始五氧化鉭添加於在襯有鉭板狀物之反應器中的鉭編織絲網上,係位於含有1.1倍理想配比含量(相對於五氧化物之氧含量)的鎂之坩堝上方。反應器係透過火爐加熱。氣體進料開口則位於反應器上,於含鎂坩堝下方處,並且排氣開口則位於五氧化鉭進料裝置上方。可經由通過爐壁之抽頭線測量爐中的內部氣壓。氬氣係用作保護氣體,而緩慢地流經火爐。於開始加熱反應器至還原溫度之前,以氬氣沖洗反應器。於達到還原溫度之前,調整氬氣壓力以用於還原反應。於反應完成及冷卻反應器之後,逐漸地將空 氣引入反應器中,俾使金屬粉末對燃燒產生鈍化。藉著以硫酸清洗且接著以去礦物質水清洗,除去所形成的氧化鎂,直到得到中性反應為止。表1顯示還原條件以及實施例1至12之初級粉末於冷卻和鈍化之後得到的性質。”MasterSizer D10、D50、D90”數值係根據ASTM B 822測定。還原的鉭對應於比表面積之氧含量,亦即氧含量(以ppm計)和根據BET測定之比表面積的商數,則提供於右欄中。表面氧含量約3000 ppm/(平方公尺/克)是必要的,否則鉭粉末將成為發火性的,且與環境空氣接觸時將燃燒。 In Examples 10 to 12 (primary powders 10 to 12), the irregular shape and the particle distribution characteristics of D10 = 32.4 μm, D50 = 138.7 μm, and D90 = 264.8 μm were used as starting materials. The specific surface area is 0.12 m 2 /g. The original ruthenium pentoxide was added to a ruthenium woven wire mesh in a reactor lined with a ruthenium plate, above the ruthenium containing 1.1 times the stoichiometric content (relative to the oxygen content of the pentoxide). The reactor is heated through a furnace. The gas feed opening is located on the reactor below the magnesium containing ruthenium and the vent opening is located above the ruthenium pentoxide feed. The internal air pressure in the furnace can be measured via a tap line through the furnace wall. Argon is used as a shielding gas and flows slowly through the furnace. The reactor was flushed with argon before starting to heat the reactor to the reduction temperature. The argon pressure was adjusted for the reduction reaction before the reduction temperature was reached. After the reaction is completed and the reactor is cooled, it will gradually become empty. Gas is introduced into the reactor and the metal powder is passivated to the combustion. The magnesium oxide formed is removed by washing with sulfuric acid and then with demineralized water until a neutral reaction is obtained. Table 1 shows the reduction conditions and the properties obtained after cooling and passivation of the primary powders of Examples 1 to 12. The "MasterSizer D10, D50, D90" values are determined in accordance with ASTM B 822. The reduced enthalpy corresponds to the oxygen content of the specific surface area, that is, the oxygen content (in ppm) and the quotient of the specific surface area measured according to BET, which is provided in the right column. A surface oxygen content of about 3000 ppm/(m^2/g) is necessary, otherwise the niobium powder will become pyrophoric and will burn when in contact with ambient air.
實施例1至12係於實質上固定氬氣壓力及固定反應器溫度下進行。於每一例中,反應器溫度亦界定鎂蒸氣的分壓:於700℃為8 hPa,於750℃為19 hPa,於780℃為29 hPa,於800℃為39 hPa,於840℃為68 hPa,於880℃為110 hPa。 Examples 1 to 12 were carried out under substantially fixed argon pressure and fixed reactor temperature. In each case, the reactor temperature also defines the partial pressure of magnesium vapor: 8 hPa at 700 ° C, 19 hPa at 750 ° C, 29 hPa at 780 ° C, 39 hPa at 800 ° C, and 68 hPa at 840 ° C. It is 110 hPa at 880 °C.
圖3顯示根據實施例9之初級粉末的掃描式電子顯微照相圖。圖4顯示根據實施例3之初級粉末的掃描式電子顯微照相圖。 Figure 3 shows a scanning electron micrograph of the primary powder according to Example 9. Figure 4 shows a scanning electron micrograph of the primary powder according to Example 3.
由MasterSizer D10、D50、D90數值可發現,於所有樣品中之粒度分布大致上保持固定。然而,比表面積係取決於還原金屬的蒸氣分壓。所有樣品的表面氧含量大體上為約 3000微克/平方公尺(ppm/(平方公尺/克)),亦即氧含量決不超過必要的氧含量,因此,顆粒與環境空氣接觸時不會燃燒。 From the values of MasterSizer D10, D50, and D90, it was found that the particle size distribution in all samples remained substantially constant. However, the specific surface area depends on the vapor partial pressure of the reduced metal. The surface oxygen content of all samples is approximately 3000 micrograms per square meter (ppm/(m^2/g)), ie the oxygen content never exceeds the necessary oxygen content, so the particles do not burn when in contact with ambient air.
以實施例1至12之初級粉末浸漬磷酸氫銨溶液,並且乾燥之,俾生成150 ppm之磷摻雜物。接著將粉末添加於水平反應管中之坩堝中。接著引入含有1.2倍理想配比含量(相對於粉末的氧含量)的鎂之坩堝於與含有粉末之坩堝具特定距離處。可經由位於反應管外側之分開的加熱裝置加熱坩堝。經由設置於含鎂坩堝前方之氣體入口,以氬氣保護氣體沖洗反應管,並且於含鉭粉坩堝後方移除氬氣保護氣體。加熱反應器之含粉末坩堝之區域至表2所示之粉末溫度,並且經由對應的調節閥調節氣體壓力至表2所示之氣體壓力。接著加熱含鎂坩堝至表2所示之鎂溫。維持脫氧條件達到亦如表2所示之持續時間。接著冷卻反應器,並且當溫度降至低於100℃時,藉逐漸引入空氣使鉭粉末鈍化,清洗至不含氧化鎂,並且通過400微米網目寬度之篩網篩分之。所得到的粉末之粒度分布(根據ASTM B 822之D10、D50、D90)及表面積則提供於表2中。 The ammonium hydrogen phosphate solution was impregnated with the primary powders of Examples 1 to 12, and dried to form 150 ppm of a phosphorus dopant. The powder was then added to the crucible in a horizontal reaction tube. Next, a magnesium containing 1.2 times the stoichiometric content (relative to the oxygen content of the powder) is introduced at a specific distance from the cookware containing the powder. The crucible can be heated via a separate heating device located outside the reaction tube. The reaction tube is flushed with an argon shielding gas via a gas inlet disposed in front of the magnesium containing crucible, and the argon shielding gas is removed behind the crucible containing crucible. The area containing the powder crucible of the reactor was heated to the powder temperature shown in Table 2, and the gas pressure was adjusted to the gas pressure shown in Table 2 via the corresponding regulating valve. The magnesium containing cerium was then heated to the magnesium temperature shown in Table 2. Maintaining the deoxidation conditions also reached the duration as shown in Table 2. The reactor was then cooled, and when the temperature dropped below 100 ° C, the cerium powder was passivated by gradual introduction of air, washed to no magnesium oxide, and sieved through a 400 micron mesh screen. The particle size distribution of the obtained powder (D10, D50, D90 according to ASTM B 822) and surface area are provided in Table 2.
自粉末製備具有壓製密度5.0克/立方公分之尺度為直徑3毫米和長度3.96毫米的壓製物件;於基質填充粉末之前,將鉭絲網0.2毫米厚(作為接觸絲網)插入於壓製基質中。於高真空中,於1210℃下,燒結壓製物件10分鐘。 A pressed article having a sintered density of 5.0 g/cm 3 and a diameter of 3 mm and a length of 3.96 mm was prepared from the powder; a ruthenium mesh of 0.2 mm thick (as a contact wire) was inserted into the pressed substrate before the matrix was filled with the powder. The article was sintered for 10 minutes at 1210 ° C in a high vacuum.
將陽極體浸漬於0.1%磷酸中,並且於電流密度(上限為150毫安培)形成10伏特及16伏特之形成電壓。於電流密度降低之後,維持電壓另外1小時。使用18%硫酸之陰極來測量電容器性質。以交流電壓120赫茲(Hz)進行測量。比電容及殘餘電流係提供於表4中。 The anode body was immersed in 0.1% phosphoric acid and formed at a current density (upper limit 150 mA) to form a voltage of 10 volts and 16 volts. After the current density was lowered, the voltage was maintained for another hour. Capacitor properties were measured using a 18% sulfuric acid cathode. The measurement was performed at an alternating voltage of 120 Hz. The specific capacitance and residual current are provided in Table 4.
1‧‧‧反應器 1‧‧‧reactor
2‧‧‧反應器空間 2‧‧‧Reactor space
3‧‧‧反應器空間 3‧‧‧Reactor space
4‧‧‧坩堝 4‧‧‧坩埚
5‧‧‧坩堝 5‧‧‧坩埚
6‧‧‧連接通道 6‧‧‧Connected channel
7‧‧‧加熱構件 7‧‧‧heating components
8‧‧‧加熱構件 8‧‧‧heating components
9‧‧‧加熱構件 9‧‧‧heating components
10‧‧‧載氣 10‧‧‧ carrier gas
P‧‧‧壓力 P‧‧‧ pressure
T1、T2和T3‧‧‧溫度 T 1 , T 2 and T 3 ‧‧‧ temperatures
1‧‧‧流體漏斗 1‧‧‧Funnel funnel
2‧‧‧開關 2‧‧‧Switch
3‧‧‧振動器 3‧‧‧Vibrator
4‧‧‧高度差 4‧‧‧ height difference
5‧‧‧上開口 5‧‧‧Opening
6‧‧‧下開口 6‧‧‧ opening
7‧‧‧斜角 7‧‧‧ oblique angle
圖1係示意地顯示一種較佳可用於進行根據本發明之脫氧方法之反應器。 BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic representation of a reactor which is preferably useful for carrying out the deoxygenation process according to the present invention.
圖2顯示原始五氧化物的掃描式電子顯微照相圖。 Figure 2 shows a scanning electron micrograph of the original pentoxide.
圖3顯示根據實施例9之初級粉末的掃描式電子顯微照相圖。 Figure 3 shows a scanning electron micrograph of the primary powder according to Example 9.
圖4顯示根據實施例3之初級粉末的掃描式電子顯微照相圖。 Figure 4 shows a scanning electron micrograph of the primary powder according to Example 3.
圖5顯示一種測定流動性之裝置。 Figure 5 shows a device for determining fluidity.
1‧‧‧反應器 1‧‧‧reactor
2‧‧‧反應器空間 2‧‧‧Reactor space
3‧‧‧反應器空間 3‧‧‧Reactor space
4‧‧‧坩堝 4‧‧‧坩埚
5‧‧‧坩堝 5‧‧‧坩埚
6‧‧‧連接通道 6‧‧‧Connected channel
7‧‧‧加熱構件 7‧‧‧heating components
8‧‧‧加熱構件 8‧‧‧heating components
9‧‧‧加熱構件 9‧‧‧heating components
10‧‧‧載氣 10‧‧‧ carrier gas
P‧‧‧壓力 P‧‧‧ pressure
T1、T2和T3‧‧‧溫度 T 1 , T 2 and T 3 ‧‧‧ temperatures
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